Electronic device including sound output module

By designing a special sound hole structure and sound guidance unit in the electronic device, the user privacy infringement caused by the voice sound generated by the sound output module is solved, and the effect of reducing the sound sound through the speaker hole and improving the speaker emission performance is achieved.

CN119895349APending Publication Date: 2025-04-25SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
CN202380066608.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2022-11-17
Filing Date
2023-09-19
Publication Date
2025-04-25

AI Technical Summary

Technical Problem

In an electronic device, the voice sound generated by the sound output module is emitted through the speaker hole, resulting in problems of user privacy infringement.

Method used

A sound emission structure is designed, including a housing, a camera module, a sound output module, a first sound hole, a second sound hole, a sound outlet and a sound guide section. Among them, the second sound hole includes a dummy hole and a connecting hole. The dummy hole is partially closed, and the connecting hole is further away from the sound output module. The sound outlet is connected to the first sound hole and the second sound hole. The sound guide part extends along the sound hole and connects the sound outlet and the sound hole.

Benefits of technology

With this structure, when the amount of voice sound through the speaker hole is reduced during a telephone call, the speaker transmission performance is improved, and the user privacy protection effect is better.

✦ Generated by Eureka AI based on patent content.

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Abstract

An electronic device according to an embodiment of the present disclosure may include: a housing; a camera module disposed in the housing; a sound output module disposed in the housing and spaced apart from the camera module; a first sound hole in a front surface of the electronic device; a second sound hole on a side of the electronic device and including a dummy hole disposed adjacent to the sound output module and at least partially closed and a connection hole spaced further from the sound output module than the dummy hole; a sound outlet formed in the housing through which the sound generated by the sound output module is output, and connected to the first sound hole and the second sound hole; and a sound guide portion formed in the housing along an extending direction of the first sound hole and the second sound hole, and connecting the sound outlet to the first sound hole and the second sound hole.
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Description

Technical Field

[0001] Various embodiments disclosed herein relate to an electronic device including a sound output module. For example, various embodiments disclosed herein may relate to a sound output module having a speaker function and a receiver function. Background Art

[0002] The electronic device may include a sound output module configured to play sound. More and more content has been played through electronic devices, and users' attention to audio performance has gradually increased accordingly.

[0003] Meanwhile, in consideration of design elements, the sound hole may be designed so as to be aligned at the center of the electronic device so that the sound output from the speaker module is emitted outwardly from the electronic device. Summary of the invention

[0004] Technical issues

[0005] The electronic device may include a sound output module for outputting sound. Considering the electronic component mounting structure inside the electronic device, a single sound output module may output receiver sound and speaker sound. The receiver sound may be the voice sound received when the user makes a phone call, and the speaker sound may be generated by the operation of applications such as videos and games. In such a structure, the receiver hole and the speaker hole may be formed separately, the receiver sound is emitted through the receiver hole, and the speaker sound is emitted through the speaker hole. The receiver hole may be positioned on the front surface of the electronic device to facilitate the user's call. Considering the aesthetic appearance and stereo performance, the speaker hole may be positioned on the top side surface and / or the bottom side surface of the electronic device.

[0006] Meanwhile, the receiver hole and the speaker hole may be connected to the sound output module through a channel. In such a case, the voice sound generated from the sound output module may be emitted not only through the receiver hole but also through the speaker hole, thereby causing the problem of privacy infringement of the user.

[0007] The embodiments of the present disclosure can improve a phenomenon in which a voice sound generated from a sound output module is emitted through a speaker hole.

[0008] Solution to the problem

[0009] According to an embodiment of the present disclosure, an electronic device may include: a housing; a camera module arranged in the housing; a sound output module, arranged in the housing to be spaced apart from the camera module; a first sound hole, located on a front surface of the electronic device; a second sound hole, which is located on a side surface of the electronic device and includes a dummy hole and a connecting hole, the dummy hole being arranged to be adjacent to the sound output module and being at least partially closed, and the connecting hole being spaced apart from the sound output module farther than the dummy hole; a sound outlet, formed through the housing to allow sound generated in the sound output module to be output therethrough, and connected to the first sound hole and the second sound hole; and a sound guide, formed in the housing along a direction in which the first sound hole and the second sound hole extend, and configured to connect the sound outlet, the first sound hole, and the second sound hole.

[0010] According to an embodiment of the present disclosure, the sound emission structure of an electronic device may include: a sound output module, which is arranged in a shell to be spaced apart from a camera module arranged in the shell of the electronic device; a first sound hole, which is located on the front surface of the electronic device; a second sound hole, which is located on the side surface of the electronic device and includes a dummy hole and a connecting hole, the dummy hole is adjacent to the sound output module and is at least partially closed, and the connecting hole is spaced apart from the sound output module farther than the dummy hole; a sound outlet, which is formed through the shell to allow sound generated in the sound output module to be output therethrough, and is connected to the first sound hole and the second sound hole; and a sound guide, which is formed in the shell along the direction in which the first sound hole and the second sound hole extend, and is configured to connect the sound outlet, the first sound hole, and the second sound hole.

[0011] Advantageous Effects of the Invention

[0012] According to various embodiments disclosed herein, when a voice sound is generated from a sound output module during a phone call, the amount of sound emitted through a speaker hole instead of a receiver hole may be reduced.

[0013] In addition, when the speaker function is used in response to application execution, the sound generated from the sound output module can be emitted through the receiver hole and the speaker hole. Therefore, the speaker emission performance can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Regarding the description of the drawings, the same or similar reference numerals will be used to refer to the same or similar elements.

[0015] Regarding the description of the drawings, the same or similar reference numerals will be used to refer to the same or similar elements.

[0016] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0017] Figure 2ais a front perspective view of an electronic device according to an embodiment disclosed in this document.

[0018] Figure 2b According to an embodiment disclosed in this document Figure 2a A rear perspective view of an electronic device in FIG.

[0019] Figure 3 is an exploded perspective view of an electronic device according to an embodiment disclosed in this document.

[0020] Figure 4 is a view showing a portion of an electronic device according to an embodiment disclosed in this document.

[0021] Figure 5a is a view when a housing of an electronic device according to an embodiment disclosed in this document is viewed in a front direction of the electronic device.

[0022] Figure 5b is a view when a housing of an electronic device according to an embodiment disclosed in this document is viewed in a rear direction of the electronic device.

[0023] Figure 6a is a plan view when an upper end of a housing according to an embodiment disclosed in this document is viewed from a front surface of an electronic device.

[0024] Figure 6b is an enlarged view of a first sound hole viewed from a front surface of an electronic device according to an embodiment disclosed in this document.

[0025] Figure 6c is a view showing a state when a second sound hole is viewed from an upper end of an electronic device according to an embodiment disclosed in this document.

[0026] Figure 7 is an enlarged view of a sound guide viewed from a front surface of an electronic device according to an embodiment disclosed in this document.

[0027] Figure 8a is a perspective view of a shielding member for shielding a portion of a second sound hole according to an embodiment disclosed in this document.

[0028] Figure 8b is a view showing a state in which a shielding member is provided in a sound guide according to an embodiment disclosed in this document.

[0029] Figure 9a is along Figure 6a A cross-sectional view of the electronic device taken along line AA in FIG.

[0030] Figure 9b is along Figure 6a A cross-sectional view of the electronic device taken along line BB in FIG.

[0031] Fig.10a and Fig.10b 1 is a view of an electronic device in an unfolded state according to an embodiment of the present disclosure when viewed from its front and rear surfaces.

[0032] Fig.11a and Fig.11b 1 is a view of an electronic device in a folded state according to an embodiment of the present disclosure when viewed from its front and rear surfaces.

[0033] Fig.12 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0034] Fig.13 is a view illustrating speaker performance of a sound output module according to an embodiment disclosed in this document. DETAILED DESCRIPTION

[0035] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents, or alternative forms to the corresponding embodiments.

[0036] With respect to the description of the drawings, similar reference numerals may be used to designate similar or related elements.Nouns corresponding to the singular form of an item may include one or more items unless the relevant context clearly indicates otherwise.

[0037] When used herein, each of phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include all possible combinations of items listed together in the corresponding one of the phrases. When used herein, terms such as "first", "second", "the first" and "the second" may be used to simply distinguish the corresponding element from another element and do not limit the elements in other aspects (e.g., importance or order). It should be understood that if an element (e.g., a first element) is referred to as "coupled with" / "coupled to" another element (e.g., the second element) or "connected with" / "connected to" another element (e.g., the second element) with or without the term "operably" or "communicatively", it means that the element can be coupled / connected / coupled to / connected to the other element directly (e.g., wired), wirelessly, or via a third element.

[0038] Figure 11 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0039] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0040] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0041] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0042] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0043] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0044] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0045] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0046] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0047] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0048] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0049] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0051] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0052] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0053] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0055] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0056] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element, the radiating element being formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as a part of the antenna module 197.

[0057] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0058] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0059] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0060] Figure 2a is a perspective view showing a front surface of the electronic device 200 according to various embodiments disclosed in this document. Figure 2b is a diagram showing various embodiments disclosed in this document. Figure 2a 2 is a perspective view of a rear surface of the electronic device 200.

[0061] Figure 2a and Figure 2b The electronic device 200 may be at least partially similar to Figure 1 The electronic device 101 may include other components of the electronic device.

[0062] refer to Figure 2a and Figure 2b According to an embodiment, the electronic device 200 may include a housing 210, the housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C, the side surface 210C surrounding the space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the housing 210 may refer to a structure forming a portion of the first surface 210A, the second surface 210B, and the side surface 210C. According to an embodiment, the first surface 210A may be formed by a front plate 202 (e.g., a polymer plate or a glass plate including various coatings) having at least a substantially transparent portion. The second surface 210B may be formed by a substantially opaque rear plate 211. The rear plate 211 may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of at least two of the above materials. The side surface 210C can be coupled to the front plate 202 and the rear plate 211, and can be formed by a side frame structure (or "side member") 218 ​​including metal and / or polymer. In some embodiments, the rear plate 211 and the side frame structure 218 can be integrally formed and include the same material (e.g., a metal material such as aluminum).

