Current sensor

Abstract

This current sensor is provided with a sensor housing, a conductive member, a wiring board, a magnetoelectric conversion unit, and a shield unit. The shield portion includes a plate-shaped first shield portion and a plate-shaped second shield portion, a portion of the conductive member and the magnetoelectric conversion portion are located between one surface of the first shield portion and one surface of the second shield portion, and a portion of the conductive member located between the first shield portion and the second shield portion extends in an extension direction along the one surface of the first shield portion. The central portion of the first shield portion and the second shield portion in the extension direction has a longer length in the lateral direction intersecting the extension direction along one surface of the first shield portion than both end portions thereof, and the second shield portion has extending portions extending toward the first shield portion at both ends of the central portion in the lateral direction. The extended portion has an end surface facing one surface of the center portion of the first shield portion in a direction intersecting the lateral direction and the extension direction, and the magnetoelectric conversion portion is located between both end portions of the first shield portion and the second shield portion in the extension direction.

Description

[0001] This application is a divisional application of the Chinese patent application with application number 201980020169.4 and invention name “Current Sensor” filed on January 22, 2019.

[0002] Cross-reference to related applications

[0003] This application is based on Japanese application No. 2018-52959 filed on March 20, 2018, and the contents thereof are cited herein. Technical Field

[0004] The present disclosure relates to a current sensor for detecting a current to be measured. Background Art

[0005] As disclosed in Patent Document 1, there is known a current detection system (current sensor) that detects current by converting a magnetic field generated by current flowing through a bus bar into an electrical signal.

[0006] As described in Patent Document 1, in the technical field of current sensors, there is a problem that the detection accuracy of current (current to be measured) is reduced.

[0007] Prior art literature

[0008] Patent Literature

[0009] Patent Document 1: Japanese Patent Application Publication No. 2015-194472 Summary of the invention

[0010] An object of the present disclosure is to provide a current sensor that suppresses a decrease in the detection accuracy of a current to be measured.

[0011] According to one embodiment of the present disclosure, a current sensor includes: a sensor housing having a base;

[0012] A conductive component through which a measured current flows, comprising a covering portion covered by the above-mentioned base; a wiring substrate, arranged in a first storage space formed by one end face of the above-mentioned base and a first enclosure formed on the above-mentioned one end face; a magneto-electric conversion portion, arranged on an opposite surface of the above-mentioned wiring substrate opposite to the above-mentioned one end face of the above-mentioned base, converting a measured magnetic field generated by the flow of the above-mentioned measured current into an electrical signal; and a shielding portion, suppressing input of electromagnetic noise into the above-mentioned magneto-electric conversion portion, the above-mentioned shielding portion comprising a plate-shaped first shielding portion and a second shielding portion, each of the first shielding portion and the second shielding portion having one side opposed to each other in a separated manner, the above-mentioned first shielding portion being arranged in the above-mentioned first storage space in a state in which the above-mentioned one side is opposed to the above-mentioned wiring substrate, the above-mentioned second shielding portion being arranged in a state in which the above-mentioned one side is opposed to the other end face of the above-mentioned base on the opposite side of the above-mentioned one end face, the second storage space being formed by the other end face of the above-mentioned base and the second enclosure formed on the above-mentioned other end face. The first shielding part is formed by a portion of the conductive component and the magneto-electric conversion part, and the portion of the conductive component located between the first shielding part and the second shielding part extends in the extension direction along the one side of the first shielding part. The central portions of the first shielding part and the second shielding part in the extension direction are longer in the lateral direction along the one side of the first shielding part and intersecting the extension direction than the two end portions thereof. The first shielding part is a flat plate, and the second shielding part has an extension portion extending toward the first shielding part at both ends of the lateral direction of the central portion, and the extension portion has an end surface opposite to the one side of the central portion of the first shielding part in a direction intersecting the lateral direction and the extension direction. In the extension direction, the magneto-electric conversion part is located between the two end portions of the first shielding part and the second shielding part.

[0013] According to one embodiment of the present disclosure, the two ends of at least one of the first shielding part and the second shielding part are shorter in length in the lateral direction than the central part. Therefore, it is not easy for electromagnetic noise to penetrate into the two ends compared with the central part. Therefore, in the extension direction, it is not easy for electromagnetic noise to penetrate from one end to the other through the central part. Thus, the central part of at least one of the first shielding part and the second shielding part is not easy to be magnetically saturated. The leakage of electromagnetic noise from the central part of at least one of the first shielding part and the second shielding part is suppressed.

[0014] According to one embodiment of the present disclosure, the magnetoelectric conversion part is located between the two ends of the first shield part and the second shield part in the extension direction. That is, the magnetoelectric conversion part is located between the central part of the first shield part and the central part of the second shield part. Therefore, the situation in which the electromagnetic noise leaked due to the magnetic saturation of the central part of at least one of the first shield part and the second shield part is input into the magnetoelectric conversion part is suppressed. As a result, the reduction in the detection accuracy of the measured current is suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other objects, features and advantages of the present disclosure will become more apparent from the following detailed description with reference to the accompanying drawings.

[0016] Figure 1 It is a block diagram for explaining the in-vehicle system.

[0017] Figure 2 It is a perspective view showing the first current sensor.

[0018] Figure 3 It is an exploded perspective view showing the first current sensor.

[0019] Figure 4 is a graph showing the first current sensor.

[0020] Figure 5 is a graph showing the first current sensor.

[0021] Figure 6 It is a diagram showing a wiring board.

[0022] Figure 7 This is a block diagram for explaining the sensor unit.

[0023] Figure 8 is a diagram showing a conductive busbar.

[0024] Fig. 9 : is a diagram showing the first shielding part.

[0025] Fig.10 It is a diagram showing the second shielding part.

[0026] Fig.11 is a diagram showing a sensor case.

[0027] Fig.12 This is a diagram for explaining substrate supporting pins and substrate bonding pins.

[0028] Fig.13 It is along Fig.12 Column (b) shows a cross-sectional view taken along line XIII-XIII.

[0029] Fig.14 It is a diagram for explaining the shield portion supporting pins and the shield portion bonding pins.

[0030] Fig.15 It means along Fig.14 Column (b) shows a cross-sectional view taken along line XV-XV.

[0031] Fig.16 It is a perspective view showing two independent sensors.

[0032] Fig.17 It is a perspective view showing a wiring case.

[0033] Fig.18 This is a perspective view for explaining the assembly of the independent sensor to the wiring case.

[0034] Fig.19 It is a perspective view showing the second current sensor.

[0035] Fig. 20 is a diagram showing a wiring case.

[0036] Fig.21 is a diagram showing a wiring case.

[0037] Fig. 22 is a graph showing the second current sensor.

[0038] Fig.23 is a graph showing the second current sensor.

[0039] Fig.24 This is a graph for explaining the magnetic saturation of the first shield portion.

[0040] Fig.25 It is a graph showing the simulation results of magnetic saturation.

[0041] Fig.26 This is a diagram for explaining the second shielding portion according to the second embodiment.

[0042] Fig. 27 This is a schematic diagram for explaining the magnetic field that passes through the shield.

[0043] Fig.28 : is a diagram showing a modification example of the shielding portion.

[0044] Fig.29 : is a diagram showing a modification example of the shielding portion.

[0045] Fig.30 It is a perspective view showing a first current sensor according to a third embodiment.

[0046] Fig.31 It is along Fig.30 A cross-sectional view taken along line XXXI-XXXI is shown in FIG.

[0047] Fig.32 It is a diagram for explaining the fixing form of the first current sensor.

[0048] Fig.33 It is a diagram showing the arrangement of the magneto-electric conversion unit and the conductive busbar according to the fourth embodiment.

[0049] Fig.34 This is a graph for explaining the output change of the magneto-electric conversion unit.

[0050] Fig.35 This is a block diagram for explaining the sensor unit according to the fourth embodiment.

[0051] Fig.36 is a block diagram used to represent a differential circuit.

[0052] Fig.37 This is a schematic diagram for explaining the shielding property of the shield portion according to the fifth embodiment.

[0053] Fig.38 It is a schematic diagram for explaining the shielding property of the shield portion.

[0054] Fig.39 : is a diagram showing a modification example of the shielding portion.

[0055] Fig.40 : is a diagram showing a modification example of the shielding portion.

[0056] Fig.41 It is a perspective view showing a modified example of the second current sensor.

[0057] Fig.42 It is a graph showing a modification of the second current sensor.

[0058] Fig.43 It is a graph showing a modification of the second current sensor.

[0059] Fig.44 It is a perspective view showing a state where the independent sensor is assembled to the wiring case.

[0060] Fig.45 is a diagram for explaining the types of detection patterns. DETAILED DESCRIPTION

[0061] (First embodiment)

[0062] <In-vehicle system>

[0063] First, a vehicle-mounted system 100 to which the current sensor is applied is described. The vehicle-mounted system 100 constitutes a hybrid system. Figure 1As shown, the vehicle-mounted system 100 includes a battery 200 , a power conversion device 300 , a first motor 400 , a second motor 500 , an engine 600 , and a power split mechanism 700 .

[0064] Furthermore, the in-vehicle system 100 has a plurality of ECUs. Figure 1 In the figure, as representatives of these multiple ECUs, a battery ECU 801 and an MGECU 802 are illustrated. These multiple ECUs send and receive signals to each other via a bus wiring 800 to coordinately control the hybrid vehicle. Through this coordinated control, the regeneration and power operation of the first motor 400, the power generation of the second motor 500, and the output of the engine 600 corresponding to the SOC of the battery 200 are controlled. SOC is the abbreviation of state of charge. ECU is the abbreviation of electronic control unit.

[0065] In addition, the ECU has at least one processing unit (CPU) and at least one memory device (MMR) as a storage medium for storing programs and data. The ECU is provided by a microcomputer having a storage medium that can be read by a computer. The storage medium is a non-movable physical storage medium that non-temporarily stores programs that can be read by a computer. The storage medium can be provided by a semiconductor memory or a magnetic disk, etc. The components of the vehicle-mounted system 100 are summarized below.

[0066] The battery 200 includes a plurality of secondary batteries. These plurality of secondary batteries constitute a battery stack connected in series. As the secondary battery, a lithium ion secondary battery, a nickel hydrogen secondary battery, an organic radical battery, etc. can be used.

[0067] A secondary battery generates an electromotive force through a chemical reaction. A secondary battery has a property that deteriorates rapidly if the charge amount is too much or too little. In other words, a secondary battery has a property that deteriorates rapidly if the SOC is overcharged or over-discharged.

[0068] The SOC of the battery 200 is equivalent to the SOC of the battery stack described above. The SOC of the battery stack is the sum of the SOCs of the plurality of secondary batteries. Overcharging and overdischarging of the SOC of the battery stack are avoided by the above-mentioned coordinated control. In this regard, overcharging and overdischarging of the SOC of the plurality of secondary batteries are avoided by equalizing the SOCs of the plurality of secondary batteries.

[0069] The equalization process is performed by charging and discharging the plurality of secondary batteries separately. The battery 200 includes a switch for charging and discharging the plurality of secondary batteries separately. In addition, the battery 200 includes a voltage sensor, a temperature sensor, etc. for detecting the SOC of each of the plurality of secondary batteries. The battery ECU 801 controls the switch on and off based on the output of these sensors and the first current sensor 11 described later. Thus, the SOC of each of the plurality of secondary batteries is equalized.

[0070] The power conversion device 300 performs power conversion between the battery 200 and the first motor 400. In addition, the power conversion device 300 also performs power conversion between the battery 200 and the second motor 500. The power conversion device 300 converts the direct current of the battery 200 into alternating current of a voltage level suitable for power operation of the first motor 400 and the second motor 500. The power conversion device 300 converts the alternating current generated by the power generation of the first motor 400 and the second motor 500 into direct current of a voltage level suitable for charging the battery 200. The power conversion device 300 will be described in detail later.

[0071] The first motor 400, the second motor 500 and the engine 600 are respectively connected to the power distribution mechanism 700. The first motor 400 is directly connected to the output shaft of the hybrid vehicle (not shown). The rotational energy of the first motor 400 is transmitted to the running wheels via the output shaft. Conversely, the rotational energy of the running wheels is transmitted to the first motor 400 via the output shaft.

[0072] The first motor 400 performs power operation based on the AC power supplied from the power conversion device 300. The rotational energy generated by the power operation is distributed to the engine 600 and the output shaft of the hybrid vehicle by the power distribution mechanism 700. In this way, the propulsion force is imparted to the rotating power output shaft of the crankshaft and the running wheels. In addition, the first motor 400 regenerates using the rotational energy transmitted from the running wheels. The AC power generated by the regeneration is converted into DC power by the power conversion device 300 and is stepped down. The DC power is supplied to the battery 200. In addition, the DC power is also supplied to various electrical loads mounted on the hybrid vehicle.

[0073] The second motor 500 generates electricity using rotational energy supplied from the engine 600. The AC power generated by the power conversion device 300 is converted into DC power and its voltage is stepped down. The DC power is supplied to the battery 200 and various electrical loads.

[0074] The engine 600 generates rotational energy by burning fuel and driving. The rotational energy is distributed to the second motor 500 and the output shaft via the power distribution mechanism 700. Thus, the second motor 500 generates power and applies propulsion force to the running wheels.

[0075] The power split mechanism 700 has a planetary gear mechanism. The power split mechanism 700 has a ring gear, a planetary gear, a sun gear, and a planetary carrier.

[0076] The internal gear is annular and has a plurality of teeth arranged in a circumferential direction on the outer circumferential surface and the inner circumferential surface of the internal gear.

[0077] The planetary gear and the sun gear are each in the shape of a disk. A plurality of teeth are formed on the circumferential surface of each of the planetary gear and the sun gear in a circumferential direction.

[0078] The planet carrier is annular. A plurality of planetary gears are connected to a flat surface connecting an outer peripheral surface and an inner peripheral surface of the planet carrier. The flat surfaces of the planet carrier and the planetary gears face each other.

[0079] The plurality of planetary gears are located on a circle centered on the rotation center of the planet carrier. The adjacent intervals of the plurality of planetary gears are equal. In this embodiment, the three planetary gears are arranged at intervals of 120°.

[0080] A sun gear is provided at the center of the internal gear. The inner circumference of the internal gear and the outer circumference of the sun gear face each other. Three planetary gears are provided between the two. The teeth of each of the three planetary gears mesh with the teeth of each of the internal gear and the sun gear. Thus, the rotation of each of the internal gear, the planetary gear, the sun gear and the planet carrier is transmitted to each other.

[0081] The internal gear is connected to the output shaft of the first motor 400. The planetary carrier is connected to the crankshaft of the engine 600. The sun gear is connected to the output shaft of the second motor 500. As a result, the rotation speeds of the first motor 400, the engine 600, and the second motor 500 are in a linear relationship in the collinear diagram.

[0082] By supplying AC power from the power conversion device 300 to the first motor 400 and the second motor 500, torque is generated in the internal gear and the sun gear. The planetary carrier generates torque by the combustion drive of the engine 600. In this way, the first motor 400 performs power running and regeneration, and the second motor 500 generates power and applies propulsion force to the running wheels.

[0083] The operations of the first motor 400, the second motor 500, and the engine 600 are coordinated and controlled by a plurality of ECUs. For example, the MGECU 802 determines the target torques of the first motor 400 and the second motor 500 based on the physical quantities detected by various sensors mounted in the hybrid vehicle and the vehicle information input from other ECUs. Furthermore, the MGECU 802 performs vector control so that the torques generated by the first motor 400 and the second motor 500, respectively, become the target torques.

[0084] <Power conversion device>

[0085] Next, the power conversion device 300 is described. The power conversion device 300 includes a converter 310, a first inverter 320, and a second inverter 330. The converter 310 realizes a function of stepping up and down the voltage level of direct current. The first inverter 320 and the second inverter 330 realize a function of converting direct current into alternating current. The first inverter 320 and the second inverter 330 realize a function of converting alternating current into direct current.

[0086] In the vehicle-mounted system 100, the converter 310 boosts the DC power of the battery 200 to a voltage level suitable for the power operation of the first motor 400 and the second motor 500. The first inverter 320 and the second inverter 330 convert the DC power into AC power. The AC power is supplied to the first motor 400 and the second motor 500. In addition, the first inverter 320 and the second inverter 330 convert the AC power generated by the first motor 400 and the second motor 500 into DC power. The converter 310 steps down the DC power to a voltage level suitable for charging the battery 200.

[0087] like Figure 1 As shown, the converter 310 is electrically connected to the battery 200 via the first power line 301 and the second power line 302. The converter 310 is electrically connected to the first inverter 320 and the second inverter 330 via the third power line 303 and the fourth power line 304, respectively.

[0088] One end of the first power line 301 is electrically connected to the positive electrode of the battery 200 . One end of the second power line 302 is electrically connected to the negative electrode of the battery 200 . The other ends of the first power line 301 and the second power line 302 are electrically connected to the converter 310 .

[0089] The first power line 301 and the second power line 302 are connected to a first smoothing capacitor 305. One of two electrodes of the first smoothing capacitor 305 is connected to the third power line 303, and the other is connected to the fourth power line 304.

[0090] In addition, the battery 200 has a system main relay (SMR) not shown. The electrical connection between the battery stack of the battery 200 and the power conversion device 300 is controlled by opening and closing the system main relay. That is, the continuation and interruption of the power supply between the battery 200 and the power conversion device 300 are controlled by opening and closing the system main relay.

[0091] One end of the third power line 303 is electrically connected to a high-side switch 311 of a converter 310 described later. One end of the fourth power line 304 is electrically connected to the other end of the second power line 302. Furthermore, the other ends of the third power line 303 and the fourth power line 304 are electrically connected to the first inverter 320 and the second inverter 330, respectively.

[0092] The third power line 303 and the fourth power line 304 are connected to the second smoothing capacitor 306. One of the two electrodes of the second smoothing capacitor 306 is connected to the third power line 303, and the other is connected to the fourth power line 304.

[0093] The first inverter 320 is electrically connected to the first U-phase stator winding 401 to the first W-phase stator winding 403 of the first motor 400 via the first to third energizing bus bars 341 to 343. The second inverter 330 is electrically connected to the second U-phase stator winding 501 to the second W-phase stator winding 503 of the second motor 500 via the fourth to sixth energizing bus bars 344 to 346.

[0094] <Inverter>

[0095] The converter 310 includes a high-side switch 311, a low-side switch 312, a high-side diode 311a, a low-side diode 312a, and a reactor 313. IGBTs, power MOSFETs, etc. can be used as the high-side switch 311 and the low-side switch 312. In the present embodiment, n-channel IGBTs are used as the high-side switch 311 and the low-side switch 312.

[0096] In addition, when MOSFET is used as the high-side switch 311 and the low-side switch 312, a body diode is formed in the MOSFET. Therefore, the high-side diode 311a and the low-side diode 312a may be omitted. The semiconductor element constituting the converter 310 can be manufactured by a semiconductor such as Si or a wide-bandgap semiconductor such as SiC.

[0097] The high-side diode 311 a is connected in anti-parallel to the high-side switch 311 . That is, the collector electrode of the high-side switch 311 is connected to the cathode electrode of the high-side diode 311 a , and the emitter electrode of the high-side switch 311 is connected to the anode electrode of the high-side diode 311 a .

[0098] Likewise, the low-side diode 312a is connected in anti-parallel to the low-side switch 312. The collector electrode of the low-side switch 312 is connected to the cathode electrode of the low-side diode 312a. The emitter electrode of the low-side switch 312 is connected to the anode electrode of the low-side diode 312a.

[0099] like Figure 1As shown, the collector electrode of the high-side switch 311 is electrically connected to the third power line 303. In addition, the emitter electrode of the high-side switch 311 and the collector electrode of the low-side switch 312 are connected. The emitter electrode of the low-side switch 312 is electrically connected to the second power line 302 and the fourth power line 304. Thus, the high-side switch 311 and the low-side switch 312 are sequentially connected in series from the third power line 303 toward the second power line 302. In other words, the high-side switch 311 and the low-side switch 312 are sequentially connected in series from the third power line 303 toward the fourth power line 304.

