Display panel and display device

Abstract

The invention provides a display panel and a display device. The display panel includes a substrate and a plurality of pads. The bonding pad comprises a first lap joint area, a second lap joint area and a crimping area connected between the first lap joint area and the second lap joint area. The bonding pad further comprises bonding pads which are arranged on one side of the substrate and located in the first lap joint area and the second lap joint area. The lap joint parts are arranged on the side, away from the substrate, of the transmission part, and the lap joint parts are also located in the first lap joint area and the second lap joint area respectively; the crimping parts are arranged on the sides, away from the substrate, of the lapping parts, and the two ends of the crimping parts extend into the first lapping area and the second lapping area from the crimping area respectively and are electrically connected with the corresponding lapping parts. The surface flatness of the bonding pad in the crimping area is improved by changing the structure of the bonding pad, so that the problem that the crimping part of the bonding pad is poor is solved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] In order to achieve a narrow frame, a chip on PI (COP) technology has been developed to package the driver chip on the substrate of the flexible display panel. However, when the driver chip is pressed onto the substrate of the flexible display panel, the problem of poor pressing still occurs, thus affecting the display quality of the product. Summary of the invention

[0003] The object of the present invention is to provide a display panel and a display device to solve the problems of poor crimping and poor display quality that occur in related display technologies.

[0004] To achieve the above-mentioned object, the present invention provides a display panel, which includes a substrate and a plurality of pads. The pad includes a first overlap area, a second overlap area, and a crimping area connecting the first overlap area and the second overlap area. The pad also includes at least two transmission parts, at least two overlap parts, and a crimping part, the transmission part is arranged on one side of the substrate, and at least one of the transmission parts is respectively arranged in the first overlap area and the second overlap area. The overlap part is arranged on the side of the transmission part away from the substrate, and at least one of the overlap part is respectively arranged in the first overlap area and the second overlap area. The crimping part is arranged on the side of the overlap part away from the substrate, and the two ends of the crimping part extend from the crimping area to the first overlap area and the second overlap area, respectively, and are electrically connected to the corresponding overlap parts.

[0005] Further, in a direction perpendicular to the plane where the substrate is located, the thickness of the pads in the first overlapping area and the second overlapping area is greater than the thickness of the pads in the crimping area. Preferably, the orthographic projection of the transmission portion on the substrate is within the orthographic projection range of the overlapping portion on the substrate. Preferably, the orthographic projection of the overlapping portion on the substrate is within the orthographic projection range of the crimping portion on the substrate.

[0006] Furthermore, the display panel also includes an insulating structure. At least part of the insulating structure is located on the side of the transmission part away from the substrate. The insulating structure includes at least two overlapping interfaces, and the overlapping interfaces are respectively located in the first overlapping area and the second overlapping area, and at least part of the transmission part is exposed in the corresponding overlapping interfaces. Preferably, the crimping part is located on the side of the insulating structure away from the substrate, and extends from the crimping area to the overlapping interface. Preferably, the orthographic projection of the overlapping interface on the substrate is located within the orthographic projection range of the corresponding overlapping part on the substrate.

[0007] Further, the insulating structure includes a first insulating layer and a second insulating layer. The first insulating layer is provided on one side of the substrate, and at least a portion of the first insulating layer is located between the transmission portion and the overlapping portion. The second insulating layer is provided on a side of the first insulating layer away from the substrate, and at least a portion of the second insulating layer is located between the overlapping portion and the crimping portion. Preferably, the overlapping interface includes a first opening and a second opening. The first opening penetrates the first insulating layer, and at least a portion of the transmission portion is exposed in the first opening. The second opening penetrates the second insulating layer, and at least a portion of the overlapping portion is exposed in the second opening. Preferably, the orthographic projection of the first opening on the substrate is located within the orthographic projection range of the second opening on the substrate.

[0008] Furthermore, the display panel further comprises a first metal layer, a second metal layer and a touch layer. The first metal layer is disposed on one side of the substrate, and the transmission portion is located in the first metal layer. The second metal layer is insulated and disposed on a side of the first metal layer away from the substrate, and at least a portion of the overlap portion is located in the second metal layer. The touch layer is insulated and disposed on a side of the second metal layer away from the substrate, and the crimping portion is located in the touch layer.

