Satellite communication antenna device and vehicle-mounted high-latitude satellite communication terminal
By setting up a medium storage space in the satellite communication antenna device and integrating the dual-band communication line and antenna into the upper and lower two-layer structures, the problem of easy interference and high cost in traditional dual-band satellite antenna modules is solved, and higher signal stability and lower production costs are achieved.
Patent Information
- Application Number
- CN202510057615.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-14
- Publication Date
- 2025-04-18
AI Technical Summary
The traditional dual-band satellite antenna module is prone to interference due to the distribution structure of the double-layer circuit board and the double-layer antenna, and is costly and difficult to be effectively used in high-latitude areas.
A satellite communication antenna device is designed, in which a medium storage space is formed between the communication main control circuit board and the communication top board to reduce signal interference, and the dual-band communication line and antenna are integrated into the upper and lower two-layer structures respectively to reduce production costs.
It effectively reduces communication signal interference, improves signal transmission stability, and reduces production costs, making communication in high-latitude areas more reliable and economical.
Smart Images

Figure CN119852710A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of communication antennas, and in particular to a satellite communication antenna device and a vehicle-mounted high-latitude satellite communication terminal. Background Art
[0002] Satellite antennas are important components of modern mobile communication systems. The function of satellite antennas is to collect weak signals transmitted by satellites and remove noise as much as possible. Mobile communication is the abbreviation of "satellite ground station communication system in motion". Through the mobile communication system, mobile carriers such as vehicles, ships, and aircraft can track satellites and other platforms in real time during movement, and continuously transmit multimedia information such as voice, data, and images, which can meet the needs of various military and civilian emergency communications and multimedia communications under mobile conditions.
[0003] At present, most satellite communication satellites use synchronous orbit satellites. In different latitudes, the required antenna elevation angle is different. The required elevation angle is low in low latitudes and large in high latitudes, so the antenna height needs to be higher in high latitudes. Moreover, in order to use it in high latitudes, it is usually necessary to adopt a dual-band method to improve communication stability and diversity, and to maintain normal communication in extreme weather and geographical environments.
[0004] However, traditional dual-band satellite antenna modules usually use a combination of two layers of antenna modules with different bands, with independent circuit board structure and antenna structure on each layer. This is not only prone to interference, but the distribution structure of the double-layer circuit board and double-layer antenna greatly increases the cost. Summary of the invention
[0005] The purpose of the present invention is to overcome the deficiencies in the prior art and to provide a satellite communication antenna device and a vehicle-mounted high-latitude satellite communication terminal that can effectively reduce communication signal interference and production costs.
[0006] The purpose of this disclosure is achieved through the following technical solutions:
[0007] A satellite communication antenna device comprises: a shell and a communication component; the communication component is arranged in the shell, the communication component comprises a communication main control circuit board, a communication top plate and a communication feeder, the communication main control circuit board and the communication top plate are arranged relative to each other to form a medium receiving space between the communication main control circuit board and the communication top plate, the communication main control circuit board is connected to the shell, the communication feeder comprises a dual-frequency communication antenna and a communication feeder post, the dual-frequency communication antenna is arranged on a side of the communication top plate away from the communication main control circuit board, the feeder end of the dual-frequency communication antenna is electrically connected to the communication feeder post, and the communication feeder post is also electrically connected to the feed transceiver end of the communication main control circuit board, wherein the dual-frequency communication antenna is used to transmit and receive dual-band communication signals.
[0008] In one embodiment, the dual-band communication antenna includes a first communication sub-antenna and a second communication sub-antenna, and the transceiver band frequency of the first communication sub-antenna is different from the transceiver band frequency of the second communication sub-antenna.
[0009] In one embodiment, the first communication sub-antenna and the second communication sub-antenna are arranged parallel to each other.
[0010] In one embodiment, the first communication sub-antenna and the second communication sub-antenna have a spiral distribution structure.
[0011] In one embodiment, the communication feed pole includes a first feed pole and a second feed pole, the first feed pole is electrically connected to the first communication sub-antenna and the first feed transceiver end of the communication main control circuit board, respectively, and the second feed pole is electrically connected to the second communication sub-antenna and the second feed transceiver end of the communication main control circuit board, respectively.