[0063] In the illustrated embodiment, the front plate 202 may include a first region 210D extending seamlessly by bending from the first surface 210A toward the rear plate at both long side ends of the front plate. Figure 2b ), the back plate 211 may include a second area 210E extending seamlessly by bending from the second surface 210B toward the front plate at both long side ends. In some embodiments, the front plate 202 or the back plate 211 may include only one of the first area 210D or the second area 210E. In some embodiments, the front plate 202 does not include the first area and the second area, but may only include a straight plane arranged parallel to the second surface 210B. In the above embodiments, when viewed from the side surface of the electronic device, the side frame structure 218 may have a first thickness (or width) at the side surface not including the first area 210D or the second area 210E, and have a second thickness thinner than the first thickness at the side surface including the first area or the second area.

[0064] According to an embodiment, the electronic device 200 may include at least one of the display 201, the input device 203, the sound holes 207 and 214, the sensor modules 204 and 219, the camera modules 212 and 213, the key input device 217, an indicator (not shown), or the connector hole 208. In some embodiments, the electronic device 200 may omit at least one of the components (e.g., the key input device 217 or the indicator), or may additionally include other components.

[0065] The display 201 may be exposed, for example, through a large portion of the front plate 202. In some embodiments, at least a portion of the display 201 may be exposed through the front plate 202 forming the first area 210D of the first surface 210A and the side surface 210C. The display 201 may be coupled to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus, or disposed adjacent thereto. In some embodiments, at least a portion of the sensor modules 204 and 219 and / or at least a portion of the key input device 217 may be disposed in the first area 210D and / or the second area 210E.

[0066] The input device 203 may include a microphone. In some embodiments, the input device 203 may include a plurality of microphones arranged to detect the direction of sound. The sound holes 207 and 214 may be connected to a speaker. In some embodiments, the microphone, the speaker, and the connector hole 208 may be arranged in the space of the electronic device 200 and exposed to the external environment through at least one sound hole 207 and 214 formed in the housing 210. In some embodiments, the sound holes 207 and 214 formed in the housing 210 may be used together for the microphone and the speaker. In some embodiments, the sound output device may include a speaker (e.g., a piezoelectric speaker) that operates while not including the hole formed in the housing 210.

[0067] The sensor modules 204 and 219 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 200. The sensor modules 204 and 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed at the first surface 210A of the housing 210, and / or a third sensor module 219 (e.g., an HRM sensor) disposed at the second surface 210B of the housing 210. The fingerprint sensor may be disposed at the first surface 210A of the housing 210. A fingerprint sensor (e.g., an ultrasonic fingerprint sensor or an optical fingerprint sensor) may be disposed below the display 201 of the first surface 210A. The electronic device 200 may further include, for example, a sensor module (not shown) of at least one of a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 204.

[0068] The camera modules 212 and 213 may include a first camera device (not shown) disposed at the first surface 210A of the electronic device 200, and a second camera device 212 disposed at the second surface 210B of the electronic device 200, and / or a flash 213. The camera module 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens and a telephoto lens) and an image sensor may be disposed at one surface of the electronic device 200.

[0069] The key input device 217 may be provided at the side surface 210C of the housing 210. In another embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 217, and the key input device 217 not included may be implemented in other forms such as soft keys on the display 201. In another embodiment, the key input device 217 may be implemented using a pressure sensor included in the display 201.

[0070] The indicator may be provided, for example, at the first surface 210A of the housing 210. The indicator may provide, for example, status information of the electronic device 200 in the form of light. In another embodiment, a light emitting device may provide, for example, a light source that cooperates with the operation of the camera module 212. The indicator may include, for example, a light emitting diode (LED), an infrared (IR) LED, and a xenon lamp.

[0071] The connector hole 208 may include a first connector hole 208 and / or a second connector hole (or headphone jack), the first connector hole 208 being capable of accommodating a connector (e.g., a USB connector or an interface connector port module (IF module)) for sending power and / or data to an external electronic device and receiving power and / or data from an external electronic device, and the second connector hole being capable of accommodating a connector for sending audio signals to an external electronic device and receiving audio signals from an external electronic device.

[0072] Some of the camera modules 212, some of the sensor modules 204 and 219, or the indicator may be arranged to be exposed through the display 201. For example, the camera module, the sensor module 204, or the indicator may be arranged to contact the external environment through an opening or a transparent area 205, which runs through the internal space of the electronic device 200 to the front plate 202 of the display 201. According to an embodiment, the camera hole 205 in which the display 201 and the camera module face each other may be formed in a transmissive area having a predetermined transmittance as a part of the area where the content is displayed. According to an embodiment, the transmissive area may be formed to have a transmittance in the range of about 5% to about 20%. Such a transmissive area may include an area overlapping with an effective area (e.g., a viewing angle area) of the camera module, through which light for generating an image by an image sensor passes. For example, the transmissive area of ​​the display 201 may include an area having a pixel density lower than the surrounding pixel density. For example, the transmissive area may replace the opening. For example, the camera module may include an under-display camera (UDC). In another embodiment, some sensor modules 204 may be disposed in the internal space of the electronic device to perform their functions without being visually exposed through the front plate 202. For example, in this case, the area of ​​the display 201 facing the sensor modules may not require a through opening.

[0073] Figure 3 is an exploded perspective view illustrating an electronic device according to various embodiments disclosed in this document.

[0074] Figure 3 The electronic device 300 may be at least partially similar to Figure 1 The electronic device 101 and / or Figure 2a The electronic device 200 may include other components of the electronic device.

[0075] refer to Figure 3 , the electronic device 300 (eg, Figure 1 The electronic device 101 of FIG. 2 or the electronic device 200 of FIG. 2 may include a side member 310 (eg, Figure 2a side frame structure 218), a support member 311 (eg, a bracket or a support member), a front cover 320 (eg, Figure 2a 202), a display 330 (e.g., Figure 2a2 ), at least one substrate 341 and 342 (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (R-FPCB)), a battery 350, at least one additional support member 361 and 362 (e.g., a rear case), an antenna 370, and a back cover 380 (e.g., the back plate 211 of FIG. 2 ). In some embodiments, the electronic device 300 may omit at least one of the components (e.g., the support member 311 or at least one additional support member 361 and 362), or may additionally include other components. At least one of the components of the electronic device 300 may be identical to the components of the electronic device 300. Figure 1 The electronic device 101 or Figure 2a At least one of the components of the electronic device 200 is the same or similar, and repeated description may be omitted.

[0076] According to various embodiments, the side member 310 may include a first surface 3101 facing a first direction (e.g., z-axis direction), a second surface 3102 facing a direction opposite to the first surface 3101, and a space (e.g., Figure 4 According to an embodiment, at least a portion of the side surface 3103 may form an external shape of the electronic device. According to an embodiment, the support member 311 may be disposed to extend from the side member 310 toward the internal space (e.g., Figure 44001) extends from the inner space of the electronic device 300. In some embodiments, the support member 311 may be provided separately from the side member 310. According to an embodiment, the side member 310 and / or the support member 311 may be made of, for example, a metal material and / or a non-metal material (e.g., a polymer). According to an embodiment, the support member 311 may support at least a portion of the display 330 through the first surface 3101, and is configured to support at least a portion of the battery 350 and / or at least one substrate 341 and 342 through the second surface 3102. According to an embodiment, at least one substrate 341 and 342 may include a first substrate 341 (e.g., a main substrate) provided on one side based on the battery 350 in the inner space of the electronic device 300 and a second substrate 342 (e.g., a sub-substrate) provided on the other side. According to an embodiment, the first substrate 341 and / or the second substrate 342 may include a processor, a memory and / or an interface. According to an embodiment, the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processor, an image signal processor, a sensor hub processor, or a communication processor. According to an embodiment, the memory may include, for example, a volatile memory or a non-volatile memory. According to an embodiment, the interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and include a USB connector, an SD card / multimedia connection (MMC) connector, or an audio connector. According to an embodiment, the battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed on a substantially identical plane to, for example, at least one of the substrates 341 and 342. According to an embodiment, the battery 350 may be disposed in a manner embedded in the electronic device 300. In some embodiments, the battery 350 may be detachably disposed from the electronic device 300.

[0077] According to various embodiments, the antenna 370 may be disposed between the back cover 380 and the battery 350. According to one embodiment, the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform short-range communication with an external device, or wirelessly send and receive power required for charging. In some embodiments, the antenna may be formed by some or a combination of the side member 310 and / or the support member 311. In some embodiments, the electronic device 300 may further include a digitizer for detecting an external electronic pen.

[0078] Figure 4is a view showing a portion of an electronic device according to an embodiment disclosed in this document. Figure 5a is a view when a housing of an electronic device according to an embodiment disclosed in this document is viewed in a front direction of the electronic device. Figure 5b is a view when a housing of an electronic device according to an embodiment disclosed in this document is viewed in a rear direction of the electronic device. Figure 6a is a plan view when an upper end of a housing according to an embodiment disclosed in this document is viewed from a front surface of an electronic device. Figure 6b is an enlarged view of a first sound hole viewed from a front surface of an electronic device according to an embodiment disclosed in this document. Figure 6c is a view showing a state in which a second sound hole is viewed from an upper end of an electronic device according to an embodiment disclosed in this document.

[0079] In one embodiment disclosed in this document, Figure 4 The electronic device 400 shown may be Figure 1 The electronic device 101 shown, Figure 2a and Figure 2b The electronic device 200 and / or Figure 3 The example of the electronic device 300 shown in FIG. Figure 2a , Figure 2b and Figure 3 The electronic device 400 described below is described as a bar-shaped electronic device, but in some embodiments, the electronic device 400 may be a foldable electronic device, a slidable electronic device, a retractable electronic device, and / or a rollable electronic device. Figure 1 , Figure 2a , Figure 2b and Figure 3 For elements that are the same or similar to the elements described in , the same or similar reference numerals may be used to refer to the same components unless otherwise specified.

[0080] In one embodiment, the electronic device 400 may include a housing assembly that supports various mechanical components and electrical components that constitute the electronic device 400, and at least a portion of the housing assembly constitutes the appearance of the electronic device 400 (for example, Figure 2a Here, the electrical component can be understood as a general term for an element for sending or receiving an electrical signal. The housing component can be configured as a single element, or can be configured in a manner in which multiple elements are combined. For example, the housing component can be a support member 412 disposed inside the housing 410.