[0009] The display panel also includes a third metal layer, which is insulated and arranged between the second metal layer and the touch layer. The overlap portion includes a first sub-overlap portion and a second sub-overlap portion. The first sub-overlap portion covers the exposed surface of the transmission portion in the first opening and extends to the side of the first insulating layer away from the substrate, and the first sub-overlap portion is located in the first metal layer. The second sub-overlap portion is arranged on the side of the first sub-overlap portion away from the substrate, and the second sub-overlap portion is located in the third metal layer. Preferably, the orthographic projection of the transmission portion on the substrate is located within the orthographic projection range of the first sub-overlap portion on the substrate. Preferably, the orthographic projection of the first sub-overlap portion on the substrate is located within the orthographic projection range of the second sub-overlap portion on the substrate.

[0010] Further, the display panel further comprises a fourth metal layer, and the fourth metal layer is insulated and arranged between the third metal layer and the touch control layer. Preferably, the overlap portion further comprises a third sub-overlap portion, and the third sub-overlap portion is arranged on a side of the second sub-overlap portion away from the substrate, and the third sub-overlap portion is located in the fourth metal layer. Preferably, the orthographic projection of the second sub-overlap portion on the substrate is located within the orthographic projection range of the third sub-overlap portion on the substrate.

[0011] Furthermore, the display panel further comprises a driving component, the driving component comprises a gold finger, and the gold finger is electrically connected to the pad. Preferably, the orthographic projection of the gold finger on the pad is located in the crimping area. Preferably, the driving component comprises a driving chip.

[0012] Further, the display panel further comprises a conductive adhesive layer, and the conductive adhesive layer is arranged between the gold finger and the pad. Preferably, the conductive adhesive layer comprises a plurality of conductive particles, and at least some of the conductive particles are located between the gold finger and the pad. Preferably, the spacing between the gold finger and the corresponding pad is less than or equal to the diameter of the conductive particles. Preferably, the conductive adhesive layer wraps the exposed surface of the gold finger and the pad.

[0013] The present invention further provides a display device, which includes the display panel as described above.

[0014] The advantages of the present invention are as follows: a display panel and a display device of the present invention improve the flatness of the pad surface in the pressing area by changing the structure of the pad, thereby solving the problem of poor pad pressing parts and improving the display quality of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 A schematic diagram of partitions of a display panel in an embodiment of the present invention;

[0017] Figure 2 Schematic diagram of the partitioning of the pad in an embodiment of the present invention;

[0018] Figure 3 Schematic diagram of the stacking of pads and driving components in an embodiment of the present invention.

[0019] The components in the figure are shown as follows:

[0020] Display panel 1; Display area AA;

[0021] Non-display area BA; Frame area BA1;

[0022] Binding area BA2; Base 10;

[0023] Solder pad 20; First bonding area 20A;

[0024] Second overlapping area 20B; Pressing area 20C;

[0025] Transmission part 21; Lap part 22;

[0026] A first sub-lapping portion 221; A second sub-lapping portion 222;

[0027] The third sub-lapping portion 223; The crimping portion 23;

[0028] Insulation structure 24; First insulation layer 241;

[0029] The second insulating layer 242; The overlapping interface 25;

[0030] A first opening 251; A second opening 252;

[0031] A first metal layer M1; A second metal layer M2;

[0032] A third metal layer M3; A fourth metal layer M4;

[0033] Touch layer TP; Driving component 30;

[0034] Gold finger 31; Conductive adhesive layer 40;

[0035] Conductive particles 41; Colloid 42. DETAILED DESCRIPTION

[0036] The preferred embodiments of the present invention are described below with reference to the drawings in the specification to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied through many different forms of embodiments of the invention, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0037] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0038] In addition, the following descriptions of the various embodiments of the invention are made with reference to the attached diagrams to illustrate specific embodiments of the invention that the present invention can be implemented with. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0039] When some components are described as being "on" another component, the component may be directly placed on the other component; there may also be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "mounted on" or "connected to" another component, the two may be understood to be directly "mounted on" or "connected", or one component may be indirectly "mounted on" or "connected to" another component via an intermediate component.

