Wafer laser slotting non-stop cutting mark detection method, device, equipment and medium
Through the two camera systems, the location of cut marks and feature points can be detected and compensated without stopping, and the problem of cutting mark detection in the prior art affecting cutting efficiency, improving processing efficiency and reducing feature requirements.
Patent Information
- Application Number
- CN202510029267.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2025-05-09
AI Technical Summary
In the prior art, the cutting mark detection requires a pause process, which seriously affects the cutting efficiency. At the same time, the coaxial camera detection requires high requirements for the peripheral features of the cutting path, which increases the difficulty of identification.
Using a two-camera system, the first camera captures the cut mark position in real time, and the second camera captures the chip's feature point position in real time, and realizes real-time detection and compensation of the cut mark position and feature point position by keeping the relative position unchanged.
It realizes scratch detection and compensation without stopping, improves processing efficiency, reduces the requirements for the periphery of the cutting track, and is suitable for products with fewer features.
Smart Images
Figure CN119963503A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of cut mark detection technology, and in particular to a method, device, equipment and medium for detecting cut marks during wafer laser grooving without stopping the machine. Background Art
[0002] In the semiconductor device manufacturing process, chips are distributed in a grid pattern in the wafer. The wafer laser grooving process uses laser high-temperature vaporization along specific cutting paths to remove the circuit layer on the surface of the cutting path, thereby avoiding cracking, pulling, etc. caused by the circuit layer in subsequent processes.
[0003] The laser slotting device will fix the wafer on the work plate, then locate (align) the cutting path, and then hit the laser on the surface of the chip cutting path to vaporize the circuit layer on the cutting path surface to complete the slotting. Since the optical path lens will have a certain temperature change during the working process, the position of the light spot will fluctuate due to thermal expansion and contraction, which will cause the actual cut to shift; and the cutting path interval of the wafer may also be affected by the step progress of the previous processing, and there will be a certain step shift, so it is necessary to calibrate the cut and cutting path position regularly.
[0004] In the prior art, it is usually necessary to first perform laser grooving on the wafer, then pause and search for the characteristic points on the chip to confirm whether the position of the cutting path is offset; then project the cut marks formed after laser grooving to check whether the center of the cut mark is offset from the center of the image. This technology requires pausing during measurement and can only continue after the detection is completed, which seriously affects the cutting efficiency.
[0005] In addition, there is also a real-time cut mark detection technology that uses a camera coaxial with the light outlet. However, since the processing point and the camera are coaxial, the image is taken at the same time as the processing, and a large amount of residue that has not been discharged in time will be included in the captured image, greatly increasing the difficulty of identification. In order to capture more features, the coaxial camera generally uses a lower magnification lens to obtain a wider field of view, but the resolution of the low-magnification lens is low, and the requirements for the features around the cutting path are very high. A large number of distinct light and dark features are required to achieve stable production. Summary of the invention
[0006] The embodiments of the present invention provide a method, device, equipment and medium for detecting cut marks during wafer laser grooving without stopping the machine, aiming to solve the problem in the prior art that cut mark detection seriously affects cutting efficiency.
[0007] In a first aspect, an embodiment of the present invention provides a method for detecting cut marks of wafer laser slotting without stopping the machine, wherein the processing module includes a laser processing port and a camera module, wherein the camera module includes a first camera and a second camera, and the method includes:
[0008] Obtain a first image captured by a first camera, and determine whether there is a deviation between the center of the cut mark and the center of the first image;
[0009] If there is a deviation between the center of the cut mark and the center of the first camera, based on the deviation between the center of the cut mark and the center of the first image, adjusting the position of the laser processing port so that the center of the cut mark is aligned with the center of the first image;
[0010] Acquire a second image captured by a second camera, and determine whether the position of the feature point of the chip deviates from the position of the preset template in the second image;
[0011] If there is a deviation between the position of the feature point of the chip and the preset template position in the second image, the position of the processing module is adjusted based on the deviation between the position of the feature point of the chip and the preset template position in the second image so that the position of the feature point of the chip is aligned with the preset template position in the second image.
[0012] A further technical solution is that the method further comprises:
[0013] The positions of the first camera and the second camera are calibrated so that the image center of the first camera is aligned with the cutting path center of the chip, and the template position in the image of the second camera is aligned with the feature point position of the chip.