[0100] A midpoint between the high-side switch 311 and the low-side switch 312 connected in series and one end of a reactor 313 are electrically connected via a current-carrying bus 307 . The other end of the reactor 313 is electrically connected to the other end of the first power line 301 .

[0101] Thus, the DC power of the battery 200 is supplied to the midpoint of the high-side switch 311 and the low-side switch 312 connected in series via the reactor 313 and the energized bus 307. The AC power of the motor converted into the DC power by at least one of the first inverter 320 and the second inverter 330 is supplied to the collector electrode of the high-side switch 311. The AC power of the motor converted into the DC power is supplied to the battery 200 via the high-side switch 311, the energized bus 307 and the reactor 313.

[0102] In this way, direct current for inputting and outputting to and from the battery 200 flows through the energizing bus 307. In terms of the physical quantity that flows, direct current for inputting and outputting to and from the battery 200 flows through the energizing bus 307.

[0103] The high-side switch 311 and the low-side switch 312 of the converter 310 are switched on and off by the MGECU 802. The MGECU 802 generates a control signal and outputs it to the gate driver 803. The gate driver 803 amplifies the control signal and outputs it to the gate electrode of the switch. Thus, the MGECU 802 steps up or down the voltage level of the DC power input to the converter 310.

[0104] The MGECU 802 generates a pulse signal as a control signal. The MGECU 802 adjusts the buck-boost level of the DC power by adjusting the on-duty ratio and frequency of the pulse signal. The buck-boost level is determined based on the target torque and the SOC of the battery 200 .

[0105] When boosting the DC power of the battery 200 , the MGECU 802 alternately opens and closes the high-side switch 311 and the low-side switch 312 . To do this, the MGECU 802 inverts the voltage levels of the control signals output to the high-side switch 311 and the low-side switch 312 .

[0106] When a high level is input to the gate electrode of the high-side switch 311, a low level is input to the gate electrode of the low-side switch 312. In this case, the direct current of the battery 200 is supplied to the first inverter 320 and the second inverter 330 via the reactor 313 and the high-side switch 311. At this time, electric energy is accumulated in the reactor 313 by the flow of current. In addition, electric charge is accumulated in the second smoothing capacitor 306. The second smoothing capacitor 306 is charged.

[0107] When a low level is input to the gate electrode of the high-side switch 311, a high level is input to the gate electrode of the low-side switch 312. In this case, a closed loop is formed through the first smoothing capacitor 305, the reactor 313, and the low-side switch 312. As described above, electric energy is accumulated in the reactor 313. Therefore, a current flows through the reactor 313. The current caused by the electric energy of the reactor 313 flows through the above-mentioned closed loop.

[0108] In this case, the supply of DC power to the first inverter 320 and the second inverter 330 via the high-side switch 311 is interrupted. However, the second smoothing capacitor 306 is charged. Therefore, power is supplied from the second smoothing capacitor 306 to the first inverter 320 and the second inverter 330. The power supply to the first inverter 320 and the second inverter 330 continues.

[0109] After that, a high level is input to the high-side switch 311, and a low level is input to the low-side switch 312. At this time, the electric energy stored in the reactor 313 is supplied to the first inverter 320 and the second inverter 330 together with the direct current of the battery 200 as direct current. Thus, the direct current of the battery 200 that has been stepped up evenly in time is supplied to the first inverter 320 and the second inverter 330. In addition, the charging of the second smoothing capacitor 306 is restored, and the amount of charge increases. Thus, the voltage level of the direct current supplied from the second smoothing capacitor 306 to the first inverter 320 and the second inverter 330 also rises.

[0110] When stepping down the DC power supplied from at least one of the first inverter 320 and the second inverter 330, the MGECU 802 fixes the control signal output to the low-side switch 312 to a low level. Furthermore, the MGECU 802 switches the control signal output to the high-side switch 311 to a high level and a low level in sequence.

[0111] When a high level is input to the gate electrode of the high-side switch 311 , the DC power of at least one of the first inverter 320 and the second inverter 330 is supplied to the battery 200 via the high-side switch 311 and the reactor 313 .

[0112] When a low level is input to the gate electrode of the high-side switch 311, the DC power of at least one of the first inverter 320 and the second inverter 330 is not supplied to the battery 200. As a result, the DC power whose voltage is stepped down in average over time is supplied to the battery 200.

[0113] In addition, strictly speaking, if a high level is input to the gate electrode of the high-side switch 311 as described above, the first smoothing capacitor 305 is charged. Electric energy is stored in the reactor 313. Thereafter, if a low level is input to the gate electrode of the high-side switch 311, when there is a difference in the output voltage and time constant between the second smoothing capacitor 306 and the battery 200, charging and discharging are performed between the second smoothing capacitor 306 and the battery 200. In addition, a diode not shown connects the first power line 301 and the second power line 302. The anode electrode of the diode is connected to the second power line 302, and the cathode electrode is connected to the first power line 301. Therefore, a closed loop passing through the diode, the reactor 313, and the first smoothing capacitor 305 is formed. The current caused by the electric energy of the reactor 313 flows through the closed loop.

[0114] <Inverter>

[0115] The first inverter 320 has a first switch 321 to a sixth switch 326 and a first diode 321a to a sixth diode 326a. As the first switch 321 to the sixth switch 326, an IGBT or a power MOSFET or the like can be used. In the present embodiment, an n-channel IGBT is used as the first switch 321 to the sixth switch 326. When MOSFET is used as these switches, the above-mentioned diode may not be provided. The semiconductor element constituting the first inverter 320 can be manufactured by a semiconductor such as Si or a wide bandgap semiconductor such as SiC.

[0116] The first diode 321a to the sixth diode 326a corresponding to the first switch 321 to the sixth switch 326 are connected in anti-parallel. That is, if k is a natural number from 1 to 6, the collector electrode of the kth switch is connected to the cathode electrode of the kth diode. The emitter electrode of the kth switch is connected to the anode electrode of the kth diode.

[0117] The first switch 321 and the second switch 322 are connected in series from the third power line 303 to the fourth power line 304. The first U-phase leg includes the first switch 321 and the second switch 322. One end of the first energized bus 341 is connected to the midpoint between the first switch 321 and the second switch 322. The other end of the first energized bus 341 is connected to the first U-phase stator winding 401 of the first motor 400.

[0118] The third switch 323 and the fourth switch 324 are connected in series from the third power line 303 to the fourth power line 304. The first V-phase branch line includes the third switch 323 and the fourth switch 324. One end of the second energized bus 342 is connected to the midpoint between the third switch 323 and the fourth switch 324. The other end of the second energized bus 342 is connected to the first V-phase stator winding 402 of the first motor 400.

[0119] The fifth switch 325 and the sixth switch 326 are connected in series from the third power line 303 to the fourth power line 304. The first W-phase branch line includes the fifth switch 325 and the sixth switch 326. One end of the third energized bus 343 is connected to the midpoint between the fifth switch 325 and the sixth switch 326. The other end of the third energized bus 343 is connected to the first W-phase stator winding 403 of the first motor 400.

[0120] The second inverter 330 has the same configuration as the first inverter 320. The second inverter 330 includes seventh to twelfth switches 331 to 336 and seventh to twelfth diodes 331a to 336a.

[0121] The 7th diode 331a to the 12th diode 336a corresponding to the 7th switch 331 to the 12th switch 336 are connected in anti-parallel. If n is a natural number of 7 to 12, the collector electrode of the nth switch is connected to the cathode electrode of the nth diode. The emitter electrode of the nth switch is connected to the anode electrode of the nth diode.

[0122] The seventh switch 331 and the eighth switch 332 are connected in series between the third power line 303 and the fourth power line 304 to form a second U-phase branch line. One end of the fourth power bus 344 is connected to the midpoint between the seventh switch 331 and the eighth switch 332. The other end of the fourth power bus 344 is connected to the second U-phase stator winding 501 of the second motor 500.

[0123] The ninth switch 333 and the tenth switch 334 are connected in series between the third power line 303 and the fourth power line 304 to form a second V-phase branch line. One end of the fifth energizing bus 345 is connected to the midpoint between the ninth switch 333 and the tenth switch 334. The other end of the fifth energizing bus 345 is connected to the second V-phase stator winding 502 of the second motor 500.

[0124] The 11th switch 335 and the 12th switch 336 are connected in series between the third power line 303 and the fourth power line 304 to form the second W-phase branch line. One end of the sixth energizing bus 346 is connected to the midpoint between the 11th switch 335 and the 12th switch 336. The other end of the sixth energizing bus 346 is connected to the second W-phase stator winding 503 of the second motor 500.

[0125] As described above, the first inverter 320 and the second inverter 330 each have three-phase branches corresponding to the stator windings of the motor phases U to W. The control signal of the MGECU 802 amplified by the gate driver 803 is input to the gate electrodes of the switches constituting the three-phase branches.

[0126] When the motor is powered, each switch is PWM controlled according to the output of the control signal from MGECU802. Thus, a three-phase AC is generated by the inverter. When the motor generates electricity, MGECU802, for example, stops the output of the control signal. Thus, the AC generated by the motor passes through the diode. As a result, the AC is converted into DC.

[0127] The AC current input and output to the first motor 400 described above passes through the first to third power buses 341 to 343 connecting the first inverter 320 and the first motor 400. Similarly, the AC current input and output to the second motor 500 passes through the fourth to sixth power buses 344 to 346 connecting the second inverter 330 and the second motor 500.

[0128] If the physical quantity flowing is limited, the AC current input and output to the first motor 400 flows through the first to third power buses 341 to 343. The AC current input and output to the second motor 500 flows through the fourth to sixth power buses 344 to 346.

[0129] <Current Sensor>

[0130] Next, the current sensor applied to the vehicle-mounted system 100 described above will be described.

[0131] The current sensors include a first current sensor 11, a second current sensor 12, and a third current sensor 13. The first current sensor 11 detects the current flowing through the inverter 310. The second current sensor 12 detects the current flowing through the first motor 400. The third current sensor 13 detects the current flowing through the second motor 500.

[0132] The first current sensor 11 is provided on the energizing bus bar 307. As described above, a direct current that inputs and outputs the battery 200 flows through the energizing bus bar 307. The first current sensor 11 detects the direct current.

[0133] The DC current detected by the first current sensor 11 is input to the battery ECU 801. The battery ECU 801 monitors the SOC of the battery 200 based on the DC current detected by the first current sensor 11, the voltage of the battery stack detected by a voltage sensor (not shown), and the like.

[0134] The second current sensor 12 is provided on the first to third energizing bus bars 341 to 343. As described above, the AC current that inputs and outputs the first motor 400 flows through the first to third energizing bus bars 341 to 343. The second current sensor 12 detects the AC current.

[0135] The AC current detected by the second current sensor 12 is input to the MGECU 802. The MGECU 802 performs vector control on the first motor 400 based on the AC current detected by the second current sensor 12, the rotation angle of the first motor 400 detected by a rotation angle sensor (not shown), and the like.

[0136] The third current sensor 13 is provided at the fourth to sixth energizing bus bars 344 to 346. As described above, the AC current that inputs and outputs the second motor 500 flows through the fourth to sixth energizing bus bars 344 to 346. The third current sensor 13 detects the AC current.

[0137] The AC current detected by the third current sensor 13 is input to the MGECU 802. The MGECU 802 performs vector control on the second motor 500 based on the AC current detected by the third current sensor 13, the rotation angle of the second motor 500 detected by a rotation angle sensor (not shown), and the like.

[0138] In addition, the first U-phase stator winding 401, the first V-phase stator winding 402, and the first W-phase stator winding 403 of the first motor 400 are connected in star shape. Similarly, the second U-phase stator winding 501, the second V-phase stator winding 502, and the second W-phase stator winding 503 of the second motor 500 are connected in star shape. Therefore, by detecting the current of two phases among the three-phase stator windings, the current of the remaining one phase can be detected.

[0139] It is also possible to adopt a structure in which the stator windings of these three phases are connected in a delta shape. In this structure, the current of the remaining one phase can be detected by detecting the current of the stator windings of two phases.

[0140] The second current sensor 12 is provided at two of the first to third energizing bus bars 341 to 343 connected to the first U-phase to first W-phase stator windings 401 to 403. More specifically, the second current sensor 12 is provided at the first and second energizing bus bars 341 and 342.

[0141] Therefore, the second current sensor 12 detects the current flowing through the first U-phase stator winding 401 and the current flowing through the first V-phase stator winding 402. Based on these currents flowing through the first U-phase stator winding 401 and the first V-phase stator winding 402, the MGECU 802 detects the current flowing through the first W-phase stator winding 403.

[0142] Similarly, the third current sensor 13 is provided at two of the fourth to sixth energizing bus bars 344 to 346 connected to the second U-phase to second W-phase stator windings 501 to 503. More specifically, the third current sensor 13 is provided at the fourth and fifth energizing bus bars 344 and 345.

[0143] Therefore, the third current sensor 13 detects the current flowing through the second U-phase stator winding 501 and the current flowing through the second V-phase stator winding 502. The MGECU 802 detects the current flowing through the second W-phase stator winding 503 based on the currents flowing through the second U-phase stator winding 501 and the second V-phase stator winding 502.

[0144] The direct current input and output to the battery 200 and the alternating current input and output to the first motor 400 and the second motor 500 correspond to the current to be measured, respectively. The magnetic field generated by the flow of these currents corresponds to the magnetic field to be measured.

[0145] <First current sensor>

[0146] As described above, the first current sensor 11 is provided on the energized bus 307. The energized bus 307 is cut off at the reactor 313 side and the high-side switch 311 (low-side switch 312) side. The first current sensor 11 is provided on the energized bus 307 in a form of bridging the reactor 313 side and the high-side switch 311 side of the cut energized bus 307. As a result, the current flowing through the energized bus 307, that is, the DC current input and output to the battery 200, flows through the first current sensor 11.

[0147] In addition, of course, the structure in which the energized bus 307 is disconnected between the reactor 313 side and the high-side switch 311 side is just an example. For example, when the energized bus 307 is not disconnected and is connected only to the high-side switch 311 side, the first current sensor 11 bridges the reactor 313 and the energized bus 307.

[0148] like Figure 2 to Figure 5 As shown, the first current sensor 11 includes a wiring substrate 20, a conductive bus bar 30, a shield 40, and a sensor case 50. The conductive bus bar 30 bridges the above-mentioned current-carrying bus bar 307. Therefore, a direct current flows through the conductive bus bar 30. The conductive bus bar 30 corresponds to a conductive member.

[0149] Figure 4 Column (a) shows a top view of the first current sensor 11 . Figure 4 Column (b) shows a front view of the first current sensor. Figure 4 Column (c) shows a bottom view of the first current sensor. Figure 5Column (a) shows a front view of the first current sensor 11 . Figure 5 Column (b) shows a side view of the first current sensor. Figure 5 Column (c) shows a rear view of the first current sensor. Figure 4 Column (b) and Figure 5 Column (a) of FIG. 1 represents the same accompanying drawing.

[0150] As clearly shown in these drawings, a part of the conductive bus bar 30 is insert-molded in the sensor housing 50. The wiring substrate 20 and the shield portion 40 are provided in the sensor housing 50. The sensor housing 50 is made of an insulating resin material.

[0151] The wiring substrate 20 is fixed to the sensor housing 50 in a manner opposite to the portion where the conductive busbar 30 is insert-molded in the sensor housing 50. A magnetoelectric converter 25, which will be described later, is mounted on the portion of the wiring substrate 20 opposite to the conductive busbar 30. The magnetoelectric converter 25 converts the magnetic field generated by the direct current flowing through the conductive busbar 30 into an electrical signal.

[0152] The shield 40 includes a first shield 41 and a second shield 42. The first shield 41 and the second shield 42 are fixed to the sensor housing 50 in a mutually separated state. The mutually opposing portions of the wiring substrate 20 and the conductive bus bar 30 are located between the first shield 41 and the second shield 42.

[0153] The first shield 41 and the second shield 42 are made of a material having a higher magnetic permeability than the sensor housing 50. Therefore, electromagnetic noise (external noise) that is about to penetrate from the outside to the inside of the first current sensor 11 actively passes through the first shield 41 and the second shield 42. Thus, input of the external noise to the magneto-electric converter 25 is suppressed.

[0154] In addition, the sensor housing 50 is insert-molded with Figure 4 The connecting terminal 60 is shown. The connecting terminal 60 is electrically and mechanically connected to the wiring substrate 20 through solder 61. The connecting terminal 60 is electrically connected to the battery ECU 801 via a wiring harness or the like. The electrical signal converted by the magnetoelectric converter 25 is input to the battery ECU 801 via the connecting terminal 60 and a wiring harness or the like not shown in the figure.

[0155] Next, the components of the first current sensor 11 are described in detail. Hereinafter, three directions orthogonal to each other are referred to as the x direction, the y direction, and the z direction. The x direction corresponds to the lateral direction. The y direction corresponds to the extension direction.

[0156] <Wiring board>

[0157] like Figure 6As shown, the wiring substrate 20 is in the shape of a flat plate. The wiring substrate 20 is in a flat shape with a relatively thin thickness in the z direction. The wiring substrate 20 is formed by stacking a plurality of insulating resin layers and conductive metal layers in the z direction. The facing surface 20a of the wiring substrate 20 with the largest area and the back surface 20b on the inner side face each other in the z direction. Figure 6 Column (a) shows a top view of the wiring substrate. Figure 6 Column (b) shows a bottom view of the wiring substrate.

[0158] On the facing surface 20a of the wiring substrate 20, there is mounted Figure 6 Column (a) and Figure 7 The first sensor unit 21 and the second sensor unit 22 are shown. The first sensor unit 21 and the second sensor unit 22 respectively have an ASIC 23 and a filter 24. The ASIC 23 and the filter 24 are electrically connected via a wiring pattern of the wiring substrate 20. The wiring pattern is electrically connected to the connection terminal 60. ASIC is an abbreviation of application specific integrated circuit. In addition, a structure in which the first sensor unit 21 and the second sensor unit 22 are mounted on the back side 20b can also be adopted.

[0159] <ASIC>

[0160] ASIC 23 includes a magnetoelectric converter 25, a processing circuit 26, a connection pin 27, and a resin portion 28. The magnetoelectric converter 25 is electrically connected to the processing circuit 26. One end of the connection pin 27 is electrically connected to the processing circuit 26. The other end of the connection pin 27 is electrically and mechanically connected to the wiring substrate 20. One end side of the connection pin 27, the processing circuit 26, and the magnetoelectric converter 25 are covered by the resin portion 28. The other end side of the connection pin 27 is exposed from the resin portion 28.

[0161] The magnetoelectric converter 25 has a magnetoresistive element whose resistance value changes according to the magnetic field (transmitted magnetic field) passing through it. The magnetoresistive element changes its resistance value according to the transmitted magnetic field along the opposing surface 20a. That is, the magnetoresistive element changes its resistance value according to the component along the x direction and the component along the y direction of the transmitted magnetic field.

[0162] On the contrary, the resistance value of the magnetoresistive element does not change according to the magnetic field transmitted in the z direction. Therefore, even if external noise in the z direction transmits through the magnetoresistive element, the resistance value of the magnetoresistive element does not change.

[0163] The magnetoresistance effect element has a pinned layer whose magnetization direction is fixed, a free layer whose magnetization direction changes according to the magnetic field, and a non-magnetic intermediate layer arranged between the two. When the intermediate layer is non-conductive, the magnetoresistance effect element is a giant magnetoresistance element. When the intermediate layer is conductive, the magnetoresistance effect element is a tunnel magnetoresistance element. In addition, the magnetoresistance effect element can be an anisotropic magnetoresistance effect element (AMR). Furthermore, the magnetoelectric conversion unit 25 can also have a Hall element instead of the magnetoresistance effect element.

