Temperature control method and system, storage medium and electronic equipment

Abstract

The invention provides a temperature control method and system, a storage medium and electronic device.The temperature control method is applied to the electronic device and comprises the steps that current temperature information and historical temperature information in the electronic device are obtained; obtaining a simulated shell temperature of the electronic equipment according to the current temperature information and the historical temperature information; and adjusting parameters of the electronic equipment according to the simulated shell temperature and the temperature control strategy so as to control the temperature of the electronic equipment. The temperature control method can realize more accurate temperature control of the electronic equipment.

Description

Technical Field

[0001] The present application relates to the field of temperature control of electronic equipment, and in particular to a temperature control method and system, a storage medium and an electronic equipment. Background Art

[0002] As electronic devices continue to develop, the functions that various applications can provide are becoming more comprehensive. However, the performance requirements of these applications are also increasing. When users use these applications, the processors of electronic devices are usually in a high-load operation state, and heat is continuously generated during the use process, which can easily cause electronic devices to overheat, affecting the user experience and may also cause component damage.

[0003] Therefore, how to control the temperature of electronic equipment becomes an urgent problem to be solved. Summary of the invention

[0004] The present application provides a temperature control method and system, a storage medium and an electronic device, which can achieve more accurate temperature control of the electronic device.

[0005] In a first aspect, a temperature control method is provided, which is applied to an electronic device, comprising: obtaining current temperature information and historical temperature information inside the electronic device; obtaining a simulated shell temperature of the electronic device based on the current temperature information and the historical temperature information; and adjusting parameters of the electronic device based on the simulated shell temperature and a temperature control strategy to control the temperature of the electronic device.

[0006] The above-mentioned implementation method can obtain a more stable and responsive simulated housing temperature by combining the current temperature information and the historical temperature information inside the electronic device. Based on the simulated housing temperature, more accurate temperature control of the electronic device can be achieved.

[0007] In combination with the first aspect, in certain implementations of the first aspect, obtaining current temperature information and historical temperature information inside the electronic device includes: obtaining the current temperature information and historical temperature information inside the electronic device through n temperature sensors located inside the electronic device, where n is a positive integer.

[0008] Various types of temperature sensors are installed at key heat sources such as the main board, battery, and charging port inside the electronic device, which can monitor and collect temperature information at each heat source inside the electronic device in real time over a certain period of time.

[0009] In combination with the first aspect, in certain implementations of the first aspect, historical temperature information refers to n×t temperature information obtained by n temperature sensors recording the ambient temperature according to a time interval m (0≤m<T, and m is an integer) within a time period T, where T and t are both positive integers.

[0010] Acquiring the ambient temperature recorded by the temperature sensor within a time period T can improve the response capability of the simulated housing temperature. The time period T and the time interval m can be determined according to the performance of the electronic device or actual application requirements.

[0011] In combination with the first aspect, in some implementations of the first aspect, the simulated housing temperature of the electronic device is obtained according to the current temperature information and the historical temperature information, which is implemented by the following formula: s =T b ×ωXW T , where T s is the simulated shell temperature; T b is the offset coefficient; ω is the weight parameter of the current temperature information and the historical temperature information of the temperature sensor; X is the current temperature information and the historical temperature information of the n temperature sensors; W is the weight parameter of the n temperature sensors.

[0012] Through the above implementation, the weight of each sensor and the weight of the historical temperature information recorded by the sensor are used to simulate the fitting of the shell temperature, and the offset coefficient T is used. b Adjusting the shell temperature obtained by fitting is beneficial to avoiding abnormal fluctuations in the simulated shell temperature, so that the final simulated shell temperature is more accurate.

[0013] In combination with the first aspect, in certain implementations of the first aspect, the offset coefficient is obtained based on n temperature sensors.

[0014] The offset coefficient can be obtained by evaluating the temperature sensor through electronic equipment hardware or other related devices, which can make the simulated shell temperature more accurate.

[0015] In combination with the first aspect, in certain implementations of the first aspect, the temperature control method also includes obtaining a usage scenario of the electronic device; determining the target hardware and target temperature control strategy of the electronic device based on the usage scenario, the target temperature control strategy being the temperature control strategy corresponding to the target hardware; and adjusting the parameters of the target hardware based on the simulated shell temperature and the target temperature control strategy to control the temperature of the electronic device.

