Housing, electronic device including the same, and method for manufacturing the housing

Abstract

A housing may be provided. The case may include: a metal member including a metal material and an oxide film in which voids are formed; the dye is arranged in the gap; the ultraviolet blocking agent comprises an ultraviolet blocking material and is arranged in the gap; and a sealing layer over the oxide film and covering the void. The void may include a first region underlying the sealing layer and a second region underlying the first region. The ratio of the ultraviolet blocking agent to the dye in the first region may be greater than the ratio of the ultraviolet blocking agent to the dye in the second region.

Description

Technical Field

[0001] The present disclosure relates to a housing, an electronic device including the housing, and a method for manufacturing the housing. Background Art

[0002] With the development of information and communication technology and semiconductor technology, various functions are being integrated into a portable electronic device. For example, the electronic device can realize not only communication functions but also entertainment functions such as playing games, multimedia functions such as playing music and videos, communication and security functions of mobile banking, and schedule and electronic wallet functions. These electronic devices have been reduced in size to facilitate users to carry.

[0003] As the recent trend emphasizes making portable electronic devices small, slim, and portable, research efforts are being made to give electronic devices a more beautiful appearance. Summary of the invention

[0004] Solutions to the problem

[0005] According to an exemplary embodiment of the present disclosure, a housing may include: a metal member including a metal material and an oxide film having a void; a dye disposed in the void; an ultraviolet (UV) blocker including a UV blocking material and disposed in the void; and a sealing layer disposed on the oxide film. The void may include a first region located below the sealing layer and a second region located below the first region. The ratio of the UV blocker to the dye in the first region may be greater than the ratio of the UV blocker to the dye in the second region.

[0006] According to an exemplary embodiment of the present disclosure, an electronic device may include a housing and a processor located in the housing. The housing may include: a metal member including a metal material and including an oxide film having a void; a dye disposed in the void; and an ultraviolet (UV) blocker including a UV blocking material and disposed in the void. The void may include a first region adjacent to a surface of the housing and a second region located below the first region. The ratio of the UV blocker to the dye in the first region may be greater than the ratio of the UV blocker to the dye in the second region.

[0007] According to an example embodiment of the present disclosure, a method for manufacturing a shell may include: preparing a metal component including a metal material and having an oxide film; applying a dye to the oxide film; applying an ultraviolet (UV) blocker to the oxide film, the UV blocker including an ultraviolet (UV) blocking material having a concentration in a range of 1 ng / ml to 500 ng / ml; and forming a sealing layer on the oxide film. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and other aspects, features and advantages of certain embodiments of the present disclosure will be more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0009] Figure 1 is a block diagram illustrating example electronic devices in a network environment according to various embodiments.

[0010] Figure 2 is a front perspective view showing an electronic device according to various embodiments.

[0011] Figure 3 is a rear perspective view showing an electronic device according to various embodiments.

[0012] Figure 4 is an exploded perspective view illustrating an electronic device according to various embodiments.

[0013] Figure 5 is an enlarged perspective view showing a portion of a housing according to various embodiments.

[0014] Figure 6 is a diagram showing an example structure of a housing according to various embodiments.

[0015] Figure 7 is a diagram showing an example structure of a housing according to various embodiments.

[0016] Figure 8 is a graph showing changes in the concentration of a UV blocker depending on a location according to various embodiments.

[0017] Figure 9a and Figure 9b is a diagram showing results of UV verification of a housing according to various embodiments.

[0018] Fig.10 is a flow chart illustrating an example method for manufacturing a housing according to various embodiments. Specific embodiments

[0019] Figure 1 is a block diagram illustrating example electronic devices in a network environment according to various embodiments.

[0020] refer to Figure 1, the electronic device 101 in the network environment 100 may communicate with at least one of the electronic devices 102 via a first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In an embodiment, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. According to an embodiment, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (eg, display module 160).

[0021] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the result data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be dedicated to a designated function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0022] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0023] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0024] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0025] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0026] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0027] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the strength of a force generated by a touch.

[0028] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0029] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0030] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0031] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0033] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0034] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0035] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network (LAN) or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify or authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0037] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0038] The antenna module 197 may send a signal or power to the outside (e.g., an external electronic device) or receive a signal or power from the outside (e.g., an external electronic device). According to an embodiment, the antenna module may include an antenna including a radiator formed by a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190. Subsequently, a signal or power may be sent or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other components (e.g., a radio frequency integrated circuit (RFIC)) other than the radiator may be further formed as a part of the antenna module 197.

[0039] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0040] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0041] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. The external electronic device 102 or the electronic device 104 may be a device of the same or different type as the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request when the result is further processed or when the result is not further processed. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In an embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0042] The electronic device according to various embodiments of the present disclosure may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, a household appliance, etc. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0043] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include all possible combinations of items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being "coupled with another element (e.g., a second element)", "coupled to another element (e.g., the second element)", "connected with another element (e.g., the second element)" or "connected to another element (e.g., the second element)" when the terms "operably" or "communicatively" are used or when the terms "operably" or "communicatively" are not used, the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0044] As used herein, the term "module" may include a unit implemented in hardware, software, or firmware, or any combination thereof, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or part of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0045] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities. Some entities in the multiple entities may be arranged in different components detachably. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as the corresponding one component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0046] Figure 2 is a front perspective view showing an electronic device according to various embodiments. Figure 3 is a rear perspective view showing an electronic device according to various embodiments.

