Multifunctional incoming material inspection device

Abstract

The invention relates to a multifunctional incoming material inspection device, which comprises a tool plate and a power supply module arranged on the tool plate, and is characterized in that the tool plate is also detachably provided with a plurality of test modules; the test module comprises an optocoupler test module, a nixie tube test module, an LED lamp test module, a buzzer test module, a cable test module, a panel test module, a power supply chip test module, a digital-to-analog converter test module, an analog-to-digital converter test module, an operational amplifier test module and a chip function integration test module. Compared with the prior art, the system has the advantages of being good in expansibility, high in integration level, easy to operate, capable of improving efficiency and the like.

Description

Technical Field

[0001] The invention relates to the field of sensor production and manufacturing, and in particular to a multifunctional incoming material inspection device. Background Art

[0002] In the sensor manufacturing process, the quality of incoming materials has an important impact on the quality of the final product. In order to avoid quality problems caused by unqualified incoming materials during the production process, various raw materials need to be inspected before entering the factory. Among them, the chip is the most important, which is directly related to whether the product can realize its basic functions.

[0003] At present, in order to strengthen product quality control, it is necessary to add detection methods during incoming material inspection to detect defective incoming materials in advance and prevent them from entering the production process. However, the incoming materials include many types of materials, including power chips, cables, LEDs, panels, buzzers, ADCs, DACs and other components. Since each component requires independent design of corresponding tooling and circuits, and each material requires disassembly and assembly of cables, this will greatly affect the efficiency and reliability of incoming material inspection.

[0004] Therefore, it is necessary to design a device that is convenient for unified inspection of incoming materials, reduce the steps of disassembly and assembly, and improve the detection efficiency. At the same time, it can also be applied to the test and analysis of some defective components or raw materials encountered in the production process. Summary of the invention

[0005] In order to solve the technical problems in the background technology, the present invention provides a multifunctional incoming material inspection device, including a tooling board and a power module arranged on the tooling board, and a plurality of test modules can be detachably installed on the tooling board, and the test modules include:

[0006] Optocoupler test module: comprising an optocoupler test circuit consisting of a first power switch, an optocoupler socket for plugging in the optocoupler to be tested, a first light emitting diode and a battery connected in sequence, for testing the on-off performance of the optocoupler;

[0007] Digital tube test module: comprising a digital tube test circuit consisting of a second power switch and a digital tube socket for plugging in the digital tube to be tested, for testing the display performance of the digital tube;

[0008] LED lamp test module: comprising an LED lamp test circuit consisting of a third power switch and an LED lamp socket for plugging in the LED lamp to be tested, for testing the luminous performance of the LED lamp;

[0009] Buzzer test module: comprising a buzzer test circuit consisting of a fourth power switch and a buzzer pin connector for plugging in the buzzer to be tested, for testing the sound performance of the buzzer;

[0010] The cable test module includes a cable test circuit composed of a fifth power switch, a second light emitting diode, and a cable pin connector for connecting the cable to be tested, and is used to test the conductivity and line sequence of the cable;

[0011] Panel test module: comprising a panel test circuit consisting of a sixth power switch, a third light emitting diode and a panel socket for connecting the panel to be tested, for testing the switch performance of the panel;

[0012] The power chip test module includes a power chip test circuit composed of a seventh power switch, a chip test socket for mounting the power chip to be tested, and a first voltage detection port, and is used to test the voltage output performance of the power chip;

[0013] The digital-to-analog converter test module includes a digital-to-analog converter test circuit composed of an eighth power switch, a first single-chip microcomputer, a chip test socket for mounting the digital-to-analog converter to be tested, and a second voltage detection port;

[0014] The analog-to-digital converter test module includes an analog-to-digital converter test circuit composed of a ninth power switch, a second single-chip microcomputer, a chip test socket for mounting the analog-to-digital converter to be tested, a first sensor chip, and a communication detection port;

[0015] The operational amplifier test module includes a digital-to-analog converter test circuit consisting of a tenth power switch, a second sensor chip, a chip test socket for mounting the operational amplifier to be tested, and a third voltage detection port.

[0016] Furthermore, the power module includes a power input terminal, a power management chip, a first voltage conversion chip and a second voltage conversion chip. The input end of the power management chip is connected to the power input terminal to convert the 8-24V voltage into +7.4V and output it to the first voltage conversion chip and the second voltage conversion chip respectively. The first voltage conversion chip is used to convert the +7.4V voltage into a +5V output, and the second voltage conversion chip is used to convert the +7.4V voltage into a +3.3V output.

[0017] Further, in the optical coupler test module, one end of the optical coupler socket is connected to the output end of the first voltage conversion chip through the first power switch, the positive electrode of the battery is connected to the other end of the optical coupler socket through the first light-emitting diode, the negative electrode is grounded, and a redundant power supply interface is provided between the positive electrode of the battery and the first light-emitting diode;

[0018] During the test, the optical coupler to be tested is installed in the optical coupler socket. When the first power switch is closed, if the light emitting diode emits light, it is determined that the on-off performance of the optical coupler to be tested is normal.

[0019] Furthermore, the digital tube test module includes a four-digit eight-segment digital tube test submodule and a single-digit eight-segment digital tube test submodule. When the second power switch is closed, if the digital tube to be tested displays 8 and the decimal point is lit, it is determined that the display function of the digital tube to be tested is normal;

[0020] In the panel test module, the switch of the panel to be tested and the corresponding third light-emitting diode constitute a panel switch sub-circuit. When the sixth power switch and the switch of the panel to be tested are closed, if the third light-emitting diode on the corresponding switch sub-circuit lights up, it is determined that the switch performance of the panel to be tested is normal.

[0021] The LED lamp test module includes a two-pin LED lamp test submodule, a common anode two-color lamp test submodule and a common cathode two-color lamp test submodule. When the third power switch is closed, if the corresponding light of the LED lamp to be tested is on, the luminous performance of the LED lamp to be tested is normal;

[0022] The buzzer test module includes a +5V buzzer test submodule and a +3.3V buzzer test submodule. When the fourth power switch is closed, if the buzzer to be tested sounds, the sound performance of the buzzer to be tested is normal.

[0023] Further, the cable test module includes a cable continuity test submodule and a cable line sequence test submodule;

[0024] In the cable conductivity test submodule, the connector at one end of the cable to be tested is connected to the cable pin connector, and the other end is grounded to form multiple conductivity test sub-loops. When the fifth power switch is closed, if the second light-emitting diode lights corresponding to each conductivity test sub-loop are all on, it is determined that the connectivity function of the cable to be tested is normal;

[0025] In the cable wire sequence test sub-module, the two ends of the cable to be tested are respectively plugged into the cable pin connectors to form multiple wire sequence test sub-loops with multiple sub-loop switches. When the fifth power switch and the corresponding sub-loop switch are closed, if only the second light-emitting diode corresponding to the sub-loop with the closed switch is on, it is judged that the wire sequence of the cable to be tested is normal.

