Display device

Abstract

An organic light emitting display is provided. The organic light emitting display includes a glass substrate, an organic light emitting element on the glass substrate, and a phase retardation layer disposed below the glass substrate. Accordingly, cracks generated on the glass substrate can be easily detected, thereby ensuring an improvement in durability and reliability of the display device.

Description

[0001] This application claims the priority of Korean Patent Application No. 10-2023-0137062 filed in the Korean Intellectual Property Office on October 13, 2023, the disclosure of which is incorporated herein by reference. Technical Field

[0002] The present disclosure relates to an organic light emitting display device, and more particularly, to an organic light emitting display device with minimized cracks. Background Art

[0003] Unlike a liquid crystal display (LCD) device provided with a backlight, an organic light emitting display (OLED) device does not require a separate light source. Therefore, the OLED device can ensure light weight and thinness, advantages in manufacturing, and lower power consumption based on low voltage driving. First, the organic light emitting display device includes a self-luminous element, and each layer can be formed of a thin organic film, thereby ensuring greater flexibility and elasticity than other display devices, and realizing a flexible display device.

[0004] Generally, an organic light-emitting display device uses an organic light-emitting element that emits light when electrons and holes from a cathode for injecting electrons and an anode for injecting holes are injected into a light-emitting layer, respectively, and excitons coupled by the injected electrons and the injected holes fall from an excited state to a ground state.

[0005] In recent years, display devices in which an organic light emitting element or the like is formed on a flexible substrate made of a flexible material such as plastic or the like have attracted attention, but a glass substrate is still used because it ensures ease of manufacturing and rigidity.

[0006] In particular, when it comes to a display device in which an organic light emitting element is formed on a thin film glass substrate, technology for preventing and detecting cracks that may be generated on the glass substrate has been actively studied. Summary of the invention

[0007] An object of the present disclosure is to provide an organic light emitting display device which can easily detect minute cracks of a glass substrate on which an organic light emitting element is disposed.

[0008] Another object of the present disclosure is to provide an organic light emitting display device which can easily detect cracks generated even in a non-display region of a glass substrate.

[0009] Still another object of the present disclosure is to provide an organic light emitting display device that can prevent cracks, ensuring improvements in durability and reliability.

[0010] The objects of the present disclosure are not limited to the above objects and other objects not mentioned above may be clearly understood by those skilled in the art from the following description.

[0011] According to the present disclosure, an organic light-emitting display device of one embodiment includes a glass substrate, an organic light-emitting element located on the glass substrate, and a phase delay layer disposed under the glass substrate. Therefore, cracks generated on the glass substrate can be easily detected, thereby ensuring the improvement of the durability and reliability of the display device.

[0012] Additional details of example embodiments are included in the detailed description and the accompanying drawings.

[0013] According to the present disclosure, cracks generated even on the outer side of the glass substrate can be easily detected.

[0014] According to the present disclosure, micro cracks generated on a glass substrate can be easily detected.

[0015] According to the present disclosure, cracks on a glass substrate can be prevented, thereby ensuring improved durability and reliability of a display device.

[0016] The effects according to the present disclosure are not limited to those exemplified above, and more various effects are included in the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which:

[0018] Figure 1 is a schematic diagram of an organic light emitting display device according to one embodiment;

[0019] Figure 2 is along Figure 1 A cross-sectional view taken along the line I-I';

[0020] Figure 3 is along Figure 1 A cross-sectional view taken along the line II-II';

[0021] Figure 4 is a cross-sectional view of an organic light emitting display device according to another embodiment;

[0022] Figure 5 is a cross-sectional view of an organic light emitting display device according to another embodiment;

[0023] Figure 6 is a cross-sectional view of an organic light emitting display device according to yet another embodiment; and

[0024] Figure 7is a schematic diagram of a process of detecting cracks of a glass substrate in an organic light emitting display device according to one embodiment. DETAILED DESCRIPTION

[0025] By referring to the exemplary embodiments described in detail below and the accompanying drawings, the advantages and features of the present disclosure and the methods for achieving these advantages and features will be clear. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only as examples so that those skilled in the art can fully understand the content disclosed by the present disclosure and the scope of the present disclosure.

[0026] The shapes, sizes, ratios, angles, quantities, etc. shown in the drawings for describing the exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. Throughout the specification, the same reference numerals generally represent the same elements. In addition, in the following description of the present disclosure, a detailed explanation of known related art may be omitted to avoid making the subject matter of the present disclosure unnecessarily difficult to understand. Terms such as "including", "having" and "consisting of..." used herein are generally intended to allow the addition of other components, unless these terms are used together with the term "only". Unless otherwise expressly stated, any reference to the singular may include the plural.

[0027] Even if not explicitly stated, the components are interpreted as including the ordinary error range.

[0028] When terms such as "on", "over", "below" and "beside" are used to describe the positional relationship between two parts, one or more parts may be located between the two parts unless these terms are used together with the terms "immediately next to" or "directly".

[0029] When an element or layer is referred to as being “on” another element or layer, the other layer or element may be directly on or interposed between the other element.

[0030] Although the terms "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component to be mentioned below may be the second component in the technical concept of the present disclosure.

[0031] Throughout the specification, like reference numerals generally refer to like elements.

[0032] For convenience of description, the size and thickness of each component shown in the drawings are illustrated, and the present disclosure is not limited to the size and thickness of the components shown.

