Attaching device for polar plate and adhesive film ring

Abstract

The invention relates to the technical field of fuel cells, and particularly discloses a pole plate and adhesive film ring laminating device which comprises a workbench, a conveying mechanism, a cutting mechanism, a waste discharge mechanism and a laminating mechanism, and the workbench comprises a cutting workbench, a waste discharge workbench and a laminating workbench which are sequentially arranged in the first horizontal direction; the conveying mechanism is used for conveying the bottom supporting film in the first horizontal direction and enabling the adhesive film belt to sequentially slide through the cutting workbench, the waste discharging workbench and the attaching workbench. The cutting mechanism is used for cutting the adhesive film on the cutting workbench so as to obtain an adhesive film ring; the waste discharging mechanism is used for removing inner side adhesive film waste on the inner side of the adhesive film ring on the waste discharging workbench; and the laminating mechanism is used for laminating the polar plate with the adhesive film ring on the laminating worktable. When the adhesive film belt is cut, after the adhesive film is cut through, the cutting depth of the bottom supporting film is smaller than the thickness of the bottom supporting film, so that the strength of the bottom supporting film is reserved, the strength and rigidity of the adhesive film ring are improved in the transfer process of bearing the adhesive film ring, and the problems of warping and wrinkling of the adhesive film ring are effectively solved.

Description

Technical Field

[0001] The invention relates to the technical field of fuel cells, and in particular to a bonding device for an electrode plate and a film ring. Background Art

[0002] A fuel cell cell is a sandwich structure consisting of a cathode monopolar plate with glue lines and an anode monopolar plate sandwiching a membrane electrode assembly, in which the cathode monopolar plate, anode monopolar plate and the frame of the membrane electrode are all bonded with adhesive. Hot melt adhesive, as an environmentally friendly and pollution-free adhesive, can effectively bond the membrane electrode frame and the metal bipolar plate. Hot melt adhesive film has become a high-quality choice in the preparation of integrated metal bipolar plate cells due to its ultra-high self-source precision.

[0003] At present, in the process of laminating the plate and film of a single fuel cell, the film is mainly cut into slices and transported in the form of sheets. The thickness of the film itself is relatively thin and the rigidity is extremely poor. The film will inevitably wrinkle and warp during the transfer of the sheets. At the same time, the laminating accuracy between the film and the plate is difficult to guarantee. For example, the previous patent CN117594804A discloses a single-cell high-speed laminating method, which uses the method of slicing the coil and hot laminating the single sheet to pre-laminate the plate and the film. This patent adopts the method of adsorption transfer of sheet-shaped film and adsorption transfer of sheet-shaped finished film. The adsorption and transfer process will cause problems such as warping and wrinkling of the film sheet, affecting the laminating quality.

[0004] Therefore, a bonding device for the electrode plate and the film ring is urgently needed to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a bonding device for an electrode plate and a film ring, so as to solve the problem that in the related art, the adsorption and transfer of sheet-shaped films and the adsorption and transfer of finished sheet-shaped films may cause warping and wrinkling of the film sheet, thus affecting the bonding quality.

[0006] The present invention provides a bonding device for a plate and a film ring, which is used for cutting a film on a film strip into a film ring and bonding the film ring to a plate, wherein the film strip comprises a bottom support film and a film, and the bonding device for a plate and a film ring comprises:

[0007] The workbench comprises a cutting workbench, a waste discharge workbench and a laminating workbench which are sequentially arranged along a first horizontal direction;

[0008] A conveying mechanism, used for conveying the base film along the first horizontal direction, and making the adhesive film belt slide through the cutting workbench, the waste discharge workbench and the laminating workbench in sequence, wherein the cutting workbench, the waste discharge workbench and the laminating workbench are respectively used for supporting the adhesive film belt, and the adhesive film is located on the side of the base film away from the workbench;

[0009] A cutting mechanism, used for cutting the adhesive film on the cutting workbench to obtain the adhesive film ring, wherein the cutting depth of the adhesive film strip by the cutting mechanism is less than the thickness of the adhesive film strip and greater than the thickness of the adhesive film;

[0010] A waste discharge mechanism, used for removing the inner film waste inside the film ring on the waste discharge workbench;

[0011] The laminating mechanism is used to laminate the electrode plate with the adhesive film ring on the laminating workbench.

[0012] As an optimal technical solution for the bonding device of the electrode plate and the film ring, the conveying mechanism includes a unwinding roller and a winding roller located on both sides of the workbench along the first horizontal direction, the unwinding roller and the winding roller are configured to respectively wind up the film tape, and the winding roller and the unwinding roller rotate synchronously so that the film tape slides over the cutting workbench, the waste discharge workbench and the bonding workbench in sequence.

[0013] As an optimal technical solution for the bonding device of the electrode plate and the film ring, the conveying mechanism also includes a plurality of limiting roller groups, and the plurality of limiting roller groups are used to support the film tape so that the film tape on both sides of the cutting workbench along the first horizontal direction is coplanar with the film tape on the cutting workbench, so that the film tape on both sides of the waste discharge workbench along the first horizontal direction is coplanar with the film tape on the waste discharge workbench, and so that the film tape on both sides of the bonding workbench along the first horizontal direction is coplanar with the film tape on the bonding workbench.

[0014] As an optimal technical solution for the bonding device of the electrode plate and the film ring, the cutting mechanism is located above the cutting workbench, and the cutting mechanism includes a cutting die and a first driving component. The first driving component drives the cutting die to approach the cutting workbench along the vertical direction, and the depth of the cutting die extending into the film tape is less than the thickness of the film tape.

