A glass wafer through-hole processing device and its control method

Abstract

The present invention relates to the technical field of glass wafer production and processing, and particularly relates to a glass wafer through-hole processing device and a control method thereof, including a machine base. An organic cover is arranged on the periphery of the upper part of the machine base. A robotic arm is installed on one side of the upper part of the machine base. A three-dimensional driving part is installed at the rear side of the middle of the upper part of the machine base. A laser drilling instrument is installed on the three-dimensional driving part. A bearing seat is arranged at the middle of the upper part of the machine base, and the cavity inside the bearing seat is designed with four-way openings. Through the distributed negative pressure formed by the annular air suction pipe and the extension pipe, a uniform adsorption force field is formed on the bottom surface of the wafer, reducing the deformation caused by local stress concentration; the radial elastic clamping of the silica gel fixture and the microscopic embedding positioning of the contact ball form a physical contact type error suppression system, effectively offsetting the wafer deformation caused by vacuum adsorption and improving the positioning accuracy; the sliding seat and the linkage rod form a parallelogram movement, and synchronous symmetric displacement is realized through the screw rod drive, ensuring that the center offset of the wafer is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of glass wafer production and processing, and particularly to a glass wafer via processing device and a control method thereof. Background Art

[0002] A glass wafer is a circular precision thin sheet made of glass. Such wafers are processed and formed through precision processes such as cutting, grinding, and polishing, and need to undergo strict quality inspections to ensure that the surface flatness and thickness tolerance meet the requirements.

[0003] In the automated production process, the robotic arm cooperates with the vacuum adsorption device to complete the grasping and positioning of the wafer. However, some processing defects are exposed during long-term operation: on the one hand, during continuous operation of the mechanical system, problems such as joint wear and component thermal expansion will gradually accumulate, resulting in a slow decrease in positioning accuracy; on the other hand, the local stress generated by vacuum adsorption interacts with the small deformation of the wafer itself, further amplifying the position deviation. These hidden errors are particularly sensitive in high-precision processes such as laser drilling; when the actual position of the wafer deviates from the preset coordinates, it will cause defects such as misaligned via arrangements and uneven hole diameters, affecting the product yield. However, the existing technologies rely on passive solutions such as regular shutdown calibration or strengthening the rigidity of components, and it is difficult to solve the problem of error superposition in a dynamic environment.

[0004] Therefore, it is urgent to design a glass wafer via processing device and a control method thereof to solve the above technical problems. Summary of the Invention

[0005] In order to overcome the above-mentioned drawbacks of the existing technologies, the present invention provides a glass wafer via processing device and a control method thereof to assist the positioning process of the glass wafer after adsorption, so as to more accurately and efficiently realize the via processing process of the glass wafer.

[0006] The technical implementation solution of the present invention is as follows: A glass wafer via processing device includes a machine base. An organic cover is arranged around the upper part of the machine base. A robotic arm is installed on one side of the upper part of the machine base. A three-dimensional driving part is installed at the rear side in the middle of the upper part of the machine base. A laser drilling instrument is installed on the three-dimensional driving part. A bearing seat is arranged in the middle of the upper part of the machine base. The cavity inside the bearing seat is designed to be open in all four directions. Protrusions are provided on the four sides of the top plate of the bearing seat corresponding to the openings below. Sliding grooves are opened in each of the protrusions. A processing table is arranged on the upper part of the top plate of the bearing seat. An adsorption assembly is loaded jointly between the processing table and the top plate. Inclined grooves are opened at the edges of the upper part of the processing table. A motor is installed at the middle of the upper part inside the bearing seat. Guide frames are symmetrically arranged at the middle of the lower part inside the bearing seat. The guide frames are externally connected to the motor. A lead screw is rotatably arranged in the middle of the two guide frames. The lead screw is connected to the output shaft of the motor. A push plate is rotatably arranged outside the lead screw. The push plate is slidably connected to the guide frame. A sliding seat is slidably installed in each of the sliding grooves of the protrusion of the bearing seat. A linkage rod is hinged to the lower part of each sliding seat. A torsion spring I is arranged inside the hinge shafts at both ends of each linkage rod. A silica gel clamp is slidably arranged at the upper part inside each sliding seat. The clamping ends of each silica gel clamp are designed to be inclined. The inclined part is in sliding contact with the inclined groove. A spring I is arranged at the sliding connection between the silica gel clamp and the sliding seat. A ring seat is jointly arranged between the hinge shafts at the lower part of each linkage rod. The middle part of the ring seat is hollowed out. The push plate is in sliding contact with the ring seat, causing it to move linearly around the outside of the guide frame.

[0007] Preferably, it further includes a main control module and a touch screen. A main control module for centrally controlling the operation of each electrical component is installed on the inner side of the machine cover. A touch screen is installed on the upper part of the machine cover on the same side as the main control module. The touch screen is electrically connected to the main control module.

[0008] Preferably, it further includes a temperature and pressure integration unit. A temperature and pressure integration unit for real-time monitoring of the processing temperature and environment is installed on the side of the upper part of the machine cover away from the touch screen. The temperature and pressure integration unit is electrically connected to the touch screen.

