Portable skin cooling equipment

Abstract

The invention provides portable skin cooling equipment, and belongs to the technical field of skin cooling. The portable skin cooling equipment comprises a shell, a cavity is formed in the rear side of the shell, a connecting port is formed in the front side of the shell and used for connecting a water inlet pipe and a water outlet pipe, a cold compress pad is installed between the other end of the water inlet pipe and the other end of the water outlet pipe, and a cooling liquid circulation channel is formed in the cold compress pad. And the cooling liquid is driven to circulate through the circulating pump. By arranging the cooling mechanism, heat of the human skin is guided into cooling liquid and returns to the interior of the cooling liquid storage box, so that the human skin is cooled, at the moment, a semiconductor chilling plate is powered on, and heat generated by the heat release end of the semiconductor chilling plate is transferred to a first transfer plate. The cooling device can effectively cool the skin of the human body, is better in cooling effect and longer in cooling time, and is particularly suitable for being used when the skin is continuously in a high-temperature state.

Description

Technical Field

[0001] The present invention relates to the technical field of skin cooling and cooling, and in particular to a portable skin cooling and cooling device. Background Art

[0002] Skin cooling has important applications in daily life, medical treatment, sports and other fields. In the medical field, fever is an immune response of the body to the invasion of pathogens, but too high a body temperature may cause damage to the body, such as convulsions, coma, etc. Therefore, for patients with fever, timely skin cooling measures can help lower body temperature, relieve discomfort symptoms, and prevent further damage to the body caused by excessive body temperature.

[0003] When cooling human skin in existing equipment, the user usually holds an ice pack and applies ice, which gradually reduces the temperature of the human skin through the heat transfer effect. However, this method is slow to take effect and is far from meeting the needs when the patient's body temperature is high. Summary of the invention

[0004] In order to make up for the above deficiencies, the present invention provides a portable skin cooling device that overcomes the above technical problems or at least partially solves the above problems.

[0005] The present invention is achieved in that: The present invention provides a portable skin cooling device, comprising a shell, a cavity is provided on the rear side of the shell, a connection port is provided on the front side of the shell, a cooling mechanism is provided inside the cavity, and the cooling mechanism comprises: A mounting plate, the mounting plate is fixedly mounted on the top of the inner wall of the cavity, and a rotating rod is rotatably mounted on the bottom of the mounting plate; A connecting rod, wherein two connecting rods are provided and the two connecting rods are respectively fixedly mounted on the left and right sides of the rotating rod; A clamping ring, the clamping ring is rotatably mounted on an end of the connecting rod away from the rotating rod through a bearing, and a cooling cylinder is provided in an internal fixed sleeve of the clamping ring; A plurality of transfer rods are provided, and the transfer rods are slidably sleeved inside the bottom wall of the cooling cylinder. A first transfer plate is fixedly installed at the bottom of the transfer rod, and a second transfer plate is fixedly installed at the top of the transfer rod.

[0006] In a preferred solution, a fan is installed on the top of the cooling cylinder, a follower rod is fixedly installed on the output end of the fan, a plurality of limit plates are fixedly installed on the surface of the follower rod, a plurality of limit rings are fixedly sleeved between the limit plates, and the first transfer plate, the transfer rod and the second transfer plate are all made of heat conductive material.

[0007] In a preferred embodiment, a coolant storage tank is installed inside the cavity, coolant is stored inside the coolant storage tank, a semiconductor refrigeration plate is installed inside the top wall of the coolant storage tank, the heat release end of the semiconductor refrigeration plate is in contact with the bottom of the first transfer plate, an inspection door is installed on the rear side of the shell, a servo motor is installed on the mounting plate, and the output end of the servo motor is fixedly connected to the top of the rotating rod.

[0008] In a preferred solution, a reuse mechanism is provided inside the cooling cylinder, and the reuse mechanism includes a mold plate, and the mold plate is fixedly installed inside the cooling cylinder, and a plurality of square grooves are provided at the bottom of the mold plate.