[0014] A further technical solution is that the calibrating the positions of the first camera and the second camera includes:
[0015] Control the second camera to find the feature point position of the chip, and align the template position in the image of the second camera with the feature point position of the chip;
[0016] Controlling the first camera to find the center of the cutting path of the chip, and aligning the center of the image of the first camera with the center of the cutting path;
[0017] The relative position of the first camera and the second camera is recorded, and the relative position of the first camera and the second camera is kept unchanged.
[0018] A further technical solution is that, based on the deviation between the center of the cut mark and the center of the first image, the position of the laser processing opening is adjusted so that the center of the cut mark is aligned with the center of the first image, including:
[0019] If the center of the cut mark is above the center of the first image by a first distance, the camera module is controlled to move up by the first distance, and the processing module is controlled to move down by the first distance.
[0020] A further technical solution is that, based on the deviation between the center of the cut mark and the center of the first image, the position of the laser processing opening is adjusted so that the center of the cut mark is aligned with the center of the first image, including:
[0021] If the center of the cut mark is below the center of the first image by a second distance, the camera module is controlled to move downward by the second distance, and the processing module is controlled to move upward by the second distance.
[0022] A further technical solution is that the position of the processing module is adjusted based on the deviation between the position of the characteristic point of the chip and the position of the template preset in the second image so that the position of the characteristic point of the chip is aligned with the position of the template preset in the second image, including:
[0023] If the position of the feature point is lower than the position of the template by a third distance, the processing module is controlled to move downward by the third distance.
[0024] A further technical solution is that the position of the processing module is adjusted based on the deviation between the position of the characteristic point of the chip and the position of the template preset in the second image so that the position of the characteristic point of the chip is aligned with the position of the template preset in the second image, including:
[0025] If the position of the feature point is above the template position by a fourth distance, the processing module is controlled to move up by the fourth distance.
[0026] In a second aspect, an embodiment of the present invention further provides a non-stop wafer laser grooving cut mark detection device, which includes a unit for executing the above method.
[0027] In a third aspect, an embodiment of the present invention further provides a computer device, which includes a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the above method when executing the computer program.
[0028] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium, wherein the storage medium stores a computer program, and the computer program can implement the above method when executed by a processor.
[0029] The embodiment of the present invention provides a method, device, equipment and medium for detecting cut marks during wafer laser slotting without stopping. The method includes: obtaining a first image captured by a first camera, and determining whether there is a deviation between the center of the cut mark and the center of the first image; if there is a deviation between the center of the cut mark and the center of the first camera, adjusting the position of the laser processing port based on the deviation between the center of the cut mark and the center of the first image, so that the center of the cut mark is aligned with the center of the first image; obtaining a second image captured by a second camera, and determining whether there is a deviation between the position of the feature point of the chip and the preset template position in the second image; if there is a deviation between the position of the feature point of the chip and the preset template position in the second image, adjusting the position of the processing module based on the deviation between the position of the feature point of the chip and the preset template position in the second image, so that the position of the feature point of the chip is aligned with the preset template position in the second image, so that the real-time detection and compensation of the cut mark position and the feature point position can be realized without stopping the machine, so as to avoid affecting the cutting efficiency.
[0030] The present invention adds a second camera to capture the position of feature points in real time, and cooperates with the first camera to capture the position of cutting marks in real time, thereby realizing non-stop detection and improving processing efficiency. It also avoids the disadvantage of coaxial camera detection that has high requirements for the peripheral features of the cutting path, and can be widely used in various products, especially products with fewer features. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.
[0032] Figure 1 A schematic diagram of a process flow of a method for detecting cut marks during wafer laser grooving without stopping the machine provided by an embodiment of the present invention;
[0033] Figure 2 A schematic diagram of a use scenario of a method for detecting cut marks during wafer laser grooving without stopping the machine provided by an embodiment of the present invention;
[0034] Figure 3 A schematic block diagram of a computer device provided in an embodiment of the present invention. DETAILED DESCRIPTION
[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0036] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.
[0037] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.
[0038] It should be further understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
[0039] As used in this specification and the appended claims, the term "if" may be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined" or "if [described condition or event] is detected" may be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.
