Display module preparation method and display module

Abstract

The invention provides a display module preparation method and a display module, and the preparation method comprises the steps: providing a substrate, and etching a groove in the surface of the substrate; a binding circuit is placed in the groove; the binding circuit is fixed in the groove in a magnetic control mode; a substrate is prepared on the surface, provided with the groove, of the base, and the binding circuit is fixed to the side, close to the base, of the substrate; a screen body layer is prepared on the side, away from the substrate, of the substrate, the screen body layer and the substrate are etched to form a wire passing hole, the screen body layer comprises a screen body circuit, and the screen body circuit is electrically connected with the binding circuit through the wire passing hole; stripping the substrate from the substrate to enable the binding circuit to be exposed out of one side, close to the substrate, of the substrate; and providing a binding assembly, and electrically connecting the binding circuit with the binding assembly. According to the method, the bound circuit is positioned and fixed in a magnetic control mode, and the frame of the screen body can be effectively reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module preparation method and a display module. Background Art

[0002] With the advancement of technology and the improvement of consumer aesthetics, terminal displays require the entire device to be lighter and thinner and the borders to be further compressed. However, the screen lines of the display module are currently led out from the display panel (also called the screen body) and the pad bending (substrate bending) process is used for line binding, resulting in a larger screen border and the inability to achieve the extremely narrow border requirement.

[0003] Therefore, it is necessary to improve the existing display module. Summary of the invention

[0004] The object of the present invention is to provide a display module preparation method and a display module, so as to solve the problem that the substrate bending process used in the prior art leads to a larger screen frame.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] In a first aspect, a method for preparing a display module is provided, the method comprising:

[0007] Providing a substrate,

[0008] Etching a groove on the surface of the substrate,

[0009] Place the binding wire in the groove,

[0010] The binding line is fixed in the groove by magnetic control,

[0011] A substrate is prepared on the surface of the substrate where the groove is formed, and the binding line is fixed on a side of the substrate close to the substrate;

[0012] A screen layer is prepared on a side of the substrate away from the base, and the screen layer and the substrate are etched to form a wire hole, wherein the screen layer includes a screen circuit, and the screen circuit is electrically connected to the binding circuit through the wire hole;

[0013] The substrate and the base are peeled off to expose the binding line on a side of the substrate close to the base,

[0014] A binding component is provided, and the binding line is electrically connected to the binding component.

[0015] Furthermore, the binding circuit is placed in a groove opened on the surface of the base and the binding circuit protrudes from the surface of the base, and the substrate covers the portion of the binding circuit protruding from the groove.

[0016] Preferably, the substrate comprises a glass substrate.

[0017] Furthermore, the depth of the groove etched on the substrate is between 7 and 10 μm.

[0018] Further, the binding circuit includes a connecting portion and a conductive contact piece fixed on the connecting portion;

[0019] Preferably, the binding circuit is formed by a metal rolling process, and the connecting portion comprises a metal substrate;

[0020] Preferably, the binding line is magnetic;

[0021] Preferably, the thickness of the binding circuit is greater than or equal to 20 μm. The electrical connection between the screen circuit and the chip (IC) and the flexible circuit board (FPC) in the binding area is mainly conducted through the conductive contact sheet. Since it is difficult to place multiple conductive contacts arranged in parallel in the groove, a metal substrate is used as a support when preparing the binding circuit to facilitate placing the entire binding circuit in the groove.

[0022] The thickness of the binding circuit is about 20μm. When the binding circuit is placed in the groove, the upper end of the binding circuit will be outside the groove and protrude from the surface of the glass substrate, so that the substrate coated on the surface of the glass substrate can effectively wrap the protruding part of the upper end of the binding circuit after solidification. The magnetic control is removed before laser peeling of the glass substrate and the substrate, so that the binding circuit will be detached from the groove of the glass substrate after laser peeling and fixedly embedded in the surface of the substrate.

[0023] Furthermore, the screen body layer includes a dam and an organic encapsulation layer, and the organic encapsulation layer is located in a region surrounded by the dam.

[0024] Furthermore, the screen body layer includes a packaging protection area and a cutting area, and the cutting area is outside the packaging protection area.