[0040] In relevant display technologies, the pads in the crimping binding area of ​​the display panel are mostly stacked structures of multiple metal film layers. Due to the influence of metal width design and film formation, the pads under this stacked structure have inconsistent thicknesses at different positions, resulting in different contacts between the gold fingers on the chip and different positions on the same pad after IC bonding (chip bonding), which increases the impedance on the pad and affects the display quality of the product.

[0041] Based on the technical problems found in the above-mentioned related display technologies, a display panel 1 provided in an embodiment of the present invention is as follows: Figure 1 As shown in , the display panel 1 includes a display area AA and a non-display area BA connected to the display area AA. Multiple display lights are provided in the display area AA to present a display image. The non-display area BA includes a border area BA1 arranged around the display area AA and a binding area BA2 located on the side of the border area BA1 away from the display area AA. The binding area BA2 is used to bind and connect with a driving component 30 such as a driving chip. A plurality of signal lines are used in the border area BA1. One end of the signal line is connected to the display area AA in the display area AA, and the other end extends to the binding area BA2 and is connected to the driving component 30 through the binding area BA2.

[0042] like Figure 2 As shown in FIG. 1 , in the binding area BA2, a plurality of pads 20 are provided in the display panel 1 for electrically connecting to the driving component 30. Figure 3As shown in FIG. 1 , the pad 20 has a first overlapping region 20A, a second overlapping region 20B and a crimping region 20C. The first overlapping region 20A and the second overlapping region 20B are respectively located at two ends of the crimping region 20C, and the two ends of the crimping region 20C are respectively connected to the first overlapping region 20A and the second overlapping region 20B. The pad 20 includes at least two transmission parts 21, at least two overlapping parts 22 and a crimping part 23. At least one transmission part 21 and at least one crimping part 23 are respectively provided in the first overlapping area 20A and the second overlapping area 20B. The transmission part 21 and the crimping part 23 are stacked, and the two ends of the crimping part 23 are respectively stacked on the side of the crimping part 23 away from the transmission part 21, thereby forming a pad 20 with a bridge structure, so that there is only a single metal film layer in the crimping area 20C, so that the surface of the pad 20 in the crimping area 20C is located in the same plane, ensuring that the thickness of the pad 20 at different positions in the crimping area 20C is consistent, and ensuring that the surface of the pad 20 in the crimping area 20C is flat, thereby increasing the contact area between the driving component 30 and the pad 20, thereby reducing the impedance on the pad 20 after crimping, and improving the display quality of the display panel 1. Since the first overlap area 20A and the second overlap area 20B are both stacked structures of multiple metal film layers, the thickness of the pads 20 in the first overlap area 20A and the second overlap area 20B is greater than the thickness of the pads 20 in the crimping area 20C in the direction perpendicular to the plane of the substrate 10.

[0043] Specifically, the display panel 1 includes a substrate 10, and a pad 20 is arranged on one side of the substrate 10. In an embodiment of the present invention, the pad 20 includes two transmission parts 21 and two overlap parts 22. The two transmission parts 21 are respectively arranged in the first overlap area 20A and the second overlap area 20B. The two overlap parts 22 are also respectively located in the first overlap area 20A and the second overlap area 20B, and are respectively arranged on the side of the corresponding transmission part 21 away from the substrate 10. The crimping part 23 is arranged on the side of the overlap part 22 away from the substrate 10, and the two ends of the crimping part 23 extend from the crimping area 20C to the first overlap area 20A and the second overlap area 20B, respectively, and are electrically connected to the corresponding overlap part 22. Among them, the orthographic projection of the transmission part 21 on the substrate 10 is located within the orthographic projection range of the overlap part 22 on the substrate 10, and the orthographic projection of the overlap part 22 on the substrate 10 is located within the orthographic projection range of the crimping part 23 on the substrate 10.

[0044] The pad 20 further includes an insulating structure 24, which is disposed on the transmission part 21 away from the substrate 10, and includes at least two overlapped ports 25, each of the first overlapped area 20A and the second overlapped area 20B having at least one overlapped port 25, at least a portion of the transmission part 21 is exposed in the overlapped port 25, and the overlapped portion 22 and the crimped portion 23 are electrically connected to the transmission part 21 through the overlapped port 25. The orthographic projection of the overlapped port 25 on the substrate 10 is located within the orthographic projection range of the corresponding overlapped portion 22 on the substrate 10.

