Plate heat exchanger with micro-structured surface selection area of heat exchange plate and manufacturing method of plate heat exchanger

Abstract

The invention discloses a plate heat exchanger with a micro-structured surface selection area of a heat exchange plate and a manufacturing method of the plate heat exchanger. The plate heat exchanger with the micro-structured surface selection area of the heat exchange plate comprises a mounting frame, the multiple heat exchange plates are installed on the installation frame and stacked in the thickness direction, each heat exchange plate is provided with a heat exchange groove, the heat exchange grooves are suitable for heat exchange medium circulation, the inner wall face of each heat exchange groove is provided with a microstructure machined through ultrasonic vibration milling, each heat exchange plate is provided with a temperature measuring hole, and the temperature measuring holes are used for measuring the temperature of the heat exchange medium. A temperature measuring device is suitable for being installed in the temperature measuring hole. The plate heat exchanger with the micro-structured surface selection area of the heat exchange plate has the advantages of being high in heat exchange efficiency, high in machining efficiency, low in technological condition requirement, convenient to evaluate the heat exchange efficiency, convenient to research the influence of the microstructure on the heat exchange efficiency and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of heat exchange equipment manufacturing, and in particular to a plate heat exchanger with a heat exchange plate surface having a selected area microstructured and a manufacturing method thereof. Background Art

[0002] Processing microstructures on the heat exchange plates of plate heat exchangers to increase the surface area or change the wetting properties can effectively improve the heat transfer efficiency of the plate heat exchanger.

[0003] The preparation of the surface microstructure of the plate heat exchanger in the related technology relies on photolithography, etching, and femtosecond laser processing, but these methods have problems such as low processing efficiency or harsh process conditions, and are difficult to apply in actual production. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a plate heat exchanger with a selected microstructured surface of a heat exchange plate, which has the advantages of high heat exchange efficiency, high processing efficiency, low process condition requirements, easy evaluation of heat exchange efficiency, and easy study of the influence of microstructure on heat exchange efficiency.

[0005] The present invention also provides a method for manufacturing the plate heat exchanger with micro-structuring of selected areas on the surface of the heat exchange plate.

[0006] To achieve the above-mentioned purpose, according to an embodiment of the first aspect of the present invention, a plate heat exchanger with a microstructured selected area on the surface of a heat exchange plate is provided, and the plate heat exchanger with a microstructured selected area on the surface of a heat exchange plate comprises: a mounting frame; a plurality of heat exchange plates, wherein the plurality of heat exchange plates are mounted on the mounting frame and stacked along the thickness direction, each of the heat exchange plates is provided with a heat exchange groove, the heat exchange groove is suitable for the circulation of heat exchange medium, a microstructure processed by ultrasonic vibration milling is provided on the inner wall surface of the heat exchange groove, and each of the heat exchange plates is provided with a temperature measuring hole, and the temperature measuring hole is suitable for installing a temperature measuring device.

[0007] The plate heat exchanger with selected microstructured areas on the surface of the heat exchange plate according to the embodiment of the present invention has the advantages of high heat exchange efficiency, high processing efficiency, low process condition requirements, easy evaluation of heat exchange efficiency, and easy study of the influence of microstructure on heat exchange efficiency.

[0008] In addition, the plate heat exchanger with selected microstructured areas on the surface of the heat exchange plate according to the above embodiment of the present invention may also have the following additional technical features:

[0009] According to an embodiment of the present invention, a plurality of flow channel partitions are provided on the bottom wall of each heat exchange groove, a flow channel groove is formed between two adjacent flow channel partitions, and the microstructure is provided on the bottom wall of the flow channel groove.

[0010] According to one embodiment of the present invention, each of the heat exchange plates includes two first surfaces opposite to each other in the thickness direction and four second surfaces parallel to the thickness direction, the heat exchange groove is arranged on at least one of the two first surfaces, and the temperature measuring hole is arranged on one of the four second surfaces and extends to the middle of the heat exchange plate.

