Shock wave generating device and shock wave treatment catheter system

Abstract

The invention provides a shock wave generating device and a shock wave treatment catheter system.The shock wave generating device comprises a flexible generating assembly, the flexible generating assembly comprises at least one circuit board and at least one discharging unit, the discharging unit comprises at least one discharging assembly, and the discharging assembly comprises a first electrode, a second electrode and a third electrode; the first electrode and the second electrode are electrically connected to the circuit board. Two shock wave generation gaps are formed between the third electrode and the first electrode and between the third electrode and the second electrode. The shock wave generating device has the advantages of being small in size, excellent in flexibility, high in precision, good in consistency and high in integration level.

Description

Technical Field

[0001] The present application relates to the technical field of medical devices, and in particular to a shock wave generating device and a shock wave therapy catheter system. Background Art

[0002] An electrode is a component connected to a conductive medium (including solids, liquids, gases, plasmas, or vacuums) to transfer charge into and / or remove charge from the medium. Electrodes are classified as positive and negative. The movement of charged particles creates an electric field between the positive and negative electrodes. Positive and negative electrodes typically occur in pairs, and a pair of positive and negative electrodes connected to the same circuit is sometimes collectively referred to as an electrode. Under certain conditions, a large amount of charge accumulates at the electrodes. The strong electric field and charged particles ionize neutral particles in the medium into plasma, resulting in electrode discharge. When plasma is generated, it rapidly expands outward and then contracts rapidly after acquiring charge. The rapid movement of the plasma and surrounding particles creates pressure waves in the medium that propagate outward. When the particle motion exceeds the speed of sound waves in the medium, shock waves are generated. In particular, when the medium between the electrodes is liquid, the high current in the plasma channel can rapidly vaporize the surrounding liquid, forming bubbles, creating a cavitation effect. The rapid expansion and collapse of cavitation bubbles accelerates the movement of particles in the medium, generating even stronger shock waves. This phenomenon is known as the hydro-electrochemical effect.

[0003] The electrohydraulic effect is one of the main methods for generating shock waves. It has the advantages of high impact energy, high energy efficiency, fast propagation speed, and a wide frequency range, and is widely used. Electrohydraulic shock wave lithotripsy is a technology based on the electrohydraulic effect that generates high-intensity shock waves for breaking hard stones. It has applications in processing, mining, and medical fields. Based on a similar principle, a new type of percutaneous angioplasty has recently been used to treat calcified stenosis of blood vessels (Chinese patent CN104582597B discloses a shock wave balloon catheter with multiple shock wave sources. The shock wave balloon catheter includes a balloon that can be filled with a conductive liquid and an electrode assembly that can emit shock waves). This type of catheter typically places one or more groups of miniaturized electrode units inside the balloon and connects them to an external high-voltage circuit via one or more wires through the catheter.

[0004] Existing shock wave generators suffer from several shortcomings: 1. Dense wiring and a high number of electrode components lead to low integration, making positioning difficult, the manufacturing process complex, processing time long, and product yield low, making large-scale mass production difficult. 2. Inter-component and individual product consistency is poor, with poor accuracy in inter-electrode spacing and inter-electrode gaps. 3. Due to the dense wiring and line dimensions, the catheters are relatively large and rigid, resulting in poor physical properties and vascular permeability. These issues ultimately lead to the widespread high production costs and poor shock wave consistency of these catheters, resulting in challenges in vascular adaptability, decalcification effectiveness, and product safety, limiting the further application of this technology in angioplasty. Summary of the Invention

[0005] In order to solve the above-mentioned defects in the prior art, the shock wave generating device provided in the present application has the advantages of small size, excellent flexibility, high precision, good consistency and high integration.

[0006] The present application provides a shock wave generating device, including a flexible generating component, the flexible generating component including at least one circuit board and at least one discharge unit, the discharge unit including at least one discharge component, the discharge component including a first electrode, a second electrode and a third electrode, the first electrode and the second electrode being electrically connected to the circuit board, and two shock wave generating gaps being formed between the third electrode and the first electrode and the second electrode respectively.

[0007] Optionally, the circuit board includes a substrate and at least one conductive circuit arranged corresponding to each of the discharge units, the first electrode and the second electrode are arranged on the substrate, the conductive circuit includes a first circuit and a second circuit, the proximal ends of the first circuit and the second circuit are used to connect to the energy generator, the distal end of the first circuit is electrically connected to the first electrode, and the distal end of the second circuit is electrically connected to the second electrode.

