Ultrasonic detection test clamp suitable for micro plastic package component

Abstract

The invention relates to the field of semiconductor component detection, and discloses an ultrasonic detection test fixture suitable for a tiny plastic package component. The base plate is matched with an objective table of the ultrasonic detection instrument and is used for being placed on the objective table, the substrate is used for bearing a plastic package component, the cover plate is used for being stacked on the substrate and blocking the plastic package component, a hollow-out part which is communicated in the longitudinal direction is formed in the base plate, and the substrate is installed in the hollow-out part. The hollow part is arranged on the base plate, so that the whole clamp can be conveniently mounted on an objective table of an ultrasonic detection instrument, and the hollow part can reduce attenuation of ultrasonic signals and enhance transmission information; through the cooperation of the substrate and the cover plate, the plastic package component can be positioned, so that the plastic package component cannot be influenced by water waves driven by scanning of a transducer probe when ultrasonic detection is carried out in medium water, the plastic package component is effectively prevented from moving, the imaging quality of an ultrasonic detection instrument during detection is ensured, and the detection precision is improved.

Description

Technical Field

[0001] The invention relates to the field of semiconductor component detection, and in particular to an ultrasonic detection test fixture suitable for tiny plastic-sealed components. Background Art

[0002] In recent years, as the size and power consumption of semiconductor components continue to decrease, the market share of low-cost, miniaturized plastic-encapsulated components has also increased. However, due to improper control of process parameters, plastic-encapsulated components still have potential defects such as delamination, cracks, and voids. At present, the most commonly used test method is to use acoustic scanning microscopes to perform non-destructive testing of internal defects on plastic-encapsulated components and screen out defective samples. In acoustic scanning testing, the signal emission source is an ultrasonic transducer and the propagation medium is water, so it is also called ultrasonic testing. Ultrasonic testing mainly includes reflection mode and transmission mode. In the reflection mode, the defect information of a specific position (A-Scan), a specific cross section (B-Scan), and a specific depth (C-Scan) of the plastic-encapsulated component can be focused, and the transmission mode (T-Scan) can detect defects within the entire thickness range of the plastic-encapsulated component.

[0003] For ultrasonic testing of tiny plastic-encapsulated components with a size less than 5mm×5mm, there are two main methods of placement: one is to place them directly on a submerged stage, and the other is to use double-sided tape to stick them to a rigid substrate such as a silicon wafer and then place them on a submerged stage. Method 1: Due to the small size and light weight of plastic-encapsulated components, they are easily moved by the water waves caused by the sweeping of the ultrasonic transducer probe during the detection process, resulting in reduced imaging quality; Method 2: Due to the obstruction of the silicon wafer, only the reflection imaging mode can be achieved, and the transmission imaging information cannot be obtained at the same time. In addition, in the process of sticking and taking the tray back and forth, it is easy to bring risks to the appearance quality of the tiny devices. Therefore, the existing technology has not yet achieved the imaging problem of simultaneous reflection scanning and transmission scanning of large quantities of tiny plastic-encapsulated components, and the efficiency of ultrasonic testing is low. Summary of the invention

[0004] In view of the above-mentioned deficiencies of the prior art, the technical problem to be solved by the present invention is to provide an ultrasonic testing fixture suitable for tiny plastic-encapsulated components to solve the problem that the tiny plastic-encapsulated components are easily moved due to the influence of water during use.

[0005] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide an ultrasonic detection test fixture suitable for tiny plastic-encapsulated components, including a base plate adapted to the stage of an ultrasonic detection instrument for being placed on the stage, a substrate for carrying plastic-encapsulated components, and a cover plate for being stacked on the substrate and blocking the plastic-encapsulated components, wherein a hollow portion connected along a longitudinal direction is formed on the base plate, and the substrate is installed in the hollow portion.

