Temperature control method, device and system and readable storage medium

Abstract

The invention provides a temperature control method, device and system and a readable storage medium. The temperature control method comprises the following steps: acquiring a real-time temperature and a target temperature of controlled equipment; determining a temperature difference level according to the temperature difference between the real-time temperature and the target temperature; determining limited power according to the temperature difference and the target temperature; determining whether PID adjustment is needed or not according to the temperature difference level; when PID adjustment needs to be carried out, PID adjustment is carried out according to the temperature difference, a PID adjustment result is obtained, output power is determined according to the PID adjustment result, and temperature control is carried out on the controlled equipment according to the output power and the limiting power. By increasing the limiting power, the influence caused by heating lag can be effectively prevented, whether PID adjustment is needed or not is determined through temperature difference grading, and high-precision temperature control can be achieved.

Description

Technical Field

[0001] The present application relates to the field of temperature control technology, and in particular to a temperature control method, device, system and readable storage medium. Background Art

[0002] In the existing technology, the equipment is cooled mainly by natural cooling without external cooling devices. The heating adopts direct PID (Proportional, Integral, Differential) temperature control to heat the pipeline. By increasing the temperature of the pipeline, the liquid to be tested is heated. The temperature feedback adopts NTC (Negative Temperature Coefficient) to measure the module temperature. However, due to the weak heat dissipation rate of the equipment and the fact that the temperature measurement feedback has only one temperature measurement point, this heating method will cause the temperature of the heating module itself to continue to drive the flow path heating even if the PID algorithm automatically stops heating, which will cause the temperature to have a certain overshoot, that is, the heating has hysteresis and overshoot. The traditional PID adjustment method can quickly adjust and stabilize the temperature for systems that respond quickly to temperature changes, but for lagging systems, the PID algorithm will also have problems such as too many oscillations and too slow temperature stabilization rate. Summary of the invention

[0003] The present application provides a temperature control method, device, system and readable storage medium, which can solve the technical problems in the prior art of excessive temperature control oscillation times and slow temperature stabilization rate without an active cooling system.

[0004] In the first aspect, an embodiment of the present application provides a temperature control method, including: obtaining the real-time temperature and target temperature of a controlled device; determining the temperature difference level according to the temperature difference between the real-time temperature and the target temperature; determining the limiting power according to the temperature difference and the target temperature; determining whether PID adjustment is required according to the temperature difference level; when PID adjustment is required, performing PID adjustment according to the temperature difference and obtaining the PID adjustment result, determining the output power according to the PID adjustment result, and controlling the temperature of the controlled device according to the output power and the limiting power.

[0005] Preferably, the temperature difference level includes a first temperature difference level and a second temperature difference level, and the temperature difference corresponding to the first temperature difference level is greater than the temperature difference corresponding to the second temperature difference level; determining whether PID adjustment is required according to the temperature difference level includes: when the temperature difference level is the second temperature difference level, PID adjustment is required.

[0006] Further preferably, the temperature difference level further includes a third temperature difference level, and the temperature difference corresponding to the third temperature difference level is less than the temperature difference corresponding to the second temperature difference level; the PID control includes a first PID control and a second PID control; and determining whether PID adjustment is required according to the temperature difference level includes: when the temperature difference level is the second temperature difference level, the first PID control is required; when the temperature difference level is the third temperature difference level, the second PID control is required. The first PID control amplitude is greater than the second PID control amplitude.

[0007] Further preferably, determining whether PID adjustment is required according to the temperature difference level includes: when the temperature difference level is the first temperature difference level, PID adjustment is not required; and controlling the temperature of the controlled device according to the limited power.

[0008] Preferably, performing PID adjustment according to the temperature difference and obtaining the PID adjustment result includes: determining PID adjustment parameters according to the real-time temperature, the first moment temperature corresponding to the real-time temperature, and the second moment temperature corresponding to the real-time temperature, and performing PID adjustment according to the PID adjustment parameters to obtain the PID adjustment result.

[0009] Preferably, controlling the temperature of the controlled device according to the output power and the limiting power includes: when the output power is less than or equal to the limiting power, controlling the temperature of the controlled device according to the output power; when the output power is greater than, equal to or greater than the limiting power, controlling the temperature of the controlled device according to the limiting power.

[0010] Preferably, determining the limiting power according to the temperature difference and the target temperature includes: obtaining the real-time temperature according to a preset period and obtaining the periodic temperature difference between the real-time temperature of each period and the target temperature; determining the limiting power of the target temperature corresponding to each period according to the periodic temperature difference and the target temperature.

