Electrostatic chuck detection device and detection method

Abstract

The invention discloses an electrostatic chuck detection device and method, and the device comprises a fixing assembly and a detection assembly, and the fixing assembly is used for installing a to-be-detected electrostatic chuck; the detection assembly comprises a rack and a probe structure, the probe structure is movably installed on the rack in the axial direction of the probe structure so that the probe structure can partially coincide with the to-be-detected electrostatic chuck, and the probe structure is configured to be capable of detecting the potential of the corresponding position of the to-be-detected electrostatic chuck; wherein the probe structure moves in the axial direction of the probe structure to adjust the detection radius, at least one of the fixing assembly and the detection assembly rotates around the central axis of the to-be-detected electrostatic chuck to adjust the detection angle, and the central axis intersects with the plane where the to-be-detected electrostatic chuck is located. According to the embodiment, the adsorption effect of the electrostatic chuck on the wafer is improved by detecting the uniform distribution degree of the surface electric field of the electrostatic chuck, and the machining detection precision is improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and in particular, relates to an electrostatic chuck detection device and a detection method. Background Art

[0002] In the semiconductor production process, electrostatic chucks (ESC) are widely used to adsorb and fix wafers for processing or testing. Electrostatic chucks can provide uniform adsorption force to keep the wafer stable and flat during the process, which helps to improve the process accuracy of semiconductor products.

[0003] However, in the actual production process, the electrostatic chuck may be contaminated or oxidized, resulting in poor consistency in its adsorption force, which greatly affects the production yield of semiconductor products. Summary of the invention

[0004] An embodiment of the present application provides an electrostatic chuck detection device and a detection method. The probe structure of the electrostatic chuck detection device can traverse the electrostatic chuck to be tested and detect the potential at each position, thereby checking the electrode uniformity of the electrostatic chuck to be tested, so as to reduce the situation where the adsorption effect of the electrostatic chuck is weakened and the production yield is affected.

[0005] In the first aspect, an embodiment of the present application provides an electrostatic chuck detection device, comprising a fixed component and a detection component, the fixed component is used to install the electrostatic chuck to be tested; the detection component comprises a frame and a probe structure, the probe structure is movably installed on the frame along its own axis so that the probe structure can move to the side of the electrostatic chuck to be tested away from the fixed component to realize detection, and the probe structure is configured to detect at least one of the potential and magnetic induction intensity at the corresponding position of the electrostatic chuck to be tested; wherein the probe structure can move along its own axis to adjust the distance between its detection point and the center of the electrostatic chuck, at least one of the fixed component and the detection component can be rotatably arranged around the central axis of the electrostatic chuck to be tested, and the probe structure and the electrostatic chuck to be tested can rotate relative to each other to adjust the detection angle.

[0006] In some embodiments, the detection assembly further includes a slider, which is slidably matched with the frame along the central axis direction of the electrostatic chuck to be tested, and the probe structure is movably mounted on the slider along its own axis.

[0007] In some embodiments, the detection assembly further includes a slider adjusting bolt, which is threadably connected to the slider so that the slider adjusting bolt can be rotated to press the end thereof against the frame, thereby fixing the slider to the frame.

[0008] In some embodiments, the fixing assembly includes a rotating base and a fixing platform, wherein the fixing platform is used to mount the electrostatic chuck to be tested and is rotatably connected to the rotating base.

[0009] In some embodiments, the probe structure includes a probe telescopic rod and a first probe. The probe telescopic rod is movably connected to the frame along its own axis. The first probe is installed on the probe telescopic rod and is configured to detect one of the potential and magnetic induction intensity at the corresponding position of the electrostatic suction cup to be tested.

[0010] In some embodiments, the probe structure also includes a second probe, which is configured to measure the other of the potential and the magnetic induction intensity at the corresponding position of the electrostatic suction cup to be measured. The second probe is detachably connected to the probe telescopic rod, the first probe is detachably connected to the probe telescopic rod, and the second probe and the first probe are used alternately.

[0011] In some embodiments, the probe telescopic rod includes a rod body and a feeding structure, the feeding structure is used to drive the first probe to move axially relative to the rod body, the feeding structure is connected to the rod body and the output end of the feeding structure is detachably connected to the first probe.