[0008] Optionally, the conductive circuit includes multiple layers of circuits, and the multiple layers of circuits are separated by insulating materials, or the multiple layers of circuits are arranged in parallel.

[0009] Optionally, the circuit board includes at least one insulating layer arranged corresponding to the discharge component, the first electrode and the second electrode are arranged on the lower surface of the insulating layer, the third electrode is arranged on the upper surface of the insulating layer, and the insulating layer is provided with a first through hole exposing the first electrode and a second through hole exposing the second electrode.

[0010] Optionally, the shock wave generating device includes at least one of the following: The third electrode is provided with a third through hole corresponding to the first through hole and a fourth through hole corresponding to the second through hole; The third electrode and the substrate are both ring-shaped, and the substrate is arranged through the third electrode; The third electrode and the substrate are both planar; The third electrode is curved, and the base is ring-shaped.

[0011] Optionally, the shock wave generating device includes at least one of the following: The insulating layer is fixed on the substrate, and the third electrode is fixed on the upper surface of the insulating layer; The insulating layer is fixed on the substrate, and the third electrode is detachably provided on the upper surface of the insulating layer; The insulating layer is detachably arranged on the substrate, and the third electrode is fixed on the upper surface of the insulating layer.

[0012] Optionally, welding points are provided at the distal ends of the first circuit and the second circuit, and the energy generator is connected to the welding points via a wire; and / or, A connection terminal is formed at the distal end of the circuit board, and the distal ends of the first circuit and the second circuit are electrically connected to the connection terminal, and the connection terminal is used to connect to the connection hole of the energy generator.

[0013] Optionally, the discharge unit includes at least two discharge components, the first electrode of each discharge component is electrically connected to the second electrode of an adjacent discharge component, and the number of shock wave generation gaps formed by the discharge unit is greater than or equal to 4.

[0014] Optionally, the discharge unit including only one discharge component is defined as a first discharge unit; the discharge unit including at least two discharge components is defined as a second discharge unit; the flexible generating component includes a plurality of circuit boards; At least one of the circuit boards is electrically connected to at least one of the first discharge units; At least one of the circuit boards is electrically connected to at least one of the second discharge units; At least one of the circuit boards is electrically connected to at least one of the first discharge units and at least one of the second discharge units.

[0015] The present application also relates to a shock wave therapy catheter system, comprising a catheter, a balloon, a connecting seat, and the above-mentioned shock wave generating device, wherein the proximal end of the catheter is connected to the connecting seat, the proximal end of the balloon is connected to the connecting seat, and the distal end of the balloon is connected to the distal end of the catheter. A liquid-filled cavity is formed between the balloon and the catheter, a liquid discharge medium is provided in the liquid-filled cavity, the shock wave generating device is provided in the liquid-filled cavity, and the circuit board is connected to the catheter.

[0016] Optionally, the circuit board is integrally formed on the conduit; and / or, The circuit board is detachably connected to the conduit.

[0017] Optionally, the shock wave therapy catheter system includes at least one of the following: A channel for the guide wire to pass through is formed in the catheter; The shock wave therapy catheter system further includes an energy generator, which is electrically connected to the shock wave generating device; The shock wave therapy catheter system further includes at least two imaging rings, each of which is connected to the catheter.

[0018] The shock wave generating device of the present application integrates the discharge component with the circuit board based on the principles and technologies of circuit board manufacturing, and has the advantages of small size, excellent flexibility, high precision, good consistency, and high integration. Because the conductive circuit is integrated into the circuit board, the space occupied by the wire is reduced, and the process of connecting the first electrode, the second electrode and the wire, and pairing and positioning the first electrode, the second electrode and the third electrode is omitted, which simplifies the manufacturing process and is more suitable for large-scale industrialization. At the same time, it avoids the problems of inaccurate positioning of electronic components and loose connections, improves product yield, and reduces production costs. Because the printed third electrode and the first electrode and the second electrode can accurately control the gap between the shock wave generation, the discharge stability is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the shock wave generating device of the first embodiment of the present application.

[0020] Figure 2 It is a partial cross-sectional structural schematic diagram of the shock wave generating device of the present application.