[0011] In the second aspect, the embodiment of the present application also provides a temperature control device, including: a temperature acquisition module, configured to obtain the real-time temperature of the controlled device; a temperature control setting module, configured to obtain the target temperature of the controlled device; a temperature difference level determination module, configured to determine the temperature difference level according to the temperature difference between the real-time temperature and the target temperature; a power limit acquisition module, configured to determine the power limit according to the temperature difference and the target temperature; an adjustment judgment module, configured to determine whether PID adjustment is required according to the temperature difference level; a PID adjustment module, configured to perform PID adjustment according to the temperature difference and obtain the PID adjustment result when PID adjustment is required, and determine the output power according to the PID adjustment result; a temperature control module, configured to control the temperature of the controlled device according to the output power and the power limit.

[0012] In the third aspect, the embodiment of the present application also provides a temperature control system, including a temperature control setting unit, a temperature acquisition unit, an MCU, a heating unit and a controlled unit; the temperature control setting unit and the temperature acquisition unit are respectively connected to the MCU, the MCU is connected to the heating unit, and the controlled unit is connected to the heating unit and the temperature acquisition unit; the temperature control setting unit is used to obtain the target temperature of the controlled unit; the temperature acquisition unit is used to collect the real-time temperature of the controlled unit; the MCU is used to determine the temperature difference level according to the temperature difference between the target temperature and the real-time temperature, and at the same time determine the limiting power according to the temperature difference and the target temperature, and determine whether PID adjustment is needed according to the temperature difference level; when PID adjustment is needed, PID adjustment is performed according to the temperature difference and the PID adjustment result is obtained, the output power is determined according to the PID adjustment result, and the output power and the limiting power are compared; the heating unit is used to heat the controlled unit according to the output power or the limiting power.

[0013] In a third aspect, an embodiment of the present application further provides a readable storage medium, on which a temperature control program is stored, wherein when the temperature control program is executed by a processor, the steps of the temperature control method described above are implemented.

[0014] In the present application, by increasing the upper and lower limits of the output power, the influence of heating lag can be effectively prevented. By dividing the temperature difference into segments and adopting different temperature control strategies, the temperature rise rate and cooling rate can be effectively increased, the temperature stabilization speed can be increased, and the temperature fluctuation range can be reduced, thereby achieving high-precision temperature control. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the temperature control system structure in one embodiment of the present application; Figure 2 This is a flow chart of a temperature control method in another embodiment of the present application; FIG3 (a) is a schematic diagram of the temperature control result of the prior art in another embodiment of the present application; FIG3 (b) is a schematic diagram of the temperature control result of FIG3 (a) after the present application is adopted; Figure 4 This is a schematic diagram of the functional modules of a temperature control device in another embodiment of the present application; Figure 5 This is a schematic diagram of the hardware structure of the temperature control device involved in the embodiment of the present application. DETAILED DESCRIPTION

[0016] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0017] In order to make the module temperature control more accurate, the present application provides a temperature control method, device, system and readable storage medium. By increasing the upper and lower limits of power output and temperature difference graded temperature control, it can effectively prevent the influence of heating lag, increase the module heating rate and cooling rate, and achieve stable temperature control.

[0018] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0019] like Figure 1 As shown, in one embodiment, the present application provides a temperature control system, including a temperature control setting unit, a temperature acquisition unit, an MCU (Microcontroller Unit), a heating unit and a controlled unit. The temperature control setting unit and the temperature acquisition unit are respectively connected to the MCU, the MCU is connected to the heating unit, and the controlled unit is connected to the heating unit and the temperature acquisition unit; the temperature control setting unit is used to obtain the target temperature of the controlled unit; the temperature acquisition unit is used to collect the real-time temperature of the controlled unit; the MCU is used to determine the temperature difference level according to the temperature difference between the target temperature and the real-time temperature, and at the same time determine the limit power according to the temperature difference and the target temperature, and determine whether PID adjustment is required according to the temperature difference level; when PID adjustment is required, PID adjustment is performed according to the temperature difference and the PID adjustment result is obtained, the output power is determined according to the PID adjustment result, and the output power and the limit power are compared; the heating unit is used to heat the controlled unit according to the output power or the limit power.

[0020] Specifically, the temperature control setting unit is used to set the target temperature to be achieved. The output end of the temperature control setting unit is connected to the input end of the MCU. After the target temperature is set, the temperature control setting unit inputs it into the MCU. The MCU is connected to the converter chip (AD chip) in the temperature acquisition unit through the SPI (Serial Peripheral Interface) communication method. The AD chip can compare the voltage at the measurement point with the reference voltage and output the AD value. The voltage value on the NTC (Negative Temperature Coefficient) thermistor can be calculated through the AD value of the AD chip, and its resistance value can be calculated according to the circuit connection relationship. Then, it is converted into temperature through the conversion formula of resistance value and temperature to obtain the real-time temperature of the controlled unit. The MCU compares the difference between the current real-time temperature and the target temperature, determines how to adjust the output heating power, and outputs it from the heating unit. The temperature of the controlled unit changes and is transmitted back to the MCU. This is a cycle. The controlled unit cools down naturally, and the heating and cooling performance of the controlled unit is changed only by adjusting the heating power.

