Efficient heat dissipation device applied to high-speed IO laminated optical module

Abstract

The invention relates to a high-efficiency heat dissipation device applied to a high-speed IO laminated optical module, and the device comprises an upper-layer optical fiber cage, a lower-layer optical fiber cage, a plurality of heat-conducting elastic assemblies, and a plurality of heat dissipation assemblies, and a first reserved space is disposed between the upper-layer optical fiber cage and the lower-layer optical fiber cage. The heat dissipation assembly is located in the first reserved space or above the upper-layer optical fiber cage, and the heat dissipation assembly comprises a heat dissipation plate and is used for heat dissipation; the heat conduction elastic assembly is elastically connected with the optical fiber cage, two ends of the heat conduction elastic assembly abut against the optical module and the heat dissipation assembly respectively, and the heat conduction elastic assembly is used for applying elastic pressure to the optical module and transferring heat of the optical module to the heat dissipation assembly. According to the invention, the lower optical module and the upper optical module are subjected to heat dissipation by adopting the heat dissipation assembly, so that the heat dissipation effect is effectively improved; according to the invention, the large heat dissipation plate is adopted to dissipate heat of the optical modules in the multi-group double-layer optical fiber cage, so that the cost can be reduced; elastic pressure is applied to the optical module by adopting the heat-conducting elastic assembly, so that smooth plugging and unplugging of the optical module are effectively guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of optical fiber communication, and in particular to a high-efficiency heat dissipation device applied to a high-speed IO stacked optical module. Background Art

[0002] As an important part of optical fiber communication, optical modules are optoelectronic devices that realize the photoelectric conversion and electro-optical conversion functions in the process of optical signal transmission. With the rapid development of communication technology, the requirements for the IO (Input / Output) transmission efficiency of optical modules are getting higher and higher;

[0003] Using stacked optical modules is one of the methods to improve transmission efficiency. The connection between optical modules and connectors usually requires the assistance of fiber cages, which are used to provide support and electromagnetic shielding. However, due to the closed structure in the middle of traditional stacked connectors or the small size of the lower fiber cage, it is difficult to implement a heat dissipation solution for the lower optical module, resulting in poor heat dissipation; and, after the optical modules are inserted into multiple sets of double-layer fiber cages, it is difficult to have a good flatness, which leads to the optical module being difficult to plug and unplug and the optical module being unstable. Summary of the invention

[0004] The technical problem to be solved by the present invention is the problem of non-smooth plugging and unplugging of optical modules and poor heat dissipation. In view of the above-mentioned defects of the prior art, an efficient heat dissipation device applied to high-speed IO stacked optical modules is provided.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A high-efficiency heat dissipation device for high-speed IO stacked optical modules is constructed, wherein the device comprises a plurality of double-layer optical fiber cages, a plurality of heat-conductive elastic components and a plurality of heat-dissipating components. The double-layer optical fiber cage comprises an upper optical fiber cage and a lower optical fiber cage and is used to install the optical module. A first reserved space is provided between the upper optical fiber cage and the lower optical fiber cage. The heat-dissipating components are respectively located in the first reserved space or above the upper optical fiber cage and are used to dissipate heat. The heat-conductive elastic component is elastically connected to the optical fiber cage, and one end abuts against the optical module and the other end abuts against the heat-dissipating component, and is used to apply elastic pressure to the optical module and transfer the heat of the optical module to the heat-dissipating component.

[0007] Furthermore, the thermally conductive elastic component includes an elastic module, the elastic module includes a concave disk, an elastic arm and a mounting plate, and the concave disk, the elastic arm and the mounting plate are integrally formed.

[0008] Furthermore, any of the optical fiber cages is provided with a second reserved space, the position of the second reserved space corresponds to the position of the optical module, and the position of the elastic module corresponds to the position of the second reserved space.

[0009] Furthermore, the mounting plate is connected to the optical fiber cage so that the elastic module is fixedly connected to the optical fiber cage; one end of the elastic arm is connected to the concave plate, and the other end is connected to the mounting plate, and is used to provide elastic deformation space for the concave plate.

[0010] Furthermore, the concave plate is sunken downward to form a groove, and the concave surface of the concave plate passes through the second reserved space and abuts against the optical module, and is used to apply elastic pressure to the optical module.

