Camera module support and secondary processing method thereof

Abstract

The invention belongs to the technical field of mobile camera equipment, and particularly relates to a camera module support and a secondary processing method thereof.The secondary processing method comprises the following steps that cleaning is conducted, specifically, the surface of a support body is cleaned; plasma treatment is conducted, specifically, the cleaned support body is placed into plasma equipment to be subjected to plasma treatment; glue is brushed, specifically, glue is brushed on the bonding area set on the support body subjected to plasma treatment in a point mode; baking: putting the bracket main body subjected to glue dispensing into an oven for baking; molding: putting the baked bracket main body into a mold, and molding a silica gel strip in a bonding area, which is brushed with glue, of the bracket main body by injecting molten silica gel; and vulcanizing, namely putting the bracket main body on which the silica gel strip is formed into an oven, and meanwhile, vulcanizing and baking. The camera module support processed by the secondary processing method of the camera module support has good buffering and damping performance, excellent sealing performance, high temperature resistance and cold resistance.

Description

Technical Field

[0001] The invention belongs to the technical field of mobile camera equipment, and in particular relates to a camera module bracket and a secondary processing method thereof. Background Art

[0002] The bracket of the camera fixing module of traditional cameras is mainly composed of a plastic body and a steel sheet. The bracket and lens assembly of this structure have poor sealing problems, and will also cause abnormal noise when shaking during use. In addition, its structural rigidity is high, and it is easy to damage the components inside the bracket when subjected to impact, and its durability needs to be improved. Summary of the invention

[0003] The object of the present invention is to provide a camera module bracket and a secondary processing method thereof, aiming to at least solve one of the above-mentioned technical problems existing in the camera fixed module bracket in the prior art.

[0004] To achieve the above object, an embodiment of the present invention provides a secondary processing method of a camera module bracket, which is characterized by comprising the following steps:

[0005] S100: cleaning, cleaning the surface of the bracket body;

[0006] S200: Plasma, placing the cleaned bracket body into a plasma device for plasma treatment;

[0007] S300: applying glue, applying glue to the set bonding area on the support body that has been processed by plasma;

[0008] S400: Baking, putting the stent body after the dispensing into the oven for baking;

[0009] S500: molding, placing the baked stent body into a mold, and molding a silicone strip by injecting molten silicone into the bonding area of ​​the stent body where the glue is applied;

[0010] S600: Vulcanization: put the bracket body with the silicone strip into the oven and add sulfur and bake it at the same time.

[0011] Optionally, in step S100, first wet a dust-free cloth with alcohol to clean the cabin partitions and inner walls of the oven, and then wait for drying after cleaning; then use a clean dust-free cloth dipped in anhydrous ethanol to wipe the surface of the bracket body; then put the wiped bracket body into a clean tray; finally, place the tray in the oven for baking, the baking temperature is 80-100°C, and the baking time is 5-6 minutes.

[0012] Optionally, in step S200, the bracket body is placed in a mesh disk, the mesh disk is placed in a plasma device, and the oxygen and argon gas cylinder switches are turned on for plasma treatment, wherein the standard value of oxygen is 0.5-0.6 MPa, the standard value of argon is 0.5-0.6 MPa, and the plasma treatment time is 420-450 seconds.

[0013] Optionally, in step S300, a bamboo stick dipped in glue is applied to a set bonding area on the bracket body in a contactless manner.

[0014] Optionally, in step S400, first wet a dust-free cloth with alcohol to clean the cabin partitions and inner walls of the oven, and then wait for drying after cleaning; then put the bracket body with glue on it into a clean tray; finally, place the tray in the oven for baking, the baking temperature is 110-130°C, and the baking time is 10-12 minutes.

[0015] Optionally, in step S500, the upper cover plate of the mold is opened, the bracket body is placed in and pressed, and then the upper cover plate is closed, and molten silicone is injected at 110-150° C. until a silicone strip is formed on the bracket body.

[0016] Optionally, in step S600, first wet a dust-free cloth with alcohol to clean the cabin partitions and inner walls of the oven, and then wait for drying after cleaning; then place the bracket body into a clean screen; finally, place the screen in the oven for sulfur baking, the baking temperature is 80-100°C, and the baking time is 240-260 minutes.

[0017] Optionally, at least one connecting groove is provided at the bonding area of ​​the bracket body, a glue layer is provided in the connecting groove, a connecting boss is provided at a position of the silicone strip corresponding to the connecting groove, and the connecting boss is bonded to the connecting groove through the glue layer.

[0018] Optionally, a sink bulge is provided in the connecting sink, and a boss groove is provided in the connecting boss, and the boss groove is adapted to the sink bulge.

[0019] An embodiment of the present invention also provides a camera module bracket, which is formed by the secondary processing method of the camera module bracket mentioned above.

