Data processing methods, devices, systems, and storage media

Abstract

This invention discloses a data processing method, apparatus, system, and storage medium. The method includes: acquiring a processing line data packet corresponding to a target processing line on a target workpiece using a self-processing device. The processing line data packet includes multiple sets of processing data corresponding one-to-one with multiple processing points on the target processing line. Each set of processing data includes position data indicating the location of the corresponding processing point and height data indicating the height of the corresponding processing point. A two-dimensional waveform diagram is generated based on at least a portion of the processing data in the processing line data packet. The two-dimensional waveform diagram contains a target waveform presented in a planar coordinate system, where the target waveform is the waveform showing the change in height of each processing point on the target processing line corresponding to the processing line data packet as the position of the processing point changes. This scheme can store and process processing data to obtain a two-dimensional waveform diagram that can intuitively display the flatness of the target processing line and has traceability.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more specifically, to a data processing method, apparatus, system, and storage medium. Background Technology

[0002] When machining parts using a processing device, in order to analyze product problems, the ranging mechanism of the processing device can collect machining data during the machining process and transmit it to the processing device's circuit board. The circuit board can sample the machining data, and the sampled machining data needs to be viewed using an oscilloscope. However, when an oscilloscope is not available at the machining site, workers cannot view the machining data of the parts, making it difficult to analyze product problems. Furthermore, the machining data sampled during the machining process is temporary data; after machining is completed, the previously collected machining data is discarded, making it impossible to trace the machining data. Summary of the Invention

[0003] The present invention addresses the aforementioned problems. It provides a data processing method, apparatus, system, and storage medium. This solution can store and process processing data to obtain a two-dimensional waveform diagram that visually displays the flatness of the target processing line and provides traceability.

[0004] According to one aspect of the present invention, a data processing method is provided for processing processing data of a workpiece, applied to a host computer. The method includes: acquiring a processing line data packet corresponding to a target processing line on a target workpiece from a processing device; the processing line data packet includes multiple sets of processing data corresponding one-to-one with multiple processing points on the target processing line; wherein each set of processing data includes position data indicating the position of the corresponding processing point and height data indicating the height of the corresponding processing point, the height being the distance between the processing point and a ranging mechanism in the processing device; generating a two-dimensional waveform based on at least a portion of the processing data in the processing line data packet; the two-dimensional waveform includes a target waveform presented in a planar coordinate system; the target waveform is a waveform showing the change in height of each processing point on the target processing line corresponding to the processing line data packet as the position of the processing point changes; the first coordinate axis of the planar coordinate system represents the position of the processing point, and the second coordinate axis of the planar coordinate system represents the height of the processing point.

[0005] Optionally, the self-processing device acquires a processing line data packet corresponding to a target processing line on a target workpiece, including: querying and acquiring a processing line data packet corresponding to a target processing line on a target workpiece from an initial data packet stored by the self-processing device, based on a first identification information of the target workpiece and a second identification information of the target processing line; wherein the initial data packet includes processing line data packets corresponding one-to-one with multiple processing lines, and the multiple processing lines belong to one or more workpieces.

[0006] Optionally, generating a two-dimensional waveform based on at least a portion of the processing data in the processing line data packet includes: generating a preset background image; generating a planar coordinate system within the preset background image based on at least a portion of the processing data in the processing line data packet; and determining the pixel coordinates of each set of processing data within the preset background image when mapping at least a portion of the processing data to the planar coordinate system, based on the at least a portion of the processing data and the planar coordinate system, so as to generate a two-dimensional waveform.

[0007] Optionally, generating a planar coordinate system within a preset background image based on at least a portion of the processing data in the processing line data packet includes: determining the coordinate axis precision of a first coordinate axis based on the position data contained in at least a portion of the processing data and the image resolution of the preset background image in the direction of the first coordinate axis; determining the coordinate axis precision of a second coordinate axis based on the height data contained in at least a portion of the processing data and the image resolution of the preset background image in the direction of the second coordinate axis; determining the coordinate axis position of the first coordinate axis and the coordinate axis position of the second coordinate axis in the preset background image by combining the position data and height data contained in at least a portion of the processing data and the image resolution of the preset background image in the directions of the first and second coordinate axes respectively; and generating a planar coordinate system within the preset background image based on the determined coordinate axis precision and coordinate axis position.

[0008] Optionally, based on at least some of the processing data and the planar coordinate system, the pixel coordinates of each set of processing data in the preset background image when mapping at least some of the processing data to the planar coordinate system are determined, including: determining the coordinate mapping relationship for mapping the processing data to the corresponding pixel coordinates based on the coordinate axis precision of each coordinate axis in the planar coordinate system and the coordinate axis position of the coordinate axis in the preset background image; and determining the pixel coordinates corresponding to each of the at least some processing data according to the coordinate mapping relationship.

[0009] Optionally, based on at least some processing data and a planar coordinate system, the pixel coordinates of each set of processing data within a preset background image are determined when mapping at least some processing data to the planar coordinate system to generate a two-dimensional waveform. This includes: highlighting the target pixels at the corresponding pixel coordinates of at least some processing data in a manner different from the pixel values ​​of the preset background image to obtain a two-dimensional waveform; or, highlighting the target pixels at the corresponding pixel coordinates of at least some processing data and the intermediate pixels located between adjacent target pixels in a manner different from the pixel values ​​of the preset background image to obtain a two-dimensional waveform, wherein the intermediate pixels are pixels located on the line connecting adjacent target pixels, and the adjacent target pixels are pixels adjacent along the direction of the first coordinate axis.

[0010] Optionally, before generating a two-dimensional waveform based on at least a portion of the processing data in the processing line data packet, the method includes: dividing each group of processing data in the processing line data packet into multiple data sets, wherein the number of groups of processing data in different data sets is the same, and the positions of the processing points corresponding to each group of processing data in each data set are continuous within the processing line; determining the processing data corresponding to the processing point with the largest height and the processing data corresponding to the processing point with the smallest height in each of the multiple data sets, to obtain at least a portion of the processing data in the processing line data packet.

[0011] According to another aspect of the present invention, a data processing method is also provided, applied to a control mechanism in a processing device connected to the aforementioned host computer. The processing device includes a control mechanism, a ranging mechanism, a position measuring mechanism, and a storage mechanism. The control mechanism is connected to the ranging mechanism and the position measuring mechanism respectively. The ranging mechanism is used to collect height data of the processed workpiece and send the collected height data to the control mechanism in real time. The position measuring mechanism is used to collect position data of the processed workpiece and send the collected position data to the control mechanism in real time. The method includes: acquiring the position data collected by the position measuring mechanism and the height data collected by the ranging mechanism; storing the collected position data and height data in the storage mechanism so that the host computer can obtain the processing line data packet from the storage mechanism.

