Cover plate module mother board, cover plate module, preparation method of cover plate module and display module

Abstract

The invention provides a cover plate module mother board, a cover plate module, a preparation method of the cover plate module and a display module. The cover plate module mother board comprises a cover plate, a first optical adhesive layer and a second optical adhesive layer. The cover plate comprises a first main surface, a second main surface and a side surface, the first main surface and the second main surface are opposite, the side surface is located between the first main surface and the second main surface, the cover plate comprises at least one first part and at least two second parts, the first part is located between the adjacent second parts, the first main surface is provided with a groove, and the bottom face of the groove coincides with the first part. The first optical adhesive layer covers the first main surface and the side surface of the cover plate, the surface, away from the first main surface, of the first optical adhesive layer is a plane, and the second optical adhesive layer covers the second main surface and the side surface of the cover plate. The main surface and the side surface of the cover plate are coated by the optical adhesive layer at the same time, so that the risks of film layer separation and crack occurrence are reduced, and the problem of non-uniform optical display caused by arrangement of a groove can be eliminated.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a cover module motherboard, a cover module and a preparation method thereof, and a display module. Background Art

[0002] As existing flexible displays are mainly made of organic materials, folding or curved displays have serious creases. In recent years, in order to improve impact resistance and bending performance, various manufacturers have also been developing unequal thickness cover plates. However, due to the design of their own structure, the current unequal thickness cover plates are prone to problems such as edge film separation and crack extension. Summary of the invention

[0003] The first aspect of the present disclosure provides a cover module motherboard, which includes a cover, a first optical adhesive layer and a second optical adhesive layer. The cover includes a first main surface and a second main surface opposite to each other and a side surface located between the first main surface and the second main surface, the cover includes at least one first part and at least two second parts, the first part is located between adjacent second parts, the first main surface has a groove and the bottom surface of the groove coincides with the first part. The first optical adhesive layer covers the first main surface and the side surface of the cover, and the surface of the first optical adhesive layer away from the first main surface is a plane, and the second optical adhesive layer covers the second main surface and the side surface of the cover.

[0004] In the above scheme, the main surface and the side surface of the cover plate are simultaneously coated by the optical adhesive layer to increase the strength of the side surface of the cover plate, which can increase the impact resistance of the cover plate and reduce the risk of film separation and cracks; in addition, during the subsequent processing (cutting process), the optical adhesive layer will further protect the cover plate to avoid the risk of film separation and cracks at the edge of the cover plate; in addition, the groove side is flattened by the first optical adhesive layer, which can eliminate the problem of uneven optical display caused by setting the groove.

[0005] In a specific embodiment of the first aspect of the present disclosure, the angle between the side surface of the cover plate and the first main surface is rounded, and / or the angle between the side surface of the cover plate and the second main surface is rounded. In this way, the risk of stress concentration at the corners of the cover plate can be reduced to avoid film separation or cracks at the edge of the cover plate.

[0006] In a specific implementation of the first aspect of the present disclosure, at the side surface of the cover plate, the first optical adhesive layer is located between the second optical adhesive layer and the cover plate.

[0007] In a specific implementation of the first aspect of the present disclosure, at the side surface of the cover plate, the thickness of the first optical adhesive layer and / or the second optical adhesive layer is 0.1-0.5 mm.

[0008] In a specific embodiment of the first aspect of the present disclosure, the first main surface and the second main surface of the cover plate have a first area and a second area, the second area surrounds the first area, and the cover plate module master plate also includes an ink layer, the ink layer is located outside the first area and covers the second area.

[0009] In the embodiments of the present disclosure, the ink layer will not span across different film layers, so that uneven coating (including printing, etc.) or color difference will not occur at the junction of different film layers, thereby improving the visual effect of the cover module motherboard when it is applied to the display panel.

[0010] In another specific embodiment of the first aspect of the present disclosure, the ink layer is located on the first major surface and between the first optical adhesive layer and the cover plate.

[0011] In this way, the ink layer is directly coated (including printing, etc.) on the first main surface of the cover plate with the groove. During the preparation of the cover plate module motherboard, the cover plate will expand due to the tempering treatment. The expansion amount of the first main surface with the groove is relatively larger, and stress is easily released during bending, thereby improving the ink's anti-bending ability.

[0012] Optionally, an edge of the ink layer is located between a junction between the side surface of the cover plate and the first main surface and a junction between the side surface of the cover plate and the second main surface.

[0013] Optionally, the ink layer covers a portion of the side surface of the cover plate.

[0014] Optionally, an edge of the first optical adhesive layer is coplanar with the second major surface of the cover plate.

[0015] Optionally, an edge of the second optical adhesive layer is coplanar with a surface of the first optical adhesive layer on a side away from the first major surface.

[0016] In another specific embodiment of the first aspect of the present disclosure, the ink layer is located on a surface of the first optical adhesive layer away from the first major surface.

[0017] Optionally, the outer edge of the ink layer is coplanar with a surface of the first optical adhesive layer away from the side surface of the cover plate.

[0018] Optionally, the cover plate module mother plate also includes a third optical adhesive layer, the third optical adhesive layer covers the side surface and the first main surface of the cover plate, a portion of the third optical adhesive layer located on one side of the side surface of the cover plate is located between the cover plate and the second optical adhesive layer, a portion of the first optical adhesive layer located on one side of the side surface of the cover plate is located between the third optical adhesive layer and the cover plate, and the ink layer is located between the first optical adhesive layer and the third optical adhesive layer.

[0019] Optionally, edges of the first optical adhesive layer and the third optical adhesive layer are coplanar with the second major surface of the cover plate.

[0020] Optionally, the edge of the second optical adhesive layer is coplanar with a surface of the third optical adhesive layer on a side away from the first major surface.

[0021] In another specific embodiment of the first aspect of the present disclosure, the ink layer is located between the cover plate and the second optical adhesive layer, and is located on the second major surface of the cover plate.

[0022] Optionally, the outer edge of the ink layer is coplanar with the side surface of the cover plate.