[0164] The resistance value of the magnetoresistance effect element changes according to the angle between the magnetization directions of the pinned layer and the free layer. The magnetization direction of the pinned layer is along the opposing surface 20a. The magnetization direction of the free layer is determined according to the magnetic field transmitted along the opposing surface 20a. The resistance value of the magnetoresistance effect element is minimum when the magnetization directions of the free layer and the fixed layer are parallel. The resistance value of the magnetoresistance effect element is maximum when the magnetization directions of the free layer and the fixed layer are antiparallel.

[0165] The magnetoelectric conversion unit 25 has a first magnetoresistance effect element 25a and a second magnetoresistance effect element 25b as the above-mentioned magnetoresistance effect elements. The magnetization directions of the pinned layers of the first magnetoresistance effect element 25a and the second magnetoresistance effect element 25b differ by 90°. Therefore, the increase and decrease of the resistance values ​​of the first magnetoresistance effect element 25a and the second magnetoresistance effect element 25b are reversed. If the resistance value of one of the first magnetoresistance effect element 25a and the second magnetoresistance effect element 25b decreases, the resistance value of the other increases by the same amount.

[0166] The magnetoelectric converter 25 includes two first magnetoresistance effect elements 25a and two second magnetoresistance effect elements 25b. The first magnetoresistance effect element 25a and the second magnetoresistance effect element 25b are sequentially connected in series from the power supply potential to the reference potential to form a first half-bridge circuit. The second magnetoresistance effect element 25b and the first magnetoresistance effect element 25a are sequentially connected in series from the power supply potential to the reference potential to form a second half-bridge circuit.

[0167] In this way, the arrangement of the first magnetoresistance effect element 25a and the second magnetoresistance effect element 25b in the two half-bridge circuits is reversed. Therefore, the midpoint potential of the two half-bridge circuits becomes a structure in which the potential of the other increases when the potential of one decreases. In the magnetoelectric conversion unit 25, these two half-bridge circuits are combined to form a full-bridge circuit.

[0168] The magnetoelectric conversion unit 25 includes a differential amplifier 25c, a feedback coil 25d, and a shunt resistor 25e in addition to the magnetoresistive effect element constituting the full-bridge circuit. The midpoint potential of the two half-bridge circuits is input to the inverting input terminal and the non-inverting input terminal of the differential amplifier 25c. The feedback coil 25d and the shunt resistor 25e are connected in series in sequence from the output terminal of the differential amplifier 25c toward the reference potential.

[0169] By the connection structure shown above, an output corresponding to the change in the resistance value of the first magnetoresistance effect element 25a and the second magnetoresistance effect element 25b constituting the full bridge circuit is obtained from the output terminal of the differential amplifier 25c. The magnetic field along the opposing surface 20a passes through the magnetoresistance effect element, thereby causing the change in the resistance value. The magnetic field (magnetic field to be measured) generated by the current flowing through the conductive bus 30 passes through the magnetoresistance effect element. Therefore, a current corresponding to the magnetic field to be measured flows to the input terminal of the differential amplifier 25c.

[0170] The input terminal and output terminal of the differential amplifier 25c are connected via a feedback circuit (not shown). Therefore, the differential amplifier 25c is virtual short. Therefore, the differential amplifier 25c operates in a manner that the inverting input terminal and the non-inverting input terminal have the same potential. That is, the differential amplifier 25c operates in a manner that the current flowing to the input terminal and the current flowing to the output terminal become zero. As a result, a current (feedback current) corresponding to the magnetic field to be measured flows from the output terminal of the differential amplifier 25c.

[0171] The feedback current flows between the output terminal of the differential amplifier 25c and the reference potential via the feedback coil 25d and the shunt resistor 25e. The flow of the feedback current generates a canceling magnetic field in the feedback coil 25d. The canceling magnetic field passes through the magnetoelectric converter 25. As a result, the measured magnetic field passing through the magnetoelectric converter 25 is canceled. As a result, the magnetoelectric converter 25 operates in a manner that the measured magnetic field passing through itself is balanced with the canceling magnetic field.

[0172] A feedback voltage corresponding to the amount of the feedback current that generates the canceling magnetic field is generated at the midpoint between the feedback coil 25d and the shunt resistor 25e. The feedback voltage is output to the subsequent processing circuit 26 as an electrical signal obtained by detecting the measured current.

[0173] The processing circuit 26 includes an adjustment amplifier 26a and a threshold power supply 26b. The midpoint between the feedback coil 25d and the shunt resistor 25e is connected to the non-inverting input terminal of the adjustment amplifier 26a. The threshold power supply 26b is connected to the inverting input terminal of the adjustment amplifier 26a. Thus, the differentially amplified feedback voltage is output from the adjustment amplifier 26a.

[0174] The resistance values ​​of the first magnetoresistance effect element 25a and the second magnetoresistance effect element 25b constituting the full bridge circuit each have a property of being temperature-dependent. Therefore, the output of the adjustment amplifier 26a changes according to the temperature change. Therefore, the processing circuit 26 has a temperature detection element not shown in the figure, a non-volatile memory storing the relationship between the temperature and the resistance value of the magnetoresistance effect element, etc. The non-volatile memory can be rewritten electrically. By rewriting the value stored in the non-volatile memory, the gain and offset of the adjustment amplifier 26a are adjusted. As a result, the change in the output of the adjustment amplifier 26a caused by the temperature change is eliminated.

[0175] <Filter>

[0176] The filter 24 has a resistor 24a and a capacitor 24b. Figure 7 As shown, in the wiring substrate 20, a power supply wiring 20c, a first output wiring 20d, a second output wiring 20e, and a ground wiring 20f are formed as a wiring pattern.

[0177] The ASIC 23 of the first sensor unit 21 is connected to the power supply wiring 20c, the first output wiring 20d, and the ground wiring 20f, respectively. The output terminal of the adjustment amplifier 26a of the ASIC 23 of the first sensor unit 21 is connected to the first output wiring 20d.

[0178] The resistor 24a of the filter 24 of the first sensor unit 21 is provided on the first output wiring 20d. The capacitor 24b connects the first output wiring 20d and the ground wiring 20f. Thus, the filter 24 of the first sensor unit 21 forms a low-pass filter through the resistor 24a and the capacitor 24b. The output of the ASIC 23 of the first sensor unit 21 is output to the battery ECU 801 via the low-pass filter. Therefore, the output of the first sensor unit 21 after the high-frequency noise is removed is input to the battery ECU 801.

[0179] The ASIC 23 of the second sensor unit 22 is connected to the power supply wiring 20c, the second output wiring 20e, and the ground wiring 20f, respectively. The output terminal of the adjustment amplifier 26a of the ASIC 23 of the first sensor unit 21 is connected to the second output wiring 20e.

[0180] The resistor 24a of the filter 24 of the second sensor unit 22 is provided on the second output wiring 20e. The capacitor 24b connects the second output wiring 20e and the ground wiring 20f. Thus, the filter 24 of the second sensor unit 22 forms a low-pass filter through the resistor 24a and the capacitor 24b. The output of the ASIC 23 of the second sensor unit 22 is output to the battery ECU 801 via the low-pass filter. Thus, the output of the second sensor unit 22 after the high-frequency noise is removed is input to the battery ECU 801.

[0181] As shown above, the first sensor section 21 and the second sensor section 22 of this embodiment have the same structure. The magnetoelectric converters 25 of the first sensor section 21 and the second sensor section 22 are arranged in the y direction. As described in detail later, the magnetic fields passing through the magnetoelectric converters 25 of the first sensor section 21 and the second sensor section 22 are the same.

[0182] Therefore, the electric signal input from the first sensor unit 21 to the battery ECU 801 is the same as the electric signal input from the second sensor unit 22 to the battery ECU 801. The battery ECU 801 compares the two input electric signals to determine whether an abnormality has occurred in one of the first sensor unit 21 and the second sensor unit 22. In this way, the first current sensor 11 of the present embodiment has redundancy.

[0183] The shunt resistor 25e may be provided in or outside the resin portion 28. When provided outside the resin portion 28, the shunt resistor 25e is mounted on the wiring substrate 20. The shunt resistor 25e is externally connected to the ASIC 23.

[0184] In addition, each of the four resistors constituting the full-bridge circuit may not be a magnetoresistive element. At least one of the four resistors may be a magnetoresistive element. Instead of constituting a full-bridge circuit, only one half-bridge circuit may be constituted.

[0185] When the above-mentioned redundancy is not necessary, the first current sensor 11 may also be configured to include one of the first sensor unit 21 and the second sensor unit 22 .

[0186] <Conductive busbar>

[0187] The conductive busbar 30 is made of a conductive material such as copper, brass, and aluminum. The conductive busbar 30 can be manufactured by, for example, the following methods. The conductive busbar 30 can be manufactured by stamping a flat plate. The conductive busbar 30 can be manufactured by integrally connecting a plurality of flat plates. The conductive busbar 30 can be manufactured by welding a plurality of flat plates. The conductive busbar 30 can be manufactured by pouring a conductive material in a molten state into a mold. The manufacturing method of the conductive busbar 30 is not particularly limited.

[0188] like Figure 8 As shown in FIG. 1 , the conductive bus bar 30 is in a flat shape with a relatively thin thickness in the z direction. The surface 30a and the inner surface 30b of the conductive bus bar 30 face each other in the z direction. Figure 8 Column (a) shows a top view of the conductive busbar. Figure 8 Column (b) shows a side view of the conductive busbar.

[0189] The conductive busbar 30 extends along the y direction. Figure 8, as shown by two dotted lines, the conductive busbar 30 includes a cover portion 31 covered by the sensor housing 50, and a first exposed portion 32 and a second exposed portion 33 exposed from the sensor housing 50. The first exposed portion 32 and the second exposed portion 33 are arranged in the y direction with the cover portion 31 interposed therebetween. The first exposed portion 32 and the second exposed portion 33 are integrally connected via the cover portion 31.

[0190] like Figure 8 As shown in column (b), the lengths (thicknesses) in the z direction of the covering portion 31, the first exposed portion 32, and the second exposed portion 33 are equal. That is, the distances in the z direction between the surface 30a and the back surface 30b of the covering portion 31, the first exposed portion 32, and the second exposed portion 33 are equal.

[0191] Bolt holes 30c for passing bolts to electrically and mechanically connect to the current-carrying busbar 307 are formed in the first exposed portion 32 and the second exposed portion 33. The bolt holes 30c penetrate the front surface 30a and the back surface 30b.

[0192] As described above, the energizing bus bar 307 is divided at the reactor 313 side and the high-side switch 311 side. The energizing bus bar 307 at the reactor 313 side and the high-side switch 311 side has mounting holes corresponding to the bolt holes 30c.

[0193] The mounting hole on the reactor 313 side of the energized busbar 307 and the bolt hole 30c of the first exposed portion 32 are arranged in the z direction. The mounting hole on the high-side switch 311 side of the energized busbar 307 and the bolt hole 30c of the second exposed portion 33 are arranged in the z direction. In this state, the shaft of the bolt is passed through the bolt hole 30c and the mounting hole. And, the nut is tightened from the front end of the shaft of the bolt toward the head. The energized busbar 307 and the conductive busbar 30 are clamped by the head and nut of the bolt. As a result, the energized busbar 307 and the conductive busbar 30 are brought into contact, and the two are electrically and mechanically connected. As a result, the reactor 313 side and the high-side switch 311 side of the energized busbar 307 that have been cut off are bridged by the conductive busbar 30. A common current flows through the energized busbar 307 and the conductive busbar 30.

[0194] like Figure 8As shown in column (a), a narrow portion 31a having a locally shorter length in the x-direction is formed in the covering portion 31. The length of the narrow portion 31a in the x-direction of the present embodiment is shortened in stages. The length of the narrow portion 31a in the x-direction shortens in two stages as it moves from the first exposed portion 32 side of the covering portion 31 toward the center point CP of the covering portion 31 in the y-direction. Similarly, the length of the narrow portion 31a in the x-direction shortens in two stages as it moves from the second exposed portion 33 side of the covering portion 31 toward the center point CP of the covering portion 31 in the y-direction. In addition, the length of the narrow portion 31a in the x-direction may shorten in more stages or may shorten continuously.

[0195] The above-mentioned center point CP is the same as the center of gravity of the covering portion 31. The covering portion 31 and the narrowed portion 31a are formed into line-symmetrical shapes with a center line passing through the center point CP in the z direction as a symmetry axis AS.

[0196] The length of the narrow portion 31a in the x direction is shorter than that of the first exposed portion 32 and the second exposed portion 33. Therefore, the density of the current flowing through the narrow portion 31a is greater than the density of the current flowing through the first exposed portion 32 and the second exposed portion 33. As a result, the intensity of the magnetic field to be measured generated by the current flowing through the narrow portion 31a becomes higher.

[0197] exist Figure 8 In each of the columns (a) and (b) of FIG. 1 , as shown by schematically enclosing the magnetoelectric converters 25 of the first sensing section 21 and the second sensing section 22 with dotted lines, the first sensing section 21 and the second sensing section 22 are disposed opposite to the narrow portion 31a and separated in the z direction. Therefore, the high-intensity magnetic field to be measured generated by the current flowing through the narrow portion 31a passes through each of the first sensing section 21 and the second sensing section 22.

[0198] As described above, the conductive busbar 30 extends in the y direction. Therefore, a current flows in the y direction through the conductive busbar 30. Due to the flow of the current in the y direction, a magnetic field to be measured in accordance with Ampere's law is generated in the circumferential direction around the y direction. The magnetic field to be measured flows in a ring shape with the conductive busbar 30 as the center in a plane defined by the x direction and the z direction. The first sensor unit 21 and the second sensor unit 22 detect the component of the magnetic field to be measured along the x direction.

[0199] like Figure 8 As shown by the middle dotted line, the magnetoelectric converters 25 of the first sensor 21 and the second sensor 22 are arranged in the y direction. The two magnetoelectric converters 25 are symmetrically arranged with the symmetry axis AS between them. The positions of the two magnetoelectric converters 25 in the x direction are the same as the positions of the symmetry axis AS (center point CP) in the x direction. Therefore, the two magnetoelectric converters 25 are arranged in the y direction with the center point CP between them.

[0200] The two magnetoelectric converters 25 and the cover 31 are spaced at the same distance in the z direction. As described above, the cover 31 and the narrow portion 31a are line-symmetrical about the symmetry axis AS. Thus, the magnetic field to be measured with equal components in the x direction passes through the two magnetoelectric converters 25.

[0201] In addition, the conductive busbar 30 of the present embodiment is manufactured by stamping a conductive flat plate. In the stamping process, the flat plate is placed in a die, and a punch is brought close to the die to apply tension to the flat plate. In this way, the flat plate is separated into the conductive busbar 30 and chips, thereby manufacturing the conductive busbar 30.

[0202] When the conductive busbar 30 is manufactured by the above-mentioned punching process, a shear surface is formed in the conductive busbar 30. Collapse occurs in the shear surface on the side of the surface that first contacts the punch in the conductive busbar 30. As a result, the right angle of the shear surface may be impaired. As a result, the distribution of the measured magnetic field generated by the current flowing through the conductive busbar 30 may deviate from the design.

[0203] The conductive busbar 30 of the present embodiment is not disposed on the wiring substrate 20 side on the surface that is initially in contact with the punch, but on the surface that is finally separated by the punch. That is, the surface that is initially in contact with the punch is the inner surface 30b, and the surface that is finally separated by the punch is the surface 30a. The shear surface corresponds to the side surface between the surface 30a and the inner surface 30b. Therefore, the right angle of the surface 30a side of the side surface of the conductive busbar 30 is not easily damaged. The surface 30a of the conductive busbar 30 is opposite to the wiring substrate 20. Therefore, the distribution of the measured magnetic field through the first sensor unit 21 and the second sensor unit 22 mounted on the wiring substrate 20 is suppressed from deviating from the design.

[0204] In addition, after the conductive busbar 30 is manufactured by stamping as described above, it is necessary to distinguish whether the edge collapse occurs on one of the surface 30a side and the back surface 30b side of the side surface. A notch 33a for distinguishing this is formed as a mark on the second exposed portion 33 of the conductive busbar 30. The notch 33a of this embodiment is semicircular.

[0205] <Shielding part>

[0206] As described above, the shielding portion 40 includes the first shielding portion 41 and the second shielding portion 42. Fig. 9 and Fig.10 As shown, the first shielding part 41 and the second shielding part 42 are both in the shape of plates with a relatively thin thickness in the z direction. The largest surface 41a of the first shielding part 41 and its inner surface 41b face each other in the z direction. The largest surface 42a of the second shielding part 42 and its inner surface 42b face each other in the z direction.

[0207] like Figure 2 and Figure 3 As shown in FIG. 1 , the first shielding portion 41 and the second shielding portion 42 are provided in the sensor housing 50 in a form in which one surface 41a and one surface 42a are opposed to each other in the z direction. The inner surface 41b of the first shielding portion 41 and the inner surface 42b of the second shielding portion 42 are respectively exposed to the outside of the sensor housing 50. The inner surface 41b and the inner surface 42b respectively constitute a part of the outermost surface of the first current sensor 11.

[0208] Fig. 9 Column (a) shows a top view of the first shielding portion. Fig. 9 Column (b) shows a bottom view of the first shielding portion. Fig.10 Column (a) shows a top view of the second shielding portion. Fig.10 Column (b) shows a bottom view of the second shielding portion.

[0209] The first shield portion 41 and the second shield portion 42 can be manufactured by press-bonding a plurality of flat plates made of a soft magnetic material with high magnetic permeability such as permalloy. Alternatively, the first shield portion 41 and the second shield portion 42 can be manufactured by rolling electromagnetic steel.

[0210] The first shielding part 41 and the second shielding part 42 of the present embodiment are respectively manufactured by crimping a plurality of flat plates made of soft magnetic material. Four convex parts protruding from the main surface toward the inside are formed in each of the plurality of flat plates. Correspondingly, four concave parts recessed from the inside toward the main surface are formed in each of the plurality of flat plates. These plurality of flat plates are respectively arranged in a manner that the main surface and the inside face are opposed to each other. And, the plurality of flat plates are stacked in a manner that the concave part of one of the two opposing flat plates enters the convex part of the other. The plurality of flat plates are crimped in this stacked state. Thus, the first shielding part 41 and the second shielding part 42 are manufactured.

[0211] In addition, when the first shielding part 41 and the second shielding part 42 are manufactured by rolling the electromagnetic steel, the direction in which the electromagnetic steel is stretched by the rolling is set to, for example, the x direction. As a result, the atomic arrangement (crystallization) of the electromagnetic steel is arranged in the x direction. As a result, the magnetic permeability in the x direction is improved compared to the y direction. By determining the rolling direction of the electromagnetic steel in this way, the magnetic permeability of the shielding part can be anisotropic.

[0212] <First shielding part>

[0213] The planar shape of the first shielding portion 41 is as follows: Fig. 9 As shown in FIG. 1 , the first shielding portion 41 is in a rectangular shape with the x direction as the long side direction. In addition, notches 41c are formed at the four corners of the first shielding portion 41 of the present embodiment. Fig. 9In order to make the boundary between the center and both ends of the first shielding portion 41 in the y direction clear, two imaginary lines extending in the x direction are given to the first shielding portion 41. Hereinafter, the center of the first shielding portion 41 in the y direction is represented as the first central portion 41d. The both ends of the first shielding portion 41 in the y direction are represented as the first end portions 41e. The first central portion 41d is located between the two ends of the first end portions 41e in the y direction.

