Optical chip, optical device, manufacturing method, optical module and optical processing equipment

Abstract

The embodiment of the invention provides an optical chip, an optical device, a manufacturing method, an optical module and optical processing equipment, which are applied to the field of design and manufacturing of optical chips and optical devices. The optical chip comprises a crystal grain substrate, at least one 3D printing lens and a built-in optical processing device. A waveguide is arranged on the crystal grain substrate; a receding groove is formed in the outer surface of the crystal grain substrate. The at least one 3D printed lens includes an inner lens. The inner lens and the built-in light processing device are arranged in the receding groove, and the inner lens is coupled to the crystal grain substrate or the built-in light processing device. Wherein the inner lens is used for shaping an optical signal; and optical signals are transmitted with the waveguide and / or a built-in optical processing device. By means of the mode, a packaging coupling structure internally provided with an optical processing device and an optical chip can be omitted, the cost and the area overhead of the optical chip are reduced, the integration degree of the optical chip is improved, and low-cost and miniaturized development of optical devices can be greatly promoted.

Description

Technical Field

[0001] The present application relates to the technical field of design and manufacturing of optical chips and optical devices, and in particular to an optical chip, an optical device, a manufacturing method, an optical module and an optical processing device. Background Art

[0002] With the development of technology, there are higher requirements for the processing performance of chips. This has led to an increasing demand for highly miniaturized and integrated chips. For electronic chips, external packaging such as metal leads is implemented outside the die of the electronic chip. The electronic chip interacts with the peripheral discrete devices through the metal leads of the package to realize the interaction of related electrical signals for data processing. Because of the small area overhead, electronic chips have a rapid and highly miniaturized and highly integrated development.

[0003] For optical chips, it is necessary to design a packaging coupling structure for the optical port outside the optical signal die (such as a fiber coupling structure after packaging coupling processing, etc.). The optical port packaging coupling structure of the optical chip will occupy a large amount of area and cost of the optical chip, and will also increase the area and cost of the optical device. This hinders the development of low cost, miniaturization and high integration of optical chips and optical devices. Summary of the invention

[0004] The embodiments of the present application provide an optical chip, an optical device, a manufacturing method, an optical module, and an optical processing device, which reduce the cost and area overhead of the optical chip and the optical device and improve the degree of miniaturization and integration.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, an optical chip is provided, comprising a crystal substrate, at least one 3D printed lens and a built-in optical processing device. A waveguide is arranged on the crystal substrate. An avoidance groove is formed on the outer surface of the crystal substrate. At least one 3D printed lens comprises an inner lens. The inner lens and the built-in optical processing device are arranged in the avoidance groove, and the inner lens is coupled to the crystal substrate or the built-in optical processing device. Wherein: the inner lens is used to: shape the optical signal; and transmit the optical signal with the waveguide and / or the built-in optical processing device.

[0007] In an embodiment of the present application, when the chip is manufactured, an avoidance groove is processed on the grain base of the optical chip. By placing a traditional external discrete device as a built-in light processing device in the avoidance groove, and manufacturing an internal lens for realizing spot shaping in the avoidance groove through 3D printing technology. The mold expansion is realized through the internal lens, so that the built-in light processing device can realize light transmission and light processing inside the optical chip. The embodiment of the present application can solve the problem that the built-in light processing device cannot realize light transmission with the waveguide inside the optical chip through the 3D printed internal lens, so as to realize the integration of the external discrete device as the built-in light processing device into the optical chip, and then the original packaging coupling structure between the external discrete device and the optical chip can be omitted, thereby fundamentally reducing the cost and area overhead brought by the packaging coupling structure of the optical chip. At the same time, based on the solution of the embodiment of the present application, the external discrete device is encapsulated in the optical chip, and the packaging of the electrical chip and the optical chip can also be realized on the same platform.

[0008] In a possible implementation, the built-in optical processing device includes a passive optical device; the inner lens includes a first inner lens and a second inner lens; and the waveguide includes a first waveguide. Wherein: the first end of the first waveguide extends from the crystal substrate to the first inner side surface of the avoidance groove. The first inner lens is arranged at a position corresponding to the first waveguide on the first inner side surface. The passive optical device is arranged in the avoidance groove and is located between the optical transmission path of the second inner lens and the first inner lens. The second inner lens, the passive optical device, the first inner lens and the first waveguide form a transmission path for the first optical signal in sequence. In an embodiment of the present application, the passive optical device can be encapsulated in the avoidance groove of the optical chip as a built-in optical processing device. The passive optical device can be used to process the optical signal. At this time, the first optical signal can be transmitted to the passive optical device for optical processing through the first inner lens and the second inner lens, and the first optical signal processed by the passive optical device can be transmitted to the waveguide of the crystal substrate of the optical chip for subsequent optical transmission and optical processing.

[0009] In some examples, a second waveguide is also provided on the die substrate; the first end of the second waveguide extends from the die substrate to the second inner side surface of the avoidance groove. Wherein: the second inner lens is provided at a position corresponding to the first end of the second waveguide; the second waveguide is used to: transmit the first optical signal with the second inner lens. In an embodiment of the present application, the first optical signal can be transmitted from the die substrate to the passive optical device through the waveguide and the inner lens, and after the passive optical device performs optical processing on the first optical signal, the optically processed first optical signal is transmitted to the die substrate of the optical chip through the inner lens and the waveguide for subsequent optical transmission and optical processing.

[0010] In some examples, the first active optical device and the passive optical device can be used as different built-in optical processing devices, respectively. At this time, the first active optical device is arranged in the avoidance groove. The first active optical device is coupled with the second inner lens. Wherein: the first active optical device is used to: transmit the first optical signal with the second inner lens. In an embodiment of the present application, the first optical signal can be an optical signal transmitted from the first active optical device to the second inner lens, and transmitted to the passive optical device through the second inner lens. After the passive optical device performs optical processing on the first optical signal, the optically processed first optical signal is transmitted to the first inner lens. The optically processed first optical signal is then transmitted to the grain substrate of the optical chip through the first inner lens for subsequent optical transmission and optical processing.

[0011] In a possible implementation, the second inner lens is specifically used to: shape the first optical signal into parallel light. The beam waist mode field of the second inner lens is greater than the first value; the first value satisfies: the collimation distance of the first optical signal as parallel light is greater than the distance between the second inner lens and the passive optical device. In the embodiment of the present application, the inner lens realizes spot shaping based on the Gaussian beam principle. When the built-in optical processing device includes a passive optical device, the size of the traditional 3D printed lens is usually between 3um-10um, and there is no application demand for expanding the lens size. When the second inner lens needs to transmit parallel light to the passive optical device, the collimation distance of the parallel light obtained by the ordinary 3D printed lens spot shaping cannot meet the distance requirement for optical transmission with the passive optical device. In the embodiment of the present application, the size of the second inner lens is set at 15um or above, and can even be processed to more than 50um, so that a collimation distance of more than 1200um (also known as Rayleigh length) can be achieved, which fully meets the optical transmission requirements of the passive optical device in the avoidance groove, and can make the working parameters of the passive optical device in the avoidance groove meet the requirements of optical transmission and optical processing.

[0012] In one possible implementation, the built-in optical processing device includes a second active optical device. The inner lens includes a third inner lens. The waveguide includes a third waveguide. The first end of the third waveguide extends from the grain base to the inner side of the avoidance groove. The third inner lens is mounted on the second active optical device and is located at a position corresponding to the first end of the third waveguide. Wherein: the second active optical device is used to: transmit the second optical signal with the third inner lens. The third inner lens is used to: shape the second optical signal; and transmit the shaped second optical signal with the first end of the third waveguide. In an embodiment of the present application, the second active optical device can be arranged in the avoidance groove as a built-in optical processing device. The second active optical device that provides the second optical signal to the optical chip is integrated into the optical chip, which reduces the packaging coupling process of the second active optical device and reduces the cost and area overhead of the optical chip.

[0013] In one possible implementation, at least one 3D printed lens also includes an external lens. The waveguide also includes a fourth waveguide; the first end of the fourth waveguide extends from the grain substrate to the outer side of the grain substrate. The external lens is arranged at a position on the grain substrate corresponding to the first end of the fourth waveguide. Wherein: the fourth waveguide is used to: transmit a third optical signal with the external lens. The external lens is used to: shape the third optical signal and transmit the shaped third optical signal. In an embodiment of the present application, when the optical chip also needs to perform optical transmission and optical processing with some external discrete devices that are not integrated, the spot shaping and mode expansion of the third optical signal can be achieved through the external lens, thereby improving the optical coupling efficiency between the optical chip and the external discrete devices. In some cases, the packaging coupling structure between the fourth waveguide and the external optical fiber can be omitted.

[0014] In a possible implementation, the optical chip also includes a packaging coupling structure. The external lens is used to: transmit the shaped third optical signal with the packaging coupling structure. In an embodiment of the present application, when the coupling requirements between the fourth waveguide and the external optical fiber are high, a certain packaging coupling structure is still required. However, the third optical signal is spot shaped and expanded by the external lens. Because the 3D lens technology can have higher flexibility in external lens design and processing flexibility, the external lens has higher spot shaping and expansion capabilities. The external lens can greatly reduce the complexity of the packaging process between the fourth waveguide and the external optical fiber, so as to reduce the cost and area overhead of the packaging coupling process of the optical chip.

[0015] In one possible implementation, the external lens is an elliptical lens structure. In the embodiment of the present application, usually, the horizontal light field limitation factor and the vertical light field limitation factor of the optical chip waveguide are different, which will make the light output spot of the optical chip elliptical rather than circular. The fiber spot of the commonly used external optical fiber is circular. Therefore, there is additional coupling insertion loss between the light output spot of the waveguide of the optical chip and the coupled fiber spot. By setting the external lens to an elliptical lens structure with different vertical and horizontal curvatures, the third optical signal of the elliptical spot output by the fourth waveguide of the optical chip is converted into a third optical signal of a circular spot and transmitted to the external optical fiber, so as to reduce the coupling insertion loss and improve the coupling efficiency.

[0016] In a possible implementation, the inner lens and / or the outer lens include a connecting portion and a reshaping lens. Wherein: the reshaping lens of the inner lens is coupled to the grain substrate or the built-in light processing device through the corresponding connecting portion. The reshaping lens of the outer lens is coupled to the grain substrate through the corresponding connecting portion. In an embodiment of the present application, when processing a 3D printed lens (including an inner lens and / or an outer lens) by 3D printing technology, a connecting portion can be designed and processed for the lens. After designing the connecting portion, the reliability and structural stability of the 3D printed lens are higher. In this case, the size of the 3D printed lens can be made larger to further increase the mold expansion capability of the 3D printed lens, thereby achieving a higher coupling efficiency. At a higher coupling efficiency, more cost and area costs can be reduced.