[0006] Furthermore, the hollow portion includes a first groove body opened longitudinally from one side of the base plate and a second groove body opened from the middle of the inner wall of the first groove body away from the base plate to the other side of the base plate, the first groove body is adapted to be set on the base plate and connected to the second groove body, the size of the second groove body is smaller than the size of the first groove body so as to form a first step extending inwardly relative to the inner walls of each side of the first groove body between the first groove body, the part surrounded by the inner side of the first step is configured as the second groove body, and the base plate is installed in the first groove body and supported on the first step.

[0007] Furthermore, the thickness of the first step is 0.5 mm.

[0008] Furthermore, a detection area is formed on the substrate at a position corresponding to the second slot body in the longitudinal direction. When the substrate is installed in the first slot body, the detection area is exposed outside the second slot body along the longitudinal direction toward one side of the second slot body, and a plurality of spaced-apart supporting grooves adapted to the plastic-encapsulated components are formed on the detection area.

[0009] Furthermore, the supporting groove includes a placement groove section which is recessed on a top surface of the base plate facing the cover plate along the longitudinal direction. The size of the placement groove section in a horizontal direction perpendicular to the longitudinal direction is adapted to the plastic-encapsulated components, and the placement groove section is used for placing the plastic-encapsulated components therein.

[0010] Furthermore, the bearing groove also includes a supporting groove section that is recessed and widened in the horizontal direction from the groove opening of the placement groove section, and the supporting groove section penetrates the top surface of the substrate in the longitudinal direction and forms a second step between the placement groove section and the support groove section that extends inward relative to the inner walls of each side of the support groove section; a protruding block is provided on the cover plate at a position corresponding to each support groove section and protrudes longitudinally toward one side of the substrate, and the protruding block is adapted to be arranged in the support groove section so as to extend into the support groove section and to block the placement groove section.

[0011] Furthermore, a through hole is formed in the middle of the protruding block and passes through the cover plate in the longitudinal direction. The size of the protruding block in the horizontal direction is larger than the size of the placement groove section, and the size of the through hole in the horizontal direction is smaller than the size of the placement groove section. The protruding block is used to support on the second step and block the plastic-encapsulated components.

[0012] Furthermore, the thickness of the base plate, the substrate and the cover plate are all between 2 and 3 mm.

[0013] Furthermore, the base plate, substrate and cover plate are all made of one of organic glass, polycarbonate and polyamide.

[0014] The ultrasonic testing fixture for tiny plastic-sealed components of the present invention has at least the following beneficial effects: a hollow portion is provided on the base plate, so that the entire fixture can be installed on the stage of an ultrasonic testing instrument, and the hollow portion can reduce the attenuation of ultrasonic signals and enhance transmission information; the cooperation between the base plate and the cover plate can be used to position the plastic-sealed components so that they will not be affected by water waves driven by the scanning of the transducer probe during ultrasonic testing in medium water, thereby effectively preventing the plastic-sealed components from moving, ensuring the imaging quality during testing by the ultrasonic testing instrument, and improving the testing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0016] Figure 1 It is a structural schematic diagram of the ultrasonic testing fixture of the present invention;

[0017] Figure 2 An exploded view of the ultrasonic testing fixture of the present invention;

[0018] Figure 3 for Figure 2 An enlarged view of section A is shown;

[0019] Figure 4 A partial side cross-sectional view of the base plate and the cover plate of the present invention in cooperation;

[0020] Figure 5 A partial side cross-sectional view of a base plate of the present invention;

[0021] Figure 6 A partial side cross-sectional view of a substrate of the present invention;

[0022] Figure 7 This is an ultrasonic imaging photo of the plastic-encapsulated components clamped in the ultrasonic testing fixture.

[0023] The meanings of the symbols in the accompanying drawings are:

[0024] Base plate 1, hollow portion 11, first slot body 111, second slot body 112, first step 113, substrate 2, detection area 21, bearing slot 22, placement slot section 221, support slot section 222, second step 223, cover plate 3, protruding block 31, through hole 32. DETAILED DESCRIPTION

[0025] The present invention will be further described below in conjunction with the accompanying drawings.

