A polytetrafluoroethylene sealing ring forming device

Abstract

The present invention belongs to the technical field of sealing ring molding, and specifically relates to a polytetrafluoroethylene sealing ring molding device, comprising: a molding main frame, a sealing ring molding mold is installed on the inner side of the molding main frame, opening and closing mechanisms are provided at both ends of the molding main frame, and a heat exchange mechanism is integrated inside the molding main frame; the sealing ring molding mold comprises a fixed ring seat, a molding support ring and a symmetrically arranged molding sealing ring mold, and a sealing ring molding cavity is provided inside the molding sealing ring mold; the problem to be solved by the present invention is that traditional heating and cooling systems (such as electric heating wire heating and external water cooling devices) have slow response speeds and large thermal inertia, making it difficult to achieve rapid switching, resulting in increased time consumption in the feeding and cooling stages and limited production efficiency; the present invention uses the technology of synchronous heat absorption and heat dissipation on both sides of semiconductor refrigeration plates, combined with the precise control of capillary heat conduction layers and circulating pumps, to achieve rapid switching between heating and cooling modes, which is more efficient than traditional water cooling / electric heating systems.

Description

Technical Field

[0001] The invention belongs to the technical field of sealing ring molding, and particularly relates to a polytetrafluoroethylene sealing ring molding device. Background Art

[0002] As a high-performance sealing element, polytetrafluoroethylene (PTFE) sealing rings are widely used in chemical industry, aerospace and other fields due to their excellent corrosion resistance, low friction coefficient and wide temperature range stability. At present, the main molding methods of PTFE sealing rings include sintering molding and push molding. Sintering molding uses high-temperature treatment to melt and solidify PTFE powder, which is suitable for the production of thick-walled products. However, its process cycle is long, energy consumption is high, and it is difficult to achieve precision molding of complex structures. Although push molding can improve efficiency, it requires precise control of temperature and pressure during the processing to ensure sufficient flow and rapid solidification of the material, which places high demands on equipment performance;

[0003] In existing technology, the production of PTFE sealing rings often uses high-temperature and high-pressure molding combined with post-cutting processes. However, this method has significant drawbacks: traditional heating and cooling systems (such as electric heating wire heating and external water cooling devices) have slow response speeds and large thermal inertia, making rapid switching difficult. This increases the time required for the feeding and cooling stages, limiting production efficiency.

[0004] Therefore, it is necessary to design a polytetrafluoroethylene sealing ring molding device to solve the above problems. Summary of the Invention

[0005] The object of the present invention is to provide a polytetrafluoroethylene sealing ring forming device to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a polytetrafluoroethylene sealing ring forming device, comprising:

[0007] The main molding frame has a sealing ring molding die installed on the inner side thereof, an opening and closing mechanism is provided at both ends of the main molding frame, and a heat exchange mechanism is integrated inside the main molding frame;

[0008] The sealing ring forming mold includes a fixed ring seat, a forming support ring and a symmetrically arranged forming sealing ring mold. A sealing ring forming cavity is provided inside the forming sealing ring mold. An injection molding channel is formed between the fixed ring seat and the forming support ring, and the injection molding channel is connected to the sealing ring forming cavity.

[0009] The heat exchange mechanism includes a semiconductor refrigeration plate, a cooling heat exchange tube, a heating heat exchange tube, a cooling circulation pump, a heating circulation pump and a forming mold heat exchange tube. The two sides of the semiconductor refrigeration plate are thermally coupled with the cooling heat exchange tube and the heating heat exchange tube respectively. The cooling circulation pump and the heating circulation pump control the connection between the cooling heat exchange tube and the heating heat exchange tube and the forming mold heat exchange tube through a branch pipe and a heat exchange valve to quickly regulate the temperature of the sealing ring molding cavity.

[0010] Preferably, the inner walls of the cooling heat exchange tube and the heating heat exchange tube are both provided with a capillary heat conduction layer, and the cooling heat exchange tube and the heating heat exchange tube are attached to the surface of the semiconductor refrigeration plate through a heat exchange valve.