[0016] Through the above implementation, it is possible to adjust the parameters of the target hardware in a targeted manner based on the usage scenario of the electronic device, thereby achieving more intelligent temperature control of the electronic device and improving the user experience.

[0017] In a second aspect, a temperature control system is provided, including: an acquisition module for acquiring current temperature information and historical temperature information inside an electronic device; a calculation module for obtaining a simulated shell temperature of the electronic device based on the current temperature information and the historical temperature information; and a processing module for adjusting parameters of the electronic device based on the simulated shell temperature and a temperature control strategy to control the temperature of the electronic device.

[0018] In a third aspect, a computer-readable storage medium is provided, in which a computer program is stored. When the computer program is executed by a computer, the computer implements the method in the first aspect or each implementation manner of the first aspect.

[0019] In a fourth aspect, an electronic device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor executes the method in the first aspect or each implementation manner of the first aspect by calling the computer program. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a flow chart of a temperature control method provided in an embodiment of the present application.

[0021] Figure 2 It is a flow chart of another temperature control method provided in an embodiment of the present application.

[0022] Figure 3 It is a flow chart of another temperature control method provided in an embodiment of the present application.

[0023] Figure 4 It is a structural schematic diagram of a temperature control system provided in an embodiment of the present application.

[0024] Figure 5 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0025] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0026] An embodiment of the present application provides a temperature control method, which can be applied to an electronic device, and the electronic device can be a smart phone, a tablet computer, a personal digital assistant (PDA), a wearable device, etc.

[0027] In some related technologies, the temperature control method of electronic devices is usually based on the internal temperature of the electronic device, but the internal temperature cannot accurately reflect the actual physical sensation of the user when using the electronic device, that is, the shell temperature of the electronic device, which leads to the temperature control strategy (cooling action) based on the internal temperature being difficult to achieve precise temperature control of the electronic device based on the user's physical sensation, affecting the user experience, and lacking real-time and accuracy.

[0028] Based on the above situation, the temperature control method provided in the present application performs temperature control based on the shell temperature of the electronic device, which can solve or partially solve the above problem.

[0029] Figure 1 A schematic diagram of a temperature control method provided in an embodiment of the present application. Figure 1 As shown, the temperature control method may include steps 101 to 103 .

[0030] 101. Obtain current temperature information and historical temperature information inside the electronic device.

[0031] The current temperature information and the historical temperature information inside the electronic device may be collectively referred to as the temperature information inside the electronic device, that is, the temperature information inside the electronic device may include the current temperature information and the historical temperature information.

[0032] Optionally, step 101 may include acquiring current temperature information and historical temperature information inside the electronic device through n temperature sensors located inside the electronic device, where n is a positive integer.

[0033] That is, the temperature information may be the temperature information monitored and recorded by n temperature sensors inside the electronic device, usually specific temperature data. For example, the multiple temperature sensors may be various types of temperature sensors located at key heat source locations such as the electronic device mainboard, battery, and charging port, which can monitor and collect temperature information at each heat source inside the electronic device in real time within a certain period of time.

[0034] The types of temperature sensors may include negative temperature coefficient (NTC) temperature sensors, also known as thermistor temperature sensors, temperature sensors based on metal oxide semiconductors (MOS), etc. The historical temperature information of the electronic device may be the temperature information recorded by each temperature sensor within a historical time, which may be 30 seconds. The historical time may also be increased or decreased accordingly according to differences in electronic device performance or actual application requirements.

[0035] 102 , obtaining a simulated housing temperature of the electronic device according to the current temperature information and the historical temperature information.

[0036] Optionally, the historical temperature information may be n×t pieces of temperature information obtained by n temperature sensors recording the ambient temperature according to a time interval m (0≤m<T, and m is an integer) within a time period T, where T and t are both positive integers.

[0037] As an example, the time period T can be 30s, with the time corresponding to the current temperature information as 0s. When the time interval m=1s, the collected t=15 historical temperature information are the temperature information recorded by the target temperature sensor at -2s, -4s, ... -30s. According to the difference in electronic equipment performance or actual application requirements, the time interval m can be changed accordingly. For example, when the time period T=30s, m=4s or m=9s, the number t of historical temperature information is 6 or 3 respectively.