[0045] Specifically, the insulating structure 24 includes a first insulating layer 241 and a second insulating layer 242, and each overlapping interface 25 includes a first opening 251 that penetrates the first insulating layer 241 and a second opening 252 that penetrates the second insulating layer 242. The first insulating layer 241 is disposed on the substrate 10 and extends from the surface of the substrate 10 to the side of the transmission part 21 that is away from the substrate 10, so that part of the first insulating layer 241 is located between the transmission part 21 and the overlapping part 22. The first opening 251 penetrates the first insulating layer 241, so that part of the surface of the transmission part 21 is exposed in the first opening 251. The overlapping part 22 fills the first opening 251 and covers the exposed surface of the transmission part 21 in the first opening 251, so that the overlapping part 22 is electrically connected to the transmission part 21. The second insulating layer 242 is disposed on the side of the first insulating layer 241 away from the substrate 10, and extends from the surface of the first insulating layer 241 to the side of the crimping portion 23 away from the substrate 10, so that part of the second insulating layer 242 is located between the lap portion 22 and the crimping portion 23. The second opening 252 penetrates the second insulating layer 242, so that part of the surface of the crimping portion 23 is exposed in the second opening 252. The two ends of the crimping portion 23 extend from the crimping area 20C to the corresponding second opening 252, and cover the exposed surface of the lap portion 22 in the second opening 252, so that the two ends of the crimping portion 23 are electrically connected to the corresponding lap portion 22, and the crimping portion 23 is indirectly electrically connected to the transmission portion 21, forming a pad 20 of a bridge structure. Furthermore, the orthographic projection of the first opening 251 on the substrate 10 is located within the orthographic projection range of the corresponding transmission portion 21 on the substrate 10, and the orthographic projection of the second opening 252 on the substrate 10 is located within the orthographic projection range of the corresponding overlapping portion 22 on the substrate 10, thereby forming an efficient and stable electrical connection structure in the pad 20.

[0046] The display panel 1 further includes a first metal layer M1 and a second metal layer M2 which are alternately stacked and a touch layer TP which is insulated and arranged in the second metal layer M2 and is away from the substrate 10. The transmission part 21 is located in the first metal layer M1, at least part of the overlapping part 22 is located in the second metal layer M2, and the pressing part 23 is located in the touch layer TP, that is, the transmission part 21 can be prepared simultaneously with other components in the first metal layer M1 in the same process, at least part of the overlapping part 22 can be prepared simultaneously with other components in the second metal layer M2 in the same process, and the pressing part 23 can be prepared simultaneously with other components in the touch layer TP in the same process.

[0047] Specifically, the touch layer TP generally includes sensing electrodes, touch electrodes and touch signal lines. The first metal layer M1 and the second metal layer M2 can be combined into an array substrate, and the first metal layer M1 and the second metal layer M2 are respectively provided with signal lines for transmitting different signals. Further, the array substrate may also include a third metal layer M3 and a fourth metal layer M4, the third metal layer M3 is insulated and arranged between the second metal layer M2 and the touch layer TP, the fourth metal layer M4 is insulated and arranged between the third metal layer M3 and the touch layer TP, and the third metal layer M3 and the fourth metal layer M4 are also respectively provided with signal lines for transmitting different signals, and the remaining parts of the overlapped part 22 are respectively located in the third metal layer M3 and the fourth metal layer M4. The signal lines included in the first metal layer M1, the second metal layer M2, the third metal layer M3 and the fourth metal layer M4 can be one or more of the signal lines such as the scanning signal line, the data signal line, the light emitting control line, the power signal line, the recovery signal line, and the fan-out line. The array substrate is also provided with a plurality of transistors arranged in an array, and the gate, source and drain of the thin film transistor and the capacitor plate of the pixel circuit are also dispersed in different metal layers of the array substrate.

