Display panel and display module

By designing the first electrode of the thinned section with an electrical connection isolation structure in the display panel, the high resistance problem caused by poor cathode bonding was solved, and the display abnormality was reduced.

CN119907586BActive Publication Date: 2026-07-07HEFEI VISIONOX TECH CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HEFEI VISIONOX TECH CO LTD
Filing Date
2024-11-12
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

Existing electronic display products are prone to display abnormalities, mainly due to high resistance values ​​caused by poor connection between the cathode and the isolation structure.

Method used

Design a display panel that uses a thinned portion to electrically connect the first electrode of the isolation structure. The thickness of the thinned portion is smaller than that of other areas. Optimize the morphology of the cathode to ensure effective bonding and reduce bonding resistance.

Benefits of technology

By optimizing the cathode morphology, a reliable connection to the isolation structure was achieved, reducing the connection resistance and avoiding display abnormalities.

✦ Generated by Eureka AI based on patent content.

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Abstract

The display panel and the display module are provided. The display panel comprises a substrate, a light emitting unit, a first electrode and an isolation structure. The isolation structure is arranged on one side of the substrate and encloses a plurality of isolation openings. The light emitting unit is at least partially located in the isolation opening. The first electrode covers the light emitting unit and comprises a main body and a thinning portion. The main body covers a central area of the isolation opening and extends outward to form the thinning portion. At least part of the thinning portion is electrically connected to the isolation structure. The thickness of the thinning portion is less than the thickness of the main body. By controlling the topography of the first electrode, effective lapping with the isolation structure is achieved while the lapping resistance is reduced, and subsequent display abnormalities can be reduced.
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Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a display panel and a display module. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are organic thin-film electroluminescent units. They have attracted great attention and are widely used in electronic display products due to their advantages such as simple manufacturing process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display capability.

[0003] However, current electronic display products are prone to display abnormalities due to their structural design limitations. Summary of the Invention

[0004] In view of this, the purpose of this disclosure is to provide a display panel and a display module that can reduce display abnormalities.

[0005] For the purposes described above, the first aspect of this disclosure discloses a display panel comprising:

[0006] Substrate, first electrode, light-emitting unit and isolation structure,

[0007] The isolation structure layer is disposed on the substrate, including a plurality of isolation structures and enclosing a plurality of isolation openings.

[0008] The light-emitting unit is at least partially located within the isolation opening.

[0009] The first electrode covers the light-emitting unit and includes a thinned portion and a main body portion. The main body portion covers the central region of the isolation opening and extends outward to form the thinned portion. At least a portion of the thinned portion is electrically connected to the isolation structure, and the thickness of the thinned portion is less than the thickness of the main body portion.

[0010] In one embodiment, the first electrode includes a thinned portion and a main body portion, wherein the edge of the thinned portion overlaps with the isolation structure and the thickness decreases as it approaches the isolation structure.

[0011] Preferably, the thinned portion includes an overlap area and a transition area, wherein the overlap area is electrically connected to the isolation structure.

[0012] In one embodiment, the edges of the first electrode on opposite sides each include thinning portions, which are electrically connected to the matching isolation structure.

[0013] Preferably, the thinned portions at the opposite edges of the first electrode respectively include an overlap region and a transition region, the overlap region being electrically connected to the matching isolation structure.

[0014] Preferably, the transition area is located between the main body and the overlapping area, and includes a first transition area and a second transition area. The first transition area is close to the overlapping area, and the second transition area is close to the main body. The overlapping area is electrically connected to the isolation structure.

[0015] In one embodiment, the isolation structure includes a support portion, a base portion, and a crown portion. The base portion is disposed on one side of the support portion and is mounted on the substrate. The crown portion is disposed on the side of the support portion away from the substrate. The crown portion has ends on both sides, and the thickness of the ends in the region corresponding to the orthographic projection of the first electrode is less than or equal to 70% of the thickness of the main body portion of the first electrode.

