Display substrate, manufacturing method thereof, display panel and display device

Abstract

The present disclosure discloses a display substrate, a manufacturing method thereof and a display panel, and belongs to the technical field of display. The display substrate comprises: a light emitting unit comprising a first electrode, a second electrode and a light emitting part; a driving unit comprising a third electrode, a fourth electrode, a driving circuit and a substrate, wherein the substrate is located on the side of the driving circuit away from the light emitting unit; a support structure comprising a plurality of first pins, the support structure is located on the side of the substrate away from the driving circuit, the plurality of first pins are electrically connected with the driving circuit, and the support structure comprises a support area in contact with the driving unit; a back plate comprising a plurality of conductive pads, and the plurality of conductive pads are connected one by one with the plurality of first pins. Wherein, the ratio of the orthographic projection of the support area on the back plate to the orthographic projection of the driving unit on the back plate is greater than or equal to 50%. The embodiment of the present disclosure can improve the display substrate deformation caused by insufficient support of the driving unit on the side close to the back plate.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display substrate and its manufacturing method, a display panel, and a display device. Background Technology

[0002] Display devices are widely used in people's daily lives, such as mobile phones, monitors, and tablets. The display substrate is an important component of display devices.

[0003] In related technologies, a display substrate includes a backplate, multiple pins, a driving unit, and a light-emitting unit stacked sequentially. The multiple pins protrude away from the driving unit, and the ratio of the orthographic projection of the multiple pins on the backplate to the orthographic projection of the driving unit on the backplate is small. The multiple pins are used for electrical connections between the multiple driving units and the backplate.

[0004] Due to the presence of multiple pins, there is a gap between the driving unit and the back plate; and because the ratio of the orthographic projection of the multiple pins on the back plate to the orthographic projection of the driving unit on the back plate is small, the driving unit may not be adequately supported on the side closer to the back plate, which may lead to deformation of the display substrate. Summary of the Invention

[0005] This disclosure provides a display substrate and its manufacturing method, a display panel, and a display device, which can improve the defect of display substrate deformation caused by insufficient support on the side of the driving unit near the back plate. The technical solution is as follows:

[0006] On one hand, a display substrate is provided, comprising: a light-emitting unit, the light-emitting unit including: a first electrode, a second electrode, and a light-emitting portion electrically connected to the first electrode and the second electrode respectively; a driving unit, the driving unit including: a third electrode, a fourth electrode, a driving circuit, and a substrate, the third electrode and the fourth electrode being located on the side of the driving unit facing the light-emitting unit, the third electrode and the fourth electrode being electrically connected to the driving circuit respectively, the third electrode being electrically connected to the first electrode, the fourth electrode being electrically connected to the second electrode, and the substrate being located on the side of the driving circuit away from the light-emitting unit; a support structure, the support structure being located on the side of the substrate away from the driving circuit, the support structure including a support area in contact with the driving unit, the support structure including a plurality of first pins, the plurality of first pins being electrically connected to the driving circuit; and a back plate, the back plate being located on the side of the support structure away from the light-emitting unit, the back plate including a plurality of conductive pads, the plurality of conductive pads being connected one-to-one with the plurality of first pins; wherein, the ratio of the orthographic projection of the support area on the back plate to the orthographic projection of the driving unit on the back plate is greater than or equal to 50%.

[0007] Optionally, the driving unit further includes a connection structure, the substrate has a connection via, and the connection structure is located within the connection via; the first pin is in contact with the connection structure, and the first pin and the driving circuit are connected through the connection structure.

[0008] Optionally, the substrate is made of one of polyimide, polyamide, acrylic resin and phenolic resin; the thickness of the substrate is in the range of 25 μm to 35 μm.

[0009] Optionally, the support structure further includes a first auxiliary support structure, which contacts the substrate and the backplate respectively.

[0010] Optionally, the material of the first auxiliary support structure includes at least one of resin, silicon nanospheres, metal oxide nanospheres, and non-metal oxide nanospheres.

[0011] Optionally, the support structure further includes a second auxiliary support structure, which is connected to the side of the substrate away from the driving circuit, and the first pin is located on the side of the second auxiliary support structure away from the substrate.

[0012] Optionally, the material of the second auxiliary support structure is glass.

[0013] Optionally, the first pin includes a first side facing the driving circuit and a second side facing away from the driving circuit; the projected area of ​​the first side on the backplane is greater than the projected area of ​​the second side on the backplane.

[0014] Optionally, the first pin includes a first connection structure located on the side of the first pin away from the substrate and includes a plurality of protrusions; the conductive pad includes a second connection structure located on the side of the first pin away from the substrate and includes a plurality of protrusions; the protrusions of the first connection structure and the protrusions of the second connection structure are connected in a staggered manner; or, the protrusions of the first connection structure and the protrusions of the second connection structure are connected opposite to each other.

[0015] Optionally, the display substrate further includes an isolation structure located between the light-emitting part and the driving circuit, and in contact with the light-emitting part and the driving circuit respectively; the isolation structure surrounds the entire first electrode and the third electrode to isolate the first electrode and the third electrode from the outside world; the isolation structure surrounds the entire second electrode and the fourth electrode to isolate the second electrode and the fourth electrode from the outside world.

[0016] Optionally, the display substrate further includes a first substrate located on the side of the light-emitting unit away from the driving unit, the isolation structure surrounding the light-emitting unit and filling the space between the driving unit to which the light-emitting unit is connected and the first substrate, the isolation structure being in contact with the driving unit and the first substrate respectively.

[0017] Optionally, the material of the isolation structure includes UV-curing adhesive. 、 At least one of silicon nanospheres, metal oxide nanospheres, and non-metal oxide nanospheres.

[0018] Optionally, at least one of the plurality of first pins comprises an alloy containing nickel and gold.

[0019] Optionally, the plurality of light-emitting units include a first color light-emitting unit, a second color light-emitting unit, and a third color light-emitting unit; wherein the colors of the light emitted by the first color light-emitting unit, the second color light-emitting unit, and the third color light-emitting unit are different from each other.

[0020] Optionally, the light-emitting part includes a color filter layer, a color conversion layer and a light-emitting layer stacked sequentially along the direction close to the driving unit, wherein the light-emitting layer emits blue light.

[0021] Optionally, the light-emitting layer includes a first doped layer, a multiple quantum well layer, and a second doped layer stacked together, wherein the first doped layer is electrically connected to the first electrode, and the second doped layer is electrically connected to the second electrode.

[0022] Optionally, the driving circuit includes a plurality of thin-film transistors and at least one storage capacitor, each thin-film transistor including a gate, a source, and a drain; one of the plurality of first pins is connected to the source of one of the plurality of thin-film transistors to provide the driving circuit with a data driving signal from the backplane.

[0023] Optionally, the driving circuit includes a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer stabilizing layer, a source-drain layer, and a planarization layer, all stacked sequentially on one side of the substrate; the third electrode and the fourth electrode are located on the side of the planarization layer away from the substrate; the active layer includes multiple active patterns corresponding to the plurality of thin-film transistors, each active pattern including a source region, a drain region, and a channel region; the source and drain of the thin-film transistors are located in the source-drain layer, the source and source region of the thin-film transistors are connected, and the drain and drain region of the thin-film transistors are connected; the first gate layer includes multiple gate patterns corresponding to the plurality of thin-film transistors, and the channel region is the overlapping area of ​​the orthographic projection of the gate pattern on the substrate and the orthographic projection of the active pattern on the substrate.

[0024] On the other hand, a method for manufacturing a display substrate is provided, the method comprising: obtaining a light-emitting unit, the light-emitting unit including: a first electrode, a second electrode, and a light-emitting portion electrically connected to the first electrode and the second electrode respectively; obtaining a driving unit, the driving unit including: a third electrode, a fourth electrode, a driving circuit, and a substrate, the third electrode and the fourth electrode being electrically connected to the driving circuit respectively; and bonding the light-emitting unit and the driving unit together by a bonding process, such that the third electrode and the fourth electrode are both located on the side of the driving unit facing the light-emitting unit, and the substrate is located on the side of the driving circuit away from the light-emitting unit, the third electrode and the first electrode being electrically connected to the second electrode respectively; and bonding the light-emitting unit and the driving unit together by a bonding process, such that the third electrode and the fourth electrode are both located on the side of the driving unit facing the light-emitting unit, and the substrate is located on the side of the driving circuit away from the light-emitting unit. Electrode electrical connection: the fourth electrode and the second electrode are electrically connected; the substrate is located on the side of the driving circuit away from the light-emitting unit; a support structure is fabricated on the side of the substrate away from the driving circuit; the support structure includes a support area in contact with the driving unit; the support structure includes a plurality of first pins; the plurality of first pins are electrically connected to the driving circuit; a backplate is obtained; the backplate includes a plurality of conductive pads; the first pins and the backplate are bonded together by a bonding process; the plurality of conductive pads are connected one-to-one with the plurality of first pins; wherein, the ratio of the orthographic projection of the support area on the backplate to the orthographic projection of the driving unit on the backplate is greater than or equal to 50%.

[0025] Optionally, the support structure further includes a first auxiliary support structure, which contacts the substrate and the backplate respectively; the manufacturing method further includes: before connecting the first pin and the backplate, coating an initial auxiliary support layer on the side of the backplate near the driving unit, and forming a plurality of grooves in the initial auxiliary support layer to obtain a first auxiliary support structure, wherein the plurality of grooves correspond to the plurality of first pins, and the first pins are located in the grooves; or, after connecting the first pin and the backplate, immersing the driving unit and the backplate, which are fixedly connected by the plurality of first pins, in a first auxiliary support material liquid to solidify and form the first auxiliary support structure.