[0015] As an optimal technical solution for the bonding device of the electrode plate and the film ring, the waste discharge mechanism is located above the waste discharge workbench, and the waste discharge mechanism includes a waste discharge grabbing member, a second driving component and a waste box. The second driving component drives the waste discharge grabbing member to grab the inner side film waste on the waste discharge workbench, and moves the inner side film waste grabbed by the waste discharge grabbing member to the waste box.

[0016] As a preferred technical solution of the bonding device of the electrode plate and the film ring, the workbench further includes a slide rail, a material unloading workbench and a material loading workbench, the material unloading workbench and the material loading workbench are sequentially arranged along the first horizontal direction on a side of the bonding workbench away from the waste discharge workbench, the material loading workbench is used to place the electrode plate that is not bonded to the film ring, the material unloading workbench is used to place the electrode plate bonded to the film ring, and the slide rail is laid along the first horizontal direction;

[0017] The bonding mechanism includes a first sliding frame, a third driving component and a bonding mold. The third driving component is arranged on the first sliding frame. The third driving component drives the bonding mold to move in the vertical direction. The first sliding frame slides with the slide rail and enables the bonding mold to selectively be opposite to one of the bonding workbench, the unloading workbench and the loading workbench along the vertical direction. The bonding mold can grab the electrode plate.

[0018] As an optimal technical solution for the bonding device of the electrode plate and the film ring, the bonding mold includes a plate body, a pressing portion and a bonding grasping piece. The plate body is provided with a pressing portion on the side opposite to the workbench, and the pressing portion is consistent with the shape of the film ring. The plate body is provided with the pressing portion on the side thereof. The bonding grasping piece for grasping the electrode plate is provided. The bonding grasping piece is attracted to the electrode plate, and the pressing portion is in contact with the electrode plate.

[0019] As a preferred technical solution of the bonding device of the electrode plate and the film ring, the bonding workbench includes a support plate and an elastic plate stacked on each other, and the bottom support film is located on a side of the elastic plate away from the support plate.

[0020] As an optimal technical solution for the bonding device of the electrode plate and the film ring, it also includes a loading and unloading mechanism, a loading frame and a unloading frame. The loading frame and the unloading frame are arranged in sequence along the first horizontal direction on the side of the loading workbench away from the unloading workbench. The loading and unloading mechanism is located along the first horizontal direction on the side of the bonding mechanism away from the waste discharge mechanism. The loading and unloading mechanism includes a second sliding frame, a fourth driving assembly and a loading and unloading grabbing piece. The fourth driving assembly is arranged on the second sliding frame. The fourth driving assembly drives the loading and unloading grabbing piece to move along the vertical direction. The second sliding frame slides with the slide rail to enable the loading and unloading grabbing piece to selectively be opposite to one of the unloading workbench, the loading workbench, the loading frame and the unloading frame along the vertical direction.

[0021] As a preferred technical solution of the electrode plate and the film ring bonding device, the loading workbench can adjust the position of the electrode plate located on the loading workbench;

[0022] It also includes a first visual inspection mechanism and a second visual inspection mechanism. The first visual inspection mechanism is used to be opposite to the bonding workbench and to detect the film ring on the bonding workbench. The second visual inspection mechanism is used to be opposite to the loading workbench and to detect the electrode plate on the loading workbench.

[0023] The beneficial effects of the present invention are:

[0024] The present invention provides a bonding device for an electrode plate and an adhesive film ring, which is used for cutting an adhesive film on an adhesive film strip into adhesive film rings and bonding the adhesive film rings to the electrode plate. The adhesive film strip includes a base film and an adhesive film. The bonding device for the electrode plate and the adhesive film ring includes a workbench, a conveying mechanism, a cutting mechanism, a waste discharge mechanism and a bonding mechanism. The workbench includes a cutting workbench, a waste discharge workbench and a bonding workbench which are sequentially arranged along a first horizontal direction. The conveying mechanism is used for conveying the base film along the first horizontal direction and making the adhesive film strip slide through the cutting workbench in sequence. The cutting mechanism is used to cut the film on the cutting workbench to obtain a film ring, and the cutting depth of the film tape is less than the thickness of the film tape and greater than the thickness of the film; the waste discharge mechanism is used to remove the inner film waste inside the film ring on the waste discharge workbench; the bonding mechanism is used to bond the electrode plate to the film ring on the bonding workbench. When the bonding device of the electrode plate and the film ring is working, the conveying mechanism conveys the film belt to move along the first horizontal direction, so that the film belt slides through the cutting workbench, the waste discharge workbench and the bonding workbench in sequence. During this process, the cutting mechanism cuts the film of the film belt on the cutting workbench, so as to obtain the film ring and the inner film waste located inside the film ring and the outer film waste located outside; the waste discharge mechanism removes the inner film waste located inside the film ring on the waste discharge workbench, so as to avoid the inner film waste inside the film ring being bonded to the electrode plate together when bonding the electrode plate and the film ring in the next step; The bonding mechanism is used to bond the electrode plate to the film ring on the bonding workbench with the inner film waste removed, thereby completing the bonding of the electrode plate and the film ring. After that, after removing the electrode plate with the film ring bonded, the conveying mechanism is started to send the film ring, the inner film waste and the outer film waste on the cutting workbench to the waste discharge workbench, and the film ring with the inner film waste removed and the outer film waste are sent to the bonding workbench. At this time, the cutting workbench is provided with the cut film. The cutting mechanism, the waste discharge mechanism and the bonding mechanism repeat the above operations to realize the continuous bonding processing of the electrode plate and the film ring. When cutting the film tape, since the cutting depth of the cutting mechanism is less than the thickness of the film tape, the cutting mechanism fails to cut through the base film after cutting the film. Therefore, the base film retains its own strength. During the transportation of the film ring, the strength and rigidity of the film ring are improved, and the problems of warping and wrinkling of the film ring are effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 The structure of the bonding device between the electrode plate and the film ring in the embodiment of the present invention is shown in FIG. Figure 1 ;