[0047] Reference Figure 2 and Figure 3 According to one embodiment, the electronic device 200 may include a housing 210 having a front surface 210A, a rear surface 210B, and a side surface 210C surrounding a space between the front surface 210A and the rear surface 210B. According to one embodiment (not shown), the housing 210 may be, for example, formed Figure 2 The structure of the portion of the front surface 210A, the rear surface 210B and the side surface 210C. For example, the housing 210 may include a front plate 202 and a rear plate 211. According to one embodiment, at least a portion of the front surface 210A may have a substantially transparent front plate 202 (e.g., a glass plate or a polymer plate including various coatings). The rear surface 210B may be formed by a rear plate 211. The rear plate 211 may be formed by, for example, glass, ceramic, polymer, metal (e.g., titanium (Ti), stainless steel (STS), aluminum (Al) or magnesium (Mg)) or a combination of at least two thereof. The side surface 210C may be formed by a side frame structure (or "side member") 218, which is coupled to the front plate 202 and the rear plate 211 and includes metal and / or polymer. According to one embodiment, the rear plate 211 and the side frame plate 218 may be formed integrally together and include the same material (e.g., glass, metal (such as aluminum) or ceramic). According to an embodiment, the front surface 210A and / or the front plate 202 may be interpreted as a part of the display 220 .

[0048] According to an embodiment, the electronic device 200 may include a display 220, audio modules 203, 207, and 214 (eg, Figure 1 audio module 170), sensor module (e.g., Figure 1 sensor module 176), camera modules 205 and 206 (e.g., Figure 1 camera module 180), key input device 217 (eg, Figure 1 input module 150) and connector holes 208 and 209 (e.g., Figure 1 According to one embodiment, the electronic device 200 may exclude at least one of the above components (e.g., the connector hole 209) or may add other components. According to one embodiment, the display 220 may be visually exposed through, for example, a majority of the front panel 202.

[0049] According to an embodiment, the surface of the housing 210 (or the front plate 202) may include a screen display area formed when the display 220 is visually exposed (eg, visible). For example, the screen display area may include the front surface 210A.

[0050] According to an embodiment, the electronic device 200 may include a recess or an opening formed in a portion of the screen display area (e.g., the front surface 210A) of the display 220, and may include at least one or more of the audio module 214, the sensor module (not shown), the light emitting device (not shown), and the camera module 205 aligned with the recess or the opening. According to an embodiment (not shown), at least one or more of the audio module 214, the sensor module (not shown), the camera module 205, the fingerprint sensor (not shown), and the light emitting device (not shown) may be included on the rear surface of the screen display area of ​​the display 220.

[0051] According to an embodiment, the display 220 may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field type stylus.

[0052] According to an embodiment, the audio modules 203, 207, and 214 may include, for example, a microphone hole 203 and speaker holes 207 and 214. A microphone for acquiring external sound may be provided in the microphone hole 203. In an embodiment, a plurality of microphones may be provided to detect the direction of the sound. The speaker holes 207 and 214 may include an external speaker hole 207 and a telephone handset hole 214. According to an embodiment, the speaker holes 207 and 214 and the microphone hole 203 may be implemented as a single hole, or may include a speaker without including the speaker holes 207 and 214 (e.g., a piezoelectric speaker).

[0053] According to an embodiment, the sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 200. The sensor module (not shown) may include, for example, a first sensor module (not shown) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the front surface 210A of the housing 210. The sensor module (not shown) may include a third sensor module (not shown) (e.g., an HRM sensor) and / or a fourth sensor module (not shown) (e.g., a fingerprint sensor) disposed on the rear surface 210B of the housing 210. In an embodiment (not shown), the fingerprint sensor may be disposed on the rear surface 210B of the housing 210 and on the front surface 210A (e.g., the display 220) of the housing 210. The electronic device 200 may further include a sensor module not shown, such as at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor (not shown).

[0054] According to an embodiment, the camera modules 205 and 206 may include a front camera module 205 disposed on a first surface 210A of the electronic device 200 and a rear camera module 206 disposed on a rear surface 210B and / or a flash 204. The camera modules 205 and 206 may include one or more lenses, an image sensor and / or an image signal processor. The flash 204 may include, for example, a light emitting diode (LED) or a xenon lamp. In an embodiment, two or more lenses (an infrared (IR) camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 200.

[0055] According to one embodiment, the key input device 217 may be disposed on the side surface 210C of the housing 210. According to one embodiment, the electronic device 200 may exclude all or some of the key input devices 217, and the excluded key input devices 217 may be implemented in other forms (e.g., as soft keys) on the display 220. According to one embodiment, at least a portion of the key input device 217 may be disposed on the side frame structure 218.

[0056] According to an embodiment, a light emitting device may be provided, for example, on the front surface 210A of the housing 210. The light emitting device (not shown) may provide, for example, information about the state of the electronic device 200 in the form of light. According to an embodiment, the light emitting device (not shown) may provide a light source that interacts with, for example, the front camera module 205. The light emitting device (not shown) may include, for example, a light emitting diode (LED), an infrared (IR) LED, and / or a xenon lamp.

[0057] According to an embodiment, the connector holes 208 and 209 may include a first connector hole 208 for receiving a connector (e.g., a headphone jack) for transmitting / receiving an audio signal to / from an external electronic device or a connector (e.g., a USB connector) for transmitting / receiving power and / or data to / from an external electronic device, and / or a second connector hole 209 for receiving a storage device (e.g., a subscriber identity module (SIM) card). According to an embodiment, the first connector hole 208 and / or the second connector hole 209 may be omitted.

[0058] Figure 4 is an exploded perspective view illustrating an electronic device according to various embodiments.

[0059] Reference Figure 4 , the electronic device 200 (eg, Figure 2 and Figure 3 The electronic device 200 may include a front panel 222 (eg, Figure 2 202), a display 220 (e.g., Figure 2 , a display 220), a bracket 232 (e.g., a front support member), a printed circuit board 240, a battery 250, a rear case 260 (e.g., a rear support member), an antenna 270, and a rear plate 280 (e.g., Figure 3 According to an embodiment, the electronic device 200 may omit at least one of the above components (eg, the rear housing 260) or may add other components. At least one of the above components of the electronic device 200 may be connected to the rear housing 211. Figure 2 or Figure 3 At least one of the components of the electronic device 200 is the same or similar, and a repeated description will not be given below.