[0020] The above one or more technical solutions in the camera module bracket and the secondary processing method thereof provided by the embodiments of the present invention have at least one of the following technical effects: the camera module bracket processed by the secondary processing method of the camera module bracket of the present invention is an integral structure of plastic + hardware + silicone, which has good buffering and shock absorbing performance, and the silicone strip formed on the side of the bracket body made of plastic material is soft and elastic, which can effectively absorb the impact force and vibration of the camera module during use, protect the precision components inside the camera module, and reduce the risk of component damage or image quality degradation due to vibration; at the same time, it also has excellent sealing performance, can fit tightly with the outer casing of the camera module to form a good sealing effect, prevent dust, moisture and other impurities from entering the lens of the camera module, and ensure the optical performance and service life of the lens of the camera module; moreover, it is also resistant to high temperature and cold, and can maintain stable performance in a wide temperature range, whether in a high temperature environment or in cold conditions, it can ensure the normal operation of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 A schematic structural diagram of one direction of a camera module bracket provided in an embodiment of the present invention.

[0023] Figure 2 A schematic structural diagram of another direction of the camera module bracket provided in an embodiment of the present invention.

[0024] Figure 3 A schematic diagram of the structural decomposition of a camera module bracket provided in an embodiment of the present invention.

[0025] Figure 4 A schematic diagram of the structure of a silicone strip of a camera module bracket provided in an embodiment of the present invention.

[0026] Figure 5 A partial structural cutaway view of a camera module bracket provided in an embodiment of the present invention.

[0027] Figure 6 A flow chart of a secondary processing method for a camera module bracket provided in an embodiment of the present invention.

[0028] Among them, the reference numerals in the figure are:

[0029] 10—bracket body 11—connection sink 12—sink protrusion

[0030] 20—silicone strip 12—connecting boss 22—boss groove. DETAILED DESCRIPTION

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. Figures 1 to 6 The described embodiments are exemplary and are intended to be used to explain the embodiments of the present invention, but should not be construed as limiting the present invention.

[0032] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0035] In one embodiment of the present invention, Figure 6 As shown, a secondary processing method of a camera module bracket is provided, wherein the camera module bracket can be applied to the camera module of a camera.

[0036] Specifically, the secondary processing method of the camera module bracket includes the following steps:

[0037] S100: Cleaning, cleaning the surface of the bracket body 10; wherein the bracket body 10 itself has a hardware sheet;

[0038] S200: Plasma, placing the cleaned support body 10 into a plasma device for plasma treatment;

[0039] S300: Applying glue, applying glue to the set bonding area on the support body 10 that has completed the plasma treatment;

[0040] S400: baking, placing the support body 10 after the glue dispensing is completed into an oven for baking;

[0041] S500: molding, placing the baked bracket body 10 into a mold, and molding a silicone strip 20 by injecting molten silicone into the bonding area of ​​the bracket body 10 brushed with glue, and the silicone strip 20 protrudes from the side of the bracket body 10; after the silicone strip 20 is processed, the silicone strip 20 is exposed on the surface of the bracket body 10, so that the camera module bracket of the present invention is leveled and the horizontal plane is used as a reference plane, then the horizontal plane height of the top surface of the silicone strip 10 is higher than the horizontal plane height of the top surface of the bracket body 10;

[0042] S600: Vulcanization, putting the bracket body 10 formed with the silicone strip 20 into an oven, and performing vulcanization and baking at the same time, finally forming the camera module bracket provided by the embodiment of the present invention (see Figures 1 to 3 ).

[0043] The camera module bracket processed by the secondary processing method of the camera module bracket provided in the embodiment of the present invention is an integral structure of plastic + hardware + silicone, which has good buffering and shock absorbing performance. The silicone strip 20 formed on the side of the bracket body 10 made of plastic is soft and elastic, and can effectively absorb the impact force and vibration of the camera module during use, protect the precision components inside the camera module, and reduce the risk of component damage or image quality degradation due to vibration; at the same time, it also has excellent sealing performance, can fit tightly with the outer casing of the camera module to form a good sealing effect, prevent impurities such as dust and moisture from entering the lens of the camera module, and ensure the optical performance and service life of the lens of the camera module; moreover, it is also resistant to high temperature and cold, and can maintain stable performance in a wider temperature range, whether in a high temperature environment or in cold conditions, it can ensure the normal operation of the camera module.

