SIP (Session Initiation Protocol) packaging-based four-channel temperature and pressure combined sensor

Abstract

The invention provides a four-channel temperature and pressure combined sensor based on SIP packaging, and belongs to the technical field of airborne aviation multi-channel temperature and pressure combined sensors, and the four-channel temperature and pressure combined sensor specifically comprises a dual-redundancy temperature sensing element combination, a PCB, a functional circuit, a housing and a socket. The PCB is fixed in the shell, the dual-redundancy temperature sensing element combination is fixed at one end of the shell, the socket is fixed at the other end of the shell, the functional circuit is packaged into an SIP module, the SIP module is installed on the PCB, the dual-redundancy temperature sensing element combination is electrically connected with the PCB, and the socket is electrically connected with the PCB. According to the processing scheme, the size and the weight of the sensor are reduced, and the requirements of the on-board four-channel temperature and pressure combined sensor for the size and the weight are met.

Description

Technical Field

[0001] The present application relates to the field of airborne aviation multi-channel temperature and pressure combination sensors, and in particular to a four-channel temperature and pressure combination sensor based on SIP packaging. Background Art

[0002] The multi-channel temperature and pressure combination sensor is a sensor that integrates temperature sensitive elements and pressure sensitive elements at the device or component level. It can achieve synchronous measurement of temperature and pressure in the same structure. Due to its small size and light weight, it has a wide range of application prospects in the field of aviation. In order to improve its reliability, according to user needs, the temperature and pressure combination sensor needs to be designed as a three-channel, four-channel or other multi-channel sensor to achieve synchronous measurement of multiple temperatures and multiple pressures, and realize multiple functions such as monitoring and flight parameter recording.

[0003] In the field of aviation vehicle measurement and control, it is necessary to measure multiple parameters to make a comprehensive judgment on the status of the equipment, and the parameters of a single sensor can no longer meet the needs. Combined with the future development needs of sensor miniaturization and combination, multi-channel temperature and pressure combination sensors have obvious advantages in co-location acquisition, synchronous testing, whole-machine weight reduction, data fusion, and fault prediction. It is also of great significance for the unification of whole-machine sensors, sensor standardization, modular design, and sensor production capacity improvement. Temperature and pressure are designed as dual channels, and the comprehensive evaluation of medium parameter measurement can be achieved through dual-channel output comparison, which is conducive to improving the accuracy of on-board medium parameter monitoring.

[0004] At present, with the continuous development of aviation technology, the new generation of aircraft is bound to have the characteristics of large thrust and strong maneuverability, and its system has put forward new requirements for sensors of temperature and pressure parameters. At the same time, with the increase in the number of sensors in the aircraft electromechanical system and engine system, users have higher and higher requirements for the volume and weight of sensors. Simply relying on optimizing the mechanical structure of the sensor can no longer meet the weight reduction needs. Summary of the invention

[0005] In view of this, the present application provides a four-channel temperature and pressure combination sensor based on SIP packaging, which solves the problems in the prior art, reduces the volume and weight of the sensor, and meets the size and weight requirements of the on-board four-channel temperature and pressure combination sensor.

[0006] The present application provides a four-channel temperature and pressure combination sensor based on SIP packaging, which adopts the following technical solution:

[0007] A four-channel temperature and pressure combination sensor based on SIP package, comprising a dual-redundancy temperature sensing element combination, a PCB board, a functional circuit, a housing and a socket;

[0008] The PCB board is fixed in the shell, the dual-redundancy temperature sensing element combination is fixed on one end of the shell, the socket is fixed on the other end of the shell, the functional circuit is packaged as a SIP module, the SIP module is installed on the PCB board, the dual-redundancy temperature sensing element combination is electrically connected to the PCB board, and the socket is electrically connected to the PCB board.

[0009] Optionally, the functional circuit includes a temperature conditioning circuit, a pressure conditioning circuit and an electromagnetic protection circuit, and the temperature conditioning circuit, the pressure conditioning circuit and the electromagnetic protection circuit are respectively packaged as a SIP temperature module, a SIP pressure module and a SIP electromagnetic protection module, and the SIP temperature module, the SIP pressure module and the SIP electromagnetic protection module are fixed on the PCB.

[0010] Optionally, a mounting plate and two connecting rods are provided in the shell, the connecting rod and the shell are fixedly connected, the mounting plate and the two connecting rods are fixedly connected, one end of the connecting rod is provided with a bushing, the other end of the connecting rod is fixedly connected with a mounting seat, the mounting seat and one end of the shell are fixedly connected, the PCB board is fixed on the mounting plate, the socket is fixed on the bushing, a dual-redundancy pressure core is provided in the mounting seat, one end of the dual-redundancy pressure core is electrically connected to the PCB board, and the other end of the dual-redundancy pressure core is electrically connected to the dual-redundancy temperature sensing element combination.

[0011] Optionally, a pipe joint is provided at one end of the mounting base away from the PCB board, and the dual-redundancy temperature sensing element assembly is fixed in the pipe joint.