[0081] In one embodiment, the housing component (e.g., support member 412) can be formed of various materials. In the case where the housing component is configured by multiple elements, these elements can be formed of different materials. For example, the housing component can be formed of various materials such as synthetic resin materials, metal materials, and composite materials.

[0082] In one embodiment, a support member 412 for supporting various mechanical members and electronic components may be provided in the housing 410. In one embodiment, the support member 412 may support at least one of the sound output module 450 and the camera module 440. In one embodiment, the support member 412 may include a groove for accommodating at least one of the sound output module 450 and the camera module 440. In one embodiment, the support member 412 may be formed separately from the housing 410 and then assembled to the housing 410. In some embodiments, the support member 412 may be formed integrally with the housing 410 to divide the internal space of the housing 410. In one embodiment, the support member 412 may form a sound guide 550 for connecting the sound output module 450, the first sound hole 510, and the second sound hole 520. For example, the sound guide 550 may be a space formed by the support member 412 and the side frame 411 constituting the side appearance of the housing 410.

[0083] In one embodiment, at least a portion of the housing 410 may constitute the appearance of the electronic device 400. The housing 410 may include a portion for supporting a display module 430 of the electronic device 400.

[0084] In one embodiment, the housing 410 can be formed of various materials. For example, the housing can be formed of a metal material and / or a non-metal material. Here, the metal material can include an alloy of aluminum, stainless steel (STS or SUS), iron, magnesium and / or titanium, and the non-metal material can include a synthetic resin, ceramic and / or engineering plastic. In addition, the housing 410 can be formed by various methods such as injection molding or die casting.

[0085] In one embodiment, reference Figure 4 and Figure 5a , the camera module 440 may be configured so that the camera module 440 (eg, Figure 1 The lens component 441 of the camera module 180 in the width direction (eg, Figure 5a The X-axis direction in the center of the Figure 4 , the display module 430 may include a camera hole 431 facing the lens part 441 of the camera module 440. The camera hole 431 may be a portion that allows external light that has passed through the camera module 440 to be incident on the lens part 441 of the camera module 440. At least a portion of a portion thereof corresponding to the camera hole 431 may be configured to be transparent.

[0086] According to one embodiment, Figure 5a and Figure 5b As shown, the sound output module 450 can be disposed in the housing 410 of the electronic device 400. Figure 5a and Figure 5b The sound output module 450 may be disposed at the upper end of the housing 410 (eg, based on Figure 5a The portion arranged in the +Y axis direction). In one embodiment, the sound output module 450 may refer to a component for outputting sound according to a command of the processor 120 when an application is executed. In one embodiment, when the application is running, the sound output module 450 may include a speaker for outputting sound and / or a receiver for outputting call sound. In one embodiment, during a call, the sound output module 450 may output the sound of the receiver as a call sound, and may output the sound of the speaker when an application such as a video or a game is running. Hereinafter, for ease of explanation, the sound output from the sound output module 450 according to the operation of the call application will be defined and described as a "receiver sound", and the sound output from the sound output module 450 when the speaker function (such as a speaker mode for videos, games, and calls) is normally activated will be defined and described as a "speaker sound".

[0087] refer to Figure 5b In various embodiments disclosed in this document, the sound output module 450 (eg, Figure 1 The sound output module 155 in the embodiment may be disposed in a first direction (eg, Figure 5b and Figure 6a In the case where the lens part 441 of the camera module 440 is disposed to be aligned with the center of the width direction of the housing 410, the sound output module 450 may be disposed eccentrically relative to the center of the width direction of the housing 410.

[0088] refer to Figure 4 and Figure 6b , the electronic device 400 may include a first sound hole 510 (eg, Figure 2a The first sound hole 510 may include a slit-shaped slot between the housing 410 and the display module 430. For example, the first sound hole 510 may be a slit-shaped hole between the display module 430 and the side frame 411 of the housing 410. The first sound hole 510 having a slit shape may be formed to extend in a predetermined direction (e.g., Figure 4The shape of the first sound hole 510 is a shape extending in the X-axis direction of the electronic device 400. For example, the plurality of holes constituting the first sound hole 510 may be arranged in a direction parallel to the width direction of the electronic device 400. In some embodiments, in order to form the first sound hole 510 having a slit shape, at least a portion of the housing 410 and the display module 430 may be formed to be recessed. In some cases, the first sound hole 510 having a slit shape may be provided by a height difference formed between the housing 410 and the display module 430. In another embodiment, the first sound hole 510 may be formed in the display module 430. For example, the first sound hole 510 may be formed at the upper end of the display module 430 so that the sound output from the sound output module 450 can be emitted to the outside of the electronic device 400.

[0089] In one embodiment, the first sound hole 510 may be positioned such that it is relatively close to the width direction (eg, Figure 4 The center of the first acoustic hole 510 (in the X-axis direction) is aligned with the camera hole 431. In other words, the first acoustic hole 510 may be formed symmetrically with respect to the camera hole 431. The camera hole 431 may be provided to be aligned with the center of the housing 410, and thus the first acoustic hole 510 aligned with the camera hole 431 may be formed to be aligned with the center of the housing 410.

[0090] In one embodiment, a foreign matter prevention member including a mesh may be provided in the first sound hole 510 to prevent entry of external foreign matter through the first sound hole 510. The foreign matter prevention member may be provided in an entrance portion of the first sound hole 510 or inside the first sound hole 510.

[0091] According to one embodiment, Figure 6a and Figure 6c As shown, the electronic device 400 may include a second sound hole 520 (eg, Figure 2a The second sound hole 520 may include a plurality of holes (eg, Figure 2a The plurality of holes of the second sound hole 520 may be arranged in a width direction of the electronic device 400 (eg, based on Figure 6c In one embodiment, the second sound hole 520 may be arranged to surround the side surface of the housing 410 and may pass through the side frame 411 (eg, Figure 2a For example, the second sound holes 520 may be arranged in the side frame 411 in the width direction of the electronic device 400 (eg, Figure 4In one embodiment, the second sound hole 520 may be arranged so that its center relative to the width direction is aligned with the camera hole 431. In other words, the second sound hole 520 may be formed symmetrically with respect to the camera hole 431. The camera hole 431 may be arranged to be aligned with the center of the housing 410, so the second sound hole 520 aligned with the camera hole 431 may be formed to be aligned with the center of the housing 410. A foreign body prevention member including a net may be provided in the second sound hole 520 to prevent the entry of external foreign matter through the second sound hole 520. The foreign body prevention member may be provided in the entrance portion of the second sound hole 520 or inside the second sound hole 520.

[0092] In one embodiment, a plurality of sound output modules 450 may be arranged in the housing 410 of the electronic device 400. For example, the sound output module may be arranged at the upper end of the housing 410 (eg, based on Figure 3 toward the +Y axis direction) and the lower end (for example, based on Figure 3 As described above, the sound output from the sound output module 450 disposed at the upper end of the housing 410 may be emitted through the first sound hole 510 and the second sound hole 520. The sound output from the sound output module 450 disposed at the lower end of the housing 410 may be emitted through the third sound hole (e.g., Figure 2a In one embodiment, the third sound hole 207 may be formed through the side frame 411 constituting the side appearance of the electronic device 400. For example, referring to Figure 2a , the third sound hole 207 may be formed through the side frame 411 to be disposed on the bottom side surface of the electronic device 400. A plurality of holes constituting the third sound hole 207 may be formed through the side frame 411 in a direction parallel to the width direction of the electronic device 400 (eg, based on Figure 4 In one embodiment, considering the aesthetics of the electronic device 400, the third sound hole 207 may be formed along the width direction of the electronic device 400 (for example, based on Figure 4 The third sound hole 207 may be symmetrically arranged with respect to the second sound hole 520 along the length direction of the electronic device 400 (e.g., based on the X-axis direction). In this case, the center of the third sound hole 207 may be aligned with the camera hole 431, as in the second sound hole 520. Figure 4 The center of the third sound hole 207 may be symmetrical with respect to a straight line in the Y-axis direction of the housing 410 (for example, based on the Y-axis direction of the housing 410). Figure 4 The center of the X-axis direction) is aligned.

[0093] In one embodiment, reference Figure 6a, the second sound hole 520 may include a dummy hole 521 and a connection hole 522. In one embodiment, the dummy hole 521 among the second sound holes 520 may be arranged adjacent to the sound output module 450. The connection hole 522 may be arranged to be spaced farther from the sound output module 450 than the dummy hole 521. For example, the dummy hole 521 and the sound output module 450 may be arranged relative to an imaginary first axis (e.g., based on a first axis) passing between the connection hole 522 and the dummy hole 521. Figure 6a Y axis) is arranged in a first direction (e.g., based on Figure 6a The connection hole 522 can be arranged in the second direction (for example, based on the -X axis direction) with reference to the first axis. Figure 6a In the +X-axis direction), the second direction is the opposite direction to the first direction.

[0094] In one embodiment, reference Figure 6a , Figure 6b and Figure 6c , the connection hole 522 may have a hole or opening shape that allows the sound output from the sound output module 450 to be emitted to the outside of the electronic device 400. On the other hand, the dummy hole 521 may be formed in a groove shape, so that the inside and outside of the electronic device 400 may not communicate with each other. In an embodiment, the dummy hole 521 may be formed in an opening shape different from the groove shape, so that it can be formed by a separate mechanical member (e.g., Figure 8a In this structure, the hole of the second sound hole 520 may include a hole formed to allow the inside and outside of the electronic device 400 to communicate with each other, and a portion of the hole may be shielded by the shielding member 610. Therefore, the sound output from the sound output module 450 can be emitted to the outside of the electronic device 400 through the remaining holes except for the hole shielded by the shielding member 610 (e.g., the dummy hole 521).

[0095] Figure 7 is an enlarged view of a sound guide viewed from the front surface of an electronic device according to an embodiment disclosed in this document. Figure 8a is a perspective view of a shielding member for shielding a portion of a second sound hole according to an embodiment disclosed in this document. Figure 8b is a view showing a state in which a shielding member is provided in a sound guide according to an embodiment disclosed in this document.

[0096] According to various embodiments disclosed in this document, the sound emitted from the speaker module 450 can be emitted to the outside of the electronic device 400 through a sound guide, and the sound guide is formed or provided by the housing 410 or a housing assembly. Here, "sound guide (channel)" may mean a channel for guiding the sound (sound wave) being transmitted. For example, a sound guide may mean a physical space. The sound guide may include a space filled with a medium (e.g., air) capable of transmitting sound waves. In the following, the transmission of sound through the sound guide may mean that the sound is transmitted via a specific space.

