Wafer measurement environment quality compensation device

Abstract

The invention discloses a wafer measurement environment quality compensation device, and particularly relates to the technical field of environment quality compensation equipment, the wafer measurement environment quality compensation device comprises a mounting table, an environment compensation component is arranged in the middle of the mounting table, and a heating component is arranged at the lower end of the environment compensation component. According to the wafer measurement environment quality compensation device, by arranging the heating component and the flow guide mechanism, when the temperature in the inner cavity of the mounting table needs to be adjusted, the control table can conduct heating through the heating component, the flow guide mechanism can be started through the control table, and the temperature in the inner cavity of the mounting table can be adjusted. The flow guide mechanism guides external air with lower temperature into the inner cavity of the mounting table through the four release mechanisms, and air with higher temperature in the inner cavity of the mounting table is discharged from the filter pieces I on the two sides, so that the temperature in the inner cavity of the mounting table is adjusted, and meanwhile, under the action of the flow guide mechanism and the filter pieces I on the two sides, the temperature in the inner cavity of the mounting table is adjusted. And air entering the inner cavity of the mounting table can be purified.

Description

Technical Field

[0001] The invention relates to the technical field of environmental quality compensation equipment, and in particular to a wafer measurement environmental quality compensation device. Background Art

[0002] The wafer measurement environmental quality compensation device is mainly used to monitor and compensate environmental quality factors such as temperature, humidity, air cleanliness, etc. in real time during the wafer measurement process to ensure the accuracy and reliability of the measurement results.

[0003] Chinese patent document CN114197380B discloses an automatic environmental quality compensation device for a cross-river bridge, comprising an environmental quality intelligent perception module, a bridge deck environmental quality prediction model, a bridge deck self-cooling working module, a bridge deck ice and snow melting working module and a pulse type high visibility spraying module; the environmental quality intelligent perception module is used to obtain real-time environmental quality parameters of the target bridge; the bridge deck environmental quality prediction model is used to determine environmental quality compensation instructions, cooling instructions and ice and snow melting instructions; the bridge deck self-cooling working module is used to receive the cooling instructions; the bridge deck ice and snow melting working module is used to receive ice and snow melting instructions; the pulse type high visibility spraying module is used to spray water and / or spray medicine on the bridge deck of the target bridge according to the environmental quality compensation instructions, cooling instructions and ice and snow melting instructions. The device can be used for daily maintenance of the bridge, extreme situations such as high temperature or low temperature, does not require manual operation and frequent maintenance, does not affect driving visibility, and efficiently guarantees the quality of the cross-river bridge traffic environment. However, in actual use, the device has many corresponding supporting facilities to achieve the above functions, so its production cost is relatively large, which is not conducive to large-scale use. Summary of the invention

[0004] The main purpose of the present invention is to provide a wafer measurement environment quality compensation device, which can effectively solve the problem that there are many corresponding supporting facilities, so its production cost is high and it is not conducive to large-scale use.

[0005] To achieve the above object, the technical solution adopted by the present invention is:

[0006] A wafer measurement environment quality compensation device comprises a mounting platform, a plurality of protective doors are arranged on the outer side of the upper part of the mounting platform, a control console is arranged in the middle of the outer surface of the protective door on one side, and a filter is arranged in the middle of the outer surface of the protective doors on the other two sides, a measuring component is arranged in the middle of the mounting platform, a mounting plate is arranged at the upper end of the mounting platform, an environmental compensation component is arranged in the middle of the mounting plate, a transmission mechanism for providing kinetic energy to the environmental compensation component is arranged on the side of the upper end of the mounting plate away from the control console, and a heating component is arranged at the lower end of the environmental compensation component;

[0007] The transmission mechanism includes a motor and multiple transmission rods. The motor is fixedly mounted on one side of the upper end of the mounting plate. The multiple transmission rods are rotatably mounted on the inner wall of the mounting plate. The output end of the motor is connected to the multiple transmission rods via belts.

[0008] Specifically, when the wafer needs to be inspected, the staff can place the wafer on the measuring component for inspection. In the process of inspecting the wafer, in order to enable the measuring component to inspect the wafer more accurately, there are certain requirements for the inspection environment. At this time, environmental compensation components and heating components are needed to compensate for the environment.

[0009] Furthermore, different filter layers are placed in the inner cavity of the filter element to filter dust and moisture in the air, preventing dust and other impurities in the air from entering the inner cavity of the mounting table. At the same time, it also prevents excess moisture in the outside air from entering the inner cavity of the mounting table, thereby affecting the detection accuracy of the measuring component in detecting the wafer.

[0010] Furthermore, the wafer can be inspected through the measuring component. At the same time, the console can control the operation of the transmission mechanism and the measuring component. Various indicators in the inner cavity of the mounting table can be monitored in real time through the various sensors arranged in the inner cavity of the mounting table. These are all existing technologies and will not be described in detail in this manual.