[0009] Preferably, the adsorption assembly includes an exhaust pipe, a vacuum pump, and an extension pipe. An annularly arranged exhaust pipe is installed at the middle of the upper part inside the bearing seat. A vacuum pump connected to the exhaust pipe is installed at the upper side part inside the bearing seat. A plurality of vertically arranged extension pipes are symmetrically communicated with the upper part of the exhaust pipe. Each extension pipe passes through the upper part inside the bearing seat and is placed inside the processing table. The suction end of the extension pipe is flush with the upper surface of the processing table, and a filter screen is arranged inside it.

[0010] Preferably, it also includes a lifting plate, a matching piece, a push rod, two torsion springs and a contact ball. Lifting plates are hinged on both sides of the middle of the upper inner part of the support seat. The two lifting plates are in rotational contact with the push plate below. The two lifting plates are symmetrically hinged on both ends facing outwards with matching pieces. A push rod is hinged in the middle of each matching piece. Each push rod slides through the upper inner part of the support seat and the inside of the processing table. Two torsion springs are arranged at both ends of the hinge axis between each push rod and the corresponding matching piece. A contact ball is embedded in the upper inner part of each push rod and is rotatably arranged. The contact ball contacts the lower surface of the glass wafer.

[0011] Preferably, it also includes an air collecting hood, a push rack, a pressure relief push plate, an air pipe, an air outlet head, two springs and a dust collecting frame. Two air collecting hoods are installed on the upper part of the processing platform below the three-dimensional driving group. The two air collecting hoods are respectively located on both sides of one of the slide seats located between the two. The lower parts of the two air collecting hoods are slidably connected with a push rack. The cross bar at the lower part of the push rack is provided with an inclined surface that slides in contact with the lower part of the slide seat. A pressure relief push plate with an outer contour adapted to its inner wall is slidably arranged inside the air collecting hood. The lower parts of the two pressure relief push plates are connected to the rod-shaped part at the upper part of the push rack. The upper parts of the two air collecting hoods are both connected to the air pipe. The air outlet ends of the two air pipes are both connected to the air outlet head. Two springs are provided between the rod-shaped part and the lower part of the air collecting hood. One-way valve ports for gas circulation are installed on the upper side parts of the two air collecting hoods. A dust collecting frame is provided on the side of the upper part of the processing platform away from the two air outlet heads. Two dust inlet chambers are provided on the upper part of the dust collecting frame, and both correspond to the air outlet ends of the two air outlet heads.

[0012] Preferably, an environmental monitor, a purifier, an exhaust pipe and an air suction hood are further included. The environmental monitors are symmetrically installed on both sides of the upper part of the supporting seat. The environmental monitor is placed inside the processing table, and its detection end is flush with the processing table. A purifier is installed on the upper side of the machine cover. The exhaust end of the purifier is connected to the exhaust pipe, and the exhaust pipe is connected and runs through the side of the machine cover. The inlet end of the purifier is connected to the exhaust hood, and the exhaust hood is close to the processing table and above it.

[0013] A glass wafer through-hole processing control method is based on a glass wafer through-hole processing device and includes the following steps:

[0014] S1. First, the gripper at the end of the robot arm grabs the glass wafer and transfers it to the surface of the processing table. The vacuum pump starts the exhaust program, and the extension tube forms a ring-shaped negative pressure area on the bottom surface of the wafer. The filter intercepts dust particles. The main control module starts the motor to reverse, and the corresponding screw rotates clockwise, so that the push plate slides down along the guide frame, and the push plate moves down to push the ring seat to move down synchronously along the outside of the guide frame, so that the linkage rod rotates and closes, and the slide seat is pulled by the linkage rod to slide toward each other along the slide groove. The moving speed is accurately controlled by the screw rod speed. The inclined part of the silicone clamp contacts the inclined groove to generate an oblique force, so that the silicone clamp compression spring slides up, and the slide seat continues to move inward. When the distance between the slide seats reaches the edge of the wafer diameter, the silicone clamp elastically deforms to generate a radial clamping force to position and clamp the glass wafer.

[0015] S2. Meanwhile, the jacking plate disengages from the rotating contact with the pushing plate and rotates downward under the action of the second torsion spring, driving the fitting to rotate upward. The ejector rod slides upward under the traction of the fitting, and the contact ball protrudes a small distance from the surface of the processing table and forms multi-point contact support with the lower surface of the wafer. Moreover, the contact ball sinks into the surface of the wafer under the action of negative pressure to form a microscopic positioning reference;

[0016] S3. After the adsorption pressure stabilizes, the laser processing ready signal of the laser drilling machine is triggered. The three-dimensional drive unit drives the laser drilling machine along a spiral path, making the laser pulse frequency dynamically match the aperture to perform through-hole processing on the glass wafer. While the slide is sliding, the inclined surface of the cross bar of the push frame disengages from the lower part of the slide, and the second spring releases to make the push frame rise. The pressure relief push plate moves under the action of the rising push frame, expanding the volume of the air collecting hood to generate negative pressure, sucking the dust-containing air flow through the one-way valve port. The processing debris enters the air delivery pipe with the air flow and is ejected from the air outlet head, and the dust particles are captured by the dust collection frame;

[0017] S4. When the environmental monitor detects an increase in the particulate matter content or temperature in the processing environment, the main control module executes a dynamic adjustment program, triggers the purifier to start, captures the suspended particles and hot air flow in the processing area through the suction hood, purifies them through multiple layers of filter elements and discharges them through the discharge pipe. At the same time, according to the feedback data of the temperature and pressure integration unit, if the temperature exceeds the threshold, the three-dimensional drive unit automatically reduces the moving speed of the laser drilling machine and extends the pulse interval time to reduce heat accumulation;