[0009] In a preferred embodiment, an air inlet is provided at the top of the cooling cylinder, and a plurality of air inlet pipes are installed inside the side wall of the cooling cylinder. One end of the air inlet pipe is connected to the air inlet, and the other end of the air inlet pipe is located below the mold plate.

[0010] In a preferred solution, the second transfer plate is provided with a plurality of through holes extending vertically therethrough, the plurality of through holes and the plurality of square grooves are arranged in a ring array, and a liquid level sensor is installed on the inner wall of the cooling cylinder.

[0011] In a preferred solution, a flip mechanism is provided inside the cavity, and the flip mechanism comprises a connecting shaft, the connecting shaft is fixedly mounted on a side of the clamping ring away from the rotating rod, and a flip plate is fixedly mounted on the other end of the connecting shaft.

[0012] In a preferred solution, a flip shaft is fixedly installed on the other side of the flip plate, the center of the flip shaft and the center of the connecting shaft are staggered, the shape of the flip plate is set to be arc-shaped, and two eccentric wheels are fixedly sleeved on the rotating rod.

[0013] In a preferred embodiment, a sleeve is fixedly installed on the top of the inner wall of the cavity, the cross-section of the sleeve is circular, the bottom of the sleeve is open, a first stroke groove and a second stroke groove are provided on the inner wall of the sleeve, and a flip groove is provided between the first flip groove and the second flip groove.

[0014] In a preferred embodiment, the height of the first stroke groove is higher than the height of the connecting shaft, the height of the second stroke groove is lower than the height of the connecting shaft, two flip grooves are provided, the two flip grooves are respectively located on the front and rear sides of the inner wall of the sleeve, and are mirror-imaged along the axis, and the shape of the flip groove is set to be an arc.

[0015] The portable skin cooling device provided by the present invention has the following beneficial effects: 1. By setting up a cooling mechanism, the heat of the human skin is introduced into the coolant and returned to the inside of the coolant storage box, so as to cool the human skin. At this time, the semiconductor refrigeration plate is energized, and the heat generated by the heat release end of the semiconductor refrigeration plate is transferred to the first transfer plate. Compared with the existing technology, it is more effective to cool the human skin, the cooling effect is better, and the cooling time is longer, which is especially suitable for use when the skin is continuously in a high temperature state.

[0016] 2. By setting up a reuse mechanism, the position of the cooling cylinder that is in contact with the semiconductor refrigeration plate in the initial state is interchanged with the position of the cooling cylinder that is not in contact with the semiconductor refrigeration plate, and in this process the cooling cylinder flips 180 degrees and is in an upside-down state. At this time, the liquid heat sink flows back through the through hole and enters the mold groove on the mold plate. With the cooperation of the fan, it gradually cools down and changes from liquid to solid again, leaving it for the next use, so that the staff does not need to frequently add cooling materials.

[0017] 3. By setting up a flipping mechanism, the two cooling cylinders flip themselves when their positions are interchanged. When the rotating rod rotates, it drives the two eccentric wheels to rotate, so that the two eccentric wheels collide with the two cooling cylinders respectively, thereby avoiding the problem that after the liquid heat sink is formed in the mold groove of the mold plate, some of the heat sink does not fall onto the second transfer plate during the flipping process, and also speeds up the speed of the liquid heat sink flowing back through the through hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of the overall three-dimensional structure provided by an embodiment of the present invention; Figure 2 A schematic diagram of the structure of the rear view is provided for an embodiment of the present invention; Figure 3 A schematic structural diagram of a cavity is provided for an embodiment of the present invention; Figure 4 A schematic diagram of the structure of a cooling cylinder is provided for an embodiment of the present invention; Figure 5 A schematic structural diagram of a rotating rod and a connecting rod is provided for an embodiment of the present invention; Figure 6 A partial cross-sectional view of a cooling cylinder is provided for an embodiment of the present invention; Figure 7A schematic diagram of the structure of a square groove and a through hole is provided for an embodiment of the present invention; Figure 8 An exploded view of a mold plate and a stirring rod is provided for an embodiment of the present invention; Fig. 9 A partial cross-sectional view of a sleeve is provided for an embodiment of the present invention; Fig.10 A schematic structural diagram of a first travel groove, a second travel groove and a flip groove is provided for an embodiment of the present invention.

