Ka frequency modulation continuous wave transceiver module based on multifunctional chip

Abstract

The invention discloses a Ka frequency modulation continuous wave transceiver module based on a multifunctional chip. The Ka frequency modulation continuous wave transceiver module comprises the multifunctional chip, a power supply unit, a receiving unit, an intermediate frequency output unit and a transmitting unit, the power supply unit is respectively connected with the multifunctional chip and the transmitting unit, and the multifunctional chip is respectively connected with the receiving unit, the intermediate frequency output unit and the transmitting unit. According to the invention, functions are integrated in the multifunctional chip, so that the circuit structure of the module is simplified, and the device cost and the production cost are reduced; as the devices are greatly reduced, the size and the weight are greatly reduced; the reliability of the system module is improved, the power consumption is lower, and the reliability of the module is also improved.

Description

Technical Field

[0001] The invention belongs to the field of communication technology, and in particular relates to a Ka frequency modulation continuous wave transceiver module based on a multifunctional chip. Background Art

[0002] Traditional Ka frequency modulation continuous wave transceiver module such as Figure 6 As shown, a separation circuit is used to generate a millimeter-wave linear frequency modulation signal, amplify the linear frequency modulation signal and transmit it, and receive the echo signal to obtain an intermediate frequency signal through mixing. The frequency source part is composed of a temperature-compensated crystal oscillator, a phase-locked loop, a loop filter, an operational amplifier, a VCO, a CPLD, a bandpass filter, a resistor divider network, and a frequency multiplier. It generates a linear frequency modulation signal with a center frequency of f0 / 4, and multiplies it to f0 frequency through a quadrupler; the transmitting part is composed of a bandpass filter, a driving amplifier, a power amplifier, and a power divider. After the signal is filtered through the bandpass filter, it is saturated amplified by the driving amplifier and the power amplifier, and is output into two paths through the power divider; the receiving part is composed of a low-noise amplifier, a combiner, a bandpass filter, a driving amplifier, a mixer, a temperature-compensated attenuator, and a low-pass filter. After the received signal is amplified by the low-noise amplifier, the two received paths are combined into one path through the combiner and enter the bandpass filter for filtering, amplified by the driving amplifier, mixed into the intermediate frequency by the mixer, and then output after passing through the temperature-compensated attenuator and the low-pass filter.

[0003] Traditional Ka frequency-modulated continuous wave transceiver modules use discrete devices for circuit construction. They are large in size, high in price, low in modularity, poor in development efficiency, and have a single product variety and function. They can no longer meet the needs of domestic weapon system development and have severely restricted the development of professional technology. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a Ka frequency-modulated continuous wave transceiver module based on a multifunctional chip.

[0005] The present invention is achieved through the following technical solutions.

[0006] The present invention provides a Ka frequency modulation continuous wave transceiver module based on a multifunctional chip, comprising: a multifunctional chip, a power supply unit, a receiving unit, an intermediate frequency output unit and a transmitting unit; the power supply unit is respectively connected to the multifunctional chip and the transmitting unit, and the multifunctional chip is respectively connected to the receiving unit, the intermediate frequency output unit and the transmitting unit;

[0007] The multifunctional chip is used to realize the generation and amplification of the transmission signal, realize the amplification, mixing and intermediate frequency filtering of the received signal and then amplification, and configure and control the gain of the receiving end;

[0008] The power supply unit is used to supply power to the multifunctional chip and the transmitting unit;

[0009] The receiving unit is used to receive signals, amplify the front-stage low noise, and optimize the noise coefficient of the receiving channel;

[0010] The transmitting unit is used to increase the output power of the transmitting signal;

[0011] The intermediate frequency output unit is used to achieve gain variation requirements over the full temperature range.

[0012] Preferably, the multifunctional chip comprises: a first low noise amplifier, a mixer, a high pass filter, a low pass filter, an adjustable gain amplifier, a register, a frequency source and a first power amplifier;

[0013] The first low noise amplifier is connected to a mixer, the mixer is connected to a high pass filter, the high pass filter is connected to a low pass filter, the low pass filter is connected to an adjustable gain amplifier, the register is connected to a frequency source, and the frequency source is respectively connected to the mixer and the first power amplifier.