[0011] Furthermore, the thermally conductive elastic component also includes a heat conduction module, which is disposed in the groove, with one end of the heat conduction module abutting against the concave surface and the other end of the heat dissipation component.

[0012] Furthermore, the heat dissipation component includes a heat sink and a circulation pipe, wherein a liquid inlet and a liquid outlet are respectively provided at both ends of the heat sink, and a cavity is provided inside the heat sink, wherein the liquid inlet and the liquid outlet are both connected to the cavity, and the cavity is used to circulate cooling liquid to dissipate heat from the optical module.

[0013] Furthermore, the circulation pipe is respectively connected to the liquid inlet and the liquid outlet, and is used to input and discharge the cooling liquid into and out of the cavity.

[0014] Furthermore, a movable baffle is provided at the inlet end of the optical fiber cage, and the heat sink runs through the entire first reserved space, and the movable baffle is used to embed the heat sink in the first reserved space.

[0015] Furthermore, it includes a PCB substrate, and the double-layer optical fiber cage is arranged correspondingly above the PCB substrate and fixedly connected to the PCB substrate.

[0016] The beneficial effects of the present invention are as follows: the present invention relates to an efficient heat dissipation device applied to a high-speed IO stacked optical module, comprising an upper optical fiber cage, a lower optical fiber cage, a plurality of heat-conductive elastic components and a plurality of heat-dissipating components, a first reserved space is provided between the upper optical fiber cage and the lower optical fiber cage, the heat-dissipating components are respectively located in the first reserved space or above the upper optical fiber cage, the heat-dissipating components include a heat-dissipating plate and are used for heat dissipation; the heat-conductive elastic component is elastically connected to the optical fiber cage, and the two ends are respectively abutted against the optical module and the heat-dissipating component, and are used to apply elastic pressure to the optical module, and transfer the heat of the optical module to the heat-dissipating component. The present invention adopts the heat-dissipating component to dissipate heat for the lower optical module and the upper optical module respectively, which effectively improves the heat dissipation effect; the present invention adopts a large heat-dissipating plate to dissipate heat for the optical modules in multiple groups of double-layer optical fiber cages, so that the entire device structure is simpler and is conducive to reducing costs; the present invention adopts the heat-conductive elastic component to apply a positive force to the optical module, that is, the elastic module applies elastic pressure to the optical module, so that the optical fiber cage does not deform during the hot plugging process of the optical module, effectively ensuring the smooth hot plugging of the optical module, and effectively ensuring the stability of the connection between the optical module and the connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work:

[0018] Figure 1 It is an overall stereogram of a high-efficiency heat dissipation device applied to a high-speed IO stacked optical module in one embodiment of the present invention;

[0019] Figure 2 for Figure 1 The overall stereogram of the efficient heat dissipation device used in high-speed IO stacked optical modules without a housing;

[0020] Figure 3 for Figure 2 The overall stereogram of the efficient heat dissipation device used in high-speed IO stacked optical modules without a heat sink;

[0021] Figure 4 The present invention Figure 3 A partial enlarged view of the G in the middle;

[0022] Figure 5 is a three-dimensional diagram of another embodiment of the present invention in which the concave disk is provided with an elastic structure;

[0023] Figure 6 is a three-dimensional diagram of a heat sink with a heat conduction module in the present invention;

[0024] Figure 7 The present invention Figure 6 Exploded diagram of

[0025] Figure 8 is a three-dimensional diagram of a thermally conductive elastic component in another embodiment of the present invention;

[0026] Fig. 9 is an exploded view of a thermally conductive elastic component and a heat dissipation component in another embodiment of the present invention;

[0027] Fig.10 It is a three-dimensional diagram of the device when the upper layer adopts air cooling to dissipate heat in the present invention.

