Flexible circuit boards and display devices

Abstract

This application relates to a flexible circuit board and a display device. The flexible circuit board includes a photosensitive area, an attachment area, and at least two connection areas. The photosensitive area is equipped with a photosensitive device. The attachment area is used to attach to the backlight surface of a display module. The at least two connection areas are distributed around the photosensitive area, connecting the photosensitive area and the attachment area. This application can prevent localized warping of the flexible circuit board from causing light leakage in the display.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a flexible circuit board and a display device. Background Technology

[0002] With the continuous innovation of high-end electronic products, light sensors have become an indispensable functional component of display products (especially wearable products such as watches).

[0003] When existing flexible circuit boards with light sensors are bonded to display modules, they are prone to localized lifting, resulting in light leakage. Summary of the Invention

[0004] Therefore, it is necessary to provide a flexible circuit board and display device that can prevent light leakage caused by local warping, in order to address the above-mentioned technical problems.

[0005] A flexible circuit board, comprising:

[0006] The light-sensing area is equipped with a light-sensing device;

[0007] The attachment area is used for attaching to the backlight surface of the display module;

[0008] At least two connection areas are distributed around the periphery of the light-sensing area, connecting the light-sensing area and the attachment area.

[0009] In one embodiment, the at least two connection areas are evenly distributed around the periphery of the light-sensitive area.

[0010] In one embodiment, the connection area includes a stretchable area.

[0011] In one embodiment, the at least two connection areas include at least one pair of stretchable areas, each pair of stretchable areas including two stretchable areas located on opposite sides of the photosensitive area and centrally symmetrically distributed.

[0012] In one embodiment, the stretchable region includes a bending region;

[0013] Preferably, the bending area includes a loop-shaped bending area;

[0014] Preferably, the bending form of the meandering bend includes N-shape, S-shape, U-shape or V-shape.

[0015] In one embodiment, the structure on both sides of the bend in the loop-shaped bend area includes a slot or cut line.

[0016] In one embodiment, the bottom of the slot or the cut line includes a crack-stopping hole.

[0017] In one embodiment, the attachment area includes at least one circuit board body area, and the at least two connection areas are located between the same circuit board body area and the photosensitive area.

[0018] In one embodiment, the main body area of ​​the circuit board includes a first sub-area and second sub-areas located on both sides of the first sub-area. The first sub-area and the second sub-areas on both sides form a groove, and the light-sensing area is located in the groove.

[0019] Preferably, the stretchable region is located between the photosensitive region and the second sub-regions on both sides.

[0020] The aforementioned flexible circuit board includes at least two connection areas. After the flexible circuit board is attached to the display module, each connection area can apply a tensile force to the light-sensing area. Furthermore, the presence of at least two connection areas improves the uniformity of force distribution on the light-sensing area, thereby preventing localized warping of the flexible circuit board and resulting in light leakage.

[0021] A display device, comprising:

[0022] Display module;

[0023] A high-density layer is located on the backlight surface of the display module;

[0024] In the aforementioned flexible circuit board, the light-sensing area is located on the surface of the pad layer away from the display module, and the attachment area is located on the backlight surface of the display module. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a partial top view of a traditional display device;

[0027] Figure 2 This is a partial cross-sectional schematic diagram of a traditional display device;

[0028] Figure 3 This is a partial top view of a display device according to an embodiment of this application;

[0029] Figure 4 This is a partial cross-sectional schematic diagram of a display device according to an embodiment of this application;

[0030] Figure 5 This is a partial top view of a display device according to another embodiment of this application;

[0031] Figure 6 for Figure 3 or Figure 5 Enlarged view of region A in the middle;

[0032] Figure 7 This is an enlarged schematic diagram of region A in another embodiment;