[0014] Preferably, the power supply unit comprises: a chip power supply circuit and a power amplifier power supply circuit; the chip power supply circuit is connected to the multifunctional chip, and the power amplifier power supply circuit is connected to the first power amplifier in the multifunctional chip.

[0015] Preferably, the chip power supply circuit comprises a first voltage converter, a first voltage regulator and a second voltage regulator; the first voltage converter is connected to the first voltage regulator and the second voltage regulator respectively.

[0016] Preferably, the power amplifier power supply circuit comprises a second voltage converter, a third voltage regulator and a fourth voltage regulator; the second voltage converter is connected to the third voltage regulator and the fourth voltage regulator respectively.

[0017] Preferably, the receiving unit includes a first receiving antenna, a second receiving antenna, a second low-noise amplifier, a third low-noise amplifier and a synthesizer; the first receiving antenna is connected to the second low-noise amplifier, the second low-noise amplifier is connected to the synthesizer, the second receiving antenna is connected to the third low-noise amplifier, the third low-noise amplifier is connected to the synthesizer, and the synthesizer is connected to a multi-function chip.

[0018] Preferably, the intermediate frequency output unit comprises: a filter and a temperature-compensated attenuator; and the filter is connected to the temperature-compensated attenuator.

[0019] Preferably, the transmitting unit comprises a second power amplifier, a power divider, a first transmitting antenna and a second transmitting antenna; the second power amplifier is connected to the power divider, and the power divider is connected to the first transmitting antenna and the second transmitting antenna respectively.

[0020] Preferably, it further comprises: a cavity, wherein a waveguide port is arranged on the cavity, wherein the waveguide port is respectively connected to the first transmitting antenna and the second transmitting antenna, and wherein the receiving unit and the transmitting unit are respectively connected to the waveguide port.

[0021] Preferably, it also includes: a cover plate, a multi-layer PCB board, a microwave board, an insulator connector and a SSMP connector;

[0022] The cavity is provided with several layers, the cover plate, the multi-layer PCB board and the microwave board are respectively arranged in the cavity, the multi-function chip, the power supply unit and the intermediate frequency output unit are fixed on the multi-layer PCB board, and the multi-function chip, the power supply unit and the intermediate frequency output unit are connected through the multi-layer PCB board;

[0023] The receiving unit and the transmitting unit are fixed on the microwave board, the multi-layer PCB board is connected to the microwave board through an SSMP connector, and the power supply unit is respectively connected to the receiving unit and the transmitting unit through an insulator connector.

[0024] The beneficial effects of the present invention are:

[0025] 1. By integrating functions into a multifunctional chip, the circuit structure of the module is simplified, and the device cost and production cost are reduced;

[0026] 2. Due to the large reduction of devices, its volume and weight are greatly reduced;

[0027] 3. The reliability of the system module is increased, the power consumption is lower, and the reliability of the module is also improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of the Ka frequency modulation continuous wave transceiver module provided in an embodiment of the present invention;

[0029] Figure 2 is a schematic diagram of the structure of a multifunctional chip provided by an embodiment of the present invention;

[0030] Figure 3 is a schematic diagram of the connection relationship of the multifunctional chip provided by an embodiment of the present invention;

[0031] Figure 4 is a plan view of a cavity and an antenna structure provided by an embodiment of the present invention;

[0032] Figure 5 is a schematic cross-sectional view of the internal structure of a cavity provided by an embodiment of the present invention;

[0033] Figure 6 It is a structural schematic diagram of the prior art. DETAILED DESCRIPTION

[0034] The technical solution of the present invention is further described below, but the scope of protection claimed is not limited to the description.

