A punch forming high heat flow density three-dimensional uniform heating plate and manufacturing method
By manufacturing a high heat flux density three-dimensional heat vapor chamber using a stamping process, the problems of low manufacturing efficiency and high cost of three-dimensional heat vapor chambers are solved, realizing an efficient and economical heat dissipation solution suitable for stable heat dissipation under high power and anti-gravity conditions.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SOUTH CHINA UNIV OF TECH
- Filing Date
- 2025-01-07
- Publication Date
- 2026-06-09
AI Technical Summary
Existing three-dimensional heat exchangers are inefficient and costly to manufacture, and they are difficult to maintain phase change cycles in high-power or anti-gravity applications, leading to heat dissipation failure.
A high heat flux density three-dimensional heat spreader is manufactured using a stamping process. The top surface of the cover plate has densely distributed three-dimensional fins, and the bottom plate is equipped with support columns and return columns. Combined with the liquid wick structure, the heat dissipation efficiency and stability are improved through integrated processing.
It improves heat dissipation efficiency, reduces costs, and maintains stable operation under high power and anti-gravity conditions, making it suitable for a wider range of applications.
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Figure CN119915125B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a stamped high heat flux density three-dimensional heat vapor chamber, belonging to the field of heat vapor chamber technology. Background Technology
[0002] With the rapid development of technologies such as 5G communication, radar, and drones, the heat dissipation requirements of electronic devices, especially high-power radio frequency chips, are increasing, placing higher demands on heat dissipation technology. Three-dimensional vapor chamber (3DVC) technology has attracted attention for its excellent heat dissipation performance and integrated heat dissipation solution. Compared with traditional heat pipes and two-dimensional vapor chambers, the main advantage of 3D vapor chambers is that they can directly dissipate heat in an integrated manner without the need for additional interface materials to connect with three-dimensional fins for heat dissipation, thereby effectively reducing thermal resistance. This design not only simplifies the heat dissipation structure but also improves heat dissipation efficiency. Especially in air-cooled heat dissipation systems, 3D vapor chambers can further improve heat dissipation efficiency.
[0003] Currently, the manufacturing of three-dimensional vapor chambers mainly relies on welding processes to join three-dimensional cavities with vapor chambers. However, this method suffers from low production efficiency and poor stability, and is costly in large-scale mass production. Moreover, common three-dimensional vapor chambers have liquid retention issues due to their three-dimensional structure, making it difficult to maintain phase change cycles in high-power or anti-gravity applications, leading to heat dissipation failure. With the continuous growth in demand for three-dimensional vapor chambers, the market urgently needs a manufacturing method for three-dimensional vapor chambers that is more efficient, lower in cost, and has a wider range of applications.
[0004] This patent aims to design a high heat flux density three-dimensional heat spreader and its manufacturing method to address the challenges in the prior art and provide a more efficient and economical heat dissipation solution. Summary of the Invention
[0005] The main objective of this invention is to provide a stamped high heat flux density three-dimensional heat spreader.
[0006] The objective of this invention can be achieved by adopting the following technical solution:
[0007] A stamped high heat flux density three-dimensional heat spreader includes a cover plate and a base plate. The cover plate is integrally formed by stamping with a mold. The top surface of the cover plate is stamped to form densely distributed three-dimensional fins. These fins are spaced apart, with gaps between adjacent fins forming airflow channels. Each fin has a hollow structure and an inner surface with a liquid-absorbing core structure. The base plate is processed by stamping, machining, or etching to form grooves. These grooves contain support columns, return columns, and liquid-absorbing cores.
[0008] Preferably, the three-dimensional fins include, but are not limited to, V-shaped, square, arc-shaped, long rectangular, or tapered fin shapes;
[0009] The cross-section of the three-dimensional fins after stamping is inclined at an angle from top to bottom or the top and bottom surfaces are perpendicular to each other. The three-dimensional fins are arranged in a manner including but not limited to staggered arrangement, parallel arrangement, and honeycomb arrangement.
[0010] Preferably, the support columns on the base plate are formed by machining or etching, and the support columns are arranged at intervals on the base plate at positions offset from the three-dimensional fin projection of the cover plate, and the height of the support columns does not exceed the top of the groove.
[0011] Preferably, the reflux column is positioned at the center of the three-dimensional fin projection on the base plate, and the height of the reflux column is the same as the height of the cavity inside the three-dimensional fin.