[0011] Preferably, the outer side of the heat exchange tube of the forming mold is provided with a heat-insulating partition, a heat-dissipating and heat-conducting film and a forming heat exchange plate in sequence, and the forming heat exchange plate is in direct contact with the inner wall of the sealing ring forming cavity.

[0012] Preferably, an opening and closing sealing groove is provided on the inner side of the molding sealing ring mold, and an opening and closing sealing ring is provided in the opening and closing sealing groove for sealingly cooperating with the molding support ring when closed.

[0013] Preferably, a heating wire is embedded in the inner side of the molding support ring, and the heating wire is distributed along the built-in channel of the fixed ring seat and the molding support ring, which is used to maintain the fluidity of the material injected into the molding channel. A snap-fit sealing groove is provided at the end of the molding sealing ring mold, and a snap-fit sealing ring is provided on the inner side of the snap-fit sealing groove.

[0014] Preferably, the opening and closing mechanism includes an opening and closing hydraulic cylinder, an opening and closing mounting plate, an opening and closing sliding plate, a forming mold mounting seat and an opening and closing guide slot, and the opening and closing hydraulic cylinder drives the opening and closing sliding plate to drive the forming sealing ring mold to move along the opening and closing guide slot;

[0015] An opening and closing guide slide plate is fixed on one side of the opening and closing sliding plate, and the opening and closing guide slide plate is slidably matched with the opening and closing guide sliding groove.

[0016] Preferably, a reinforcement mechanism is provided at the upper end of the main molding frame, and the reinforcement mechanism includes a reinforcement hydraulic cylinder and a reinforcement pressure plate, and the reinforcement pressure plate presses the end of the molding sealing ring mold to enhance stability after closing.

[0017] Preferably, guide mechanisms are provided at both ends of the molding main frame, and the guide mechanisms include positioning guide rods and positioning guide frames. The positioning guide rods are fixed to the ends of the molding sealing ring mold and are slidably installed in the positioning guide grooves of the positioning guide frames.

[0018] Preferably, the guide mechanism also includes a positioning guide seat, a positioning guide hole is provided on the inner side of the positioning guide seat, and both ends of the forming mold heat exchange tube are connected to heat exchange connecting pipes. The heat exchange connecting pipes pass through the positioning guide holes and move synchronously with the forming sealing ring mold to ensure the stability of the heat exchange pipeline connection.

[0019] Preferably, a mounting center column and a mounting side frame are fixed to the supporting main seat of the forming main frame by bolts, a supporting center frame is provided in the middle of the mounting center column, both ends of the supporting center frame are fixed to the mounting side frames, and forming mold mounting grooves are provided at both ends of the mounting center column, and the fixing ring seat, the forming support ring and the forming sealing ring mold are all installed in the forming mold mounting groove.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. Through the dual-sided synchronous heat absorption and heat dissipation technology of the semiconductor refrigeration plate, combined with the precise control of the capillary heat conduction layer and the circulation pump, rapid switching between heating and cooling modes is achieved, which is more efficient than traditional water cooling / electric heating systems. During the feeding stage, the heating heat exchange tube is quickly heated to the set temperature to ensure the fluidity of the PTFE material. During the curing stage, the cooling heat exchange tube is quickly cooled to quickly set the material. Dynamic control shortens the single molding cycle and reduces energy consumption.

[0022] 2. The hydraulically driven reinforcement mechanism and multi-level guide system, including positioning guide rods, opening and closing guide slides and reinforced pressure plates, improve the mold closing accuracy and solve the misalignment problem caused by vibration or thermal expansion of traditional molds.

[0023] 3. The outer side of the heat exchange tube of the molding mold is integrated with a heat-dissipating thermal conductive film and a molding heat exchange plate. Combined with the precise temperature control of the semiconductor refrigeration plate, the temperature distribution in the molding cavity of the sealing ring is uniform, avoiding material degradation caused by local overheating or internal cracks caused by uneven cooling.

