Manufacturing method of double-sided display transparent screen adopting LED (light-emitting diode) chips

Abstract

The invention discloses a manufacturing method of a double-sided display transparent screen adopting LED chips, which is convenient to implement, a first insulating material layer is formed on a first surface of a transparent substrate in an injection molding manner, a second insulating material layer is formed on a second surface of the transparent substrate in an injection molding manner, and the manufacturing method is convenient to implement. A first unit box dam used for defining a plurality of first LED light-emitting unit cavities is conveniently arranged on the first face of the transparent substrate, a second unit box dam used for defining a plurality of second LED light-emitting unit cavities is conveniently arranged on the second face of the transparent substrate, follow-up optical crosstalk prevention between the LED light-emitting units is facilitated, and practicability is good; and subsequently, an IC chip and an LED chip which are electrically connected with the first circuit unit are arranged in the first LED light-emitting unit cavity, and an IC chip and an LED chip which are electrically connected with the first circuit unit are arranged in the second LED light-emitting unit cavity. Compared with the prior art, the technical scheme that the LED chips are welded and attached to the LED lamp bead seats to form LED lamp beads, and then the LED lamp beads are welded and attached to the substrate is adopted; according to the scheme, the LED chip is welded and mounted once, the procedure that the LED chip is welded and mounted on the LED lamp bead base to form the LED lamp bead is omitted, the situation that damage is easily caused by secondary welding and mounting is avoided, the production efficiency can be improved, and practicability is good.

Description

Technical Field

[0001] The invention relates to a method for manufacturing a double-sided display transparent screen using LED chips. Background Art

[0002] LED transparent display screens are used in more and more occasions for their unique invisible and transparent display effects. The transparent screens in the industry are mostly made by mounting and welding LED light-emitting diodes on a transparent substrate containing circuits. This transparent screen production process requires two production processes: LED packaging and mounting and welding. There are defects such as damage to the light-emitting tube during secondary mounting and high process production costs. It is necessary to solve this problem. Summary of the invention

[0003] The present invention overcomes the shortcomings of the above-mentioned technology and provides a method for manufacturing a double-sided display transparent screen using LED chips.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] A method for manufacturing a double-sided display transparent screen using LED chips, characterized by comprising the following steps:

[0006] Step 1, preparing a transparent substrate 1, wherein the first surface of the transparent substrate 1 carries the required first circuit unit 2, and the second surface of the transparent substrate 1 carries the required second circuit unit 4, and the position of the first circuit unit 2 is opposite to the position of the second circuit unit 4;

[0007] Step 2: installing an injection mold on the transparent substrate 1, and then performing injection molding, so that a first insulating material layer 3 is formed on the first surface of the transparent substrate 1 and a second insulating material layer 5 is formed on the second surface of the transparent substrate 1, wherein the first insulating material layer 3 includes a plurality of first unit dams 32 located on the first circuit unit 2 for enclosing a plurality of first LED light-emitting unit cavities 31, and the second insulating material layer 5 includes a plurality of second unit dams 52 located on the second circuit unit 4 for enclosing a plurality of second LED light-emitting unit cavities 51;

[0008] Step three, an IC chip and several LED chips electrically connected to the first circuit unit 2 are set in the first LED light-emitting unit cavity 31 by a machine, and then epoxy sealing glue is filled into the first LED light-emitting unit cavity 31; an IC chip and several LED chips electrically connected to the first circuit unit 2 are set in the second LED light-emitting unit cavity 51 by a machine, and then epoxy sealing glue is filled into the second LED light-emitting unit cavity 51.

[0009] Preferably, the first circuit unit 2 includes a power supply circuit for powering the IC chip and the LED chip and a communication circuit for communication with the IC chip, and the second circuit unit 4 includes a power supply circuit for powering the IC chip and the LED chip and a communication circuit for communication with the IC chip.

[0010] Preferably, in step two, the position of the first unit dam 32 is opposite to the position of the second unit dam 52 front and back, and the position of the first LED light-emitting unit cavity 31 corresponds to the solid position of the second unit dam 52, and the position of the second LED light-emitting unit cavity 51 corresponds to the solid position of the first unit dam 32.

[0011] Preferably, the transparent substrate 1 is provided with front-to-back through holes. In step 2, the first unit dam 32 and the second unit dam 52 which are located opposite to each other front to back are connected together through the front-to-back through holes.