[0021] Among them, PID is the abbreviation of Proportional, Integral, and Differential. As the name implies, the PID control algorithm is a control algorithm that combines the three links of proportion, integration, and differentiation. It is the most mature and widely used control algorithm in continuous systems. This control algorithm appeared in the 1930s and 1940s and is suitable for occasions where the model of the controlled object is not clearly understood. Both the actual operation experience and theoretical analysis have shown that when this control law is used to control many industrial processes, relatively satisfactory results can be obtained. The essence of PID control is to perform calculations based on the input deviation value according to the functional relationship of proportion, integration, and differentiation, and the calculation results are used to control the output.

[0022] NTC temperature sensor is a thermistor, probe, its principle is: the resistance value drops rapidly as the temperature rises. It is usually composed of 2 or 3 metal oxides, mixed in a fluid-like clay, and sintered into a dense sintered ceramic in a high-temperature furnace. The actual size is very flexible, they can be as small as 0.010 inches or a very small diameter. The maximum size is almost unlimited, but it is usually suitable for less than half an inch. Under a certain measurement power, the resistance value of NTC thermistor drops rapidly as the temperature rises. Using this characteristic, the NTC thermistor can be used to determine the corresponding temperature by measuring its resistance value, thereby achieving the purpose of detecting and controlling temperature.

[0023] Microcontroller Unit (MCU), also known as single chip microcomputer or single chip microcomputer, is a chip-level computer that appropriately reduces the frequency and specifications of the central processing unit (CPU), and integrates memory, timer, USB, A / D conversion, UART, PLC, DMA and other peripheral interfaces, and even LCD driver circuits on a single chip to make different combination controls for different applications. MCU can be seen in mobile phones, PC peripherals, remote controls, automotive electronics, industrial stepper motors, robot arm control, etc.

[0024] Converter chips include A / D converter chips and D / A converter chips. Analog-to-digital converter is A / D converter, or ADC for short. A stands for analog quantity and D stands for digital quantity. It usually refers to an electronic component that converts analog signals into digital signals. Digital-to-analog converter, also known as D / A converter, or DAC for short, is a device that converts digital quantities into analog ones.

[0025] SPI (Serial Peripheral Interface) bus is a synchronous serial interface technology introduced by Motorola. The SPI bus system is a synchronous serial external interface that allows MCU to communicate and exchange data with various peripheral devices in a serial manner. Peripheral devices include FLASHRAM, A / D converters, network controllers, MCUs, etc. SPI is a high-speed, full-duplex, synchronous communication bus.

[0026] PID control is proportional, integral and differential control. It has a simple and practical structure and is often used in industrial production. The obvious disadvantage is that it is difficult to adjust the PID parameters on site and it is easily affected by external interference. For process control with large lag, the adjustment time is too long. Its control algorithm requires the establishment of a model in advance, and the impact on the system dynamics is difficult to be incorporated into the model.

[0027] The parameter tuning of PID controller is the core content of control system design. It determines the proportional coefficient, integral time and differential time of PID controller according to the characteristics of the controlled process. There are many methods for PID controller parameter tuning, which can be summarized into two categories: one is the theoretical calculation tuning method. It is mainly based on the mathematical model of the system and determines the controller parameters through theoretical calculation. The calculated data obtained by this method may not be directly used, and must be adjusted and modified through engineering practice. The second is the engineering tuning method, which mainly relies on engineering experience and is carried out directly in the test of the control system. The method is simple and easy to master, and is widely used in engineering practice. The engineering tuning methods of PID controller parameters mainly include critical proportion method, reaction curve method and attenuation method. The two methods have their own characteristics, and their common point is that they are tested and then the controller parameters are tuned according to the engineering experience formula. However, no matter which method is used, the controller parameters obtained need to be finally adjusted and improved in actual operation. The critical proportion method is generally used. The steps for tuning the PID controller parameters using this method are as follows: ⑴ First, preselect a sampling period that is short enough for the system to work; ⑵ Only add the proportional control link until the system shows critical oscillation in response to the input step, and record the proportional gain and critical oscillation period at this time; ⑶ Calculate the parameters of the PID controller through the formula under a certain control degree.

[0028] The controlled unit can be any equipment that needs temperature control, such as a conductivity cell, an ampere cell, a column temperature box, an incubator, a chromatograph, etc.