[0026] Optionally, the support structure plate further includes a second auxiliary support structure, which is connected to the side of the substrate away from the driving circuit. The manufacturing method further includes: after bonding the light-emitting unit and the driving unit together by a bonding process, thinning and drilling holes in the initial substrate connected to the side of the driving unit away from the light-emitting unit to form a plurality of openings, wherein the plurality of openings correspond one-to-one with the plurality of first pins, thereby obtaining the second auxiliary support structure.

[0027] In another aspect, a display panel is provided, the display panel including any of the aforementioned display substrates, a touch layer and an encapsulation layer, wherein the touch layer and the encapsulation layer are sequentially stacked on the side of the light-emitting unit away from the driving unit.

[0028] In another aspect, a display device is provided, the display device including any of the aforementioned display substrates and a power supply circuit, the power supply circuit being used to supply power to the display substrate; or, the display device including the aforementioned display panel and a power supply circuit, the power supply circuit being used to supply power to the display panel.

[0029] The beneficial effects of the technical solution provided in this disclosure include at least the following: This disclosure provides a display substrate having a back plate, a support structure, a driving unit, and a light-emitting unit arranged sequentially. The support structure includes a support area that contacts the driving unit. By ensuring that the ratio of the orthographic projection of the support area on the back plate to the orthographic projection of the driving unit on the back plate is greater than or equal to 50%, gaps between the driving unit and the back plate due to the presence of multiple first pins can be avoided, preventing insufficient support on the side of the driving unit closer to the back plate and thus avoiding deformation of the display substrate. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic cross-sectional view of a display substrate provided in an embodiment of this disclosure;

[0032] Figure 2 This is a schematic diagram of a planar structure of a display substrate provided in an embodiment of this disclosure;

[0033] Figure 3 This is a cross-sectional structural diagram of the connected driving unit and the first pin provided in an embodiment of this disclosure;

[0034] Figure 4 This is a schematic cross-sectional view of a light-emitting unit provided in an embodiment of this disclosure;

[0035] Figure 5 This is a schematic cross-sectional view of another light-emitting unit provided in an embodiment of this disclosure;

[0036] Figure 6 This is an optical simulation diagram of an isolation structure made of silicon nanospheres provided in an embodiment of this disclosure;

[0037] Figure 7 This is a schematic diagram of a cross-sectional structure of another display substrate provided in an embodiment of this disclosure;

[0038] Figure 8 This is provided by the embodiments of this disclosure. Figure 7 A magnified view of a portion of the image;

[0039] Figure 9 This is a schematic cross-sectional view of another driving unit provided in an embodiment of this disclosure;

[0040] Figure 10 This is a schematic diagram of a cross-sectional structure of another display substrate provided in an embodiment of this disclosure;

[0041] Figure 11 This is provided by the embodiments of this disclosure. Figure 10 A magnified view of a portion of the image;

[0042] Figure 12 This is a schematic cross-sectional view of another display substrate provided in this embodiment and a bottom view of the first pin;

[0043] Figure 13 This is a schematic diagram of a cross-sectional structure of another display substrate provided in an embodiment of this disclosure;

[0044] Figure 14 This is a schematic flowchart of a method for manufacturing a display substrate according to an embodiment of the present disclosure;

[0045] Figure 15 This is a schematic flowchart of another method for manufacturing a display substrate provided in this embodiment of the present disclosure;

[0046] Figure 16 This is a schematic flowchart of another method for manufacturing a display substrate provided in this embodiment of the present disclosure;

[0047] Figure 17 This is a schematic flowchart of another method for manufacturing a display substrate provided in this embodiment. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0049] The terminology used in the embodiments of this disclosure is for illustrative purposes only and is not intended to limit the disclosure. Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should be understood in their ordinary sense by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar words used in the patent application specification and claims of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “a” or “an” and similar words do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar words mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, but do not exclude other elements or objects.

[0050] Micro light-emitting diode (Micro LED) display substrates typically include a backplane, driving units integrated on the backplane, and light-emitting chips bonded to the driving units. To achieve color display during the fabrication of this Micro LED display substrate, different colored light-emitting chips need to be transferred and bonded to the backplane with the integrated driving units. Chips of the same color are transferred once, while chips of different colors are transferred in multiple transfers. The number of transfers equals the number of colors of the light-emitting chips. Optionally, the light-emitting chips include three colors, such as red, green, and blue, requiring three transfers. This method involves a relatively large number of transfers and is therefore more complex in fabricating the Micro LED display substrate.

[0051] Furthermore, to reduce the manufacturing cost of Micro LED display substrates, the backplane size cannot be designed to be too large (because if some of the light-emitting chips fail to emit light after transfer, the entire product will be scrapped, resulting in high costs). Therefore, if this solution needs to achieve a large-size display, it can only be achieved through splicing, resulting in poor display quality.

[0052] This involves bonding RGB micro-LEDs with driving units to form a new active-matrix light-emitting diode (AM-LED) chip with its own driving circuitry. This AM-LED chip includes RGB light-emitting chips and driving units that drive these chips. Furthermore, the required number of AM-LED chips is transferred and bonded to a backplane in a single process to fabricate a glass-based color LED display substrate. This method requires only one transfer process, simplifying the manufacturing process. Moreover, it enables large-size displays without the need for splicing, improving the glass utilization rate of the backplane and thus reducing costs.

[0053] Furthermore, this AM-LED chip utilizes detection technology to achieve dual electrical and optical detection, screening out chips that meet both optical and driving performance requirements. Therefore, compared to integrating the driving circuitry onto the backplane to form the display substrate, this approach is more conducive to improving chip yield on the display substrate and also facilitates the repair and replacement of defective chips.

[0054] However, since the AM-LED chip has multiple first pins on the side closest to the back panel, after the AM-LED chip is transferred to the back panel, there is a gap between the AM-LED chip and the back panel due to the presence of the first pins. This may cause the display substrate to deform due to insufficient support on the side of the driving unit closest to the back panel.

[0055] Figure 1 This is a schematic cross-sectional view of a display substrate provided in an embodiment of this disclosure. Figure 1 As shown, the display substrate includes: a light-emitting unit 101, a driving unit 102, a support structure 103, and a back plate 105.

[0056] The light-emitting unit 101 includes a first electrode 1011, a second electrode 1012, and a light-emitting portion 1013 electrically connected to the first electrode 1011 and the second electrode 1012, respectively. The driving unit 102 includes a third electrode 1021, a fourth electrode 1022, a driving circuit 1023, and a substrate 1024. The third electrode 1021 and the fourth electrode 1022 are both located on the side of the driving unit 102 facing the light-emitting unit 101. The third electrode 1021 and the fourth electrode 1022 are electrically connected to the driving circuit 1023, the third electrode 1021 is electrically connected to the first electrode 1011, and the fourth electrode 1022 is electrically connected to the second electrode 1012. The substrate 1024 is located on the side of the driving circuit 1023 away from the light-emitting unit 101. The support structure 103 is located on the side of the substrate 1024 away from the light-emitting unit 101, and the support structure 103 includes a support region 103A that contacts the driving unit 102. The support structure 103 includes a plurality of first pins 1031, which are located on the side of the substrate 1024 away from the driving circuit 1023 and are electrically connected to the driving circuit 1023. A backplate 105 is located on the side of the support structure 103 away from the light-emitting unit 101. The backplate 105 includes a plurality of conductive pads 1051, which are connected one-to-one with the plurality of first pins 1031. Here, the light-emitting unit 101 is the aforementioned microdisplay chip, and the light-emitting unit 101 and the driving unit 102 can form the aforementioned AM-LED chip.

[0057] Figure 2 This is a schematic diagram of a planar structure of a display substrate provided in an embodiment of this disclosure. (In conjunction with...) Figure 1 and Figure 2 The ratio of the orthographic projection of the support area 103A onto the backplate 105 to the orthographic projection of the drive unit 102 onto the backplate 105 is greater than or equal to 50%. It should be noted that... Figure 2 In the enlarged view on the right, the first electrode 1011 and the second electrode 1012 are indicated by a dashed box because they are located between the light-emitting unit 101 and the driving unit 102; the support region 103A is indicated by a dashed box because it is located on the side of the driving unit 102 away from the light-emitting unit 101. To better distinguish the first electrode 1011, the second electrode 1012, and the support region 103A, Figure 2 The dashed frame of the central support area 103A has a larger line width.

[0058] Since the support structure 103 is located between the substrate 1024 and the back plate 105, and the ratio of the orthographic projection of the support area 103A on the back plate to the orthographic projection of the driving unit on the back plate is greater than or equal to 50%, the support structure 103 can reduce the gap between the back plate 105 and the driving unit 102 caused by the first pin 1031, play a supporting role, and improve the defect of insufficient support on the side of the driving unit 102 near the back plate 105 that leads to the deformation of the display substrate.

[0059] Optionally, the ratio of the orthographic projection of the support area 103A on the back plate 105 to the orthographic projection of the drive unit 102 on the back plate 105 is greater than or equal to 70%, so as to better support the side of the drive unit 102 near the back plate 105.

[0060] Figure 3 This is a cross-sectional schematic diagram of the connected driving unit and the first pin provided in an embodiment of this disclosure. The driving unit 102 also includes a connection structure 1025. A connection via 1024a is provided in the substrate 1024, and the connection structure 1025 is located within the connection via 1024a. The first pin 1031 is in contact with the connection structure 1025, and the first pin 1031 and the driving circuit 1023 are connected through the connection structure 1025. The connection structure 1025 facilitates the electrical connection between the first pin 1031 and the driving circuit 1023.

[0061] For example, such as Figure 3 As shown, the area of ​​the orthographic projection of the first pin 1031 on the substrate 1024 is larger than the area of ​​the orthographic projection of the connection structure 1025 on the substrate 1024, and the orthographic projection of the first pin 1031 on the substrate 1024 covers the orthographic projection of the connection structure 1025 on the substrate 1024. This design, where the orthographic projection of the first pin 1031 on the substrate 1024 is larger than the orthographic projection of the connection structure 1025 on the substrate 1024 and the former covers the latter, ensures a stable connection between the first pin 1031 and the connection structure 1025. It avoids misalignment of the first pin 1031 relative to the connection structure 1025 due to the first pin being too small or process errors, which could lead to poor connection between the first pin 1031 and the connection structure 1025.