[0012] Preferably, in step one, the first circuit units 2 are a plurality of first circuit units 2 arranged at intervals from left to right, each first circuit unit 2 extends up and down, the corresponding first unit dam 32 on each first circuit unit 2 is neatly arranged in a line up and down, the first unit dam 32 between adjacent first circuit units 2 is aligned left to right, and the first transparent partition area 11 of the transparent substrate 1 is between adjacent first circuit units 2; the second circuit units 4 are a plurality of second circuit units 4 arranged at intervals from left to right, each second circuit unit 4 extends up and down, the corresponding second unit dam 52 on each second circuit unit 4 is neatly arranged in a line up and down, the second unit dam 52 between adjacent second circuit units 4 is aligned left to right, and the second transparent partition area 12 of the transparent substrate 1 is between adjacent second circuit units 4, and the position of the first transparent partition area 11 is opposite to the position of the second transparent partition area 12 front to back.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The manufacturing method of the double-sided display transparent screen of the present invention is convenient to implement. The first insulating material layer is formed on the first surface of the transparent substrate and the second insulating material layer is formed on the second surface of the transparent substrate by injection molding. The implementation is convenient, and it is convenient to set a first unit dam for enclosing a plurality of first LED light-emitting unit cavities on the first surface of the transparent substrate and a second unit dam for enclosing a plurality of second LED light-emitting unit cavities on the second surface of the transparent substrate, which is convenient for the subsequent anti-cross-light setting between the LED light-emitting units and has good practicality. Subsequently, an IC chip and an LED chip electrically connected to the first circuit unit are set in the first LED light-emitting unit cavity, and an IC chip and an LED chip are set in the second LED light-emitting unit cavity. Compared with the technical solution of the prior art that first solders and mounts the LED chip on the LED lamp bead holder to form the LED lamp bead and then solders and mounts the LED lamp bead on the substrate, the LED chip of the present invention is soldered and mounted once, which eliminates the process of first soldering and mounting the LED chip on the LED lamp bead holder to form the LED lamp bead, and avoids the situation that the secondary soldering and mounting is easy to cause damage, which is conducive to improving production efficiency and has good practicality.

[0015] 2. The position of the first unit dam is front-to-back relative to the position of the second unit dam. On the one hand, it is convenient for the one-to-one correspondence between the front and rear LED light-emitting units when setting the LED light-emitting units. On the other hand, it can reduce the area occupied by the projections of the front and rear unit dams on the transparent substrate, which is beneficial to improving the transparent screen effect. In addition, the position of the first LED light-emitting unit cavity corresponds to the solid position of the second unit dam, which is beneficial to enhancing the strength of the transparent substrate at the first LED light-emitting unit cavity for facilitating the setting of IC chips and LED chips. The position of the second LED light-emitting unit cavity corresponds to the solid position of the first unit dam, which is beneficial to enhancing the strength of the transparent substrate at the second LED light-emitting unit cavity for facilitating the setting of IC chips and LED chips, and has good practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is one of the structural diagrams of the double-sided display transparent screen obtained by the manufacturing method of this case.

[0017] Figure 2 This is the second structural diagram of the double-sided display transparent screen obtained by the manufacturing method of this case.

[0018] Figure 3 This is the third structural diagram of the double-sided display transparent screen obtained by the manufacturing method of this case. DETAILED DESCRIPTION

[0019] The features of the present invention and other related features are further described in detail below through embodiments to facilitate understanding by those skilled in the art:

[0020] like Figures 1 to 3 As shown, a method for manufacturing a double-sided display transparent screen using LED chips includes the following steps:

[0021] Step 1, preparing a transparent substrate 1, wherein the first surface of the transparent substrate 1 carries the required first circuit unit 2, and the second surface of the transparent substrate 1 carries the required second circuit unit 4, and the position of the first circuit unit 2 is opposite to the position of the second circuit unit 4;

[0022] Step 2: installing an injection mold on the transparent substrate 1, and then performing injection molding, so that a first insulating material layer 3 is formed on the first surface of the transparent substrate 1 and a second insulating material layer 5 is formed on the second surface of the transparent substrate 1, wherein the first insulating material layer 3 includes a plurality of first unit dams 32 located on the first circuit unit 2 for enclosing a plurality of first LED light-emitting unit cavities 31, and the second insulating material layer 5 includes a plurality of second unit dams 52 located on the second circuit unit 4 for enclosing a plurality of second LED light-emitting unit cavities 51;

[0023] Step three, an IC chip and several LED chips electrically connected to the first circuit unit 2 are set in the first LED light-emitting unit cavity 31 by a machine, and then epoxy sealing glue is filled into the first LED light-emitting unit cavity 31; an IC chip and several LED chips electrically connected to the first circuit unit 2 are set in the second LED light-emitting unit cavity 51 by a machine, and then epoxy sealing glue is filled into the second LED light-emitting unit cavity 51.