[0040] See also Figure 1-Figure 2 The embodiment of the present invention provides a method for detecting cut marks during laser grooving of a wafer without stopping the machine. Figure 1 As shown, the method comprises the following steps:
[0041] S1, obtaining a first image captured by a first camera, and determining whether there is a deviation between the center of the cut mark and the center of the first image.
[0042] For specific implementation, see Figure 2 The processing module includes a laser processing 10 and a camera module, and the camera module includes a first camera 20 and a second camera 30.
[0043] In an embodiment of the present invention, first, the positions of the first camera and the second camera are calibrated so that the image center of the first camera is aligned with the cutting path center of the chip, and the template position in the image of the second camera is aligned with the feature point position of the chip. After the calibration is completed, the relative positions of the first camera and the second camera remain unchanged, and the camera module is movable, that is, the first camera and the second camera are movable at the same time. At the same time, the processing module is movable, that is, the laser processing port, the first camera and the second camera are movable at the same time. It should be noted that the cutting path center of the chip is the center of the cutting path reserved for the subsequent separation process during the front-end processing of the wafer, and is relatively fixed with the feature point position on the chip, so the cutting path center is calibrated before cutting.
[0044] Specifically, the above step of "calibrating the positions of the first camera and the second camera" specifically includes the following steps: controlling the second camera to find the position of the characteristic point of the chip, and aligning the template position in the image of the second camera with the position of the characteristic point of the chip; controlling the first camera to find the position of the center of the cutting path of the chip, and aligning the center of the image of the first camera with the center of the cutting path; recording the relative position of the first camera and the second camera, and keeping the relative position of the first camera and the second camera unchanged. By keeping the relative position of the first camera and the second camera unchanged, the first camera and the second camera can move together as a whole.
[0045] Furthermore, after the positions of the first camera and the second camera are calibrated, the first image captured by the first camera is obtained to determine whether there is a deviation between the center of the cut mark and the center of the first image, that is, to determine whether the center of the cut mark is aligned with the center of the first image.
[0046] S2: If there is a deviation between the center of the cut mark and the center of the first camera, based on the deviation between the center of the cut mark and the center of the first image, adjust the position of the laser processing port so that the center of the cut mark is aligned with the center of the first image.
[0047] In a specific implementation, the center of the cut is the center of the cut made by the laser during the laser grooving process. It may be offset due to thermal expansion and contraction of the optical path, and compensation correction is required during the cutting process. Specifically, if there is a deviation between the center of the cut and the center of the first camera, the position of the laser processing port is adjusted based on the deviation between the center of the cut and the center of the first image so that the center of the cut is aligned with the center of the first image.
[0048] Specifically, in some embodiments, the laser processing port is usually unable to move independently. In order to realize the movement of the laser processing port while keeping the camera module stationary, the above step of "adjusting the position of the laser processing port based on the deviation between the center of the cut mark and the center of the first image so that the center of the cut mark is aligned with the center of the first image" specifically includes the following steps: if the center of the cut mark is above the center of the first image by a first distance, the camera module is controlled to move up by a first distance, and then the processing module is controlled to move down by a first distance; if the center of the cut mark is below the center of the first image by a second distance, the camera module is controlled to move down by a second distance, and then the processing module is controlled to move up by a second distance.
[0049] Specifically, when the camera is controlled to move, the laser processing port does not move; and when the processing module moves, the laser processing port, the first camera and the second camera move simultaneously. Thus, if the center of the cut mark is above the center of the first image by a first distance, the camera module is controlled to move up by the first distance, and then the processing module is controlled to move down by the first distance. The final effect is that the laser processing port moves downward by the first distance, while the position of the camera module remains unchanged, thereby ensuring that the position of the feature points is not affected during the cut mark compensation.
[0050] Furthermore, if the center of the cut mark is lower than the center of the first image by a second distance, the camera module is controlled to move down by the second distance, and then the processing module is controlled to move up by the second distance; the final effect is that the laser processing port moves upward by the first distance, while the position of the camera module remains unchanged, thereby ensuring that the position of the feature points is not affected during the cut mark compensation.
[0051] S3, obtaining a second image captured by a second camera, and determining whether the position of the feature point of the chip deviates from the position of a preset template in the second image.
[0052] In a specific implementation, a second image captured by a second camera is obtained to determine whether the position of the feature point of the chip deviates from the position of the template preset in the second image, that is, to determine whether the position of the feature point of the chip is aligned with the position of the template preset in the second image.