[0012] Optionally, acquiring position data collected by the position measuring mechanism and height data collected by the ranging mechanism includes: acquiring position data collected by the position measuring mechanism; and receiving height data corresponding to each processing point from the ranging mechanism based on the position data to obtain processing data corresponding to each processing point.

[0013] According to another aspect of the present invention, a processing apparatus is also provided, including a control mechanism, a ranging mechanism, a position measuring mechanism, and a storage mechanism. The control mechanism is connected to the ranging mechanism and the position measuring mechanism respectively. The ranging mechanism is used to collect height data of the processed workpiece and send the collected height data to the control mechanism in real time. The position measuring mechanism is used to collect position data of the processed workpiece and send the collected position data to the control mechanism in real time. The control mechanism is used to execute the above-described data processing method.

[0014] According to another aspect of the present invention, a data processing apparatus is also provided for processing processing data of a workpiece. The apparatus includes: an acquisition module for acquiring a processing line data packet corresponding to a target processing line on a target workpiece from a processing device. The processing line data packet includes multiple sets of processing data corresponding one-to-one with multiple processing points on the target processing line. Each set of processing data includes position data indicating the position of the corresponding processing point and height data indicating the height of the corresponding processing point, wherein the height is the distance between the processing point and a ranging mechanism in the processing device; and a generation module for generating a two-dimensional waveform based on at least a portion of the processing data in the processing line data packet. The two-dimensional waveform includes a target waveform presented in a planar coordinate system. The target waveform is a waveform showing the change in height of each processing point on the target processing line corresponding to the processing line data packet as the position of the processing point changes. The first coordinate axis of the planar coordinate system represents the position of the processing point, and the second coordinate axis of the planar coordinate system represents the height of the processing point.

[0015] According to another aspect of the present invention, a storage medium is also provided, on which program instructions are stored, which are used to execute the above-described data processing method when running.

[0016] The aforementioned technical solution acquires the processing line data packets of the target processing lines on the target workpiece via a host computer and generates a two-dimensional waveform diagram based on the processing data. This two-dimensional waveform diagram visually displays the flatness of the target processing lines. After the target workpiece is processed, the flatness of each target processing line can still be analyzed based on the processing data acquired by the host computer and the generated two-dimensional waveform diagram, thus ensuring the traceability of the processing data. Furthermore, when an oscilloscope is not configured at the processing site, the host computer can acquire and process the processing data, which helps save hardware costs.

[0017] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0018] The above and other objects, features, and advantages of the present invention will become more apparent from the more detailed description of the embodiments of the invention in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same parts or steps.

[0019] Figure 1 A schematic flowchart of a data processing method according to an embodiment of the present invention is shown;

[0020] Figure 2 A schematic diagram of a processing apparatus according to an embodiment of the present invention is shown;

[0021] Figure 3 A schematic diagram of a two-dimensional waveform is shown according to an embodiment of the present invention;

[0022] Figure 4 A schematic block diagram of a data processing apparatus according to an embodiment of the present invention is shown;

[0023] Figure 5 A schematic block diagram of an electronic device according to an embodiment of the present invention is shown. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely a part of the embodiments of the present invention, and not all of the embodiments of the present invention. It should be understood that the present invention is not limited to the exemplary embodiments described herein. Based on the embodiments of the present invention described herein, all other embodiments obtained by those skilled in the art without inventive effort should fall within the protection scope of the present invention.

[0025] As described above, in related technologies, the processing data collected during the processing of a workpiece needs to be viewed using an oscilloscope, and the sampled processing data is temporary. After processing is completed, the previously collected processing data is discarded, making it impossible to trace the processing data. To at least partially solve the above-mentioned technical problems, embodiments of the present invention provide a data processing method, apparatus, system, and storage medium. This solution can store and process processing data to obtain a two-dimensional waveform diagram that can intuitively display the flatness of the target processing line and has traceability.

[0026] Please see Figure 1 As shown, it is a schematic flowchart of a data processing method according to an embodiment of the present invention. According to one aspect of the present invention, a data processing method is provided for processing processing data of a workpiece, applied to a host computer, and the method includes steps S110 and S120.

[0027] In step S110, the self-processing device acquires a processing line data packet corresponding to the target processing line on the target workpiece. The processing line data packet includes multiple sets of processing data corresponding one-to-one with multiple processing points on the target processing line. Each set of processing data includes position data for indicating the position of the corresponding processing point and height data for indicating the height of the corresponding processing point. The height is the distance between the processing point and the ranging mechanism in the processing device.

[0028] Please see Figure 2 The diagram shown is a structural schematic of a processing apparatus according to an embodiment of the present invention. The processing apparatus may include a stage 210, a ranging mechanism 220, a processing head 230, and an adjustment mechanism 240. Figure 2 The workpiece 250 is also shown. The workpiece can be any object, such as a wafer or chip; for ease of description and understanding, it will be primarily described as a wafer below. The stage 210 may include a processing platform for placing the workpiece 250, a drive unit for moving the processing platform and the workpiece 250 placed on the processing platform along the x-axis, and a position measuring mechanism for measuring the distance traveled by the processing platform and the workpiece 250 along the x-axis. Exemplarily, the drive unit may be any component capable of driving the workpiece 250 along the x-axis, such as an x-axis linear motor, a ball screw, a combination of a linear guide and a servo motor. The position measuring mechanism may be any component capable of measuring the distance traveled by the processing platform and the workpiece 250 placed on the processing platform along the x-axis, such as a grating ruler or a displacement sensor. The grating ruler can measure the distance between the processing platform and the origin, which can be used as the distance between the workpiece 250 and the origin. The ranging mechanism 220 may be, for example, a laser rangefinder, and the adjusting mechanism 240 may be, for example, a piezoelectric ceramic motor. The adjusting mechanism 240 is connected to the processing head 230, and the adjusting mechanism 240 can drive the processing head 230 to move in the vertical direction (i.e., the z-axis direction) perpendicular to the x-axis direction. There is a gap in the x-axis direction between the ranging mechanism 220, the processing head 230, and the adjusting mechanism 240 connected to the processing head 230.