[0038] In some embodiments, the simulated housing temperature T of the electronic device s The calculation can be achieved by the following formula:

[0039] T s =T b ×[ω1x1ω2x2…ω n x n ]×W T ;

[0040] Wherein, n may be the number of temperature sensors, and n is an integer greater than or equal to 1; T b It can be an offset coefficient, which is used to adjust the fitted electronic device housing temperature so that the final simulated housing temperature is more accurate, which is beneficial to avoid abnormal fluctuations in the simulated housing temperature.

[0041] Optionally, the offset coefficient may be a value obtained from n temperature sensors. In other words, the offset coefficient is obtained by evaluating the temperature sensor by electronic equipment hardware or other related devices.

[0042] ω n It can be the weight parameter of the current temperature information corresponding to the nth temperature sensor and the tth historical temperature information:

[0043] ω n =[ω n0 ω n1 …ω nt ];

[0044] x n It can be the current temperature information of the nth temperature sensor (x n0 ) and t historical temperature information:

[0045] x n =[x n0 x n1 …x nt ] T ;

[0046] W T It can be the weight parameter of n temperature sensors:

[0047] W=[W1 W2…W n ].

[0048] The weight parameter W of the temperature sensor and the weight parameters ω1 to ω n It can be pre-stored in the memory of the electronic device and called when the shell temperature fitting is performed. For example, the weight parameter can be stored in the temp-coeff item in the device tree (DTS) configuration file of the electronic device. DTS is a data structure that describes the information of computer-specific hardware devices so that the kernel of the operating system can manage and use these hardware, including the central processing unit (CPU), memory, bus, interrupt controller, etc.

[0049] The simulated shell temperature calculation formula can be used to calculate the simulated shell temperature of the electronic device. Furthermore, the operating parameters of the electronic device can be adjusted based on the shell problem to control the temperature of the electronic device, which can make the temperature control process of the electronic device more real-time and accurate.

[0050] In some embodiments, the weight parameter of the temperature information of each temperature sensor may be the same, that is, ω1=ω2=…=ω n .

[0051] Optionally, step 102 may be implemented by the following formula:

[0052] T s =T b ×ωXW T ;

[0053] Among them, T S It can be the simulated shell temperature; ω can be the weight parameter of the current temperature information and historical temperature information of the temperature sensor:

[0054] ω=[ω0 ω1…ω t ];

[0055] X can be the current temperature information and historical temperature information of n temperature sensors:

[0056] X=[x1 x2…x n ];

[0057] W may be a weight parameter of the n temperature sensors.

[0058] The meanings of other parameters in the simulated shell temperature calculation formula can be referred to above and will not be repeated here.

[0059] 103 , adjusting parameters of the electronic device according to the simulated housing temperature and the temperature control strategy to control the temperature of the electronic device.

[0060] The temperature control strategy may include a division method of the housing temperature interval and a corresponding relationship between the housing temperature interval and the hardware parameters. The temperature control strategy may be pre-configured in the memory of the electronic device.

[0061] The hardware parameters of the electronic device may be hardware performance parameters, including hardware load parameters, frequency parameters, memory utilization parameters, etc.

[0062] The above-mentioned embodiment obtains the simulated shell temperature of the electronic device by combining the current temperature information and the historical temperature information inside the electronic device, and performs temperature control on the electronic device based on the simulated shell temperature. The current temperature information and the historical temperature information recorded by the temperature sensor inside the electronic device are used together to calculate the simulated shell temperature, which can obtain more stable and responsive simulated shell temperature data, thereby achieving more accurate temperature control of the electronic device.

[0063] In some embodiments, the temperature control method provided in the embodiments of the present application can also adjust the parameters of the electronic device hardware corresponding to the usage scenario of the electronic device, such as calling, charging, video playing, gaming, etc., that is, adjust the operating parameters of the hardware of the electronic device with high power consumption or high heat generation in the usage scenario, so as to achieve more intelligent temperature control of the electronic device.

[0064] Figure 2 Another schematic flow chart of the temperature control method provided in the embodiment of the present application. Figure 2 As shown, the temperature control method may include steps 201 to 204 .

[0065] 201, obtaining current temperature information and historical temperature information inside the electronic device and a usage scenario of the electronic device.

[0066] 202 : Obtain a simulated housing temperature of the electronic device according to current temperature information and historical temperature information.

[0067] 203 , determining target hardware and a target temperature control strategy of the electronic device according to the usage scenario, where the target temperature control strategy is a temperature control strategy corresponding to the target hardware.