[0026] Furthermore, in the digital-to-analog converter test module, the power pin of the first single-chip microcomputer is connected to the power module through the eighth power switch, and the digital output pin of the first single-chip microcomputer is connected to the input end of the digital-to-analog converter chip to be tested, the output end of the digital-to-analog converter chip to be tested is connected to the second voltage detection port, and the second voltage detection port is connected to a voltmeter.

[0027] Further, in the analog-to-digital converter test module, the power supply module is connected to the power pin of the second single-chip microcomputer through the voltage conversion circuit and the ninth power switch in sequence, and the power supply module is connected to the power pin of the first sensor chip through the first voltage conversion circuit, the data output end of the first sensor chip is connected to the second single-chip microcomputer through the analog-to-digital converter to be tested, and the data output end of the second single-chip microcomputer is connected to the communication detection port.

[0028] Furthermore, in the operational amplifier test module, the power pin of the second sensor chip is connected to the power module through the tenth power switch and the second voltage conversion circuit, the data output end of the second sensor chip is connected to the third voltage detection port through the operational amplifier test group to be tested, and the third voltage detection port is connected to the voltmeter.

[0029] Furthermore, the power chip test module also includes a third single-chip microcomputer, a third sensor chip, a transistor and a relay. The power module is connected to the power pin of the third single-chip microcomputer through the seventh power switch, the power chip to be tested and the third voltage conversion circuit in sequence. The base of the transistor is connected to the signal control pin of the third single-chip microcomputer, the emitter is grounded, and the collector is connected to the output end of the third voltage conversion circuit through the coil part of the relay. One end of the switch part of the relay is connected to the power module, and the other end is connected to the first voltage detection port. The first voltage detection port is connected to the voltmeter, and the data output end of the third sensor chip is connected to the third single-chip microcomputer.

[0030] Furthermore, the device also includes a chip function integration test module, which is used to uniformly test the transistor to be tested, the sensor chip to be tested, the voltage-current converter chip to be tested, the voltage reference chip to be tested and the digital-to-analog converter chip to be tested. The module includes a current detection port, a chip mounting seat, a fourth single-chip microcomputer, a fourth sensor chip, and the power supply module is connected to the voltage reference chip to be tested through the current detection port. The voltage reference chip to be tested is respectively connected to the sensor chip to be tested, the digital-to-analog converter chip to be tested and the fourth single-chip microcomputer for power supply. The base and emitter of the transistor to be tested are respectively connected to the corresponding pins of the voltage-current converter chip to be tested, and the collector is connected to the current detection port. The data output pin of the fourth sensor chip is connected to the fourth single-chip microcomputer, and the fourth single-chip microcomputer is connected to the digital input terminal of the digital-to-analog converter chip to be tested. The voltage output terminal of the digital-to-analog converter chip to be tested is connected to the voltage input terminal of the voltage-current converter chip to be tested, and the current output terminal of the voltage-current converter chip to be tested is connected to the current detection port.

[0031] Compared with the prior art, the present invention has the following advantages:

[0032] The invention provides a multifunctional material supply device suitable for the production of inclination sensors. The device adopts a modular and detachable component design, can realize functional testing of various component materials (including optical couplers, digital tubes, LED lamps, buzzers, cables, panels, power chips, digital-to-analog converters, operational amplifiers, analog-to-digital converters and / or chip function integration), and can also perform test analysis on some defective components or raw materials encountered in the production process. The device adopts a modular setting, each module is controlled by a corresponding power switch, can be operated independently or several modules can be operated simultaneously. When it is necessary to detect components of the same type but different models, it is only necessary to replace the corresponding chip test seat and the supporting circuit, or add a new detection module to a tooling board. The device is expandable, improveable and replaceable, and the chip test seat can also test its function without damaging the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is the circuit schematic diagram of the multifunctional incoming material inspection device;

[0034] Figure 2 This is the circuit schematic diagram of the power module;

[0035] Figure 3 This is the circuit schematic diagram of the optocoupler test module;

[0036] Figure 4 This is the circuit schematic diagram of the four-digit eight-segment digital tube test submodule;

[0037] Figure 5 This is the circuit diagram of a four-digit eight-segment digital tube;

[0038] Figure 6 This is the circuit schematic diagram of the eight-segment digital tube test submodule;

[0039] Figure 7 This is the circuit diagram of an eight-segment digital tube;

[0040] Figure 8 This is the circuit schematic diagram of the two-pin LED lamp test submodule;

[0041] Fig. 9 This is the circuit schematic diagram of the common anode two-color lamp test submodule;

[0042] Fig.10 This is the circuit schematic diagram of the common cathode two-color lamp test submodule;

[0043] Fig.11a This is the circuit schematic diagram of the +5V buzzer test submodule;

[0044] Fig.11bThis is the circuit schematic diagram of the +3.3V buzzer test submodule;

[0045] Fig.12 This is the circuit schematic diagram of the cable continuity test submodule;

[0046] Fig.13 It is the circuit schematic diagram of the cable line sequence test submodule;

[0047] Fig.14a A circuit schematic diagram of the first panel test submodule;

[0048] Fig.14b is the circuit schematic diagram of the first panel;

[0049] Fig.15a A circuit schematic diagram of the second panel test submodule;

[0050] Fig.15b is the circuit schematic diagram of the second panel;

[0051] Fig.16a A circuit schematic diagram of the third panel test submodule;

[0052] Fig.16b This is the circuit schematic diagram of the third panel;

[0053] Fig.17a The circuit schematic diagram of the fourth panel test submodule;

[0054] Fig.17b The circuit schematic diagram of the fourth panel;

[0055] Fig.18a The circuit schematic diagram of the fifth panel test submodule;

[0056] Fig.18b This is the circuit schematic diagram of the fifth panel;

[0057] Fig.19 A circuit schematic diagram of the first power chip test submodule;

[0058] Fig. 20 A circuit schematic diagram of a second power chip test submodule;

[0059] Fig.21 A circuit schematic diagram of the third power chip test submodule;

[0060] Fig. 22 A circuit schematic diagram of a fourth power chip test submodule;

[0061] Fig.23 A circuit schematic diagram of the power supply part of the fifth power chip test submodule;

[0062] Fig.24A circuit schematic diagram of the control part of the fifth power chip test submodule;

[0063] Fig.25 The circuit schematic diagram of the digital-to-analog converter test module;

[0064] Fig.26 The circuit schematic diagram of the operational amplifier test module;

[0065] Fig. 27 The circuit schematic diagram of the analog-to-digital converter test module;

[0066] Fig.28 This is the circuit schematic diagram of the chip function integration test module. DETAILED DESCRIPTION

[0067] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0068] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0069] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0070] The terms “first”, “second”, etc. are only used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0071] In the description of this embodiment, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this embodiment can be understood according to specific circumstances.