[0016] Preferably, the support portion is made of aluminum, the base portion is made of molybdenum or titanium nitride, and the crown portion is made of titanium.

[0017] In one embodiment, the orthographic projection of the end portion onto the first electrode is located in the transition region, and the ratio of the thickness of the transition region to the thickness of the main body portion is less than or equal to 0.7.

[0018] Preferably, the ratio of the thickness of the transition zone to the thickness of the film layer in the main body is in the range of 0.3 to 0.7.

[0019] Preferably, the orthographic projection of the end portion onto the first electrode is located in the first transition region of the first electrode, and the ratio of the thickness of the first transition region to the thickness of the main body portion is less than or equal to 0.7.

[0020] Preferably, the orthographic projection of the end on the first electrode coincides with the first transition region of the first electrode, and the ratio of the thickness of the first transition region to the thickness of the main body is in the range of 0.3 to 0.7.

[0021] In one embodiment, the thickness ratio of the main body portion to the base portion is less than 2.

[0022] Preferably, the thickness ratio of the main body portion to the base portion is less than or equal to 1.5.

[0023] Preferably, the thickness ratio of the main body portion to the base portion is in the range of 1.01 to 1.4.

[0024] In one embodiment, the first electrode overlaps with a portion of the support portion and the base, or overlaps with the base.

[0025] Preferably, the thinned portion overlaps the side of a portion of the support portion and the base portion or overlaps the base portion.

[0026] In one embodiment, a pixel defining layer is further included, the pixel defining layer being disposed on the substrate.

[0027] The isolation structure is disposed on the side of the pixel defining layer away from the substrate.

[0028] In one embodiment, the display panel further includes a planarization layer disposed on one side of the substrate, the pixel defining layer disposed on the side of the planarization layer away from the substrate, and a second electrode disposed on the side of the planarization layer away from the substrate.

[0029] Preferably, the flattening layer covers the display area or covers the display area and the non-display area outside the display area.

[0030] In one embodiment, the pixel defining layer has a pixel opening, and the main body is projected onto the substrate to cover the pixel opening and a portion of the pixel defining layer around the pixel opening. The pixel opening corresponds to the position of the isolation opening and has a slope.

[0031] Preferably, the angle α between the inclined surface and the plane of the substrate or the plane of the second electrode is between 30° and 75°.

[0032] Based on the same concept, this application proposes a display module, which includes a display panel as described above.

[0033] Compared with the prior art, this disclosure provides a first electrode (cathode) and optimizes its structure. A thinning portion is provided on the overlapping isolation structure side of the first electrode. At least part of the thinning portion is electrically connected to the isolation structure, and the thickness of the thinning portion is less than the thickness of other areas of the first electrode. In this way, the first electrode can achieve an effective overlapping isolation structure while reducing the overlapping resistance and avoiding potential display abnormalities. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in this disclosure or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of a display panel according to an embodiment of the present disclosure;

[0036] Figure 2 for Figure 1Schematic diagram of the cross-section at point A;

[0037] Figure 2a for Figure 2 A schematic diagram of the overlapping isolation structure on one side of the first electrode;

[0038] Figure 3 This is a schematic diagram of an electrode covered by an insulating layer according to an embodiment of the present disclosure;

[0039] Figure 4 This is a schematic diagram of an electrode fabrication system according to an embodiment of the present disclosure;

[0040] Figure 5 This is a schematic flowchart of an electrode preparation method according to an embodiment of the present disclosure. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0042] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0043] The manufacturing process for OLED (Organic Light-Emitting Diode) display products can be broadly divided into the array substrate stage, the light-emitting layer preparation stage, and the module stage.

[0044] In the light-emitting layer preparation stage, light-emitting units are deposited on the entire surface of the array substrate with the isolation structure. Then, a cathode layer and an encapsulation layer are deposited on the light-emitting units. The light-emitting layer (sub-pixel) is fabricated on the array substrate by etching. Only when the cathode can be properly connected to the isolation structure (also known as the auxiliary cathode) can the sub-pixel conduct electricity and light up normally.