[0026] Please refer to Figures 1 to 7The ultrasonic testing fixture for tiny plastic-encapsulated components of the present invention comprises a base plate 1 adapted to the stage of the ultrasonic testing instrument for placement on the stage, a substrate 2 for carrying plastic-encapsulated components, and a cover plate 3 for being stacked on the substrate 2 and blocking the plastic-encapsulated components. The ultrasonic testing instrument can be an ultrasonic scanning display mirror. This case is directed to but not limited to the SAM301 ultrasonic scanning display mirror produced by PVATEPLA of Germany, and the plastic-encapsulated components in this case are described by taking a 2mm×2mm chip as an example but are not limited to chips of this size. The base plate 1 is adapted to the stage corresponding to the ultrasonic scanning display mirror and is used to be installed in the loading slot on the stage so that the base plate 1 is positioned on the stage. The substrate 2 is mounted on the base plate 1, the base plate 1 supports and positions the substrate 2, the chip is mounted on the substrate 2 and is limited by the substrate 2, and the cover plate 3 is covered on the substrate 2 and blocks the chip, so that when the transducer probe of the ultrasonic scanning display mirror scans in the water, the chip is no longer affected by the fluctuation of the water, so that the chip can always remain in a predetermined position.

[0027] Please refer to Figure 1 , Figure 2 and Figure 5 In the present invention, the base plate 1, the substrate 2 and the cover plate 3 are all long sheet structures and have length, width and height. The thickness range of the base plate 1 is preferably between 2 and 3 mm and includes 2 mm and 3 mm. The dimensions of one embodiment of the base plate 1: length × width × height (thickness) are 310 mm × 170 mm × 3 mm, respectively, wherein the thickness direction of the base plate 1 is parallel to a longitudinal direction (i.e., the vertical direction), and the side surface of the base plate 1 facing upward along the longitudinal direction is defined as the top surface, and the side surface of the base plate 1 facing downward along the longitudinal direction is defined as the bottom surface, and the substrate 2 is placed on the base plate 1 from the top surface of the base plate 1. It should be noted that the size of the base plate 1 is not limited to the size of this embodiment.

[0028] In the content defined in this embodiment, a hollow portion 11 is formed on the base plate 1, and the hollow portion 11 is formed by penetrating the base plate 1 in the longitudinal direction, and the base plate 2 is installed in the hollow portion 11, and the hollow portion 11 supports and limits the base plate 2. The hollow portion 11 is located in the middle of the base plate 2, and the parts of the base plate 1 located on any two opposite sides thereof are symmetrically distributed. The hollow portion 11 includes a first groove body 111 opened longitudinally from the top surface of the base plate 1 and a second groove body 112 opened from the middle of the inner wall of the first groove body 111 away from the substrate 2 to the bottom surface of the base plate 1, wherein the sizes of the first groove body 111 and the substrate 2 are adapted to each other and have similar size values, the first groove body 111 and the second groove body 112 are both rectangular structures, the second groove body 112 is opened on the inner wall of the first groove body 111 facing downward along the longitudinal direction so that the first groove body 111 is connected to the second groove body 112, the second groove body 112 is opened at the middle position of the first groove body 111, and the size of the second groove body 112 is smaller than that of the first groove body 111. Taking the size of the substrate 1 of the aforementioned embodiment as an example, the length×width×height of the first trough 111 may be 152mm×82mm×2.5mm respectively, and the size of the second trough 112 is smaller than the size of the first trough 111 and the length×width×height may be 140mm×70mm×0.5mm respectively. For this reason, a first step 113 extending inwardly and protruding in the horizontal direction relative to the inner wall of each side of the first trough 111 is formed between the inner wall of each side of the first trough 111 and the inner wall of each side of the second trough 112, and the portion surrounded by the inner side of the first step 113 is configured as the second trough 112. The first step 113 is a rectangular frame structure with four side frames, and the width of any side frame is 6mm, and the thickness of each side frame of the first step 113 is 0.5mm, so as to reduce the influence of the first step 113 on the substrate 2 while ensuring the support of the substrate 2. The first step 113 is used to allow the substrate 2 to penetrate into the first slot 111 and be supported on the first step 113 when installing the substrate 2. While ensuring the height position of the substrate 2, the substrate 2 is not completely blocked but remains partially hollow, thereby reducing the attenuation of the ultrasonic signal and enhancing the transmission information.