[0060] According to one embodiment, the bracket 232 may be disposed inside the electronic device 200 to be connected to the side frame structure 231 or to be integrated with the side frame structure 231. The bracket 232 may be formed of, for example, metal and / or non-metallic materials (e.g., polymers). The bracket 232 may receive the display 220 on one surface and the printed circuit board 240 on another surface. The processor (e.g., Figure 1 processor 120), memory (e.g., Figure 1 Memory 130) and / or interfaces (e.g., Figure 1 The interface 177) can be mounted on the printed circuit board 240.

[0061] According to an embodiment, the battery 250 may be a device for supplying power to at least one component (e.g., the camera module 212) of the electronic device 200. The battery 250 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 250 may be disposed on substantially the same plane as the printed circuit board 240. The battery 250 may be integrally or detachably disposed inside the electronic device 200.

[0062] According to an embodiment, the rear case 260 may be disposed between the printed circuit board 240 and the antenna 270. For example, the rear case 260 may include one surface to which at least one of the printed circuit board 240 and the battery 250 is coupled and another surface to which the antenna 270 is coupled.

[0063] According to one embodiment, the antenna 270 may be disposed between the back plate 280 and the battery 250. The antenna 270 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 270 may communicate with, for example, an external device over a short distance, or may wirelessly transmit or receive power required for charging. For example, the antenna 270 may include a coil for wireless charging. According to one embodiment, the antenna structure may be formed by a portion or combination of the side frame structure 231 and / or the bracket 232.

[0064] According to an embodiment, the electronic device 200 may include a second housing (eg, Figure 2 According to one embodiment, the camera module 212 may be disposed on the bracket 232 and may be a rear camera module (e.g., Figure 3 According to an embodiment, at least a portion of the camera module 212 may be exposed to the outside of the electronic device 200 through an opening 282 formed in the rear plate 280.

[0065] Figures 2 to 4 The electronic device 200 disclosed in the embodiment has a bar-type or plate-type appearance, but the present disclosure is not limited thereto. For example, the electronic device shown may be a rollable electronic device or a foldable electronic device. A “rollable electronic device” may refer to, for example, a display (e.g., Figure 4 When the display 220 is bent and deformed, at least a portion thereof may be rolled or curled or received in a housing (e.g., Figure 2 When the display is unfolded outward or visible in a larger area according to the needs of the user, the rollable electronic device can use the expanded second display area.

[0066] Figure 5is an enlarged perspective view showing a portion of a housing according to various embodiments. Figure 6 is a diagram showing an example structure of a housing according to various embodiments. Figure 7 is a diagram showing an example structure of a housing according to various embodiments.

[0067] Reference Figure 5 , Figure 6 and / or Figure 7 , the housing 300 may include a metal member 310 , a dye 320 , a UV blocker 330 and / or a sealing layer 340 .

[0068] According to one embodiment, the housing 300 may form an electronic device (eg, Figure 2 At least a portion of the appearance of the electronic device 200). For example, Figure 5 , Figure 6 and / or Figure 7 The housing 300 may be Figure 2 The housing 210, Figure 3 The rear plate 211 and / or Figure 4 The configuration of the side frame structure 231 is completely or partially the same.

[0069] According to an embodiment, the housing 300 may include a metal member 310. The metal member 310 may be a material (e.g., a metal material) on which an oxide film 311 may be formed by an anodizing process. For example, the metal member 310 may include at least one of aluminum, magnesium, or titanium. The metal member 310 may not include steel or stainless steel. According to an embodiment, the shape of the housing 300 and / or the metal member 310 may be formed by a cutting process and / or a polishing process.

[0070] According to an embodiment, the metal component 310 may include an oxide film 311. The oxide film 311 may refer to a portion of the metal component 310 that is oxidized in the metal component 310. According to an embodiment, the oxide film 311 may be formed by an anodizing process. Through the anodizing process, the thickness of the oxidized portion of the metal component 310 may be increased. The oxide film 311 may enhance the wear resistance, corrosion resistance, and / or aesthetics of the metal component 310.

[0071] According to an embodiment, the oxide film 311 may include a void 313. For example, the oxide film 311 may have a porous surface. The void 313 may refer to a plurality of holes or a plurality of depressions formed in the oxide film 311. According to an embodiment, the void 313 may be a depression formed in the oxide layer 311 in a substantially cylindrical shape. The shape of the void 313 is only a non-limiting example. For example, the void 313 may have various shapes other than a cylindrical shape (e.g., a rectangular column, etc.).

[0072] According to an embodiment, the dye 320 and the UV blocker 330 may be deposited on the oxide film 311 of the metal member 310. For example, the void 313 may accommodate the dye 320 and the UV blocker 330. The particles of the dye 320 and the particles of the UV blocker 330 may be positioned in the void 313 of the oxide film 311. For example, the void 313 may have a + (e.g., positive) charge relatively, and the particles may have a - (e.g., negative) charge. The void 313 may attract particles having a - (e.g., negative) polarity.

[0073] According to an embodiment, the housing 300 may include a dye 320. The dye 320 may impart a color to the housing 300 and / or the electronic device (e.g., Figure 2 For example, the color of the housing 300 may be realized by reflecting light of a predetermined (eg, specified) wavelength band from the housing 300. The dye 320 may reflect light of a specified wavelength according to its type. The color of the housing 300 may be realized by the dye 320.