[0097] According to one embodiment, Figure 7 As shown in FIG. 4 , the electronic device 400 may include a sound outlet 540, and the sound generated from the sound output module 450 passes through the sound outlet 540. In one embodiment, referring to the later described Figure 9a , the sound outlet 540 may be relative to Figure 9a In one embodiment, the sound outlet 540 may be formed in an area of ​​the housing 410 that is disposed adjacent to a portion of the sound output module 450 from which sound is emitted. Alternatively, the sound outlet 540 may be a space formed in a portion of the support member 412 that supports the sound output module 450.

[0098] In one embodiment, reference will be made to the later described Figure 9a , the electronic device 400 may include a sealing member 630. The sealing member 630 may be provided on a sound passage connected to the sound outlet 540 so as to prevent foreign matter outside the electronic device 400 from being introduced into the sound output module 450 through the sound outlet 540. The sealing member 630 may include an adhesive member that allows the sealing member to be fixed to another mechanical member, and may include a mesh structure that can transmit sound but block foreign matter.

[0099] According to one embodiment, Figure 7As shown, the electronic device 400 may include a sound guide 550 for connecting the first sound hole 510 and the second sound hole 520 and the sound output module 450. The receiver sound and the speaker sound output from the sound output module 450 may be transferred to the first sound hole 510 and / or the second sound hole 520 through the sound guide 550. In one embodiment, the sound guide 550 may extend from the sound outlet 540 so as to connect the first sound hole 510 and the second sound hole 520 to the sound outlet 540. In one embodiment, the sound guide 550 may be formed in the housing 410 so that the sound output from the sound output module 450 is transferred to the first sound hole 510 and the second sound hole 520. In some embodiments, the sound guide 550 may be a space formed by a plurality of mechanical members constituting the housing 410. For example, the sound guide 550 may be a space formed by a support member 412 and a side frame 411 constituting the side appearance of the housing 410.

[0100] In one embodiment, as described above, the second sound hole 520 may include a connection hole 522, and the sound output from the sound output module 450 is substantially emitted to the outside of the electronic device 400 through the connection hole 522. The sound guide 550 may connect the connection hole 522 of the second sound hole 520 and the sound output module 450. In addition, the sound guide 550 may connect the first sound hole 510 and the sound output module 450. Therefore, according to the application operation, in the case where the speaker sound is generated in the sound output module 450, the speaker sound may be emitted through the first sound hole 510 and the second sound hole 520.

[0101] According to one embodiment, the first sound hole 510 and the second sound hole 520 may be connected to the sound output module 450 through the sound guide 550. In this structure, in the case where the receiver sound is generated in the sound output module 450, the receiver sound may be emitted to the outside of the electronic device 400 not only through the first sound hole 510 but also through the second sound hole 520. In this case, the user's call sound may be exposed to other people, and thus the user's privacy may be violated. According to one embodiment disclosed in this document, the holes adjacent to the sound output module 450 constituting the second sound hole 520 may be shielded. For example, the holes adjacent to the sound output module 450 constituting the second sound hole 520 may be used as dummy holes 521, and the remaining holes thereof (the remaining holes are relatively spaced apart from the sound output module 450) except for the dummy holes 521 may be used as connection holes 522. As described above, the second sound hole 520 may include a hole located in a first direction relative to the camera module 440 (for example, based on Figure 6a The dummy hole 521 in the -X axis direction) and the dummy hole 521 in the second direction (eg, based on the -X axis direction) relative to the camera module 440 Figure 6aThe dummy hole 521 may be a shielded hole, and may be a hole for blocking the inside and outside of the electronic device 400. The connection hole 522 may be a hole among the second sound holes 520 through which the inside and outside of the electronic device 400 are connected and through which the sound output from the sound output module 450 is emitted.

[0102] According to an embodiment, the dummy hole 521 may have a form in which the inside thereof is blocked. For example, the dummy hole 521 may be formed in a groove shape, so that the inside and the outside of the electronic device 400 may not communicate with each other.

[0103] According to an embodiment, the dummy hole 521 may be formed in an opening shape different from the groove shape, so that it can be opened by a separate mechanical member (eg, Figure 8a In this structure, the hole of the second sound hole 520 may include a hole formed to allow the inside and outside of the electronic device 400 to communicate with each other, and a portion of the hole may be shielded by the shielding member 610. In one embodiment, referring to Figure 8a and Figure 8b , the shielding member 610 may be disposed in the sound guide 550 to shield the dummy hole 521. In one embodiment, the shielding member 610 may be disposed in the sound guide 550 to be adjacent to the sound outlet 540 through which the sound output from the sound output module 450 is output. In one embodiment, referring to Figure 8a , the shielding member 610 may include a shielding portion 611 for closing the dummy hole 521 and an opening 612. The shielding member 610 may be disposed in the sound guide 550 so that the shielding portion 611 faces the dummy hole 521. In one embodiment, the opening 612 may connect the sound outlet 540 and the sound guide 550. For example, the receiver sound or the speaker sound generated in the sound output module 450 may be sequentially transmitted through the sound outlet 540-the opening 612 of the shielding member 610-the sound guide 550, and then may be emitted to the first sound hole 510 and / or the second sound hole 520.

[0104] According to an embodiment of the present disclosure, the dummy hole 521 of the second sound hole 520 may be formed in various ways. For example, in an embodiment, the dummy hole 521 may be formed in a groove shape, so that the inside and outside of the electronic device 400 may not be connected to each other. In some embodiments, the dummy hole 521 may be formed in an opening shape different from the groove shape, so that it may be formed by a separate mechanical member (e.g., Figure 8aThe first sound hole 510 is enclosed by the shielding member 610 in the sound output module 450. In this case, the receiver sound output from the sound output module 450 can be emitted to the outside of the electronic device 400 through the first sound hole 510. For example, the first sound hole 510 can be arranged to be closer to the sound output module 450 than the second sound hole 520. The receiver sound can be a sound heard by the user when the user holding the electronic device 400 puts the first sound hole 510 close to the ear, and therefore can have a relatively lower sound intensity (decibel (db)) than the speaker sound. In this case, the receiver sound can be emitted through the first sound hole 510 before reaching the connection hole 522 of the second sound hole 520, and the connection hole 522 is relatively farther from the sound output module 450 than the first sound hole 510. For example, the receiver sound generated in the sound output module 450 can be emitted to the outside of the electronic device 400 through the first sound hole 510 after passing through the sound outlet 540-sound guide 550. Therefore, as the receiver sound emitted through the second sound hole 520 is reduced, the problem of user privacy can be improved.

[0105] In contrast, the speaker sound can be used when the speaker mode is activated in the video, game and call operation modes, and a relatively higher sound intensity may be required compared to the receiver sound. In this case, since the intensity of the speaker sound is higher than the intensity of the receiver sound, the speaker sound can be emitted to the outside of the electronic device 400 through the first sound hole 510 and the second sound hole 520. Therefore, the speaker sound generated in the sound output module 450 can be emitted to the outside of the electronic device 400 through the first sound hole 510 and the second sound hole 520 after passing through the sound outlet 540-sound guide 550. At the same time, in the case where the shielding member 610 is arranged in the sound guide 550, the sound movement channel can be narrowed, so that its acoustic performance is reduced. According to an embodiment disclosed in this document, the speaker sound generated in the sound output module 450 can be emitted to the outside of the electronic device 400 through the first sound hole 510 and the second sound hole 520, so its speaker performance can be improved.

[0106] According to an embodiment, the shielding member 610 can be formed of various materials. For example, the shielding member can be formed of an elastic material, a metal material or a non-metal material. The elastic material may include materials such as rubber or urethane. The metal material may include alloys such as aluminum, stainless steel (STS or SUS), iron, magnesium and titanium, and the non-metal material may include synthetic resins, ceramics and engineering plastics. In addition, the shielding member 610 can be formed by various methods such as injection molding or die casting.

[0107] Although not shown in the drawings, in one embodiment, the shielding member 610 may be a part of a mechanical member constituting the housing 410 of the electronic device 400. For example, the shielding member 610 may be a rear shell (e.g., Figure 3 The portion of the rear shell disposed on the rear surface of the housing 410 may extend to the dummy hole 521 to close the dummy hole 521. In some embodiments, the shielding member 610 may refer to the concept of a portion of the housing 410 that closes the dummy hole 521. In addition, the dummy hole 521 formed through the side member 411 of the housing 410 may be closed by a separate mechanical member (e.g., the shielding member 610) disposed inside the housing 410, or may be closed by various methods within the scope that can be implemented by those skilled in the art, such as a method of closing the dummy hole 521 by extending a mechanical member constituting the housing 410.

[0108] Figure 9a is along Figure 6a A cross-sectional view of the electronic device taken along line AA in FIG. Figure 9b is along Figure 6a A cross-sectional view of the electronic device taken along line BB in FIG.

[0109] According to one embodiment, Figure 9a and Figure 9b As shown, from the rear surface of the housing 410 (eg, based on Figure 9a The surface facing the -Z-axis direction) faces the front surface of the housing 410 (for example, based on Figure 9a The penetration portion 560 formed on the surface facing the +Z axis direction) may be included therein. In one embodiment, the penetration portion 560 may be a part of the sound guide portion 550. The penetration portion 560 may be a passage into which a processing tool for forming the sound guide portion 550 in the housing 410 is inserted. The sound guide portion 550 may be formed by inserting a processing tool through the penetration portion 560 in the width direction of the electronic device 400 (for example, based on Figure 8b A space is formed by processing the shell 410 in the X-axis direction).

[0110] According to one embodiment, Figure 9a and Figure 9b As shown, a soundproof member 570 for covering the penetration portion 560 may be provided on the rear surface of the housing 410. The soundproof member 570 may block the sound output from the sound output module 450 from being emitted to the outside of the electronic device 400 through the penetration portion 560. In one embodiment, the soundproof member 570 may be formed of a metal material such as stainless steel (SUS) or aluminum (AL) or a non-metal material such as rubber, urethane, or silicone, and may shield the penetration portion 560.

