Temperature control module based on silicon-based OLED product

Abstract

The invention relates to the technical field of temperature control aging test, and discloses a temperature control module based on a silicon-based OLED product, the temperature control module comprises a temperature control module, the temperature control module comprises a connection module, a temperature transmission module, a temperature control module and a detection module, the connection module is used for connecting an OLED FPC product and an OLED PCB product, and the detection module is used for detecting the temperature of the OLED FPC product. The temperature transmission module is used for transmitting temperature to the OLED FPC product and the OLED PCB product in a heat exchange mode, the temperature control module is used for controlling the temperature, and the detection module is used for carrying out aging detection on the OLED FPC product and the OLED PCB product. Through the arrangement of the connection module, the OLED PCB product can be connected in an OLED FPC product mode through the switching matching of the FPC switching module and the PCB connection module, the glass surface of the OLED PCB product can be in close contact with the heat conduction platform, the accurate temperature control of the OLED PCB product is realized, and the data accuracy of the aging test is improved.

Description

Technical Field

[0001] The invention relates to the technical field of temperature control aging testing, and in particular to a temperature control module based on silicon-based OLED products. Background Art

[0002] Silicon-based OLED uses monocrystalline silicon as substrate, and CMOS driving circuit is integrated in monocrystalline silicon. Silicon-based OLED places pixel points directly on silicon wafer instead of glass substrate, so pixel size can be smaller and pixel density can be higher. At the same time, silicon-based OLED retains many advantages of OLED display screens, such as self-luminescence, better color, shorter response time, lower power consumption, etc., and has the potential for higher resolution than traditional OLED. Temperature-controlled aging test is an important link in the production process of silicon-based OLED products. Its purpose is to accelerate the aging process of products by simulating long-term use and high-temperature environment, so as to screen out potential quality problems and ensure the stability and reliability of the final product. There are two types of existing silicon-based OLED products, namely, FPC connection circuit and PCB connection circuit, which are called OLED FPC products and OLED PCB products respectively. The advantages of OLED FPC products are that they are light, thin, compact and flexible, and can realize the flat bottom of silicon-based OLED products, easy to fix and easy to control temperature. The advantages of OLED PCB products are that the material is highly impact-resistant and can achieve a more secure connection.

[0003] However, the prior art has the following problems:

[0004] Since OLED PCB products have electrical components at the bottom, they need to be protected and temperature-controlled separately. As a result, the temperature control effect of OLED PCB products through external devices is poor. When conducting temperature-controlled aging tests on OLED PCB products, the temperature control of OLED PCB products is not stable enough, resulting in unstable aging effects, which affects the accuracy of the aging test results. Summary of the invention

[0005] The purpose of the present invention is to provide a temperature control module based on silicon-based OLED products in order to solve the above problems and overcome the defects of the prior art, as described below.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] The present invention provides a temperature control module based on a silicon-based OLED product, including a temperature control module, characterized in that: the temperature control module includes a connection module, a temperature transfer module, a temperature control module, a detection module and a simulation module, the connection module is used to connect the OLED FPC product and the OLED PCB product, the temperature transfer module is used to transfer the temperature to the OLED FPC product and the OLED PCB product by heat exchange, the temperature control module is used to control the temperature, the detection module is used to perform aging detection on the OLED FPC product and the OLED PCB product, and the simulation module is used to transmit image information to the OLED FPC product and the OLED PCB product.

[0008] Preferably, the connection module comprises an FPC adapter module and an FPC connection module, the FPC connection module is used to connect the OLED FPC product, the FPC adapter module is connected to a PCB connection module, and the PCB connection module is used to connect the OLED PCB product.

[0009] Preferably, the temperature transfer module includes an adsorption module and a thermal conductive platform, the adsorption module is arranged on the thermal conductive platform, the adsorption module includes a plurality of adsorption holes, a vacuum pump is arranged at the bottom of the thermal conductive platform, and the adsorption module is used to adsorb OLED FPC products and OLED PCB products onto the thermal conductive platform.