[0012] Preferably, the reflux column is connected to the top surface inside the three-dimensional fin after the heat spreader cover plate and the bottom plate are joined. The reflux column is formed by processes such as machining, etching, welding or sintering. The structure of the reflux column includes, but is not limited to, solid structure, hollow structure, porous liquid wicking structure and suspended braided belt structure.
[0013] Preferably, the liquid-absorbing core includes, but is not limited to, various liquid-absorbing core structures such as sintered powder, wire mesh, woven tape, and microgrooves. The liquid-absorbing core is disposed in the groove of the base plate and on the surface of the return column by various methods such as sintering, electrodeposition, and laser processing.
[0014] Preferably, the thickness of the liquid-absorbing core does not exceed the depth of the groove.
[0015] A high heat flux density three-dimensional heat spreader plate formed by stamping includes the following steps:
[0016] S1. A cover plate with a three-dimensional fin structure is integrally formed by stamping process;
[0017] S2. The base plate is processed by machining or etching to form grooves and support columns within the grooves;
[0018] S3. A reflux column is formed in the groove by machining, etching, welding or sintering.
[0019] S4. The liquid suction core is placed on the cover plate, the inner surface of the three-dimensional fins, the groove of the bottom plate and the surface of the reflux column by means of sintering, electrodeposition, laser processing and other methods.
[0020] S5. Weld the cover plate and the bottom plate at their edges and leave an injection port. Weld the injection pipe at the injection port.
[0021] S6. The liquid working fluid is injected into the cavity through the filling pipe, and after low-temperature freezing, vacuuming and sealing, a heat spreader is formed.
[0022] Preferably, in step S6, the liquid working medium is a liquid that does not react with the cover plate, bottom plate, reflux column and suction core.
[0023] Beneficial technical effects of the present invention:
[0024] This invention provides a stamped high heat flux density three-dimensional heat spreader.
[0025] 1) The cooling surface of the heat spreader cover is equipped with a finned heat dissipation structure, which can increase the heat dissipation area and improve the heat dissipation efficiency.
[0026] 2) The heat spreader cover and the three-dimensional fin heat dissipation structure are integrally processed and formed. The integrated heat dissipation reduces the thermal resistance of the heat spreader and reduces the cost.
[0027] 3) The bottom plate is equipped with a reflux column to further improve the strength of the heat spreader and accelerate the condensation and reflux of the liquid working fluid, thereby improving the heat dissipation efficiency.
[0028] 4) Both the cover plate and the bottom plate are equipped with a liquid suction core structure to ensure stable operation of liquid condensation and reflux, and can operate stably under high power and anti-gravity conditions.
[0029] 5) The manufacturing method is simple, the processing cost is low, and the yield is high. Attached Figure Description
[0030] Figure 1 This is a perspective view of a preferred embodiment of a stamped high heat flux density three-dimensional heat spreader and manufacturing method according to the present invention;
[0031] Figure 2 This is an exploded structural diagram of a preferred embodiment of a stamped high heat flux density three-dimensional heat spreader and manufacturing method according to the present invention;
[0032] Figure 3 This is a perspective view of a cover plate and a base plate according to a preferred embodiment of a stamped high heat flux density three-dimensional heat spreader and manufacturing method of the present invention;
[0033] Figure 4 This is a perspective side view of the cover plate and the bottom plate according to a preferred embodiment of a stamped high heat flux density three-dimensional heat spreader and manufacturing method of the present invention;
[0034] Figure 5 This is a cross-sectional view of a preferred embodiment of a stamped high heat flux density three-dimensional heat spreader and manufacturing method according to the present invention;
[0035] Figure 6 This is a partial cross-sectional view of Embodiment 1, a preferred embodiment of a stamped high heat flux density three-dimensional heat spreader and manufacturing method according to the present invention;
[0036] Figure 7This is a partial cross-sectional view of Embodiment 2 of a preferred embodiment of a stamped high heat flux density three-dimensional heat spreader and manufacturing method according to the present invention;
[0037] Figure 8 This is a manufacturing process flow of a preferred embodiment of a stamping high heat flux density three-dimensional heat spreader and manufacturing method according to the present invention.
[0038] In the diagram: 1. Cover plate; 2. Base plate; 3. Liquid suction core; 4. Liquid filling port; 5. Liquid working fluid; 11. Three-dimensional fins; 21. Reflux column; 22. Support column. Detailed Implementation
[0039] To enable those skilled in the art to understand the technical solution of the present invention more clearly, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the embodiments of the present invention are not limited thereto.