[0048] In the display area AA, multiple thin film transistors and multiple signal lines are regularly arranged in the array substrate, and different signal lines are connected to corresponding thin film transistors, so as to form a pixel circuit in the array substrate. The pixel circuit is electrically connected to the corresponding light-emitting device in the display panel 1, and the thin film transistor turns on the relevant circuit in the pixel circuit according to the display signal transmitted by the corresponding signal line, and finally lights up the corresponding light-emitting device. In the non-display area BA, multiple signal lines are also arranged in the array substrate. The signal lines in the display area AA extend to the non-display area BA and are connected to the corresponding signal lines in the non-display area BA. The signal lines in the non-display area BA extend from the frame area BA1 to the binding area BA2, and are electrically connected to the pad 20 located in the binding area BA2, and are connected to the driving component 30 through the pad 20, so that the signal and energy transmitted by the driving component 30 are transmitted to the substrate through the pad 20. For example, the scanning signal line in the display area AA extends to the frame area BA1 and is connected to the fan-out line located in the frame area BA1. Multiple fan-out lines are concentratedly extended to the binding area BA2 and are connected to the transmission part 21 of the pad 20 located in the binding area BA2. The driving component 30 is connected to the crimping part 23 of the pad 20 to transmit the scanning signal one by one through the pad 20, the fan-out line and the scanning signal line to the corresponding thin film transistor in the display area AA, thereby realizing the output of the scanning signal and completing the switching control of the corresponding thin film transistor.

[0049] In the array substrate, one or more insulating film layers can be used to achieve insulation between two adjacent metal layers. The insulating film layer can be one or more insulating film layers such as a gate dielectric layer (Gate Insulator, GI), a capacitor dielectric layer (Capacitor Insulator, CI), an interlayer dielectric layer (Inter Layer Dielectric, ILD), etc., and its material can be one or more inorganic materials such as silicon oxide and silicon nitride. The insulating structure 24 in the pad 20 can be prepared simultaneously with part of the insulating film layers in the array substrate in the same preparation process, that is, the material of the insulating structure 24 in the pad 20 also includes inorganic materials.

[0050] The overlap portion 22 includes a first sub-overlap portion 221 located in the second metal layer M2, a second sub-overlap portion 222 located in the third metal layer M3, and a third sub-overlap portion 223 located in the fourth metal layer M4. The first sub-overlap portion 221 covers the exposed surface of the transmission portion 21 in the first opening 251, and extends to the side of the first insulating layer 241 away from the substrate 10, and the orthographic projection of the transmission portion 21 on the substrate 10 is located within the orthographic projection range of the first sub-overlap portion 221 on the substrate 10. The second sub-overlap portion 222 is arranged on the side of the first sub-overlap portion 221 away from the substrate 10. The third sub-overlap portion 223 is arranged on the side of the second sub-overlap portion 222 away from the substrate 10. The second sub-lapping portion 222 extends from the side of the first insulating layer 241 away from the substrate 10 and covers the surface of the first sub-lapping portion 221 away from the substrate 10, and the third sub-lapping portion 223 extends from the side of the first insulating layer 241 away from the substrate 10 and covers the surface of the second sub-lapping portion 222 away from the substrate 10, so that the orthographic projection of the first sub-lapping portion 221 on the substrate 10 is within the orthographic projection range of the second sub-lapping portion 222 on the substrate 10, and the orthographic projection of the second sub-lapping portion 222 on the substrate 10 is within the orthographic projection range of the second sub-lapping portion 222 on the substrate 10. Located within the range of the positive projection of the third sub-lap joint 223 on the substrate 10, even if the second sub-lap joint 222 wraps the first sub-lap joint 221, it is the third sub-lap joint 223 that wraps the second sub-lap joint 222, forming a structure in which the rear metal layer wraps the boundary of the front metal layer, thereby reducing the influence of the patterning process of the subsequent film layer on the metal film layer completed in the previous process, preventing the metal structure in the overlap joint 22 from being over-engraved or side-engraved, improving the structural reliability of the overlap joint 22, and further reducing the impedance of the pad 20.