[0035] like Figure 1-3 As shown, a Ka frequency modulation continuous wave transceiver module based on a multifunctional chip comprises: a multifunctional chip, a power supply unit, a receiving unit, an intermediate frequency output unit and a transmitting unit; the power supply unit is respectively connected to the multifunctional chip and the transmitting unit, and the multifunctional chip is respectively connected to the receiving unit, the intermediate frequency output unit and the transmitting unit;

[0036] The multifunctional chip is used to realize the generation and amplification of the transmission signal, the amplification, mixing and intermediate frequency filtering of the received signal, and the configuration and control of the receiving end gain;

[0037] like Figure 2 As shown, the multifunctional chip includes: a first low noise amplifier, a mixer, a high pass filter, a low pass filter, an adjustable gain amplifier, a register, a frequency source and a first power amplifier;

[0038] The first low-noise amplifier is connected to a mixer, the mixer is connected to a high-pass filter, the high-pass filter is connected to a low-pass filter, the low-pass filter is connected to an adjustable gain amplifier, the register is connected to a frequency source, and the frequency source is respectively connected to the mixer and the first power amplifier. The multifunctional chip has a low price and a small size. The multifunctional chip can independently complete the generation and amplification of the transmitted frequency modulation signal through the cooperation of the register, the frequency source and the first power amplifier, and the received signal is amplified, mixed and intermediate frequency filtered and then amplified through the cooperation of the first low-noise amplifier, the mixer, the high-pass filter, the low-pass filter and the frequency source.

[0039] The power supply unit is used to supply power to the multifunctional chip and the transmitting unit;

[0040] The power supply unit comprises: a chip power supply circuit and a power amplifier power supply circuit; the chip power supply circuit is connected to the multifunctional chip, and the power amplifier power supply circuit is connected to the first power amplifier in the multifunctional chip.

[0041] The chip power supply circuit includes a first voltage converter, a first voltage regulator and a second voltage regulator; the first voltage converter is connected to the first voltage regulator and the second voltage regulator respectively.

[0042] The power amplifier power supply circuit includes a second voltage converter, a third voltage regulator and a fourth voltage regulator; the second voltage converter is connected to the third voltage regulator and the fourth voltage regulator respectively.

[0043] In this embodiment, the chip power supply circuit first outputs a +3.6V power supply through the first voltage converter, and then outputs +3.3V and +1.2V power supplies through the first voltage regulator and the second voltage regulator to power the multi-functional chip; the power amplifier power supply circuit first outputs a +6.5V power supply through the second voltage converter, and then outputs +6V and +5V power supplies through the third voltage regulator and the fourth voltage regulator to power the transmitting unit.

[0044] Among them, the power supply is shared, so it is necessary to do a good job of power supply filtering, reduce the length of the power line, and reduce coupling to ensure that the power quality is good enough, and further make the Ka frequency modulation continuous wave transceiver module smaller in size.

[0045] In this embodiment, the first voltage converter and the second voltage converter are DC-DC voltage converters, and the first voltage regulator, the second voltage regulator, the third voltage regulator and the fourth voltage regulator are all LDO voltage regulators.

[0046] The receiving unit is used to receive signals, amplify the front-stage low noise, and optimize the receiving channel noise coefficient;

[0047] The receiving unit includes a first receiving antenna, a second receiving antenna, a second low-noise amplifier, a third low-noise amplifier and a synthesizer; the first receiving antenna is connected to the second low-noise amplifier, the second low-noise amplifier is connected to the synthesizer, the second receiving antenna is connected to the third low-noise amplifier, the third low-noise amplifier is connected to the synthesizer, and the synthesizer is connected to a multi-function chip.

[0048] The receiving unit realizes the requirements of reception and receiving gain. In this embodiment, the millimeter wave low noise amplifier, i.e., LNA, selected by the receiving unit has excellent in-band flatness, with fluctuation better than 1dB within the module operating frequency band, noise coefficient better than 2.5dB, and receiving gain not less than 12dB.