[0021] Figure 3 It is a partial cross-sectional structural schematic diagram of the shock wave generating device of Example 1 of the present application in the expanded state.

[0022] Figure 4 It is a partial cross-sectional structural schematic diagram of the shock wave generating device of Example 2 of the present application in an expanded state.

[0023] Figure 5 It is a partial cross-sectional structural schematic diagram of the shock wave generating device of Example 3 of the present application in the expanded state.

[0024] Figure 6 This is a schematic diagram of the proximal structure of a circuit board according to an embodiment of the present application.

[0025] Figure 7 This is a schematic diagram of the proximal structure of a circuit board according to another embodiment of the present application.

[0026] Figure 8 It is a structural schematic diagram of the shock wave generating device of the second embodiment of the present application.

[0027] Figure 9 It is a structural schematic diagram of the shock wave generating device of the third embodiment of the present application.

[0028] Figure 10 It is a structural schematic diagram of the shock wave generating device of the fourth embodiment of the present application.

[0029] Figures 11 to 14 This is a schematic diagram of at least two circuit boards of the fifth embodiment of the present application being spliced ​​together.

[0030] Figure 15 It is a structural diagram of the shock wave therapy catheter system of the sixth embodiment of the present application.

[0031] Figure 16 yes Figure 15 Schematic diagram of the structure of the shock wave therapy catheter system shown. DETAILED DESCRIPTION

[0032] The following describes the implementation of the present application through specific embodiments. People familiar with this technology can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0033] In the following description, reference is made to the accompanying drawings, which illustrate several embodiments of the present application. It should be understood that other embodiments may be used, and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description should not be considered limiting, and the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the present application.

[0034] Although the terms "first", "second", etc. are used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0035] Furthermore, as used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms "comprise", "include" indicate the presence of features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B, and C". Exceptions to this definition occur only when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0036] First embodiment Figure 1 This is a schematic structural diagram of the shock wave generating device of the first embodiment of the present application. Figure 2 This is a partial cross-sectional structural diagram of the shock wave generating device of the present application. Figure 1 and Figure 2 As shown, the shock wave generating device 10 includes a flexible generating assembly, which includes at least one circuit board 12 and at least one discharge unit 13. The discharge unit 13 includes at least one discharge assembly 131. The discharge assembly 131 includes a first electrode 1311, a second electrode 1312, and a third electrode 1313. The first electrode 1311 and the second electrode 1312 are electrically connected to the circuit board 12. The third electrode 1313 forms two shock wave generating gaps 101 with the first electrode 1311 and the second electrode 1312, respectively. That is, each discharge assembly 131 has two shock wave generating gaps 101. The width of the shock wave generating gap 101 is, for example, 0.01 mm to 5 mm. In this embodiment, the shock wave generating device 10 is used in medical equipment, such as medical catheters, balloons, stents, and other instruments. The shock wave generating device 10 is fixed to the medical equipment by methods including, but not limited to, gluing, welding, riveting, binding, curing, and snap-on connection.

[0037] The shock wave generating device 10 of this embodiment is capable of generating two or more shock waves. When the shock wave generating device 10 is located within a liquid discharge medium, the electrical energy provided by the energy generator 24 is conducted through the circuit board 12 to the first electrode 1311. The electrical energy then penetrates the liquid discharge medium from the first electrode 1311 and flows to the third electrode 1313. The electrical energy then penetrates the liquid discharge medium through the third electrode 1313 and flows to the second electrode 1312. Finally, the electrical energy returns from the second electrode 1312 to the circuit board 12 and the energy generator 24, completing a complete discharge process. As the current penetrates the liquid discharge medium through the two shock wave generating gaps 101, it rapidly vaporizes the liquid discharge medium to form bubbles, generating a cavitation effect. The rapid expansion and collapse of the cavitation bubbles accelerates the movement of particles within the medium, generating a more powerful shock wave. This shock wave can be used to impact, loosen, or shatter calcified tissue in blood vessels and heart valves, and can also act on urinary stones or other obstructions.