[0068] 204 , adjusting parameters of the target hardware according to the simulated housing temperature and the target temperature control strategy to control the temperature of the electronic device.

[0069] Through the above implementation, it is possible to adjust the parameters of the target hardware in a targeted manner based on the usage scenario of the electronic device, thereby achieving more intelligent temperature control of the electronic device and improving the user experience.

[0070] In step 201, the usage scenario of the electronic device can be obtained by detecting the currently active application program of the electronic device.

[0071] In step 203, the target hardware may be one or more hardware corresponding to the usage scenario of the electronic device, and the corresponding relationship between the usage scenario of the electronic device and the target hardware may be preset. In some embodiments, the target hardware may also be obtained by performing real-time load analysis or power consumption analysis on the electronic device hardware.

[0072] As an example, when the electronic device is in a call state, the target hardware may include a communication module, and the temperature control strategy may be mainly executed for the communication module. That is, when the electronic device is in a call state and the housing temperature is at a high level, the power or rate of the communication module may be reduced through an AT command (AT+SPASENGMD) to reduce heat generation.

[0073] The following Table 1 shows an exemplary correspondence between some typical usage scenarios and electronic device hardware. It should be understood that the correspondence between the electronic device usage scenarios and hardware in Table 1 is only an incomplete list, and the usage scenarios of electronic devices also include other scenarios such as playing music / videos, navigation and positioning, etc.; each usage scenario may also correspond to other corresponding hardware not shown in Table 1, such as Wi-Fi modules, Bluetooth modules, etc.; different usage scenarios can also be combined, such as taking pictures while charging, playing games while making voice calls, etc.

[0074] Table 1

[0075] Electronic device usage scenarios Electronic equipment hardware Voice Call System on chip (SoC), communication module, speaker... Video Calling SoC, communication module, speaker, camera, screen... Charge SoC, battery module... Take pictures / videos SoC, camera, flash... game SoC, display, speakers...

[0076] Among them, SoC, also known as system on chip, is an integrated circuit with a dedicated purpose, including a complete system and all the contents of embedded software. SoC is the main chip of an electronic device that integrates functional modules such as CPU and graphics processing unit (GPU).

[0077] In step 203, the target temperature control strategy of the electronic device may include a segmented shell temperature interval division method and a correspondence between the shell temperature interval and the target hardware parameters. For example, when the shell temperature is in the first temperature interval, the target hardware parameters may be adjusted to the first hardware parameters; when the shell temperature is in the second temperature interval, the target hardware parameters may be adjusted to the second hardware parameters; and so on.

[0078] From the first temperature interval to the second temperature interval, the shell temperature increases successively, and correspondingly, the corresponding target hardware performance decreases successively.

[0079] Table 2 shows exemplary correspondences between some housing temperature ranges and hardware parameters.

[0080] Table 2

[0081]

[0082] It should be understood that the correspondence between the shell temperature intervals and the hardware parameters shown in Table 2 is only exemplary, and the hardware parameters corresponding to the shell temperature intervals may also be a range. In actual applications, the division method of the shell temperature intervals or the correspondence between the shell temperature intervals and the hardware parameters may be different.

[0083] In addition, due to the differences in temperature sensitivity or other related temperature characteristics of different electronic equipment hardware, the division method of the shell temperature range corresponding to different target hardware may also be different.

[0084] For example, when the target hardware is a battery module, the temperature range of the housing can be divided as shown in Table 2, that is, the first temperature range is 40°C-50°C; when the target hardware is a communication module, the corresponding first temperature range may be 45°C-55°C. In other words, different usage scenarios of electronic devices can correspond to different target hardware, and each target hardware can correspond to its own target temperature control strategy.

[0085] In some embodiments, the temperature control strategy implementation methods of the target hardware may be different. For example, when the target hardware is a CPU, when the housing temperature of the electronic device is within a first temperature range, the power distribution of the electronic device can be dynamically adjusted through a proportional integral differential (PID) algorithm to adjust the CPU frequency to a first hardware parameter. For another example, when the target hardware is a screen, when the electronic device is within a first temperature range, the maximum backlight brightness of the electronic device can be controlled to the first hardware parameter through the sys / class / display / backlight / max_brightness node.