[0029] In another embodiment, if Figure 2 The present application provides a temperature control method, comprising the following steps: S1. Obtain the real-time temperature and target temperature of the controlled device; determine the temperature difference level according to the temperature difference between the real-time temperature and the target temperature; determine the limiting power according to the temperature difference and the target temperature.

[0030] In a specific embodiment, the controlled device is a device that needs to be temperature controlled, and may also be a controlled module, a controlled unit, a controlled device, etc. Specifically, it may be any device / module / unit that needs to be temperature controlled, such as a conductivity cell, an ampere cell, a column temperature box, an incubator, a chromatograph, etc. In one embodiment, the real-time temperature of the controlled device can be obtained through an NTC thermistor, and the target temperature that the controlled device wants to reach can be independently set through the temperature control setting module. After obtaining the real-time temperature and the target temperature of the controlled device, the temperature difference level of the temperature difference can be determined according to the temperature difference between the real-time temperature and the target temperature.

[0031] In one embodiment, the temperature difference level may include a first temperature difference level and a second temperature difference level, and the temperature difference corresponding to the first temperature difference level is greater than the temperature difference corresponding to the second temperature difference level.

[0032] In another embodiment, the temperature difference level may further include a third temperature difference level, and the temperature difference corresponding to the third temperature difference level is smaller than the temperature difference corresponding to the second temperature difference level.

[0033] That is, the first temperature difference level may be the level at which the temperature difference between the actual temperature and the target temperature is the largest, the second temperature difference level may be the level at which the temperature difference between the actual temperature and the target temperature is medium, and the third temperature difference level may be the level at which the temperature difference between the actual temperature and the target temperature is the smallest. For example, the first temperature difference level may be the difference between the actual temperature and the target temperature within 3°C, the second temperature difference level may be the difference between the actual temperature and the target temperature within 0.3°C, and the third temperature difference level may be the difference between the actual temperature and the target temperature within 0.02°C. In other embodiments, a fourth temperature difference level may also be included, and the fourth temperature difference level may be a temperature difference close to the target temperature, for example, a temperature difference between the actual temperature and the target temperature within 0.001. Specifically, when the actual temperature differs from the target temperature by [-3, -0.3) and (0.3, 3], the temperature difference is at the first temperature difference level, when the actual temperature differs from the target temperature by [-0.3, -0.02) and (0.02, 0.3], the temperature difference is at the second temperature difference level, when the actual temperature differs from the target temperature by [-0.02, -0.001) and (0.001, 0.02], the temperature difference is at the third temperature difference level, and when the actual temperature differs from the target temperature by [-0.001, 0.001], the temperature difference is at the fourth temperature difference level. In other embodiments, the temperature difference data in each temperature difference level can be set according to actual needs.

[0034] In one embodiment, while confirming the temperature difference level, the limit power can be determined according to the temperature difference and the target temperature. Specifically, the real-time temperature can be obtained according to a preset period and the periodic temperature difference between the real-time temperature and the target temperature of each period can be obtained, and then the limit power of the target temperature corresponding to each period can be determined according to the periodic temperature difference and the target temperature. In the embodiment, the limit power can be obtained by manual testing or automatically calculated.

[0035] Among them, the power limit includes the power limit value, and the power limit value includes the power lower limit and the power upper limit. The power lower limit refers to the minimum power value required to reach the target temperature under a certain temperature difference, and the power upper limit refers to the maximum power value required to reach the target temperature under a certain temperature difference. That is, under a certain temperature difference, if you want to reach the target temperature, you must choose a power between the corresponding power lower limit value and power upper limit value under the temperature difference to quickly reach its target temperature.

[0036] In one embodiment, obtaining the limited power through manual testing can be specifically as follows: determining the corresponding limited power under different temperature differences in advance through manual testing. Specifically, the set temperature can be divided into multiple intervals according to the temperature range used by the controlled module. For example, when the target temperature setting range of the controlled module is 40°C to 80°C, each 20°C can be an interval, that is, 40°C-59°C is the first interval, 60°C-79°C is the second interval, and 80°C or above is the third interval. Because the device adopts a natural cooling method and does not adopt auxiliary cooling measures, it is necessary to test the upper and lower limits of the power at the working temperature. Assuming that the controlled module is a laboratory device, the laboratory device is generally 20°C, that is, it can be tested at an ambient temperature of 10°C-30°C. First, the temperature of the controlled module needs to be higher than the ambient temperature. If it is lower than the ambient temperature, it cannot be cooled. When the target temperature of the controlled module temperature is 40°C, 60°C, and 80°C, the lower and upper limits of the power that can be heated by the controlled module within the working temperature range, as well as the lower and upper limits of the power for cooling, are tested. Under the condition that the required temperature climbing and stabilization time (the time from reaching the target temperature to stabilizing within the error range) are met, the limit power can take an approximate value and be used as long as the conditions are met, or you can take the middle value after multiple tests and then pre-set it according to the test data. If there is a demand for the climbing time and stabilization time, you can change the parameters, measure the climbing time and the temperature stabilization time multiple times, and take the optimal value as the limit power. According to the experimental results, if an approximate value is taken, the conductivity cell can reach the target temperature and stabilize within 30-40 minutes. If the optimal value is taken, the time can be increased by 5-10 minutes.

