Electrodynamic loudspeaker with micro electro mechanical system

Abstract

The invention relates to the technical field of loudspeakers, in particular to an electrodynamic loudspeaker with a micro-electro-mechanical system (MEMS), the MEMS loudspeaker being assembled and structured by at least one liquid metal membrane, the apparatus comprising: a noise reduction module configured to reduce noise without a plurality of software interfaces; the static part comprises at least one silicon frame, and the silicon frame serves as a platform of a universal magnet; and the moving part comprises at least one liquid metal diaphragm, the liquid metal diaphragm is fixed at the top of the silicon frame, the liquid metal diaphragm is used as a constituent part of at least one microphone or loudspeaker, and the liquid metal diaphragm is made of gallium or indium alloy materials. According to the equipment, the original design is deeply changed in the aspects of material science, an electric power system and sound effect optimization, and quantum calculation, a liquid metal diaphragm, wireless electric power transmission and a nanometer manufacturing technology are fused. The sound quality, the energy efficiency and the customization capability are remarkably improved through the innovativeness.

Description

[Technical field]

[0001] The present invention relates to the technical field of loudspeakers, and in particular to an electric loudspeaker with a micro-electromechanical system. [Background technology]

[0002] MEMS is a technology that integrates computers with micro-mechanical devices such as sensors, valves, gears, mirrors, and actuators into semiconductor chips. Basically, a MEMS device contains a tiny silicon chip with some mechanical devices such as mirrors or sensors integrated on it. Such chips have the potential to be mass-produced at low cost, making them cost-effective in many applications. With the rise of the electronics industry, there is currently a growing market demand for a variety of embedded audio devices, including at least multimedia and mobile devices such as hearing aids, headphones (headphones), mobile phones, smartphones, PDAs and tablets, as well as personal computers. These devices need to be thinner and lighter without sacrificing the device's ability to improve performance and ensure that they can be properly integrated into certain small devices.

[0003] MEMS technology can be considered as an alternative for the development of small micro-speaker technology and structure. This technology will eventually enable high-precision manufacturing, uniform acoustic structures, and improved batch processing capabilities, so that the final manufacturing cost remains low enough, which is currently lacking in small speakers, although this technology has been applied to some extent in macro-machining precision technology.

[0004] There are still limited efforts to develop such small devices using conventional technologies to improve their performance parameters such as sound quality and sound pressure while reducing energy consumption. The main reason for the limited development of these small devices is that the technical complexity of the integration and structure requirements ultimately leads to a significant reduction in the physical size of the micro speakers. Although there have been some efforts in the development of electrodynamic MEMS speakers, their acoustic performance (such as sound quality and sound pressure level) still lags behind that of conventional micro speakers.

[0005] The causes of the aforementioned problems include: non-uniformity of moving parts in the structure, leads (interconnections) between the deformable diaphragm, the planar coil and the contact pad, and small electromagnetic forces generated between the coil and the magnet, the nonlinear behavior of these electromagnetic forces and the numerous structural modes lead to a certain degree of sound distortion. Considering the problems existing in the conventional and existing technologies, it is urgent to provide a small MEMS speaker that can achieve improved broadband sound effects and maintain consistent playback quality. [Summary of the invention]

[0006] The main purpose of the present invention is to overcome the deficiencies in the prior art and provide an electrodynamic speaker with a micro-electromechanical system.

[0007] The technical solution adopted by the present invention to achieve its technical purpose is: an electric speaker with a micro-electromechanical system, including a MEMS speaker, the MEMS speaker is assembled and structured by at least one liquid metal diaphragm, and the device includes:

[0008] (a) A noise reduction module configured to reduce noise without multiple software interfaces;

[0009] (b) a static part comprising at least one silicon frame serving as a platform for the universal magnet;

[0010] (c) A moving part, including at least one liquid metal diaphragm, wherein the liquid metal diaphragm is fixed on the top of the silicon frame, wherein the liquid metal diaphragm serves as a component of at least one microphone or speaker, and the liquid metal diaphragm is made of gallium or indium alloy material.

