Optical assembly and optical module with same

Abstract

The invention discloses an optical assembly and an optical module with the same, the optical assembly comprises signal lines, ground planes and bonding lines, the signal lines comprise a first signal line and a second signal line which are distributed at intervals, and the ground planes comprise a left ground plane and a right ground plane which are located on the two sides of the signal lines. The left ground plane comprises a first left ground plane and a second left ground plane which are distributed at intervals, the right ground plane comprises a first right ground plane and a second right ground plane which are distributed at intervals, the bonding wires comprise a first bonding wire, a second group of second bonding wires and a third group of second bonding wires, the first bonding wire is connected with the first signal wire and the second signal wire, and the third bonding wire is connected with the second signal wire. The second group of second bonding wires is connected with the first left ground plane and the second right ground plane, the third group of second bonding wires is connected with the second left ground plane and the first right ground plane, the second group of second bonding wires comprises two sub-bonding wires, and the third group of second bonding wires comprises two sub-bonding wires. The second bonding wire forms electromagnetic shielding, so that the sensibility and impedance of the first bonding wire can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of optical communication element manufacturing, and in particular to an optical component and an optical module having the same. Background Art

[0002] In the prior art, in two links that need to be connected, conduction and signal transmission are usually achieved through bonding wires. However, the bonding wires themselves are highly inductive, and there is mutual inductance between adjacent bonding wires, which makes the bonding wire impedance high. There is an impedance mutation point at the bonding wire in the entire link, and the loss is large, which is not conducive to the development of higher-speed optical modules. Summary of the invention

[0003] The present application discloses an optical component and an optical module having the same. The optical component includes a signal line, a ground plane and a bonding wire. The signal line includes a first signal line and a second signal line that are spaced apart. The ground plane includes a left ground plane and a right ground plane located on both sides of the signal line. The left ground plane includes a first left ground plane and a second left ground plane that are spaced apart. The right ground plane includes a first right ground plane and a second right ground plane that are spaced apart. The bonding wire includes a first bonding wire, a second group of second bonding wires and a third group of second bonding wires. The first bonding wire connects the first signal line and the second signal line, the second group of second bonding wires connects the first left ground plane and the second right ground plane, the third group of second bonding wires connects the second left ground plane and the first right ground plane, the second group of second bonding wires includes two sub-bonding wires, and the third group of second bonding wires includes two sub-bonding wires.

[0004] In one embodiment, the second group of second bonding wires and the third group of second bonding wires are arranged crosswise.

[0005] In one embodiment, the second group of second bonding wires and the third group of second bonding wires are both suspended and cover the first bonding wires.

[0006] In one embodiment, two sub-bonding wires in the second group of second bonding wires are arranged at intervals, and two sub-bonding wires in the third group of second bonding wires are arranged at intervals.

[0007] In one embodiment, two sub-bonding lines in the second group of second bonding lines are parallel to each other, and two sub-bonding lines in the third group of second bonding lines are parallel to each other.

[0008] In one embodiment, the bonding wires further include a first group of second bonding wires and a fourth group of second bonding wires, the first group of second bonding wires connects the first left ground plane and the first right ground plane, and the fourth group of second bonding wires connects the second left ground plane and the second right ground plane.

[0009] In one embodiment, the first group of second bonding wires includes one sub-bonding wire, and the fourth group of second bonding wires includes one sub-bonding wire.

[0010] In one embodiment, the first group of second bonding wires and the fourth group of second bonding wires are both located outside the second group of second bonding wires and the third group of second bonding wires.

[0011] In one embodiment, the bonding wires further include a third bonding wire and a fourth bonding wire, the third bonding wire connects the first left ground plane and the second left ground plane, and the fourth bonding wire connects the first right ground plane and the second right ground plane.

[0012] In one embodiment, the third bonding wire includes one sub-bonding wire, and the fourth bonding wire includes one sub-bonding wire.

[0013] In one embodiment, the third bonding wire and the fourth bonding wire are both located outside the second group of second bonding wires and the third group of second bonding wires.

[0014] In one embodiment, the first bonding wire includes two first sub-bonding wires having a first gap, the third bonding wire includes two third sub-bonding wires having a third gap, and the first gap is larger than the third gap.