[0011] According to an embodiment of the present invention, there are four temperature measuring holes and they are arranged in an array on the same second surface.

[0012] According to one embodiment of the present invention, the mounting frame comprises: an upper guide rod and a lower guide rod, each heat exchange plate is provided with an upper guide groove on the upper surface and a lower guide groove on the lower surface, the upper guide rod is slidably matched with the plurality of upper guide grooves, and the lower guide rod is slidably matched with the plurality of lower guide grooves; two end plates, the plurality of heat exchange plates are clamped between the two end plates, and the two end plates are connected by bolts; and a support column, the support column is respectively connected to the upper guide rod and the lower guide rod.

[0013] According to an embodiment of the present invention, each of the heat exchange plates is provided with a flow channel hole penetrating the heat exchange plate along the thickness direction.

[0014] According to an embodiment of the second aspect of the present invention, a method for manufacturing a plate heat exchanger with a heat exchange plate surface microstructured in a selected area according to the embodiment of the first aspect of the present invention is provided, comprising at least the following steps:

[0015] S1. Provide an ultrasonic vibration milling device;

[0016] S2, calculating the unit feed rate according to the spacing of the microstructures to be processed in the feed direction, calculating the cutting speed, unit feed rate and cutting edge inclination angle according to the spacing of the microstructures to be processed in the cutting direction and the length of the microstructures to be processed, and calculating the tool tip radius and cutting depth of the tool according to the width of the microstructures to be processed;

[0017] S3. Using the ultrasonic vibration milling device to process the microstructure on the heat exchange plate according to the unit feed rate, the cutting speed, the cutting edge inclination angle, the tool tip radius and the cutting depth.

[0018] The method for manufacturing a plate heat exchanger with a heat exchange plate surface having a selected microstructure according to an embodiment of the present invention has the advantages of high processing efficiency and low requirements on process conditions.

[0019] According to one embodiment of the present invention, the length of the microstructure is l and the width is w, the spacing of the microstructures in the cutting direction is S, the spacing of the microstructures in the feeding direction is d, and the cutting speed is V. c , the tool tip radius is R n, cutting depth is DOC, cutting edge inclination angle is β, unit feed is f, then:

[0020]

[0021] According to an embodiment of the present invention, before step S3, the following step is also included: processing flow channel grooves on the heat exchange plate.

[0022] According to one embodiment of the present invention, the ultrasonic vibration milling processing device includes: a signal generating device; a piezoelectric transducer, wherein the piezoelectric transducer is suitable for converting the electrical signal generated by the signal generating device into mechanical vibration; and a tool, wherein the tool is connected to the piezoelectric transducer and is suitable for vibrating under the drive of the piezoelectric transducer.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 1 is a schematic structural diagram of a plate heat exchanger with micro-structuring of selected areas on the surface of a heat exchange plate according to an embodiment of the present invention.

[0026] Figure 2 It is a partial exploded view of a plate heat exchanger with micro-structuring of selected areas on the surface of the heat exchange plate according to an embodiment of the present invention.

[0027] Figure 3 It is a schematic structural diagram of a heat exchange plate of a plate heat exchanger with micro-structuring of selected areas on the surface of the heat exchange plate according to an embodiment of the present invention.

[0028] Figure 4 It is a schematic structural diagram of a heat exchange plate of a plate heat exchanger with micro-structuring of selected areas on the surface of the heat exchange plate according to an embodiment of the present invention.

[0029] Figure 5 It is a schematic diagram of the process of manufacturing a plate heat exchanger with micro-structuring of selected areas on the surface of a heat exchange plate according to an embodiment of the present invention.

[0030] Figure 6 It is a schematic structural diagram of a heat exchange plate of a plate heat exchanger with micro-structuring of selected areas on the surface of the heat exchange plate according to an embodiment of the present invention.