[0029] During the machining process, the workpiece 250 and the machining head 230 can move relative to each other along the x-axis, and the position measuring mechanism can measure the position of the workpiece 250 in the x-axis direction. Figure 2 In the illustrated embodiment, when machining the workpiece 250, the position of the machining head 230 can be kept fixed in the X-axis direction, while the workpiece 250 can move along the X-axis direction. A position measuring mechanism can measure the movement distance of the workpiece 250 in the X-axis direction, and the position of the workpiece 250 in the X-axis direction can be determined based on the measured movement distance. In another embodiment, when machining the workpiece, the position of the workpiece can be kept fixed, while the machining head can move along a preset machining direction (e.g., ...). Figure 2The illustrated embodiment shows movement along the x-axis. A position measuring mechanism can measure the movement distance of the machining head in a preset machining direction, and the position of the workpiece in the preset machining direction can be determined based on the measured movement distance. This embodiment mainly uses a scheme where the position of the machining head 230 is fixed in the x-axis direction, and the workpiece 250 moves along the x-axis direction as an example. Specifically, during machining, the driving component can drive the machining platform to move along the x-axis direction. During this process, the machining head 230 can machine various machining points in the x-axis direction. The position data of each machining point in the x-axis direction can be determined by the measurement value of a grating ruler. Alternatively, the position data of each machining point in the x-axis direction can be represented by the acquisition sequence number of each machining point. In this case, the control mechanism for the machining device can, based on the measurement value of the position measuring mechanism, trigger the ranging mechanism 220 to measure the height of the machining points from a preset starting position of the machining line according to a preset sampling interval. The position of each machining point can be determined by the corresponding acquisition sequence number and the preset sampling interval. When the workpiece 250 is a wafer, the processing point can be any dicing point on the wafer parallel to the x-axis (processing along the Y-axis can be performed by rotating the wafer 90 degrees using a processing table). The height data of each processing point can be measured by the ranging mechanism 220. The distance between the ranging mechanism and each processing point can be used as the height data of that point. The position and height data of the processing points can be transmitted to the control mechanism. The control mechanism can determine the corresponding control signal based on the position data and output the control signal to the adjustment mechanism 240, thereby controlling the vertical movement of the adjustment mechanism 240 to move the processing head 230 vertically to the processing point position matching the height data, i.e., the processing position matching the height of each processing point.

[0030] For example, the position and height data of the processing points can also be transmitted to a storage mechanism for the processing apparatus. For each of the at least one workpiece processed by the processing apparatus, the storage mechanism can store at least one processing line data packet corresponding one-to-one with at least one processing line on that workpiece. Specifically, each workpiece can have at least one processing line; for example, if the workpiece is a wafer, the processing line on the wafer can be a dicing track. Each data packet can include multiple sets of processing data, each set of processing data corresponding one-to-one with each processing point of the corresponding processing line. Each set of processing data can include position and height data of the corresponding processing point; the position data can indicate the position of the corresponding processing point, and the height data can indicate the height of the corresponding processing point. The storage mechanism can be connected to a host computer, which can retrieve the processing line data packet corresponding to the target processing line on the target workpiece from the at least one processing line data packet stored in the storage mechanism. It is understood that the target workpiece can be any one of the at least one workpieces, and the target processing line can be any one of the at least one processing line on the target workpiece.

[0031] In step S120, a two-dimensional waveform diagram is generated based on at least a portion of the processing data in the processing line data packet. The two-dimensional waveform diagram contains the target waveform presented in a planar coordinate system. The target waveform is the waveform in which the height of each processing point on the target processing line corresponding to the processing line data packet changes with the position of the processing point. The first coordinate axis of the planar coordinate system represents the position of the processing point, and the second coordinate axis of the planar coordinate system represents the height of the processing point.

[0032] For example, after the host computer obtains the machining line data package, it can generate a two-dimensional waveform diagram of the target machining line based on some or all of the machining data in the machining line data package. The two-dimensional waveform diagram can include a planar coordinate system and a target waveform, with the target waveform presented in the planar coordinate system. Specifically, the planar coordinate system can have two mutually perpendicular coordinate axes passing through the origin, denoted as the first coordinate axis and the second coordinate axis, respectively. The first coordinate axis can represent the position of the machining point, and the second coordinate axis can represent the height of the machining point. For each set of machining data in at least a portion of the machining data in the machining line data package, the position data and height data contained in that set of machining data can be used as coordinate values ​​on the corresponding coordinate axes in the planar coordinate system. Based on the position data and height data in that set of machining data, the coordinate points of the corresponding machining points in the planar coordinate system can be determined. Based on the coordinate points determined in the planar coordinate system, the target waveform can be obtained, which can represent the change in the height of each machining point on the target machining line as the position of the machining point changes.

[0033] The aforementioned technical solution acquires the processing line data packets of the target processing lines on the target workpiece via a host computer and generates a two-dimensional waveform diagram based on the processing data. This two-dimensional waveform diagram visually displays the flatness of the target processing lines. After the target workpiece is processed, the flatness of each target processing line can still be analyzed based on the processing data acquired by the host computer and the generated two-dimensional waveform diagram, thus ensuring the traceability of the processing data. Furthermore, when an oscilloscope is not configured at the processing site, the host computer can acquire and process the processing data, which helps save hardware costs.

[0034] Optionally, the self-processing device acquires a processing line data packet corresponding to a target processing line on a target workpiece, including: querying and acquiring a processing line data packet corresponding to a target processing line on a target workpiece from an initial data packet stored by the self-processing device, based on a first identification information of the target workpiece and a second identification information of the target processing line; wherein the initial data packet includes processing line data packets corresponding one-to-one with multiple processing lines, and the multiple processing lines belong to one or more workpieces.

[0035] For example, each workpiece may have corresponding first identification information, such as a string, serial number, or identification code, which can be used to distinguish each workpiece. Similarly, each processing line of each workpiece may have corresponding second identification information, such as a string, serial number, or other information used to distinguish each processing line. In some embodiments, the first and second identification information may be input by the user, and the host computer may determine the first and second identification information in response to the user's input. In other embodiments, when processing the current processing line of the current workpiece, the host computer may obtain the first identification information of the current workpiece from the control mechanism of the processing device or from the image acquired by the image acquisition device of the processing device. In this case, the target workpiece may be the current workpiece, and the target processing line may be the current processing line. In a specific embodiment, the target workpiece may be a wafer, on which a wafer ID may be etched. The image acquisition device of the processing device may acquire an image of the target workpiece and transmit the acquired image to the control mechanism of the processing device. The control mechanism may determine the first identification information of the target workpiece based on the received image and transmit the acquired first identification information to the host computer. In another specific embodiment, the target workpiece can be a wafer, on which a wafer number can be etched. The image acquisition device of the processing apparatus can acquire images of the target workpiece and transmit the acquired images to a host computer. The host computer can determine the first identification information of the target workpiece based on the received images. In other embodiments, the number and arrangement of processing lines on each workpiece are the same. The host computer can store at least one set of second identification information in a preset arrangement order. The host computer can determine the second identification information of the target processing line according to the preset arrangement order. The at least one set of second identification information stored by the host computer can correspond one-to-one with each processing line of each workpiece. In other words, the second identification information of the corresponding processing lines on each workpiece can be the same. Taking a processing line as a dicing track on a wafer as an example, the at least one set of second identification information may include, for example, dicing track 1, dicing track 2, ..., dicing track n.