[0011] Preferably, it also includes a connector, wherein the connector is in the form of at least one lead, forming a plurality of arms to constitute a connecting arm. Preferably, it also includes a thin conductor connecting arm, wherein the thin conductor connecting arm is evenly and diagonally distributed on the arm of the liquid metal diaphragm.

[0012] Preferably, the thin conductor connecting arm is used to connect at least one planar micro coil and a plurality of connecting arms.

[0013] Preferably, the liquid metal diaphragm adopts a stiffness adjustment mechanism to improve the movement accuracy and expand the operation bandwidth, and then acts as an insulating layer to separate the at least one planar micro-coil from the connecting arm.

[0014] Preferably, the MEMS speaker comprises an acoustic hole for releasing the air volume in the back cavity under the diaphragm so as to release the air volume to the external environment.

[0015] Preferably, the silicon frame comprises a first silicon frame and a second silicon frame;

[0016] The first silicon frame serves as the moving part of the MEMS speaker, and the second silicon frame serves as the static part of the MEMS speaker.

[0017] Preferably, the static part comprises a silicon frame as a platform for the permanent magnet, an acoustic hole and the permanent magnet.

[0018] Preferably, the liquid metal diaphragm is forced to move by an electric actuator and connected to the center of the liquid metal diaphragm. Preferably, the thin conductor connecting arms are symmetrically distributed on the liquid metal diaphragm and move in a piston motion. Preferably, the liquid metal diaphragm is suspended on the diagonal spring structure of the thin conductor connecting arms, so that the thin conductor connecting arms are evenly distributed on the arms of the liquid metal diaphragm.

[0019] Preferably, the thin conductor connecting arm is protected by a liquid metal membrane, and the liquid metal membrane acts as a dielectric layer to separate the at least one connecting element from the planar microcoil.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The device uses a MEMS speaker, which is assembled and structured by at least one liquid metal diaphragm, a noise reduction module for reducing noise without multiple software interfaces, a static part for serving as a platform for universal magnets, and a moving part for making the liquid metal diaphragm a component of at least one microphone or speaker. And by improving and fine-tuning the mechanism of the liquid metal diaphragm stiffness, higher reliability and precision are ensured, so that the diaphragm can maintain optimal motion characteristics and better adapt to different frequencies and environmental conditions. In terms of material science, power systems and sound optimization, it has profoundly changed the original design, integrating quantum computing, liquid metal diaphragms, wireless power transmission and nano-manufacturing technologies. Its innovation significantly improves sound quality, energy efficiency and customization capabilities.

Brief Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 A cross-sectional perspective view of a device using a MEMS speaker.

[0024] Figure 2 A more detailed enlarged perspective cross-sectional view of a device using a MEMS speaker with a liquid metal diaphragm.

[0025] Figure 3 A detailed exploded view of the components of a device using a MEMS speaker.

[0026] Figure 4 An exploded perspective view of the moving parts of a device using a MEMS speaker.

[0027] Figure 5 Top view of the moving parts of a device using a MEMS speaker.

[0028] Figure 6 Another top view of the moving parts of a device using a MEMS speaker.

[0029] Among them: 1. MEMS speaker; 2. static part; 3. moving part; 4. first silicon frame; 5. second silicon frame; 6. permanent magnet; 7. acoustic hole; 8. liquid metal diaphragm; 9. planar micro coil; 10. thin conductor connecting arm; 11. connecting part; 12. contact pad; 13. liquid metal diaphragm arm. [Specific implementation method]

[0030] The above contents are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the scope of the principles of the present invention should be included in the protection scope of the present invention.

[0031] Typically, the present invention can be implemented in a single chip and used as an electronic component for audio signal processing. The chip is programmable and configurable, and can perform more complex tasks, such as microphone array signal processing, by connecting and combining multiple identical chips. Each chip can be used as an independent module and can be configured as a component with one or more audio signal processing functions. The size of each chip can be as small as a resistor or capacitor, has low power consumption and can be mass-produced at low cost. Therefore, the new invention can be implemented in a variety of different applications as an electronic component in system design.