[0062] Optionally, the cross-sectional area of ​​the connection structure 1025 in the thickness direction of the substrate 1024 gradually changes with the increase of the distance from the driving circuit 1023. Optionally, as... Figure 3As shown, the cross-sectional area of ​​the connection structure 1025 in the thickness direction perpendicular to the substrate 1024 gradually increases with the increase of the distance from the driving circuit 1023. That is, the area of ​​the side of the connection structure 1025 near the driving circuit 1023 is smaller than the area of ​​the side of the connection structure 1025 near the first pin 1031, and the projection of the side of the connection structure 1025 near the driving circuit 1023 is located within the projection of the side of the connection structure 1025 near the first pin 1031. Since the wiring space near the driving circuit 1023 is relatively tight, the cross-sectional area of ​​the end of the connection structure 1025 near the driving circuit 1023 can be designed to be smaller; since there is a larger wiring space away from the driving circuit 1023, the cross-sectional area of ​​the end of the connection structure 1025 away from the driving circuit 1023 can be designed to be larger, and the connection area between the first pin 1031 and the connection structure 1025 can be made as large as possible, thereby ensuring the connection reliability between the first pin 1031 and the connection structure 1025.

[0063] Optionally, the connection structure 1025 is made of a metal material, such as copper or aluminum.

[0064] In this embodiment, the first pin 1031 includes a first surface facing the driving circuit 1023 and a second surface facing away from the driving circuit 1023. The projected area of ​​the first surface on the backplate 105 is larger than the projected area of ​​the second surface on the backplate 105. This design, with its larger first surface area, facilitates an increase in the area of ​​the support region 103A, thereby improving the support effect of the support structure 103 on the driving unit 102.

[0065] In one possible implementation, such as Figure 1 As shown, the first pin 1031 is hemispherical in shape. In other possible embodiments, the first pin 1031 may also be shaped like a frustum, a truncated cone, etc.

[0066] Exemplarily, at least one of the plurality of first pins 1031 comprises an alloy containing nickel and gold. Optionally, at least one of the plurality of first pins 1031 comprises a first metal layer and a second metal layer stacked together before soldering. The first metal layer is located between the second metal layer and the driving unit 102, i.e., the first metal layer is closer to the driving unit 102 relative to the second metal layer. The material of the first metal layer includes nickel (Ni), and the material of the second metal layer includes gold (Au). For example, the material of the first metal layer is nickel, and the material of the second metal layer is gold. The first pin formed after soldering comprises an alloy of nickel and gold.

[0067] Through the design of the first pin 1031 in this embodiment, when the driving unit 102 is fixed away from the light-emitting unit 101 and the back plate 105, the first pin 1031 can be fixedly connected to the conductive pad 1051 of the back plate 105 by a soldering process, thereby realizing the connection between the driving unit 102 and the back plate 105.

[0068] Optionally, the substrate 1024 is a flexible substrate. The flexible substrate can be made of organic materials. Because flexible substrates have weaker supporting forces, embodiments of this disclosure are particularly suitable for display substrates having this type of substrate. For example, the material of the substrate 1024 can be one of polyimide, polyamide, acrylic resin, and phenolic resin.

[0069] Optionally, the thickness of the substrate 1024 is 25 μm to 35 μm. Conventional substrates are relatively thin, about 20 μm, and have poor support; while the substrate 1024 of the embodiments of this disclosure is relatively thick, has relatively good support, and has less deformation.

[0070] In this embodiment of the disclosure, such as Figure 1 As shown, the support structure 103 also includes a first auxiliary support structure 1033, which is in contact with the substrate 1024 and the back plate 105 respectively. Since the first auxiliary support structure 1033 is in contact with the substrate 1024 and the back plate 105 respectively, the first auxiliary support structure 1033 can further increase the contact portion between the support structure 103 and the driving unit 102, that is, increase the ratio of the orthographic projection of the support area 103A on the back plate 105 to the orthographic projection of the driving unit 102 on the back plate 105, thus playing an auxiliary support role and preventing the side of the driving unit in the display substrate near the back plate from cracking due to insufficient support.

[0071] Optionally, the first auxiliary support structure 1033 has multiple first auxiliary support holes 1033a, each corresponding to a multiple first pins 1031. The connected first pins 1031 and conductive pads 1051 are located within the first auxiliary support holes 1033a. The design of the first auxiliary support holes 1033a does not affect the electrical connection between the drive unit 102 and the backplate 105 via the multiple first pins 1031 and the multiple conductive pads 1051.

[0072] For example, the material of the first auxiliary support structure 1033 is at least one of inorganic particles and organic matter.

[0073] For example, such as Figure 1As shown, the first auxiliary support structure 1033 is made of silicon nanospheres, which are inorganic particles. Silicon nanospheres easily fill the gaps between the drive unit 102 and the backplate 105 to form the first auxiliary support structure 1033. Furthermore, when the substrate 1024 in the drive unit 102 is formed using organic materials such as PI, the substrate 1024 will be water-absorbent. The first auxiliary support structure 1033 made of silicon nanospheres can also improve the problem of deformation caused by prolonged absorption of water and oxygen by this type of substrate.

[0074] Optionally, such as Figure 1 As shown, the first auxiliary support structure 1033 made of silicon nanospheres includes multiple silicon nanosphere layers, each silicon nanosphere layer including multiple silicon nanospheres.

[0075] Optionally, the first auxiliary support structure 1033 can also be made of resin, an organic material. Resin material facilitates the fabrication of the first auxiliary support hole 1033a through methods such as etching, thereby providing auxiliary support for the substrate 1024 without affecting the electrical connection between the first pin 1031 and the conductive pad 1051. Furthermore, when the substrate 1024 in the drive unit 102 is formed using an organic material such as PI, the substrate 1024 is absorbent. The resin-based first auxiliary support structure 1033 can also mitigate the problem of deformation caused by prolonged absorption of water and oxygen by this type of substrate.

[0076] Optionally, the first auxiliary support structure 1033 can also be made of metal oxide nanospheres (e.g., zirconia nanospheres) or non-metal oxide nanospheres (e.g., silicon oxide nanospheres). Both metal oxide nanospheres and non-metal oxide nanospheres are inorganic particles. The metal oxide nanospheres or non-metal oxide nanospheres can easily fill the gap between the drive unit 102 and the back plate 105 to form the fabricated first auxiliary support structure 1033.

[0077] Optionally, the first auxiliary support structure 1033 can also be made of resin and silicon nanospheres. For example, a portion of the first auxiliary support structure 1033 (e.g., a portion away from the substrate 1024) is made of resin, while another portion of the first auxiliary support structure 1033 (e.g., a portion close to the substrate 1024) is made of silicon nanospheres.

[0078] In this embodiment of the disclosure, the driving circuit 1023 includes a plurality of thin-film transistors and at least one storage capacitor. Each thin-film transistor includes a gate, a source, and a drain.

[0079] Optionally, the driving circuit 1023 may include seven thin-film transistors and one storage capacitor, i.e., the driving circuit 1023 is a 7T1C driving circuit. Alternatively, the driving circuit 1023 may include other numbers of thin-film transistors and other numbers of storage capacitors. This disclosure does not limit the number of thin-film transistors or the number of storage capacitors included in the driving circuit 1023. The multiple thin-film transistors included in the driving circuit 1023 are interconnected to drive the light-emitting unit 101 to emit light.

[0080] For example, one of the plurality of first pins 1031 is connected to the source of one of the plurality of thin film transistors to provide a data drive signal from the backplane 105 to the driving circuit 1023, thereby causing the driving unit 102 to drive the light-emitting unit 101 to emit light.

[0081] Optionally, the plurality of thin-film transistors include at least a data write transistor, the source of which is used to connect to a data line on the backplane 105 of the display substrate. This data line can transmit data drive signals to the drive circuit 1023 via the data write transistor.

[0082] Optionally, combined Figure 1 and Figure 3 The first pin 1031 is connected to the source of the data writing transistor in the driving circuit 1023. The data writing transistor is connected to the third electrode 1021 of the driving unit 102 through other thin film transistors, thereby enabling the data lines included in the back plate 105 in the display substrate to transmit data driving signals to the first electrode 1011 of the light-emitting unit 101 in sequence through the first pin 1031, the driving circuit 1023, and the third electrode 1021.

[0083] For example, such as Figure 3 As shown, the support structure 103 also includes a plurality of third pins 1032, which are located on the side of the substrate 1024 opposite to the driving circuit 1023. In order for the driving unit 102 to drive the light-emitting unit 101 to emit light, in addition to the data driving signal provided to the first electrode 1011 of the light-emitting unit 101, a power signal (e.g., a VSS signal) also needs to be provided to the second electrode 1012 of the light-emitting unit 101. Optionally, the power signals provided to the plurality of driving units 102 and light-emitting units 101 included in the display substrate by the backplate 105 can be the same, so a power signal can be provided to the second electrode 1012 of the plurality of light-emitting units 101 through the third pins 1032. Optionally, combined with... Figure 1 and Figure 3The backplane includes multiple fourth pins 1052, each of which is connected to a corresponding number of third pins 1032. Power signals pass sequentially through the fourth pins 1052, the third pins 1032, the driving circuit 1023, and the fourth electrode 1022 to the second electrode 1012. Optionally, the third pins 1032 are located in the peripheral area of ​​the display substrate. Optionally, the third pins 1032 and the first pins 1031 are made of the same material.

[0084] The following is an exemplary description of the layer structure in the drive circuit 1023.