[0017] In some examples, the inner lens and / or the outer lens can interact with the waveguide of the die substrate through the air medium for optical signals.

[0018] In some examples, the inner lens and / or the outer lens can interact with the waveguide of the grain substrate through a 3D printed structure as a transmission medium for optical signals. At this time, the inner lens and / or the outer lens include a connecting portion, a transmission portion and a reshaping lens. Among them: the reshaping lens of the inner lens is coupled with the corresponding transmission portion. The transmission portion and / or the reshaping lens of the inner lens are also coupled to the grain substrate or the built-in light processing device through the connecting portion. The reshaping lens of the outer lens is coupled with the corresponding transmission portion; the transmission portion and / or the reshaping lens of the outer lens are also coupled to the grain substrate through the connecting portion. In an embodiment of the present application, a transmission portion can be processed in a 3D printed lens through 3D printing technology. The optical signal is transmitted through the transmission portion as a transmission medium. For example, the transmission portion can realize direct transmission and turning direction transmission of the optical signal to adapt to different optical coupling methods.

[0019] Exemplarily, the built-in optical processing devices may include modulators, lasers, isolators, and the like.

[0020] In a second aspect, an embodiment of the present application further provides an optical device, which includes a mounting plate and an optical chip. The optical chip is disposed on the mounting plate. The optical chip includes a grain substrate, at least one 3D printed lens and a built-in optical processing device; a waveguide is disposed on the grain substrate. An avoidance groove is formed on the outer surface of the grain substrate. At least one 3D printed lens includes an inner lens. The inner lens and the built-in optical processing device are disposed in the avoidance groove, and the inner lens is coupled to the grain substrate or the built-in optical processing device. Wherein: the inner lens is used to: shape the optical signal; and transmit the optical signal with the waveguide and / or the built-in optical processing device.

[0021] In some possible embodiments, the optical device further includes at least one external discrete device; the at least one 3D printed lens of the optical chip further includes an external lens; the at least one external discrete device is disposed on a mounting substrate; the external lens is coupled to the outer side surface of the grain substrate of the optical chip; and the optical chip achieves optical communication coupling with the at least one external discrete device through the external lens.

[0022] In a third aspect, an embodiment of the present application further provides a manufacturing method for manufacturing an optical chip as described in the first aspect above. The method comprises: etching a grain array on a wafer. A waveguide is arranged on the grain substrate of each grain in the grain array. An avoidance groove is formed on the outer surface of the grain substrate. An internal optical processing device is installed in the avoidance groove, and at least one 3D printed lens is etched based on 3D printing technology; at least one 3D printed lens includes an inner lens; the inner lens is arranged in the avoidance groove, and the inner lens is coupled to the grain substrate or the internal optical processing device. The inner lens is used for: shaping the optical signal; transmitting the optical signal with the waveguide and / or the internal optical processing device.

[0023] In one possible implementation, the built-in optical processing device includes a passive optical device. The inner lens includes a first inner lens and a second inner lens; the waveguide includes a first waveguide. The first end of the first waveguide extends from the grain substrate to the first inner side surface of the avoidance groove. The etching of at least one 3D printed lens includes: etching the first inner lens at a position corresponding to the first waveguide on the first inner side surface. The installation of the built-in optical processing device in the avoidance groove includes: installing the passive optical device in the avoidance groove and between the optical transmission path of the second inner lens and the first inner lens. The second inner lens, the passive optical device, the first inner lens and the first waveguide form a transmission path for the first optical signal in a transmission order.

[0024] In a possible implementation, a second waveguide is further provided on the crystal substrate. The first end of the second waveguide extends from the crystal substrate to the second inner side surface of the avoidance groove. The etching of at least one 3D printed lens further includes: etching a second inner lens at a position corresponding to the first end of the second waveguide. The second waveguide is used to: transmit the first optical signal to the second inner lens.

[0025] In a possible implementation, the built-in optical processing device further includes a first active optical device. The above-mentioned installation of the built-in optical processing device in the avoidance groove further includes: setting the first active optical device in the avoidance groove. The above-mentioned etching of at least one 3D printed lens further includes: etching a second inner lens on the first active optical device. The first active optical device is used to: output a first optical signal with the second inner lens.

[0026] In a possible implementation, the built-in optical processing device includes a second active optical device. The inner lens includes a third inner lens. The waveguide includes a third waveguide. The first end of the third waveguide extends from the grain substrate to the inner side of the avoidance groove. The above-mentioned installation of the built-in optical processing device in the avoidance groove includes: installing the second active optical device in the avoidance groove. The above-mentioned etching of at least one 3D printed lens includes: etching the third inner lens on the second active optical device and located at a position corresponding to the first end of the third waveguide. The second active optical device is used to: output a second optical signal with the third inner lens. The third inner lens is used to: shape the second optical signal; and output the shaped second optical signal with the first end of the third waveguide.

[0027] In a possible implementation, at least one 3D printed lens further includes an outer lens. The waveguide further includes a fourth waveguide. The first end of the fourth waveguide extends from the grain substrate to the outer side surface of the grain substrate. The etching of at least one 3D printed lens further includes: etching the outer lens at a position on the grain substrate corresponding to the first end of the fourth waveguide. The fourth waveguide is used to: transmit a third optical signal to the outer lens. The outer lens is used to: shape the third optical signal and transmit the shaped third optical signal.

[0028] In a possible implementation, the method further includes: manufacturing a packaging coupling structure outside the die substrate to package the die substrate to obtain an optical chip. The external lens is used to: transmit the shaped third optical signal with the packaging coupling structure.

[0029] In a fourth aspect, an embodiment of the present application further provides a manufacturing method for manufacturing an optical device as described in the second aspect above. The method comprises: etching a grain array on a wafer; a waveguide is provided on the grain substrate of each grain in the grain array; and an avoidance groove is formed on the outer surface of the grain substrate. An internal light processing device is installed in the avoidance groove, and at least one 3D printed lens is etched based on 3D printing technology. At least one 3D printed lens includes an inner lens; the inner lens is provided in the avoidance groove, and the inner lens is coupled to the grain substrate or the internal light processing device. The inner lens is used to: shape the optical signal; and transmit the optical signal with the waveguide and / or the internal light processing device. The grain substrate is encapsulated to obtain an optical chip. The optical chip package is provided on a mounting substrate to obtain an optical device.

[0030] In some possible implementations, the optical device further includes at least one external discrete optical device. The above-mentioned method of packaging an optical chip on a mounting substrate to obtain an optical device further includes: packaging an optical chip and at least one external discrete optical device on a mounting substrate to obtain an optical device.

[0031] Regarding the technical principles and beneficial effects of the second, third and fourth aspects, please refer to the relevant description of the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic diagram of a packaging structure of an electric chip;

[0033] Figure 2 The figure is a schematic diagram of a packaging structure of an optical chip;

[0034] Figure 3 A schematic diagram of the coupling structure of vertical coupling and port coupling of an optical chip;

[0035] Figure 4 A schematic diagram of the structure of a first optical device including a first optical chip provided in an embodiment of the present application;

[0036] Figure 5 A schematic diagram of the structure of a first optical chip provided in an embodiment of the present application that performs light spot shaping based on a free-space dual lens;

[0037] Figure 6 A schematic diagram of the structure of a first optical chip provided in an embodiment of the present application that performs light spot shaping based on a free-space single lens;

[0038] Figure 7 A schematic diagram of the structure of a first optical chip for performing light spot shaping based on a ridge waveguide provided in an embodiment of the present application;

[0039] Figure 8 A schematic diagram of the structure of a first optical chip provided in an embodiment of the present application that performs light spot shaping based on intra-grain processing;

[0040] Fig. 9 A schematic diagram of the structure of a first optical chip provided in an embodiment of the present application for performing light spot shaping based on a photolithographic top lens;

[0041] Fig.10 A schematic diagram of the structure of a second optical device including a second optical chip provided in an embodiment of the present application Figure 1 ;

[0042] Fig.11 A schematic diagram of the structure of a second optical chip provided in an embodiment of the present application Figure 1 ;

[0043] Fig.12 A schematic diagram of the structure of an inner lens for transmitting optical signals based on a spatial medium provided in an embodiment of the present application;

[0044] Fig.13 A schematic diagram of the structure of an inner lens for transmitting optical signals based on a transmission part structure provided in an embodiment of the present application;

[0045] Fig.14A schematic diagram of the structure of an inner lens for realizing a turning transmission optical signal based on a transmission part structure provided in an embodiment of the present application;

[0046] Fig.15 A schematic diagram of the structure of another second optical chip provided in an embodiment of the present application Figure 2 ;

[0047] Fig.16 A schematic diagram of the structure of another second optical chip provided in an embodiment of the present application Figure 3 ;

[0048] Fig.17 A schematic diagram of the structure of another second optical chip provided in an embodiment of the present application Figure 4 ;

[0049] Fig.18 A schematic diagram of the structure of another second optical chip provided in an embodiment of the present application Figure 5 ;

[0050] Fig.19 A schematic diagram of the structure of another second optical chip provided in an embodiment of the present application Figure 6 ;

[0051] Fig. 20 A schematic diagram of the structure of another second optical device including a second optical chip provided in an embodiment of the present application Figure 2 ;

[0052] Fig.21 A schematic diagram of the structure of an outer lens with an elliptical structure provided in an embodiment of the present application;

[0053] Fig. 22 A schematic diagram of a process for manufacturing a second optical chip provided in an embodiment of the present application;

[0054] Fig.23 A schematic diagram of the structure of a second optical device provided in an embodiment of the present application when it is a coherent optical transceiver device;

[0055] Fig.24 A schematic diagram of the structure of a second optical device provided in an embodiment of the present application when it is a direct-modulation optical transceiver device;

[0056] Fig.25 A method provided in the embodiment of the present application Fig.16 Schematic diagram of the structure of the second optical chip when the passive optical device is a polarization-dependent isolator Figure 1 ;

[0057] Fig.26 A method provided in the embodiment of the present application Fig.16 A schematic diagram of the structure of the second optical chip when the passive optical device is a polarization-independent isolator;

[0058] Fig. 27 Another embodiment of the present application provides Fig.16 Schematic diagram of the structure of the second optical chip when the passive optical device is a polarization-dependent isolator Figure 2 ;

[0059] Fig.28 A method provided in the embodiment of the present application Fig.25 and Fig. 27 A schematic diagram of the simulation effect of the second optical chip;

[0060] Fig.29 A schematic diagram of the structure of a second optical chip including a first inner lens, a second inner lens, a third inner lens and an outer lens provided in an embodiment of the present application;

[0061] Fig.30 A schematic diagram of the mold expansion effect based on different processing techniques and light spot shaping structures provided in an embodiment of the present application. DETAILED DESCRIPTION

[0062] It should be noted that the terms "first", "second", etc. involved in the embodiments of the present application are only used to distinguish features of the same type and cannot be understood as indicating relative importance, quantity, order, etc.