[0018] S5. After the through-hole processing of the current wafer is completed, the main control module executes a reset instruction. The motor rotates forward to drive the lead screw to rotate counterclockwise. The pushing plate pushes the ring seat to move upward synchronously along the guide frame. The linkage rod rotates in the reverse direction to drive the slide to slide outward and reset. The silicone fixture retracts under the action of the first spring to release the clamping. The vacuum pump stops running, and the negative pressure adsorption is released. The jacking plate rotates upward under the upward push of the pushing plate, drives the ejector rod to move downward through the fitting, and the contact ball retracts into the interior of the processing table. At this time, the robotic arm grabs the processed wafer again and transfers it to the next process;

[0019] S6. Finally, the main control module starts the self-check program. After inputting the processing parameters of the next wafer through the touch screen, the three-dimensional drive unit drives the laser drilling machine to perform an empty walk calibration, calculates the coordinate compensation using the preset reference marking points on the edge of the processing table, and updates the linkage mapping relationship between the robotic arm grasping path and the laser positioning coordinates. At the same time, the pressure relief push plate compresses the gas in the air collecting hood during the reset process of the push frame, spraying the residual dust into the collection frame intensively to complete the preparation for the processing cycle.

[0020] Advantages of the present invention: 1. The distributed negative pressure formed by the annular suction pipe and the extension pipe in the present invention creates a uniform adsorption force field on the bottom surface of the wafer, reducing deformation caused by local stress concentration; the radial elastic clamping of the silica gel fixture and the microscopic embedding and positioning of the contact balls form a physical contact type error suppression system, effectively offsetting the deformation of the wafer caused by vacuum adsorption and improving the positioning accuracy; the sliding seat and the linkage rod form a parallelogram motion, and synchronous symmetric displacement is achieved through the drive of the lead screw, ensuring a reduction in the center offset of the wafer.

[0021] 2. In the present invention, through the separation and rotation of the lifting plate and the pushing plate, the cooperating part is driven to rotate under the drive of the second torsion spring, realizing the vertical displacement of the ejector rod, and enabling the contact ball to form a microscopic positioning reference with a small embedding depth, which can further reduce the local deformation of the bottom surface of the wafer caused by vacuum adsorption.

[0022] 3. Through the linkage design of the negative pressure adsorption of the air collecting hood and the pressure relief push plate, the present invention can capture processing debris in real time during the laser processing process, and cooperate with the dust collection frame to avoid energy attenuation caused by the pollution of the laser lens; the environmental monitor and the purifier operate in coordination to dynamically monitor and purify the suspended particles in the processing area, which can reduce the influence of particle deposition on the optical system and improve the consistency of via processing. Brief Description of the Drawings

[0023] Figure 1 It is the assembly schematic diagram of the present invention.

[0024] Figure 2 It is the three-dimensional structure schematic diagram of components such as the machine base, robotic arm and bearing seat of the present invention.

[0025] Figure 3 It is the three-dimensional structure schematic diagram of the three-dimensional drive part and the laser drilling machine of the present invention.

[0026] Figure 4 It is the three-dimensional structure schematic diagram of components such as the processing table, contact ball and air collecting hood of the present invention.

[0027] Figure 5 It is the sectional structure schematic diagram of the processing table and the environmental monitor of the present invention.

[0028] Figure 6 It is the three-dimensional structure schematic diagram of components such as the linkage rod, vacuum pump and push frame of the present invention.

[0029] Figure 7 It is the exploded structure schematic diagram of components such as the motor, guide frame and lead screw of the present invention.

[0030] Figure 8 It is the sectional structure schematic diagram of components such as the linkage rod, first torsion spring and silica gel fixture of the present invention.

[0031] Figure 9This is a three-dimensional structural schematic diagram of components such as the processing table, exhaust pipe, and lifting plate of the present invention.

[0032] Figure 10 This is a three-dimensional structural schematic diagram of components such as the lifting plate, fitting, and ejector rod of the present invention.

[0033] Figure 11 This is a three-dimensional structural schematic diagram of components such as the processing table, air collection hood, and environmental monitor of the present invention.

[0034] Figure 12 This is a three-dimensional structural schematic diagram of components such as the sliding seat, air collection hood, and pushing frame of the present invention.

[0035] Figure 13 This is a sectional structural schematic diagram of components such as the air collection hood, pushing frame, and pressure relief push plate of the present invention.

[0036] Figure 14 This is a three-dimensional structural schematic diagram of components such as the machine base, machine cover, and bearing seat of the present invention.

[0037] The markings of each component in the drawings are as follows: 1. Machine base, 100. Main control module, 101. Temperature and pressure integration unit, 102. Touch screen, 11. Machine cover, 12. Robot arm, 13. Three-dimensional drive unit, 14. Laser drilling machine, 2. Bearing seat, 21. Processing table, 3. Motor, 31. Guide frame, 32. Lead screw, 33. Pushing plate, 34. Sliding seat, 35. Linking rod, 36. First torsion spring, 37. Silicone fixture, 38. First spring, 39. Ring seat, 4. Exhaust pipe, 41. Vacuum pump, 42. Extension pipe, 5. Lifting plate, 51. Fitting, 52. Ejector rod, 53. Second torsion spring, 54. Contact ball, 6. Air collection hood, 61. Pushing frame, 62. Pressure relief push plate, 63. Air delivery pipe, 64. Air outlet head, 65. Second spring, 66. Check valve port, 67. Dust collection box, 7. Environmental monitor, 71. Purifier, 72. Discharge pipe, 73. Suction hood. Detailed implementation manners