[0214] As indicated by the dotted lines, the length of the first two ends 41e in the x direction is shorter than that of the first central portion 41d. Therefore, the magnetic permeability of the first two ends 41e in the x direction becomes lower than that of the first central portion 41d. The magnetic field is not easy to penetrate into the first two ends 41e. Therefore, the situation in which the magnetic field penetrates from one of the two ends of the first two ends 41e to the other through the portion (parallel portion) in the first central portion 41d that is directly connected to the first two ends 41e and arranged in the y direction is suppressed. The magnetic field is not easy to penetrate in the parallel portion of the first central portion 41d. As a result, the parallel portion of the first central portion 41d is not easy to be magnetically saturated.

[0215] The parallel portion of the first central portion 41d where magnetic saturation is suppressed is aligned in the z direction with the first sensor portion 21 and the second sensor portion 22 mounted on the wiring substrate 20. The magnetoelectric converter 25 of each of the first sensor portion 21 and the second sensor portion 22 is located between the first central portion 41d and the narrow portion 31a.

[0216] <Second shielding section>

[0217] The planar shape of the second shielding portion 42 is as follows: Fig.10 As shown, it is a rectangle with the x direction as the long side direction. Fig.10 In order to clearly define the boundary between the center and both ends of the second shielding portion 42 in the y direction, two imaginary lines extending in the x direction are given to the second shielding portion 42. Hereinafter, the center of the second shielding portion 42 in the y direction is represented as a second central portion 42d. Both ends of the second shielding portion 42 in the y direction are represented as second end portions 42e. The second central portion 42d is located between the two ends of the second end portions 42e in the y direction.

[0218] The second shielding portion 42 has two end sides 42f arranged in the x direction. On the second central portion 42d side of the two end sides 42f, an extended portion 42c extending in the z direction is formed. The two extended portions 42c extend in the z direction from the back surface 42b toward the one surface 42a. The extended portion 42c is a rectangular parallelepiped with the y direction as the long side direction. The extended portion 42c is formed by bending after crimping a plurality of flat plates made of soft magnetic material when manufacturing the second shielding portion 42 as described above.

[0219] As described above, the first shielding portion 41 and the second shielding portion 42 are provided in the sensor housing 50 in a form in which the one surface 41a of the first shielding portion 41 and the one surface 42a of the second shielding portion 42 are opposed to each other in the z direction. In the state provided in the sensor housing 50, the extended portion 42c extends toward the first shielding portion 41. The end surface of the extended portion 42c is opposed to the one surface 41a of the first central portion 41d of the first shielding portion 41 in the z direction.

[0220] Thus, the distance in the z direction between the first central portion 41d of the first shield portion 41 and the extended portion 42c of the second shield portion 42 is shorter than the distance in the z direction between the one surface 41a of the first shield portion 41 and the one surface 42a of the second shield portion 42. Therefore, the magnetic field that has entered the first shield portion 41 is likely to pass through the second shield portion 42 via the extended portion 42c.

[0221] As described above, the extended portion 42c extends from the second central portion 42d side of the end side 42f in the z direction. The extended portion 42c is not formed on the second end portions 42e side of the end side 42f. Therefore, the magnetic field intruding into the first shielding portion 41 is likely to pass through the second central portion 42d of the second shielding portion 42 via the extended portion 42c.

[0222] The second central portion 42d faces the first sensor portion 21 and the second sensor portion 22 mounted on the wiring substrate 20 in the z direction. The magnetoelectric converter 25 and the narrow portion 31a of each of the first sensor portion 21 and the second sensor portion 22 are located between the first central portion 41d and the second central portion 42d.

[0223] In addition, the position of the magnetoelectric converter 25 in the x direction is between the two extended portions 42c formed on the two end sides 42f. Therefore, when external noise along the x direction is about to pass through the area between the one surface 41a of the first shielding portion 41 and the one surface 42a of the second shielding portion 42 where the magnetoelectric converter 25 is located, the external noise is about to invade the extended portion 42c instead of the magnetoelectric converter 25. The external noise invading the extended portion 42c is bent in the direction of passing through the second shielding portion 42. As a result, the situation in which the external noise passes through the magnetoelectric converter 25 is suppressed.

[0224] <Sensor housing>

[0225] like Figure 3 and Fig.11 As shown, the conductive busbar 30 and the connection terminal 60 are insert-molded in the sensor housing 50. In addition, the wiring substrate 20 and the shielding part 40 are provided in the sensor housing 50. The conductive busbar 30, the wiring substrate 20 and the shielding part 40 are arranged separately in the z direction. Fig.11Column (a) shows a top view of the sensor housing. Fig.11 Column (b) shows a bottom view of the sensor housing.

[0226] like Figure 5 and Fig.11 As shown, the sensor housing 50 includes a base portion 51 , an insulating portion 52 , a first surrounding portion 53 , a second surrounding portion 54 , and a connector portion 55 .

[0227] The base 51 is a rectangular parallelepiped with the x direction as the long side direction. Therefore, the base 51 has 6 faces. The base 51 has a left face 51a and a right face 51b facing each other in the y direction. The base 51 has an upper surface 51c and a lower surface 51d facing each other in the x direction. The base 51 has an upper end face 51e and a lower end face 51f facing each other in the z direction.

[0228] like Figure 5 Column (a) and Figure 5 As shown in the column (c) of FIG. 5 , the insulating portion 52 is formed on a portion of each of the left surface 51a and the right surface 51b of the base 51. The two insulating portions 52 extend in the y direction away from the base 51. The two insulating portions 52 are arranged in the y direction across the base 51. The covering portion 31 of the conductive busbar 30 is covered by the two insulating portions 52 and the base 51, respectively.

[0229] In general, the first exposed portion 32 side and the second exposed portion 33 side of the cover portion 31 are covered by two insulating portions 52. The narrow portion 31a of the cover portion 31 is covered by the base portion 51. Therefore, the narrow portion 31a is located between the upper end surface 51e and the lower end surface 51f of the base portion 51 in the z direction. The insulating resin material constituting the base portion 51 is located between the narrow portion 31a and the upper end surface 51e, and between the narrow portion 31a and the lower end surface 51f.

[0230] like Fig.11 As shown in the column (a) of FIG. 5 , the first surrounding portion 53 is formed on the upper end surface 51e of the base portion 51. The first surrounding portion 53 has a left wall 53a and a right wall 53b arranged in the y direction. The first surrounding portion 53 has an upper wall 53c and a lower wall 53d arranged in the x direction.

[0231] These walls constituting the first enclosure 53 are formed along the edge of the upper end surface 51e. In the circumferential direction around the z direction, the left wall 53a, the upper wall 53c, the right wall 53b and the lower wall 53d are connected in sequence. Thus, the first enclosure 53 is in a ring shape that is open in the z direction. The upper end surface 51e is surrounded by the first enclosure 53. The wiring substrate 20 and the first shielding portion 41 are provided in the first storage space formed by the first enclosure 53 and the upper end surface 51e.

[0232] like Fig.11As shown in the column (b) of FIG. 5 , the second surrounding portion 54 is formed on the lower end surface 51f of the base portion 51. The second surrounding portion 54 has a left wall 54a and a right wall 54b arranged in the y direction. The second surrounding portion 54 has an upper wall 54c and a lower wall 54d arranged in the x direction.

[0233] These walls constituting the second surrounding portion 54 are formed around the portion of the base 51 in the lower end surface 51f that is parallel to the narrow portion 31a in the z direction. In the circumferential direction around the z direction, the left wall 54a, the upper wall 54c, the right wall 54b and the lower wall 54d are connected in sequence. Thus, the second surrounding portion 54 is annular and open in the z direction. A part of the lower end surface 51f is surrounded by the second surrounding portion 54. The second shielding portion 42 is provided in the second storage space constituted by the second surrounding portion 54 and the lower end surface 51f.

[0234] The second storage space is smaller in size than the first storage space in a plane perpendicular to the z direction. The second storage space is aligned with a portion of the first storage space in the z direction. The portion of the first storage space that is not aligned with the second storage space in the z direction is aligned with the connector portion 55 in the z direction.

[0235] like Figure 5 Column (b) and Fig.11 As shown in column (b) of FIG. 5 , the connector portion 55 is formed on the lower end surface 51f of the base portion 51. The connector portion 55 extends in the z direction away from a portion (non-enclosed portion) of the lower end surface 51f that is not surrounded by the second enclosing portion 54. The connector portion 55 constitutes a portion of the lower wall 54d.

[0236] The connector portion 55 includes a column portion 55a extending from the lower end surface 51f in the z direction and a surrounding portion 55c surrounding the front end surface 55b of the column portion 55a in the circumferential direction around the z direction. The connection terminal 60 extends in the z direction. The connection terminal 60 is covered by the column portion 55a and a portion of the base 51 that is aligned with the column portion 55a in the z direction.

[0237] One end of the connection terminal 60 is exposed from the front end face 55b to the outside of the column part 55a. The one end of the connection terminal 60 exposed from the front end face 55b is surrounded by the surrounding part 55c. Thus, the connector includes the surrounding part 55c and one end of the connection terminal 60. The connector is connected to a connector such as a wiring harness.

[0238] The other end of the connection terminal 60 is exposed from the upper end surface 51e to the outside of the base 51. The other end of the connection terminal 60 is provided in the first storage space. The connection terminal 60 is separated from the portion (narrow portion 31a) of the conductive busbar 30 covered by the base 51 in the x direction. The other end of the connection terminal 60 is located on the lower wall 53d side in the x direction. The narrow portion 31a is located on the upper wall 53c side. The insulating resin material constituting the base 51 is located between the portions of the connection terminal 60 and the narrow portion 31a that are insert-molded with the sensor housing 50.

[0239] As described above, the direct current input and output to the battery 200 flows through the conductive bus bar 30. In addition, in the connection terminal 60, an electric signal with a current smaller than the direct current flows between the wiring substrate 20 and the battery ECU 801. If the creepage distance between the conductive bus bar 30 and the connection terminal 60 is short, there is a concern that the two will be conductive and short-circuited.

[0240] The rib 52a for suppressing the occurrence of such a problem is formed on the insulating portion 52. The rib 52a protrudes from the insulating portion 52 in the z direction. The rib 52a extends in the x direction. The length of the rib 52a in the x direction is longer than the length of each of the first exposed portion 32 and the second exposed portion 33 in the x direction.

[0241] The rib 52a is located between the first exposed portion 32 and the second exposed portion 33 of the conductive bus bar 30 located outside the insulating portion 52, and the other end of the connecting terminal 60 exposed to the outside from the upper end surface 51e. The rib 52a increases the creepage distance between the conductive bus bar 30 and the connecting terminal 60 on the surface of the sensor housing 50. As a result, a short circuit between the conductive bus bar 30 and the connecting terminal 60 is suppressed.

[0242] Furthermore, the rib 52a is located between the first exposed portion 32 and the second exposed portion 33 and the first shield portion 41 and the second shield portion 42. This also suppresses short circuits between the conductive bus bar 30 and the shield portion 40.

[0243] The ribs 52a extend the creeping distance, thereby shortening the length of the insulating portion 52 in the y direction. The length of the insulating portion 52 in the y direction can be shortened by approximately 85%. This prevents the volume of the first current sensor 11 from increasing.

[0244] <How the wiring board is fixed to the sensor housing>

[0245] like Fig.11 Column (a) and Fig.12 As shown in the column (a) of FIG. 5 , substrate support pins 56a and substrate bonding pins 56b partially extending in the z direction are formed on the upper end surface 51e of the base 51. A plurality of substrate support pins 56a and substrate bonding pins 56b are formed on the upper end surface 51e. Fig.12Column (a) shows a perspective view of the sensor housing. Fig.12 Column (b) shows a perspective view of a sensor housing provided with a wiring substrate. Fig.12 In order to illustrate these pins, some of the markings are omitted.

[0246] The plurality of substrate support pins 56a each have a front end surface 56c facing the z direction. The positions of the plurality of front end surfaces 56c in the z direction are equal. Similarly, the plurality of substrate bonding pins 56b each have a front end surface 56d facing the z direction. The positions of the plurality of front end surfaces 56d in the z direction are equal.

[0247] like Fig.13 As shown, the length in the z direction between the front end surface 56c of the substrate support pin 56a and the upper end surface 51e is L1. The length in the z direction between the front end surface 56d of the substrate bonding pin 56b and the upper end surface 51e is L2. As shown in the figure, the length L1 is longer than the length L2.

[0248] Therefore, the front end surface 56c of the substrate support pin 56a is away from the upper end surface 51e in the z direction compared with the front end surface 56d of the substrate bonding pin 56b. The wiring substrate 20 is mounted on the sensor housing 50 in a state where the facing surface 20a is in contact with the front end surface 56c of the substrate support pin 56a. The substrate support pin 56a is equivalent to the substrate support portion. The front end surface 56c is equivalent to the support surface.

[0249] In the state of being mounted on the front end surface 56c of the substrate support pin 56a, the facing surface 20a of the wiring substrate 20 and the front end surface 56d of the substrate bonding pin 56b are separated in the z direction. Between the wiring substrate 20 and the substrate bonding pin 56b, a substrate adhesive 56e is provided to bond and fix the two. The substrate bonding pin 56b is equivalent to the substrate bonding portion. The front end surface 56d is equivalent to the mounting surface.

[0250] When the wiring substrate 20 and the sensor housing 50 are bonded and fixed by the substrate adhesive 56e, the temperature of the substrate adhesive 56e is set higher than the ambient temperature of the first current sensor 11. The temperature of the substrate adhesive 56e at this time can be set to, for example, about 150°C. At this temperature, the substrate adhesive 56e has fluidity. As the substrate adhesive 56e, a silicone adhesive can be used.

[0251] A substrate adhesive 56e having fluidity at about 150° C. is applied to the front end surface 56d of the substrate adhesive pin 56b. Then, the wiring substrate 20 is set in the sensor housing 50 in such a manner that the front end surface 56c of the substrate support pin 56a and the substrate adhesive 56e are in contact with the facing surface 20a of the wiring substrate 20. Thereafter, the substrate adhesive 56e is cooled to room temperature and cured.

[0252] As a result, residual stress that gathers toward the center of the substrate adhesive 56e is generated in the ambient temperature where the first current sensor 11 is installed. Due to this residual stress, the wiring substrate 20 and the substrate adhesive pin 56b are brought into a state of being close to each other. The contact state between the facing surface 20a of the wiring substrate 20 and the front end surface 56c of the substrate support pin 56a is maintained.

[0253] As a result, the positional deviation of the wiring substrate 20 relative to the sensor housing 50 no longer depends on the shape deviation of the substrate adhesive 56e having fluidity during bonding and fixing. The positional deviation of the wiring substrate 20 relative to the sensor housing 50 becomes a manufacturing error of the sensor housing 50. In other words, the positional deviation of the wiring substrate 20 relative to the conductive busbar 30 insert-molded in the sensor housing 50 becomes a manufacturing error of the sensor housing 50.

[0254] In this embodiment, three substrate support pins 56a are formed on the upper end surface 51e. Two of the three substrate support pins 56a are arranged apart in the y direction. The remaining substrate support pin 56a is separated from the midpoint between the two substrate support pins 56a arranged in the y direction in the x direction. The front end surfaces 56c of the three substrate support pins 56a form the vertices of an isosceles triangle. The narrow portion 31a of the conductive busbar 30 is located between the two substrate support pins 56a arranged in the y direction and the remaining substrate support pin 56a.

[0255] In this embodiment, three substrate bonding pins 56b are formed on the upper end surface 51e. Two of the three substrate bonding pins 56b are arranged apart in the y direction. The remaining substrate bonding pin 56b is separated from the midpoint between the two substrate support pins 56a arranged in the y direction in the x direction. The front end surfaces 56d of the three substrate bonding pins 56b form the vertices of an isosceles triangle.

[0256] The other ends of the plurality of connection terminals 60 are arranged between the two substrate support pins 56a arranged in the y direction. The remaining one substrate support pin 56a is located at the midpoint between the two substrate bonding pins 56b arranged in the y direction. Therefore, the remaining one substrate support pin 56a and the remaining one substrate bonding pin 56b are arranged in the x direction. In addition, the center point CP of the narrow portion 31a is located between the remaining one substrate support pin 56a and the remaining one substrate bonding pin 56b in the x direction.

[0257] With the above-described structure, an isosceles triangle formed by connecting the front end faces 56c of the three substrate support pins 56a and an isosceles triangle formed by connecting the front end faces 56d of the three substrate bonding pins 56b overlap in the z direction. Furthermore, the center point CP of the narrow portion 31a is located in the region where the two isosceles triangles overlap in the z direction.

[0258] The wiring substrate 20 is provided in the sensor housing 50 in a form that is opposed to the two isosceles triangles in the z direction. The portion of the wiring substrate 20 that is opposed to the two isosceles triangles is in contact with the substrate support pin 56a and is connected to the substrate bonding pin 56b via the substrate adhesive 56e, so that the connection with the sensor housing 50 is more stable than that of the portion that is not opposed to the two isosceles triangles. The first sensor unit 21 and the second sensor unit 22 are mounted at the portion of the wiring substrate 20 that is stably connected to the sensor housing 50.

[0259] When the wiring substrate 20 is mounted on the substrate support pins 56a and fixed to the substrate adhesive pins 56b via the substrate adhesive 56e, the facing surface 20a of the wiring substrate 20 and the upper end surface 51e of the base 51 are spaced apart in the z direction and face each other. In the absence of any manufacturing error, the distance between the facing surface 20a and the upper end surface 51e is constant over the entire surface, and the two are in a parallel relationship.

[0260] As described above, the narrow portion 31a of the conductive busbar 30 is insert-molded in the base 51. When there is no manufacturing error, the distance between the surface 30a of the narrow portion 31a and the upper end surface 51e of the base 51 is constant over the entire surface, and the two are parallel.

[0261] According to the parallel relationship described above, when there is no manufacturing error, the distance between the facing surface 20a of the wiring substrate 20 and the surface 30a of the narrowed portion 31a is constant over the entire surface, and the two are in a parallel relationship.

[0262] In addition, as described above, the wiring substrate 20 is formed by stacking a plurality of resin layers and metal layers in the z direction. Therefore, the manufacturing error of the thickness of the wiring substrate 20 in the z direction becomes large. The manufacturing error of the thickness of the wiring substrate 20 in the z direction is about twice the manufacturing error of the position in the z direction caused by insert molding of the conductive busbar 30 into the sensor housing 50 and the arrangement error of the wiring substrate 20 in the z direction relative to the sensor housing 50.

[0263] In this regard, as described above, the first sensor portion 21 and the second sensor portion 22 are provided on the opposing surface 20a of the wiring substrate 20 that is opposed to the conductive bus bar 30. Therefore, the distances in the z direction between the first sensor portion 21 and the second sensor portion 22 and the conductive bus bar 30 no longer depend on the thickness in the z direction of the wiring substrate 20. The variation in the distances in the z direction between the first sensor portion 21 and the second sensor portion 22 and the conductive bus bar 30 due to the manufacturing error in the thickness in the z direction of the wiring substrate 20 is suppressed.

[0264] The number of substrate support pins 56a and substrate bonding pins 56b is not limited to 3. The number of substrate support pins 56a may be 4 or more, and the number of substrate bonding pins 56b may be 1, 2, or 4 or more.

[0265] In addition, when the number of substrate support pins 56a and substrate bonding pins 56b is three or more, a polygon formed by connecting the front end surfaces 56c of three or more substrate support pins 56a and a polygon formed by connecting the front end surfaces 56d of three or more substrate bonding pins 56b may overlap in the z direction. In this structure, the first sensor unit 21 and the second sensor unit 22 can be mounted in the area of ​​the wiring substrate 20 that is opposite to the two polygons in the z direction. As a result, the positional deviation of each of the first sensor unit 21 and the second sensor unit 22 relative to the sensor housing 50 is suppressed.

[0266] As the substrate support pins 56a and substrate bonding pins 56b are named, they are shown as a columnar example extending in the z direction. However, their shapes are not limited to the columnar shape. The front end surface 56c of the substrate support pin 56a can be farther from the upper end surface 51e than the front end surface 56d of the substrate bonding pin 56b, and their shapes are not particularly limited.