[0023] Optionally, an edge of the first optical adhesive layer is coplanar with a surface of the ink layer away from the second major surface.

[0024] Optionally, an edge of the second optical adhesive layer is coplanar with a surface of the first optical adhesive layer on a side away from the first major surface.

[0025] In another specific embodiment of the first aspect of the present disclosure, the ink layer is located on a surface of the second optical adhesive layer away from the second major surface.

[0026] Optionally, the outer edge of the ink layer is coplanar with a surface of the second optical adhesive layer away from the side surface of the cover plate.

[0027] Optionally, an edge of the first optical adhesive layer is coplanar with the second major surface of the cover plate.

[0028] Optionally, the edge of the second optical adhesive layer is coplanar with a surface of the first optical adhesive layer on a side away from the first major surface;

[0029] Optionally, the cover module motherboard also includes a third optical adhesive layer, which covers the side surface and the first main surface of the cover, the second optical adhesive layer is located between the cover and the third optical adhesive layer, and the ink layer is located between the second optical adhesive layer and the third optical adhesive layer.

[0030] Optionally, the edge of the third optical adhesive layer and the edge of the second optical adhesive layer are both coplanar with a surface of the first optical adhesive layer on a side away from the first major surface.

[0031] The second aspect of the present disclosure provides a cover module, which includes a cover, a first optical adhesive layer and a second optical adhesive layer. The cover includes a first main surface and a second main surface opposite to each other and a side surface located between the first main surface and the second main surface, and the cover includes at least one first part and at least two second parts, the first part is located between adjacent second parts, the first main surface has a groove and the bottom surface of the groove coincides with the first part. The first optical adhesive layer covers the first main surface of the cover, and the surface of the first optical adhesive layer away from the first main surface is a plane, and the second optical adhesive layer covers the second main surface of the cover. Only one of the first optical adhesive layer and the second optical adhesive layer covers the side surface of the cover.

[0032] In a specific implementation of the second aspect of the present disclosure, at the side surface of the cover plate, the first optical adhesive layer covers the side surface of the cover plate.

[0033] In a specific embodiment of the second aspect of the present disclosure, the distance between the surface of the first optical adhesive layer away from the side surface of the cover plate and the side surface of the cover plate is 0.05 to 0.5 mm, that is, when cutting the cover plate module mother plate to obtain the cover plate module, the distance from the cutting line to the side surface of the cover plate is 0.05 to 0.5 mm.

[0034] In a specific embodiment of the second aspect of the present disclosure, the first main surface and the second main surface of the cover plate have a first area and a second area, the second area surrounds the first area, and the cover plate module also includes an ink layer, which is located outside the first area and covers the second area.

[0035] In a specific embodiment of the second aspect of the present disclosure, the ink layer is located on the first major surface and between the first optical adhesive layer and the cover plate, and the edge of the ink layer is located between the junction of the side surface of the cover plate and the first major surface and the junction of the side surface of the cover plate and the second major surface.

[0036] Optionally, the ink layer covers a portion of the side surface of the cover plate, the edge of the first optical adhesive layer is coplanar with the second main surface of the cover plate, and the edge of the second optical adhesive layer is coplanar with the surface of the first optical adhesive layer away from the side surface of the cover plate.

[0037] In another specific embodiment of the second aspect of the present disclosure, the ink layer is located on a surface of the first optical adhesive layer away from the first major surface, and an outer edge of the ink layer is coplanar with a surface of the first optical adhesive layer away from the side surface of the cover plate.

[0038] Optionally, the cover module also includes a third optical adhesive layer, which covers the first main surface of the cover, and is located between the cover and the second optical adhesive layer on a side of the first optical adhesive layer away from the first main surface of the cover, the first optical adhesive layer is located between the third optical adhesive layer and the cover, and the ink layer is located between the first optical adhesive layer and the third optical adhesive layer.

[0039] Optionally, edges of the second optical adhesive layer and the third optical adhesive layer are coplanar with a surface of the first optical adhesive layer on a side away from the side surface of the cover plate.

[0040] In another specific embodiment of the second aspect of the present disclosure, the ink layer is located between the cover plate and the second optical adhesive layer, and is located on the second major surface of the cover plate.

[0041] Optionally, the outer edge of the ink layer is coplanar with the side surface of the cover plate.

[0042] Optionally, the edge of the first optical adhesive layer is coplanar with a surface of the ink layer away from the second main surface, and the edge of the second optical adhesive layer is coplanar with a surface of the first optical adhesive layer away from the side surface of the cover plate;

[0043] In another specific embodiment of the second aspect of the present disclosure, the ink layer is located on the surface of the second optical adhesive layer away from the second major surface, and the outer edge of the ink layer is coplanar with the surface of the first optical adhesive layer away from the side surface of the cover plate.

[0044] Optionally, an edge of the first optical adhesive layer is coplanar with the second major surface of the cover plate.

[0045] Optionally, an edge of the second optical adhesive layer is coplanar with a surface of the first optical adhesive layer away from the side surface of the cover plate.

[0046] Optionally, the cover module also includes a third optical adhesive layer, which covers the first main surface of the cover, the second optical adhesive layer is located between the cover and the third optical adhesive layer, the ink layer is located between the second optical adhesive layer and the third optical adhesive layer, and the edge of the third optical adhesive layer and the edge of the second optical adhesive layer are both coplanar with the surface of the side surface of the first optical adhesive layer away from the cover.

[0047] According to a third aspect of the present disclosure, there is provided a method for preparing a cover module, the method comprising: providing a cover and thinning the cover to form a groove, wherein the cover comprises a first main surface and a second main surface opposite to each other and a side surface located between the first main surface and the second main surface, the cover comprises at least one first portion formed by thinning and at least two second portions that are not thinned, the first portion is located between adjacent second portions, the first main surface forms a groove, and the bottom surface of the groove coincides with the first portion; coating a first optical adhesive material on the cover, and curing the first optical adhesive material to form a first optical adhesive layer, wherein the first optical adhesive layer covers the first main surface and the side surface of the cover, and the surface of the first optical adhesive layer away from the first main surface is a plane; coating a second optical adhesive material on the cover, and curing the second optical adhesive material to form a second optical adhesive layer, wherein the second optical adhesive layer covers the second main surface and the side surface of the cover; cutting the first optical adhesive layer and the second optical adhesive layer along a cutting line, wherein the cutting line is parallel to the side surface of the cover, and before cutting, is located between the surface of the first optical adhesive layer away from the side surface of the cover and the side surface of the cover.