[0072] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0073] Example

[0074] like Figure 1 As shown, the present invention provides a multifunctional incoming material inspection device for realizing functional inspection of various incoming materials. The device includes a tooling board, power modules detachably arranged on the tooling board, and optocoupler test modules, digital tube test modules, LED lamp test modules, buzzer test modules, cable test modules, panel test modules, power chip test modules, digital-to-analog converter test modules, operational amplifier test modules, analog-to-digital converter test modules and chip function integration test modules respectively connected to the power modules. The functions and circuits of each module are described in detail below.

[0075] (1) Figure 2 As shown, the power module is used to provide 8-24V, +7.4V, +3.3V, and +5V voltages to other modules in the device respectively. The module includes a power input terminal P20, a power management chip U3, a first voltage conversion chip U2, and a second voltage conversion chip U4. The input end of the power management chip U3 is connected to the power input terminal P20, and the +7.4V voltage output by the output end of U3 is respectively output through the first voltage conversion chip U2 to output a +5V voltage and through the second voltage conversion chip U4 to output a +3.3V voltage.

[0076] The power module also includes a switch S29, a recoverable fuse F1 (preferably 500mA / 30V, for overcurrent protection), an overvoltage protection device D34 (transient suppression diode, preferably 40V overvoltage protection), a one-way conducting diode D32 (for reverse connection protection), an input filter capacitor C4 of pin 1 vin of the power management chip U3, an output rectifier diode D35 of the power management chip U3, an output inductor L1 and output capacitors C8 and C10, a feedforward capacitor C3, an input filter capacitor C5 of the first voltage conversion chip U2, output capacitors C1 and C2 of the second voltage conversion chip U4, and output filter capacitors C6, C7 and C9 of the second voltage conversion chip U4.

[0077] In this example, the power management chip U3 adopts TD1509PR to convert the 8-30V voltage input into a +7.4V voltage output, and Vout=1.23*(1+R165 / R166), the first voltage conversion chip U2 adopts LM1117-5.0 to convert the +7.4V voltage input into a +5V voltage output, and the second voltage conversion chip U4 adopts LM1117-3.3 to convert the +7.4V voltage input into a +3.3V voltage output.

[0078] (2) Figure 3As shown, the optocoupler test module is used to detect the optocoupler element. The input end of the module is connected to the +5V voltage output end of the power module. The input end is connected to pin 1 of the 2*2 pin connector P9 through switch S11, touch switch S10, and resistor R65 in sequence. The negative pole of the battery BT2 is grounded, and the positive pole is connected to pin 2 of the 2*2 pin connector P9 through light-emitting diode D7 and resistor R62 in sequence. Pins 3 and 4 of the pin connector P9 are grounded.

[0079] When testing the optocoupler, plug the optocoupler to be tested into the 2*2 pin connector P9 (pay attention to the installation direction). If the switch S11 is closed and the switch S10 is pressed, the light-emitting diode D7 is on, and the switch S10 is disconnected and the light-emitting diode D7 is off, the performance of the optocoupler to be tested is normal. J2 is a redundant design interface. When the battery is not used, pin 1 of J2 can be connected to a +3.3V voltage for testing.

[0080] (3) The digital tube test module includes a four-digit eight-segment digital tube test submodule and a single-digit eight-segment digital tube test submodule, which are used to perform functional tests on the four-digit eight-segment digital tube and the single-digit eight-segment digital tube respectively.

[0081] like Figure 4 As shown, the four-digit eight-segment digital tube test submodule includes a digital tube socket U28, which is connected to the +5V voltage output terminal of the power module through a switch S20 to realize +5V power supply. Figure 5 When the switch S20 (not shown) is closed and powered, if the four-digit eight-segment digital tube displays four 8s and all decimal points are lit, it is determined that the display function of the four-digit eight-segment digital tube is normal.

[0082] like Figure 6 As shown, the eight-segment digital tube test submodule includes a digital tube socket U29, which is connected to the +5V voltage output terminal of the power module through a switch S18 to realize +5V power supply. Figure 7 When the switch S18 (not shown) is closed and powered, if the eight-segment digital tube displays 8 and the decimal point is fully lit, it is determined that the display function of the eight-segment digital tube is normal.

[0083] It can be predicted that the present invention can not only detect single-digit eight-segment digital tubes and four-digit eight-segment digital tubes, but also only needs to replace the corresponding sockets if it is to detect other types of digital tubes.

[0084] (4) The LED lamp test module includes a two-pin LED lamp test submodule, a common anode two-color lamp test submodule and a common cathode two-color lamp test submodule, which are used to test the two-pin LED lamp, the common anode two-color lamp and the common cathode two-color lamp respectively.

[0085] like Figure 8 As shown, the two-pin LED lamp test submodule includes a switch S7, an LED lamp socket P7 and a current limiting resistor. The LED lamp socket P7 is provided with multiple parallel terminal contacts, each terminal contact is installed with a two-pin LED lamp to be tested, and one end corresponds to a 1K ohm current limiting resistor connected in parallel and then grounded, and the other end is connected in parallel to the +5V voltage output terminal of the power module through the switch S7.

[0086] During the test, the two-pin LED lamp to be tested is plugged into the LED lamp socket P7 (a 30*2 socket is used in this example), and the switch S7 is closed. If the two-pin LED lamp is on, it is judged that the two-pin LED lamp to be tested is functioning normally.

[0087] like Fig. 9 As shown, the common anode bicolor lamp test submodule includes a socket P4, a socket P5 and a socket P6 for respectively plugging in the three pins of the common anode bicolor lamp, wherein the anode pin of the common anode bicolor lamp is inserted into the socket P5 and connected to the +5V voltage output terminal of the power module, the green light cathode pin of the common anode bicolor lamp is inserted into the socket P4 and grounded through the switch S16, the red light cathode pin of the common anode bicolor lamp is inserted into the socket P6 and grounded through the switch S15, and the socket P4, the socket P5 and the socket P6 are all provided with multi-way terminal contacts, which can meet the simultaneous detection of multiple common anode bicolor lamps.

[0088] During testing, the three pins of the common anode bicolor lamp to be tested are correspondingly plugged into sockets P4, P5 and P6. When switch S16 is closed alone, the green light turns on; when switch S15 is closed alone, the red light turns on. When both S16 and S15 are closed and the light turns orange, it is judged that the common anode bicolor lamp to be tested is functioning normally.

