Integrated circuit structure and manufacturing method thereof

Abstract

The present disclosure provides an integrated circuit (IC) structure. The IC structure includes an IC package structure having an IC chip; and a thermoelectric self-cooling device (TESCD) integrated with the IC package structure. The TESCD also includes a thermoelectric cooling (TEC) device having a plurality of TEC cells configured in an array and electrically connected to provide a cooling effect to the IC package structure, and a liquid cooling module having a coolant driving device and a generator coupled with the coolant driving device to collectively generate power supplied to the TEC device, the TEC device having a plurality of TEC cells configured in an array and electrically connected to provide a cooling effect to the IC package structure. Therefore, a self-cooling function is provided for the IC packaging structure. The embodiment of the invention relates to a method for manufacturing an integrated circuit structure.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to integrated circuit structures and methods for manufacturing the same. Background Art

[0002] Many technological advances have occurred in the field of three-dimensional IC (3DIC) packaging, which involves stacking and bonding multiple chips together. Each chip includes at least one functional IC, such as an IC configured to perform logic functions, memory functions, digital functions, analog functions, mixed signal functions, radio frequency (RF) functions, input / output (I / O) functions, communication functions (e.g., by adopting a desired communication protocol, such as 5G (fifth generation) wireless communication protocol, Ethernet communication protocol, IB communication protocol, etc., to provide support for wired communication and / or wireless communication), power management functions, other functions, or combinations thereof. Some memory devices involve capacitors. With the continuous advancement of 3DIC stacking technology, integrated chips may encounter various problems, including heat dissipation, which may further lead to other problems, such as bonding, stress and delamination problems, and reliability problems. In other aspects, as multi-gate devices are used in advanced IC structures and continue to scale, challenges have emerged in some areas, including current leakage and heat dissipation problems, especially when the IC structure has high current, high voltage or high speed. Therefore, although existing IC structures and their manufacturing methods are generally sufficient for their intended purposes, they are not satisfactory in all aspects. Summary of the invention

[0003] An embodiment of the present disclosure provides an integrated circuit (IC) structure, comprising: an integrated circuit packaging structure having an integrated circuit chip; and a thermoelectric self-cooling device (TESCD) integrated with the integrated circuit packaging structure, wherein the thermoelectric self-cooling device further comprises: a thermoelectric cooling (TEC) device having a plurality of thermoelectric cooling units, the plurality of thermoelectric cooling units being configured into an array and electrically connected to provide a cooling effect to the integrated circuit packaging structure, and a liquid cooling module having a cooling liquid drive device and a generator coupled to the cooling liquid drive device to jointly generate power supplied to the thermoelectric cooling device to provide a self-cooling function to the integrated circuit packaging structure.

[0004] Another embodiment of the present disclosure provides an integrated circuit (IC) structure, including: an integrated circuit packaging structure having an integrated circuit chip; and a thermoelectric self-cooling device (TESCD) integrated with the integrated circuit packaging structure and providing a cooling effect to the integrated circuit packaging structure, wherein the thermoelectric self-cooling device also includes: a thermoelectric cooling (TEC) device having a plurality of thermoelectric cooling units, the plurality of thermoelectric cooling units being configured into an array having n columns and m rows, n and m being appropriate integers, wherein the thermoelectric cooling units in each column are electrically connected in series, and each row of the thermoelectric cooling units is electrically connected in parallel with other rows, and a liquid cooling module having a cooling liquid drive device and a generator coupled to the cooling liquid drive device to jointly generate power supplied to the thermoelectric cooling device to provide a self-cooling function to the integrated circuit packaging structure.

[0005] Yet another embodiment of the present disclosure provides a method for manufacturing an integrated circuit structure, comprising: forming an integrated circuit (IC) chip on a substrate; sealing the integrated circuit chip on the substrate to form an integrated circuit package structure; forming a thermoelectric cooling (TEC) device on the integrated circuit package structure, the thermoelectric cooling device having a plurality of thermoelectric cooling units configured in an array; and forming a liquid cooling module on the thermoelectric cooling device, the liquid cooling module being integrated with the thermoelectric cooling device to provide a thermal cooling effect to the integrated circuit chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Aspects of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be emphasized that, in accordance with standard practice in the industry, the various components are not drawn to scale. In fact, the sizes of the various components may be arbitrarily increased or decreased for clarity of discussion. It should also be emphasized that the accompanying drawings illustrate only typical embodiments of the present disclosure and, therefore, should not be considered to be limiting in scope, as the present disclosure may be equally well applied to other embodiments.

[0007] Figure 1 A cross-sectional view or schematic diagram of an integrated circuit (IC) structure having a thermoelectric self-cooling device (TESCD) constructed in accordance with some embodiments is shown.

[0008] Figure 2 shows a structure constructed according to some embodiments Figure 1 A cross-sectional view of a portion of an IC structure.

[0009] Figure 3 shows a structure constructed according to some embodiments Figure 1 Top view of a portion of the IC structure.

[0010] Figure 4A cross-sectional view or schematic diagram of an IC structure having a TESCD constructed in accordance with some embodiments is shown.

[0011] Figure 5A , Figure 5B and Figure 5C Shown are structures constructed according to various embodiments Figure 1 Top view of a portion of the IC structure.

[0012] Figure 6 A cross-sectional view or schematic diagram of an IC structure having a TESCD constructed in accordance with some embodiments is shown.

[0013] Fig. 7A , Figure 7B , Figure 7C , Fig.7D , Fig. 7E and Figure 7F Shown are structures constructed according to various embodiments Figure 1 Top view of a portion of the IC structure.

[0014] Figure 8 shows a structure constructed according to some embodiments Figure 1 A cross-sectional view of a portion of an IC structure.

[0015] Fig. 9 Shows a manufacturing method constructed according to some embodiments Figure 1 A flow chart of a method of constructing a portion of an IC. DETAILED DESCRIPTION

[0016] The following disclosure provides many different embodiments or examples for realizing the different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, forming a first component above or on a second component may include an embodiment in which the first component and the second component are directly contacted and formed, and may also include an embodiment in which an additional component may be formed between the first component and the second component, so that the first component and the second component may not be in direct contact. In addition, the present disclosure may repeat reference numbers and / or letters in various examples. This repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or configurations discussed. For ease of description, spatial relative terms such as "below ... ", "below ... ", "lower part", "above ... ", "upper part" and the like may be used herein to describe the relationship between an element or component and another element or component as shown in the figure. In addition to the orientation shown in the figure, the spatial relative terms are intended to include different orientations of the device in use or operation. The device may be positioned in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used in this article may be interpreted accordingly.