[0024] 4. Through the integrated heat exchange mechanism design, the traditional independent heating furnace and cooling water tank are eliminated, the equipment footprint is reduced, and the cooling water consumption is reduced (the traditional process requires continuous water supply); the Peltier effect of the semiconductor refrigeration plate can realize the recycling of heat energy, and the overall energy consumption is lower than that of similar equipment.

[0025] 5. The modular design of the opening and closing mechanism and the guide mechanism supports rapid disassembly and replacement of mold components, shortening maintenance time. In addition, the redundant design of the heat exchange valve and branch pipe allows the system to switch to the backup channel when a single-side pipeline fails. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the present invention;

[0027] Figure 2 It is a front view structural schematic diagram of the present invention;

[0028] Figure 3 It is a schematic diagram of the opening and closing structure of the present invention;

[0029] Figure 4 Schematic diagram of the molding cavity structure of the present invention;

[0030] Figure 5 It is a schematic diagram of the reinforcement structure of the present invention;

[0031] Figure 6 For the present invention Figure 1 A in the middle is an enlarged structural diagram;

[0032] Figure 7 Schematic diagram of the heat exchange structure of the present invention;

[0033] Figure 8 This is a schematic diagram of the circulating heat exchange tapping structure of the present invention;

[0034] Figure 9 Schematic diagram of the heat exchange capillary structure of the present invention;

[0035] Figure 10 This is a schematic diagram of heat exchange pipe connections according to the present invention;

[0036] In the figure: 1. Main frame for forming; 11. Main support seat; 12. Center column installation; 13. Center support frame; 14. Side frame installation; 2. Sealing ring forming die; 21. Fixed ring seat; 22. Forming support ring; 23. Sealing ring forming die; 24. Sealing ring forming cavity; 25. Opening and closing sealing groove; 26. Opening and closing sealing ring; 27. Engaging sealing ring; 28. Engaging sealing groove; 29. Injection molding channel; 3. Opening and closing mechanism; 31. Opening and closing hydraulic cylinder; 32. Opening and closing mounting plate; 33. Opening and closing sliding plate; 34. Forming die mounting seat; 35. Opening and closing guide slide; 36. Opening and closing guide slide; 4. Reinforcement mechanism ; 41. Reinforced hydraulic cylinder; 42. Reinforced pressure plate; 43. Molding mold mounting groove; 5. Guide mechanism; 51. Positioning guide frame; 52. Positioning guide groove; 53. Positioning guide rod; 54. Positioning guide seat; 55. Positioning guide hole; 6. Heat exchange mechanism; 61. Semiconductor refrigeration plate; 62. Cooling heat exchange tube; 621. Capillary heat conduction layer; 63. Heating heat exchange tube; 64. Cooling circulation pump; 65. Heating circulation pump; 66. Molding mold heat exchange tube; 661. Insulation partition; 662. Heat-dissipating heat conductive film; 663. Molding heat exchange plate; 67. Heat exchange connecting pipe; 68. Branch pipe; 69. Heat exchange valve. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] Example 1: Please refer to Figures 1 to 10The present invention provides a technical solution: a polytetrafluoroethylene sealing ring molding device, comprising a molding main frame 1, a sealing ring molding die 2 is installed on the inner side of the molding main frame 1, an opening and closing mechanism 3 is provided at both ends of the molding main frame 1, and a heat exchange mechanism 6 is provided inside the molding main frame 1;

[0039] The formed main frame 1 includes a supporting main seat 11, a mounting center column 12 is fixedly installed in the middle of the supporting main seat 11 by bolts, and mounting side frames 14 are fixedly installed at both ends of the supporting main seat 11 by bolts. A supporting center frame 13 is provided in the middle of the mounting center column 12, and both ends of the supporting center frame 13 are fixed to the mounting side frames 14 by bolts. A reinforcement mechanism 4 is provided at the upper end of the mounting center column 12;