[0089] like Fig.10 As shown, the common cathode bicolor lamp test submodule includes a socket P1, a socket P2 and a socket P3 for respectively plugging in the three pins of the common cathode bicolor lamp, wherein the cathode pin of the common cathode bicolor lamp is inserted into the socket P2 and grounded, the red light anode pin of the common cathode bicolor lamp is inserted into the socket P1 and connected to the +5V voltage output end of the power module through the switch S13, the green light anode pin of the common cathode bicolor lamp is inserted into the socket P3 and connected to the +5V voltage output end of the power module through the switch S14, and the socket P1, the socket P2 and the socket P3 are all provided with multi-way terminal contacts, which can meet the simultaneous detection of multiple common cathode bicolor lamps.

[0090] During testing, the three pins of the common cathode bicolor lamp to be tested are correspondingly plugged into sockets P1, P2 and P3. When switch S14 is closed alone, the green light turns on; when switch S13 is closed alone, the red light turns on. When both S13 and S12 are closed and the light turns orange, it is determined that the common cathode bicolor lamp to be tested is functioning normally.

[0091] (5) Fig.11a and 11b As shown, the buzzer test module can detect two types of buzzers with different voltages (5V buzzer and 3.3V buzzer) respectively. The buzzer test module is correspondingly provided with a 4*2 pin connector P36 and a 4*2 pin connector P35. Pins 7 and 8 of the 4*2 pin connector P36 and the 4*2 pin connector P35 are grounded, and pin 2 corresponds to the +5V voltage output terminal and the +3.3V voltage output terminal of the power module.

[0092] During the detection, the 5V buzzer and 3.3V buzzer to be tested are connected to the corresponding pins 1 and 7 of the 4*2 pin connector P36 and the 4*2 pin connector P35 respectively. If the 5V buzzer and 3.3V buzzer to be tested sound, it is judged that the buzzer to be tested is functioning normally.

[0093] (6) The cable test module includes a cable conductivity test submodule and a cable line sequence test submodule, which are used to respectively detect whether the conductivity and line sequence of the cable to be tested (with a connector at one end and / or with connectors at both ends) are correct.

[0094] like Fig.12 As shown, the cable conductivity test submodule is used to detect the conductivity of the cable to be tested. The +5V voltage output end of the power module is connected to the input end of the module, and is connected to the connector P15 through the switch S28, the resistor R161 and a plurality of light-emitting diodes connected in parallel (D23, D24, D27, D30, D33) in sequence. In this example, there are 5 light-emitting diodes (the number can be adjusted according to actual needs), which are respectively connected to the 5 pins of the connector P15. The cable to be tested (containing 5 core wires in this example) is connected to the connector P15 at one end with a connector, and the other end is connected in parallel and grounded. The terminal P13 is used to detect the voltage through a multimeter.

[0095] During the test, after connecting the cable to be tested to the connector P15, close the switch S28. If the five light-emitting diodes D23, D24, D27, D30, and D33 are all on, it is judged that the conductivity of the cable to be tested is qualified. If any light-emitting diode is not lit, the corresponding cable conductivity is unqualified.

[0096] like Fig.13As shown, the cable sequence test submodule is used to detect whether the sequence of the cable to be tested is welded correctly or whether there is a continuous welding phenomenon. The 8-30V power supply of the power module is connected to the input end of the module, and is connected to the anodes of multiple parallel light-emitting diodes (a total of 6 in this example, namely D40, D43, D46, D31, D54, and D56) through the switch S34. The cathode of each light-emitting diode is connected to the 6 pins on one side of the 6*2 pin connector P29 through a switch, and the 6 pins on the other side of the 6*2 pin connector P29 are grounded through the corresponding 6 light-emitting diodes (D42, D44, D48, D53, D53, and D57) and a 1K ohm current limiting resistor.

[0097] During the detection, one end of the cable to be tested is connected to the 6 pins (pins 1, 3, 5, 7, 9, and 11) on one side of the 6*2 pin connector P29, and the other end is connected to the 6 pins (pins 2, 4, 6, 8, 10, and 12) on the other side of the 6*2 pin connector P29. Taking the first circuit as an example, after closing switches S34 and S35, if only light-emitting diodes D40 and D42 are illuminated, and the other light-emitting diodes are not illuminated, it indicates that there is no misalignment in the welding sequence of the core wires and no continuous welding errors. If the light-emitting diodes D40 and D42 are not illuminated, it indicates that the core wire is broken. If, in addition to the light-emitting diodes D40 and D42, one or more of the other light-emitting diodes D44, D48, D53, D53, and D57 are illuminated, it proves that the core wire is continuously welded with the core wire where the light-emitting diode is located, and so on to complete the detection of all core wires.

[0098] (7) Panel test module, used to detect the switch functions of various types of panels. In this example, the panel test module can detect a total of 5 different types of panels. The specific detection circuit and detection method are as follows.

[0099] like Fig.14a As shown, the +5V voltage output terminal of the power supply module is connected to the input terminal of the first panel test submodule, and is directly connected to pin 1 of connector P32 through switch S39 and diode D47 in sequence, and is also connected to pins 2 and 3 of connector P32 through light-emitting diodes D50 and D52 respectively, and pin 4 of connector P32 is grounded.

[0100] like Fig.14b As shown, pin 1 of the connection terminal P30 of the first panel under test is grounded through a light emitting diode D45, pin 2 is grounded through a touch switch S40, pin 3 is grounded through a touch switch S42, and pin 4 is directly grounded.

[0101] During testing, connect connector P32 to connection terminal P30 of the first panel under test, close switch S39, and light-emitting diode D45 lights up, indicating that the power is on. Press touch switches S40 and S42 on the first panel under test respectively. If the corresponding light-emitting diodes D50 and D52 light up, the first panel under test is judged to be qualified.

[0102] like Fig.15a As shown, the +5V voltage output terminal of the power module is connected to the input terminal of the second panel test submodule, and is connected to pins 1 and 2 of connector P25 through switch S30 and diode D36 respectively through light-emitting diodes D37 and D38, and pin 3 of connector P25 is grounded.

[0103] like Fig.15b As shown, pin 1 of the connection terminal P26 of the second panel under test is grounded via a touch switch S31, pin 2 is grounded via a touch switch S32, and pin 3 is directly grounded.

[0104] During testing, the connector P25 is connected to the connection terminal P26 of the second panel under test, the switch S30 is closed, and the touch switches S31 and S32 on the second panel under test are pressed respectively. If the corresponding light-emitting diodes D37 and D38 light up, the second panel under test is judged to be qualified.

[0105] like Fig.16a As shown, the +5V voltage output terminal of the power module is connected to the input terminal of the third panel test submodule, and is connected to pins 1 and 2 of connector P25 through switch S36 and diode D25 respectively through light-emitting diodes D26 and D28, pin 3 of connector P17 is grounded through resistor R163, pins 4 and 6 are connected to the cathode of diode D25, and pins 5 and 7 are grounded.

[0106] like Fig.16b As shown, pin 1 of the connection terminal P16 of the third panel under test is grounded through a touch switch S25, pin 2 is grounded through a touch switch S27, pin 3 is directly grounded, pin 4 is connected to pin 5 through a light-emitting diode D29 and a resistor R162 in sequence, and pin 6 is connected to pin 7 through a light-emitting diode D31 and a resistor R164 in sequence.