[0024] As described above, in order to improve the transparent screen effect, the first insulating material layer 3 does not completely cover the first surface of the transparent substrate 1 , and the second insulating material layer 5 does not completely cover the second surface of the transparent substrate 1 .

[0025] As described above, the manufacturing method of the double-sided display transparent screen of the present invention is easy to implement. The first insulating material layer 3 is formed on the first surface of the transparent substrate 1 and the second insulating material layer 5 is formed on the second surface of the transparent substrate 1 by injection molding. The implementation is convenient, and it is convenient to set the first unit dam 32 for enclosing a plurality of first LED light-emitting unit cavities 31 on the first surface of the transparent substrate 1 and to set the second unit dam 52 for enclosing a plurality of second LED light-emitting unit cavities 51 on the second surface of the transparent substrate 1, which is convenient for the subsequent anti-cross-light setting between the LED light-emitting units, has good practicality, and the subsequent An IC chip and an LED chip electrically connected to the first circuit unit 2 are arranged in the first LED light-emitting unit cavity 31, and an IC chip and an LED chip are arranged in the second LED light-emitting unit cavity 51. Compared with the technical solution in the prior art of first welding and mounting the LED chip on the LED lamp bead holder to form the LED lamp bead and then welding and mounting the LED lamp bead on the substrate, the LED chip in this case is welded and mounted once, eliminating the step of first welding and mounting the LED chip on the LED lamp bead holder to form the LED lamp bead, avoiding the situation that the secondary welding and mounting is easy to cause damage, which is conducive to improving production efficiency and has good practicality.

[0026] As described above, in a specific implementation, the first circuit unit 2 includes a power supply circuit for connecting the IC chip and the LED chip with power and a communication circuit for connecting the IC chip with communication, and the second circuit unit 4 includes a power supply circuit for connecting the IC chip and the LED chip with power and a communication circuit for connecting the IC chip with communication. In addition, in a specific implementation, the IC chip and the LED chip in the same LED light-emitting unit cavity also have an electrical connection relationship, so that the operation of the LED chip can be controlled by the IC chip.

[0027] As described above, during the specific implementation, in step 2, the position of the first unit dam 32 is opposite to the position of the second unit dam 52 front to back, which, on the one hand, facilitates the one-to-one correspondence between the front and rear LED light-emitting units when setting the LED light-emitting units, and on the other hand, can reduce the area occupied by the projections of the front and rear unit dams on the transparent substrate 1, which is beneficial to improving the transparent screen effect. In addition, the position of the first LED light-emitting unit cavity 31 corresponds to the solid position of the second unit dam 52, which is beneficial to enhancing the strength of the transparent substrate 1 at the first LED light-emitting unit cavity 31 to facilitate the setting of IC chips and LED chips, and the position of the second LED light-emitting unit cavity 51 corresponds to the solid position of the first unit dam 32, which is beneficial to enhancing the strength of the transparent substrate 1 at the second LED light-emitting unit cavity 51 to facilitate the setting of IC chips and LED chips, and has good practicality.

[0028] As described above, in the specific implementation, the transparent substrate 1 is provided with front-to-back through holes. In step 2, the first unit dam 32 and the second unit dam 52 which are located front-to-back and opposite to each other are connected together through the front-to-back through holes to facilitate a more stable connection.