[0025] In the preparation area, the display screen layer is prepared by inkjet printing. The ink needs to spread and diffuse to form a uniform film layer. Therefore, in order to prevent the ink from overflowing outside the preparation area of ​​the display module, a dam needs to be set around the edge of the preparation area of ​​the display module to block the ink. There is a circle of encapsulation protection area outside the area surrounded by the dam. The encapsulation protection area is to prevent the edge of the laser cutting part from extending and causing damage to the display module, so the laser cutting part is located outside the encapsulation protection area.

[0026] Furthermore, when the substrate is cut, the connection part of the binding circuit is cut off. The connection part serves as a support for a plurality of conductive contacts arranged in parallel. When the screen circuit fan-out is electrically connected to the binding circuit, the conductive contact has been fixed and embedded in the surface of the substrate, so the connection part has lost its function. In order to minimize the size of the frame, the entire connection part can be cut off during laser cutting. Combined with the packaging protection area outside the dam, the cutting area is outside the packaging protection area and inside the connection part. This can ensure that the cutting does not damage the screen packaging and can also completely cut off the connection part to reduce the screen frame.

[0027] Furthermore, the magnetic control method includes:

[0028] A coil is arranged on a side of the substrate facing away from the groove,

[0029] After the binding line is placed in the groove, the coil is energized, and the binding line is adsorbed and positioned in the groove through the magnetic field generated by the coil.

[0030] Further, after the binding line is fixed to a side of the substrate close to the base, the magnetron is removed.

[0031] In a second aspect, the present invention provides a display module, wherein the display module is prepared by using any of the above-mentioned display module preparation methods. The display module comprises:

[0032] A substrate, the substrate comprising a first base layer, a first inorganic layer disposed on the first base layer, a second base layer disposed on the first inorganic layer, and a second inorganic layer disposed on the second base layer;

[0033] The display module also includes:

[0034] The screen layer is arranged on the second inorganic layer, and the screen layer includes a screen circuit.

[0035] In the area of ​​the display module frame, a binding circuit is embedded on the lower surface of the first base layer, and the metal substrate of the binding circuit has been removed during laser cutting, leaving a conductive contact sheet for connecting the screen body circuit and the binding component embedded on the lower surface of the first base layer and the conductive contact sheet is exposed to the outside, so as to facilitate subsequent connection with the binding component;

[0036] In the area of ​​the display module frame, a wire hole is opened on the substrate, and the wire hole passes through the first base layer, the first inorganic layer, the second base layer and the second inorganic layer and is connected to the conductive contact sheet located on the lower surface of the first base layer. A metal connecting wire is arranged in the wire hole by nanometal imprinting, one end of the metal connecting wire is connected to the screen body circuit, and the other end of the metal connecting wire is connected to the conductive contact sheet.

[0037] The display module also includes:

[0038] The dam is arranged on the surface of the second inorganic layer, and the dam is arranged around the outer periphery of the screen body layer. The number of layers of the dam is not less than one, and the extra part outside the outermost dam is the encapsulation protection area.

[0039] The advantages of the present invention are as follows:

[0040] A display module preparation method and a display module of the present invention eliminate the substrate bending process, open a groove on a substrate (such as a glass substrate), arrange a binding circuit in the groove, and use magnetic control to position and fix the binding circuit. Then, a hole is opened on the substrate so that the screen circuit is directly perforated from the back of the screen and then bound to the binding area component, which can effectively reduce the screen frame and achieve a narrow frame effect of the display module screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0042] Figure 1 FIG. 4 is a flow chart of a method for preparing a display module in an embodiment of the present invention.

[0043] Figure 2 FIG. 1 is a schematic diagram of the distribution of grooves formed on a glass substrate in an embodiment of the present invention.

[0044] Figure 3 It is a schematic diagram of a groove structure formed on the surface of a glass substrate in one embodiment of the present invention.

[0045] Figure 4 It is a schematic diagram of a binding circuit structure placed in a groove in one embodiment of the present invention.

[0046] Figure 5 FIG. 4 is a schematic diagram of a binding line structure in an embodiment of the present invention.

[0047] Figure 6 FIG. 1 is a schematic diagram of a frame portion during the preparation process of a display module in an embodiment of the present invention.