[0036] In some embodiments, the storage mechanism for the processing apparatus can acquire an initial data packet with first identification information sent by the control mechanism, and the storage mechanism can store at least one set of second identification information arranged in a preset order. The storage mechanism can associate and save each processing line data packet with the initial data packet based on the order in which the control mechanism acquires the processing line data packets, and can also associate and save the processing line data packets with the second identification information one-to-one based on the order in which the control mechanism acquires the processing line data packets and the preset order of the second identification information. In other embodiments, the first identification information corresponding to the initial data packet of each workpiece and the second identification information corresponding to each processing line data packet in the storage mechanism can be input by the user and associated and saved. It is understood that one or more initial data packets can be stored in the storage mechanism, each initial data packet can correspond to a workpiece, and each initial data packet can include at least one processing line data packet corresponding one-to-one with at least one processing line on the corresponding workpiece. For example, the host computer can query and retrieve the processing line data packet corresponding to the second identification information of the target processing line from the initial data packets stored in the storage mechanism of the processing apparatus, based on the first identification information of the target workpiece and the second identification information of the target processing line.

[0037] The above technical solution obtains the processing line data packet corresponding to the target processing line from multiple initial data packets based on the first identification information of the target workpiece and the second identification information of the target processing line. This enables the rapid and accurate acquisition of the processing line data packet corresponding to the target processing line when the processing device stores multiple processing line data packets corresponding to multiple processing lines on multiple workpieces.

[0038] Optionally, generating a two-dimensional waveform based on at least a portion of the processing data in the processing line data packet includes: generating a preset background image; generating a planar coordinate system within the preset background image based on at least a portion of the processing data in the processing line data packet; and determining the pixel coordinates of each set of processing data within the preset background image when mapping at least a portion of the processing data to the planar coordinate system, based on the at least a portion of the processing data and the planar coordinate system, so as to generate a two-dimensional waveform.

[0039] For example, the host computer can generate a preset background image. The colors of all pixels in the preset background image can be the same or similar; for example, it can be an image where all pixels are black. This embodiment of the invention does not specifically limit the size of the preset background image; it can be defined by the user according to actual needs. The host computer can determine the coordinate axis accuracy of the planar coordinate system and the coordinate axis position in the preset background image based on at least a portion of the processing data in the processing line data package. For example, if each set of processing data is in the first quadrant of the planar coordinate system, then the two coordinate axes of the planar coordinate system can be at the left and bottom ends of the preset background image, respectively.

[0040] For example, for a processing line data packet corresponding to a target processing line, each set of processing data can be represented as (X, Y), where X indicates the position of the corresponding processing point on the target processing line, and Y indicates the height of the corresponding processing point. In a specific embodiment, the ranging mechanism of the processing device can be a laser rangefinder, and the control mechanism can trigger the laser rangefinder to measure the height of the processing point according to a preset sampling interval, starting from a preset starting position of the processing line based on the measurement value of the position measuring mechanism. The position of each processing point on the corresponding processing line can be determined by the corresponding acquisition sequence number and the preset sampling interval. In this case, the acquisition sequence number can be used as position data to indicate the position of the corresponding processing point on the corresponding processing line, and the analog voltage value of the laser rangefinder can be used as height data to indicate the height of the corresponding processing point. The control mechanism can transmit the position data and height data of the processing point to the storage mechanism. For each set of processing data in the processing line data packet stored in the storage mechanism, it can be represented as (N, DataN), where N can represent the acquisition sequence number of the processing point corresponding to the set of processing data, and DataN can represent the analog voltage value of the laser rangefinder when sampling the processing point corresponding to the set of processing data. In this embodiment, in the planar coordinate system generated based on at least a portion of the processing data from the processing line data packet, the first coordinate axis can represent the acquisition sequence number of the processing point, and the second coordinate axis can represent the analog voltage value of the laser rangefinder. A larger acquisition sequence number indicates a greater distance between the processing point and the preset processing start point of the target processing line. For any processing point with acquisition sequence number N (N≥0), the distance between this processing point and the preset processing start point can be equal to the product of the acquisition sequence number and the preset sampling interval. The host computer can preset position data to indicate the location of the preset processing start point. The location of this processing point can be determined by the location of the preset processing start point and the distance between the processing point and the preset processing start point. The preset sampling interval can be directly input by the user, or the host computer can preset position data to indicate the location of the preset processing start point and position data to indicate the location of the preset processing end point. The preset sampling interval can be calculated based on the position difference between the preset processing end point and the preset processing start point and the number of sampled processing points.

[0041] In another specific embodiment, the position of each processing point can be determined by the measurement value of the position measuring mechanism. For each set of processing data in the processing line data package stored in the storage mechanism, it can be represented as (x, h), where x can represent the measurement value of the position measuring mechanism when sampling the processing point corresponding to that set of processing data, and h can represent the measurement value of the ranging mechanism when sampling the processing point corresponding to that set of processing data. Taking a laser rangefinder as an example, h can be the analog voltage value of the laser rangefinder when sampling the processing point corresponding to that set of processing data, or it can be the distance value obtained by converting the analog voltage value according to a preset conversion relationship. In this embodiment, the first coordinate axis of the planar coordinate system can represent the measurement value of the position measuring mechanism when sampling the processing point, and the second coordinate axis can represent the analog voltage value of the laser rangefinder when sampling the processing point.

[0042] For example, after determining a planar coordinate system in a preset background image, the processing data can be mapped to that planar coordinate system. Specifically, the processing data can be mapped to the corresponding pixel coordinates within the preset background image based on the image position of the planar coordinate system within the preset background image. Please refer to [link to relevant documentation]. Figure 3 The diagram shown is a schematic representation of a two-dimensional waveform according to an embodiment of the present invention. In this embodiment, the target workpiece can be a wafer, and the target processing line can be a dicing track. Figure 3 In the two-dimensional waveform diagram shown, the first coordinate axis of the generated planar coordinate system is the x-axis, which represents the acquisition sequence number of the processing point. Figure 3 It can be seen that in the preset background image, the coordinate range displayed on the first coordinate axis is from 0 to 32400. The second coordinate axis of the planar coordinate system is the y-axis, representing the analog voltage value of the laser rangefinder. Figure 3 It can be seen that in the preset background image, the coordinate range displayed on the second coordinate axis is from -8 to 0. The higher the simulated voltage value, the higher the height of the corresponding processing point. The processing data of each group in the processing line data packet corresponding to the target processing line is in the fourth quadrant of the plane coordinate system. Therefore, the two coordinate axes of the plane coordinate system can be at the top and left of the preset background image, respectively.