[0063] The terms "exemplary" or "for example" and the like in the embodiments of the present application are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the related concepts in a specific way.

[0064] The terms "coupling" and "connection" involved in the embodiments of the present application should be understood in a broad sense. For example, they may refer to a direct physical connection, or an indirect connection achieved through electronic devices, such as a connection achieved through resistors, inductors, capacitors or other electronic devices.

[0065] First, some basic concepts involved in the embodiments of the present application are explained:

[0066] The chip manufacturing process mainly includes wafer manufacturing, chip probing (CP), chip packaging, final test (FT), etc. In the wafer manufacturing stage, the designer designs the mask corresponding to the chip to be processed, and the mask is printed with the pre-designed chip circuit / optical path structure pattern. During processing, the wafer is etched based on the designed mask and photoresist. After the etching is completed, a die array can be formed on the wafer. Chip probing (CP) refers to establishing an electrical connection between the die and the automatic test equipment (ATE) through a probe card and a probe station to test the electrical connectivity, function, parameters, etc. of the die. Chip packaging is to cut the wafer, cut the die on the wafer, discard the die that failed the chip test, and package the die that passed the chip test to obtain a packaged chip. The final test (FT) is to establish an electrical connection between the automatic test equipment (ATE) and the packaged chip through a test board (load board) and a test socket (socket) to test the electrical connectivity, function, parameters, etc. of the packaged chip.

[0067] According to the different types of signals processed by the chip, the chip can be divided into electrical signal and optical chip. In the past technological development, integrated circuits (ICs) supported by complementary metal oxide semiconductor (CMOS) technology have developed rapidly, driving the continuous progress of modern information technology. With the continuous reduction of transistor feature size, the semiconductor manufacturing level has gradually approached the limit of physical process level, resulting in slow or even stagnant improvement of integration, and the system performance has also begun to be seriously restricted, mainly reflected in the insurmountable electronic bottleneck of the electrical interconnection network. When the interconnected electrical signal is transmitted, it is interfered by resistance, parasitic capacitance and induced inductance, which will not only cause time delay, but also seriously affect the transmission performance of high-frequency signals, limiting the improvement of electrical interconnection bandwidth; at the same time, the transmitted electrical signal is also susceptible to electromagnetic interference from adjacent electromagnetic wires or external electromagnetic fields, resulting in the degradation of transmission signal quality. In addition, with the increase in the number of microprocessors and the increase in computing speed, power consumption and heat dissipation caused by parasitic effects have gradually become limiting factors that cannot be ignored. In order to break through the bottleneck of traditional IC technology in the post-Moore era, promote the development of modern communication networks, and adapt to the growing computing needs of modern times, optical interconnection has entered people's field of vision with its unique performance advantages and has become an important technical means to replace traditional electrical interconnection. Compared with electrical signals, using light as a carrier for signal transmission has incomparable advantages, mainly reflected in large transmission bandwidth, low transmission loss, strong anti-interference ability, high-speed and non-crosstalk parallel transmission, etc. Therefore, the use of light for interconnection communication will undoubtedly become the mainstream development direction of high-speed communication in the future. Optical interconnection refers to the use of optical carriers to connect the source and the destination. Although optical fiber communication technology has achieved rapid development in the past few decades and has become an important pillar of modern long-distance, high-speed, and large-capacity communication networks, there are still many technical difficulties in optical interconnection technology in short-distance data interconnection such as data centers and on-chip. How to develop on-chip optical interconnection to break through the bottleneck of traditional electrical interconnection is also one of the current research hotspots. At the same time, at the switching nodes of current optical communication networks, the optical-electrical-optical signal processing is still limited by electronic bottlenecks. Therefore, on-chip optical interconnection and optical processing technology are of great significance to the development of modern high-speed and large-capacity communication networks.

[0068] The core of on-chip optical interconnection and optical processing is the optoelectronic integrated chip, which is composed of active and passive devices with various functions integrated on the same substrate. They are interconnected and communicated through optical waveguides, thereby realizing an on-chip optical interconnection processing system with specific functions. Photonic integration technology has achieved rapid development in recent years. The current mainstream material platforms include III-V compounds and silicon-based materials. Among them, the main advantage of III-V materials such as indium phosphide (InP) is that they are direct bandgap materials and can be used to make key active devices such as semiconductor lasers, modulators and detectors. However, the non-standardized and complex preparation process not only leads to high production costs, but also limits its real commercialization. In contrast, the advantages of silicon materials are large storage capacity in nature, low cost, almost transparent in the near-infrared band and even the mid-infrared band, and extremely low material loss. The large relative refractive index difference of silicon-on-insulator (SOI) waveguide is also more conducive to high-density integration of devices. More importantly, silicon materials are compatible with existing mature electrical CMOS processes, which undoubtedly plays an important supporting role in the development of silicon-based optoelectronic technology. Since silicon is an indirect bandgap material and cannot be used to make high-efficiency light sources, monolithic integration on a single material system still faces great challenges. The current mainstream development direction is still hybrid integration technology, that is, independently manufactured discrete active devices (such as lasers, photodetectors, etc.) and some discrete passive optical devices are integrated into silicon-based passive chips through bonding and other processing methods, thereby realizing low-cost, high-performance hybrid photonic integrated optical chips.

[0069] Nowadays, with the development of technology, there are higher requirements for chip processing performance. This leads to an increasing demand for high miniaturization and integration of chips. Figure 1 The figure shows a schematic diagram of the packaging of an electric chip. Figure 1 Figure (a) is a cross-sectional schematic diagram of an electric chip. Figure 1 As can be seen from Figure (a), the die_a of the electric chip is coupled with the metal pin Pin of the chip package based on the metal interconnection line WB to achieve external packaging, etc. Figure 1 As shown in Figure (b), the electronic chip realizes the interaction of relevant electrical signals of data processing with the peripheral discrete device WS through the metal pin Pin of the package. Because the metal pin Pin process of the electronic chip is simple and the area cost is small, the electronic chip has a rapid development of high miniaturization and high integration. Figure 2As shown, it is a schematic diagram of the packaging structure of the optical chip. The optical chip includes a die_b, a heat dissipation material layer SR1, and a packaging coupling structure FZ. The packaging coupling structure FZ includes a bonding (structural bonding) structure SB1, an FPC reinforcement bonding (FPC reinforcement bonding) structure FPCRB1, a laser diode bonding (laser diode bonding) structure LDB1, an active alignment (active alignment) structure AA1, etc. The optical port packaging coupling structure of the optical chip will occupy a large amount of area and cost overhead of the optical chip. This hinders the development of low cost, miniaturization and high integration of optical chips. As Figure 2 It can be seen that the packaging of optical chips involves optical port coupling and input and output design. Optical port coupling will occupy a large amount of non-functional area of ​​the optical chip packaging, as well as the area of ​​the finished optical chip packaging. This makes all scenarios where optical chips are used have the problem of high cost and area overhead. How to solve the cost and area overhead of optical chips is a major problem. Taking optical modules based on optical chips as an example, optical modules are currently widely used in communication scenarios such as long-distance trunk lines, metropolitan area transmission, data center transmission and access network transmission. Compared with traditional copper wire transmission, optical fiber transmission based on optical modules has the characteristics of large capacity, low latency, strong anti-interference ability and long transmission distance. Fiber-to-the-home copper-to-optical conversion (home terminals are directly equipped with optical fiber routers) is an inevitable trend in the field of communications, and fiber-to-the-room (for example, equipment terminals such as computers, TVs, etc. are directly equipped with optical fiber routers) is also a major development direction that has been widely discussed recently. The biggest difficulty of fiber-to-the-home is how to make the cost equivalent to or even lower than the cost of copper wire to the home. The current largest cost component is the high cost of optical modules, which greatly limits the further widespread application of optical communications. Reducing the cost of optical modules is the core of further expanding optical communications.

[0070] Optical coupling technology is an important technology for optical interconnection systems. Its main purpose is to provide an optical connection interface that can be compatible with external optical fiber communication networks by coupling with optical fibers, giving full play to the application potential of optical interconnection chips. At the same time, on-chip optical coupling technology can also be used for interconnection between optical chips, thereby building a heterogeneous integrated on-chip optical interconnection system. The coupling connection between optical chips and optical fibers is the most important aspect of optical coupling. The main challenge lies in the large size mismatch between the optical fiber and the photonic waveguide mode distribution. The common fiber-photonic chip interface can be divided into two categories: vertical coupling and end-face coupling.

[0071] Vertical coupling is also called grating coupling. The most common scheme is Figure 3The vertically coupled diffraction grating structure shown in (a) changes the waveguide refractive index by defining a periodic pattern along one or more dimensions, thereby allowing phase matching between the optical mode incident on the grating structure from the optical fiber in a nearly vertical direction and the optical mode of the on-chip integrated waveguide in the horizontal plane. This vertically coupled grating can usually be manufactured in large quantities, is more compatible with the packaging process, can be placed anywhere on the die, and has a relatively loose positioning tolerance. However, this structure is inherently polarization and wavelength sensitive, and these limitations need to be reduced through further design and optimization. Grating-based vertical coupling technology is a non-planar coupling design. This non-planar coupling design will cause blockage on the chip surface and increase the overall size of the chip package.

[0072] End coupling is also called edge coupling. Figure 3 As shown in (b), an optical coupling interface based on end-face coupling is designed on the optical chip. The light beam is coupled from the side to enter or transmit out of the waveguide in the chip. The end-face coupling method can provide large bandwidth and polarization-independent optical coupling. At present, end-face coupling has become the mainstream coupling method of optical chips, and it is widely used in optical chips based on InP materials and SiPh.

[0073] The embodiment of the present application provides an optical processing device, which includes a mounting plate. The processor device also includes an optical module or an optical device. The optical module or the optical device is arranged on the mounting plate. The optical module includes an optical fiber interface and the above-mentioned optical device, and the optical device is coupled to the optical fiber interface. Exemplarily, the optical processing device can be an optical communication device, an optical manufacturing device, an optical detection device, etc.