[0012] In some embodiments, the fixing assembly further comprises at least one spacer block, which is disposed on one side of the fixing assembly for mounting the electrostatic chuck to be tested so as to separate the electrostatic chuck to be tested from the fixing assembly, and the electrostatic chuck to be tested is detachably connected to the spacer block.

[0013] In some embodiments, there are multiple spacer blocks, and the multiple spacer blocks are evenly distributed along the circumference of the fixing component.

[0014] In a second aspect, an embodiment of the present application provides an electrostatic chuck detection method, which is applied to the electrostatic chuck detection device provided by any of the above embodiments, and the detection method includes:

[0015] Obtaining the potentials of N collection points on the surface of the electrostatic chuck;

[0016] A potential map of the surface of the electrostatic chuck is drawn based on the potentials of N acquisition points;

[0017] The degree of uniform distribution of the electric field on the surface of the electrostatic chuck is obtained based on the potential diagram;

[0018] The potential difference between each collection point and its surrounding collection points is obtained. If the potential difference is greater than a preset threshold, the collection point is recorded as an abnormal area. If all the potential differences of N collection points are less than the preset threshold, the electrostatic chuck is confirmed to be qualified.

[0019] The electrostatic chuck detection device of the embodiment of the present application is provided with a fixed component and a detection component, at least one of which can rotate relative to the electrostatic chuck, the probe structure can move along its own axis to approach or move away from the electrostatic chuck, and the fixed component and the detection component can be combined to realize the traversal of the surface of the electrostatic chuck, thereby detecting the consistency of the electric field distribution on the entire surface of the electrostatic chuck. The electrostatic chuck detection device can be used to detect the uniform distribution of the electrodes of the electrostatic chuck, so that the electrostatic chuck provides a uniform adsorption force to the wafer, thereby improving the process accuracy of semiconductor products. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0021] Figure 1 A schematic diagram of the structure of an electrostatic chuck detection device according to some embodiments of the present application;

[0022] Figure 2 for Figure 1 A schematic diagram of the structure of a fixed component in an electrostatic chuck detection device shown;

[0023] Figure 3 for Figure 1 A schematic diagram of the structure of a detection component in an electrostatic chuck detection device shown;

[0024] Figure 4 Schematic diagram of the process of detecting an electrostatic chuck according to some embodiments of the present application.

[0025] The reference numerals in the specific implementation manner are as follows:

[0026] 100. Electrostatic chuck to be tested;

[0027] 200, fixed assembly; 210, rotating base; 220, fixed platform; 230, spacer block;

[0028] 300, detection component; 311, probe telescopic rod; 312, first probe; 313, telescopic rod adjustment bolt; 320, frame; 330, slider; 331, slider adjustment bolt. DETAILED DESCRIPTION

[0029] The following embodiments of the technical solution of the present application will be described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0031] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0032] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0033] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0034] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0035] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0036] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0037] Electrostatic chuck (ESC) is a device that uses electrostatic force to adsorb objects on its surface. It is widely used in fields such as semiconductor manufacturing and optical component processing due to its characteristics of pollution-free contact and high-precision positioning. Electrostatic chuck applies DC voltage to the electrode to accumulate charge on the insulating layer, thereby generating uniformly distributed electrostatic force to adsorb objects on the surface of the electrostatic chuck.

[0038] However, during actual use, the electrostatic chuck may have defects such as electrode contamination and insulation layer damage, which in turn affects the uniformity of the electrostatic chuck's adsorption force, causing a greater negative impact on semiconductor products with higher processing precision and reducing product yield.

[0039] In addition, in scenarios such as semiconductor testing, the uniformity of the electric field or magnetic field of the electrostatic chuck will also cause an offset in the electron beam used for testing, thereby affecting the test results and reducing the test accuracy.

[0040] In order to solve the problems in the prior art, the embodiments of the present application provide an electrostatic chuck detection device and a detection method. The electrostatic chuck detection device provided in the embodiments of the present application is first introduced below.

