Display panel, display device and tiled display device

Abstract

The invention discloses a display panel, a display device and a tiled display device. The display panel comprises a first substrate, a plurality of first electrodes, a plurality of connecting leads, a connecting layer, a second substrate and a plurality of second electrodes arranged on the side, away from the first substrate, of the second substrate. The first substrate comprises a first surface and a second surface opposite to the first surface, and a plurality of side surfaces connecting the first surface and the second surface, and at least one side surface is a selected side surface. The first surface comprises a display area and a peripheral area located on at least one side of the display area, and the peripheral area is closer to the selected side face than the display area. The plurality of first electrodes are arranged in the peripheral area. The second substrate is arranged on the second surface. The connecting layer is bonded with the first substrate and the second substrate; the orthographic projection of the connecting layer on the second surface falls within the orthographic projection range of the second substrate on the second surface. The connecting lead extends from the first surface to the second surface through the selected side surface, one end of the connecting lead is connected with the first electrode, and the other end is connected with the second electrode.

Description

Display panel, display device, and spliced ​​display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel, a display device, and a spliced ​​display device. Background Art

[0002] The use of micro light-emitting diodes (MLDs) or sub-millimeter light-emitting diodes (MLDs) as pixels in display panels has attracted widespread attention and research. However, due to mass transfer yield issues, large-scale display devices cannot be produced in one go. Instead, a large-scale spliced ​​display device is usually assembled by splicing small-scale display devices.

[0003] In order to reduce the bezel size of the display device and reduce the seam width of the spliced ​​display device, a single display panel can currently use wiring arranged on the side of the display panel to connect the wiring on the display surface with the driver (such as a circuit board or driver chip) arranged on the non-display surface. In this way, when multiple display panels are composed to form a larger spliced ​​display device, the spacing between adjacent display panels can be smaller, thereby improving the display quality.

[0004] Summary of the Invention

[0005] In one aspect, a display panel is provided. The display panel includes a first substrate, a plurality of first electrodes, a second substrate, a plurality of second electrodes, a plurality of connecting leads, and a connecting layer. The first substrate includes a first surface and a second surface facing each other, and a plurality of side surfaces connecting the first and second surfaces, at least one of the side surfaces being a selected side surface. The first surface includes a display area and a peripheral area located on at least one side of the display area, the peripheral area being closer to the selected side surface than the display area.

[0006] A second substrate is disposed on the second surface, and a plurality of second electrodes are disposed on a side of the second substrate distal from the first substrate and proximate to a selected side surface. A connecting layer is disposed between the first and second substrates, bonding the first and second substrates together; the orthographic projection of the connecting layer on the second surface falls within the orthographic projection of the second substrate on the second surface. A connecting lead extends from the first surface through the selected side surface to the second surface; one end of the connecting lead is connected to the first electrode, and the other end is connected to the second electrode.

[0007] In some embodiments, the connection layer includes at least one groove extending from the upper surface of the connection layer to the lower surface of the connection layer.

[0008] In some embodiments, the grooves include: at least one first groove and / or at least one second groove, the first groove and the second groove extend in different directions, and the boundaries of the first groove and the second groove do not overlap with the boundaries of the connection layer.

[0009] In some embodiments, the slots extend through the connection layer along a predetermined direction, and the predetermined direction is parallel to the lower surface of the connection layer. When the connection layer includes a plurality of slots, the plurality of slots are spaced apart.

[0010] In some embodiments, when the groove penetrates the connection layer along a first direction, the groove is located on a side of the second electrode away from the selected side surface. The first direction is parallel to the second surface and the selected side surface.

[0011] In some embodiments, the grooves are in a grid shape.

[0012] In some embodiments, a boundary of the connection layer close to the selected side surface is closer to the selected side surface than a boundary of the second substrate close to the selected side surface.

[0013] In some embodiments, a boundary of the connection layer close to the selected side surface overlaps a boundary of the second substrate close to the selected side surface.

[0014] In some embodiments, a boundary of the connection layer close to the selected side surface is farther away from the selected side surface than a boundary of the second substrate close to the selected side surface.

[0015] In some embodiments, the second substrate includes a main body and a plurality of protrusions disposed on a side of the main body close to the selected side surface, wherein one end of the protrusion is connected to the main body and the other end extends toward the selected side surface. The plurality of protrusions are spaced apart along the first direction.

[0016] In some embodiments, the protrusion overlaps with the at least one second electrode in an orthographic projection onto a reference plane; the reference plane is parallel to the selected side surface.

[0017] In some embodiments, the second substrate includes a plurality of first via holes arranged in an array, and the first via holes penetrate from the upper surface of the second substrate to the lower surface of the second substrate.

[0018] In some embodiments, the plurality of first via holes are arranged in a plurality of columns along a second direction, and at least one second electrode is disposed on both sides of each column of first via holes. The second direction is perpendicular to the first direction and the selected side surface.

[0019] In some embodiments, along the first direction, a size of the first via hole is smaller than a gap between two adjacent second electrodes.

[0020] In some embodiments, the connection layer further includes a plurality of second via holes, the second via holes extending from the upper surface of the connection layer to the lower surface of the connection layer, and the second via holes are connected to the first via holes.

[0021] In some embodiments, the display panel further comprises a buffer layer disposed on a side of the second substrate away from the first substrate, the buffer layer covering an edge portion of the second substrate near the selected side surface, and the connecting lead spans the buffer layer and is connected to the second electrode.

[0022] In some embodiments, the buffer layer has no overlap with the second electrode, and a gap exists between the buffer layer and the selected side surface.

[0023] In some embodiments, the buffer layer includes a first slope surface and a second slope surface connected to each other. Along the second direction and from the selected side surface toward the second substrate, the height of the first slope surface gradually increases, and the height of the second slope surface gradually decreases, with the first slope surface and the second slope surface transitioning smoothly.

[0024] In some embodiments, the slope angle of the first slope surface and the slope angle of the second slope surface are both acute angles.

[0025] In some embodiments, an edge portion of the second substrate near the selected side extends relative to a boundary of the connection layer near the selected side, and the edge portion of the second substrate and the side and second surface of the connection layer enclose a gap area, and a portion of the buffer layer fills the gap area.

[0026] In another aspect, a display device is provided, comprising: an integrated circuit chip and a display panel according to any one of the above embodiments; the integrated circuit chip is electrically connected to the second electrode of the display panel.

[0027] In another aspect, a spliced ​​display device is provided, comprising: a plurality of spliced ​​display devices according to the above embodiments.

[0028] In another aspect, a spliced ​​display device is provided, comprising: a plurality of spliced ​​display panels according to any one of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0030] FIG1 is a cross-sectional structural diagram of a display panel according to some embodiments;

[0031] FIG2 is a cross-sectional structural diagram of a display panel during preparation according to some embodiments;

[0032] FIG3 is a structural diagram of a first surface side of a display panel according to some embodiments;

[0033] FIG4 is a structural diagram of a second surface side of a display panel according to some embodiments;

[0034] FIG5 is a cross-sectional structural diagram of a display panel according to some embodiments along the cross-sectional line AA in FIG4 ;

[0035] FIG6 is an enlarged structural diagram of region B of the display panel shown in FIG5 ;

[0036] FIG7 is another enlarged structural diagram of region B of the display panel shown in FIG5 ;

[0037] FIG8 is a structural diagram of a connection layer according to some embodiments;

[0038] FIG9 is a structural diagram of a connection layer according to some other embodiments;

[0039] FIG10 is a structural diagram of a connection layer according to yet other embodiments;

[0040] FIG11 is a structural diagram of a connection layer according to still other embodiments;

[0041] FIG12 is a structural diagram of a connection layer according to yet other embodiments;

[0042] FIG13 is a structural diagram of a connection layer according to yet other embodiments;

[0043] FIG14 is a structural diagram of a second substrate according to some embodiments;

[0044] FIG15 is a structural diagram of a second substrate according to some other embodiments;

[0045] FIG16 is a structural diagram of a second substrate according to yet other embodiments;

[0046] FIG17 is a cross-sectional structural diagram of a display panel according to some embodiments, taken along the cross-sectional line CC in FIG15 ;

[0047] FIG18 is a structural diagram of a second surface side of a display panel according to some embodiments;

[0048] FIG19 is a structural diagram of a second surface side of a display panel according to some other embodiments;

[0049] FIG20 is a structural diagram of a display device according to some embodiments;

[0050] FIG. 21 is a structural diagram of a spliced ​​display device according to some embodiments. DETAILED DESCRIPTION

[0051] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0052] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0053] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0054] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0055] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0056] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0057] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0058] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0059] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0060] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0061] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0062] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0063] The display panel, display device and spliced ​​display device provided by the present disclosure are introduced below respectively.

[0064] In the present disclosure, Figure 1 is a cross-sectional structural diagram of a display panel according to some embodiments. In order to clearly describe the structural changes of the display panel during the preparation process, the first electrode 12 and the light-emitting device 201 and other structures of the display panel are not illustrated in Figure 2. The cross-sectional structural diagram shown in Figure 2 only includes the first substrate 11, the electrode carrier 13', the second electrode 14, the adhesive 16' and the connecting lead 15.

[0065] Figures 3, 4, 18 and 19 are planar structural diagrams of the display panel 100 according to other embodiments, Figure 5 is a cross-sectional view of the display panel 100 obtained according to the section line AA in Figure 4, and Figures 6 and 7 are enlarged views of area B of the display panel shown in Figure 5.

[0066] The second electrode 14 and the connecting layer 16 are respectively disposed on opposite sides of the second substrate 13. To facilitate a clear description of the arrangement of the grooves C in the connecting layer 16, the second electrode 14 and the connecting layer 16 are placed on one side of the second substrate 13, resulting in the structural diagrams of the connecting layer as shown in Figures 8 to 13. Figures 14 to 16 are structural diagrams of the second substrate.