[0029] Please refer to Figures 1 to 4 , Figure 6In this embodiment, the size of the substrate 2 is smaller than that of the base plate 1, and the size of the substrate 2 is adapted to the size of the first trough 111. The thickness of the substrate 2 is between 2 mm and 3 mm. When the length, width, and height of the first trough 111 are 152 mm, 82 mm, and 2.5 mm, respectively, the length of the substrate 2 is maintained at 141 mm to 151 mm, the width of the substrate 2 is maintained at 71 mm to 81 mm, and the thickness of the substrate 2 is preferably maintained within 2.5 mm (including 2.5 mm). One embodiment is that the length, width, and height of the substrate 2 can be 150 mm, 80 mm, and 2.5 mm, respectively. For this reason, the substrate 2 can be placed in the first trough 111 and after being placed therein, it is sunken into the first trough 111 relative to the top surface of the base plate 1. If the substrate 2 is to be kept in the first trough 111 at all times and the top surface of the substrate 2 does not extend out of the first trough 111, it is necessary to ensure that the thickness of the substrate 2 is less than or equal to the depth of the first trough 111. In order to ensure that the chip placed on the substrate 2 is not blocked by the first step 113, a detection area 21 is formed on the substrate 2 at a position facing the second slot body 112 in the longitudinal direction. For example, under the premise that the width of each side frame of the first step 113 is 6 mm, the part outside the detection area 21 of the substrate 2 corresponds to the four side frames of the first step 113 to form four supporting areas for supporting on the first step 113, wherein the width of two opposite supporting areas can be set to 11 mm, and the width of the other two opposite supporting areas can be set to 12.4 mm. For this reason, the detection area 21 is rectangular. When the substrate 2 is installed in the first slot body 111, the detection area 21 faces the second slot body 112 in the longitudinal direction and is exposed outside the second slot body 112 toward one side of the second slot body 112, so that the detection area 21 is not blocked by the base plate 1 in the longitudinal direction, thereby reducing or even avoiding the influence of the base plate 1 on the ultrasonic signal.

[0030] In this embodiment, a plurality of spaced bearing slots 22 are formed on the detection area 21 of the substrate 2, each bearing slot 22 is adapted to the chip so that the chip can be installed in the bearing slot 22, and the bearing slot 22 can limit the chip in a horizontal direction perpendicular to the longitudinal direction. In the content defined in this embodiment, each bearing slot 22 is spaced in a rectangular array, and the number of bearing slots 22 is determined according to the chip size, groove spacing and scanning range, usually between 100 and 300, so as to be able to notify 100 to 300 chips to be loaded on the substrate 2 and ultrasonic detection. In one embodiment, the bearing slots 22 are arranged in 11 rows and 25 columns, totaling 275. In another embodiment, the bearing slots 22 are arranged in 10 rows and 15 columns, totaling 150.