[0031] Figure 7 It is a schematic diagram of the process of heat flux and heat transfer coefficient of a plate heat exchanger with micro-structuring of selected areas on the surface of a heat exchange plate according to an embodiment of the present invention changing with subcooling.

[0032] Figure 8 The present invention is a flowchart of a method for manufacturing a plate heat exchanger with micro-structuring of selected areas on the surface of a heat exchange plate according to an embodiment of the present invention.

[0033] Figure numerals: plate heat exchanger with microstructuring of selected areas on the surface of heat exchange plate 1, upper guide rod 11, lower guide rod 12, end plate 13, bolt 14, support column 15, heat exchange plate 20, heat exchange groove 21, microstructure 22, temperature measuring hole 23, flow channel baffle 24, flow channel groove 25, upper guide groove 26, lower guide groove 27, flow channel hole 28, signal generating device 2, piezoelectric transducer 3, tool 4. DETAILED DESCRIPTION

[0034] This application is based on the inventor's discovery and understanding of the following facts and problems:

[0035] Processing microstructures on the heat exchange plates of plate heat exchangers to increase the surface area or change the wetting properties can effectively improve the heat transfer efficiency of the plate heat exchanger.

[0036] The preparation of the surface microstructure of the plate heat exchanger in the related technology relies on photolithography, etching, and femtosecond laser processing, but these methods have problems such as low processing efficiency or harsh process conditions, and are difficult to apply in actual production.

[0037] In addition, the relevant technology only mentions that processing microstructures on the heat exchange plate can improve the heat transfer efficiency, but there is a lack of relevant research on the influence of various parameters of the microstructure on the heat transfer efficiency. It is necessary to study the relationship between the specific parameters of the microstructure and the heat transfer effect to provide guidance for the optimal setting of the microstructure.

[0038] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0039] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0040] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] The plate heat exchanger 1 with selected micro-structuring of the surface of the heat exchange plate according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0042] like Figure 1-Figure 8 As shown, the plate heat exchanger 1 with micro-structuring of selected areas on the surface of the heat exchange plate according to an embodiment of the present invention comprises a mounting frame and a plurality of heat exchange plates 20 .

[0043] A plurality of heat exchange plates 20 are mounted on the mounting frame and stacked in the thickness direction. A heat exchange groove 21 is provided on each heat exchange plate 20. The heat exchange groove 21 is suitable for the circulation of heat exchange medium. A microstructure processed by ultrasonic vibration milling is provided on the inner wall surface of the heat exchange groove 21. A temperature measuring hole 23 is provided on each heat exchange plate 20. The temperature measuring hole 23 is suitable for installing a temperature measuring device.

[0044] Specifically, if Figure 7 As shown, a heat exchanger without a microstructured heat exchange plate and a plate heat exchanger 1 with a microstructured surface of a heat exchange plate selected according to the present invention were tested. In the experiment, the inlet temperature and flow rate of the cold fluid were controlled to be stable, and the subcooling degree was set to the calculated temperature difference between the wall temperature of the heat exchange plate 20 and the inlet cold fluid. Finally, a curve of heat flux and heat transfer coefficient changing with the system subcooling degree was obtained. Figure 7As shown in the figure, it can be found that under the same degree of subcooling, the heat transfer and heat transfer coefficient of the central area of ​​the heat exchange plate 20 are greatly improved. It can be effectively proved that the plate heat exchanger 1 with micro-structuring of the heat exchange plate surface selected according to the present invention can effectively strengthen the condensation heat transfer process, thereby improving the heat exchange efficiency of the plate heat exchanger and enhancing the ability of residual heat recovery.

[0045] According to the plate heat exchanger 1 with selected microstructures on the surface of the heat exchange plate according to the embodiment of the present invention, by providing microstructures 22 on the heat exchange grooves 21, the microstructures 22 can be used to increase the surface area and / or improve the wetting performance, thereby improving the heat exchange efficiency of the heat exchange plate 20.