[0028] Explanation of reference numerals: 1. optical module; 2. PCB substrate; 3. double-layer optical fiber cage; 4. thermally conductive elastic component; 5. heat dissipation component; 31. first reserved space; 32. second reserved space; 33. movable baffle; 34. inlet end; 41. elastic module; 411. concave disk; 4111. groove; 4112. lower concave surface; 412. elastic arm; 413. mounting plate; 42. thermal conduction module; 51. heat sink; 511. cavity; 5111. convex strip; 512. liquid inlet; 513. liquid outlet; 52. circulation pipe; 61. elastic structure; 62. spring; 71. spring; 72. bump; 73. heat absorbing plate; 81. heat sink; 82. buckle. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] Please refer to the attached Figure 1-Figure 8 The present invention proposes an efficient heat dissipation device applied to a high-speed IO stacked optical module 1, comprising a plurality of double-layer optical fiber cages 3, a plurality of thermally conductive elastic components 4 and a plurality of heat dissipation components 5. The double-layer optical fiber cage 3 comprises an upper optical fiber cage and a lower optical fiber cage, and is used to install the optical module 1. A first reserved space 31 is provided between the upper optical fiber cage and the lower optical fiber cage. The heat dissipation component 5 is located in the first reserved space 31 or above the upper optical fiber cage, and is used to dissipate heat. The thermally conductive elastic component 4 is elastically connected to the optical fiber cage, and one end abuts against the optical module 1, and the other end abuts against the heat dissipation component 5, and is used to apply elastic pressure to the optical module 1, and transfer the heat of the optical module 1 to the heat dissipation component 5.

[0031] In the present embodiment, an efficient heat dissipation device applied to a high-speed IO stacked optical module 1 includes a PCB substrate 2, multiple groups of double-layer optical fiber cages 3, multiple thermally conductive elastic components 4 and multiple heat dissipation components 5, the double-layer optical fiber cages 3 are arranged correspondingly above the PCB substrate 2 (Printed Circuit Board) and are fixedly connected to the PCB substrate 2; each group of double-layer optical fiber cages 3 includes an upper optical fiber cage and a lower optical fiber cage, the end of the upper optical fiber cage is connected to the end of the lower optical fiber cage and is used to install a connector, the inlet end 34 of the upper optical fiber cage and the lower optical fiber cage are separated and used to plug and unplug the optical module 1, and the optical module 1 is connected to the connector to form a communication connection; any optical fiber cage is provided with a second reserved space 32, the position of the second reserved space 32 corresponds to the position of the optical module 1, the thermally conductive elastic component 4 includes an elastic module 41, and the elastic module 41 includes an integrally formed concave disc 411, an elastic arm 412 and a mounting plate 41 3, and the position of the elastic module 41 corresponds to the position of the second reserved space 32; the mounting plate 413 is connected to the optical fiber cage so that the elastic module 41 is fixedly connected to the optical fiber cage; one end of the elastic arm 412 is connected to the concave plate 411, and the other end is connected to the mounting plate 413, and is used to provide elastic deformation for the concave plate 411; the concave plate 411 is recessed downward to form a groove 4111, and the lower concave surface 4112 of the concave plate 411 passes through the second reserved space 32 and abuts against the optical module 1, and is used to provide a positive force for the optical module 1. In a specific embodiment, the positive force refers to a force perpendicular to the contact surface, that is, the elastic module 41 applies elastic pressure to the optical module 1, so that the optical module 1 is hot-swapped during hot-plugging. The fiber cage does not deform, effectively ensuring that the optical module 1 is hot-plugged smoothly and stably connected to the connector; the thermally conductive elastic component 4 also includes a heat conduction module 42, which is arranged in the groove 4111, and one end of the heat conduction module 42 abuts against the lower concave surface 4112, and the other end abuts against the heat dissipation component 5. In a specific embodiment, the heat conduction module 42 can use a TIM thermal interface material with elasticity and thermal conductivity. The TIM thermal interface material provides a positive force for the optical module 1 and effectively transfers the heat of the optical module 1 to the heat dissipation component 5; the heat dissipation component 5 includes a heat dissipation plate 51 and a flow pipe 52. The heat dissipation plate 51 is provided with a liquid inlet 512 and a liquid outlet 513 at both ends, and a cavity 5 is provided inside the heat dissipation plate 51. 11, the liquid inlet 512 and the liquid outlet 513 are both connected to the cavity 511, the cavity 511 is used to circulate the cooling liquid, the circulation pipe 52 connects the liquid inlet 512 and the liquid outlet 513, and is used to input and discharge the cooling liquid into the cavity 511, the cooling liquid takes away the heat of the optical module 1 to achieve heat dissipation of the optical module 1; the inlet end 34 of the optical fiber cage is provided with a movable baffle 33, the heat sink 51 runs through the entire first reserved space 31, the movable baffle 33 is used to make the heat sink 51 embedded in the first reserved space 31, and a large heat sink 51 is used to dissipate heat for multiple groups of double-layer optical fiber cages 3, so that the entire equipment structure is simpler and the cost is effectively reduced.