[0048] Figure 7 It is a schematic diagram of the structure of the frame portion of a display module in another embodiment of the present invention.

[0049] The components in the figure are shown as follows:

[0050] 1. Glass substrate; 2. Grooves; 3. Substrate; 31. First base layer; 32. First inorganic layer; 33. Second base layer; 34. Second inorganic layer; 4. Screen layer; 41. Screen circuit; 5. Binding circuit; 51. Metal substrate; 52. Conductive contact; 6. Dam; 7. Metal wire;

[0051] AA, display area; A, via-bonding line area; B, dam area; C, packaging protection area; D, cutting area. DETAILED DESCRIPTION

[0052] The preferred embodiments of the present invention are described below with reference to the drawings in the specification to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied through many different forms of embodiments of the invention, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0053] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0054] In addition, the following descriptions of the various embodiments of the invention are made with reference to the attached diagrams to illustrate specific embodiments of the invention that the present invention can be implemented with. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0055] When some components are described as being "on" another component, the component may be directly placed on the other component; there may also be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "mounted on" or "connected to" another component, the two may be understood to be directly "mounted on" or "connected", or one component may be indirectly "mounted on" or "connected to" another component via an intermediate component.

[0056] As described in the background technology, the circuits of the current display module are led out from the display panel (also called the screen body) and are bound using the padbending (substrate bending) process. The screen body circuits located at the lower frame part of the display area (also called the lower frame) need to be bent to the back of the module to be electrically connected to the binding components (such as ICs). This will result in a larger (wider) frame of the screen body. In the context of current terminal displays requiring the entire machine to be lightweight and have narrow frames, the product cannot meet the needs of consumers.

[0057] In response to the above problems, the inventors improved the preparation method of the display module by eliminating the pad bending process, opening a groove on the glass substrate, laying a binding circuit in the groove, and using magnetic control to position and fix the binding circuit. Then, a hole is opened on the substrate so that the screen circuit can be directly pierced from the back of the screen and bound to the binding area component. This can effectively reduce the screen frame, thereby reducing the size of the lower frame, and achieving a narrow frame (ultra-narrow frame) effect for the display module screen.

[0058] Based on the above concept, the present application will be exemplarily described below in conjunction with the accompanying drawings.

[0059] This embodiment provides a method for preparing a display module. Figure 1 As shown, the preparation method comprises:

[0060] S1. Provide a substrate, which may be a glass substrate.

[0061] S2, etching a groove on the surface of the substrate,

[0062] S3, place the binding line in the groove,

[0063] S4, fix the binding line in the groove by magnetic control,

[0064] S5, preparing a substrate on the surface of the substrate with a groove, and fixing the binding circuit on a side of the substrate close to the substrate;

[0065] S6. Prepare a screen layer on a side of the substrate away from the base, the screen layer and the substrate form a wire hole, the screen layer includes a screen circuit, and the screen circuit and the binding circuit are electrically connected through the wire hole;

[0066] The substrate and the base are peeled off to expose the binding line on the side of the substrate close to the base.

[0067] A binding component is provided to electrically connect the binding circuit to the binding component. The method uses magnetic control to position and fix the binding circuit, and then opens a hole on the substrate so that the screen circuit is directly perforated from the back of the screen and then bound to the binding area component, which can effectively reduce the screen frame and achieve a narrow frame effect for the display module screen.

[0068] In one embodiment, the method further includes cutting the substrate into a plurality of sub-substrates;

[0069] The cut sub-substrate is peeled off from the base to expose the binding circuit on the surface of the substrate.

[0070] A binding component is provided, and the binding line is electrically connected to the binding component.

[0071] It should be noted that in the above-mentioned display module preparation method, multiple display modules are prepared simultaneously on a substrate (such as a glass substrate). At this time, a whole substrate (also called a motherboard) is arranged on one side surface of the substrate, and then the substrate is divided into sub-substrates (sometimes also called substrates) of preset sizes by cutting.

[0072] like Figure 2 As shown, the substrate takes a glass substrate as an example, and the grooves 2 opened on the glass substrate 1 are based on a single display module preparation area, and the number and position of the grooves 2 opened in each display module preparation area are consistent.