[0067] Figure 17 is a cross-sectional structural diagram of the display panel 100 along the cross-sectional line CC in Figure 15 according to some embodiments. To facilitate a clear description of the correspondence between the second via holes K2 on the connection layer 16 and the first via holes K1 on the second substrate 13, structures such as the first electrode 12 and the connecting lead 15 in the display panel 100 are not shown in the figure. Figure 20 is a planar structural diagram of the display device 1000 according to some embodiments, and Figure 21 is a planar structural diagram of the spliced ​​display device 2000 according to some embodiments.

[0068] In some embodiments, as shown in FIG1 , a display panel 100 includes: a first substrate 11, a driving circuit layer 19, a plurality of light-emitting devices 201, a plurality of first electrodes 12, an electrode carrier 13′, a plurality of second electrodes 14, and a plurality of connecting leads 15. The first substrate 11 includes a first surface 11a and a second surface 11b opposite each other, and a plurality of side surfaces 11c connecting the first and second surfaces 11a and 11b, at least one of which is a selected side surface 11cc. The driving circuit layer 19, the light-emitting devices 201, and the first electrodes 12 are disposed on the first surface 11a, and the driving circuit layer 19 is electrically connected to the first electrodes 12 and the light-emitting devices 201, respectively. The electrode carrier 13′ is disposed on the second surface 11b of the first substrate 11, and the second electrodes 14 are disposed on a side of the electrode carrier 13′ away from the first substrate 11. One end of the connecting lead 15 is connected to the first electrode 12, and the other end of the connecting lead 15 extends from the first surface 11a through the selected side surface 11cc to the second surface 11b, where it is connected to the second electrode 14.

[0069] Exemplarily, the thickness of the first substrate 11 ranges from 0.1 mm to 1 mm.

[0070] Illustratively, each first electrode 12 is disposed opposite to one second electrode 14 along a direction perpendicular to the first surface 11a of the first substrate 11. In an orthographic projection onto the first surface 11a, each first electrode 12 overlaps or substantially overlaps with one second electrode 14.

[0071] For example, as shown in FIG1 , the display panel 100 further includes a driving circuit board 21 disposed on a side of the second electrode 14 away from the first substrate 11. The driving circuit board 21 is configured to issue a driving signal, such as a display driving signal, which is sequentially transmitted through the second electrode 14, the connecting lead 15, and the first electrode 12 to the driving circuit layer 19. The driving signal is then transmitted to the light-emitting device 201 through the driving circuit layer 19, thereby controlling the light-emitting device 201 to emit light, causing the display panel 100 to display an image.

[0072] Exemplarily, the driving circuit layer 19 includes a plurality of signal lines and a plurality of pads, wherein the pads are electrically connected to the signal lines, each signal line is connected to a first electrode 12, and the pins of the light emitting device 201 are connected to the pads.

[0073] In some examples, the electrode carrier 13' is bonded to the first substrate 11 via adhesive 16'. The electrode carrier 13' and the adhesive 16' are approximately the same size, and the surface of the electrode carrier 13' near the first substrate 11 is completely covered by the adhesive 16'. When the ambient temperature changes, the adhesive 16' may expand or contract due to the influence of the ambient temperature. The extent of the deformation of the adhesive 16' under the influence of temperature is related to the change in ambient temperature.

[0074] For example, in the preparation process of the display panel, after forming the connecting leads 15, a die-bonding process is also included, in which the plurality of light-emitting devices 201 are fixed to the first substrate 11. In the die-bonding process, the pins of the plurality of light-emitting devices 201 are soldered to the solder pads, for example, by a soldering process. During the soldering process, the ambient temperature (the temperature around the adhesive 16') rises from room temperature (20±5°C) to 150°C to 380°C, and then gradually decreases to room temperature. In this process, the ambient temperature changes significantly. The boundary of the electrode carrier 13' and the adhesive 16' near the selected side surface 11cc is, for example, roughly flush. During the change in ambient temperature, the adhesive 16' expands due to heat during the ambient temperature rising stage, and then gradually contracts during the ambient temperature cooling stage. When the adhesive 16' expands or contracts under the influence of temperature, the distance between the second electrodes 14 increases or decreases, and the portion of the connecting lead 15 located on the second surface 11b is connected to the second electrode 14. Therefore, during this process, the connecting lead 15 is subjected to tension and / or shear force, and is prone to breakage.

[0075] At the same time, due to the thinness of the first substrate 11, the adhesive 16' expands or contracts under the influence of ambient temperature, causing the first substrate 11 to bend. For example, as shown in Figure 2, the adhesive 16' contracts and deforms, causing the first substrate 11 to bend. In this case, the second surface 11b of the first substrate 11, on which the adhesive 16' is applied, changes from a flat surface to a curved surface that convexly faces the first surface 11a. The curvature of the first substrate 11, for example, is greater than 0.1 mm. The connecting lead 15 is subjected to shear forces in the first direction X and tensile forces in the second direction Y, posing a risk of breakage.

[0076] Based on this, an embodiment of the present disclosure provides a display panel 100. As shown in FIG3, FIG4 and FIG5, the display panel 100 includes a first substrate 11, a plurality of first electrodes 12, a second substrate 13, a plurality of second electrodes 14, a plurality of connection leads 15 and a connection layer 16.

[0077] As shown in Figure 3 , the first surface 11a includes a display area AA and a peripheral area AN located on at least one side of the display area AA. The peripheral area AN is closer to the selected side surface 11cc than the display area AA. A plurality of first electrodes 12 are arranged in the peripheral area AN at intervals along a first direction X. As shown in Figures 4 and 5 , a second substrate 13 is disposed on the second surface 11b, and a plurality of second electrodes 14 are disposed on a side of the second substrate 13 away from the first substrate 11. The first direction X is parallel to the second surface 11b and the selected side surface 11cc of the first substrate 11.

[0078] As shown in Figure 5, connecting wire 15 extends from first surface 11a through selected side surface 11cc to second surface 11b. One end of connecting wire 15 is connected to first electrode 12, and the other end is connected to second electrode 14. Connecting layer 16 is disposed between first substrate 11 and second substrate 13, bonding the two substrates together. Its orthographic projection onto second surface 11b falls within the orthographic projection of second substrate 13 onto second surface 11b.

[0079] As shown in Figure 2, the connecting layer 16 may expand or shrink under the influence of temperature. The deformation of the connecting layer 16 in the first direction X and the second direction Y will produce stress on the connecting lead 15. For example, the deformation of the connecting layer 16 along the first direction X may cause the part where the connecting lead 15 is connected to the second electrode 14 to be subjected to shear force, and the deformation of the connecting layer 16 along the second direction Y may cause the part where the connecting lead 15 is connected to the second electrode 14 to be subjected to tension, thereby posing a risk of disconnection of the connecting lead 15.

[0080] By reducing the area of ​​the connecting layer 16, the connecting layer 16 only covers a portion of the surface of the second substrate 13 on the side close to the first substrate 11. Compared with the design in which the connecting layer 16 completely covers the surface of the second substrate 13, since the contact area between the connecting layer 16 and the second substrate 13 and the first substrate 11 is reduced, when the connecting layer 16 expands or contracts under the influence of ambient temperature and deforms, the deformation of the connecting layer 16 is smaller, thereby reducing the shear force and / or tension on the connecting lead 15, avoiding the connecting lead 15 from breaking under the action of the stress generated by the deformation of the connecting layer 16, thereby ensuring the reliability of the connecting lead 15, enabling the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0081] At the same time, since the contact area between the connecting layer 16 and the second substrate 13 and the first substrate 11 is reduced, when the connecting layer 16 expands or contracts, the bending deformation of the first substrate 11 is also reduced, so that during the preparation process of the display panel 100, the first surface 11a and the second surface 11b of the first substrate 11 can be kept flat (the curvature is less than 0.1mm, kept flat, or approximately flat), thereby avoiding the problem of the connecting lead 15 being broken due to the tension caused by the bending deformation of the first substrate 11, thereby ensuring the reliability of the connecting lead 15, allowing the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0082] In some embodiments, the material of the connection layer 16 includes but is not limited to at least one of a thermosetting adhesive, a pressure-sensitive adhesive, or a textured adhesive.

[0083] Exemplarily, the thermal expansion coefficient of the material of the connection layer 16 is, for example, less than or equal to 20 PPM / °C.

[0084] In some embodiments of the present disclosure, the thermal expansion coefficient of the material of the connecting layer 16 needs to be ensured to be within a set range, so that the deformation of the connecting layer 16 when it expands or contracts under the influence of the ambient temperature is small. Therefore, when the connecting layer 16 is deformed, the relative position of the selected side surfaces of the second substrate 13 and the first substrate 11 is changed less, thereby reducing the force on the connecting lead 15 when the connecting layer 16 is deformed, thereby avoiding the problem of the connecting lead 15 breaking, thereby ensuring the reliability of the connecting lead 15, enabling the drive signal to be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0085] 4 and 5 , along the second direction Y, a distance d2 is formed between a boundary of the second electrode 14 close to the selected side surface 11 cc and a boundary of the second substrate 13 close to the selected side surface 11 cc.

[0086] In some embodiments, 1.6 mm ≥ d2 ≥ 1 mm. Because the second substrate 13 and the connecting layer 16 are disposed between the second electrode 14 and the first substrate 11, the distance between the second electrode 14 and the first substrate 11 is relatively large. The portion of the connecting lead 15 located on the second surface 11 b has different distances from the first substrate 11 than the portion located on the second substrate 13 and the portion near the selected side surface 11 cc. Consequently, the portion of the connecting lead 15 connected to the second electrode 14 located near the selected side surface 11 cc of the second substrate 13 is subjected to greater force, which may put the portion of the connecting lead 15 located on the second substrate 13 at risk of peeling off from the first substrate 11.