[0038] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0039] In addition, the terms "first", "second", and "third" are for descriptive purposes only and should not be construed as indicating or implying relative importance. The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. It should be noted that the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0040] Example: A glass wafer via processing device, such as Figures 1-9 and Figure 11 、 Figure 12 and Figure 14As shown in the figure, it includes a machine base 1. The machine base 1 serves as the main frame of the equipment, providing structural support and installation reference. An engine hood 11 is arranged on the upper periphery of the machine base 1 through bolts. The engine hood 11 is designed to be semi-open, which can reduce environmental interference and ensure processing stability. A robotic arm 12 with servo drive is installed on one side of the upper part of the machine base 1. The robotic arm 12 is responsible for grasping, transferring, and placing the glass wafer, and accurately positions the wafer to the processing table 21 through a gripper. At the rear side of the middle part of the upper part of the machine base 1, a three-dimensional drive unit 13 is installed. A laser drilling machine 14 is installed on the three-dimensional drive unit 13 through a slide rail mechanism. The three-dimensional drive unit 13 controls the precise movement of the laser drilling machine 14 in the X, Y, and Z axis directions and performs through-hole processing according to a preset spiral path. The laser drilling machine 14 emits high-energy laser pulses to perform through-hole processing on the glass wafer. A bearing seat 2 is arranged at the middle part of the upper part of the machine base 1 through bolts. The cavity inside the bearing seat 2 is designed with four-way openings. Protrusions are provided on the four sides of the top plate of the bearing seat 2 corresponding to the openings below. Each protrusion is provided with a chute inside. A processing table 21 is arranged on the upper part of the top plate of the bearing seat 2 through bolts. The processing table 21 is the loading surface for wafer processing. An adsorption component is loaded jointly between the processing table 21 and the top plate. Bevel grooves are opened at the edges of the upper part of the processing table 21. A motor 3 is installed at the middle part of the upper part inside the bearing seat 2. Guide frames 31 are symmetrically arranged at the middle part of the lower part inside the bearing seat 2. The guide frames 31 are externally connected to the motor 3. A lead screw 32 is rotatably arranged in the middle of the two guide frames 31. The lead screw 32 is connected to the output shaft of the motor 3. A push plate 33 is rotatably arranged outside the lead screw 32. The push plate 33 is slidably connected to the guide frame 31. The guide frame 31 and the lead screw 32 form a linear motion guiding mechanism to ensure the stable displacement of the push plate 33. A sliding seat 34 is slidably installed in each chute of the protrusion of the bearing seat 2. A linkage rod 35 is hinged to the lower part of each sliding seat 34. The linkage rod 35 converts the linear motion of the push plate 33 into a radial clamping action of the sliding seat 34. A torsion spring 36 is arranged inside the hinge shafts at both ends of each linkage rod 35. A silica gel fixture 37 is slidably arranged in the upper part of each sliding seat 34. The clamping ends of each silica gel fixture 37 are designed to be inclined. The inclined part is in sliding contact with the bevel groove. The silica gel fixture 37 contacts the bevel groove through the inclined part, causing elastic deformation to generate a radial clamping force to fix the edge of the wafer. A spring 38 is arranged at the sliding connection between the silica gel fixture 37 and the sliding seat 34. A ring seat 39 is jointly arranged between the hinge shafts at the lower part of each linkage rod 35. The motor 3 drives the lead screw 32 to rotate forward and backward. The push plate 33 slides along the guide frame 31, driving the ring seat 39 and the linkage rod 35 to move. The middle part of the ring seat 39 is hollowed out. The push plate 33 is in sliding contact with the ring seat 39, causing it to move linearly around the outside of the guide frame 31. The push plate 33 converts the rotational motion of the lead screw 32 into the displacement of the sliding seat 34 through sliding contact with the ring seat 39. The sliding seat 34 slides along the chute of the bearing seat and forms a parallelogram mechanism with the linkage rod 35 and the ring seat 39 to achieve synchronous and symmetric displacement.

[0041] As Figure 1 andFigure 14 As shown in the figure, it further includes a main control module 100 and a touch screen 102. The main control module 100 for centrally controlling the operation of each electrical component is installed on the inner side of the machine cover 11. The main control module 100 is a prior art, which can centrally control components such as the robotic arm 12, the three-dimensional drive unit 13, the laser drilling machine 14, the motor 3, the vacuum pump 41, and the purification system, and execute the coordinate compensation algorithm and the dynamic adjustment program. The touch screen 102 is installed on the upper part of the machine cover 11 on one side of the main control module 100. The touch screen 102 is electrically connected to the main control module 100. The touch screen 102 realizes the human-machine interaction interface to input processing parameters and display real-time data.

[0042] As Figure 1 and Figure 14 shown in the figure, it further includes a temperature and pressure integration unit 101. The temperature and pressure integration unit 101 for real-time monitoring of the processing temperature and environment is installed on the side of the upper part of the machine cover 11 away from the touch screen 102. The temperature and pressure integration unit 101 is electrically connected to the touch screen 102. The temperature and pressure integration unit 101 monitors the temperature and pressure fluctuations and feeds them back to the main control module 100 to dynamically adjust the processing parameters.

