Display panel

Abstract

The invention discloses a display panel. The display panel comprises a substrate, at least one microchip, a reflecting cover and a plurality of light-emitting elements, the substrate has a first surface and a second surface. The at least one microchip is electrically connected to the substrate and located on the first surface. The reflective cover covers the at least one microchip. The reflective cover includes a plurality of openings. The light-emitting elements are electrically connected to the substrate and located on the first surface. The plurality of light-emitting elements are located in the plurality of openings. The exhaust structure is disposed in the substrate and penetrates from the first surface to the second surface to remove bubbles between the reflective cover and the at least one microchip.

Description

Technical Field

[0001] The present invention relates to a display panel, and in particular to a display panel with an exhaust structure. Background Art

[0002] At present, the substrates of direct-type light panels are mostly glass fiber epoxy resin copper foil (FR4) substrates or BT (BismaleimideTriazine) resin substrates, and the reflectivity of white ink on these two substrates is about 70% to 75%. In order to improve the operating efficiency of the light panel, increasing the reflectivity of the light panel is one way. For example, attaching a reflective sheet to the direct-type light panel can increase the reflectivity by 8% to 14%.

[0003] However, when attaching the reflective sheet to the light board, bubbles are easily left between the reflective sheet and the microchip, causing uneven attachment. Although setting a seam line around the microchip on the reflective sheet can solve the problem of bubble residue, the user will see the seam line when viewing the light board, affecting the overall taste. Therefore, how to simultaneously improve the reflectivity of the light board and avoid affecting the overall taste is one of the goals that researchers in this field are working hard to study. Summary of the invention

[0004] The invention provides a display panel which can eliminate air bubbles between a reflective cover and a microchip.

[0005] The display panel of the present invention comprises a substrate, at least one microchip, a reflective cover and a plurality of light-emitting elements. The substrate has a first surface and a second surface. The at least one microchip is electrically connected to the substrate and is located on the first surface. The reflective cover covers the at least one microchip. The reflective cover comprises a plurality of openings. The plurality of light-emitting elements are electrically connected to the substrate and are located on the first surface. The plurality of light-emitting elements are located in the plurality of openings. An exhaust structure is disposed in the substrate and penetrates from the first surface to the second surface to remove bubbles between the reflective cover and the at least one microchip.

[0006] In one embodiment of the present invention, the exhaust structure is aligned with at least one side surface of at least one microchip.

[0007] In one embodiment of the present invention, the area of ​​the exhaust structure is between 40% and 80% of the area of ​​at least one microchip projected onto the substrate.

[0008] In one embodiment of the present invention, the display panel further comprises a covering layer, and the plurality of light emitting elements and at least one microchip reflective cover are located between the covering layer and the substrate.

[0009] In one embodiment of the present invention, the exhaust structure is a plurality of through holes, and the plurality of through holes are respectively disposed on two opposite sides of each at least one microchip.

[0010] In one embodiment of the present invention, the exhaust structure is a plurality of through holes, and the plurality of through holes are respectively disposed on four sides of each at least one microchip.

[0011] Based on the above, the display panel of the present invention includes a substrate, at least one microchip, a reflective cover and a plurality of light-emitting elements, wherein the at least one microchip and the plurality of light-emitting elements are located on the first surface of the substrate. The reflective cover covers the at least one microchip, and the plurality of light-emitting elements are located in a plurality of openings of the reflective cover. An exhaust structure is disposed in the substrate and penetrates from the first surface to the second surface to remove bubbles between the reflective cover and the at least one microchip. Through the above arrangement, the display panel of the present invention can improve the reflectivity while solving the problem of uneven attachment of the reflective cover and improving the overall taste. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a cross-sectional schematic diagram of a display panel according to a first embodiment of the present invention;

[0013] Figure 2A yes Figure 1 A top view of a display panel;

[0014] Figure 2B is a top view of a display panel according to a second embodiment of the present invention;

[0015] Figure 2C is a top view of a display panel according to a third embodiment of the present invention;

[0016] Figure 2D is a top view of a display panel according to a fourth embodiment of the present invention.

[0017] Explanation of symbols

[0018] 100, 100a, 100b, 100c: display panel

[0019] 110: Substrate

[0020] 111: First surface

[0021] 112: Second surface

[0022] 120: Microchip

[0023] 121: Side

[0024] 130: Reflective cover

[0025] 131: Opening

[0026] 140: Light-emitting element

[0027] 150, 150a, 150b, 150c: Exhaust structure

[0028] 160: Overlay

[0029] A1, A2: Area

[0030] B: Bubbles

[0031] S: Space DETAILED DESCRIPTION

[0032] The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. As those skilled in the art will realize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present invention.