[0032] The present invention adopts a heat dissipation component 5 to dissipate heat for the lower optical module 1 and the upper optical module 1 respectively, thereby effectively improving the heat dissipation effect; the present invention adopts a large heat dissipation plate 51 to dissipate heat for the optical modules 1 in multiple groups of double-layer optical fiber cages 3, thereby making the entire device structure simpler and effectively reducing costs; the present invention adopts a thermal conductive elastic component 4 to apply a positive force to the optical module 1, that is, the elastic module 41 applies elastic pressure to the optical module 1, so that the optical fiber cage does not deform during the hot plugging process of the optical module 1, effectively ensuring smooth hot plugging of the optical module 1, and effectively ensuring the stability of the connection between the optical module 1 and the connector.

[0033] Please refer to Figure 1 and Figure 2 A high-efficiency heat dissipation device applied to a high-speed IO stacked optical module 1 includes a PCB substrate 2 and a plurality of groups of double-layer optical fiber cages 3, the double-layer optical fiber cages 3 are arranged correspondingly above the PCB substrate 2 and are fixedly connected to the PCB substrate 2; each group of double-layer optical fiber cages 3 includes an upper optical fiber cage and a lower optical fiber cage, the end of the upper optical fiber cage is connected to the end of the lower optical fiber cage and is used to install a connector, the inlet ends 34 of the upper optical fiber cage and the lower optical fiber cage are separated and are used to plug and unplug the optical module 1, and the optical module 1 is connected to the connector to form a communication connection.

[0034] In the specific implementation: the PCB substrate 2 (Printed Circuit Board) is placed horizontally, and multiple groups of double-layer fiber cages 3 are arranged in a straight line on the PCB and fixedly connected to the PCB substrate 2. In a specific embodiment, the number of groups of double-layer fiber cages 3 is not fixed and is set according to actual conditions; each group of double-layer fiber cages 3 includes an upper fiber cage and a lower fiber cage. In a specific embodiment, the number of upper fiber cages and lower fiber cages in each group of double-layer fiber cages 3 is not fixed and is set according to actual conditions. Usually, the upper fiber cage and the lower fiber cage of each group of double-layer fiber cages 3 include two fiber cages; the end of the upper fiber cage is connected to the end of the lower fiber cage and is used to install a connector. The inlet ends 34 of the upper fiber cage and the lower fiber cage are separated and used to plug and unplug the optical module 1. The optical module 1 is connected to the connector to form a communication connection. The fiber cage is used to provide support and electromagnetic shielding.

[0035] Please refer to Figure 2-Figure 4 Any optical fiber cage is provided with a second reserved space 32 , the position of the second reserved space 32 corresponds to the position of the optical module 1 , the thermal conductive elastic component 4 includes an elastic module 41 , and the position of the elastic module 41 corresponds to the position of the second reserved space 32 .

[0036] In specific implementation: any fiber cage is provided with a second reserved space 32. In a specific embodiment, a hole is dug in the fiber cage above each optical module 1 to form the second reserved space 32. The position and number of the second reserved space 32 correspond to the optical module 1. The thermal conductive elastic component 4 includes an elastic module 41. The number and position of the elastic module 41 correspond to the number and position of the second reserved space 32. The elastic module 41 passes through the second reserved space 32 and abuts against the optical module 1, and is used to provide a positive force for the optical module 1. The positive force refers to the force perpendicular to the contact surface, that is, the elastic module 41 applies elastic pressure to the optical module 1, so that the fiber cage does not deform during the hot plugging of the optical module 1, effectively ensuring smooth hot plugging of the optical module 1 and stable connection with the connector.

[0037] Please refer to Figure 2-Figure 5 The elastic module 41 includes an integrally formed concave disc 411, an elastic arm 412 and a mounting plate 413. The mounting plate 413 is connected to the optical fiber cage so that the elastic module 41 and the optical fiber cage are fixedly connected. One end of the elastic arm 412 is connected to the concave disc 411, and the other end is connected to the mounting plate 413, and is used to provide elastic deformation for the concave disc 411.