[0085] For example, such as Figure 3 As shown, the driving circuit 1023 includes a buffer layer m1, an active layer m2, a first gate insulating layer m3, a first gate layer m4, a second gate insulating layer m5, a second gate layer (not shown), an interlayer dielectric layer m6, a source / drain layer m7, and a planarization layer m8, which are stacked sequentially on one side of the substrate 1024. The third electrode 1021 and the fourth electrode 1022 are located on the side of the planarization layer m8 away from the substrate 1024. Optionally, the second gate layer may also be located on the side of the active layer m2 away from the first gate layer m4.

[0086] The active layer m2 includes multiple active patterns corresponding to multiple thin-film transistors (TFTs). Each active pattern includes a source region m21, a drain region m22, and a channel region m23. The source and drain of the TFTs are located in the source-drain layer, and the source and source region m21 of the TFTs are connected, and the drain and drain region m22 are connected. The first gate layer m4 includes multiple gate patterns corresponding to multiple TFTs. The orthographic projection of the channel region m23 onto the substrate 1024 is the overlapping region of the orthographic projections of the gate patterns onto the substrate 1024 and the orthographic projections of the active patterns onto the substrate 1024.

[0087] For example, the materials used to fabricate the buffer layer m1, the first gate insulating layer m3, the second gate insulating layer m5, and the interlayer dielectric layer m6 can be silicon oxide or silicon nitride, silicon nitride, etc.

[0088] For example, the active layer m2 is made of low-temperature polycrystalline silicon, and the driving unit 102 can also be called an LTPS (Low Temperature Poly-Silicon) driving unit. Alternatively, the active layer m2 can be made of low-temperature polycrystalline silicon and metal oxide semiconductor materials such as IGZO (Indium Gallium Zinc Oxide), and the driving unit 102 can also be called an LTPO (Low Temperature Polycrystalline Oxide) driving unit.

[0089] In some examples, the first gate layer m4 and the second gate layer can be fabricated as a single metal layer, such as molybdenum, copper, or aluminum. In other examples, the first gate layer m4 and the second gate layer may also comprise multiple layers of metal layers stacked sequentially, such as titanium, aluminum, and titanium stacked sequentially.

[0090] For example, the planarization layer m8 is made of an organic insulating material, such as resin.

[0091] For example, such as Figure 3 As shown, the first gate layer m4 also includes a gate connection portion m41 connected to the connection structure 1025. This gate connection portion m41 is used to connect to the connection structure 1025 and the source of the data writing transistor. To enable the connection structure 1025 and the gate connection portion m41 to connect, the buffer layer m1 and the first gate insulating layer m3 can also have connection vias. Furthermore, the connection structure 1025 is located not only within the connection vias of the substrate 1024, but also within the connection vias of the buffer layer m1 and the first gate insulating layer m3.

[0092] The following provides an exemplary description of each structure in the light-emitting unit.

[0093] See you again Figure 2 The plurality of light-emitting units 101 include a first color light-emitting unit 101a, a second color light-emitting unit 101b, and a third color light-emitting unit 101c. The colors of the light emitted by the first color light-emitting unit 101a, the second color light-emitting unit 101b, and the third color light-emitting unit 101c are all different. For example, the colors of the light emitted by the first color light-emitting unit 101a, the second color light-emitting unit 101b, and the third color light-emitting unit 101c are red, green, and blue, respectively. The display function is achieved by setting different colored light-emitting units.

[0094] Figure 4 This is a schematic cross-sectional view of a light-emitting unit provided in an embodiment of this disclosure. For example... Figure 4 As shown, the light-emitting part 1013 includes a color filter layer 1014, a color conversion layer 1015 and a light-emitting layer 1016 stacked sequentially along the direction close to the driving unit 102, and the light-emitting color of the light-emitting layer 1016 is blue.

[0095] Optionally, the light-emitting layer 1016 includes a first light-emitting part, a second light-emitting part, and a third light-emitting part. The first light-emitting part, the second light-emitting part, and the third light-emitting part are respectively located in the first color light-emitting unit 101a, the second color light-emitting unit 101b, and the third color light-emitting unit 101c. That is, the light-emitting color of the first light-emitting part, the second light-emitting part, and the third light-emitting part is blue. Figure 4Only one light-emitting part is shown in the diagram. By providing a first light-emitting part, a second light-emitting part, and a third light-emitting part in the light-emitting layer 1016, light sources are provided for the first color light-emitting unit 101a, the second color light-emitting unit 101b, and the third color light-emitting unit 101c, respectively.

[0096] Optionally, the color transfer layer 1015 includes a first color transfer portion, a second color transfer portion, and a transparent portion. Figure 4 Only one color conversion unit or one transparent unit 10151 is shown. The orthographic projection of the first color conversion unit on the back plate 105 overlaps with the orthographic projection of the first light-emitting unit on the back plate 105, that is, the first color conversion unit and the first light-emitting unit are located in the same light-emitting unit, for example, both are located in the first color light-emitting unit 101a. The first color conversion unit is used to convert the light emitted by the first light-emitting unit into the color corresponding to the first color conversion unit (for example, converting it into red). The orthographic projection of the second color conversion unit on the back plate 105 overlaps with the orthographic projection of the second light-emitting unit on the back plate 105, that is, the second color conversion unit and the second light-emitting unit are located in the same light-emitting unit, for example, both are located in the second color light-emitting unit 101b. The second color conversion unit is used to convert the light emitted by the second light-emitting unit into the color corresponding to the second color conversion unit (for example, converting it into green). The orthographic projection of the transparent unit on the back plate 105 overlaps with the orthographic projection of the third light-emitting unit on the back plate 105, that is, the transparent unit and the third light-emitting unit are located in the same light-emitting unit, for example, both are located in the third color light-emitting unit 101a. The transparent unit is used to transmit the light emitted by the third light-emitting unit.

[0097] Optionally, the first color transfer section and the second color transfer section are made of red quantum dot luminescent particles and green quantum dot luminescent particles, respectively, for example, at least one compound selected from CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgTe, GaN, GaAs, InP, and InAS. The transparent section is made of a material with high transmittance, such as a transparent resin material like polyimide or polyacrylic acid.

[0098] Optionally, such as Figure 4 As shown, the color transfer layer 1015 also includes a spacer 10152 located between any two adjacent structures in the first color transfer section, the second color transfer section and the transparent section. The spacer 10152 is used to distinguish and separate different color transfer sections and transparent sections.

[0099] Optionally, the color filter layer 1014 includes a first color block, a second color block, a third color block, and a black matrix 10142. Figure 5Only one color resist block 10141 is shown. A black matrix 10142 is located between adjacent color resist blocks. The orthographic projection of the first color resist block on the back plate 105 at least partially overlaps with the orthographic projection of the first color converter on the back plate 105. The first color resist block transmits light of the corresponding color after conversion by the first color converter and blocks light of other colors. The orthographic projection of the second color resist block on the back plate 105 at least partially overlaps with the orthographic projection of the second color converter on the back plate 105. The second color resist block transmits light of the corresponding color after conversion by the second color converter and blocks light of other colors. The orthographic projection of the third color resist block on the back plate 105 at least partially overlaps with the orthographic projection of the transparent portion on the back plate 105. The third color resist block transmits light of the corresponding color transmitted through the transparent portion and blocks light of other colors. Optionally, the first color resist block is a red color resist block, the second color resist block is a green color resist block, and the third color resist block is a blue color resist block.

[0100] Optionally, such as Figure 4 As shown, the light-emitting unit 101 further includes an adhesive layer 1017 and a buffer layer 1018. Both the adhesive layer 1017 and the buffer layer 1018 are located between the color transfer layer 1015 and the light-emitting layer 1016. The adhesive layer 1017 is used to bond the color transfer layer 1015 and the buffer layer 1018. The material of the buffer layer 1018 can be GaN.

[0101] In one possible implementation, Figure 4 The light-emitting layer 1016 in the illustrated embodiment includes a first electrode layer, a light-emitting material layer, and a second electrode layer sequentially stacked in a direction from near to far from the driving unit 102. Different electrical signals can be applied to the first electrode layer and the second electrode layer, which can drive the light-emitting material layer to emit light. Optionally, the first electrode layer and the second electrode layer are an anode layer and a cathode layer, respectively.

[0102] In another possible implementation, Figure 4 The light-emitting layer 1016 in the embodiment shown is formed of inorganic material. Figure 5 This is a schematic cross-sectional view of another light-emitting unit provided in an embodiment of this disclosure. For example... Figure 5 As shown, the light-emitting layer 1016 includes a first doped layer 10161, a multiple quantum well layer 10162, and a second doped layer 10163 stacked together. The first doped layer 10161 is electrically connected to the first electrode 1011, and the second doped layer 10163 is electrically connected to the second electrode 1012.

[0103] Optionally, the first doped layer 10161 can be an N-type doped layer, and the second doped layer 10163 can be a P-type doped layer. Correspondingly, the first electrode 1011 can be called an N-type electrode, and the second electrode 1012 can be called a P-type electrode. Optionally, the material of the first doped layer 10161 can be N-type gallium nitride (GaN), and the first doped layer 10161 is denoted as N-GaN. The material of the second doped layer 10163 can be P-type gallium nitride (GaN), and the second doped layer 10163 is denoted as P-GaN.

[0104] For example, such as Figure 5 As shown, the light-emitting unit 101 further includes a diffusion layer 1019, which is located between the adhesive layer 1017 and the color conversion layer 1015. The diffusion layer 1019 includes multiple diffusion portions 10191 and a barrier 10192 located between two adjacent diffusion portions 10191. The multiple diffusion portions 10191 correspond one-to-one with the multiple light-emitting units 101, and the diffusion portions 10191 have multiple uneven structures 10191a. The arrangement of the multiple uneven structures 10191a can homogenize the light emitted from the light-emitting layer 1016 to the diffusion layer 1019, and then emit it to the color conversion layer 1015. The barrier 10192 has the function of reflecting light, which can prevent light from leaking out after being emitted from the multi-quantum well layer 10162 in the light-emitting layer 1016 to the sidewall of the light-emitting unit 101. The barrier 10192 can reflect this part of the light back into the light-emitting unit 101, thereby improving the light extraction efficiency.