[0044] In one embodiment of the present invention, in step S100, firstly wet a dust-free cloth with alcohol to clean the cabin partition and inner wall of the oven, and then dry it after cleaning; then use a clean dust-free cloth with anhydrous ethanol to wipe the surface of the bracket body 10; then put the clean bracket body 10 into a clean tray; finally, place the tray in the oven for baking, the baking temperature is 80-100°C, and the baking time is 5-6 minutes. For example, the baking temperature can be 80°C, 90°C or 100°C; the baking time is 5-6 minutes, and the baking time can be 5 minutes, 5 minutes and 30 seconds or 6 minutes.

[0045] Among them, the bracket body 10 is an incoming part, and its appearance needs to be inspected to ensure that the product appearance, size, and dyne value meet the standards. During the cleaning process of the bracket body 10, it cannot be touched directly by hand to avoid contamination of the bracket body 10. When wiping the surface of the bracket body 10, the staff needs to wear clean gloves to operate. In this way, sufficient preparation can be submitted for the subsequent injection molding process steps, so as to achieve more urgent and effective bonding work.

[0046] In one embodiment of the present invention, in the step S200, the support body 10 is placed in a mesh disk, the mesh disk is placed in a plasma device, and the oxygen and argon gas cylinder switches are turned on for plasma treatment, wherein the standard value of oxygen is 0.5-0.6MPa, and the standard value of argon is 0.5-0.6MPa. For example, the standard value of oxygen and the standard value of argon can be 0.5Mpa or 0.6Mpa. The plasma treatment duration is 420-450 seconds, for example, the plasma treatment duration can be 420 seconds, 430 seconds, 440 seconds or 450 seconds. In this step of the present embodiment, by plasma treatment of the clean support body 10, the bonding between the support body 10 and the silicone can be better achieved in the subsequent processing steps.

[0047] In one embodiment of the present invention, in step S300, a non-contact method is used to apply FY-435-C1 glue to a bamboo stick and apply it to a bonding area set on the bracket body 10. In this embodiment, glue is further applied to the bonding area set on the surface of the bracket body 10 so as to form a glue layer.

[0048] In one embodiment of the present invention, in the step S400, first wet a dust-free cloth with alcohol to clean the cabin partition and inner wall of the oven, and wait for drying after cleaning; then put the bracket body 10 brushed with glue into a clean tray; finally, place the tray in the oven for baking, the baking temperature is 110-130°C, for example, the baking temperature can be 110°C, 120°C or 130°C; the baking time is 10-12 minutes, and the baking time can be 10 minutes, 11 minutes or 12 minutes. In this embodiment, the glue layer can be softened by the baking process, and the softened glue layer has timeliness, so that the silicone strip 20 injected in the subsequent process can achieve a more stable and effective bonding with the glue layer, and then a silicone strip 20 can be formed on the side of the bracket body 10.

[0049] In one embodiment of the present invention, in step S500, the upper cover plate of the mold is opened, the bracket body 10 is placed and pressed, and then the upper cover plate is covered, and molten silica gel is injected at 110-150° C. until the silica gel strip 20 is formed on the bracket body 10. The silica gel strip 20 is formed on the side of the bracket body 10 by injection molding, and the silica gel strip 20 can be bonded to the glue layer, so that the silica gel strip 20 and the bracket body 10 can be stably connected.

[0050] In one embodiment of the present invention, in step S600, first wet a dust-free cloth with alcohol to clean the cabin partition and inner wall of the oven, and then dry it after cleaning; then put the bracket body 10 into a clean screen; finally, put the screen into the oven for sulfur baking, the baking temperature is 80-100°C, for example, the baking temperature can be 80°C, 90°C or 100°C; the baking time is 240-260 minutes, for example, the baking time can be 240 minutes, 250 minutes or 260 minutes. The last step is to implement sulfur treatment on the bracket body 10 formed with the silicone strip 20, further improve the wear resistance, high temperature resistance, and corrosion resistance of the silicone strip 20, and at the same time improve the surface gloss and touch of the silicone strip 20.

[0051] In one embodiment of the present invention, Figures 3 to 5 As shown, at least one connection groove 11 is provided at the bonding area of ​​the bracket body 10, a glue layer is provided in the connection groove 11, and a connection boss 12 is provided at the position of the silicone strip 20 corresponding to the connection groove 11, and the connection boss 12 is bonded to the connection groove 11 through the glue layer. In this embodiment, a specific structure is provided in the side bonding area of ​​the bracket body 10, namely, the connection groove 11, so that the silicone strip 20 formed at this position forms a connection boss 12 that is adapted to the structure of the connection groove 11, and the connection boss 12 is matched with the connection groove 11 through the concave-convex matching of the connection boss 12 and the connection groove 11, so as to further enhance the stability and reliability of the connection between the entire silicone strip 20 and the bracket body 10.