[0048] The fourth aspect of the present disclosure provides a display module, which includes a display panel and the cover plate module in the second aspect or the cover plate module obtained by the preparation method in the third aspect. The cover plate module is located on the light-emitting side of the display panel, and the groove of the cover plate in the cover plate module faces the display panel. The display panel includes a bending area and a non-bending area, the bending area is located within the orthographic projection of the first part on the display panel, and the orthographic projection of the second part on the display panel is located within the non-bending area. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 A schematic diagram of the planar structure of a cover module motherboard under a certain design is provided in one embodiment of the present disclosure.

[0050] Figure 2A for Figure 1 The cover module motherboard is shown in a cross-sectional view along M1-N1.

[0051] Figure 2B for Figure 2A The structure schematic diagram of the cover plate module after the cover plate module motherboard is cut along the cutting line P is shown.

[0052] Figure 3A for Figure 1 The cover module motherboard is shown in a cross-sectional view along M2-N2.

[0053] Figure 3B for Figure 3A The structure schematic diagram of the cover plate module after the cover plate module motherboard is cut along the cutting line P is shown.

[0054] Figure 4A for Figure 1 The cross-sectional view of the cover module motherboard along M2-N2 under another design is shown.

[0055] Figure 4B for Figure 4A The structure schematic diagram of the cover plate module after the cover plate module motherboard is cut along the cutting line P is shown.

[0056] Figure 5A for Figure 1 The cross-sectional view of the cover module motherboard along M2-N2 under another design is shown.

[0057] Figure 5B for Figure 5A The structure schematic diagram of the cover plate module after the cover plate module motherboard is cut along the cutting line P is shown.

[0058] Fig. 6A for Figure 1 The cross-sectional view of the cover module motherboard along M2-N2 under another design is shown.

[0059] Figure 6B for Fig. 6A The structure schematic diagram of the cover plate module after the cover plate module motherboard is cut along the cutting line P is shown.

[0060] Figure 7 A flow chart of a method for preparing a cover plate module provided in one embodiment of the present disclosure.

[0061] Figure 8 A schematic diagram of the planar structure of a display module provided by an embodiment of the present disclosure.

[0062] Fig. 9 for Figure 8 The shown figure shows a cross-sectional view of the module along M3-N3.

[0063] Description of reference numerals:

[0064] 10-cover module motherboard; 20-cover module; 30-display module; AA-display area; NA-non-display area; W1-bending area; W2-non-bending area;

[0065] 100-cover plate; 101-first main surface; 102-second main surface; 103-side surface; 104-groove; 111-first part; 112-second part; 121-first area; 122-second area;

[0066] 210 - first optical adhesive layer; 220 - second optical adhesive layer; 230 - third optical adhesive layer;

[0067] 300-Ink layer. DETAILED DESCRIPTION

[0068] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0069] There are two main types of cover plates for display modules, one is a fixed-form, non-foldable cover plate, and the other is a foldable, flexible cover plate. Fixed-form cover plates have better strength, but cannot achieve complex curved surface modeling. Foldable, flexible cover plates can achieve dynamic bending and complex curved surface modeling, but they are thinner, have poorer strength, and are prone to bending and wrinkling between layers. The film layers in the edge area are prone to separation during the bending process, and the cover plate edges are easily affected by external forces, causing crack extension.

[0070] The present disclosure provides a cover plate module mother plate, a cover plate module and a preparation method thereof to at least solve the above-mentioned problems. The cover plate module mother plate includes a cover plate, a first optical adhesive layer and a second optical adhesive layer. The cover plate includes a first main surface and a second main surface opposite to each other and a side surface located between the first main surface and the second main surface. The cover plate includes at least one first part and at least two second parts. The first part is located between adjacent second parts. The first main surface has a groove and the bottom surface of the groove coincides with the first part. The first optical adhesive layer covers the first main surface and the side surface of the cover plate, and the surface of the first optical adhesive layer away from the first main surface is a plane. The second optical adhesive layer covers the second main surface and the side surface of the cover plate. In the cover plate module motherboard, the main surface and side surface of the cover plate are simultaneously coated by the optical adhesive layer to increase the strength of the side surface of the cover plate, which can increase the impact resistance of the cover plate and reduce the risk of film separation and cracks; in addition, during the subsequent processing (cutting process), the optical adhesive layer will further protect the cover plate to avoid the risk of film separation and cracks at the edge of the cover plate; in addition, the groove side is flattened by the first optical adhesive layer, which can eliminate the problem of uneven optical display caused by setting the groove.

[0071] Below, the structure of the cover plate module motherboard and the cover plate module in at least one embodiment of the present disclosure is described in detail in conjunction with the accompanying drawings. In addition, in these drawings, a spatial rectangular coordinate system is established with the surface where the cover plate is located (such as the flat second main surface described below) as a reference to more intuitively present the positional relationship of the relevant structures in the cover plate, and in this spatial rectangular coordinate system, the X-axis and the Y-axis are parallel to the surface where the cover plate is located, and the Z-axis is perpendicular to the surface where the cover plate is located. It should be noted that because the cover plate module is obtained by cutting the cover plate module motherboard, therefore, in the following embodiments, the cover plate module motherboard and the cover plate module are described simultaneously to clarify the corresponding relationship between the cover plate module motherboard and the cover plate module under different design structures.