[0038] The flexible generating assembly of the shock wave generating device 10 of the present application integrates the discharge assembly 131 with the circuit board 12 based on the principles and technologies of flexible circuit board manufacturing. This design offers advantages such as small size, excellent flexibility, high precision, good consistency, and high integration. Since the circuit (conductive circuit 122) is integrated into the circuit board 12, the space occupied by the wires is reduced, and the process of connecting the first and second electrodes 1311, 1312 to the wires and pairing and positioning the first and second electrodes 1311, 1312, and third electrodes 1313 is omitted. This simplifies the manufacturing process and makes it more suitable for large-scale industrialization. It also avoids the problems of inaccurate positioning of electronic components and loose connections, improves product yield, and reduces production costs. Because the printed third electrode 1313, together with the first and second electrodes 1311, 1312, can precisely control the shock wave generating gap 101, the discharge stability is improved.

[0039] Alternatively, as Figure 2As shown, the circuit board 12 includes a substrate 121 and at least one conductive trace 122 corresponding to each discharge assembly 131. A first electrode 1311 and a second electrode 1312 are disposed on the substrate 121. The conductive trace 122 includes a first trace 1221 and a second trace 1222. The proximal ends of the first trace 1221 and the second trace 1222 are used to connect to the energy generator 24. The distal end of the first trace 1221 is electrically connected to the first electrode 1311, and the distal end of the second trace 1222 is electrically connected to the second electrode 1312. In this embodiment, the conductive trace 122 is formed in the substrate 121 using processes such as photolithography, etching, deposition, and lamination. The highly integrated conductive trace 122 on the substrate 121 avoids complex positioning operations during the manufacturing process, significantly improving the width and gap accuracy of the shock wave generating gap 101, which is crucial for product consistency. Furthermore, the circuit board 12 is lightweight and thin, and the conductive trace 122 is flexible and bendable, facilitating the development of smaller and more flexible products.

[0040] Optionally, the conductive circuit 122 may include multiple layers of circuits separated by insulating material, or the multiple layers of circuits may be arranged side by side. In this embodiment, the line width of the first circuit 1221 and the second circuit 1222 is 0.02 mm to 5 mm, the line thickness is 0.01 mm to 5 mm, and the spacing between circuits on the same layer is 0.01 mm to 5 mm.

[0041] Optionally, the substrate 121 is made of a material resistant to high voltage breakdown, such as polyimide, polytetrafluoroethylene, or PET, but not limited thereto.

[0042] Optionally, the substrate 121 may be an insulating layer formed of an insulating material.

[0043] Optionally, at least one of the first electrode 1311 , the second electrode 1312 , the third electrode 1313 and the conductive circuit 122 is made of a high-voltage-resistant conductive material, such as metal materials such as stainless steel, aluminum alloy, copper alloy, or non-metallic material such as graphite, but not limited thereto.

[0044] Optionally, the circuit board 12 includes at least one insulating layer 123 disposed corresponding to the discharge assembly 131. A first electrode 1311 and a second electrode 1312 are disposed on the lower surface of the insulating layer 123, and a third electrode 1313 is disposed on the upper surface of the insulating layer 123. The insulating layer 123 is provided with a first through-hole 1011 exposing the first electrode 1311 and a second through-hole 1012 exposing the second electrode 1312. In this embodiment, the number of insulating layers 123 is the same as the number of discharge assemblies 131, and the insulating layers 123 are used to control discharge conditions.

[0045] Optionally, the thickness of the insulating layer 123 is 0.01 mm to 5 mm.

[0046] Optionally, the insulating layer 123 is made of a material resistant to high voltage breakdown, such as polyimide, polytetrafluoroethylene, or PET, but is not limited thereto.

[0047] Alternatively, as Figure 2 As shown, the third electrode 1313 is provided with a third through hole 1013 corresponding to the first through hole 1011 and a fourth through hole 1014 corresponding to the second through hole 1012 .

[0048] Alternatively, as Figure 2 As shown, the third electrode 1313 and the substrate 121 are both ring-shaped, and the substrate 121 is disposed through the third electrode 1313 .

[0049] In another embodiment, the third electrode 1313 and the substrate 121 are both planar. In this case, the first electrode 1311 and the second electrode 1312 are arranged on the substrate 121 at intervals, the insulating layer 123 is laid flat on the substrate 121, and the third electrode 1313 is laid flat on the upper surface of the insulating layer 123.

[0050] In other embodiments, the third electrode 1313 is curved (eg, ring-shaped), and the base 121 is ring-shaped.