[0074] In some possible implementations, the optical device may be a first optical device, such as Figure 4 As shown, the first optical device 10000A includes a first optical chip 1000A and at least one first external discrete device 2000A. The first optical chip 1000A includes a first die substrate 100A and a first packaging coupling structure 200A. An optical transmission waveguide 110A is processed on the first die substrate 100A. The optical transmission waveguide 110A is coupled to the first optical fiber fiber1 through the first packaging coupling structure 200A, and is coupled to at least one first external discrete device 2000A through the first optical fiber fiber1 to achieve transmission and interaction of optical signals. At least one first external discrete device 2000A may include passive devices and / or active devices.

[0075] In some possible implementations, such as Figure 5 As shown, in the first package coupling structure 200A of the first optical chip 1000A, a free space lens (lens) can be designed to perform beam shaping. Figure 5As shown in FIG. (a) and FIG. (b), a solution for realizing parallel light shaping is based on a double lens structure including a first lens lens1, a second lens lens2 and an isolator 210A. Figure 6 As shown in (a) and (b), it is a solution for realizing convergent light shaping based on a single lens structure including a third lens lens3 and an isolator 210A. In the spatial optical path, the use of a dual-lens structure needs to consider the lens coupling process, which will occupy a large amount of space size and material cost. In the single-lens structure, although one lens is missing, the savings in cost and area expenditure are limited. And in the solution of setting a lens in free space, it is more sensitive to the optical path length, and the actual coupling insertion loss (IL) is large. This solution can only be applied in scenarios where the optical power budget is relatively sufficient.

[0076] In order to reduce the cost and area overhead caused by the optical port coupling of the first optical chip 1000A, so as to achieve low cost and high integration of the first optical chip 1000A. In some possible implementations, Figure 7 As shown, a ridge waveguide 120A can be designed on the die of the first optical chip 1000A as a taper structure to form an SSC. The ridge waveguide 120A is covered on the optical transmission waveguide 110A of the first optical chip 10000A, and light beam leakage is achieved through the ridge waveguide 120A to expand the waist mode field of the optical signal emitted by the optical transmission waveguide 110A of the first optical chip 1000A. When the waist mode field of the optical signal emitted by the first optical chip 1000A is expanded, the coupling quality between the emitted optical signal and the coupled first fiber 1 is improved. With higher optical coupling quality, the structural requirements and process requirements for the first packaging coupling structure 200A can be appropriately reduced, and the coupling area overhead can be reduced to a certain extent.

[0077] For example, Figure 7 The method shown can be applied to the first optical chip 1000A based on III-V materials (for example, InP materials). At this time, the mode expansion capability of the ridge waveguide 120A is limited, and the maximum mode expansion can usually reach about 3*3um. The degree of improvement in the optical coupling quality is also limited, and the addition of the SSC structure formed by the ridge waveguide 120A will increase the area overhead of the first optical chip 1000A, and the insertion loss of the SSC structure itself will also increase by 0.5dB to 1dB. The III-V process accuracy is also poor, and the addition of the SSC structure will also reduce the yield of the first optical chip 1000A.

[0078] For example, Figure 7The method shown can be applied to the first optical chip 1000A based on SiPh. The SiPh process is slightly better than the process of III-V materials, which can expand the first optical chip 1000A to 9*9um, improving the coupling quality to a certain extent. Thereby simplifying more packaging coupling processes. However, in the SiPh process, the insertion loss of the SSC itself is 0.2dB~0.5dB, and the large-size expansion will involve more complex processing technology, affecting the yield of the first optical chip 1000A. At the same time, a coupling process is still required between the first optical chip 1000A and the first optical fiber fiber1, and the complex optical chip coupling process still exists. Compared with the packaging process of the electrical chip, there is still a higher cost and area overhead.

[0079] In some possible implementations, an SSC structure for mode expansion may be provided inside the first optical chip 1000A.

[0080] For example, Figure 8 As shown in FIG. (a), for a first optical chip 1000A based on a III-V material (e.g., an InP material), multiple stacked structures can be processed in the quantum well layer of the first grain substrate 100A of the first optical chip 1000A to form an SSC based on a taper structure. The taper structure is used to achieve beam leakage for mode expansion. In this way, a mode expansion of up to 3*3um can also be achieved. It also has the same Figure 7 In the embodiment, the technical problem of forming an SSC based on the ridge waveguide 120A is solved.

[0081] For example, Figure 8 As shown in FIG. (b), for the first optical chip 1000A based on SiPh, the beam leakage can be realized based on the CTL structure inside the first optical chip 1000A. A trident structure for beam leakage is processed inside the first optical chip 1000A to form an SSC. In this implementation, a maximum expansion mode of 9*9um can be achieved. However, there will also be Figure 7 Related issues in the SiPh based embodiment shown.

[0082] In some possible implementations, such as Fig. 9As shown, during the wafer manufacturing process of the first optical chip 1000A, when etching the grain array, a photolithography microlens lens4 structure can be etched on the upper surface of the first grain substrate 100A based on the photolithography technology. The etched photolithography microlens lens4 is used to achieve spot shaping for mold expansion. The maximum mold expansion degree of this process can reach more than 30*30um. However, the photolithography process can only form a simple-shaped photolithography microlens lens4, and the spot shaping ability is poor. And this process can only process the photolithography microlens lens4 on the top surface of the first grain substrate 100A, that is, it can only meet the application scenario of grating coupling (ie vertical coupling), and cannot meet the application scenario of edge coupling (ie port coupling). Edge coupling is the mainstream optical chip coupling method. This also makes it Fig. 9 The application scenarios of the illustrated embodiment are more limited.

[0083] In summary, Figure 7 , Figure 8 and Fig. 9 In the embodiment shown, the expansion of the beam waist mode field is achieved based on SSC to improve the coupling efficiency, thereby simplifying the coupling process and coupling structure. However, these processes have limited improvement on the coupling efficiency on the basis of increasing the chip area and cost, and there is no way to significantly reduce or even omit the coupling process.

[0084] In some possible implementations, in order to significantly reduce the coupling process of the optical chip, or even to omit the coupling process of the optical chip, the optical device may be a second optical device. Fig.10 As shown, the second optical device 10000B includes a second optical chip 1000B and a mounting substrate 2000B. The second optical chip 1000B is mounted on the mounting substrate 2000B. Fig.11 As shown, the second optical chip 1000B includes a second die substrate 100B, at least one 3D printed lens 200B and a built-in optical processing device 300B. A waveguide 110B is arranged on the second die substrate 100B. A avoidance groove 120B is formed on the outer surface of the second die substrate 100B. At least one 3D printed lens 200B includes an inner lens 210B. The inner lens 210B and the built-in optical processing device 300B are arranged in the avoidance groove 120B, and the inner lens 210B is coupled to the second die substrate 100B or the built-in optical processing device 300B. Wherein: the inner lens 210B is used to: shape the optical signal. Transmit the optical signal with the waveguide 110B and / or the built-in optical processing device 300B.

[0085] In this application Fig.11In the illustrated embodiment, when processing the second optical chip 1000B, a conventional external discrete device (such as the first external discrete device 2000A described in the embodiment of the first optical chip 1000A) is processed to form an avoidance groove 120B on the outer surface of the second grain substrate 100B of the second optical chip 1000B as a built-in optical processing device 300B is arranged in the second optical chip 1000B, and at least one 3D printed lens 200B is processed in the avoidance groove 120B. The 3D printed lens 200B is used to shape the light spot of the optical signal, and the transmission of the optical signal between the waveguide 110B and / or the built-in optical processing device 300B is realized. Through the embodiment of the present application, the external discrete device in the conventional technology is processed as the built-in optical processing device 300B in the second optical chip 1000B, and at least one 3D printed lens 200B is generated in the avoidance groove 120B based on 3D printing technology. The optical transmission of the optical processing device 300B and the waveguide 110B inside the second optical chip 1000B is realized through the 3D printed lens 200B. Through the above operation, the coupling process originally required for the built-in optical processing device 300B and its corresponding packaging coupling structure can be directly omitted. After omitting the coupling process of the built-in optical processing device 300B, the cost and size of the second optical chip 1000B can be greatly reduced, and the miniaturization and high integration of the second optical chip 1000B can be realized. At the same time, this solution can also realize a shared technology platform for optical chip packaging and electrical chip packaging.

[0086] In some possible implementations, the inner lens 210B of different shapes may be manufactured by 3D printing technology.

[0087] For example, Fig.12 As shown, the inner lens 210B includes a connection portion L and a shaping lens lens Z. The connection portion L is used to fix and couple the shaping lens lens Z to the second die substrate 100B or the built-in light processing device 300B. The shaping lens lens Z is used to shape the transmitted light signal. In some examples, such as Fig.12 As shown in FIG. (a) and FIG. (b), taking the case where the inner lens 210B is mounted on the second die substrate 100B as an example, the optical signal output by the waveguide 110B on the second die substrate 100B is a divergent optical signal. Fig.12 Figure (a) is a cross-sectional schematic diagram. Fig.12 FIG. (b) is a top view. The shaping lens lens Z of the inner lens 210B can shape the divergent light signal into a parallel light signal. In some examples, such as Fig.12 As shown in FIG. (c) and FIG. (d), taking the case where the inner lens 210B is mounted on the second die substrate 100B as an example, the optical signal output by the waveguide 110B on the second die substrate 100B is a divergent optical signal. Fig.12Figure (c) is a cross-sectional schematic diagram. Fig.12 Figure (d) is a top view. The waveguide 110B transmits the divergent light signal to the inner lens 210B through the spatial medium. The shaping lens lens Z of the inner lens 210B can shape the divergent light signal into a convergent light signal. Fig.12 This is an illustration of the inner lens 210B receiving the optical signal emitted by the waveguide 110B. Although not illustrated in the drawings, the inner lens 210B can also be used to shape the optical signal before transmitting it to the waveguide 110B.