[0015] In one embodiment, the first bonding wire includes two first sub-bonding wires that are spaced apart from each other, and a contact point between the first sub-bonding wire and the signal wire is located within 100 micrometers inward from an edge of the signal wire.

[0016] In one embodiment, the signal line includes a first edge close to a left ground plane and a second edge close to a right ground plane, and a contact point between a first sub-bonding line relatively close to the first edge of the two first sub-bonding lines and the signal line is located within 100 microns inward of the first edge, and a contact point between a first sub-bonding line relatively close to the second edge of the two first sub-bonding lines and the signal line is located within 100 microns inward of the second edge.

[0017] In one embodiment, the two first sub-bonding lines are arranged in parallel, the signal line is a strip microstrip line structure, and the two first sub-bonding lines are arranged parallel to the edge of the signal line.

[0018] In one embodiment, the optical component includes a first component and a second component that are spaced apart, the first left ground plane, the first signal line and the first right ground plane are located in the first component, and the second left ground plane, the second signal line and the second right ground plane are located in the second component.

[0019] In one embodiment, the first component is an optical transceiver device, and the second component is a printed circuit board.

[0020] The present application discloses an optical module, comprising an optical component as described in any one of the above technical solutions.

[0021] Compared with the prior art, the second bonding wire of the technical solution of the present application is connected to the ground plane to form an electromagnetic shielding, and the second bonding wire passes through the signal line area where the first bonding wire is set. The electromagnetic shielding effect can be well radiated to the first bonding wire area, which can reduce the inductance of the first bonding wire and reduce the impedance of the first bonding wire, which is beneficial to the efficient transmission of the signal in the signal line, and can greatly reduce the loss, improve the transmission bandwidth, and meet the high-frequency design requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a stereogram of the optical assembly of the present application;

[0023] Figure 2 is a top view of the optical assembly of the present application;

[0024] Figure 3 yes Figure 2 Enlarged view of the middle area;

[0025] Figure 4 is a perspective view of an optical assembly of the prior art;

[0026] Figure 5 is a top view of an optical assembly of the prior art;

[0027] Figure 6 yes Figure 5 Enlarged view of the middle area;

[0028] Figure 7 It is an impedance simulation effect diagram at the first bonding wire in the prior art and the present application;

[0029] Figure 8 It is a simulation effect diagram of return loss in the prior art and the present application;

[0030] Fig. 9 It is a simulation effect diagram of insertion loss in the prior art and this application;

[0031] Fig.10 is a current distribution diagram at the first bonding wire in the prior art;

[0032] Fig.11 It is the current distribution diagram at the first bonding wire in this application. DETAILED DESCRIPTION

[0033] The present application will be described in detail below in conjunction with the specific implementations shown in the accompanying drawings. However, these implementations do not limit the present application, and any structural, methodological, or functional changes made by a person of ordinary skill in the art based on these implementations are all included in the protection scope of the present application.

[0034] In various drawings of the present application, for the convenience of illustration, some sizes of structures or parts are exaggerated relative to other structures or parts, and thus, are only used to illustrate the basic structure of the subject matter of the present application.

[0035] In addition, terms such as "upper", "above", "lower", "below", etc. used herein to indicate spatial relative positions are used for the purpose of convenience to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings. Terms of spatial relative position may be intended to include different orientations of the device in use or operation other than the orientation shown in the drawings. For example, if the device in the figure is turned over, the units described as being "below" or "beneath" other units or features will be located "above" the other units or features. Therefore, the exemplary term "below" can encompass both the above and below orientations. The device may be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptors used herein interpreted accordingly.

[0036] Ginseng Figures 1 to 3 In one embodiment of the present application, an optical component 100 is provided.

[0037] The optical component 100 includes a signal line 10 , a ground plane 20 and a bonding wire 30 .

[0038] The signal line 10 includes a first signal line 11 and a second signal line 12 which are spaced apart from each other.

[0039] Here, the signal line 10 is used to transmit a signal. The signal line 10 is, for example, a radio frequency (RF) signal line, but is not limited thereto.

[0040] In addition, “distributed at intervals” means that the first signal lines 11 and the second signal lines 12 are disconnected from each other.