[0017] In addition, when "about," "approximately," or the like is used to describe a value or a range of values, the term is intended to encompass values ​​within a reasonable range, taking into account variations inherent during manufacturing as understood by those of ordinary skill in the art. For example, based on known manufacturing tolerances associated with manufacturing components having characteristics associated with the value, the value or range of values ​​encompasses a reasonable range including the described value, such as within + / - 10% of the described value. For example, a material layer having a thickness of "about 5 nm" may encompass a size range from 4.25 nm to 5.75 nm, where the manufacturing tolerance associated with the deposited material layer is known to those of ordinary skill in the art to be + / - 15%. In addition, the present disclosure may repeat reference numbers and / or letters in various examples. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0018] The present disclosure relates to integrated circuit (IC) structures and methods for manufacturing the same. More specifically, the present disclosure relates to methods and structures for IC structures having advanced packaging structures, such as three-dimensional IC (3DIC) structures and methods for manufacturing the same. A 3DIC structure is an IC structure having multiple IC chips that are stacked and configured in the same package with various configurations, for example, such as heterogeneous integration including logic devices stacked above memory devices, and vice versa. In some embodiments, the IC structure includes a transistor structure having multiple vertically stacked transistors, each transistor including multiple vertically stacked nanowires or nanosheets as channels and a gate structure wrapping each channel. More specifically, the disclosed IC packaging structure includes a mechanism and structure configured for self-cooling.

[0019] The disclosed IC packaging structure is integrated with a thermoelectric self-cooling device (TESCD). The thermoelectric self-cooling device includes various structural features and manufacturing steps to provide collective heat dissipation and enhance the thermal performance of the IC packaging structure. In some embodiments, the disclosed IC packaging structure includes a thermoelectric self-cooling device integrated with a generator and a mechanism for transferring heat using liquid. In addition, the TESCD also includes a mechanism for generating electricity to self-power the thermoelectric cooling (TEC) device, hence the name thermoelectric self-cooling device. An enhanced liquid cooling solution combined with a self-cooling thermoelectric cooler is provided for high-performance chip packages. The disclosed device structure and its manufacturing method provide more efficient heat dissipation and enhance the performance of the packaged IC structure.

[0020] Figure 11 is a schematic diagram of an IC structure 100 constructed according to some embodiments. The IC structure 100 includes one or more IC chips formed and sealed in the same package and integrated with a thermoelectric self-cooling device. In particular, the IC structure 100 includes an IC package structure 102 and a TESCD 104 formed and fixed on the IC package structure 102. The IC structure 100 (including the IC package structure 102 and the TESCD 104) can be attached to a circuit board, such as a printed circuit board (PCB) with appropriate circuit routing and connections.

[0021] The substrate 106 may also include some conductive traces 110 to provide electrical connections, such as connections from an IC chip to a PCB. In some embodiments, the conductive traces 110 in the carrier substrate 106 may include a redistribution layer structure, an interposer, or a combination thereof.

[0022] In the disclosed embodiment, the IC package structure 102 includes a substrate 106 (such as a carrier substrate) and one or more IC chips 108 formed on the substrate 106. Figure 1 Only one IC chip 108 is shown, but it should be understood that the IC structure 100 may include two or more IC chips 108 configured on a substrate 106 in a three-dimensional (3D) package. In various embodiments, these IC chips can be stacked, directly attached to the substrate 106 side by side, or have a combination of hybrid structures. For example, one or more subsets of IC chips 108 are stacked, and one or more subsets of IC chips 108 are independently and directly attached to the substrate. The IC chip 108 attached to the substrate 106 can be bonded by any appropriate mechanism. Various bonding mechanisms can be implemented in a multi-chip package, such as conductive bumps 112 (e.g., metal bumps), semiconductor through-holes (TSVs), bonding pads, or combinations thereof. In some embodiments, the conductive bumps 112 that connect the chip and / or chip stack to the substrate 106 can be micro-bumps, or controlled collapse chip connections (referred to as C4 bonding) (e.g., solder bumps and / or solder balls). In some embodiments, the gap in the bonding interface can be filled with bottom fill material.

[0023] The IC package structure 102 also includes a heat sink 114 of a material with higher thermal conductivity to dissipate heat. The heat sink 114 can be thermally anisotropic, such as having a lateral thermal conductivity greater than the vertical thermal conductivity, so as to dissipate heat laterally more effectively. In some embodiments, the heat sink 114 includes a metal or metal alloy, such as aluminum, copper, steel or other suitable metal / metal alloy. A thermal interface material (TIM) 116 is between the heat sink 114 and the IC chip 108 to provide a heat dissipation path. In some embodiments, the TIM 116 includes an adhesive material so that the heat sink 114 is attached to the IC chip 108 through the TIM 116. In a further embodiment, the TIM 116 includes an adhesive material provided with a thermally conductive material (mainly such as metal particles, metal wires or graphite). In some embodiments, the heat sink 114 is also used as a lid fixed on the substrate 106 to form a metal shell as a 3DIC package. For example, the IC package structure 102 includes an edge frame 118; and the heat sink 114 is attached to the substrate 106 through the edge frame 118 and an adhesive material 120, and the adhesive material 120 is applied to the interface between the edge frame 118 and the heat sink 114 and the interface between the edge frame 118 and the substrate 106. In this case, a curing process may be performed on the adhesive material 120 for a bonding effect, such as by ultraviolet (UV) light and mechanical stress.

[0024] Still refer to Figure 1 , the TESCD 104 includes a thermoelectric cooling (TEC) device 122 having a plurality of TEC units 122U, the plurality of TEC units 122U being configured in an array to provide a thermal cooling effect for the IC chip 108 and reduce the heat generated by the IC chip 108. The TESCD 104 also includes a liquid cooling module 124 and a generator 126 integrated with the TEC device 122. It should be noted that for redundancy, a plurality of generators 126 and a plurality of cooling liquid driving devices 128 may be employed, thereby reducing the possibility of insufficient power to drive the TEC device 122.

[0025] The coolant driven device 128 includes a mechanism driven by the coolant to generate power. In some embodiments, the coolant driven device 128 includes one or more fans, blades, rotors, other suitable coolant driven devices, or combinations thereof. Without limiting the scope, the coolant driven device 128 is optionally referred to as a fan 128. The generator 126 and the coolant driven device 128 are coupled to generate electricity and are therefore collectively referred to as a power generation module (or device).

[0026] Thermoelectric cooling device 122 utilizes the Peltier effect to generate heat flux at the junction of two different types of materials. A Peltier thermoelectric heat pump is a solid-state active heat pump that transfers heat from one side of the device to the other side depending on the direction of the current flow while consuming electrical energy. Such an instrument is also referred to as a thermoelectric cooler (TEC) or TEC device 122. In the present disclosure, TEC device 122 is used for cooling functions, thereby transferring heat from IC chip 108 to the environment through thermal interface material 116 and heat sink 114, such as Figure 1 As indicated by the arrow in .