[0045] The applicant conducted further research on the cathode and found that the morphology of the cathode has a significant impact on whether the cathode can be properly connected to the auxiliary cathode. Abnormal cathode connection occurs, and the resistance value at the connection point is higher than the preset value, which may cause the corresponding sub-pixel display abnormalities in subsequent use.

[0046] To this end, the applicant proposes a display panel and a display module. The display panel includes a substrate, a light-emitting unit, a first electrode, and an isolation structure. The isolation structure is disposed on one side of the substrate and forms a plurality of isolation openings. The light-emitting unit is at least partially located within the isolation openings. The first electrode covers the light-emitting unit and includes a thinned portion. At least a portion of the thinned portion is electrically connected to the isolation structure, and the thickness of the thinned portion is less than the thickness of other areas of the first electrode. The morphology of the first electrode is designed in this way, and it has a thinned portion that can reliably connect to the isolation structure / auxiliary cathode, and can reduce display abnormalities caused by poor connection.

[0047] The electrode fabrication method, display panel, and display module proposed in this application will now be described in conjunction with the accompanying drawings.

[0048] like Figure 1 The diagram shown is a schematic diagram of the display panel according to an embodiment of this application.

[0049] The display panel 100 includes a light-emitting area 110 and a non-light-emitting area 120 (also called a border area) located outside the light-emitting area 110.

[0050] The light-emitting area 110 includes regularly arranged light-emitting devices 111, each light-emitting device 111 including multiple sub-pixels, such as red sub-pixels, green sub-pixels and blue sub-pixels (not shown) or red sub-pixels, green sub-pixels, blue sub-pixels and white sub-pixels.

[0051] In this embodiment, the sub-pixels of the light-emitting area are obtained by a combination of whole-surface evaporation and etching. This fabrication process does not require a mask. For example, red sub-pixels can be prepared by whole-surface evaporation and etching of the array substrate, and green sub-pixels can be prepared by whole-surface evaporation and etching of the array substrate. This can yield a display panel with a high PPI (Pixels Per Inch). When preparing sub-pixels by whole-surface evaporation and etching of the array substrate, there is no restriction on the order in which the red / green / blue sub-pixels are prepared.

[0052] Next, combine Figure 2 Describe the structure of a pixel using a single pixel as an example. Figure 2 for Figure 1 A schematic diagram of the structure at point A with the encapsulation layer hidden.

[0053] The display panel includes a substrate 130, an insulating layer 140, a second electrode 141, a light-emitting unit 160, a first electrode 170, and an isolation functional layer.

[0054] The substrate 130 is a flexible substrate, and its material can be selected from polyimide (PI), polyethylene naphthalate (PEN), or polyethylene terephthalate (PET), or a mixture of the above materials. Alternatively, the substrate 130 can be a rigid substrate, which can be made of glass. Preferably, one side of the substrate has a driving circuit for driving pixels. The topology of the driving circuit can be a 7T1C circuit, a 7T2C circuit, an 8T1C circuit, an 8T2C circuit, etc., without limitation, as long as it can drive pixels. The substrate material can be selected from polyimide (PI), polyethylene naphthalate (PEN), or polyethylene terephthalate (PET), or a mixture of the above materials, or it can be formed from materials such as glass.

[0055] The second electrode 141 is disposed on the substrate 130. In the same light-emitting device, the second electrodes 141 of multiple sub-pixels can be connected together, while the cathodes / second electrodes are physically isolated from each other, enabling independent control of the sub-pixels. That is, the cathodes of different sub-pixels are not directly or indirectly electrically connected together. Preferably, the cathodes corresponding to the sub-pixel can be connected to the external circuit through separately configured traces or through auxiliary electrodes.