[0033] The features of the various embodiments of the present disclosure may be partially or completely coupled or combined with each other, may be technically interlocked and operated in various ways, and the embodiments may be performed independently or in association with each other.

[0034] Hereinafter, an organic light emitting display device according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0035] Figure 1-Figure 3 is a diagram for describing an organic light emitting display device according to one embodiment. Figure 1 is a schematic diagram of an organic light emitting display device according to an embodiment. Figure 2 is along Figure 1 Cross-sectional view of I-I'. Figure 3 is along Figure 1 II-II' cross-sectional view.

[0036] refer to Figure 1-Figure 3 According to one embodiment, an organic light-emitting display device 100 includes a glass substrate 110, a thin film transistor TFT, an organic light-emitting element 130, an encapsulation layer 140, a touch sensor portion 150, a polarization layer 160, a cover glass 170, a phase retardation layer 180, and a heat dissipation substrate 190. Figure 2 In the embodiment, for convenience of description, the thin film transistor TFT, the organic light emitting display device 130, the encapsulation layer 140, and the touch sensor portion 150 are illustrated as a display portion DP.

[0037] refer to Figure 1 The glass substrate 110 includes a display area DA and a non-display area NDA. The display area DA is an area where a plurality of pixels are arranged and basically displays an image. In the display area DA, a display element that displays an image and various driving elements for driving the display element may be arranged.

[0038] The thickness of the glass substrate 110 may be 30 μm to 200 μm. When the thickness of the glass substrate 110 is within the above range, the glass substrate 110 may support components of the organic light-emitting display device 100, and at the same time, the folding or bending of the display device may be achieved. Specifically, the glass substrate 110 may be formed by etching a mother glass substrate having a thickness of 400 μm to 800 μm or 500 μm to 650 μm. That is, the mother glass substrate has sufficient thickness to withstand the conditions and environment of manufacturing. However, since the display panel is continuously formed on the mother glass substrate, the lower surface of the mother glass substrate may be damaged during manufacturing. In order to prevent this from happening, it is necessary to improve the surface properties of the mother glass substrate. To this end, while the thickness of the mother glass substrate is reduced during the etching process, the outer surface of the mother glass substrate may be uniformized.

[0039] A plurality of pixels may be included in the display area DA. The plurality of pixels are arranged in a matrix form, and each of the plurality of pixels may include a plurality of sub-pixels SP. Each sub-pixel SP as a component for displaying one color may be defined as an area where a plurality of gate lines arranged in a first direction and a plurality of data lines arranged in a second direction different from the first direction intersect each other. In this context, the first direction may be Figure 1 The horizontal direction (X-axis direction) of Figure 1 The vertical direction (Y-axis direction) of the pixel is shown in FIG. 1 , but is not limited thereto. Each sub-pixel SP includes a light-emitting area that emits light and a non-light-emitting area that does not emit light, but in the present disclosure, the area that emits light is defined only as a sub-pixel SP. Each of the plurality of pixels may include a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3. The first sub-pixel SP1 may be a red pixel, the second sub-pixel SP2 may be a green pixel, and the third sub-pixel SP3 may be a blue pixel, but are not limited thereto.

[0040] Each sub-pixel SP may include an organic light emitting element 130 and a driving element. The driving element may include a switching transistor, a driving transistor, etc. The driving element may be electrically connected to a signal line such as a gate line, a data line, etc. connected to a gate driver, a data driver, etc. disposed in the non-display area NDA.

[0041] The non-display area NDA may be disposed in a surrounding area of ​​the glass substrate 110, and may be an area where no image is displayed. The non-display area NDA may be disposed to surround the display area DA. In the non-display area NDA, various components for driving a plurality of sub-pixels SP disposed in the display area DA may be disposed. For example, in the non-display area NDA, a driver IC, a driver circuit, a signal line, a flexible film, and the like that provide signals for driving the plurality of sub-pixels SP may be disposed. The driver IC may include a gate driver, a data driver, and the like. The driver IC and the driver circuit may be disposed based on a gate in panel (GIP) method, a chip on film (COF) method, a tape automated bonding (TAB) method, a tape carrier package (TCP) method, a chip on glass (COG) method, and the like.

[0042] Also refer to Figure 3 , a first buffer layer 121 for preventing oxygen or moisture from penetrating may be disposed on the glass substrate 110. The first buffer layer 121 may have a single-layer structure, and may have a multi-layer structure when necessary.

[0043] A thin film transistor TFT including a gate electrode G, an active layer ACT, a source electrode S, and a drain electrode D is disposed on the first buffer layer 121. The thin film transistor FTF is disposed in each of the first sub-pixel SP1 region, the second sub-pixel SP2 region, and the third sub-pixel SP3 region. Figure 3 In the embodiment, for the convenience of description, only the driving thin film transistor among various thin film transistors that may be included in the organic light emitting display device 100 is shown. Figure 3 In the embodiment, the thin film transistor TFT has a coplanar structure, such as but not limited to, and may also have an inverse staggered structure.

[0044] For example, an active layer ACT is disposed on the first buffer layer 121, and a gate insulating layer 123 for isolating the active layer ACT and the gate electrode G is disposed on the active layer ACT. In addition, an interlayer insulating layer 122 for isolating the gate electrode G, the source electrode S, and the drain electrode D is disposed on the first buffer layer 121. The source electrode S and the drain electrode D, which contact the active layer ACT, respectively, are formed on the interlayer insulating layer 122. A planarization layer 124 may be disposed on the thin film transistor TFT. The planarization layer 124 planarizes the upper portion of the thin film transistor TFT. The planarization layer 124 may include a contact hole for electrically connecting the thin film transistor TFT and the anode 131 of the organic light emitting element 130.