[0043] The above technical solution generates a planar coordinate system within a preset background image based on at least a portion of the processing data in the processing line data packet. This helps ensure that the planar coordinate system and the target waveform can be displayed in the preset background image and helps to display the target waveform in the middle area of ​​the image as much as possible.

[0044] Optionally, generating a planar coordinate system within a preset background image based on at least a portion of the processing data in the processing line data packet includes: determining the coordinate axis precision of a first coordinate axis based on the position data contained in at least a portion of the processing data and the image resolution of the preset background image in the direction of the first coordinate axis; determining the coordinate axis precision of a second coordinate axis based on the height data contained in at least a portion of the processing data and the image resolution of the preset background image in the direction of the second coordinate axis; determining the coordinate axis position of the first coordinate axis and the coordinate axis position of the second coordinate axis in the preset background image by combining the position data and height data contained in at least a portion of the processing data and the image resolution of the preset background image in the directions of the first and second coordinate axes respectively; and generating a planar coordinate system within the preset background image based on the determined coordinate axis precision and coordinate axis position.

[0045] For example, the coordinate range displayed by a first coordinate axis in a preset background image can be determined based on the position data contained in at least a portion of the processing data in the processing line data packet. The image resolution of the preset background image in the direction of the first coordinate axis can be the number of rows / columns of pixels in the preset background image. Based on the determined coordinate range displayed by the first coordinate axis and the image resolution of the preset background image in the direction of the first coordinate axis, the coordinate axis precision of the first coordinate axis can be determined. The coordinate axis precision can be considered as the absolute value of the coordinate difference between adjacent scales on the coordinate axis. The larger the coordinate range displayed by the first coordinate axis, the larger the absolute value of the coordinate difference between adjacent scales on the first coordinate axis. Similarly, the coordinate range displayed by a second coordinate axis in a preset background image can be determined based on the height data contained in at least a portion of the processing data in the processing line data packet. The image resolution of the preset background image in the direction of the second coordinate axis can be the number of rows / columns of pixels in the preset background image. Based on the determined coordinate range displayed by the second coordinate axis and the image resolution of the preset background image in the direction of the second coordinate axis, the coordinate axis precision of the second coordinate axis can be determined. The coordinate axis precision can be considered as the absolute value of the coordinate difference between adjacent scales on the coordinate axis. The larger the coordinate range displayed by the second coordinate axis, the greater the absolute value of the coordinate difference between adjacent ticks on the second coordinate axis.

[0046] For example, the position of the second coordinate axis in the preset background image can be determined based on the coordinate range displayed by the first coordinate axis and the image resolution of the preset background image in the direction of the second coordinate axis. Specifically, if all coordinates in the coordinate range displayed by the first coordinate axis are positive, the preset background image can display the first quadrant and / or the fourth quadrant of the planar coordinate system, and the second coordinate axis can be located at the left end of the preset background image. As another example, if the coordinate range displayed by the first coordinate axis contains both positive and negative values, the position of the second coordinate axis in the preset background image along the direction of the first coordinate axis can be determined according to the ratio of the number of positive coordinates to the number of negative coordinates. It can be understood that the more positive coordinates there are, the closer the position of the second coordinate axis is to the left edge of the preset background image. The image resolution of the preset background image along the direction of the second coordinate axis determines the number of pixels the second coordinate axis can occupy in that direction. For example, if the image resolution of the preset background image along the direction of the second coordinate axis is 750, then the number of pixels the second coordinate axis occupies in the preset background image along that direction can be the product of 750 and a preset ratio. The preset ratio can be less than 1 and can be defined according to the actual display effect, for example, it can be 0.8. The coordinate axis position of the second coordinate axis in the preset background image can be determined based on the position of the second coordinate axis along the direction of the first coordinate axis, the second coordinate axis itself, and the number of pixels it occupies in that direction. Similarly, the coordinate axis position of the first coordinate axis in the preset background image can be determined based on the coordinate range displayed by the determined second coordinate axis and the image resolution of the preset background image along the direction of the first coordinate axis. Specifically, if all coordinates in the coordinate range displayed by the second coordinate axis are positive, then the preset background image can display the first quadrant and / or the second quadrant of the planar coordinate system, and the first coordinate axis can be located at the lower end of the preset background image. For example, if the coordinate range displayed by the second coordinate axis contains both positive and negative values, the position of the first coordinate axis along the direction of the second coordinate axis in the preset background image can be determined based on the ratio of the number of positive to negative coordinates. It can be understood that the more positive coordinates there are, the closer the position of the second coordinate axis is to the bottom of the preset background image. The image resolution of the preset background image along the direction of the first coordinate axis determines the number of pixels the first coordinate axis can occupy in that direction. Based on the position of the second coordinate axis along the direction of the first coordinate axis in the preset background image, and the second coordinate axis itself and the number of pixels it occupies in that direction, the coordinate axis position of the second coordinate axis in the preset background image can be determined.After determining the coordinate axis accuracy and coordinate axis position of the first and second coordinate axes, a planar coordinate system containing the first and second coordinate axes can be generated within a preset background image.

[0047] Please continue reading. Figure 3 As shown, in Figure 3 In the illustrated two-dimensional waveform, the precision of the first coordinate axis of the generated planar coordinate system is 324. Specifically, the coordinate difference between adjacent tick marks with coordinate values ​​on the first coordinate axis is 3240. Between these adjacent tick marks with coordinate values, there are nine tick marks without coordinate values. The absolute value of the coordinate difference between each unmarked tick mark and its adjacent tick mark is 324. Therefore, the precision of the first coordinate axis is 324. The precision of the second coordinate axis is 0.1. Specifically, the coordinate difference between adjacent tick marks with coordinate values ​​on the second coordinate axis is 1. Between these adjacent tick marks with coordinate values, there are nine tick marks without coordinate values. The absolute value of the coordinate difference between each unmarked tick mark and its adjacent tick mark is 0.1. Therefore, the precision of the second coordinate axis is 0.1. If each set of processing data in the processing line data packet corresponding to the target processing line is in the fourth quadrant of the plane coordinate system, then the first coordinate axis of the plane coordinate system can be at the top of the preset background image, and the second coordinate axis can be at the left end of the preset background image.

[0048] The above technical solution includes at least some of the processing data, including position data, height data, and the resolution of the preset background image, to determine the coordinate axis accuracy and position of the first and second coordinate axes. This is beneficial for the generated target waveform to fill the image as much as possible and for the target waveform to be displayed in the middle area of ​​the image.