[0012] In one of the embodiments, the communication feeder also includes a communication feed PCB board, the communication feed PCB board is respectively connected to the communication main control circuit board and the communication top board, and the communication feed column is formed on the communication feed PCB board.
[0013] In one embodiment, the communication top plate has a avoidance area, and the communication component also includes a plurality of medium receiving plates, and the medium receiving plates are respectively connected to the communication main control circuit board and the communication top plate, and the avoidance area is located between the two medium receiving plates, and the avoidance area corresponds to the installation position of the communication main control circuit board.
[0014] In one of the embodiments, the opening of the avoidance area is arranged opposite to a side edge of the communication main control circuit board.
[0015] In one of the embodiments, the communication component further includes at least one medium fixing plate disposed on the communication top plate, and each of the medium fixing plates is connected to one of the medium receiving plates.
[0016] A vehicle-mounted high-latitude satellite communication terminal comprises the satellite communication antenna device described in any one of the above items.
[0017] Compared with the prior art, the present invention has at least the following advantages:
[0018] A medium is filled between the communication main control circuit board and the communication top plate to reduce signal interference between the communication main control circuit board and the dual-band communication antenna. Moreover, the communication main control circuit board integrates a dual-band communication line, and the communication top plate integrates a dual-band communication antenna, i.e., a dual-frequency communication antenna, so that the communication circuit and the communication antenna are respectively integrated on the upper and lower layers of the structure, effectively reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0020] Figure 1 is a schematic diagram of a satellite communication antenna device in one embodiment;
[0021] Figure 2 for Figure 1 A cross-sectional view of the satellite communication antenna device along the AA direction;
[0022] Figure 3 for Figure 1 The internal structure diagram of the satellite communication antenna device shown;
[0023] Figure 4 A schematic diagram of the internal structure of a satellite communication antenna device according to another embodiment;
[0024] Figure 5 is an average left-handed gain curve of a satellite communication antenna device;
[0025] Figure 6 It is a maximum left-hand gain curve diagram of a satellite communication antenna device;
[0026] Figure 7 is a graph of average axial ratios of satellite communication antenna devices;
[0027] Figure 8 is a return loss curve diagram of a satellite communication antenna device;
[0028] Fig. 9 This is a graph of the out-of-roundness of a satellite communication antenna device. DETAILED DESCRIPTION
[0029] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.
[0030] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.
[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0032] The present disclosure relates to a satellite communication antenna device. In one embodiment, the satellite communication antenna device includes a housing and a communication component; the communication component is arranged in the housing, the communication component includes a communication main control circuit board, a communication top plate and a communication feeder, the communication main control circuit board is arranged relative to the communication top plate to form a medium receiving space between the communication main control circuit board and the communication top plate, the communication main control circuit board is connected to the housing, the communication feeder includes a dual-frequency communication antenna and a communication feeder post, the dual-frequency communication antenna is arranged on a side of the communication top plate away from the communication main control circuit board, the feeder end of the dual-frequency communication antenna is electrically connected to the communication feeder post, and the communication feeder post is also electrically connected to the feed transceiver end of the communication main control circuit board, wherein the dual-frequency communication antenna is used to transmit and receive dual-band communication signals. A medium is filled between the communication main control circuit board and the communication top plate to reduce signal interference between the communication main control circuit board and the dual-band communication antenna. Moreover, the communication main control circuit board integrates a dual-band communication line, and the communication top plate integrates a dual-band communication antenna, i.e., a dual-frequency communication antenna, so that the communication circuit and the communication antenna are respectively integrated on the upper and lower layers of the structure, effectively reducing production costs.
[0033] See also Figure 1 , which is a structural diagram of a satellite communication antenna device according to an embodiment of the present disclosure.