[0267] <Securing form of the first shield portion to the sensor housing>

[0268] like Fig.11 Column (a) and Fig.14 As shown in the column (a) of FIG. 1 , shield support pins 57a and shield bonding pins 57b partially extending in the z direction are formed on the upper end surface 51e of the base 51. A plurality of shield support pins 57a and shield bonding pins 57b are formed on the upper end surface 51e. Fig.14 Column (a) shows a perspective view of a sensor housing provided with a wiring substrate. Fig.14 Column (b) shows a perspective view of a sensor case provided with a wiring substrate and a shielding portion. Fig.14 In order to illustrate these pins, some markings are omitted.

[0269] The plurality of shielding portion support pins 57a each have a front end surface 57c facing the z direction. The positions of the plurality of front end surfaces 57c in the z direction are equal. Similarly, the plurality of shielding portion bonding pins 57b each have a front end surface 57d facing the z direction. The positions of the plurality of front end surfaces 57d in the z direction are equal.

[0270] like Fig.15As shown, the lengths of the shield support pins 57a and the shield adhesive pins 57b in the z direction are longer than those of the substrate support pins 56a. More specifically, the lengths of the shield support pins 57a and the shield adhesive pins 57b in the z direction are longer than those of the substrate support pins 56a by more than the thickness of the wiring substrate 20 in the z direction. Therefore, in the state where the wiring substrate 20 is mounted on the sensor housing 50 as described above, the front end surface 57c of the shield support pins 57a and the front end surface 57d of the shield adhesive pins 57b are respectively separated from the upper end surface 51e in the z direction from the back surface 20b of the wiring substrate 20. In addition, a structure in which the difference in the lengths of the shield adhesive pins 57b and the substrate support pins 56a in the z direction is shorter than the thickness of the wiring substrate 20 in the z direction can be adopted.

[0271] like Fig.15 As shown, the length in the z direction between the front end face 57c of the shield support pin 57a ​​and the upper end face 51e is L3. The length in the z direction between the front end face 57d of the shield bonding pin 57b and the upper end face 51e is L4. As shown in the figure, the length L3 is longer than the length L4.

[0272] Therefore, the front end surface 57c of the shield portion support pin 57a ​​is farther from the upper end surface 51e in the z direction than the front end surface 57d of the shield portion bonding pin 57b. The first shield portion 41 is mounted on the sensor housing 50 in a state where one surface 41a contacts the front end surface 57c of the shield portion support pin 57a. The shield portion support pin 57a ​​corresponds to the shield portion support portion. The front end surface 57c corresponds to the contact surface.

[0273] In the state of being mounted on the front end surface 57c of the shield support pin 57a, the one surface 41a of the first shield 41 and the front end surface 57d of the shield adhesive pin 57b are separated in the z direction. Between the first shield 41 and the shield adhesive pin 57b, a substrate adhesive 56e is provided to bond and fix the two. The shield adhesive pin 57b is equivalent to the shield adhesive portion. The front end surface 57d is equivalent to the installation surface.

[0274] When the first shielding part 41 and the sensor housing 50 are bonded and fixed by the shielding part adhesive 57e, the temperature of the shielding part adhesive 57e is set higher than the ambient temperature of the first current sensor 11. The temperature of the shielding part adhesive 57e at this time can also be set to, for example, about 150°C. At this temperature, the shielding part adhesive 57e has fluidity. As the shielding part adhesive 57e, a silicone adhesive can be used.

[0275] A shield adhesive 57e having fluidity at about 150°C is applied to the front end surface 57d of the shield adhesive pin 57b. Then, the first shield 41 is installed in the sensor housing 50 so that the one surface 41a of the first shield 41 contacts the front end surface 57c of the shield support pin 57a ​​and the shield adhesive 57e, respectively. Then, the shield adhesive 57e is cooled to room temperature to be cured.

[0276] As a result, residual stress is generated in the shield adhesive 57e, which is concentrated toward the center of the shield adhesive 57e at the ambient temperature where the first current sensor 11 is installed. Due to this residual stress, the first shield 41 and the shield adhesive pin 57b are brought into a state of being close to each other. The contact state between the one surface 41a of the first shield 41 and the front end surface 57c of the shield support pin 57a ​​is maintained.

[0277] As a result, the positional deviation of the first shield portion 41 relative to the sensor housing 50 no longer depends on the shape deviation of the shield portion adhesive 57e having fluidity during bonding and fixing. The positional deviation of the first shield portion 41 relative to the sensor housing 50 becomes a manufacturing error of the sensor housing 50. In other words, the positional deviation of the first shield portion 41 relative to the wiring substrate 20 fixed to the sensor housing 50 becomes a manufacturing error of the sensor housing 50.

[0278] In this embodiment, three shielding portion support pins 57a are formed on the upper end surface 51e. One of the three shielding portion support pins 57a is integrally connected to the left wall 53a. One of the remaining two shielding portion support pins 57a is integrally connected to the right wall 53b. The remaining one shielding portion support pin 57a ​​is integrally connected to the upper wall 53c. As a result, the front end surfaces 57c of the three shielding portion support pins 57a become the vertices of a triangle.

[0279] The shield support pin 57a ​​integrally connected to the left wall 53a and the shield support pin 57a ​​integrally connected to the right wall 53b are arranged in the y direction. The two shield support pins 57a are spaced apart from the shield support pin 57a ​​integrally connected to the upper wall 53c in the x direction. The first sensor portion 21 and the second sensor portion 22 of the wiring substrate 20 are located in a triangular region formed by connecting the front end surfaces 57c of the three shield support pins 57a.

[0280] In this embodiment, three shielding part adhesive pins 57b are formed on the upper end surface 51e. One of the three shielding part adhesive pins 57b is integrally connected to the left wall 53a. One of the remaining two shielding part adhesive pins 57b is integrally connected to the right wall 53b. The remaining one shielding part adhesive pin 57b is integrally connected to the upper wall 53c. As a result, the front end surfaces 57d of the three shielding part adhesive pins 57b become the vertices of the triangle.

[0281] The shielding part bonding pin 57b integrally connected to the left wall 53a and the shielding part bonding pin 57b integrally connected to the right wall 53b are arranged in the y direction. The two shielding part bonding pins 57b are separated from the shielding part bonding pin 57b integrally connected to the upper wall 53c in the x direction. The first sensor part 21 and the second sensor part 22 are arranged in the z direction with the triangular area formed by connecting the front end surfaces 57d of the three shielding part bonding pins 57b.

[0282] In addition, one shielding portion support pin 57a ​​and one shielding portion bonding pin 57b are arranged on the left wall 53a and the right wall 53b, respectively. One shielding portion support pin 57a ​​and one shielding portion bonding pin 57b are arranged on the upper wall 53c. A triangle formed by connecting the front end surfaces 57c of the three shielding portion support pins 57a and a triangle formed by connecting the front end surfaces 57d of the three shielding portion bonding pins 57b overlap in the z direction. And, these overlapping areas in the z direction are arranged in the z direction with the center point CP of the narrow portion 31a.

[0283] The first shielding part 41 is provided on the sensor housing 50 in a state of being opposed to the two triangles in the z direction. The portion of the first shielding part 41 opposed to the two triangles is in contact with the shielding part support pin 57a ​​and is connected to the shielding part bonding pin 57b via the shielding part adhesive 57e, compared with the portion not opposed to the two triangles, so that the connection with the sensor housing 50 is more stable.

[0284] The portion of the first shield portion 41 that is stably connected to the sensor housing 50 is aligned in the z direction with the first sensor portion 21 and the second sensor portion 22 of the wiring substrate 20. Specifically, the first central portion 41d of the first shield portion 41 is aligned in the z direction with the first sensor portion 21 and the second sensor portion 22.

[0285] In a state where the first shielding part 41 is mounted on the shielding part supporting pins 57a and fixed to the shielding part bonding pins 57b via the shielding part adhesive 57e, the one surface 41a of the first shielding part 41 and the back surface 20b of the wiring substrate 20 are separated and opposed in the z direction. In the case where there is no manufacturing error, the distance between the one surface 41a and the back surface 20b is constant over the entire surface, and the two are in a parallel relationship. Therefore, the distance between the opposing surface 20a of the wiring substrate 20 and the one surface 41a of the first shielding part 41 is also constant over the entire surface, and the two are in a parallel relationship.

[0286] In addition, if Figure 6 as well as Fig.14As shown in the column (a) of FIG. 1 , a notch 20g is formed at the end of the wiring substrate 20 for allowing the shield support pin 57a ​​and the shield bonding pin 57b to pass through the upper side of the wiring substrate 20. In addition, a plurality of through holes 20h are formed in the wiring substrate 20 for allowing the other ends of the connection terminals 60 to pass through.

[0287] like Figure 6 As shown in FIG. 1 , a plurality of through holes 20h are arranged in the y direction. The portion of the wiring substrate 20 where the plurality of through holes 20h are formed and the portion where the first sensor unit 21 and the second sensor unit 22 are mounted are arranged in the x direction. Between the two portions of the wiring substrate 20 arranged in the x direction, a first notch 20i is formed for guiding the position of the wiring substrate 20 relative to the sensor housing 50 in the x direction when the wiring substrate 20 is set in the sensor housing 50. In addition, a second notch 20j is formed for guiding the position of the wiring substrate 20 relative to the sensor housing 50 in the y direction when the wiring substrate 20 is set in the sensor housing 50 at the portion where the first sensor unit 21 and the second sensor unit 22 are mounted.

[0288] Accordingly, on the left wall 53a and the right wall 53b of the sensor housing 50, Fig.11 Column (a) and Fig.12 As shown in the column (b) of FIG. 2 , a first protrusion 53e is formed to be inserted into the first notch 20i. A second protrusion 53f is formed on the left wall 53a and the right wall 53b, respectively, to be arranged opposite to the second notch 20j in the y direction. The first notch 20i and the first protrusion 53e have similar shapes and extend in the y direction. The second notch 20j and the second protrusion 53f have similar shapes and extend in the x direction.

[0289] The number of the shield support pins 57a and the shield bonding pins 57b is not limited to the above example. The number of the shield support pins 57a may be 4 or more, and the number of the shield bonding pins 57b may be 1, 2, or 4 or more.

[0290] When the number of the shield support pins 57a and the number of the shield bonding pins 57b are three or more, a polygon formed by connecting the front end surfaces 57c of the three or more shield support pins 57a and a polygon formed by connecting the front end surfaces 57d of the three or more shield bonding pins 57b may overlap in the z direction. In this structure, the region of the first shield 41 that faces the two polygons in the z direction may be arranged in the z direction with the first sensor 21 and the second sensor 22 of the wiring substrate 20. Thus, the positional deviation of the first shield 41 relative to the first sensor 21 and the second sensor 22 is suppressed.

[0291] As the shielding portion support pin 57a ​​and the shielding portion bonding pin 57b are named, they are shown as a columnar example extending in the z direction. However, their shapes are not limited to the columnar shape. The front end surface 57c of the shielding portion support pin 57a ​​can be farther from the upper end surface 51e than the front end surface 57d of the shielding portion bonding pin 57b, and their shapes are not particularly limited.

[0292] <Second shield portion fixed to sensor housing>

[0293] like Fig.11 Column (b) and Fig.15 As shown, a plurality of shield portion supporting pins 57 a are also formed on the lower end surface 51 f of the base portion 51 .

[0294] Unlike the first shielding part 41, the wiring substrate 20 is not provided between the sensor housing 50 and the second shielding part 42. Therefore, the shielding part support pin 57a ​​formed on the lower end surface 51f is shorter in length in the z direction than the shielding part support pin 57a ​​formed on the upper end surface 51e. The positions of the front ends of the plurality of substrate support pins 56a in the z direction are equal. The second shielding part 42 is mounted on the sensor housing 50 in a form in which one surface 42a contacts the front end surface 57c of the shielding part support pin 57a.

[0295] In a state where the second shield portion 42 is mounted on the front end surface 57c of the shield portion support pin 57a, the one surface 42a of the second shield portion 42 is separated from the lower end surface 51f in the z direction. A shield portion adhesive 57e is provided between the second shield portion 42 and the lower end surface 51f.

[0296] When the second shield portion 42 and the sensor housing 50 are bonded and fixed by the shield portion adhesive 57 e , the temperature of the shield portion adhesive 57 e is also set higher than the ambient temperature in which the first current sensor 11 is installed.

[0297] A fluid shielding adhesive 57e is applied to the lower end surface 51f. Then, the second shielding portion 42 is installed in the sensor housing 50 so that the one surface 42a of the second shielding portion 42 contacts the front end surface 57c of the shielding portion support pin 57a ​​and the shielding adhesive 57e, respectively. Then, the shielding adhesive 57e is cooled to room temperature to be cured.

[0298] Thus, in the shielding adhesive 57e provided on the lower end surface 51f, residual stress that gathers toward the center of the shielding adhesive 57e is generated even at the ambient temperature where the first current sensor 11 is installed. Due to this residual stress, the second shielding portion 42 and the shielding adhesive pin 57b are brought into a state of being close to each other. The contact state between the one surface 42a of the second shielding portion 42 and the front end surface 57c of the shielding support pin 57a ​​is maintained.

[0299] As a result, the positional deviation of the second shield portion 42 relative to the sensor housing 50 no longer depends on the shape deviation of the shield portion adhesive 57e having fluidity during bonding and fixing. The positional deviation of the second shield portion 42 relative to the sensor housing 50 becomes a manufacturing error of the sensor housing 50. In other words, the positional deviation of the second shield portion 42 relative to the wiring substrate 20 fixed to the sensor housing 50 becomes a manufacturing error of the sensor housing 50.

[0300] In this embodiment, four shielding portion support pins 57a are formed on the lower end surface 51f. The front end surfaces 57c of the four shielding portion support pins 57a serve as vertices of a quadrilateral. The quadrilateral formed by connecting the front end surfaces 57c of the four shielding portion support pins 57a and the center point CP of the narrow portion 31a are arranged in the z direction. The shielding portion adhesive 57e is applied to the area of ​​the lower end surface 51f that is opposite to the quadrilateral.

[0301] The second shielding part 42 is provided on the sensor housing 50 in a state facing the above-mentioned quadrilateral in the z direction. The portion of the second shielding part 42 facing the quadrilateral is in contact with the shielding part support pin 57a ​​and connected to the lower end surface 51f via the shielding part adhesive 57e, compared with the portion not facing the quadrilateral, so that the connection with the sensor housing 50 is more stable.

[0302] The portion of the second shield portion 42 that is stably connected to the sensor housing 50 is aligned with the first sensor portion 21 and the second sensor portion 22 of the wiring substrate 20 in the z direction. Specifically, the second central portion 42d of the second shield portion 42 is aligned with the first sensor portion 21 and the second sensor portion 22 in the z direction.

[0303] The number of the shield portion support pins 57a formed on the lower end surface 51f is not limited to 4. The number of the shield portion support pins 57a can be appropriately set as long as it is 3 or more.

[0304] When the number of the shielding portion support pins 57a is three or more, the region of the second shielding portion 42 that is opposed to the polygon formed by connecting the front end surfaces 57c of the three or more shielding portion support pins 57a in the z direction can be arranged in the z direction with the first sensor portion 21 and the second sensor portion 22. Thus, the positional deviation of the second shielding portion 42 relative to the first sensor portion 21 and the second sensor portion 22 is suppressed.

[0305] As described above, the extension portions 42c extending in the z direction are respectively formed on the two end sides 42f arranged in the x direction of the second shield portion 42. The two groove portions 51g for providing the extension portions 42c are formed on the lower end surface 51f.

[0306] like Fig.11Column (b) and Fig.13 As shown, two grooves 51g are arranged between the upper wall 54c and the lower wall 54d along the x direction. The two grooves 51g are formed along the z direction from the lower end surface 51f toward the upper end surface 51e. A part of one of the two grooves 51g is formed by the upper wall 54c. A part of the remaining groove 51g is formed by the lower wall 54d. The cover portion 31 is located between the two grooves 51g. Therefore, the cover portion 31 is located between the two extension portions 42c of the second shield portion 42.

[0307] <Length of support pin and bonding pin>

[0308] The upper end surface 51e of the base 51 can be divided into a portion where the other ends of the connection terminals 60 arranged in the x direction are exposed and a portion where the narrow portion 31a is covered, with the first convex portion 53e as the boundary in the y direction. The portion where the other ends of the connection terminals 60 are exposed in the upper end surface 51e is closer to the lower end surface 51f in the z direction than the portion where the narrow portion 31a is covered. Therefore, the distance between the portion where the other ends of the connection terminals 60 are exposed in the upper end surface 51e and the opposing surface 20a of the wiring substrate 20 in the z direction is greater than the distance between the portion where the narrow portion 31a is covered in the upper end surface 51e and the opposing surface 20a of the wiring substrate 20 in the z direction. This is to ensure a distance for inserting the other ends of the connection terminals 60 into the through holes 20h of the wiring substrate 20.

[0309] Thus, the position of the portion of the upper end surface 51e where the other end of the connection terminal 60 is exposed and the portion covering the narrow portion 31a are different in the z direction. The substrate support pins 56a are formed at these two positions. Although the positions of the upper end surface 51e formed in this way are different in the z direction, in this embodiment, the positions of the front end surfaces 56c of the plurality of substrate support pins 56a in the z direction are the same. Therefore, the lengths of the plurality of substrate support pins 56a in the z direction are different.

[0310] The lengths of the plurality of substrate supporting pins 56a in the z direction are not uniformly Fig.13 The length L1 shown in FIG. 1 is the length in the z direction of the substrate support pin 56a formed at the portion of the upper end surface 51e that covers the narrow portion 31a. The length in the z direction of the substrate support pin 56a formed at the portion of the upper end surface 51e where the other end of the connection terminal 60 is exposed is longer than the length L1 by the difference in the position in the z direction of the upper end surface 51e divided into two.

[0311] As described above, the length of the support pin in the z direction may be different depending on the position of the surface to be formed in the z direction. The position of the front end surface 56c of each of the plurality of substrate support pins 56a in the z direction may be the same. This also applies to the plurality of shielding portion support pins 57a.

[0312] In addition, when the wiring substrate 20 is mounted on the sensor housing 50, a fluid substrate adhesive 56e is applied to the front end surface 56d of the substrate adhesive pin 56b. The substrate adhesive 56e is variable in shape in the z direction due to the fluidity. Therefore, the positions of the front end surfaces 56d of the plurality of substrate adhesive pins 56b in the z direction can be different. This is also the same for the plurality of shielding portion adhesive pins 57b.

[0313] <Second current sensor and third current sensor>

[0314] Next, the second current sensor 12 will be described in detail. The second current sensor 12 and the third current sensor 13 have substantially the same structure, so the description of the third current sensor 13 will be omitted.

[0315] The second current sensor 12 has the same components as the first current sensor 11. Therefore, the following description of the same points as the first current sensor 11 will be omitted, and the differences will be mainly described.

[0316] As described above, the second current sensor 12 is provided on the first energized bus bar 341 and the second energized bus bar 342. In order to detect the current of each of the first energized bus bar 341 and the second energized bus bar 342, the second current sensor 12 includes two independent sensors 71 having the same function as the first current sensor 11. In addition, the second current sensor 12 includes a wiring case 72 for accommodating the two independent sensors 71.

[0317] One of the two independent sensors 71 detects the magnetic field generated by the AC current flowing through the first energizing bus bar 341 , and the other of the two independent sensors 71 detects the magnetic field generated by the AC current flowing through the second energizing bus bar 342 .

[0318] Fig.16 2 independent sensors 71 are shown in FIG. 2. Thus, the two independent sensors 71 have the same shape. The difference in structure between the independent sensor 71 and the first current sensor 11 is the connection portion with the current-carrying busbar in the conductive busbar 30, and the shape of the connector portion 55 covering the connection terminal 60. That is, the shapes of the first exposed portion 32 and the second exposed portion 33 of the conductive busbar 30, and the disappearance of the surrounding portion 55c, etc.