[0010] Preferably, the temperature control module includes a temperature sensor, a semiconductor heating plate, a controller and an actuator, the temperature sensor is arranged on the top of the heat-conducting platform, the semiconductor heating plate is arranged on the bottom of the heat-conducting platform, the controller and the actuator are both arranged on the bottom of the semiconductor heating plate, the temperature sensor is connected to the controller through a wire, the controller is connected to the actuator through a wire, and the actuator is connected to the semiconductor heating plate through a wire.

[0011] Preferably, the detection module includes an optical defect detection module, a laser repair module, an aging detection module and an analysis module. The optical defect detection module is used to perform preliminary defect detection on OLED FPC products and OLED PCB products. The laser repair module is used to repair and eliminate defect points based on the preliminary defect detection. The aging detection module is used to perform continuous detection according to the temperature-controlled aging process of the product. The analysis module is used to analyze the product performance after aging.

[0012] Preferably, the simulation module includes a signal sending module, a display switching module and a screen protection module. The signal sending module is connected to the OLED FPC product or the OLED PCB product via an FPGA. The display switching module stores multiple image files. The display switching module is connected to the signal sending module via a wire. The display switching module can cyclically output image information of multiple image files. The screen protection module is connected to the display switching module via a wire. The screen protection module can periodically transmit screen protection image information to the display switching module.

[0013] Preferably, a heat dissipation module is provided in the semiconductor heating plate, and the heat dissipation module includes a temperature sensing module, a frequency conversion module and a radiator. The temperature sensing module is connected to the temperature sensor, and the frequency conversion module is connected to the temperature sensing module. The frequency conversion module can control the current output through the temperature information received by the temperature sensing module. The radiator is located at the bottom of the semiconductor heating plate, and the radiator is connected to the frequency conversion module.

[0014] Preferably, the bottom of the heat-conducting platform is connected to the top of the semiconductor heating plate, and the FPC adapter module and the FPC connection module are both arranged on the heat-conducting platform.

[0015] Preferably, the OLED FPC product is provided with a silicon back and a light-emitting surface. When the FPC adapter module is connected to the OLED FPC product, the silicon back of the OLED FPC product faces downward, the light-emitting surface of the OLED FPC product faces upward, and the silicon back of the OLEDFPC product contacts the thermal conductive platform. The OLED PCB product is provided with a glass surface and a light-emitting surface. When the PCB connection module is connected to the OLED PCB product, the glass surface and the light-emitting surface of the OLED FPC product both face downward, and the glass surface of the OLED PCB product contacts the thermal conductive platform.

[0016] The beneficial effects are:

[0017] 1. The temperature control module based on silicon-based OLED products, through the setting of the connection module, enables the OLED PCB products to be connected in the form of OLED FPC products through the transfer cooperation of the FPC transfer module and the PCB connection module, so that the glass surface of the OLED PCB products can be in close contact with the thermal conductive platform, and the precise temperature control of the OLED PCB products is achieved. During the temperature control process, the OLED PCB products are subjected to aging tests, and the temperature is accurately controlled, thereby improving the accuracy of the aging test data.

[0018] 2. The temperature control module based on silicon-based OLED products, through the cooperation of the adsorption module and the thermal conductive platform, enables both OLEDFPC products and OLED PCB products to be tightly adsorbed on the thermal conductive platform, thereby improving the heat transfer efficiency of the thermal conductive platform, reducing heat loss, and improving the stability of temperature control; through the setting of the heat dissipation module, the temperature sensing module collects temperature information through the temperature sensor and transmits the temperature information to the frequency conversion module, and the frequency conversion module adjusts the output power of the radiator according to the real-time temperature to maintain a relatively stable temperature.

[0019] 3. The temperature control module based on silicon-based OLED products can realize real-time temperature control of the semiconductor heating plate according to the real-time temperature of the OLED FPC product or the OLED PCB product, so that the semiconductor heating plate can be heated or cooled in time according to the real-time temperature of the OLED FPC product or the OLED PCB product, maintain the stability of temperature control, and thus ensure the stability of the aging process.