[0049] Optionally, based on at least some of the processing data and the planar coordinate system, the pixel coordinates of each set of processing data in the preset background image when mapping at least some of the processing data to the planar coordinate system are determined, including: determining the coordinate mapping relationship for mapping the processing data to the corresponding pixel coordinates based on the coordinate axis precision of each coordinate axis in the planar coordinate system and the coordinate axis position of the coordinate axis in the preset background image; and determining the pixel coordinates corresponding to each of the at least some processing data according to the coordinate mapping relationship.

[0050] For example, the coordinates of each point in the planar coordinate system can be determined based on the precision of each coordinate axis. The pixel coordinates of each point in the planar coordinate system within the preset background image can be determined based on the coordinate axis positions within the preset background image. There is a mapping relationship between the coordinates of each point in the planar coordinate system and the pixel coordinates, i.e., a coordinate mapping relationship. For instance, the pixel coordinate range of the preset background image can be (0, 0) to (PX, PY), and the coordinate range displayed by the planar coordinate system in the preset background image is (0, Data0) to (N, DataN). It can be understood that a proportionality coefficient can be calculated between the coordinate range displayed by the planar coordinate system and the pixel coordinate range of the preset background image; this proportionality coefficient can serve as the coordinate mapping relationship. After determining the coordinate mapping relationship, the corresponding pixel coordinates of at least a portion of the processing data of the processing line data packet corresponding to the target processing line in the preset background image can be determined based on the coordinate mapping relationship.

[0051] The above technical solution determines the coordinate mapping relationship by using coordinate axis precision and coordinate axis position, and determines the pixel coordinates corresponding to the processing data based on the coordinate mapping relationship. This can accurately map the processing data to the corresponding pixel point with the corresponding pixel coordinates, and the coordinates of the mapped pixel point in the preset planar coordinate system can accurately indicate the height and position of the corresponding processing point.

[0052] Optionally, based on at least some processing data and a planar coordinate system, the pixel coordinates of each set of processing data within a preset background image are determined when mapping at least some processing data to the planar coordinate system to generate a two-dimensional waveform. This includes: highlighting the target pixels at the corresponding pixel coordinates of at least some processing data in a manner different from the pixel values ​​of the preset background image to obtain a two-dimensional waveform; or, highlighting the target pixels at the corresponding pixel coordinates of at least some processing data and the intermediate pixels located between adjacent target pixels in a manner different from the pixel values ​​of the preset background image to obtain a two-dimensional waveform, wherein the intermediate pixels are pixels located on the line connecting adjacent target pixels, and the adjacent target pixels are pixels adjacent along the direction of the first coordinate axis.

[0053] For example, after determining the corresponding pixel coordinates of at least a portion of the processing data of the processing line data packet corresponding to the target processing line in a preset background image, the target pixels at their respective pixel coordinates can be highlighted in a manner different from the pixel values ​​of the preset background image. For instance, when the preset background image is an RGB image, the pixel values ​​of the target pixels in the R, G, and B channels can be set to pixel values ​​that are different from the preset background image. Taking the color of all pixels in the preset background image as black as an example, the target pixels can be set to yellow by setting the pixel values ​​of the target pixels in the R, G, and B channels. In this case, the target waveform in the two-dimensional waveform diagram includes the highlighted target pixels. For example, the target pixels and the intermediate pixels on the lines connecting adjacent target pixels can also be highlighted in a manner different from the pixel values ​​of the preset background image. In this case, the target waveform in the two-dimensional waveform diagram includes both the highlighted target pixels and the intermediate pixels.

[0054] The above technical solution highlights the target pixels to obtain a clear target waveform. The target waveform can accurately and intuitively express the change in the height of each processing point on the target processing line as the position of the processing point changes.

[0055] Optionally, before generating a two-dimensional waveform based on at least a portion of the processing data in the processing line data packet, the method includes: dividing each group of processing data in the processing line data packet into multiple data sets, wherein the number of groups of processing data in different data sets is the same, and the positions of the processing points corresponding to each group of processing data in each data set are continuous within the processing line; determining the processing data corresponding to the processing point with the largest height and the processing data corresponding to the processing point with the smallest height in each of the multiple data sets, to obtain at least a portion of the processing data in the processing line data packet.

[0056] For example, for each group of processing data within a processing line data packet, the processing data can be divided into multiple data sets according to the location data contained in each group of processing data, with each data set containing the same number of processing data groups. Taking each group of processing data in the processing line data packet as (x, Datax), where x = 0, 1, 2, ..., N, as an example, x can represent the acquisition sequence number of the processing point, and Datax can represent the analog voltage value of the laser rangefinder when sampling the processing point. Based on a preset division number 'a', each group of processing data can be divided into 'a' data sets, and the number of processing data groups contained in each data set can be (N+1) / a. The acquisition sequence numbers contained in each group of processing data within each data set are consecutive; in other words, the positions of the processing points corresponding to each group of processing data within each data set are consecutive within the processing line. For example, for each of the divided data sets, the processing data corresponding to the processing point with the largest height and the processing data corresponding to the processing point with the smallest height can be determined based on the height data in each group of processing data contained in the data set. At least part of the processing data in the obtained processing line data package may include the processing data corresponding to the processing point with the largest height and the processing data corresponding to the processing point with the smallest height contained in each data set.

[0057] The above technical solution can effectively reduce the amount of processing data. Furthermore, under the premise of reducing the amount of processing data, a two-dimensional waveform diagram is generated by determining the processing data corresponding to the processing point with the largest height and the processing data corresponding to the processing point with the smallest height in each of the multiple data sets. This helps to avoid missing key processing points on the target processing line.

[0058] According to another aspect of the present invention, a data processing method is also provided, applied to a control mechanism in a processing device connected to the aforementioned host computer. The processing device includes a control mechanism, a ranging mechanism, a position measuring mechanism, and a storage mechanism. The control mechanism is connected to the ranging mechanism and the position measuring mechanism respectively. The ranging mechanism is used to collect height data of the processed workpiece and send the collected height data to the control mechanism in real time. The position measuring mechanism is used to collect position data of the processed workpiece and send the collected position data to the control mechanism in real time. The method includes: acquiring the position data collected by the position measuring mechanism and the height data collected by the ranging mechanism; storing the collected position data and height data in the storage mechanism so that the host computer can obtain the processing line data packet from the storage mechanism.

[0059] For example, the descriptions of the control mechanism, ranging mechanism, and position measuring mechanism of the processing apparatus can be found in the foregoing embodiments and will not be repeated here. The processing apparatus may also include a storage mechanism, and the storage mechanism for the processing apparatus in the foregoing embodiments may be a storage mechanism included in the processing apparatus. When processing a workpiece, the position measuring mechanism can collect the position data of the workpiece after receiving a trigger signal from the control mechanism, and can also send the collected position data to the control mechanism in real time. Similarly, the ranging mechanism can collect the height data of the workpiece after receiving a trigger signal from the control mechanism, and can also send the collected height data to the control mechanism in real time. The control mechanism can acquire the position data collected by the position measuring mechanism and the height data collected by the ranging mechanism, and store the acquired position data and height data in the storage mechanism. The host computer can obtain the processing line data packet from the storage mechanism.