[0034] The satellite communication antenna device 10 of one embodiment includes a housing 100. Figure 2 The satellite communication antenna device 10 further includes a communication component 200; the communication component 200 is disposed in the housing 100, please refer to Figure 3 The communication component 200 includes a communication main control circuit board 210, a communication top plate 220 and a communication feeder 230. The communication main control circuit board 210 and the communication top plate 220 are arranged relative to each other to form a medium receiving space 202 between the communication main control circuit board 210 and the communication top plate 220. The communication main control circuit board 210 is connected to the housing 100. The communication feeder 230 includes a dual-frequency communication antenna 232 and a communication feeder column 234. The dual-frequency communication antenna 232 is arranged on a side of the communication top plate 220 away from the communication main control circuit board 210. The feeding end of the dual-frequency communication antenna 232 is electrically connected to the communication feeder column 234, and the communication feeder column 234 is also electrically connected to the feeding transceiver end of the communication main control circuit board 210, wherein the dual-frequency communication antenna 232 is used to transmit and receive dual-band communication signals.
[0035] In this embodiment, a medium is filled between the communication main control circuit board 210 and the communication top plate 220 to reduce signal interference between the communication main control circuit board 210 and the dual-frequency communication antenna 232. Moreover, the communication main control circuit board 210 integrates a dual-band communication line, and the communication top plate 220 integrates a dual-band communication antenna, i.e., a dual-frequency communication antenna 232, so that the communication circuit and the communication antenna are respectively integrated on the upper and lower layers of the structure, thereby effectively reducing the production cost.
[0036] In one embodiment, see Figure 3 , the dual-frequency communication antenna 232 includes a first communication sub-antenna 2322 and a second communication sub-antenna 2324, and the transceiver band frequency of the first communication sub-antenna 2322 is different from the transceiver band frequency of the second communication sub-antenna 2324. In this embodiment, the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are both arranged on the communication top plate 220, and the first communication sub-antenna 2322 and the second communication sub-antenna 2324 communicate in different frequency bands, that is, the communication frequency band of the first communication sub-antenna 2322 is different from the communication frequency band of the second communication sub-antenna 2324, so that the satellite communication antenna device has two different communication frequency bands, so that the satellite communication antenna device communicates in multiple frequency bands, so as to improve the communication frequency band range of the satellite communication antenna device.
[0037] In another embodiment, the receiving and transmitting band frequency of the first communication sub-antenna 2322 is 1980MHz to 2010MHz. For example, the first communication sub-antenna 2322 transmits communication signals within the frequency range of 1980MHz to 2010MHz. At the same time, the receiving frequency of the second communication sub-antenna 2324 is different from the transmitting frequency band of the first communication sub-antenna 2322.
[0038] In another embodiment, the receiving and transmitting band frequency of the second communication sub-antenna 2324 is 2170MHz to 2200MHz. For example, the second communication sub-antenna 2324 receives communication signals within the frequency range of 2170MHz to 2200MHz. At the same time, the transmitting frequency of the first communication sub-antenna 2322 is different from the receiving frequency of the second communication sub-antenna 2324.
[0039] In one embodiment, see Figure 3 , the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are arranged parallel to each other. In this embodiment, the first communication sub-antenna 2322 is used as a type of communication antenna in the satellite communication antenna device, and the second communication sub-antenna 2324 is used as a type of communication antenna in the satellite communication antenna device. In the two communication antennas with different frequencies, the receiving and transmitting frequencies use adjacent communication frequencies. The first communication sub-antenna 2322 and the second communication sub-antenna 2324 are structurally adjusted. Specifically, the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are kept parallel to each other, so that the polarization modes of the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are kept the same, so that the various antenna performances of the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are kept synchronized, which facilitates the adjustment of antenna parameters of the first communication sub-antenna 2322 and the second communication sub-antenna 2324.
[0040] In one embodiment, see Figure 3, the first communication sub-antenna 2322 and the second communication sub-antenna 2324 have a spiral distribution structure. In this embodiment, the first communication sub-antenna 2322 is distributed in a spiral manner on the communication top plate 220, and the second communication sub-antenna 2324 is distributed in the same spiral structure on the communication top plate 220, and the second communication sub-antenna 2324 remains parallel to each other in the spiral direction, so that the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are spirally distributed in a parallel manner, so that the polarization mode of the first communication sub-antenna 2322 and the second communication sub-antenna 2324 is the same, specifically, the polarization mode of the first communication sub-antenna 2322 and the second communication sub-antenna 2324 is left-hand circular polarization.