[0045] The organic light emitting element 130 is disposed on the planarization layer 124. The organic light emitting element 130 includes a first organic light emitting element 130a disposed in the first sub-pixel SP1, a second organic light emitting element 130b disposed in the second sub-pixel SP2, and a third organic light emitting element 130c disposed in the third sub-pixel SP3. Each of the organic light emitting elements 130a, 130b, 130c includes an anode 131, an organic light emitting layer 132, and a cathode 133.

[0046] The anode 131 is disposed on the planarization layer 124. The anode 131 is disposed in a manner corresponding to each of the plurality of sub-pixels SP1, SP2, and SP3. The anode 131 is formed of a high power function conductive material as a component for providing holes to the organic light emitting layer 132. The anode 131 may be a transparent conductive layer formed of a transparent conductive oxide (TCO). For example, the anode 131 may be formed of one or more selected from transparent conductive oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), SnO2, ZnO, indium copper oxide (ICO), and Al:ZnO (AZO), but is not limited thereto. In the case where the organic light emitting display device 100 is driven based on a top emission method, the anode 131 may further include a reflective layer for reflecting light emitted from the organic light emitting layer 132 toward the cathode 133. The anode 131 may be formed in a manner such that the anode 131 is separated for each of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3.

[0047] The dam 125 is disposed on the anode 131 and the planarization layer 124. The dam 125 may cover the edge of the anode 131 of the organic light emitting element 130 and define a light emitting region. That is, the dam 125 may divide a plurality of sub-pixels SP1, SP2, and SP3. The dam 125 may be made of an insulating material to isolate the anodes 131 of adjacent sub-pixels SP1, SP2, and SP3 from each other. In addition, the dam 125 may be composed of a black dam with a high light absorbance to prevent color mixing between adjacent sub-pixels SP1, SP2, and SP3. For example, the dam 125 may be made of a polyimide resin, an acrylic resin, or a benzocyclobutene resin, but is not limited thereto.

[0048] The cathode 133 is disposed on the anode 131. The cathode 133 may be formed of a metal material of a low power function to smoothly provide electrons to the organic light emitting layer 132. For example, the cathode 133 may be formed of a metal material selected from calcium (Ca), barium (Ba), aluminum (Al), silver (Ag), and an alloy including one or more thereof, but is not limited thereto. In addition, the cathode 133 may be formed in a single layer on the anode 131. That is, the cathode 133 may be formed in a single layer in the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3. In the case of driving the organic light emitting display device 100 based on a top emission method, the cathode 133 is formed to be very thin so that the cathode 133 may become substantially transparent.

[0049] The organic light emitting layer 132 is disposed between the anode 131 and the cathode 133. The organic light emitting layer 132 is a layer in which electrons and holes are coupled to emit light. The organic light emitting layer of the first organic light emitting element 130a may be a green organic light emitting layer, the organic light emitting layer of the second organic light emitting element 130b may be a red organic light emitting layer, and the organic light emitting layer of the third organic light emitting element 130c may be a blue organic light emitting layer.

[0050] In order to enhance the luminous efficiency of the organic light emitting element 130, the organic light emitting element 130 may further include a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, etc. For example, the hole injection layer and the hole transport layer may be disposed between the anode 131 and the organic light emitting layer 132, and the electron transport layer and the electron injection layer may be disposed between the organic light emitting layer 132 and the cathode 133. In addition, in order to further enhance the recoupling efficiency of holes and electrons in the organic light emitting layer 132, the organic light emitting layer 132 may further include a hole blocking layer or an electron blocking layer.

[0051] The encapsulation layer 140 is disposed on the organic light emitting element 130. The encapsulation layer 140 may cover the organic light emitting element 130. The encapsulation layer 140 may protect the organic light emitting element 130 from external moisture, external oxygen, external impact, etc. The encapsulation layer 140 may have a multilayer structure in which an inorganic layer formed of an inorganic insulating material and an organic layer formed of an organic material are stacked. For example, the encapsulation layer 140 may be composed of at least one organic layer and at least two inorganic layers, and may have a multilayer structure in which inorganic layers and organic layers are alternately stacked, but may not be limited thereto. The encapsulation layer 140 may, for example, have a three-layer structure including a first inorganic layer 141, an organic layer 142, and a second inorganic layer 143. At this time, each of the first inorganic layer 141 and the second inorganic layer 143 may be independently formed of one or more selected from silicon nitride (SiNx), silicon oxide (SiOx), aluminum oxide (AlOx), silicon oxynitride (SiON), but may not be limited thereto. In addition, the organic layer 142 may be formed of one or more selected from epoxy, polyimide, polyethylene, and silicon oxycarbide (SiOC), but is not limited thereto.

[0052] In order to provide the organic light-emitting display device 100 with a touch sensing function, the touch sensor component 150 is disposed on the encapsulation layer 140. The organic light-emitting display device 100 according to one embodiment includes the touch sensor component 150 having a structure in which the touch electrode 151 is formed on the encapsulation layer 140, rather than a structure in which the touch electrode is formed on a separate substrate and is disposed on the organic light-emitting element through an adhesive member in an existing touch panel. Since the touch sensor component 150 is directly formed on the encapsulation layer 140, an adhesive member for adhering the touch sensor component 150 and the organic light-emitting display panel can be omitted, so that the thickness of the organic light-emitting display device 100 can be thinned.