[0073] In some embodiments, Figure 3 As shown, a groove 2 is etched on a glass substrate 1, the depth of the groove 2 is between 7 and 10 μm, and a binding line 5 is formed by a metal rolling process. Preferably, the thickness of the binding line 5 is about 20 μm. Figure 4 As shown, when the binding circuit 5 is placed in the groove 2, the upper end of the binding circuit 5 will be outside the groove 2 and protrude from the surface of the glass substrate 1, so that the substrate 3 (such as a PI substrate) coated on the surface of the glass substrate 1 can effectively wrap the protruding upper end of the binding circuit 5 after curing. Before the glass substrate 1 and the substrate 3 are peeled off (such as by laser peeling), the magnetron is removed, so that after the laser peeling of the glass substrate 1 and the substrate 3, the binding circuit 5 is separated from the groove 2 of the glass substrate 1 and fixedly embedded on the surface of the substrate 3.

[0074] In some embodiments, the binding wire 5 is formed by a metal rolling process, such as Figure 5 As shown, the binding circuit 5 includes a layer of connecting portion 51 and a plurality of conductive contacts 52 arranged in parallel on the connecting portion 51. The screen circuit 41 is electrically connected to the chip (IC) and the flexible circuit board (FPC) in the binding area mainly through the conductive contacts 52. Since it is difficult to place multiple conductive contacts 52 arranged in parallel in the groove 2, the connecting portion 51 is used as a support when preparing the binding circuit 5, so as to facilitate placing the entire binding circuit 5 in the groove 2. Preferably, the thickness of the binding circuit is greater than or equal to 20μm. Preferably, the binding circuit is magnetic.

[0075] like Figure 6As shown, the surface of the array substrate 3 includes several modules, one module is a preparation area of ​​a display module, and the preparation area includes an organic encapsulation layer prepared by inkjet printing. The ink needs to be spread and diffused to form a uniform film layer. Therefore, in order to prevent the ink from overflowing outside the preparation area of ​​the display module during the process, a dam 6 needs to be set around the edge of the preparation area of ​​the display module to block the ink.

[0076] In some embodiments, Figure 6 As shown, there is a circle of packaging protection area outside the area enclosed by the dam 6. The packaging protection area is to prevent the edge of the laser cutting part from extending to cause damage to the display module, so the laser cutting part is located outside the packaging protection area.

[0077] In some embodiments, the connecting portion 51 in the above-mentioned binding circuit 5 serves as a support for a plurality of conductive contacts 52 arranged in parallel. When the screen circuit 41 is fanned out and electrically connected to the binding circuit 5, the conductive contacts 52 are fixed and embedded in the surface of the substrate 3, so the connecting portion 51 has lost its function. In order to minimize the size of the frame, the entire connecting portion 51 can be removed during laser cutting, and the packaging protection area outside the dam 6 can be combined. Figure 6 As shown, the cutting area D is outside the packaging protection area and inside the connecting portion 51, so that it can be ensured that the cutting does not damage the screen packaging and the connecting portion 51 can be completely removed, which can reduce the screen frame (width).

[0078] In some embodiments, the magnetic control method includes:

[0079] A coil is arranged on the side of the glass substrate 1 away from the groove 2.

[0080] The binding line 5 is placed in the groove 2 and the coil is energized, so that the binding line 5 is adsorbed and positioned in the groove 2 through the magnetic field generated by the coil.

[0081] It should be noted that the coil can be directly arranged on the carrier on the back of the glass substrate 1 , and the energized coil can be removed after the binding circuit 5 is fixed in the groove 2 and the base layer is coated on the surface of the glass substrate 1 .

[0082] The embodiment of the present application provides a display module, which is prepared by using the above-mentioned display module preparation method. Figure 7 As shown, the display module includes:

[0083] The substrate 3 includes a first base layer 31 , a first inorganic layer 32 disposed on the first base layer 31 , a second base layer 33 disposed on the first inorganic layer 32 , and a second inorganic layer 34 disposed on the second base layer 33 .

[0084] It should be noted that both the first base layer 31 and the second base layer 33 can be flexible substrates (such as PI material, polyimide), the first base layer 31 is formed by coating on the surface of the glass substrate 3, and the second base layer 33 is formed by coating on the surface of the first inorganic layer 32.