[0037] In another embodiment, obtaining the limited power by automatic calculation can be specifically as follows: automatically determining the limited power and storing the power limit value. Each time the temperature measurement is started, the last limited power value can be automatically read. When the environment or the performance of the controlled module changes, and the current limit value is an obstacle to heating or cooling, that is, the temperature cannot be raised or lowered within a certain time range, the power limit value can be correspondingly increased or decreased and stored. The hysteresis problem can also be solved by reducing the control frequency, that is, the original 0.1s control is reduced to 1s control. By increasing the response time, the hysteresis of the system is released, and the process of erroneous increase or decrease of power is reduced.

[0038] In other embodiments, the power limit may be determined by combining a manual test method and an automatic calculation method.

[0039] In addition, when the real-time temperature differs greatly from the target temperature, the maximum power of the device, that is, the full power, can be directly used as the limiting power.

[0040] S2. Determine whether PID adjustment is required based on the temperature difference level.

[0041] In the case where there are only the first temperature difference level and the second temperature difference level, when the temperature difference level is the second temperature difference level, PID adjustment is required.

[0042] When there are the first temperature difference level, the second temperature difference level and the third temperature difference level, when the temperature difference level is the second temperature difference level, the first PID regulation is required, and when the temperature difference level is the third temperature difference level, the second PID regulation is required, and the first PID regulation amplitude is greater than the second PID regulation amplitude.

[0043] In the case of a first temperature difference level, a second temperature difference level, a third temperature difference level and a fourth temperature difference level, when the temperature difference level is the second temperature difference level, the first PID regulation is required, when the temperature difference level is the third temperature difference level and / or the fourth temperature difference level, the second PID regulation is required, and the first PID regulation amplitude is greater than the second PID regulation amplitude. Or, when the temperature difference level is the second temperature difference level, the first PID regulation is required, when the temperature difference level is the third temperature difference level, the second PID regulation is required, when the temperature difference level is the fourth temperature difference level, the third PID regulation is required, and the first PID regulation amplitude is greater than the second PID regulation amplitude, and the second PID regulation amplitude is greater than the third PID regulation amplitude. In specific implementation, the level to which the temperature difference level needs to be divided can be determined according to the needs of the controlled device, and the PID regulation amplitude required for each temperature difference level can be determined according to the needs.

[0044] In the above cases, when the temperature difference level is the first temperature difference level, it can be set to not require PID adjustment, and the temperature of the controlled device can be controlled directly according to the limited power. Even when the first temperature difference level is too large, the temperature of the controlled device can be controlled directly at full power output.

[0045] In a specific embodiment, after determining the temperature difference level, it can be determined whether PID adjustment is required according to the temperature difference level, that is, different temperature control methods can be executed according to different temperature difference levels to improve the control rate of the temperature curve.

[0046] For example, when the difference between the real-time temperature and the target temperature is large, in order to maximize the efficiency of heating and cooling, PID control may not be performed. When the difference between the actual temperature and the target temperature is medium or small, in order to make the control response quick, PID control may be performed.

[0047] S3. When PID adjustment is required, PID adjustment is performed according to the temperature difference and a PID adjustment result is obtained. The output power is determined according to the PID adjustment result. The temperature of the controlled device is controlled according to the output power and the limited power.

[0048] In one embodiment, performing PID adjustment according to the temperature difference and obtaining the PID adjustment result may include: determining PID adjustment parameters according to the real-time temperature, the temperature at a first moment corresponding to the real-time temperature, and the temperature at a second moment corresponding to the real-time temperature, and performing PID adjustment according to the PID adjustment parameters to obtain the PID adjustment result.

[0049] In one embodiment, controlling the temperature of the controlled device according to the output power and the limiting power includes: when the output power is less than or equal to the limiting power, controlling the temperature of the controlled device according to the output power; when the output power is greater than, equal to or greater than the limiting power, controlling the temperature of the controlled device according to the limiting power.

[0050] Specifically, when PID adjustment is not required, the power is output directly according to the limited power. When PID adjustment is required, appropriate PID parameters can be selected and adjusted according to the temperature difference. After adjustment, if the power is still required to be limited, the power can be output according to the limited power range.