[0072] like Figure 1 , Figure 2A and Figure 3AAs shown, the cover module motherboard 10 includes a cover 100, a first optical adhesive layer 210 and a second optical adhesive layer 220. The cover 100 includes a first main surface 101 and a second main surface 102 opposite to each other and a side surface 103 located between the first main surface 101 and the second main surface 102. The cover 100 includes at least one first portion 111 and at least two second portions 112. The first portion 111 is located between adjacent second portions 112. The thickness of the first portion 111 is less than the thickness of the second portion 112 so that the first main surface 101 has a groove 104, and the bottom surface of the groove 104 coincides with the first portion 111. The first optical adhesive layer 210 covers the first main surface 101 and the side surface 103 of the cover 100, and the surface of the first optical adhesive layer 210 away from the first main surface 101 is a plane. The second optical adhesive layer 220 covers the second main surface 102 and the side surface 103 of the cover 100. In this structure, the first optical adhesive layer 210 and the second optical adhesive layer 220 of the second part 111 simultaneously cover the first main surface 101, the second main surface 102 and the side surface 103 of the cover plate 100 to increase the strength of the side surface 103 of the cover plate 100 and reduce the risk of film layer separation and cracks.

[0073] like Figure 2B and Figure 3B As shown, after the edge portion of the cover module motherboard 10 is cut along the cutting line P, the cover module 20 is obtained. Corresponding to the structure of the cover module motherboard 10, the cover module 20 includes a cover 100, a first optical adhesive layer 210 and a second optical adhesive layer 220. The cover 100 includes a first main surface 101 and a second main surface 102 opposite to each other and a side surface 103 located between the first main surface 101 and the second main surface 102. The cover 100 includes at least one first portion 111 and at least two second portions 112. The thickness of the first portion 111 is less than the thickness of the second portion 112 so that the first main surface 101 has a groove 104, and the bottom surface of the groove 104 coincides with the first portion 111. The first optical adhesive layer 210 covers the first main surface 101 of the cover 100, and the surface of the first optical adhesive layer 210 away from the first main surface 101 is a plane. The second optical adhesive layer 220 covers the second main surface 102 of the cover 100. Only one of the first optical adhesive layer 210 and the second optical adhesive layer 220 covers the side surface 103 of the cover plate 100 .

[0074] It should be noted that the preset position of the cutting line P cannot reach the side surface 103 of the cover plate 100 , so that after the cutting process, the side surface 103 of the cover plate 100 is still covered with optical adhesive, thereby protecting the cover plate 100 .

[0075] For example, the distance from the cutting line P to the side surface 103 of the cover plate 100 may be 0.05-0.5 mm, that is, after the cover plate module mother plate 10 is cut to obtain the cover plate module, the distance between the surface of the first optical adhesive layer 210 away from the side surface 103 of the cover plate 100 and the side surface 103 of the cover plate 100 is 0.05-0.5 mm. For example, in the cover plate module mother plate 10, the thickness of the first optical adhesive layer 210 and the second optical adhesive layer 220 on the side surface 103 of the cover plate 100 may be 0.1-0.5 mm.

[0076] In at least one embodiment of the present disclosure, Figure 1 , Figure 2A , Figure 2B , Figure 3A and Figure 3B As shown, the angle between the side surface 103 of the cover plate 100 and the first main surface 101 is rounded, and / or the angle between the side surface 103 of the cover plate 100 and the second main surface 102 is rounded. In this way, the risk of stress concentration at the corners of the cover plate 100 can be reduced to avoid film separation or cracks at the edge of the cover plate 100.

[0077] In at least one embodiment of the present disclosure, Figure 2A and Figure 3A As shown, at the side surface 103 of the cover plate 100 , the first optical adhesive layer 210 is located between the second optical adhesive layer 220 and the cover plate 100 .

[0078] For example, at the side surface of the cover plate 100, the outer second optical adhesive layer 220 can be cut off during the cutting process. Figure 2B and Figure 3B As shown, that is, at the side surface 103 of the cover plate 100 , the first optical adhesive layer 210 covers the side surface 103 of the cover plate 100 , and the second optical adhesive layer 220 is entirely located on the side where the second main surface 102 of the cover plate 100 is located.

[0079] In at least one embodiment of the present disclosure, Figure 1 , Figure 2A and Figure 3AAs shown, in the cover module motherboard 10, the first main surface 101 and the second main surface 102 of the cover module 100 have a first area 121 and a second area 122, the second area 122 surrounds the first area 121, and the cover module motherboard 10 further includes an ink layer 300, the ink layer 300 is located outside the first area 121 and covers the second area 122. When the cover module motherboard 10 or the cover module 20 obtained by cutting the cover module motherboard 10 is applied to the display module, the first area 121 may correspond to the display area of ​​the display module, the second area 122 may correspond to the non-display area (which may be called the frame area) of the edge portion of the display module, and the ink layer 300 may shield the non-display area of ​​the edge portion of the display module to prevent light leakage at the edge. In the embodiment of the present disclosure, the ink layer 300 will not span across different film layers, so that uneven coating (including printing, etc.) or color difference will not occur at the junction of different film layers, so as to improve the visual effect of the cover module motherboard 10 when applied to the display panel.

[0080] In such Figure 2A and Figure 3A After the cover module motherboard 10 is cut, the following Figure 2B and Figure 3B The cover module 20 shown, specifically, in the cover module 20, the first main surface 101 and the second main surface 102 of the cover 100 have a first area 121 and a second area 122, the second area 122 surrounds the first area 121, and the cover module 20 also includes an ink layer 300, which is located outside the first area 121 and covers the second area 122.

[0081] The positional relationship between the ink layer, the cover plate, and each optical adhesive layer is described below through different embodiments.

[0082] In some embodiments of the present disclosure, Figure 2A and Figure 3A As shown, in the cover plate module mother plate 10, the ink layer 300 is located on the first main surface 101 and between the first optical adhesive layer 210 and the cover plate 100. In this way, the ink layer 300 is directly coated (including printing, etc.) on the first main surface 101 of the cover plate 100 having the groove 104. During the preparation process of the cover plate module mother plate 10, the cover plate 100 will expand due to the tempering treatment, and the expansion amount of the first main surface 101 provided with the groove 104 is relatively larger, and stress is easily released when bending, thereby improving the anti-bending ability of the ink.