[0087] For example, when the connecting layer 16 is made of glue, due to problems such as uneven adhesion of the glue, bubbles may exist between the second substrate 13 and the first substrate 11. The bubbles may exist between the first substrate 11 and the connecting layer 16, or between the connecting layer 16 and the second substrate 13. Under the influence of the ambient temperature, when the glue expands or contracts, bubbles may also be generated in the glue. When the bubbles overflow from between the second substrate 13 and the first substrate 11 toward the selected side surface 11cc, bubbles will be caused to exist between the portion of the connecting lead 15 close to the selected side surface 11cc and the second surface 11b of the first substrate 11, reducing the connection stability of the connecting lead 15, causing the connecting lead 15 to be at risk of peeling off from the first substrate 11, and causing the connection between the second electrode 14 and the connecting lead 15 to be at risk of disconnection.

[0088] In other embodiments, as shown in Figures 4 and 5 , the boundary of the second electrode 14 near the selected side surface 11cc is further away from the selected side surface 11cc than the boundary of the second substrate 13 near the selected side surface 11cc. Along the second direction Y, the distance between the boundary of the second electrode 14 near the selected side surface 11cc and the boundary of the second substrate 13 near the selected side surface 11cc is 0.5 mm ≥ d21 ≥ 0.1 mm.

[0089] Exemplarily, as shown in FIG. 4 and FIG. 5 , the connecting lead 15 is in contact with or overlaps with an end of the second electrode 14 that is close to the end of the second electrode 14 .

[0090] When the connecting lead 15 overlaps the second electrode 14, the contact area between the connecting lead 15 and the second electrode 14 is increased, reducing the risk of disconnection between the connecting lead 15 and the second electrode 14, thereby improving the connection stability between the connecting lead 15 and the second electrode 14. When the overlapping portions of the connecting lead 15 and the second electrode 14 along the second direction Y are the same size, by increasing the distance d2 between the boundary of the second electrode 14 near the selected side surface 11cc and the boundary of the second substrate 13 near the selected side surface 11cc, the size of the portion of the connecting lead 15 located on the second substrate 13 is increased, increasing the contact area between the connecting lead 15 and the second substrate 13, and making the connection between the connecting lead 15 and the second substrate 13 tighter. This reduces the risk of the connecting lead 15 peeling off from the second substrate 13 and improves the connection stability between the connecting lead 15 and the second electrode 14, thereby ensuring the reliability of the connecting lead 15, enabling the drive signal to be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0091] The distance between the boundary of the second electrode 14 close to the selected side surface 11cc and the boundary of the second substrate 13 close to the selected side surface 11cc is d2, which can be selected according to design requirements. It is only used as an example here and is not intended to limit the present disclosure.

[0092] Exemplarily, the plurality of first electrodes 12 are spaced apart along the first direction X, and each first electrode 12 extends along the second direction Y. The plurality of first electrodes 12 have the same or different sizes along the first direction X, and have the same size along the second direction Y.

[0093] Exemplarily, the distances between any two adjacent first electrodes 12 are the same or different.

[0094] By controlling the spacing between adjacent first electrodes 12, during the process of forming the connecting lead 15, while ensuring effective connection between the connecting lead 15 and the corresponding first electrode 12, contact between the connecting lead 15 and other first electrodes 12 adjacent to the corresponding first electrode 12 is prevented, thereby avoiding the short circuit phenomenon caused by the same connecting lead 15 being electrically connected to two or more first electrodes 12.

[0095] In some embodiments, as shown in FIG. 5 , the display panel 100 further includes a protective layer 18 covering at least the plurality of connecting leads 15 .

[0096] Exemplarily, the material of the protection layer 18 includes but is not limited to SiN (silicon nitride) or epoxy resin materials.

[0097] By providing a protective layer 18 to cover the plurality of connecting leads 15, the problem of water-oxygen corrosion caused by contact between the connecting leads 15 and the air and / or water vapor in the air can be avoided; the protective layer 18 can also prevent the connecting leads 15 from contacting the remaining conductive structures in the display panel 100, thereby avoiding the problem of short circuit; at the same time, the protective layer 18 can also prevent the connecting leads 15 from being damaged by bumps, and reduce the problem of partial missing or broken connecting leads 15 caused by bumps, thereby ensuring the reliability of the connecting leads 15, enabling the driving signal to be transmitted to the light-emitting device 201 through the connecting leads 15, and ensuring that the display panel 100 can display normally.

[0098] Illustratively, a deposition process or a printing process is used to form a protective layer 18 on the side of the connecting leads 15 away from the first substrate 11. The protective layer 18 covers the multiple connecting leads 15, thereby preventing the connecting leads 15 from contacting with air and / or water vapor in the air to produce water and oxygen corrosion.

[0099] Exemplarily, as shown in FIG5 , the plurality of connecting leads 15 are covered by the protective layer 18 , and the distance between the outermost boundary of the plurality of connecting leads 15 and the boundary of the protective layer 18 is d14 , 22 μm ≥ d14 ≥ 18 μm.

[0100] Exemplarily, as shown in FIG. 5 , the protection layer 18 also covers portions of the plurality of second electrodes 14 close to the selected side surface 11 cc; or, completely covers the plurality of second electrodes 14 .

[0101] Exemplarily, as shown in FIG. 5 , the protection layer 18 covers at least portions of the plurality of first electrodes 12 close to the selected side surface 11 cc, or completely covers the plurality of first electrodes 12 .

[0102] The protective layer 18 covers the parts of the first electrode 12 and the second electrode 14 that do not need to be connected to the rest of the structure, thereby preventing the connecting lead 15 from contacting the air and / or water vapor in the air to cause water-oxygen corrosion; the protective layer 18 can also prevent the first electrode 12 and the second electrode 14 from contacting the rest of the conductive structures in the display panel 100, thereby avoiding the short circuit problem; at the same time, the protective layer 18 can also prevent the first electrode 12 and the second electrode 14 from being damaged by bumps, reducing the problem of partial loss or breakage of the first electrode 12 and the second electrode 14 caused by bumps, thereby ensuring the reliability of the first electrode 12 and the second electrode 14, so that the driving signal can be transmitted to the light-emitting device 201 through the second electrode 14, the connecting lead 15 and the first electrode 12 in sequence, ensuring that the display panel 100 can display normally.

[0103] In some embodiments, as shown in FIG5 , the display panel 100 further includes a buffer layer 17 disposed on a side of the second substrate 13 away from the first substrate 11 . The buffer layer 17 covers an edge portion of the second substrate 13 near the selected side surface 11 cc. The connecting wire 15 extends across the buffer layer 17 and connects to the second electrode 14 .

[0104] By providing a buffer layer 17, the adhesion tightness between the portion of the second substrate 13 close to the selected side surface 11cc and the first substrate 11 is increased, thereby preventing the second electrode 14 from deviating from the set position due to the displacement of the second substrate 13, thereby ensuring that the connecting lead 15 and the second electrode 14 can be effectively connected, and further ensuring that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, ensuring that the display panel 100 can display normally.

[0105] For example, the second substrate 13 expands and contracts under the influence of temperature, and the buffer layer 17 fixes the side of the second substrate 13 close to the selected side 11cc. Since the position of the second electrode 14 is close to the selected side 11cc, it can be understood that in this way, the second electrode 14 expands and contracts on the second substrate 13, but can still be guaranteed to be located at the set position without offset, thereby ensuring that the connecting lead 15 can be effectively connected to the second electrode 14.

[0106] In some examples, as shown in FIG1 , a distance k1 between the surface of the second electrode 14 on the side away from the first substrate 11 and the first substrate 11 is greater than the thickness of the connecting lead 15 , and there is an obvious step difference between the second electrode 14 and the first substrate 11 . Therefore, when the connecting lead 15 extends from the second surface 11 b of the first substrate 11 to the second substrate 13 and connects to the second electrode 14 , breakage is likely to occur at the step difference position, preventing the drive signal from being transmitted normally.

[0107] Exemplarily, the material of the buffer layer 17 includes but is not limited to reinforcing glue.

[0108] Exemplarily, the thermal expansion coefficient of the material of the buffer layer 17 is less than or equal to 20 PPM / °C.

[0109] The thermal expansion coefficient of the material of the buffer layer 17 needs to be ensured to be within a set range so that the deformation of the buffer layer 17 when it expands or contracts under the influence of the ambient temperature is small, thereby avoiding the problem of the second substrate 13 being displaced due to the expansion and contraction of the buffer layer 17, causing the second electrode 14 to deviate from the set position, and allowing the connecting lead 15 to maintain an effective connection with the second electrode 14.

[0110] For example, after the second substrate 13 is attached, a printing process is used to print reinforcing glue on the edge of the second substrate 13 near the selected side 11cc to fill the step position and reduce the step difference when the connecting lead 15 extends from the second surface 11b to the surface of the second substrate 13, thereby preventing the connecting lead 15 from breaking and causing the driving signal to be unable to be transmitted normally.

[0111] In some embodiments, the thickness of the second electrode 14 is less than 5 μm. As shown in FIG. 6 , the buffer layer 17 does not overlap with the second electrode 14 .

[0112] In some other embodiments, the thickness of the second electrode 14 is greater than or equal to 5 μm. As shown in FIG. 7 , the buffer layer 17 further covers the edge portion of the second electrode 14 close to the selected side surface 11 cc.

[0113] By disposing the buffer layer 17 on the second electrode 14 away from the boundary of the selected side surface 11cc, the buffer layer 17 and the second electrode 14 overlap, thereby filling the step difference between the side of the second electrode 14 close to the selected side surface 11cc and the second substrate 13, reducing the step difference when the connecting lead 15 extends from the second substrate 13 to the surface of the second electrode 14, thereby preventing the connecting lead 15 from breaking and causing the driving signal to be unable to be transmitted normally.

[0114] Exemplarily, as shown in FIG. 7 , along the second direction Y, a size d17 of an overlapping portion of the buffer layer 17 and the second electrode 14 is less than or equal to 100 μm.