[0056] The insulating layer 140 (also called the pixel defining layer) is disposed on the substrate 130 and defines pixel openings. The pixel defining layer is configured to cover the gap between adjacent second electrodes 141, and the pixel defining openings expose at least a portion of the second electrodes 141 for electrical connection with the light-emitting unit 160 above them. The pixel defining layer can be fabricated by a patterning process. In the light-emitting area, it is used to define the pixel openings of the pixels. The shape of the pixel openings matches the shape of the pixels, such as square, rhomboid, circular, or elliptical, etc., and is not limited here.

[0057] Preferably, a planarization layer is disposed on one side of the substrate 130, and the pixel defining layer is disposed on the side of the planarization layer away from the substrate 130. A second electrode 141 is disposed on the side of the planarization layer away from the substrate 130, and the planarization layer covers the display area. Preferably, the planarization layer covers both the display area and the non-display area. In other embodiments, the second electrode 141 is embedded in the side of the planarization layer away from the substrate 130, with its exposed top surface electrically connected to the light-emitting unit 160 above it.

[0058] The isolation functional layer includes a plurality of isolation structures 150, which enclose a plurality of isolation openings 154. Each isolation structure 150 includes a support portion 151, a base portion 152, and a crown portion 153 (roof). The base portion 152 is disposed on one side of the support portion 151 and is located on the pixel defining layer 140. The crown portion 153 is located on the side of the support portion 151 away from the pixel defining layer 140. Each side of the crown portion 153 has an end point 153a (edge ​​point of the roof). The orthographic projection of the end point 153a of the crown portion 153 onto the substrate corresponds to 70% or less of the thickness h2 of the film layer (transition region) of the first electrode / cathode region and the thickness h1 of the film layer of the main body portion (such as the main flat region). Preferably, the support portion 151 is made of aluminum. The base portion 152 is made of molybdenum or titanium nitride. The crown portion 153 is made of titanium. The composition and preparation of the isolation structure (or partition structure or isolation column) are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 for reference.

[0059] The light-emitting unit 160 is at least partially located within the isolation opening, with its side near the substrate electrically connected to the second electrode 141 (anode), and its side away from the second electrode 141 (anode) covering the first electrode.

[0060] The first electrode covers the light-emitting unit 160 and at least partially overlaps the isolation structure 150 (auxiliary electrode). The first electrode has a thinned portion, the thickness of which is less than the thickness of other areas of the first electrode. Preferably, the edge of the thinned portion overlaps with the isolation structure, and the thickness decreases as it gets closer to the isolation structure. This achieves effective overlap with the isolation structure while reducing the overlap resistance, avoiding potential display abnormalities.

[0061] In one embodiment, one side of the first electrode overlaps with the side of the partial support portion 151 and the base portion 152, or overlaps with the base portion 152. In another embodiment, the edges of opposite sides of the first electrode each have a thinned portion, which overlaps with the side of the partial support portion 151 and the base portion 152, or overlaps with the base portion 152. The first electrode is a cathode, and the first electrode includes a thinned portion and a main body portion, wherein the thickness of the thinned portion is configured to be less than the thickness of other areas (such as the main body portion). Preferably, the thinned portion may include an overlap area and a transition area. The first electrode is obtained by full-surface vapor deposition during fabrication, and within the isolation opening, the edge is a thinned portion, satisfying the requirement that at least a portion of the thinned portion is electrically connected to the isolation structure.