[0319] The difference in structure between the independent sensor 71 and the first current sensor 11 is because the connection objects of the two are different. This is because the first current sensor 11 is connected to the power bus 307 of the converter 310. This is because the second current sensor 12 is connected to the first power bus 341 and the second power bus 342 of the first inverter 320. However, the internal structure of the independent sensor 71 and the first current sensor 11 is the same. Therefore, the independent sensor 71 achieves the same effect as the first current sensor 11.

[0320] A plurality of independent sensors 71 are housed in Fig.17 The wiring housing 72 is shown. Fig.18 As shown, multiple independent sensors can be housed together in the wiring housing 72. Fig.19 As shown, the second current sensor 12 is configured by accommodating a plurality of independent sensors in a wiring case 72 .

[0321] In this arrangement, the first shield portions 41 and the second shield portions 42 of each individual sensor 71 are arranged alternately in the x direction. The sensing directions of the magnetic field of the magnetoelectric converter 25 of the individual sensor 71 are the z direction and the y direction.

[0322] In addition, in the Figure 17 to Figure 19 Each of the wiring cases 72 shown in the following drawings accommodates six independent sensors 71. The number of independent sensors 71 accommodated in the wiring case 72 is just an example. The wiring case 72 only needs to accommodate at least two independent sensors 71.

[0323] In addition, other current sensors for detecting the current of the vehicle-mounted device may be accommodated in the wiring case 72 of the second current sensor 12. Furthermore, the following structure may be adopted: the second current sensor 12 and the third current sensor 13 have a common wiring case 72, and the independent sensors 71 of the second current sensor 12 and the third current sensor 13 are accommodated in the common wiring case 72.

[0324] <Wiring case>

[0325] like Fig.17 As shown in FIG. 1 , the wiring housing 72 includes a general housing 73, a terminal housing 74, and a power supply terminal 75. The general housing 73 and the terminal housing 74 are made of an insulating resin material. The general housing 73 and the terminal housing 74 are integrally connected. Fig.18 as well as Fig.19 As shown, a plurality of independent sensors 71 are accommodated in the integrated housing 73. Therefore, the volume of the integrated housing 73 is larger than the sensor housing 50 of the independent sensor 71. A plurality of power terminals 75 are insert-molded in the terminal housing 74. Figure 20 to Figure 23As shown, one end and the other end of each of the plurality of power terminals 75 are exposed outside the terminal housing 74 .

[0326] Fig. 20 Column (a) shows a rear view of the wiring case. Fig. 20 Column (b) shows a top view of the wiring case. Fig. 20 Column (c) shows a bottom view of the wiring case. Fig.21 Column (a) shows a left side view of the wiring case. Fig.21 Column (b) shows a top view of the wiring case. Fig.21 Column (c) shows the right side view of the wiring case. Fig. 20 Column (b) and Fig.21 The same figure is represented in column (b) of FIG.

[0327] Fig. 22 Column (a) shows a front view of the second current sensor. Fig. 22 Column (b) shows a top view of the second current sensor. Fig. 22 Column (c) shows a bottom view of the second current sensor. Fig.23 Column (a) shows a side view of the second current sensor. Fig.23 Column (b) shows a top view of the second current sensor. Fig. 22 Column (b) and Fig.23 The same figure is represented in column (b) of FIG.

[0328] like Fig. 20 as well as Fig. 22 As shown in the respective (c) columns, the wiring case 72 has an integrated wiring substrate 76. The integrated wiring substrate 76 is connected to one end of the connection terminal 60 of the independent sensor 71. The integrated wiring substrate 76 is connected to one end of the power-on terminal 75. Thus, the independent sensor 71 and the power-on terminal 75 are electrically connected via the wiring pattern of the integrated wiring substrate 76. The other end of the power-on terminal 75 is electrically connected to the MGECU 802 via a wiring harness or the like. Thus, the output of the independent sensor 71 is input to the MGECU 802 via the integrated wiring substrate 76, the power-on terminal 75 and the wiring harness. The integrated wiring substrate 76 and the power-on terminal 75 are equivalent to input and output wiring.

[0329] As described above, the second current sensor 12 is provided on the first energizing bus 341 and the second energizing bus 342. These energizing bus bars are cut off on the first inverter 320 side and the first motor 400 side. The energizing bus bar has a portion connecting the first inverter 320 and the second current sensor 12, and a portion connecting the second current sensor 12 and the first motor 400.

[0330] The portion of the energized bus bar of the present embodiment that connects the first inverter 320 and the second current sensor 12 is a conductive plate formed of a metal material. The portion of the energized bus bar that connects the second current sensor 12 and the first motor 400 is a wire. Hereinafter, the portion of the energized bus bar that connects the first inverter 320 and the second current sensor 12 is simply represented as a conductive plate. The portion of the energized bus bar that connects the second current sensor 12 and the first motor 400 is simply represented as a wire.

[0331] In addition, the shape of the power bus can be appropriately changed according to the shapes of the inverter and the motor, and their vehicle-mounted forms. Therefore, the specific shape of the power bus is not limited to the above example. The shapes of the wiring shell 72 and the conductive bus 30 of the independent sensor 71 can be appropriately changed according to the shapes of these power buses. In particular, the shape of the conductive bus 30 of the independent sensor 71 can be matched only by changing the shapes of the first exposed portion 32 and the second exposed portion 33. Therefore, there is no need to change the internal shape of the independent sensor 71. As a result, the production line of the independent sensor 71 does not need to be changed.

[0332] like Fig. 20 as well as Fig.21 As shown, the integrated housing 73 has a bottom wall 77 and a peripheral wall 78. The bottom wall 77 faces the z direction. The planar shape of the bottom wall 77 is a rectangle with the x direction as the long side direction.

[0333] The peripheral wall 78 rises in the z direction from the inner bottom surface 77a of the bottom wall 77 facing the z direction. The peripheral wall 78 has a left wall 78a and a right wall 78b arranged in the x direction. The peripheral wall 78 has an upper wall 78c and a lower wall 78d arranged in the y direction. In the circumferential direction around the z direction, the left wall 78a, the upper wall 78c, the right wall 78b and the lower wall 78d are connected in sequence. Therefore, the peripheral wall 78 is in the shape of a cylinder opened in the z direction. In the storage space formed by the bottom wall 77 and the peripheral wall 78, a plurality of independent sensors 71 can be accommodated.

[0334] like Fig.18 As shown, the independent sensor 71 is inserted into the accommodation space of the integrated housing 73 from the z direction. Fig.19 As shown, a plurality of independent sensors 71 are arranged in the x direction in the accommodation space.

[0335] The plurality of independent sensors 71 have the first shielding part 41 and the second shielding part 42 similarly to the first current sensor 11. The first shielding part 41 and the second shielding part 42 are spaced apart and opposed to each other in the x direction. Therefore, the first shielding parts 41 and the second shielding parts 42 of the plurality of independent sensors are alternately arranged in the storage space.

[0336] like Fig.16As shown, the first exposed portion 32 and the second exposed portion 33 extend in the y direction from the sensor housing 50 of the independent sensor 71. A slit 78e is formed on the upper wall 78c of the integrated housing 73 for accommodating the sensor housing 50 of the independent sensor 71 in the accommodating space and arranging the front end of the first exposed portion 32 outside the accommodating space. The slit 78e is formed from the front end surface of the upper wall 78c toward the bottom wall 77 in the z direction.

[0337] When the individual sensor 71 is accommodated in the integrated housing 73, the tip of the first exposed portion 32 of the individual sensor 71 is located outside the accommodation space via the slit 78e. The tip of the first exposed portion 32 is electrically connected to the conductive plate by laser welding or the like.

[0338] In addition, the conductive terminal 79 is insert-molded on the bottom wall 77 of the integrated housing 73. Fig. 20 as well as Fig.21 As shown in the respective columns (b), a portion of the conductive terminal 79 is exposed from the inner bottom surface 77 a of the bottom wall 77 .

[0339] When the individual sensor 71 is accommodated in the integrated housing 73, the second exposed portion 33 of the individual sensor 71 is disposed opposite to the portion of the conductive terminal 79 exposed from the inner bottom surface 77a. The second exposed portion 33 and the conductive terminal 79 are electrically connected by laser welding or the like.

[0340] In addition, the integrated housing 73 has a terminal block 80 for supporting a plurality of conductive terminals 79. The terminal block 80 is integrally formed on the bottom wall 77 side of the lower wall 78d. The terminal block 80 is in the shape of a rectangular parallelepiped extending in the x direction. A plurality of conductive terminals 79 are also insert-molded in the terminal block 80. A portion of the plurality of conductive terminals 79 is exposed from the terminal block 80. The portion of the conductive terminal 79 exposed from the terminal block 80 extends in the z direction in a manner away from the terminal block 80. The portion of the conductive terminal 79 exposed from the terminal block 80 is opposite to the lower wall 78d in the y direction. The portions of the plurality of conductive terminals 79 exposed from the terminal block 80 are arranged separately in the x direction.

[0341] The portion of the conductive terminal 79 exposed from the terminal block 80 is in a flat shape with a relatively thin thickness in the y direction. The portion of the conductive terminal 79 exposed from the terminal block 80 has a current-carrying surface 79a and an inner surface 79b facing each other in the y direction. The conductive terminal 79 is formed with a bolt hole 79c that penetrates the current-carrying surface 79a and the inner surface 79b in the y direction.

[0342] Furthermore, a nut 81 opened in the y direction is provided on the inner surface 79b of the conductive terminal 79. The opening of the nut 81 and the opening of the bolt hole 79c are aligned in the y direction.

[0343] The terminal of the wire is provided on the current-carrying surface 79a of the conductive terminal 79. A bolt hole penetrating in the y direction is also formed in the terminal of the wire. The surface through which the bolt hole in the terminal of the wire is passed is made to face the current-carrying surface 79a of the conductive terminal 79. In this form, the shaft of a bolt not shown is passed through the bolt holes of both. And, the front end of the shaft of the bolt is fastened with the nut 81. The bolt and the nut 81 are fastened from the front end of the shaft of the bolt toward the head. The conductive terminal 79 and the terminal of the wire are clamped by the head of the bolt and the nut 81. As a result, the terminal of the wire and the conductive terminal 79 are brought into contact, and the two are electrically and mechanically connected. As a result, the second exposed portion 33 of the independent sensor 71 and the terminal of the wire are electrically connected via the conductive terminal 79.

[0344] The connection terminal 60 extends from the sensor housing 50 of the independent sensor 71 in the z direction. A through hole is formed on the bottom wall 77 of the integrated housing 73 for arranging one end of the connection terminal 60 outside the storage space. The through hole penetrates the inner bottom surface 77a of the bottom wall 77 and the outer bottom surface 77b on the opposite side. One end of the connection terminal 60 protrudes out of the storage space in a form of leaving from the outer bottom surface 77b via the through hole. In addition, the through hole is small. Therefore, the through hole is not shown in the drawings.

[0345] The terminal housing 74 is arranged in the x direction with the integrated housing 73. The terminal housing 74 is integrally connected to the left wall 78a of the integrated housing 73. The terminal housing 74 extends in the z direction. The terminal housing 74 has an upper surface 74a and a lower surface 74b arranged in the z direction.

[0346] A plurality of power terminals 75 insert-molded in the terminal housing 74 extend in the z direction. One end of the power terminal 75 protrudes from the lower surface 74 b of the terminal housing 74 . The other end of the power terminal 75 protrudes from the upper surface 74 a of the terminal housing 74 .

[0347] like Fig. 20 As shown in columns (a) and (c), the outer bottom surface 77b of the bottom wall 77 of the integrated housing 73 and the lower surface 74b of the terminal housing 74 are continuously connected in the x direction and the y direction. An integrated wiring substrate 76 is provided on the continuously connected outer bottom surface 77b and the lower surface 74b.

[0348] The integrated wiring substrate 76 is in a flat shape with a relatively thin thickness in the z direction. The integrated wiring substrate 76 has a mounting surface 76a and an opposite surface 76b facing each other in the z direction. The integrated wiring substrate 76 is fixed to the integrated housing 73 and the terminal housing 74 in a state where the mounting surface 76a, the outer bottom surface 77b and the lower surface 74b are respectively opposed in the z direction.

[0349] As described above, one end of the power-on terminal 75 protrudes from the lower surface 74b. One end of the connection terminal 60 protrudes from the outer bottom surface 77b. In contrast, a first through hole 76c is formed on the integrated wiring substrate 76 for inserting one end of the power-on terminal 75. A second through hole 76d is formed on the integrated wiring substrate 76 for inserting one end of the connection terminal 60. These first through hole 76c and second through hole 76d penetrate the mounting surface 76a and the opposite surface 76b of the integrated wiring substrate 76 in the z direction, respectively. In addition, a wiring pattern that electrically connects the first through hole 76c and the second through hole 76d is formed on the integrated wiring substrate 76.

[0350] The integrated wiring board 76 is installed on the outer bottom surface 77b and the lower surface 74b so that one end of the power supply terminal 75 is inserted into the first through hole 76c. Then, the first through hole 76c and the power supply terminal 75 are electrically connected via solder or the like.

[0351] The independent sensor 71 is placed in the storage space by inserting one end of the connection terminal 60 into the insertion hole of the bottom wall 77 and the second through hole 76d. And the second through hole 76d and the connection terminal 60 are electrically connected via solder or the like. Thus, the connection terminal 60 of the independent sensor 71 is electrically connected to the power-on terminal 75 via the second through hole 76d, the wiring pattern of the integrated wiring substrate 76, and the first through hole 76c.

[0352] The wiring case 72 has a plurality of flanges 82 for mounting on a vehicle. Bolt holes 82a for bolting the second current sensor 12 to the vehicle are formed in each of the plurality of flanges 82.

[0353] The wiring case 72 of this embodiment has three flanges 82. One of the three flanges 82 is formed on the right wall 78b side of the bottom wall 77. One of the remaining two flanges 82 is formed on the lower wall 78d side of the terminal housing 74. The flange 82 is integrally connected to the terminal block 80. The remaining flange 82 is formed on the opposite side of the terminal housing 74 to the connection portion with the integrated housing 73.

[0354] Thus, two of the three flanges 82 are arranged in the x direction via the integrated housing 73 and the terminal housing 74. The remaining flange 82 is separated from the two flanges 82 arranged in the x direction in the y direction. Thus, the three flanges 82 form the vertices of a triangle.

[0355] As described above, one end of the connection terminal 60 protrudes from the outer bottom surface 77b, and one end of the power-on terminal 75 protrudes from the lower surface 74b. In addition, the integrated wiring substrate 76 is provided on the outer bottom surface 77b and the lower surface 74b. In order to prevent one end of the connection terminal 60, one end of the power-on terminal 75, and the integrated wiring substrate 76 from contacting the vehicle, the three flanges 82 each have a leg 83 extending in the z direction. Through the leg 83, when the second current sensor 12 is mounted on the vehicle, one end of the connection terminal 60, one end of the power-on terminal 75, and the integrated wiring substrate 76 are separated from the vehicle in the z direction.

[0356] <Effects of current sensors>

[0357] Next, the effects of the current sensor of this embodiment are described. As described above, the first current sensor 11 has the same structure as the independent sensor 71 of the second current sensor 12 and the third current sensor 13. Therefore, the same effects are achieved. Therefore, in order to avoid complexity, the first current sensor 11 and the independent sensor 71 are not distinguished, and they are simply represented as current sensors. Through the various effects shown below, the decrease in the detection accuracy of the measured current is suppressed.

[0358] <Magnetic saturation of the shield>

[0359] As described above, the length of the first two ends 41e of the first shielding portion 41 in the x direction is shorter than that of the first central portion 41d. Therefore, it is difficult for the magnetic field to penetrate into the first two ends 41e. The magnetic field is suppressed from penetrating from one of the two ends of the first two ends 41e to the other at the portion (parallel portion) directly connected to the first two ends 41e in the first central portion 41d and arranged in the y direction. As a result, the magnetic saturation of the parallel portion of the first central portion 41d is suppressed. The electromagnetic noise is suppressed from leaking from the first central portion 41d.

[0360] Fig.24 In FIG. 1 , a region of the first shield portion 41 that is easily magnetically saturated due to the transmission of a magnetic field is schematically indicated by hatching. Fig.24 The column (a) is a schematic diagram showing magnetic saturation generated in the first shield portion without a notch as a comparative structure. Fig.24 Column (b) is a schematic diagram showing the magnetic saturation region of the first shield portion 41 according to the present embodiment. Fig.24 The thick solid arrows shown represent the current flowing through the conductive busbar 30 .

[0361] As shown in the schematic diagram, the first shield portion without the notch is easily magnetically saturated uniformly. In contrast, in the first shield portion 41 having the notch 41c, even if magnetic saturation occurs in areas other than the parallel portion of the first central portion 41d, magnetic saturation in the parallel portion is suppressed.

[0362] Fig.25 The simulation results of the magnetic field distribution through the shield are shown in FIG. Fig.25 Column (a) indicates the Fig.24 Magnetic field distribution in the cross section along line XXVa-XXVa shown. Fig.25 Column (b) shows the Fig.24 Magnetic field distribution in the cross section along line XXVb-XXVb is shown.

[0363] in, Fig.25 Column (a) shows simulation results when the first shield portion 41 and the second shield portion 42 are both rectangular. Fig.25 Column (b) shows the simulation results when the first shield 41 and the second shield 42 are respectively formed with notches 41c. The intensity of the magnetic field is represented by the density of hatching. The sparser the hatching, the weaker the magnetic field intensity, and the denser the hatching, the higher the magnetic field intensity.

[0364] It is also clear from the simulation results that, in the absence of the notch 41c, the magnetic field distribution of the first shielding part and the second shielding part is the same. In addition, the strength of the overall magnetic field of the first shielding part and the second shielding part is improved. In contrast, if the notch 41c is formed, the strength of the overall magnetic field of the first shielding part and the second shielding part is reduced. In particular, the strength of the magnetic field distribution of the parallel parts of the first central part 41d and the second central part 42d is reduced. Therefore, the leakage of electromagnetic noise from the first central part 41d and the second central part 42d due to magnetic saturation is suppressed.

[0365] In addition, if Fig.25 As shown, the first shield 41 and the second shield 42 have different magnetic field distribution intensities. This difference is caused by the difference in the distance between the first shield 41 and the second shield 42 and the conductive bus 30. In any magnetic field distribution, the intensity is low in the parallel position and high in the area other than the parallel position.

[0366] The parallel portion of the first central portion 41d where the magnetic saturation is suppressed is arranged in the z direction with the first sensor portion 21 and the second sensor portion 22 mounted on the wiring substrate 20. Therefore, the electromagnetic noise leaked due to the magnetic saturation of the first central portion 41d is suppressed from being input to the magnetoelectric converter 25 of the first sensor portion 21 and the second sensor portion 22.

[0367] <Displacement of the shielding part>

[0368] The first shield portion 41 is mounted on the shield portion support pins 57a and fixed to the shield portion adhesive pins 57b via the shield portion adhesive 57e. The second shield portion 42 is mounted on the shield portion support pins 57a and fixed to the base portion 51 via the shield portion adhesive 57e.

[0369] Thus, the positional deviation of each of the first shielding portion 41 and the second shielding portion 42 relative to the sensor housing 50 no longer depends on the shape deviation of the shielding portion adhesive 57e having fluidity when being bonded and fixed. The positional deviation of each of the first shielding portion 41 and the second shielding portion 42 relative to the sensor housing 50 becomes a manufacturing error of the sensor housing 50. The cause of the positional deviation of each of the first shielding portion 41 and the second shielding portion 42 relative to the wiring substrate 20 fixed to the sensor housing 50 can be made a manufacturing error of the sensor housing 50. As a result, the reduction in the suppression of the input of the electromagnetic noise to the magnetoelectric converter 25 by the first shielding portion 41 and the second shielding portion 42 is suppressed.