[0040] The sealing ring forming mold 2 includes a fixed ring seat 21 fixed on the installation center column 12, a forming support ring 22 is fixedly installed on one side of the installation center column 12, a forming sealing ring mold 23 is provided on the outer side of the forming support ring 22, and the two ends of the forming sealing ring mold 23 are connected with a guide mechanism 5. A sealing ring forming cavity 24 is provided inside the forming sealing ring mold 23, and a snap-fit sealing groove 28 is provided at the end of the forming sealing ring mold 23. A snap-fit sealing ring 27 is provided on the inner side of the snap-fit sealing groove 28. The snap-fit sealing groove 28 cooperates with the snap-fit sealing ring 27 to ensure the sealing of the forming sealing ring mold 23 when it is closed. An injection molding channel 29 is provided on the inner side of the installation center column 12, and one end of the injection molding channel 29 is connected to the sealing ring through the built-in channel inside the molding support ring 22 and the fixed ring seat 21. The sealing ring molding cavity 24 is connected, the shape of the molding sealing ring mold 23 is set to be semicircular, and the molding sealing ring mold 23 is symmetrically installed on the outer side of the molding support ring 22. The inner side of the molding sealing ring mold 23 is provided with an opening and closing sealing groove 25, and the inner side of the opening and closing sealing groove 25 is provided with an opening and closing sealing ring 26. When in use, the molding sealing ring mold 23 and the molding support ring 22 are sealed by the opening and closing sealing ring 26; the inner side of the molding support ring 22 is provided with a heating wire, and the position of the heating wire corresponds to the position of the built-in channel inside the molding support ring 22 and the fixed ring seat 21. When in use, the extrusion equipment connected to the injection molding channel 29 squeezes the heated polytetrafluoroethylene material into the sealing ring molding cavity 24, and the heating of the heating wire ensures that the material is always in a liquid state;

[0041] The heat exchange mechanism 6 includes a semiconductor refrigeration plate 61 installed in the support main seat 11 and a molding die heat exchange pipe 66 installed in the molding sealing ring mold 23. A cooling heat exchange pipe 62 and a heating heat exchange pipe 63 are respectively provided on both sides of the semiconductor refrigeration plate 61. One end of the cooling heat exchange pipe 62 is connected to a cooling circulation pump 64, and one end of the heating heat exchange pipe 63 is connected to a heating circulation pump 65. Both ends of the molding die heat exchange pipe 66 are connected to a heat exchange connecting pipe 67. The heat exchange connecting pipe 67, the cooling heat exchange pipe 62, and the heating heat exchange pipe 63 are connected to the heat exchange connecting pipe 67. The heat exchange pipe 63, the cooling circulation pump 64 and the heating circulation pump 65 are all connected with a branch pipe 68 and a heat exchange valve 69. The heat exchange connecting pipe 67 is connected to the cooling heat exchange pipe 62 and the heating heat exchange pipe 63 through the branch pipe 68 and the heat exchange valve 69 respectively. The surface of the cooling heat exchange pipe 62 and the heating heat exchange pipe 63 are provided with a heat exchange valve 69, and the cooling heat exchange pipe 62 and the heating heat exchange pipe 63 are both attached to the surface of the semiconductor refrigeration plate 61 through the heat exchange valve 69. The interior of the cooling heat exchange pipe 62 and the heating heat exchange pipe 63 are A capillary heat conducting layer 621 is provided, and the surface of the semiconductor refrigeration sheet 61 on one side dissipates heat to heat the heating heat exchange tube 63 and the internal medium, and the inner side of the heat exchange tube 66 of the forming mold is heated by the heating circulation pump 65, thereby heating the inner side of the sealing ring forming cavity 24; after the extrusion is completed, the heat exchange valve 69 connecting the heating heat exchange tube 63 and the forming mold heat exchange tube 66 is closed, and the heat exchange valve 69 connecting the cooling heat exchange tube 62 and the forming mold heat exchange tube 66 is opened, and the semiconductor refrigeration sheet 61 heats the heating heat exchange tube 63 is heated while cooling the cooling heat exchange tube 62 and the internal medium; a heat-distributing thermal film 662 is provided on the outside of the forming mold heat exchange tube 66, a heat-distributing thermal film 662 is provided on one side of the heat-distributing thermal film 662, and a heat-insulating partition 661 is provided on the other side of the heat-distributing thermal film 662. A forming heat exchange plate 663 is provided, and the forming heat exchange plate 663 corresponds to the inner position of the sealing ring forming cavity 24, which ensures that the forming mold heat exchange tube 66 can quickly exchange heat with the polytetrafluoroethylene material in the sealing ring forming cavity 24 during heat exchange when in use.