[0105] Optionally, the retaining wall 10192 is a Bragg reflector (DBR, Distributed Bragg Reflection). For example... Figure 5 As shown, the DBR10192 includes multiple film layer structures sequentially stacked in a direction away from the backplate 105. The multiple film layer structures include multiple high-refractive-index film layer structures and multiple low-refractive-index film layer structures, with the multiple high-refractive-index film layer structures and multiple low-refractive-index film layer structures alternately stacked. This disclosure does not limit the materials of the high-refractive-index film layer structures and the low-refractive-index film layer structures; for example, the material of the high-refractive-index film layer structures can be titanium oxide or niobium oxide, and the material of the low-refractive-index film layer structures can be silicon nitride or silicon oxide.

[0106] Alternatively, the retaining wall 10192 can also be made of metal materials such as copper and has a reflective function.

[0107] For example, such as Figure 5 As shown, the light-emitting layer 1016 also includes a raised electrode 10164, a conductive layer 10165, and an insulating layer 10166.

[0108] The raised electrode 10164 is connected to the first doped layer 10161. The conductive layer 10165 is located on the side of the second doped layer 10163 away from the backplate 105. The insulating layer 10166 is located on the side of the raised electrode 10164 and the conductive layer 10165 away from the backplate 105. The insulating layer 10166 has a first via 10166a and a second via 10166b. The first via 10166a exposes the raised electrode 10164, and the raised electrode 10164 and the first electrode 1011 are connected through the first via 10166a. The second via 10166b exposes the conductive layer 10165, and the conductive layer 10165 and the second electrode 1012 are connected through the second via 10166b. Optionally, the conductive layer 10165 can be made of indium tin oxide (ITO); the insulating layer 10166 can be a passivation layer (PVX), and the insulating layer 10166 can be made of silicon oxide or silicon nitride.

[0109] In this disclosure embodiment, see again Figure 2 The display substrate includes multiple light-emitting units 101 and multiple driving units 102, and the multiple light-emitting units 101 and multiple driving units 102 are connected in a one-to-one correspondence and distributed in an array. The orthographic projection of each light-emitting unit 101 on the bearing surface of the back plate 105 is located inside the orthographic projection of the corresponding driving unit 102 on the bearing surface.

[0110] Optionally, since some of the film layers in the multiple driving circuits 1023 can be shared film layers, a driving unit 102 can include multiple driving circuits 1023. That is, multiple light-emitting units 101 can be connected to a driving unit 102 respectively. Each driving circuit 1023 in the driving unit 102 can be used to drive a corresponding light-emitting unit 101 to emit light.

[0111] In this disclosure embodiment, see again Figure 1 The display substrate also includes an isolation structure 107, which is located between the light-emitting part 1013 and the driving circuit 1023, and is in contact with both the light-emitting part 1013 and the driving circuit 1023. The isolation structure 107 surrounds the entire first electrode 1011 and the second electrode 1012 to isolate them from the outside environment. The isolation structure 107 also surrounds the entire second electrode 1012 and the fourth electrode 1022 to isolate them from the outside environment. The isolation structure 107 prevents damage to the connection between the first electrode 1011 and the second electrode 1012, and also prevents damage to the connection between the third electrode 1021 and the fourth electrode 1022.

[0112] Optionally, since the isolation structure 107 covers at least a portion of the light-emitting unit 101, the isolation structure 107 also serves to prevent conductive material from penetrating into the interior of the light-emitting unit 101. It should be noted that, in order to illustrate more planar relationships between structures, Figure 2 The isolation structure 107 is not shown in the diagram. Figure 2 Based on this, the isolation structure 107, the first electrode 1011, and the second electrode 1012 cover the light-emitting unit 101. That is, the sum of the orthographic projection of the isolation structure 107 on the supporting surface of the display back panel 105 and the orthographic projection of the first electrode 1011 and the second electrode 1012 on the supporting surface of the display back panel 105 covers the orthographic projection of the light-emitting unit 101 on the supporting surface of the display back panel 105.

[0113] Since the display substrate manufacturing process involves drilling holes and injecting conductive material (e.g., metal material) from the side of the driving unit 102 near the back plate 105 to the side away from the back plate 105 to prepare the aforementioned connection structure 1025 or fourth electrode 1022, if there is no isolation structure 107, there may be a risk that the injected conductive material will leak to the light-emitting unit 101 side in this step. Since the light-emitting unit 101 has multiple structural layers, the injected conductive material may seep into the light-emitting unit 101 along the gaps between these structural layers, causing a short circuit.

[0114] For example, such as Figure 1 As shown, the display substrate also includes a first substrate 104, which is located on the side of the light-emitting unit 101 away from the driving unit 102. The first substrate 104 is used to protect the plurality of light-emitting units 101. An isolation structure 107 surrounds the light-emitting unit 101 and fills the space between the driving unit 102 connected to the light-emitting unit 101 and the first substrate 104. The isolation structure 107 is in contact with both the driving unit 102 and the first substrate 104. In this embodiment, since the isolation structure 107 fills the space between the driving unit 102 connected to the light-emitting unit 101 and the first substrate 104, the short circuit caused by the conductive material injected during the manufacturing process penetrating into the light-emitting unit 101 can be improved.

[0115] It should be noted that, in order to demonstrate more planar relationships between structures, Figure 2 The isolation structure 107 is not shown in the diagram. Figure 2 Based on this, the isolation structure 107, the first electrode 1011, and the second electrode 1012 cover the back plate 105. That is, the sum of the orthographic projection of the isolation structure 107 on the bearing surface of the back plate 105 and the orthographic projection of the first electrode 1011 and the second electrode 1012 on the bearing surface of the back plate 105 covers the bearing surface of the back plate 105.

[0116] For example, the material of the isolation structure 107 includes at least one of inorganic particles and organic matter.

[0117] For example, such as Figure 1 As shown, the isolation structure 107 is made of silicon nanospheres, which are inorganic particles. The isolation structure 107 made of silicon nanospheres can fully fill the space between the driving unit 102 connected to the light-emitting unit 101 and the bearing surface of the first substrate 104. The isolation structure 107 made of silicon nanospheres also has the function of reflecting light leaking from the edge of the light-emitting unit 101 back to the light-emitting unit 101. Optionally, as... Figure 1 As shown, the isolation structure 107 made of silicon nanospheres includes multiple silicon nanosphere layers, each silicon nanosphere layer including multiple silicon nanospheres.

[0118] Figure 6 This is an optical simulation diagram of an isolation structure made of silicon nanospheres provided in an embodiment of this disclosure. The optical simulation of the silicon nanosphere isolation structure is performed using electromagnetic simulation software, such as... Figure 6 As shown, the isolation structure 107 has the characteristic of high reflectivity in the wavelength range of 400nm to 465nm. The wavelength range of 400nm to 465nm includes the blue light band, so it can reflect the blue light leaking out from the edge of the light-emitting layer 1016 in the light-emitting unit 101 back to the light-emitting unit 101.

[0119] Optionally, the radius of the silicon nanospheres is 45 nm to 55 nm, for example, the radius of the silicon nanospheres is 50 nm.

[0120] Optionally, the dielectric constant of the silicon nanospheres is 11.5.

[0121] Alternatively, in other possible embodiments, the material of the isolation structure 107 can also be UV-curing adhesive, which is an organic material. UV-curing adhesive is easy to form into different shapes, and the isolation structure 107 made of UV-curing adhesive can fully fill the space between the driving unit 102 connected to the light-emitting unit 101 and the bearing surface of the first substrate 104. Furthermore, the isolation structure 107 made of UV-curing adhesive is easy to remove after curing.

[0122] Optionally, the material of the isolation structure 107 can also be metal oxide nanospheres (e.g., zirconia nanospheres) or non-metal oxide nanospheres (e.g., silicon oxide nanospheres). Metal oxide nanospheres and non-metal oxide nanospheres are inorganic particles. The isolation structure 107 made of metal oxide nanospheres or non-metal oxide nanospheres can fully fill the space between the driving unit 102 connected to the light-emitting unit 101 and the bearing surface of the first substrate 104.

[0123] Alternatively, the isolation structure 107 can also be made of UV-curing adhesive and silicon nanospheres. The isolation structure 107 made of UV-curing adhesive and silicon nanospheres can fully fill the space between the driving unit 102 connected to the light-emitting unit 101 and the bearing surface of the first substrate 104. For example, a portion of the isolation structure 107 near the surface of the light-emitting unit 101 is made of silicon nanospheres, and the remaining portion is made of UV-curing adhesive.

[0124] Figure 7 This is a schematic cross-sectional view of another display substrate provided in an embodiment of this disclosure. For example... Figure 7 As shown, the support structure 103 also includes a second auxiliary support structure 1034, which is connected to the side of the substrate 1024 away from the driving circuit 1023. The first pin 1031 is located on the side of the second auxiliary support structure 1034 away from the substrate 1024.

[0125] and Figure 1 Compared to the embodiments shown, Figure 7 In the illustrated embodiment, the support structure includes a second auxiliary support structure 1034, but does not include the first auxiliary support structure 1033. Since the second auxiliary support structure 1034 is connected to the side of the substrate 1024 furthest from the driving circuit 1023, it can further increase the contact portion between the support structure 103 and the driving unit 102. This increases the ratio of the orthographic projection of the support area 103A on the back plate 105 to the orthographic projection of the driving unit 102 on the back plate 105, thus providing auxiliary support and preventing cracking or defects in the display substrate due to insufficient support. Furthermore, Figure 7 The illustrated embodiment does not have an isolation structure 107, or, Figure 7 In the embodiment shown, the isolation structure 107 of the cured shadowless adhesive material is removed.