[0012] Optionally, the SIP temperature module, the SIP pressure module and the SIP electromagnetic protection module are fixed on the PCB by means of patches.

[0013] Optionally, SIP modules of different functional circuits are composed of the same HTCC unit module and corresponding peripheral resistors and capacitors. The SIP modules use an alumina thick film substrate and an alumina HTCC housing as component carriers and are packaged using a bare chip microassembly process and a ceramic housing sealing process.

[0014] In summary, this application includes the following beneficial technical effects:

[0015] This application performs SIP encapsulation on the functional circuit parts separately to form a SIP module, and then fixes multiple small SIP modules on a layer of PCB by patch means, replacing the original multi-layer PCB board interconnection. The space occupancy rate of the previous pure PCB board is reduced. At the same time, the difficulty of welding the 12 leads on one side of the temperature / pressure sensor and the 12 leads on the lead end is reduced. Thereby, the size and weight of the sensor are reduced, meeting the size and weight requirements of the on-board four-channel temperature and pressure combination sensor. At the same time, the selection of corresponding SIP modules for matching and combination can improve the standardization and modular design level of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the overall structure of a four-channel temperature and pressure combination sensor based on SIP packaging in this application.

[0018] Description of reference numerals: 1. Dual-redundancy temperature sensing element assembly; 2. Pipe joint; 3. Dual-redundancy pressure core; 4. Mounting plate; 5. PCB board; 6. SIP module; 7. Housing; 8. Socket DETAILED DESCRIPTION

[0019] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0020] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0021] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0022] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The illustrations only show the components related to the present application rather than being drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0023] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects described may be practiced without these specific details.

[0024] The embodiment of the present application provides a four-channel temperature and pressure combination sensor based on SIP packaging.

[0025] like Figure 1 As shown, a four-channel temperature and pressure combination sensor based on SIP packaging includes a dual-redundancy temperature sensing element combination 1, a PCB board 5, a functional circuit, a shell 7 and a socket 8; the PCB board 5 is fixed in the shell 7, the dual-redundancy temperature sensing element combination 1 is fixed on one end of the shell 7, the socket 8 is fixed on the other end of the shell 7, the functional circuit is packaged as a SIP module 6, the SIP module 6 is installed on the PCB board 5, the dual-redundancy temperature sensing element combination 1 is electrically connected to the PCB board 5, and the socket 8 is electrically connected to the PCB board 5.

[0026] The functional circuit includes a temperature conditioning circuit, a pressure conditioning circuit and an electromagnetic protection circuit. The temperature conditioning circuit, the pressure conditioning circuit and the electromagnetic protection circuit are respectively packaged as a SIP temperature module, a SIP pressure module and a SIP electromagnetic protection module. The SIP temperature module, the SIP pressure module and the SIP electromagnetic protection module are fixed on the PCB and fixed on the PCB board 5 by means of a patch.

[0027] The circuit part of the conventional four-channel temperature and pressure combination sensor includes two temperature conditioning circuits, two pressure conditioning circuits and one electromagnetic protection circuit, and also includes two independent power supplies. In order to reduce the size and weight of the sensor and improve the standardization and modularization level of the sensor in the future, this application adopts HTCC and thick film hybrid integration process, and the temperature conditioning circuit part, the pressure conditioning circuit part and the electromagnetic protection circuit part are SIP packaged respectively to form a SIP temperature module, a SIP pressure module and a SIP electromagnetic protection module, and then multiple small SIP modules 6 are fixed on a layer of PCB by means of patches, replacing the original multi-layer PCB board 5 interconnection. That is, the space occupancy rate of the previous pure PCB board 5 is reduced. At the same time, the difficulty of welding the 12 leads on one side of the temperature / pressure sensor and the 12 leads on the lead end is reduced.

[0028] The SIP modules 6 of different functional circuits are composed of the same HTCC unit modules and corresponding peripheral resistors and capacitors. The SIP modules 6 use an alumina thick film substrate and an alumina HTCC shell as component carriers and are packaged using a bare chip micro-assembly process and a ceramic shell sealing process.

[0029] For the SIP temperature module, SIP pressure module and SIP electromagnetic protection module, since the circuits are basically the same, a single acquisition circuit is prepared in a unitized manner using a chiplet-like module, and the SIP module 6 uses the same HTCC unit module supplemented by different peripheral resistors and capacitors. In the future, when making changes to different types of sensors, it is only necessary to replace the corresponding unitized substrate. Such a design can greatly improve the standardization and modularization level of the sensor. In terms of structural design, alumina thick film substrates and alumina HTCC shells are used as component carriers, and bare chip micro-assembly processes and ceramic shell sealing processes are used for packaging. Thick film resistors are printed on thick film substrates, chip capacitors are assembled on ceramic shells, and finally parallel seam welding is used for sealing to form an airtight package, SIP temperature, pressure and electromagnetic protection module, the four-channel temperature and pressure combination sensor in this application has obvious miniaturization and lightweight effects when the performance indicators are comparable to the four-channel temperature and pressure combination sensors developed in the early stage.