[0088] For example, Fig.13 As shown, the inner lens 210B comprises a connection portion L, a transmission portion C and a shaping lens lens Z. The shaping lens lens Z of the inner lens 210B is coupled to the corresponding transmission portion C; the transmission portion C and / or the shaping lens lens Z of the inner lens 210B are also coupled to the second die substrate 100B or the built-in light processing device 300B through the connection portion L. The connection portion L is used to fix and couple the shaping lens lens Z to the second die substrate 100B or the built-in light processing device 300B. The transmission portion C serves as a transmission medium between the shaping lens lens Z and the waveguide 110B. The shaping lens lens Z is used to shape the transmitted optical signal. In some examples, such as Fig.13 As shown in FIG. (a) and FIG. (b), the inner lens 210B is installed on the second die substrate 100B as an example, wherein: Fig.13 Figure (a) is a cross-sectional schematic diagram. Fig.13 Figure (b) is a top view. The optical signal output by the waveguide 110B on the second die substrate 100B is a divergent optical signal. The inner lens 210B transmits the emitted optical signal to the shaping lens lens Z of the inner lens 210B based on the transmission part C as a transmission medium. The shaping lens lens Z of the inner lens 210B can shape the divergent optical signal into a parallel optical signal. In some examples, such as Fig.13 As shown in FIG. (c), taking the case where the inner lens 210B is mounted on the second die substrate 100B as an example, the optical signal output by the waveguide 110B on the second die substrate 100B is a divergent optical signal. The waveguide 110B transmits the divergent optical signal to the shaping lens lens Z of the inner lens 210B through the transmission portion C as a medium. The shaping lens lens Z of the inner lens 210B can shape the divergent optical signal into a convergent optical signal. Fig.13 This is an illustration of the inner lens 210B receiving the optical signal emitted by the waveguide 110B. Although not illustrated in the drawings, the inner lens 210B can also be used to shape the optical signal before transmitting it to the waveguide 110B.

[0089] Although not shown in the drawings, the technical principle and beneficial effects of the inner lens 210B being installed on the built-in light processing device 300B can be referred to in the aforementioned Fig.12 and Fig.13 The description related to the inner lens 210B being mounted on the second die substrate 100B in the illustrated embodiment will not be repeated here.

[0090] In this application Fig.12 and Fig.13 In the embodiment shown in the figure and its related text description, the shaping of the optical signal is achieved by the shaping lens lens Z. The connection strength and structural strength of the inner lens 210B are increased by the connecting portion L to increase the process reliability. At the same time, in some scenarios, in order to enable the inner lens 210B to bring better coupling efficiency, etc., the size of the inner lens 210B can be increased to increase the size of the beam waist mode field. When the size of the inner lens 210B is increased, the use of the connecting portion L can ensure the stability and reliability of the installation of the inner lens 210B.

[0091] In some possible implementations, based on the above Fig.13 Based on the embodiment shown, the transmission part C can be processed into different shapes. In some examples, the transmission part C can be as follows Fig.13 In some examples, such as Fig.14 As shown, the transmission part C can be a structure with light turning. In the embodiment of the present application, based on 3D printing technology, the result of the inner lens 210B can be designed more flexibly to meet the light transmission requirements in different scenarios. For example, different built-in light processing devices 300B can have a more flexible position design in the avoidance groove 120B. Alternatively, the inner lens 210B can be optically coupled with the waveguide and / or the built-in light processing device 300B in the avoidance groove 120B in the form of grating coupling or edge coupling. It should be noted that when the transmission part C and the shaping lens lensZ structure are generated by 3D printing technology, there is a certain connection structure between the transmission part C itself and the installed device. For example, it can be expressed as a small gripper bonded to the built-in light processing device 300B or the second grain substrate 100B. However, this small gripper form is not the structure of the connection part L recorded in the embodiment of the present application. The connection part L of the embodiment of the present application is a connection fixing structure that is significantly longer than the small gripper structure.

[0092] In some possible implementations, the inner lens 210B may be mounted on the second die substrate 100B by means other than the connection portion C. For example, a mounting notch may be machined on the second die substrate 100B to fix the inner lens 210B. Fig.12 , Fig.13 and Fig.14In the illustrated embodiment, the method of generating the connection portion L based on 3D printing technology can greatly increase the bonding area between the inner lens 210B and the die substrate 100B, and the bonding surface is increased from 1 to 2, which can greatly improve the bonding strength between the inner lens 210B and the die substrate 100B, and its long-term reliability performance can also be greatly improved.

[0093] In some possible implementations, such as Fig.11 In the embodiment shown, the built-in optical processing device 300B may include a passive optical device, such as Fig.15 As shown, the inner lens 210B includes a first inner lens 211B and a second inner lens 212B. The waveguide 110B includes a first waveguide 111B. Wherein: the first end of the first waveguide 111B extends from the second crystal substrate 100B to the first inner side surface of the avoidance groove 120B. The first inner lens 211B is arranged at a position corresponding to the first waveguide 111B on the first inner side surface. The passive optical device 310B is arranged in the avoidance groove 120B and is located between the optical transmission path of the second inner lens 212B and the first inner lens 211B. The second inner lens 212B, the passive optical device 310B, the first inner lens 211B and the first waveguide 111B sequentially form a transmission path for the first optical signal. In the embodiment of the present application, the passive optical device 310B is used to perform certain optical processing on the optical signal. At this time, two lenses, the first inner lens 211B and the second inner lens 212B, can be arranged in the avoidance groove 120B. The second inner lens 212B shapes the first optical signal and transmits the shaped first optical signal to the passive optical device 310B. After the passive optical device 310B performs optical processing on the first optical signal, the optically processed first optical signal is transmitted to the first inner lens 211B. The first inner lens 211B performs spot shaping processing on the optically processed first optical signal and transmits the processed first optical signal to the first waveguide 111B. The first waveguide 111B carries the input first optical signal and continues to be subsequently transmitted and processed on the second die substrate 100B of the second optical chip 1000B.

[0094] For example, in Fig.15 In the embodiment shown, the second inner lens 212B can obtain the first optical signal from the second die substrate 100B. Fig.16As shown, a second waveguide 112B is also provided on the second grain substrate 100B. The first end of the second waveguide 112B extends from the second grain substrate 100B to the second inner side surface of the avoidance groove 120B. Wherein: the second inner lens 212B is arranged at a position corresponding to the first end of the second waveguide 112B; the second waveguide 112B is used to: transmit the first optical signal to the second inner lens 212B. In the embodiment of the present application, the second waveguide 112B of the second grain substrate 100B transmits the first optical signal to the second inner lens 212B in the avoidance groove 120B. The second inner lens 212B then performs spot shaping on the first optical signal, and then realizes the following Fig.15 The light transmission path is shown.

[0095] For example, in Fig.15 In the embodiment shown, the internal optical processing device 300B may include a passive optical device and an active optical device. The second internal lens 212B may input the first optical signal from the active optical device and implement the following Fig.15 The light transmission path is shown in Figure 2. Fig.17 As shown, the internal optical processing device 300B further includes a first active optical device 320B; the first active optical device 320B is arranged in the avoidance groove 120B; the first active optical device 320B is coupled with the second inner lens 212B. The first active optical device 320B is used to output a first optical signal to the second inner lens 212B.

[0096] For example, in the above Fig.15 , Fig.16 and Fig.17 In the illustrated embodiment, the optical chip obtained based on the second die substrate 100B may be a silicon optical chip. The passive optical device 310B may be a circulator or an isolator.

[0097] For example, in the above Fig.17 In the embodiment shown, the obtained second optical device 10000B can be a silicon optical modulator, which can be used to implement a client-side optical modulator. Among them, the passive optical device 310B can be an isolator, and the first active optical device 320B can be a distributed feedback (DFB) laser of III-V process.

[0098] In some possible implementations, such as Fig.15 , Fig.16 and Fig.17In the illustrated embodiment, the second inner lens 212B is specifically used to: shape the first optical signal into parallel light. The beam waist mode field of the second inner lens 212B is greater than the first value; the first value satisfies: the collimation distance of the first optical signal as parallel light is greater than the distance between the second inner lens 212B and the passive optical device 310B. In the embodiment of the present application, how to achieve optical transmission and optical processing between the inner lens 210B and the passive device in the avoidance groove 120B is a major design difficulty. Traditional 3D printed lenses are usually designed with a size between 3um and 10um, which is used to simplify the coupling between optical chips and optical fibers. There is no idea or demand in the industry to increase the size of 3D printed lenses, nor is there any idea or demand to use 3D printed lenses to improve the integration of optical chips. And it is usually used for optical coupling and coupling alignment design between optical chips and external discrete devices. In the process of using lenses to achieve optical transmission based on Gaussian beams, the laser beam will diverge laterally when propagating in space. When passing through such as Fig.12 , Fig.13 and Fig.14 When the lens structure shown is shaped to obtain parallel light, the optical signal appears as parallel light only within a certain collimation distance. Outside the collimation distance, it will still show divergent characteristics. This collimation distance can be regarded as the Rayleigh distance of a Gaussian beam (or called the Rayleigh length). The Rayleigh length (Rayleigh range) of a laser beam is the distance between its beam waist (in the propagation direction) and the point where the beam radius increases to the square root of 2. For a beam with a circular cross-section, it corresponds to the point when its mode area becomes twice as large. The beam waist mode field is the minimum spot mode field of the optical signal. Therefore, the use of traditional 3D printed lenses cannot meet the requirements of using an inner lens 210B and passive devices in the avoidance groove 120B to achieve optical transmission and optical processing. In the present application, Fig.15 , Fig.16 and Fig.17 In the embodiment shown, when it is necessary to transmit parallel light to the passive optical device 310B through the second inner lens 212B, the size of the second inner lens 212B can be enlarged to obtain a larger beam waist mode field, such as a beam waist mode field of 15um, 20um, 50um, etc. In this way, a Rayleigh length of more than 1200um can be obtained, and the collimation distance of the parallel light fully meets the design requirements in the avoidance zone. The embodiment of the present application can realize the application of the passive optical device 310B set in the avoidance groove 120B. At the same time, a design is provided on the inner lens 210B. Fig.12 , Fig.13 and Fig.14 The connecting portion L of the illustrated embodiment can ensure the reliability and stability of the inner lens 210B while increasing the size of the inner lens 210B.