[0051] Optionally, Figure 3 FIG. 1 is a partial cross-sectional structural diagram of the shock wave generating device in the first embodiment of the present application in the expanded state. Figure 3 As shown, the insulating layer 123 is fixed to the substrate 121, and the third electrode 1313 is fixed to the upper surface of the insulating layer 123, that is, the discharge unit 13 is integrated with the circuit board 12. In this embodiment, the insulating layer 123 can be fixed by, but is not limited to, bonding, welding, riveting, crimping, hot melting, heat shrinking, and coating on the surface of the substrate 121.

[0052] Optionally, Figure 4 FIG. 1 is a partial cross-sectional structural diagram of the shock wave generating device of the second embodiment of the present application in the expanded state. Figure 4 As shown, the insulating layer 123 is fixed to the substrate 121, and the third electrode 1313 is detachably disposed on the upper surface of the insulating layer 123. That is, the substrate 121, the insulating layer 123, the conductive trace 122 located between the substrate 121 and the insulating layer 123, the first electrode 1311, and the second electrode 1312 are integrated into a single unit. When using the shock wave generating device 10, the third electrode 1313 needs to be attached to the insulating layer 123.

[0053] Optionally, Figure 5 FIG. 1 is a partial cross-sectional structural diagram of the shock wave generating device of the third embodiment of the present application in the expanded state. Figure 5As shown, the insulating layer 123 is detachably disposed on the substrate 121, and the third electrode 1313 is fixed to the upper surface of the insulating layer 123. That is, the substrate 121, the conductive circuit 122, the first electrode 1311, and the second electrode 1312 thereon are integrated into a single body; the insulating layer 123 and the third electrode 1313 are integrated into a single body. When the shock wave generating device 10 is in use, the insulating layer 123 needs to be attached to the substrate 121.

[0054] Optionally, Figure 6 This is a schematic diagram of the proximal structure of a circuit board according to an embodiment of the present application. Figure 6 As shown, welding points 1225 are provided at the distal ends of the first and second lines 1221, 1222, and the energy generator 24 is connected to the welding points 1225 via wires. In this embodiment, the welding points 1225 of the circuit board 12 are used to connect to the wires (welding methods include soldering, hot melt, electric current welding, and conductive adhesive bonding), and the circuit board 12 is electrically connected to the energy generator 24 via the wires.

[0055] Optionally, Figure 7 This is a schematic diagram of the proximal structure of a circuit board according to another embodiment of the present application. Figure 7 As shown, a terminal block 1226 is formed at the distal end of the circuit board 12. The distal ends of the first and second circuits 1221, 1222 are electrically connected to the terminal block 1226. The terminal block 1226 is used to connect to the wiring hole of the energy generator 24. In this embodiment, the circuit board 12 is electrically connected to the energy generator 24 by connecting the terminal block 1226 to the wiring hole of the energy generator 24.

[0056] Optionally, in order to improve the strength of the terminal 1226, conductive and hard wear-resistant materials such as nickel, gold, silver, and stainless steel can be added to the terminal 1226 or the conductive circuit 122 through electroplating, deposition, hot melting, chemical plating, etc.

[0057] Optionally, the circuit board 12 can integrate a variety of micro devices, such as various sensors (such as temperature sensing, potential sensing, pressure sensing, impedance sensing, etc.), treatment devices (such as thermocouples, ablation devices, etc.), imaging devices (such as optical imaging, acoustic imaging), etc.

[0058] Optionally, the electrode pairs of the discharge assembly 131 can be arranged horizontally or in a regular staggered arrangement at any angle, and the spacing between the discharge units 13 can also be adjusted arbitrarily according to the product length and the treatment site.

[0059] Optionally, the multi-layer structure of the circuit board 12 allows for a variety of circuit layouts and electrode pair layouts. The flexibility of the circuit board 12 and the selectivity of the circuit layout ensure the flexibility of the product.

[0060] Second embodiment Figure 8 Schematic diagram of the structure of the shock wave generating device of the second embodiment of the present application. Figure 8 As shown, the shock wave generating device 10 of this embodiment is substantially the same as the shock wave generating device 10 of the first embodiment, except for the number of discharge units 13. In this embodiment, the flexible generating assembly includes at least two discharge units 13, each of which includes only one discharge assembly 131. The discharge assemblies 131 of each discharge unit 13 are arranged in parallel on the circuit board 12.