[0043] As Figure 6 , Figure 9 and Figure 11 shown in the figure, the adsorption assembly includes an exhaust pipe 4, a vacuum pump 41, and an extension pipe 42. The exhaust pipe 4 arranged in a ring is installed in the middle of the upper part inside the carrier 2. The vacuum pump 41 connected to the exhaust pipe 4 is installed on the upper side inside the carrier 2. The exhaust pipe 4 generates negative pressure through the vacuum pump 41 to form a uniform adsorption force field on the bottom surface of the wafer. A plurality of vertical extension pipes 42 are symmetrically connected to the upper part of the exhaust pipe 4. Each extension pipe 42 passes through the upper part inside the carrier 2 and is placed inside the processing table 21. The suction end of the extension pipe 42 is flush with the upper surface of the processing table 21, and a filter screen is provided inside it. The extension pipe 42 transmits the negative pressure to the surface of the processing table 21, and the filter screen intercepts dust to prevent blockage.

[0044] As Figure 4 , Figure 6 and Figures 9-11As shown in the figure, it further includes a jacking plate 5, a fitting 51, a jacking rod 52, a second torsion spring 53, and a contact ball 54. On both sides of the middle of the upper part inside the bearing seat 2, the jacking plates 5 are hinged. Both jacking plates 5 are in rotational contact with the lower pushing plate 33. On the outer ends of both jacking plates 5, the fittings 51 are symmetrically hinged. In the middle of each fitting 51, a jacking rod 52 is hinged. Each jacking rod 52 slides through the upper part inside the bearing seat 2 and the inside of the processing table 21. At both ends of the hinge shaft of each jacking rod 52 and the corresponding fitting 51, the second torsion springs 53 are arranged. The jacking plate 5 is in rotational contact with the pushing plate 33. Driven by the second torsion spring 53, it drives the fitting 51 to rotate. Inside the upper part of each jacking rod 52, a contact ball 54 is embedded and rotatably arranged. The contact ball 54 contacts the lower surface of the glass wafer to form a microscopic positioning reference. When the pushing plate 33 moves downward, it disengages from the contact of the jacking plate 5. The jacking plate 5 rotates downward under the action of the second torsion spring 53, driving the fitting 51 to rotate upward. The upward movement of the jacking rod 52 makes the contact ball 54 protrude from the surface of the processing table 21. When the pushing plate 33 resets, the jacking plate 5 is pushed upward to rotate, and the contact ball 54 retracts into the inside of the processing table 21.

[0045] As Figure 4 , Figure 6 and Figures 11-13 shown in the figure, it further includes an air collecting hood 6, a pushing frame 61, a pressure relief pushing plate 62, an air delivery pipe 63, an air outlet head 64, a second spring 65, and a dust collection box 67. Below the three-dimensional drive group on the upper part of the processing table 21, two air collecting hoods 6 are installed. The two air collecting hoods 6 are respectively located on both sides of one of the sliding seats 34 in the middle of the two. The lower parts of the two air collecting hoods 6 are jointly and slidably connected with a pushing frame 61. On the cross bar of the lower part of the pushing frame 61, there is an inclined surface that is in sliding contact with the lower part of the sliding seat 34. Inside the air collecting hood 6, a pressure relief pushing plate 62 whose outer contour fits the inner wall is slidably arranged. The lower parts of both pressure relief pushing plates 62 are connected to the rod-shaped part of the upper part of the pushing frame 61. The air collecting hood 6 is linked with the pushing frame 61 through the pressure relief pushing plate 62 to expand the volume to generate negative pressure and adsorb processing debris in real time. The upper parts of both air collecting hoods 6 are connected with air delivery pipes 63. The air outlet ends of both air delivery pipes 63 are connected with air outlet heads 64. Between the rod-shaped part and the lower part of the air collecting hood 6, a second spring 65 is arranged. The second spring 65 provides a reset elastic force. When the sliding seat 34 moves inwards, its outer edge contacts the inclined surface of the cross bar of the pushing frame 61, pushing the pushing frame 61 downward, thereby compressing the second spring 65. When the sliding seat 34 resets, the second spring 65 releases the elastic force, and the upward movement of the pushing frame 61 drives the pressure relief pushing plate 62 to expand the volume of the air collecting hood 6 to generate negative pressure to adsorb dust. On the upper side parts of both air collecting hoods 6, one-way valve ports 66 for gas circulation are installed. On one side of the upper part of the processing table 21 away from the two air outlet heads 64, a dust collection box 67 is arranged. There are two dust inlet chambers on the upper part of the dust collection box 67, and both of them correspond to the air outlet ends of the two air outlet heads 64. The dust collection box 67 captures dust particles to avoid laser lens contamination.

[0046] As Figure 2As shown in the figure, it further includes an environmental monitor 7, a purifier 71, an exhaust pipe 72 and an air suction hood 73. Environmental monitors 7 are symmetrically installed on both sides of the upper part of the bearing seat 2. The environmental monitors 7 are placed inside the processing table 21, and their detection ends are flush with the processing table 21. A purifier 71 is installed on the upper side inside the machine cover 11. The environmental monitor 7 detects the particulate matter concentration and temperature in the processing area in real time and triggers the purifier 71 to start. The exhaust end of the purifier 71 is connected to an exhaust pipe 72. The exhaust pipe 72 penetrates through the side of the machine cover 11. The inlet end of the purifier 71 is connected to an air suction hood 73. The air suction hood 73 is close to the processing table 21 and is located above it. The purifier 71 captures suspended particles and hot air flow through the air suction hood 73, and discharges them through the exhaust pipe 72 after being purified by the filter element.