[0074] According to an embodiment, dye 320 may include natural dyes. For example, dye 320 may be a pigment obtained from a plant, an animal or a mineral. For example, dye 320 of the present disclosure may be a dye natural material extracted by salt ash extraction, hydrothermal extraction, raw juice extraction and / or alkali extraction. According to an embodiment, using natural dyes may reduce harm to the body and environmental pollution. Natural dyes may provide a different aesthetic feeling from synthetic dyes by including auxiliary ingredients.

[0075] According to an embodiment, dye 320 may be deposited on metal member 310. For example, dye 320 may be positioned within void 313 of oxide film 311. According to an embodiment, dye 320 may be covered by sealing layer 340. Since dye 320 is protected by sealing layer 340, discoloration of dye 320 may be reduced.

[0076] According to one embodiment, the housing 300 may include a UV barrier 330. The UV barrier 330 may reduce the color change of the housing 300. According to one embodiment, the molecular structure of the dye 320 may be changed by light (e.g., ultraviolet light) L. When the molecular structure of the dye 320 changes, the wavelength of light reflected by the dye 320 and / or the wavelength of light absorbed by the dye 320 changes, and the color of the housing 300 may change. For example, photochromism may occur. The UV barrier 330 may reduce the change in the molecular structure of the dye 320. According to one embodiment, natural dyes may have unstable characteristics compared to synthetic dyes. For example, natural dyes may easily change color due to ultraviolet light. The UV barrier 330 may reduce the color change of natural dyes.

[0077] According to an embodiment, the UV blocker 330 may include a physical UV blocker. For example, the UV blocker 330 may reflect at least a portion of the light (e.g., ultraviolet light) L. According to an embodiment, the UV blocker 330 may be a metal-based compound. For example, the UV blocker 330 may include at least one of zirconium (Zr), zinc (Zn), titanium (Ti), boron (B), or phosphorus (P). According to an embodiment, the UV blocker 330 may include at least one of zirconium dioxide, zinc oxide, or titanium dioxide.

[0078] According to an embodiment, the UV blocker 330 may include a chemical UV blocker. For example, the UV blocker 330 may convert at least a portion of the light (e.g., ultraviolet light) L into heat energy. According to an embodiment, the UV blocker 330 may include at least one of oxybenzone, ethylhexyl methoxycinnamate, octyl methoxycinnamate, avobenzone, octyl methoxycinnamate, or octocrylene.

[0079] According to an embodiment, the UV blocker 330 may be deposited on the metal member 310. For example, the UV blocker 330 may be positioned within the void 313 of the oxide film 311. According to an embodiment, the UV blocker 330 may be covered by the sealing layer 340. Since the UV blocker 330 is protected by the sealing layer 340, damage or delamination of the UV blocker 330 may be reduced.

[0080] According to an embodiment, the housing 300 may include a sealing layer 340. The sealing layer 340 may seal the dye 320 and / or the UV blocker 330. For example, the sealing layer 340 may be positioned on the oxide film 311 (in the +Z direction). According to an embodiment, the sealing layer 340 may include an extended surface 340c extended from the oxide film 311. The extended surface 340c may close at least a portion of the void 313.

[0081] According to an embodiment, the sealing layer 340 may form at least a portion of a surface of the housing 300. For example, the sealing layer 340 may include a rear surface 340b positioned on the first surface 311a of the oxide film and a surface 340a opposite to the rear surface 340b and forming at least a portion of the exterior of the housing 300.

[0082] According to an embodiment, the sealing layer 340 may refer to a portion of the metal member 310. For example, the sealing layer 340 is formed by a sealing process and may be a portion of the metal member 310 that closes the void 313. The sealing layer 340 may cover at least a portion of the void 313. According to an embodiment, the sealing layer 340 may be a portion of the metal member 310 that is formed by extending from at least a portion of the first surface 311a of the oxide film 311. According to an embodiment, the oxygen concentration of the sealing layer 340 may be greater than the oxygen concentration of the metal member 310.

[0083] According to an embodiment, the sealing layer 340 may be formed on the housing 300 based on a hydration sealing process, a metal salt sealing process, an organic sealing process, and / or a sealing process using spraying.

[0084] According to an embodiment, the dye 320 and the UV blocker 330 may be positioned within the void 313. According to an embodiment, the UV blocker 330 may be mixed with the dye 320 and positioned in the void 313. For example, the dye 320 and the UV blocker 330 may be mixed and positioned in the void 313.

[0085] According to one embodiment, the void 313 may include a first region 3131 and a second region 3132. The first region 3131 may be a portion of the void 313 adjacent to the surface of the housing 300. For example, the first region 3131 may be positioned below the sealing layer 340 (in the -Z direction). The first region 3131 may be covered by the sealing layer 340. The second region 3132 may be positioned below the first region 3131. The second region 3132 may be an empty space extending from the first region 3131. For example, the first region 3131 and the second region 3132 may be a single connected empty space.

[0086] According to an embodiment, the ratio of dye 320 and UV blocker 330 may be different depending on the position of void 313. When a material including particles is deposited in void 313 of oxide film 311, the position of the material may be changed depending on the size of the particles. For example, as the particle size of the material deposited in void 313 increases, it may be deposited near the surface of oxide film 311 and / or near oxide film 311.

[0087] According to an embodiment, in order to make the UV blocker 330 reflect ultraviolet rays, the particle size of the UV blocker 330 may be larger than the particle size of the dye 320. The ratio of the UV blocker 330 to the dye 320 may increase as approaching the gap 313 and / or the outside of the housing 300. For example, the ratio of the UV blocker 330 to the dye 320 in the first region 3131 may be higher than the ratio of the UV blocker 330 to the dye 320 in the second region 3132.

[0088] According to an embodiment, the dye 320 may be substantially uniformly distributed in the void 313. The UV blocker 330 may be non-uniformly distributed in the void 313. For example, the concentration of the UV blocker 330 increases as approaching the front surface 311a of the oxide film 311, and the concentration may decrease as approaching the lower surface 313a of the void 313.