[0041] In another embodiment, the first communication sub-antenna 2322 and the second communication sub-antenna 2324 have different gains for different polarization angles under left-hand circular polarization. Specifically, the polarization angle Theta of the satellite communication antenna device is within ±30 degrees, and the corresponding gain is greater than or equal to 5dBi; the polarization angle Theta of the satellite communication antenna device is within ±50 degrees, and the corresponding gain is greater than or equal to 2dBi; the polarization angle Theta of the satellite communication antenna device is within ±60 degrees, and the corresponding gain is greater than or equal to 0dBi. For details, see the attached Figure 5 Theta = 60, the average left-handed gain is close to 0.7dbi, which can meet the design index of Theta60 = 0dbi. Theta = 30, the average left-handed gain is close to 4.3dbi, and the index is Theta30 = 5dbi, which is 0.7 away, and also meets the requirements of high-latitude communication antennas. In this way, in high-latitude areas, the satellite communication antenna device is suitable for communications at high elevation angles.
[0042] In another embodiment, the MAX left-handed gain of the antenna of the satellite communication antenna device is used as a polarization gain indicator of another high-latitude communication antenna. Figure 6 Thus, when Theta = 60 degrees, the MAX left-handed gain is close to 1.8dbi; when Theta = 30 degrees, the MAX left-handed gain is close to 5.09dbi, which can also meet the left-handed gain design index of high-latitude communication antennas.
[0043] In another embodiment, the antenna of the satellite communication antenna device has a corresponding average axial ratio in the polarization pattern of left-hand circular polarization, as shown in the attached drawings for details. Figure 7 The average axial ratio is less than 1, which fully meets the axial ratio design indicators of high-latitude communication antennas.
[0044] In another embodiment, the antenna of the satellite communication antenna device has a specified S11 parameter under left-hand circular polarization, that is, has a return loss that meets the index, as shown in the attached Figure 8 In this way, the S11 of the satellite communication antenna device is -10, which meets the design index of VSWR (voltage standing wave ratio) less than 2.
[0045] In another embodiment, the antenna of the satellite communication antenna device has non-circularity indicators with different polarization angles under left-hand circular polarization, as shown in the attached drawings for details. Fig. 9 Thus, when Theta=60 degrees, the out-of-roundness of the antenna of the satellite communication antenna device is 2.7; when Theta=30 degrees, the out-of-roundness of the antenna of the satellite communication antenna device is 1.5, which meets the out-of-roundness design index of the high-latitude communication antenna.
[0046] In one of the embodiments, please also refer to Figure 2 and Figure 3 The communication feed post 234 includes a first feed post 2342 and a second feed post 2344. The first feed post 2342 is electrically connected to the first communication sub-antenna 2322 and the first feed transceiver end of the communication main control circuit board 210, respectively, and the second feed post 2344 is electrically connected to the second communication sub-antenna 2324 and the second feed transceiver end of the communication main control circuit board 210. In this embodiment, the first feed post 2342 and the second feed post 2344 are both feed conductive posts, which are used for transmitting communication signals between the communication antenna and the communication main control circuit board 210. One end of the first feeding post 2342 is connected to the feeding point of the first communication sub-antenna 2322. Specifically, one end of the first feeding post 2342 is electrically connected to the spiral starting end of the first communication sub-antenna 2322, and the other end of the first feeding post 2342 is electrically connected to the first feeding transceiver end of the communication main control circuit board 210, and the first communication sub-antenna 2322 and the communication main control circuit board 210 are communicated and transmitted through the first feeding post 2342. One end of the second feeding post 2344 is connected to the feeding point of the second communication sub-antenna 2324. Specifically, one end of the second feeding post 2344 is electrically connected to the spiral starting end of the second communication sub-antenna 2324, and the other end of the second feeding post 2344 is electrically connected to the second feeding transceiver end of the communication main control circuit board 210, and the second communication sub-antenna 2324 and the communication main control circuit board 210 are communicated and transmitted through the second feeding post 2344. Under the communication conduction of the first feeding pole 2342 and the second feeding pole 2344 , it is convenient for the communication main control circuit board 210 to process the communication signals of the first communication sub-antenna 2322 and the second communication sub-antenna 2324 .