[0040] like Figure 1 - Figure 8 As shown in the figure, this embodiment provides a stamped high heat flux density three-dimensional heat spreader, including a cover plate 1 and a base plate 2. The cover plate 1 is integrally formed by stamping with a mold. The top surface of the cover plate 1 is stamped to form densely distributed three-dimensional fins 11. The three-dimensional fins 11 are arranged at intervals, and the gaps between adjacent fins form air flow channels. The three-dimensional fins 11 have a hollow structure and a liquid absorption core structure on the inner surface. The base plate 2 is processed by stamping, machining or etching to form a groove. The groove of the base plate 2 is provided with a support column, a return column 21 and a liquid absorption core 3.
[0041] Three-dimensional fins 11 include, but are not limited to, V-shaped, square, arc-shaped, long rectangular or tapered fin shapes;
[0042] The cross section of the stamped three-dimensional fin 11 is inclined at an angle from top to bottom or the top and bottom surfaces are perpendicular to each other. The three-dimensional fin 11 is arranged in a manner including but not limited to staggered arrangement, parallel arrangement, and honeycomb arrangement.
[0043] The support columns 22 on the base plate 2 are formed by machining or etching. The support columns 22 are arranged at intervals on the base plate 2 at positions that are offset from the three-dimensional fin projection of the cover plate 1. The height of the support columns 22 does not exceed the top of the groove.
[0044] The reflux column 21 is located at the center of the projection of the three-dimensional fin 11 on the base plate 2, and the height of the reflux column 21 is the same as the height of the cavity inside the three-dimensional fin 11.
[0045] The reflux column 21 is connected to the inner top surface of the three-dimensional fin 11 after the heat spreader cover plate 1 and the bottom plate are joined. The reflux column 21 is formed by machining, etching, welding or sintering and other processes. The structure of the reflux column 21 includes, but is not limited to, solid structure, hollow structure, porous liquid suction core 3 structure and suspension braided belt structure.
[0046] The liquid-absorbing core 3 includes, but is not limited to, various liquid-absorbing core 3 structures such as sintered powder, wire mesh, woven tape, and microgroove. The liquid-absorbing core 3 is disposed in the groove of the base plate and on the surface of the return column through various methods such as sintering, electrodeposition, and laser processing.
[0047] The thickness of the liquid-absorbing core 3 does not exceed the depth of the groove.
[0048] In step S6, the liquid working medium is a liquid that does not react with the cover plate 1, the bottom plate 2, the reflux column 21 and the liquid suction core 3.
[0049] like Figure 1 - Figure 8 As shown in the figure, the working process of a stamped high heat flux density three-dimensional heat spreader plate provided in this embodiment is as follows:
[0050] S1. A cover plate 1 with a three-dimensional fin structure 11 is integrally formed by stamping process;
[0051] S2. The base plate 2 is processed by machining or etching to form a groove and a support column 22 inside the groove;
[0052] S3. The reflux column 21 is processed in the groove by machining, etching, welding or sintering.
[0053] S4. The liquid suction core 3 is disposed on the inner surface of the three-dimensional fin 11 of the cover plate 1, the groove of the bottom plate 2 and the surface of the reflux column 21 by means of sintering, electrodeposition, laser processing, etc.
[0054] S5. Weld the cover plate 1 and the bottom plate 2 at their edges and leave the filling port 4. Weld the filling pipe at the filling port 4.
[0055] S6. Liquid working fluid 5 is injected into the cavity through the filling pipe, and after low-temperature freezing, vacuuming and sealing, a heat spreader is formed.
[0056] Example 1
[0057] like Figure 3 As shown, the three-dimensional fins 11 have a square cross-sectional shape and are arranged in parallel at intervals on the top surface of the cover plate 1, as shown. Figure 4As shown, to prevent collapse when the cover plate 1 and the base plate 2 are stacked, support columns 22 are etched onto the base plate 2. The support columns 22 are evenly spaced on the base plate 2 at positions offset from the projection of the three-dimensional fins 11 of the cover plate 1, and the height of the support columns 22 is flush with the top of the groove. The return column 21 is a solid metal column, welded to the center of the projection of the three-dimensional fins 1 on the base plate 2, and has the same height as the inner cavity of the three-dimensional fins 11.