[0126] For example, the material of the second auxiliary support structure 1034 is glass. The glass can be made into a planar second auxiliary support structure 1034, with a large contact area with the driving unit 102. In addition, the strength of the glass is relatively greater than that of the substrate 1024, providing better support.

[0127] Optionally, the thickness of the second auxiliary support structure 1034 is 0.1 μm to 100 μm. Optionally, the thickness of the second auxiliary support structure 1034 is 0.1 μm to 50 μm. Optionally, the thickness of the second auxiliary support structure 1034 is 0.1 μm to 0.15 μm, which facilitates the thinning of the display substrate. Specifically, the thickness of the second auxiliary support structure 1034 can be 0.1 μm, 0.12 μm, 0.13 μm, 0.14 μm, 0.15 μm, 20 μm, 40 μm, 60 μm, 80 μm, and 100 μm.

[0128] Figure 8 This is provided by the embodiments of this disclosure. Figure 7 A magnified view of a portion of the image. (Compared to...) Figure 1 Compared to the embodiments shown, Figure 8 In the illustrated embodiment, the first pin 1031 includes a first connection structure 1031b, which is located on the side of the first pin 1031 away from the substrate 1024 and includes multiple protrusions. The conductive pad 1051 includes a second connection structure 1051b, which is located on the side of the first pin 1031 away from the substrate 1024 and includes multiple protrusions. The protrusions 1031b' of the first connection structure and the protrusions 1051b' of the second connection structure are connected in a staggered manner. This staggered connection between the first pin 1031 and the conductive pad 1051 allows for a tighter and more reliable connection between the drive unit 102 and the backplate 105. Furthermore, with... Figure 1 Compared to the embodiments shown: Figure 8 In the embodiment shown, the isolation structure 107 of the cured shadowless adhesive material is removed; Figure 8 In the embodiment shown, the first pin 1031 is shaped like a frustum with an uneven surface.

[0129] Here, misaligned connection means that a recessed region 1031b” is formed between two adjacent protruding structures 1031b' in the first connecting structure 1031b, and a recessed region 1051b” is formed between two adjacent protruding structures 1051b' in the second connecting structure 1051b. The protruding structures 1031b' in the first connecting structure 1031b and the recessed regions 1051b” in the second connecting structure 1051b have matching shapes and are side-fitted, and the recessed regions 1031b” in the first connecting structure 1031b and the protruding structures 1051b' in the second connecting structure 1051b have matching shapes and are side-fitted.

[0130] Optionally, such as Figure 8 As shown, the first pin 1031 includes a first body 1031a and a first connection structure 1031b connected together. The first connection structure 1031b includes a plurality of protrusions 1031b' located on the surface of the first body 1031a away from the substrate 1024. The conductive pad 1051 includes a second body 1051a and a second connection structure 1051b connected together. The second connection structure 1051b includes a plurality of protrusions 1051b' located on the surface of the second body 1051a away from the substrate 1024.

[0131] Optionally, such as Figure 8As shown, the plurality of protrusions 1031b' of the first connecting structure 1031b and the plurality of protrusions 1051b' of the second connecting structure 1051b are both strip-shaped and arranged in the same direction. Optionally, the arrangement direction of the plurality of protrusions 1031b' intersects with, for example, the length direction of the plurality of protrusions 1031b', or is perpendicular to it.

[0132] Figure 9 This is a cross-sectional structural schematic diagram of another driving unit provided in this embodiment of the present disclosure, and Figure 9 The driving unit shown is Figure 7 The driving unit in the illustrated embodiment. (And...) Figure 1 and Figure 3 Compared to the embodiments shown, Figure 7 and Figure 9 In the illustrated embodiment, the second auxiliary support structure 1034 has a second connecting via 1034a, and the connecting structure 1025 is also located in the second connecting via 1034a. Since the second auxiliary support structure 1034 is located within the aforementioned thickness range of 0.1μm to 100μm, it is convenient to drill a hole in the second auxiliary support structure 1034 to form the second connecting via 1034a.

[0133] Figure 10 This is a schematic cross-sectional view of another display substrate provided in an embodiment of this disclosure. Figure 11 This is provided by the embodiments of this disclosure. Figure 10 A magnified view of a portion of the image. (Compared to...) Figure 7 Compared to the embodiments shown, Figure 10 and Figure 11 In the illustrated embodiment, the protrusion 1031a of the first connecting structure is connected to the protrusion 1051a of the second connecting structure. This connection method can increase the heat dissipation area. Furthermore, Figure 10 In the embodiment shown, the isolation structure 107 of the cured shadowless adhesive material is removed.

[0134] Figure 12 This is a schematic cross-sectional view of another display substrate provided in this embodiment, and a bottom view of the first pin. Figure 1 Compared to the embodiments shown, Figure 12 In the illustrated embodiment, the insulating structure 107 made of shadowless adhesive is removed after curing. Furthermore, Figure 12 The first pin 1031 in the middle is shaped like a frustum.

[0135] Figure 13 This is a schematic cross-sectional view of another display substrate provided in an embodiment of this disclosure. Figure 1 Compared to the embodiments shown, Figure 13 In the illustrated embodiment, the isolation structure 107 made of shadowless adhesive is removed after curing. And... Figure 13In the illustrated embodiment, the first auxiliary support structure 1033 is made of resin, and the resin material first auxiliary support structure 1033 has a plurality of first auxiliary support holes 1033a. The first pin 1031 and the conductive pad 1051 are located in the first auxiliary support holes 1033a.

[0136] Figure 14 This is a schematic flowchart illustrating a method for manufacturing a display substrate according to an embodiment of this disclosure. Figure 14 As shown, the method includes:

[0137] In step S1, a light-emitting unit is obtained, which includes a first electrode, a second electrode, and a light-emitting part that is electrically connected to the first electrode and the second electrode respectively.

[0138] In step S2, a driving unit is obtained. The driving unit includes a third electrode, a fourth electrode, a driving circuit, and a substrate. The third electrode and the fourth electrode are electrically connected to the driving circuit, respectively.

[0139] In step S3, the light-emitting unit and the driving unit are bonded together by a bonding process, such that the third electrode and the fourth electrode are both located on the side of the driving unit facing the light-emitting unit, the substrate is located on the side of the driving circuit away from the light-emitting unit, the third electrode and the first electrode are electrically connected, the fourth electrode and the second electrode are electrically connected, and the substrate is located on the side of the driving circuit away from the light-emitting unit.

[0140] In step S4, a support structure is fabricated on the side of the substrate away from the driving circuit. The support structure includes a support area that contacts the driving unit and a plurality of first pins that are electrically connected to the driving circuit.

[0141] In step S5, a backplane is obtained. The backplane includes multiple conductive pads.

[0142] In step S6, the first pins and the backplane are bonded together using a bonding process. Multiple conductive pads are connected one-to-one with multiple first pins.

[0143] The support structure includes a support area that contacts the drive unit, and the ratio of the orthographic projection of the support area on the back plate to the orthographic projection of the drive unit on the back plate is greater than or equal to 50%.

[0144] For example, the support structure further includes a first auxiliary support structure, which contacts the substrate and the backplate respectively. The fabrication method further includes: before connecting the first pins and the backplate, coating an initial auxiliary support layer on the side of the backplate near the driving unit, and forming multiple grooves in the initial auxiliary support layer to obtain the first auxiliary support structure. The multiple grooves correspond to multiple first pins, and the first pins are located in the grooves. This fabrication method can be used to fabricate the first auxiliary support structure made of resin. Correspondingly, the material of the initial auxiliary support layer is resin. Since resin is easily etchable, multiple grooves can be formed in the initial auxiliary support layer by etching.

[0145] For example, the support structure further includes a first auxiliary support structure, which contacts the substrate and the backplate respectively. The manufacturing method further includes: after connecting the first pins and the backplate, immersing the driving unit and the backplate, which are fixedly connected by multiple first pins, into a first auxiliary support material liquid to solidify and form the first auxiliary support structure. Connecting the first pins and the backplate first and then forming the first auxiliary support structure by immersion in the first auxiliary support material liquid prevents the first auxiliary support material liquid from forming part of the first auxiliary support structure between the first pins and the backplate, which would affect the electrical connection between the first pins and the backplate.

[0146] For example, the support structure plate further includes a second auxiliary support structure, which is connected to the side of the substrate away from the driving circuit. The fabrication method further includes: after bonding the light-emitting unit and the driving unit together by a bonding process, thinning and drilling holes in the initial substrate connected to the side of the driving unit away from the light-emitting unit to form multiple openings, with each opening corresponding to a multiple first pin, thus obtaining the second auxiliary support structure. Since the initial substrate, the thinned initial substrate, and the second auxiliary support structure formed by drilling holes in the initial substrate have never left the substrate, these three components can provide good support for the substrate during the fabrication process, preventing insufficient substrate support during fabrication.

[0147] Figure 15 This is a schematic flowchart of another method for manufacturing a display substrate according to an embodiment of this disclosure. It can be used to manufacture... Figure 1 The display substrate shown is manufactured using the following steps:

[0148] First step, such as Figure 15 As shown in part (a), a first substrate 104 and a light-emitting unit 101, and a driving unit 102 with an initial support substrate 1030 attached are obtained.

[0149] The first substrate 104 is located on one side of the light-emitting unit 101. The light-emitting unit 101 includes a first electrode 1011, a second electrode 1012, and a light-emitting part 1013 that is electrically connected to the first electrode 1011 and the second electrode 1012 respectively. The first electrode 1011 and the second electrode 1022 are located on the side of the light-emitting part 1013 away from the first substrate 104.

[0150] The driving unit 102 includes a third electrode 1021, a fourth electrode 1022, a driving circuit 1023, and a substrate 1024. The third electrode 1021 and the fourth electrode 1022 are electrically connected to the driving circuit, respectively. The initial support substrate 1030 is located on the side of the substrate 1024 away from 1022.

[0151] Optionally, the initial support substrate 1030 is made of glass.