[0041] The bonding wires 30 include a first bonding wire 31 and at least one second bonding wire 32 which are adjacently disposed.

[0042] The first bonding wire 31 connects the first signal line 11 and the second signal line 12 .

[0043] The second bonding wire 32 is connected to the ground plane 20 , and at least a portion of the second bonding wire 32 is suspended above the signal line 10 .

[0044] Here, the bonding wire 30 can be, for example, a gold wire, and can be fixed to the signal line 10 or the ground plane 20 by welding. The bonding wire 30 is used to realize signal transmission between two links that need to be connected. For example, the first bonding wire 31 can realize signal transmission between the first signal line 11 and the second signal line 12.

[0045] In addition, “adjacent arrangement” means that the first bonding wire 31 and at least one second bonding wire 32 are adjacently arranged, the first bonding wire 31 connects the first signal line 11 and the second signal line 12, and the second bonding wire 32 surrounds or is arranged in the distribution area of ​​the first bonding wire 31; “the second bonding wire 32 is at least partially suspended and covers above the signal line 10” means that the extension path of the second bonding wire 32 passes through the signal line 10 area, and the second bonding wire 32 and the signal line 10 do not contact each other.

[0046] In this embodiment, the second bonding wire 32 is connected to the ground plane 20 to form an electromagnetic shield, and the second bonding wire 32 passes through the signal line 10 area where the first bonding wire 31 is set. The electromagnetic shielding effect can be well radiated to the first bonding wire 31 area, which can reduce the inductance of the first bonding wire 31 and reduce the impedance of the first bonding wire 31, which is beneficial to the efficient transmission of the signal in the signal line 10, and can greatly reduce the loss and improve the transmission bandwidth, meeting the high-frequency design requirements.

[0047] In this embodiment, at least a portion of the second bonding wire 32 is suspended and covers the first bonding wire 31 .

[0048] That is to say, at least a portion of the second bonding wires 32 are arranged to cross the first bonding wires 31 , so that the impedance of the first bonding wires 31 can be further reduced.

[0049] In this embodiment, the optical component 100 includes a first component 101 and a second component 102 that are spaced apart from each other. The first signal line 11 is located in the first component 101 , and the second signal line 12 is located in the second component 102 .

[0050] Here, the first component 101 and the second component 102 may be optical transceiver devices or circuit boards, but are not limited thereto. The first component 101 and the second component 102 may be packaging structures bonded by other bonding wires.

[0051] For example, the first component 101 is a light emitting device 101 (Transmitter Optical Subassembly, TOSA), and the second component 102 is a printed circuit board 102 (Printed Circuit Board, PCB). When the first bonding wire 31 is used to realize the interconnection between the light emitting device 101 and the printed circuit board 102, in order to obtain a higher bandwidth and meet high-frequency design requirements, it is necessary to ensure the impedance continuity of the first bonding wire 31, the light emitting device 101 and the printed circuit board 102 as much as possible. In this embodiment, the second bonding wire 32 is set to effectively reduce the influence of the inductance of the first bonding wire 31 itself on the impedance continuity, thereby improving the transmission bandwidth to meet the high-frequency design requirements.

[0052] Combination Figure 2 and Figure 3 , is a schematic diagram of an optical component 100 of a specific example of the present application.

[0053] The ground plane 20 includes a left ground plane 21 and a right ground plane 22 located at two sides of the signal line 10 , and the second bonding wire 32 connects the left ground plane 21 and the right ground plane 22 .

[0054] The left ground plane 21 includes a first left ground plane 211 and a second left ground plane 212 that are spaced apart from each other, and the right ground plane 22 includes a first right ground plane 221 and a second right ground plane 222 that are spaced apart from each other.

[0055] Here, the left ground plane 21, the signal line 10 and the right ground plane 22 are arranged in parallel in sequence, the first left ground plane 211, the first signal line 11 and the first right ground plane 221 are located in the first component 101, the second left ground plane 212, the second signal line 12 and the second right ground plane 222 are located in the second component 102, and the first component 101 and the second component 102 are distributed at intervals.

[0056] The bonding wires 30 further include a third bonding wire 33 and a fourth bonding wire 34 .