[0051] The display panel 1 further includes a driving component 30, which may be one or more electronic devices such as a driving chip (IC) or a flexible printed circuit (FPC). Figure 3As shown in , the driving component 30 has a plurality of gold fingers 31, which are arranged one by one corresponding to the pads 20, and are bound and connected with the pressing area 20C of the pads 20 through a pressing process, so that the driving component 30 can transmit display signals to the light-emitting device in the panel. Among them, the positive projection of the gold finger 31 on the corresponding pad 20 is located in the pressing area 20C of the pad 20, that is, the gold finger 31 of the driving component 30 is pressed with the pressing area 20C with a flat surface in the pad 20, thereby providing an effective connection area between the gold finger 31 and the corresponding pad 20, thereby reducing the impedance between the pad 20 and the gold finger 31, and improving the picture quality of the display panel 1.

[0052] Furthermore, the display panel 1 further includes a conductive adhesive layer 40 disposed between the gold finger 31 of the driving component 30 and the pad 20, and the gold finger 31 and the pad 20 can be electrically connected through the conductive adhesive layer 40. The conductive adhesive layer 40 includes a colloid 42 and a plurality of conductive particles 41 mixed in the colloid 42, and at least part of the conductive particles 41 are located between the gold finger 31 and the pad 20. Optionally, the conductive adhesive layer 40 can be anisotropic conductive film (ACF).

[0053] Before crimping, the conductive particles 41 may be mixed in the insulating colloid 42 in advance, and then the colloid 42 mixed with the conductive particles 41 may be coated on the pad 20 or the gold finger 31, and the gold finger 31 and the pad 20 may be aligned and bonded, and finally the colloid 42 may be cured to complete the crimping of the gold finger 31 and the pad 20. During the bonding process, the excess colloid 42 between the gold finger 31 and the pad 20 may be squeezed out by applying pressure, so that the overflowed colloid 42 can fill the gap between the adjacent gold finger 31 and the adjacent pad 20 and wrap the exposed surface of the gold finger 31 and the pad 20, thereby insulating and protecting the gold finger 31 and the pad 20.

[0054] At the same time, in the process of squeezing out the excess colloid 42, the distance between the gold finger 31 and the corresponding pad 20 can be reduced, so that the distance between the gold finger 31 and the corresponding pad 20 is less than or equal to the diameter of the conductive particle 41, so that both sides of the conductive particle 41 located in the crimping area 20C can be in contact with the gold finger 31 and the pad 20, and then the gold finger 31 and the corresponding pad 20 can be electrically connected. In addition, since the surface of the pad 20 in the crimping area 20C is flat, the number of suspended conductive particles 41 (i.e., suspended in the colloid 42 and at least one side not in contact with the corresponding gold finger 31 or pad 20) can be reduced, the effective contact area between the pad 20 and the conductive particle 41 is increased, the impedance between the pad 20 and the gold finger 31 is reduced, and the display quality of the display panel 1 is improved.

[0055] A display device is also provided in an embodiment of the present invention, which may be an AMOLED (Active-Matrix Organic Light-Emitting Diode) display device, comprising the display panel 1 as described above, and the display panel 1 is used to provide a display image for the display device. The display device may be any display device with a display function, such as a mobile phone, a laptop computer, a tablet computer, a car display, etc.

[0056] In an embodiment of the invention, a solder pad with a bridge-type structure is provided to improve the surface flatness of the solder pad crimping area, thereby ensuring that the height of the solder pads at different positions in the crimping area is the same, thereby increasing the effective connection area between the solder pad and the gold finger, thereby reducing the impedance on the solder pad, improving the display picture of the display panel, and providing the user with a better experience.

[0057] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A display panel, characterized in that: include: substrate; A plurality of pads, each pad comprising a first overlapping region, a second overlapping region, and a crimping region connecting the first overlapping region and the second overlapping region; The pad also includes: At least two transmission parts are provided on one side of the substrate, and at least one transmission part is provided in the first overlapping area and the second overlapping area respectively; At least two overlapping portions are provided on a side of the transmission portion facing away from the substrate, and at least one overlapping portion is provided in each of the first overlapping area and the second overlapping area; The crimping portion is arranged on a side of the overlapping portion away from the substrate, and two ends of the crimping portion extend from the crimping area to the first overlapping area and the second overlapping area respectively, and are electrically connected to the corresponding overlapping portion.