[0051] In one embodiment, when the real-time temperature is significantly lower than the target temperature, that is, the actual temperature is significantly lower than the target temperature, heating can be directly performed according to limited power or full power output to speed up the temperature rise. When the real-time temperature is significantly higher than the target temperature, the output can be directly stopped to increase the cooling efficiency.

[0052] When the temperature difference level is medium, PID control is used at this time. The purpose is to hope that the control response is fast and the power required for balance can be quickly increased or decreased. Therefore, the PID parameters need to be set to a type with a larger adjustment range under the same temperature change.

[0053] When the temperature difference level is small and / or the actual temperature is close to the target temperature, PID control is used at this time. The purpose is to stabilize the temperature control and not drastically change the output power due to sudden temperature fluctuations. Therefore, the PID parameters need to be set to a type with a smaller adjustment range under the same temperature change.

[0054] In one embodiment, the magnitude of the PID adjustment range can be understood as, for example, for the output power of the entire instrument, such as 0.0-100.0%, for the PID incremental formula △u(k)=Ae(k)-Be(k-1)+Ce(k-2), the A / B / C coefficients can correspond to the three coefficients P / I / D, e(k) is the current temperature difference, e(k-1) is the last temperature difference, e(k-2) is the temperature difference of the last time, and △u(k) is the power that needs to be changed after this calculation. A positive △u(k) means that the power needs to be increased, and a negative value means that the power needs to be reduced. Assuming that the temperature difference is fixed each time, that is, the PID parameter calculated to fluctuate between ±(0.1-1) is a smaller adjustment type, between ±(5-10) is moderate, and ±(15-50) is a larger adjustment type.

[0055] At present, for different temperature differences, the power changes calculated by the same PID parameters are definitely different. The above-mentioned PID parameters with different control ranges are used to control the control range within different temperature difference levels, so that when the temperature difference is large, the temperature can be raised or lowered as quickly as possible, and when the temperature difference is small, the control becomes slower, so that the instrument can be controlled as smoothly as possible.

[0056] In one embodiment, the power limit is increased because some modules have hysteresis, that is, the temperature rise or fall rate is slow, which causes the algorithm to increase or decrease the power too early, resulting in the temperature not being able to drop normally when the temperature is to be lowered, and the temperature not being able to rise normally when the temperature is to be raised. That is, as shown in Figure 3 (a), it will oscillate back and forth like a sine wave periodically and cannot be stable.

[0057] When the actual temperature is significantly lower (higher) than the set value, the upper and lower limits are generally the upper and lower limits of the actual power, which is equivalent to no limit. If it is for the sake of overall machine power considerations, such as not being able to heat at full power, the upper limit can be changed.

[0058] For other temperature difference levels, the limit value is uniformly selected according to the currently set target temperature.

[0059] The advantage of this application is that by adding upper and lower limits of power output, the influence of heating lag can be effectively prevented. By segmenting the temperature difference and adopting different temperature control strategies, the temperature climbing rate and cooling rate can be effectively increased, the temperature stabilization speed can be increased, and the temperature fluctuation range can be reduced. In addition, high-precision temperature control can be achieved by using simple and universal PID adjustment.

[0060] After using this method, as shown in Figure 3 (b), the temperature overshoot is well suppressed and the temperature fluctuation range is suppressed within ±0.001 degrees. Before using this method, the temperature fluctuation is about ±0.1 degrees.

[0061] In a second aspect, an embodiment of the present application also provides a temperature control device.

[0062] Figure 4 A schematic diagram of the functional modules of a temperature control device in an embodiment of the present application is shown.

[0063] Reference Figure 4 In one embodiment, the temperature control device includes: a temperature acquisition module, configured to obtain the real-time temperature of the controlled device; a temperature control setting module, configured to obtain the target temperature of the controlled device; a temperature difference level determination module, configured to determine the temperature difference level according to the temperature difference between the real-time temperature and the target temperature; a power limit acquisition module, configured to determine the power limit according to the temperature difference and the target temperature; an adjustment judgment module, configured to determine whether PID adjustment is required according to the temperature difference level; a PID adjustment module, configured to perform PID adjustment according to the temperature difference and obtain the PID adjustment result when PID adjustment is required, and determine the output power according to the PID adjustment result; a temperature control module, configured to control the temperature of the controlled device according to the output power and the power limit.

[0064] In another embodiment, the temperature difference level includes a first temperature difference level and a second temperature difference level, and the temperature difference corresponding to the first temperature difference level is greater than the temperature difference corresponding to the second temperature difference level; the adjustment judgment module can be configured to perform PID adjustment when the temperature difference level is the second temperature difference level.