[0042] From the above description, it can be seen that the present invention has the following beneficial effects: during assembly, the sealing ring molding mold 2 is installed on the molding main frame 1 through the opening and closing mechanism 3, and is connected to the extrusion equipment through the injection molding channel 29 during use. The molding sealing ring mold 23 is quickly docked and clamped on one side of the molding support ring 22 through the opening and closing mechanism 3, and the cooling heat exchange tube 62 and the heating heat exchange tube 63 are quickly cooled and heated through the double-sided heat absorption and heat dissipation of the semiconductor refrigeration plate 61, and the cooling circulation pump 64 and the heating circulation pump 65 are connected to the molding mold heat exchange tube 66, so as to quickly heat or cool the polytetrafluoroethylene material in the sealing ring molding cavity 24, thereby facilitating the rapid flow of the material and rapid molding after the material is added, thereby speeding up the processing efficiency.

[0043] Example 2: Please refer to Figures 1 to 10The cam 32 is fixed to the side frame 14 and the cam 33 is fixed to the side frame 14 so that the cam 32 can move relative to the cam 33.

[0044] Further, see Figures 1 to 5 The reinforcement mechanism 4 includes a reinforcement hydraulic cylinder 41 fixed to the upper end of the installation center column 12 and a reinforcement pressure plate 42 installed on the piston rod of the reinforcement hydraulic cylinder 41 by bolts. The reinforcement pressure plate 42 is pressed on the end of the forming sealing ring mold 23. Forming mold mounting grooves 43 are provided at both ends of the installation center column 12. The fixed ring seat 21, the forming support ring 22 and the forming sealing ring mold 23 are all installed in the forming mold mounting groove 43. When in use, the opening and closing hydraulic cylinder 31 drives the opening and closing sliding plate 33 and the forming sealing ring mold 23 to move, so that the forming sealing ring mold 23 is aligned into a ring. The reinforcement hydraulic cylinder 41 pushes the reinforcement pressure plate 42 to press on the end of the forming sealing ring mold 23 to ensure that the forming sealing ring mold 23 is more stable after alignment.

[0045] The reinforcement mechanism 4 and the opening and closing mechanism 3 of the above-mentioned technical solution are adopted. When in use, the opening and closing hydraulic cylinder 31 drives the opening and closing sliding plate 33 and the forming sealing ring mold 23 to move, thereby opening the forming sealing ring mold 23 to remove the sealing ring formed on the inner side. When in use, the reinforcement hydraulic cylinder 41 and the reinforcement pressure plate 42 of the reinforcement mechanism 4 are used to tightly press and position the end of the forming sealing ring mold 23, thereby ensuring that the forming sealing ring molds 23 are more stable when they are matched.

[0046] Further, see Figures 1 to 6The guide mechanism 5 includes a positioning guide rod 53 fixed to the outer side of the end of the molding sealing ring mold 23 and a positioning guide frame 51 integrally formed at the end of the mounting side frame 14. The inner side of the positioning guide frame 51 is provided with a positioning guide groove 52. The positioning guide rod 53 is slidably installed in the positioning guide groove 52. When the molding sealing ring mold 23 moves, the positioning guide rod 53 follows the movement, and cooperates with the positioning guide frame 51 and the positioning guide groove 52 to position and guide the positioning guide rod 53, thereby ensuring that the molding sealing ring mold 23 is more stable when moving; the guide mechanism 5 also includes a positioning guide seat 54 fixed to the mounting side frame 14, and the inner side of the positioning guide seat 54 is provided with a positioning guide hole 55. The heat exchange connecting pipe 67 is slidably connected to the positioning guide seat 54 through the positioning guide hole 55. When in use, the molding sealing ring mold 23 moves to drive the heat exchange connecting pipe 67 to move, and cooperates with the positioning guide seat 54 to position the heat exchange connecting pipe 67, thereby ensuring that the heat exchange connecting pipe 67 is stably connected to the molding sealing ring mold 23.