[0027] The TEC device 122 includes a plurality of TEC units 122U configured in a suitable connection, such as in series, in parallel, or in a combination thereof. Figure 2 Each TEC unit 122U is described in further detail. Figure 2 1 is a schematic or cross-sectional view of a TEC unit 122U constructed according to some embodiments. The TEC unit 122U includes an n-type doped semiconductor component 132 and a p-type doped semiconductor component 134 arranged adjacent to each other; a bottom conductive component 136 and a top conductive component 138; and a power source 142 (such as a direct current power source or DC power source) connected to an electrical loop 144 so that current flows in the electrical loop 144. When both the electrons in the n-type doped semiconductor component 132 and the holes in the p-type doped semiconductor component 134 are along the direction 150 from the first plate 146 to the second plate 148. Therefore, these electrons and holes carry and transfer heat energy from the first plate 146 to the second plate 148, thereby providing a cooling effect for the first plate 146. The first plate 146 serves as a cooling surface. Both the plates 146 and 148 are thermally conductive to provide a thermal path for dissipating heat from the first plate 146 to the second plate 148. In some embodiments, the plates 146 and 148 are made of a suitable thermally conductive material, such as a thermal interface material (TIM). In further embodiments, the TIM may include a bonding material dispersed with thermally conductive particles or filaments. The n-type doped semiconductor component 132 and the p-type doped semiconductor component 134 are made of one or more semiconductor materials (such as silicon, germanium, silicon germanium, other suitable semiconductor materials, or combinations thereof) doped with n-type dopants (such as phosphorus) and p-type dopants (such as boron), respectively. In some embodiments, the n-type doped semiconductor component 132 and the p-type doped semiconductor component 134 are formed on a silicon substrate. Optionally, the n-type doped semiconductor component 132 and the p-type doped semiconductor component 134 are formed by a process including deposition using an appropriate method (such as chemical vapor deposition (CVD)); doping by implantation or diffusion; and patterning by a photolithography process.

[0028] refer to Figure 3 The TEC device 122 is further described as having a plurality of TEC units 122U. Figure 31 is a top view or schematic diagram of a TEC device 122 constructed in accordance with some embodiments. The TEC units 122U are configured in an array with appropriate electrical connections 152 and connected to a power source from a generator 126, such as Figure 3 As shown. The TEC units 122U in the TEC device 122 are configured as a two-dimensional array, such as n columns and m rows. The parameters n and m are any suitable integers. In the disclosed embodiment, n=m=3. However, it should be understood that n and m can be different and can take any suitable integer. For example, n=4, and m=5. The TEC units 122U are electrically connected in series, in parallel, or a combination thereof. In the disclosed embodiment, the TEC units 122U in each column are electrically connected in series. The columns of TEC units 122U are electrically connected in parallel with other columns of TEC units 122U.

[0029] The TEC device 122 is also integrated with a liquid cooling module 124, which includes a liquid channel 156, a liquid inlet 158, and a liquid outlet 160, which are configured to circulate a cooling liquid (or simply liquid) and transfer heat from the IC structure to the environment. The liquid used in the liquid cooling module 124 can be any suitable liquid compatible with the IC structure 100, such as water, deionized water. In some embodiments, the liquid used in the liquid cooling module 124 can include a gas, such as nitrogen or argon, other suitable gases, or combinations thereof. Reference will be made to Figure 1 Liquid cooling module 124 and generator 126 are described in further detail.

[0030] Return to reference Figure 1 , the TESCD 104 includes a TEC device 122, a liquid cooling module 124, and a generator 126 that are integrated together. The liquid cooling module 124 is coupled to the TEC device 122 to remove heat generated by the IC chip 108.

[0031] The TESCD 104 also includes one or more cooling liquid drive devices 128 configured in the liquid cooling module 124. For example, the cooling liquid drive device 128 includes a fan and is configured in the liquid channel 156 and is driven by the flowing liquid, such as flowing from the liquid inlet 158 ​​to the liquid outlet 160 along the direction 162 and driving the cooling liquid drive device 128. The fan 128 is also coupled to the generator 126 to generate electricity under the driving force of the liquid flowing in the liquid channel 156. In the disclosed embodiment, the fan 128 is configured to be substantially perpendicular to the flow direction 162 of the liquid to effectively generate electricity. In particular, the rotation axis of the fan 128 is configured to be perpendicular to the flow direction 162 of the liquid.

[0032] The generator 126 is coupled to the coolant drive device 128 to generate electricity. For example, the rotation of the coolant drive device 128 drives the generator 126 to generate electricity, which is supplied to the TEC device 122 to enable heat dissipation. Therefore, the TEC device 122 can operate without an external power source, thereby saving energy and cost. Therefore, the TESCD 104 is self-supporting or self-cooling.

[0033] Generator 126 is a device that converts motion-based power into electricity for use by an external circuit. The source of mechanical energy includes a gas turbine, a liquid turbine, or other suitable mechanism. Figure 1 The generator 126 shown is schematic only. The generator 126 may have any suitable structure and may include any suitable generator.

[0034] The coolant drive device 128 is a mechanical device that can be driven by the flow of the liquid flowing in the liquid channel 156 . Figure 1 The coolant driven device 128 in the figure is only a schematic diagram for illustration. The coolant driven device 128 can have any suitable structure. In some embodiments, the coolant driven device 128 is a turbine, a blade, a rotor, or a combination thereof. Figure 1 As shown, the coolant driven device 128 is appropriately configured in the fluid passage 156 to maximize the mechanical power from the flowing fluid to the coolant driven device 128 .

[0035] In some embodiments, the TESCD 104 further includes a controller 130 coupled to the generator 126 and the liquid inlet 158 ​​(such as a valve of the liquid inlet) to monitor and control the flow rate or flow rate to adjust the voltage (or current) supplied to the TEC device 122. Therefore, the voltage / current supplied to the TEC device 122 is monitored and controlled by adjusting the flow rate of the cooling liquid to keep the TEC device 122 in a proper operating condition.

[0036] Figure 4 is a cross-sectional or schematic diagram of an IC structure 100 constructed in accordance with some embodiments. Figure 4 The IC structure 100 and Figure 1 However, the TESCD 104 includes a plurality of fans 128 disposed in the liquid channel 156, such as, for example, Figure 4 The three fans 128 are shown in FIG. The number and location of the fans 128 in the liquid passage 156 are optimized to maximize power output. In the disclosed embodiment, the fans 128 are configured perpendicular to the flow direction 162 of the liquid to efficiently generate electricity.

[0037] Liquid cooling modules can be designed with different configurations, such as FIG. 5A to FIG. 5C shown. FIG. 5A to FIG. 5C 1 is a top view of a portion of a TESCD 104 constructed in accordance with some embodiments. In particular, the liquid cooling module 124 is shown in various configurations. Figure 5A In the embodiment, the liquid channel 156 is designed as a Z-shaped configuration, and the fan 128 is configured in the liquid channel 156. Therefore, the liquid inlet 158 ​​and the liquid outlet 160 are configured at opposite corners. The liquid flows from the liquid inlet 158 ​​along the X direction, then flows through the fan 128 along the Y direction, and then flows to the liquid outlet 160 along the X direction.