[0086] In another temperature control method provided by an embodiment of the present application, the shell temperature can also be obtained by:

[0087] (1) By setting a temperature sensor on the surface of the electronic device housing, the actual housing temperature of the electronic device is directly collected;

[0088] (2) Using a trained machine learning model, the temperature information of a temperature sensor and an ambient temperature factor, or the temperature information of a temperature sensor is used as input data to obtain a simulated casing temperature of the electronic device, wherein the temperature information may include current temperature information and historical temperature information.

[0089] Except for the method of obtaining the shell temperature, other steps can refer to the above-mentioned temperature control method and will not be repeated here.

[0090] Furthermore, in some embodiments, the temperature control can be achieved by independently controlling the power output of each hardware of the electronic device and dynamically adjusting the power output of the hardware.

[0091] The temperature control method provided in the embodiment of the present application can realize dynamic monitoring of the housing temperature of the electronic device through temperature polling, that is, by continuously polling to detect the temperature information inside the electronic device, and obtain the simulated housing temperature. Continuing temperature polling can dynamically determine whether the simulated housing temperature exceeds the temperature threshold. The temperature threshold can be the lowest temperature value of the electronic device housing for starting the temperature control strategy, or the minimum value in the first temperature range. In different usage scenarios, the corresponding different target hardware can have different temperature thresholds.

[0092] The temperature polling period can be controlled by the polling-delay parameter, which is configured in DTS.

[0093] For example, when the temperature polling cycle is 1 minute, if the calculated simulated shell temperature exceeds the temperature threshold of the target hardware corresponding to the current usage scenario, temperature control can be started to adjust the parameters of the target hardware to the corresponding parameter values ​​or ranges; if the calculated simulated shell temperature exceeds the second temperature range corresponding to the target hardware, the parameters of the target hardware can be further adjusted to the corresponding parameter values ​​or ranges.

[0094] In addition, in order to avoid frequent fluctuations in the temperature of the electronic device near the temperature threshold during the temperature control process, resulting in frequent start and stop of the control of the target hardware parameters, which affects the performance of the electronic device, a hysteresis temperature can also be set, that is, when the simulated housing temperature of the electronic device in the temperature control state is lower than the hysteresis temperature, the temperature control is stopped. The hysteresis temperature is lower than the temperature threshold. For example, when the temperature threshold is 40°C, the hysteresis temperature can be 30°C. Accordingly, the hysteresis temperatures corresponding to different target hardware may also be different.

[0095] Through the above implementation, the intelligence and smoothness of the temperature control of the electronic device can be improved, which is helpful to avoid the influence of the fluctuation of the housing temperature of the electronic device near the temperature threshold on the performance of the electronic device.

[0096] Another flow chart of the temperature control method provided by the present application is as follows Figure 3 As shown, the temperature control method may include steps 301 to 308 .

[0097] 301, initialize the temperature sensor.

[0098] Through this step, each temperature sensor can be registered as an independent thermal zone node, and the thermal zone can be bound to the corresponding temperature sensor. The calculated simulated shell temperature can also be registered as an independent thermal zone node.

[0099] 302, configure DTS.

[0100] Through this step, you can define parameters that control the temperature polling period, such as polling-delay, or configure the weight parameters of the temperature sensor, etc.

[0101] 303, configure the temperature control strategy.

[0102] 304, temperature polling.

[0103] In this step, the simulated housing temperature may be acquired based on a certain temperature polling cycle; the method for acquiring the simulated housing temperature may refer to the relevant steps shown in the above embodiment.

[0104] 305, shell temperature range determination.

[0105] If the simulated housing temperature is lower than the temperature threshold and the current electronic device is not in the temperature control strategy execution state, then continue to execute step 304 ; if the simulated housing temperature exceeds the temperature threshold, then execute step 306 .

[0106] 306, execute the temperature control strategy.

[0107] This step may include detecting the usage scenario of the electronic device and the corresponding target hardware, and executing the target temperature control strategy based on the above detection results.

[0108] 307, hysteresis temperature judgment.

[0109] 308, stop executing the temperature control strategy.

[0110] After stopping the execution of the temperature control strategy, the process may go to step 304 to continue executing the temperature polling.

[0111] The above implementation can improve the intelligence and accuracy of temperature control of electronic equipment and the stability of system operation, and can improve the user experience.

[0112] In some embodiments, the temperature control method provided in the present application may also include debugging and optimization steps.