[0060] In the above technical solution, the control mechanism can acquire the position and height data of each processing point on the processing line and store the position and height data in the storage mechanism, which can realize the storage of processing data at the processing device end and further ensure the traceability of processing data.

[0061] Optionally, acquiring position data collected by the position measuring mechanism and height data collected by the ranging mechanism includes: acquiring position data collected by the position measuring mechanism; and receiving height data corresponding to each processing point from the ranging mechanism based on the position data to obtain processing data corresponding to each processing point.

[0062] For example, the control mechanism can receive position data sent by the position measuring mechanism, and upon receiving the position data, it can receive height data from the ranging mechanism based on the position data. The height data received based on the position data can be used as the height data of the processing point at the corresponding position. The processing data corresponding to each processing point may include position data and the height data received based on the position data.

[0063] The above technical solution receives height data corresponding to each processing point from the ranging mechanism based on location data, which enables the height data of the processing points stored in the storage mechanism to be accurately associated with the corresponding processing points.

[0064] According to another aspect of the present invention, a processing apparatus is also provided, including a control mechanism, a ranging mechanism, a position measuring mechanism, and a storage mechanism. The control mechanism is connected to the ranging mechanism and the position measuring mechanism respectively. The ranging mechanism is used to collect height data of the processed workpiece and send the collected height data to the control mechanism in real time. The position measuring mechanism is used to collect position data of the processed workpiece and send the collected position data to the control mechanism in real time. The control mechanism is used to execute the above-described data processing method.

[0065] For example, the storage mechanism may be a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a portable compact disc read-only memory (CD-ROM), a USB memory, etc. The ranging mechanism may be, for example, a laser rangefinder, an infrared rangefinder, an ultrasonic rangefinder, etc. The position measuring mechanism may be, for example, a grating ruler, a position sensor, etc.

[0066] Optionally, the control mechanism is a floppy disk controller board.

[0067] For example, the control mechanism of the processing device can be a floppy disk controller board (also known as a "FDC board"). The floppy disk controller can be connected to the ranging mechanism, the position measuring mechanism, and the storage mechanism respectively to execute the data processing method described above. The floppy disk controller board has low hardware cost and is easy to maintain.

[0068] Please see Figure 4 The diagram shown is a schematic block diagram of a data processing apparatus according to an embodiment of the present invention. According to another aspect of the present invention, a data processing apparatus 400 is also provided for processing processing data of a workpiece. The apparatus 400 includes:

[0069] The acquisition module 410 is used to acquire a processing line data packet corresponding to the target processing line on the target workpiece by the self-processing device. The processing line data packet includes multiple sets of processing data that correspond one-to-one with multiple processing points on the target processing line. Each set of processing data includes position data for indicating the position of the corresponding processing point and height data for indicating the height of the corresponding processing point. The height is the distance between the processing point and the ranging mechanism in the processing device.

[0070] The generation module 420 is used to generate a two-dimensional waveform based on at least a portion of the processing data in the processing line data package. The two-dimensional waveform includes a target waveform presented in a plane coordinate system. The target waveform is a waveform in which the height of each processing point on the target processing line corresponding to the processing line data package changes with the position of the processing point. The first coordinate axis of the plane coordinate system represents the position of the processing point, and the second coordinate axis of the plane coordinate system represents the height of the processing point.

[0071] According to another aspect of the present invention, a processing system is also provided, including the above-described processing apparatus and a host computer.

[0072] For example, the processing system may include the processing device and the host computer described above. The host computer may be, for example, a desktop computer, a laptop computer, an industrial control computer, etc.

[0073] Please see Figure 5As shown, it is a schematic block diagram of an electronic device according to an embodiment of the present invention. According to another aspect of the present invention, an electronic device 500 is also provided, including: a processor 510 and a memory 520, wherein the memory 520 stores computer program instructions, which are executed by the processor 510 to perform the above-described data processing method.

[0074] According to another aspect of the present invention, a storage medium is also provided, on which program instructions are stored. When the program instructions are executed by a computer or processor, the computer or processor performs corresponding steps of the data processing method described in the embodiments of the present invention, and is used to implement the control mechanism or the host computer in the processing apparatus described in the embodiments of the present invention. The storage medium may, for example, include a memory card of a smartphone, a storage component of a tablet computer, a hard disk of a personal computer, a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a portable compact disc read-only memory (CD-ROM), a USB memory, or any combination of the above storage media. A computer-readable storage medium may be any combination of one or more computer-readable storage media.

[0075] According to another aspect of the present invention, a computer program product is also provided, including computer program instructions, which, when executed, are used to perform the data processing method as described above.

[0076] Those skilled in the art can understand the specific implementation and beneficial effects of the above-described processing apparatus or system by reading the detailed description of the data processing method above, and for the sake of brevity, they will not be described in detail here.

[0077] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of the invention. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of the invention. All such changes and modifications are intended to be included within the scope of the invention as claimed in the appended claims.

[0078] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0079] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not executed.

[0080] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0081] Similarly, it should be understood that, in order to streamline the invention and aid in understanding one or more of the various aspects of the invention, features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of the invention. However, this approach should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, its inventive point lies in solving the corresponding technical problem with fewer features than all of those in a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of the invention.

[0082] Those skilled in the art will understand that, apart from the mutual exclusion of features, all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or apparatus so disclosed can be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0083] Furthermore, those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

[0084] The various component embodiments of the present invention can be implemented in hardware, or as software modules running on one or more processors, or a combination thereof. Those skilled in the art will understand that microprocessors or digital signal processors (DSPs) can be used in practice to implement some or all of the functions of the control mechanism in the processing apparatus or the aforementioned host computer according to embodiments of the present invention. The present invention can also be implemented as an apparatus program (e.g., a computer program and computer program product) for performing part or all of the methods described herein. Such programs implementing the present invention can be stored on a computer-readable medium or can be in the form of one or more signals. Such signals can be downloaded from an Internet website, provided on a carrier signal, or provided in any other form.