[0053] The touch sensor component 150 includes a touch electrode 151 and a touch protection layer 152. The touch electrode 151 can be formed directly on the encapsulation layer 140 without an adhesive member. The touch electrode 151, which is an electrode for sensing touch input, can be composed of a sensing electrode and a driving electrode, and can sense changes in capacitance between the sensing electrode and the driving electrode and detect touch coordinates. For example, the driving electrode can be arranged on the second inorganic layer 143, and the sensing electrode can be arranged on the same planar surface as the driving electrode. In another example, a touch insulating layer can be arranged on the driving electrode, and the sensing electrode can be arranged on the touch insulating layer. The setting of the touch electrode 151 may not be limited to the above setting, and may be changed when necessary.

[0054] Since the touch electrode 151 is directly formed on the encapsulation layer 140, the distance between the organic light emitting element 130 and the touch electrode 151 is very short, so that a parasitic capacitance is generated between the organic light emitting element 130 or an electrode included in the thin film transistor TFT and the touch electrode 151, thereby causing a decrease in touch sensitivity. To prevent this from happening, the thickness of the encapsulation layer 140 can be appropriately adjusted to minimize the parasitic capacitance.

[0055] The touch electrode 151 may be formed of a transparent metal material capable of transmitting light, such as indium tin oxide (ITO) or indium zinc oxide (IZO). The touch electrode 151 may have various shapes such as a rectangle, an octagon, a circle, or a rhombus.

[0056] The touch protection layer 152 is disposed on the touch electrode 151. The touch protection layer 152 prevents short circuit of the touch electrode 151 or damage to the touch electrode 151, etc., and flattens the upper surface of the touch electrode 151. The touch protection layer 152 may be formed of a transparent insulating resin, such as an acryl-based resin, a polyester-based resin, an epoxy resin, a silicon-based resin, etc.

[0057] In addition, Figure 3 , a structure in which the touch electrode 151 of the touch sensor component 150 is disposed on the encapsulation layer 140 and in direct contact with the encapsulation layer 140 is shown, but it is not limited thereto. For example, a touch buffer layer may be disposed between the encapsulation layer 140 and the touch sensor component 150, and the touch electrode 151 may be disposed on the touch buffer layer. The touch buffer layer may prevent the encapsulation layer 140 and the organic light emitting element 130 from being damaged in the process in which the touch electrode 151 is directly formed on the encapsulation layer 140.

[0058] The touch buffer layer may be formed of an inorganic material having excellent barrier properties. Therefore, the touch buffer layer may minimize the penetration of moisture or oxygen. The touch buffer layer may be made of, for example, an inorganic material such as silicon nitride (SiNx), silicon oxide (SiOx), aluminum oxide (AlOx), etc., but is not limited thereto.

[0059] The polarizing layer 160 may be disposed on the touch sensor portion 150. The polarizing layer 160, which is a layer for polarizing input light, may include a polarizing plate POL as a film having a predetermined level of light transmittance to prevent contrast from being deteriorated by absorbing external light and its reflected light. That is, the deterioration of display quality caused by reflected light reflecting external light can be prevented, and the transmittance of the image of the display device can be improved. Since the polarizing plate POL is disposed in the display area DA, the size of the polarizing plate POL may be smaller than the size of the glass substrate 110, and specifically, the four edges of the polarizing plate POL may be disposed inside the four edges of the glass substrate 110.

[0060] The first adhesive layer OCA1 may be disposed between the touch sensor part 150 and the polarizing layer 160. The first adhesive layer OCA1 may use an optically clear adhesive (OCA) to minimize generation of bubbles or foreign matter between the touch sensor part 150 and the polarizing layer 160.

[0061] The cover glass 170 may be disposed on the polarizing layer 160. The cover glass 170 may protect the display panel from external impact, external moisture, external heat, etc. For example, the cover glass 170 may be a tempered glass with a high Young's modulus, but is not limited thereto.

[0062] The second adhesive layer OCA2 may be disposed between the polarizing layer 160 and the cover glass 170. Similar to the first adhesive layer OCA1, the second adhesive layer OCA2 may use an optically clear adhesive (OCA) to minimize generation of bubbles or foreign matter between the polarizing layer 160 and the cover glass 170.

[0063] In the following, reference Figure 2 The phase retardation layer 180 disposed below the glass substrate 110 is described in detail. Figure 2 In the embodiment, for convenience of description, the thin film transistor TFT, the organic light emitting element 130, the encapsulation layer 140, and the touch sensor portion 150 are illustrated as a display portion DP.

[0064] refer to Figure 2 , a phase retardation layer 180 may be provided under the glass substrate 110, and the phase retardation layer 180 includes a phase retardation film having an in-plane retardation value Ro of 120 nm to 300 nm. The phase retardation film may compensate for the delay of light passing through the portion of the glass substrate 110 where the crack C is generated, and ensure that the crack C is easily detected. Specifically, the optical axis of the phase retardation film may be 45° or 135° relative to the major axis or minor axis of the glass substrate. This is because the polarization axis of the crack detector is generally parallel to the major axis or minor axis of the glass substrate 110, and in the following reference Figure 7 A detailed description is provided on this point. In addition, in order to prevent chromatic aberration, the thickness retardation value Rth of the phase retardation film may be smaller than the in-plane retardation value Ro of the phase retardation film. At this time, the retardation delay value of the phase retardation film may be λ / 4 or λ / 2.