[0047] A glass wafer through-hole processing control method, based on a glass wafer through-hole processing device, includes the following steps:

[0048] S1. First, the jaws at the end of the robotic arm 12 grab the glass wafer and transfer it to the surface of the processing table 21. The vacuum pump 41 starts the air extraction program. The extension tube 42 forms an annular negative pressure area on the bottom surface of the wafer. The filter screen intercepts dust particles. The main control module 100 starts the motor 3 to reverse. The corresponding lead screw 32 rotates clockwise, causing the push plate 33 to slide downward along the guide frame 31. And the downward movement of the push plate 33 pushes the ring seat 39 to move downward synchronously along the outside of the guide frame 31, so that the linkage rod 35 rotates and folds. The slide seat 34 is pulled by the linkage rod 35 to slide towards each other along the chute. The moving speed is accurately controlled by the rotation speed of the lead screw 32. The inclined part of the silicone fixture 37 contacts the inclined surface groove to generate an oblique acting force, causing the silicone fixture 37 to compress the first spring 38 and slide upward. The slide seat 34 continues to move inward. When the distance between the slide seats 34 reaches the edge of the wafer diameter, the elastic deformation of the silicone fixture 37 generates a radial clamping force to position and clamp the glass wafer.

[0049] S2. At the same time, the lifting plate 5 disengages from the rotational contact with the push plate 33 and rotates downward under the action of the second torsion spring 53, driving the fitting 51 to rotate upward. The ejector rod 52 is pulled by the fitting 51 to slide upward, and the contact ball 54 protrudes a small distance from the surface of the processing table 21 and forms a multi-point contact support with the lower surface of the wafer. And the contact ball 54 sinks into the surface of the wafer under the negative pressure to form a microscopic positioning reference.

[0050] S3. After the adsorption pressure stabilizes, trigger the laser processing ready signal of the laser drilling machine 14. The three-dimensional drive unit 13 drives the laser drilling machine 14 along a spiral path, making the laser pulse frequency dynamically match the aperture, and performing through-hole processing on the glass wafer. While the slide 34 slides, the inclined surface of the crossbar of the push frame 61 disengages from the lower part of the slide 34, and the second spring 65 is released to make the push frame 61 rise. The pressure relief push plate 62 generates a moving stroke under the action of the rising push frame 61, causing the volume of the air collecting hood 6 to expand to generate negative pressure, sucking in the dust-containing air flow through the one-way valve port 66. The processing debris enters the air delivery pipe 63 with the air flow and is ejected from the air outlet head 64, and the dust particles are captured by the dust collection frame 67;

[0051] S4. When the environmental monitor 7 detects an increase in the particulate matter content or temperature in the processing environment, the main control module 100 executes a dynamic adjustment program, triggers the purifier 71 to start, captures the suspended particles and hot air flow in the processing area through the suction hood 73, purifies them through multiple filter elements and discharges them through the discharge pipe 72. At the same time, according to the feedback data of the temperature and pressure integration unit 101, if the temperature exceeds the threshold, the three-dimensional drive unit 13 automatically reduces the moving speed of the laser drilling machine 14 and extends the pulse interval time to reduce heat accumulation;

[0052] S5. After completing the through-hole processing of the current wafer, the main control module 100 executes a reset instruction. The motor 3 rotates forward to drive the lead screw 32 to rotate counterclockwise, and the push plate 33 pushes the ring seat 39 to move upward synchronously along the guide frame 31. The linkage rod 35 rotates in the reverse direction to drive the slide 34 to slide outward and reset. The silicone fixture 37 retracts under the action of the first spring 38 to release the clamping. The vacuum pump 41 stops running, and the negative pressure adsorption is released. The jacking plate 5 rotates upward under the upward push of the push plate 33, drives the ejector rod 52 to move downward through the fitting 51, and the contact ball 54 retracts into the interior of the processing table 21. At this time, the robotic arm 12 grabs the processed wafer again and transfers it to the next process;

[0053] S6. Finally, the main control module 100 starts a self-check program. After inputting the processing parameters of the next wafer through the touch screen 102, the three-dimensional drive unit 13 drives the laser drilling machine 14 to perform an empty running position calibration, calculates the coordinate compensation using the reference marking points preset on the edge of the processing table 21, and updates the linkage mapping relationship between the grasping path of the robotic arm 12 and the laser positioning coordinates. At the same time, the pressure relief push plate 62 compresses the gas in the air collecting hood 6 during the reset process of the push frame 61, and sprays the residual dust into the collection frame intensively to complete the preparation for the processing cycle.

[0054] The above are only examples of the present invention and are not used to limit the present invention. All equivalent replacements made within the principles of the present invention shall be included within the protection scope of the present invention. The content not elaborated in detail in the present invention belongs to the well-known prior art of those skilled in the art.