[0032] Example:

[0033] like Figure 1-6 As shown, an embodiment of the present invention provides an electric speaker with a micro-electromechanical system, which preferably has a pair of stators and a diaphragm located between the stators. The speaker converts electrical audio input into acoustic output. In addition, it also includes a first dynamic speaker and a second dynamic speaker. All speakers are installed in a component, and the sound radiation openings on their front sides are roughly coplanar. The first dynamic speaker is packaged so that all its acoustic output is basically discharged from the package through the front opening of the speaker. The first dynamic speaker is powered by a first crossover network to receive audio input in the bass range below the first cutoff frequency. The second dynamic speaker is installed in the device so that its acoustic output is discharged through the front opening and the back opening of the speaker.

[0034] The present invention provides a method for using and implementing an electrodynamic speaker with a micro-electromechanical system, assembled and constructed by at least one liquid metal diaphragm 8, which can be used as a part of a microphone or a speaker. In addition, the device includes a noise reduction module for reducing noise without multiple software interfaces; a static part 2, including at least one silicon frame, designed as a platform for universal magnets; and a moving part 3, including at least one liquid metal diaphragm 8, which is fixed on top of the silicon frame.

[0035] The subject matter disclosed and claimed in the present invention also provides a system and method that can be used in a variety of different client devices, including but not limited to desktop computers, PDAs, smart phones, mobile phones, tablet computers, laptop computers, and any electronic / electrical devices containing speakers. Therefore, although the subject matter disclosed and claimed can be embodied in many different forms, the drawings and discussion are for the purpose of illustrating the principles and are not intended to be limited to any disclosed embodiment.

[0036] The following detailed description is intended to provide those of ordinary skill in the art with exemplary embodiments and is not intended to limit the disclosed and claimed subject matter to the precise disclosure, as those of ordinary skill in the art will appreciate that variations can be made within the scope of the described and claimed subject matter.

[0037] Speech signals captured by traditional microphones are often susceptible to noise, which degrades the perceived quality and intelligibility of speech.

[0038] In addition, noise in speech may deteriorate the performance of automatic speech recognition (hereinafter referred to as "ASR") systems, making them less accurate. Typically, speech systems / devices reduce noise in speech signals while maintaining overall speech quality through noise reduction or noise cancellation modules. Traditionally, speech systems / devices use general-purpose DSPs or CPUs to perform these techniques along with other applications. In the current invention, the entire noise reduction function is implemented on a liquid metal diaphragm, which can be an integral part of an electronic device such as a microphone or speaker. By using the present invention, the noise reduction module can be easily integrated into the application system without worrying about software interfaces or occupying the computing power of a general-purpose CPU.

[0039] Instead of basic AI calibration, a quantum-driven adaptive audio system is introduced. The system uses quantum sensors and quantum dots embedded in the diaphragm to adjust the frequency response at the molecular level. Quantum algorithms are able to adjust the ambient sound in real time, optimizing the sound based on the user's preferences and the surrounding acoustic conditions.

[0040] Wireless energy transmission is achieved by using magnetic induction, rather than relying on traditional wired power. This method enables energy to be wirelessly transmitted from an external source to the speaker, providing continuous power without battery support. The use of magnetic resonance further improves the range and efficiency of energy transmission. In terms of manufacturing technology, the traditional MEMS manufacturing is turned to nano-manufacturing technology to achieve scalable and modular production.

[0041] The present invention will now be discussed in detail separately or in combination with the accompanying drawings.

[0042] like Figure 1As shown, in order to achieve the above-mentioned object of the present invention, an electric speaker with a micro-electromechanical system includes a MEMS speaker 1 composed of at least two parts, such as a static part 2 and a moving part 3 for generating sound. In addition, the static part 2 includes a silicon frame or any suitable silicon frame 4 as a platform for a permanent magnet, such as an acoustic hole 7 and a permanent magnet 6. The static part structure of the device usually has a standard shape to contain the stator component of the electric MEMS speaker.