[0089] Figure 8is a graph showing the concentration of a UV blocker depending on a location according to various embodiments.

[0090] Reference Figure 8 The concentration of the UV blocking component in the UV blocking material 330 may be based on the surface of the housing 300 (eg, Figure 8 The depth of the front surface 311a of the oxide film 311 and / or the surface 340a of the sealing layer 340 varies.

[0091] Figure 8 The concentration of the UV blocker 330 in may be the concentration of the UV blocking component (eg, zirconium, zinc, titanium, boron, and / or phosphorus) of the UV blocker 330 as determined by cross-sectional scanning electron microscopy (SEM) / energy dispersive spectroscopy (EDS) analysis.

[0092] According to one embodiment, for example, Figure 8 In the graph of FIG. 1 , the concentration of the UV blocking component of the UV blocking material 330 may be the concentration of zirconium (Zr) detected in the housing 300, which includes 330 ng / ml of zirconium dioxide (ZrO 2 ). For the UV blocker 330, in a region from the surface of the housing 300 (e.g., the front surface 311a of the oxide film 311 or the surface 340a of the sealing layer 340) to a depth of about 1 μm, a concentration of 100 counts per second (cps) or more can be detected as the concentration of the UV blocking component. The concentration of the UV blocking component of 100 cps or more in the region from the surface of the housing 300 (e.g., the front surface 311a of the oxide film 311 or the surface 340a of the sealing layer 340) to a depth of about 1 μm can be referred to as the UV blocking component of the UV blocker 330 being detected as having a concentration of 100 cps or more in the region.

[0093] In one embodiment, the concentration of the UV blocking component of the UV blocker 330 in a region from a surface of the housing 300 (e.g., the front surface 311a of the oxide film 311 or the surface 340a of the sealing layer 340) to a specified depth (e.g., 0.3 μm) may be determined to be 100 counts per second (cps) or higher.

[0094] Since the UV blocker 330 has a concentration of 100 cps or more within the above range, discoloration of the dye 320 may be reduced.

[0095] According to an embodiment, a portion of the housing 300 from a surface of the housing 300 (eg, the front surface 311a of the oxide film 311 or the surface 340a of the sealing layer 340) to a depth of about 1 μm may be Figure 7For example, the first region 3131 may be a region from the entrance of the void 313 toward the surface of the housing 300 to a depth of 1 μm. According to an embodiment, the first length d1 of the first region 3131 may be about 1 μm. The UV blocker 330 may have a concentration of 100 cps or more in the first region 3131. The entrance of the void 313 may be the front surface 311a of the oxide film or the extended surface 340c of the sealing layer 340.

[0096] Figure 8 The graph in which the UV blocker 330 is zirconium dioxide is shown, but the type of the UV blocker 330 is not limited thereto. For example, in one embodiment, the UV blocker 330 may be zinc oxide (ZnO), and the concentration of zinc (Zn) may be 100 cps or more in a region from the surface of the housing 300 (e.g., the front surface 311a of the oxide film 311 or the surface 340a of the sealing layer 340) to a depth of about 1 μm. For example, in one embodiment, the UV blocker 330 may be titanium dioxide (TiO 2 ), and in a region from a surface of the housing 300 (eg, the front surface 311a of the oxide film 311 or the surface 340a of the sealing layer 340) to a depth of 1 μm, the concentration of titanium (Ti) may be 100 cps or more.

[0097] In one embodiment, the UV blocker 330 may be a boron (B)-based compound. In a region from the surface of the housing 300 (eg, the front surface 311a of the oxide film 311 or the surface 340a of the sealing layer 340) to a depth of 1 μm, the concentration of boron (B) may be 100 cps or more.

[0098] In one embodiment, the UV blocker 330 may be a phosphorus (P)-based compound. In a region from the surface of the housing 300 (eg, the front surface 311a of the oxide film 311 or the surface 340a of the sealing layer 340) to a depth of 1 μm, the concentration of phosphorus (P) may be 100 cps or more.

[0099] In one embodiment, the UV blocker 330 may be a chemical UV blocker, and in a region from the surface of the housing 300 (e.g., the front surface 311a of the oxide film 311 or the surface 340a of the sealing layer 340) to a depth of about 1 μm, the concentration of the component for blocking ultraviolet rays among the components of the chemical UV blocker may be 100 cps.

[0100] Figure 8 The graph can be used to describe Figure 6 and / or Figure 7 A graph showing the concentration of the UV barrier 330 of the housing 300 .

[0101] Figure 9a and Figure 9b is a diagram showing UV verification results of a housing according to various embodiments.

[0102] According to one embodiment, the housing (e.g. Figure 5 The degree of discoloration of the housing 300) can be determined based on whether there is a UV blocker 330. For example, Figure 9a The UV verification result of the housing 300 not including the UV barrier 330 according to an embodiment of the present disclosure is shown. Figure 9b FIG. 4 shows the UV verification result of the housing 300 including the UV barrier 330 according to an embodiment of the present disclosure. Figure 9a and Figure 9b In the present invention, the UV verification result may be a result obtained by receiving UV light having a wavelength of about 340 nm from a UV lamp under specified experimental conditions (eg, 50 degrees and 40 hours).

[0103] The degree of discoloration can be determined by the CIE chromaticity formula. The CIE chromaticity formula is a formula defined to approximate the color discrimination area of ​​the human eye on the CIE LAB color space. For example, the CIE chromaticity formula may be the CIEDE2000 formula. The chromaticity value ΔE may be determined based on the correction of the brightness difference, the saturation difference, and the color difference using weighting factors and / or parameter factors. According to an embodiment, the chromaticity value ΔE may refer to, for example, the difference between the color before irradiation with UV light and the color after irradiation with UV light.