[0026] Figure 2 The structure of the bonding device between the electrode plate and the film ring in the embodiment of the present invention is shown in FIG. Figure 2;

[0027] Figure 3 Schematic diagram of the structure of the bonding device of the electrode plate and the film ring in the embodiment of the present invention (excluding the cutting mechanism, the waste discharge mechanism and the bonding mechanism);

[0028] Figure 4 It is a schematic diagram of the assembly of the conveying mechanism and the workbench in an embodiment of the present invention;

[0029] Figure 5 It is a schematic diagram of the assembly of the laminating mold and the laminating workbench in an embodiment of the present invention.

[0030] In the figure:

[0031] 100, adhesive film belt; 101, bottom support film; 102, adhesive film; 1021, adhesive film ring; 200, plate;

[0032] X, first horizontal direction; Y, second horizontal direction; Z, vertical direction;

[0033] 11. Cutting workbench; 12. Waste discharge workbench; 13. Laminating workbench; 131. Support plate; 132. Elastic plate; 14. Slide rail; 15. Unloading workbench; 16. Loading workbench;

[0034] 21. Unwinding roller; 22. Rewinding roller; 23. Position limiting roller group; 231. Upper pressure roller; 232. Lower pressure roller;

[0035] 3. Cutting mechanism; 31. Cutting die; 32. First driving assembly; 33. Cutting bracket;

[0036] 4. Waste discharge mechanism; 41. Waste discharge grabbing member; 42. Second drive assembly; 43. Waste discharge bracket;

[0037] 5. Laminating mechanism; 51. First sliding frame; 52. Third driving assembly; 53. Laminating mold; 531. Plate body; 532. Pressing part; 533. Laminating grabbing member;

[0038] 6. Loading and unloading mechanism; 61. Second sliding frame; 62. Fourth driving assembly; 63. Loading and unloading grabbing member;

[0039] 7. Loading frame; 8. Unloading frame; 9. First visual inspection mechanism; 10. Second visual inspection mechanism. DETAILED DESCRIPTION

[0040] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be a communication between the inner sides of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0044] like Figure 1 to Figure 5As shown, the present embodiment provides a bonding device for a plate and a film ring, which is used to cut a film 102 on a film tape 100 into a film ring 1021, and to bond the film ring 1021 to a plate 200. The film tape 100 includes a base film 101 and a film 102. The bonding device for a plate and a film ring includes a workbench, a conveying mechanism, a cutting mechanism 3, a waste discharge mechanism 4, and a bonding mechanism 5. The workbench includes a cutting workbench 11, a waste discharge workbench 12, and a bonding workbench 13 which are sequentially arranged along a first horizontal direction X. The conveying mechanism is used to convey the base film 101 along the first horizontal direction X, and to make the film tape 100 slide over the cutting workbench 11, the waste discharge workbench 12, and the bonding workbench 13 in sequence. The workbench 12 and the laminating workbench 13, the cutting workbench 11, the waste discharge workbench 12 and the laminating workbench 13 are respectively used to support the film tape 100, and the film 102 is located on the side of the base film 101 away from the workbench; the cutting mechanism 3 is used to cut the film 102 on the cutting workbench 11 to obtain a film ring 1021, and the cutting depth of the film tape 100 by the cutting mechanism 3 is less than the thickness of the film tape 100 and greater than the thickness of the film 102; the waste discharge mechanism 4 is used to remove the inner film waste inside the film ring 1021 on the waste discharge workbench 12; the laminating mechanism 5 is used to laminate the electrode 200 with the film ring 1021 on the laminating workbench 13. When the bonding device of the electrode plate and the film ring is working, the conveying mechanism conveys the film tape 100 to move along the first horizontal direction X, so that the film tape 100 slides through the cutting workbench 11, the waste discharge workbench 12 and the bonding workbench 13 in sequence. In this process, the cutting mechanism 3 cuts the film 102 of the film tape 100 located on the cutting workbench 11, so as to obtain the film ring 1021 and the inner film waste located inside the film ring 1021 and the outer film waste located outside; the waste discharge mechanism 4 removes the inner film waste inside the film ring 1021 located on the waste discharge workbench 12, so as to avoid the inner film waste inside the film ring 1021 being bonded to the electrode plate 200 together with the film ring 1021 in the next step; bonding The bonding mechanism 5 is used to bond the electrode 200 with the film ring 1021 on the bonding workbench 13, from which the inner film waste has been removed, thereby completing the bonding of the electrode 200 and the film ring 1021. Subsequently, after the electrode 200 bonded with the film ring 1021 is removed, the conveying mechanism is started to deliver the film ring 1021, the inner film waste and the outer film waste on the outer side of the cutting workbench 11 to the waste discharge workbench 12, and deliver the film ring 1021 with the inner film waste removed and the outer film waste to the bonding workbench 13. At this time, the cutting workbench 11 is provided with uncut film 102. The cutting mechanism 3, the waste discharge mechanism 4 and the bonding mechanism 5 repeat the above operations to achieve continuous bonding processing of the electrode 200 and the film ring 1021.When cutting the film tape 100, since the cutting depth of the film tape 100 by the cutting mechanism 3 is less than the thickness of the film tape 100 and greater than the thickness of the film 102, the cutting mechanism 3 fails to cut through the base film 101 after cutting the film 102. Therefore, the base film 101 retains its own strength. During the transportation of the film ring 1021, the strength and rigidity of the film ring 1021 are improved, and the problems of warping and wrinkling of the film ring 1021 are effectively improved.