[0043] In a preferred embodiment, the structure of the moving part 3 is different from that of a common diaphragm, and includes a liquid metal diaphragm 8 including 8a and 8b fixed on the top of the second silicon frame 5.

[0044] The present embodiment also provides an electrostatic speaker system, which includes a first electrostatic speaker element having a first pair of stators and a first diaphragm located between the stators. The first diaphragm has a first area. The first electrostatic speaker element is configured to couple with a first electrostatic speaker drive circuit to receive an audio signal higher than a first predetermined frequency. The electrostatic speaker system also includes a second electrostatic speaker element having a second pair of stators and a second diaphragm located between the stators. The area of ​​the second diaphragm is greater than the area of ​​the first diaphragm.

[0045] In addition, there is an interconnection in the form of a wire for forming a thin conductor connection arm 10, which is evenly distributed on the liquid metal diaphragm 8 and connected to the planar micro coil 9 through the contact pad 12. The thin conductor connection arm 10 is evenly and diagonally distributed in the arm of the liquid metal diaphragm 8 so as to be connected to the planar micro coil 9 and the contact pad 12 through the connector 11 located between the two components. The thin conductor connection arm 10 is embedded in the liquid metal diaphragm 8, diagonally distributed, and protected by the liquid metal diaphragm 8, which acts as an insulating layer to separate the planar micro coil 9 and the thin conductor connection arm 10. Figure 1 As shown, the thin conductor connecting arm 10 has a symmetrical structure, which can realize piston-like movement in the diaphragm, thereby generating sound pressure and reducing high power consumption.

[0046] In a preferred embodiment, at least two micro-machined silicon frames, a first silicon frame 4 and a second silicon frame 5, are included; wherein the first silicon frame 4 is a micro-machined flexible film or a diaphragm located on a silicon wafer, serving as a sound generating part; and the second silicon frame 5 is a micro-machined silicon wafer, serving as a permanent magnet platform.

[0047] In a preferred embodiment, an acoustic hole 7 is also included to vent the air volume in the back cavity or chamber below the diaphragm to release sufficient air volume to the external environment. The two silicon frames are combined together to form an integrated electromechanical MEMS speaker device, such as Figure 1 and Figure 2The first silicon frame 4 is considered as the moving part that generates the sound pressure, and the second silicon frame 5 is considered as the static part for the device.

[0048] In a preferred embodiment, reference Figure 3 The static part 2 includes a silicon frame 4 as a permanent magnet platform, an acoustic hole 7 and a permanent magnet 6. The moving part 3 causes the generation of air pressure difference, which is the liquid metal diaphragm 8a-8b or dynamic structure. The liquid metal diaphragm 8a-8b is forced to move by an electric actuator and is connected to the center of the diaphragm.

[0049] In a preferred embodiment, a liquid metal diaphragm 8 is used to improve the displacement of the diaphragm. In addition, the liquid metal diaphragm is made of gallium or indium alloy material to ensure that the movement of the diaphragm remains on a straight path. In addition, a thin interconnection structure is evenly distributed on the diaphragm to ensure that the diaphragm can move in a "piston-like" manner.

[0050] The thin conductor connecting arm 10 is isolated and protected by the liquid metal diaphragm 8 to avoid cracks caused by the movement of the diaphragm. The liquid metal diaphragm 8b also serves as a dielectric layer to isolate the layer between the thin conductor connecting arm 10 and the planar micro-coil structure 9. The liquid metal diaphragm 8b acts as a rigid diaphragm structure, suspended on the four diagonal spring arm liquid metal diaphragms 8. The transmission of the electrical signal to the planar micro-coil 9 is to make the liquid metal diaphragm 8 vibrate, and the electrical signal is also connected to the contact pad 12 through the connector 11.

[0051] In a preferred embodiment, the stiffness of the liquid metal diaphragm 8 is enhanced by a precision adjustment mechanism, including material thickness optimization and integrated pre-strain methods. These improvements enable the diaphragm to maintain piston-like motion under high stress and variable frequency conditions, thereby ensuring stable performance.