[0041] First, see Figures 1 to 3 The embodiment of the present application provides an electrostatic chuck detection device, including a fixing assembly 200 and a detection assembly 300, wherein the fixing assembly 200 is used to install the electrostatic chuck 100 to be tested, and the detection assembly 300 includes a frame 320 and a probe structure, wherein the probe structure is movably mounted on the frame 320 along its own axis so that the probe structure can move to the side of the electrostatic chuck 100 to be tested away from the fixing assembly 200 to realize detection, and the probe structure is configured to detect the potential at the corresponding position of the electrostatic chuck 100 to be tested. Among them, the probe mechanism can move along its own axis to adjust the detection radius, at least one of the fixing assembly 200 and the detection assembly 300 can be rotatably arranged around the central axis of the electrostatic chuck 100 to be tested, and the probe structure and the electrostatic chuck 100 to be tested can rotate relative to each other to adjust the detection angle.

[0042] The probe structure refers to a structure having a tip and capable of performing measurement through the tip. Optionally, in some embodiments, the probe structure is arranged in contact with the electrostatic chuck 100 to be tested; in other embodiments, the probe structure and the electrostatic chuck 100 to be tested are arranged at intervals in the direction of the central axis of the electrostatic chuck 100 to be tested.

[0043] Optionally, the electrostatic chuck 100 to be tested is arranged in a horizontal plane, and the central axis of the electrostatic chuck 100 to be tested extends along the height direction.

[0044] Thus, the electrostatic chuck detection component 300 realizes the circumferential movement of the probe structure along the electrostatic chuck by rotating at least one of the fixing component 200 and the detection component 300 relative to the electrostatic chuck, so as to adjust the detection angle between the electrostatic chuck 100 to be tested and the electrostatic chuck detection device; at the same time, the probe structure can move along its own axial direction, so that the probe structure approaches or moves away from the central axis of the electrostatic chuck 100 to be tested, so as to adjust the detection radius of the electrostatic chuck 100 to be tested and the electrostatic chuck detection device. The electrostatic chuck detection component 300 can realize the overall traversal of the electrostatic chuck 100 to be tested by adjusting the detection angle and the detection radius, and perform potential measurement on multiple collection points of the electrostatic chuck 100 to be tested to obtain the uniform distribution of the electrodes of the electrostatic chuck, thereby screening out unqualified electrostatic chucks to reduce the yield reduction of semiconductor products caused by uneven adsorption force, and reduce the negative impact of the electrostatic chuck on the detection electron beam.

[0045] See also Figure 3 According to some embodiments of the present application, the detection assembly 300 also includes a slider 330, which slides with the frame 320 along the central axis of the electrostatic chuck 100 to be tested, and the probe mechanism is movably installed on the slider 330 along its own axis.

[0046] Optionally, the detection assembly 300 further includes a slider adjustment bolt 331, which is threadedly connected to the slider 330 and abuts against the frame 320 to adjust the relative fixed or relative sliding state of the slider 330 and the frame 320. It can be understood that when the slider adjustment bolt 331 is loosened, the frame 320 and the slider 330 are clearance-matched, and the slider 330 can slide relative to the frame 320 to make the probe structure approach the electrostatic chuck 100 to be tested or away from the electrostatic chuck 100 to be tested; when the slider adjustment bolt 331 is tightened, the slider adjustment bolt 331 abuts against the frame 320, and the end of the slider adjustment bolt 331 presses the frame and applies a load to the slider 330 so that the slider 330 and the frame 320 are relatively fixed, and the probe structure is fixed relative to the electrostatic chuck 100 to be tested.

[0047] Optionally, the detection assembly 300 further includes a first driving member, and the slider 330 is connected to the output end of the first driving member to enable the slider 330 to slide relative to the frame 320. Exemplarily, the first driving member is configured as a linear motor, and the stroke of the slider 330 is consistent with that of the output end of the first driving member, or the first driving member is configured as a stepping motor, and the output end of the first driving member rotates to drive the slider 330 to slide relative to the frame 320.

[0048] Thus, the slider 330 can slide relative to the frame 320 to drive the probe mechanism to move in the central axis direction of the electrostatic chuck 100 to be tested, so that the probe structure approaches or moves away from the electrostatic chuck 100 to be tested, and the distance between the probe structure and the electrostatic chuck 100 to be tested is adjusted according to actual detection requirements.