[0053] S4, if there is a deviation between the position of the feature point of the chip and the preset template position in the second image, based on the deviation between the position of the feature point of the chip and the preset template position in the second image, adjust the position of the processing module so that the position of the feature point of the chip is aligned with the preset template position in the second image.
[0054] In a specific implementation, if there is a deviation between the position of the feature point of the chip and the preset template position in the second image, the position of the processing module is adjusted based on the deviation between the position of the feature point of the chip and the preset template position in the second image so that the position of the feature point of the chip is aligned with the preset template position in the second image.
[0055] For example, in some embodiments, the above step of "adjusting the position of the processing module based on the deviation between the position of the characteristic point of the chip and the preset template position in the second image, so that the position of the characteristic point of the chip is aligned with the preset template position in the second image" specifically includes the following steps: if the position of the characteristic point is lower than the template position by a third distance, controlling the processing module to move down by a third distance; if the position of the characteristic point is higher than the template position by a fourth distance, controlling the processing module to move up by a fourth distance. Specifically, when the processing module moves, the laser processing port, the first camera, and the second camera move simultaneously.
[0056] By repeatedly executing the above steps S1-S4, the image center of the first camera is finally aligned with the center of the cut mark, and the template position in the image of the second camera is aligned with the feature point position of the chip, thereby realizing real-time detection and compensation of the cut mark position and the feature point position.
[0057] An embodiment of the present invention proposes a method for detecting cut marks during wafer laser grooving without stopping, comprising: acquiring a first image captured by a first camera, and determining whether there is a deviation between the center of the cut mark and the center of the first image; if there is a deviation between the center of the cut mark and the center of the first camera, adjusting the position of a laser processing port based on the deviation between the center of the cut mark and the center of the first image, so that the center of the cut mark is aligned with the center of the first image; acquiring a second image captured by a second camera, and determining whether the position of a feature point of a chip deviates from a preset template position in the second image; if there is a deviation between the position of a feature point of the chip and the preset template position in the second image, adjusting the position of a processing module based on the deviation between the position of a feature point of the chip and the preset template position in the second image, so that the position of a feature point of the chip is aligned with the preset template position in the second image, thereby enabling real-time detection and compensation of the cut mark position and the feature point position without stopping, thereby avoiding affecting the cutting efficiency.
[0058] The present invention adds a second camera to capture the position of feature points in real time, and cooperates with the first camera to capture the position of cutting marks in real time, thereby realizing non-stop detection and improving processing efficiency. It also avoids the disadvantage of coaxial camera detection that has high requirements for the peripheral features of the cutting path, and can be widely used in various products, especially products with fewer features.
[0059] Corresponding to the above wafer laser slotting non-stop cut mark detection method, the present invention also provides a wafer laser slotting non-stop cut mark detection device. The wafer laser slotting non-stop cut mark detection device includes a unit for executing the above wafer laser slotting non-stop cut mark detection method, and the wafer laser slotting non-stop cut mark detection device can be configured in a desktop computer, a tablet computer, a laptop computer, and other terminals. Specifically, the wafer laser slotting non-stop cut mark detection device includes;
[0060] A first judgment unit is used to obtain a first image captured by a first camera, and judge whether there is a deviation between the center of the cut mark and the center of the first image;
[0061] A first compensation unit is used to adjust the position of the laser processing port based on the deviation between the center of the cut mark and the center of the first image if there is a deviation between the center of the cut mark and the center of the first camera, so that the center of the cut mark is aligned with the center of the first image;
[0062] A second judgment unit is used to obtain a second image captured by a second camera, and judge whether the position of the characteristic point of the chip deviates from the preset template position in the second image;
[0063] The second compensation unit is used to adjust the position of the processing module based on the deviation between the position of the feature point of the chip and the preset template position in the second image, so that the position of the feature point of the chip is aligned with the preset template position in the second image.
[0064] In some embodiments, the wafer laser slotting non-stop cutting mark detection device further includes:
[0065] The calibration unit is used to calibrate the positions of the first camera and the second camera so that the image center of the first camera is aligned with the cutting path center of the chip, and the template position in the image of the second camera is aligned with the feature point position of the chip.