[0107] During testing, the connector P17 is connected to the connection terminal P16 of the third panel under test, the switch S26 is closed, and the touch switches S25 and S27 on the third panel under test are pressed respectively. If the corresponding light-emitting diodes D26 and D28 light up, the third panel under test is judged to be qualified.

[0108] like Fig.17aAs shown, the +5V voltage output terminal of the power module is connected to the input terminal of the fourth panel test submodule, and is connected to pins 1, 3, 5, 6, and 7 of connector P25 through light-emitting diodes D17, D19, D20, D21, and D22 respectively, and pins 2 and 4 of connector P12 are grounded through resistors R158 and R160 respectively, and pin 8 is directly grounded.

[0109] like Fig.17b As shown, pin 1 of the connection terminal P11 of the fourth panel under test is grounded through the touch switch S17, pin 3 is grounded through the touch switch S21, pin 2 is grounded through the diode D16 and the resistor R156 in sequence, pin 4 is grounded through the diode D18 and the resistor R159 in sequence, pin 5 is grounded through the touch switch S22, pin 6 is grounded through the touch switch S23, pin 7 is grounded through the touch switch S24, and pin 8 is directly grounded.

[0110] During testing, connect connector P12 to connection terminal P11 of the fourth panel under test, close switch S19, and light-emitting diodes D16 and D18 of the fourth panel under test will light up, indicating that the power is on. Press touch switches S17, S21, S22, S23 and S24 on the fourth panel under test respectively. If the corresponding light-emitting diodes D17, D19, D20, D21 and D22 light up, the fourth panel under test is judged to be qualified.

[0111] like Fig.18a As shown, the +5V voltage output terminal of the power module is connected to the input terminal of the fifth panel test submodule, and is connected to pins 1-6 of the connector P10 through light-emitting diodes D3, D4, D5, D6, D8 and D10 respectively after passing through switch S5 and resistor R157 in sequence, and pins 7-10 of the connector P10 are connected in parallel between the switch S5 and resistor R157 through resistors R106, R118, R129 and R132 respectively, and pin 11 is directly grounded.

[0112] like Fig.18b As shown, pins 1-6 of the connection terminal P8 of the fifth panel under test are grounded through touch switches S1, S4, S6, S8, S9, and S12 respectively, pin 7 is grounded through diode D9 and resistor R94 in sequence, pin 8 is grounded through diode D11 and resistor R123 in sequence, pin 9 is grounded through diode D12 and resistor R137 in sequence, pin 10 is grounded through diode D13 and resistor R144 in sequence, and pin 11 is directly grounded.

[0113] During testing, connect connector P10 to connection terminal P8 of the fifth panel under test, close switch S5, and light-emitting diodes D9, D11, D12, and D13 of the fifth panel under test will light up, indicating that the power has been turned on. Press touch switches S1, S4, S6, S8, S9, and S10 on the fifth panel under test respectively. If the corresponding light-emitting diodes D3, D4, D5, D6, D8, and D10 light up, the fifth panel under test is judged to be qualified.

[0114] (8) A power chip test module is used to detect the functions of various types of power chips. In this example, the power chip test module can detect a total of 5 different types of power chips. The specific detection circuit and detection method are as follows.

[0115] like Fig.19 As shown, the first power chip test submodule is used to test the LT1776IS8 power chip. During the test, the LT1776IS8 power chip to be tested is installed on the power chip test socket U5, and the No. 5 pin of the power chip test socket U5 is connected to the 8-30V voltage of the power module through the switch S36. The LT1776IS8 power chip converts the input 8-30V voltage into a +7V output, then Vout=1.23*(1+R173 / R172), No. 3 pin is the +7V voltage output terminal, D41 is the output rectifier diode, L2 is the output inductor, C13, C14, and C12 are the output filter capacitors, respectively, No. 1 pin of the LT1776IS8 power chip U5 is grounded through the capacitor C15, and No. 8 pin is grounded through C18 and R176, and P27 is a terminal block for connecting different loads to test the load capacity of the LT1776IS8 power chip.

[0116] like Fig. 20 As shown, the second power chip test submodule is used to test the TD1509PR power chip. During the test, the TD1509PR power chip to be tested is installed on the power chip test socket U6, and the 8-30V voltage of the power module is connected to pin 1 of the TD1509PR power chip through the switch S33. The TD1509PR power chip converts the input 8-30V voltage into a +6.8V output, then Vout=1.23*(1+R169 / R174), pin 3 is the +6.8V voltage output terminal, D49 is the output rectifier diode, L3 is the output inductor, C16 and C17 are the output filter capacitors respectively, C11 is the feedforward capacitor (can be unsoldered), and P28 is a terminal block for connecting different loads to test the load capacity of the TD1509PR power chip.

[0117] like Fig.21As shown, the third power chip test submodule is used to test the REF195 power chip. The +7.4V voltage output terminal of the power module is connected to the No. 2 and No. 3 pins of the REF195 power chip through the switch S46 and the inductor L4. C21, C22, and C23 are input filter capacitors, C24 and C20 are output filter capacitors, the terminal P34 is connected to the positive pole of the voltmeter, and the terminal P37 is connected to the negative pole of the voltmeter.

[0118] During the test, install the REF195 power chip on the power chip test socket U7, close the switch S46, connect the positive probe of the voltmeter to P34 and the negative probe to P37, and measure whether the output voltage range of pin 6 of the REF195 power chip is within the range of 5±0.01V. In addition, add a 5K load for testing to detect whether the output voltage of pin 6 is within the range of 5±0.01V. If so, it is judged that the chip is functioning normally.

[0119] like Fig. 22 As shown, the fourth power chip test submodule is used to test the TPS780270200DDCT power management chip. During the test, the TPS780270200DDCT power management chip to be tested is installed on the power chip test socket U7, and the +3.3V voltage output terminal of the power module is connected to the No. 1, No. 3 and No. 4 pins of the TPS780270200DDCT chip through the switch S45. C25 and C29 are input filter capacitors, and C26, C27, and C28 are input filter capacitors. It is the output filter capacitor, pin 2 of the TPS780270200DDCT power management chip is grounded, pin 5 is the converted voltage output terminal, connected to terminal P33, and diode D58 is connected between switch S45 and terminal P33 to prevent the reverse potential from affecting the power management chip. During detection, by detecting the output voltage range of terminal P33, if it is within the range of 2±0.04V, it indicates that the TPS780270200DDCT power management chip is functioning normally.