[0065] Generally, a glass substrate may have cracks due to external impact during manufacturing, and moisture may penetrate through the cracks, causing a display device failure. To prevent this from happening, a TFT tester or a tester including a polarization member and a reflective plate may be used to detect cracks in the glass substrate. In the case where the TFT tester includes a liquid crystal layer, a voltage may be supplied to the TFT and the line, and the liquid crystal layer of the TFT tester may be driven by the voltage to test the failure of the TFT and the line. However, it is difficult to detect cracks generated at the outer portion of the panel where there is no line (i.e., in the non-display area), and it is difficult to detect cracks generated after the TFT process.

[0066] In addition, in the case of a tester including a polarization member and a reflective plate, a fault can be detected as follows: a camera recognizes a color difference caused by a delay of a light source reflected from a portion where a crack is generated and a delay of a light source reflected from a portion where no crack is generated. However, in the case where the size of the crack is from several micrometers to several tens of micrometers, that is, the size of the crack is very minute, there is only a slight difference in the refractive index, making it difficult to recognize the color change and detect the fault.

[0067] In addition, sometimes in the process of etching the mother glass substrate to make it thinner, micro cracks are easily generated due to external impact, and in order to protect the glass substrate from external impact, polyurethane foam can be set under the glass substrate. However, there are holes in the polyurethane foam, and light may be scattered through the holes, resulting in an increase in thickness delay Rth and color difference during crack detection.

[0068] Therefore, in the organic light emitting display device 100 of one embodiment, the phase retardation layer 180 is disposed under the glass substrate 110 so that the delay of the light source transmitted through or reflected from the portion where the crack C is generated is compensated, so that the crack C can be detected. That is, the organic light emitting display device 100 according to one embodiment can prevent the crack C from being generated on the glass substrate 110, thereby enhancing reliability.

[0069] The third adhesive layer OCA3 may be disposed between the glass substrate 110 and the phase retardation layer 180. Similar to the first adhesive layer OCA1, the third adhesive layer OCA3 may use an optically clear adhesive (OCA) to minimize the generation of bubbles or foreign matter between the glass substrate 110 and the phase retardation layer 180. At this time, in order to minimize the delay change caused by the third adhesive layer OCA3, in the process of detecting the crack C, the third adhesive layer OCA3 may be made of a material having the same refractive index as the glass substrate 110. In addition, the refractive index and delay of the phase retardation film may be reduced at a glass transition temperature Tg or higher, or the refractive index of the third adhesive layer OCA3 may be reduced at a glass transition temperature Tg or higher. Therefore, in order to minimize the change in optical properties caused by temperature change, the glass transition temperature Tg of the third adhesive layer OCA3 may be greater than the glass transition temperature Tg of the phase retardation film. Specifically, the glass transition temperature Tg of the phase retardation film may be 90°C or higher, and the glass transition temperature Tg of the third adhesive layer OCA3 may be 150°C or higher. In addition, in order to minimize deformation caused by the difference between the physical properties of the glass substrate 110 and the third adhesive layer OCA3, the storage modulus of the third adhesive layer OCA3 may be 10 6 Pa or more, but not limited thereto.

[0070] The heat dissipation substrate 190 may be disposed under the glass substrate 110. The heat dissipation substrate 190 may be made of a material having excellent thermal conductivity, and for example, made of aluminum (Al), but is not limited thereto.

[0071] The fourth adhesive layer OCA4 may be disposed between the phase retardation layer 180 and the heat dissipation substrate 190. Similar to the first adhesive layer OCA1, the fourth adhesive layer OCA4 may use an optically transparent adhesive OCA to minimize generation of bubbles or foreign matter between the phase retardation layer 180 and the heat dissipation substrate 190.

[0072] In the following, reference Figure 4 An organic light emitting display device 200 according to another embodiment is described in detail.

[0073] Figure 4 is a cross-sectional view of an organic light emitting display device according to another embodiment. In addition to the configuration of the phase retardation layer 280 and the presence or absence of the third adhesive layer OCA3, Figure 4 Components of the organic light emitting display device 200 and Figure 1-Figure 3 Components of the organic light emitting display device 100 are substantially the same, and thus, common components will not be described.

[0074] refer to Figure 4, a bit delay layer 280 may be provided under the glass substrate 110, and the bit delay layer 280 includes a liquid crystal coating layer having an in-plane delay value Ro of 120 nm to 300 nm. The liquid crystal coating layer may compensate for the delay of light passing through the portion of the glass substrate 110 where the crack C is generated, so as to ensure that the crack C is easily detected. Specifically, the optical axis of the liquid crystal coating layer may be 45° or 135° relative to the long axis or short axis of the glass substrate. This is because the polarization axis of the crack detection device is generally parallel to the long axis or short axis of the glass substrate 110, and in the following reference Figure 7 A detailed description is provided on this point. In addition, in order to prevent the color characteristics depending on the viewing angle from being distorted, the thickness retardation value Rth of the liquid crystal coating layer may be smaller than the in-plane retardation value Ro of the liquid crystal coating layer. In addition, the retardation value of the liquid crystal coating layer may be λ / 4 or λ / 2. In the case where the phase retardation layer 280 includes a liquid crystal coating layer, the liquid crystal coating layer may be disposed in such a manner that the liquid crystal coating layer directly contacts the lower surface of the glass substrate 110 without using a separate adhesive layer.