[0057] The third bonding wire 33 connects the first left ground plane 211 and the second left ground plane 212 , and the fourth bonding wire 34 connects the first right ground plane 221 and the second right ground plane 222 .

[0058] That is, the first component 101 and the second component 102 are interconnected through the first bonding wire 31 , the third bonding wire 33 and the fourth bonding wire 34 .

[0059] One end of the second bonding wire 32 is connected to one of the first left ground plane 211 and the second left ground plane 212 , and the other end of the second bonding wire 32 is connected to one of the first right ground plane 221 and the second right ground plane 222 . In this way, the extension path of the second bonding wire 32 can be ensured to pass through the signal line 10 area.

[0060] Specifically, the bonding wires 30 include four groups of second bonding wires 32, which respectively connect the first left ground plane 211 and the first right ground plane 221, the first left ground plane 211 and the second right ground plane 222, the second left ground plane 212 and the first right ground plane 221, and the second left ground plane 212 and the second right ground plane 222.

[0061] Here, the first group of second bonding wires 32a connects the first left ground plane 211 and the first right ground plane 221, the second group of second bonding wires 32b connects the first left ground plane 211 and the second right ground plane 222, the third group of second bonding wires 32c connects the second left ground plane 212 and the first right ground plane 221, and the fourth group of second bonding wires 32d connects the second left ground plane 212 and the second right ground plane 222.

[0062] That is to say, the extension directions of the first group of second bonding wires 32a and the fourth group of second bonding wires 32d are parallel to the arrangement directions of the left ground plane 21, the signal line 10 and the right ground plane 22. The first group of second bonding wires 32a is located in the first component 101, and the fourth group of second bonding wires 32d is located in the second component 102; the second group of second bonding wires 32b and the third group of second bonding wires 32c are cross-arranged bonding wires, and the second group of second bonding wires 32b and the third group of second bonding wires 32c are both connected to the first component 101 and the second component 102.

[0063] It can be seen that in this specific example, multiple groups of second bonding wires 32 arranged in parallel and crosswise manner form an electromagnetic shield that fully covers the first bonding wires 31 , which can more effectively reduce the inductance of the first bonding wires 31 and make the impedance at the first bonding wires 31 more continuous.

[0064] In this specific example, the first bonding wire 31 includes two first sub-bonding wires 31 a having a first gap, and the third bonding wire 33 includes two third sub-bonding wires 33 a having a third gap, and the first gap is larger than the third gap.

[0065] That is to say, the gap between the two first sub-bonding wires 31 a is relatively large, which can reduce the mutual inductance between the two first sub-bonding wires 31 a , lower the impedance, and further increase the impedance continuity.

[0066] In other examples, the first bonding wire 31 includes two first sub-bonding wires 31 a that are spaced apart from each other, and the contact point between the first sub-bonding wire 31 a and the signal line 10 is located within 100 micrometers inward from the edge of the signal line 10 .

[0067] Here, the two first sub-bonding wires 31 a are arranged in parallel, the signal line 10 is a strip microstrip line structure, and the two first sub-bonding wires 31 a are arranged parallel to the edge of the signal line 10 .

[0068] That is, the two first sub-bonding wires 31a are both arranged close to the edge of the signal line 10, so that there is a sufficiently large gap between the two first sub-bonding wires 31a, which can reduce the mutual inductance between the two first sub-bonding wires 31a, reduce the impedance, and further increase the impedance continuity.

[0069] In addition, in this specific example, the second bonding wire 32 and the fourth bonding wire 34 include two sub-bonding wires respectively, but the present invention is not limited thereto.

[0070] It can be understood that in other examples, the number and location of the second bonding wires 32 may be determined according to actual conditions.

[0071] Next, a comparison is made between the optical component 100 of the present application and the optical component 100 ′ of the prior art.

[0072] Combination Figures 4 to 6 , is a schematic diagram of an optical component 100 ′ of the prior art. For ease of description, similar structures in the prior art and the present application are given similar names and numbers.