Claims

1. A glass wafer through-hole processing device, comprising a machine base (1); characterized in that: It also includes a hood (11) arranged on the upper periphery of the machine base (1), a robotic arm (12) installed on one side of the upper part of the machine base (1), a three-dimensional drive unit (13) installed at the rear side in the middle of the upper part of the machine base (1), a laser drilling machine (14) installed on the three-dimensional drive unit (13), a carrier seat (2) arranged in the middle of the upper part of the machine base (1), the cavity inside the carrier seat (2) is designed with four-way openings, the four sides of the top plate of the carrier seat (2) are provided with protruding parts corresponding to the openings below, each protruding part is provided with a chute, a processing table (21) is arranged on the upper part of the top plate of the carrier seat (2), an adsorption assembly is jointly loaded between the processing table (21) and the top plate, inclined grooves are opened at the upper edges of each side of the processing table (21), a motor (3) is installed at the middle of the upper part inside the carrier seat (2), guide frames (31) are symmetrically arranged at the middle of the lower part inside the carrier seat (2), the guide frames (31) are externally connected to the motor (3), a lead screw (32) is rotatably arranged in the middle of the two guide frames (31), the lead screw (32) is connected to the output shaft of the motor (3), a push plate (33) is rotatably arranged outside the lead screw (32), the push plate (33) is slidably connected to the guide frames (31), sliding seats (34) are slidably installed in the chutes of the protruding parts of the carrier seat (2), a linkage rod (35) is hinged to the lower part of each sliding seat (34), a first torsion spring (36) is arranged in the hinge shafts at both ends of each linkage rod (35), a silica gel clamp (37) is slidably arranged at the upper part inside each sliding seat (34), the clamping ends of each silica gel clamp (37) are designed to be inclined, the inclined part is in sliding contact with the inclined groove, a first spring (38) is arranged at the sliding connection between the silica gel clamp (37) and the sliding seat (34), a ring seat (39) is jointly arranged between the hinge shafts at the lower part of each linkage rod (35), the middle of the ring seat (39) is hollowed out, the push plate (33) is in sliding contact with the ring seat (39), so that it makes a linear movement around the outside of the guide frame (31); The adsorption assembly includes an air extraction pipe (4), a vacuum pump (41) and an extension pipe (42), an annularly arranged air extraction pipe (4) is installed at the middle of the upper part inside the carrier seat (2), a vacuum pump (41) connected to the air extraction pipe (4) is installed at the upper side part inside the carrier seat (2), a plurality of vertically arranged extension pipes (42) are symmetrically communicated with the upper part of the air extraction pipe (4), each extension pipe (42) passes through the upper part inside the carrier seat (2) and is placed inside the processing table (21), the air extraction end of the extension pipe (42) is flush with the upper surface of the processing table (21), and a filter screen is arranged inside it;It further includes a jacking plate (5), a fitting (51), a jacking rod (52), a second torsion spring (53) and a contact ball (54). Jacking plates (5) are hinged on both sides of the middle of the upper part inside the bearing seat (2). Both jacking plates (5) are in rotational contact with the lower pushing plate (33). Fittings (51) are symmetrically hinged at the outer ends of both jacking plates (5). Jacking rods (52) are hinged in the middle of each fitting (51). Each jacking rod (52) slidably penetrates through the upper part inside the bearing seat (2) and the inside of the processing table (21). Torsion springs (53) are arranged at both ends of the hinge shaft of each jacking rod (52) and the corresponding fitting (51). Contact balls (54) are embedded and rotatably arranged in the upper part of each jacking rod (52), and the contact balls (54) are in contact with the lower surface of the glass wafer.; 2. The glass wafer via hole processing equipment according to claim 1, wherein: It further includes a main control module (100) and a touch screen (102). The main control module (100) for centrally controlling the operation of each electrical component is installed on the inner side of the machine cover (11). The touch screen (102) is installed on the upper part of the machine cover (11) on one side of the main control module (100). The touch screen (102) is electrically connected to the main control module (100).

3. The glass wafer via hole processing equipment according to claim 2, characterized in that: It further includes a temperature and pressure integration unit (101). The temperature and pressure integration unit (101) for real-time monitoring of the processing temperature and environment is installed on one side of the upper part of the machine cover (11) away from the touch screen (102). The temperature and pressure integration unit (101) is electrically connected to the touch screen (102).

4. A glass wafer via processing device according to claim 3, characterized in that: It further includes an air collecting hood (6), a pushing frame (61), a pressure relief pushing plate (62), an air delivery pipe (63), an air outlet head (64), a second spring (65) and a dust collection box (67). Two air collecting hoods (6) are installed below the upper part of the processing table (21) and below the three-dimensional driving group. The two air collecting hoods (6) are respectively located on both sides of one of the sliding seats (34) in the middle of the two. A pushing frame (61) is slidably connected to the lower parts of the two air collecting hoods (6). An inclined surface that slidably abuts against the lower part of the sliding seat (34) is provided on the cross bar of the lower part of the pushing frame (61). A pressure relief pushing plate (62) with an outer contour adapted to the inner wall thereof is slidably arranged inside the air collecting hood (6). The lower parts of the two pressure relief pushing plates (62) are both connected to the rod-shaped part of the upper part of the pushing frame (61). Air delivery pipes (63) are connected to the upper parts of the two air collecting hoods (6). The air outlet ends of the two air delivery pipes (63) are both communicated with an air outlet head (64). A second spring (65) is arranged between the rod-shaped part and the lower part of the air collecting hood (6). One-way valve openings (66) for gas flow are installed on the upper side parts of the two air collecting hoods (6). A dust collection box (67) is arranged on the upper part of the processing table (21) on the side away from the two air outlet heads (64). Two dust inlet chambers are provided on the upper part of the dust collection box (67), and both of them correspond to the air outlet ends of the two air outlet heads (64).