[0115] In some embodiments, as shown in Figures 6 and 7 , the buffer layer 17 includes a first slope 171 and a second slope 172. Along the second direction Y, and from the selected side surface 11cc toward the second substrate 13, the height of the first slope 171 gradually increases, while the height of the second slope 172 gradually decreases, with a smooth transition between the first slope 171 and the second slope 172.

[0116] The first slope 171 is closer to the selected side surface 11cc than the second slope 172. The connecting lead 15 is, for example, disposed on a side of the buffer layer 17 away from the first substrate 11. The connecting lead 15 is located on the second surface 11b of the first substrate 11. The distance between the connecting lead 15 and the first substrate 11 gradually increases along the third direction Z from the selected side surface 11cc toward the second electrode 14. The third direction Z is perpendicular to the second surface 11b of the first substrate 11 and parallel to the selected side surface 11cc.

[0117] Compared with the part of the connecting lead 15 located on the second surface 11b, the part crossing the second substrate 13 close to the selected side surface 11cc is connected to the second electrode 14, which reduces the variation of the distance between the connecting lead 15 and the first substrate 11 along the third direction Z, avoids the problem of the connecting lead 15 breaking due to a large step difference, ensures the reliability of the connecting lead 15, ensures the effective connection between the second electrode 14 and the connecting lead 15, enables the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, and ensures that the display panel 100 can display normally.

[0118] Exemplarily, as shown in FIG5 , the buffer layer 17 is away from the surface of the first substrate 11 and arches in a direction away from the first substrate 11 , forming a hill shape.

[0119] In some embodiments, as shown in FIG. 6 and FIG. 7 , the slope angles of the first slope surface 171 and the second slope surface 172 are both acute angles.

[0120] With such a design, the distance between the connecting lead 15 and the first substrate 11 gradually increases from the second surface 11b of the first substrate 11 to the part connected to the second electrode 14 on the second substrate 13. The slower the trend of the distance increase, the closer the connecting lead 15 is to being set on a plane. Therefore, the slope angles of the first slope 171 and the second slope 172 are set to acute angles, thereby ensuring that the connecting lead 15 can be approximately set on a plane, thereby reducing the risk of the connecting lead 15 breaking, ensuring that the connecting lead 15 and the second electrode 14 can be effectively connected, and thereby ensuring that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, ensuring that the display panel 100 can display normally.

[0121] Exemplarily, as shown in FIG6 and FIG7 , the angle between the tangent plane at any point on the first slope 171 and the second slope 172 and the second surface 11 b is α, and 50°≥α≥30°.

[0122] In some embodiments, as shown in Figures 6 and 7, the edge portion of the second substrate 13 near the selected side 11cc extends out relative to the boundary of the connecting layer 16 near the selected side 11cc, and the edge portion of the second substrate 13 and the side 11c and the second surface 11b of the connecting layer 16 form a gap area Q, and a portion of the buffer layer 17 fills the gap area Q.

[0123] By providing the buffer layer 17, while filling the gap area Q between the portion of the second substrate 13 close to the selected side surface 11cc and the first substrate 11, it also serves to connect the second substrate 13 and the first substrate 11, ensuring the tightness of adhesion between the second substrate 13 and the first substrate 11, and preventing the edge portion of the second substrate 13 from warping, thereby reducing the risk of the connecting lead 15 breaking under the action of the warped portion of the second substrate 13 when the edge portion of the second substrate 13 warps, thereby ensuring the reliability of the connecting lead 15, enabling the drive signal to be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0124] Exemplarily, as shown in FIG. 6 and FIG. 7 , along the third direction Z, the distance between the buffer layer 17 and the second substrate 13 is d10, and 120 μm ≥ d10 > 0.

[0125] In some examples, as shown in FIG. 7 , the buffer layer 17 covers an edge portion of the second electrode 14 near the selected side surface 11 cc. Along the third direction Z, a distance d16 between the buffer layer 17 and the second electrode 14 is 20 μm ≥ d16 > 0.

[0126] In some embodiments, as shown in FIG. 5 , a space is provided between the buffer layer 17 and the selected side surface 11 cc.

[0127] It can be understood that the buffer layer 17 is close to the boundary of the selected side surface 11 cc, and there may be a certain distance between the buffer layer 17 and the selected side surface 11 cc, or the buffer layer 17 may overlap or substantially overlap with the selected side surface 11 cc.

[0128] 5 , along the second direction Y, the distance between the second substrate 13 and the selected side surface 11 cc is d12. For example, 1.1 mm ≥ d12 ≥ 0.9 mm.

[0129] It can be understood that by controlling the distance between the second substrate 13 and the selected side 11cc, compared to the design in which the boundary of the second substrate 13 close to the selected side 11cc overlaps or roughly overlaps with the selected side 11cc, while reserving space for the setting of the buffer layer 17, the length of the portion of the connecting lead 15 located between the second substrate 13 and the selected side 11cc is extended. Combined with the setting of the buffer layer 17, the connecting lead 15 can be approximately set on a plane, thereby reducing the risk of the connecting lead 15 breaking under the influence of the step difference between the second electrode 14 and the first substrate 11.

[0130] Exemplarily, as shown in FIG6 and FIG7 , along the second direction Y, the size of the buffer layer 17 is d13, and d13 ≥ 0.6 mm.

[0131] 6 and 7 , along the second direction Y, the buffer layer 17 is away from the boundary of the selected side surface 11 cc, and the distance between the buffer layer 17 and the boundary of the second substrate 13 close to the selected side surface 11 cc is d131, 0.3 mm ≥ d131 ≥ 0.2 mm.

[0132] 6 and 7 , along the second direction Y, a distance between the buffer layer 17 near the boundary of the selected side surface 11 cc and the boundary of the second substrate 13 near the selected side surface 11 cc is d132 , and 0.3 mm ≥ d132 ≥ 0.2 mm.

[0133] 6 and 7 , a distance d3 is provided between a boundary of the connection layer 16 close to the selected side surface 11 cc and a boundary of the second substrate 13 close to the selected side surface 11 cc.

[0134] As shown in FIG1 , the display panel has a second electrode 14 that is away from the surface of the first substrate 11 and has a large distance k1 from the first substrate 11 , such as 100 μm. Thus, a large step exists in the portion of the second electrode 14 that is close to the selected side surface 11cc, and the portion of the connecting lead 15 located at the step is subjected to a large force. When the first substrate 11 is bent or when the electrode carrier 1 ' and the first substrate 11 move relative to each other, the connecting lead 15 is prone to breakage, resulting in a short circuit in the display panel, causing the electrical signal to be unable to be transmitted normally, and the display panel to be unable to display normally.

[0135] In some embodiments, as shown in Figures 6 and 7, the boundary of the connecting layer 16 close to the selected side 11cc is farther away from the selected side 11cc than the boundary of the second substrate 13 close to the selected side 11cc; or, the boundary of the connecting layer 16 close to the selected side 11cc overlaps or approximately overlaps with the boundary of the second substrate 13 close to the selected side 11cc.

[0136] Illustratively, 0.3 mm ≥ d3 > 0.

[0137] With the design shown in Figures 6 and 7 , the distance between the portion of the second substrate 13 and the first substrate 11 that does not include the connecting layer 16 is smaller than the distance between the portion of the second substrate 13 and the first substrate 11 that includes the connecting layer 16. With this design, when the second substrate 13 is attached to the second surface 11b of the first substrate 11, while ensuring effective attachment of the second substrate 13, the distance between the portion of the connecting lead 15 located near the boundary of the second substrate 13 near the selected side surface 11cc and the first substrate 11 gradually increases as it moves away from the selected side surface 11cc. Compared to the design shown in Figure 1 , this reduces the step difference between the side of the second substrate 13 near the selected side surface 11cc and the first substrate 11, thereby reducing the force on the connecting lead 15 at this step difference. This prevents the connecting lead 15 from breaking due to excessive force, ensures the reliability of the connecting lead 15, and enables the drive signal to be transmitted to the light-emitting device 201 through the connecting lead 15, ensuring normal display of the display panel 100.

[0138] In some embodiments, as shown in FIG. 8 , FIG. 9 , FIG. 10 and FIG. 11 , the connection layer 16 includes at least one groove C, and the groove C extends from the upper surface of the connection layer 16 to the lower surface of the connection layer 16 .

[0139] During the preparation of the display panel, for example, in the die-bonding process, a large amount of heat is generated, causing the connecting layer 16 to expand or shrink and deform under the influence of the ambient temperature. The deformation of the connecting layer 16 causes the relative position of the second substrate 13 and the first substrate 11 to change, which will cause the relative position of the second electrode 14 and the connecting lead 15 to change, and there is a risk of breakage of the connecting lead 15; at the same time, the connecting layer 16 is attached to the surface of the first substrate 11, so the expansion and contraction deformation of the connecting layer 16 will also cause the bending deformation of the first substrate 11, further increasing the risk of breakage of the connecting lead 15.

[0140] By patterning the connection layer 16 and providing grooves C therein, the grooves C can disperse the high-temperature stresses experienced by the connection layer 16 when the ambient temperature fluctuates, thereby reducing the deformation of the connection layer 16 caused by the ambient temperature, and thereby reducing the risk of breakage of the connection leads 15 during the display panel manufacturing process. Furthermore, since the deformation of the connection layer 16 caused by the ambient temperature is reduced, the bending deformation of the first substrate 11 caused by the deformation of the connection layer 16 is also reduced, thereby reducing the risk of breakage of the connection leads 15 during the display panel manufacturing process.

[0141] At the same time, when attaching the second substrate 13, bubbles may exist between the connecting layer 16 and the first substrate 11 and / or between the connecting layer 16 and the second substrate 13 due to uneven attachment. Under the influence of ambient temperature, when the adhesive material expands or contracts, bubbles may also be generated in the adhesive material. The bubbles can be discharged through the groove C, thereby ensuring the flatness and tightness of the attachment of the second substrate 13 to the first substrate 11.