[0038] In specific implementation: the elastic module 41 includes an integrally formed concave plate 411, an elastic arm 412 and a mounting plate 413. In a specific embodiment, the elastic module 41 is integrally formed by a stamping process. The stamping process refers to the one-time processing of materials such as metal plates into parts of a desired shape through molds and stamping equipment. It has high precision and is conducive to large-scale production, effectively reducing costs. The mounting plate 413 is connected to the optical fiber cage so that the elastic module 41 and the optical fiber cage are fixedly connected. In a specific embodiment, the mounting plate 413 is connected to the optical fiber cage by a riveting process. The riveting process refers to the process of pressing rivets or similar parts into materials by mechanical force to deform them into a specific shape to achieve connection. The operation is simple and effectively reduces costs. One end of the elastic arm 412 is connected to the concave plate 411, and the other end is connected to the mounting plate 413. The elastic arm 412 has good elasticity and is used to provide elastic deformation for the concave plate 411.

[0039] Please refer to Figure 2-Figure 5 The concave plate 411 is recessed downward to form a groove 4111 , and a lower concave surface 4112 of the concave plate 411 passes through the second reserved space 32 and abuts against the optical module 1 , and is used to provide a positive force for the optical module 1 .

[0040] During specific implementation: the concave disk 411 is recessed downward to form a groove 4111. In a specific embodiment, the concave surface 4112 of the concave disk 411 is a plane; the concave surface 4112 passes through the second reserved space 32 and abuts against the optical module 1. The elastic arm 412 provides elastic deformation for the concave surface 4112. During the plugging and unplugging of the optical module 1, the concave surface 4112 has a certain elastic restoring force. Furthermore, the concave surface 4112 provides a positive force for the optical module 1, that is, the concave surface 4112 applies elastic pressure to the optical module 1, so that the optical fiber cage does not deform during the hot plugging and unplugging of the optical module 1, effectively ensuring smooth hot plugging and unplugging of the optical module 1, and effectively ensuring the stability of the connection between the optical module 1 and the connector.

[0041] In another embodiment, if Figure 5 As shown, the lower concave surface 4112 of the concave disk 411 can also be provided with an elastic structure 61. In a specific embodiment, the lower concave surface 4112 is divided into a plurality of spring pieces 62, one end of the spring piece 62 is connected to the lower concave surface 4112, and the other end is bent at a certain angle to the lower concave surface 4112. The spring pieces 62 are cross-arranged, and the spring pieces 62 are elastic, which further applies a positive force to the optical module 1, further ensuring the smooth hot plugging of the optical module 1 and the stability of the connection with the connector; secondly, the optical fiber cage and the concave disk 411 are hollow as a whole, which is more conducive to the heat dissipation of the optical module 1.

[0042] More specifically, spring pieces 62 facing the inside of the cage are provided on both sides of the inlet end 34 of the upper optical fiber cage and the inlet end 34 of the lower optical fiber cage. The spring pieces 62 are elastic. When the optical module 1 is inserted or pulled out, the spring pieces 62 exert a pressure on the optical module 1 toward the inside of the optical fiber cage, thereby further improving the stability of the connection between the optical module 1 and the connector.

[0043] Please refer to Figure 2-Figure 8 The thermally conductive elastic component 4 further includes a heat conduction module 42 . The heat conduction module 42 is disposed in the groove 4111 , and one end of the heat conduction module 42 abuts against the groove 4111 , and the other end abuts against the heat dissipation component 5 .

[0044] In specific implementation: the thermally conductive elastic component 4 also includes a heat conduction module 42, and the heat conduction module 42 is arranged in the groove 4111. In a specific embodiment, the heat conduction module 42 can use a TIM thermal interface material, which is arranged in the groove 4111, and one end of the TIM thermal interface material abuts the lower concave surface 4112, and the other end abuts the heat dissipation component 5. The TIM thermal interface material has strong thermal conductivity, which can reduce the gap between the elastic module 41 and the heat dissipation component 5, thereby reducing the contact thermal resistance and effectively transferring the heat of the optical module 1 to the heat dissipation component 5; the material is elastic and can provide a positive force for the optical module 1, effectively ensuring the smooth hot plugging of the optical module 1 and the stability of the connection with the connector.