[0099] In some possible implementations, such as Fig.11The built-in optical processing device 300B in the illustrated embodiment may include an active optical device. Fig.18 As shown, the internal optical processing device 300B includes a second active optical device 330B. The inner lens 210B includes a third inner lens 213B. The waveguide 110B includes a third waveguide 113B. The first end of the third waveguide 113B extends from the second die substrate 100B to the inner side of the avoidance groove 120B. The third inner lens 213B is mounted on the second active optical device 330B and is located at a position corresponding to the first end of the third waveguide 113B. Among them: the second active optical device 330B is used to: output a second optical signal to the third inner lens 213B. The third inner lens 213B is used to: shape the second optical signal; output the shaped second optical signal to the first end of the third waveguide 113B. In the embodiment of the present application, other external discrete active devices can be set as active optical devices (such as the second active optical device 330B) in the avoidance groove 120B. The second optical signal is generated or output to the third inner lens 213B by the second active optical device 330B. For example, the third inner lens 213B can shape the second optical signal outputted by the second active optical device 330B as divergent light into convergent light, and transmit the second optical signal as convergent light to the third waveguide 113B of the second die substrate 100B, and the carried second optical signal is processed and transmitted on the second die substrate 100B through the third waveguide 113B. In the embodiment of the present application, the external discrete active device in the traditional technology can be integrated as an active optical device in the second optical chip 1000B through the avoidance groove 120B and the inner lens 210B, thereby omitting the coupling process and coupling structure of the active optical device, and greatly reducing the device cost and area overhead of the optical chip.

[0100] In some possible implementations, such as Fig.19 As shown, at least one 3D printed lens 200B also includes an outer lens 220B. The waveguide 110B also includes a fourth waveguide 114B. The first end of the fourth waveguide 114B extends from the second grain substrate 100B to the outer side surface of the second grain substrate 100B. The outer lens 220B is arranged at a position corresponding to the first end of the fourth waveguide 114B on the second grain substrate 100B. Among them: the fourth waveguide 114B is used to: transmit the third optical signal to the outer lens 220B. The outer lens 220B is used to: shape the third optical signal and transmit the shaped third optical signal. In the embodiment of the present application, the outer surface of the second grain substrate 100B of the second optical chip 1000B can be realized by the outer lens 220B.

[0101] For example, Fig. 20As shown, the second optical device 10000B may also include at least one second external discrete device 3000B. These second external discrete devices 3000B are devices that cannot be integrated such as the second optical chip 1000B or can be integrated but not integrated into the second optical chip 1000B. At this time, the second optical chip 1000B also includes a second packaging coupling structure 400B. The second optical chip 1000B is coupled to at least one second external discrete device 3000B through the second packaging coupling structure 400B and the external second optical fiber fiber2. At this time, in order to reduce the cost and area overhead brought by the second packaging coupling structure 400B, in the embodiment of the present application, the external lens 220B obtained by 3D printing technology forms an SSC, which can perform spot shaping and mode expansion on the third optical signal output by the fourth waveguide 114B of the second optical chip 1000B. And the third optical signal after spot shaping is aligned and transmitted to the external optical fiber fiber2 to realize the optical signal interaction between the second optical chip 1000B and at least one second external discrete device 3000B. The third optical signal after mode expansion has higher alignment and coupling efficiency, thereby reducing the requirements on the process and structure of the second packaging coupling structure 400B, so as to reduce the cost and area overhead caused by packaging coupling.

[0102] In some possible implementations, such as Fig.21 As shown, the outer lens 220B is an elliptical lens structure. Fig.21 Figure (a) is a side view of the outer lens 220B. Fig.21 Figure (b) is a top view of the outer lens 220B. In the figure, x is the vertical spot diameter of the outer lens 220B, y is the horizontal spot diameter of the outer lens 220B, and x is not equal to y. In an embodiment of the present application, usually, the horizontal light field limitation factor and the vertical light field limitation factor of the optical chip waveguide are different, which will make the light output spot of the optical chip elliptical rather than circular. The fiber spot of the commonly used external optical fiber is circular. Therefore, there is additional coupling insertion loss between the light output spot of the waveguide of the optical chip and the coupled fiber spot. By setting the external lens 220B to an elliptical lens structure with different vertical and horizontal curvatures, the third optical signal of the elliptical spot output by the fourth waveguide 114B of the second optical chip 1000B is converted into a third optical signal of a circular spot and emitted to the second optical fiber fiber2, so as to reduce the coupling insertion loss and improve the coupling efficiency.

[0103] For example, according to different actual designs and application requirements, the second optical chip 1000B may transmit optical signals to an external discrete device through an external lens 220B, or may obtain optical signals from an external discrete device through an external lens 220B.

[0104] For the technical principles and technical effects of the design structure of the outer lens 220B, please refer to the aforementioned Fig.12 , Fig.13 and Fig.14 The relevant description of the embodiment of the inner lens 210B is not repeated here. The outer lens 220B is coupled to the outer edge of the second die substrate 100B through the connection portion L to achieve edge coupling.

[0105] The present application also provides a method for manufacturing the above-mentioned Fig.11 , Fig.12 , Fig.13 , Fig.14 , Fig.15 , Fig.16 , Fig.17 , Fig.18 , Fig.19 , Fig. 20 and Fig.21 The second optical device 10000B or the second optical chip 1000B of the structure shown in FIG. Fig. 22 As shown, the manufacturing method includes the following operations from step S100 to step S600:

[0106] S100, etching a grain array on wafer 1.

[0107] In the embodiments of the present application, Fig. 22 As shown, the die array includes a plurality of second die dies dies 2. A waveguide 110B is disposed on the second die substrate 100B of each second die dies dies 2. An avoidance groove 120B is formed on the outer surface of the second die substrate 100B.

[0108] In some possible implementations, such as Fig.15 As shown, when the built-in optical processing device 300B includes a passive optical device 310B, the waveguide 110B constructed in step S100 includes a first waveguide 111B. The first end of the first waveguide 111B extends from the second die substrate 100B to the first inner side surface of the avoidance groove 120B.

[0109] In some possible implementations, such as Fig.16 As shown, a second waveguide 112B can also be processed on the second die substrate 100B. The first end of the second waveguide 112B extends from the second die substrate 100B to the second inner side surface of the avoidance groove 120B. According to the transmission turning direction, coupling mode, etc. of the inner lens 210B used in the design, the first inner side surface and the second inner side surface can be opposite surfaces (for example, the inner lens 210B is an edge coupling form under straight-through transmission), or the first inner side surface and the second inner side surface can also be adjacent surfaces (for example, the inner lens 210B is a grating coupling or edge coupling form under turning transmission).

[0110] In some possible implementations, before executing step S100, the wafer wafer1 may be cleaved, that is, the die array is cut into rows (or columns) of main pieces, each of which includes a plurality of second dies die2. Then, subsequent operations are performed on the plurality of second dies die2 on each main piece.

[0111] S200 , installing the built-in light processing device 300B and processing the 3D printed lens 200B.

[0112] In some examples, when a certain 3D printed lens 200B is installed on the second die substrate 100B, at least one 3D printed lens 200B may be etched out based on the 3D printing technology, and then the built-in light processing device 300B may be installed in the avoidance groove 120B. Alternatively, the built-in light processing device 300B may be installed in the avoidance groove 120B, and then at least one 3D printed lens 200B may be etched out on the second die substrate 100B based on the 3D printing technology.

[0113] In some examples, when a certain 3D printed lens 200B is disposed on a built-in light processing device 300B, the built-in light processing device 300B may be first installed in the avoidance groove 120B, and then at least one 3D printed lens 200B may be etched out based on 3D printing technology.

[0114] In some possible implementations, such as Fig.15 As shown, when the built-in optical processing device 300B includes a passive optical device 310B. The waveguide 110B obtained by the architecture in step S100 includes a first waveguide 111B. The first end of the first waveguide 111B extends from the second crystal substrate 100B to the first inner side surface of the avoidance groove 120B. At this time, the following operations are specifically performed in step S200: the first inner lens 211B is etched at a position corresponding to the first waveguide 111B on the first inner side surface. The passive optical device 310B is installed in the avoidance groove 120B and is located between the optical transmission path of the second inner lens 212B and the first inner lens 211B; the second inner lens 212B, the passive optical device 310B, the first inner lens 211B and the first waveguide 111B form a transmission path for the first optical signal in a transmission order.

[0115] In the application embodiment of step S200, the inner lens 210B, the outer lens 220B, and the internal optical processing device 300B can be processed and manufactured. Based on the operations recorded in the above embodiment, according to the different integrated designs of the second optical chip 1000B, the above can be processed in step S200. Fig.12 , Fig.13 , Fig.14 , Fig.15 , Fig.16 , Fig.17 , Fig.18 , Fig.19 , Fig. 20 and Fig.21 The second die substrate 100B structure, the 3D printed lens 200B structure and the built-in light processing device 300B structure. For the specific structure of the processing, please refer to the text description of the related embodiments of the aforementioned hardware, which will not be repeated here.

[0116] In some possible implementations, taking the second optical device 10000B as an optical signal transceiver device as an example, Fig.23 and Fig.24 As shown, Fig.23 Figure (a) is a schematic diagram of the architecture of the coherent optical transceiver B1 in coherent optical communication. In the figure, the coherent optical transceiver B1 includes a digital processor DSP1, an adjustable light source B11, a coherent receiver ICR, a coherent transmitter ICT, an optical fiber amplifier EDFA, etc. In some examples, taking the second optical chip 1000B as an optical chip in the coherent receiver ICR as an example, the corresponding adjustable light source B11 can be integrated into the second optical chip 1000B as an active optical device 320B and packaged to obtain Fig.23 The structure shown in Figure (b). Fig.23 There are only three optical devices in Figure (b), compared with Fig.23 Of the five optical devices in FIG. (a), two fiber fusion points can be omitted. Alternatively, some or all of the adjustable light source B11, the coherent receiver ICR, the coherent transmitter ICT, and other devices are integrated into a second optical device 10000B, etc., so as to further reduce the fiber fusion points between the discrete optical devices. In some examples, Fig.24 Figure (a) is a schematic diagram of the architecture of a direct-modulation optical transceiver device B2 under direct-modulation optical communication. In the figure, the direct-modulation optical transceiver device includes a digital processor DSP1, a receiver R1, a light source B21 and a silicon optical modulator T1. In the embodiment of the present application, the light source B21 and the silicon optical modulator T1 can be integrated together to manufacture a second optical device 10000B, thereby obtaining Fig.24 (b) The architecture of Figure . Fig.24 In the architecture of FIG. (b), two discrete optical devices are integrated into a second optical device 10000B, and one fiber splicing point can be omitted.