[0085] Preferably, the display module further includes:

[0086] The organic encapsulation layer 4 and the screen body layer 4 are arranged on the second inorganic layer 34 , and the screen body layer 4 includes a screen body circuit 41 .

[0087] In the area of ​​the display module frame, a binding circuit 5 is embedded in the lower surface of the first base layer 31. The connecting portion 51 of the binding circuit 5 has been removed during laser cutting, leaving a conductive contact 52 for connecting the screen circuit 41 and the binding component embedded in the lower surface of the first base layer 31 and the conductive contact 52 is exposed to the outside, so as to facilitate subsequent connection with the binding component.

[0088] In the area of ​​the display module frame, a wire hole is opened on the substrate 3, and the wire hole passes through the first base layer 31, the first inorganic layer 32, the second base layer 33 and the second inorganic layer 34, and is connected to the conductive contact 52 located on the lower surface of the first base layer 31, and one end of the metal connecting wire in the wire hole is connected to the screen circuit 41, and the other end is connected to the conductive contact 52.

[0089] Preferably, the display module further includes:

[0090] The dam 6 is arranged on the surface of the second inorganic layer 34 and is arranged around the outer periphery of the screen body layer 4. The number of layers of the dam 6 is not less than one layer, and the extra portion outside the outermost dam 6 is a packaging protection area.

[0091] It should be noted that in the exemplary structure, Figure 7 As shown in the figure, the display area AA of the display module is located on the left side (not drawn), and the border of the display module is located on the right side. The right side includes the via binding line area A, the dam area B and the packaging protection area C. After measurement, it can be concluded that the width of the via binding line area A is about 100μm, the width of the dam area B is about 100μm, and the width of the packaging protection area C is about 100μm. Therefore, the width of the border area of ​​the entire display module is about 300μm.

[0092] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A method for preparing a display module, characterized in that: The preparation method comprises: Providing a substrate, Etching a groove on the surface of the substrate; placing the binding wire in the groove; Fixing the binding line in the groove by magnetic control; A substrate is prepared on the surface of the substrate where the groove is formed, and the binding line is fixed on a side of the substrate close to the substrate; A screen layer is prepared on a side of the substrate away from the base, and the screen layer and the substrate are etched to form a wire hole, wherein the screen layer includes a screen circuit, and the screen circuit is electrically connected to the binding circuit through the wire hole; The substrate and the base are peeled off to expose the binding circuit on a side of the substrate close to the base; A binding component is provided, and the binding line is electrically connected to the binding component.

2. The method for preparing a display module according to claim 1, wherein: The binding circuit is placed in a groove opened on the surface of the base and the binding circuit protrudes from the surface of the base, and the substrate covers the portion of the binding circuit protruding from the groove. Preferably, the substrate comprises a glass substrate.

3. The method for preparing a display module according to claim 1, wherein: The depth of the groove etched on the substrate is between 7 and 10 μm.

4. The method for preparing a display module according to claim 1, wherein: The binding circuit includes a connecting portion and a conductive contact piece fixed on the connecting portion; Preferably, the binding circuit is formed by a metal rolling process, and the connecting portion comprises a metal substrate; Preferably, the binding line is magnetic; Preferably, the thickness of the binding line is greater than or equal to 20 μm.

5. The method for preparing a display module according to claim 1, wherein: The screen body layer includes a dam and an organic encapsulation layer, and the organic encapsulation layer is located in the area surrounded by the dam.

6. The method for preparing a display module according to any one of claims 1 to 5, characterized in that: The screen body layer includes a packaging protection area and a cutting area, and the cutting area is outside the packaging protection area.

7. The method for preparing a display module according to claim 6, wherein: When the substrate is cut, the connection portion of the binding line is cut off.

8. The method for preparing a display module according to claim 1, wherein: The magnetic control method includes: A coil is arranged on a side of the substrate facing away from the groove, After the binding line is placed in the groove, the coil is energized, and the binding line is adsorbed and positioned in the groove through the magnetic field generated by the coil.

9. The method for preparing a display module according to claim 8, wherein: After the binding line is fixed to a side of the substrate close to the base, the magnetron is removed.

10. A display module, characterized in that: The display module is prepared by the display module preparation method according to any one of claims 1 to 9.

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