[0370] The temperature of the shielding adhesive 57e when the first shielding part 41 and the second shielding part 42 are respectively bonded and fixed to the sensor housing 50 is set higher than the ambient temperature of the current sensor. The shielding adhesive 57e is cooled to room temperature and solidified. Therefore, in the shielding adhesive 57e, residual stress that is concentrated toward the center of the shielding adhesive 57e is generated at the ambient temperature of the current sensor. The contact state between the first shielding part 41 and the shielding support pin 57a, and the contact state between the second shielding part 42 and the shielding support pin 57a ​​are maintained by the residual stress.

[0371] Thus, the displacement of each of the first shield portion 41 and the second shield portion 42 in the z direction relative to the sensor housing 50 is suppressed. In other words, the displacement of each of the first shield portion 41 and the second shield portion 42 in the z direction relative to the wiring substrate 20 fixed to the sensor housing 50 is suppressed. Thus, the reduction in the suppression of the input of the electromagnetic noise to the magneto-electric converter 25 by the first shield portion 41 and the second shield portion 42 is suppressed.

[0372] <Positional deviation of wiring board>

[0373] The wiring board 20 is mounted on the board supporting pins 56a and fixed to the board bonding pins 56b via the board adhesive 56e.

[0374] Thus, the positional deviation of the wiring substrate 20 relative to the sensor housing 50 no longer depends on the shape deviation of the substrate adhesive 56e having fluidity during bonding and fixing. The positional deviation of the wiring substrate 20 relative to the sensor housing 50 becomes a manufacturing error of the sensor housing 50. The cause of the positional deviation of the wiring substrate 20 relative to the conductive bus bar 30 fixed to the sensor housing 50 can be made into a manufacturing error of the sensor housing 50. As a result, the change of the measured magnetic field passing through the magnetoelectric converter 25 mounted on the wiring substrate 20 is suppressed.

[0375] The temperature of the substrate adhesive 56e when the wiring substrate 20 is bonded and fixed to the sensor housing 50 is set higher than the ambient temperature of the current sensor. The substrate adhesive 56e is cooled to room temperature and solidified. Therefore, in the substrate adhesive 56e, residual stress that is concentrated toward the center of itself is generated at the ambient temperature of the current sensor. The contact state between the wiring substrate 20 and the substrate support pin 56a is maintained by this residual stress.

[0376] As a result, the displacement of the wiring substrate 20 in the z direction relative to the sensor housing 50 is suppressed. In other words, the displacement of the wiring substrate 20 in the z direction relative to the conductive bus bar 30 fixed to the sensor housing 50 is suppressed. As a result, the change of the measured magnetic field passing through the magnetoelectric converter 25 mounted on the wiring substrate 20 is suppressed.

[0377] <Manufacturing error of wiring board>

[0378] The first sensor portion 21 and the second sensor portion 22 are provided on the surface 20a of the wiring substrate 20 facing the conductive bus bar 30. Thus, the distances between the first sensor portion 21 and the second sensor portion 22 and the conductive bus bar 30 in the z direction no longer depend on the thickness in the z direction of the wiring substrate 20. The variation in the distances between the sensor portions and the conductive bus bar 30 in the z direction due to the manufacturing error of the thickness in the z direction of the wiring substrate 20 is suppressed.

[0379] <Separation of wiring case and independent sensor>

[0380] When the conductive busbar is fixed to a housing made of an insulating resin material, the conductive busbar may be displaced relative to the housing due to manufacturing errors and deterioration such as creep of the housing. The larger the volume of the housing, the larger the positional displacement.

[0381] In contrast, as described above, the second current sensor 12 and the third current sensor 13 have an integrated housing 73 that is larger than the sensor housing 50 of the current sensor (independent sensor 71). The current sensor is accommodated in the integrated housing 73. The conductive bus bar 30 is not fixed to the large integrated housing 73 but to the sensor housing 50. The magnetoelectric converter 25 detects the current flowing through the conductive bus bar 30.

[0382] This suppresses the relative positional deviation between the conductive bus bar 30 and the magneto-electric converter 25 caused by the above-mentioned manufacturing error of the housing and deterioration such as creep.

[0383] (Second embodiment)

[0384] Next, based on Fig.26 and Fig. 27 The second embodiment is described. The current sensors of the following embodiments have many common points with the current sensors of the above embodiments. Therefore, the description of the common parts is omitted below, and the focus is on the different parts. In addition, the same reference numerals are attached to the same elements as those shown in the above embodiments.

[0385] <Extensions at both ends>

[0386] In the first embodiment, an example is shown in which the extension portion 42c extending in the z direction is formed on the second center portion 42d side of each of the two end sides 42f arranged in the x direction of the second shield portion 42. Fig.26 As shown in FIG. 1 , an extended portion 42 c is formed on the second both end portions 42 e side of each of the two end sides 42 f of the second shield portion 42 . Fig.26 Column (a) is a perspective view for explaining the arrangement of the shielding portion, the magneto-electric conversion portion, and the conductive busbar. Fig.26 Column (b) is a side view for explaining the arrangement of the shielding portion, the magneto-electric conversion portion, and the conductive busbar.

[0387] With this structure, the magnetic field that enters the second shielding portion 42 easily passes through the first shielding portion 41 via the extended portion 42c formed on the second end portions 42e. Fig. 27 As schematically shown, the first shield portion 41 is on the first end portion 41 e side. Similarly, the transmission path of the magnetic field is on the second end portion 42 e side of the second shield portion 42 .

[0388] in addition, Fig. 27The thick solid arrows shown indicate the current flowing through the conductive busbar 30. The solid arrows indicate the magnetic field passing through the first shielding portion 41. The dashed arrows indicate the magnetic field passing through the second shielding portion 42. The mark with a dot added to the center of the circle indicates the magnetic field from the second shielding portion 42 toward the first shielding portion 41 in the z direction. The mark with a cross added to the circle indicates the magnetic field from the first shielding portion 41 toward the second shielding portion 42 in the z direction.

[0389] Therefore, electromagnetic noise entering the second shield portion 42 is unlikely to flow to the first shield portion 41 via the second central portion 42d. Similarly, electromagnetic noise entering the first shield portion 41 is unlikely to penetrate into the second shield portion 42 via the first central portion 41d.

[0390] Therefore, the second central portion 42d and the first central portion 41d are less likely to be magnetically saturated. As a result, leakage of the magnetic field from the second central portion 42d and the first central portion 41d due to magnetic saturation is suppressed.

[0391] In addition, if Fig.26 As clearly indicated in the column (b) of FIG. 1 , the magnetoelectric converter 25 of each of the first sensing portion 21 and the second sensing portion 22 is located between the two extended portions 42c in the y direction. That is, the magnetoelectric converter 25 is located between the second central portion 42d and the first central portion 41d in the z direction. Therefore, the magnetic field leaked due to the magnetic saturation of each of the second central portion 42d and the first central portion 41d is suppressed from being input to the magnetoelectric converter 25. As a result, the reduction in the detection accuracy of the measured current is suppressed.

[0392] In the present embodiment, an example is shown in which the extension portions 42c are formed on the second end portions 42e of the two end sides 42f of the second shield portion 42. However, for example, the following example may also be used. Fig.28 As shown in the column (a) of FIG. 1 , the second shielding portion 42 also has an extended portion 42c formed in the second central portion 42d of the two end sides 42f. However, the extended portion 42c formed in the second central portion 42d is shorter in length in the z direction than the extended portion 42c formed in the second end portions 42e. As a result, the magnetic field intruding into the shielding portion 40 is more likely to pass through the end portions than the central portion.

[0393] In addition, if Fig.28 As shown in the column (b) of FIG. 4 , it is also possible to adopt a structure in which an extended portion 42c is formed on the second two end portions 42e side of one of the two end sides 42f, and an extended portion 42c is formed on the second two end portions 42e and the second central portion 42d of the other side. The lengths of the extended portions 42c formed on the second two end portions 42e and the second central portion 42d of the other side of the two end sides 42f are the same in the z direction. As a result, the magnetic field intruding into the shielding portion 40 is also more likely to pass through the end portion than the central portion. Fig.28 Columns (a) and (b) are perspective views for explaining the arrangement of the shielding portion, the magneto-electric conversion portion, and the conductive busbar, respectively.

[0394] Furthermore, if Fig.29 As shown in the column (a) of FIG. 1 , it is also possible to adopt a structure in which an extended portion 42c is formed on one side of the two ends of the second two ends 42e of one of the two end sides 42f and on the other side of the two ends of the second two ends 42e of the other side. The extended portion 42c formed on one of the two end sides 42f is separated from the extended portion 42c formed on the other side in the y direction and the x direction.

[0395] It is also possible to adopt a structure in which the extension portion 42c is formed not only in the second shield portion 42 but also in the first shield portion 41. The first shield portion 41 has two opposing sides 41f arranged in the x direction. Fig.29 As shown in the column (b) of FIG. 1 , it is possible to adopt a structure in which the extended portions 42 c are respectively formed on the first both end portions 41 e sides of the two opposing sides 41 f of the first shield portion 41 . Fig.29 Columns (a) and (b) are perspective views for explaining the arrangement of the shielding portion, the magneto-electric conversion portion, and the conductive busbar, respectively.

[0396] The extended portion 42c that can be formed in the first shield portion 41 can have a form similar to the extended portion 42c formed in the second shield portion 42 described above. The extended portion 42c formed in the first shield portion 41 corresponds to an extended portion.

[0397] The current sensor of this embodiment and the embodiments described below include the same components as those of the current sensor described in the first embodiment, so it goes without saying that the same operational effects can be achieved.

[0398] (Third embodiment)

[0399] Next, based on Figure 30 to Figure 32 A third embodiment will be described.

[0400] <Stress relief section>

[0401] In the present embodiment, the stress relieving portion 34 is formed on the conductive bus bar 30 of the first current sensor 11. The stress relieving portion 34 is formed on the first exposed portion 32 and the second exposed portion 33 of the conductive bus bar 30, respectively.

[0402] As described above, the conductive busbar 30 has the cover portion 31 covered by the sensor housing 50. The first exposed portion 32 and the second exposed portion 33 are respectively exposed from the sensor housing 50 and are integrally connected to the cover portion 31. In addition, the bolt holes 30c for passing bolts to electrically and mechanically connect to the conductive busbar 307 are formed in the first exposed portion 32 and the second exposed portion 33. The stress relief portion 34 is formed between the connection portion of the first exposed portion 32 and the second exposed portion 33 with the cover portion 31 and the formation portion of the bolt hole 30c.

[0403] like Fig.31 As shown, the stress relief portion 34 is partially bent from the back surface 30b of the conductive busbar 30 toward the surface 30a. By this bending, the stress relief portion 34 can bend and elastically deform in response to the force in the z direction applied to the conductive busbar 30. Fig.31 In the embodiment, the stress relaxation portion 34 is bent in a single wave pattern, but the number of waves and the bending form are not limited to the above example.

[0404] As described above, the conductive bus bar 30 and the current carrying bus bar 307 are fixed by bolts. The current carrying bus bar 307 of this embodiment corresponds to Fig.32 The first terminal block 307a and the second terminal block 307b are shown. The conductive busbar 30 is bolted to the first terminal block 307a and the second terminal block 307b. Thus, the conductive busbar 307 bridges the first terminal block 307a and the second terminal block 307b. The first terminal block 307a and the second terminal block 307b are electrically connected via the conductive busbar 307. Fig.32 As shown in FIG. 1 , a mark 307c is added to the bolt inserted into the bolt hole 30c of the conductive bus bar 30. The first terminal block 307a and the second terminal block 307b correspond to an external current supply unit.

[0405] The first terminal block 307a has a first mounting surface 307d facing the z direction. Similarly, the second terminal block 307b has a second mounting surface 307e facing the z direction. A fastening hole 307f for fastening the shaft portion of the bolt 307c is formed on the first mounting surface 307d and the second mounting surface 307e. The fastening hole 307f opens on the first mounting surface 307d and the second mounting surface 307e. The fastening hole 307f extends along the z direction. Fig.32 The column (a) shows a case where the positions of the first mounting surface and the second mounting surface in the z direction coincide with each other. Fig.32 Column (b) shows a case where the positions of the first mounting surface and the second mounting surface in the z direction do not coincide with each other.

[0406] The back surface 30b of the first exposed portion 32 faces the first mounting surface 307d in the z direction. The back surface 30b of the second exposed portion 33 faces the second mounting surface 307e in the z direction. In this embodiment, the first current sensor 11 is provided on the first terminal block 307a and the second terminal block 307b.

[0407] In such Fig.32 When the positions of the first loading surface 307d and the second loading surface 307e in the z direction are consistent as shown in the column (a) of , the inner surface 30b of the first exposed portion 32 contacts the first loading surface 307d and the inner surface 30b of the second exposed portion 33 contacts the second loading surface 307e. In this contact state, the front end of the shaft of the bolt 307c is inserted into the bolt hole 30c of the conductive busbar 30 and the fastening hole 307f of the terminal block from the z direction. And, the bolt 307c is fastened to the terminal block in such a manner that the head of the bolt 307c approaches the first loading surface 307d (the second loading surface 307e). The first exposed portion 32 and the second exposed portion 33 are clamped by the head of the bolt 307c and the terminal block. Thus, the first current sensor 11 is mechanically and electrically connected to the terminal block.

[0408] In contrast, in Fig.32 When the positions of the first loading surface 307d and the second loading surface 307e in the z direction are inconsistent as shown in the column (b) of FIG. 3 , when the inner surface 30b of the first exposed portion 32 contacts the first loading surface 307d, the inner surface 30b of the second exposed portion 33 does not contact the second loading surface 307e. The second loading surface 307e and the inner surface 30b of the second exposed portion 33 are separated in the z direction, and a gap is formed therebetween.

[0409] When the shaft of the bolt 307 c is passed through the bolt hole 30 c and the fastening hole 307 f in this separated state and the head of the bolt 307 c contacts the surface 30 a of the second exposed portion 33 , a force in the z direction acts on the second exposed portion 33 .

[0410] As described above, in order to enhance the strength of the measured magnetic field passing through the magnetoelectric converter 25, a narrow portion 31a having a shorter length in the x direction is partially formed in the cover portion 31. Since the narrow portion 31a has a shorter length in the x direction, its rigidity is lower than that of other portions. Therefore, the narrow portion 31a is easily deformed.

[0411] Therefore, if the force in the z direction when the bolt 307c is tightened acts on the second exposed portion 33 as described above, the narrow portion 31a may be deformed. The position of the narrow portion 31a in the sensor housing 50 may be displaced. Of course, even if the narrow portion 31a is not formed in the cover portion 31, the position of the cover portion 31 in the sensor housing 50 may be displaced. As a result, the distribution of the measured magnetic field passing through the magnetoelectric converter 25 may change.

[0412] In this regard, as described above, stress relief portions 34 are formed in the first exposed portion 32 and the second exposed portion 33, respectively. Therefore, even if there is a gap between the second loading surface 307e and the inner surface 30b of the second exposed portion 33 due to the difference in position between the first loading surface 307d and the second loading surface 307e in the z direction, the stress relief portion 34 is elastically deformed in response to the force of the bolt 307c in the z direction. Thus, deformation of the narrow portion 31a is suppressed. Displacement of the position of the narrow portion 31a in the sensor housing 50 is suppressed. As a result, changes in the distribution of the measured magnetic field passing through the magnetoelectric conversion portion 25 are suppressed. A decrease in the detection accuracy of the measured current is suppressed.

[0413] In addition, the length (thickness) between the surface 30a and the back surface 30b of the stress relief portion 34 is equal to the thickness of each of the cover portion 31, the first exposed portion 32, and the second exposed portion 33. Thus, unlike a structure in which the thickness of the stress relief portion is locally thinner than that of the cover portion and the exposed portion, the stress relief portion 34 is prevented from being locally heated by the passage of current. As a result, the reduction in the life of the conductive busbar 30 is prevented.

[0414] (Fourth embodiment)

[0415] Next, based on Figures 33-35 A fourth embodiment will be described. Fig.33 Column (a) shows a top view of the conductive busbar. Fig.33 Column (b) shows a side view of the conductive busbar. Fig.34 The column (a) shows the positions of the wiring substrate 20 and the conductive bus bar 30 on which the magnetoelectric converter 25 of each of the first sensor section 21 and the second sensor section 22 is mounted. Fig.34 Column (b) shows the displacement of the wiring substrate 20 relative to the conductive bus bar 30 . Fig.34 The column (c) shows the magnetic field transmitted through the magneto-electric converter 25 of each of the first sensor section 21 and the second sensor section 22 .

[0416] <Difference elimination>

[0417] In the first embodiment, the example in which the magnetoelectric converters 25 of the first sensor section 21 and the second sensor section 22 are arranged in the y direction is shown. Fig.33 As shown by the middle dotted line, the magnetoelectric converters 25 of the first sensor section 21 and the second sensor section 22 are arranged in the x direction. The magnetoelectric converters 25 of the first sensor section 21 correspond to the first magnetoelectric converters. The magnetoelectric converters 25 of the second sensor section 22 correspond to the second magnetoelectric converters.

[0418] The two magnetoelectric converters 25 are symmetrically arranged with the symmetry axis AS interposed therebetween. The positions of the two magnetoelectric converters 25 in the y direction are the same as the position of the symmetry axis AS (center point CP) in the y direction. Therefore, the two magnetoelectric converters 25 are arranged in the x direction with the center point CP interposed therebetween.

[0419] In addition, the two magnetoelectric converters 25 and the cover 31 are separated by the same distance in the z direction. In addition, the cover 31 and the narrow portion 31a are linearly symmetrical with respect to the symmetry axis AS. Thus, the measured magnetic field with different components in the z direction but the same components in the x direction is transmitted through the two magnetoelectric converters 25. Therefore, the absolute values ​​of the electrical signals output from the two magnetoelectric converters 25 are equal.

[0420] As described above, the cover 31 is covered by the base 51 of the sensor housing 50. The wiring board 20 carrying the two magnetoelectric converters 25 is mounted on the board support pins 56a formed in the sensor housing 50. Therefore, the displacement of the wiring board 20 in the z direction is restricted by the board support pins 56a.

[0421] However, the wiring substrate 20 is fixed to the substrate adhesive pins 56b via the substrate adhesive 56e. The substrate adhesive 56e deteriorates due to expansion or creep due to changes in ambient temperature. Therefore, the wiring substrate 20 may be displaced relative to the cover 31 in the x-direction and the y-direction.

[0422] When the wiring substrate 20 is displaced in the y direction, the x-direction component of the magnetic field to be measured that passes through the two magnetoelectric converters 25 does not change due to the symmetrical arrangement of the two magnetoelectric converters 25 in the x direction. Fig.34 As shown, when the wiring substrate 20 is displaced in the x direction, the x-direction component of the magnetic field to be measured that passes through both of them changes. As a result, the absolute values ​​of the electric signals output from the two magneto-electric converters 25 become unequal.

[0423] Fig.34 The dashed lines shown indicate the configuration positions of the two magnetoelectric converters 25 relative to the conductive busbar 30. The single-dash line indicates the symmetry axis AS passing through the center point CP of the conductive busbar 30. The double-dash line indicates the position of the two magnetoelectric converters 25 after displacement relative to the conductive busbar 30. The blank arrow indicates the displacement direction of the wiring substrate 20 carrying the two magnetoelectric converters 25 relative to the conductive busbar 30 due to the substrate adhesive 56e. Fig.34 The solid arrows shown in columns (a) and (b) of FIG. 2 represent the magnetic field passing through the magneto-electric conversion unit 25 . Fig.34 The solid arrows shown in the column (c) of FIG. 2 represent the changing direction of the magnetic field passing through the magnetoelectric converter 25 .