[0038] exist Figure 5B In the embodiment, the liquid channel 156 is designed as a C-shaped configuration, and the fan 128 is configured in the liquid channel 156. Therefore, the liquid inlet 158 ​​and the liquid outlet 160 are configured at the same size corner. The liquid flows from the liquid inlet 158 ​​along the X direction, then flows through the fan 128 along the Y direction, and then flows to the liquid outlet 160 along the X direction.

[0039] exist Figure 5C In the embodiment, the liquid channel 156 is designed as an I-shaped configuration, and the fan 128 is configured in the liquid channel 156. Therefore, the liquid inlet 158 ​​and the liquid outlet 160 are configured at the center position of the opposite side. The liquid flows from the liquid inlet 158 ​​to the edge, then flows through the fan 128 along the Y direction, and then flows toward the center to the liquid outlet 160.

[0040] According to some embodiments, the liquid cooling module 124 may be designed to have other configurations. It should be understood that the liquid inlet 158, the liquid outlet 160, and the liquid channel 156 may be adjusted so that the flow direction of the liquid is different.

[0041] Figure 6 is a cross-sectional or schematic diagram of an IC structure 100 constructed in accordance with some embodiments. Figure 6 The IC structure 100 and Figure 1 1. However, the TESCD 104 includes a jet impingement system 164 and a nozzle 166 configured in the liquid cooling module 124. The jet impingement system 164 provides fluid to the liquid channel 156 through the nozzle 166. The nozzle 166 is configured on the top of the corresponding fan 128. For example, the TESCD 104 includes a plurality of (such as 3, 4 or 5) fans 128, and the same number of nozzles 166 are configured above the fans 128 and coupled to the jet impingement system 164 to provide liquid flowing through the fans 128 in the liquid channel 156.

[0042] 7A to 7E1 is a top view of a portion of a TESCD 104 constructed in accordance with various embodiments. In particular, the liquid cooling module 124 is differently designed in size and shape to control and regulate the flow rate of the cooling liquid.

[0043] exist Fig. 7A In the embodiment of the present invention, the liquid channel 156 is designed to have different sizes, such as different widths. The width (i.e., cross-sectional size) of the liquid channel 156 is designed differently to control the flow rate of the coolant, which is related to the performance of the coolant-driven device 128 in the liquid channel 156. For example, when the width of the liquid channel 156 is reduced, the liquid flows faster therein, and more power is generated by the fan 128 and the generator 126. Therefore, higher power is supplied to the TEC device 122, and the heat dissipation capacity of the TESCD 104 is enhanced. Therefore, the flow rate in each liquid channel 156 can be independently controlled, which helps to solve the problem of local hot spots. Note that the number 162 represents the flow direction, and its size also represents the flow rate.

[0044] There are multiple liquid channels 156 along the Y direction from the liquid inlet 158 ​​to the liquid outlet 160. Since each Y-direction liquid channel 156 is configured differently relative to the liquid inlet 158 ​​and the liquid outlet 160, the width is designed to be different to adjust the liquid speed and the output power of each fan 128 to maximize the total output power, optimize the heat dissipation through the liquid, or both. In the disclosed embodiment, there are three Y-direction liquid channels 156 and three fans 128 respectively configured to these Y-direction liquid channels 156. It should be understood that, depending on the design, the number of fans 128 (or the number of Y-direction liquid channels 156) can be any appropriate number, such as 4, 5, 6 or other suitable numbers. Each Y-direction liquid channel 156 includes a fan configured therein. In particular, the corresponding fan is configured with its rotation axis along the Z direction perpendicular to the X and Y directions. In this embodiment, the widths of the Y-direction liquid channels 156 are W1, W2 and W3, respectively. In a further embodiment, W1>W2>W3. In some embodiments, the ratio r of W1 / W2=W2 / W3. In the disclosed example, the ratio r ranges between 1.2 and 1.6.

[0045] In some embodiments, the shape of the liquid channel 156 is adjusted to control and adjust the flow rate of the cooling liquid, such as FIG. 7B to FIG. 7FAs shown. In particular, experiments and analysis have found that changing the cross-sectional area of ​​the liquid channel 156 along the flow direction can change the flow rate of the coolant. In addition, reducing the cross-sectional area of ​​one liquid channel 156 along the flow direction of the coolant can increase the flow rate; and increasing the cross-sectional area of ​​one liquid channel 156 along the flow direction of the coolant can reduce the flow rate. Adjusting the flow rate of each liquid channel 156 of the liquid cooling module 124 can further adjust the flow pattern, maximize the TEC cooling capacity, and enhance the power generation of the coolant-driven device 128. In addition, the flow rate in each liquid channel 156 can be independently controlled, which helps to solve the problem of local hot spots that require more cooling power.

[0046] exist Figure 7B , the liquid channel 156 is designed to have different shapes, such as a trapezoid. The liquid cooling module 124 includes three liquid channels 156 arranged in parallel and having different cross-sectional areas. In particular, the first liquid channel 156 includes a cross-sectional dimension that increases from W2 to W1 along the flow direction, and thus has a reduced flow rate; the second liquid channel 156 includes a cross-sectional dimension that decreases from W1 to W2 along the flow direction, and thus has an increased flow rate; and the third liquid channel 156 includes a cross-sectional dimension that increases from W2 to W1 along the flow direction, and thus has a reduced flow rate. In some embodiments, the ratio r of W1 / W2 is in the range between 1.2 and 1.6.

[0047] exist Figure 7C , the liquid channel 156 is designed to have different shapes, such as a trapezoid. The liquid cooling module 124 includes three liquid channels 156 arranged in parallel and having different cross-sectional areas. In particular, the first liquid channel 156 includes a cross-sectional dimension that increases from W2 to W1 along the flow direction, and thus has a reduced flow rate; the second liquid channel 156 includes a cross-sectional dimension that decreases from W1 to W2 along the flow direction, and thus has an increased flow rate; and the third liquid channel 156 includes a cross-sectional dimension that decreases from W1 to W2 along the flow direction, and thus has an increased flow rate. In some embodiments, the ratio r of W1 / W2 is in the range between 1.2 and 1.6.

[0048] exist Fig.7DIn the embodiment, the liquid channel 156 is designed to have different shapes, such as a trapezoid and a rectangle. The liquid cooling module 124 includes three liquid channels 156 arranged in parallel. In particular, the first liquid channel 156 has a rectangular shape and includes a cross-sectional dimension of a constant W1 along the flow direction; the second liquid channel 156 has a trapezoidal shape, has a cross-sectional dimension that decreases from W1 to W2 along the flow direction, and thus has an increased flow rate; and the third liquid channel 156 has a trapezoidal shape, has a cross-sectional dimension that increases from W2 to W1 along the flow direction, and thus has a reduced flow rate. In some embodiments, the ratio r of W1 / W2 is in the range between 1.2 and 1.6.