[0142] It is understood that the groove C can extend perpendicularly from the upper surface of the connecting layer 16 to the lower surface of the connecting layer 16, or the groove C can extend obliquely from the upper surface of the connecting layer 16 to the lower surface of the connecting layer 16. For example, the groove C extends through the connecting layer 16 along a third direction Z, which is perpendicular to the first direction X and the second surface 11b. Alternatively, the direction along which the groove C extends through the connecting layer 16 forms an angle θ with the upper or lower surface of the connecting layer 16, where 90° ≥ θ > 0.

[0143] This is merely an illustrative description and is not intended to limit the present disclosure.

[0144] Exemplarily, as shown in FIG8 , the dimension of the slot C perpendicular to its extending direction is c, and 5 mm ≥ c ≥ 1 mm.

[0145] If the size of the slots C is too large, the connection layer 16 will have too many slots, resulting in a small area of ​​the connection layer 16 that has a bonding effect, which will affect the bonding effect of the connection layer 16. If the size of the slots C is too small, when the connection layer 16 expands and deforms, the slots C may close due to the expansion and deformation, affecting the slots C's ability to distribute the high-temperature stress to the connection layer 16. By controlling the width of the slots C, the high-temperature stress to the connection layer 16 is effectively distributed while also ensuring the bonding effect of the connection layer 16, ensuring a secure attachment of the second substrate 13 and preventing poor connection between the second electrode 14 and the connection lead 15 caused by poor adhesion of the second substrate 13.

[0146] Exemplarily, as shown in FIG8 , when the connection layer 16 includes a plurality of slots C, the distance between any two adjacent slots C is d4 , and d4 ≥ 10 mm.

[0147] Exemplarily, as shown in FIG8 , FIG9 , FIG10 , FIG11 , FIG12 and FIG13 , along the second direction Y, the spacing between the slot C closest to the second electrode 14 and the second electrode 14 is d5 , and d5 ≥ 5 mm.

[0148] When attaching the second substrate 13, bubbles may exist between the connecting layer 16 and the first substrate 11 and / or between the connecting layer 16 and the second substrate 13 due to uneven attachment. Under the influence of ambient temperature, when the adhesive material expands or contracts, bubbles may also be generated in the adhesive material. The bubbles can be discharged through the groove C. When the distance between the groove C and the second electrode 14 is too small, the bubbles may overflow to the position between the second electrode 14 and the first substrate 11, and there is a possibility that the bubbles will further overflow toward the selected side surface 11cc of the first substrate 11, so that bubbles exist in the part between the connecting lead 15 and the first substrate 11, affecting the flatness and tightness of the attachment of the connecting lead 15 to the first substrate 11.

[0149] By controlling the distance between the groove C and the second electrode 14, bubbles generated when attaching the second substrate 13 are prevented from overflowing to the position between the second electrode 14 and the first substrate 11. While ensuring the tightness of the attachment of the second substrate 13 to the first substrate 11, the connecting lead 15 is prevented from being affected by the bubbles attached to the second substrate 13 and causing breakage or poor connection between the second electrode 14 and the connecting lead 15. The reliability of the connecting lead 15 is ensured, so that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, ensuring that the display panel 100 can display normally.

[0150] In some embodiments, as shown in FIG8 , the grooves C include at least one first groove C1 and / or at least one second groove C2. The first groove C1 and the second groove C2 extend in different directions. The boundaries of the first groove C1 and the second groove C2 do not overlap with the boundaries of the connection layer 16.

[0151] By providing a groove C (a first groove C1 and / or a second groove C2) in the connecting layer 16, the covering area of ​​the connecting layer 16 is reduced while ensuring the covering effect of the second substrate 13, thereby reducing the overall expansion and contraction deformation of the connecting layer 16 under the influence of ambient temperature, etc. At the same time, by providing the first groove C1 and / or the second groove C2 in the connecting layer 16, the expansion and contraction deformation of the connecting layer 16 in a direction perpendicular to the extension direction of the first groove C1 and / or the second groove C2 can be improved. While reducing the deformation amount of the first substrate 11 under the influence of the expansion and contraction deformation of the connecting layer 16, the risk of the connecting lead 15 being broken due to the expansion and contraction deformation of the connecting layer 16 is reduced, thereby ensuring the reliability of the connecting lead 15, and enabling the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, thereby ensuring that the display panel 100 can display normally.

[0152] As shown in FIG8 , the first groove C1 and the second groove C2 are located in the connecting layer 16 . Therefore, there is no gap at the boundary of the connecting layer 16 , so that the edge of the connecting layer 16 can be well adhered and not easily warped, effectively avoiding the problem of poor adhesion of the second substrate 13 caused by the warping of the edge of the connecting layer 16 . At the same time, the first groove C1 and / or the second groove C2 can also serve as an exhaust channel. When laminating the second substrate 13, bubbles may exist between the connecting layer 16 and the first substrate 11 and / or between the connecting layer 16 and the second substrate 13 due to uneven adhesion. Under the influence of ambient temperature, when the adhesive material expands or contracts and deforms, bubbles may also be generated in the adhesive material. The bubbles can be discharged through the first groove C1 and the second groove C2, thereby ensuring the tightness of adhesion between the second substrate 13 and the first substrate 11, avoiding the problem of bubbles overflowing toward the selected side 1cc direction causing poor bonding between the connecting lead 15 and the first substrate 11, preventing the connecting lead 15 from peeling off from the first substrate 11, reducing the risk of the connecting lead 15 breaking, ensuring the reliability of the connecting lead 15, and enabling the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, thereby ensuring that the display panel 100 can display normally.

[0153] 8 , the dimension of the slot C along the first direction X is smaller than the dimension of the connection layer 16 along the first direction X. The dimension of the slot C along the second direction Y is smaller than the dimension of the connection layer 16 along the second direction Y.

[0154] In some embodiments, as shown in Figures 9, 10, and 11, the slots C extend through the connection layer 16 along a predetermined direction. When the connection layer 16 includes a plurality of slots C, the slots C are spaced apart. The predetermined direction is parallel to the upper or lower surface of the connection layer 16.

[0155] For example, the extending directions of the plurality of slots C may be the same or different. When the extending directions of the plurality of slots C are different, the extending directions of the plurality of slots C may cross.

[0156] In some examples, at least two slots C in the plurality of slots C intersect.

[0157] It is understood that the connection layer 16 may include only one slot C extending in any direction, or include multiple slots C extending in the same direction and arranged at intervals, or include multiple slots C extending in different directions. It is understood that the multiple slots may extend in one or more directions.

[0158] By providing a groove C extending along a set direction in the connecting layer 16, the covering area of ​​the connecting layer 16 is reduced while ensuring the covering effect of the second substrate 13, thereby reducing the overall expansion and contraction deformation of the connecting layer 16 under the influence of ambient temperature, etc., and reducing the risk of the connecting lead 15 being broken due to the expansion and contraction deformation of the connecting layer 16.

[0159] At the same time, the groove C can also serve as an exhaust channel. When the second substrate 13 is attached, bubbles may exist between the connecting layer 16 and the first substrate 11 and / or between the connecting layer 16 and the second substrate 13 due to uneven attachment. Under the influence of ambient temperature, when the adhesive material expands or contracts and deforms, bubbles may also be generated in the adhesive material. The bubbles can be discharged through the groove C, thereby ensuring the tightness of attachment between the second substrate 13 and the first substrate 11, avoiding the problem of bubbles overflowing toward the selected side 1cc direction, resulting in poor bonding between the connecting lead 15 and the first substrate 11, preventing the connecting lead 15 from peeling off from the first substrate 11, reducing the risk of the connecting lead 15 breaking, ensuring the reliability of the connecting lead 15, and enabling the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, thereby ensuring that the display panel 100 can display normally.

[0160] Illustratively, the set direction may be parallel to the selected side surface 11cc, or the set direction may be perpendicular to the selected side surface 11cc, or the angle formed between the set direction and the selected side surface 11cc may be an acute angle.

[0161] In some examples, as shown in FIG. 9 , the slots C penetrate the connection layer 16 along the first direction X.

[0162] In other examples, as shown in FIG. 10 , a portion of the groove C penetrates the connection layer 16 along the first direction X, and a portion of the groove C penetrates the connection layer 16 along the second direction Y.

[0163] A distance between the boundary of the connecting layer 16 and the second electrode 14 along the second direction Y is d6, where d6 is ≥ 5 mm.

[0164] As shown in Figures 9 and 10, when the groove C penetrates the connection layer 16 along the first direction X, the distance d5 between the groove C closest to the second electrode 14 and the second electrode 14 is equal to the distance d6 between the boundary of the connection layer 16 and the second electrode 14 along the second direction Y.

[0165] In some other examples, as shown in FIG11 , a plurality of slots C obliquely penetrate the connection layer 16 , and the extension directions of the plurality of slots C are different. The angle formed between the extension direction of each slot C and the selected side surface 11cc is an acute angle.

[0166] In some embodiments, as shown in FIG. 9 , when the groove C penetrates the connection layer 16 along the first direction X, the groove C is located on a side of the second electrode 14 away from the selected side surface 11 cc.

[0167] When laminating the second substrate 13, bubbles may be generated between the connecting layer 16 and the first substrate 11 and / or between the connecting layer 16 and the second substrate 13 due to problems such as uneven lamination, and / or bubbles may be generated in the adhesive when the adhesive expands or contracts under the influence of ambient temperature. When the bubbles are discharged through the groove C, the connecting layer 16 may be warped at the boundary position of the groove C when the bubbles are discharged. When the warped portion is located between the second electrode 14 and the first substrate 11, the second electrode 14 may deviate from the preset position, so that when the connecting lead 15 is formed, the connecting lead 15 and the second electrode 14 cannot be effectively connected, and the driving signal cannot be normally transmitted to the light-emitting device 201, so that the display panel cannot display normally.

