SFP + packaging optical module

Abstract

The invention relates to the technical field of optical communication, in particular to an SFP + packaging optical module which comprises a module base, the top of the module base is connected with a module upper cover through a sunk screw and a buckle, an unlocking block is arranged on the outer wall of the module base, and a pull ring is installed on the outer wall of the unlocking block and on the front face of the module base. An EM I elastic piece is connected to the position, close to the unlocking block, of the outer wall of the module base, a PCB receiving and transmitting assembly is installed in the module base and below the module upper cover, a metal cage is installed on the outer wall of the module base and on the back face of the EM I elastic piece, and a base limiting groove is formed in the bottom of the inner wall of the module base. According to the SFP + packaging optical module, unlocking is completed by designing the SFP + packaging optical module and utilizing ingenious cooperation of structures among the module base, the pull ring and the unlocking block in the device, and the problems that an unlocking part of an existing SFP + packaging optical module is complex in structural form, difficult to assemble and large in manufacturing difficulty are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of optical communications, and in particular to an SFP+ packaged optical module. Background Art

[0002] SFP+ is a new type of pluggable optical module developed on the basis of SFP optical module. It has the characteristics of miniaturization, high speed, good heat dissipation and hot plugging. With the maturity of technology, the expansion of market scale and the continuous improvement of the industrial chain, the cost of optical modules is expected to gradually decrease, making it applicable in a wider range of fields. 100G Ethernet is gradually becoming popular, and 400G Ethernet is also beginning to emerge. The market for 25G SFP+ optical modules is becoming increasingly mature, and prices are gradually falling. The shell structure design of SFP+ optical modules is also constantly innovating to simplify the manufacturing process, improve manufacturing efficiency and reduce costs.

[0003] However, the existing SFP+ packaged optical modules still have shortcomings. Specifically, the unlocking part of the existing SFP+ packaged optical modules has a complex structure, is difficult to assemble, and is difficult to manufacture.

[0004] Therefore, an SFP+ packaged optical module is needed to solve the problems raised in the above background technology. Summary of the invention

[0005] The object of the present invention is to provide a SFP+ packaged optical module to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] An SFP+ packaged optical module comprises a module base, the top of the module base is connected to a module cover by countersunk screws and buckles, an outer wall of the module base is provided with an unlocking block, a pull ring is installed on the outer wall of the unlocking block and on the front of the module base, an EM I spring is connected to the outer wall of the module base near the unlocking block, a PCB transceiver assembly is installed inside the module base and below the module cover, and the outer wall of the module base is connected to the EM I spring. A metal cage is installed on the back of I spring piece, a base limiting groove is provided at the bottom of the inner wall of the module base, a supporting boss is provided on the inner wall of the module base, a limiting boss is provided on the inner wall of the module base, a special-shaped groove is provided on the inner wall of the module base near the limiting boss, an array boss is fixedly connected to the top of the module base and on both sides of the unlocking block, a sliding groove is provided on the outer wall of the module base below the array boss, a circular boss is fixedly connected to the outer wall of the module base near the pull ring, a threaded hole is provided inside the module base and on the front side of the base limiting groove, and long strip bosses are fixedly connected to both sides of the module base.

[0008] As a preferred solution of the present invention, a special-shaped boss is fixedly connected on the outer wall of the module cover just above the special-shaped groove, an upper cover limiting groove is provided at the bottom of the module cover at a position corresponding to the base limiting groove, a clamping boss is fixedly connected at the bottom of the module cover just above the supporting boss, a screw hole is provided inside the module cover just above the threaded hole, and a square long groove is provided on the outer wall of the module cover in front of the screw hole.

[0009] As a preferred solution of the present invention, a locking triangular boss is fixedly connected to the outer wall of the unlocking block near the countersunk screw, a first cylinder is installed on both sides of the unlocking block away from the locking triangular boss, and a second cylinder is fixedly connected to both sides of the unlocking block and below the first cylinder.

[0010] As a preferred solution of the present invention, a first hole is formed on the outer wall of the pull ring at a position corresponding to the circular boss, and a second hole is formed on the outer wall of the pull ring at a position corresponding to the first cylinder.

[0011] As a preferred solution of the present invention, the outer wall of the EMI spring sheet is provided with a long slot hole at a position corresponding to the long boss, and the outer wall of the EMI spring sheet is fixedly connected with a limiting convex strip above the long slot hole.

[0012] As a preferred solution of the present invention, the PCB transceiver assembly includes a PCB board sliding in the module base, a transmitter is installed on the front of the PCB board, and a receiver is installed on the outer wall of the PCB board and on the left side of the transmitter.