[0083] For example, Figure 2A and Figure 3A As shown, the edge of the ink layer 300 is located between the junction of the side surface 103 of the cover plate 100 and the first main surface 101 and the junction of the side surface 103 of the cover plate 100 and the second main surface 102 .

[0084] For example, Figure 2A and Figure 3A As shown, the ink layer 300 covers a portion of the side surface of the cover plate 100 , that is, at the side surface 103 of the cover plate 100 , the orthographic projection of the edge of the ink layer 300 on the side surface 103 is located within the orthographic projection of the first optical adhesive layer 210 on the side surface 103 .

[0085] For example, the edge of the first optical adhesive layer 210 is coplanar with the second major surface 102 of the cover plate 100 .

[0086] For example, the edge of the second optical adhesive layer 220 is coplanar with the surface of the first optical adhesive layer 210 away from the first major surface 101 .

[0087] In the case of Figure 2A and Figure 3A After the cover module motherboard 10 is cut, the following Figure 2B and Figure 3B The cover module 20 shown, specifically, in the cover module 20, the ink layer 300 is located on the first major surface 101 and between the first optical adhesive layer 210 and the cover 100, and the edge of the ink layer 300 is located between the junction of the side surface 103 of the cover 100 and the first major surface 101 and the junction of the side surface 103 of the cover 100 and the second major surface 102.

[0088] For example, Figure 2B and Figure 3B As shown, the ink layer 300 covers a portion of the side surface of the cover plate 100, that is, at the side surface 103 of the cover plate 100, the orthographic projection of the edge of the ink layer 300 on the side surface 103 is located within the orthographic projection of the first optical adhesive layer 210 on the side surface 103. In addition, the edge of the first optical adhesive layer 210 is coplanar with the second major surface 102 of the cover plate 100, and the edge of the second optical adhesive layer 220 is coplanar with the surface of the first optical adhesive layer 210 on the side away from the side surface 103 of the cover plate 100.

[0089] In other embodiments of the present disclosure, Figure 4A As shown, in the cover plate module master plate 10 , the ink layer 300 is located on the surface of the first optical adhesive layer 210 away from the first major surface 101 .

[0090] For example, Figure 4A As shown, in the cover plate module mother plate 10 , the outer edge of the ink layer 300 is coplanar with the surface of the first optical adhesive layer 210 away from the side surface 103 of the cover plate 100 .

[0091] For example, Figure 4AAs shown, in the cover module motherboard 10, the cover module motherboard 10 further includes a third optical adhesive layer 230, the third optical adhesive layer 230 covers the side surface 103 and the first main surface 101 of the cover 100, the portion of the third optical adhesive layer 230 located on one side of the side surface 103 of the cover 100 is located between the cover 100 and the second optical adhesive layer 220, the portion of the first optical adhesive layer 210 located on one side of the side surface 103 of the cover 100 is located between the third optical adhesive layer 230 and the cover 100, and the ink layer 300 is located between the first optical adhesive layer 210 and the third optical adhesive layer 230. The third optical adhesive layer 230 can encapsulate and protect the ink layer 300.

[0092] For example, Figure 4A As shown, in the cover module mother board 10 , the edges of the first optical adhesive layer 210 and the third optical adhesive layer 230 are coplanar with the second major surface 102 of the cover 100 .

[0093] For example, Figure 4A As shown, in the cover module mother board 10 , the edge of the second optical adhesive layer 220 is coplanar with the surface of the third optical adhesive layer 230 away from the first major surface 101 .

[0094] In the case of Figure 4A After the cover module motherboard 10 is cut, the following Figure 4B The cover module 20 shown, specifically, in the cover module 20, the ink layer 300 is located on the surface of the first optical adhesive layer 210 away from the first major surface 101, and the outer edge of the ink layer 300 is coplanar with the surface of the first optical adhesive layer 210 away from the side surface 103 of the cover 100.

[0095] For example, Figure 4B As shown, the cover module 20 further includes a third optical adhesive layer 230, which covers the first main surface 101 of the cover 100, and is located between the cover 100 and the second optical adhesive layer 220 on a side of the first optical adhesive layer 210 away from the first main surface 101 of the cover 100, the first optical adhesive layer 210 is located between the third optical adhesive layer 230 and the cover 100, and the ink layer 300 is located between the first optical adhesive layer 210 and the third optical adhesive layer 230. The third optical adhesive layer 230 can encapsulate and protect the ink layer 300.

[0096] For example, Figure 4B As shown, in the cover module 20 , the edges of the second optical adhesive layer 220 and the third optical adhesive layer 230 are coplanar with the surface of the first optical adhesive layer 210 away from the side surface 103 of the cover 100 .

[0097] In other embodiments of the present disclosure, Figure 5AAs shown, in the cover plate module master plate 10 , the ink layer 300 is located between the cover plate 100 and the second optical adhesive layer 220 , and is located on the second major surface 102 of the cover plate 100 .

[0098] For example, Figure 5A As shown, in the cover plate template master plate 10 , the outer edge of the ink layer 300 is coplanar with the side surface 103 of the cover plate 100 .

[0099] For example, Figure 5A As shown, in the cover plate module mother plate 10 , the edge of the first optical adhesive layer 210 is coplanar with the surface of the ink layer 300 away from the second major surface 102 .

[0100] For example, Figure 5A As shown, in the cover module mother board 10 , the edge of the second optical adhesive layer 220 is coplanar with the surface of the first optical adhesive layer 210 on the side away from the first major surface 101 .

[0101] In the case of Figure 5A After the cover module motherboard 10 is cut, the following Figure 5B In the illustrated cover plate module 20 , specifically, in the cover plate module 20 , the ink layer 300 is located between the cover plate 100 and the second optical adhesive layer 220 , and is located on the second major surface 102 of the cover plate 100 .

[0102] For example, Figure 5B As shown, in the cover plate module 20 , the outer edge of the ink layer 300 is coplanar with the side surface 103 of the cover plate 100 .

[0103] For example, Figure 5B As shown, in the cover module 20, the edge of the first optical adhesive layer 210 is coplanar with the surface of the ink layer 300 away from the second major surface 102, and the edge of the second optical adhesive layer 220 is coplanar with the surface of the first optical adhesive layer 210 away from the side surface 103 of the cover 100.