[0052] In a preferred embodiment, if Figure 4 As shown, the moving part 3 is the part that causes the air pressure difference of the liquid metal diaphragm 8 or the dynamic structure. The liquid metal diaphragm 8 is forced to move by an electrodynamic actuator and is connected to the center of the diaphragm. In addition, in order to improve the displacement of the diaphragm, a liquid metal diaphragm material is used, which is also used to keep the movement of the diaphragm along a straight path. In addition, thin conductor connecting arms 10 are evenly distributed on the liquid metal diaphragm 8 to ensure that the diaphragm can move in a "piston-like" manner. The thin conductor connecting arms 10 are isolated and protected by the liquid metal diaphragm 8 to prevent cracking caused by the movement of the diaphragm. This liquid metal diaphragm 8b also serves as a dielectric layer to separate the layer between the interconnect structure 10 and the planar micro-coil structure 9.

[0053] In a preferred embodiment, the thin conductor connecting arm 10 is symmetrically structured. In addition, the center of the liquid metal diaphragm 8 is suspended on a diagonal spring structure so that it can be evenly distributed, and through this moving part structure, the diaphragm as the sound reproduction part can move in a piston-like manner. In addition, through this structure, the frequency bandwidth can be increased, thereby increasing the bandwidth overall.

[0054] The structure of the multi-turn planar microcoil 9 can be manufactured in a single or double layer form on the top and / or bottom of the diaphragm, and this stacked design can further improve the efficiency of the device. This change is due to the longer coil length, which can generate improved electromagnetic force even at low power consumption.

[0055] Embodiment 2:

[0056] like Figure 5 and Figure 6 As shown in the figure, the MEMS speaker is a miniature speaker based on micro-mechanical manufacturing technology, and is also used as a sound reproduction device, which uses an electromagnetic system as an actuator to vibrate the diaphragm. This movement of the diaphragm causes pressure changes in the air, which are perceived as changes in audio or sound. The vibration of the diaphragm is provided by an electromechanical drive system, while the working principle of the electrodynamic MEMS speaker is based on the Lorentz force actuator.

[0057] In science, Lorentz actuators are capable of producing large displacements. In physics, especially electromagnetism, the Lorentz force is a combination of the electric and magnetic forces on a point charge due to an electromagnetic field. If a charged particle with charge q moves with velocity v in the presence of an electric field EE and a magnetic field BB, it will experience a certain force.

[0058] When the signal current passes through the voice coil in the magnetic field of the micro-speaker, a force is generated to push the liquid metal diaphragm 8 of the speaker to move. According to the Lorentz force law FLorentzF_{\text{Lorentz}}, this force is equal to the product of the magnetic flux density BB, the coil length ll, and the time the current II flows in the coil, see formula 1:

[0059] F Lorentz =Bl I 1;

[0060] In the voice coil of a microspeaker, electrons move or oscillate along a common cylindrical path at a constant speed, generating an alternating magnetic field, which is called the Biot-Savart field. In physics, specifically in electromagnetism, the Biot-Savart law is an equation that describes the magnetic field generated by an electric current. The Biot-Savart law is dependent on the strength, direction, length of the magnetic field, and the proximity of the electric current. The law is valid under the magnetostatic approximation and is consistent with Ampere's loop law and Gauss's magnetic field law.

[0061] Microspeakers are essentially considered transducers because they convert electrical energy or signals, such as current flow, into mechanical acoustic energy. Without the interaction between the static magnetic field and the magnetic field generated by the changing electric charge, no acoustic output can be generated.

[0062] The force generated by the electrodynamic actuator is applied to a flexible diaphragm, causing the diaphragm to produce peak vibration. For example, Equation 2 shows that the effective sound pressure PrmsP_{\text{rms}} can be expressed by the peak displacement of the diaphragm xpeakx_{\text{peak}}, the diaphragm surface area SS, the vibration frequency ff, and the distance rr from the sound source to the listener.