[0013] As a preferred solution of the present invention, the circular bosses, limiting bosses, special-shaped grooves, base limiting grooves and sliding grooves are each provided with two groups, the array bosses are provided with multiple groups, the supporting bosses are provided with four groups, and the connection method of the countersunk screws and the threaded holes is a threaded connection.

[0014] As a preferred solution of the present invention, the special-shaped bosses, rectangular long grooves and upper cover limiting grooves are each provided with two groups, the clamping bosses are provided with four groups, the special-shaped bosses and the special-shaped grooves are connected by sliding connection, and the countersunk screws penetrate and extend outside the screw holes.

[0015] As a preferred solution of the present invention, the connection modes between the first hole and the circular boss, and between the second hole and the second cylinder are both rotational connections, and the second cylinder and the slide groove are movably connected.

[0016] As a preferred solution of the present invention, the position-limiting convex strips and the long slot holes are both provided with two groups, and the connection modes between the long slot holes and the long bosses, and between the position-limiting convex strips and the rectangular long slots are all sliding connections.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. In the present invention, an SFP+ packaged optical module is designed, and the unlocking is completed by cleverly cooperating the structure between the module base, the pull ring and the unlocking block in the device. The module base and the module cover form a closed space through the limiting boss and the countersunk screw, and the PCB transceiver assembly is fixed inside. The first hole and the second hole on the pull ring are respectively matched with the circular boss on the module base and the second cylinder on the unlocking piece. The second cylinder in the unlocking piece is assembled in the slide groove of the module base. Rotating the pull ring can make the brake piece slide and rotate in the slide groove on the module base, thereby ensuring that the locking triangular boss on the unlocking block can sink below the upper surface of the upper cover, so as to achieve the unlocking of the SFP+ cage. One end of the module cover is obliquely inserted into the groove corresponding to the module base, and the other end is threadedly assembled with the module base through screws. The end position of the I spring piece is fixed with the base groove limiter, and an array boss feature is provided on the module base, which is helpful for the overall heat dissipation of the module. When locked, the locking triangular boss on the unlocking block and the metal cage are buckled and locked. When unlocked, the unlocking block is driven to rotate by rotating the pull ring, and the locking triangular boss sinks to complete the separation of the module and the metal cage. The unlocking part has a simple structure, which solves the problems of complex structure, difficult assembly and difficult manufacturing of the unlocking part of the existing SFP+ packaged optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the three-dimensional structure of the module assembly of the present invention;

[0021] Figure 3 This is an exploded view of the three-dimensional structure of the module assembly of the present invention;

[0022] Figure 4 It is a side cross-sectional view of the module of the present invention in a locked state;

[0023] Figure 5 This is a side sectional view of the present invention in an unlocked state;

[0024] Figure 6 This is a schematic diagram of the three-dimensional structure of the module base of the present invention;

[0025] Figure 7 This is a schematic diagram of the three-dimensional structure of the upper cover of the module of the present invention;

[0026] Figure 8 This is a schematic diagram of the three-dimensional structure of the upper cover of the module of the present invention when viewed from above;

[0027] Fig. 9 This is a schematic diagram of the three-dimensional structure of the unlocking block of the present invention;

[0028] Fig.10 It is a schematic diagram of the three-dimensional structure of the pull ring of the present invention;

[0029] Fig.11 This is a schematic diagram of the three-dimensional structure of the EM I spring of the present invention;

[0030] Fig.12 It is a schematic diagram of the three-dimensional structure of the PCB transceiver assembly of the present invention.

[0031] In the figure: 1, module base; 2, countersunk screw; 3, module cover; 4, unlocking block; 5, pull ring; 6, EM I spring; 7, PCB transceiver assembly; 8, metal cage; 101, base limit groove; 102, support boss; 103, limit boss; 104, special-shaped groove; 105, array boss; 106, slide groove; 107, circular boss; 108, threaded hole; 109, long boss; 301, special-shaped boss; 302, upper cover limit groove; 303, clamping boss; 304, screw hole; 305, square long groove; 401, locking triangular boss; 402, first cylinder; 403, second cylinder; 501, first hole; 502, second hole; 601, long slot hole; 602, limit boss; 701, PCB board; 702, transmitter; 703, receiver. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0033] To facilitate understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0034] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may also be a central element. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0036] For examples, see Figure 1-12 , the present invention provides a technical solution:

[0037] An SFP+ packaged optical module comprises a module base 1, the top of the module base 1 is connected to a module cover 3 through a countersunk screw 2 and a buckle, an outer wall of the module base 1 is provided with an unlocking block 4, a pull ring 5 is installed on the outer wall of the unlocking block 4 and on the front of the module base 1, and an EM is connected to the outer wall of the module base 1 near the unlocking block 4. I shrapnel 6, a PCB transceiver assembly 7 is installed inside the module base 1 and below the module upper cover 3, a metal cage 8 is installed on the outer wall of the module base 1 and on the back of the EMI shrapnel 6, a base limiting groove 101 is opened at the bottom of the inner wall of the module base 1, a supporting boss 102 is set on the inner wall of the module base 1, a limiting boss 103 is set on the inner wall of the module base 1, and a special-shaped groove 104 is opened on the inner wall of the module base 1 near the limiting boss 103. An array boss 105 is fixedly connected to the top of the module base 1 and on both sides of the unlocking block 4, a sliding groove 106 is opened on the outer wall of the module base 1 and below the array boss 105, a circular boss 107 is fixedly connected to the outer wall of the module base 1 near the pull ring 5, a threaded hole 108 is opened on the inside of the module base 1 and on the front of the base limiting groove 101, and a long strip boss 109 is fixedly connected to both sides of the module base 1;

[0038] Among them, the circular boss 107, the limiting boss 103, the special-shaped groove 104, the base limiting groove 101 and the slide groove 106 are each provided with two groups, the array boss 105 is provided with multiple groups, the support boss 102 is provided with four groups, the countersunk screw 2 is connected with the threaded hole 108 by threaded connection, the module cover 3 and the module base 1 cooperate with each other through the special-shaped boss 301 at the bottom of the module cover 3 and the special-shaped groove 104 on the module base 1, and the countersunk screw 2 passes through the screw hole 304 in the module cover 3 and the threaded hole 108 on the module base 1, the module cover 3 and the module base 1 are completely assembled and fixed, and the array boss 105 is provided on the module base 1, which helps to improve the overall heat dissipation effect of the module base 1;

[0039] In this embodiment, reference Figure 7 and Figure 8, a special-shaped boss 301 is fixedly connected to the outer wall of the module cover 3 and just above the special-shaped groove 104, a cover limiting groove 302 is opened at the bottom of the module cover 3 and at the corresponding position of the base limiting groove 101, a clamping boss 303 is fixedly connected to the bottom of the module cover 3 and just above the supporting boss 102, a screw hole 304 is opened inside the module cover 3 and just above the threaded hole 108, and a rectangular long groove 305 is opened on the outer wall of the module cover 3 and on the front of the screw hole 304;

[0040] There are two groups of special-shaped bosses 301, rectangular long grooves 305 and upper cover limit grooves 302, and four groups of clamping bosses 303. The connection between the special-shaped bosses 301 and the special-shaped grooves 104 is a sliding connection, and the countersunk screws 2 penetrate and extend to the outside of the screw holes 304.

[0041] In this embodiment, reference Figure 3 and Fig. 9 , a locking triangular boss 401 is fixedly connected to the outer wall of the unlocking block 4 near the countersunk screw 2, a first cylinder 402 is installed on both sides of the unlocking block 4 and away from the locking triangular boss 401, a second cylinder 403 is fixedly connected to both sides of the unlocking block 4 and below the first cylinder 402, the second cylinder 403 on the unlocking block 4 is matched and connected with the slide groove 106 on the module base 1, so as to realize the movement switching between the locked and unlocked states of the module, and the design of all structural dimensions ensures that the locking triangular boss 401 on the unlocking block 4 can sink below the upper surface of the module cover 3 in the unlocked state, so as to achieve the plug-in and unplug unlocking effect between the module base 1 and the metal cage 8;

[0042] In this embodiment, reference Figure 3 and Fig.10 The outer wall of the pull ring 5 is provided with a first hole 501 at a position corresponding to the circular boss 107, and the outer wall of the pull ring 5 is provided with a second hole 502 at a position corresponding to the first cylinder 402;

[0043] The connection between the first hole 501 and the circular boss 107, and the connection between the second hole 502 and the second cylinder 403 are both rotational connections, and the connection between the second cylinder 403 and the slide groove 106 is movable;

[0044] In this embodiment, reference Figure 3 and Fig.11 The outer wall of the EMI shrapnel 6 is provided with a long slot hole 601 at a position corresponding to the long strip boss 109, and the outer wall of the EMI shrapnel 6 is fixedly connected with a limited convex strip 602 above the long slot hole 601;