[0058] like Figure 5 As shown, the liquid suction core 3 is a copper wire mesh liquid suction core, which is sintered in the groove of the base plate 2 and on the surface of the return column 21. The liquid working medium 5 is high-purity water.
[0059] Example 2
[0060] like Figure 7 As shown, the difference between this embodiment and Embodiment 1 is that the reflux column 21 is a suspended braided strip structure. By sintering the copper braided strip and suspending it in the groove of the bottom plate 2, the reflux effect of the reflux column 21 is further enhanced, the flow of the liquid working fluid is accelerated, and the temperature uniformity of the heat exchange plate is improved, thereby improving the heat dissipation effect of the heat exchange plate.
[0061] The above description is merely a further embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope disclosed in the present invention, based on the technical solution and concept of the present invention, shall fall within the scope of protection of the present invention.
Claims
1. A stamped high heat flux density three-dimensional heat spreader, comprising a cover plate (1) and a base plate (2), characterized in that, The cover plate (1) is integrally formed by stamping with a mold. The top surface of the cover plate (1) is stamped to form dense three-dimensional fins (11). The three-dimensional fins (11) are arranged at intervals, and the gaps between adjacent fins form air channels. The three-dimensional fins (11) are hollow structures and have liquid-absorbing core structures on their inner surfaces. The bottom plate (2) is processed by stamping, machining or etching to form grooves. The grooves of the bottom plate (2) are provided with support columns, return columns (21) and liquid-absorbing cores (3). Three-dimensional fins (11) include, but are not limited to, V-shaped, square, arc-shaped, long rectangular or tapered fin shapes; The cross section of the stamped three-dimensional fins (11) is inclined at an angle from top to bottom or the top and bottom surfaces are perpendicular to each other. The three-dimensional fins (11) are arranged in a manner including but not limited to staggered arrangement, parallel arrangement, and honeycomb arrangement. The support columns (22) on the base plate (2) are formed by machining or etching. The support columns (22) are arranged at intervals on the base plate (2) at positions that are offset from the three-dimensional fin projection of the cover plate (1). The height of the support columns (22) does not exceed the top of the groove. The reflux column (21) is located at the center of the projection of the three-dimensional fin (11) on the base plate (2), and the height of the reflux column (21) is the same as the height of the cavity inside the three-dimensional fin (11); The reflux column (21) is connected to the top surface inside the three-dimensional fin (11) after the heat spreader cover plate (1) and the bottom plate are joined. The reflux column (21) is formed by machining, etching, welding or sintering processes. The reflux column (21) structure includes, but is not limited to, solid structure, hollow structure, porous liquid-absorbing core (3) structure and suspended braided belt structure.
2. The stamped high heat flux density three-dimensional heat spreader plate according to claim 1, characterized in that: The liquid suction core (3) includes, but is not limited to, sintered powder, wire mesh, woven tape, microgroove and other liquid suction core (3) structures. The liquid suction core (3) is set in the groove of the base plate and on the surface of the return column (21) by sintering, electrodeposition and laser processing.
3. The stamped high heat flux density three-dimensional heat spreader plate according to claim 2, characterized in that: The thickness of the liquid-absorbing core (3) shall not exceed the depth of the groove.
4. The stamped high heat flux density three-dimensional heat spreader plate according to claim 3, characterized in that: Includes the following steps: Step S1: The cover plate (1) with a three-dimensional fin (11) structure is integrally formed by stamping process. Step S2: The base plate (2) is processed by machining or etching to form a groove and a support column (22) inside the groove. Step S3: The reflux column (21) is processed in the groove by machining, etching, welding or sintering. Step S4: The liquid suction core is placed on the inner surface of the cover plate (1), the three-dimensional fins (11), the groove of the bottom plate (2), and the surface of the reflux column by means of sintering, electrodeposition, and laser processing. Step S5: Weld the edges of the cover plate (1) and the bottom plate (2) and leave the filling port. Weld the filling pipe at the filling port. Step S6: The liquid working fluid is injected into the cavity through the filling tube, and after low-temperature freezing, vacuuming and sealing, a heat exchange plate is formed.
5. A stamped high heat flux density three-dimensional heat spreader according to claim 4, characterized in that, In step S6, the liquid working medium is a liquid that does not react with the cover plate (1), the bottom plate (2), the reflux column (21) and the suction core (3).