[0029] As described above, during the specific implementation, in step one, the first circuit units 2 are a plurality of first circuit units 2 arranged at intervals from left to right, each first circuit unit 2 extends up and down, the first unit dam 32 corresponding to each first circuit unit 2 is neatly arranged in a line up and down, the first unit dam 32 between adjacent first circuit units 2 is aligned left to right, the first transparent partition area 11 of the transparent substrate 1 is between adjacent first circuit units 2, the second circuit units 4 are a plurality of second circuit units 4 arranged at intervals from left to right, the second unit dam 52 corresponding to each second circuit unit 4 is neatly arranged in a line up and down, the second unit dam 52 between adjacent second circuit units 4 is aligned left to right, each second circuit unit 4 extends up and down, the second transparent partition area 12 of the transparent substrate 1 is between adjacent second circuit units 4, the position of the first transparent partition area 11 is opposite to the position of the second transparent partition area 12 front to back, so that the neat implementation of multiple circuit units on the transparent substrate 1 is facilitated, and the neat arrangement of the unit dam up and down, left to right and the neat arrangement of the LED light-emitting units up and down, left to right and right is facilitated.

[0030] As mentioned above, this case protects a method for manufacturing a double-sided display transparent screen using LED chips. All technical solutions that are identical or similar to the structure of this case should be deemed to fall within the scope of protection of this case.

Claims

1. A method for manufacturing a double-sided display transparent screen using LED chips, characterized in that The steps include: Step 1: prepare a transparent substrate (1), wherein the first surface of the transparent substrate (1) carries a desired first circuit unit (2), and the second surface of the transparent substrate (1) carries a desired second circuit unit (4), and the position of the first circuit unit (2) and the position of the second circuit unit (4) are opposite to each other in front and back; Step 2: installing an injection mold on the transparent substrate (1), and then performing injection molding, so that a first insulating material layer (3) is formed on the first surface of the transparent substrate (1) and a second insulating material layer (5) is formed on the second surface of the transparent substrate (1), wherein the first insulating material layer (3) includes a plurality of first unit dams (32) located on the first circuit unit (2) and used to enclose a plurality of first LED light-emitting unit cavities (31), and the second insulating material layer (5) includes a plurality of second unit dams (52) located on the second circuit unit (4) and used to enclose a plurality of second LED light-emitting unit cavities (51); Step three: using a machine to place an IC chip and a plurality of LED chips electrically connected to the first circuit unit (2) into the first LED light-emitting unit cavity (31), and then filling the first LED light-emitting unit cavity (31) with epoxy sealant; using a machine to place an IC chip and a plurality of LED chips electrically connected to the first circuit unit (2) into the second LED light-emitting unit cavity (51), and then filling the second LED light-emitting unit cavity (51) with epoxy sealant.

2. The method for manufacturing a double-sided display transparent screen using LED chips according to claim 1, characterized in that The first circuit unit (2) comprises a power supply circuit for supplying power to the IC chip and the LED chip and a communication circuit for supplying communication to the IC chip, and the second circuit unit (4) comprises a power supply circuit for supplying power to the IC chip and the LED chip and a communication circuit for supplying communication to the IC chip.

3. The method for manufacturing a double-sided display transparent screen using LED chips according to claim 1, characterized in that In step 2, the position of the first unit dam (32) is opposite to the position of the second unit dam (52) in front and back, and the position of the first LED light-emitting unit cavity (31) corresponds to the solid position of the second unit dam (52), and the position of the second LED light-emitting unit cavity (51) corresponds to the solid position of the first unit dam (32).

4. The method for manufacturing a double-sided display transparent screen using LED chips according to claim 3, characterized in that The transparent substrate (1) is provided with a front-to-back through hole. In step 2, a first unit dam (32) and a second unit dam (52) that are located opposite to each other are connected together through the front-to-back through hole.

5. A method for manufacturing a double-sided display transparent screen using LED chips according to claims 1-4, characterized in that In step 1, a plurality of first circuit units (2) are arranged in a left-right interval, each first circuit unit (2) extends up and down, a corresponding first unit dam (32) on each first circuit unit (2) is neatly arranged in a line in the upper and lower directions, the first unit dams (32) between adjacent first circuit units (2) are aligned left and right, a first transparent partition area (11) of the transparent substrate (1) is located between adjacent first circuit units (2), a plurality of second circuit units (4) are arranged in a left-right interval, each second circuit unit (4) extends up and down, a corresponding second unit dam (52) on each second circuit unit (4) is neatly arranged in a line in the upper and lower directions, the second unit dams (52) between adjacent second circuit units (4) are aligned left and right, a second transparent partition area (12) of the transparent substrate (1) is located between adjacent second circuit units (4), and the position of the first transparent partition area (11) is opposite to the position of the second transparent partition area (12) in the front and back directions.

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