[0049] See also Figure 2 According to some embodiments of the present application, the fixing assembly 200 includes a rotating base 210 and a fixing platform 220 . The fixing platform 220 is used to install the electrostatic chuck 100 to be tested and is rotatably connected to the rotating base 210 .

[0050] According to some embodiments of the present application, the frame 320 of the detection assembly 300 is rotatably disposed relative to the central axis of the electrostatic chuck 100 to be tested.

[0051] It can be understood that the fixing component 200 and the detection component 300 can be simultaneously rotatably arranged relative to the central axis of the electrostatic chuck 100 to be tested, or can be individually rotatably arranged relative to the central axis of the electrostatic chuck 100 to be tested, so as to drive the probe structure to rotate circumferentially along the electrostatic chuck 100 to be tested to adjust the detection angle.

[0052] Optionally, the circumferential direction of the probe structure is arranged to overlap with the radial direction of the electrostatic chuck 100 to be tested, so that the probe structure extends perpendicularly to the circumference of the electrostatic chuck 100 to be tested, thereby minimizing the overlapping area between adjacent collection points and improving the detection efficiency.

[0053] Please continue reading Figure 2 According to some embodiments of the present application, the fixing assembly 200 further includes at least one spacer block 230 , and the spacer block 230 is disposed on one side of the fixing platform 220 for mounting the electrostatic chuck 100 to be tested.

[0054] Optionally, the spacer block 230 is detachably connected to the electrostatic chuck 100 to be tested, so as to facilitate the assembly of the electrostatic chuck 100 to be tested to the electrostatic chuck detection device.

[0055] Optionally, there are multiple spacer blocks 230 , and the multiple spacer blocks 230 are evenly distributed along the circumference of the fixed platform 220 , so that the multiple spacer blocks 230 provide a uniform support effect to the fixed platform 220 and the electrostatic chuck 100 to be tested.

[0056] Thus, the electrostatic chuck 100 to be tested is separated from the fixed platform 220 by the spacer block 230. On the one hand, it is convenient to adjust the horizontality of the electrostatic chuck 100 to be tested through the spacer block 230. On the other hand, the electrostatic chuck 100 to be tested can be kept as far away from the rotating base 210 as possible to reduce the electromagnetic interference that may be caused by the electrical components in the rotating base 210.

[0057] According to some embodiments of the present application, the probe structure includes a probe telescopic rod 311 and a first probe 312. The probe telescopic rod 311 is movably connected to the frame 320 along its own axis. The first probe 312 is installed at the end of the probe telescopic rod 311 close to the electrostatic suction cup 100 to be tested. The first probe 312 is configured to detect one of the potential and the magnetic induction intensity at the corresponding position of the electrostatic suction cup 100 to be tested.

[0058] Optionally, the first probe 312 is an electrostatic meter, or the first probe 312 is a Gauss meter.

[0059] Specifically, see Figure 3 The probe telescopic rod 311 is movably connected to the slider 330 along its own axial direction.

[0060] Further optionally, the probe structure also includes a telescopic rod adjustment bolt 313, which is threadedly connected to the slider 330 and abuts against the probe telescopic rod 311 to adjust the relative fixed or relative sliding state of the slider 330 and the probe telescopic rod 311. It can be understood that by loosening the telescopic rod adjustment bolt 313, the probe telescopic rod 311 and the slider 330 are clearance-matched, and the probe telescopic rod 311 can move relative to the slider 330 to make the first probe 312 approach or move away from the central axis of the electrostatic chuck 100 to be tested; by tightening the telescopic rod adjustment bolt 313, the telescopic rod adjustment bolt 313 abuts against the probe telescopic rod 311 to relatively fix the slider 330 and the probe telescopic rod 311, thereby completing the adjustment of the detection radius.

[0061] Further optionally, the probe structure further includes a second driving member, and the probe telescopic rod 311 is connected to the output end of the second driving member to drive the probe telescopic rod 311 to move along its own axial direction. Exemplarily, the second driving member is a linear motor, and the movement stroke of the probe telescopic rod 311 and the first probe 312 is consistent with the movement stroke of the output end of the second driving member; or, the second driving member is configured as a stepping motor, and the output end of the second driving member rotates to drive the probe telescopic rod 311 to move along its own axial direction.