[0061] Optionally, the circuit board 12 includes at least two conductive circuits 122, each conductive circuit 122 is electrically connected to the first electrode 1311 and the second electrode 1312 of each discharge component 131, respectively. Specifically, the first circuit 1221 of each conductive circuit 122 is electrically connected to the first electrode 1311 of each discharge component 131, and the second circuit 1222 of each conductive circuit 122 is electrically connected to the second electrode 1312 of each discharge component 131.

[0062] Optionally, the circuit board 12 includes at least two insulating layers 123 , and each insulating layer 123 is used to insulate and separate the first electrode 1311 , the second electrode 1312 , and the third electrode 1313 of each discharge component 131 .

[0063] Third embodiment Figure 9 : is a schematic structural diagram of the shock wave generating device of the third embodiment of the present application, as shown in FIG. Figure 9 As shown, the shock wave generating device 10 of this embodiment is substantially the same as the shock wave generating device 10 of the above embodiment, except that each discharge unit 13 has a different number of discharge assemblies 131. In this embodiment, each discharge unit 13 includes at least two discharge assemblies 131, and the first electrode 1311 of each discharge assembly 131 is electrically connected to the second electrode 1312 of an adjacent discharge assembly 131. The number of shock wave generating gaps 101 formed by the discharge units 13 is greater than or equal to four.

[0064] Optionally, the circuit board 12 includes at least one conductive circuit 122, the conductive circuit 122 includes a first circuit 1221, a second circuit 1222, a third circuit 1223 and a fourth circuit 1224, the first circuit 1221 is electrically connected to the first electrode 1311 of the first discharge component 131, the second circuit 1222 is electrically connected to the second electrode 1312 of the first discharge component 131, one end of the third circuit 1223 is electrically connected to the second electrode 1312 of the first discharge component 131, the other end of the third circuit 1223 is electrically connected to the first electrode 1311 of the second discharge component 131, one end of the fourth circuit 1224 is electrically connected to the second electrode 1312 of the second discharge component 131, and the other end of the fourth circuit 1224 is electrically connected to the second circuit 1222.

[0065] Optionally, the circuit board 12 includes at least two insulating layers 123 , wherein one insulating layer 123 is disposed between the first electrode 1311 , the second electrode 1312 , and the third electrode 1313 of the first discharge component 131 , and the other insulating layer 123 is disposed between the first electrode 1311 , the second electrode 1312 , and the third electrode 1313 of the second discharge component 131 .

[0066] The shock wave generating device 10 of this embodiment is capable of generating four or more shock waves. When the shock wave generating device 10 is located in a liquid discharge medium, the electrical energy provided by the energy generator 24 is conducted through the circuit board 12 to the first electrode 1311 of the first discharge component 131. The electrical energy then penetrates the liquid discharge medium from the first electrode 1311 and flows to the third electrode 1313. The electrical energy then penetrates the liquid discharge medium through the third electrode 1313 and flows to the second electrode 1312. The electrical energy then passes through the second electrode 1312 and the third line 1223 to the first electrode 1311 of the second discharge component 131. The electrical energy then penetrates the liquid discharge medium from the first electrode 1311 and flows to the third electrode 1313. The electrical energy then penetrates the liquid discharge medium through the third electrode 1313 and flows to the second electrode 1312. Finally, the electrical energy then flows from the second electrode 1312 back to the energy generator 24 via the fourth line 1224, completing a complete discharge process.

[0067] Fourth embodiment Figure 10 : is a schematic structural diagram of a shock wave generating device according to a fourth embodiment of the present application. Figure 10As shown, the shock wave generating device 10 of this embodiment is substantially the same as the shock wave generating device 10 of the third embodiment, except for the number of discharge units 13. In this embodiment, the flexible generating assembly includes at least two discharge units 13, and each discharge unit 13 includes at least two discharge assemblies 131. The first electrode 1311 of the discharge assembly 131 of each discharge unit 13 is electrically connected to the second electrode 1312 of the adjacent discharge assembly 131. That is, the number of shock wave generating gaps 101 formed by the discharge units 13 is greater than or equal to 4.