[0033] Figures 8 to 11 This is a schematic diagram showing the distribution of the connection area in different embodiments.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100-Display module, 110-Display panel, 111-Substrate, 112-Encapsulation layer, 120-Polarizer, 130-Optical adhesive, 140-Cover plate, 150-Buffer layer, 200-Pad layer, 300-Flexible circuit board, 310-Photosensitive area, 310a-Photosensitive device, 320-Attachment area, 321-Circuit board body area, 321a-Components, 321b-Battery, 3211-First sub-area, 3212-Second sub-area, 330-Connection area, 331-Stretchable area, 10-Slotting, 20-Cutting line. Detailed Implementation

[0036] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0038] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0039] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as "on" another layer or substrate, the layer or element may be directly on said other layer or substrate, or there may be intermediate layers. Furthermore, it is understood that when a layer is referred to as "between" two layers, the layer may be the only layer between said two layers, or there may be one or more intermediate layers. Additionally, the same reference numerals always denote the same elements.

[0040] In the following embodiments, when a layer, region, or element is “connected,” it can be interpreted as the layer, region, or element being connected not only directly but also through other constituent elements placed therebetween. For example, when a layer, region, element, etc., is described as being connected or electrically connected, the layer, region, element, etc., can not only be directly connected or directly electrically connected, but can also be connected or electrically connected through another layer, region, element, etc., placed therebetween.

[0041] In the following text, although terms such as “first” and “second” may be used to describe various components, these components are not necessarily limited to the terms above. The terms above are only used to distinguish one component from another. It will also be understood that expressions used in the singular form include plural expressions, unless the singular form has a distinctly different meaning in the context.

[0042] When a phrase such as “at least one of…” follows a list of elements, it modifies the entire list of elements, not individual elements within that list. The term “and / or” as used herein includes any and all combinations of one or more of the associated listed items. As used in the application documents, the term “and / or” includes any and all combinations of one or more of the associated listed items. It should also be understood that terms such as “comprising / including” or “having” specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0043] Electronic or electrical devices and / or any other related devices or components (e.g., display devices including a display panel and a display panel driver, wherein the display panel driver further includes a drive controller, a gate driver, a gamma reference voltage generator, a data driver, and a transmit driver) according to embodiments of the concepts described herein can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuits), software, or a combination of software, firmware, and hardware. For example, various components of these devices may be formed on an integrated circuit (IC) chip or on a separate IC chip. Additionally, various components of these devices may be implemented on a flexible printed circuit film, a tape-on-a-package (TCP), a printed circuit board (PCB), or formed on a substrate. Furthermore, various components of these devices may be processes or threads running on one or more processors in one or more computing devices to execute computer program instructions and interact with other system components to perform the various functions described herein. Computer program instructions are stored in memory, which may be implemented in a computing device using standard storage devices such as random access memory (RAM). Computer program instructions may also be stored in other non-transitory computer-readable media such as CD-ROMs, flash drives, etc. Furthermore, those skilled in the art will recognize that the functions of various computing devices may be combined or integrated into a single computing device, or the functions of a particular computing device may be distributed across one or more other computing devices, without departing from the spirit and scope of the exemplary embodiments of the present application.

[0044] While exemplary embodiments of the display module and the display device including the display module have been specifically described herein, many modifications and variations will be apparent to those skilled in the art. Therefore, it will be understood that the display module and the display device including the display module, constructed according to the principles of this application, may be implemented in ways other than those specifically described herein. This application is also defined in the claims and their equivalents.

[0045] As mentioned in the background section, existing flexible circuit boards, when bonded to the display module, are prone to localized lifting, resulting in light leakage. The inventors have discovered that the cause of this problem is:

[0046] Please see Figure 1 as well as Figure 2When the flexible circuit board is attached to the display module, the side of the flexible circuit board with the photosensitive device 310a' faces the display module 100'. Simultaneously, the area of ​​the flexible circuit board with the photosensitive device 310a' (the photosensitive area 310') is typically raised by a padding layer 200' (such as foam tape) to prevent the photosensitive device 310a' from touching the display module 100'. After the flexible circuit board is attached to the display module 100', the photosensitive area 310' of the flexible circuit board is higher than the area it is attached to on the display module (attachment area 320', typically the main body of the circuit board with components). The photosensitive area 310' attached to the padding layer 200' is connected to the attachment area 320' via a connecting area 330'. At this point, the photosensitive area is prone to uneven stress, and the photosensitive area 310' is prone to warping, creating gaps and causing light leakage.