[0049] The transmitting unit is used to increase the output power of the transmitting signal;

[0050] The transmitting unit includes a second power amplifier, a power divider, a first transmitting antenna and a second transmitting antenna; the second power amplifier is connected to the power divider, and the power divider is connected to the first transmitting antenna and the second transmitting antenna respectively.

[0051] Due to the multifunctional chip process, in order to achieve the output power requirements and two-way output, the transmitting unit needs to be assisted, in which the second power amplifier works to saturation to reduce the output power change with the operating temperature. In this way, the Ka-band power amplifier determines the output power of the transmitting channel signal;

[0052] In this embodiment, the transmitting unit is intended to use a high-efficiency 1W power amplifier chip manufactured using GaAs technology.

[0053] The intermediate frequency output unit is used to achieve gain variation requirements over the full temperature range.

[0054] The intermediate frequency output unit comprises: a filter and a temperature-compensated attenuator; the filter is connected to the temperature-compensated attenuator.

[0055] The intermediate frequency output unit realizes the gain variation requirement over the full temperature range. In this embodiment, the gain variation of the RF receiving front end of the multifunctional chip is less than 1.5dB, and the gain temperature variation of the low noise amplifier is less than 1dB. A temperature compensation chip with 3dB temperature compensation capability can be used.

[0056] The Ka frequency modulated continuous wave transceiver module further includes: a cavity 1, on which a waveguide port 5 is provided, the waveguide port 5 is respectively connected to the first transmitting antenna and the second transmitting antenna, and the receiving unit and the transmitting unit are respectively connected to the waveguide port 5.

[0057] like Figure 4 As shown, it is a schematic diagram of the upper surface of the cavity 1 provided in this embodiment, wherein TX1 and TX2 represent the first transmitting antenna and the second transmitting antenna, RX1 and RX2 represent the first receiving antenna and the second receiving antenna, LNA1 and LNA2 represent low noise amplifiers, and PA1 and PA2 represent power amplifiers.

[0058] like Figure 5 As shown, the Ka frequency modulated continuous wave transceiver module also includes: a cover plate 2, a multi-layer PCB board 3, a microwave board 4, an insulator connector 6 and a SSMP connector 7;

[0059] The cavity 1 is provided with several layers, the cover plate 2, the multi-layer PCB board 3 and the microwave board 4 are respectively arranged in the cavity 1, the multi-function chip, the power supply unit and the intermediate frequency output unit are fixed on the multi-layer PCB board 3, and the multi-function chip, the power supply unit and the intermediate frequency output unit are connected through the multi-layer PCB board 3;

[0060] The receiving unit and the transmitting unit are fixed on the microwave board 4, the multi-layer PCB board 3 is connected to the microwave board via the SSMP connector 7, and the power supply unit is respectively connected to the receiving unit and the transmitting unit via the insulator connector 6.

[0061] Insulator connectors are used to achieve vertical feeding of multi-layer PCB boards.

[0062] Through Figure 5 According to the structural setting shown, the overall structural dimensions of the transceiver module are estimated to be approximately 30 mm in diameter and 15 mm in height.

[0063] The present invention simplifies the circuit structure of the module and reduces the device cost and production cost by integrating functions into a multifunctional chip; since a large number of devices are reduced, the volume and weight are greatly reduced; the reliability of the system module is increased, the power consumption is lower, and the reliability of the module is also improved.

Claims

1. A Ka frequency modulated continuous wave transceiver module based on a multifunctional chip, characterized in that: include: Multifunctional chip, power supply unit, receiving unit, intermediate frequency output unit and transmitting unit; The power supply unit is respectively connected to the multifunctional chip and the transmitting unit, and the multifunctional chip is respectively connected to the receiving unit, the intermediate frequency output unit and the transmitting unit; The multifunctional chip is used to realize the generation and amplification of the transmission signal, realize the amplification, mixing and intermediate frequency filtering of the received signal and then amplification, and configure and control the gain of the receiving end; The power supply unit is used to supply power to the multifunctional chip and the transmitting unit; The receiving unit is used to receive signals, amplify the front-stage low noise, and optimize the receiving channel noise coefficient; The transmitting unit is used to increase the output power of the transmitting signal; The intermediate frequency output unit is used to achieve gain variation requirements over the full temperature range.