[0045] In another embodiment, if Figure 8As shown, the thermally conductive elastic component 4 can also be composed of a heat absorbing plate 73 and a heat conducting module 42. In a specific embodiment, the heat absorbing plate 73 is made of a copper plate, which has good thermal conductivity, and the heat conducting module 42 is made of a TIM thermal interface material, which has good thermal conductivity and elasticity; the TIM thermal interface material is arranged between the heat absorbing plate 73 and the heat dissipation plate 51, and is used to transfer the heat absorbed by the heat absorbing plate 73 to the heat dissipation plate 51; the heat absorbing plate 73 passes through the second reserved space 32 on the optical fiber cage and abuts against the optical module 1, and is used to absorb The heat generated by the optical module 1; the TIM thermal interface material has strong thermal conductivity, which can reduce the gap between the elastic module 41 and the heat dissipation component 5, thereby reducing the contact thermal resistance and effectively transferring the heat of the optical module 1 to the heat dissipation component 5; the TIM thermal interface material is elastic and can provide a positive force for the optical module 1, effectively ensuring the smooth hot plugging of the optical module 1 and the stability of the connection with the connector; at this time, the thermally conductive elastic components 4 are evenly arranged on the heat dissipation plate 51, and the number and position of the thermally conductive elastic components 4 correspond to the number and position of the optical modules 1.

[0046] Please refer to Figure 2-Figure 9 The heat dissipation component 5 includes a heat sink 51 and a circulation tube 52. A liquid inlet 512 and a liquid discharge port 513 are provided at both ends of the heat sink 51. A cavity 511 is provided inside the heat sink 51. The liquid inlet 512 and the liquid discharge port 513 are both connected to the cavity 511. The cavity 511 is used to circulate cooling liquid. The circulation tube 52 connects the liquid inlet 512 and the liquid discharge port 513, and is used to input and discharge the cooling liquid into the cavity 511. The cooling liquid takes away the heat of the optical module 1 to achieve heat dissipation of the optical module 1.

[0047] In a specific implementation: the heat dissipation component 5 includes a heat sink 51 and a circulation tube 52, a liquid inlet 512 and a liquid outlet 513 are provided at both ends of the heat sink 51, a cavity 511 is provided inside the heat sink 51, the liquid inlet 512 and the liquid outlet 513 are both connected to the cavity 511, the cavity 511 is used to circulate cooling liquid, in a specific embodiment, a convex strip 5111 can also be provided in the cavity 511, the cavity 511 and the convex strip 5111 cooperate to form a curved channel, increase the cooling liquid circulation path, and effectively improve the heat dissipation effect; the circulation tube 52 is connected and used to input and discharge the cooling liquid into the cavity 511, and the cooling liquid takes away the heat of the optical module 1 to achieve heat dissipation of the optical module 1.

[0048] In another embodiment, if Fig. 9As shown, a heat sink 51 plus a spring 71 is used to replace the entire thermally conductive elastic component 4 and the heat sink 5. In a specific embodiment, the internal cavity 511 of the heat sink 51 is recessed downward to form a plurality of cavities, and a plurality of protrusions 72 are correspondingly formed at the bottom of the heat sink 51. The position and number of the protrusions 72 correspond to the position and number of the second reserved space 32, and the protrusions 72 pass through the second reserved space 32 and abut against the optical module 1. The spring 71 is located in the cavities, and the number of the springs 71 is not fixed. The protrusions 72 and the springs 71 cooperate to provide a positive force for the optical module 1, and the heat sink 51 directly dissipates heat for the optical module 1.

[0049] Please refer to Figure 2-Figure 10 The heat dissipation component 5 is located in the first reserved space 31 or above the upper optical fiber cage and is used for heat dissipation. The inlet end 34 of the optical fiber cage is provided with a movable baffle 33. The heat dissipation plate 51 runs through the entire first reserved space 31. The movable baffle 33 is used to embed the heat dissipation plate 51 in the first reserved space 31.

[0050] In specific implementation: the heat dissipation component 5 is located in the first reserved space 31 or above the upper optical fiber cage. In a specific embodiment, the heat dissipation component 5 is liquid-cooled, and the double-layer heat dissipation effect is better. A movable baffle 33 is provided between the inlet end 34 of the upper optical fiber cage and the inlet end 34 of the lower optical fiber cage. The movable baffle 33 is located at the front end of the first reserved space 31. The heat dissipation plate 51 runs through the entire first reserved space 31. The movable baffle 33 is used to embed the heat dissipation plate 51 in the first reserved space 31 and fix it so as not to slip.