[0120] like Fig.23 and 24As shown, the fifth power chip test submodule is used to implement testing through actual circuits when changing the chip to determine whether the chip function is normal. The 8-30V voltage Vin of the power module is connected to the chip test socket U12 through the switch S47 and the anti-reverse connection diode D59 (in this example, the chip test socket U12 is installed with the buck regulator chip LM2594), C39 is the input capacitor of the chip test socket U12, and the buck regulator chip LM2594 is used to convert the 8-30V voltage into a +7V output, then Vout = 1.23*(1+R188 / R189), D60 is the output rectifier diode, L8 is the output inductor, C41 and C46 are output capacitors, C40 is the feedforward capacitor (can be unsoldered), capacitor C52 is the input filter capacitor of chip U14 (LM1117-5.0 in this case), C49, C50, and C51 are the output filter capacitors of chip U14, chip U14 converts the +7V voltage output by the buck regulator chip LM2594 into +5V and outputs it to the coil of relay K1, C46 and C52 are the input capacitors of chip U14, and C49, C50, and C51 are the output capacitors of chip U14.

[0121] Pins 5, 17 and 38 of the single-chip computer U9 are connected to +5V, pins 6, 18, 28 and 39 are grounded, J3 is the program burning port, +5V is connected to pin 4 of the single-chip computer U9 through resistor R181, capacitors C34, C36 and crystal oscillator Y1 adjust the operating frequency of the single-chip computer, J5 is the communication interface,

[0122] Pin No. 40 PB0 of the single-chip microcomputer U9 is connected to the base of the transistor Q1, and the on and off of the relay K1 is controlled by controlling the switch of the transistor Q1. Pins No. 4 and 8 of the dual-axis inclination sensor chip U10 are connected to +5V, C31 is a filter capacitor, pins No. 3 and 7 are grounded, and pin No. 1 of U10 is connected to pin No. 30 of the single-chip microcomputer U9 through resistor R182. Pins No. 2 and No. 5 are respectively connected to pins No. 42 and No. 44 of the single-chip microcomputer U9 to send inclination data to the single-chip microcomputer U9.

[0123] During the test, the buck regulator chip LM2594 to be tested is installed on the chip test socket U12, and the switch S47 is closed to supply power. When the angle detected by the dual-axis inclination sensor chip U10 exceeds the threshold, the microcontroller U9 controls the transistor Q1 to turn on through pin 40 PB0. If the coil power switch of relay K1 is closed, it is detected through the voltage detection port J7 that pin 1 is de-energized and pin 3 is energized, and there is no abnormal sound of rapid attraction and disconnection, then the buck regulator chip LM2594 is functioning normally.

[0124] (9) Fig.25As shown, the DAC test module is used to implement functional testing of the AD5310 / 5320 chip. The +5V voltage output point of the power module supplies power to the microcontroller U13 through the switch S48, the light-emitting diode LED2 and the resistor R193 act as power indicators, C48 and C47 are input filter capacitors, and U11 is a chip test socket for placing the AD5310 / 5320 chip to be tested.

[0125] The 3rd and 7th pins of the dual-axis tilt sensor chip U15 are grounded, the 8th and 4th pins are connected to +5V, and C45 is a filter capacitor. The 1st pin of U15 is connected to the 19th pin of the microcontroller U13 through the resistor R192, the 2nd pin of U15 is connected to the 32nd pin of the microcontroller U13, and the 5th pin of U15 is connected to the 12th pin of the microcontroller U13.

[0126] The single-chip computer U13 burns the test program through the burning port J8. The capacitors C43, C53 and the crystal oscillator Y2 jointly adjust the working frequency of the single-chip computer U13. The pins 3, 5 and 21 of the single-chip computer U13 are grounded, the pins 4, 6 and 18 are connected to +5V, and the pin 20 is grounded through the capacitor C42.

[0127] Pin 2 of the chip test socket U11 is grounded, pin 3 is connected to +5V, C38 is a filter capacitor, pins 4, 5, and 6 are connected to pins 25, 24, and 23 of the microcontroller U13 respectively, and pin 1 of the chip test socket U11 is connected to Vyout of the voltage detection port J4 through resistor R185.

[0128] During measurement, a voltmeter is used to test the voltage Vyout of pin 4 of the voltage detection port J4. When the dual-axis inclination sensor chip U15 is rotated within the set range (for example, from 0° to 90°), if the voltage variation range collected by the voltmeter increases between 0.05 and 4.95V, it is judged that the AD5310 / 5320 chip under test is functioning normally.

[0129] (10) Fig.26 As shown, the operational amplifier test module is used to implement functional testing of different types of operational amplifiers (OP747 chips in this example). The module includes chip test sockets U22 (four are shown in the figure, U22A, U22B, U22C, and U22D) for placing OP747 chips, dual-axis tilt sensor chip U23 (model SCA100T-D02) and voltage reference chip U26 (MAX6043C is used in this example).

[0130] The 24V voltage Vin of the power module is connected to pin 4 of U26 through switch S50 and anti-reverse polarity diode D64. C88 is the input filter capacitor of U26. The voltage reference chip U26 converts the 8-30V voltage into 5V output. C86 and C89 are the output filter capacitors of U26. Pins 1, 2, 3, 4, 7 and 8 of U23 are left floating, pins 6, 9 and 10 are grounded, pin 5 is connected to pin 3 of U22, and pin 11 is connected to pin 12 of U22.

[0131] Pin 11 of U22 is grounded, pin 4 is connected to VCC, pins 5 and 10 are connected to +5V, C85 and C101 are filter capacitors at the 5V input of U22, C100 is a filter capacitor to ground at the output of chip test socket U22 Vy, C104 is a filter capacitor to ground at the output of chip test socket U22 Vx, C93 and C94 are filter capacitors, C78, ​​C85 and C76 are filter capacitors, and the output of chip test socket U22 Vx and Vy are connected to pins 3 and 4 of voltage detection port J11 respectively. The output voltage is calculated as follows:

[0132] Vy=(R217+R216) / R218*(5-R209*Vout_2 / R213)

[0133] Vx=(R199+R198) / R203*(5-R202*Vout_1 / R208)

[0134] During the test, the closed switch S50 is powered by 24V from the power module, and a voltmeter is used to test the voltage Vx or Vy of pins 3 and 4 of the terminal J11. When the dual-axis inclination sensor chip U23 is rotated, if the reading of the voltmeter changes within the range of 0 to 10V, it is judged that the operational amplifier to be tested is functioning normally.

[0135] (11) Fig. 27 As shown, the analog-to-digital converter test module is used to implement functional testing of different types of analog-to-digital converters (in this case, AD7799BRUZ / TSSOP16 or AD7798BRUZ / TSSOP16 chips). The module includes a chip test socket U18 for placing the analog-to-digital converter chip, a single-chip microcomputer U17, a reference voltage source chip U27 (REF195 is used in this case), and a dual-axis tilt sensor chip U19 (model SCA100T-D02).