[0073] In the prior art, the optical component 100' includes a signal line 10', the signal line 10' includes a first signal line 11' and a second signal line 12' that are spaced apart, the first signal line 11' and the second signal line 12' are connected by a first bonding wire 31', the first bonding wire 31' includes two first sub-bonding wires 31a', and the gap between the two first sub-bonding wires 31a' in the prior art is smaller than the gap between the two first sub-bonding wires 31a in the present application.

[0074] At this time, since the gap between the two first sub-bonding wires 31a' in the prior art is small, there is a large mutual inductance between the two first sub-bonding wires 31a', so that the impedance of the first bonding wire 31' is large, and the link impedance has a sudden change at the first bonding wire 31'.

[0075] The gap between the two first sub-bonding wires 31a of the present application is larger, which can reduce the mutual inductance between the two first sub-bonding wires 31a, and the second bonding wire 32 of the present application is connected to the ground plane 20 to form an electromagnetic shield, which can reduce the inductance of the first bonding wire 31 and reduce the impedance of the first bonding wire 31, which is beneficial to the efficient transmission of the signal in the signal line 10, and can greatly reduce the loss, improve the transmission bandwidth, and meet the high-frequency design requirements.

[0076] Specific, combined Figure 7 , which is an impedance simulation effect diagram of the first bonding wire 31 ′ (or the first bonding wire 31 ) in the prior art and the present application.

[0077] Curve L1 represents the impedance at the first bonding wire 31 ′ in the prior art, and the impedance is about 57 ohm.

[0078] Curve L2 represents the impedance at the first bonding wire 31 in the present application, and the impedance is greater than 53 ohm.

[0079] It can be seen that the impedance at the first bonding wire 31 of the present application is smaller than the impedance at the first bonding wire 31 ′ of the prior art.

[0080] Combination Figure 8 and Fig. 9 , which is a simulation effect diagram of return loss and insertion loss in the prior art and this application.

[0081] Figure 8 The curve M1 in the figure represents the return loss of the prior art, and the curve M2 represents the return loss of the present application; Fig. 9 The N1 in the figure represents the insertion loss of the prior art, and the curve N2 represents the insertion loss of the present application.

[0082] It can be seen that the return loss and insertion loss of the present application are greatly improved compared with the prior art, which can increase the link impedance continuity and effectively reduce the transmission loss.

[0083] Combination Fig.10 and Fig.11 , which is a current distribution diagram at the first bonding wire 31 ′ (or the first bonding wire 31 ) in the prior art and the present application.

[0084] Combination Fig.10 In the prior art, since the impedance at the first bonding wire 31' is large and the link impedance is discontinuous, the current flowing through the signal line 10' is reflected at the first bonding wire 31' (see Fig.10 The current distribution at A in the figure makes the current actually flowing through the signal line 10' less, which affects the transmission of the signal.

[0085] Combination Fig.11 In the prior art, since the impedance at the first bonding wire 31 is small and the link impedance is continuous, the current flowing through the signal line 10 will not be reflected at the first bonding wire 31, so that the current actually flowing through the signal line 10' remains unchanged, greatly improving the signal transmission performance.

[0086] The present invention further provides an optical module, comprising the optical component 100 as described above.

[0087] In addition, the optical module may also include other components, such as optical coupling devices, optical multiplexing / demultiplexing devices, etc., which can be determined according to actual conditions.

[0088] To sum up, the second bonding wire 32 of the present application is connected to the ground plane 20 to form an electromagnetic shield, and the second bonding wire 32 passes through the signal line 10 area where the first bonding wire 31 is set, and the electromagnetic shielding effect can be well radiated to the first bonding wire 31 area, which can reduce the inductance of the first bonding wire 31 and reduce the impedance of the first bonding wire 31, which is beneficial to the efficient transmission of the signal in the signal line 10, and can greatly reduce the loss, improve the transmission bandwidth, and meet the high-frequency design requirements.

[0089] In addition, in the present application, there is a sufficiently large gap between the two first sub-bonding wires 31 a, which can reduce the mutual inductance between the two first sub-bonding wires 31 a, lower the impedance, and further increase the impedance continuity.

[0090] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0091] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present application. They are not intended to limit the scope of protection of the present application. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present application should be included in the scope of protection of the present application.