[0047] For the reasons mentioned above, this application provides a flexible circuit board and display device that can prevent light leakage caused by local warping.

[0048] In one embodiment, see Figure 3 as well as Figure 4 A display device is provided, including a display module 100, a padding layer 200, and a flexible circuit board 300.

[0049] Please see Figure 4 The display module 100 may include a display panel 110, a polarizer 120, a cover plate 140, and a buffer layer 150, etc.

[0050] The display panel 110 may include a substrate 111, a pixel circuit layer (not shown), a light-emitting device layer (not shown), and an encapsulation layer 112. As an example, the substrate 111 of the display panel 110 may include a low-temperature polycrystalline silicon (LTPS) substrate. The pixel circuit layer may include thin-film transistors, capacitors, etc. Thin-film transistors may be formed on a low-temperature polycrystalline silicon substrate, etc. The light-emitting device layer may include an anode, a light-emitting layer, and a cathode. The light-emitting device layer includes multiple sub-pixels of different colors (e.g., red sub-pixels, green sub-pixels, and blue sub-pixels). The anodes of different sub-pixels can be set independently. Different sub-pixels may share a cathode formed on the same surface. The encapsulation layer 112 may cover the light-emitting device layer and the pixel circuit layer.

[0051] The polarizer 120 can be disposed on the encapsulation layer 112 of the display panel 110. The cover plate 140 can be attached to the polarizer 120 by means of optical adhesive 130 or the like.

[0052] The buffer layer 150 can be disposed on the side of the substrate 111 of the display panel 110 away from the cover plate 140. The material of the buffer layer 150 can be, but is not limited to, cushioning foam or polyethylene terephthalate (PET). The buffer layer 150 may have openings. The openings are used to allow the light sensor 310a to receive light from the display module 100.

[0053] The padding layer 200 can be connected to the buffer layer 150 of the display module 100. The material of the padding layer 200 can be, but is not limited to, foam tape. The foam tape can be adhered to the buffer layer 150 of the display module 100. The foam tape can also have receiving holes. These receiving holes can be used to house the photosensitive device 310a.

[0054] The flexible circuit board 300 extends from the backlight surface of the display module 100 to the surface of the padding layer 200 away from the display panel 110. A photosensitive device 310a is provided in the area of ​​the flexible circuit board 300 located on the surface of the padding layer 200. The photosensitive device 310a is located within a receiving hole in the padding layer 200. The padding layer 200 can elevate and protect the photosensitive device 310a, thereby preventing the photosensitive device 310a from touching the display module 100.

[0055] In one embodiment, a flexible circuit board 300 is provided. See also... Figure 3 as well as Figure 4 The flexible circuit board 300 includes a light-sensing area 310, an attachment area 320, and at least two connection areas 330.

[0056] The light-sensitive area 310 is the area of ​​the flexible circuit board 300 that is equipped with a light-sensitive device 310a.

[0057] When the flexible circuit board 300 is bonded to the display module 100 to form a display device, the photosensitive area 310 can be attached to the padding layer 200. The padding layer 200 can be, for example, foam tape. The opposite sides of the padding layer 200 can be bonded to the backlight surface of the display module 100 (such as the surface of the buffer layer 150 away from the substrate 111) and the photosensitive area 310 of the flexible circuit board 300, respectively.

[0058] The attachment area 320 is the area of ​​the flexible circuit board 300 for attachment to the backlight surface of the display module 100. Specifically, the attachment area 320 can be attached to the buffer layer 150 or other back structure of the display module 100, for example, via an adhesive layer 400. The adhesive layer 400 may include, but is not limited to, double-sided adhesive.

[0059] The attachment area 320 may include at least one circuit board body area 321. The circuit board body area 321 is provided with circuit board components 321a and batteries 321b, etc. When the flexible circuit board 300 is bonded to the display module 100 to form a display device, the circuit board body area 321 is attached to the backlight surface of the display module 100.