[0062] Taking a cross-section of a sub-pixel as an example (cut along the thickness of the substrate 130), see further... Figure 2 (The corresponding edges on both sides of the first electrode are respectively connected to the isolation structure) and Figure 2a , Figure 2a for Figure 2 Enlarged view to the left of the dashed line (first electrode side overlapping with isolation structure). The first electrode has a thinned portion, and the cathode thickness / film thickness (y direction) is less than the thickness of other areas of the first electrode. Preferably, the edge of the thinned portion overlaps with the isolation structure, and the thickness decreases as it gets closer to the isolation structure. This achieves effective cathode overlap with the isolation structure while reducing overlap resistance and avoiding potential display abnormalities. This thinned portion can be obtained by single-source evaporation during fabrication. In this embodiment, the total height h3 of the isolation structure (see...) Figure 2 The angstrom ranges from 7000 to 15000 angstroms. In this embodiment, one side of the cathode overlaps with the isolation structure, and the structure on the opposite side of the cathode overlaps with the isolation structure is the same or substantially the same (due to process limitations, a completely symmetrical structure cannot be fabricated). In the x-direction, the width of the crown 153 is wider than the width of the base 152, that is, the projection of the crown 153 onto the pixel defining layer covers the projection of the base 152 onto the pixel defining layer. The orthogonal projection a of one end portion 153a of the crown 153 onto the first electrode is located within the transition region.

[0063] The pixel defining layer 140 has a pixel opening. The main body's orthographic projection on the substrate covers the pixel opening and the orthographic projection of a portion of the pixel defining layer 140 around the pixel opening on the substrate. The pixel opening has a slope 142. The angle between the slope 142 and the plane where the substrate 130 is located / the angle between the plane where the second electrode 141 is located is α (sometimes called the slope angle). α is between 30° and 75° (30°, 45°, 60°, 75°). One side of the slope 142 covers the second electrode 141 (covering part of the surface of the second electrode). The other side of the slope 142 has a flat portion 142a, on which an isolation structure 150 is provided. The second electrode is an anode, which can be made of ITO material, and is used to electrically connect the light-emitting unit thereon. In this embodiment, the combination of slopes 142 encloses and forms the pixel opening, which is interconnected with the isolation structure. In this embodiment, some film layers in the light-emitting unit, such as the light-emitting layer, can be prepared using non-evaporation methods, such as inkjet printing. The specific method can be selected based on the material of these film layers. For example, if these film layers are made of polymer materials and evaporation is not suitable, inkjet printing can be used. The first electrode, i.e., the cathode, can be prepared by evaporation. In this embodiment, when preparing the cathode, a conductive layer is deposited on the light-emitting unit using an evaporation apparatus, and then the first electrode (cathode) is obtained by etching (removing the conductive layer in irrelevant areas). The evaporation apparatus includes a first evaporation chamber CTD1 and a second evaporation chamber CTD2.

[0064] The vapor deposition process is limited by the vapor deposition angle of the vapor deposition source in the first vapor deposition chamber CTD1 and the second vapor deposition chamber CTD2.

[0065] Next, combine Figure 3 and Figure 4 Taking the example of the cathode covering the pixel defining layer (omitting the light-emitting unit on the side below it), the structure / morphology of the first electrode (cathode) co-deposited by the first evaporation cavity CTD1 and the second evaporation cavity CTD2 is described. The isolation structure / auxiliary cathode overlapped on one side of the evaporation cavity CTD2 (see Figure 4 ).

[0066] The first electrode 170 includes a thinned portion and a main body portion. The thinned portion includes an overlap region 171 and a transition region. The transition region includes a first transition region 172 and a second transition region 173.

[0067] The first transition region 172 is close to the overlap region 171, and the second transition region 173 is close to the main body. The overlap region overlaps with the isolation structure (in the y direction), and the thickness of the overlap region decreases as it approaches the isolation structure. This overlap region can be obtained by single-source vapor deposition during fabrication. The film thickness of the main body is greater than that of the transition region, and the film thickness of the transition region is greater than that of the overlap region. The main body includes a flat main body region 174 and a sloping main body region 175. In this embodiment, the film thickness is the same or approximately the same within the flat main body region. The film thickness of the sloping main body region 175 is the same or approximately the same as that of the flat main body region 174.

[0068] Preferably, the film thickness h2 of the first transition region 172 (i.e., the region where the first electrode / cathode is located, corresponding to the orthographic projection of the end of the crown onto the first electrode) is less than 70% of the film thickness h1 of the main body flat region 174 of the main body.