[0066] In some embodiments, calibrating the positions of the first camera and the second camera includes:
[0067] Control the second camera to find the feature point position of the chip, and align the template position in the image of the second camera with the feature point position of the chip;
[0068] Controlling the first camera to find the center of the cutting path of the chip, and aligning the center of the image of the first camera with the center of the cutting path;
[0069] The relative position of the first camera and the second camera is recorded, and the relative position of the first camera and the second camera is kept unchanged.
[0070] In some embodiments, adjusting the position of the laser processing port based on the deviation between the center of the cut mark and the center of the first image so that the center of the cut mark is aligned with the center of the first image includes:
[0071] If the center of the cut mark is above the center of the first image by a first distance, the camera module is controlled to move up by the first distance, and the processing module is controlled to move down by the first distance.
[0072] In some embodiments, adjusting the position of the laser processing port based on the deviation between the center of the cut mark and the center of the first image so that the center of the cut mark is aligned with the center of the first image includes:
[0073] If the center of the cut mark is below the center of the first image by a second distance, the camera module is controlled to move downward by the second distance, and the processing module is controlled to move upward by the second distance.
[0074] In some embodiments, adjusting the position of the processing module based on the deviation between the position of the feature point of the chip and the position of the template preset in the second image so that the position of the feature point of the chip is aligned with the position of the template preset in the second image includes:
[0075] If the position of the feature point is lower than the position of the template by a third distance, the processing module is controlled to move downward by the third distance.
[0076] In some embodiments, adjusting the position of the processing module based on the deviation between the position of the feature point of the chip and the position of the template preset in the second image so that the position of the feature point of the chip is aligned with the position of the template preset in the second image includes:
[0077] If the position of the feature point is above the template position by a fourth distance, the processing module is controlled to move up by the fourth distance.
[0078] It should be noted that technicians in the relevant field can clearly understand that the specific implementation process of the above-mentioned wafer laser grooving non-stop cut mark detection device and each unit can refer to the corresponding description in the aforementioned method embodiment, and for the convenience and brevity of description, it will not be repeated here.
[0079] The wafer laser slotting non-stop cut mark detection device can be implemented in the form of a computer program. The computer program can be used in Figure 3 Runs on the computer device shown.
[0080] See also Figure 3 , Figure 3 5 is a schematic block diagram of a computer device provided in an embodiment of the present application. The computer device 500 may be a terminal or a server, wherein the terminal may be an electronic device with communication functions such as a smart phone, a tablet computer, a laptop computer, a desktop computer, a personal digital assistant, and a wearable device. The server may be an independent server or a server cluster composed of multiple servers.
[0081] The computer device 500 includes a processor 502 , a memory, and a network interface 505 connected via a system bus 501 , wherein the memory may include a non-volatile storage medium 503 and an internal memory 504 .
[0082] The non-volatile storage medium 503 can store an operating system 5031 and a computer program 5032. When the computer program 5032 is executed, the processor 502 can execute a non-stop cutting mark detection method for wafer laser slotting.
[0083] The processor 502 is used to provide computing and control capabilities to support the operation of the entire computer device 500 .
[0084] The internal memory 504 provides an environment for the operation of the computer program 5032 in the non-volatile storage medium 503. When the computer program 5032 is executed by the processor 502, the processor 502 can execute a method for detecting cut marks during wafer laser slotting without stopping the machine.
[0085] The network interface 505 is used to communicate with other devices over the network. Those skilled in the art will appreciate that the above structure is only a block diagram of a portion of the structure related to the present application solution, and does not constitute a limitation on the computer device 500 to which the present application solution is applied. The specific computer device 500 may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.
[0086] The processor 502 is used to run a computer program 5032 stored in the memory to implement the steps of a method for detecting cut marks during wafer laser grooving without stopping the machine provided in any of the above method embodiments.
[0087] It should be understood that in the embodiment of the present application, the processor 502 may be a central processing unit (CPU), and the processor 502 may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.
[0088] It is understood by those skilled in the art that all or part of the processes in the method for implementing the above embodiment can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a storage medium, which is a computer-readable storage medium. The computer program is executed by at least one processor in the computer system to implement the process steps of the embodiment of the above method.
[0089] Therefore, the present invention also provides a storage medium. The storage medium may be a computer-readable storage medium. The storage medium stores a computer program. When the computer program is executed by a processor, the processor executes the steps of a non-stop cut mark detection method for wafer laser slotting provided in any of the above method embodiments.