[0060] Of course, the attachment area 320 may also include an attachment area used only for attaching to the display module 100, and not for setting components 321a and battery 321b, etc. This application does not impose any limitations on this.

[0061] The connecting area 330 connects the photosensitive area 310 and the attachment area 320. At least two connecting areas 330 are distributed around the periphery of the photosensitive area 310, allowing the photosensitive area 310 to be subjected to forces in at least two directions, thereby improving the uniformity of force distribution on the photosensitive area 310. As an example, the at least two connecting areas can be evenly distributed around the periphery of the photosensitive area, facilitating uniform force distribution on the photosensitive area 310. Of course, the distribution of the at least two connecting areas can also differ. For example, if the photosensitive area 310 is quadrilateral, a connecting area 330 can be provided around each of the four edges of the photosensitive area 310. In this case, the connecting areas 330 located on opposite sides are centrally symmetrically arranged, ensuring uniform force distribution on the photosensitive area 310 even if the four connecting areas 330 are not evenly distributed.

[0062] At least two connection areas 330 ensure that the photosensitive area 310 is subjected to uniform force. That is, through force analysis, it can be found that the vector sum of the tensile forces F exerted by at least two connection areas 330 on the photosensitive area 310 is zero or less than a preset range. The preset range is the range that ensures that the photosensitive area 310 will not locally warp. The specific setting can be made according to the actual product.

[0063] When the flexible circuit board 300 is bonded to the display module 100 to form a display device, each connection area 330 undergoes bending deformation, so that while the attachment area 320 is attached to the backlight surface of the display module 100, the light-sensing area 310 can be attached to the surface of the pad layer 200 away from the display module 100.

[0064] In this embodiment, the flexible circuit board 300 includes at least two connection areas 330. After the flexible circuit board 300 is attached to the display module 100, each connection area 330 can apply a tensile force to the light-sensing area 310. Furthermore, the at least two connection areas 330 can improve the uniformity of force on the light-sensing area 310, thereby preventing localized warping of the flexible circuit board 300 and resulting in light leakage.

[0065] In one embodiment, see Figure 3 The connecting area 330 includes a stretchable area 331.

[0066] As an example, the stretchable area 331 may include a bending area.

[0067] As an example, the bending area may include a spiral bending area. The bending form of the spiral bending area may include N-shape, S-shape, U-shape, or V-shape, etc. Of course, the bending area may also have other irregular bending forms. Alternatively, the stretchable area 331 may also have other forms, such as a three-dimensional spiral or spring shape, or other regular and irregular arc or curve shapes, as long as it can be stretched.

[0068] Please see Figure 1 Through long-term research, the inventors discovered that the connection area 330' of a traditional flexible circuit board 300' is typically a linear region. In this case, if the length of the connection area 330' between the attachment area 320' and the photosensitive area 310' is short, a height difference will occur between the attachment area 320' and the photosensitive area 310' after the flexible circuit board 300' is attached to the display module 100', causing the portion of the attachment area 320' near the connection area 330' to lift up. Therefore, the connection area 330' of a traditional flexible circuit board 300' usually needs to be relatively long, thus occupying a larger amount of circuit board space.

[0069] In this embodiment, the connection area 330 is set as a stretchable area 331. The stretchable area 331 is in a contracted state when the flexible circuit board 300 is not attached, thereby effectively reducing the length between the light-sensing area 310 and the attachment area 320 occupied by the connection area 330, and reducing the space occupied by the connection area 330 on the flexible circuit board 300.

[0070] Meanwhile, the periphery of the photosensitive area 310 is connected to multiple stretchable areas 331, allowing each stretchable area 331 to be designed with a smaller linewidth. Specifically, when only one stretchable area 331 is provided on one side of the photosensitive area 310, its linewidth can be W to meet electrical connection requirements. When n stretchable areas 331 are provided around the photosensitive area 310, its linewidth can be W / n. For example, when two stretchable areas 331 are provided around the photosensitive area 310, its linewidth can be W / 2. When three stretchable areas 331 are provided around the photosensitive area 310, its linewidth can be W / 3. When four stretchable areas 331 are provided around the photosensitive area 310, its linewidth can be W / 4.