[0069] In one embodiment, the thickness h2 of the film layer (first transition region 172) corresponding to the orthographic projection of the end portion 153a of the crown portion 153 onto the first electrode is less than or equal to 0.7 (i.e., less than 0.7 times), meaning the orthographic projection of the end portion onto the first electrode is located in the first transition region of the transition region, the main body includes the main body flat region, and the ratio of the thickness of the first transition region to the thickness of the film layer in the main body flat region is less than or equal to 0.7. Preferably, the ratio of the thickness h2 of the first transition region 172 to the thickness h1 of the film layer in the main body flat region 174 is between 0.3 and 0.7 (e.g., 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, etc.), meaning the thickness h2 of the first transition region 172 corresponding to the orthographic projection of the end portion 153a of the crown portion 153 onto the first electrode is less than 0.7 times the thickness h1 of the main body flat region 174.

[0070] Preferably, the film thickness h1 of the flat region 174 is less than twice the thickness (y-direction) of the base 152. Further, the film thickness h1 of the flat region 174 is less than or equal to 1.5 times (e.g., 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5) the thickness (y-direction) of the base 152, such as when the film thickness h1 of the flat region 174 is 1.01 to 1.4 times the thickness of the base 152. Alternatively, the film thickness h1 of the flat region 174 may be 0.5 to 1.4 times the thickness of the base 152.

[0071] In one embodiment, the overlap region 171 and the first transition region 172 of the first electrode / cathode are deposited by the second evaporation chamber CTD2 (see [link]). Figure 3Region B (i.e., single-socket thinning); the second transition region 173, the main body flat region 174, and the main body ramp 175 are double-deposited by the first evaporation chamber CTD1 and the second evaporation chamber CTD2 (see...). Figure 3 In the central region A), the slope 142 is covered by the main climbing area 175, thereby controlling the morphology of the prepared cathode and preparing a cathode of a predetermined shape (thickness). In this method, the first electrode is evaporated by the first evaporation chamber CTD1 and the second evaporation chamber CTD2. On the overlap side of the first electrode and the isolation structure, there is a region where the thickness of the first electrode is reduced by single-socket evaporation by the first evaporation chamber CTD1 or the second evaporation chamber CTD2. This allows control over the morphology of the prepared / evaporated electrode, preparing a predetermined shape (thickness), effectively overlapping the first electrode with the isolation structure while reducing the overlap resistance, and avoiding potential display abnormalities.

[0072] It should be noted that the display panel can also include other functional structures. For example, the display panel can also include a touch structure to provide touch functionality. For example, the touch structure can be a touch panel or a touch layer. The touch panel can be bonded into the display panel, or the touch layer can be directly fabricated on the encapsulation layer of the display panel, which is beneficial for the thinner and lighter design of the display panel.

[0073] like Figure 4 The diagram shown is a schematic of the electrode (cathode) preparation system proposed in this disclosure.

[0074] The preparation system includes a vapor deposition apparatus having two vapor deposition chambers, namely a first vapor deposition chamber CTD1 and a second vapor deposition chamber CTD2. Preferably, the vapor deposition angle of the first vapor deposition chamber CTD1 and the vapor deposition angle of the second vapor deposition chamber CTD2 are symmetrically arranged.

[0075] The first evaporation cavity CTD1 and the second evaporation cavity CTD2 are each equipped with an evaporation source. The evaporation source is a Mg-containing evaporation source, an Ag-containing evaporation source, or a combination thereof. In this embodiment, the first evaporation cavity CTD1 contains a first evaporation source and a second evaporation source, and the second evaporation cavity CTD2 contains a third evaporation source and a fourth evaporation source. The material of the first evaporation source is the same as that of the third evaporation source, such as a Mg-containing evaporation source. The material of the second evaporation source is the same as that of the fourth evaporation source, such as an Ag-containing evaporation source. The evaporation angle of the Ag-containing evaporation source in the first evaporation cavity CTD1 is between 0° and 70°, and the evaporation angle of the Ag-containing evaporation source in the second evaporation cavity CTD1 is between 0° and -70°. A 0° evaporation angle is perpendicular to the substrate; clockwise evaporation angles are positive, and counterclockwise evaporation angles are negative. The Mg to Ag plating ratio in the same evaporation cavity is between 1:7 and 1:10. Preferably, the Mg to Ag plating ratio is 1:9. The coating ratio of the second evaporation chamber CTD2 to the first evaporation chamber CTD1 is 1:1 to 2:1.