[0085] It should be noted that the above embodiments are illustrative of the invention and not restrictive, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

[0086] The above are merely specific embodiments or descriptions of the present invention, and the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. The scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A data processing method for processing machining data of a workpiece, characterized in that, Applied to a host computer, the method includes: The self-processing device acquires a processing line data packet corresponding to the target processing line on the target workpiece. The processing line data packet includes multiple sets of processing data that correspond one-to-one with multiple processing points on the target processing line. Each set of processing data includes position data for indicating the position of the corresponding processing point and height data for indicating the height of the corresponding processing point. The height is the distance between the processing point and the ranging mechanism in the processing device. A two-dimensional waveform is generated based on at least a portion of the processing data in the processing line data package. The two-dimensional waveform includes a target waveform presented in a planar coordinate system. The target waveform is the waveform in which the height of each processing point on the target processing line corresponding to the processing line data package changes with the position of the processing point. The first coordinate axis of the planar coordinate system represents the position of the processing point, and the second coordinate axis of the planar coordinate system represents the height of the processing point.

2. The method according to claim 1, characterized in that, The self-processing device acquires a processing line data packet corresponding to the target processing line on the target workpiece, including: Based on the first identification information of the target workpiece and the second identification information of the target processing line, the processing line data packet corresponding to the target processing line on the target workpiece is retrieved from the initial data packet stored in the processing device; The initial data packet includes processing line data packets that correspond one-to-one with multiple processing lines, and the multiple processing lines belong to one or more processing parts.

3. The method according to claim 1 or 2, characterized in that, The step of generating a two-dimensional waveform based on at least a portion of the processing data in the processing line data packet includes: Generate a preset background image; Based on at least a portion of the processing data in the processing line data package, the planar coordinate system is generated within the preset background image; Based on the at least part of the processing data and the planar coordinate system, determine the pixel coordinates of each set of processing data within the preset background image when mapping the at least part of the processing data to the planar coordinate system, so as to generate the two-dimensional waveform.

4. The method according to claim 3, characterized in that, The step of generating the planar coordinate system within the preset background image based on at least a portion of the processing data in the processing line data packet includes: Based on the position data contained in the at least part of the processing data and the image resolution of the preset background image in the direction of the first coordinate axis, the coordinate axis accuracy of the first coordinate axis is determined; Based on the height data contained in at least a portion of the processing data and the image resolution of the preset background image in the direction of the second coordinate axis, the coordinate axis accuracy of the second coordinate axis is determined; Based on the position and height data included in the at least part of the processing data and the image resolution of the preset background image in the respective directions of the first and second coordinate axes, the coordinate axis positions of the first and second coordinate axes in the preset background image are determined. Based on the determined coordinate axis accuracy and coordinate axis position, the planar coordinate system is generated within the preset background image.

5. The method according to claim 3, characterized in that, The step of determining the pixel coordinates of each set of processing data within the preset background image when mapping the at least partial processing data to the planar coordinate system, based on the at least partial processing data and the planar coordinate system, includes: Based on the coordinate axis accuracy of each coordinate axis in the planar coordinate system and the coordinate axis position in the preset background image, a coordinate mapping relationship for mapping the processing data to the corresponding pixel coordinates is determined. The pixel coordinates corresponding to each of the at least some of the processing data are determined based on the coordinate mapping relationship.

6. The method according to claim 3, characterized in that, The step of determining the pixel coordinates of each set of processing data within the preset background image when mapping the at least partial processing data to the planar coordinate system, based on the at least partial processing data and the planar coordinate system, to generate the two-dimensional waveform includes: The target pixels at their respective pixel coordinates corresponding to at least a portion of the processed data are highlighted in a manner different from the pixel values ​​of the preset background image to obtain the two-dimensional waveform; or, The target pixels at their respective pixel coordinates and the intermediate pixels between adjacent target pixels are highlighted in a manner different from the pixel values ​​of the preset background image to obtain the two-dimensional waveform. The intermediate pixels are pixels on the line connecting adjacent target pixels, and the adjacent target pixels are pixels adjacent along the direction of the first coordinate axis.

7. The method according to claim 1, characterized in that, Before generating a two-dimensional waveform based on at least a portion of the processing data in the processing line data packet, the method includes: The processing data in the processing line data packet is divided into multiple data sets, wherein the number of processing data sets in different data sets is the same, and the processing points corresponding to the processing data sets in each data set are located continuously within the processing line. Within each of the plurality of data sets, determine the processing data corresponding to the processing point with the highest height and the processing data corresponding to the processing point with the lowest height, in order to obtain at least a portion of the processing data of the processing line data package.

8. A data processing method, characterized in that, A control mechanism is applied in a processing device connected to a host computer according to any one of claims 1-7, the processing device including the control mechanism, a ranging mechanism, a position measuring mechanism, and a storage mechanism, wherein the control mechanism is respectively connected to the ranging mechanism and the position measuring mechanism, the ranging mechanism is used to collect height data of the processed workpiece and send the collected height data to the control mechanism in real time, and the position measuring mechanism is used to collect position data of the processed workpiece and send the collected position data to the control mechanism in real time, the method comprising: Acquire the position data collected by the position measuring mechanism and the height data collected by the ranging mechanism; The collected location and height data are stored in the storage mechanism so that the host computer can retrieve the processing line data packet from the storage mechanism.

9. The method according to claim 8, characterized in that, The acquisition of position data collected by the position measuring mechanism and height data collected by the ranging mechanism includes: Acquire the position data collected by the position measuring mechanism; Based on the location data, the distance measuring mechanism receives height data corresponding to each processing point to obtain processing data corresponding to each processing point.

10. A processing apparatus, characterized in that, The system includes a control mechanism, a ranging mechanism, a position measuring mechanism, and a storage mechanism. The control mechanism is connected to the ranging mechanism and the position measuring mechanism, respectively. The ranging mechanism is used to collect the height data of the workpiece and send the collected height data to the control mechanism in real time. The position measuring mechanism is used to collect the position data of the workpiece and send the collected position data to the control mechanism in real time. The control mechanism is used to execute the data processing method as described in claim 8 or 9.

11. A data processing apparatus for processing machining data of a workpiece, characterized in that, The device includes: The acquisition module is used to acquire a processing line data packet corresponding to the target processing line on the target workpiece by the self-processing device. The processing line data packet includes multiple sets of processing data that correspond one-to-one with multiple processing points on the target processing line. Each set of processing data includes position data for indicating the position of the corresponding processing point and height data for indicating the height of the corresponding processing point. The height is the distance between the processing point and the ranging mechanism in the processing device. A generation module is used to generate a two-dimensional waveform based on at least a portion of the processing data in the processing line data package. The two-dimensional waveform includes a target waveform presented in a planar coordinate system. The target waveform is a waveform in which the height of each processing point on the target processing line corresponding to the processing line data package changes with the position of the processing point. The first coordinate axis of the planar coordinate system represents the position of the processing point, and the second coordinate axis of the planar coordinate system represents the height of the processing point.

12. A storage medium on which program instructions are stored, characterized in that, The program instructions, when executed, are used to perform the data processing method as described in any one of claims 1-7 or as described in claim 8 or 9.

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