[0104] In other embodiments of the present disclosure, Fig. 6A As shown, in the cover plate module master plate 10 , the ink layer 300 is located on the surface of the second optical adhesive layer 220 away from the second major surface 102 .

[0105] For example, Fig. 6A As shown, in the cover plate module mother plate 10 , the outer edge of the ink layer 300 is coplanar with the surface of the second optical adhesive layer 220 away from the side surface 103 of the cover plate 100 .

[0106] For example, Fig. 6A As shown, in the cover module mother board 10 , the edge of the first optical adhesive layer 210 is coplanar with the second major surface 102 of the cover 100 .

[0107] For example, Fig. 6A As shown, in the cover module mother board 10 , the edge of the second optical adhesive layer 220 is coplanar with the surface of the first optical adhesive layer 210 away from the first major surface 101 .

[0108] For example, Fig. 6A As shown, in the cover module motherboard 10, the cover module motherboard 10 further includes a third optical adhesive layer 230, the third optical adhesive layer 230 covers the side surface 103 and the first main surface 101 of the cover 100, the second optical adhesive layer 220 is located between the cover 100 and the third optical adhesive layer 230, and the ink layer 300 is located between the second optical adhesive layer 220 and the third optical adhesive layer 230. The third optical adhesive layer 230 can encapsulate and protect the ink layer 300.

[0109] For example, Fig. 6A As shown, in the cover module mother board 10 , the edge of the second optical adhesive layer 220 and the edge of the third optical adhesive layer 230 are both coplanar with the surface of the first optical adhesive layer 210 away from the first major surface 101 .

[0110] In the case of Fig. 6A After the cover module motherboard 10 is cut, the following Figure 6B The cover module 20 shown, specifically, in the cover module 20, the ink layer 300 is located on the surface of the second optical adhesive layer 220 away from the second major surface 102, and the outer edge of the ink layer 300 is coplanar with the surface of the first optical adhesive layer 210 away from the side surface 103 of the cover 100.

[0111] For example, Figure 6B As shown, in the cover module 20 , the edge of the first optical adhesive layer 210 is coplanar with the second major surface 102 of the cover 100 .

[0112] For example, Figure 6B As shown, in the cover module 20 , the edge of the second optical adhesive layer 220 is coplanar with the surface of the first optical adhesive layer 210 away from the side surface 103 of the cover 100 .

[0113] For example, Figure 6B As shown, in the cover module 20, the cover module 20 also includes a third optical adhesive layer 230, the third optical adhesive layer 230 covers the first main surface 101 of the cover 100, the second optical adhesive layer 220 is located between the cover 100 and the third optical adhesive layer 230, the ink layer 300 is located between the second optical adhesive layer 220 and the third optical adhesive layer 230, and the edge of the second optical adhesive layer 220 and the edge of the third optical adhesive layer 230 are both coplanar with the surface of the first optical adhesive layer 210 away from the side surface 103 of the cover 100.

[0114] In at least one embodiment of the present disclosure, the first optical adhesive layer 210 , the second optical adhesive layer 220 and the third optical adhesive layer 230 may be cured after coating, and the curing may include optical curing (eg, UV curing), thermal curing, and the like.

[0115] In at least one embodiment of the present disclosure, after the first optical adhesive layer 210, the second optical adhesive layer 220 and the third optical adhesive layer 230 (or only the first optical adhesive layer 210 and the second optical adhesive layer 220) are cured, a hardened layer can be formed on the surface of the optical adhesives through processes such as evaporation or spraying for protection.

[0116] At least one embodiment of the present disclosure provides a method for preparing a cover plate module, such as Figure 7 As shown, the preparation method may include the following steps S100 to S400.

[0117] S100, providing a cover plate and performing a thinning process on the cover plate to form a groove, wherein the cover plate includes a first main surface and a second main surface relative to each other and a side surface located between the first main surface and the second main surface, the cover plate includes at least one first portion formed by thinning and at least two second portions that are not thinned, the first portion is located between adjacent second portions, the first main surface forms a groove, and the bottom surface of the groove coincides with the first portion.

[0118] S200, coating a first optical adhesive material on the cover plate, and curing the first optical adhesive material to form a first optical adhesive layer, wherein the first optical adhesive layer covers the first main surface and side surface of the cover plate, and the surface of the first optical adhesive layer away from the first main surface is a plane.

[0119] S300, coating a second optical adhesive material on the cover plate, and curing the second optical adhesive material to form a second optical adhesive layer, wherein the second optical adhesive layer covers the second main surface and the side surface of the cover plate.

[0120] S400, cutting the first optical adhesive layer and the second optical adhesive layer along a cutting line, wherein the cutting line is parallel to the side surface of the cover plate and is located between a surface of the first optical adhesive layer away from the side surface of the cover plate and the side surface of the cover plate before cutting.

[0121] In the preparation process of the above steps S100 to S400, the main surface and the side surface of the cover plate are coated simultaneously by the optical adhesive layer to increase the strength of the side surface of the cover plate, which can increase the impact resistance of the cover plate and reduce the risk of film separation and cracks; in addition, in the subsequent processing (cutting process), the optical adhesive layer will further protect the cover plate to avoid the risk of film separation and cracks at the edge of the cover plate; in addition, the groove side is flattened by the first optical adhesive layer, which can eliminate the problem of uneven optical display caused by the setting of the groove. The structure of the cover plate module mother plate obtained by the preparation process and the cover plate module obtained by cutting the cover plate module mother plate and further improvements, etc., can refer to the relevant descriptions in the above embodiments, and will not be repeated here.

[0122] The preparation method of at least one embodiment of the present disclosure may further include forming (e.g., printing, etc.) a light-shielding material on the cover plate to form an ink layer. The positional relationship between the ink layer and the cover plate, the first optical adhesive layer, and the second optical adhesive layer can be found in the relevant description in the aforementioned embodiments and will not be elaborated here.