[0076] During cathode fabrication, the substrate to be deposited is suspended above the first deposition chamber CTD1 and the second deposition chamber CTD2, and moved from the first deposition chamber CTD1 side to the second deposition chamber CTD2 side to deposit a conductive layer on the substrate (which is then patterned to obtain the cathode). If a carrier is used to suspend the substrate above the first deposition chamber CTD1 and the second deposition chamber CTD2, the substrate, the first deposition chamber CTD1, and the second deposition chamber CTD2 are all located in a sealed environment.

[0077] like Figure 5 The diagram shows a flow chart of the electrode preparation method proposed in this disclosure.

[0078] The preparation method utilizes the above-described preparation system and includes the following steps:

[0079] The substrate to be vapor-deposited is moved using a carrier. Specifically, the substrate moves from the first vapor deposition chamber CTD1 to the second vapor deposition chamber CTD2. In other embodiments, it may move from the second vapor deposition chamber CTD2 to the first vapor deposition chamber CTD1.

[0080] While the substrate is being moved, the first evaporation cavity CTD1 and the second evaporation cavity CTD2, which are symmetrically arranged at the evaporation angle below the substrate, are used to sequentially evaporate the surface of the substrate to deposit a conductive layer on the substrate.

[0081] A patterning process is used to form the cathode by patterning the conductive layer.

[0082] In this method, the deposition rate ratio of the second deposition chamber CTD2 to the first deposition chamber CTD1 is between 1:1 and 2:1. The deposition angle of the Ag evaporation source in the first deposition chamber CTD1 is between 0 and 70° (0° is perpendicular to the substrate direction), and the deposition angle of the Ag evaporation source in the second deposition chamber CTD1 is between 0 and -70°. This preparation method utilizes the symmetrically or approximately symmetrically arranged first deposition chamber CTD1 and second deposition chamber CTD2 to adjust the morphology of the cathode film, obtaining a cathode with a specific morphology (reducing the thickness of the overlap region). This achieves effective overlap between the cathode and the isolation structure / auxiliary electrode while reducing the overlap resistance and minimizing overlap-related anomalies. A deposition angle of 0° is perpendicular to the substrate direction; clockwise deposition angles are positive, and counterclockwise deposition angles are negative.

[0083] Preferably, the cathode prepared by this method is used in an LED display panel. Furthermore, the conductive layer deposited by this method is stacked on top of the light-emitting layer, thereby obtaining a cathode with a specific morphology for the light-emitting device / sub-pixel. This achieves reliable bonding while reducing bonding resistance, thus minimizing subsequent display anomalies.

[0084] Other embodiments of this application provide a display device including the display panel described in the above embodiments. The pixel density of this display device ranges from 400 PPI to 7000 PPI, making it suitable for scenarios such as televisions and laptops, and also suitable for use in micro-display products (such as AR and VR). Furthermore, this display device can be any product or component with display functionality, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, navigator, or console.

[0085] It should be noted that the above description describes some embodiments of this disclosure. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0086] This disclosure is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A display panel, characterized in that, include: Substrate, light-emitting unit, first electrode and isolation structure, The isolation structure is disposed on one side of the substrate and encloses multiple isolation openings. The isolation structure includes a support portion, a base portion, and a crown portion. The base portion is disposed on one side of the support portion and is mounted on the substrate. The crown portion is disposed on the side of the support portion away from the substrate, and each side of the crown portion has an end portion. The light-emitting unit is at least partially located within the isolation opening. The first electrode covers the light-emitting unit and includes a thinned portion and a main body portion. The main body portion covers the central region of the isolation opening and extends outward to form the thinned portion. The thinned portion is located around the inner edge of the isolation opening. At least a portion of the thinned portion is electrically connected to the isolation structure. The thickness of the thinned portion is less than the thickness of the main body portion. The thinned portion includes a transition region. The ratio of the thickness of the transition region to the thickness of the main body portion is in the range of 0.3 to 0.