[0113] For example, in the debugging and optimization step, a virtual simulated housing temperature can be set to simulate a scenario where the housing temperature of the electronic device is above the temperature threshold to verify the response effect of the temperature control strategy, thereby adjusting the temperature control strategy based on the verification result. Accordingly, in order to facilitate debugging and optimization, the electronic device may also include a master switch for starting and stopping the temperature control strategy, a charging temperature control switch, a communication power control switch, and the like.

[0114] The present application embodiment provides a temperature control system, such as Figure 4 As shown, the temperature control system may include an acquisition module 401, which is used to acquire current temperature information and historical temperature information inside the electronic device; a calculation module 402, which is used to obtain a simulated shell temperature of the electronic device based on the current temperature information and the historical temperature information; and a processing module 403, which is used to adjust the parameters of the electronic device according to the simulated shell temperature and the temperature control strategy to control the temperature of the electronic device.

[0115] In some embodiments, the acquisition module 401 may also be used to acquire the usage scenario of the electronic device.

[0116] In some embodiments, the processing module 403 can also be used to determine the target hardware and target temperature control strategy of the electronic device according to the usage scenario. The target temperature control strategy can be the temperature control strategy corresponding to the target hardware; adjust the parameters of the target hardware according to the simulated shell temperature and the target temperature control strategy to control the temperature of the electronic device.

[0117] An embodiment of the present application further provides a computer-readable medium, in which a computer program is stored. When the computer program is executed, the computer can implement the temperature control method in any of the above embodiments.

[0118] The present application also provides an electronic device, such as Figure 5 As shown, the electronic device may include a memory 501 and a processor 502. The memory 501 stores a computer program, and the processor 502 may execute the temperature control method in any of the above embodiments by calling the computer program.

[0119] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0120] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0121] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0122] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0123] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage media include: various media that can store program codes, such as USB flash drives, mobile hard disks, read-only memories (ROM), random access memories (RAM), magnetic disks or optical disks.

[0124] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A temperature control method, applied to electronic equipment, characterized in that: include: Acquiring current temperature information and historical temperature information inside the electronic device; Obtaining a simulated housing temperature of the electronic device according to the current temperature information and the historical temperature information; The parameters of the electronic device are adjusted according to the simulated housing temperature and the temperature control strategy to control the temperature of the electronic device.

2. The method according to claim 1, characterized in that The obtaining of current temperature information and historical temperature information inside the electronic device includes: The current temperature information and the historical temperature information inside the electronic device are obtained through n temperature sensors located inside the electronic device, where n is a positive integer.

3. The method according to claim 2, characterized in that The historical temperature information refers to n×t pieces of temperature information obtained by n temperature sensors recording the ambient temperature according to a time interval m (0≤m<T, and m is an integer) within a time period T, where T and t are both positive integers.

4. The method according to claim 2, characterized in that: The simulated housing temperature of the electronic device is obtained according to the current temperature information and the historical temperature information, and is implemented by the following formula: T s =T b ×ωXW T ; Among them, T s is the simulated shell temperature; T b is the offset coefficient; ω is the weight parameter of the current temperature information and the historical temperature information of the temperature sensor; X is the current temperature information and the historical temperature information of n temperature sensors; W is the weight parameter of n temperature sensors.

5. The method according to claim 4, characterized in that The offset coefficient is obtained according to n temperature sensors.

6. The method according to any one of claims 1 to 5, characterized in that The method further comprises: Acquire a usage scenario of the electronic device; Determining target hardware and a target temperature control strategy of the electronic device according to the usage scenario, wherein the target temperature control strategy is the temperature control strategy corresponding to the target hardware; The parameters of the target hardware are adjusted according to the simulated housing temperature and the target temperature control strategy to control the temperature of the electronic device.

7. A temperature control system, characterized in that: include: An acquisition module, used to acquire current temperature information and historical temperature information inside the electronic device; A calculation module, used for obtaining a simulated housing temperature of the electronic device according to the current temperature information and the historical temperature information; The processing module is used to adjust the parameters of the electronic device according to the simulated housing temperature and the temperature control strategy to control the temperature of the electronic device.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a computer, the computer implements the method according to any one of claims 1 to 6.

9. An electronic device, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program, and the processor executes the method according to any one of claims 1 to 6 by calling the computer program.

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