[0011] Preferably, the environmental compensation component includes a mounting shell, which is fixedly mounted on the middle part of the mounting plate, a humidity compensation mechanism is provided on one side of the inner cavity of the mounting shell, the upper end of the humidity compensation mechanism extends to the outside of the mounting shell, lifting mechanisms are provided on both sides of the humidity compensation mechanism, a flow guide mechanism is provided on the other side of the inner cavity of the mounting shell, the upper end of the flow guide mechanism is flush with the upper end of the mounting shell, two release mechanisms are provided on both sides of the outer surface of the mounting shell, and the inner cavities of the four release mechanisms are communicated with the inner cavities of the release mechanism and the flow guide mechanism.

[0012] Specifically, when the temperature in the upper inner cavity of the mounting table is low, the control console can heat the environment through the heating component to make the ambient temperature of the measuring component at a temperature suitable for detection. At the same time, when the temperature in the upper inner cavity of the mounting table is high, the control console can start the guide mechanism to make the guide mechanism guide the air with lower external temperature into the inner cavity of the mounting table through four release mechanisms, and then the air with higher temperature in the inner cavity of the mounting table is discharged from the filter elements on both sides. The temperature in the inner cavity of the mounting table is adjusted by the above method.

[0013] Furthermore, most of the equipment capable of inspecting wafers is installed in a constant temperature workshop or a corresponding constant temperature laboratory, and the temperature in the constant temperature workshop or constant temperature laboratory is mostly maintained at 22-25 degrees Celsius, which is also the optimal temperature for wafer inspection. Therefore, when the temperature in the inner cavity of the mounting table is high, the air with a lower temperature from the outside can be introduced into the inner cavity of the mounting table.

[0014] Furthermore, when the humidity in the inner cavity of the mounting table is high, the control console will also open the diversion mechanism. Since the diversion mechanism is provided with corresponding filtering components, it can filter the water vapor in the air and then introduce the dry air into the inner cavity of the mounting table. In this process, the temperature in the inner cavity of the mounting table may change, so it is necessary to perform auxiliary adjustment through the heating component. When the humidity in the inner cavity of the mounting table is low, the control personnel can start the humidity compensation mechanism, and the water is atomized by the humidity compensation mechanism and then introduced into the four release mechanisms. Then the water atomized by the four release mechanisms is discharged into the inner cavity of the mounting table, thereby increasing the humidity in the inner cavity of the mounting table.

[0015] Preferably, the humidity compensation mechanism includes an atomizer, which is fixedly mounted on one side of the inner cavity of the mounting shell, and the output port of the atomizer is provided with a transverse duct, both ends of the transverse duct are provided with axial ducts, and the lower part of the inner cavity of the transverse duct and the two axial ducts is provided with a leak plate.

[0016] Preferably, the release mechanism includes an installation frame, which is fixedly mounted on the outer surface of the installation shell, a partition is provided in the middle of the installation frame, and the partition divides the inner cavity of the installation frame into two upper and lower spaces, a spray component is provided on the outside of the inner cavity of the installation frame, and the lower end of the spray component extends to the outside of the installation frame, a driven rod 1 is provided in the middle of the inner cavity of the installation frame, and the upper end of the driven rod 1 extends to the outside of the installation frame, the upper part of the outer surface of the driven rod 1 is connected to a transmission rod located on one side through a belt, and a guide fan 1 is provided on the lower part of the outer surface of the driven rod 1, and the guide fan 1 is arranged on the lower side of the inner cavity of the installation frame.

[0017] Preferably, the spraying member includes a U-shaped conduit and a plurality of atomizing nozzles, the U-shaped conduit is fixedly installed on the upper side of the inner cavity of the mounting frame, an inclined plate is provided in the middle of the inner cavity of the U-shaped conduit, the plurality of atomizing nozzles are fixedly installed on the lower part of the mounting frame, and the lower ends of the plurality of atomizing nozzles extend to the outside of the mounting frame, and the U-shaped conduit and the plurality of atomizing nozzles are connected via a connecting pipe.

[0018] Preferably, both side end surfaces of the U-shaped conduit are aligned with the outer surface of the axial conduit, and the inner cavity of the U-shaped conduit is communicated with the inner cavity of the axial conduit.

[0019] Specifically, when the humidity in the inner cavity of the mounting table is low, the control console controls the atomizer to atomize the water inside it, and then the atomizer introduces the atomized water from the transverse duct and the axial ducts on both sides into the inner cavities of the U-shaped ducts in the four release mechanisms. Thereafter, the four U-shaped ducts introduce the atomized water in their inner cavities into the inner cavities of multiple atomizing nozzles through multiple connecting pipes respectively, and finally the atomized water is discharged into the inner cavity of the mounting table through multiple atomizing nozzles, thereby increasing the humidity in the inner cavity of the mounting table.