5. The glass wafer through-hole processing equipment according to claim 4, characterized in that: It further includes an environmental monitor (7), a purifier (71), an exhaust pipe (72) and an air suction hood (73). Environmental monitors (7) are symmetrically installed on both sides of the upper part of the bearing seat (2). The environmental monitors (7) are placed inside the processing table (21), and their detection ends are flush with the processing table (21). The purifier (71) is installed on the upper inner side part of the machine cover (11). The exhaust end of the purifier (71) is connected to an exhaust pipe (72). The exhaust pipe (72) penetrates through the side part of the machine cover (11). The inlet end of the purifier (71) is connected to an air suction hood (73). The air suction hood (73) is close to the processing table (21) and is located above it.

6. A method for controlling the processing of vias in a glass wafer. According to the glass wafer via processing equipment described in claim 5, characterized in that, It includes the following steps: S1. First, the gripper at the end of the robot arm (12) grabs the glass wafer and transfers it to the surface of the processing table (21). The vacuum pump (41) starts the exhaust program, and the extension tube (42) forms a ring-shaped negative pressure area on the bottom surface of the wafer. The filter screen intercepts dust particles. The main control module (100) starts the motor (3) to reverse, and the corresponding screw rod (32) rotates clockwise, so that the push plate (33) slides downward along the guide frame (31), and the push plate (33) moves downward to push the ring seat (39) along the outside of the guide frame (31) synchronously downward. The sliding seat (34) is pulled by the linkage rod (35) to slide toward each other along the sliding groove, and the moving speed is precisely controlled by the rotation speed of the lead screw (32). The inclined portion of the silicone clamp (37) contacts the inclined groove to generate an oblique force, so that the silicone clamp (37) compresses the spring one (38) to slide upward, and the sliding seat (34) continues to move inward. When the distance between the sliding seats (34) reaches the edge of the wafer diameter, the silicone clamp (37) elastically deforms to generate a radial clamping force to position and clamp the glass wafer; S2. At the same time, the lifting plate (5) and the pushing plate (33) are separated from the rotational conflict and rotate downward under the action of the second torsion spring (53), driving the matching piece (51) to rotate upward. The lifting rod (52) is pulled upward by the matching piece (51) to slide upward. The contact ball (54) protrudes a small distance from the surface of the processing table (21) and forms a multi-point contact support with the lower surface of the wafer. The contact ball (54) sinks into the surface of the wafer under the action of negative pressure to form a micro positioning reference. S3. When the adsorption pressure is stable, the laser processing ready signal of the laser puncher (14) is triggered, and the three-dimensional driving unit (13) drives the laser puncher (14) along a spiral path, so that the laser pulse frequency dynamically matches the aperture, and through-hole processing is performed on the glass wafer. While the slide (34) slides, the inclined surface of the cross bar of the push frame (61) is out of contact with the lower part of the slide (34), and the spring 2 (65) is released to make the push frame (61) rise. The pressure relief push plate (62) is moved by the rising action of the push frame (61), so that the volume of the gas collecting hood (6) is expanded to generate negative pressure, and the dust-containing airflow is sucked in through the one-way valve port (66). The processing debris enters the air supply pipe (63) with the airflow, and is ejected from the air outlet head (64), and the dust particles are captured by the dust collection frame (67); S4. When the environmental monitor (7) detects that the particulate matter content or temperature of the processing environment increases, the main control module (100) executes a dynamic adjustment program to trigger the purifier (71) to start, and the suspended particles and hot air flow in the processing area are captured by the suction hood (73), and are discharged from the discharge pipe (72) after being purified by the multi-layer filter element. At the same time, according to the feedback data of the temperature and pressure integrated unit (101), if the temperature exceeds the threshold, the three-dimensional drive unit (13) automatically reduces the moving speed of the laser drilling device (14) and prolongs the pulse interval time to reduce heat accumulation; S5. After the current wafer through-hole processing is completed, the main control module (100) executes a reset instruction. The motor (3) rotates forward to drive the lead screw (32) to rotate counterclockwise, pushing the push plate (33) to move upward along the guide frame (31) to push the ring seat (39) to move upward synchronously. The linkage rod (35) rotates in the reverse direction to drive the slide seat (34) to slide outward and reset. The silica gel fixture (37) retracts under the action of the first spring (38) to release the clamping. The vacuum pump (41) stops running, and the negative pressure adsorption is released. The lifting plate (5) is pushed upward by the push plate (33) and rotates upward. The ejector rod (52) is driven to move downward through the fitting (51), and the contact ball (54) retracts into the interior of the processing table (21). At this time, the robotic arm (12) grabs the processed wafer again and transfers it to the next process; S6. Finally, the main control module (100) starts a self-check program. After inputting the processing parameters of the next wafer through the touch screen (102), the three-dimensional drive unit (13) drives the laser drilling machine (14) to perform an empty position calibration. Coordinate compensation calculation is carried out using the reference marking points preset on the edge of the processing table (21), and the linkage mapping relationship between the grasping path of the robotic arm (12) and the laser positioning coordinates is updated. At the same time, the pressure relief push plate (62) compresses the gas in the air collecting hood (6) during the reset process of the push frame (61), and the residual dust is concentrated and sprayed into the collection box to complete the preparation for the processing cycle.

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