[0049] exist Fig. 7E In the embodiment, the liquid channel 156 is designed to have different shapes, such as a trapezoid and a rectangle. The liquid cooling module 124 includes three liquid channels 156 arranged in parallel. In particular, the first liquid channel 156 has a rectangular shape and includes a cross-sectional dimension of a constant W1 along the flow direction; the second liquid channel 156 has a trapezoidal shape, has a cross-sectional dimension that decreases from W1 to W2 along the flow direction, and thus has an increased flow rate; and the third liquid channel 156 has a trapezoidal shape, has a cross-sectional dimension that decreases from W1 to W2 along the flow direction, and thus has an increased flow rate. In some embodiments, the ratio r of W1 / W2 is in the range between 1.2 and 1.6.

[0050] exist Figure 7F In the embodiment, the liquid channel 156 is designed to have different shapes, such as a trapezoid and a rectangle. The liquid cooling module 124 includes three liquid channels 156 arranged in parallel. In particular, the first liquid channel 156 has a rectangular shape and includes a cross-sectional dimension of a constant W1 along the flow direction; the second liquid channel 156 has a trapezoidal shape, has a cross-sectional dimension that decreases from W1 to W2 along the flow direction, and thus has an increased flow rate; and the third liquid channel 156 has a rectangular shape, has a cross-sectional dimension of a constant W1 along the flow direction. In some embodiments, the ratio r of W1 / W2 is in the range between 1.2 and 1.6.

[0051] Return to reference Figure 1 , the IC package structure 102 may include multiple IC chips 108 in any suitable configuration and sealed in the same package structure. For example, according to various embodiments, refer to Figure 8 Further described Figure 1 The portion of the IC package structure 102 is within the dashed box 170 in FIG.

[0052] Figure 86 is a partial cross-sectional view of part or all of an IC structure 600 according to various aspects of the present disclosure, the IC structure 600 being provided by arranging a chipset using a combination of multi-chip packaging technologies, such as a chip on wafer on substrate (CoWoS) packaging technology, a system on integrated chip (SoIC) multi-chip packaging technology, an integrated fan-out (InFO) package. In particular, the IC structure 600 includes an IC package structure 102 and a TESCD 104 attached to the IC package structure 102 to provide a self-cooling effect. Figure 1 However, according to various embodiments, the IC package structure 102 is different. Figure 8 The IC structure shown is to illustrate that the TESCD 104 can be used in any suitable IC packaging structure 102 to provide a self-cooling effect. The IC structure 600 (which can be referred to as a 3D IC package and / or a 3D IC module) includes a CoW structure 602 attached to a substrate 604 (e.g., a packaging substrate), and in the depicted embodiment, the substrate 604 includes a package component 604A and a package component 604B. The CoW structure 602 includes a chip group (e.g., a core chip 606-1, a core chip 606-2, a photonic chip 607, a memory chip 608-1, a memory chip 608-2, an input / output (I / O) chip 610-1, and an I / O chip 610-2) attached to an interposer 615. The chipset is arranged into at least one chip stack, such as a chip stack 620A and a chip stack 620B. Chip stack 620A includes core chip 606-2 and photonic chip 607, and chip stack 620B includes I / O chip 610-1 and I / O chip 610-2. In the depicted embodiment, the chips of chip stack 620A and chip stack 620B are directly bonded face-to-face and / or back-to-back to provide a SoIC package of a multi-chip package. In some embodiments, the chip stack of the multi-chip package includes a combination of chip types, such as a core chip with one or more memory chips disposed thereon. For clarity, the diagrams are simplified. Figure 8 To better understand the inventive concepts of the present disclosure. Additional components may be added in a multi-chip package, and some of the components described below may be replaced, modified, or eliminated in other embodiments of the multi-chip package.

[0053] Core chip 606-1 and core chip 606-2 are central processing unit (CPU) chips and / or other chips. In some embodiments, core chip 606-1 is a CPU chip that forms at least part of a CPU cluster, and core chip 606-2 is a GPU chip. In some embodiments, core chip 606-1 and core chip 606-2 or a combination thereof represent a stack of CPU dies, which can be joined and / or packaged in a manner that provides a CPU package and / or a CPU-based SoIC package. In some embodiments, core chip 606-1 and core chip 606-2 or a combination thereof represent a stack of dies, which can be joined and / or packaged in a manner that provides a GPU package and / or a SoIC package (e.g., a GPU-based SoIC package). In some embodiments, core chip 606-1, core chip 606-2 or a combination thereof represent a stack of CPU dies, which can be joined and / or packaged in a manner that provides a core package and / or a core-based SoIC package. In some embodiments, core chip 606 - 1 , core chip 606 - 2 , or a combination thereof is a SoC.

[0054] Memory chip 608-1 and memory chip 608-2 are high bandwidth memory (HBM) chips, graphic double data rate (GDDR) memory chips, dynamic random access memory (DRAM) chips, static random access memory (SRAM) chips, magnetoresistive random access memory (MRAM) chips, resistive random access memory (RRAM) chips, other suitable memory chips, or combinations thereof. In some embodiments, memory chip 608-1 and memory chip 608-2 are HBM chips that form at least part of a memory device. In some embodiments, memory chip 608-1 and memory chip 608-2 are GDDR memory chips that form at least part of a memory device. In some embodiments, memory chip 608-1 is an HBM chip, and memory chip 608-2 is a GDDR memory chip, or vice versa, and they form at least part of a memory device. In some embodiments, memory chip 608-1 and / or memory chip 608-2 represent a stack of memory dies that can be joined and / or packaged in a manner to provide a memory package and / or a memory-based SoIC package. The memory package can be an HBM package (also referred to as an HBM cube) or a GDDR memory package.

[0055] The core chip 606-1, the core chip 606-2 and the photonic chip 607 (and therefore the chip stack 620A), the memory chip 608-1, the memory chip 608-2 and the I / O chip 610-1 and the I / O chip 610-2 (and therefore the chip stack 620B) are attached and / or interconnected to the interposer 615. The interposer 615 is attached and / or interconnected to the substrate 604. Various bonding mechanisms such as conductive bumps 622 (e.g., metal bumps), semiconductor through vias (TSVs) 624, bonding pads 626, or combinations thereof may be employed in the multi-chip package. For example, the conductive bumps 622 physically and / or electrically connect the core chip 606-1, the photonic chip 607 (and therefore the chip stack 620A), the memory chip 608-1, the memory chip 608-2 and the I / O chip 610-1 (and therefore the chip stack 620B) to the interposer 615. Conductive bumps 622 and TSVs 624 physically and / or electrically connect the interposer 615 to the substrate 604. The TSVs 624 of the interposer 615 are electrically connected to the conductive bumps 622 of the chips and / or chip stacks of the CoW structure 602 through the conductive routing structures (paths) 628 of the interposer 612. The bonding pads 626 physically and / or electrically connect the photonic chips 607 and the core chips 606-2 of the chip stack 620A and the I / O chips 610-1 and 610-2 of the chip stack 620B. In addition, the dielectric bonding layer adjacent to the bonding pads 626 can physically contact the photonic chips 607 and the core chips 606-2 of the chip stack 620A and / or the I / O chips 610-1 and 610-2 of the chip stack 620B. In some embodiments, the conductive bumps 622 connecting the chip and / or chip stack to the interposer 615 can be microbumps, and the conductive bumps 622 connecting the interposer 615 to the substrate 604 can be controlled collapse chip connections (referred to as C4 bonding) (e.g., solder bumps and / or solder balls).