[0071] Therefore, multiple stretchable areas 331 are connected to the periphery of the photosensitive area 310, thereby further reducing the length between the photosensitive area 310 and the attachment area 320 occupied by a single stretchable area 331.

[0072] Please also see Figure 1 as well as Figure 2Through long-term research, the inventors discovered that in traditional flexible circuit boards 300', the photosensitive area 310' is connected to the attachment area 320' (such as the main body area 321 of the circuit board) via a linear connecting area 330' located on one side (such as the left side) of the photosensitive area 310'. When the flexible circuit board 300' is bonded to the display module 100' to form a display device, the attachment area 320' (such as the main body area of ​​the circuit board) needs to be attached first. Then, the connecting area 330' is bent and deformed, causing the photosensitive area 310' to be raised. The photosensitive area 310' is then attached.

[0073] During this process, after the connecting area 330' undergoes bending deformation, its orthographic projection length on the display module 100' will shorten. Therefore, the position of the light-sensing area 310' and the light-sensing device 310a' mounted thereon will shift horizontally to the left. Therefore, before attaching the light-sensing area 310', it is necessary to perform secondary positioning of the light-sensing device 310a' to ensure that the position of the light-sensing device 310a' is accurate.

[0074] In this embodiment, the photosensitive area 310 and the attachment area 320 (such as the circuit board body area 321) are connected by a stretchable area 331 (connection area 330). When the flexible circuit board 300 is bonded to the display module 100 to form a display device, the photosensitive area 310 and the attachment area 320 can be attached simultaneously, and the stretchable area 331 is stretched at the same time. At this time, when the photosensitive area 310 is raised, the orthographic projection length of the stretchable area 331 on the display module 100 can be kept constant. At the same time, each stretchable area 331 is distributed around the periphery of the photosensitive area 310, so that each stretchable area 331 has a pulling force on the photosensitive area 310, thereby preventing the photosensitive device 310a on the photosensitive area 310 from moving in the horizontal direction, thus eliminating the need for secondary alignment of the photosensitive device 310a after the flexible circuit board 300 is attached. Therefore, this embodiment can improve alignment accuracy and increase work efficiency.

[0075] Meanwhile, by setting the connection area 330 to include the stretchable area 331, the degree of stretching of the stretchable area 331 can be controlled to adapt to the attachment requirements of the photosensitive device 310a of different heights.

[0076] In one embodiment, see Figure 3 The attachment area 320 includes at least one circuit board body area 321. At least two connection areas 330 are located between the same circuit board body area 321 and the photosensitive area 310. The connection areas 330 are stretchable areas 331.

[0077] As an example, the flexible circuit board 300 may include a circuit board body area 321, a light-sensitive area 310, and at least two connection areas 330 located between the two.

[0078] When at least two connection areas 330 are disposed between the same circuit board body area 321 and the light-sensing area 310, and the flexible circuit board 300 is bonded to the display module 100 to form a display device, the light-sensing area 310 needs to be raised, and each connection area 330 will undergo bending deformation. If each connection area 330 is a non-stretchable area (such as a straight area), after each connection area 330 undergoes bending deformation, its orthographic projection length on the display module 100 will be shortened, thereby causing each connection area 330 to exert a pulling force on the same circuit board body area 321 toward the light-sensing area 310, thus causing the circuit board body area 321 to deform.

[0079] By designating the connection area 330 as a stretchable area 331, when the flexible circuit board 300 is bonded to the display module 100 to form a display device, each connection area 330 can be stretched. When the light-sensing area 310 is raised, the orthographic projection length of each connection area 330 on the display module 100 remains unchanged, thereby ensuring that the shape of the main circuit board area 321 remains unchanged. At this time, the circuit board components 321a, etc., on the main circuit board area 321 can be accurately positioned.