[0168] By setting the groove C on the side of the second electrode 14 away from the selected side 11cc, the connection layer 16 is prevented from warping at the boundary portion of the groove C, thereby ensuring that the connecting lead 15 and the second electrode 14 can be effectively connected, thereby ensuring that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0169] In some embodiments, as shown in FIG. 12 and FIG. 13 , there are multiple slots C that intersect with each other to form a grid.

[0170] For example, when forming the connection layer 16, a single mother layer is first formed, and then grid-shaped slots C are formed in the single mother layer to form a plurality of blocks arranged in an array. Alternatively, when forming the connection layer 16, the plurality of blocks arranged in an array are directly formed. When the connection layer 16 includes a plurality of blocks, the shape of the blocks includes, but is not limited to, at least one of a rectangle, a trapezoid, a triangle, or a parallelogram.

[0171] As shown in FIG. 12 and FIG. 13 , when the connection layer 16 is in the shape of a plurality of blocks arranged in an array, the plurality of blocks are all located on a side of the second electrode 14 away from the selected side surface 11 cc.

[0172] Exemplarily, a distance between the boundary of the block closest to the second electrode 14 and the second electrode 14 along the second direction Y is d6, and d6≧5 mm.

[0173] In some embodiments, as shown in Figures 8 to 16 , the second substrate 13 includes a main body 131 and a plurality of protrusions 132 disposed on a side of the main body 131 near the selected side surface 11cc. One end of the protrusion 132 is connected to the main body 131, and the other end extends toward the selected side surface 11cc. The plurality of protrusions 132 are spaced apart along a first direction X, which is parallel to the first surface 11a and the selected side surface 11cc.

[0174] During the preparation of the display panel 100, for example, due to the high temperature generated during the die bonding process, the second substrate 13 is affected by the temperature, and the material of the second substrate 13 will deform under the influence of the temperature change, thereby causing the position of the second electrode 14 thereon to deviate from the preset position, making the connection between the connecting lead 15 and the second electrode 14 unreliable and posing a risk of disconnection.

[0175] By patterning the side of the second substrate 13 close to the selected side 11cc, a plurality of protrusions 132 are formed on the side of the second substrate 13 close to the selected side 11cc. Compared with a design in which a flat boundary is flush with the selected side 11cc, the area of ​​the side surface of the second substrate 13 is increased, so that the second substrate 13 can dissipate heat better, and the area of ​​the second substrate 13 is reduced, thereby reducing the deformation of the material of the second substrate 13 under temperature changes, thereby ensuring the connection reliability of the second electrode 14 and the connecting lead 15, so that the driving signal can be transmitted to the light-emitting device 201 through the second electrode 14 and the connecting lead 15, and ensuring that the display panel 100 can display normally. At the same time, the patterned boundary of the second substrate 13 can disperse edge stress, reduce the impact of ambient temperature changes on the second substrate 13, and reduce the deformation of the second substrate 13 caused by temperature, so that the second electrode 14 on the second substrate 13 can be maintained in the set position without any deformation, thereby ensuring that the connecting lead 15 and the second electrode 14 can be effectively connected, thereby ensuring that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0176] Exemplarily, the material of the second substrate 13 includes but is not limited to polyimide (PI, Polyimide Film).

[0177] Exemplarily, the material of the second electrode 14 includes but is not limited to copper foil.

[0178] In some embodiments, in an orthographic projection onto a reference plane M, the protrusion 132 overlaps with at least one second electrode 14 ; the reference plane M is parallel to the selected side surface 11 cc.

[0179] It is understood that at least one second electrode 14 is provided corresponding to each convex portion 132. As shown in FIG4 and FIG5, each convex portion 132 is provided corresponding to one, two or three second electrodes 14.

[0180] This is merely an illustrative description and is not intended to limit the present disclosure.

[0181] Exemplarily, as shown in FIG. 16 , along the second direction Y, the dimension of the protrusion 132 is d8, where d8 is ≥ 0.2 mm.

[0182] By controlling the width of the protrusion 132 (for example, the dimension of the protrusion 132 along the second direction Y shown in Figures 4 and 5), it is avoided that the protrusion 132 is not firmly adhered to the first substrate 11 due to the protrusion 132 being too small, causing the position of the second electrode 14 to deviate from the preset position, resulting in the problem that the connecting lead 15 and the second electrode 14 may not be effectively connected. The effective bonding area of ​​the protrusion 132 is guaranteed, thereby ensuring the tightness of the fit between the protrusion 132 and the first substrate 11, and further ensuring that the connecting lead 15 and the second electrode 14 can be effectively connected, so that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0183] Exemplarily, as shown in FIG16 , along the first direction X, the distance between any two adjacent second electrodes 14 is d1 , the distance between any two adjacent protrusions 132 is d7 , and d11 > d1 > d7 ≥ 30 μm.

[0184] It should be noted that, as shown in Figure 16, any protrusion 132 is arranged corresponding to at least one second electrode 14, and the at least one second electrode 14 corresponding to each protrusion 132 is regarded as an electrode group W. The distance d1 between any two adjacent second electrodes 14 is greater than the distance d7 between any two adjacent protrusions 132. The any two adjacent second electrodes 14 referred to here belong to the two electrode groups W corresponding to the two protrusions 132 respectively.

[0185] By controlling the spacing between two adjacent protrusions 132, while ensuring the effective bonding area of ​​the protrusions 132, the side surface area of ​​the connecting layer 16 is increased, allowing the connecting layer 16 to better dissipate heat and disperse the high-temperature stress experienced by the connecting layer 16. This reduces the deformation of the connecting layer 16 caused by the ambient temperature, thereby reducing the risk of breakage of the connecting lead 15 during the display panel manufacturing process. Furthermore, since the deformation of the connecting layer 16 caused by the ambient temperature is reduced, the bending deformation of the first substrate 11 caused by the deformation of the connecting layer 16 is also reduced, thereby reducing the risk of breakage of the connecting lead 15 during the display panel manufacturing process.

[0186] In some examples, as shown in FIG16 , along the first direction X, the size of the protrusion 132 is greater than the distance between the outermost boundaries of k second electrodes 14 corresponding to the protrusion 132. Each protrusion 132 is provided corresponding to k second electrodes 14, where k is a positive integer greater than or equal to 1.

[0187] Along the first direction X, the size of the protrusion 132 is d15. Among them, a q is the size of the qth second electrode 14 along the first direction X among the k second electrodes 14 corresponding to the convex portion 132, is the sum of the dimensions of k second electrodes 14 corresponding to the protrusion 132 along the first direction X, k≥q≥1.

[0188] Exemplarily, as shown in FIG18 , along the first direction X, the size of the second electrode 14 is a, where a≥0.06 mm.

[0189] Exemplarily, as shown in FIG18 , along the second direction Y, the size of the second electrode 14 is b, 0.2 mm ≥ b ≥ 0.08 mm.

[0190] It can be understood that, among the k second electrodes 14 corresponding to each convex portion 132, the size a of the k first electrodes 12 is q or the size a of the k first electrodes 12 may be the same; q Not exactly the same.

[0191] In some embodiments, as shown in FIG. 14 , FIG. 15 , FIG. 16 and FIG. 17 , the second substrate 13 includes a plurality of first via holes K1 arranged in an array. The first via holes K1 penetrate from the upper surface of the second substrate 13 to the lower surface of the second substrate 13 .

[0192] When attaching the second substrate 13, bubbles may exist between the connecting layer 16 and the second substrate 13 due to problems such as uneven attachment, and / or bubbles may also be generated in the adhesive when the adhesive expands or contracts under the influence of ambient temperature. The bubbles can be discharged through the grooves C on the connecting layer 16 and / or discharged through the first vias K1, thereby ensuring the flatness and tightness of the attachment of the second substrate 13 to the connecting layer 16, and further ensuring the flatness and tightness of the attachment of the second substrate 13 to the first substrate 11, preventing the connecting lead 15 from being affected by the bubbles attached to the second substrate 13 and causing breakage or poor connection between the second electrode 14 and the connecting lead 15, ensuring the reliability of the connecting lead 15, so that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0193] For example, as shown in FIG. 14 , FIG. 15 and FIG. 16 , the first via hole K1 may be in at least one of the shapes of an oblique cylinder, a cylinder, a truncated cone, a prism, and a truncated pyramid.

[0194] As shown in Figures 14, 15 and 16, any cross-sectional shape of the first via K1 parallel to the second surface 11b includes but is not limited to a circle, an ellipse, a trapezoid, a rectangle and a polygon, etc. For a first via K1, any two of its multiple cross-sections parallel to the second surface 11b are similar or congruent.

[0195] For example, as shown in Figures 14, 15, and 16, the plurality of first vias K1 arranged in an array may be arranged in at least one of a honeycomb arrangement, a matrix arrangement, a linear arrangement, or a circular arrangement. When the plurality of first vias K1 are arranged in a linear array, they may be arranged in a linear array along a straight line, a curve, or a broken line.

[0196] Exemplarily, as shown in FIG. 14 , FIG. 15 and FIG. 16 , the boundaries of the plurality of first via holes K1 do not overlap with the boundary of the second substrate 13 .

[0197] Exemplarily, as shown in FIG. 14 , FIG. 15 and FIG. 16 , the dimension of the first via hole K1 along the first direction X is smaller than or equal to the dimension of the second substrate 13 along the first direction X.

[0198] Exemplarily, as shown in FIG. 14 , FIG. 15 and FIG. 16 , the dimension of the first via hole K1 along the second direction Y is smaller than or equal to the dimension of the second substrate 13 along the second direction Y.

[0199] In some examples, the orthographic projections of the plurality of first via holes K1 on the second surface 11 b fall within the orthographic projection range of the second substrate 13 on the second surface 11 b .