[0424] However, as described above, both magnetoelectric converters 25 are mounted on the wiring substrate 20. Therefore, even if the relative position of the wiring substrate 20 and the cover 31 in the x direction changes due to the deformation of the substrate adhesive 56e as described above, the relative distance between the two magnetoelectric converters 25 mounted on the wiring substrate 20 does not change. Therefore, when the relative position of the wiring substrate 20 and the cover 31 changes in the x direction due to the deformation of the substrate adhesive 56e, one direction of the two magnetoelectric converters 25 approaches the symmetry axis AS, and the other direction moves away from the symmetry axis AS. The distances are equal. Fig.34 In column (b), the distance is represented by Δ.

[0425] Therefore, if Fig.34 As shown in column (c), the measured magnetic field passing through one of the two magnetoelectric converters 25 decreases, while the measured magnetic field passing through the other increases. It is expected that the decrease and increase of the measured magnetic field passing through the two magnetoelectric converters 25 are equal. Fig.34 In column (b), the amount of change in the measured magnetic field is represented as ΔB.

[0426] Therefore, in this embodiment, the polarity of the electrical signal output by the two magnetoelectric converters 25 is reversed. Fig.35 This can be achieved by reversing the arrangement of the first magnetoresistance effect element 25a and the second magnetoresistance effect element 25b in the two magnetoelectric converters 25 as shown in FIG. Figure 7 The inverting input terminal and the non-inverting input terminal of the differential amplifier 25 c shown are inverted in the first sensor section 21 and the second sensor section 22 , so that the polarities of the two electrical signals can be reversed.

[0427] Thus, electrical signals having equal absolute values ​​of increase and decrease and different polarities are output from the two magnetoelectric converters 25. The two electrical signals generated by the first current sensor 11 are input to the battery ECU 801. The two electrical signals generated by the second current sensor 12 and the third current sensor 13 are input to the MGECU 802.

[0428] The battery ECU 801 and the MGECU 802 take the difference of two electrical signals. In the absence of displacement, if the absolute value of the electrical signal output from the two magnetoelectric conversion units 25 is set to B and the absolute value of the change in the electrical signal based on the displacement is set to ΔB, the differential processing can be expressed as B+ΔB-(-(B-ΔB))=2B. Alternatively, it can be expressed as B-ΔB-(-(B+ΔB))=2B. Positive corresponds to one side of the first polarity and the second polarity, and negative corresponds to the other side of the first polarity and the second polarity.

[0429] By performing the differentiation process in this way, the decrease and increase of the electric signal caused by the change in the relative position between the wiring substrate 20 and the cover portion 31 due to the deformation of the substrate adhesive 56e described above are eliminated. The battery ECU 801 and the MGECU 802 correspond to the differentiation unit.

[0430] In addition, for example, it is also possible to use Fig.36 As shown in FIG. 1 , a differential circuit 29 for taking the difference of the outputs of the two magnetoelectric converters 25 is mounted on the wiring substrate 20. The inverting input terminal and the non-inverting input terminal of the differential circuit 29 are connected to the first output wiring 20d and the second output wiring 20e. In this case, the differential circuit 29 corresponds to the differential section.

[0431] The change in the relative position of the wiring substrate 20 and the cover 31 in the x direction is caused not only by the deformation of the substrate adhesive 56e, but also by, for example, external stress acting on the vehicle and vibration caused by the driving of the engine 600. However, even if the relative position of the wiring substrate 20 and the cover 31 in the x direction changes, the difference of the two electrical signals output from the two magnetoelectric converters 25 is taken as described above. In this way, the reduction and increase of the electrical signal caused by the change in the relative position of the wiring substrate 20 and the cover 31 are eliminated. As a result, the reduction in the detection accuracy of the measured magnetic field is suppressed.

[0432] (Fifth embodiment)

[0433] Next, based on Fig.37 and Fig.38 A fifth embodiment will be described.

[0434] <Anisotropy of magnetic permeability>

[0435] In the first embodiment, the example in which the first shield portion 41 and the second shield portion 42 are manufactured separately by crimping a plurality of flat plates made of a soft magnetic material is shown. In contrast, in the present embodiment, the first shield portion 41 and the second shield portion 42 are manufactured separately by rolling electromagnetic steel.

[0436] As described in the first embodiment, by determining the rolling direction of the electromagnetic steel, the magnetic permeability of the shielding portion can be made anisotropic. In the present embodiment, the rolling direction of the first shielding portion 41 and the second shielding portion 42 is made along the z direction. Thus, the magnetic permeability of the first shielding portion 41 and the second shielding portion 42 is made anisotropic. In addition, the manufacturing method of the first shielding portion 41 and the second shielding portion 42 is not limited to the above example, and the materials whose magnetic permeability is originally anisotropic can also be used for manufacturing. In addition, one of the first shielding portion 41 and the second shielding portion 42 can also have anisotropy of magnetic permeability.

[0437] like Fig.37As shown, in each of the second current sensor 12 and the third current sensor 13, the independent sensors 71 are arranged in the x direction. The first shielding portion 41 and the second shielding portion 42 of each independent sensor 71 are arranged alternately in the x direction. Under this structure, the sensing direction of the magnetic field of the magnetoelectric converter 25 of the independent sensor 71 becomes the z direction and the y direction. In addition, under this structure, it is also possible to adopt a structure in which the first shielding portion 41 of one of the two independent sensors 71 arranged in the x direction and the second shielding portion 42 of the other are integrated into one.

[0438] In this way, in a structure where a plurality of independent sensors 71 are arranged in the x direction, the magnetic field to be measured generated from the conductive bus 30 of a certain independent sensor 71 becomes external noise for other independent sensors 71. This external noise is formed into a ring shape in a plane defined by the x direction and the z direction with the conductive bus 30 as the center. Therefore, the external noise has components along the x direction and the z direction. In this way, the environment in which the external noise along the x direction and the z direction easily penetrates the independent sensor 71 is formed.

[0439] Fig.37 2 independent sensors 71 are shown in FIG. 2 . A current to be measured flows in the direction of the cross in the circle through the conductive busbars 30 of the two independent sensors 71. A magnetic field to be measured is generated therefrom. For the adjacent independent sensors 71, the magnetic field to be measured generated from the conductive busbars 30 with the cross in the circle becomes electromagnetic noise. Fig.37 The magnetic field is represented by arrows.

[0440] As described above, the first shielding part 41 and the second shielding part 42 have anisotropy in the z direction. Therefore, the component of the external noise along the z direction will invade the first shielding part 41 and the second shielding part 42 respectively. In contrast, the component of the external noise along the x direction no longer depends on the anisotropy of the first shielding part 41 and the second shielding part 42. Therefore, the component along the x direction will pass through the magnetoelectric converter 25.

[0441] For example, Fig.37 When the magnetic field indicated by the dotted arrow in FIG. 1 is about to pass through the magnetoelectric converter 25, the component of the magnetic field along the z direction is about to actively pass through the first shield 41 and the second shield 42. However, a small amount of the component of the magnetic field in the x direction remains. Therefore, the component of the magnetic field in the x direction is about to pass through the magnetoelectric converter 25.

[0442] In contrast, the sensing directions of the magnetic field to be measured by the magnetoelectric converter 25 are the z direction and the y direction. The magnetoelectric converter 25 does not sense the magnetic field in the x direction. Therefore, even if the x-direction component of the above-mentioned electromagnetic noise passes through the magnetoelectric converter 25, the situation where the detection accuracy of the magnetic field to be measured is reduced is suppressed.

[0443] The arrangement structure of the independent sensors 71 is not limited to the above example. Fig.38 As shown, a structure in which the independent sensors 71 are arranged in the x-direction can also be considered. In this structure, the first shielding parts 41 of the independent sensor 71, the second shielding parts 42, and the magnetoelectric converter 25 are arranged in the x-direction. The sensing directions of the magnetic field of the magnetoelectric converter 25 of the independent sensor 71 become the x-direction and the y-direction. In this structure, it is also possible to adopt a structure in which the first shielding parts 41 of each of the multiple independent sensors 71 arranged in the x-direction are integrated into one. Similarly, it is also possible to adopt a structure in which the second shielding parts 42 of each of the multiple independent sensors 71 are integrated into one.

[0444] Fig.38 Two independent sensors 71 are also shown in FIG. 1 . The current to be measured flows through the conductive busbars 30 in the two independent sensors 71 in the direction of the cross in the circle. Fig.38 The magnetic field is also indicated by arrows in FIG. The magnetic field has components along the x direction and the z direction. Therefore, it becomes an environment in which external noise along the x direction and the z direction easily penetrates the independent sensor 71.

[0445] In this structure, the magnetic permeability of the first shielding part 41 and the second shielding part 42 is increased in the x direction compared with the y direction. Therefore, the component of the external noise along the x direction will invade the first shielding part 41 and the second shielding part 42 respectively. In contrast, the component of the external noise along the z direction no longer depends on the anisotropy of the first shielding part 41 and the second shielding part 42. Therefore, the component along the z direction will pass through the magnetoelectric converter 25.

[0446] For example, in Fig.38 When the magnetic field indicated by the dotted arrow is about to pass through the magnetoelectric converter 25, the component of the magnetic field along the x direction is about to actively pass through the first shield 41 and the second shield 42. However, a small amount of the component of the magnetic field in the z direction remains. Therefore, the component of the magnetic field in the z direction is about to pass through the magnetoelectric converter 25.

[0447] In contrast, the sensing directions of the magnetic field to be measured by the magnetoelectric converter 25 are the x direction and the y direction. The magnetoelectric converter 25 does not sense the magnetic field in the z direction. Therefore, even if the z-direction component of the above-mentioned electromagnetic noise passes through the magnetoelectric converter 25, the situation where the detection accuracy of the magnetic field to be measured is reduced is suppressed.

[0448] As mentioned above, although the preferred embodiment of the present disclosure has been described, the present disclosure is not limited to the above-mentioned embodiment, and can be implemented with various modifications within the scope not departing from the gist of the present disclosure.

[0449] (First Modification)

[0450] In the first embodiment, the example in which the notches 41c are formed at the four corners of the first shield portion 41 is shown. This shows an example in which the length in the x direction of the first end portions 41e of the first shield portion 41 is shorter than that of the first central portion 41d. In addition, the example in which the extended portion 42c is formed in the second shield portion 42 is shown.

[0451] In contrast, Fig.39 As shown in FIG. 1 , it is also possible to adopt a structure in which notches 41c are formed at the four corners of each of the first shielding portion 41 and the second shielding portion 42. Thus, the second end portions 42e are shorter in length in the x direction than the second central portion 42d. Fig.39 As shown in the column (b) of FIG. 2 , the magnetoelectric converter 25 of the first sensor section 21 and the second sensor section 22 mounted on the wiring substrate 20 is located between the first central portion 41 d and the second central portion 42 d . Fig.39 Column (a) is a perspective view for explaining the arrangement of the shielding portion, the magneto-electric conversion portion, and the conductive busbar. Fig.39 Column (b) is a side view for explaining the arrangement of the shielding portion, the magneto-electric conversion portion, and the conductive busbar.

[0452] In addition, you can Fig.40 As shown in the column (a) of FIG. 1 , the second shielding portion 42 does not have the extending portion 42c and the notch 41c. Fig.40 As shown in column (b) of FIG. 1 , a structure is adopted in which notches 41c are formed at two of the four corners of the first shielding portion 41. Fig.40 In column (b), the two notches 41c are arranged in the x direction. Fig.40 Columns (a) and (b) are three-dimensional diagrams for explaining the configuration of the shielding part, the magnetoelectric conversion part, and the conductive busbar. As shown above, the first two end portions 41e of the first shielding part 41 only need to be shorter in the x direction than the first central portion 41d, and the formation position of the notch 41c is not particularly limited.

[0453] (Second Modification)

[0454] In the first embodiment, the integrated housing 73 has a bottom wall 77 and a peripheral wall 78, and a plurality of independent sensors 71 are accommodated in the accommodation space formed by the bottom wall 77 and the peripheral wall 78. Figure 41 to Figure 43As shown, the integrated housing 73 does not have a peripheral wall 78. In this case, the independent sensor 71 is arranged to be rotated 90° relative to the bottom wall 77. As a result, the surface 30a and the inner surface 30b of the conductive busbar 30 of the independent sensor 71 face each other in the z direction. One surface 41a and the inner surface 41b of the first shielding part 41 face each other in the z direction. Similarly, one surface 42a and the inner surface 42b of the second shielding part 42 also face each other in the z direction. The sensing direction of the magnetoelectric conversion part 25 of the independent sensor 71 becomes the x direction and the y direction.

[0455] Therefore, if Fig.38 As shown, the first shields 41 of the plurality of individual sensors 71 are arranged in the x direction. The second shields 42 of the plurality of individual sensors 71 are arranged in the x direction. The magnetoelectric converters 25 of the plurality of individual sensors 71 are arranged in the x direction.

[0456] in addition, Fig.42 Column (a) shows a top view of the second current sensor. Fig.42 Column (b) shows a front view of the second current sensor. Fig.42 Column (c) shows a bottom view of the second current sensor. Fig.43 Column (a) shows a side view of the second current sensor. Fig.43 Column (b) shows a front view of the second current sensor. Fig.42 Column (b) and Fig.43 Column (b) of FIG. 1 shows the same figure.

[0457] In this modification, the terminal block 80 is provided with the same number of bolt holes along the z direction as the number of the independent sensors 71. The second exposed portion 33 of the independent sensor 71 is provided with a bolt hole 30c. The bolt passes through the bolt hole of the terminal block 80 and the bolt hole 30c of the second exposed portion 33, as well as the bolt hole formed in the terminal of the wire. And, a nut is fastened to the front end of the bolt. The nut is fastened to the bolt from the front end of the shaft of the bolt toward the head. The second exposed portion 33 and the terminal of the wire are clamped by the head of the bolt and the terminal block 80. As a result, the second exposed portion 33 and the terminal of the wire are in contact, and the two are electrically and mechanically connected.

[0458] (Third Modification)

[0459] As shown in the first embodiment, the rib 52a is formed on the sensor housing 50 of the first current sensor 11. Fig.44As shown, the rib 52a may be formed in the sensor housing 50 of the independent sensor 71. Furthermore, a guide portion 72a for inserting the independent sensor 71 into the wiring shell 72 may be formed in the bottom wall 77 of the integrated housing 73. The guide portion 72a is a hollow groove having a shape similar to the rib 52a. The guide portion 72a is open in the z direction. Through the opening, the rib 52a passes through the hollow of the guide portion 72a. This makes it easy to assemble the independent sensor 71 into the integrated housing 73. In addition, Fig.44 In the illustrated modification, a groove 77 c is formed in the bottom wall 77 for accommodating the protruding end of the connection terminal 60 in the independent sensor 71 .

[0460] (Fourth Modification)

[0461] like Fig.45 As schematically shown in the column (a) of FIG. 1 , each embodiment shows an example in which independent sensors 71 are provided for the U-phase stator winding and the V-phase stator winding of the motor. An example in which these independent sensors 71 include the first sensor unit 21 and the second sensor unit 22 is shown.

[0462] However, it is also possible Fig.45 As schematically shown in the column (b) of FIG. 1 , an independent sensor 71 is provided for each of the U-phase stator winding, the V-phase stator winding, and the W-phase stator winding of the motor. These independent sensors 71 may be configured to include only the first sensor unit 21 .

[0463] As described above, the current of the remaining stator winding can be detected based on the current flowing through two of the three-phase stator windings. Therefore, the current of the remaining stator winding can be detected based on the outputs of two of the first sensor units 21 of the three independent sensors 71 provided in the three-phase stator windings. In addition, the current of the remaining stator winding can be detected by the first sensor unit 21 of the independent sensor 71 provided in the remaining stator winding. By comparing the two detected currents, it can be determined whether an abnormality has occurred in one of them.

[0464] (Other Modifications)

[0465] In each embodiment, an example of applying a current sensor to a vehicle-mounted system 100 constituting a hybrid system is shown. However, the vehicle-mounted system to which the current sensor is applied is not limited to the above examples. For example, the current sensor can also be applied to the vehicle-mounted system of an electric vehicle or a fuel vehicle. The system to which the current sensor is applied is not particularly limited.

[0466] The present disclosure is described based on the embodiments, but it should be understood that the present disclosure is not limited to the embodiments and structures. The present disclosure also includes various modifications and modifications within the scope of equality. In addition, various combinations and forms, and other combinations and forms containing only one element, above or below them, also fall within the scope and scope of thought of the present disclosure.

Claims

1. A current sensor, characterized in that: have: a sensor housing having a base; A conductive member through which the measured current flows, having a covering portion covered by the base portion; A wiring substrate is arranged in a first accommodation space formed by one end surface of the base and a first surrounding portion formed on the one end surface; A magnetoelectric conversion unit is provided on a surface of the wiring substrate facing the one end surface of the base portion, and converts the magnetic field to be measured generated by the flow of the current to be measured into an electrical signal; as well as a shielding portion for suppressing input of electromagnetic noise to the magneto-electric conversion portion; The shielding part includes a plate-shaped first shielding part and a second shielding part, and one surface of each of the first shielding part and the second shielding part is separated from each other and faces each other. The first shielding portion is arranged in the first storage space in a state where the first surface thereof faces the wiring substrate, and the second shielding portion is arranged in the second storage space in a state where the first surface thereof faces the other end surface on the opposite side of the one end surface of the base, and the second storage space is formed by the other end surface of the base and the second surrounding portion formed on the other end surface. A portion of the conductive member and the magneto-electric converter are located between the one surface of the first shield and the one surface of the second shield. A portion of the conductive member located between the first shield portion and the second shield portion extends in a direction extending along the one surface of the first shield portion. The central portions of the first shield portion and the second shield portion in the extension direction are longer than the both ends thereof in the lateral direction along the one surface of the first shield portion and intersecting the extension direction. The first shielding portion is in the form of a flat plate. The second shielding portion has extending portions extending toward the first shielding portion at both ends of the central portion in the lateral direction. The extended portion has an end surface facing the one surface of the central portion of the first shield portion in a direction intersecting the lateral direction and the extension direction. The magneto-electric converter is located between both ends of the first shield and the second shield in the extending direction.

2. The current sensor according to claim 1, characterized in that The first shield portion and the second shield portion each have a rectangular shape with notches at four corners and a planar shape in which the length of the central portion in the lateral direction is longer than that of the two ends.

3. The current sensor according to claim 1 or 2, characterized in that: The magnetoelectric conversion unit includes a magnetoelectric conversion element that detects a component of a magnetic field that passes through the magnetoelectric conversion unit in the lateral direction.

4. The current sensor according to claim 1 or 2, characterized in that: The first shield portion and the second shield portion each have anisotropy such that the magnetic permeability in the transverse direction is higher than that in the extension direction.

5. The current sensor according to claim 1 or 2, characterized in that: The cover portion of the conductive member is insert-molded on the base portion and has a narrow portion whose width in the lateral direction gradually narrows. The magneto-electric converter is provided between a central portion of the first shield portion and the narrow portion on the facing surface of the wiring substrate.

6. The current sensor according to claim 1 or 2, characterized in that: The magnetoelectric conversion unit has at least two magnetoelectric conversion elements. The at least two magneto-electric conversion elements are arranged side by side in the extension direction at positions opposing the narrow portion on the opposing surfaces of the wiring substrate.

7. The current sensor according to claim 1 or 2, characterized in that: The base portion has a groove formed on the other end surface, and the groove accommodates the extended portion of the second shielding portion. The covering portion of the conductive member is located between the extending portions arranged in the groove portion.

8. The current sensor according to claim 1 or 2, characterized in that: The first storage space has a larger horizontal plane size than the second storage space. The wiring substrate has a larger size in the lateral direction than the first shield portion, and includes a connection terminal at a position not facing the first shield portion.

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