[0047] In one embodiment, see Figure 4 , the communication feeder 230 also includes a communication feed PCB board 236, the communication feed PCB board 236 is respectively connected to the communication main control circuit board 210 and the communication top board 220, and the communication feed column 234 is formed on the communication feed PCB board 236. In this embodiment, the communication feed column 234 is located on the communication feed PCB board 236. Specifically, the communication feed column 234 is formed on the communication feed PCB board 236 in a line manner, that is, the communication feed PCB board 236 serves as a feed PCB for the communication feed column, and the communication main control circuit board 210 can also be electrically connected with the first communication sub-antenna 2322 and the second communication sub-antenna 2324 on the communication top board 220 through the line on the communication feed PCB board 236.
[0048] In one embodiment, see Figure 2 The communication component 200 also includes a communication support plate 240, which is arranged between the communication main control circuit board 210 and the communication top plate 220, and the communication support plate 240 is connected to the communication main control circuit board 210 and the communication top plate 220 respectively. In this embodiment, the communication support plate 240 serves as the bottom support of the communication top plate 220. Specifically, the height of the communication support plate 240 is 16mm to 17.5mm. The communication support plate 240 is located in the medium receiving space 202, and the communication top plate 220, the communication support plate 240 and the air in the medium receiving space 202 serve as an insulating dielectric layer between the dual-frequency communication antenna 232 and the communication main control circuit board 210, so as to form a feeding electric field of the dual-frequency communication antenna 232 and improve the polarization gain of the satellite communication antenna device.
[0049] In another embodiment, the medium containing space 202 may be filled with mediums with different dielectric constants so that the characteristic impedance of the satellite communication antenna device meets the index requirements. For example, the characteristic impedance of the satellite communication antenna device is 50Ω.
[0050] During the process of the communication main control circuit board 210 transmitting and processing the satellite communication signal, the communication main control circuit board 210 transmits the signal with the communication feeder 230 on the communication top plate 220 through the communication feeder 230. The circuit on the communication main control circuit board 210 and the welded electronic components are prone to generate electromagnetic pulses during operation. The generated pulses will cause crosstalk to the satellite communication signal on the communication feeder 230, which can easily lead to unstable communication signals and even seriously cause satellite communication interruption. Moreover, in high-latitude areas, the stability of satellite communication signals directly affects normal use.
[0051] To improve the transmission stability of satellite communication signals, please refer to Figure 2 The communication component 200 also includes a communication circuit lifting board 250 connected to the shell, the communication circuit lifting board 250 is connected to the communication main control circuit board 210, the communication circuit lifting board 250 is located on the side of the communication main control circuit board 210 away from the communication top plate 220, and the communication circuit lifting board 250 also corresponds to the component welding surface of the communication main control circuit board 210, so that the various electronic components of the communication main control circuit board 210 face the side of the communication main circuit board 210 away from the communication top plate 220.
[0052] In this embodiment, the communication circuit lifting plate 250 is located between the bottom of the housing 100 and the communication main control circuit board 210. The communication circuit lifting plate 250 supports the communication main control circuit board 210 and keeps it away from the bottom of the housing 100, so that a gap is formed between the communication main control circuit board 210 and the bottom of the housing 100. The electronic components of the communication main control circuit board 210 are oriented toward the side of the communication main control circuit board 210 away from the communication top plate 220, that is, the electronic components of the communication main control circuit board 210 are located in the gap between the communication main control circuit board 210 and the bottom of the outer shell 100, so that the electronic components of the communication main control circuit board 210 can be accommodated in the above-mentioned gap, so that the medium between the electronic components of the communication main control circuit board 210 and the communication feeder 230 is increased, so that the pulses of the electronic components on the communication main control circuit board 210 to the communication feeder 230 are weakened, which effectively reduces the communication interference to the communication feeder 230, thereby improving the transmission stability of the satellite communication signal.
[0053] Furthermore, the communication circuit pull-up board 250 is provided with a heat dissipation communication hole 204, and the outer shell 100 is provided with a wire threading hole 102. The wire threading hole 102 is arranged opposite to the heat dissipation communication hole 204. The wire threading hole 102 and the heat dissipation communication hole 204 are both used to pass through the communication line electrically connected to the communication main control circuit board 210, and the aperture of the heat dissipation communication hole 204 is larger than the aperture of the wire threading hole 102.