[0200] Exemplarily, as shown in FIG17 , the first via hole K1 obliquely penetrates the second substrate 13 along a set direction, and an angle formed between the set direction and the upper surface of the second substrate 13 is an acute angle.

[0201] In some embodiments, as shown in FIG. 15 , a plurality of first via holes K1 are arranged into a plurality of columns along the second direction Y, and at least one second electrode 14 is disposed on both sides of each column of first via holes K1 .

[0202] When bubbles exist in the portion between the second electrode 14 and the first substrate 11, for example, the portion between the second substrate 13 and the connecting layer 16 and between the second electrode 14 and the first substrate 11, the second electrode 14 may deviate from the preset position, resulting in the problem that the connecting lead 15 and the second electrode 14 cannot be effectively connected when forming the connecting lead 15, and the driving signal cannot be normally transmitted to the light-emitting device 201, so that the display panel cannot display normally.

[0203] By providing the first via hole K1, bubbles existing in the portion between the second substrate 13 and the connecting layer 16 and between the second electrode 14 and the first substrate 11 can be discharged through the first via hole K1, so that the position of the second electrode 14 can be maintained at the set position, thereby ensuring that the connecting lead 15 and the second electrode 14 can be effectively connected, and further ensuring that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, thereby ensuring that the display panel 100 can display normally.

[0204] In some embodiments, as shown in FIG. 15 , along the first direction X, the size of the first via hole K1 is smaller than the gap between two adjacent second electrodes 14 .

[0205] Exemplarily, in an orthographic projection onto the second surface 11 b of the first substrate 11 , there is a gap between the second electrode 14 and the first via hole K1 .

[0206] When attaching the second substrate 13, bubbles may exist between the connecting layer 16 and the second substrate 13 due to problems such as uneven attachment. The bubbles can be discharged through the first via hole K1. When the first via hole K1 overlaps with the second electrode 14, the second electrode 14 may contact the remaining conductive structures in the display panel 100 through the first via hole K1, causing a short circuit. At the same time, since the first via hole K1 and the second electrode 14 overlap, when the bubbles are discharged from the first via hole K1, the edge of the second electrode 14 may be lifted up, and there is a risk of peeling off from the second substrate 13.

[0207] By controlling the size of the first via K1 between two adjacent second electrodes 14, the problem of the second electrode 14 contacting the remaining structure through the first via K1 can be effectively avoided. At the same time, the problem of the edge of the second electrode 14 warping caused by bubbles being discharged through the first via K1 can be avoided, thereby ensuring the tightness of the adhesion between the second electrode 14 and the second substrate 13.

[0208] It is understandable that, among the plurality of first via holes K1 , except for the first via hole K1 located between two adjacent second electrodes 14 , the remaining first via holes K1 may have a size along the first direction X that is smaller than, larger than, or equal to the gap between two adjacent second electrodes 14 .

[0209] In some embodiments, as shown in FIG. 17 , the connection layer 16 includes a plurality of second via holes K2 , which extend from the upper surface of the connection layer 16 to the lower surface of the connection layer 16 , and are connected to the first via holes K1 .

[0210] When attaching the second substrate 13, bubbles may exist between the connecting layer 16 and the first substrate 11 and / or between the connecting layer 16 and the second substrate 13 due to problems such as uneven attachment. When the adhesive material expands or contracts under the influence of ambient temperature, bubbles may also be generated in the adhesive material. By providing a plurality of second via holes K2 corresponding to the plurality of first via holes K1 on the connecting layer 16, the bubbles can be discharged through the second via holes K2 and / or the first via holes K1, thereby ensuring the flatness and tightness of the attachment of the second substrate 13 to the first substrate 11.

[0211] Exemplarily, the shape of the second via hole K2 is the same as that of the first via hole K1 penetrating therethrough, and the second via hole K2 corresponds to the first via hole K1 one to one.

[0212] For example, the second via hole K2 may be in at least one of the following shapes: an oblique cylinder, a cylinder, a truncated cone, a prism, a truncated pyramid, and the like.

[0213] Any cross-sectional shape of the second via K2 parallel to the second surface 11b includes but is not limited to a circle, an ellipse, a trapezoid, a rectangle and a polygon, etc. For a first via K1, any two of its multiple cross-sectional shapes parallel to the second surface 11b are similar or congruent.

[0214] Exemplarily, as shown in FIG. 17 , the second via hole K2 obliquely penetrates the connection layer 16 along a set direction, and an angle formed between the set direction and the upper surface of the connection layer 16 is an acute angle.

[0215] In some embodiments, as shown in Figures 18 and 19, the display panel 100 also includes a plurality of fan-out lines 22 arranged on the second substrate 13, the first end 221 of each fan-out line 22 is electrically connected to a second electrode 14, and the second end of each fan-out line 22 is electrically connected to the driving circuit board 21.

[0216] By providing the fan-out line 22 , the signal line (such as the second electrode 14 or the connecting lead 15 ) connected to the driving circuit board 21 is narrowed along the first direction X as a whole, thereby reducing the size of the driving circuit board 21 connected to the signal line, thereby reducing the thickness of the display panel 100 .

[0217] It is understandable that the second electrode 13 and the fan-out line 22 can be an integral structure, or two electrically connected parts, and can be specifically designed according to needs. This is only used as an example and not as a limitation to the present disclosure.

[0218] For example, as shown in FIG. 4 , FIG. 18 and FIG. 19 , the second electrode 14 may be directly connected to the driving circuit board 21 , or the second electrode 14 may be connected to the driving circuit board 21 through other structures, such as a fan-out line 22 .

[0219] For example, as shown in FIG. 4 , FIG. 18 and FIG. 19 , the plurality of second electrodes 14 may be connected to the same driving circuit board 21 , or the plurality of second electrodes 14 may be connected to a plurality of driving circuit boards 21 , respectively.

[0220] In some embodiments, as shown in FIG18 , the distance between any two adjacent second electrodes 14 along the first direction X is d1. The distance between the second electrodes 14 can be set as needed. The distance d1 between any two adjacent second electrodes 14 can be the same; or the distance d1 between any two adjacent second electrodes 14 can be different.

[0221] For example, as shown in FIG19 , the plurality of second electrodes 14 are divided into a plurality of electrode groups W, each electrode group W including p second electrodes 14 , where p is a positive integer and p ≥ 1. The spacing d11 between any two adjacent electrode groups W is greater than or equal to the spacing d1 between any two adjacent second electrodes 14 within each electrode group W.

[0222] In some examples, along the first direction X, a distance d11 between any two adjacent electrode groups W is ≥0.1 mm.

[0223] By controlling the spacing d1 between adjacent second electrodes 14 and the spacing d11 between adjacent electrode groups W, during the process of forming the connecting lead 15, while ensuring effective connection between the connecting lead 15 and the corresponding second electrode 14, the connecting lead 15 is prevented from contacting other second electrodes 14 adjacent to the corresponding second electrode 14, thereby avoiding the short circuit phenomenon caused by the same connecting lead 15 being electrically connected to two or more second electrodes 14.

[0224] Exemplarily, the dimensions of the second substrate 13 are related to the plurality of second electrodes 14 and the plurality of fan-out lines 22. As shown in FIG19 , the orthographic projections of the second electrodes 14 and the fan-out lines 22 on the second surface 11 b fall within the orthographic projection of the second substrate 13 on the second surface 11 b. The dimension f of the second substrate 13 along the second direction Y is designed based on the dimensions of the second electrodes 14 and the fan-out lines 22 along the second direction Y.

[0225] Exemplarily, as shown in FIG19 , along the first direction X, the distance between the two most distant boundaries of the plurality of second electrodes 14 is d8 , and the size of the second substrate 13 is d9 , where d9 > d8 .

[0226] As shown in FIG. 19 , along the second direction Y, the dimension of the second substrate 13 is d9, and 50 mm ≥ d9 ≥ 3 mm.

[0227] Exemplarily, the driving circuit board 21 includes but is not limited to a PCB (Printed Circuit Board) or an FPC (Flexible Printed Circuit).

[0228] Exemplarily, as shown in FIG. 4 , FIG. 18 and FIG. 19 , the shape of the second substrate 13 includes but is not limited to a rectangle, a “T” shape and a “Π” shape.

[0229] For example, as shown in FIG19 , the second surface 11 b includes a connection region BN and a bonding region BB located on a side of the connection region BN away from the selected side surface 11 cc. The connection region BN is located near the selected side surface 11 cc. The second electrode 14 is located in the connection region BN, and the second end 222 of the fan-out line 22 is located in the bonding region BB.

[0230] Exemplarily, as shown in FIG. 5 , the protection layer 18 may also cover the first ends 221 of the plurality of fan-out lines 22 .

[0231] In some embodiments, as shown in FIG. 5 , the light emitting layer 20 includes a plurality of light emitting devices 201 , a plurality of light emitting driving chips 202 and a protective film 203 .

[0232] Exemplarily, the light-emitting device 201 includes but is not limited to OLED (Organic Light-Emitting Diode), Mini LED (Mini Light-Emitting Diode), Micro LED (Micro Light-Emitting Diode), etc.

[0233] Exemplarily, the light-emitting layer 20 further includes a light-emitting driver chip 202, which is electrically connected to the drive circuit layer 19. The light-emitting driver chip 202 is configured to drive and control the brightness of the light-emitting device 201. The pads within the drive circuit layer 19 include, for example, device pads and driver pads. The pins of the light-emitting device 201 are connected to the device pads, and the leads of the light-emitting driver chip 202 are connected to the driver pads.

[0234] Each light-emitting driver chip 202 is configured to control one or more light-emitting devices 201 . For example, each light-emitting driver chip 202 controls three light-emitting devices 201 .

[0235] For example, the material of the protective film 203 may be black silicone or black resin.