[0104] Reference Figure 9a and Figure 9b , the degree of discoloration of the housing 300 including the dye 320 and the UV blocker 330 may be less than the degree of discoloration of the housing 300 including the dye 320 but not including the UV blocker 330. For example, referring to Figure 9a , the chromaticity value ΔE of the shell using the red dye may be about 5.0, and the chromaticity value ΔE of the shell using the blue dye may be about 3.9. When the chromaticity value ΔE is less than about 5.0, the user can recognize the color change. Figure 9b , the chromaticity value ΔE of the shell using the red dye may be less than 1.0, and the chromaticity value ΔE of the shell using the blue dye may be less than 1.0. When the chromaticity value ΔE is less than 1.0, the user may perceive the color change as blurry. For example, the lower the chromaticity value ΔE, the more difficult it is for the user to recognize the color change.

[0105] Fig.10 is a flow chart illustrating an example method for manufacturing a housing according to various embodiments.

[0106] Reference Fig.10, the method for manufacturing the shell may include a process 1010 of forming a metal component, a process 1020 of decontaminating the metal component, an anodizing process 1030 of forming an oxide film on the metal component, a process 1040 of applying a dye to the oxide film, a process 1050 of applying a UV blocker to the oxide film, and / or a process 1060 of forming a sealing layer on the metal component.

[0107] Fig.10 The method for manufacturing a housing may be for manufacturing a combination Figure 5 , Figure 6 and Figure 7 For example, the process of the housing 300 described above is combined with Fig.10 The metal components, oxide films, dyes, UV barriers and sealants described can be used with Figure 6 and / or Figure 7 The configurations of the metal member 310, the oxide film 311, the dye 320, the UV blocker 330, and the sealing layer 340 are entirely or partially the same.

[0108] According to an embodiment, the process 1010 of forming a metal component may be a process of forming a metal (e.g., aluminum, magnesium, and / or titanium). For example, the process of forming a metal component may include pressing, casting, and / or cutting processes. The process of forming a metal component may include polishing and / or forming a surface curvature.

[0109] According to one embodiment, the process 1020 for decontaminating a metal component may be a process for surface treatment of a metal component. According to one embodiment, the process 1020 for decontaminating a metal component may remove foreign matter generated by the process 1010 for forming a metal component (e.g., a cutting fluid used in a machining process and / or a polishing agent used in a polishing process). According to one embodiment, the process 1020 for decontaminating a metal component may remove an oxide film of a metal component oxidized in the air. For example, the process 1020 for decontaminating a metal component may remove an oxide film on a metal component and / or foreign matter attached to a metal component by an organic solvent method, a surfactant method, or an acidic decontamination method. The organic solvent method may be a surface treatment method using benzene and ethylene. The surfactant method may be a surface treatment method using a neutral detergent and / or a synthetic detergent. The acidic decontamination method may be a surface treatment method using sulfuric acid and / or nitric acid.

[0110] According to one embodiment, the anodizing process 1030 for forming an oxide film on a metal component is a process of immersing the metal component in an electrolyte solvent and then applying an electric current to form an oxide film on the surface of the metal component. In one embodiment, the electrolyte solvent may include at least one of sulfuric acid, hydroxy acid, oxalic acid, or chromic acid. The voltage for applying the current may be about 5V to 100V. The process time of the anodizing process 1030 may be about 10 minutes to 3 hours. The process temperature of the anodizing process 1030 may be about 0°C to about 50°C. According to one embodiment, the oxide film (e.g., Figure 6 The oxide film 311 may include at least one void (eg, Figure 6 gap 313).

[0111] According to an embodiment, the process 1010 of forming the metal member, the process 1020 of decontaminating the metal member, and / or the anodizing process 1030 of forming an oxide film on the metal member may be referred to as a process of preparing a metal member having an oxide film. In an embodiment, at least some of the processes of preparing the metal member may be performed together with the process 1040 of applying a dye to the oxide film, the process 1050 of applying a UV blocker to the oxide film, and the process 1060 of forming a sealing layer on the metal member. In an embodiment, the entity performing the process of preparing the metal member may be different from the entity performing the process 1040 of applying a dye to the oxide film, the process 1050 of applying a UV blocker to the oxide film, and the process 1060 of forming a sealing layer on the oxide film.

[0112] According to an embodiment, the process 1040 of applying a dye to the oxide film may be referred to as a coloring process. For example, the process 1040 of applying a dye to the oxide film may be a process of applying a dye (eg, a natural dye) to a void (eg, Figure 6 The process of the gap 313).

[0113] In one embodiment, the process 1040 of applying a dye to the oxide film may use an immersion method to achieve the color of the oxide film. For example, the process 1040 of applying a dye to the oxide film may prepare a dye dissolved in a solution, immerse a metal member formed with an oxide film in the solution, and use the diffused and adsorbed dye to achieve the color of the oxide film.

[0114] According to an embodiment, the process 1050 of applying a UV blocker to the oxide film may be to apply a UV blocker (eg, Figure 6 A process in which a UV blocker 330) is applied to the gaps formed in the oxide film.

[0115] According to an embodiment, the concentration of the UV blocker used in the process 1050 of applying the UV blocker to the oxide film may be selected to reduce the seal (eg, the sealing layer (eg, Figure 6 The sealing layer 340 of the present invention is not formed properly, stains are generated, or there is no coloring or whitening. For example, the concentration of the UV blocker can be 1ng / ml to 500ng / ml. When the concentration of the UV blocker exceeds 500ng / ml, at least a portion of the UV blocker is not located in the gap, but may be gathered on the gap.