[0046] Moreover, by using ultrasonic vibration milling to process the microstructure 22, compared with the processing methods using photolithography, etching or femtosecond laser in related technologies, ultrasonic vibration milling can be directly processed on the surface of the heat exchange groove 21 without other additional steps, with higher processing efficiency and lower process conditions, which is convenient for mass production.

[0047] In addition, by setting a temperature measuring hole 23 on the heat exchange plate 20, a temperature measuring device can be installed using the temperature measuring hole 23, and the temperature measuring device can be used to detect the temperature change of the heat exchange plate 20, thereby facilitating the evaluation of the influence of different microstructures 22 on the heat exchange efficiency of the heat exchange plate 20, and providing guidance for optimizing the microstructure 22 to improve the heat exchange effect.

[0048] Therefore, the plate heat exchanger 1 with selected microstructured areas on the surface of the heat exchange plate according to the embodiment of the present invention has the advantages of high heat exchange efficiency, high processing efficiency, low process condition requirements, easy evaluation of heat exchange efficiency, and easy study of the influence of microstructure on heat exchange efficiency.

[0049] The plate heat exchanger 1 with selected area micro-structuring on the surface of the heat exchange plate according to a specific embodiment of the present invention will be described below with reference to the accompanying drawings.

[0050] In some specific embodiments of the present invention, Figure 1-Figure 8 As shown, the plate heat exchanger 1 with micro-structuring of selected areas on the surface of the heat exchange plate according to an embodiment of the present invention comprises a mounting frame and a plurality of heat exchange plates 20 .

[0051] Specifically, Figure 5 and Figure 6 As shown, the bottom wall of each heat exchange groove 21 is provided with a plurality of flow channel baffles 24, and a flow channel 25 is formed between two adjacent flow channel baffles 24, and the microstructure 22 is provided on the bottom wall of the flow channel 25. It should be understood here that the "bottom wall" refers to the bottom wall in the groove direction, in other words, it refers to the wall surface opposite to the open side. In this way, it is convenient to form a flow channel on the heat exchange plate 20, which is convenient for the heat exchange medium to flow.

[0052] Advantageously, if Figure 2-Figure 5As shown, each heat exchange plate 20 includes two first surfaces opposite to each other in the thickness direction and four second surfaces parallel to the thickness direction, the heat exchange groove 21 is provided on at least one of the two first surfaces, and the temperature measuring hole 23 is provided on one of the four second surfaces and extends to the middle of the heat exchange plate 20. This makes it easier to install the temperature measuring device and to measure the temperature of the heat exchange plate 20.

[0053] Furthermore, if Figure 3 and Figure 4 As shown, there are four temperature measuring holes 23 arranged in an array on the same second surface. In this way, four temperature measuring devices can be installed to provide redundancy for unexpected situations such as failure of the temperature measuring device, thereby improving the reliability of temperature measurement.

[0054] Specifically, let q be the heat flux, λ S is the thermal conductivity of the material used for the heat exchange plate 20, T1 and x1 are the temperature of the side close to the fluid inlet and outlet and the distance from the surface of the heat exchange plate 20, T2 and x2 are the temperature of the side far from the fluid inlet and outlet and the distance from the surface of the heat exchange plate 20. h is the condensation heat transfer coefficient, and ΔT is the subcooling (superheating). The specific setting of the subcooling (superheating) can be determined according to actual needs, then:

[0055]

[0056] This can facilitate the evaluation of the heat transfer capacity of the heat exchange plate and provide guidance for the optimization of microstructure-enhanced heat transfer effects.