[0045] Specifically, the base film 101 is made of PET, which has a relatively high material hardness. The base film 101 and the adhesive film 102 are connected with low viscosity, which ensures the flatness of the adhesive film 102 on the one hand, and facilitates the discharge of adhesive film waste on the other hand.

[0046] Specifically, the conveying mechanism drives the bottom film 101 to move, thereby realizing the movement of the adhesive film 102. The conveying mechanism works intermittently. When the conveying mechanism rests intermittently, the cutting mechanism 3, the waste discharge mechanism 4 and the laminating mechanism 5 complete their respective operations. When the conveying mechanism works intermittently, the conveying mechanism moves the adhesive film belt 100 as a whole to the position of a workbench. Specifically, the cutting workbench 11, the waste discharge workbench 12 and the laminating workbench 13 are arranged at equal intervals along the first horizontal direction X.

[0047] As for how the conveying mechanism drives the film tape 100 to move along the first horizontal direction X, optionally, the conveying mechanism includes an unwinding roller 21 and a winding roller 22 located on both sides of the workbench along the first horizontal direction X, the unwinding roller 21 and the winding roller 22 are configured to wind up the film tape 100 respectively, and the winding roller 22 and the unwinding roller 21 rotate synchronously, so that the film tape 100 slides through the cutting workbench 11, the waste discharge workbench 12 and the laminating workbench 13 in sequence. The film tape 100 can be wound into a film roll; the unwinding roller 21 is configured to be fixedly connected to the film roll coaxially, and the winding roller 22 is configured to be fixedly connected to the free end of the film roll, and the winding roller 22 rotates so that the film tape 100 wound into a film roll slides through the cutting workbench 11, the waste discharge workbench 12 and the laminating workbench 13 in sequence. In this embodiment, the film roll is sleeved on the unwinding roller 21 and fixedly connected to the unwinding roller 21, and the winding roller 22 rotates, so that the film tape 100 of the film roll is wound on the winding roller 22. Since the unwinding roller 21 and the winding roller 22 are arranged on both sides of the workbench along the first horizontal direction X, the film tape 100 between the unwinding roller 21 and the winding roller 22 slides through the cutting workbench 11, the waste discharge workbench 12 and the laminating workbench 13 in sequence, and the winding roller 22 winds up the base film 101 and the outer film waste located on the base film 101. The unwinding roller 21 and the winding roller 22 can control the tension of the base film 101, ensure the flatness of the film 102, and ensure the stability of the process of transporting the film 102.

[0048] Optionally, the conveying mechanism also includes a plurality of limiting roller groups 23, and the plurality of limiting roller groups 23 are used to support the film tape 100 so that the film tape 100 on both sides of the cutting workbench 11 along the first horizontal direction X is coplanar with the film tape 100 on the cutting workbench 11, so that the film tape 100 on both sides of the waste discharge workbench 12 along the first horizontal direction X is coplanar with the film tape 100 on the waste discharge workbench 12, and so that the film tape 100 on both sides of the laminating workbench 13 along the first horizontal direction X is coplanar with the film tape 100 on the laminating workbench 13. In this embodiment, there are four limiting roller groups 23, the first of which is arranged between the cutting workbench 11 and the unwinding roller 21, and this arrangement makes the film tape 100 on the side of the cutting workbench 11 close to the unwinding roller 21 and the film tape 100 on the cutting workbench 11 located in the same plane; the second one is arranged between the cutting workbench 11 and the waste discharge workbench 12, and this arrangement makes the film tape 100 between the cutting workbench 11 and the waste discharge workbench 12 and the film tape 100 on the cutting workbench 11 located in the same plane, so that the film tape 100 between the cutting workbench 11 and the waste discharge workbench 12 and the film tape 100 on the waste discharge workbench 12 are located in the same plane. The third one is arranged between the waste discharge workbench 12 and the laminating workbench 13, and this arrangement makes the film tape 100 between the waste discharge workbench 12 and the laminating workbench 13 and the film tape 100 on the waste discharge workbench 12 located in the same plane, and makes the film tape 100 between the waste discharge workbench 12 and the laminating workbench 13 and the film tape 100 on the laminating workbench 13 located in the same plane; the fourth one is arranged between the laminating workbench 13 and the winding roller 22, and this arrangement makes the film tape 100 on the side of the laminating workbench 13 close to the winding roller 22 and the film tape 100 on the cutting workbench 11 located in the same plane. On the one hand, the above arrangement can make the film tape 100 on the cutting workbench 11 more evenly attached to the cutting workbench 11, the film tape 100 on the waste discharge workbench 12 more evenly attached to the waste discharge workbench 12, and the film tape 100 on the laminating workbench 13 more evenly attached to the laminating workbench 13; on the other hand, it can prevent the edges of the cutting workbench 11, the edges of the waste discharge workbench 12, and the edges of the laminating workbench 13 from scratching the film tape 100.

[0049] As for the specific structure of the limiting roller group 23, optionally, the limiting roller group 23 includes an upper pressure roller 231 and a lower pressure roller 232, and the film tape 100 is arranged between the upper pressure roller 231 and the lower pressure roller 232. This arrangement can, on the one hand, limit the film tape 100 along the vertical direction Z, and on the other hand, make the film tape 100 smoother.