[0052] In one embodiment of the present invention, further, Figures 3 to 5 As shown, a groove protrusion 12 is provided in the connecting groove 11, and a boss groove 22 is provided in the connecting boss 12, and the boss groove 22 is adapted to the groove protrusion 12. In other words, the cooperation between the bracket body 10 and the silicone strip 20 not only has the concave-convex cooperation between the connecting boss 12 and the connecting groove 11, but also has the concave-convex cooperation between the boss groove 22 and the groove protrusion 12, so as to realize the stable cross concave-convex cooperation between the inner circle and the outer circle in the connecting area between the silicone strip 20 and the plastic body, and can more effectively enhance the reliability and stability of the connection between the silicone strip 20 and the bracket body 10.

[0053] There may be multiple bonding areas, which are set according to actual needs. For example, different numbers of bonding areas may be required for plastic brackets made of different materials.

[0054] Similarly, one connection groove 11 or two or more connection grooves 11 may be provided at the bonding area, and each connection groove 11 may also be provided with one groove protrusion 12 or two or more groove protrusions 12. Then correspondingly, corresponding positions and numbers of connection protrusions 12 and convex-concave grooves may be provided on the silicone strip 20 to cooperate with it for stable connection.

[0055] The embodiment of the present invention also provides a camera module bracket, which is formed by the secondary processing method of the camera module bracket. The camera module bracket processed by the secondary processing method of the camera module bracket of the embodiment of the present invention has good buffering and shock absorption performance, excellent sealing performance, and high temperature resistance and cold resistance.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A secondary processing method for a camera module bracket, characterized in that: The following steps are involved: S100: cleaning, cleaning the surface of the bracket body; S200: Plasma, placing the cleaned bracket body into a plasma device for plasma treatment; S300: applying glue, applying glue to the set bonding area on the support body that has been processed by plasma; S400: Baking, putting the stent body after the dispensing into the oven for baking; S500: molding, placing the baked stent body into a mold, and molding a silicone strip by injecting molten silicone into the bonding area of ​​the stent body where the glue is applied; S600: Vulcanization: put the bracket body with the silicone strip into the oven and add sulfur and bake it at the same time.

2. The secondary processing method of the camera module bracket according to claim 1, characterized in that: In the step S100, firstly wet a dust-free cloth with alcohol to clean the cabin partition and inner wall of the oven, and wait for drying after cleaning; then use a clean dust-free cloth dipped in anhydrous ethanol to wipe the surface of the bracket body; then put the cleaned bracket body into a clean tray; finally, place the tray in the oven for baking, the baking temperature is 80-100°C, and the baking time is 5-6 minutes.

3. The secondary processing method of the camera module bracket according to claim 1, characterized in that: In step S200, the bracket body is placed in a mesh disk, the mesh disk is placed in a plasma device, and the oxygen and argon gas cylinder switches are turned on for plasma treatment, wherein the standard value of oxygen is 0.5-0.6 MPa, the standard value of argon is 0.5-0.6 MPa, and the plasma treatment time is 420-450 seconds.

4. The secondary processing method of the camera module bracket according to claim 1, characterized in that: In the step S300, a bamboo stick dipped in glue is non-contactly applied to the bonding area set on the bracket body.

5. The secondary processing method of the camera module bracket according to claim 1, characterized in that: In step S400, first wet a dust-free cloth with alcohol to clean the cabin partitions and inner walls of the oven, and then wait for drying after cleaning; then put the bracket body with glue on it into a clean tray; finally, place the tray in the oven for baking, the baking temperature is 110-130°C, and the baking time is 10-12 minutes.

6. The secondary processing method of the camera module bracket according to claim 1, characterized in that: In the step S500, the upper cover plate of the mold is opened, the bracket body is placed in and pressed, and then the upper cover plate is closed, and molten silica gel is injected at 110-150° C. until a silica gel strip is formed on the bracket body.

7. The secondary processing method of the camera module bracket according to claim 1, characterized in that: In the step S600, first wet a dust-free cloth with alcohol to clean the cabin partitions and inner walls of the oven, and then wait for drying after cleaning; then put the bracket body into a clean screen; finally, place the screen in the oven for sulfur baking, the baking temperature is 80-100°C, and the baking time is 240-260 minutes.

8. The secondary processing method of the camera module bracket according to claim 1, characterized in that: At least one connecting groove is arranged at the bonding area of ​​the bracket body, a glue layer is arranged in the connecting groove, a connecting boss is arranged at a position of the silicone strip corresponding to the connecting groove, and the connecting boss is bonded to the connecting groove through the glue layer.

9. The secondary processing method of the camera module bracket according to claim 8, characterized in that: A sink bulge is arranged in the connecting sink, and a boss groove is arranged in the connecting boss, and the boss groove is matched with the sink bulge.

10. A camera module bracket, characterized in that: The camera module bracket is formed by the secondary processing method of any one of claims 1 to 9.

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