[0054] In this embodiment, the heat dissipation communication hole 204 is connected to the gap between the communication main control circuit board 210 and the bottom of the housing 100. The heat dissipation communication hole 204 not only passes the communication line on the communication main control circuit board 210, but also dissipates a large amount of heat on the communication main control circuit board 210. The heat dissipation communication hole 204 is larger than the threading hole 102, which is convenient for quickly dissipating more heat through the threading hole 102, and is also convenient for passing and installing the communication line.
[0055] For further information, see Figure 3 The communication top plate 220 has an avoidance area 206, and the communication component 200 also includes a plurality of medium receiving plates 260, and the medium receiving plates 260 are respectively connected to the communication main control circuit board 210 and the communication top plate 220, and the avoidance area 206 is located between the two medium receiving plates 260, and the avoidance area 206 corresponds to the installation position of the communication main control circuit board 210.
[0056] In this embodiment, the avoidance area 206 is located on the side of the communication top plate 220. The avoidance area 206 is an air avoidance area on the side of the communication top plate 220. The avoidance area 206 serves as an installation avoidance area 206 on the communication top plate 220. The fixed installation area on the communication main control circuit board 210 corresponds to the avoidance area 206. The medium receiving plate 260 lifts up the communication top plate 220 to facilitate the formation of a space for receiving the medium between the communication top plate 220 and the communication main control circuit board 210. The avoidance area 206 is located between the two medium receiving plates 260 to facilitate the injection of the medium into the medium receiving space 202 through the gap between the medium receiving plates 260, so as to further reduce the communication interference between the communication feeder 230 and the communication main control circuit board 210.
[0057] In another embodiment, a plurality of the dielectric receiving plates 260 are added to the dielectric receiving space 202, and together with the dielectric in the dielectric receiving space 202, form the dielectric between the communication main control circuit board 210 and the communication top plate 220. When the dielectric receiving space 202 is air, the material of the dielectric receiving plates 260 can be used as an additional dielectric to reduce the amount of FR-4 dielectric added to the dielectric receiving space 202. The dielectric constant of FR-4 dielectric is 4.6, and the dielectric loss is 0.025. The dielectric receiving plates and the communication support plates also serve as supplementary dielectrics, and the materials used are plastics, and the dielectric constant is 2.9, and the dielectric loss is 0.025.
[0058] In another embodiment, see Figure 4 The opening of the avoidance area 206 is arranged opposite to the side of the communication main control circuit board 210, that is, the opening of the avoidance area 206 faces the side of the communication main control circuit board 210 to adapt to different communication direction requirements.
[0059] In another embodiment, see Figure 4 The communication component 200 further includes at least one medium fixing plate 270 disposed on the communication top plate 220, and each medium fixing plate 270 is connected to one medium receiving plate 260. In this embodiment, the medium fixing plates 270 are connected to the communication top plate 220 and the medium receiving plate 260, respectively, and the medium fixing plates 270 serve as a fixing and connecting component of the medium receiving plate 260 on the communication top plate 220 to improve the installation stability of the medium receiving plate 260 on the communication top plate 220.
[0060] Further, see Figure 2 The housing 100 includes a bottom plate 110, a top cover 120 and a sealing ring 130. The top cover 120 is covered on the bottom plate 110. Specifically, the top cover 120 is screwed to the bottom plate 110. The bottom plate 110 is connected to the communication circuit lifting plate 250. The sealing ring 130 is connected to the bottom plate 110 and the top cover 120 respectively. The sealing ring 130 is arranged around the outer side of the communication circuit lifting plate 250. The sealing ring 130 also abuts against a side of the communication main control circuit board 210 away from the communication top plate 220.
[0061] In this embodiment, the bottom plate 110 and the top cover 120 are interlocked and connected to form an internal space for accommodating the communication component 200. The sealing ring 130 is located at the periphery of the communication circuit lifting plate 250. The sealing ring 130 not only blocks the gap between the bottom plate 110 and the top cover 120, but also forms a sealed space between the communication main control circuit board 210 and the bottom plate 110, which is used to seal the various electronic components on the communication main control circuit board 210 to reduce external influences. Moreover, the sealing ring 130 is located between the bottom plate 110 and the communication main control circuit board 210. The sealing ring 130 can effectively limit the electromagnetic pulse on the communication main control circuit board 210 to the bottom, further reducing the communication interference to the communication feeder 230.