[0045] There are two groups of limiting convex strips 602 and long slot holes 601. The connection modes of the long slot holes 601 and the long bosses 109 as well as the limiting convex strips 602 and the rectangular long slots 305 are all sliding connections. The EMI spring clip 6 is elastic and surrounds the outer surface of the module base 1. The limiting convex strips 602 at the end of the EMI spring clip 6 cooperate with the rectangular long slots 305 in the module upper cover 3 for limiting. The long slot holes 601 set on the side of the EMI spring clip 6 cooperate with the long bosses 109 on the side of the module base 1 for limiting, so as to completely limit the EMI spring clip 6. In addition, after the module base 1 and the metal cage 8 are assembled, the EMI spring clip 6 will contact the metal cage 8, which is helpful to reduce electromagnetic interference.

[0046] In this embodiment, reference Figure 3 and Fig.12 The PCB transceiver assembly 7 includes a PCB board 701 that slides in the module base 1, a transmitter 702 is installed on the front of the PCB board 701, and a receiver 703 is installed on the outer wall of the PCB board 701 and on the left side of the transmitter 702. The assembled and fixed module base 1 and the module cover 3 form a closed space through the limiting boss 103 and the countersunk screw 2 to fix the PCB transceiver assembly 7 inside. The limiting boss 103 in the module base 1 ensures that the PCB board 701 is limited front and back, the supporting boss 102 on the module base 1 and the pressing boss 303 at the bottom of the module cover 3 ensure that the PCB board 701 is limited up and down, and the base limiting groove 101 in the module base 1 and the upper cover limiting groove 302 at the bottom of the module cover 3 can completely limit the receiver 703 and the transmitter 702.

[0047] The working process of the present invention: When the SFP+ packaged optical module designed by the present invention is in operation, the module cover 3 and the module base 1 cooperate with each other through the special-shaped boss 301 at the bottom of the module cover 3 and the special-shaped groove 104 on the module base 1, and the countersunk screw 2 passes through the screw hole 304 in the module cover 3 and cooperates with the threaded hole 108 on the module base 1, so that the module cover 3 and the module base 1 are completely assembled and fixed, and the module base 1 is provided with an array boss 105, which helps to improve the overall heat dissipation effect of the module base 1;

[0048] The assembled and fixed module base 1 and module upper cover 3 form a closed space through the limiting boss 103 and the countersunk screw 2, and the PCB transceiver assembly 7 is fixed inside. The limiting boss 103 in the module base 1 ensures that the PCB board 701 is limited in front and back, the supporting boss 102 on the module base 1 and the pressing boss 303 at the bottom of the module upper cover 3 ensure that the PCB board 701 is limited in the upper and lower directions, and the base limiting groove 101 in the module base 1 and the upper cover limiting groove 302 at the bottom of the module upper cover 3 can completely limit the receiver 703 and the transmitter 702;

[0049] The first hole 501 on the pull ring 5 cooperates with the circular boss 107 on the module base 1 to ensure that the pull ring 5 can rotate around the center of the circular boss 107. At the same time, the second hole 502 on the pull ring 5 cooperates with the first cylinder 402 on the unlocking block 4, and the second cylinder 403 on the unlocking block 4 cooperates with the slide groove 106 on the module base 1, thereby realizing the movement switching between the locked and unlocked states of the module. The design of all structural dimensions ensures that the locking triangular boss 401 on the unlocking block 4 can sink below the upper surface of the module cover 3 in the unlocked state, so as to achieve the plug-in and unplug unlocking effect between the module base 1 and the metal cage 8;

[0050] The EM I spring piece 6 is elastic and surrounds the outer surface of the module base 1. The limiting convex strip 602 at the end of the EM I spring piece 6 cooperates with the rectangular long groove 305 in the module upper cover 3 for limiting. The long slot hole 601 set on the side of the EM I spring piece 6 cooperates with the long protrusion 109 on the side of the module base 1 for limiting, so that the EM I spring piece 6 is completely limited. In addition, after the module base 1 and the metal cage 8 are assembled, the EM I spring piece 6 will contact the metal cage 8, which is helpful to reduce electromagnetic interference;