[0117] For example, in Fig.16 In the embodiment shown, the passive optical device 310B of the second optical chip 1000B based on SiPh process and integrated with polarization-dependent optical isolator (ISO) is taken as an example. Fig.25As shown, the first optical isolator ISO1 includes a first polarizer ISO11, a first Faraday rotator ISO12, a second polarizer ISO13 and a half-wave plate ISO14 in sequence. The second waveguide 112B as an output waveguide is optically coupled with the second inner lens 212B, and the first waveguide 111B as an output waveguide is optically coupled with the first inner lens 211B. The second inner lens 212B obtains a sufficiently long Rayleigh length by expanding the mode, so as to realize the shaping of the divergent light output by the second waveguide into parallel light and transmit it to the optical isolator ISO1. Along the optical transmission path, the first inner lens 210B shapes the parallel light into convergent light and transmits it to the first waveguide 111B. When transmitting along the incident light direction, the polarization state of the optical signal is a transverse electric (TE) mode, and the polarization direction of the forward incident light is the same as the polarization direction of the first polarizer ISO11 and the second polarizer ISO13, and the transmission insertion loss is small. When the light passes in the reverse direction, the polarization direction of the optical signal at the first polarizer ISO11 and the second polarizer ISO13 is orthogonal to the polarization state of the light beam, so that the reverse light transmission isolation can be achieved.

[0118] For example, Fig.16 The passive optical device 310B is Fig.26 The second optical isolator ISO2 in the embodiment. The second optical isolator ISO2 is a polarization-independent optical isolator, which includes a first yttrium vanadate ISO21, a second Faraday rotator ISO22, and a second yttrium vanadate ISO23 in sequence. Fig.26 As shown in FIG. (a), the second inner lens 220B can transmit an optical signal to the first inner lens 210B through the second optical isolator ISO2. Fig.26 As shown in FIG. 2( b ), the first inner lens 210B may also transmit an optical signal to the second inner lens 220B via the second optical isolator ISO2 .

[0119] For example, Fig.16 In the illustrated embodiment, multiple optical transmission paths can be formed by the passive optical device 310B. For example, multiple optical signals are obtained based on a polarization splitter and rotator (PSR), and the multiple optical signals are optically processed separately based on the passive optical device 310B. Fig. 27 As shown, Fig.16 The passive optical device 310B shown is Fig.25Taking the polarization-related first optical isolator ISO1 as an example, a first polarization separation rotator PSR1 and a second polarization separation rotator PSR2 are also processed in the second die substrate 100B of the second optical chip 1000B. The first polarization separation rotator PSR1 can convert and separate the TE mode and transverse magnetic (TM) mode light beams into two TE mode light signals, which are respectively transmitted to the two second waveguides 112B, and are transmitted to the second polarization separation rotator PSR2 through the two second waveguides 112B, the two second inner lenses 220B, the first optical isolator ISO1, the two first inner lenses 210B and the two first waveguides 111B. The second polarization separation rotator PSR2 combines the two TE mode light signals to obtain TE mode and TM mode light beams.

[0120] For example, Fig.25 and Fig. 27 Taking the polarization-related ISO as an example, the polarization direction of the forward light incident light is exactly the same as the polarization direction of the polarizer, and the transmission insertion loss L is small. When the light is reversed, the polarization direction of the light beam at the P1 polarizer is orthogonal to the polarization state of the light beam, and finally the reverse light isolation is achieved. Fig.28 Figure (a) is a schematic diagram of the isolation effect. Fig.28 Figure (b) is a schematic diagram of the effect of wavelength depend loss (WDL) between the two waveguides. Taking the optical signal in the C band as an example, the isolation is greater than 20dB. At the same time, the overall insertion loss level between the first waveguide 111B and the second waveguide 112B can be controlled within 2dB. It can be seen that based on the above Fig. 22 When the second optical chip 1000B is processed by the manufacturing method shown, it can be achieved that the optical capability is basically equivalent to the performance of the optical fiber type external isolator under the condition of greatly reduced cost and size.

[0121] In the above Fig.24 , Fig.25 , Fig.26 , Fig. 27 and Fig.28 The second optical chip 1000B is used in an optical communication scenario as an example. However, the solution described in this application can also be applied to scenarios based on optical signal processing, such as fronthaul networks in the field of wireless communication technology, industrial lasers, bump lasers, optical sensing, optical measurement, and medical imaging.

[0122] For example, Fig.29As shown, it is a top view of the second die substrate 100B of the second optical chip 1000B. A plurality of 3D printed lenses 200B may be provided on the second optical chip 1000B, and the plurality of 3D printed lenses 200B include an inner lens coupled with an internal optical processing device 300B (including a passive optical device 310B, a first active optical device 320B or a second active optical device 330B, etc.), and also include an outer lens for coupling with a second external discrete device 3000B, etc. The embodiment of the present application can greatly reduce the cost and device area overhead of the optical chip based on different lenses.

[0123] For example, Fig.30 As shown in Figure (a), it is a simulation diagram of the beam waist mode field of the traditional SSC based on the III-V process in the first optical device 10000A, and the beam waist mode field simulation result is 3.4um*2.7um. Fig.30 As shown in FIG. (b), it is a simulation diagram of the beam waist mode field of the 3D printing process based on the III-V process in the second optical device 10000B, and the beam waist mode field simulation result is 40.4um*45.8um. Fig.30 As shown in FIG. (c), it is a simulation schematic diagram of the beam waist mode field of the conventional SSC based on SiPh process in the first optical device 10000A, and the simulation result of the beam waist mode field is 9um*7.5um. Fig.30 As shown in Figure (d), it is a simulation diagram of the beam waist mode field of the 3D printing process based on the SiPh process in the second optical device 10000B, and the beam waist mode field simulation result is 47um*61.4um. Compared with the SSC of the III-V process and SiPh process, the 3D printed lens obtained by 3D printing in the embodiment of the present application can have a mold expansion capability of more than 20 times. Based on the 3D printing process, the chip area of ​​the optical chip does not need to be occupied, the processing and design freedom of the lens is higher, and it will not affect the yield rate of the optical chip production.

[0124] The comparison of various parameters for spot shaping and mold expansion based on III-V process, SiPh process and 3D printing process is shown in Table 1 below:

[0125] Table 1

[0126]

[0127] In some possible implementations, the second die die2 may be tested before or after step S200 to screen out qualified die.

[0128] In some possible implementations, after processing the inner lens 210B, the outer lens 220B, the internal light processing device 300B and other structures, the qualified die can be cut from the main handle or wafer 1 to perform the subsequent step S300.

[0129] S300 , packaging the second chip die2.

[0130] In the embodiment of the present application, the qualified second die 2 is packaged to obtain a packaged second optical chip 1000B.

[0131] In some possible implementations, when the second optical chip 1000B includes an external lens 220B, the second optical chip 1000B needs to design a corresponding second packaging coupling structure 400B and other packaging structures for the external lens 220B.

[0132] S400 , testing the second optical chip 1000B.

[0133] In the embodiment of the present application, according to the test of the second optical chip 1000B, the qualified second optical chip 1000B is screened out as the final product.

[0134] Based on the above Fig. 22 The manufacturing method described above Fig.30 From the records in Table 1, we can see that: Figure 6 When the first optical chip 1000A is used for spot shaping based on a double lens, its cost and area expenditure can be Figure 2 As shown. Figure 7 , Figure 8 and Fig. 9 In the spot shaping scenario shown in the figure, the coupling efficiency is improved by mode expansion, which can be Figure 2 On the basis of , the coupling process and the area of ​​the coupling structure are reduced to a certain extent, but the reduction in cost and area overhead is limited. In the embodiment of the present application using the second optical chip 1000B, on the basis of omitting the packaging coupling structure or greatly reducing the optical coupling structure, the cost and integration of the second optical chip 1000B can reach or approach Figure 1 At the same time, the second optical chip 1000B of the present application can also realize the optical chip and the electrical chip packaging on the same platform.

[0135] The second optical chip 1000B can be obtained based on the manufacturing method of step S100 to step S400. On the basis of obtaining the second optical chip 1000B, the manufacturing method of step S500 to step S600 can be further performed to obtain the second optical device 10000B:

[0136] S500 , packaging the second optical device 10000B.

[0137] In some examples, when there is no second external discrete device 3000B in the second optical device 10000B, the second optical chip 1000B is mounted on the mounting liner 2000B and packaged to obtain the corresponding second optical device 10000B. In some examples, when there is a second external discrete device 3000B in the second optical device 10000B, the second optical chip 1000B and the second external discrete device 3000B need to be mounted together on the mounting liner 2000B to package the second optical device 10000B. Compared with optical devices manufactured using traditional packaging processes, the area of ​​the second optical device 10000B manufactured using the packaging process of the embodiment of the present application is greatly reduced, and its area overhead can be close to the area overhead of the electrical chip.

[0138] S600. Test the second optical device 10000B.

[0139] By testing the second optical device 10000B, qualified products are screened out as final products.

[0140] The embodiments of the present application propose an optical chip, an optical device, a manufacturing method, an optical module and an optical processing device. First, an avoidance groove is processed on the outer surface of the crystal substrate of the optical chip. An internal lens and a built-in optical processing device are arranged in the avoidance groove. By processing the traditional external discrete device as a built-in optical processing device in the optical chip, and realizing the processing and interaction of optical signals through the internal lens obtained by 3D printing and the waveguide of the built-in optical processing device and / or the crystal substrate. In this way, the original packaging coupling structure between the external discrete device and the optical chip can be omitted, which greatly reduces the cost and area overhead of the optical signal and improves the miniaturization and integration of the optical chip. Second, an external lens is processed at the edge of the crystal substrate of the optical chip, and the mold expansion is realized by the external lens, so as to improve the optical port coupling efficiency of the second optical chip, thereby reducing the requirements for the packaging coupling structure between the optical chip and the external discrete device, so as to reduce the cost and area overhead. Third, by manufacturing an optical chip through the optical chip manufacturing method, a common packaging platform for the optical chip and the electrical chip can be realized. Fourth, compared with traditional lenses, this application increases the size of the 3D printed lens, improves the mode expansion capability and coupling efficiency, and realizes the integration of passive optical devices in the optical chip. Fifth, in the optical chip, a connection portion is set in the 3D printed lens to improve the reliability and stability of the lens. Sixth, the 3D printed lens is set as an elliptical lens to improve the coupling efficiency between the waveguide spot of the optical chip and the optical fiber spot outside the optical chip, and reduce the coupling insertion loss. Seventh, an optical device is obtained based on the above optical chip, and the optical device can have all the advantages and beneficial effects related to the above optical chip.

[0141] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0142] Those of ordinary skill in the art will appreciate that the modules and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0143] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and modules described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0144] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation, such as multiple modules or components can be combined or integrated into another device, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.

[0145] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one device or distributed on multiple devices. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0146] In addition, each functional module in each embodiment of the present application may be integrated into one device, or each module may exist physically separately, or two or more modules may be integrated into one device.