[0056] In some embodiments, substrate 604 is a package substrate, such as a coreless substrate or a substrate with a core, which can be physically and / or electrically connected to another component through an electrical connector 630. Electrical connector 630 is electrically connected to conductive bumps 622 of interposer 615 through a conductive routing structure (path) 632 of substrate 604. In some embodiments, package assembly 604A and package assembly 604B are parts of a single package substrate. In some embodiments, package assembly 604A and package assembly 604B are separate package substrates arranged side by side. In some embodiments, substrate 604 is an interposer. In some embodiments, substrate 604 is a printed circuit board (PCB).

[0057] In some embodiments, the interposer 615 is a semiconductor substrate, such as a silicon wafer (generally referred to as a silicon interposer). In some embodiments, the interposer 615 is a laminate substrate, a core package substrate, a coreless package substrate, etc. In some embodiments, the interposer 615 may include an organic dielectric material, such as a polymer, which may include polyimide, polybenzoxazole (PBO), benzocyclobutene (BCB), other suitable polymer-based materials, or combinations thereof. In some embodiments, a redistribution line (layer) (RDL) may be formed in the interposer 615, such as within the organic dielectric material of the interposer 615. The RDL may form part of the conductive routing structure 628 of the interposer 615. In some embodiments, the RDL electrically connects a bonding pad on one side of the interposer 615 (e.g., the top side of the interposer 615 with the chipset attached thereto) to a bonding pad on the other side of the interposer 615 (e.g., the bottom side of the interposer 615 attached to the substrate 604). In some embodiments, the RDL electrically connects bonding pads on the top side of the interposer 615 , which may electrically connect chips of a chipset. In the disclosed embodiments, one or more deep trench capacitors 616 may be embedded in the interposer 615 .

[0058] In some embodiments, by rearranging the chipset, the multi-chip package can be configured as a 2.5D IC package and / or a 2.5D IC module so that each chip is bonded and / or attached to the interposer 615. In other words, the 2.5D IC module does not include chip stacks, such as chip stack 620A and chip stack 620B, and the chips of the chipset are arranged in a single plane. In such an embodiment, the core chip 606-2 and the I / O chip 610-2 are electrically connected and / or physically connected to the interposer through the conductive bumps 622.

[0059] The IC structure 600 is sealed in the package using a sealing material 636. In this embodiment, the sealing material 636 includes the anisotropic heat dissipation material described above. The IC structure 600 with the anisotropic heat dissipation material in the sealed package provides a mechanism for effectively transferring heat in a directional manner, such as transferring heat horizontally above the substrate 604.

[0060] In particular, the TESCD 104 includes a thermoelectric cooling (TEC) device 122 having a plurality of TEC units 122U configured in an array to provide a thermal cooling effect to the IC chip 108 and reduce the amount of heat generated by the IC chip 108, such as Figure 1The TESCD 104 further includes a liquid cooling module 124 and a generator 126 integrated with the TEC device 122. In some embodiments, multiple generators 126 and multiple cooling liquid drive devices 128 are used for redundancy, thereby reducing the possibility of insufficient power to drive the TEC device 122. The disclosed structure of the TESCD 104 and the method of manufacturing the same provide more efficient heat dissipation and enhance the performance of the IC structure 600.

[0061] Fig. 9 The manufacturing method according to various embodiments is shown. Figure 1 Flowchart of method 700 of a portion of IC structure 100 in FIG. 700 includes operation 702 of forming IC chip 108 on substrate 106, such as bonding IC chip 108 to substrate 106. IC chip 108 may include various IC chips, such as electrical IC chips, memory chips, photonic IC chips, other suitable IC chips, or combinations thereof. IC chip 108 may be suitably disposed on substrate 106 in any suitable configuration, including stacked IC chips, disposed laterally adjacent to each other on substrate 108, and as Figure 1 and Figure 8 Other configurations shown.

[0062] The method 700 includes an operation 704 of sealing the IC chip 108 on the substrate 106 to form the IC package structure 102. The IC chip 108 is sealed by the substrate 106 and the sealing structure with the expected sealing effect. In some embodiments, the sealing structure may include a heat sink 114, a thermal interface material (TIM) 116, an edge frame 118, and other suitable components configured to form a sealing structure to provide a sealing effect and provide a heat dissipation path to transfer heat from the IC chip 108.

[0063] Method 700 includes operation 706 of forming a thermoelectric cooling (TEC) device 122 on IC package structure 102, such as attached or bonded to IC package structure 102. TEC device 122 includes a plurality of TEC units 122U configured in an array to provide a thermal cooling effect to IC chip 108 and reduce heat generated by IC chip 108.

[0064] The method 700 includes an operation 708 of forming a liquid cooling module 124 on the TEC device 122. The liquid cooling module 124 includes a liquid channel 156, a liquid inlet 158, and a liquid outlet 160 configured to circulate a cooling liquid (or simply liquid) and transfer heat from the IC structure to the environment.

[0065] The method 700 includes an operation 710 of configuring and fixing one or more generators 126 and one or more cooling liquid drive devices 128 to the liquid cooling module 124, so that the liquid cooling module 24, the generators 126 and the cooling liquid drive devices 128 are integrated with the TEC device 122 for thermoelectric self-cooling. The method 700 may include other operations before, during, or after the above operations are performed.

[0066] The present disclosure provides an IC structure, which includes an IC package structure having one or more IC chips sealed in the same package and a thermoelectric self-cooling device integrated with the IC package structure. The thermoelectric self-cooling device (TESCD) includes a thermoelectric cooling (TEC) device, and the TEC device has a plurality of TEC units configured in an array and electrically connected to provide a cooling effect to the IC chip in the IC package structure. The TESCD also includes a cooling liquid drive device and a generator coupled to the cooling liquid drive device to jointly generate power supplied to the TEC device, thereby realizing a self-supporting self-cooling function.

[0067] In one exemplary aspect, the present disclosure provides an integrated circuit (IC) structure. The IC structure includes an IC package structure having an IC chip; and a thermoelectric self-cooling device (TESCD) integrated with the IC package structure. The TESCD also includes a thermoelectric cooling (TEC) device and a liquid cooling module, the TEC device having a plurality of TEC units, the plurality of TEC units being configured in an array and electrically connected to provide a cooling effect to the IC package structure, the liquid cooling module having a cooling liquid drive device and a generator coupled to the cooling liquid drive device to jointly generate power supplied to the TEC device, and provide a self-cooling function to the IC package structure.