[0047] The guiding mechanism 5 adopts the above-mentioned technical solution, through the designed positioning guide rod 53 and positioning guide seat 54, when in use, the positioning guide rod 53 and the positioning guide frame 51 are used to guide the molding sealing ring mold 23 to be more stable during movement, thereby reducing the phenomenon of deviation after long-term use. The positioning guide seat 54 supports and guides the heat exchange connecting pipe 67, while ensuring that the heat transfer medium can stably enter the molding mold heat exchange pipe 66 through the heat exchange connecting pipe 67 without affecting the movement of the molding sealing ring mold 23.

[0048] The working principle and use process of the present invention are as follows: when in use, the opening and closing hydraulic cylinder 31 drives the opening and closing sliding plate 33 and the forming sealing ring mold 23 to move, so that the forming sealing ring mold 23 is aligned into a ring and pressed on the outside of the forming support ring 22, and the reinforcement hydraulic cylinder 41 pushes the reinforcement pressure plate 42 to press on the end of the forming sealing ring mold 23, ensuring that the forming sealing ring mold 23 is more stable after alignment. At the same time, the surface heat of one side of the semiconductor refrigeration plate 61 is running to heat the heating heat exchange tube 63 and the internal medium, and the inner side of the heat exchange tube 66 of the forming mold is heated by the heating circulation pump 65, thereby heating the inner side of the sealing ring forming cavity 24, and the extrusion equipment connected to the injection molding channel 29 squeezes the heated polytetrafluoroethylene material into the sealing ring. In the cavity 24, the heating effect is combined to ensure that the sealing ring molding cavity 24 can be fully filled during extrusion to avoid cooling and solidification. After the extrusion is completed, the heat exchange valve 69 connecting the heating heat exchange tube 63 and the molding mold heat exchange tube 66 is closed, and the heat exchange valve 69 connecting the cooling heat exchange tube 62 and the molding mold heat exchange tube 66 is opened. The semiconductor refrigeration plate 61 heats the heating heat exchange tube 63 and cools the cooling heat exchange tube 62 and the internal medium at the same time. After being drawn into the molding mold heat exchange tube 66 by the cooling circulation pump 64, it can be quickly cooled and molded, thereby ensuring better results during molding production, and no other large-scale equipment such as cooling and heating is required to reduce the volume. After molding, the opening and closing hydraulic cylinder 31 drives the molding sealing ring mold 23 to open and demold.

[0049] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0050] The above description is only used to illustrate the technical solution of the present invention and is not intended to limit it. Other modifications or equivalent substitutions made to the technical solution of the present invention by ordinary technicians in this field should be included in the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A polytetrafluoroethylene sealing ring forming device, characterized in that: include: A main molding frame (1), a sealing ring molding die (2) is installed on the inner side of the main molding frame (1), opening and closing mechanisms (3) are provided at both ends of the main molding frame (1), and a heat exchange mechanism (6) is integrated inside the main molding frame (1); The sealing ring forming mold (2) comprises a fixed ring seat (21), a forming support ring (22) and a symmetrically arranged sealing ring forming mold (23); a sealing ring forming cavity (24) is provided inside the sealing ring forming mold (23); an injection molding channel (29) is formed between the fixed ring seat (21) and the forming support ring (22); and the injection molding channel (29) is communicated with the sealing ring forming cavity (24); The heat exchange mechanism (6) includes a semiconductor refrigeration plate (61), a cooling heat exchange tube (62), a heating heat exchange tube (63), a cooling circulation pump (64), a heating circulation pump (65) and a forming mold heat exchange tube (66). Both sides of the semiconductor refrigeration plate (61) are thermally coupled with the cooling heat exchange tube (62) and the heating heat exchange tube (63), respectively. The cooling circulation pump (64) and the heating circulation pump (65) control the communication between the cooling heat exchange tube (62) and the heating heat exchange tube (63) and the forming mold heat exchange tube (66) through a branch pipe (68) and a heat exchange valve (69), so as to quickly regulate the temperature of the sealing ring forming cavity (24); The inner walls of the cooling heat exchange tube (62) and the heating heat exchange tube (63) are both provided with a capillary heat conduction layer (621), and the cooling heat exchange tube (62) and the heating heat exchange tube (63) are attached to the surface of the semiconductor refrigeration plate (61) through a heat exchange valve (69); The outer side of the forming mold heat exchange tube (66) is provided with a heat-insulating partition (661), a heat-dissipating heat-conducting film (662), and a forming heat exchange plate (663) in sequence, and the forming heat exchange plate (663) is in direct contact with the inner wall of the sealing ring forming cavity (24); An opening and closing sealing groove (25) is provided on the inner side of the forming sealing ring mold (23), and an opening and closing sealing ring (26) is provided in the opening and closing sealing groove (25) for sealingly cooperating with the forming support ring (22) when closed; A heating wire is embedded in the inner side of the forming support ring (22), and the heating wire is distributed along the built-in channels of the fixed ring seat (21) and the forming support ring (22).