[0031] In this embodiment, the supporting groove 22 includes a placement groove section 221 which is recessed on a top surface of the substrate 2 facing the cover plate 3 along the longitudinal direction, and a support groove section 222 which is recessed and widened in the horizontal direction from the groove opening of the placement groove section 221. The support groove section 222 and the placement groove section 221 are T-shaped as a whole and the central axes are arranged in a colinear manner. The support groove section 222 is located on a side close to the top surface of the substrate 2 along the longitudinal direction, and the placement groove section 221 is located on a side away from the top surface of the substrate 2 along the longitudinal direction. The horizontal dimension of the placement slot section 221 is adapted to the chip, that is, the length and width of the placement slot section 221 are slightly larger than the chip dimension of 2mm×2mm, for example: the length and width or side length of the placement slot section 221 are both 2.2mm, so that the chip can be placed in the placement slot section 221, and at the same time, there is a gap of 0mm to 0.2mm between each side of the chip and each inner wall of the placement slot section 221, and the gap between at least two adjacent inner walls of the placement slot section 221 and the chip is greater than 0, so that the chip will not be squeezed and damaged, and will not move significantly. It should be noted that it is preferred to ensure that the size of the placement slot section 221 is 0.2mm to 0.4mm larger than the chip size, so that the chip can be placed in or taken out. In this embodiment, the support groove section 222 is used to position the cover plate 3. The support groove section 222 penetrates the top surface of the substrate 2 in the longitudinal direction and is open upward to facilitate the chip to pass through the placement groove section 221 from top to bottom. The size of the support groove section 222 in the horizontal direction is slightly larger than the size of the placement groove section 221 in the horizontal direction. For example, when the side length of the placement groove section 221 is 2.2 mm, the length and width or side length of the support groove section 222 can be 3.2 mm. For this reason, the inner wall of each side of the support groove section 222 extends inward in the horizontal direction to form a second step 223 in the shape of a square frame. The second step 223 is consistent with the first step 113 and has four side frames. The width of the four side frames is 0.5 mm. The part surrounded by the inner side of the four side frames of the second step 223 is the placement groove section 221. For this reason, the thickness of the second step 223 is the depth of the placement groove section 221, that is, the size of the second step 223 in the longitudinal direction. In order to ensure the strength of the cover plate 3 and take into account the positioning of the chip, the depth of the placement groove section 221 can be greater than the depth of the support groove section 222. The depth of the placement groove section 221 can be 0.8 mm, and the depth of the support groove section 222 can be 0.5 mm. Correspondingly, the distance between the bottom surface of the placement groove section 221 and the bottom surface of the cover plate 3 is 1.2 mm. It should be noted that the above dimensions are examples and can be used in practice. The actual dimensions are adjusted according to the conditions of the chip and are not limited to the above embodiments.

[0032] Please refer to Figure 1 , Figure 2 and Figure 4In this embodiment, the shape of the cover plate 3 is consistent with that of the substrate 2 and is a rectangular sheet structure. The length×width dimensions of the cover plate 3 are consistent with those of the substrate 2, and the thickness of the cover plate 3 can be 2-3 mm. In one embodiment, the length×width×height of the cover plate 3 is 150 mm×80 mm×1.5 mm, and the thickness of the cover plate 3 is less than that of the substrate 2. Therefore, after the cover plate 3 is stacked on the substrate 2, the substrate 2 can block the notch of the bearing slot 22 to prevent the chip from moving, and can reduce the influence of the cover plate 3 on the chip detection. Since the cover plate 3 is relatively thin, in order to prevent the water fluctuation when the transducer probe moves from driving the cover plate 3 to move and thus affecting the restriction on the chip, a protruding block 31 is protruded longitudinally toward one side of the substrate 2 at the position of the cover plate 3 corresponding to each supporting slot segment 222. The shape of the protruding block 31 is adapted to the shape of the supporting slot segment 222 and is a rectangular parallelepiped structure. In order to ensure that the protruding block 31 can extend into the supporting groove section 222 and can be supported on the second step 223, the length and width or side length of the protruding block 31 are both 3mm, and the size of the protruding block 31 is larger than the size of the placement groove section 221, so that the protruding block 31 cannot penetrate into the placement groove section 221 after extending into the supporting groove section 222, so that the protruding block 31 can be used to block the chip in the placement groove section 221, thereby preventing the chip from escaping from the placement groove section 221, ensuring that the chip can always be located in the placement groove section 221 during the use of the fixture, and ensuring the detection of the chip by the ultrasonic scanning microscope. Preferably, the thickness of the protruding block 31 is the same as the depth of the supporting groove section 222 and is 0.5mm, so that the protruding block 31 can be supported on the second step 223 after extending into the supporting groove section 222, and at the same time, the cooperation between the protruding block 31 and the supporting groove section 222 is mutually limited in the horizontal direction, and after the chip is blocked by the cover plate 3, it is easier to remove the bubbles adsorbed on the surface of the chip in water. It should be noted that the depth of the placement groove section 221 should be greater than or equal to the height of the chip to ensure that the protruding block 31 can be supported on the second step 223, so as to ensure that the protruding block 31 can contact the second step 223 and increase stability by increasing the contact area.