2. The display panel according to claim 1, wherein: In a direction perpendicular to the plane where the substrate is located, the thickness of the pads in the first overlapping area and the second overlapping area is greater than the thickness of the pads in the crimping area; Preferably, the orthographic projection of the transmission portion on the substrate is located within the orthographic projection range of the overlapping portion on the substrate; Preferably, the orthographic projection of the overlapping portion on the substrate is located within the orthographic projection range of the crimping portion on the substrate.

3. The display panel according to claim 1, wherein: Also includes: an insulating structure, at least a portion of which is located on a side of the transmission portion facing away from the substrate; The insulating structure comprises at least two overlapping interfaces, the overlapping interfaces are respectively located in the first overlapping area and the second overlapping area, and at least part of the transmission part is exposed in the corresponding overlapping interfaces; Preferably, the crimping portion is located on a side of the insulating structure away from the substrate, and extends from the crimping area to the overlapped interface; Preferably, the orthographic projection of the overlapping interface on the substrate is located within the orthographic projection range of the corresponding overlapping portion on the substrate.

4. The display panel according to claim 3, wherein: The insulating structure comprises: A first insulating layer, disposed on one side of the substrate, and at least a portion of the first insulating layer is located between the transmission portion and the overlapping portion; A second insulating layer is disposed on a side of the first insulating layer away from the substrate, and at least a portion of the second insulating layer is located between the overlapping portion and the crimping portion; Preferably, the joint includes: A first opening, penetrating the first insulating layer, wherein at least a portion of the transmission portion is exposed in the first opening; A second opening, penetrating the second insulating layer, wherein at least a portion of the overlapping portion is exposed in the second opening; Preferably, the orthographic projection of the first opening on the substrate is located within the range of the orthographic projection of the second opening on the substrate.

5. The display panel according to claim 1, wherein: Also includes: A first metal layer is disposed on one side of the substrate, and the transmission part is located in the first metal layer; a second metal layer, insulated and disposed on a side of the first metal layer away from the substrate, wherein at least a portion of the overlapping portion is located in the second metal layer; The touch layer is insulated and arranged on a side of the second metal layer away from the substrate, and the crimping portion is located on the touch layer.

6. The display panel according to claim 5, wherein: Also includes: a third metal layer, insulated and disposed between the second metal layer and the touch control layer; The overlapping portion comprises: a first sub-lapping portion, covering an exposed surface of the transmission portion in the first opening and extending to a side of the first insulating layer away from the substrate, wherein the first sub-lapping portion is located in the first metal layer; A second sub-lapping portion, disposed on a side of the first sub-lapping portion away from the substrate, the second sub-lapping portion being located in the third metal layer; Preferably, the orthographic projection of the transmission portion on the substrate is located within the orthographic projection range of the first sub-lapping portion on the substrate; Preferably, the orthographic projection of the first sub-overlapping portion on the substrate is located within the range of the orthographic projection of the second sub-overlapping portion on the substrate.

7. The display panel according to claim 6, wherein: Also includes: a fourth metal layer, insulated and arranged between the third metal layer and the touch layer; Preferably, the overlapping portion further comprises: A third sub-lapping portion, disposed on a side of the second sub-lapping portion away from the substrate, the third sub-lapping portion being located in the fourth metal layer; Preferably, the orthographic projection of the second sub-overlapping portion on the substrate is located within the orthographic projection range of the third sub-overlapping portion on the substrate.

8. The display panel according to claim 1, wherein: Also includes: A driving component, the driving component comprising a gold finger, the gold finger being electrically connected to the pad; Preferably, the orthographic projection of the gold finger on the pad is located within the crimping area; Preferably, the driving component includes a driving chip.

9. The display panel according to claim 8, wherein: Also includes: A conductive adhesive layer, disposed between the gold finger and the pad; Preferably, the conductive adhesive layer includes a plurality of conductive particles, and at least part of the conductive particles are located between the gold finger and the pad; Preferably, the distance between the gold finger and the corresponding pad is less than or equal to the diameter of the conductive particle; Preferably, the conductive adhesive layer wraps the gold finger and the exposed surface of the pad.

10. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-9.

Images