[0123] In the preparation method of the cover module provided by at least one embodiment of the present disclosure, a third optical adhesive material can also be coated on the cover, and the third optical adhesive material can be cured to form a third optical adhesive layer. The positional relationship between the third optical adhesive layer and the cover, the ink layer, the first optical adhesive layer and the second optical adhesive layer can be found in the relevant description in the aforementioned embodiments and will not be elaborated here.

[0124] At least one embodiment of the present disclosure provides a display module 30, such as Figure 8 As shown, the display module 30 includes the cover module 20 in the above embodiment.

[0125] In at least one embodiment of the present disclosure, Figure 8 and Fig. 9 As shown, the display module 30 may further include a display panel 40, and the display panel 40 is located on a side of the cover plate 100 included in the cover plate module 20 where the groove is provided. Figure 8 The arrow direction in is the light emitting direction of the display panel 40, that is, the cover plate 100 is located at the light emitting side of the display panel 40. For example, the display panel 40 may be a foldable or bendable display panel, which requires the cover plate module 200 to also have foldable or bendable performance, thus requiring the relevant design solutions in the aforementioned embodiments of the present disclosure.

[0126] The display panel 40 includes a bending area W1 and a non-bending area W2 . The bending area W1 is located within the orthographic projection of the first portion 111 on the display panel 40 . The orthographic projection of the second portion 112 on the display panel 40 is located within the non-bending area W2 .

[0127] For example, the display panel 40 includes a display area AA and a non-display area NA, wherein the display area AA may correspond to the first area 121 mentioned in the above embodiment (see Figure 1 ), the non-display area NA may correspond to the second area 122 mentioned in the above embodiment (see Figure 1 ).

[0128] In some embodiments of the present disclosure, the display panel 40 of the display module 30 may be a folding panel (the display module 30 is a folding screen). In this case, the portion of the display area AA located in the bending area W1 may also be used for display, and at least part of the display area AA is located in the first area 121.

[0129] In some other embodiments of the present disclosure, the display panel 40 of the display module 30 may be in a curved shape (the display module 30 is a curved screen), and at least a portion of the display area AA is located in the first area 121 .

[0130] In some further embodiments of the present disclosure, the display panel 40 of the display module 30 may be a rollable panel (the display module 30 may be called a rollable screen, a pull-out screen, etc.), and at least a portion of the display area AA is located in the first area 121 .

[0131] The display module 30 can be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, a navigator, etc. For example, the display module can be used in products such as foldable mobile phones and tablets.

[0132] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0133] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

[0134] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, etc. made within the spirit and principles of this specification should be included in the protection scope of this specification.

Claims

1. A cover module motherboard, characterized in that: include: A cover plate, comprising a first main surface and a second main surface opposite to each other and a side surface located between the first main surface and the second main surface, wherein the cover plate comprises at least one first portion and at least two second portions, the first portion is located between adjacent second portions, the first main surface is provided with a groove, and the bottom surface of the groove coincides with the first portion; A first optical adhesive layer, covering the first main surface and the side surface of the cover plate, wherein a surface of the first optical adhesive layer away from the first main surface is a plane; and The second optical adhesive layer covers the second main surface and the side surface of the cover plate.

2. The cover module motherboard according to claim 1, characterized in that: At the side surface of the cover plate, the first optical adhesive layer is located between the second optical adhesive layer and the cover plate; Preferably, the angle between the side surface of the cover plate and the first main surface is a rounded angle, and / or the angle between the side surface of the cover plate and the second main surface is a rounded angle; Preferably, at the side surface of the cover plate, the thickness of the first optical adhesive layer and / or the second optical adhesive layer is 0.1-0.5 mm.

3. The cover module motherboard according to claim 2, characterized in that: The first major surface and the second major surface of the cover plate have a first area and a second area, the second area surrounds the first area, and The cover plate module master plate further includes an ink layer, which is located outside the first area and covers the second area; Preferably, at least part of the second portion is located in the second zone, part of the first portion is located in the first zone, and an edge portion of the first portion not connected to the second portion is located in the second zone.

4. The cover module motherboard according to claim 3, characterized in that: The ink layer is located on the first main surface and between the first optical adhesive layer and the cover plate; Preferably, the edge of the ink layer is located between the boundary between the side surface of the cover plate and the first main surface and between the boundary between the side surface of the cover plate and the second main surface; Preferably, the ink layer covers a portion of the side surface of the cover plate; Further preferably, the edge of the first optical adhesive layer is coplanar with the second major surface of the cover plate; Further preferably, an edge of the second optical adhesive layer is coplanar with a surface of the first optical adhesive layer on a side away from the first major surface.

5. The cover module motherboard according to claim 3, characterized in that: The ink layer is located on the surface of the first optical adhesive layer away from the first major surface; Preferably, the outer edge of the ink layer is coplanar with the surface of the first optical adhesive layer away from the side surface of the cover plate; Preferably, the cover plate module mother plate further includes a third optical adhesive layer, the third optical adhesive layer covers the side surface of the cover plate and the first main surface, a portion of the third optical adhesive layer located on one side of the side surface of the cover plate is located between the cover plate and the second optical adhesive layer, a portion of the first optical adhesive layer located on one side of the side surface of the cover plate is located between the third optical adhesive layer and the cover plate, and the ink layer is located between the first optical adhesive layer and the third optical adhesive layer; Preferably, the edges of the first optical adhesive layer and the third optical adhesive layer are coplanar with the second major surface of the cover plate; Preferably, an edge of the second optical adhesive layer is coplanar with a surface of the third optical adhesive layer on a side away from the first major surface.