[0020] In the figure: 1. shell; 2. cavity; 3. connection port; 401. mounting plate; 402. rotating rod; 403. connecting rod; 404. clamping ring; 405. cooling cylinder; 406. transfer rod; 407. first transfer plate; 408. second transfer plate; 409. fan; 410. follower rod; 411. limit plate; 412. limit ring; 413. coolant storage tank; 414. conductor cooling plate; 415. inspection door; 416. servo motor; 501. mold plate; 502. square groove; 503. air inlet; 504. air inlet pipe; 505. through hole; 506. liquid level sensor; 601. connecting shaft; 602. flip plate; 603. flip shaft; 604. eccentric wheel; 605. sleeve; 606. first stroke groove; 607. second stroke groove; 608. flip groove. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Reference Figure 1-10The present invention provides a technical solution: a portable skin cooling device, comprising a shell 1, a cavity 2 is provided on the rear side of the shell 1, a connecting port 3 is provided on the front side of the shell 1 for connecting a water inlet pipe and a water outlet pipe, a cold compress pad is installed between the other end of the water inlet pipe and the other end of the water outlet pipe, a coolant circulation channel is provided inside the cold compress pad, and the coolant circulation is driven by a circulating pump, a cooling mechanism is provided inside the cavity 2, the cooling mechanism comprises a mounting plate 401, a connecting rod 403, a clamping ring 404 and a transmission rod 406, the mounting plate 401 is fixedly installed on the top of the inner wall of the cavity 2, a rotating rod 402 is rotatably installed on the bottom of the mounting plate 401, and the connecting rod 403 is provided There are two, the two connecting rods 403 are fixedly mounted on the left and right sides of the rotating rod 402 respectively, the clamping ring 404 is rotatably mounted on the end of the connecting rod 403 away from the rotating rod 402 through a bearing, the inner fixed sleeve of the clamping ring 404 is provided with a cooling cylinder 405, and the transfer rods 406 are provided with a plurality of them, and the transfer rods 406 are slidably sleeved inside the bottom wall of the cooling cylinder 405, and the bottom of the transfer rod 406 is fixedly mounted with a first transfer plate 407, the first transfer plate 407 is elastic, and the top of the transfer rod 406 is fixedly mounted with a second transfer plate 408, and the interior of the cavity 2 is installed with a coolant storage tank 413, and the interior of the coolant storage tank 413 stores coolant. A semiconductor refrigeration sheet 414 is installed inside the top wall of the cooling liquid storage tank 413, and a sealing gasket is installed between the cooling liquid storage tank 413 and the semiconductor refrigeration sheet 414. The heat release end of the semiconductor refrigeration sheet 414 is in contact with the bottom of the first transfer plate 407, and the heat absorption end of the semiconductor refrigeration sheet 414 is in contact with the cooling liquid inside the cooling liquid storage tank 413. By setting a cooling mechanism, the user puts the cold compress pad in contact with the human skin, starts the circulation pump, and circulates the cooling liquid. When the cooling liquid passes through the cooling liquid circulation channel inside the cold compress pad, heat is transferred to the human skin, and the heat of the human skin is introduced into the cooling liquid, and then returns to the inside of the cooling liquid storage tank 413, thereby cooling the human skin. However, at this time, the semiconductor refrigeration sheet 414 is powered on. Based on the Peltier effect, the heat absorbing end of the semiconductor refrigeration sheet 414 starts to absorb heat, and cools the gradually heated coolant. The heat releasing end of the semiconductor refrigeration sheet 414 starts to release heat. Since the first transfer plate 407 is in contact with the heat releasing end of the semiconductor refrigeration sheet 414, the heat generated by the heat releasing end of the semiconductor refrigeration sheet 414 is transferred to the first transfer plate 407, and is transferred to the second transfer plate 408 through the transfer rod 406, thereby alleviating the problem of