[0020] Furthermore, in the above process, the control console will also drive the driven rod 1 and the guide fan 1 to rotate through the transmission mechanism. The rotation of the guide fan 1 can accelerate the flow of air and adjust the humidity in the inner cavity of the mounting table to the corresponding value more quickly.

[0021] Furthermore, when the humidity in the inner cavity of the mounting table is high, the control console controls the operation of the guide mechanism and the guide fan 1 through the transmission mechanism, draws the air in the inner cavity of the mounting table upward, and introduces the external air into the inner cavity of the mounting table through the filter element 1 on both sides. During this process, the filter element 1 can absorb the water vapor in the air entering the inner cavity of the mounting table, thereby achieving the purpose of reducing the humidity in the inner cavity of the mounting table.

[0022] Furthermore, the atomizer can atomize water, and suitable water can be introduced into the inner cavity of the atomizer through the water inlet at the upper part of the atomizer before use. This is a prior art and will not be described in detail in this specification.

[0023] Preferably, the lifting mechanism includes a small water tank, which is fixedly installed in the inner cavity of the mounting shell, the inner cavity of the small water tank is communicated with the inner cavities of the two axial ducts, a baffle is provided in the middle of the inner cavity of the small water tank, an extraction piece is provided on one side of the inner cavity of the small water tank, a guide tube is provided on the upper part of the extraction piece, the upper end of the guide tube extends to the outside of the small water tank, the inner cavity of the guide tube is communicated with the inner cavity of the funnel for introducing liquid on the humidity compensation mechanism, and a driven handle for transferring kinetic energy to the extraction piece is provided at the upper end of the guide tube, and the driven handle is connected to a transmission rod located on one side by a belt.

[0024] Preferably, the flow guide mechanism includes a U-shaped shell, which is fixedly installed in the inner cavity of the mounting shell, and a driven rod 2 is provided in the middle of the inner cavity of the U-shaped shell, the upper end of the driven rod 2 extends to the outside of the mounting shell, and the upper part of the outer surface of the driven rod 2 is connected to the transmission rod located in the middle through a belt, and a guide fan 2 is provided at the lower part of the outer surface of the driven rod 2, and a filter element 2 is provided in the middle of the inner cavity of the U-shaped shell, and the middle part of the filter element 2 is rotatably connected to the outer surface of the driven rod 2.

[0025] Preferably, the U-shaped shell includes a U-shaped frame, which is fixedly installed in the inner cavity of the mounting shell, two guide frames are arranged on both sides of the outer surface of the U-shaped frame, and a fixed frame is arranged in the middle of the U-shaped frame, and the middle part of the inner cavity of the fixed frame is fixedly connected to the outer surface of the filter element 2, and the inner cavities of the four guide frames are respectively communicated with the lower parts of the inner cavities of the four mounting frames.

[0026] Specifically, when it is necessary to adjust the temperature or humidity of the inner cavity of the mounting platform, the control console is required to drive the driven rod 2 and the guide fan 2 to operate through the transmission mechanism. When the temperature of the inner cavity of the mounting platform is high, the control console drives the driven rod 2 and the filter element 2 to rotate through the transmission mechanism. When the filter element 2 rotates, the air with a lower external temperature can be introduced into the inner cavity of the mounting platform. When the humidity in the inner cavity of the mounting platform is high, the transmission mechanism drives the filter element 2 to rotate in the opposite direction. During this process, the guide fan 1 in the inner cavity of the release mechanism will also rotate in the opposite direction, and then the air with a higher humidity in the inner cavity of the mounting platform is sucked into the inner cavity of the mounting frame. After that, the air is introduced into the inner cavity of the filter element 2 through the guide frame and the U-shaped frame. Finally, the air will be discharged from the filter element 2 to the outside of the mounting shell. When the humidity in the inner cavity of the mounting platform is low, at this time, water is atomized and input into the inner cavity of the mounting platform under the action of the humidity compensation mechanism and the release mechanism. During this process, the filter element 2 will introduce the outside air, and then discharge it into the inner cavity of the mounting platform through the mounting frame and the guide fan 1 to accelerate the diffusion speed of the atomized water vapor.

[0027] Furthermore, the filter material contained in the inner cavity of the second filter element is the same as the filter material contained in the inner cavity of the first filter element.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] 1. In the present invention, by providing a humidity compensation mechanism and a release mechanism, when it is necessary to adjust the air humidity in the inner cavity of the mounting table, the control console will also open the guide mechanism. Since the guide mechanism is provided with corresponding filtering components, it can filter the water vapor in the air, and then introduce the dry air into the inner cavity of the mounting table. During this process, the temperature in the inner cavity of the mounting table may change, so it is necessary to perform auxiliary adjustment through the heating component. When the humidity in the inner cavity of the mounting table is low, the control personnel can start the humidity compensation mechanism, and the water is atomized by the humidity compensation mechanism and then introduced into the four release mechanisms. Then the water atomized by the four release mechanisms is discharged into the inner cavity of the mounting table, thereby increasing the humidity in the inner cavity of the mounting table.