[0050] Optionally, the cutting mechanism 3 is located above the cutting workbench 11, and the cutting mechanism 3 includes a cutting die 31 and a first driving assembly 32. The first driving assembly 32 drives the cutting die 31 to approach the cutting workbench 11 along the vertical direction Z, and the depth of the cutting die 31 extending into the adhesive film strip 100 is less than the thickness of the adhesive film strip 100. In this embodiment, the cutting mechanism 3 also includes a cutting bracket 33, and the cutting bracket 33 is disposed on the cutting workbench 11. The first driving assembly 32 is fixed to the cutting bracket 33. The first driving assembly 32 drives the cutting die 31 to slide along the vertical direction Z, thereby causing the cutting die 31 to extend into the adhesive film 102, so as to cut an adhesive film ring 1021 from the adhesive film 102 on the cutting workbench 11. The depth of the cutting die 31 extending into the adhesive film strip 100 is less than the thickness of the adhesive film strip 100. This setting can avoid cutting through the base film 101 during the process of cutting the adhesive film 102. Specifically, the thickness of the base film 101 is a, the thickness of the adhesive film 102 is b, and the depth of the cutting die 31 extending into the adhesive film strip 100 is h, where b<h<a+b.

[0051] Optionally, the first driving assembly 32 may be one of a hydraulic cylinder, a pneumatic cylinder, a screw-nut structure, or a rack-and-pinion structure.

[0052] Optionally, the waste discharge mechanism 4 is located above the waste discharge workbench 12, and the waste discharge mechanism 4 includes a waste discharge grabbing member 41, a second driving component 42 and a waste box. The second driving component 42 drives the waste discharge grabbing member 41 to grab the inner film waste on the waste discharge workbench 12, and moves the inner film waste grabbed by the waste discharge grabbing member 41 into the waste box. In this embodiment, the waste discharge mechanism 4 also includes a waste discharge bracket 43, the second driving component 42 is arranged on the waste discharge workbench 12, and the waste box is arranged on one side of the waste discharge workbench 12 along the second horizontal direction Y. The second driving component 42 can drive the waste discharge grabbing member 41 to move in the vertical direction Z or the second horizontal direction Y. When grabbing the inner film waste in the film ring 1021, the second driving component 42 first drives the waste discharge grabbing member 41 to move along the vertical direction Z toward the direction close to the waste discharge workbench 12, until The waste discharge grabbing member 41 grabs the inner waste film in the film ring 1021, and then the second driving component 42 drives the waste discharge grabbing member 41 along the vertical direction Z away from the waste discharge workbench 12, so that the inner waste film in the film ring 1021 is spaced apart from the film ring 1021 along the vertical direction Z, and finally the second driving member drives the waste discharge grabbing member 41 to move along the second horizontal direction Y, so that the waste discharge grabbing member 41 is opposite to the waste box. At this time, the waste discharge grabbing member 41 can place the inner waste film in the waste box.

[0053] Specifically, the waste discharge gripping member 41 includes a waste discharge suction cup and a vacuum pump connected to the waste discharge suction cup. By controlling the opening and closing of the vacuum pump, it is controlled whether the waste discharge suction cup sucks the inner rubber film waste.

[0054] Optionally, the workbench further includes a slide rail 14, a material unloading workbench 15 and a material loading workbench 16, the material unloading workbench 15 and the material loading workbench 16 are sequentially arranged along the first horizontal direction X on the side of the bonding workbench 13 away from the waste discharge workbench 12, the material loading workbench 16 is used to place the electrode plate 200 not bonded with the film ring 1021, the material unloading workbench 15 is used to place the electrode plate 200 bonded with the film ring 1021, and the slide rail 14 is laid along the first horizontal direction X; the bonding mechanism 5 It includes a first sliding frame 51, a third driving component 52 and a bonding mold 53. The third driving component 52 is arranged on the first sliding frame 51. The third driving component 52 drives the bonding mold 53 to move along the vertical direction Z. The first sliding frame 51 slides with the slide rail 14, and enables the bonding mold 53 to be selectively opposite to one of the bonding workbench 13, the unloading workbench 15 and the loading workbench 16 along the vertical direction Z. The bonding mold 53 can grab the electrode 200. In this embodiment, a plate 200 not bonded with a film ring 1021 is provided on the loading workbench 16. When the first sliding frame 51 slides to the loading workbench 16, the third driving component 52 drives the bonding mold 53 to move along the vertical direction Z and grabs the plate 200 on the loading workbench 16. Then the first sliding frame 51 slides to the bonding workbench 13. When it reaches the position of the bonding workbench 13, the third driving component 52 drives the bonding mold 53 to move along the vertical direction Z toward the film ring 1021, thereby making the plate 200 on the bonding mold 53 bonded with the film ring 1021 on the bonding workbench 13. Finally, the first sliding frame 51 slides to the unloading workbench 15, and the third driving component 52 can drive the bonding mold 53 to place the plate 200 bonded with the film ring 1021 on the unloading workbench 15. The laminating mechanism 5 repeats the above operation to achieve laminating of the electrode plate 200 and the adhesive film ring 1021 , and delivers the electrode plate 200 laminating with the adhesive film ring 1021 to the unloading workbench 15 .