[0075] In the organic light emitting display device 200 according to another embodiment, the phase retardation layer 280 is disposed under the glass substrate 110 to compensate for the delay of the light source transmitted through or reflected from the portion where the crack C is generated, so that the crack C can be detected. That is, the organic light emitting display device 200 according to another embodiment prevents the crack C from being generated on the glass substrate 110, thereby ensuring improved reliability.

[0076] In addition, in the organic light emitting display device 200 according to another embodiment, the phase retardation layer 280 is provided in such a manner that the phase retardation layer 280 directly contacts the lower surface of the glass substrate 110 , thereby reducing the thickness of the organic light emitting display device 200 .

[0077] Figure 5 is a cross-sectional view of an organic light emitting display device according to another embodiment. In addition to the presence or absence of the protective film 395, Figure 5 Components of the organic light emitting display device 300 and Figure 4 Components of the organic light emitting display device 200 are substantially the same, and thus, common components will not be described.

[0078] refer to Figure 5 , a protective film 395 may be provided on the lower surface of the phase retarder layer 280. The protective film 395 may prevent the crack C by reducing the impact during manufacturing. At this time, unlike the phase retarder layer 280, the in-plane retardation value Ro of the protective film 395 may be 0 to minimize the change in retardation caused by the protective film 395 when the crack C is detected. For example, the protective film 395 may be formed of a triacetyl cellulose (TAC) film, but is not limited thereto.

[0079] In the organic light emitting display device 300 according to another embodiment, the phase retardation layer 280 is disposed under the glass substrate 110 to compensate for the delay of the portion where the crack C is generated, so that the crack C can be detected. That is, the organic light emitting display device 300 according to another embodiment can prevent the crack C from being generated on the glass substrate 110, ensuring improved reliability.

[0080] In addition, in the organic light emitting display device 300 according to another embodiment, the phase retardation layer 280 is provided in such a manner that the phase retardation layer 280 directly contacts the lower surface of the glass substrate 110 , thereby reducing the thickness of the organic light emitting display device 300 .

[0081] In addition, in the organic light emitting display device 300 according to another embodiment, the protective film 395 is disposed under the glass substrate 110 , thereby more effectively preventing the generation of the crack C of the glass substrate 110 .

[0082] Figure 6 is a cross-sectional view of an organic light emitting display device according to another embodiment. In addition to the polarizing layer 460, Figure 6 Components of the organic light emitting display device 400 and Figure 1-Figure 3 Components of the organic light emitting display device 100 are substantially the same, and thus, common components will not be described.

[0083] refer to Figure 6 , a second buffer layer 461 may be disposed on the touch sensor component 150. The second buffer layer 461 may protect the components of the organic light-emitting display device 400 by preventing moisture or oxygen from penetrating from the outside. The second buffer layer 461 may be formed of an inorganic material having excellent barrier properties. Thus, the penetration of moisture or oxygen may be minimized. For example, the second buffer layer 461 may be made of a material selected from silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiON) or aluminum oxide (Al2O3), but is not limited thereto. In addition, the second buffer layer 461 can supplement the adhesion between the plurality of color filters 462a, 462b, 462c and the black matrix 463 and the touch protection layer 152. That is, the second buffer layer 461 can be disposed on the touch protection layer 152 to bond the plurality of color filters 462a, 462b, 462c and the black matrix 463 to the touch protection layer 152.

[0084] A polarizing layer 460 including a plurality of color filters 462a, 462b, 462c and a black matrix 463 may be disposed on the second buffer layer 461. The plurality of color filters 462a, 462b, 462c and the black matrix 463 may absorb external light and function as an anti-reflection layer to minimize degradation of visibility and contrast of the organic light emitting display device 400 caused by external light.

[0085] The black matrix 463 is disposed on the encapsulation layer 140. The black matrix 463 may be configured on the touch sensor component 150 or the buffer layer 461. The black matrix 463 is disposed along the boundary of the sub-pixel and includes an opening exposing the sub-pixel. The black matrix 463 divides each of the plurality of color filters 462a, 462b, 462c. The black matrix 463 may be disposed to overlap with the partition 125. Therefore, color mixing between the sub-pixels SP1, SP2, SP3 may be minimized. In addition, the black matrix 463 may absorb external light. Therefore, the degradation of visibility and contrast of the organic light-emitting display device (400) caused by external light may be minimized.

[0086] The black matrix 463 may be formed of an organic material. The black matrix 463 includes a base resin and a black material. The base resin may be one or more selected from carbon-based resins, epoxy-based resins, acrylate-based resins, siloxane-based resins, and polyimides, but is not limited thereto. The black material may be a black pigment selected from carbon-based pigments, metal oxide-based pigments, and organic pigments. For example, the carbon-based pigment may be carbon black. For example, the metal oxide-based pigment may be titanium black (TiN x O y ), Cu-Mn-Fe based black pigment, etc., but not limited thereto. For example, the organic pigment may be selected from lactam black, perylene black and aniline black, but not limited thereto. In addition, the black material may use RGB black pigments including red pigment, blue pigment and green pigment.