[0030] 2. In the present invention, by providing a heating component and a guide mechanism, when it is necessary to adjust the temperature in the inner cavity of the mounting table, the control console can heat the environment where the measuring component is located through the heating component to make the ambient temperature of the measuring component at a temperature suitable for detection. At the same time, when the temperature in the upper inner cavity of the mounting table is high, the guide mechanism can be activated by the control console to allow the guide mechanism to introduce the air with a lower external temperature into the inner cavity of the mounting table through four release mechanisms, and the air with a higher temperature in the inner cavity of the mounting table is discharged from the filter elements 1 on both sides, thereby achieving temperature adjustment in the inner cavity of the mounting table. At the same time, under the action of the guide mechanism and the filter elements 1 on both sides, the air entering the inner cavity of the mounting table can be purified.

[0031] 3. In the present invention, when the environmental compensation component is running, the environment in the inner cavity of the mounting platform can be compensated by the motor and without setting up other power sources, thereby reducing the manufacturing cost of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 The overall structure of the present invention is shown in FIG. Figure 1 ;

[0033] Figure 2 The overall structure of the present invention is shown in FIG. Figure 2 ;

[0034] Figure 3 It is a schematic diagram of assembling the environmental compensation component of the present invention;

[0035] Figure 4 It is a schematic diagram of the transmission mechanism structure of the present invention;

[0036] Figure 5 The structure of the environmental compensation component of the present invention is shown in FIG. Figure 1 ;

[0037] Figure 6 The structure of the environmental compensation component of the present invention is shown in FIG. Figure 2 ;

[0038] Figure 7 It is a schematic diagram of the structure of the humidity compensation mechanism of the present invention;

[0039] Figure 8 It is a schematic diagram of the assembly of the release mechanism of the present invention;

[0040] Fig. 9 For the present invention Figure 8 A partial enlarged view of the middle part;

[0041] Fig.10 It is a schematic diagram of the assembly of the lifting mechanism of the present invention;

[0042] Fig.11 It is a schematic diagram of the lifting mechanism structure of the present invention;

[0043] Fig.12 It is a schematic diagram of the structure of the flow guiding mechanism of the present invention;

[0044] Fig.13 It is a schematic diagram of the U-shaped shell structure of the present invention.

[0045] In the figure: 1, mounting table; 2, protective door; 3, control console; 4, filter element 1; 5, environmental compensation component; 51, mounting shell; 52, lifting mechanism; 521, small water tank; 522, baffle; 523, extraction member; 524, guide tube; 525, driven handle; 53, humidity compensation mechanism; 531, atomizer; 532, axial conduit; 533, transverse conduit; 534, leak plate; 54, release mechanism; 541, mounting frame; 542, partition; 543, Spraying part; 5431, U-shaped conduit; 5432, atomizing nozzle; 5433, tilting plate; 544, driven rod one; 545, guide fan one; 55, guide mechanism; 551, U-shaped shell; 5511, U-shaped frame; 5512, guide frame; 5513, fixed frame; 553, driven rod two; 554, guide fan two; 555, filter element two; 6, transmission mechanism; 61, motor; 62, transmission rod; 7, measuring part; 8, mounting plate; 9, heating part. DETAILED DESCRIPTION

[0046] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0047] Embodiment 1

[0048] like Figure 1 — Figure 3 As shown, this embodiment discloses a wafer measurement environment quality compensation device, including a mounting table 1, a plurality of protective doors 2 are arranged on the outer side of the upper part of the mounting table 1, a control console 3 is arranged in the middle of the outer surface of the protective door 2 on one side, and a filter element 4 is arranged in the middle of the outer surface of the protective doors 2 on the other two sides, a measuring component 7 is arranged in the middle of the mounting table 1, a mounting plate 8 is arranged at the upper end of the mounting table 1, an environmental compensation component 5 is arranged in the middle of the mounting plate 8, a transmission mechanism 6 for providing kinetic energy to the environmental compensation component 5 is arranged on the side of the upper end of the mounting plate 8 away from the control console 3, and a heating component 9 is arranged at the lower end of the environmental compensation component 5.

[0049] Further, such as Figure 4 As shown, the transmission mechanism 6 includes a motor 61 and multiple transmission rods 62. The motor 61 is fixedly mounted on one side of the upper end of the mounting plate 8. The multiple transmission rods 62 are rotatably mounted on the inner wall of the mounting plate 8. The output end of the motor 61 is connected to the multiple transmission rods 62 via a belt.

[0050] Specifically, when the wafer needs to be inspected, the staff can place the wafer on the measuring component 7 for inspection. In the process of inspecting the wafer, in order to enable the measuring component 7 to inspect the wafer more accurately, there are certain requirements for the inspection environment. At this time, the environmental compensation component 5 and the heating component 9 are needed to compensate for the environment.