[0020] 4. The temperature control module based on the silicon-based OLED product, through the setting of the simulation module, enables the signal sending module to transmit the image information to the OLED FPC product or OLED PCB product through the FPGA, so that the OLED FPC product or OLED PCB product can play multiple image files in a loop during the aging test to simulate the actual usage scenario, further improve the simulation reality of the aging test, and improve the referenceability of the test data. The screen protection module can time the display switching module to play the screen protection file, so as to protect the OLED FPC product or OLED PCB product from displaying static images for a long time, so as to reduce the risk of screen burn-in. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 is a schematic diagram of a temperature control module of the present invention;

[0023] Figure 2 is a schematic diagram of a connection module of the present invention;

[0024] Figure 3 is a schematic diagram of a temperature transfer module of the present invention;

[0025] Figure 4 is a schematic diagram of a temperature control module of the present invention;

[0026] Figure 5 is a schematic diagram of a heat dissipation module of the present invention;

[0027] Figure 6 is a schematic diagram of a detection module of the present invention;

[0028] Figure 7 is a schematic diagram of a simulation module of the present invention;

[0029] Figure 8 It is a schematic diagram of the workflow of the present invention. DETAILED DESCRIPTION

[0030] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0031] Example 1

[0032] See also Figure 1 - Figure 6 A temperature control module based on a silicon-based OLED product includes a temperature control module, the temperature control module includes a connection module, a temperature transfer module, a temperature control module, a detection module and a simulation module, the connection module is used to connect an OLED FPC product and an OLED PCB product, the connection module includes an FPC adapter module and an FPC connection module, the FPC connection module is used to connect an OLED FPC product, a PCB connection module is connected to the FPC adapter module, the PCB connection module is used to connect an OLED PCB product, the PCB connection module is transferred to a heat conduction platform through the FPC adapter module, and the FPC adapter module has a certain deformation ability, so that the staff can flip the OLED PCB product, the OLED FPC product is provided with a silicon back and a light-emitting surface, and the OLED PCB product is provided with a glass surface and a light-emitting surface.

[0033] Furthermore, the temperature transfer module is used to transfer the temperature to the OLED FPC product and the OLED PCB product by heat exchange. The temperature transfer module includes an adsorption module and a heat conduction platform. The adsorption module is arranged on the heat conduction platform. The adsorption module includes a plurality of adsorption holes. A vacuum pump is arranged at the bottom of the heat conduction platform. After the vacuum pump is started, the plurality of adsorption holes can tightly adsorb the material on the surface of the heat conduction platform on the surface of the heat conduction platform. The adsorption module is used to adsorb the OLED FPC product and the OLED PCB product on the heat conduction platform. The bottom of the heat conduction platform is connected to the top of the semiconductor heating plate. The FPC adapter module and the FPC connection module are both arranged on the heat conduction platform. The temperature sensor contacts the OLED FPC product or the OLED PCB product and detects the temperature of its surface, and transmits the temperature data to the controller. The controller controls the semiconductor heating plate to heat up through the actuator according to the actual temperature. The semiconductor heating plate transfers the temperature to the heat conduction platform. When the FPC adapter module is connected to the OLED FPC product, the silicon back of the OLED FPC product faces downward, the light-emitting surface of the OLED FPC product faces upward, and the OLED The silicon back of the FPC product is in contact with the thermal conductive platform, and the thermal conductive platform transfers heat to the OLED FPC product through contact. The silicon back of the OLED FPC product is in contact with the thermal conductive platform, so that the OLED FPC product is heated more evenly, and the heating of the OLED FPC product is realized. When the PCB connection module is connected to the OLED PCB product, the glass surface and the light-emitting surface of the OLED FPC product are both facing downward, and the glass surface of the OLED PCB product is in contact with the thermal conductive platform. The glass surface of the OLED PCB product is in close contact with the thermal conductive platform, so that the thermal conductive platform can heat the glass surface and the light-emitting surface of the OLED PCB product more accurately, and the heating effect is uniform and the heating efficiency is fast; through the setting of the connection module, the OLED PCB product can be connected in the form of an OLED FPC product through the transfer cooperation of the FPC transfer module and the PCB connection module, so that the glass surface of the OLED PCB product can be in close contact with the thermal conductive platform, and the precise temperature control of the OLED PCB product is realized. During the temperature control process, the OLED PCB product is subjected to an aging test, and the temperature control is accurate, and the data of the aging test is highly accurate; through the cooperation of the adsorption module and the thermal conductive platform, the OLED FPC product and the OLED PCB products can be tightly adsorbed on the thermal platform, which improves the heat transfer efficiency of the thermal platform, reduces heat loss, and improves the stability of temperature control.