the semiconductor refrigeration sheet 414 being prone to overheating. Compared with the prior art, the human skin is cooled more effectively, the cooling effect is better, and the cooling time is longer, which is particularly suitable for use when the skin is continuously in a high temperature state; Reference Figure 1-10A fan 409 is installed on the top of the cooling cylinder 405, a follower rod 410 is fixedly installed on the output end of the fan 409, a plurality of limit plates 411 are fixedly installed on the surface of the follower rod 410, a plurality of limit rings 412 are fixedly sleeved between the plurality of limit plates 411, the first transfer plate 407, the transfer rod 406 and the second transfer plate 408 are all made of heat-conducting materials, by setting the fan 409, after starting the fan 409, the driving motor on the fan 409 drives the output of the fan 409 through the transmission system The end and the fan blade rotate, thereby driving the follower rod 410, the limit plate 411 and the limit ring 412 to rotate. A plurality of square heat sinks are placed above the second transfer plate 408. Since the heat sinks are made of liquid phase change material, such as paraffin and fatty acid, the contact between the heat sinks and the second transfer plate 408 will cause the heat sinks to quickly absorb the heat of the second transfer plate 408 and begin to change from solid to liquid. The rotation of the limit plate 411 and the limit ring 412 can enhance the contact effect between the heat sinks and the second transfer plate 408. Reference Figure 1-10 The rear side of the housing 1 is provided with an inspection door 415 for the convenience of users to inspect. The mounting plate 401 is provided with a servo motor 416. The output end of the servo motor 416 is fixedly connected to the top of the rotating rod 402. By providing the servo motor 416, the user can drive the rotating rod 402 to rotate by starting the servo motor 416, thereby providing driving force for the rotating rod 402. Reference Figure 1-10The cooling cylinder 405 is provided with a reuse mechanism inside, and the reuse mechanism includes a mold plate 501, and the mold plate 501 is fixedly installed inside the cooling cylinder 405. A plurality of square grooves 502 are provided at the bottom of the mold plate 501, and a plurality of through holes 505 that pass through the second transfer plate 408 are provided. The plurality of through holes 505 and the plurality of square grooves 502 are arranged in a circular array. A liquid level sensor 506 is installed on the inner wall of the cooling cylinder 405, which can be a float type liquid level sensor 506. By setting the reuse mechanism, when the heat sink changes from a solid state to a liquid state, it flows into the bottom of the second transfer plate 408 through the through hole 505, and the liquid level gradually rises with the passage of time. At the same time, the temperature of the coolant increases with the passage of time due to the constant The temperature of the human skin continues to be gradually increased until the melted heat sink contacts the liquid level sensor 506. The liquid level sensor 506 sends a signal to drive the servo motor 416 to start. This is a prior art and will not be described in detail here. After driving the rotating rod 402 to rotate 180 degrees, the position of the cooling cylinder 405 that contacts the semiconductor refrigeration sheet 414 in the initial state is interchanged with the position of the cooling cylinder 405 that does not contact the semiconductor refrigeration sheet 414. In this process, the cooling cylinder 405 flips 180 degrees and is in an upside-down state. At this time, the liquid heat sink flows back through the through hole 505 and enters the mold groove on the mold plate 501. Through the cooperation of the fan 409, it gradually cools down and changes from liquid to solid again, leaving it for next use, so that the staff does not need to frequently add cooling materials. Reference Figure 1-10 An air inlet 503 is provided at the top of the cooling cylinder 405, and a plurality of air inlet pipes 504 are installed inside the side wall of the cooling cylinder 405. A one-way valve is installed on the air inlet pipe 504. One