[0033] In the accompanying drawings, for the sake of clarity, the thickness of layers, films, panels, regions, etc. is magnified. Throughout the specification, the same reference numerals represent the same elements. It should be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to another element, or an intermediate element can also exist. On the contrary, when an element is referred to as being "directly on" or "directly connected to" another element, there is no intermediate element. As used herein, "connection" can refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" can be other elements between two elements.

[0034] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, the "first element", "component", "region", "layer" or "part" discussed below may be referred to as a second element, component, region, layer or part without departing from the teachings of this article.

[0035] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element, as shown in the figures. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is turned over, the element described as being on the "lower" side of the other elements will be oriented on the "upper" side of the other elements. Therefore, the exemplary term "lower" can include both "lower" and "upper" orientations, depending on the specific orientation of the figure. Similarly, if the device in one figure is turned over, the element described as being "below" or "below" other elements will be oriented as being "above" other elements. Therefore, the exemplary term "below" or "below" can include both above and below orientations.

[0036] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the present invention, and will not be interpreted as an idealized or overly formal meaning unless explicitly defined as such herein.

[0037] Exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments. Therefore, variations in the shapes of the illustrations as a result of, for example, manufacturing techniques and / or tolerances can be expected. Therefore, the embodiments described herein should not be interpreted as limited to the specific shapes of the regions as shown herein, but rather include shape deviations that result, for example, from manufacturing. For example, a region shown or described as flat may typically have rough and / or nonlinear features. In addition, the sharp angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shape of the regions and are not intended to limit the scope of the claims.

[0038] Figure 1 is a cross-sectional schematic diagram of a display panel according to the first embodiment of the present invention. It should be noted that: Figure 1 One microchip 120 and two light emitting elements 140 are schematically depicted, but the number of microchips 120 and light emitting elements 140 is not limited thereto.

[0039] Please refer to Figure 1 The display panel 100 of the present embodiment is, for example, a direct-type light panel and includes a substrate 110, at least one microchip 120, a reflective cover 130, a plurality of light-emitting elements 140, and a covering layer 160. The substrate 110 has a first surface 111 and a second surface 112. The at least one microchip 120 and the plurality of light-emitting elements 140 are electrically connected to the substrate 110 and are located on the first surface 111. The reflective cover 130 covers the at least one microchip 120. The reflective cover 130 includes a plurality of openings 131, and the plurality of light-emitting elements 140 are located in the plurality of openings 131. The plurality of light-emitting elements 140, the at least one microchip 120, and the reflective cover 130 are located between the covering layer 160 and the substrate 110. In other words, the reflective cover 130 covers the microchip 120 but does not cover the light-emitting elements 140. By arranging the reflective cover 130 on the substrate 110, the reflectivity of the display panel 100 of the present embodiment is improved.

[0040] In the present embodiment, the display panel 100 further includes an exhaust structure 150. The exhaust structure 150 is disposed in the substrate 110 and penetrates from the first surface 111 to the second surface 112 to remove air bubbles B between the reflective cover 130 and at least one microchip 120. The exhaust structure 150 is, for example, a plurality of through holes. Specifically, when the reflective cover 130 is covered on the substrate 110, air bubbles B are likely to remain in the gap S between the reflective cover 130 and the microchip 120. By providing a plurality of through holes in the substrate 110, the air bubbles B can be discharged from the gap S along the plurality of through holes to the outside, thereby solving the problem of uneven attachment of the reflective cover 130.

[0041] In addition, the exhaust structure 150 is disposed in the substrate 110, and is shielded by the reflective cover 130 when viewed from the first surface 111 to the second surface 112. With the above arrangement, the user does not see the exhaust structure 150 when viewing the display panel 100, thereby improving the overall taste.

[0042] In this embodiment, the exhaust structure 150 is aligned with at least one side surface 121 of at least one microchip 120. Figure 1 As shown, the projection of the microchip 120 on the substrate 110 is staggered from the exhaust structure 150 and is adjacent to the exhaust structure 150. By such a configuration, the exhaust structure 150 can be prevented from being covered by the reflective cover 130 and the microchip 120, so that the bubbles B can be smoothly discharged from the gap S along the exhaust structure 150 to the outside.

[0043] Figure 2A yes Figure 1 It should be noted that the arrangement of the exhaust structures 150, 150a, 150b, and 150c cannot be seen. FIG. 2A to FIG. 2D The reflective cover 130 is omitted in the top views.

[0044] Please refer to Figure 2A , a plurality of through holes (i.e., exhaust structures 150) are respectively disposed on opposite sides of each at least one microchip 120. In addition, an area A2 of the exhaust structure 150 is between 40% and 80% of an area A1 of at least one microchip 120 (two microchips 120 are shown) projected onto the substrate 110. With such an arrangement, it is ensured that the bubbles B are smoothly discharged from the gap S between the reflective cover 130 and the microchip 120 along the exhaust structure 150, while preventing the exhaust structure 150 from occupying too much volume of the substrate 110 and excessively reducing the available space of the substrate 110.