[0051] Furthermore, different filter layers are placed in the inner cavity of the filter element 4 to filter dust and moisture in the air, thereby preventing dust and other impurities in the air from entering the inner cavity of the mounting table 1. At the same time, it also prevents a large amount of moisture in the outside air from entering the inner cavity of the mounting table 1, thereby affecting the detection accuracy of the measuring component 7 on the wafer.

[0052] Furthermore, the wafer can be inspected by the measuring component 7. At the same time, the control console 3 can control the operation of the transmission mechanism 6 and the measuring component 7. Various indicators in the inner cavity of the mounting table 1 can be monitored in real time by means of various sensors arranged in the inner cavity of the mounting table 1. These are all existing technologies and will not be described in detail in this specification.

[0053] In order to achieve compensation for environmental quality during wafer measurement, such as Figure 5 and Figure 6 As shown, the environmental compensation component 5 includes a mounting shell 51, which is fixedly mounted in the middle of the mounting plate 8, a humidity compensation mechanism 53 is arranged on one side of the inner cavity of the mounting shell 51, the upper end of the humidity compensation mechanism 53 extends to the outside of the mounting shell 51, and lifting mechanisms 52 are arranged on both sides of the humidity compensation mechanism 53, and a guide mechanism 55 is arranged on the other side of the inner cavity of the mounting shell 51, the upper end of the guide mechanism 55 is flush with the upper end of the mounting shell 51, and two release mechanisms 54 are arranged on both sides of the outer surface of the mounting shell 51, and the inner cavities of the four release mechanisms 54 are communicated with the inner cavities of the release mechanisms 54 and the guide mechanisms 55.

[0054] Specifically, when the temperature in the upper inner cavity of the mounting platform 1 is low, the control console 3 can be heated by the heating component 9 to make the ambient temperature of the measuring component 7 at a temperature suitable for detection. At the same time, when the temperature in the upper inner cavity of the mounting platform 1 is high, the control console 3 can start the guide mechanism 55 to allow the guide mechanism 55 to guide the air with a lower external temperature into the inner cavity of the mounting platform 1 through the four release mechanisms 54, and then the air with a higher temperature in the inner cavity of the mounting platform 1 is discharged from the filter elements 4 on both sides. The temperature in the inner cavity of the mounting platform 1 is adjusted by the above method.

[0055] Furthermore, most of the equipment capable of inspecting wafers is installed in a constant temperature workshop or a corresponding constant temperature laboratory, and the temperature in the constant temperature workshop or constant temperature laboratory is mostly maintained at 22-25 degrees Celsius, which is also the optimal temperature for wafer inspection. Therefore, when the temperature in the inner cavity of the mounting table 1 is high, the air with a lower temperature from the outside can be introduced into the inner cavity of the mounting table 1.

[0056] Furthermore, when the humidity in the inner cavity of the mounting platform 1 is high, the control console 3 will also open the guide mechanism 55. Since the guide mechanism 55 is provided with corresponding filtering components, it can filter the water vapor in the air and then introduce the dry air into the inner cavity of the mounting platform 1. During this process, the temperature in the inner cavity of the mounting platform 1 may change, so it is necessary to perform auxiliary adjustment through the heating component 9. When the humidity in the inner cavity of the mounting platform 1 is low, the control personnel can start the humidity compensation mechanism 53, and the water is atomized by the humidity compensation mechanism 53 and introduced into the four release mechanisms 54. Then the water atomized by the four release mechanisms 54 is discharged into the inner cavity of the mounting platform 1, so as to increase the humidity in the inner cavity of the mounting platform 1.

[0057] In order to compensate for the humidity in the environment during wafer measurement, Figure 7 As shown, the humidity compensation mechanism 53 includes an atomizer 531, which is fixedly mounted on one side of the inner cavity of the mounting shell 51. A transverse duct 533 is provided at the output port of the atomizer 531, and axial ducts 532 are provided at both ends of the transverse duct 533. A leak plate 534 is provided at the lower part of the inner cavity of the transverse duct 533 and the two axial ducts 532.

[0058] Further, such as Figure 7 and Figure 8 As shown, the release mechanism 54 includes a mounting frame 541, which is fixedly mounted on the outer surface of the mounting shell 51, a partition 542 is arranged in the middle of the mounting frame 541, and the partition 542 divides the inner cavity of the mounting frame 541 into two upper and lower spaces, a spraying member 543 is arranged on the outer side of the inner cavity of the mounting frame 541, and the lower end of the spraying member 543 extends to the outside of the mounting frame 541, a driven rod 544 is arranged in the middle of the inner cavity of the mounting frame 541, and the upper end of the driven rod 544 extends to the outside of the mounting frame 541, the upper part of the outer surface of the driven rod 544 is connected to the transmission rod 62 located on one side through a belt, and a guide fan 545 is arranged on the lower part of the outer surface of the driven rod 544, and the guide fan 545 is arranged on the lower side of the inner cavity of the mounting frame 541.