[0062] Optionally, the first probe 312 is detachably connected to the probe telescopic rod 311 .

[0063] According to some embodiments of the present application, the probe structure further includes a second probe, which is configured to measure the other of the electric field and the magnetic induction intensity at the corresponding position of the electrostatic chuck 100 to be tested. The second probe is detachably connected to the probe telescopic rod 311, and the first probe 312 is detachably connected to the probe telescopic rod 311. It can be understood that the first probe 312 and the second probe can be used alternately and replaced according to the detection requirements to detect the uniformity of the electric field and the uniformity of the magnetic field of the electrostatic chuck 100 to be tested, thereby improving the uniformity of the adsorption force of the electrostatic chuck and reducing the negative impact of the electrostatic chuck on the detection electron beam.

[0064] Exemplarily, the first probe 312 is configured to detect the potential at the corresponding position of the electrostatic chuck 100 to be tested, and the second probe is configured to detect the magnetic induction intensity at the corresponding position of the electrostatic chuck 100 to be tested. Specifically, the first probe 312 is an electrostatic meter, and the second probe is a gauss meter.

[0065] Thus, the probe telescopic rod 311 moves along its own axial direction to drive the first probe 312 to approach or move away from the central axis of the electrostatic chuck 100 to be tested, thereby adjusting the detection radius of the detection assembly 300.

[0066] According to some embodiments of the present application, the probe telescopic rod 311 includes a rod body and a feeding structure, the feeding structure is used to drive the first probe to move axially relative to the rod body, the feeding structure is connected to the rod body and the first probe 312 is installed at the output end of the feeding structure.

[0067] Optionally, the movement accuracy of the feeding structure is less than that of the probe telescopic rod 311 , and the feeding structure and the probe telescopic rod 311 can respectively perform coarse adjustment and fine adjustment on the first probe 312 , thereby improving the adjustment accuracy of the electrostatic chuck detection device for the detection radius.

[0068] Optionally, the first probe 312 is detachably mounted on the output end of the feeding structure, or the first probe 312 is fixed to the output end of the feeding structure and the feeding structure is detachably mounted on the rod body.

[0069] Thus, the rod body can move along its own axial direction to drive the first probe 312 to approach or move away from the central axis of the electrostatic suction cup 100 to be tested, and the feeding structure can further drive the first probe 312 to extend or retract relative to the rod body to achieve two-stage adjustment of the detection radius, thereby improving the adjustment accuracy of the electrostatic suction cup detection device and thereby improving the detection accuracy.

[0070] Second, see Figure 4 The present application provides an electrostatic chuck detection method, which is implemented based on the electrostatic chuck detection device provided by any of the above embodiments. The electrostatic chuck detection method includes:

[0071] S100, obtaining the potentials of N collection points on the surface of the electrostatic chuck;

[0072] S210, drawing a potential map of the surface of the electrostatic chuck based on the potentials of the N collection points;

[0073] S220, obtaining the degree of uniform distribution of the electric field on the surface of the electrostatic chuck based on the potential diagram;

[0074] S300, obtaining the potential difference between each collection point and its surrounding collection points. If the potential difference is greater than a preset threshold, the collection point is recorded as an abnormal area. If all the potential differences of the N collection points are less than the preset threshold, the electrostatic chuck is confirmed to be qualified.

[0075] Therefore, the electric potentials of different collection points on the surface of the electrostatic chuck 100 to be tested are obtained through the electrostatic chuck detection device, and then the electric field distribution on the surface of the electrostatic chuck is detected by fitting the electric potential map. The electric field distribution on the surface of the electrostatic chuck can be judged once, and a secondary judgment is made by comparing the electric potential difference between adjacent collection points with a preset threshold value to obtain whether there is an abnormal area of ​​electric potential distribution on the surface of the electrostatic chuck. An electrostatic chuck without an abnormal area is deemed to have passed the inspection and can be used to fix wafers in semiconductor inspection equipment or processing procedures.