end of the air inlet pipe 504 is connected to the air inlet 503, and the other end of the air inlet pipe 504 is located below the mold plate 501. By setting the air inlet 503, the fan 409 first cools down the mold plate 501 when blowing air, and then bypasses the mold plate 501 from the air inlet pipe 504 to enter the interior of the cooling cylinder 405 to cool down the heat sink; Reference Figure 1-10The cavity 2 is provided with a flip mechanism inside, and the flip mechanism includes a connecting shaft 601, and the connecting shaft 601 is fixedly mounted on the side of the clamping ring 404 away from the rotating rod 402, and the other end of the connecting shaft 601 is fixedly mounted with a flip plate 602, and the other side of the flip plate 602 is fixedly mounted with a flip shaft 603, and the center of the flip shaft 603 and the center of the connecting shaft 601 are staggered, and the shape of the flip plate 602 is set to be arc-shaped, and two eccentric wheels 604 are fixedly sleeved on the rotating rod 402. By setting the flip mechanism, when the rotating rod 402 rotates to drive the two cooling cylinders 405 to exchange positions, the flip shaft 603 is connected to the connecting shaft 601 is the center of the circle for rotation. Since the turning shaft 603 is eccentrically arranged relative to the connecting shaft 601, the turning shaft 603 drives the turning plate 602, the connecting shaft 601 and the cooling cylinder 405 to turn 180 degrees, so that the two cooling cylinders 405 turn themselves when the positions are interchanged. When the rotating rod 402 rotates, it drives the two eccentric wheels 604 to rotate, so that the two eccentric wheels 604 collide with the two cooling cylinders 405 respectively, so as to avoid the problem that after the liquid heat dissipation block is formed in the mold groove of the mold plate 501, part of the heat dissipation block does not fall onto the second transfer plate 408 during the turning process, and also speeds up the speed of the liquid heat dissipation block flowing back through the through hole 505; Reference Figure 1-10A sleeve 605 is fixedly installed on the top of the inner wall of the cavity 2. The cross-section of the sleeve 605 is set to be circular. The bottom of the sleeve 605 is set to be open. The inner wall of the sleeve 605 is provided with a first stroke groove 606 and a second stroke groove 607. A flip groove 608 is provided between the first flip groove 608 and the second flip groove 608. The height of the first stroke groove 606 is higher than the height of the connecting shaft 601, and the height of the second stroke groove 607 is lower than the height of the connecting shaft 601. There are two flip grooves 608, which are respectively located at the front and rear sides of the inner wall of the sleeve 605 and are mirror-imaged along the axis. The shape of the flip groove 608 is set to be arc-shaped. By setting the sleeve 605, when the rotating rod 402 rotates to drive the two cooling cylinders 405 to exchange positions, the flip axes 603 on the two cooling cylinders 405 are respectively in the first stroke groove 606 And slide inside the second stroke groove 607 until the two flip shafts 603 are respectively squeezed by the inner walls of the two flip grooves 608, so that the cooling tube 405 in the initial state enters from the inside of the first stroke groove 606 into the inside of the second stroke groove 607. Since the height of the first stroke groove 606 is higher than the height of the connecting shaft 601, and the height of the second stroke groove 607 is lower than the height of the connecting shaft 601, the flip shaft 603 drives the cooling tube 405 to flip and become an inverted state. At the same time, another cooling tube 405 enters from the inside of the second stroke groove 607 into the inside of the first stroke groove 606, and changes from an inverted state to an upright state. The square heat dissipation block formed inside the mold plate 501 falls onto the second transfer plate 408, and the first transfer plate 407 contacts with the semiconductor refrigeration plate 414, thereby continuing to cool the heat release end of the semiconductor refrigeration plate 414, which greatly increases the cooling time.