[0045] Figure 2B is a top view of a display panel according to a second embodiment of the present invention. Figure 2B The display panel 100a of this embodiment is Figure 2AThe difference between the display panels 100 is that the exhaust structures 150 and 150a are arranged at different positions. Specifically, Figure 2A The exhaust structure 150 is located between the microchip 120 and the light emitting element 140. That is, the microchip 120, the exhaust structure 150 and the light emitting element 140 are arranged in a row. Figure 2B The exhaust structure 150a is not located in the arrangement direction of the microchip 120 and the light emitting element 140. The arrangement direction of the exhaust structure 150a and the microchip 120 and the arrangement direction of the microchip 120 and the light emitting element 140 are, for example, vertically arranged, but the present invention is not limited thereto.

[0046] Figure 2C is a top view of a display panel according to a third embodiment of the present invention. Figure 2C The display panel 100b of this embodiment is Figure 2A The difference between the display panel 100 and the display panel 100 is that the through holes of the exhaust structure 150b of the present embodiment are respectively arranged on four sides of at least one microchip 120. In detail, the exhaust structure 150b of the present embodiment is arranged as follows: Figure 2A Exhaust structure 150 and Figure 2B The exhaust structure 150a is combined with the exhaust structure 150b. Part of the exhaust structure 150b is arranged in a row with the microchip 120 and the light-emitting element 140, and another part of the exhaust structure 150b is arranged perpendicularly to the arrangement direction of the microchip 120 and the arrangement direction of the microchip 120 and the light-emitting element 140, so that the exhaust structure 150b has an appearance of, for example, a diamond shape. The arrangement of the exhaust structures 150, 150a, and 150b (such as the through holes of the aforementioned exhaust structures 150, 150a, and 150b are arranged on two sides or four sides of the microchip 120) corresponds to different attachment methods of the reflective cover 130, different substrate 110 materials and thicknesses, etc., thereby improving the success rate of attaching the reflective cover 130 to the substrate 110, but the present invention does not limit its arrangement method.

[0047] Figure 2D is a top view of a display panel according to a fourth embodiment of the present invention. Figure 2D The display panel 100c of this embodiment is Figure 2C The difference of the display panel 100b is that Figure 2C The exhaust structure 150b has a long strip appearance, and Figure 2D The exhaust structure 150c has a circular appearance, but the present invention is not limited to the shape of the appearance.

[0048] In summary, the display panel of the present invention comprises a substrate, at least one microchip, a reflective cover and a plurality of light-emitting elements, wherein the at least one microchip and the plurality of light-emitting elements are located on the first surface of the substrate. The reflective cover covers the at least one microchip, and the plurality of light-emitting elements are located in a plurality of openings of the reflective cover. An exhaust structure is disposed in the substrate and penetrates from the first surface to the second surface to remove bubbles between the reflective cover and the at least one microchip. Through the above arrangement, the display panel of the present invention can improve the reflectivity while solving the problem of uneven attachment of the reflective cover and improving the overall taste.

[0049] In addition, the exhaust structure is aligned with at least one side of at least one microchip, so that bubbles can be smoothly discharged from the gap between the reflective cover and the microchip along the exhaust structure to the outside. The area of ​​the exhaust structure is between 40% and 80% of the area of ​​the at least one microchip projected onto the substrate, so as to ensure that bubbles are smoothly discharged from the gap along the exhaust structure, while avoiding excessive reduction of the available space of the substrate.

Claims

1. A display panel, comprising: A substrate having a first surface and a second surface; at least one microchip electrically connected to the substrate and located on the first surface; a reflective cover covering the at least one microchip, the reflective cover comprising a plurality of openings; and A plurality of light emitting elements are electrically connected to the substrate and are located on the first surface. The light emitting elements are located in the openings. The exhaust structure is disposed in the substrate and penetrates from the first surface to the second surface to exhaust bubbles between the reflective cover and the at least one microchip. 2 . The display panel as claimed in claim 1 , wherein the exhaust structure is aligned with at least one side surface of the at least one microchip. 3 . The display panel as claimed in claim 1 , wherein an area of ​​the exhaust structure is between 40% and 80% of an area projected onto the substrate by the at least one microchip. 4 . The display panel as claimed in claim 1 , further comprising a covering layer, wherein the light emitting elements, the at least one microchip and the reflective cover are located between the covering layer and the substrate. 5 . The display panel as claimed in claim 1 , wherein the exhaust structure is a plurality of through holes, and the through holes are respectively disposed on two opposite sides of each of the at least one microchip. 6 . The display panel as claimed in claim 1 , wherein the exhaust structure is a plurality of through holes, and the through holes are respectively disposed on four sides of each of the at least one microchip.

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