[0034] Furthermore, the temperature control module is used to control the temperature, and the temperature control module includes a temperature sensor, a semiconductor heating sheet, a controller and an actuator. The temperature sensor is arranged on the top of the heat-conducting platform, the semiconductor heating sheet is arranged on the bottom of the heat-conducting platform, the controller and the actuator are arranged on the bottom of the semiconductor heating sheet, the temperature sensor is connected to the controller through a wire, the controller is connected to the actuator through a wire, and the actuator is connected to the semiconductor heating sheet through a wire. The temperature control module can realize real-time temperature control of the semiconductor heating sheet according to the real-time temperature of the OLED FPC product or the OLED PCB product, so that the semiconductor heating sheet can realize the temperature control of the semiconductor heating sheet according to the real-time temperature of the OLED The real-time temperature of the FPC product or OLEDPCB product is timely heated or cooled to maintain the stability of temperature control, thereby ensuring the stability of the aging process. A heat dissipation module is arranged in the semiconductor heating sheet, and the heat dissipation module includes a temperature sensing module, a frequency conversion module and a radiator. The temperature sensing module is connected to the temperature sensor, and the frequency conversion module is connected to the temperature sensing module. The frequency conversion module can control the current output through the temperature information received by the temperature sensing module. The radiator is located at the bottom of the semiconductor heating sheet, and the radiator is connected to the frequency conversion module. After the radiator is started, the semiconductor heating sheet is dissipated to avoid the semiconductor heating sheet and the OLED FPC product or OLED PCB product above it accumulating heat and causing the temperature to exceed the set range. The temperature sensing module collects temperature information through the temperature sensor and transmits the temperature information to the frequency conversion module. The frequency conversion module adjusts the output power of the radiator according to the real-time temperature, increases the output power of the radiator when the temperature is high, and reduces the output power of the radiator when the temperature is low, so that the temperature is maintained relatively stable.

[0035] Furthermore, the detection module is used to perform aging detection on OLED FPC products and OLED PCB products. The detection module includes an optical defect detection module, a laser repair module, an aging detection module and an analysis module. The optical defect detection module is used to perform preliminary defect detection on OLED FPC products and OLED PCB products. The laser repair module is used to repair and eliminate defect points based on the preliminary defect detection. The aging detection module is used to perform continuous detection according to the temperature control aging process of the product. The analysis module is used to analyze the product performance after aging. The optical defect detection module scans the OLED FPC product or OLED PCB product, detects defect points on its surface by optical scanning and transmits the defect information to the laser repair module. The laser repair module repairs and eliminates the defect points by laser repair according to the received defect information. After the repair is completed, the aging detection module detects the OLED FPC product or OLED PCB product according to the heating time of the OLED FPC product or OLED PCB product, and transmits the detection data to the analysis module. When the aging time reaches the set time, the analysis module can display the monitoring data to analyze the product performance of the OLED FPC product.

[0036] Furthermore, the simulation module is used to transmit image information to the OLED FPC product and the OLED PCB product. The simulation module includes a signal sending module, a display switching module and a screen protection module. The signal sending module is connected to the OLED FPC product or the OLED PCB product through an FPGA. The display switching module stores multiple image files. The display switching module is connected to the signal sending module through a wire. The display switching module can cyclically output image information of multiple image files. The screen protection module is connected to the display switching module through a wire. The screen protection module can regularly transmit screen protection image information to the display switching module. The display switching module can select the image file to be played and transmit the image file to the signal sending module. The signal sending module transmits the image information to the OLED FPC product or the OLED PCB product through the FPGA, so that the OLED FPC product or the OLED PCB product can cyclically play multiple image files during the aging test to simulate the actual use scenario, further improve the simulation authenticity of the aging test, and improve the referenceability of the test data. The screen protection module can time the display switching module to play the screen protection file, so as to protect the OLED FPC product or the OLED PCB product from displaying static images for a long time to reduce the risk of screen burn-in.