2. A polytetrafluoroethylene sealing ring forming device according to claim 1, characterized in that: The heating wire is used to maintain the fluidity of the material injected into the molding channel (29). The end of the molding sealing ring mold (23) is provided with a clamping sealing groove (28), and the inner side of the clamping sealing groove (28) is provided with a clamping sealing ring (27).

3. The polytetrafluoroethylene sealing ring forming device according to claim 1, characterized in that: The opening and closing mechanism (3) comprises an opening and closing hydraulic cylinder (31), an opening and closing mounting plate (32), an opening and closing sliding plate (33), a forming die mounting seat (34) and an opening and closing guide chute (36). The opening and closing hydraulic cylinder (31) drives the opening and closing sliding plate (33) to drive the forming sealing ring die (23) to move along the opening and closing guide chute (36). An opening and closing guide slide plate (35) is fixed to one side of the opening and closing sliding plate (33), and the opening and closing guide slide plate (35) is slidably matched with the opening and closing guide sliding groove (36).

4. The polytetrafluoroethylene sealing ring forming device according to claim 1, characterized in that: A reinforcement mechanism (4) is provided at the upper end of the main molding frame (1). The reinforcement mechanism (4) includes a reinforcement hydraulic cylinder (41) and a reinforcement pressing plate (42). The reinforcement pressing plate (42) presses the end of the molding sealing ring mold (23) to enhance stability after closing.

5. The polytetrafluoroethylene sealing ring forming device according to claim 1, characterized in that: A guide mechanism (5) is provided at both ends of the molding main frame (1), the guide mechanism (5) comprising a positioning guide rod (53) and a positioning guide frame (51), the positioning guide rod (53) being fixed to the end of the molding sealing ring mold (23) and being slidably mounted in a positioning guide groove (52) of the positioning guide frame (51).

6. A polytetrafluoroethylene sealing ring forming device according to claim 5, characterized in that: The guide mechanism (5) further includes a positioning guide seat (54), the inner side of which is provided with a positioning guide hole (55), and both ends of the forming mold heat exchange tube (66) are connected to a heat exchange connecting tube (67), which passes through the positioning guide hole (55) and moves synchronously with the forming sealing ring mold (23), thereby ensuring the stability of the heat exchange pipeline connection.

7. The polytetrafluoroethylene sealing ring forming device according to claim 1, characterized in that: A mounting center column (12) and a mounting side frame (14) are fixed to the supporting main seat (11) of the forming main frame (1) by bolts, a supporting center frame (13) is provided in the middle of the mounting center column (12), both ends of the supporting center frame (13) are fixed to the mounting side frames (14), and forming mold mounting grooves (43) are provided at both ends of the mounting center column (12), and the fixing ring seat (21), the forming support ring (22) and the forming sealing ring mold (23) are all installed in the forming mold mounting groove (43).

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