[0057] More specifically, Figure 1-Figure 4 As shown, the mounting frame includes an upper guide rod 11, a lower guide rod 12, two end plates 13 and a support column 15. An upper guide groove 26 is provided on the upper surface of each heat exchange plate 20 and a lower guide groove 27 is provided on the lower surface. The upper guide rod 11 is slidably matched with a plurality of upper guide grooves 26, and the lower guide rod 12 is slidably matched with a plurality of lower guide grooves 27. A plurality of heat exchange plates 20 are clamped between two end plates 13, and the two end plates 13 are connected by bolts 14. The support column 15 is respectively connected to the upper guide rod 11 and the lower guide rod 12. In this way, the heat exchange plate 20 can be clamped by the end plate 13, the heat exchange plate 20 can be positioned by the guide rod, and the guide rod can be supported by the support column 15, thereby improving the stability of the mounting frame.

[0058] Specifically, a sealing ring is provided between two adjacent heat exchange plates 20 to improve the sealing performance.

[0059] Furthermore, if Figure 1-Figure 3 As shown, each heat exchange plate 20 is provided with a flow channel hole 28 that penetrates the heat exchange plate 20 along the thickness direction. This makes it easier for the heat exchange slot 21 to communicate with the external pipeline, and further facilitates the circulation of the heat exchange medium.

[0060] Specifically, the heat exchange plate 20 may be made of copper material to improve the heat exchange effect, and the guide rod, the end plate 13 and the support column 15 may be made of stainless steel material to improve the structural strength.

[0061] The following describes a method for manufacturing a plate heat exchanger 1 with a microstructured heat exchange plate surface in a selected area according to the above embodiment of the present invention, which at least comprises the following steps:

[0062] S1. Provide an ultrasonic vibration milling device;

[0063] S2, calculating the unit feed rate according to the spacing of the microstructures 22 to be processed in the feed direction, calculating the cutting speed, the unit feed rate and the cutting edge inclination angle according to the spacing of the microstructures 22 to be processed in the cutting direction and the length of the microstructures 22 to be processed, and calculating the tool tip radius and cutting depth of the tool according to the width of the microstructures 22 to be processed;

[0064] S3. Using the ultrasonic vibration milling device to process the microstructure 22 on the heat exchange plate according to the unit feed rate, the cutting speed, the cutting edge inclination angle, the tool nose radius and the cutting depth.

[0065] It is understood by those skilled in the art that the processing and assembly methods of other structures of the plate heat exchanger 1 with micro-structuring of selected areas on the surface of the heat exchange plate are known to those skilled in the art, and they can perform operations according to actual needs.

[0066] The method for manufacturing the plate heat exchanger 1 with micro-structuring of the selected area on the surface of the heat exchange plate according to the embodiment of the present invention has the advantages of high processing efficiency and low requirements on process conditions.

[0067] Specifically, Figure 5 and Figure 6 As shown, assuming that the length of the microstructure is l and the width is w, the spacing of the microstructures in the cutting direction is S, the spacing of the microstructures in the feed direction is d, and the cutting speed is V c , the tool tip radius is R n , cutting depth is DOC, cutting edge inclination angle is β, unit feed is f, then:

[0068]

[0069] This makes it easier to set the cutting parameters according to the parameters of the microstructure.

[0070] Optionally, before step S3, the following steps are also included:

[0071] The flow channel grooves 25 are processed on the heat exchange plate 20 .

[0072] This makes it easier for the heat exchange medium to circulate.

[0073] Specifically, the ultrasonic vibration milling processing device includes a signal generating device 2, a piezoelectric transducer 3 and a tool 4. The piezoelectric transducer 3 is suitable for converting the electrical signal generated by the signal generating device 2 into mechanical vibration. The tool 4 is connected to the piezoelectric transducer 3 and is suitable for vibrating under the drive of the piezoelectric transducer 3. This makes it easier for the tool 4 to process the microstructure 22.

[0074] Other structures and operations of the plate heat exchanger 1 with micro-structuring of the heat exchange plate surface selected according to the embodiment of the present invention and the manufacturing method thereof are known to those skilled in the art and will not be described in detail here.