[0111] According to one embodiment, the size of the plurality of holes constituting the first sound hole 510 and the second sound hole 520 may be adjusted to adjust the bandwidth of the sound emitted through the first sound hole 510 and the second sound hole 520. In one embodiment, the first sound hole 510 may be a hole formed through the front surface of the electronic device 400, and its size may be limited in consideration of aesthetic factors. For example, as the width of the plurality of holes constituting the first sound hole 510 (e.g., based on Figure 6b The length in the Y-axis direction of the first sound hole 510 increases, and the degree to which the user can visually recognize the hole on the front surface of the electronic device 400 may increase, so that the aesthetic feeling is reduced. According to an embodiment of the present disclosure, the width of the hole constituting the first sound hole 510 may be adjusted in consideration of aesthetic factors (for example, based on Figure 6b Length in the X-axis direction). For example, the width of the hole constituting the first sound hole 510 may be substantially the same as the width of the hole constituting the second sound hole 520. In some embodiments, the width of the hole constituting the first sound hole 510 may be wider than the width of the hole constituting the second sound hole 520, or conversely, may be narrower. Therefore, by adjusting the width of each of the holes constituting the first sound hole 510 and the second sound hole 520, a sound having a desired sound frequency band may be emitted.

[0112] According to an embodiment, in the case where the size of the hole constituting the first sound hole 510 or the second sound hole 520 is changed, distortion may occur at the resonant frequency emitted by the sound holes 510 and 520. For example, in the case where the width of the hole constituting the first sound hole 510 increases, the volume of the sound channel including the sound holes 510 and 520 and the sound guide 550 may increase so that its resonant frequency decreases. That is, at the resonant frequency of the sound generated in the sound output module 450, distortion may occur. Therefore, the sound with the desired bandwidth may not be output through the sound holes 510 and 520. In an embodiment, a dummy member 620 may be provided in the sound guide 550. The dummy member 620 may be a member formed of a material such as rubber or urethane and having a predetermined volume. In an embodiment, the dummy member 620 may be provided in a portion of the penetration portion 560. As the dummy member 620 is provided, the volume of the sound channel including the sound holes 510 and 520 and the sound guide 550 may be reduced. Accordingly, the width of the first sound hole 510 can be expanded, so that the increase in the volume of the sound channel can be at least partially offset. Accordingly, the distortion of the resonant frequency of the sound generated in the sound output module 450 can be prevented. Therefore, the sound output from the sound output module 450 can be emitted through the first sound hole 510 and the second sound hole 520 while having a set bandwidth.

[0113] In the above description, it has been explained that the distortion of the sound generated in the sound output module 450 may occur when the width of the hole of the first sound hole 510 is expanded. However, even in the case where the width of the hole constituting the second sound hole 520 is expanded, the distortion of the sound may also occur in the same manner. In this case, the expansion of the volume of the second sound hole 520 can be offset by the dummy member 620 provided in the sound guide 550.

[0114] Fig.10a and Fig.10b 1 is a view of an electronic device in an unfolded state according to an embodiment of the present disclosure when viewed from its front and rear surfaces. Fig.11a and Fig.11b 1 is a view of an electronic device in a folded state according to an embodiment of the present disclosure when viewed from its front and rear surfaces.

[0115] The description to be described below can be Figures 2a to 5b The electronic device 400 shown is different from the description of an electronic device according to an embodiment. For example, Figures 10a to 12 The electronic device 700 shown in the figure may be a foldable electronic device in which the first housing 710 and the second housing 720 are folded or unfolded with each other. Hereinafter, with respect to the same or similar elements as those described in the previous drawings, the same or similar reference numerals may be used to refer to the same components unless otherwise specified.

[0116] refer to Figures 10a to 11b , the electronic device 700 may include at least one hinge device (eg, Figure 3 The hinge devices 900-1, 900-2 (e.g., hinge modules) are rotatably coupled to each other about a folding axis F so as to form a pair of housings 710 and 720 (e.g., a foldable housing structure) that are folded relative to each other, a first display 730 (e.g., a flexible display, a foldable display, or a main display) provided by the pair of housings 710 and 720, and / or a second display 800 (e.g., an auxiliary display) provided by the second housing 720. According to an embodiment, the hinge device (e.g., Figure 3 At least a portion of the hinge device 900-1, 900-2) of the electronic device 700 may be arranged so as not to be seen from the outside through the first housing 710 and the second housing 720, and may be arranged so as not to be seen from the outside through the hinge housing 810 covering the foldable portion. In the present disclosure, the surface where the first display 730 is arranged may be defined as the front surface of the electronic device 700, and the surface opposite to the front surface may be defined as the rear surface of the electronic device 700. In addition, the surface surrounding the space between the front surface and the rear surface may be defined as the side surface of the electronic device 700.

[0117] According to various embodiments, the pair of housings 710 and 720 may include a hinge device (eg, Figure 3 The hinge device 900-1, 900-2) is a first housing 710 and a second housing 720 that are foldably arranged relative to each other. According to one embodiment, the shape and connection of the pair of housings 710 and 720 are not limited to Figures 10a to 11b , and the pair of housings 710 and 720 may be implemented by combinations and / or couplings of other shapes or components. According to an embodiment, the first housing 710 and the second housing 720 may be arranged on opposite sides about the folding axis F, and may have shapes that are completely symmetrical to each other with respect to the folding axis F. According to an embodiment, the first housing 710 and the second housing 720 may be folded asymmetrically about the folding axis F. According to an embodiment, the angle or distance between the first housing 710 and the second housing 720 may change depending on whether the electronic device 700 is in an unfolded state, a folded state, or an intermediate state.

[0118] According to various embodiments, in the unfolded state of the electronic device 700, the first housing 710 may include a first surface 711, a second surface 712 and / or a first side member 713, the first surface 711 being connected to a hinge device (eg, Figure 3 The second housing 720 may include a third surface 721, a fourth surface 722 and / or a second side member 723, the third surface 721 being connected to the hinge device (e.g., Figure 3 The electronic device 700 includes a hinge device 900-1, 900-2) and is arranged to face the front surface of the electronic device 700, the fourth surface 722 faces in a direction opposite to the third surface 721, and the second side member 723 surrounds at least a portion of the second space 7201 between the third surface 721 and the fourth surface 722. According to one embodiment, the first surface 711 and the third surface 721 may face substantially the same direction in the unfolded state, and the first surface 711 and the third surface 721 may at least partially face each other in the folded state. According to one embodiment, the electronic device 700 may include a recess 701, which is formed by the structural connection of the first housing 710 and the second housing 720 to accommodate the first display 730. According to one embodiment, the recess 701 may have substantially the same shape as the first display 730.

[0119] According to various embodiments, the hinge housing 810 (eg, a hinge cover) may be disposed between the first housing 710 and the second housing 720, and may be disposed to cover a hinge device (eg, a hinge cover) disposed on the hinge housing 810. Figure 3 According to an embodiment, the hinge housing 810 may be hidden or exposed to the outside by a portion of the first housing 710 and the second housing 720 according to the unfolded state, the folded state or the intermediate state of the electronic device 700. For example, when the electronic device 700 is in the unfolded state, at least a portion of the hinge housing 810 may be covered by the first housing 710 and the second housing 720 and is not substantially exposed. According to an embodiment, when the electronic device 700 is in the folded state, at least a portion of the hinge housing 810 may be exposed to the outside between the first housing 710 and the second housing 720. According to an embodiment, in the intermediate state where the first housing 710 and the second housing 720 are folded to each other at a predetermined angle (folded at a certain angle), the hinge housing 810 may be at least partially exposed to the outside of the electronic device 700 between the first housing 710 and the second housing 720. For example, the area of ​​the hinge housing 810 exposed to the outside may be smaller than the area when the electronic device 700 is fully folded. According to an embodiment, the hinge housing 810 may include a curved surface.

[0120] According to various embodiments, when the electronic device 700 is in the unfolded state (eg, Fig.10a and Fig.10b ), the first housing 710 and the second housing 720 may meet at an angle of approximately 180 degrees, and the first area 730a, the second area 730b, and the folding area 730c of the first display 730 may form the same plane and be arranged to face substantially the same direction (e.g., z-axis direction). In another embodiment, when the electronic device 700 is in the unfolded state, the first housing 710 may be rotated at an angle of approximately 360 degrees relative to the second housing 720, and may be folded outward (outward folding solution) so that the second surface 712 and the fourth surface 722 face each other.

[0121] According to various embodiments, when the electronic device 700 is in a folded state (eg, Fig.11a and Fig.11bIn the state shown in the figure), the first surface 711 of the first housing 710 and the third surface 721 of the second housing 720 may be arranged to face each other. In this case, the first area 730a and the second area 730b of the first display 730 may form a narrow angle (for example, a range between 0 degrees and about 10 degrees) through the folding area 730c, and may be arranged to face each other. According to one embodiment, at least a portion of the folding area 730c may be deformed into a curved shape having a predetermined curvature. According to one embodiment, when the electronic device 700 is in the intermediate state, the first housing 710 and the second housing 720 may be arranged at a predetermined angle (a certain angle). In this case, the first area 730a and the second area 730b of the first display 730 may form an angle greater than the angle in the folded state and less than the angle in the unfolded state, and the curvature of the folding area 730c may be lower than the curvature in the folded state, and may be higher than the curvature in the unfolded state. In one embodiment, by a hinge device (for example, Figure 3 The hinge device 900-1, 900-2) can form an angle between the folded state and the unfolded state that allows the first housing 710 and the second housing 720 to stop at a specified folding angle (free stop function). In one embodiment, the hinge device (for example, Figure 3 The hinge device 900-1, 900-2), the first housing 710 and the second housing 720 can be continuously operated while being pressed in the unfolding direction or the folding direction with reference to a specified bending angle.

[0122] According to various embodiments, the electronic device 700 may include at least one of at least one display 730 and 800, an input device 715, sound output devices 727 and 728, sensor modules 717a, 717b, and 726, camera modules 716a, 716b, and 725, a key input device 719, an indicator (not shown), or a connector port 729 arranged on the first housing 710 and / or the second housing 720. In an embodiment, the electronic device 700 may omit at least one of the elements, or may additionally include at least one additional element.