7. The orthographic projection of the end on the first electrode is located in the transition region.

2. The display panel as described in claim 1, characterized in that, The edge of the thinned portion overlaps with the isolation structure, and the thickness decreases as it gets closer to the isolation structure.

3. The display panel as described in claim 1, characterized in that, The thinned portion includes an overlap area, which is electrically connected to the isolation structure.

4. The display panel as described in claim 1, characterized in that, The isolation structure is electrically connected to the edges of the opposite sides of the first electrode.

5. The display panel as described in claim 4, characterized in that, The thinned portions at the opposite edges of the first electrode include an overlap region and a transition region, respectively, and the overlap region is electrically connected to the isolation structure.

6. The display panel as described in claim 5, characterized in that, The transition area is located between the main body and the overlapping area, and includes a first transition area and a second transition area. The first transition area is close to the overlapping area, and the second transition area is close to the main body. The overlapping area is electrically connected to the isolation structure.

7. The display panel as described in claim 1, characterized in that, The crown has ends on both sides, and the thickness of the ends in the region corresponding to the orthographic projection of the first electrode is less than or equal to 70% of the thickness of the main body of the first electrode.

8. The display panel as described in claim 1, characterized in that, The material of the support portion contains aluminum, the material of the base portion contains molybdenum or titanium nitride, and the material of the crown portion contains titanium.

9. The display panel as described in claim 7, characterized in that, The orthographic projection of the end on the first electrode is located in the first transition region of the transition region, and the ratio of the thickness of the first transition region to the thickness of the main body is less than or equal to 0.

7.

10. The display panel as claimed in claim 9, characterized in that, The orthographic projection of the end on the first electrode coincides with the first transition region of the first electrode, and the ratio of the thickness of the first transition region to the thickness of the main body is in the range of 0.3 to 0.

7.

11. The display panel as claimed in claim 7, characterized in that, The thickness ratio of the main body to the base is less than 2.

12. The display panel as claimed in claim 11, characterized in that, The thickness ratio of the main body to the base is less than or equal to 1.

5.

13. The display panel as claimed in claim 12, characterized in that, The thickness ratio of the main body to the base is in the range of 1.01 to 1.

4.

14. The display panel as claimed in claim 7, characterized in that, The first electrode overlaps with a portion of the support portion and the base, or overlaps with the base. The thinned portion overlaps with the side of a portion of the support portion and the base portion or overlaps with the base portion.

15. The display panel as claimed in claim 1, characterized in that, It also includes a pixel defining layer disposed on the substrate. The isolation structure is disposed on the side of the pixel defining layer away from the substrate.

16. The display panel as claimed in claim 15, characterized in that, It also includes a planarization layer disposed on one side of the substrate, a pixel defining layer disposed on the side of the planarization layer away from the substrate, and a second electrode disposed on the side of the planarization layer away from the substrate. The flat layer covers the display area or covers the display area and the non-display area outside the display area.

17. The display panel as claimed in claim 15, characterized in that, The pixel defining layer has a pixel opening. The main body is projected onto the substrate and covers the pixel opening and the surrounding portion of the pixel defining layer on the substrate. The pixel opening corresponds to the position of the isolation opening and has a slope.

18. The display panel as claimed in claim 17, characterized in that, The angle α between the inclined plane and the plane of the substrate or the plane of the second electrode is between 30° and 75°.

19. A display module, characterized in that, The display module includes a display panel as described in any one of claims 1-18.