[0116] For example, when the concentration of the UV blocker is in the range of 1 ng / ml to 500 ng / ml, the chromaticity value of the housing including the UV blocker and the dye (e.g., natural dye) can be less than 1. When the concentration of the UV blocker 330 exceeds 500 ng / ml, at least a portion of the UV blocking component is not located in the voids, resulting in a seal (e.g., a sealing layer (e.g., Figure 6 When the concentration of the UV blocker is less than 1 ng / ml, the effect of the UV blocker in preventing and / or reducing dye discoloration may be substantially absent. The concentration of the UV blocker may refer to the concentration of the UV blocking component of the UV blocker.

[0117] According to an embodiment, the order of the process 1040 of applying the dye to the oxide film and the process 1050 of applying the UV blocker to the oxide film may be changed according to the design. According to an embodiment, the process 1050 of applying the UV blocker to the oxide film may be performed together with the process 1040 of applying the dye to the oxide film. According to an embodiment, the process 1050 of applying the UV blocker to the oxide film may be performed after the process 1040 of applying the dye to the oxide film.

[0118] According to an embodiment, the process 1060 of forming a sealing layer on a metal member may be a process of sealing a gap of an oxide film. For example, through the process 1060 of forming a sealing layer, damage to the dye 320 and the UV blocker 330 located in the gap may be reduced.

[0119] According to an embodiment, the process 1060 of forming the sealing layer on the metal member may be a metal salt treatment method, a non-metal salt treatment method, or a hydration sealing treatment method using water and steam.

[0120] According to an embodiment, the method 1000 for manufacturing a housing may include an elution process 1060 for removing metal salts or a hot water washing process for cleaning foreign substances after the process 1060 of forming a sealing layer on a metal member.

[0121] There is an increasing demand for designs that improve the aesthetics of electronic devices. For example, electronic devices may include housings that use natural dyes to achieve different colors. However, natural dyes may change color due to UV light. If a leguminous plant-based sealant is used to prevent and / or reduce the discoloration of natural dyes, the manufacturing process of the sealant may be complicated and reduce mass production. Post-processed UV barriers on the surface of the finished product may be damaged by external stimuli (e.g., scratches), and the durability of the UV barrier may be reduced.

[0122] According to an embodiment of the present disclosure, a housing including a UV blocker for reducing discoloration of a natural dye may be provided.

[0123] According to an embodiment of the present disclosure, a housing including a UV barrier disposed at a designated position in a gap to reduce degradation of a sealing layer, generation of stains, and no coloring or whitening may be provided.

[0124] The present disclosure is not limited to the foregoing embodiments, but various modifications or changes may be made thereto without departing from the spirit and scope of the present disclosure.

[0125] According to an exemplary embodiment of the present disclosure, a housing (eg, Figure 5 The housing 300 may include: a metal member including a metal material (eg, Figure 6 The metal member 310 includes a metal member having a void (e.g., Figure 6 The oxide film (eg, Figure 6 oxide film 311); dye (e.g., Figure 6 A dye 320) is disposed in the gap; a UV blocker including an ultraviolet (UV) blocking material (e.g., Figure 6 UV barrier 330) disposed in the gap; and a sealing layer (eg, Figure 6 The gap may include a first region (eg, Figure 7 a first region 3131) and a second region located below the first region (e.g., Figure 7 The ratio of the UV blocker to the dye in the first region can be greater than the ratio of the UV blocker to the dye in the second region. Since the UV blocker is disposed in the gap, discoloration of the dye can be reduced. Since the sealing layer is located on the oxide film, the durability of the UV blocker can be increased.

[0126] According to an exemplary embodiment, in the first region, the concentration of the UV blocking component of the UV blocker may be 100 cps or more. For example, the concentration of the UV blocking component of the UV blocker may be detected as 100 cps or more.

[0127] According to an exemplary embodiment, the particle size of the UV blocker may be larger than that of the dye. Since the particle size of the UV blocker is larger than that of the dye, the ratio of the UV blocker to the dye in the first region may be larger than that in the second region.

[0128] According to an example embodiment, the oxide film may form at least a portion of a surface of the metal member. The void may include a plurality of recesses formed in the oxide film.

[0129] According to an example embodiment, the oxygen concentration of the sealing layer may be greater than the oxygen concentration of the oxide film.

[0130] According to an example embodiment, the first region includes an empty space up to 1 μm from an entrance of the void in a depth direction of the housing.

[0131] According to an exemplary embodiment, the concentration of the UV blocker may be in the range of 1 ng / ml to 500 ng / ml. Due to the concentration of the UV blocker, poor sealing, generation of stains, non-coloring or whitening may be reduced.

[0132] According to an exemplary embodiment, the dye may include a natural dye. Using the natural dye may increase the beauty of the housing.

[0133] According to an example embodiment, the UV blocker may include at least one of zirconium, zinc, titanium, boron, or phosphorus.

[0134] According to an example embodiment, the UV blocker may include at least one of oxybenzone, ethylhexyl methoxycinnamate, octyl methoxycinnamate, avobenzone, octyl methoxycinnamate, or octocrylene.

[0135] According to an example embodiment, the metal member may include at least one of aluminum, magnesium, or titanium.

[0136] According to an exemplary embodiment of the present disclosure, an electronic device (eg, Figure 2 The electronic device 200 may include: a housing (eg, Figure 2 housing 210) and a processor (eg, Figure 1 processor 120). Housing (e.g., Figure 5 The housing 300 may include: a metal member including a metal material (eg, Figure 6 The metal member 310 includes a metal member having a void (e.g., Figure 6 The oxide film (eg, Figure 6 oxide film 311); dye (e.g., Figure 6Dye 320), disposed in the gap; ultraviolet (UV) blocking material (e.g., Figure 6 UV barrier 330) disposed in the gap; and a sealing layer (eg, Figure 6 The gap may include a first region (eg, Figure 7 a first region 3131) and a second region located below the first region (e.g., Figure 7 The ratio of UV blocker to dye in the first region may be greater than the ratio of UV blocker to dye in the second region.