[0037] The working principle of this case is that when testing the OLED FPC product, the staff connects the OLED FPC product to the FPC adapter module to realize power supply, and tightly adsorbs the OLED FPC product on the thermal platform through the adsorption module. The temperature sensor contacts the OLED FPC product and detects the temperature of its surface, and transmits the temperature data to the controller. The controller controls the semiconductor heating plate to heat up through the actuator according to the actual temperature. The semiconductor heating plate transfers the temperature to the thermal platform, and the thermal platform transfers the heat to the OLED FPC product through contact. The silicon back of the OLED FPC product contacts the thermal platform, so that the OLED FPC product is heated more evenly, and the heating of the OLED FPC product is realized. When the OLED FPC product is just adsorbed on the thermal platform, the optical defect detection module scans the OLED FPC product, detects the defect points on its surface by optical scanning, and transmits the defect information to the laser repair module. The laser repair module repairs and eliminates the defect points by laser repair according to the received defect information. After the repair is completed, the aging detection module regularly checks the OLED according to the heating time of the OLED FPC product. The FPC product is tested and the test data is transmitted to the analysis module. When the aging time reaches the set time, the analysis module can display the monitoring data to analyze the product performance of the OLED FPC product. When the OLED PCB product is tested, the OLED PCB product is connected to the PCB connection module. Since the PCB connection module is transferred to the thermal platform through the FPC adapter module, and the FPC adapter module has a certain deformation ability, the staff can turn the OLED PCB product over so that the glass surface of the OLED PCB product faces down. Based on the above principle, the glass surface of the OLED PCB product is in close contact with the thermal platform, so that the thermal platform can heat the glass surface and the light-emitting surface of the OLED PCB product more accurately, with uniform heating effect and fast heating efficiency. The aging test is performed by controlling the temperature. In the process of temperature control, the temperature sensing module collects temperature information through the temperature sensor and transmits the temperature information to the frequency conversion module. The frequency conversion module adjusts the output power of the radiator according to the real-time temperature, increases the output power of the radiator when the temperature is high, and reduces the output power of the radiator when the temperature is low, so that the temperature is maintained relatively stable.

[0038] During the aging test, the display switching module can select the image file to be played and transmit the image file to the signal sending module. The signal sending module transmits the image information to the OLED FPC product or OLED PCB product through the FPGA, so that the OLED FPC product or OLED PCB product can play multiple image files in a loop during the aging test to simulate the actual usage scenario, further improve the simulation realism of the aging test, and improve the reference value of the test data. The screen protection module can timer control the display switching module to play the screen protection file, so as to protect the OLED FPC product or OLED PCB product from displaying static images for a long time to reduce the risk of screen burn-in. Through the setting of the connection module, the OLED PCB product can be connected in the form of an OLED FPC product through the transfer cooperation of the FPC transfer module and the PCB connection module, so that the glass surface of the OLED PCB product can be in close contact with the thermal conductive platform, and the precise temperature control of the OLED PCB product can be achieved. During the temperature control process, the OLED PCB product is subjected to an aging test, and the temperature control is accurate, and the data of the aging test is highly accurate; through the cooperation of the adsorption module and the thermal conductive platform, both the OLED FPC product and the OLED PCB product can be closely adsorbed on the thermal conductive platform, which improves the heat transfer efficiency of the thermal conductive platform, reduces heat loss, and improves the stability of temperature control; through the setting of the heat dissipation module, the temperature sensing module collects temperature information through the temperature sensor and transmits the temperature information to the frequency conversion module, and the frequency conversion module adjusts the output power of the radiator according to the real-time temperature to maintain a relatively stable temperature.