[0055] Optionally, the laminating mold 53 includes a plate body 531, a pressing portion 532 and a laminating grabbing member 533. The pressing portion 532 is provided on the side of the plate body 531 opposite to the workbench. The pressing portion 532 is consistent with the shape of the film ring 1021. The laminating grabbing member 533 for grabbing the electrode plate 200 is provided on the side of the plate body 531 provided with the pressing portion 532. The laminating grabbing member 533 grabs the electrode plate 200, and the pressing portion 532 abuts against the electrode plate 200. In this embodiment, the laminating grabbing member 533 includes a laminating suction cup and a vacuum pump. By controlling the opening and closing of the vacuum pump, whether the laminating suction cup sucks the electrode plate 200 is controlled. The pressing portion 532 is consistent in shape with the film ring 1021. When the third driving component 52 drives the plate body 531 to move close to the bonding workbench 13 so that the electrode plate 200 and the film ring 1021 are pressed against each other, the pressing portion 532 is opposite to the film ring 1021 along the vertical direction Z, thereby making the electrode plate 200 and the film ring 1021 fit more firmly. Optionally, the pressing portion 532 is provided with a heating function. Optionally, the heating temperature of the pressing portion 532 is set to 85°C, and the speed at which the third driving component 52 drives the plate body 531 to move close to the bonding workbench 13 is 0.05mm / s.

[0056] Optionally, the laminating workbench 13 includes a support plate 131 and an elastic plate 132 stacked on each other, and the bottom support film 101 is located on a side of the elastic plate 132 away from the support plate 131. In this embodiment, this arrangement makes the pressure distribution of the laminating position of the electrode plate 200 and the film ring 1021 uniform, reduces the processing accuracy requirements for the laminating mold 53 and the laminating workbench 13, and makes the film ring 1021 and the electrode plate 200 uniformly laminating without bubbles.

[0057] Optionally, the laminating device of the electrode plate and the film ring further includes a loading and unloading mechanism 6, a loading frame 7 and a unloading frame 8, the loading frame 7 and the unloading frame 8 are sequentially arranged on the side of the loading workbench 16 away from the unloading workbench 15 along the first horizontal direction X, the loading and unloading mechanism 6 is located on the side of the laminating mechanism 5 away from the waste discharge mechanism 4 along the first horizontal direction X, the loading and unloading mechanism 6 includes a second sliding frame 61, a fourth driving assembly 62 and a loading and unloading grabbing member 63, the fourth driving assembly 62 is arranged on the second sliding frame 61, the fourth driving assembly 62 drives the loading and unloading grabbing member 63 to move along the vertical direction Z, the second sliding frame 61 and the slide rail 14 slide in cooperation, so that the loading and unloading grabbing member 63 can selectively be opposite to one of the unloading workbench 15, the loading workbench 16, the loading frame 7 and the unloading frame 8 along the vertical direction Z. In this embodiment, the fourth driving assembly 62 is arranged on the second sliding frame 61, and the fourth driving assembly 62 is used to drive the loading and unloading grabbing member 63 to move along the vertical direction Z. The loading frame 7 is provided with a pole plate 200 which is not bonded with the film ring 1021. When the pole plate 200 on the loading workbench 16 is moved to the bonding workbench 13 by the bonding mechanism 5 and bonded with the film ring 1021 on the bonding workbench 13, the second sliding frame 61 moves along the first horizontal direction X and moves to the loading frame 7, and the fourth driving component 62 drives the loading and unloading grabbing piece 63 to move, thereby grabbing the pole plate 200 in the loading frame 7, and then the second sliding frame 61 moves along the first horizontal direction X and moves to the loading workbench 16, and the fourth driving component 62 drives the loading and unloading grabbing piece 63 to place the grabbed pole plate 200 on the loading workbench 16, so that the pole plate 200 on the loading workbench 16 waits for the bonding mechanism 5 to take it. When the laminating mechanism 5 delivers the electrode plate 200 laminating with the adhesive film ring 1021 to the unloading workbench 15, the second sliding frame 61 moves along the first horizontal direction X and moves to the unloading workbench 15, and the fourth driving assembly 62 drives the loading and unloading grabbing member 63 to grab the electrode plate 200 on the unloading workbench 15 to transport the electrode plate 200 laminating with the adhesive film ring 1021 to the unloading frame 8.

[0058] Specifically, the loading and unloading material grasping member 63 includes a loading and unloading material suction cup and a vacuum pump. By controlling the opening and closing of the vacuum pump, it is controlled to control whether the loading and unloading material suction cup sucks the electrode plate 200.

[0059] Optionally, the loading workbench 16 can adjust the position of the electrode plate 200 on the loading workbench 16; specifically, the loading workbench 16 can adjust the electrode plate 200 to move along the first horizontal direction X or the second horizontal direction Y, or rotate the electrode plate 200 around the vertical direction Z. The electrode plate and film ring bonding device also includes a first visual detection mechanism 9 and a second visual detection mechanism 10, the first visual detection mechanism 9 is used to be opposite to the bonding workbench 13 and used to detect the film ring 1021 on the bonding workbench 13, and the second visual detection mechanism 10 is used to be opposite to the loading workbench 16 and used to detect the electrode plate 200 on the loading workbench 16. In this embodiment, in order to improve the accuracy of the bonding between the electrode plate 200 and the film ring 1021, a first visual inspection mechanism 9 and a second visual inspection mechanism 10 are provided. The first visual inspection mechanism 9 detects the position of the film ring 1021 on the bonding workbench 13, and the second visual inspection mechanism 10 detects the position of the electrode plate 200 on the loading workbench 16. It is determined whether the photo of the electrode plate 200 taken by the second visual inspection mechanism 10 coincides with the photo of the film ring 1021 on the bonding workbench 13 taken by the first visual inspection mechanism 9 through translation, and then it is determined whether the electrode plate 200 and the film ring 1021 can be accurately matched. If not, the angle and position of the electrode plate 200 are adjusted by the loading workbench 16, so that when the electrode plate 200 moves along the first horizontal direction X to above the film ring 1021 on the bonding workbench 13, the electrode plate 200 and the film ring 1021 can be accurately matched. In addition, the first visual inspection mechanism 9 can detect whether the inner film waste inside the film ring 1021 located on the bonding workbench 13 is removed cleanly. If not, the staff manually removes the film waste, or the conveying mechanism is directly started to discard the film ring 1021 on the bonding workbench 13.