[0075] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0076] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A plate heat exchanger with a heat exchange plate surface microstructured in selected areas, characterized in that: include: Mounting frame; Multiple heat exchange plates are installed on the mounting frame and stacked in the thickness direction. Each heat exchange plate is provided with a heat exchange groove, which is suitable for the circulation of heat exchange medium. The inner wall surface of the heat exchange groove is provided with a microstructure processed by ultrasonic vibration milling. Each heat exchange plate is provided with a temperature measuring hole, which is suitable for installing a temperature measuring device.

2. The plate heat exchanger with selected micro-structured heat exchange plate surface according to claim 1, characterized in that: The bottom wall of each heat exchange groove is provided with a plurality of flow channel partitions, a flow channel groove is formed between two adjacent flow channel partitions, and the microstructure is arranged on the bottom wall of the flow channel groove.

3. The plate heat exchanger with selected micro-structuring of the heat exchange plate surface according to claim 1, characterized in that: Each of the heat exchange plates includes two first surfaces opposite to each other in the thickness direction and four second surfaces parallel to the thickness direction. The heat exchange groove is arranged on at least one of the two first surfaces, and the temperature measuring hole is arranged on one of the four second surfaces and extends to the middle of the heat exchange plate.

4. The plate heat exchanger with selected micro-structured heat exchange plate surface according to claim 3, characterized in that: There are four temperature measuring holes arranged in an array on the same second surface.

5. The plate heat exchanger with selected micro-structuring of the heat exchange plate surface according to claim 1, characterized in that: The mounting frame comprises: An upper guide rod and a lower guide rod, wherein the upper surface of each heat exchange plate is provided with an upper guide groove and the lower surface is provided with a lower guide groove, the upper guide rod is slidably matched with a plurality of the upper guide grooves, and the lower guide rod is slidably matched with a plurality of the lower guide grooves; Two end plates, a plurality of heat exchange plates are clamped between the two end plates, and the two end plates are connected by bolts; Support columns are respectively connected to the upper guide rod and the lower guide rod.

6. The plate heat exchanger with selected micro-structuring of the heat exchange plate surface according to claim 1, characterized in that: Each of the heat exchange plates is provided with a flow channel hole penetrating the heat exchange plate along the thickness direction.

7. A method for manufacturing a plate heat exchanger with a heat exchange plate surface microstructured in selected areas according to any one of claims 1 to 6, characterized in that: At least the following steps are included: S1. Provide an ultrasonic vibration milling device; S2, calculating the unit feed rate according to the spacing of the microstructures to be processed in the feed direction, calculating the cutting speed, unit feed rate and cutting edge inclination angle according to the spacing of the microstructures to be processed in the cutting direction and the length of the microstructures to be processed, and calculating the tool tip radius and cutting depth of the tool according to the width of the microstructures to be processed; S3. Using the ultrasonic vibration milling device to process the microstructure on the heat exchange plate according to the unit feed rate, the cutting speed, the cutting edge inclination angle, the tool tip radius and the cutting depth.

8. The method for manufacturing a plate heat exchanger with a microstructured heat exchange plate surface in selected areas according to claim 7, characterized in that The length of the microstructure is l and the width is w, the spacing of the microstructures in the cutting direction is S, the spacing of the microstructures in the feeding direction is d, and the cutting speed is V. c , the tool tip radius is R n , cutting depth is DOC, cutting edge inclination angle is β, unit feed is f, then:

9. The method for manufacturing a plate heat exchanger with a heat exchange plate surface microstructured in selected areas according to claim 7, characterized in that: Before step S3, the method further includes the following steps: The flow channel grooves are processed on the heat exchange plate.

10. The method for manufacturing a plate heat exchanger with a heat exchange plate surface microstructured in selected areas according to claim 7, characterized in that: The ultrasonic vibration milling processing device comprises: Signal generating device; a piezoelectric transducer adapted to convert the electrical signal generated by the signal generating device into mechanical vibration; A tool is connected to the piezoelectric transducer and is suitable for vibrating under the driving of the piezoelectric transducer.

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