[0063]

[0064] In addition, Formula 3 shows that for the sound pressure level calculation;

[0065]

[0066] Equations 2 and 3 show that for low frequencies, the displacement of the diaphragm needs to be large and depends on the distance between the microspeaker and the listener. A single small MEMS speaker reproduces sound with optimal performance in ear canal applications. However, in free-field applications, MEMS speakers can be effectively operated in an array. The sound pressure level of an array of MEMS speakers can be calculated using Equation 4 and also depends on other parameters such as distance.

[0067]

[0068] Table 1 shows an example of the sound pressure level calculation for a MEMS speaker at a predetermined distance in a free-field application. The MEMS speaker parameters used for this calculation include a diaphragm displacement of approximately 20 microns and a surface area of ​​3.98 microns, according to Equation 2. 2 , with a frequency of 1KHz. The power consumption is proportional to the transmission of the diaphragm displacement and also depends on other factors, such as the length of the coil, which can be generated within the fixed area of ​​the planar coil at the center of the diaphragm.

[0069] Table 1 shows an example of the sound pressure level versus distance for a MEMS speaker in a free-field application.

[0070]

[0071] The calculation of MEMS speakers in ear canal applications can be calculated using equations 5-7. Since the size of the microspeaker and the ear cavity is small compared to the wavelength of the sound wave, the sound pressure is evenly distributed in the space. The pressure change is proportional to the volume displacement of the diaphragm, expressed as:

[0072]

[0073]

[0074] Where P0 is the atmospheric pressure and V0 is the volume of the ear cavity, which is approximately 2 ml. The resulting sound pressure level SPL is defined as:

[0075]

[0076]

[0077] Table 2 shows an example of the sound pressure level of a MEMS speaker in an ear canal application. The parameters of the MEMS speaker applied to this calculation include factors such as the diaphragm displacement of approximately 20 microns and the frequency of 3.98 microns at 1 kHz, as calculated according to Equations 5-7. 2 The power consumption of the diaphragm is related to the transmission of the diaphragm displacement, depends on the length of the coil, and can be generated in the fixed area of ​​the planar coil in the center of the diaphragm.

[0078] Table 2 shows an example of the relationship between sound pressure level and volume displacement change for a MEMS speaker in an ear canal application.

[0079] Embodiment 3:

[0080] This is used for micro-electromechanical system speakers, MEMS speakers, displacement changes in ear canal applications. Electric MEMS speakers or micro speakers are manufactured through micromachining technology and are electroacoustic transducers that are able to convert electrical signal audio into acoustic signals or sounds. Generally, electric MEMS speakers can be divided into two parts: the electromechanical part and the mechanical acoustic part. These two parts are the basic components of electric MEMS speakers and determine their working principles. Therefore, these parts are considered as important components of sound reproduction and cannot be separated or ignored from other parts to ensure the proper functioning of the entire system.

[0081] For example, a MEMS speaker structure 1 consists of at least two parts: a static part 2 and a moving part 3, which together generate sound / audio. The static part 2 includes a silicon frame 4, which serves as a platform for permanent magnets, an acoustic hole 7 and permanent magnets 6. The static part 2 has a general shape similar to the stator assembly of an electrodynamic MEMS speaker.

[0082] In this embodiment, the moving part 3 is different from the ordinary diaphragm structure. The moving part includes a liquid metal diaphragm 8a and 8b fixed on the top of the silicon frame 5, and thin conductor connecting arms 10 formed by connecting arm leads are evenly distributed on the liquid metal diaphragm arms 13 to connect the planar microcoil 9 and contact the contact pad 12. The thin conductor connecting arms 10 are distributed diagonally along the liquid metal diaphragm arms 13, and the planar microcoil 9 is connected to the contact arm 12 through the through-hole connector 11 located between the two. The thin conductor connecting arms 10 are embedded in the liquid metal diaphragm, distributed diagonally, and protected by the liquid metal diaphragm 8. This liquid metal diaphragm 8 structure also acts as an insulating layer for isolating the planar microcoil 9 and the thin conductor connecting arms 10.