[0059] Further, such as Figure 8 and Fig. 9As shown, the spraying member 543 includes a U-shaped duct 5431 and a plurality of atomizing nozzles 5432. The U-shaped duct 5431 is fixedly installed on the upper side of the inner cavity of the mounting frame 541. An inclined plate 5433 is provided in the middle of the inner cavity of the U-shaped duct 5431. The plurality of atomizing nozzles 5432 are fixedly installed on the lower part of the mounting frame 541, and the lower ends of the plurality of atomizing nozzles 5432 extend to the outside of the mounting frame 541. The U-shaped duct 5431 and the plurality of atomizing nozzles 5432 are connected via connecting pipes.

[0060] Furthermore, both side end surfaces of the U-shaped conduit 5431 are aligned with the outer surface of the axial conduit 532 , and the inner cavity of the U-shaped conduit 5431 is in communication with the inner cavity of the axial conduit 532 .

[0061] Specifically, when the humidity in the inner cavity of the mounting platform 1 is low, the control console 3 controls the atomizer 531 to atomize the water inside it, and then the atomizer 531 introduces the atomized water from the transverse duct 533 and the axial ducts 532 on both sides into the inner cavities of the U-shaped ducts 5431 in the four release mechanisms 54. Thereafter, the four U-shaped ducts 5431 introduce the atomized water in their inner cavities into the inner cavities of the multiple atomizing nozzles 5432 through the multiple connecting pipes respectively. Finally, the atomized water is discharged into the inner cavity of the mounting platform 1 through the multiple atomizing nozzles 5432, thereby increasing the humidity in the inner cavity of the mounting platform 1.

[0062] Furthermore, in the above process, the control console 3 will also drive the driven rod 544 and the guide fan 545 to rotate through the transmission mechanism 6. The rotation of the guide fan 545 can accelerate the flow of air and adjust the humidity in the inner cavity of the mounting platform 1 to the corresponding value more quickly.

[0063] Furthermore, when the humidity in the inner cavity of the mounting platform 1 is high, the control console 3 controls the operation of the guide mechanism 55 and the guide fan 545 through the transmission mechanism 6, so as to draw the air in the inner cavity of the mounting platform 1 upward, and the external air can be introduced into the inner cavity of the mounting platform 1 through the filter elements 4 on both sides. During this process, the filter elements 4 can adsorb the water vapor in the air entering the inner cavity of the mounting platform 1, so as to achieve the purpose of reducing the humidity in the inner cavity of the mounting platform 1.

[0064] Furthermore, the atomizer 531 can atomize water, and before use, suitable water can be introduced into the inner cavity of the atomizer 531 through the water inlet at the upper part of the atomizer 531. This is a prior art and will not be described in detail in this specification.

[0065] When the humidity compensation mechanism 53 guides the atomized water vapor into the inner cavity of the release mechanism 54, a part of the water vapor will condense into water, resulting in a certain amount of water accumulating in the inner cavities of the axial conduit 532 and the transverse conduit 533, so it needs to be discharged. Fig.10 and Fig.11As shown, 52 includes a small water tank 521, which is fixedly installed in the inner cavity of the mounting shell 51, the inner cavity of the small water tank 521 is communicated with the inner cavities of the two axial guide tubes 532, a baffle 522 is provided in the middle of the inner cavity of the small water tank 521, an extraction member 523 is provided on one side of the inner cavity of the small water tank 521, a guide tube 524 is provided on the upper part of the extraction member 523, the upper end of the guide tube 524 extends to the outside of the lower small water tank 521, the inner cavity of the guide tube 524 is communicated with the inner cavity of the funnel for introducing liquid on 53, and a driven handle 525 for transmitting kinetic energy to 523 is provided on the upper end of 524, and 525 is connected to 62 located on one side through a belt.

[0066] Specifically, when a certain amount of water condenses in the inner cavity of the axial duct 532 or the transverse duct 533, the water in the inner cavity of the axial duct 532 and the transverse duct 533 will flow into the inner cavity of the small water tanks 521 on both sides. In the process of the transmission mechanism 6 driving the release mechanism 54 to operate, the transmission mechanism 6 will also drive the extraction member 523 to rotate through the driven handle 525, so as to guide the water in the inner cavity of the small water tank 521 upward, and then flow into the inner cavity of the atomizer 531 again through the action of the guide tube 524 to be atomized.