[0023] Specifically, the working process or working principle of the portable skin cooling device is as follows: when in use, the user brings the cold compress pad into contact with the human skin, heat transfer occurs with the human skin, the heat of the human skin is introduced into the coolant, and returns to the interior of the coolant storage tank 413, thereby cooling the human skin, the semiconductor refrigeration sheet 414 is energized, the heat absorption end of the semiconductor refrigeration sheet 414 begins to absorb heat, and the gradually heated coolant is cooled, the heat release end of the semiconductor refrigeration sheet 414 begins to release heat, and since the first transfer plate 407 and the heat release end of the semiconductor refrigeration sheet 414 are in contact, the heat generated by the heat release end of the semiconductor refrigeration sheet 414 is transferred to the first transfer plate 407, and is transferred to the second transfer plate 408 through the transfer rod 406, starting After the fan 409 is started, the driving motor on the fan 409 drives the output end and the fan blades of the fan 409 to rotate through the transmission system, thereby driving the follower rod 410, the limit plate 411 and the limit ring 412 to rotate. The contact between the heat sink and the second transfer plate 408 will cause the heat sink to quickly absorb the heat of the second transfer plate 408, and the heat sink itself begins to change from a solid state to a liquid state. The rotation of the limit plate 411 and the limit ring 412 can enhance the contact effect between the heat sink and the second transfer plate 408. When the heat sink changes from a solid state to a liquid state, it flows through the through hole 505 to the bottom of the second transfer plate 408, and the liquid level gradually rises with the passage of time. At the same time, with the passage of time, the temperature of the coolant gradually increases due to the continuous cooling of the human skin until it melts. After the heat sink 506 contacts the liquid level sensor 506, the liquid level sensor 506 sends a signal to drive the servo motor 416 to start, and after driving the rotating rod 402 to rotate 180 degrees, the position of the cooling cylinder 405 that contacts the semiconductor refrigeration plate 414 in the initial state is interchanged with the position of the cooling cylinder 405 that does not contact the semiconductor refrigeration plate 414, and the flip shafts 603 on the two cooling cylinders 405 slide inside the first stroke groove 606 and the second stroke groove 607 respectively until the two flip shafts 603 are squeezed by the inner walls of the two flip grooves 608 respectively, so that the cooling cylinder 405 in the initial state enters the second stroke groove 607 from the inside of the first stroke groove 606. Since the height of the first stroke groove 606 is higher than the connecting shaft 601, the height of the second stroke groove 607 is lower than the height of the connecting shaft 601, so that the flip shaft 603 rotates with the connecting shaft 601 as the center. Since the flip shaft 603 is eccentrically arranged relative to the connecting shaft 601, the flip shaft 603 drives the flip plate 602, the connecting shaft 601 and the cooling cylinder 405 to flip 180 degrees and become an inverted state. At this time, the liquid heat dissipation block flows back through the through hole 505 and enters the mold groove on the mold plate 501. Through the cooperation of the fan 409, it gradually cools itself down and changes from liquid to solid again, leaving it for next use. At the same time, another cooling cylinder 405 enters from the inside of the second stroke groove 607 into the inside of the first stroke groove 606 and changes from an inverted state to an upright state.The square heat sink formed inside the mold plate 501 falls onto the second transfer plate 408, and the first transfer plate 407 contacts the semiconductor cooling plate 414, thereby continuing to cool the heat release end of the semiconductor cooling plate 414.