[0076] It is understandable that the preset threshold value can be adjusted according to actual detection requirements. The smaller the preset threshold value, the higher the detection standard of the electrostatic chuck, and the more uniform the adsorption force that a qualified electrostatic chuck can provide.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. An electrostatic chuck detection device, characterized in that: include: A fixing assembly (200) for mounting the electrostatic chuck (100) to be tested; A detection assembly (300) comprises a frame (320) and a probe structure, wherein the probe structure is movably mounted on the frame (320) along its own axial direction so that the probe structure can move to a side of the electrostatic chuck (100) to be tested that is away from the fixed assembly (200) to perform detection, and the probe structure is configured to detect at least one of a potential and a magnetic induction intensity at a corresponding position of the electrostatic chuck (100) to be tested; The probe structure can move along its own axis to adjust the distance between its detection point and the center of the electrostatic chuck, at least one of the fixing component (200) and the detection component (300) can be rotatably arranged around the central axis of the electrostatic chuck (100) to be tested, and the probe structure and the electrostatic chuck (100) to be tested can rotate relative to each other to adjust the detection angle.

2. The electrostatic chuck detection device according to claim 1, characterized in that: The detection assembly (300) further comprises a slider (330), wherein the slider (330) is slidably matched with the frame (320) along the central axis direction of the electrostatic chuck (100) to be tested, and the probe structure is movably mounted on the slider (330) along its own axial direction.

3. The electrostatic chuck detection device according to claim 2, characterized in that: The detection assembly (300) further comprises a slider adjusting bolt (331), wherein the slider adjusting bolt (331) is threadedly connected to the slider (330), so that by rotating the slider adjusting bolt (331), an end of the slider adjusting bolt (331) is pressed tightly against the frame, thereby fixing the slider to the frame.

4. The electrostatic chuck detection device according to claim 2, characterized in that: The fixing assembly (200) comprises a rotating base (210) and a fixing platform (220), wherein the fixing platform (220) is used to mount the electrostatic chuck (100) to be tested and is rotatably connected to the rotating base (210).

5. The electrostatic chuck detection device according to claim 1, characterized in that: The probe structure comprises a probe telescopic rod (311) and a first probe (312), wherein the probe telescopic rod (311) is movably connected to the frame (320) along its own axis, and the first probe (312) is installed on the probe telescopic rod and is configured to detect one of the potential and the magnetic induction intensity at the corresponding position of the electrostatic chuck (100) to be tested.

6. The electrostatic chuck detection device according to claim 5, characterized in that: The probe structure also includes a second probe, which is configured to measure the other of the electric field and the magnetic induction intensity at a corresponding position of the electrostatic chuck (100) to be tested, the second probe is detachably connected to the probe telescopic rod (311), the first probe (312) is detachably connected to the probe telescopic rod (311), and the second probe and the first probe (312) are used alternately.

7. The electrostatic chuck detection device according to claim 5, characterized in that: The probe telescopic rod (311) comprises a rod body and a feeding structure, wherein the feeding structure is used to drive the first probe (312) to move axially relative to the rod body, the feeding structure is connected to the rod body and the output end of the feeding structure is detachably connected to the first probe (312).

8. The electrostatic chuck detection device according to claim 1, characterized in that: The fixing assembly (200) further comprises at least one spacer block (230), wherein the spacer block (230) is arranged on one side of the fixing assembly (200) for mounting the electrostatic chuck to be tested (100) so as to space the electrostatic chuck to be tested (100) from the fixing assembly (200), and the electrostatic chuck to be tested (100) is detachably connected to the spacer block (230).

9. The electrostatic chuck detection device according to claim 8, characterized in that: There are a plurality of the spacer blocks (230), and the plurality of spacer blocks (230) are evenly distributed along the circumference of the fixing assembly (200).

10. An electrostatic chuck detection method, applied to the electrostatic chuck detection device according to any one of claims 1 to 9, characterized in that: Detection methods include: Obtaining the potentials of N collection points on the surface of the electrostatic chuck; A potential map of the surface of the electrostatic chuck is drawn based on the potentials of N acquisition points; The degree of uniform distribution of the electric field on the surface of the electrostatic chuck is obtained based on the potential diagram; The potential difference between each collection point and its surrounding collection points is obtained. If the potential difference is greater than a preset threshold, the collection point is recorded as an abnormal area. If all the potential differences of N collection points are less than the preset threshold, the electrostatic chuck is confirmed to be qualified.

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