[0152] The second step, as Figure 15 As shown in part (b), the light-emitting unit 101 and the driving unit 102 are bonded together by a bonding process. The third electrode 1021 and the fourth electrode 1022 are both located on the side of the driving unit 102 facing the light-emitting unit 101, and the substrate 1024 is located on the side of the driving circuit 1023 away from the light-emitting unit 101. The third electrode 1021 is electrically connected to the first electrode 1011, and the fourth electrode 1012 is electrically connected to the second electrode 1012.

[0153] Then, a protective film 108 is attached to the side of the first substrate 104 away from the light-emitting unit 101. The protective film 108 is used to prevent silicon nanospheres in the subsequent auxiliary support material liquid from adhering to the side of the first substrate 104 away from the light-emitting unit 101 and located in the light-emitting area of ​​the display substrate, thereby reducing the impact on light emission.

[0154] The third step, as Figure 15 As shown in part (c), the isolation structure 107 is formed by, for example, a lifting method.

[0155] The protective film 108, the first substrate 104, the light-emitting unit 101, the driving unit 102 and the initial support substrate 1030 formed in the second step and fixedly connected in sequence are repeatedly immersed in an auxiliary support material liquid. The auxiliary support material liquid is a solution containing silicon nanospheres to form an isolation structure 107 made of silicon nanosphere material.

[0156] Step four, as Figure 15 As shown in section (d), the initial support substrate 1030 is removed. At this time, the substrate 1024 needs to play a supporting role. Since the substrate 1024 in this embodiment is relatively thick, the supporting role is better and the deformation is smaller.

[0157] Step 5, as Figure 15As shown in section (e), a plurality of first pins 1031 are formed on the side of the substrate 1024 opposite to the driving circuit 1023, and the plurality of first pins 1031 are electrically connected to the driving circuit 1023. The first pins 1031 are then bonded to the backplate 105 by a bonding process.

[0158] Optionally, a hole is drilled on the side of the substrate 1024 away from the driving circuit 1023 using laser drilling, and metal material is filled in to form a connection structure. Then, multiple first pins 1031 are formed on the side of the connection structure away from the driving circuit 1023.

[0159] The backplate 105 includes multiple conductive pads 1051. The multiple conductive pads 1051 are connected to multiple first pins 1031 in a one-to-one correspondence.

[0160] Step 6, as follows Figure 15 As shown in part (f), a first auxiliary support structure 1033 is fabricated between the substrate 1024 and the backplate 105, and then the protective film 108 is removed to form a structure as shown in part (f). Figure 1 The display substrate shown.

[0161] Optionally, the fixedly connected drive unit 102 and back plate 105 are immersed in an auxiliary support material liquid, which is a solution containing silicon nanospheres, and solidified to form a first auxiliary support structure 1033 made of silicon nanospheres.

[0162] Optionally, the first substrate 104 can be thinned by means of etching to obtain a thinner first substrate 104, so that the total thickness of the final display substrate is thinner, which makes it easier to achieve a thinner and lighter display substrate.

[0163] Figure 16 This is a schematic flowchart of another method for manufacturing a display substrate according to an embodiment of this disclosure. It can be used to manufacture... Figure 7 The display substrate shown. In this manufacturing process:

[0164] First step, such as Figure 16 As shown in part (a), a first substrate 104, a light-emitting unit 101, and a driving unit 102 with an initial support substrate 1030 attached are obtained. This step is similar to... Figure 15 The first step is the same as the first step in the previous steps.

[0165] The second step, as Figure 16 As shown in part (b), the light-emitting unit 101 and the driving unit 102 are bonded together by a bonding process, but a protective film 108 is not attached to the side of the first substrate 104 away from the light-emitting unit 101.

[0166] The third step, as Figure 16As shown in section (c), liquid UV adhesive is filled between the driving unit 102 connected to the light-emitting unit 101 and the bearing surface of the first substrate 104, and cured by UV irradiation to form an isolation structure 107 of UV adhesive material. Optionally, the UV irradiation time is about 10 seconds.

[0167] Step four, as Figure 16 As shown in part (d), the initial support substrate 1030 is thinned by, for example, etching, to obtain a thinned initial support substrate 1030'.

[0168] Step 5, as Figure 16 As shown in section (e), a plurality of openings are formed in the thinned initial support substrate 1030' by means of, for example, laser drilling, to form a second auxiliary support structure 1034. A plurality of first pins 1031 are formed on the side of the second auxiliary support structure 1034 opposite to the drive circuit 1023. The plurality of first pins 1031 are electrically connected to the drive circuit 1023, and each of the plurality of first pins 1031 corresponds one-to-one with a plurality of openings in the second auxiliary support structure 1034. Optionally, the material of the second auxiliary support structure 1034 is glass, and correspondingly, the material of the initial substrate 1030 is glass.

[0169] Then, the first pin 1031 and the backplane 105 are bonded together using a bonding process. The backplane 105 includes a plurality of conductive pads 1051, and the plurality of conductive pads 1051 are connected one-to-one with the plurality of first pins 1031.

[0170] and Figure 15 Compared to the embodiments shown, Figure 16 In the embodiment shown, the surface of the first pin away from the substrate 1024 has a first connection structure, and the surface of the conductive pad 1051 facing the substrate 1024 has a second connection structure. Both the first connection structure and the second connection structure include a plurality of alternating recesses and a plurality of protrusions. The protrusions of the first connection structure are connected to the recesses of the second connection structure, and the recesses of the first connection structure are connected to the protrusions of the second connection structure.

[0171] Step 6, as follows Figure 16 As shown in section (f), the insulating structure 107 of the UV-cured adhesive material is removed by, for example, heating to approximately 80 degrees Celsius. This forms a structure as shown in section (f). Figure 7 The display substrate shown.

[0172] It should be noted that, in Figure 16 In the fifth step of the manufacturing process shown, if the first pin 1031 and the conductive pad 1051 are frustum-shaped, that is, the first pin 1031 does not have a first connection structure and the conductive pad 1051 does not have a second connection structure, then the following can be obtained: Figure 12The display substrate shown.

[0173] In addition, Figure 16 In the fifth step of the manufacturing process shown, if the first pin 1031 and the conductive pad 1051 are frustum-shaped, that is, the first pin 1031 does not have a first connection structure and the conductive pad 1051 does not have a second connection structure, then the following can be obtained: Figure 12 The display substrate shown.

[0174] Figure 17 This is a schematic flowchart of another method for manufacturing a display substrate according to an embodiment of this disclosure. It can be used to manufacture... Figure 13 The display substrate shown. (Compared to...) Figure 15 Compared to the individual steps in the shown production process, this production process:

[0175] First step, such as Figure 17 As shown in part (a), a first substrate 104, a light-emitting unit 101, and a driving unit 102 with an initial support substrate 1030 attached are obtained. This step is similar to... Figure 15 The first step is the same as the first step in the previous steps.

[0176] The second step, as Figure 17 As shown in part (b), the light-emitting unit 101 and the driving unit 102 are bonded together by a bonding process, but a protective film 108 is not attached to the side of the first substrate 104 away from the light-emitting unit 101.

[0177] The third step, as Figure 17 As shown in section (c), liquid UV adhesive is filled between the driving unit 102 connected to the light-emitting unit 101 and the bearing surface of the first substrate 104, and cured by UV irradiation to form an isolation structure 107 of UV adhesive material. Optionally, the UV irradiation time is about 10 seconds.

[0178] Step four, as Figure 17 As shown in section (d), the initial support substrate 1030 is removed. This step is related to... Figure 15 The fourth step is the same as in the previous one.

[0179] Step 5, as Figure 17 As shown in section (e), a plurality of first pins 1031 are formed on the side of the substrate 1024 opposite to the driving circuit 1023, and the plurality of first pins 1031 are electrically connected to the driving circuit 1023. A backplate 105 is obtained, and the first pins 1031 and the backplate 105 are bonded together by a bonding process.

[0180] The backplate 105 includes multiple conductive pads 1051. An initial auxiliary support layer is coated on the side of the backplate 105 closest to the drive unit 101, and multiple grooves, i.e., first auxiliary support holes 1033a, are formed in the initial auxiliary support layer by means of etching, for example, to obtain a first auxiliary support structure 1033. The multiple grooves correspond to multiple first pins 1031, and the first pins 1031 are located in the grooves. The grooves expose the surface of the conductive pads 1051 to facilitate subsequent connection between the first pins 1031 and the conductive pads 1051. This manufacturing method can be used to fabricate the first auxiliary support structure made of resin, and correspondingly, the material of the initial auxiliary support layer is resin.

[0181] In this configuration, multiple conductive pads 1051 are connected one-to-one with multiple first pins 1031.

[0182] Step 6, as follows Figure 17 As shown in section (f), the insulating structure 107 of the UV-cured adhesive material is removed by, for example, heating to approximately 80 degrees Celsius. This forms a structure as shown in section (f). Figure 13 The display substrate shown.

[0183] This disclosure also provides a display panel comprising any of the aforementioned display substrates, a touch layer, and an encapsulation layer, wherein the touch layer and the encapsulation layer are sequentially stacked on the side of the light-emitting unit away from the driving unit. This display panel has the same effects as the aforementioned display substrates, and will not be described further here.

[0184] This disclosure also provides a display device, which includes any of the aforementioned display substrates and a power supply circuit, wherein the power supply circuit supplies power to the display substrate; or, the display device includes the aforementioned display panel and a power supply circuit, wherein the power supply circuit supplies power to the display panel. This display device has the same effects as the aforementioned display substrates, and will not be described in detail here.