[0080] Of course, in other embodiments, different connection areas 330 may also be located between different attachment areas 320 and photosensitive areas 310. The different attachment areas 320 may include different circuit board body areas 321, or they may include a circuit board body area 321 and an adhesive area used only for attachment to the display module 100. Furthermore, when different connection areas 330 are located between different attachment areas 320 and photosensitive areas 310, the connection area 330 may include a stretchable area 331, or it may include other types of areas, depending on actual needs; this application does not limit the specific type of area.

[0081] In one embodiment, see Figure 3 as well as Figure 5 The main body area 321 of the circuit board includes a first sub-area 3211 and a second sub-area 3212 located on both sides of the first sub-area 3211. The first sub-area 3211 and the second sub-areas 3212 on both sides form a groove. The light-sensitive area 310 is located in the groove, and the stretchable area 331 is located between the light-sensitive area 310 and the second sub-areas 3212 on both sides.

[0082] At this point, the connection area 330 does not need to be set up at the location of the first sub-region 3211, thus saving more space to place components 321a and battery 321b, etc. (see [link]). Figure 5 ).

[0083] In one embodiment, at least two connection areas 330 include one or more stretchable areas 331. Each pair of stretchable areas 331 includes two stretchable areas 331. The two stretchable areas 331 are located on opposite sides of the photosensitive area 310 and are centrally symmetrically distributed.

[0084] For example, please refer to Figure 3 or Figure 5 The light-sensing area 310 can be a regular quadrilateral. A pair of stretchable areas 331, arranged symmetrically on opposite sides of the light-sensing area 310 in the horizontal direction, can be located on the center line of the light-sensing area 310 (e.g.,...). Figure 3 or Figure 5 As shown), they can also be located on both sides of the center line of the photosensitive area 310 (not shown), so that the length of the stretchable area 331 in the vertical direction can be adjusted, thereby improving its stretchability and thus adapting to photosensitive devices 310a of higher height.

[0085] As yet another example, please refer to Figures 8 to 10 The main body area 321 of the circuit board surrounds the light-sensing area 310, and the light-sensing area 310 can be a regular quadrilateral. Please refer to [link / reference here]. Figure 8 A pair of stretchable areas 331, arranged in a centrally symmetrical manner, may be provided on opposite sides of the light-sensitive area 310 in the horizontal direction. Alternatively, please refer to... Figure 9 A pair of stretchable areas 331 are provided on opposite sides of the light-sensitive area 310 in the vertical direction, arranged in a centrally symmetrical manner. Alternatively, please refer to... Figure 10 A pair of stretchable areas 331 are provided on opposite sides of the light-sensing area 310 in the horizontal direction and are provided on opposite sides of the light-sensing area 310 in the vertical direction.

[0086] Understandable. Figures 8 to 10 In order to highlight the distribution of the stretchable area 331 (connection area 330), the stretchable area 331 is represented by a black square, but the specific structural form of the stretchable area 331 is not drawn.

[0087] In other examples, the light-sensitive area 310 may be in other shapes, such as other regular polygons (e.g., regular hexagons, regular octagons, etc.).

[0088] In this embodiment, by having at least a pair of stretchable regions 331 located on opposite sides of the light-sensitive region 310 and distributed in a centrally symmetrical manner, the light-sensitive region 310 can be effectively subjected to uniform force by having at least two connecting regions 330.

[0089] Of course, the methods for achieving at least two connection areas 330 to ensure uniform force on the light-sensitive area 310 are not limited to this. For example, please refer to... Figure 11The light-sensing area 310 can be circular. At least two connecting areas 330 can include three connecting areas 330 arranged in pairs at 120 degrees. In this case, connecting the three connecting areas 330 can also make the light-sensing area 310 subject to uniform force.

[0090] In one embodiment, see Figure 6 The stretchable region 331 includes a loop-shaped bend area. A slot 10 is included between the structures on both sides of the loop-shaped bend area. The slot 10 separates the structures on both sides to facilitate stretching of the stretchable region 331 during the attachment of the flexible circuit board 300.