6. The cover module motherboard according to claim 3, characterized in that: The ink layer is located between the cover plate and the second optical adhesive layer, and is located on the second main surface of the cover plate; preferably, the outer edge of the ink layer is coplanar with the side surface of the cover plate; further preferably, the edge of the first optical adhesive layer is coplanar with the surface of the ink layer away from the second main surface; further preferably, the edge of the second optical adhesive layer is coplanar with the surface of the first optical adhesive layer on the side away from the first main surface; or The ink layer is located on the surface of the second optical adhesive layer away from the second major surface; preferably, the outer edge of the ink layer is coplanar with the surface of the second optical adhesive layer away from the side surface of the cover plate; preferably, the edge of the first optical adhesive layer is coplanar with the second major surface of the cover plate; preferably, the edge of the second optical adhesive layer is coplanar with the surface of the first optical adhesive layer on the side away from the first major surface; preferably, the cover plate module mother plate also includes a third optical adhesive layer, the third optical adhesive layer covers the side surface of the cover plate and the first major surface, the second optical adhesive layer is located between the cover plate and the third optical adhesive layer, and the ink layer is located between the second optical adhesive layer and the third optical adhesive layer; further preferably, the edge of the third optical adhesive layer and the edge of the second optical adhesive layer are both coplanar with the surface of the first optical adhesive layer on the side away from the first major surface.

7. A cover plate module, characterized in that: include: A cover plate, comprising a first main surface and a second main surface opposite to each other and a side surface located between the first main surface and the second main surface, wherein the cover plate comprises at least one first portion and at least two second portions, the first portion is located between adjacent second portions, the first main surface has a groove, and the bottom surface of the groove coincides with the first portion; A first optical adhesive layer, covering the first major surface of the cover plate, wherein a surface of the first optical adhesive layer away from the first major surface is a plane; and A second optical adhesive layer, covering the second major surface of the cover plate; Wherein, only one of the first optical adhesive layer and the second optical adhesive layer covers the side surface of the cover plate.

8. The cover plate module according to claim 7, characterized in that: At the side surface of the cover plate, the first optical adhesive layer covers the side surface of the cover plate; Preferably, the distance between the surface of the first optical adhesive layer away from the side surface of the cover plate and the side surface of the cover plate is 0.05-0.5 mm; Preferably, the first main surface and the second main surface of the cover plate have a first area and a second area, the second area surrounds the first area, and the cover plate module further comprises an ink layer, the ink layer is located outside the first area and covers the second area; More preferably, The ink layer is located on the first main surface and between the first optical adhesive layer and the cover plate, and the edge of the ink layer is located between the junction of the side surface of the cover plate and the first main surface and the junction of the side surface of the cover plate and the second main surface; preferably, the ink layer covers a portion of the side surface of the cover plate, the edge of the first optical adhesive layer is coplanar with the second main surface of the cover plate, and the edge of the second optical adhesive layer is coplanar with the surface of the first optical adhesive layer on the side away from the side surface of the cover plate; or, The ink layer is located on the surface of the first optical adhesive layer away from the first main surface, and the outer edge of the ink layer is coplanar with the surface of the first optical adhesive layer away from the side surface of the cover plate; preferably, the cover plate module further comprises a third optical adhesive layer, the third optical adhesive layer covers the first main surface of the cover plate, the third optical adhesive layer is located on a side of the first optical adhesive layer away from the first main surface of the cover plate, the first optical adhesive layer is located between the third optical adhesive layer and the cover plate, and the ink layer is located between the first optical adhesive layer and the third optical adhesive layer; preferably, the edges of the second optical adhesive layer and the third optical adhesive layer are coplanar with the surface of the first optical adhesive layer on a side away from the side surface of the cover plate; or, The ink layer is located between the cover plate and the second optical adhesive layer, and is located on the second main surface of the cover plate; preferably, the outer edge of the ink layer is coplanar with the side surface of the cover plate; further preferably, the edge of the first optical adhesive layer is coplanar with the surface of the ink layer away from the second main surface, and the edge of the second optical adhesive layer is coplanar with the surface of the first optical adhesive layer on the side away from the side surface of the cover plate; or, The ink layer is located on the surface of the second optical adhesive layer away from the second main surface, and the outer edge of the ink layer is coplanar with the surface of the first optical adhesive layer away from the side surface of the cover plate; preferably, the edge of the first optical adhesive layer is coplanar with the second main surface of the cover plate; preferably, the edge of the second optical adhesive layer is coplanar with the surface of the first optical adhesive layer away from the side surface of the cover plate; further preferably, the cover plate module also includes a third optical adhesive layer, the third optical adhesive layer covers the first main surface of the cover plate, the second optical adhesive layer is located between the cover plate and the third optical adhesive layer, the ink layer is located between the second optical adhesive layer and the third optical adhesive layer, and the edge of the third optical adhesive layer and the edge of the second optical adhesive layer are both coplanar with the surface of the first optical adhesive layer away from the side surface of the cover plate.

9. A method for preparing a cover plate module, characterized in that: include: Providing a cover plate and performing a thinning process on the cover plate to form a groove, wherein the cover plate comprises a first main surface and a second main surface opposite to each other and a side surface located between the first main surface and the second main surface, the cover plate comprises at least one first portion formed by thinning and at least two second portions that are not thinned, the first portion is located between adjacent second portions, the first main surface forms the groove, and the bottom surface of the groove coincides with the first portion; Coating a first optical adhesive material on the cover plate, and curing the first optical adhesive material to form a first optical adhesive layer, wherein the first optical adhesive layer covers the first main surface and the side surface of the cover plate, and a surface of the first optical adhesive layer away from the first main surface is a plane; Coating a second optical adhesive material on the cover plate, and curing the second optical adhesive material to form a second optical adhesive layer, wherein the second optical adhesive layer covers the second main surface and the side surface of the cover plate; The first optical adhesive layer and the second optical adhesive layer are cut along a cutting line, wherein the cutting line is parallel to the side surface of the cover plate and is located between a surface of the first optical adhesive layer away from the side surface of the cover plate and the side surface of the cover plate before cutting.

10. A display module, characterized in that: A display panel and a cover module according to claim 7 or 8 or a cover module obtained by the preparation method according to claim 9, wherein: The cover plate module is located on the light emitting side of the display panel, and the groove of the cover plate in the cover plate module faces the display panel. The display panel includes a bending area and a non-bending area. The bending area is located within the orthographic projection of the first part on the display panel, and the orthographic projection of the second part on the display panel is located within the non-bending area.

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