[0039] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A temperature control module based on silicon-based OLED products, comprising a temperature control module, characterized in that: The temperature control module includes a connection module, a temperature transfer module, a temperature control module, a detection module and a simulation module. The connection module is used to connect the OLED FPC product and the OLED PCB product. The temperature transfer module is used to transfer the temperature to the OLED FPC product and the OLED PCB product by heat exchange. The temperature control module is used to control the temperature. The detection module is used to perform aging detection on the OLED FPC product and the OLED PCB product. The simulation module is used to transmit image information to the OLED FPC product and the OLED PCB product.

2. The temperature control module based on silicon-based OLED products according to claim 1, characterized in that: The connection module includes an FPC adapter module and an FPC connection module, wherein the FPC connection module is used to connect the OLED FPC product, and the FPC adapter module is connected to a PCB connection module, wherein the PCB connection module is used to connect the OLED PCB product.

3. The temperature control module based on silicon-based OLED products according to claim 2, characterized in that: The temperature transfer module includes an adsorption module and a heat conduction platform. The adsorption module is arranged on the heat conduction platform. The adsorption module includes multiple adsorption holes. A vacuum pump is arranged at the bottom of the heat conduction platform. The adsorption module is used to adsorb OLED FPC products and OLED PCB products on the heat conduction platform.

4. The temperature control module based on silicon-based OLED products according to claim 3, characterized in that: The temperature control module includes a temperature sensor, a semiconductor heating sheet, a controller and an actuator. The temperature sensor is arranged on the top of the heat-conducting platform, the semiconductor heating sheet is arranged on the bottom of the heat-conducting platform, the controller and the actuator are both arranged on the bottom of the semiconductor heating sheet, the temperature sensor is connected to the controller through a wire, the controller is connected to the actuator through a wire, and the actuator is connected to the semiconductor heating sheet through a wire.

5. The temperature control module based on silicon-based OLED products according to claim 4, characterized in that: The detection module includes an optical defect detection module, a laser repair module, an aging detection module and an analysis module. The optical defect detection module is used to perform preliminary defect detection on OLED FPC products and OLED PCB products. The laser repair module is used to repair and eliminate defect points based on the preliminary defect detection. The aging detection module is used to perform continuous detection according to the temperature control aging process of the product. The analysis module is used to analyze the product performance after aging.

6. The temperature control module based on silicon-based OLED products according to claim 5, characterized in that: The simulation module includes a signal sending module, a display switching module and a screen protection module. The signal sending module is connected to the OLEDFPC product or the OLED PCB product through FPGA. The display switching module stores multiple image files. The display switching module is connected to the signal sending module through a wire. The display switching module can cyclically output image information of multiple image files. The screen protection module is connected to the display switching module through a wire. The screen protection module can regularly transmit screen protection image information to the display switching module.

7. The temperature control module based on silicon-based OLED products according to claim 6, characterized in that: A heat dissipation module is arranged in the semiconductor heating plate, and the heat dissipation module includes a temperature sensing module, a frequency conversion module and a heat sink. The temperature sensing module is connected to the temperature sensor, and the frequency conversion module is connected to the temperature sensing module. The frequency conversion module can control the current output through the temperature information received by the temperature sensing module. The heat sink is located at the bottom of the semiconductor heating plate, and the heat sink is connected to the frequency conversion module.

8. The temperature control module based on silicon-based OLED products according to claim 7, characterized in that: The bottom of the heat-conducting platform is connected to the top of the semiconductor heat-making sheet, and the FPC adapter module and the FPC connection module are both arranged on the heat-conducting platform.

9. The temperature control module based on silicon-based OLED products according to claim 8, characterized in that: The OLED FPC product is provided with a silicon back and a light-emitting surface. When the FPC adapter module is connected to the OLED FPC product, the silicon back of the OLED FPC product faces downward, the light-emitting surface of the OLED FPC product faces upward, and the silicon back of the OLED FPC product contacts the thermal conductive platform. The OLED PCB product is provided with a glass surface and a light-emitting surface. When the PCB connection module is connected to the OLED PCB product, the glass surface and the light-emitting surface of the OLED FPC product both face downward, and the glass surface of the OLED PCB product contacts the thermal conductive platform.

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