[0137] According to an example embodiment, the housing may include a bracket (eg, Figure 4 The electronic device may include a bracket 231 and / or a side frame structure 231) and a rear plate (eg, Figure 4 rear plate 280).

[0138] According to an example embodiment, the electronic device may further include a display (eg, Figure 4 220) and a printed circuit board (eg, Figure 4 circuit board 240).

[0139] According to an example embodiment, the housing may include a sealing layer (e.g., Figure 6 A sealing layer 340) is provided as a sealing layer located on the oxide film.

[0140] According to an exemplary embodiment, in the first region, the concentration of the UV blocking component of the UV blocker may be 100 cps or more. For example, the concentration of the UV blocking component of the UV blocker may be detected as 100 cps or more in the first region.

[0141] According to an example embodiment, the concentration of the UV blocking component of the UV blocker may be in the range of 1 ng / ml to 500 ng / ml.

[0142] According to an example embodiment, the dye may include a natural dye. The metal member may include at least one of aluminum, magnesium, or titanium. The UV blocker may include at least one of zirconium, zinc, titanium, boron, phosphorus, oxybenzone, ethylhexyl methoxycinnamate, octyl methoxycinnamate, avobenzone, octyl methoxycinnamate, or octocrylene.

[0143] According to an exemplary embodiment of the present disclosure, a method for manufacturing a housing (eg, Fig.10The method 1000 for manufacturing a housing may include: preparing (for example, Fig.10 The process 1010, the process 1020 and / or the process 1030) has an oxide film (eg, Figure 6 The oxide film 311 of the metal member (for example, Figure 6 metal member 310); dye (e.g., Figure 6 The dye 320) is applied (e.g., Fig.10 process 1040) to the oxide film; an ultraviolet (UV) blocker (e.g., Figure 6 UV blocker 330) is applied (e.g., Fig.10 1050) to the oxide film; and forming (eg, Fig.10 Process 1060) of sealing layer (e.g., Figure 6 Sealing layer 340).

[0144] Although the present disclosure has been shown and described with reference to various exemplary embodiments, it will be understood that the various exemplary embodiments are intended to be illustrative rather than restrictive. It will also be understood by those skilled in the art that various changes in form and detail may be made without departing from the true spirit and full scope of the present disclosure (including the appended claims and their equivalents). It will also be understood that any embodiment described herein may be used in combination with any other embodiment described herein.

Claims

1. A housing (210 or 300), comprising: A metal member comprising a metal material and including an oxide film having voids (313); A dye (320) disposed in the gap; an ultraviolet (UV) blocker (330), comprising a UV light blocking material and disposed within the gap; as well as a sealing layer (340) located on the oxide film, wherein the sealing layer (340) is configured to cover the gap, wherein the gap includes a first region (3131) located below the sealing layer and a second region (3132) located below the first region, and The ratio of the UV blocker to the dye in the first region is greater than the ratio of the UV blocker to the dye in the second region. 2 . The housing according to claim 1 , wherein in the first area, a concentration of the UV blocking component of the UV blocking material is configured to be detected as 100 cps or more.

3. The housing according to claim 1 or 2, The particle size of the UV blocking material is larger than the particle size of the dye.

4. A housing according to any one of the preceding claims, wherein the oxide film forms at least a portion of a surface (311a) of the metal member, and The voids include a plurality of depressions formed in the oxide film.

5. A housing according to any one of the preceding claims, wherein the sealing layer covers the gap, and The sealing layer covers the dye and the UV blocker.

6. The housing according to any one of the preceding claims, wherein the oxygen concentration of the sealing layer is greater than the oxygen concentration of the oxide film. 7 . The housing according to claim 1 , wherein the first region comprises an empty space extending from an entrance of the void to a depth of 1 μm in a depth direction of the housing.

8. The housing according to any one of the preceding claims, wherein the concentration of the UV blocking component in the UV blocker is in the range of 1 ng / ml to 500 ng / ml.

9. A casing according to any preceding claim, wherein the dye comprises a natural dye.

10. The housing of any one of the preceding claims, wherein the UV blocker comprises at least one of zirconium, zinc, titanium, boron or phosphorus.

11. The housing of any one of the preceding claims, wherein the UV blocker comprises at least one of oxybenzone, ethylhexyl methoxycinnamate, octyl methoxycinnamate, avobenzone, octyl methoxycinnamate, or octocrylene.

12. The housing of any one of the preceding claims, wherein the metal member comprises at least one of aluminum, magnesium or titanium.

13. An electronic device (101 or 200), comprising: Housing (210 or 300); and A processor (120), located in the housing, The housing comprises: A metal member (310) includes a metal material and includes an oxide film (311), wherein the oxide film has voids (313), a dye (320) disposed in the gap, and A UV blocker (330), comprising a UV light blocking material and disposed in the gap, wherein the gap includes a first area (3131) adjacent to the surface of the shell and a second area (3132) located below the first area, and The ratio of the UV blocker to the dye in the first region is greater than the ratio of the UV blocker to the dye in the second region.

14. The electronic device according to claim 13, wherein the housing comprises a sealing layer (340) configured to protect the UV blocker and the dye, wherein the sealing layer is disposed on the oxide film.

15. A method (1000) for manufacturing a housing, comprising: preparing (1010, 1020 and 1030) a metal member (310) including an oxide film (311); applying (1040) a dye (320) to the oxide film; applying (1050) a UV blocker (330) having a concentration in a range of 1 ng / ml to 500 ng / ml to the oxide film; as well as A sealing layer (340) is formed (1060) on the oxide film.

Images