[0147] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using a software program, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loading and executing a computer program instruction on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (Digital Subscriber Line, DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium may be any available medium that a computer can access or may contain one or more servers, data centers and other data storage devices that can be integrated with a medium. The available medium may be a magnetic medium (eg, a floppy disk, a hard disk, a magnetic tape), an optical medium (eg, a DVD), or a semiconductor medium (eg, a solid state disk (SSD)).

[0148] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An optical chip, characterized in that: The invention comprises a crystal substrate, at least one 3D printed lens and a built-in light processing device; a waveguide is arranged on the crystal substrate; an avoidance groove is formed on the outer surface of the crystal substrate; the at least one 3D printed lens comprises an inner lens; the inner lens and the built-in light processing device are arranged in the avoidance groove, and the inner lens is coupled to the crystal substrate or the built-in light processing device; wherein: the inner lens is used for: The optical signal is shaped; and the optical signal is transmitted with the waveguide and / or the built-in optical processing device.

2. The optical chip according to claim 1, characterized in that: The built-in optical processing device includes a passive optical device; the inner lens includes a first inner lens and a second inner lens; the waveguide includes a first waveguide; wherein: The first end of the first waveguide extends from the grain base to the first inner side surface of the avoidance groove; the first inner lens is arranged at a position on the first inner side surface corresponding to the first waveguide; the passive optical device is arranged in the avoidance groove and is located between the light transmission path of the second inner lens and the first inner lens; the second inner lens, the passive optical device, the first inner lens and the first waveguide sequentially form a transmission path for a first optical signal.

3. The optical chip according to claim 2, characterized in that: A second waveguide is also disposed on the crystal substrate; a first end of the second waveguide extends from the crystal substrate to the second inner side surface of the avoidance groove; wherein: The second inner lens is disposed at a position corresponding to the first end of the second waveguide; and the second waveguide is used to transmit the first optical signal with the second inner lens.

4. The optical chip according to claim 2, characterized in that: The internal optical processing device further includes a first active optical device; the first active optical device is arranged in the avoidance groove; the first active optical device is coupled with the second internal lens; wherein: The first active optical device is used to transmit the first optical signal to the second inner lens.

5. The optical chip according to any one of claims 2 to 4, characterized in that: The second inner lens is specifically used for: The first optical signal is shaped into parallel light; the beam waist mode field of the second inner lens is greater than a first value; the first value satisfies: making the collimation distance of the first optical signal as parallel light greater than the distance between the second inner lens and the passive optical device.

6. The optical chip according to claim 1, characterized in that: The built-in optical processing device includes a second active optical device; the inner lens includes a third inner lens; the waveguide includes a third waveguide; the first end of the third waveguide extends from the die substrate to the inner side of the avoidance groove; the third inner lens is mounted on the second active optical device and is located at a position corresponding to the first end of the third waveguide; wherein: The second active optical device is used to: transmit a second optical signal with the third inner lens; The third inner lens is used to: shape the second optical signal; and transmit the shaped second optical signal to the first end of the third waveguide.

7. The optical chip according to any one of claims 1 to 6, characterized in that: The at least one 3D printed lens further includes an outer lens; the waveguide further includes a fourth waveguide; the first end of the fourth waveguide extends from the grain substrate to the outer side surface of the grain substrate; the outer lens is arranged at a position on the grain substrate corresponding to the first end of the fourth waveguide; wherein: The fourth waveguide is used to: transmit a third optical signal with the outer lens; The outer lens is used to: shape the third optical signal and transmit the shaped third optical signal.

8. The optical chip according to claim 7, characterized in that: The optical chip further comprises a packaging coupling structure; the external lens is used for transmitting the shaped third optical signal with the packaging coupling structure.

9. The optical chip according to claim 7 or 8, characterized in that: The outer lens is an elliptical lens structure.

10. The optical chip according to any one of claims 1 to 9, characterized in that: The inner lens and / or the outer lens comprises a connecting portion and a shaping lens; wherein: The shaping lens of the inner lens is coupled to the die substrate or the built-in light processing device through the corresponding connecting portion; The reshaping lens of the outer lens is coupled to the die substrate via the corresponding connecting portion.

11. The optical chip according to any one of claims 1 to 10, characterized in that: The inner lens and / or the outer lens comprises a connecting portion, a transmission portion and a shaping lens; wherein: The shaping lens of the inner lens is coupled to the corresponding transmission part; the transmission part of the inner lens and / or the shaping lens are also coupled to the die substrate or the built-in light processing device through the connecting part; The shaping lens of the outer lens is coupled to the corresponding transmission part; the transmission part of the outer lens and / or the shaping lens are also coupled to the grain substrate through the connecting part.

12. An optical device, characterized in that: It comprises a mounting plate and an optical chip; the optical chip is arranged on the mounting plate; the optical chip comprises a grain substrate, at least one 3D printed lens and a built-in optical processing device; a waveguide is arranged on the grain substrate; an avoidance groove is formed on the outer surface of the grain substrate; the at least one 3D printed lens comprises an inner lens; the inner lens and the built-in optical processing device are arranged in the avoidance groove, and the inner lens is coupled to the grain substrate or the built-in optical processing device; wherein: the inner lens is used to: shape the optical signal; and transmit the optical signal with the waveguide and / or the built-in optical processing device.

13. The optical device according to claim 12, characterized in that: The optical device also includes at least one external discrete device; the at least one 3D printed lens of the optical chip also includes an external lens; the at least one external discrete device is arranged on the mounting substrate; the external lens is coupled to the outer side surface of the grain substrate of the optical chip; the optical chip realizes optical communication coupling with the at least one external discrete device through the external lens.

14. A manufacturing method, characterized in that: For manufacturing an optical chip; the method comprises: A crystal array is etched on a wafer; a waveguide is arranged on a crystal base of each crystal in the crystal array; and an avoidance groove is formed on an outer surface of the crystal base; A built-in optical processing device is installed in the avoidance groove, and at least one 3D printed lens is etched based on 3D printing technology; the at least one 3D printed lens includes an inner lens; the inner lens is arranged in the avoidance groove, and the inner lens is coupled to the grain substrate or the built-in optical processing device; the inner lens is used to: shape the optical signal; and transmit the optical signal with the waveguide and / or the built-in optical processing device.

15. The manufacturing method according to claim 14, characterized in that: The built-in optical processing device includes a passive optical device; the inner lens includes a first inner lens and a second inner lens; the waveguide includes a first waveguide; the first end of the first waveguide extends from the die base to the first inner side surface of the avoidance groove; The etching of at least one 3D printed lens comprises: etching the first inner lens at a position on the first inner side surface corresponding to the first waveguide; The installing of the built-in optical processing device in the avoidance groove comprises: installing the passive optical device in the avoidance groove and being located between the optical transmission path of the second inner lens and the first inner lens; the second inner lens, the passive optical device, the first inner lens and the first waveguide form a transmission path for the first optical signal in a transmission order.

16. The manufacturing method according to claim 15, characterized in that: A second waveguide is also disposed on the crystal grain substrate; a first end of the second waveguide extends from the crystal grain substrate to a second inner side surface of the avoidance groove; The etching of at least one 3D printed lens further includes: etching the second inner lens at a position corresponding to the first end of the second waveguide; the second waveguide is used for: transmitting the first optical signal with the second inner lens.

17. The manufacturing method according to claim 15, characterized in that: The built-in optical processing device also includes a first active optical device; The step of installing the built-in optical processing device in the avoidance groove further comprises: placing the first active optical device in the avoidance groove; The etching of at least one 3D printed lens further includes: etching the second inner lens on the first active optical device; the first active optical device is used to: output the first optical signal with the second inner lens.

18. The manufacturing method according to claim 14, characterized in that: The internal optical processing device includes a second active optical device; the internal lens includes a third internal lens; the waveguide includes a third waveguide; the first end of the third waveguide extends from the die base to the inner side of the avoidance groove; The step of installing the built-in optical processing device in the avoidance groove comprises: installing the second active optical device in the avoidance groove; The etching of at least one 3D printed lens includes: etching the third inner lens on the second active optical device and locating it at a position corresponding to the first end of the third waveguide; the second active optical device is used to: output a second optical signal with the third inner lens; the third inner lens is used to: shape the second optical signal; and output the shaped second optical signal with the first end of the third waveguide.

19. The manufacturing method according to any one of claims 14 to 18, characterized in that: The at least one 3D printed lens further includes an outer lens; the waveguide further includes a fourth waveguide; a first end of the fourth waveguide extends from the grain substrate to the outer side surface of the grain substrate; The etching of at least one 3D printed lens further includes: etching the outer lens at a position on the grain substrate corresponding to the first end of the fourth waveguide; The fourth waveguide is used to transmit the third optical signal with the external lens; the external lens is used to shape the third optical signal and transmit the shaped third optical signal.

20. The manufacturing method according to any one of claims 14 to 19, characterized in that: The method further comprises: A packaging coupling structure is manufactured outside the crystal grain substrate to package the crystal grain substrate to obtain an optical chip; the external lens is used to transmit the shaped third optical signal with the packaging coupling structure.

21. A manufacturing method, characterized in that: For manufacturing an optical device, the method comprises: A crystal array is etched on a wafer; a waveguide is arranged on a crystal base of each crystal in the crystal array; and an avoidance groove is formed on an outer surface of the crystal base; An internal light processing device is installed in the avoidance groove, and at least one 3D printed lens is etched based on 3D printing technology; the at least one 3D printed lens includes an inner lens; the inner lens is arranged in the avoidance groove, and the inner lens is coupled to the grain substrate or the internal light processing device; the inner lens is used to: shape the optical signal; and transmit the optical signal with the waveguide and / or the internal light processing device; Performing chip packaging on the chip substrate to obtain an optical chip; The optical chip package is arranged on a mounting substrate to obtain the optical device.

22. The manufacturing method according to claim 21, characterized in that: The optical device further comprises at least one external discrete optical device; the optical device is obtained by placing the optical chip package on a mounting substrate, further comprising: The optical device is obtained by arranging the optical chip and the at least one external discrete optical device package on the mounting substrate.

23. An optical module, characterized in that: It comprises an optical fiber interface and an optical device as claimed in claim 12 or 13; the optical device is coupled to the optical fiber interface.

24. A light processing device, characterized in that The light processing device comprises a mounting plate and the optical device as claimed in claim 12 or 13; the optical device is arranged on the mounting plate; or, the light processing device comprises the mounting plate and the optical module as claimed in claim 23; the optical module is arranged on the mounting plate.

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