[0060] The use process of the bonding device of the electrode plate and the film ring includes:

[0061] S10: The conveying mechanism works intermittently to make the adhesive film belt 100 slide intermittently on the workbench; wherein the unwinding roller 21 and the winding roller 22 work together to keep the base film 101 between the unwinding roller 21 and the winding roller 22 at a constant tension to avoid deformation, warping and other problems of the adhesive film 102 on the base film 101. The workbench includes a cutting workbench 11, a waste discharge workbench 12 and a laminating workbench 13, and the adhesive film belt 100 between the unwinding roller 21 and the winding roller 22 slides over the cutting workbench 11, the waste discharge workbench 12 and the laminating workbench 13 in sequence.

[0062] S20 : ​​the cutting mechanism 3 cuts the adhesive film 102 on the cutting station table to obtain an adhesive film ring 1021 and inner adhesive film waste located inside the adhesive film ring 1021 and outer adhesive film waste located outside. The cutting mechanism 3 does not cut through the bottom support film 101 .

[0063] S30: The conveying mechanism delivers the film ring 1021 on the cutting station and the inner film waste located inside the film ring 1021 and the outer film waste located outside to the waste discharge workbench 12; the waste discharge mechanism 4 removes the inner film waste located inside the film ring 1021 on the waste discharge workbench 12; the cutting mechanism 3 cuts the film 102 on the cutting workbench 11.

[0064] S40: The conveying mechanism sends the film ring 1021, the inner film waste and the outer film waste on the outer side on the cutting workbench 11 to the waste discharge workbench 12, and sends the film ring 1021 and the outer film waste on the waste discharge workbench 12 with the inner film waste removed to the bonding workbench 13, the bonding mechanism 5 grabs the electrode plate 200 on the loading workbench 16 and transfers it to the bonding workbench 13, the bonding mechanism 5 bonds the grabbed electrode plate 200 on the film ring 1021, and the bonding mechanism 5 sends the electrode plate 200 bonded with the film ring 1021 to the unloading workbench 15; the waste discharge mechanism 4 removes the inner film waste inside the film ring 1021 on the waste discharge workbench 12; the cutting mechanism 3 cuts the film 102 on the cutting workbench 11.

[0065] S50: the loading and unloading mechanism 6 delivers the electrode plate 200 with the adhesive film ring 1021 on the unloading workbench 15 to the unloading frame 8, and delivers the electrode plate 200 without the adhesive film ring 1021 in the loading frame 7 to the loading workbench 16, and returns to S40.

[0066] Optionally, in S30 and S40, the first visual inspection mechanism 9 inspects the position of the adhesive film ring 1021 and at the same time inspects whether the inner adhesive film waste is completely removed to ensure that the inner adhesive film waste is completely removed.

[0067] In S40, the laminating mechanism 5 sets the heating temperature of the electrode plate 200 to 85°C, the laminating speed to 0.05 mm / s, the laminating pressure to 0.1-0.6 MPa, and the laminating time to 10-40 s.

[0068] In S50 : the second visual inspection mechanism 10 is used to inspect the electrode plate 200 on the loading workbench 16 , and the loading workbench 16 corrects the position of the electrode plate 200 .

[0069] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A device for laminating an electrode plate and an adhesive film ring, used for cutting an adhesive film (102) on an adhesive film tape (100) into an adhesive film ring (1021), and laminating the adhesive film ring (1021) to an electrode plate (200), wherein the adhesive film tape (100) comprises a base film (101) and an adhesive film (102), and characterized in that: The bonding device of the electrode plate and the film ring comprises: The workbench comprises a cutting workbench (11), a waste discharge workbench (12) and a bonding workbench (13) which are sequentially arranged along a first horizontal direction (X); a conveying mechanism, used for conveying the adhesive film tape (100) along the first horizontal direction (X), and making the adhesive film tape (100) slide through the cutting workbench (11), the waste discharge workbench (12) and the laminating workbench (13) in sequence, wherein the cutting workbench (11), the waste discharge workbench (12) and the laminating workbench (13) are respectively used for supporting the adhesive film tape (100), and the adhesive film (102) is located on a side of the base film (101) away from the workbench; A cutting mechanism (3) for cutting the adhesive film (102) on the cutting workbench (11) to obtain the adhesive film ring (1021), wherein the cutting depth of the adhesive film strip (100) by the cutting mechanism (3) is less than the thickness of the adhesive film strip (100) and greater than the thickness of the adhesive film (102); A waste discharge mechanism (4) for removing inner rubber film waste inside the rubber film ring (1021) on the waste discharge workbench (12); The laminating mechanism (5) is used to laminate the electrode plate (200) with the adhesive film ring (1021) on the laminating workbench (13).