[0087] A plurality of color filters 462a, 462b, 462c are disposed on the encapsulation layer 140. A plurality of color filters 462a, 462b, 462c may be disposed on the touch sensor component 150 or the buffer layer 461. In addition, a plurality of color filters 462a, 462b, 462c may be disposed to directly contact the buffer layer 461 and cover a partial area of ​​the black matrix 463. A plurality of color filters 462a, 462b, 462c absorb external light and minimize the deterioration of visibility and contrast caused by external light, thereby ensuring improvement in color reproduction. A plurality of color filters 462a, 462b, 462c are disposed on the encapsulation layer 140, so that the light emission efficiency is improved while omitting the polarizing plate POL.

[0088] A plurality of color filters 462a, 462b, 462c may be arranged to correspond to the sub-pixels arranged thereunder. At this time, each of the color filters 462a, 462b, 462c may correspond to the color of the corresponding sub-pixel. That is, the plurality of color filters 462a, 462b, 462c include a first color filter 462a corresponding to the first sub-pixel SP1, a second color filter 462b corresponding to the second sub-pixel SP2, and a third color filter 462c corresponding to the third sub-pixel SP3.

[0089] Each of the color filters 462a, 462b, 462c includes a transparent base resin and a coloring substance. For example, the transparent base resin may be one selected from polyacrylate, polymethacrylate, polyimide, polyvinyl alcohol, polyethylene, polypropylene, polystyrene, polyethylene terephthalate, etc., but is not limited thereto.

[0090] A plurality of color filters 462a, 462b, 462c and a black matrix 463 are disposed on the buffer layer 461. The plurality of color filters 462a, 462b, 462c and the black matrix 463 may be integrally formed on the same plane surface, absorb external light and minimize degradation of visibility and contrast of the organic light emitting display device 400 caused by external light.

[0091] An overcoat layer 464 may be disposed on the plurality of color filters 462a, 462b, 462c and the black matrix 463. The overcoat layer 464 may planarize upper portions of the plurality of color filters 462a, 462b, 462c and the black matrix 463.

[0092] In the following, reference Figure 7 A process of detecting a crack C generated on the glass substrate 110 of the organic light emitting display device 100 according to one embodiment is described in detail.

[0093] Figure 7 FIG. 1 is a schematic diagram of a process of detecting cracks in a glass substrate in an organic light-emitting display device according to an embodiment. Figure 7 , only the phase retardation layer 180 of the glass substrate 110 of the organic light emitting display device 100 is shown, and for convenience of description, only the polarization member 1100 and the liquid crystal layer 1200 of the crack detector 1000 are shown.

[0094] refer to Figure 7 , the crack detector 1000 may include a polarization member 1100 and a liquid crystal layer 1200. The polarization member 1100 is a layer for polarizing light input thereto. The polarization member 1100 may be composed of a plurality of layers to selectively transmit light, that is, polarize light.

[0095] The liquid crystal layer 1200 may be disposed under the polarization member 1100. The liquid crystal layer 1200 has anisotropy and polarization characteristics and adjusts the arrangement of liquid crystal molecules in a predetermined direction when a voltage is applied. For example, the liquid crystal layer 1200 may be driven in a polymer dispersed liquid crystal (PDLC) mode or a twisted nematic (TN) mode.

[0096] The optical axes of the polarization member 1100 and the liquid crystal layer 1200 may form an angle of 45° to 135° with the optical axis of the phase retardation layer 180. For example, when the crack detector 1000 is in the transmission mode, the phase retardation layer 180 may have a retardation value of λ / 2. That is, the phase of the light source passing through the portion where the crack C is generated is delayed by λ / 2, and thus the crack C can be easily detected despite the small size of the crack C.

[0097] Although not shown in the figure, in the case where a reflective plate is additionally provided under the organic light emitting display device 100, the phase delay layer 180 may have a delay value of λ, and λ delay is performed when external light is input, and λ delay is performed when external light is reflected from the reflective plate, so that phase delay is performed by λ. That is, the phase of the light source passing through the portion where the crack C is generated is delayed by λ / 2, so that the crack C is easily detected even though the crack C has a micro size.

[0098] Exemplary embodiments of the present disclosure may also be described as follows:

[0099] According to one aspect of the present disclosure, an organic light-emitting display device is provided. The organic light-emitting display device includes a glass substrate, an organic light-emitting element on the glass substrate, and a phase retardation layer disposed under the glass substrate.

[0100] The in-plane retardation value (Ro) of the phase retardation layer may be 120 nm to 300 nm.

[0101] A thickness retardation value (Rth) of the phase retardation layer may be smaller than an in-plane retardation value (Ro) of the phase retardation layer.

[0102] The phase retardation layer may be a λ / 4 or λ / 2 retardation layer.

[0103] The optical axis of the phase retardation layer may be 45° or 135° relative to the major axis or the minor axis of the glass substrate.

[0104] The phase retardation layer may include a phase retardation film.

[0105] The organic light emitting display device may further include an adhesive layer disposed between the phase retardation film and the glass substrate.

[0106] The adhesive layer may be formed of an optically clear adhesive.

[0107] The adhesive layer may have a glass transition temperature (Tg) greater than a glass transition temperature (Tg) of the phase retarder film.

[0108] The adhesive layer may have the same refractive index as that of the glass substrate.