[0136] The +7.4V voltage output terminal of the power module is connected to the No. 2 and No. 3 pins of U27 through the switch S52 and the inductor L9 in turn. C96, C97, and C98 are the input capacitors of U27. C99 and C95 are the output capacitors of U27. The No. 4 pin of U27 is connected to the signal ground through the inductor L11 and to the power ground through the inductor L10. The No. 6 pin of U27 (outputting 5V voltage) is connected to the No. 12 pin of U19 for power supply. C56 and C60 are the The voltage input filter capacitor is connected to the signal ground. Pin 5 of U19 is connected to pin 5 of U18 through resistor R200. Pin 11 of U19 is connected to pin 7 of U18 through resistor R197. Pin 6 of U19 is connected to the signal ground. C59 and C57 are filter capacitors. Pin 1 of U19 is connected to pin 14 of U17. Pins 3 and 4 of U19 are connected to pins 15 and 16 of U17. Pin 7 of U19 is connected to pin 11 of U17.

[0137] Pins 6, 8, 10, and 12 of U18 are connected to the signal ground, and pin 11 is connected to the signal ground through resistor R196. Pin 13 of U18 is connected to VREF, C61 and C72 are filter capacitors, pin 14 is connected to +5V, C73 is a filter capacitor, and pins 1, 2, 16, and 15 of U18 are connected to pins 22, 21, 20, and 19 of U17 respectively.

[0138] Pins 6, 18, 28, and 39 of U17 are grounded, pins 5, 17, 27, and 38 are connected to +5V, C80 and C77 are filter capacitors, +5V is connected to pin 4 of U17 through resistor R221, C79 is a filter capacitor, capacitors C75, C82 and crystal oscillator Y5 adjust the operating frequency of the microcontroller, and J9 is the microcontroller burning port.

[0139] J10 is the serial communication detection port, which is connected to pins 9 and 10 of U17 (test angle output terminal) respectively. R222 and R223 are the corresponding serial port protection resistors to avoid burning the microcontroller by connecting to a high ground level.

[0140] During the test, place the analog-to-digital converter to be tested in the chip test socket U18, close the switch S52 to supply +7.4V, close the switch S51 to supply +5V, and if the test angle output by the serial communication detection port J10 is normal, it is judged that the analog-to-digital converter to be tested is functioning normally.

[0141] (12) Chip function integration test module, such as Fig.28As shown, the module can perform functional tests on five chips, namely, MJD41C / D-PAK (transistor Q2), SCA61T (single-axis tilt sensor chip), XTR115U / SO-8 (voltage-current converter chip), MAX6175AASA / SO-8 (voltage reference chip) and DAC7512N / 250 (digital-to-analog converter chip). The module includes terminal block P45, voltage-current converter chip test socket U20, voltage reference chip test socket U24, digital-to-analog converter chip test socket U21, microcontroller U16 and single-axis tilt sensor chip test socket U25.

[0142] The 8-24V voltage Vin of the power module is connected to the collector of transistor Q2 through the current detection port P45 and the anti-reverse connection diode D63. One end of capacitor C62 is connected to pin 1 of the current detection port P45, and the other end is connected to the ground. One end of C55 is connected to GND, and the other end is connected to the ground. D62 is an overvoltage protection diode, F3 is an overcurrent protection fuse, the base of transistor Q2 is connected to pin 5 of U20, and the emitter is connected to pin 6 of U20.

[0143] Pin 7 of U20 is connected to pin 2 of U24 through resistor R205, and pin 4 of U24 is grounded. Pin 6 of U24 is connected to pin 8 of U25 and pin 3 of U21 REF_1 respectively, C71, C90, C92 are filter capacitors of REF_1, C58, C87 are filter capacitors, C74, C68 are filter capacitors, pin 2 of U20 is connected to pin 1 of U21 through resistor R195, C69 and C70 are filter capacitors to ground, pin 2 of U21 is grounded, pin 4 is connected to pin 25 of U16, pin 5 is connected to pin 24 of U16, and pin 6 is connected to pin 23 of U16.

[0144] During the test, the corresponding chips to be tested are installed on the mounting base and powered on. An ammeter is connected to the current detection port P45. If the current collected by the ammeter meets the conditions (typical value: 3.845mA, maximum value: 3.870mA), the chip to be tested is judged to be functioning normally.

[0145] In summary, the present invention provides a multifunctional material incoming device suitable for the production of inclination sensors. The device adopts a modular and detachable component design, which can realize functional testing of various component incoming materials (including optocouplers, digital tubes, LED lights, buzzers, cables, panels, power chips, digital-to-analog converters, operational amplifiers, analog-to-digital converters and / or chip function integration), and can also perform test analysis of some defective components or raw materials encountered during the production process. The device adopts a modular setting, and each module is controlled by a corresponding power switch. It can be operated independently or several modules can be operated simultaneously. When it is necessary to detect components of the same type but different models, it is only necessary to replace the corresponding chip test seat and supporting circuits, or add a new detection module to the tooling board. It is expandable, improveable and replaceable, and the chip test seat can also test its function without damaging the chip.

[0146] The preferred specific embodiments of the present invention are described in detail above. It should be understood that a person skilled in the art can make many modifications and changes based on the concept of the present invention without creative work. Therefore, any technical solution that can be obtained by a person skilled in the art through logical analysis, reasoning or limited experiments based on the concept of the present invention on the basis of the prior art should be within the scope of protection determined by the claims.

Claims

1. A multifunctional incoming material inspection device, comprising a tooling board and a power module arranged on the tooling board, characterized in that: The tooling board can also be detachably mounted with a plurality of test modules, the test modules comprising: Optocoupler test module: comprising an optocoupler test circuit consisting of a first power switch, an optocoupler socket for plugging in the optocoupler to be tested, a first light emitting diode and a battery connected in sequence, for testing the on-off performance of the optocoupler; Digital tube test module: comprising a digital tube test circuit consisting of a second power switch and a digital tube socket for plugging in the digital tube to be tested, for testing the display performance of the digital tube; LED lamp test module: comprising an LED lamp test circuit consisting of a third power switch and an LED lamp socket for plugging in the LED lamp to be tested, for testing the luminous performance of the LED lamp; Buzzer test module: comprising a buzzer test circuit consisting of a fourth power switch and a buzzer pin connector for plugging in the buzzer to be tested, for testing the sound performance of the buzzer; The cable test module includes a cable test circuit composed of a fifth power switch, a second light emitting diode, and a cable pin connector for connecting the cable to be tested, and is used to test the conductivity and line sequence of the cable; Panel test module: comprising a panel test circuit consisting of a sixth power switch, a third light emitting diode and a panel socket for connecting the panel to be tested, for testing the switch performance of the panel; The power chip test module includes a power chip test circuit composed of a seventh power switch, a chip test socket for mounting the power chip to be tested, and a first voltage detection port, and is used to test the voltage output performance of the power chip; The digital-to-analog converter test module includes a digital-to-analog converter test circuit composed of an eighth power switch, a first single-chip microcomputer, a chip test socket for mounting the digital-to-analog converter to be tested, and a second voltage detection port; The analog-to-digital converter test module includes an analog-to-digital converter test circuit composed of a ninth power switch, a second single-chip microcomputer, a chip test socket for mounting the analog-to-digital converter to be tested, a first sensor chip, and a communication detection port; The operational amplifier test module includes a digital-to-analog converter test circuit consisting of a tenth power switch, a second sensor chip, a chip test socket for mounting the operational amplifier to be tested, and a third voltage detection port.