[0051] In another embodiment, if Fig.10 As shown, the heat dissipation component 5 can also adopt air cooling for heat dissipation. In a specific embodiment, when the lower optical module 1 adopts liquid cooling for heat dissipation and the upper optical module 1 adopts air cooling, the thermally conductive elastic component 4 adopts a heat absorbing plate 73 and a heat conduction module 42. The heat dissipation component 5 includes a heat sink 81 and a buckle 82. The thermally conductive elastic component 4 is horizontally arranged below the heat sink 81, and one end of the thermally conductive elastic component 4 passes through the second reserved space 32 to abut the optical module 1, and the other end abuts the heat sink 81. The thermally conductive elastic component 4 is used to provide a positive force for the optical module 1 and transfer the heat of the optical module 1 to the heat sink 81. The heat sink 81 performs air cooling on the optical module 1. The buckle 82 is located above the heat sink 81 and is used to fix the heat sink 81 on the optical fiber cage.

[0052] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0053] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An efficient heat dissipation device for high-speed IO stacked optical modules, characterized in that: The invention comprises a plurality of double-layer fiber cages, a plurality of heat-conductive elastic components and a plurality of heat-dissipating components. The double-layer fiber cage comprises an upper fiber cage and a lower fiber cage and is used for installing an optical module. A first reserved space is provided between the upper fiber cage and the lower fiber cage. The heat-dissipating components are respectively located in the first reserved space or above the upper fiber cage and are used for heat dissipation. The heat-conductive elastic component is elastically connected to the fiber cage, and one end abuts against the optical module and the other end abuts against the heat-dissipating component, and is used for applying elastic pressure to the optical module and transferring the heat of the optical module to the heat-dissipating component.

2. The high-efficiency heat dissipation device for high-speed IO stacked optical modules according to claim 1, characterized in that: The thermally conductive elastic component comprises an elastic module, and the elastic module comprises a concave disk, an elastic arm and a mounting plate, and the concave disk, the elastic arm and the mounting plate are integrally formed.

3. The high-efficiency heat dissipation device for high-speed IO stacked optical modules according to claim 2, characterized in that: Any of the optical fiber cages is provided with a second reserved space, the position of the second reserved space corresponds to the position of the optical module, and the position of the elastic module corresponds to the position of the second reserved space.

4. The high-efficiency heat dissipation device for high-speed IO stacked optical modules according to claim 3, characterized in that: The mounting plate is connected to the optical fiber cage so that the elastic module is fixedly connected to the optical fiber cage; one end of the elastic arm is connected to the concave plate, and the other end is connected to the mounting plate, and is used to provide elastic deformation space for the concave plate.

5. The high-efficiency heat dissipation device for high-speed IO stacked optical modules according to claim 4, characterized in that: The concave plate is sunken downward to form a groove, and the concave surface of the concave plate passes through the second reserved space and abuts against the optical module, and is used to apply elastic pressure to the optical module.

6. The high-efficiency heat dissipation device for high-speed IO stacked optical modules according to claim 5, characterized in that: The thermally conductive elastic component further includes a heat conduction module, which is disposed in the groove, with one end of the heat conduction module abutting against the lower concave surface and the other end abutting against the heat dissipation component.

7. The high-efficiency heat dissipation device for high-speed IO stacked optical modules according to claim 1, characterized in that: The heat dissipation component includes a heat dissipation plate and a circulation pipe. A liquid inlet and a liquid outlet are respectively provided at both ends of the heat dissipation plate. A cavity is provided inside the heat dissipation plate. The liquid inlet and the liquid outlet are both connected to the cavity. The cavity is used to circulate cooling liquid to dissipate heat from the optical module.

8. The high-efficiency heat dissipation device for high-speed IO stacked optical modules according to claim 7, characterized in that: The flow pipe is connected to the liquid inlet and the liquid outlet respectively, and is used to input and discharge the cooling liquid into and out of the cavity.

9. The high-efficiency heat dissipation device for high-speed IO stacked optical modules according to claim 8, characterized in that: The inlet end of the optical fiber cage is provided with a movable baffle, the heat sink runs through the entire first reserved space, and the movable baffle is used to embed the heat sink in the first reserved space.

10. The high-efficiency heat dissipation device for high-speed IO stacked optical modules according to claim 1, characterized in that: It comprises a PCB substrate, and the double-layer optical fiber cage is arranged correspondingly above the PCB substrate and is fixedly connected to the PCB substrate.

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