[0083] The entire moving part 3 structure described above can achieve the sound pressure output under the optimal performance of the MEMS speaker 1. This is due to the natural characteristics of the liquid metal diaphragm 8, which enables the diaphragm to achieve large displacement, thereby generating higher sound pressure. However, if certain components or forming elements in the system are removed or omitted, the entire electric MEMS speaker system will not work properly. The exception is that if the function of the device is reversed to a sound pressure sensor or microphone, this limitation can be ignored. This characteristic is attributed to the flexibility of the liquid metal diaphragm structure and its sensitivity to small external sound pressure and broadband frequency. Liquid metal not only has excellent fluidity and thermal conductivity, but also brings better sound pressure output and enhanced sound clarity. In addition, liquid metal also has self-healing properties, making it more durable and resilient in long-term use.

[0084] General advantages of electrostatic loudspeakers include: distortion levels one to two orders of magnitude lower than conventional drivers; extremely low mass of the diaphragm, which is driven evenly across its entire surface; and excellent frequency response both in amplitude and phase, as the force and pressure generating principles produce fewer resonances than the more common electrostatic drivers.

[0085] As will be appreciated by those skilled in the art, the present invention may be implemented in other specific forms without departing from its scope or essential features. Likewise, the specific naming and division of parts, modules, agents, managers, components, functions, processes, operations, layers, features, attributes, methodologies, and other aspects are not mandatory or significant, and the mechanisms for implementing the present invention or its features may have different names, divisions, and / or formats.

Claims

1. An electrodynamic loudspeaker having a micro-electromechanical system, characterized in that: The device comprises a MEMS speaker (1), wherein the MEMS speaker (1) is assembled and structured by at least one liquid metal diaphragm (8), and the device comprises: a noise reduction module configured to reduce noise without multiple software interfaces; a static part (2) comprising at least one silicon frame serving as a platform for the universal magnet; A moving part (3) comprises at least one liquid metal diaphragm (8), wherein the liquid metal diaphragm (8) is fixed on the top of a silicon frame, wherein the liquid metal diaphragm (8) serves as a component of at least one microphone or a loudspeaker.

2. The electrodynamic speaker with a micro-electromechanical system according to claim 1, characterized in that: It also includes a connecting piece (11), wherein the connecting piece (11) is in the form of at least one lead wire, forming a plurality of arms to constitute a connecting arm.

3. The electrodynamic speaker with a micro-electromechanical system according to claim 2, characterized in that: It also comprises thin conductor connecting arms (10), wherein the thin conductor connecting arms (10) are evenly and diagonally distributed on the arms of the liquid metal diaphragm (8).

4. The electrodynamic speaker with a micro-electromechanical system according to claim 3, characterized in that: The thin conductor connecting arm (10) is used to connect at least one planar micro coil (9) and a plurality of connecting arms.

5. The electrodynamic speaker with a micro-electromechanical system according to claim 4, characterized in that: The liquid metal diaphragm (8) uses a stiffness adjustment mechanism to improve motion accuracy and expand operating bandwidth, and then acts as an insulating layer to separate at least one planar microcoil (9) from the connecting arm.

6. The electrodynamic speaker with a micro-electromechanical system according to claim 1, characterized in that: The MEMS speaker (1) comprises an acoustic hole (7).

7. The electrodynamic speaker with a micro-electromechanical system according to claim 1, characterized in that: The silicon frame comprises a first silicon frame (4) and a second silicon frame (5); The first silicon frame (4) serves as the moving part of the MEMS speaker (1), and the second silicon frame (5) serves as the static part (2) of the MEMS speaker (1).

8. The electrodynamic speaker with a micro-electromechanical system according to claim 7, characterized in that: The static part (2) includes a silicon frame as a platform for the permanent magnet, an acoustic hole (7) and a permanent magnet (6).

9. The electrodynamic speaker with a micro-electromechanical system according to claim 1, characterized in that: The liquid metal diaphragm (8) is forced to move by an electric actuator and is connected to the center of the liquid metal diaphragm (8).

10. The electrodynamic speaker with a micro-electromechanical system according to claim 3, characterized in that: The thin conductor connecting arms (10) are symmetrically distributed on the liquid metal diaphragm (8) and move in a piston motion.

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