[0123] According to various embodiments, at least one display 730 and 800 may include a first display 730 (eg, a flexible display) and a second display 800, the first display 730 being configured to be connected from the first surface 711 of the first housing 710 via a hinge device (eg, Figure 3The hinge devices 900-1, 900-2) are supported by the third surface 721 of the second housing 720, and the second display 800 is configured to be at least partially visible from the outside through the fourth surface 722 in the space in the second housing 720. In one embodiment, the second display 800 can be configured to be visible from the outside through the second surface 712 in the space in the first housing 710. According to one embodiment, the first display 730 can be mainly used in the unfolded state of the electronic device 700, and the second display 800 can be mainly used in the folded state of the electronic device 700. According to one embodiment, in the intermediate state, the electronic device 700 can control the first display 730 and / or the second display 800 to be used based on the folding angle between the first housing 710 and the second housing 720.

[0124] According to various embodiments, the first display 730 may be disposed in a receiving space formed by the pair of housings 710 and 720. For example, the first display 700 may be disposed in a recessed chamber 701 formed by the pair of housings 710 and 720, and may be disposed to substantially occupy a majority of the front surface of the electronic device 700 in the unfolded state. According to one embodiment, the first display 730 may include a flexible display having at least one region that can be deformed into a flat or curved surface. According to one embodiment, the first display 730 may include a first region 730a facing the first housing 710 and a second region 730b facing the second housing 720. According to one embodiment, the first display 730 may include a folding region 730c including a portion of the first region 730a and a portion of the second region 730b relative to a folding axis F. According to one embodiment, at least a portion of the folding region 730c may include a hinge device (e.g., Figure 3 According to an embodiment, the division of the area of ​​the first display 730 corresponds only to the area according to the pair of housings 710 and 720 and the hinge device (for example, Figure 3 The first display 730 can be substantially divided into two parts by the pair of housings 710 and 720 and the hinge device (eg, Figure 3 According to one embodiment, the first region 730a and the second region 730b may have shapes that are completely symmetrical or partially asymmetrical with respect to the folding region 730c.

[0125] According to various embodiments, the electronic device 700 may include a first back cover 740 disposed on the second surface 712 of the first housing 710 and a second back cover 750 disposed on the fourth surface 722 of the second housing 720. In one embodiment, at least a portion of the first back cover 740 may be formed integrally with the first side member 713. In one embodiment, at least a portion of the second back cover 750 may be formed integrally with the second side member 723. According to one embodiment, at least one of the first back cover 740 and the second back cover 750 may be substantially formed of a transparent plate (e.g., a polymer plate or a glass plate including various coatings) or an opaque plate. According to one embodiment, the first back cover 740 may be formed of, for example, an opaque plate, such as coated or tinted glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two of the above materials. According to one embodiment, the second back cover 750 may be substantially formed of, for example, a transparent plate such as glass or a polymer. Therefore, the second display 800 may be arranged to be seen from the outside through the second back cover 750 in the space in the second housing 720.

[0126] According to various embodiments, the input device 715 may include a microphone. In one embodiment, the input device 715 may include a plurality of microphones arranged to detect the direction of the sound. According to one embodiment, the sound output devices 727 and 728 may include a speaker. According to one embodiment, the sound output devices 727 and 728 may include a call receiver 727 disposed through the fourth surface 722 of the second housing 720 and an external speaker 728 disposed through at least a portion of the second side member 723 of the second housing 720. In one embodiment, the input device 715, the sound output devices 727 and 728, and the connector 729 may be disposed in a space of the first housing 710 and / or the second housing 720, and may be exposed to the external environment through at least one hole formed through the first housing 710 and / or the second housing 720. In one embodiment, the hole formed through the first housing 710 and / or the second housing 720 may be used in common for the input device 715 and the sound output devices 727 and 728. In an embodiment, the sound output devices 727 and 728 may include speakers (eg, piezoelectric speakers) that operate without including holes formed through the first housing 710 and / or the second housing 720 .

[0127] According to various embodiments, the camera modules 716a, 716b, and 725 may include a first camera module 716a disposed on a first surface 711 of the first housing 710, a second camera module 716b disposed on a second surface 712 of the first housing 710, and / or a third camera module 725 disposed on a fourth surface 722 of the second housing 720. According to an embodiment, the electronic device 700 may include a flash 718 disposed around the second camera module 716b. According to an embodiment, the flash 718 may include, for example, a light emitting diode or a xenon lamp. According to an embodiment, the camera modules 716a, 716b, and 725 may include one or more lenses, an image sensor, and / or an image signal processor. In an embodiment, at least one of the camera modules 716a, 716b, and 725 may include two or more lenses (e.g., a wide-angle lens and a telephoto lens) and an image sensor, and may be arranged together on one surface of the first housing 710 and / or the second housing 720.

[0128] According to various embodiments, the sensor modules 717a, 717b, and 726 may generate a data value or an electrical signal corresponding to an internal operating state or an external environmental state of the electronic device 700. According to an embodiment, the sensor modules 717a, 717b, and 726 may include a first sensor module 717a disposed on a first surface 711 of the first housing 710, a second sensor module 717b disposed on a second surface 712 of the first housing 710, and / or a third sensor module 726 disposed on a fourth surface 722 of the second housing 720. In an embodiment, the sensor modules 717a, 717b, and 726 may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, an illumination sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (e.g., a time of flight (TOF) sensor or a light detection and ranging (LiDAR)).

[0129] According to various embodiments, the electronic device 700 may further include a sensor module not shown, for example, at least one of an atmospheric sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a fingerprint sensor. In one embodiment, the fingerprint sensor may be provided by at least one of the first side member 713 of the first housing 710 and / or the second side member 723 of the second housing 720.

[0130] According to various embodiments, the key input device 719 may be provided to be exposed to the outside through the first side member 713 of the first housing 710. In one embodiment, the key input device 719 may be provided to be exposed to the outside through the second side member 723 of the second housing 720. In one embodiment, the electronic device 700 may not include some or all of the key input devices 719, and the key input device 719 not included may be implemented in another form, such as a soft key on at least one display 730 and 800. In another embodiment, the key input device 719 may be implemented by using a pressure sensor included in at least one display 730 and 800.

[0131] According to various embodiments, the connector port 729 may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for sending data and / or power to an external electronic device and / or receiving data and / or power from an external electronic device. In one embodiment, the connector port 729 may together perform the function of sending an audio signal to an external electronic device or receiving an audio signal from an external electronic device, or may also include a separate connector port (e.g., a headphone jack) for performing the function of sending an audio signal to an external electronic device or receiving an audio signal from an external electronic device.

[0132] According to various embodiments, at least one of the camera modules 716a, 716b, and 725, at least one of the sensor modules 717a, 717b, and 726, and / or an indicator may be arranged to be exposed through at least one display 730 and 800. For example, at least one camera module 716a and 725, at least one sensor module 717a and 726, and / or an indicator may be arranged in a space in at least one housing 710 and 720 below an active area (display area) of at least one display 730 and 800, and may be arranged to contact the external environment through a transparent area or opening penetrating through a cover member (e.g., a window layer (not shown) of the first display 730 and / or the second back cover 750). According to an embodiment, as a part of an area where content is displayed, an area where at least one display 730 and 800 and at least one camera module 716a and 725 face each other may be formed as a transmissive area having a predetermined transmittance. According to an embodiment, the transmissive region may be formed to have a transmittance in the range of about 5% to about 20%. The transmissive region may include an area overlapping with an effective area (e.g., a viewing angle area) of at least one camera module 716a and 725, wherein an image is formed on an image sensor in the effective area, and the light used to generate the image passes through the effective area. For example, the transmissive region of the display 730 and 800 may include an area in which the pixel density is lower than the pixel density in the surrounding area. For example, the transmissive region may be replaced with an opening. For example, at least one camera module 716a and 725 may include a camera under the display (UDC) or a camera under the panel (UPC). In another embodiment, some camera modules or sensor modules 717a and 726 may be arranged to perform their functions without being visually exposed through the display. For example, the area of ​​the sensor modules 717a and 726 and / or camera modules 716a and 725 arranged below the display 730 and 800 (e.g., a display panel) corresponds to a camera under the display (UDC) structure, and the through opening is not necessarily required.

[0133] Fig.12 is an exploded perspective view of an electronic device 700 according to various embodiments of the present disclosure.

[0134] refer to Fig.12 The electronic device 700 may include a first display 730 (e.g., a display module 730), a second display 800, a hinge device 900, a pair of supporting members 761 and 762, at least one substrate 770 (e.g., a printed circuit board (PCB)), a first housing 710, a second housing 720, a first back cover 740 and / or a second back cover 750.

[0135] According to an embodiment, the first display 730 may include a display panel 930 (e.g., a flexible display panel), a support plate 950 disposed below the display panel 930, and a pair of reinforcing plates 9621 and 9622 disposed below the support plate 950. According to an embodiment, the display panel 930 may include a first region (e.g., Fig.10a A first panel area 930a corresponding to the first area 730a in the first display 730, a second area (eg, Fig.10a The second panel area 930b corresponding to the second area 730b in the first display 730 and the folding area (eg, Fig.10a According to one embodiment, the support plate 950 may be disposed between the display panel 930 and a pair of support members 761 and 762, and may be formed to have a material and shape for providing a planar support member and a bendable structure, the planar support member being used for the first panel area 930a and the second panel area 930b, and the bendable structure being used to promote the flexibility of the third panel area 930c. According to one embodiment, the support plate 950 may be formed of a conductive material (e.g., metal) or a non-conductive material (e.g., polymer or fiber reinforced plastic (FRP)). According to one embodiment, a pair of reinforcing plates 9621 and 9622 between the support plate 950 and the pair of support members 761 and 762 may include a first reinforcing plate 961 and a second reinforcing plate 962, the first reinforcing plate 961 being disposed to correspond to at least a portion of the first panel area 930a and the third panel area 930c, and the second reinforcing plate 962 being disposed to correspond to at least a portion of the second panel area 930b and the third panel area 930c. According to an embodiment, the pair of reinforcing plates 9621 and 9622 may be formed of a metal material (eg, SUS) to facilitate a ground connection structure and rigidity enhancement of the first display 730 .

[0136] According to an embodiment, the second display 800 may be disposed in the space between the second housing 720 and the second back cover 750. According to an embodiment, the second display 800 may be disposed in the space between the second housing 720 and the second back cover 750 to be visible from the outside through substantially the entire area of ​​the second back cover 750.