[0030] The housing 7 is provided with a mounting plate 4 and two connecting rods, the connecting rod is fixedly connected to the housing 7, the mounting plate 4 is fixedly connected to the two connecting rods, one end of the connecting rod is provided with a bushing, the other end of the connecting rod is fixedly connected with a mounting seat, the mounting seat is fixedly connected to one end of the housing 7, the PCB board 5 is fixed on the mounting plate 4, the socket 8 is fixed on the bushing, the socket 8 is fixed to the housing 7 through the bushing, a dual-redundancy pressure core 3 is provided in the mounting seat, one end of the dual-redundancy pressure core 3 is electrically connected to the PCB board 5, and the other end of the dual-redundancy pressure core 3 is electrically connected to the dual-redundancy temperature sensing element assembly 1. The mounting seat is provided with a pipe joint 2 at one end away from the PCB board 5, and the dual-redundancy temperature sensing element assembly 1 is fixed in the pipe joint 2.

[0031] In the embodiment of the present application, the temperature sensing element in the four-channel temperature and pressure combination sensor adopts a PT1000 thin film platinum resistor, and two identical PT1000s are encapsulated to the sensor probe position through a potting process. The temperature sensing element and the mounting seat are connected by continuous laser welding, and a pressure test is performed after welding. The pressure core and the mounting seat are positioned by laser four points and then continuously laser welded for one week. After welding, the sealing needs to be checked. For the assembly process of the pressure core, due to the welding process involved for sealing and failure, the welding heat input will cause the long-term stability of the core to be reduced. In order to improve the temperature resistance of the pressure core, an aging test is required to release stress after the core and the mounting seat are welded. After comparison, after the pressure core is welded, it is subjected to a high and low temperature cycle test from -55°C to 125°C, 30 minutes each, 3 cycles, and then 40 hours, 125°C high temperature aging, the core output jump is the lowest and the stability is the best. The SIP module 6 is fixed on the PCB board 5 through SMT, and the PCB board 5 is fixed in the housing 7 through the mounting plate 4, and the mounting plate 4 is fixed to the connecting rod by screws. After the electrical connection is completed, calibration is performed to meet the sensor output characteristics and accuracy requirements.

[0032] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A four-channel temperature and pressure combination sensor based on SIP packaging, characterized in that: It comprises a dual-redundancy temperature sensing element assembly (1), a PCB board (5), a functional circuit, a housing (7) and a socket (8); The PCB board (5) is fixed in the housing (7), the dual-redundancy temperature sensing element assembly (1) is fixed on one end of the housing (7), the socket (8) is fixed on the other end of the housing (7), the functional circuit is packaged as a SIP module (6), the SIP module (6) is mounted on the PCB board (5), the dual-redundancy temperature sensing element assembly (1) and the PCB board (5) are electrically connected, and the socket (8) and the PCB board (5) are electrically connected.

2. The four-channel temperature and pressure combination sensor based on SIP package according to claim 1 is characterized in that: The functional circuit includes a temperature conditioning circuit, a pressure conditioning circuit and an electromagnetic protection circuit. The temperature conditioning circuit, the pressure conditioning circuit and the electromagnetic protection circuit are respectively packaged as a SIP temperature module, a SIP pressure module and a SIP electromagnetic protection module. The SIP temperature module, the SIP pressure module and the SIP electromagnetic protection module are fixed on a PCB.

3. The four-channel temperature and pressure combination sensor based on SIP package according to claim 1 is characterized in that: A mounting plate (4) and two connecting rods are provided in the shell (7), the connecting rods are fixedly connected to the shell (7), the mounting plate (4) and the two connecting rods are fixedly connected, one end of the connecting rod is provided with a bushing, the other end of the connecting rod is fixedly connected to a mounting seat, the mounting seat is fixedly connected to one end of the shell (7), the PCB board (5) is fixed on the mounting plate (4), the socket (8) is fixed on the bushing, a dual-redundancy pressure core (3) is provided in the mounting seat, one end of the dual-redundancy pressure core (3) is electrically connected to the PCB board (5), and the other end of the dual-redundancy pressure core (3) is electrically connected to the dual-redundancy temperature sensing element assembly (1).

4. The four-channel temperature and pressure combination sensor based on SIP package according to claim 3 is characterized in that: A pipe joint (2) is provided at one end of the mounting seat away from the PCB board (5), and the dual-redundancy temperature sensing element assembly (1) is fixed in the pipe joint (2).

5. The four-channel temperature and pressure combination sensor based on SIP package according to claim 2 is characterized in that: The SIP temperature module, the SIP pressure module and the SIP electromagnetic protection module are fixed on the PCB and fixed on the PCB board (5) by means of patches.

6. The four-channel temperature and pressure combination sensor based on SIP package according to claim 1 is characterized in that: The SIP modules (6) of different functional circuits are composed of the same HTCC unit module and corresponding peripheral resistors and capacitors. The SIP modules (6) use an alumina thick film substrate and an alumina HTCC shell as component carriers and are packaged using a bare chip micro-assembly process and a ceramic shell sealing process.

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