Claims

1. An optical component, characterized in that: The invention comprises a signal line, a ground plane and a bonding wire, wherein the signal line comprises a first signal line and a second signal line which are spaced apart, the ground plane comprises a left ground plane and a right ground plane which are located on both sides of the signal line, the left ground plane comprises a first left ground plane and a second left ground plane which are spaced apart, the right ground plane comprises a first right ground plane and a second right ground plane which are spaced apart, the bonding wire comprises a first bonding wire, a second group of second bonding wires and a third group of second bonding wires, the first bonding wire connects the first signal line and the second signal line, the second group of second bonding wires connects the first left ground plane and the second right ground plane, the third group of second bonding wires connects the second left ground plane and the first right ground plane, the second group of second bonding wires comprises two sub-bonding wires, and the third group of second bonding wires comprises two sub-bonding wires.

2. The optical component according to claim 1, characterized in that The second group of second bonding wires and the third group of second bonding wires are cross-arranged.

3. The optical component according to claim 1, characterized in that The second group of second bonding wires and the third group of second bonding wires are both suspended and cover the first bonding wires.

4. The optical component according to claim 1, characterized in that Two sub-bonding wires in the second group of second bonding wires are arranged at intervals, and two sub-bonding wires in the third group of second bonding wires are arranged at intervals.

5. The optical component according to claim 1, characterized in that Two sub-bonding lines in the second group of second bonding lines are parallel to each other, and two sub-bonding lines in the third group of second bonding lines are parallel to each other.

6. The optical component according to claim 1, characterized in that The bonding wires further include a first group of second bonding wires and a fourth group of second bonding wires, the first group of second bonding wires connecting the first left ground plane and the first right ground plane, and the fourth group of second bonding wires connecting the second left ground plane and the second right ground plane.

7. The optical component according to claim 6, characterized in that The first group of second bonding wires includes one sub-bonding wire, and the fourth group of second bonding wires includes one sub-bonding wire.

8. The optical component according to claim 6, characterized in that The first group of second bonding wires and the fourth group of second bonding wires are both located outside the second group of second bonding wires and the third group of second bonding wires.

9. The optical component according to claim 1, characterized in that: The bonding wires further include a third bonding wire and a fourth bonding wire. The third bonding wire connects the first left ground plane and the second left ground plane. The fourth bonding wire connects the first right ground plane and the second right ground plane.

10. The optical component according to claim 9, characterized in that The third bonding wire includes one sub-bonding wire, and the fourth bonding wire includes one sub-bonding wire.

11. The optical component according to claim 9, characterized in that The third bonding wire and the fourth bonding wire are both located outside the second group of second bonding wires and the third group of second bonding wires.

12. The optical component according to claim 9, characterized in that The first bonding wire includes two first sub-bonding wires having a first gap, the third bonding wire includes two third sub-bonding wires having a third gap, and the first gap is larger than the third gap.

13. The optical component according to claim 1, characterized in that The first bonding wire includes two first sub-bonding wires that are spaced apart from each other, and a contact point between the first sub-bonding wire and the signal wire is located within 100 micrometers inward from an edge of the signal wire.

14. The optical component according to claim 1, characterized in that The signal line includes a first edge close to the left ground plane and a second edge close to the right ground plane. The contact point between the first sub-bonding line relatively close to the first edge of the two first sub-bonding lines and the signal line is located within 100 microns inward of the first edge, and the contact point between the first sub-bonding line relatively close to the second edge of the two first sub-bonding lines and the signal line is located within 100 microns inward of the second edge.

15. The optical component according to any one of claims 12 to 14, characterized in that The two first sub-bonding lines are arranged in parallel, the signal line is a strip microstrip line structure, and the two first sub-bonding lines are arranged parallel to the edge of the signal line.

16. The optical component according to claim 1, characterized in that The optical component includes a first component and a second component that are spaced apart from each other. The first left ground plane, the first signal line, and the first right ground plane are located in the first component. The second left ground plane, the second signal line, and the second right ground plane are located in the second component.

17. The optical component according to claim 16, characterized in that The first component is an optical transceiver device, and the second component is a printed circuit board.

18. An optical module, characterized in that: Comprising the optical component as claimed in any one of claims 1-17.

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