[0137] According to an embodiment, at least a portion of the first support member 761 may be foldably coupled to the second support member 762 through the hinge device 900. According to an embodiment, the electronic device 700 may include at least one wiring member 780 (e.g., a flexible circuit board (FPCB)) that is disposed from at least a portion of the first support member 761 to a portion of the second support member 762 while spanning the hinge device 900. According to an embodiment, the first support member 761 may be disposed in a manner extending from the first side member 713 or structurally coupled to the first side member 713. According to an embodiment, the electronic device 700 may include a first space (e.g., a first back cover 740) provided by the first support member 761 and the first back cover 740. Fig.10a According to an embodiment, the first housing 710 (e.g., the first housing structure) may be configured by a combination of the first side member 713, the first support member 761, and the first back cover 740. According to an embodiment, the second support member 762 may be provided in a manner extending from the second side member 723 or structurally coupled to the second side member 723. According to an embodiment, the electronic device 700 may include a second space (e.g., Fig.10a According to one embodiment, the second housing 720 (e.g., the second housing structure) may be configured by a combination of the second side member 723, the second support member 762, and the second back cover 750. According to one embodiment, at least one line member 780 and / or at least a portion of the hinge device 900 may be provided to be supported by at least a portion of a pair of support members 761 and 762. According to one embodiment, at least one line member 780 may be provided in a direction (e.g., an x-axis direction) that spans the first support member 761 and the second support member 762. According to one embodiment, at least one line member 780 may be provided in a direction that is substantially perpendicular to the folding axis (e.g., Fig.10a The y-axis or folding axis F) is set in the direction of the y-axis or folding axis F (for example, the x-axis direction).

[0138] According to an embodiment, at least one substrate 770 may include a first substrate 771 disposed in the first space 7101 and a second substrate 772 disposed in the second space 7201. According to an embodiment, the first substrate 771 and the second substrate 772 may include a plurality of electronic components arranged to implement various functions of the electronic device 700. According to an embodiment, the first substrate 771 and the second substrate 772 may be electrically connected to each other through at least one line member 780. In an embodiment, a camera module 782 may be disposed on the first substrate 771.

[0139] According to an embodiment, the electronic device 700 may include at least one battery 791 or 792. According to an embodiment, the at least one battery 791 and 792 may include a first battery 791 and a second battery, the first battery 791 being disposed in the first space 7101 of the first housing 710 and electrically connected to the first substrate 771, and the second battery being disposed in the second space 7201 of the second housing 720 and electrically connected to the second substrate 772. According to an embodiment, the first support member 761 and the second support member 762 may further include at least one swelling hole for the first battery 791 and the second battery 792.

[0140] According to an embodiment, the first housing 710 may include a first rotation support surface 714, and the second housing 720 may include a second rotation support surface 724 corresponding to the first rotation support surface 714. According to an embodiment, the first rotation support surface 714 and the second rotation support surface 724 may include a curved surface corresponding to (naturally connected to) the outer surface of the curved shape of the hinge housing 810. According to an embodiment, in a case where the electronic device 700 is in an unfolded state, the first rotation support surface 714 and the second rotation support surface 724 may cover the hinge housing 810 to prevent the hinge housing 810 from being exposed to the rear surface of the electronic device 700 or to allow only a portion of the hinge housing to be exposed to the rear surface of the electronic device 700. According to an embodiment, in a case where the electronic device 700 is in a folded state, the first rotation support surface 714 and the second rotation support surface 724 may be configured so that the curved shape of the hinge housing 810 rotates along its outer surface, and thus at least a portion of the hinge housing 810 is exposed to the rear surface of the electronic device 700.

[0141] According to one embodiment, the electronic device 700 may include at least one antenna 776 located inside the first space 7101. According to one embodiment, in the first space 7101, at least one antenna 776 may be provided on the first battery 791 and the first back cover 740. According to one embodiment, for example, at least one antenna 776 may include a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. According to one embodiment, for example, at least one antenna 776 may perform short-range communication with an external device, or may wirelessly send or receive power required for charging. In some embodiments, the antenna structure may be formed by at least a portion of the first side member 713 or the second side member 723 and / or a portion of the first support member 761 and the second support member 762, or a combination thereof.

[0142] According to an embodiment, the electronic device 700 may further include at least one electronic component assembly 774 or 775 and / or additional support members 763 and 773 arranged in the first space 7101 and / or the second space 7201. For example, the at least one electronic component assembly may include an interface connector port assembly 774 or a speaker assembly 775.

[0143] According to an embodiment, the electronic device 100 may include a first waterproof structure WP1 (first waterproof structure) disposed between the first reinforcing plate 961 and the first supporting member 761, and a second waterproof structure WP2 (second waterproof structure) disposed between the second reinforcing plate 962 and the second supporting member 762. According to an embodiment, between the first reinforcing plate 961 and the first supporting member 761, the first waterproof structure WP1 may include a first waterproof member, the first waterproof member being configured to allow at least one first waterproof space to be formed therein. According to an embodiment, between the second reinforcing plate 962 and the second supporting member 762, the second waterproof structure WP2 may include a second waterproof member, a third waterproof member, and a fourth waterproof member, the second waterproof member, the third waterproof member, and the fourth waterproof member being arranged so that at least one second waterproof space is formed. According to an embodiment, the fourth waterproof member may be configured to connect the space of the second waterproof member and the space of the third waterproof member, the space of the second waterproof member and the space of the third waterproof member having a height difference and being spaced apart from each other.

[0144] According to an embodiment, at least one first waterproof space may be provided as a penetration passage for accommodating a connection member (e.g., a first connection member or a flexible printed circuit board (FPCB)) through a first waterproof member, which is a circuit structure for connecting an electronic component (e.g., a first digitizer panel) disposed between the first reinforcing plate 961 and the first supporting member 762 to the first space 7101. According to an embodiment, at least one second waterproof space may be provided as a penetration passage for accommodating a connection member through a second waterproof member, a third waterproof member, and a fourth waterproof member, which is a circuit structure for connecting an electronic component (e.g., a second digitizer panel) disposed between the second reinforcing plate 962 and the second supporting member 762 to the second space 7201. According to an embodiment, at least one first waterproof space may accommodate an area corresponding to at least one electronic component (e.g., a camera module or a sensor module) disposed to be supported by the first supporting member 761. According to an embodiment, at least one second waterproof space may accommodate at least a portion of a curved portion folded to the rear surface of the first display 730. For example, at least one second waterproof space may be provided to be provided to be opened from a display panel (e.g., Fig.12The display panel 930 in the display panel 930 extends and surrounds at least a portion of the curved portion folded to its rear surface. Therefore, the control circuit and multiple electrical components (not shown) arranged in the curved portion can be disposed in at least one second waterproof space and thus can be protected from external moisture and / or foreign matter.

[0145] In the electronic device 700 according to an exemplary embodiment of the present disclosure, at least one waterproof member may include at least one waterproof structure WP1 or WP2 disposed between the first support member 761 and the first reinforcement plate 961 in the first housing 710 and / or between the second support member 762 and the second reinforcement plate 962 in the second housing 720. Therefore, in the case where the first display 730 is separated from the housings 710 and 720 in order to maintain the electronic device 700, damage to the first display can be reduced by the waterproof member. In addition, since at least one waterproof member is disposed to avoid the rear surface of the first display 730, external visibility can be improved and its surface quality can be ensured.

[0146] According to one embodiment, Figures 4 to 9b The structure shown in FIG. 7 may be a configuration or structure applied to the electronic device 700. In one embodiment, by Figures 4 to 9b The described structure or configuration may be a configuration or structure applied to at least one of the first housing 710 and / or the second housing 720 of the electronic device 700. For example, Figure 4 The configuration of the electronic device 400 in may be Figures 11a to 13 Thus, by Figures 4 to 9b The description of the first sound hole 510, the second sound hole 520, the sound output module 450, the sound outlet 540, and the sound guide 550 described above can also be applied to the same Figures 11a to 13 An electronic device 700 in.

[0147] Fig.13 is a diagram showing the speaker performance of a sound output module according to an embodiment disclosed in this document. Fig.13, the speaker performance of the sound output module 450 disclosed in this document can be determined. The first graph 1001 shows the speaker performance of the sound output module 450 disclosed in this document. The second graph 1002 shows the speaker performance of an electronic device, in which a speaker module (not shown) for a speaker function and a receiver module (not shown) for a receiver function are arranged separately. The electronic device corresponding to the second graph 1002 may include a speaker hole, through which the speaker sound emitted from the speaker module is emitted to the outside of the electronic device, and may include a receiver hole, through which the receiver sound emitted from the receiver module is emitted to the outside of the electronic device. The speaker module and the speaker hole and the receiver module and the receiver hole can be connected by separate pipes.

[0148] In one embodiment, the speaker sound generated by the sound output module 450 may be emitted to the outside of the electronic device 400 through the first sound hole 510 and the second sound hole 520. Since the sound is emitted to the outside of the electronic device 400 through multiple channels (e.g., the first sound hole 510 and the second sound hole 520), the stereo performance of the speaker can be improved.

[0149] Meanwhile, according to an embodiment of the present disclosure, the plurality of holes constituting the first sound hole 510 may have an expandable width. As the width of the holes constituting the first sound hole 510 increases, the intensity of the sound emitted through the first sound hole 510 may increase. The increase in the volume of the sound channel according to the expansion of the width of the first sound hole 510 may be offset by the dummy member 620 described above.

[0150] As described above, in the electronic device 400 according to an embodiment of the present disclosure, the speaker sound generated in the sound output module 450 can be emitted to the outside of the electronic device 400 through the first sound hole 510 and the second sound hole 520, and its speaker performance can be improved by expanding the width of the first sound hole 510. Therefore, according to the present disclosure, the speaker performance (see 1001) of the sound output module 510 for emitting speaker sound and receiver sound can be similar to the speaker performance (see 1002) of the sound output module for emitting only speaker sound. Therefore, the electronic device 400 of the present disclosure can replace multiple sound output modules with a sound output module 450 for performing multiple functions, and accordingly, the installation structure of the electronic device 400 can be improved.