[0068] Optionally, the circuit board 12 includes at least two conductive circuits 122 , and each conductive circuit 122 is electrically connected to each discharge component 131 of each discharge unit 13 . For specific connection methods, please refer to the third embodiment and will not be described again here.

[0069] Optionally, the circuit board 12 includes at least four insulating layers 123 , and each insulating layer 123 is disposed corresponding to each discharge component 131 .

[0070] Fifth embodiment Figures 11 to 14 This is a schematic diagram of at least two circuit boards of the fifth embodiment of the present application being spliced ​​together. Figures 11 to 14 , a discharge unit 13 including only one discharge component 131 is defined as a first discharge unit 13 a ; a discharge unit 13 including at least two discharge components 131 is defined as a second discharge unit 13 b ; and the flexible generating component includes multiple circuit boards 12 .

[0071] Optionally, at least one first discharge unit 13a is electrically connected to at least one circuit board 12. Specifically, Figure 11 As shown, each of the two circuit boards 12 is electrically connected to a first discharge unit 13 a. For the structure and connection relationship of the first discharge units 13 a on each circuit board 12 , please refer to the first embodiment and will not be repeated here.

[0072] Alternatively, as Figure 12 As shown, two first discharge units 13 a are electrically connected to each of the two circuit boards 12 . For the structure and connection relationship of the first discharge units 13 a on each circuit board 12 , please refer to the second embodiment and will not be described again here.

[0073] Optionally, at least one second discharge unit 13b is electrically connected to at least one circuit board 12. Specifically, Figure 13 As shown, each of the two circuit boards 12 is electrically connected to a second discharge unit 13 b. For the structure and connection relationship of the second discharge units 13 b on each circuit board 12 , please refer to the third embodiment and will not be described again here.

[0074] Optionally, at least one first discharge unit 13a and at least one second discharge unit 13b are electrically connected to at least one circuit board 12. Specifically, Figure 14 As shown, one circuit board 12 is electrically connected to two second discharge units 13b, and another circuit board 12 is electrically connected to two first discharge units 13a. For details on the structure and connection relationship of the first discharge units 13a and the second discharge units 13b on each circuit board 12, please refer to the above embodiment and will not be repeated here.

[0075] It should be noted that the combination of the discharge unit 13 and the circuit board 12 is not limited to the above-mentioned ones, and any multiple of discharge components 131 can be formed through circuit design. Based on the number of shock wave generating gaps 101, any multiple of 2 discharge components 131 can be formed through circuit design.

[0076] Sixth embodiment Figure 15 is a structural diagram of a shock wave therapy catheter system according to a sixth embodiment of the present application. Figure 16 yes Figure 15 The schematic diagram of the shock wave therapy catheter system is shown in FIG. Figure 15 and Figure 16 As shown, the present application also relates to a shock wave therapy catheter system, which includes a catheter 21, a balloon 22, a connecting seat 23, and the above-mentioned shock wave generating device 10. The proximal end of the catheter 21 is connected to the connecting seat 23, the proximal end of the balloon 22 is connected to the connecting seat 23, and the distal end of the balloon 22 is connected to the distal end of the catheter 21. A liquid-filled cavity 201 is formed between the balloon 22 and the catheter 21. A liquid discharge medium is disposed in the liquid-filled cavity 201. The shock wave generating device 10 is disposed in the liquid-filled cavity 201, and the circuit board 12 is connected to the catheter 21. In this embodiment, the liquid discharge medium is a mixture of physiological saline and a developer, but may also be other liquid media that meet the requirements.

[0077] Since the shock wave generating device 10 of the present application is composed of a highly integrated circuit board 12 and a discharge unit 13 and has a small overall size, the size of the balloon 22 can be designed to be smaller, so that the physical properties and vascular permeability of the shock wave therapy catheter system are better.

[0078] Optionally, the circuit board 12 is integrally formed on the guide tube 21 . Optionally, the circuit board 12 is detachably connected to the conduit 21 .

[0079] Optionally, a channel is formed in the catheter 21 for the guide wire to pass through.

[0080] Optionally, the shock wave therapy catheter system further includes an energy generator 24 , which is electrically connected to the shock wave generating device 10 .

[0081] Optionally, the shock wave therapy catheter system further includes at least two imaging rings 25 , each imaging ring 25 being connected to the catheter 21 .

[0082] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application.