[0051] When locking, the locking triangular boss 401 on the unlocking block 4 and the metal cage 8 are buckled and locked. When unlocking, the unlocking block 4 is driven to rotate by rotating the pull ring 5, and the locking triangular boss 401 sinks, completing the separation of the module base 1 and the metal cage 8.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An SFP+ packaged optical module, comprising a module base (1), characterized in that: The top of the module base (1) is connected to a module cover (3) via a countersunk screw (2) and a buckle; an unlocking block (4) is provided on the outer wall of the module base (1); a pull ring (5) is installed on the outer wall of the unlocking block (4) and on the front of the module base (1); an EMI shrapnel (6) is connected to the outer wall of the module base (1) and at a position close to the unlocking block (4); a PCB transceiver assembly (7) is installed inside the module base (1) and below the module cover (3); a metal cage (8) is installed on the outer wall of the module base (1) and on the back of the EMI shrapnel (6); a base limiting groove (101) is provided at the bottom of the inner wall of the module base (1); and a supporting boss (101) is provided on the inner wall of the module base (1). 2), a limiting boss (103) is provided on the inner wall of the module base (1), a special-shaped groove (104) is provided on the inner wall of the module base (1) near the limiting boss (103), an array boss (105) is fixedly connected to the top of the module base (1) and on both sides of the unlocking block (4), a sliding groove (106) is provided on the outer wall of the module base (1) and below the array boss (105), a circular boss (107) is fixedly connected to the outer wall of the module base (1) and near the pull ring (5), a threaded hole (108) is provided inside the module base (1) and on the front side of the base limiting groove (101), and a long strip boss (109) is fixedly connected to both sides of the module base (1).

2. The SFP+ packaged optical module according to claim 1, characterized in that: A special-shaped boss (301) is fixedly connected to the outer wall of the module upper cover (3) just above the special-shaped groove (104); a cover limit groove (302) is provided at the bottom of the module upper cover (3) at a position corresponding to the base limit groove (101); a clamping boss (303) is fixedly connected to the bottom of the module upper cover (3) just above the supporting boss (102); a screw hole (304) is provided inside the module upper cover (3) just above the threaded hole (108); and a rectangular long groove (305) is provided on the outer wall of the module upper cover (3) and in front of the screw hole (304).

3. The SFP+ packaged optical module according to claim 1, characterized in that: A locking triangular boss (401) is fixedly connected to the outer wall of the unlocking block (4) at a position close to the countersunk screw (2), a first cylinder (402) is installed on both sides of the unlocking block (4) at a position away from the locking triangular boss (401), and a second cylinder (403) is fixedly connected to both sides of the unlocking block (4) and below the first cylinder (402).

4. The SFP+ packaged optical module according to claim 1, characterized in that: The outer wall of the pull ring (5) is provided with a first hole (501) at a position corresponding to the circular boss (107), and the outer wall of the pull ring (5) is provided with a second hole (502) at a position corresponding to the first cylinder (402).

5. The SFP+ packaged optical module according to claim 1, characterized in that: The outer wall of the EMI spring piece (6) is provided with a long slot hole (601) at a position corresponding to the long strip boss (109), and the outer wall of the EMI spring piece (6) is fixedly connected with a limiting convex strip (602) above the long slot hole (601).

6. The SFP+ packaged optical module according to claim 1, characterized in that: The PCB transceiver assembly (7) comprises a PCB board (701) that slides inside the module base (1), a transmitter (702) is installed on the front of the PCB board (701), and a receiver (703) is installed on the outer wall of the PCB board (701) and on the left side of the transmitter (702).

7. The SFP+ packaged optical module according to claim 1, characterized in that: The circular boss (107), the limiting boss (103), the special-shaped groove (104), the base limiting groove (101) and the slide groove (106) are each provided with two groups, the array boss (105) is provided with multiple groups, the supporting boss (102) is provided with four groups, and the countersunk screw (2) and the threaded hole (108) are connected in a threaded manner.

8. The SFP+ packaged optical module according to claim 2, characterized in that: The special-shaped boss (301), the rectangular long groove (305) and the upper cover limiting groove (302) are each provided with two groups, and the clamping boss (303) is provided with four groups. The special-shaped boss (301) and the special-shaped groove (104) are connected in a sliding manner, and the countersunk screw (2) passes through and extends outside the screw hole (304).

9. The SFP+ packaged optical module according to claim 4, characterized in that: The connection modes of the first hole (501) and the circular boss (107), and the second hole (502) and the second cylinder (403) are all rotational connections, and the second cylinder (403) and the slide groove (106) are movable connections.

10. The SFP+ packaged optical module according to claim 5, characterized in that: The position-limiting convex strips (602) and the long slot holes (601) are both provided in two groups, and the connection modes of the long slot holes (601) and the long bosses (109) as well as the position-limiting convex strips (602) and the rectangular long slots (305) are all sliding connections.

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