Claims

1. A portable skin cooling device, comprising a housing (1), characterized in that: The rear side of the shell (1) is provided with a cavity (2), the front side of the shell (1) is provided with a connection port (3), and a cooling mechanism is provided inside the cavity (2), the cooling mechanism comprising: A mounting plate (401), the mounting plate (401) being fixedly mounted on the top of the inner wall of the cavity (2), and a rotating rod (402) being rotatably mounted on the bottom of the mounting plate (401); A connecting rod (403), wherein two connecting rods (403) are provided, and the two connecting rods (403) are respectively fixedly mounted on the left and right sides of the rotating rod (402); A clamping ring (404), the clamping ring (404) being rotatably mounted on an end of the connecting rod (403) away from the rotating rod (402) via a bearing, and a cooling cylinder (405) being provided inside a fixed sleeve of the clamping ring (404); A plurality of transfer rods (406) are provided, and the transfer rods (406) are slidably sleeved inside the bottom wall of the cooling cylinder (405), a first transfer plate (407) is fixedly mounted on the bottom of the transfer rod (406), and a second transfer plate (408) is fixedly mounted on the top of the transfer rod (406).

2. The portable skin cooling device according to claim 1, characterized in that: A fan (409) is installed on the top of the cooling cylinder (405), a follower rod (410) is fixedly installed on the output end of the fan (409), a plurality of limit plates (411) are fixedly installed on the surface of the follower rod (410), a plurality of limit rings (412) are fixedly sleeved between the plurality of limit plates (411), and the first transfer plate (407), the transfer rod (406) and the second transfer plate (408) are all made of heat-conducting material.

3. The portable skin cooling device according to claim 2, characterized in that: A cooling liquid storage box (413) is installed inside the cavity (2), and cooling liquid is stored inside the cooling liquid storage box (413). A semiconductor cooling plate (414) is installed inside the top wall of the cooling liquid storage box (413), and the heat release end of the semiconductor cooling plate (414) is in contact with the bottom of the first transfer plate (407). An inspection door (415) is installed on the rear side of the shell (1), and a servo motor (416) is installed on the mounting plate (401), and the output end of the servo motor (416) is fixedly connected to the top of the rotating rod (402).

4. The portable skin cooling device according to claim 3, characterized in that: A reuse mechanism is provided inside the cooling cylinder (405), and the reuse mechanism comprises a mold plate (501). The mold plate (501) is fixedly installed inside the cooling cylinder (405), and a plurality of square grooves (502) are provided at the bottom of the mold plate (501).

5. The portable skin cooling device according to claim 4, characterized in that: An air inlet (503) is provided at the top of the cooling cylinder (405), and a plurality of air inlet pipes (504) are installed inside the side wall of the cooling cylinder (405), one end of the air inlet pipe (504) is connected to the air inlet (503), and the other end of the air inlet pipe (504) is located below the mold plate (501).

6. The portable skin cooling device according to claim 5, characterized in that: The second transfer plate (408) is provided with a plurality of through holes (505) that penetrate vertically, the plurality of through holes (505) and the plurality of square grooves (502) are arranged in a ring array, and a liquid level sensor (506) is installed on the inner wall of the cooling cylinder (405).

7. The portable skin cooling device according to claim 6, characterized in that: A flip mechanism is arranged inside the cavity (2), the flip mechanism comprising a connecting shaft (601), the connecting shaft (601) being fixedly mounted on a side of the clamping ring (404) away from the rotating rod (402), and a flip plate (602) being fixedly mounted on the other end of the connecting shaft (601).

8. The portable skin cooling device according to claim 7, characterized in that: A flip shaft (603) is fixedly mounted on the other side of the flip plate (602); the center of the flip shaft (603) and the center of the connecting shaft (601) are arranged alternately; the shape of the flip plate (602) is arranged to be an arc; and two eccentric wheels (604) are fixedly sleeved on the rotating rod (402).

9. The portable skin cooling device according to claim 8, characterized in that: A sleeve (605) is fixedly mounted on the top of the inner wall of the cavity (2); the cross-section of the sleeve (605) is circular; the bottom of the sleeve (605) is open; a first travel groove (606) and a second travel groove (607) are provided on the inner wall of the sleeve (605); and a flip groove (608) is provided between the first flip groove (608) and the second flip groove (608).

10. The portable skin cooling device according to claim 9, characterized in that: The height of the first travel groove (606) is higher than the height of the connecting shaft (601), and the height of the second travel groove (607) is lower than the height of the connecting shaft (601). Two flip grooves (608) are provided, and the two flip grooves (608) are respectively located at the front side and the rear side of the inner wall of the sleeve (605), and are mirror-imaged along the axis. The shape of the flip groove (608) is set to be an arc.

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