[0068] In some embodiments, the liquid cooling module further includes: a liquid channel in which the cooling liquid driving device is configured; a liquid inlet coupled to the liquid channel to provide cooling liquid; and a liquid outlet coupled to the liquid channel for discharging the cooling liquid.

[0069] In some embodiments, the liquid cooling module also includes: a liquid channel in which the cooling liquid drive device is configured; a liquid inlet coupled to the liquid channel to provide cooling liquid; and a liquid outlet coupled to the liquid channel for discharging the cooling liquid, wherein the thermoelectric self-cooling device also includes a controller coupled to the cooling liquid drive device and the generator to control the flow rate of the cooling liquid in the liquid channel, thereby adjusting the power supplied to the thermoelectric cooling device.

[0070] In some embodiments, the liquid cooling module further includes: a liquid channel in which the coolant driving device is configured; a liquid inlet coupled to the liquid channel to provide coolant; and a liquid outlet coupled to the liquid channel for discharging the coolant, wherein the liquid cooling module further includes: a jet impact system; and a nozzle coupled to the jet impact system to provide the coolant to the liquid channel.

[0071] In some embodiments, the liquid cooling module further includes: a liquid channel in which the cooling liquid driving device is configured; a liquid inlet coupled to the liquid channel to provide cooling liquid; and a liquid outlet coupled to the liquid channel for discharging the cooling liquid, wherein the liquid channel includes a first liquid channel, a second liquid channel, and a third liquid channel spaced apart from each other along a first direction and longitudinally oriented along a second direction perpendicular to the first direction.

[0072] In some embodiments, the liquid cooling module further includes: a liquid channel in which the cooling liquid driving device is configured; a liquid inlet coupled to the liquid channel to provide cooling liquid; and a liquid outlet coupled to the liquid channel for discharging the cooling liquid, wherein the liquid channel includes a first liquid channel, a second liquid channel, and a third liquid channel spaced apart from each other along a first direction and longitudinally oriented along a second direction perpendicular to the first direction, wherein the liquid inlet and the liquid outlet are configured diagonally.

[0073] In some embodiments, the liquid cooling module further includes: a liquid channel in which the cooling liquid driving device is configured; a liquid inlet coupled to the liquid channel to provide cooling liquid; and a liquid outlet coupled to the liquid channel for discharging the cooling liquid, wherein the liquid channel includes a first liquid channel, a second liquid channel, and a third liquid channel spaced apart from each other along a first direction and longitudinally oriented along a second direction perpendicular to the first direction, wherein the liquid inlet and the liquid outlet are spaced apart along the second direction and directly connected to the first liquid channel.

[0074] In some embodiments, the liquid cooling module further includes: a liquid channel in which the cooling liquid driving device is configured; a liquid inlet coupled to the liquid channel to provide cooling liquid; and a liquid outlet coupled to the liquid channel for discharging the cooling liquid, wherein the liquid channel includes a first liquid channel, a second liquid channel, and a third liquid channel that are spaced apart from each other along a first direction and longitudinally oriented along a second direction perpendicular to the first direction, wherein the liquid inlet and the liquid outlet are spaced apart along the second direction and are directly connected to the second liquid channel.

[0075] In some embodiments, the liquid cooling module further includes: a liquid channel in which the cooling liquid driving device is configured; a liquid inlet coupled to the liquid channel to provide cooling liquid; and a liquid outlet coupled to the liquid channel for discharging the cooling liquid, wherein the liquid channel includes a first liquid channel, a second liquid channel, and a third liquid channel spaced apart from each other along a first direction and longitudinally oriented along a second direction perpendicular to the first direction, wherein the cooling liquid driving device includes a first fan, a second fan, and a third fan respectively configured in the first liquid channel, the second liquid channel, and the third liquid channel.

[0076] In some embodiments, the liquid cooling module further includes: a liquid channel in which the cooling liquid driving device is configured; a liquid inlet coupled to the liquid channel to provide cooling liquid; and a liquid outlet coupled to the liquid channel for discharging the cooling liquid, wherein the liquid channel includes a first liquid channel, a second liquid channel, and a third liquid channel spaced apart from each other along a first direction and longitudinally oriented along a second direction perpendicular to the first direction, wherein the cooling liquid driving device includes a first fan, a second fan, and a third fan respectively configured in the first liquid channel, the second liquid channel, and the third liquid channel, wherein each of the first fan, the second fan, and the third fan is configured to have a rotation axis perpendicular to the first direction and the second direction.

[0077] In some embodiments, the liquid cooling module further includes: a liquid channel in which the cooling liquid driving device is configured; a liquid inlet coupled to the liquid channel to provide cooling liquid; and a liquid outlet coupled to the liquid channel for discharging the cooling liquid, wherein the liquid channel includes a first liquid channel, a second liquid channel, and a third liquid channel spaced apart from each other along a first direction and longitudinally oriented along a second direction perpendicular to the first direction, wherein the first liquid channel spans a first width W1 along the first direction; the second liquid channel spans a second width W2 along the first direction; the third liquid channel spans a third width W3 along the first direction; and W1 is greater than W2, and W2 is greater than W3.

[0078] In some embodiments, the liquid cooling module further includes: a liquid channel in which the cooling liquid driving device is configured; a liquid inlet coupled to the liquid channel to provide cooling liquid; and a liquid outlet coupled to the liquid channel for discharging the cooling liquid, wherein the liquid channel includes a first liquid channel, a second liquid channel, and a third liquid channel spaced apart from each other along a first direction and longitudinally oriented along a second direction perpendicular to the first direction, wherein the first liquid channel includes a first constant cross-sectional area along the second direction; the second liquid channel includes a second cross-sectional area that decreases along the flow direction of the cooling liquid; and the third liquid channel includes a third cross-sectional area that increases along the flow direction of the cooling liquid.

[0079] In some embodiments, the thermoelectric cooling unit includes n*m thermoelectric cooling units configured in an array having n columns and m rows, where n and m are appropriate integers; each column includes m thermoelectric cooling units electrically connected in series; and each row includes n thermoelectric cooling units electrically connected in parallel with other rows.

[0080] In some embodiments, the integrated circuit package structure further includes: a substrate; an edge frame configured on the substrate, wherein the integrated circuit chip is attached to the substrate; and a thermal interface material layer and a heat sink located above the thermal interface material layer.