[0067] In order to adjust the temperature under the action of the filter element 4 and the heating component 9, and at the same time, purify the air, such as Fig.12 and Fig.13 As shown, the guide mechanism 55 includes a U-shaped shell 551, which is fixedly installed in the inner cavity of the mounting shell 51. A driven rod 553 is arranged in the middle of the inner cavity of the U-shaped shell 551. The upper end of the driven rod 553 extends to the outside of the mounting shell 51, and the upper part of the outer surface of the driven rod 553 is connected to the transmission rod 62 located in the middle through a belt. A guide fan 554 is arranged at the lower part of the outer surface of the driven rod 553. A filter element 555 is arranged in the middle of the inner cavity of the U-shaped shell 551. The middle part of the filter element 555 is rotatably connected to the outer surface of the driven rod 553.

[0068] Further, such as Fig.10 As shown, the U-shaped shell 551 includes a U-shaped frame 5511, which is fixedly installed in the inner cavity of the mounting shell 51, and two guide frames 5512 are arranged on both sides of the outer surface of the U-shaped frame 5511. A fixed frame 5513 is arranged in the middle of the U-shaped frame 5511, and the middle part of the inner cavity of the fixed frame 5513 is fixedly connected to the outer surface of the filter element 2 555, and the inner cavities of the four guide frames 5512 are respectively communicated with the lower parts of the inner cavities of the four mounting frames 541.

[0069] Specifically, when it is necessary to adjust the temperature or humidity of the inner cavity of the mounting platform 1, the control console 3 needs to drive the driven rod 2 553 and the guide fan 2 554 to operate through the transmission mechanism 6. When the temperature of the inner cavity of the mounting platform 1 is high, the control console 3 drives the driven rod 2 553 and the filter 2 555 to rotate through the transmission mechanism 6. When the filter 2 555 rotates, the air with a lower external temperature can be introduced into the inner cavity of the mounting platform 1. When the humidity in the inner cavity of the mounting platform 1 is high, the transmission mechanism 6 drives the filter 2 555 to rotate in the opposite direction. During this process, the guide fan 1 545 in the inner cavity of the release mechanism 54 will also rotate in the opposite direction, and then the mounting platform 1 is released. 1 is sucked into the inner cavity of the mounting frame 541, and then the air is introduced into the inner cavity of the second filter element 555 through the guide frame 5512 and the U-shaped frame 5511. Finally, the air is discharged from the second filter element 555 to the outside of the mounting shell 51. When the humidity in the inner cavity of the mounting platform 1 is low, at this time, water is atomized and input into the inner cavity of the mounting platform 1 under the action of the humidity compensation mechanism 53 and the release mechanism 54. In this process, the second filter element 555 will introduce external air, and then discharge it into the inner cavity of the mounting platform 1 through the mounting frame 541 and the guide fan 1 545 to accelerate the diffusion speed of the atomized water vapor.

[0070] Furthermore, the filter material contained in the inner cavity of the filter element 2 555 is the same as the filter material contained in the inner cavity of the filter element 1 4.

[0071] It should be noted that the specific installation method, circuit arrangement and connection method, and control method of the control console 3, transmission mechanism 6, and measuring component 7 used in the above embodiment are all conventional designs in the prior art and will not be elaborated in detail in the present invention.

[0072] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A wafer measurement environment quality compensation device, comprising a mounting table (1), characterized in that: A plurality of protective doors (2) are arranged on the outer side of the upper part of the mounting platform (1); a control console (3) is arranged in the middle of the outer surface of the protective door (2) on one side; a filter element (4) is arranged in the middle of the outer surface of the protective door (2) on the other two sides; a measuring component (7) is arranged in the middle of the mounting platform (1); a mounting plate (8) is arranged at the upper end of the mounting platform (1); an environmental compensation component (5) is arranged in the middle of the mounting plate (8); a transmission mechanism (6) for providing kinetic energy to the environmental compensation component (5) is arranged on the side of the upper end of the mounting plate (8) away from the control console (3); and a heating component (9) is arranged at the lower end of the environmental compensation component (5); The transmission mechanism (6) comprises a motor (61) and a plurality of transmission rods (62); the motor (61) is fixedly mounted on one side of the upper end of the mounting plate (8); the plurality of transmission rods (62) are rotatably mounted on the inner wall of the mounting plate (8); and the output end of the motor (61) and the plurality of transmission rods (62) are connected via belts.

2. The wafer measurement environment quality compensation device according to claim 1, characterized in that: The environmental compensation component (5) comprises a mounting shell (51), wherein the mounting shell (51) is fixedly mounted on the middle part of the mounting plate (8); a humidity compensation mechanism (53) is arranged on one side of the inner cavity of the mounting shell (51); the upper end of the humidity compensation mechanism (53) extends to the outside of the mounting shell (51); lifting mechanisms (52) are arranged on both sides of the humidity compensation mechanism (53); a flow guiding mechanism (55) is arranged on the other side of the inner cavity of the mounting shell (51); the upper end of the flow guiding mechanism (55) is flush with the upper end of the mounting shell (51); two release mechanisms (54) are arranged on both sides of the outer surface of the mounting shell (51); the inner cavities of the four release mechanisms (54) are communicated with the inner cavities of the release mechanisms (54) and the flow guiding mechanisms (55).