Claims

1. A shock wave generating device, characterized in that: It includes a flexible generating component, which includes at least one circuit board and at least one discharge unit. The discharge unit includes at least one discharge component. The discharge component includes a first electrode, a second electrode and a third electrode. The first electrode and the second electrode are electrically connected to the circuit board. The third electrode forms two shock wave generating gaps with the first electrode and the second electrode respectively.

2. The shock wave generating device according to claim 1, characterized in that: The circuit board includes a substrate and at least one conductive circuit corresponding to each of the discharge units, the first electrode and the second electrode are arranged on the substrate, the conductive circuit includes a first circuit and a second circuit, the proximal ends of the first circuit and the second circuit are used to connect to the energy generator, the distal end of the first circuit is electrically connected to the first electrode, and the distal end of the second circuit is electrically connected to the second electrode; and / or, The conductive circuit includes multiple layers of circuits, and the multiple layers of circuits are separated by insulating materials, or the multiple layers of circuits are arranged in parallel.

3. The shock wave generating device according to claim 2, characterized in that: The circuit board includes at least one insulating layer arranged corresponding to the discharge component, the first electrode and the second electrode are arranged on the lower surface of the insulating layer, the third electrode is arranged on the upper surface of the insulating layer, and the insulating layer is provided with a first through hole exposing the first electrode and a second through hole exposing the second electrode.

4. The shock wave generating device according to claim 3, characterized in that: Include at least one of the following: The third electrode is provided with a third through hole corresponding to the first through hole and a fourth through hole corresponding to the second through hole; The third electrode and the substrate are both ring-shaped, and the substrate is arranged through the third electrode; The third electrode and the substrate are both planar; The third electrode is bent, and the base is ring-shaped.

5. The shock wave generating device according to claim 3, characterized in that: Include at least one of the following: The insulating layer is fixed on the substrate, and the third electrode is fixed on the upper surface of the insulating layer; The insulating layer is fixed on the substrate, and the third electrode is detachably arranged on the upper surface of the insulating layer; The insulating layer is detachably arranged on the substrate, and the third electrode is fixed on the upper surface of the insulating layer.

6. The shock wave generating device according to claim 2, characterized in that: A welding point is provided at the far end of the first circuit and the second circuit, and the energy generator is connected to the welding point via a wire; and / or, A connection terminal is formed at the distal end of the circuit board, and the distal ends of the first circuit and the second circuit are electrically connected to the connection terminal, and the connection terminal is used to connect to the connection hole of the energy generator.

7. The shock wave generating device according to any one of claims 1 to 6, characterized in that: The discharge unit includes at least two discharge components, the first electrode of each discharge component is electrically connected to the second electrode of an adjacent discharge component, and the number of the shock wave generation gaps formed by the discharge unit is greater than or equal to 4.

8. The shock wave generating device according to claim 7, characterized in that: The discharge unit including only one discharge component is defined as a first discharge unit; the discharge unit including at least two discharge components is defined as a second discharge unit; the flexible generating component includes a plurality of circuit boards; At least one of the circuit boards is electrically connected to at least one of the first discharge units; At least one of the circuit boards is electrically connected to at least one of the second discharge units; At least one of the circuit boards is electrically connected to at least one of the first discharge units and at least one of the second discharge units.

9. A shock wave therapy catheter system, characterized in that: It comprises a catheter, a balloon, a connecting seat and the shock wave generating device according to any one of claims 1 to 8, wherein the proximal end of the catheter is connected to the connecting seat, the proximal end of the balloon is connected to the connecting seat, the distal end of the balloon is connected to the distal end of the catheter, a liquid-filled cavity is formed between the balloon and the catheter, a liquid discharge medium is arranged in the liquid-filled cavity, the shock wave generating device is arranged in the liquid-filled cavity, and the circuit board is connected to the catheter.

10. The shock wave therapy catheter system according to claim 9, wherein: The circuit board is integrally formed on the conduit; and / or, The circuit board is detachably connected to the conduit.

11. The shock wave therapy catheter system of claim 9, wherein: Include at least one of the following: A channel is formed in the catheter for the guide wire to pass through; The shock wave therapy catheter system further comprises an energy generator, the energy generator being electrically connected to the shock wave generating device; The shock wave therapy catheter system further comprises at least two developing rings, each of which is connected to the catheter.

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