[0081] In some embodiments, the integrated circuit packaging structure also includes: a substrate; an edge frame configured on the substrate, wherein the integrated circuit chip is attached to the substrate; and a thermal interface material layer and a heat sink located above the thermal interface material layer, wherein the integrated circuit chip is a first integrated circuit chip, wherein the integrated chip packaging structure also includes: a second integrated circuit chip attached to the substrate and close to the first integrated circuit chip; and a third integrated circuit chip stacked on the first integrated circuit chip and electrically connected to the first integrated circuit chip, wherein the first integrated circuit chip, the second integrated circuit chip and the third integrated circuit chip are sealed in the same package.

[0082] In one exemplary aspect, the present disclosure provides an integrated circuit (IC) structure. The IC structure includes an IC package structure having an IC chip; and a thermoelectric self-cooling device (TESCD) integrated with the IC package structure and providing a cooling effect for the IC package structure. The TESCD also includes a thermoelectric cooling (TEC) device and a liquid cooling module, the TEC device having a plurality of TEC units, the plurality of TEC units being configured into an array having n columns and m rows, n and m being appropriate integers, wherein the TEC units in each column are electrically connected in series, and each row of TEC units is electrically connected in parallel with another row, the liquid cooling module having a cooling liquid drive device and a generator coupled to the cooling liquid drive device to jointly generate power supplied to the TEC device, providing a self-cooling function to the IC package structure.

[0083] In some embodiments, the liquid cooling module also includes a liquid channel in which the coolant drive device is configured, a liquid inlet coupled to the liquid channel to provide coolant, and a liquid outlet coupled to the liquid channel for discharging the coolant, and the thermoelectric self-cooling device also includes a controller coupled to the coolant drive device and the generator to control the flow rate of the coolant in the liquid channel, thereby adjusting the power supplied to the thermoelectric cooling device.

[0084] In some embodiments, the liquid cooling module also includes a liquid channel in which the coolant drive device is configured, a liquid inlet coupled to the liquid channel to provide coolant, and a liquid outlet coupled to the liquid channel for discharging the coolant, and the thermoelectric self-cooling device also includes a controller coupled to the coolant drive device and the generator to control the flow rate of the coolant in the liquid channel, thereby adjusting the power supplied to the thermoelectric cooling device, wherein the liquid channel includes: a first liquid channel, including a first constant cross-sectional area along the flow direction of the coolant; a second liquid channel, including a second cross-sectional area that decreases along the flow direction of the coolant; and a third liquid channel, including a third cross-sectional area that increases along the flow direction of the coolant.

[0085] In one exemplary aspect, the present disclosure provides a method for manufacturing an integrated circuit (IC) structure. The method includes forming an integrated circuit (IC) chip on a substrate; sealing the IC chip on the substrate to form an IC package structure; forming a thermoelectric cooling (TEC) device on the IC package structure, the TEC device having a plurality of TEC units configured in an array; and forming a liquid cooling module on the TEC device, the liquid cooling module being integrated with the TEC device to provide a thermal cooling effect to the IC chip.

[0086] In some embodiments, the method further includes configuring and securing a generator and a cooling liquid drive device to the liquid cooling module such that the liquid cooling module, the generator, and the cooling liquid drive device are integrated with the thermoelectric cooling device for thermoelectric self-cooling.

[0087] The features of several embodiments are summarized above so that those skilled in the art can better understand aspects of the present disclosure. Those skilled in the art should understand that they can easily use the present disclosure as a basis to design or modify other processes and structures for implementing the same purpose and / or achieving the same advantages as the embodiments introduced herein. Those skilled in the art should also appreciate that such equivalent constructions do not deviate from the spirit and scope of the present disclosure, and that they can make various changes, substitutions, and modifications herein without departing from the spirit and scope of the present disclosure.

Claims

1. An integrated circuit (IC) structure, comprising: An integrated circuit packaging structure having an integrated circuit chip; as well as A thermoelectric self-cooling device (TESCD), integrated with the integrated circuit packaging structure, wherein the thermoelectric self-cooling device further comprises: a thermoelectric cooling (TEC) device having a plurality of thermoelectric cooling units arranged in an array and electrically connected to provide a cooling effect to the integrated circuit package structure, and The liquid cooling module has a cooling liquid driving device and a generator coupled to the cooling liquid driving device to jointly generate power supplied to the thermoelectric cooling device to provide a self-cooling function for the integrated circuit packaging structure.

2. The integrated circuit structure according to claim 1, wherein: The liquid cooling module also includes: a liquid channel in which the coolant driving device is disposed; a liquid inlet coupled to the liquid channel to provide cooling liquid; and The liquid outlet is coupled to the liquid channel and is used for discharging the cooling liquid.

3. The integrated circuit structure according to claim 2, wherein: The thermoelectric self-cooling device further includes a controller coupled to the cooling liquid driving device and the generator to control the flow rate of the cooling liquid in the liquid channel, thereby adjusting the power supplied to the thermoelectric cooling device.

4. The integrated circuit structure according to claim 2, wherein: The liquid cooling module also includes: Jet impingement systems; and A nozzle is coupled to the jet impingement system to provide the cooling liquid to the liquid channel.

5. The integrated circuit structure according to claim 2, wherein: The liquid channels include a first liquid channel, a second liquid channel, and a third liquid channel that are spaced apart from each other along a first direction and are longitudinally oriented along a second direction perpendicular to the first direction.

6. The integrated circuit structure according to claim 5, wherein: The liquid inlet and the liquid outlet are arranged at opposite corners.

7. The integrated circuit structure according to claim 5, wherein: The liquid inlet and the liquid outlet are spaced apart along the second direction and are directly connected to the first liquid channel.

8. The integrated circuit structure according to claim 5, wherein: The liquid inlet and the liquid outlet are spaced apart along the second direction and are directly connected to the second liquid channel.

9. An integrated circuit (IC) structure comprising: An integrated circuit packaging structure having an integrated circuit chip; as well as A thermoelectric self-cooling device (TESCD), integrated with the integrated circuit package structure and providing a cooling effect to the integrated circuit package structure, wherein the thermoelectric self-cooling device further comprises: A thermoelectric cooling (TEC) device having a plurality of thermoelectric cooling cells arranged in an array having n columns and m rows, n and m being appropriate integers, wherein the thermoelectric cooling cells in each column are electrically connected in series and each row of the thermoelectric cooling cells is electrically connected in parallel with the other rows, and The liquid cooling module has a cooling liquid driving device and a generator coupled to the cooling liquid driving device to jointly generate power supplied to the thermoelectric cooling device to provide a self-cooling function for the integrated circuit packaging structure.

10. A method of manufacturing an integrated circuit structure, comprising: forming an integrated circuit (IC) chip on a substrate; Sealing the integrated circuit chip on the substrate to form an integrated circuit package structure; forming a thermoelectric cooling (TEC) device on the integrated circuit package structure, the thermoelectric cooling device having a plurality of thermoelectric cooling units configured in an array; as well as A liquid cooling module is formed on the thermoelectric cooling device, the liquid cooling module being integrated with the thermoelectric cooling device to provide a thermal cooling effect to the integrated circuit chip.

Images