3. The wafer measurement environment quality compensation device according to claim 2, characterized in that: The humidity compensation mechanism (53) comprises an atomizer (531), wherein the atomizer (531) is fixedly mounted on one side of the inner cavity of the mounting shell (51), and a transverse conduit (533) is provided at the output port of the atomizer (531), and axial conduits (532) are provided at both ends of the transverse conduit (533), and a leak plate (534) is provided at the lower part of the inner cavity of the transverse conduit (533) and the two axial conduits (532).

4. The wafer measurement environment quality compensation device according to claim 3, characterized in that: The release mechanism (54) comprises a mounting frame (541), wherein the mounting frame (541) is fixedly mounted on the outer surface of the mounting shell (51), a partition (542) is arranged in the middle of the mounting frame (541), and the partition (542) divides the inner cavity of the mounting frame (541) into two upper and lower spaces, and a spraying member (543) is arranged outside the inner cavity of the mounting frame (541), and the lower end of the spraying member (543) extends to the outer side of the mounting frame (541). Externally, a driven rod 1 (544) is provided in the middle of the inner cavity of the installation frame (541), and the upper end of the driven rod 1 (544) extends to the outside of the installation frame (541). The upper part of the outer surface of the driven rod 1 (544) is connected to the transmission rod (62) located on one side through a belt, and the lower part of the outer surface of the driven rod 1 (544) is provided with a guide fan 1 (545), and the guide fan 1 (545) is arranged on the lower side of the inner cavity of the installation frame (541).

5. The wafer measurement environment quality compensation device according to claim 4, characterized in that: The spraying member (543) comprises a U-shaped conduit (5431) and a plurality of atomizing nozzles (5432); the U-shaped conduit (5431) is fixedly mounted on the upper side of the inner cavity of the mounting frame (541); an inclined plate (5433) is provided in the middle of the inner cavity of the U-shaped conduit (5431); the plurality of atomizing nozzles (5432) are fixedly mounted on the lower part of the mounting frame (541), and the lower ends of the plurality of atomizing nozzles (5432) extend to the outside of the mounting frame (541); the U-shaped conduit (5431) and the plurality of atomizing nozzles (5432) are connected via a connecting pipe.

6. The wafer measurement environment quality compensation device according to claim 5, characterized in that: Both side end surfaces of the U-shaped conduit (5431) are connected to the outer surface of the axial conduit (532), and the inner cavity of the U-shaped conduit (5431) is connected to the inner cavity of the axial conduit (532).

7. The wafer measurement environment quality compensation device according to claim 3, characterized in that: The lifting mechanism (52) comprises a small water tank (521), the small water tank (521) is fixedly installed in the inner cavity of the mounting shell (51), the inner cavity of the small water tank (521) is communicated with the inner cavities of the two axial guide tubes (532), a baffle (522) is arranged in the middle of the inner cavity of the small water tank (521), an extraction member (523) is arranged on one side of the inner cavity of the small water tank (521), and the upper part of the extraction member (523) is arranged There is a guide tube (524), the upper end of which extends to the outside of the small water tank (521), the inner cavity of the guide tube (524) is communicated with the inner cavity of the funnel for introducing liquid on the humidity compensation mechanism (53), and the upper end of the guide tube (524) is provided with a driven handle (525) for transmitting kinetic energy to the extraction member (523), and the driven handle (525) is connected to a transmission rod (62) located on one side through a belt.

8. The wafer measurement environment quality compensation device according to claim 6, characterized in that: The flow guide mechanism (55) comprises a U-shaped shell (551), wherein the U-shaped shell (551) is fixedly installed in the inner cavity of the mounting shell (51), a driven rod (553) is arranged in the middle of the inner cavity of the U-shaped shell (551), the upper end of the driven rod (553) extends to the outside of the mounting shell (51), and the upper part of the outer surface of the driven rod (553) is connected to the transmission rod (62) located in the middle through a belt, and a flow guide fan (554) is arranged in the lower part of the outer surface of the driven rod (553), and a filter (555) is arranged in the middle of the inner cavity of the U-shaped shell (551), and the middle part of the filter (555) is rotatably connected to the outer surface of the driven rod (553).

9. The wafer measurement environment quality compensation device according to claim 8, characterized in that: The U-shaped shell (551) comprises a U-shaped frame (5511), and the U-shaped frame (5511) is fixedly installed in the inner cavity of the mounting shell (51), and two guide frames (5512) are arranged on both sides of the outer surface of the U-shaped frame (5511), and a fixed frame (5513) is arranged in the middle of the U-shaped frame (5511), and the middle part of the inner cavity of the fixed frame (5513) is fixedly connected to the outer surface of the second filter element (555), and the inner cavities of the four guide frames (5512) are respectively communicated with the lower parts of the inner cavities of the four mounting frames (541).

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