[0065] In another embodiment, the temperature difference level further includes a third temperature difference level, and the temperature difference corresponding to the third temperature difference level is less than the temperature difference corresponding to the second temperature difference level; the PID control includes a first PID control and a second PID control; the adjustment judgment module can be configured to perform the first PID control when the temperature difference level is the second temperature difference level; and perform the second PID control when the temperature difference level is the third temperature difference level. The first PID control amplitude is greater than the second PID control amplitude.

[0066] In another embodiment, the adjustment judgment module may also be configured to, when the temperature difference level is the first temperature difference level, not require PID adjustment; and control the temperature of the controlled device according to the limited power.

[0067] In another embodiment, the PID adjustment module includes a PID adjustment result acquisition module, which can be configured to determine the PID adjustment parameters based on the real-time temperature, the first moment temperature corresponding to the real-time temperature, and the second moment temperature corresponding to the real-time temperature, and perform PID adjustment according to the PID adjustment parameters to obtain the PID adjustment result.

[0068] In another embodiment, the temperature control module can also be configured to control the temperature of the controlled device according to the output power when the output power is less than or less than equal to the limiting power; when the output power is greater than or equal to or greater than the limiting power, control the temperature of the controlled device according to the limiting power.

[0069] In another embodiment, the power limiting acquisition module can also be configured to obtain the real-time temperature according to a preset cycle and obtain the periodic temperature difference between the real-time temperature of each cycle and the target temperature; determine the power limiting of the target temperature corresponding to each cycle according to the periodic temperature difference and the target temperature.

[0070] Among them, the functional implementation of each module in the above-mentioned temperature control device corresponds to the various steps in the above-mentioned temperature control method embodiment, and its functions and implementation processes will not be repeated here one by one.

[0071] In a third aspect, an embodiment of the present application provides a temperature control device, which may be a device with data processing functions, such as a personal computer (PC), a laptop computer, or a server.

[0072] Figure 5 A schematic diagram of the hardware structure of the temperature control device involved in the embodiment of the present application is shown.

[0073] Reference Figure 5 In an embodiment of the present application, the temperature control device may include a processor, a memory, a communication interface, and a communication bus.

[0074] The communication bus may be of any type and is used to interconnect the processor, the memory, and the communication interface.

[0075] The communication interface includes input / output (I / O) interface, physical interface and logical interface, etc., which are used to realize the interconnection of devices inside the temperature control equipment operation data processing equipment, and the interface used to realize the interconnection between the temperature control equipment operation data processing equipment and other devices (such as other computing devices or user devices). The physical interface can be an Ethernet interface, a fiber optic interface, an ATM interface, etc.; the user device can be a display (Display), a keyboard (Keyboard), etc.

[0076] The memory can be various types of storage media, such as random access memory (RAM), read-only memory (ROM), non-volatile RAM (NVRAM), flash memory, optical storage, hard disk, programmable ROM (PROM), erasable PROM (EPROM), electrically erasable PROM (EEPROM), etc.

[0077] The processor may be a general-purpose processor, which may call the temperature control program stored in the memory and execute the temperature control method provided in the embodiment of the present application. For example, the general-purpose processor may be a central processing unit (CPU). The method executed when the temperature control program is called may refer to the various embodiments of the temperature control method of the present application, which will not be described in detail here.

[0078] Those skilled in the art will understand that Figure 5 The hardware structure shown in the figure does not constitute a limitation on the present application, and may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0079] The embodiment of the present application also provides a readable storage medium.

[0080] A temperature control program is stored on the readable storage medium of the present application, and when the temperature control program is executed by the processor, the steps of the temperature control method as described above are implemented.

[0081] Among them, the method implemented when the temperature control program is executed can refer to the various embodiments of the temperature control method of the present application, and will not be repeated here.

[0082] It should be noted that the serial numbers of the above-mentioned embodiments of the present application are only for description and do not represent the advantages or disadvantages of the embodiments.

[0083] The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices. The terms "first", "second" and "third" are used to distinguish different objects, etc., and do not represent a sequence, nor do they limit "first", "second" and "third" to different types.

[0084] In the description of the embodiments of the present application, "exemplary", "for example" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary", "for example" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary", "for example" or "for example" is intended to present related concepts in a specific way.

[0085] In the description of the embodiments of the present application, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; the “and / or” in the text is merely a description of the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, “multiple” refers to two or more than two.

[0086] In some processes described in the embodiments of the present application, multiple operations or steps that appear in a specific order are included, but it should be understood that these operations or steps may not be executed in the order in which they appear in the embodiments of the present application or in parallel, and the sequence number of the operation is only used to distinguish the different operations, and the sequence number itself does not represent any execution order. In addition, these processes may include more or fewer operations, and these operations or steps may be executed in sequence or in parallel, and these operations or steps may be combined.