2. The Ka frequency modulated continuous wave transceiver module as claimed in claim 1, characterized in that: The multifunctional chip comprises: a first low noise amplifier, a mixer, a high pass filter, a low pass filter, an adjustable gain amplifier, a register, a frequency source and a first power amplifier; The first low noise amplifier is connected to a mixer, the mixer is connected to a high pass filter, the high pass filter is connected to a low pass filter, the low pass filter is connected to an adjustable gain amplifier, the register is connected to a frequency source, and the frequency source is respectively connected to the mixer and the first power amplifier.

3. The Ka frequency modulated continuous wave transceiver module as claimed in claim 1, characterized in that: The power supply unit comprises: a chip power supply circuit and a power amplifier power supply circuit; the chip power supply circuit is connected to the multifunctional chip, and the power amplifier power supply circuit is connected to the first power amplifier in the multifunctional chip.

4. The Ka frequency modulated continuous wave transceiver module as claimed in claim 3, characterized in that: The chip power supply circuit includes a first voltage converter, a first voltage regulator and a second voltage regulator; the first voltage converter is connected to the first voltage regulator and the second voltage regulator respectively.

5. The Ka frequency modulated continuous wave transceiver module as claimed in claim 3, characterized in that: The power amplifier power supply circuit includes a second voltage converter, a third voltage regulator and a fourth voltage regulator; the second voltage converter is connected to the third voltage regulator and the fourth voltage regulator respectively.

6. The Ka frequency modulated continuous wave transceiver module as claimed in claim 1, characterized in that: The receiving unit includes a first receiving antenna, a second receiving antenna, a second low-noise amplifier, a third low-noise amplifier and a synthesizer; the first receiving antenna is connected to the second low-noise amplifier, the second low-noise amplifier is connected to the synthesizer, the second receiving antenna is connected to the third low-noise amplifier, the third low-noise amplifier is connected to the synthesizer, and the synthesizer is connected to a multi-function chip.

7. The Ka frequency modulated continuous wave transceiver module as claimed in claim 1, characterized in that: The intermediate frequency output unit comprises: a filter and a temperature-compensated attenuator; the filter is connected to the temperature-compensated attenuator.

8. The Ka frequency modulated continuous wave transceiver module as claimed in claim 1, characterized in that: The transmitting unit includes a second power amplifier, a power divider, a first transmitting antenna and a second transmitting antenna; the second power amplifier is connected to the power divider, and the power divider is connected to the first transmitting antenna and the second transmitting antenna respectively.

9. The Ka frequency modulated continuous wave transceiver module as claimed in claim 1, characterized in that: Also includes: A cavity (1), wherein a waveguide port (5) is provided on the cavity (1), wherein the waveguide port (5) is respectively connected to a first transmitting antenna and a second transmitting antenna, and wherein the receiving unit and the transmitting unit are respectively connected to the waveguide port (5).

10. The Ka frequency modulated continuous wave transceiver module as claimed in claim 9, characterized in that: Also includes: A cover plate (2), a multi-layer PCB board (3), a microwave board (4), an insulator connector (6) and a SSMP connector (7); The cavity (1) is provided with a plurality of layers, the cover plate (2), the multi-layer PCB board (3) and the microwave board (4) are respectively arranged in the cavity (1), the multi-function chip, the power supply unit and the intermediate frequency output unit are fixed on the multi-layer PCB board (3), and the multi-function chip, the power supply unit and the intermediate frequency output unit are connected via the multi-layer PCB board (3); The receiving unit and the transmitting unit are fixed on a microwave board (4), the multilayer PCB board (3) is connected to the microwave board via an SSMP connector (7), and the power supply unit is respectively connected to the receiving unit and the transmitting unit via an insulator connector (6).

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