[0151] According to an embodiment of the present disclosure, an electronic device 400 (eg, Figure 1 The electronic device 101 shown, Figure 2a and Figure 2b The electronic device 200 and / or Figure 3The electronic device 300 shown in FIG. 1 may include: a housing 410; a camera module 440 (eg, Figure 1 The camera module 180 in the housing); a sound output module 450 (eg, Figure 1 The first sound hole 510 (eg, Figure 2a The sound hole 214 or 207 in the middle); the second sound hole 520 (for example, Figure 2a The present invention relates to a sound hole 214 or 207 in the outer shell, which is located on the side surface of the electronic device and includes a dummy hole 521 which is arranged to be adjacent to the sound output module and is at least partially closed, and a connecting hole 522 which is spaced apart from the sound output module farther than the dummy hole; a sound outlet 540 which is formed through the outer shell to allow the sound generated in the sound output module to be output and is connected to the first sound hole and the second sound hole; and a sound guide 550 which is formed in the outer shell along the direction in which the first sound hole and the second sound hole extend and is configured to connect the sound outlet, the first sound hole and the second sound hole.

[0152] In addition, at least a portion of the sound output module and the dummy hole may be aligned with respect to an imaginary first axis (eg, Figure 6a The first axis shown in Figure 6a Y axis) is arranged in a first direction (e.g., based on Figure 6a The connecting hole may be arranged in a second direction opposite to the first direction relative to the first axis (e.g., based on Figure 6a +X-axis direction).

[0153] In addition, the connection hole of the second sound hole may include a hole configured to connect the outside and the inside of the electronic device, and the dummy hole of the second sound hole may include a groove concavely formed on the side surface of the housing.

[0154] In addition, a shielding member 610 configured to close a dummy hole of the second sound hole may be further included therein.

[0155] In addition, the shielding member may include a shielding portion 611 configured to close the dummy hole and an opening 612 configured to connect the sound outlet and the sound guide portion.

[0156] In addition, a side frame 411 may be included therein, at least a portion of the side frame 411 constitutes a side appearance of the electronic device, and the second sound hole is formed through the side frame 411 .

[0157] In addition, the sound guide may be a space formed by the side frame and the support member 412 provided in the housing.

[0158] In addition, a plurality of holes constituting each of the first sound hole and the second sound hole may be formed to have substantially the same width.

[0159] In addition, a penetration portion 560 formed from the rear surface of the housing toward the front surface of the housing and connected to the sound guide and a soundproof member 570 configured to cover the penetration portion on the rear surface of the housing may be further included therein.

[0160] In addition, the sound guide portion is formed by a processing tool that is inserted through the penetration portion and moved in the housing in the width direction of the electronic device.

[0161] In addition, a dummy member 620 provided in at least a portion of the penetration portion to reduce the volume of the sound guide may be further included therein.

[0162] In addition, a display module 430 disposed in the housing may be further included therein, the display module may include a camera hole 431 configured to allow light to be incident on a lens of the camera module, and the center of the second acoustic hole may be aligned with the camera hole.

[0163] In addition, the display module 430 provided in the housing may be further included therein, and the first sound hole may include a hole formed in a slit shape between the display module and the housing.

[0164] Furthermore, each of the first acoustic hole and the second acoustic hole may include a plurality of holes, and the plurality of holes may be arranged in a direction parallel to a width direction of the electronic device.

[0165] According to an embodiment of the present disclosure, an electronic device 400 (eg, Figure 1 The electronic device 101 shown, Figure 2a and Figure 2b The electronic device 200 and / or Figure 3 The sound-emitting structure of the electronic device 300 shown in FIG. 3 may include: a sound output module 450 (eg, Figure 1 The sound output module 155 in the housing is provided in the housing to communicate with the camera module 440 (eg, Figure 1 The camera module 180 in the first acoustic hole 510 (eg, Figure 2aThe sound hole 214 or 207 in the outer shell is located on the front surface of the electronic device; a second sound hole 520 is located on the side surface of the electronic device and includes a dummy hole 521 and a connecting hole 522, the dummy hole 521 is set to be adjacent to the sound output module and is at least partially closed, and the connecting hole 522 is spaced farther from the sound output module than the dummy hole; a sound outlet 540, which is formed through the outer shell to allow the sound generated in the sound output module to be output, and is connected to the first sound hole and the second sound hole; and a sound guide 550, which is formed in the outer shell along the direction in which the first sound hole and the second sound hole extend, and is configured to connect the sound outlet, the first sound hole, and the second sound hole.

[0166] In addition, at least a portion of the sound output module and the dummy hole may be aligned with respect to an imaginary first axis (eg, Figure 6a The first axis shown in Figure 6a The Y-axis of the connecting hole may be arranged in a first direction, and the connecting hole may be arranged in a second direction opposite to the first direction relative to the first axis.

[0167] In addition, the connection hole of the second sound hole may include a hole configured to connect the outside and the inside of the electronic device, and the dummy hole of the second sound hole may include a groove concavely formed on the side surface of the housing.

[0168] In addition, a shielding member 610 configured to close a dummy hole of the second sound hole may be further included therein.

[0169] In addition, the shielding member may include a shielding portion 611 configured to close the dummy hole and an opening 612 configured to connect the sound outlet and the sound guide portion.

[0170] In addition, a side frame 411 may be included therein, at least a portion of which constitutes a side appearance of the electronic device and a second sound hole is formed through the side frame 411, and the sound guide may be a space formed by the side frame and a support member 412 provided in the housing.

[0171] In addition, a plurality of holes constituting each of the first sound hole and the second sound hole may be formed to have substantially the same width.

[0172] In addition, a penetration portion 560, a sound insulation member 570 and a dummy member 620 may be further included therein, wherein the penetration portion 560 is formed from the rear surface of the shell toward the front surface of the shell and is connected to the sound guide portion, the sound insulation member 570 is configured to cover the penetration portion on the rear surface of the shell, and the dummy member 620 is arranged in at least a portion of the penetration portion to reduce the volume of the sound guide portion.

[0173] According to various embodiments disclosed in this document, it can be reduced that during a call, the call sound generated in the sound output module 450 is emitted through the second sound hole 520 in addition to the first sound hole 510. In addition, in the case where a speaker function is used according to application execution, the sound generated in the sound output module 450 can be emitted through the first sound hole 510 and the second sound hole 520. Therefore, the radiation performance of the speaker can be improved.

Claims

1. An electronic device (400), comprising: Housing (410); A camera module (440) disposed in the housing; a sound output module (450) disposed in the housing to be spaced apart from the camera module; A first sound hole (510), located on the front surface of the electronic device; a second sound hole (520) located on a side surface of the electronic device and comprising a dummy hole (521) and a connection hole (522), wherein the dummy hole (521) is arranged adjacent to the sound output module and is at least partially closed, and the connection hole (522) is spaced farther from the sound output module than the dummy hole; a sound outlet (540) formed through the housing to allow the sound generated in the sound output module to be output therethrough and connected to the first sound hole and the second sound hole; as well as A sound guide (550) is formed in the housing along a direction in which the first sound hole and the second sound hole extend, and is configured to connect the sound outlet, the first sound hole, and the second sound hole.

2. The electronic device according to claim 1, wherein at least a portion of the sound output module and the dummy hole are arranged in a first direction with respect to an imaginary first axis passing between the dummy hole and the connection hole, and The connecting hole is arranged in a second direction opposite to the first direction relative to the first axis.

3. The electronic device according to claim 1, wherein the connection hole of the second sound hole comprises a hole configured to connect the outside and the inside of the electronic device, and The dummy hole of the second sound hole includes a groove concavely formed on a side surface of the housing.

4. The electronic device according to claim 1, further comprising a shielding member (610) configured to close the dummy hole of the second sound hole.

5. The electronic device according to claim 4, wherein the shielding member comprises a shielding portion (611) and an opening (612), the shielding portion (611) being configured to close the dummy hole, and the opening (612) being configured to connect the sound outlet and the sound guide portion.

6. The electronic device according to claim 1, further comprising: A side frame (411), at least a portion of which constitutes a side appearance of the electronic device, and the second sound hole is formed through the side frame.

7. The electronic device according to claim 6, wherein the sound guide is a space formed by the side frame and a support member (412) provided in the housing. 8 . The electronic device according to claim 1 , wherein a plurality of holes constituting each of the first sound hole and the second sound hole are formed to have substantially the same width.

9. The electronic device according to claim 1, further comprising: a penetration portion (560) formed from the rear surface of the housing toward the front surface of the housing and connected to the sound guide; as well as A soundproof member (570) is configured to cover the penetration portion on the rear surface of the housing. 10 . The electronic device according to claim 9 , wherein the sound guide portion is formed by a processing tool which is inserted through the penetration portion and moves within the housing in a width direction of the electronic device.

11. The electronic device according to claim 9, further comprising a dummy member (620) provided in at least a portion of the penetration portion to reduce a volume of the sound guide portion.

12. The electronic device according to claim 1, further comprising a display module (430) disposed in the housing, wherein the display module comprises a camera hole (431), the camera hole (431) being configured to allow light to be incident on a lens of the camera module, and The center of the second sound hole is aligned with the camera hole.

13. The electronic device according to claim 1, further comprising a display module (430) disposed in the housing, The first sound hole includes a hole formed in a slit shape between the display module and the housing.

14. The electronic device according to claim 1, wherein each of the first sound hole and the second sound hole comprises a plurality of holes, and The plurality of holes are arranged in a direction parallel to a width direction of the electronic device.

15. A sound emitting structure of an electronic device (400), comprising: a sound output module (450) disposed in the housing to be spaced apart from a camera module (440) disposed in the housing (410) of the electronic device; A first sound hole (510), located on the front surface of the electronic device; a second sound hole (520) located on a side surface of the electronic device and comprising a dummy hole (521) and a connection hole (522), the dummy hole (521) being adjacent to the sound output module and at least partially closed, the connection hole (522) being spaced farther from the sound output module than the dummy hole; a sound outlet (540) formed through the housing to allow the sound generated in the sound output module to be output therethrough and connected to the first sound hole and the second sound hole; as well as a sound guide (550) formed in the housing along a direction in which the first sound hole and the second sound hole extend and configured to connect the sound outlet, the first sound hole and the second sound hole, wherein at least a portion of the sound output module and the dummy hole are arranged in a first direction relative to an imaginary first axis passing between the dummy hole and the connecting hole, and The connecting hole is arranged in a second direction opposite to the first direction relative to the first axis.