[0185] For example, the display device provided in the embodiments of this disclosure can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0186] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A display substrate, characterized in that, include: The light-emitting unit (101) includes: a first electrode (1011), a second electrode (1012), and a light-emitting part (1013) that is electrically connected to the first electrode (1011) and the second electrode (1012) respectively. A driving unit (102) includes a third electrode (1021), a fourth electrode (1022), a driving circuit (1023), and a substrate (1024). The third electrode (1021) and the fourth electrode (1022) are both located on the side of the driving unit (102) facing the light-emitting unit (101). The third electrode (1021) and the fourth electrode (1022) are electrically connected to the driving circuit (1023). The third electrode (1021) is electrically connected to the first electrode (1011), and the fourth electrode (1022) is electrically connected to the second electrode (1012). The substrate (1024) is located on the side of the driving circuit (1023) away from the light-emitting unit (101). A support structure (103) is located on the side of the substrate (1024) away from the driving circuit (1023). The support structure (103) includes a support area (103A) that contacts the driving unit (102). The support structure (103) includes a plurality of first pins (1031) that are electrically connected to the driving circuit (1023). A backplate (105) is located on the side of the support structure (103) away from the light-emitting unit (101). The backplate (105) includes a plurality of conductive pads (1051), and the plurality of conductive pads (1051) are connected to the plurality of first pins (1031) one by one. The ratio of the orthographic projection of the support area (103A) on the back plate (105) to the orthographic projection of the drive unit (102) on the back plate (105) is greater than or equal to 50%.

2. The display substrate according to claim 1, characterized in that, The driving unit (102) further includes a connection structure (1025), the substrate (1024) has a connection via (1024a), and the connection structure (1025) is located within the connection via (1024a); The first pin (1031) is in contact with the connection structure (1025), and the first pin (1031) and the driving circuit (1023) are connected through the connection structure (1025).

3. The display substrate according to claim 2, characterized in that, The substrate (1024) is made of one of polyimide, polyamide, acrylic resin and phenolic resin; The thickness of the substrate (1024) is in the range of 25 μm to 35 μm.

4. The display substrate according to claim 2, characterized in that, The support structure (103) further includes a first auxiliary support structure (1033), which is in contact with the substrate (1024) and the back plate (105) respectively.

5. The display substrate according to claim 4, characterized in that, The material of the first auxiliary support structure (1033) includes at least one of resin, silicon nanospheres, metal oxide nanospheres and non-metal oxide nanospheres.

6. The display substrate according to claim 2, characterized in that, The support structure (103) further includes a second auxiliary support structure (1034), which is connected to the side of the substrate (1024) away from the driving circuit (1023), and the first pin (1031) is located on the side of the second auxiliary support structure (1034) away from the substrate (1024).

7. The display substrate according to claim 6, characterized in that, The material of the second auxiliary support structure (1034) is glass.

8. The display substrate according to claim 2, characterized in that, The first pin (1031) includes a first side facing the driving circuit (1023) and a second side facing away from the driving circuit (1023); The projected area of ​​the first surface on the back plate (105) is greater than the projected area of ​​the second surface on the back plate (105).

9. The display substrate according to any one of claims 1 to 8, characterized in that, The first pin (1031) includes a first connection structure (1031b), which is located on the side of the first pin (1031) away from the substrate (1024) and includes a plurality of protrusion structures. The conductive pad (1051) includes a second connection structure (1051b), which is located on the side of the first pin (1031) away from the substrate (1024) and includes a plurality of protrusion structures. The protruding structure of the first connecting structure (1031b) is misaligned with the protruding structure of the second connecting structure (1051b); or, The protruding structure of the first connecting structure (1031b) is connected to the protruding structure of the second connecting structure (1051b).

10. The display substrate according to any one of claims 1 to 8, characterized in that, The display substrate further includes an isolation structure (107), which is located between the light-emitting part (1013) and the driving circuit (1023), and is respectively in contact with the light-emitting part (1013) and the driving circuit (1023); The isolation structure (107) surrounds the entire first electrode (1011) and the third electrode (1021) to isolate the first electrode (1011) and the third electrode (1021) from the outside world; the isolation structure (107) surrounds the entire second electrode (1012) and the fourth electrode (1022) to isolate the second electrode (1012) and the fourth electrode (1022) from the outside world.

11. The display substrate according to claim 10, characterized in that, The display substrate further includes a first substrate (104), which is located on the side of the light-emitting unit (101) away from the driving unit (102). The isolation structure (107) surrounds the light-emitting unit (101) and fills the space between the driving unit (102) connected to the light-emitting unit (101) and the first substrate (104). The isolation structure (107) is respectively in contact with the driving unit (102) and the first substrate (104).

12. The display substrate according to claim 11, characterized in that, The material of the isolation structure (107) includes at least one of the following: UV adhesive, silicon nanospheres, metal oxide nanospheres, and non-metal oxide nanospheres.

13. The display substrate according to any one of claims 1 to 8 and claims 11 to 12, characterized in that, At least one of the plurality of first pins (1031) comprises an alloy containing nickel and gold.

14. The display substrate according to any one of claims 1 to 8 and claims 11 to 12, characterized in that, The light-emitting unit (101) includes a first color light-emitting unit (101a), a second color light-emitting unit (101b), and a third color light-emitting unit (101c). The colors of the light emitted by the first color light-emitting unit (101a), the second color light-emitting unit (101b), and the third color light-emitting unit (101c) are all different.

15. The display substrate according to claim 14, characterized in that, The light-emitting part (1013) includes a color filter layer (1014), a color conversion layer (1015) and a light-emitting layer (1016) stacked sequentially in the direction close to the driving unit (102), and the light-emitting layer (1016) emits blue light.

16. The display substrate according to claim 15, characterized in that, The light-emitting layer (1016) includes a first doped layer (10161), a multi-quantum well layer (10162), and a second doped layer (10163) stacked together, wherein the first doped layer (10161) is electrically connected to the first electrode (1011), and the second doped layer (10163) is electrically connected to the second electrode (1012).

17. The display substrate according to any one of claims 1 to 8, 11 to 12, and 15 to 16, characterized in that, The driving circuit (1023) includes a plurality of thin-film transistors and at least one storage capacitor, each of the thin-film transistors including a gate, a source and a drain; One of the plurality of first pins (1031) is connected to the source of one of the plurality of thin-film transistors for providing a data drive signal from the backplane (105) to the drive circuit (1023).

18. The display substrate according to claim 17, characterized in that, The driving circuit (1023) includes a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer stabilizing layer, a source / drain layer, and a planarization layer, which are stacked sequentially on one side of the substrate (1024); the third electrode (1021) and the fourth electrode (1022) are located on the side of the planarization layer away from the substrate (1024); The active layer includes multiple active patterns corresponding to the plurality of thin-film transistors, and each active pattern includes a source region, a drain region, and a channel region. The source and drain of the thin-film transistor are located in the source-drain layer, the source and the source region of the thin-film transistor are connected, and the drain and the drain region of the thin-film transistor are connected. The first gate layer includes a plurality of gate patterns corresponding to the plurality of thin-film transistors, and the channel region is the overlapping area of ​​the orthographic projection of the gate pattern on the substrate (1024) and the orthographic projection of the active pattern on the substrate (1024).

19. A method for manufacturing a display substrate, characterized in that, The method includes: A light-emitting unit is obtained, the light-emitting unit comprising: a first electrode, a second electrode, and a light-emitting portion electrically connected to the first electrode and the second electrode respectively; A driving unit is obtained, the driving unit comprising: a third electrode, a fourth electrode, a driving circuit and a substrate, wherein the third electrode and the fourth electrode are electrically connected to the driving circuit respectively; The light-emitting unit and the driving unit are bonded together by a bonding process, such that the third electrode and the fourth electrode are both located on the side of the driving unit facing the light-emitting unit, the substrate is located on the side of the driving circuit away from the light-emitting unit, the third electrode is electrically connected to the first electrode, the fourth electrode is electrically connected to the second electrode, and the substrate is located on the side of the driving circuit away from the light-emitting unit. A support structure is fabricated on the side of the substrate away from the driving circuit. The support structure includes a support region that contacts the driving unit and includes a plurality of first pins that are electrically connected to the driving circuit. Obtain a backplane, the backplane comprising a plurality of conductive pads; The first pin and the backplane are bonded together by a bonding process, and the plurality of conductive pads are connected to the plurality of first pins one by one. The ratio of the orthographic projection of the support area on the back plate to the orthographic projection of the drive unit on the back plate is greater than or equal to 50%.

20. The method for manufacturing a display substrate according to claim 19, characterized in that, The support structure further includes a first auxiliary support structure, which is in contact with the substrate and the back plate respectively. The manufacturing method further includes: Before connecting the first pin and the backplate, an initial auxiliary support layer is coated on the side of the backplate near the drive unit, and a plurality of grooves are formed in the initial auxiliary support layer to obtain a first auxiliary support structure. The plurality of grooves correspond to the plurality of first pins, and the first pins are located in the grooves; or, After connecting the first pin and the backplate, the drive unit and the backplate, which are fixedly connected by the plurality of first pins, are immersed in a first auxiliary support material liquid and cured to form a first auxiliary support structure.

21. The method for manufacturing a display substrate according to claim 19, characterized in that, The support structure further includes a second auxiliary support structure, which is connected to the side of the substrate away from the driving circuit. The manufacturing method further includes: After the light-emitting unit and the driving unit are bonded together by a bonding process, the initial substrate connected to the side of the driving unit away from the light-emitting unit is thinned and perforated to form multiple openings. The multiple openings correspond one-to-one with the multiple first pins to obtain the second auxiliary support structure.

22. A display panel, characterized in that, The display panel includes a display substrate, a touch layer, and an encapsulation layer as described in any one of claims 1 to 18, wherein the touch layer and the encapsulation layer are sequentially stacked on the side of the light-emitting unit away from the driving unit.

23. A display device, characterized in that, The display device includes a display substrate and a power supply circuit as described in any one of claims 1 to 18, wherein the power supply circuit is used to supply power to the display substrate; or... The display device includes a display panel as described in claim 22 and a power supply circuit, wherein the power supply circuit is used to supply power to the display panel.

Images