[0062] In one embodiment, the present disclosure also provides a vehicle-mounted high-latitude satellite communication terminal, including the satellite communication antenna device described in any one of the above items. In this embodiment, the satellite communication antenna device includes a housing and a communication component; the communication component is arranged in the housing, the communication component includes a communication main control circuit board, a communication top plate and a communication feeder, the communication main control circuit board and the communication top plate are arranged relative to each other to form a medium receiving space between the communication main control circuit board and the communication top plate, the communication main control circuit board is connected to the housing, the communication feeder includes a dual-frequency communication antenna and a communication feeder column, the dual-frequency communication antenna is arranged on the side of the communication top plate away from the communication main control circuit board, the feeder end of the dual-frequency communication antenna is electrically connected to the communication feeder column, and the communication feeder column is also electrically connected to the feed transceiver end of the communication main control circuit board, wherein the dual-frequency communication antenna is used to transmit and receive dual-band communication signals. A medium is filled between the communication main control circuit board and the communication top plate to reduce signal interference between the communication main control circuit board and the dual-band communication antenna. Moreover, the communication main control circuit board integrates a dual-band communication line, and the communication top plate integrates a dual-band communication antenna, i.e., a dual-frequency communication antenna, so that the communication circuit and the communication antenna are respectively integrated on the upper and lower layers of the structure, effectively reducing production costs.
[0063] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be subject to the attached claims.
Claims
1. A satellite communication antenna device, characterized in that: include: shell, A communication component, wherein the communication component is arranged in the shell, the communication component includes a communication main control circuit board, a communication top plate and a communication feeder, the communication main control circuit board and the communication top plate are arranged relative to each other to form a medium receiving space between the communication main control circuit board and the communication top plate, the communication main control circuit board is connected to the shell, the communication feeder includes a dual-frequency communication antenna and a communication feeder post, the dual-frequency communication antenna is arranged on a side of the communication top plate away from the communication main control circuit board, the feeder end of the dual-frequency communication antenna is electrically connected to the communication feeder post, and the communication feeder post is also electrically connected to the feed transceiver end of the communication main control circuit board, wherein the dual-frequency communication antenna is used to transmit and receive dual-band communication signals.
2. The satellite communication antenna device according to claim 1, characterized in that: The dual-frequency communication antenna includes a first communication sub-antenna and a second communication sub-antenna, and the transceiver band frequency of the first communication sub-antenna is different from the transceiver band frequency of the second communication sub-antenna.
3. The satellite communication antenna device according to claim 2, characterized in that: The first communication sub-antenna and the second communication sub-antenna are arranged parallel to each other.
4. The satellite communication antenna device according to claim 2, characterized in that: The first communication sub-antenna and the second communication sub-antenna have a spiral distribution structure.
5. The satellite communication antenna device according to claim 2, characterized in that: The communication feed post includes a first feed post and a second feed post, the first feed post is electrically connected to the first communication sub-antenna and the first feed transceiver end of the communication main control circuit board, and the second feed post is electrically connected to the second communication sub-antenna and the second feed transceiver end of the communication main control circuit board.
6. The satellite communication antenna device according to claim 1, characterized in that: The communication feeder also includes a communication feed PCB board, which is connected to the communication main control circuit board and the communication top board respectively, and the communication feed column is formed on the communication feed PCB board.
7. The satellite communication antenna device according to claim 1, characterized in that: The communication top plate has an avoidance area, and the communication component also includes multiple medium receiving plates, which are respectively connected to the communication main control circuit board and the communication top plate. The avoidance area is located between two of the medium receiving plates, and the avoidance area corresponds to the installation position of the communication main control circuit board.
8. The satellite communication antenna device according to claim 7, characterized in that: The opening of the avoidance area is arranged opposite to the side of the communication main control circuit board.
9. The satellite communication antenna device according to claim 7, characterized in that: The communication component also includes at least one medium fixing plate arranged on the communication top plate, and each of the medium fixing plates is connected to one of the medium receiving plates.
10. A vehicle-mounted high-latitude satellite communication terminal, characterized in that: Comprising the satellite communication antenna device according to any one of claims 1 to 9.