[0109] The storage modulus of the adhesive layer can be 10 6 Pa or more.

[0110] The phase retardation layer may include a liquid crystal coating layer.

[0111] The liquid crystal coating layer may be disposed to directly contact a lower surface of the glass substrate.

[0112] The organic light emitting display device may further include a protective film disposed on a lower surface of the liquid crystal coating layer and having an in-plane retardation value (Ro) of 0.

[0113] The organic light emitting display device may further include a polarizing layer disposed on the organic light emitting element.

[0114] The polarizing layer may include a polarizing plate, and a size of the polarizing plate may be smaller than a size of the glass substrate, and four edges of the polarizing plate may be placed inside four edges of the glass substrate.

[0115] The organic light emitting display device may further include an encapsulation layer configured to cover the organic light emitting element, and the polarization layer may be composed of a plurality of color filters and a black matrix disposed between the plurality of color filters, the plurality of color filters being disposed on the encapsulation layer to correspond to the plurality of sub-pixels.

[0116] The glass substrate may have a thickness of 30 μm to 200 μm.

[0117] The glass substrate may include a display region and a non-display region, and a crack having a size of 3 μm to 100 μm may be formed in the non-display region.

[0118] The organic light emitting display device may further include a heat dissipation substrate disposed below the phase retardation layer.

[0119] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the attached claims, and all technical concepts within their equivalent scope should be interpreted as falling within the scope of the present disclosure.

Claims

1. An organic light emitting display device, comprising: Glass substrate; an organic light emitting element located on the glass substrate; as well as A phase retardation layer is disposed below the glass substrate. 2 . The organic light emitting display device according to claim 1 , wherein an in-plane retardation value (Ro) of the phase retardation layer is 120 nm to 300 nm. 3 . The organic light emitting display device according to claim 2 , wherein a thickness retardation value (Rth) of the phase retardation layer is smaller than an in-plane retardation value (Ro) of the phase retardation layer. 4 . The organic light emitting display device according to claim 2 , wherein the phase retardation layer is a λ / 4 or λ / 2 retardation layer. 5 . The organic light emitting display device according to claim 2 , wherein an optical axis of the phase retardation layer is 45° or 135° relative to a major axis or a minor axis of the glass substrate. The organic light emitting display device according to claim 1 , wherein the phase retardation layer comprises a phase retardation film. 7 . The organic light emitting display device according to claim 6 , further comprising an adhesive layer disposed between the phase retardation film and the glass substrate. 8 . The organic light emitting display device according to claim 7 , wherein the adhesive layer is formed of an optically transparent adhesive. 9 . The organic light emitting display device of claim 7 , wherein a glass transition temperature (Tg) of the adhesive layer is greater than a glass transition temperature (Tg) of the phase retarder film. 10 . The organic light emitting display device according to claim 7 , wherein a refractive index of the adhesive layer is the same as a refractive index of the glass substrate.

11. The organic light emitting display device according to claim 7, wherein the storage modulus of the adhesive layer is 10 6 Pa or more. 12 . The organic light emitting display device according to claim 1 , wherein the phase retardation layer comprises a liquid crystal coating layer. 13 . The organic light emitting display device according to claim 12 , wherein the liquid crystal coating layer is disposed to directly contact a lower surface of the glass substrate. 14 . The organic light emitting display device according to claim 12 , further comprising a protection film disposed on a lower surface of the liquid crystal coating layer and having an in-plane retardation value (Ro) of 0. 15 . The organic light emitting display device according to claim 1 , further comprising a polarizing layer disposed on the organic light emitting element.

16. The organic light emitting display device according to claim 15, wherein the polarizing layer comprises a polarizing plate, and The size of the polarizing plate is smaller than that of the glass substrate, and four edges of the polarizing plate are placed inside four edges of the glass substrate.

17. The organic light emitting display device according to claim 15, wherein the organic light emitting display device further comprises an encapsulation layer, the encapsulation layer being configured to cover the organic light emitting element, and The polarizing layer is composed of a plurality of color filters and a black matrix disposed between the plurality of color filters, the plurality of color filters being disposed on the encapsulation layer to correspond to a plurality of sub-pixels. 18 . The organic light emitting display device according to claim 1 , wherein a thickness of the glass substrate is 30 μm to 200 μm.

19. The organic light emitting display device according to claim 1, wherein the glass substrate comprises a display area and a non-display area, and Cracks having a size of 3 μm to 100 μm are formed in the non-display area. 20 . The organic light emitting display device according to claim 1 , further comprising a heat dissipation substrate disposed below the phase retardation layer. 21 . The organic light emitting display device of claim 9 , wherein the adhesive layer has a glass transition temperature of 150° C. or higher, and the phase retarder film has a glass transition temperature of 90° C. or higher. 22 . The organic light emitting display device of claim 9 , wherein the phase retardation layer compensates for a delay of a light source transmitted through or reflected from the cracked portion of the glass substrate.

23. A method for detecting cracks in a glass substrate in an organic light-emitting display device, wherein the organic light-emitting display device is the organic light-emitting display device according to any one of claims 1 to 22, the method comprising: detecting cracks in the glass substrate using a crack detector, The crack detector includes a polarization member and a liquid crystal layer disposed below the polarization member, and optical axes of the polarization member and the liquid crystal layer may form an angle of 45° to 135° with an optical axis of the phase retardation layer of the organic light emitting display device.

Images