[0087] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, disk, CD) as described above, and includes a number of instructions for a terminal device to execute the methods described in each embodiment of the present application.

[0088] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A temperature control method, characterized in that: include: Get the real-time temperature and target temperature of the controlled equipment; Determining a temperature difference level according to a temperature difference between the real-time temperature and the target temperature; Determining a power limit according to the temperature difference and the target temperature; Determining whether PID adjustment is required according to the temperature difference level; When PID adjustment is required, PID adjustment is performed according to the temperature difference and a PID adjustment result is obtained, the output power is determined according to the PID adjustment result, and the temperature of the controlled device is controlled according to the output power and the limited power.

2. The temperature control method according to claim 1, characterized in that: The temperature difference level includes a first temperature difference level and a second temperature difference level, the temperature difference corresponding to the first temperature difference level is greater than the temperature difference corresponding to the second temperature difference level; and determining whether PID adjustment is required according to the temperature difference level includes: When the temperature difference level is the second temperature difference level, PID adjustment is required.

3. The temperature control method according to claim 2, characterized in that: The temperature difference level further includes a third temperature difference level, and the temperature difference corresponding to the third temperature difference level is smaller than the temperature difference corresponding to the second temperature difference level; The PID control includes a first PID control and a second PID control; and determining whether PID adjustment is required according to the temperature difference level includes: When the temperature difference level is the second temperature difference level, a first PID control is required; When the temperature difference level is the third temperature difference level, a second PID control is required; The first PID control range is greater than the second PID control range.

4. The temperature control method according to claim 2, characterized in that: Determining whether PID adjustment is required according to the temperature difference level includes: When the temperature difference level is the first temperature difference level, no PID adjustment is required; The temperature of the controlled device is controlled according to the limited power.

5. The temperature control method according to claim 1, characterized in that: The performing PID adjustment according to the temperature difference and obtaining the PID adjustment result comprises: A PID adjustment parameter is determined according to the real-time temperature, a temperature at a first moment corresponding to the real-time temperature, and a temperature at a second moment corresponding to the real-time temperature, and a PID adjustment is performed according to the PID adjustment parameter to obtain the PID adjustment result.

6. The temperature control method according to claim 1, characterized in that: The controlling the temperature of the controlled device according to the output power and the limited power includes: When the output power is less than or equal to the limit power, the temperature of the controlled device is controlled according to the output power; When the output power is greater than, equal to, or greater than the limit power, the temperature of the controlled device is controlled according to the limit power.

7. The temperature control method according to claim 1, characterized in that: The determining of the limited power according to the temperature difference and the target temperature comprises: Acquire the real-time temperature according to a preset cycle and obtain the cycle temperature difference between the real-time temperature of each cycle and the target temperature; The limit power of the target temperature corresponding to each cycle is determined according to the cycle temperature difference and the target temperature.

8. A temperature control device, characterized in that: include: A temperature acquisition module is configured to obtain the real-time temperature of the controlled device; A temperature control setting module, configured to obtain a target temperature of the controlled device; a temperature difference level determination module, configured to determine the temperature difference level according to the temperature difference between the real-time temperature and the target temperature; A limited power acquisition module, configured to determine the limited power according to the temperature difference and the target temperature; An adjustment judgment module is configured to determine whether PID adjustment is required according to the temperature difference level; A PID adjustment module is configured to perform PID adjustment according to the temperature difference and obtain a PID adjustment result when PID adjustment is required, and determine the output power according to the PID adjustment result; The temperature control module is configured to control the temperature of the controlled device according to the output power and the limited power.

9. A temperature control system, characterized in that: include: A temperature control setting unit, a temperature acquisition unit, an MCU, a heating unit and a controlled unit; the temperature control setting unit and the temperature acquisition unit are connected to the MCU respectively, the MCU is connected to the heating unit, and the controlled unit is connected to the heating unit and the temperature acquisition unit; The temperature control setting unit is used to obtain the target temperature of the controlled unit; The temperature acquisition unit is used to acquire the real-time temperature of the controlled unit; The MCU is used to determine the temperature difference level according to the temperature difference between the target temperature and the real-time temperature, determine the limit power according to the temperature difference and the target temperature, and determine whether PID adjustment is required according to the temperature difference level; when PID adjustment is required, perform PID adjustment according to the temperature difference and obtain a PID adjustment result, determine the output power according to the PID adjustment result, and compare the output power with the limit power; The heating unit is used to heat the controlled unit according to the output power or the limited power.

10. A readable storage medium, characterized in that: The readable storage medium stores a temperature control program, wherein when the temperature control program is executed by the processor, the steps of the temperature control method according to any one of claims 1 to 7 are implemented.

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