2. The bonding device of the electrode plate and the film ring according to claim 1, characterized in that: The conveying mechanism comprises an unwinding roller (21) and a winding roller (22) located on both sides of the workbench along the first horizontal direction (X); the unwinding roller (21) and the winding roller (22) are configured to respectively wind up the adhesive film tape (100); the winding roller (22) and the unwinding roller (21) rotate synchronously so that the adhesive film tape (100) slides over the cutting workbench (11), the waste discharge workbench (12) and the laminating workbench (13) in sequence.

3. The bonding device of the electrode plate and the film ring according to claim 2, characterized in that: The conveying mechanism further comprises a plurality of limiting roller groups (23), wherein the plurality of limiting roller groups (23) are used to support the adhesive film tape (100) so that the adhesive film tape (100) on both sides of the cutting workbench (11) along the first horizontal direction (X) is coplanar with the adhesive film tape (100) on the cutting workbench (11), so that the adhesive film tape (100) on both sides of the waste discharge workbench (12) along the first horizontal direction (X) is coplanar with the adhesive film tape (100) on the waste discharge workbench (12), and so that the adhesive film tape (100) on both sides of the laminating workbench (13) along the first horizontal direction (X) is coplanar with the adhesive film tape (100) on the laminating workbench (13).

4. The electrode plate and film ring bonding device according to claim 1, characterized in that: The cutting mechanism (3) is located above the cutting workbench (11), and comprises a cutting die (31) and a first driving component (32). The first driving component (32) drives the cutting die (31) to approach the cutting workbench (11) along a vertical direction (Z), and the depth to which the cutting die (31) extends into the adhesive film tape (100) is less than the thickness of the adhesive film tape (100).

5. The electrode plate and film ring bonding device according to claim 1, characterized in that: The waste discharge mechanism (4) is located above the waste discharge workbench (12), and comprises a waste discharge grabbing member (41), a second driving component (42) and a waste box, wherein the second driving component (42) drives the waste discharge grabbing member (41) to grab the inner side rubber film waste on the waste discharge workbench (12), and moves the inner side rubber film waste grabbed by the waste discharge grabbing member (41) into the waste box.

6. The electrode plate and film ring bonding device according to claim 1, characterized in that: The workbench further comprises a slide rail (14), a material unloading workbench (15) and a material loading workbench (16); the material unloading workbench (15) and the material loading workbench (16) are sequentially arranged along the first horizontal direction (X) on a side of the bonding workbench (13) away from the waste discharge workbench (12); the material loading workbench (16) is used for placing the electrode plate (200) that is not bonded to the adhesive film ring (1021); the material unloading workbench (15) is used for placing the electrode plate (200) that is bonded to the adhesive film ring (1021); and the slide rail (14) is laid along the first horizontal direction (X); The bonding mechanism (5) comprises a first sliding frame (51), a third driving component (52) and a bonding mold (53); the third driving component (52) is arranged on the first sliding frame (51); the third driving component (52) drives the bonding mold (53) to move along the vertical direction (Z); the first sliding frame (51) is slidably matched with the slide rail (14), and enables the bonding mold (53) to selectively be opposite to one of the bonding workbench (13), the unloading workbench (15) and the loading workbench (16) along the vertical direction (Z); and the bonding mold (53) can grab the electrode (200).

7. The electrode plate and film ring bonding device according to claim 6, characterized in that: The bonding mold (53) comprises a plate body (531), a pressing portion (532) and a bonding grabbing piece (533); the plate body (531) is provided with a pressing portion (532) on a side opposite to the workbench; the pressing portion (532) is consistent in shape with the film ring (1021); the plate body (531) is provided with a bonding grabbing piece (533) for grabbing the electrode plate (200) on one side of the plate body (531) where the pressing portion (532) is provided; the bonding grabbing piece (533) is attracted to the electrode plate (200), and the pressing portion (532) is in contact with the electrode plate (200).

8. The electrode plate and film ring bonding device according to claim 7, characterized in that: The laminating workbench (13) comprises a supporting plate (131) and an elastic plate (132) which are stacked on each other, and the bottom support film (101) is located on a side of the elastic plate (132) away from the supporting plate (131).

9. The electrode plate and film ring bonding device according to claim 6, characterized in that: The invention also comprises a loading and unloading mechanism (6), a loading frame (7) and a unloading frame (8), wherein the loading frame (7) and the unloading frame (8) are sequentially arranged on a side of the loading workbench (16) away from the unloading workbench (15) along the first horizontal direction (X), and the loading and unloading mechanism (6) is located on a side of the laminating mechanism (5) away from the waste discharge mechanism (4) along the first horizontal direction (X), and the loading and unloading mechanism (6) comprises a second sliding frame (61), a fourth driving assembly (62) and a loading and unloading grabbing assembly (61). Part (63), the fourth driving component (62) is arranged on the second sliding frame (61), the fourth driving component (62) drives the loading and unloading grabbing component (63) to move along the vertical direction (Z), the second sliding frame (61) and the sliding rail (14) are slidably matched, so that the loading and unloading grabbing component (63) can selectively be opposite to one of the unloading workbench (15), the loading workbench (16), the loading frame (7) and the unloading frame (8) along the vertical direction (Z).

10. The electrode plate and film ring bonding device according to claim 9, characterized in that: The loading workbench (16) is capable of adjusting the position of the electrode plate (200) located on the loading workbench (16); It also includes a first visual inspection mechanism (9) and a second visual inspection mechanism (10), wherein the first visual inspection mechanism (9) is used to be opposite to the laminating workbench (13) and to detect the adhesive film ring (1021) on the laminating workbench (13), and the second visual inspection mechanism (10) is used to be opposite to the loading workbench (16) and to detect the electrode plate (200) on the loading workbench (16).

Images