[0091] For example, Figure 6 In the diagram, the structures on both sides of bend A are structure a and structure b. A slot 10 is included between structure a and structure b. This slot 10 separates structure a and structure b on both sides. For example, Figure 6 In the middle, the structures on both sides of the bend B are structure a and structure c. A slot 10 is included between structure a and structure c. This slot 10 separates structure a and structure c on both sides.

[0092] As an example, the bottom of the slot 10 includes a crack-stopping hole 30. The crack-stopping hole 30 can communicate with the slot 10 to prevent cracks from forming near the bottom of the slot 10 when the stretchable region 331 is stretched.

[0093] In one embodiment, see Figure 7 The stretchable region 331 includes a loop-shaped bend area. A cut line 20 is provided between the structures on both sides of the loop-shaped bend area. The cut line 20 cuts off the structures on both sides to facilitate stretching of the stretchable region 331 during the attachment of the flexible circuit board 300.

[0094] For example, Figure 7 In the middle, the structures on both sides of the bend A' are structure a' and structure b'. A cutting line 20 separates structure a' and structure b' on both sides. For example, Figure 6 In the middle, the structures on both sides of the bend B' are structure a' and structure c'. A cutting line 20 is included between structure a' and structure c'. This cutting line 20 separates structure a' and structure c' on both sides.

[0095] Using the cutting line method can save some of the space occupied by the slot width, and also reduce the production difficulty for FPC manufacturers.

[0096] As an example, the bottom of the cut line 20 includes a crack-stopping hole 30. The crack-stopping hole 30 can communicate with the cut line 20 to prevent cracks from forming near the bottom of the cut line 20 when the stretchable region 331 is stretched.

[0097] It is understood that the display device in the embodiments of this application can be any product or component with display function, such as OLED display device, QLED display device, electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable device, Internet of Things device, etc., and the embodiments disclosed in this application do not limit this.

[0098] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0099] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A flexible circuit board, characterized in that, include: The light-sensing area is equipped with a light-sensing device; The attachment area is used for attaching to the backlight surface of the display module; At least two connection areas are distributed around the periphery of the photosensitive area, connecting the photosensitive area and the attachment area; The connection area includes a stretchable area.

2. The flexible circuit board according to claim 1, characterized in that, The at least two connection areas are evenly distributed around the periphery of the light-sensitive area.

3. The flexible circuit board according to claim 1, characterized in that, The at least two connection areas include at least one pair of stretchable areas, each pair of stretchable areas including two stretchable areas located on opposite sides of the photosensitive area and distributed in a centrally symmetrical manner.

4. The flexible circuit board according to claim 1, characterized in that, The stretchable region includes a bending region.

5. The flexible circuit board according to claim 4, characterized in that, The bending area includes a loop-shaped bending area.

6. The flexible circuit board according to claim 5, characterized in that, The bending patterns of the meandering bends include N-shaped, S-shaped, U-shaped, or V-shaped.

7. The flexible circuit board according to claim 5, characterized in that, The structure on both sides of the bend in the meandering area includes a slot or cut line.

8. The flexible circuit board according to claim 7, characterized in that, The bottom of the slot or the cutting line includes a crack-stopping hole.

9. The flexible circuit board according to claim 1, characterized in that, The attachment area includes at least one circuit board body area, and the at least two connection areas are located between the same circuit board body area and the photosensitive area.

10. The flexible circuit board according to claim 9, characterized in that, The main body area of ​​the circuit board includes a first sub-area and a second sub-area located on both sides of the first sub-area. The first sub-area and the second sub-areas on both sides form a groove, and the light-sensing area is located in the groove.

11. The flexible circuit board according to claim 10, characterized in that, The stretchable area is located between the light-sensitive area and the second sub-areas on both sides.

12. A display device, characterized in that, include: Display module; A high-density layer is located on the backlight surface of the display module; The flexible circuit board according to any one of claims 1-11, wherein the photosensitive area is located on the surface of the pad layer away from the display module, and the attachment area is located on the backlight surface of the display module.

Images