2. A multifunctional incoming material inspection device according to claim 1, characterized in that: The power module includes a power input terminal, a power management chip, a first voltage conversion chip and a second voltage conversion chip. The input end of the power management chip is connected to the power input terminal to convert the 8-24V voltage into +7.4V and output it to the first voltage conversion chip and the second voltage conversion chip respectively. The first voltage conversion chip is used to convert the +7.4V voltage into +5V output, and the second voltage conversion chip is used to convert the +7.4V voltage into +3.3V output.

3. A multifunctional incoming material inspection device according to claim 1, characterized in that: In the optical coupler test module, one end of the optical coupler socket is connected to the output end of the first voltage conversion chip through the first power switch, the positive electrode of the battery is connected to the other end of the optical coupler socket through the first light-emitting diode, the negative electrode is grounded, and a redundant power supply interface is provided between the positive electrode of the battery and the first light-emitting diode; During the test, the optical coupler to be tested is installed in the optical coupler socket. When the first power switch is closed, if the light emitting diode emits light, it is determined that the on-off performance of the optical coupler to be tested is normal.

4. A multifunctional incoming material inspection device according to claim 1, characterized in that: The digital tube test module includes a four-digit eight-segment digital tube test submodule and a single-digit eight-segment digital tube test submodule. When the second power switch is closed, if the digital tube to be tested displays 8 and the decimal point is lit, it is determined that the display function of the digital tube to be tested is normal; In the panel test module, the switch of the panel to be tested and the corresponding third light-emitting diode constitute a panel switch sub-circuit. When the sixth power switch and the switch of the panel to be tested are closed, if the third light-emitting diode on the corresponding switch sub-circuit lights up, it is determined that the switch performance of the panel to be tested is normal. The LED lamp test module includes a two-pin LED lamp test submodule, a common anode two-color lamp test submodule and a common cathode two-color lamp test submodule. When the third power switch is closed, if the corresponding light of the LED lamp to be tested is on, the luminous performance of the LED lamp to be tested is normal; The buzzer test module includes a +5V buzzer test submodule and a +3.3V buzzer test submodule. When the fourth power switch is closed, if the buzzer to be tested sounds, the sound performance of the buzzer to be tested is normal.

5. The multifunctional incoming material inspection device according to claim 1, characterized in that: The cable test module includes a cable continuity test submodule and a cable line sequence test submodule; In the cable conductivity test submodule, the connector at one end of the cable to be tested is connected to the cable pin connector, and the other end is grounded to form multiple conductivity test sub-loops. When the fifth power switch is closed, if the second light-emitting diode lights corresponding to each conductivity test sub-loop are all on, it is determined that the connectivity function of the cable to be tested is normal; In the cable wire sequence test sub-module, the two ends of the cable to be tested are respectively plugged into the cable pin connectors to form multiple wire sequence test sub-loops with multiple sub-loop switches. When the fifth power switch and the corresponding sub-loop switch are closed, if only the second light-emitting diode corresponding to the sub-loop with the closed switch is on, it is judged that the wire sequence of the cable to be tested is normal.

6. A multifunctional incoming material inspection device according to claim 1, characterized in that: In the digital-to-analog converter test module, the power pin of the first single-chip microcomputer is connected to the power module through the eighth power switch, and the digital output pin of the first single-chip microcomputer is connected to the input end of the digital-to-analog converter chip to be tested, the output end of the digital-to-analog converter chip to be tested is connected to the second voltage detection port, and the second voltage detection port is connected to a voltmeter.

7. A multifunctional incoming material inspection device according to claim 1, characterized in that: In the analog-to-digital converter test module, the power supply module is connected to the power pin of the second single-chip microcomputer through the voltage conversion circuit and the ninth power switch in sequence, and the power supply module is connected to the power pin of the first sensor chip through the first voltage conversion circuit, the data output end of the first sensor chip is connected to the second single-chip microcomputer through the analog-to-digital converter to be tested, and the data output end of the second single-chip microcomputer is connected to the communication detection port.

8. The multifunctional incoming material inspection device according to claim 1, characterized in that: In the operational amplifier test module, the power pin of the second sensor chip is connected to the power module through the tenth power switch and the second voltage conversion circuit, the data output end of the second sensor chip is connected to the third voltage detection port through the operational amplifier test group to be tested, and the third voltage detection port is connected to the voltmeter.

9. The multifunctional incoming material inspection device according to claim 1, characterized in that: The power chip test module also includes a third single-chip microcomputer, a third sensor chip, a transistor and a relay. The power module is connected to the power pin of the third single-chip microcomputer through the seventh power switch, the power chip to be tested and the third voltage conversion circuit in sequence. The base of the transistor is connected to the signal control pin of the third single-chip microcomputer, the emitter is grounded, and the collector is connected to the output end of the third voltage conversion circuit through the coil part of the relay. One end of the switch part of the relay is connected to the power module, and the other end is connected to the first voltage detection port. The first voltage detection port is connected to the voltmeter, and the data output end of the third sensor chip is connected to the third single-chip microcomputer.

10. The multifunctional incoming material inspection device according to claim 1, characterized in that: The device also includes a chip function integration test module, which is used to uniformly test the transistor to be tested, the sensor chip to be tested, the voltage-current converter chip to be tested, the voltage reference chip to be tested and the digital-to-analog converter chip to be tested. The module includes a current detection port, a chip mounting seat, a fourth single-chip microcomputer, a fourth sensor chip, and the power supply module is connected to the voltage reference chip to be tested through the current detection port. The voltage reference chip to be tested is respectively connected to the sensor chip to be tested, the digital-to-analog converter chip to be tested and the fourth single-chip microcomputer for power supply. The base and emitter of the transistor to be tested are respectively connected to the corresponding pins of the voltage-current converter chip to be tested, and the collector is connected to the current detection port. The data output pin of the fourth sensor chip is connected to the fourth single-chip microcomputer, and the fourth single-chip microcomputer is connected to the digital input end of the digital-to-analog converter chip to be tested. The voltage output end of the digital-to-analog converter chip to be tested is connected to the voltage input end of the voltage-current converter chip to be tested, and the current output end of the voltage-current converter chip to be tested is connected to the current detection port.

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