[0090] The storage medium is a physical, non-transient storage medium, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a magnetic disk, or an optical disk, etc., which can store program codes. The computer-readable storage medium can be non-volatile or volatile.
[0091] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in terms of function in the above description. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.
[0092] In the several embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of each unit is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.
[0093] The steps in the method of the embodiment of the present invention can be adjusted in order, combined and deleted according to actual needs. The units in the device of the embodiment of the present invention can be combined, divided and deleted according to actual needs. In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.
[0094] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, terminal, or network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention.
[0095] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0096] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.
[0097] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.
Claims
1. A method for detecting cut marks during wafer laser grooving without stopping the machine, characterized in that: The processing module includes a laser processing port and a camera module, the camera module includes a first camera and a second camera, and the method includes: Obtain a first image captured by a first camera, and determine whether there is a deviation between the center of the cut mark and the center of the first image; If there is a deviation between the center of the cut mark and the center of the first camera, based on the deviation between the center of the cut mark and the center of the first image, adjusting the position of the laser processing port so that the center of the cut mark is aligned with the center of the first image; Acquire a second image captured by a second camera, and determine whether the position of the feature point of the chip deviates from the position of the preset template in the second image; If there is a deviation between the position of the feature point of the chip and the preset template position in the second image, the position of the processing module is adjusted based on the deviation between the position of the feature point of the chip and the preset template position in the second image so that the position of the feature point of the chip is aligned with the preset template position in the second image.
2. The wafer laser slotting non-stop cut mark detection method according to claim 1, characterized in that: The method further comprises: The positions of the first camera and the second camera are calibrated so that the image center of the first camera is aligned with the cutting path center of the chip, and the template position in the image of the second camera is aligned with the feature point position of the chip.
3. The wafer laser slotting non-stop cut mark detection method according to claim 2, characterized in that: The calibrating the positions of the first camera and the second camera includes: Control the second camera to find the feature point position of the chip, and align the template position in the image of the second camera with the feature point position of the chip; Controlling the first camera to find the center of the cutting path of the chip, and aligning the center of the image of the first camera with the center of the cutting path; The relative position of the first camera and the second camera is recorded, and the relative position of the first camera and the second camera is kept unchanged.
4. The method for detecting cut marks during wafer laser grooving without stopping the machine according to claim 1, characterized in that: The step of adjusting the position of the laser processing opening based on the deviation between the center of the cut mark and the center of the first image so that the center of the cut mark is aligned with the center of the first image comprises: If the center of the cut mark is above the center of the first image by a first distance, the camera module is controlled to move up by the first distance, and the processing module is controlled to move down by the first distance.
5. The method for detecting cut marks during wafer laser grooving without stopping the machine according to claim 1, characterized in that: The step of adjusting the position of the laser processing opening based on the deviation between the center of the cut mark and the center of the first image so that the center of the cut mark is aligned with the center of the first image comprises: If the center of the cut mark is below the center of the first image by a second distance, the camera module is controlled to move downward by the second distance, and the processing module is controlled to move upward by the second distance.
6. The method for detecting cut marks during wafer laser grooving without stopping the machine according to claim 1, characterized in that: The step of adjusting the position of the processing module based on the deviation between the position of the feature point of the chip and the position of the template preset in the second image so that the position of the feature point of the chip is aligned with the position of the template preset in the second image includes: If the position of the feature point is lower than the position of the template by a third distance, the processing module is controlled to move downward by the third distance.
7. The method for detecting cut marks during wafer laser grooving without stopping the machine according to claim 1, characterized in that: The step of adjusting the position of the processing module based on the deviation between the position of the feature point of the chip and the position of the template preset in the second image so that the position of the feature point of the chip is aligned with the position of the template preset in the second image includes: If the position of the feature point is above the template position by a fourth distance, the processing module is controlled to move up by the fourth distance.
8. A wafer laser slotting non-stop cut mark detection device, characterized in that: The method comprises a unit for executing the method according to any one of claims 1 to 7.
9. A computer device, characterized in that: The computer device includes a memory and a processor, the memory stores a computer program, and the processor implements the method according to any one of claims 1 to 7 when executing the computer program.
10. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 7 can be implemented.