[0236] The protective film 203 can protect the plurality of light-emitting devices 201 , thereby preventing the plurality of light-emitting devices 201 from being damaged during a manufacturing process after the light-emitting devices 201 are formed.

[0237] Exemplarily, as shown in FIG. 5 , the protection film 203 at least covers the plurality of light-emitting devices 201 and fills the gap regions between the plurality of light-emitting devices 201 .

[0238] In some examples, the protective film 203 is the film layer structure farthest from the first substrate 11 in the display panel 100, and the protective film 203 covers one side of the first surface 11a of the first substrate 11, the selected side surface 11cc, and the portion of the second surface 11b close to the selected side surface 11cc.

[0239] Exemplarily, the display panel 100 includes sub-pixels of multiple colors, wherein the sub-pixels of the multiple colors include at least a first color sub-pixel, a second color sub-pixel, and a third color sub-pixel, where the first color, the second color, and the third color are three primary colors (e.g., red, green, and blue). Each sub-pixel includes, for example, at least one light-emitting device 201.

[0240] The embodiments of the present disclosure further provide a display device 1000. As shown in FIG20 , the display device 1000 includes an integrated circuit chip and a display panel 100 as described in any of the above embodiments. The integrated circuit chip is electrically connected to the second electrode 14 of the display panel 100.

[0241] Exemplarily, the integrated circuit chip is electrically connected to the driving circuit board 21 and is configured to send a driving signal to the display panel 100 , thereby driving the display panel 100 to display an image.

[0242] In the display device 1000, a control signal is sent through an integrated circuit chip, and then the drive signal is transmitted to the second electrode 14 of the display panel 100 through the drive circuit board 21. The drive signal is sequentially transmitted through the second electrode 14, the connecting lead 15 and the first electrode 12 to the drive circuit layer 19, and then transmitted to the light-emitting layer 20 through the drive circuit layer 19, thereby controlling the light-emitting device 201 in the light-emitting layer 20 to emit light, so that the display device 1000 displays a picture.

[0243] Mini LED or Micro LED is used as the light-emitting device 201, which has a smaller volume. On the first substrate of the same area, the arrangement density of the light-emitting devices per unit area can be higher. In addition, the light-emitting device 201 can be driven independently or in partitions, thereby improving the uniformity of the display brightness and further improving the display quality of the display device 1000.

[0244] The display device 1000 has the same structure and beneficial technical effects as the display panel 100 provided in some of the above embodiments, which will not be described in detail here.

[0245] An embodiment of the present disclosure further provides a spliced ​​display device 2000 .

[0246] In some embodiments, as shown in FIG. 21 , a spliced ​​display device 2000 includes: a plurality of spliced ​​display panels 100 as described in any of the above embodiments.

[0247] In some other embodiments, the spliced ​​display device 2000 includes: a plurality of spliced ​​display devices 1000 as described in the above embodiments.

[0248] The following description will be made by taking an example where the spliced ​​display device 2000 includes a plurality of spliced ​​display panels 100 .

[0249] Exemplarily, as shown in FIG. 21 , the display panel 100 is, for example, rectangular.

[0250] In some examples, as shown in FIG. 21 , the plurality of display panels 100 in the spliced ​​display device 2000 are arranged in an array.

[0251] As shown in FIG3 , in the display panel 100 , a plurality of first electrodes 12 are arranged in parallel along a first direction X. Correspondingly, a plurality of connecting leads 15 are also arranged in parallel along the first direction X. Another direction parallel to the first surface 11 a of the display panel 100 and perpendicular to the first direction X is referred to as a second direction Y.

[0252] Exemplarily, as shown in FIG. 3 and FIG. 21 , the display panel 100 includes one selected side surface 11 cc.

[0253] As shown in FIG21 , when multiple display panels 100 as shown in FIG3 are spliced ​​together, for example, the selected side surfaces 11cc of the multiple display panels 100 are all arranged along the first direction X. In this way, among the multiple display panels 100 arranged in a row along the first direction X, there is substantially no splicing seam between two adjacent display panels 100 along the first direction X; and among the multiple display panels 100 arranged in a column along the second direction Y, there is a splicing gap between two adjacent display panels 100. That is, the size of the splicing gap between two adjacent display panels 100 among the multiple display panels 100 arranged in a row along the first direction X is smaller than the size of the splicing gap between two adjacent display panels 100 among the multiple display panels 100 arranged in a column along the second direction Y.

[0254] In this way, when viewing the spliced ​​display device 2000 , the seam between two adjacent display panels 100 is difficult to be seen by the naked eye within the viewing distance, thereby making the display image of the spliced ​​display device 2000 more complete and presenting a better display effect.

[0255] For example, in the spliced ​​display device 2000 shown in FIG21 , each display panel 100 includes sub-pixels of at least three colors, wherein the sub-pixels of multiple colors include at least a first color sub-pixel, a second color sub-pixel, and a third color sub-pixel, where the first color, the second color, and the third color are three primary colors (e.g., red, green, and blue). Each sub-pixel includes, for example, at least one light-emitting device 201.

[0256] The spliced ​​display device 2000 has the same structure and beneficial technical effects as the display panel 100 provided in some of the above embodiments, which will not be described in detail here.

[0257] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display panel, comprising: A first substrate, comprising a first surface and a second surface opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface, at least one of the side surfaces being a selected side surface; the first surface comprising a display area and a peripheral area located at least on one side of the display area, the peripheral area being closer to the selected side surface than the display area; A plurality of first electrodes are disposed in the peripheral area; A second substrate, disposed on the second surface; A connection layer is disposed between the first substrate and the second substrate, and the connection layer bonds the first substrate and the second substrate; The orthographic projection of the connecting layer on the second surface falls within the orthographic projection range of the second substrate on the second surface; A plurality of second electrodes are disposed on a side of the second substrate away from the first substrate and close to the selected side surface; A plurality of connecting leads are provided, wherein the connecting leads extend from the first surface through the selected side surface to the second surface, and one end of the connecting lead is connected to the first electrode, and the other end of the connecting lead is connected to the second electrode.

2. The display panel according to claim 1, wherein: The connection layer includes at least one groove; the groove runs through the upper surface of the connection layer to the lower surface of the connection layer.

3. The display panel according to claim 2, wherein: The slots include: at least one first slot, and / or at least one second slot, wherein the first slot and the second slot extend in different directions; The boundaries of the first groove and the second groove do not overlap with the boundaries of the connection layer.

4. The display panel according to claim 2, wherein: The groove penetrates the connection layer along a set direction, and the set direction is parallel to the lower surface of the connection layer; When the connection layer includes a plurality of the grooves, the plurality of grooves are arranged at intervals.

5. The display panel according to claim 4, wherein: When the groove penetrates the connection layer along the first direction, the groove is located on a side of the second electrode away from the selected side surface; The first direction is parallel to the second surface and the selected side.

6. The display panel according to claim 2, wherein: The grooves are in a grid shape.

7. The display panel according to any one of claims 1 to 6, wherein: A boundary of the connection layer close to the selected side overlaps with a boundary of the second substrate close to the selected side; or, A boundary of the connection layer close to the selected side surface is farther away from the selected side surface than a boundary of the second substrate close to the selected side surface.

8. The display panel according to any one of claims 1 to 7, wherein: The second substrate includes a main body and a plurality of convex portions arranged on a side of the main body close to the selected side surface; one end of the convex portion is connected to the main body, and the other end extends toward the selected side surface; The plurality of protrusions are arranged at intervals along the first direction.

9. The display panel according to claim 8, wherein: In an orthographic projection onto a reference plane, the protrusion overlaps with at least one of the second electrodes; the reference plane is parallel to the selected side surface.

10. The display panel according to any one of claims 1 to 9, wherein: The second substrate includes a plurality of first via holes arranged in an array, and the first via holes penetrate from the upper surface of the second substrate to the lower surface of the second substrate.

11. The display panel according to claim 10, wherein: A plurality of the first via holes are arranged into a plurality of columns along a second direction, wherein the second direction is perpendicular to the first direction and the selected side surface; at least one second electrode is disposed on both sides of each column of the first via holes.

12. The display panel according to claim 11, wherein: Along the first direction, a size of the first via hole is smaller than a gap between two adjacent second electrodes.

13. The display panel according to any one of claims 10 to 12, wherein: The connection layer further includes: a plurality of second via holes, wherein the second via holes penetrate from the upper surface of the connection layer to the lower surface of the connection layer, and the second via holes are connected to the first via holes.

14. The display panel according to any one of claims 1 to 13, wherein: The display panel further includes: a buffer layer, disposed on a side of the second substrate away from the first substrate, and covering an edge portion of the second substrate close to the selected side surface; The connecting lead crosses the buffer layer and is connected to the second electrode.

15. The display panel according to claim 14, wherein: The buffer layer has no overlap with the second electrode, and a gap exists between the buffer layer and the selected side surface.

16. The display panel according to claim 14 or 15, wherein: The buffer layer includes a first slope surface and a second slope surface connected to each other; along the second direction and from the selected side surface to the second substrate, the height of the first slope surface gradually increases, the height of the second slope surface gradually decreases, and the first slope surface and the second slope surface have a smooth transition.

17. The display panel according to claim 16, wherein: The slope angle of the first slope surface and the slope angle of the second slope surface are both acute angles.

18. The display panel according to any one of claims 14 to 17, wherein: The edge portion of the second substrate close to the selected side extends out relative to the boundary of the connection layer close to the selected side, and the edge portion of the second substrate, the side of the connection layer and the second surface enclose a gap area, and part of the buffer layer fills the gap area.

19. A display device comprising: An integrated circuit chip and the display panel according to any one of claims 1 to 18, wherein the integrated circuit chip is electrically connected to the second electrode.

20. A spliced ​​display device, comprising a plurality of spliced ​​display devices according to claim 19; or, The invention comprises a plurality of display panels as claimed in any one of claims 1 to 18 which are spliced ​​together.

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