[0033] In the content defined in this embodiment, since the ultrasonic scanning microscope needs to perform imaging detection on the chip, in order to reduce the blocking effect of the cover plate 3 on the ultrasonic detection information of the chip and reduce the attenuation of the ultrasonic signal, a through hole 32 is opened at the position corresponding to each placement groove section 221 on the cover plate 3, and the through hole 32 is opened to the middle position of the protruding block 31 along the longitudinal direction and penetrates the cover plate 3. In order to minimize the blocking of the chip by the through hole 32, but to ensure that the protruding block 31 blocks the placement groove section 221 to prevent the chip from detaching, the through hole 32 is in the shape of a rectangular column and the size in the horizontal direction is slightly smaller than the size of the placement groove section 221 in the horizontal direction, wherein the length and width of the through hole 32 are the same and are 0.2mm to 0.4mm smaller than the side length of the placement groove section 221, thereby improving the quality of ultrasonic imaging to a certain extent. For example: the side length of the protruding block 31 is 3mm, and the side length of the through hole 32 is 2mm, so that the protruding block 31 will not extend into the placement groove section 221 and can be supported on the second step 223. Among them, since the side length of the through hole 32 is smaller than the side length of the placement groove section 221, for this reason, after the protruding block 31 is supported on the second step 223, the inner side of the protruding block 31 protrudes inward relative to the slot opening of the placement groove section 221 to form an inverted L-shaped side structure at the slot opening of the placement groove section 221. Even if the side length of the through hole 32 is consistent with that of the chip, it is difficult for the chip to be exactly aligned with the through hole 32 in the longitudinal direction due to the obstruction of the side structure and the existence of the gap between the chip and the placement groove section 221. Even if the chip is exactly aligned with the through hole 32, Hole 32, during the detection process, there will be no auxiliary force to push the chip in the longitudinal direction, and the water waves caused by the transducer probe will also be blocked by the cover plate 3 outside the through hole 32, and the fluctuating water will be difficult to enter the through hole 32 and the placement groove section 221 in the longitudinal direction. A small amount of water will enter the through hole 32 in the direction inclined to the longitudinal direction because of the opening side of the through hole 32, but it will also collide with the inner wall of the through hole 32 and most of it will be offset to a certain extent. A small amount of water rushing to the chip is difficult to drive the chip. For this reason, while minimizing the chip from being blocked by the cover plate 3, most of the water fluctuations are offset, so that the fluctuating water basically does not enter the through hole 32 and the bearing groove 22, thereby ensuring the stability of the chip position. In this embodiment, the edges of the placement groove section 221, the support groove section 222 and the protruding block 31 are chamfered to prevent the edges from damaging the device surface.

[0034] In this embodiment, although the fixture fixes the chip to make the position of the chip relatively stable, and the existence of the through hole 32 makes the ultrasonic scanning microscope less obstructed when inspecting the chip from top to bottom through the through hole 32 in the longitudinal direction, the existence of the cover plate 3 and the like still causes certain obstruction. For this reason, the base plate 1, the substrate 2 and the cover plate 3 are all made of organic glass (such as acrylic) or polycarbonate (PC) or polyamide (PA, nylon). The selection of materials is based on two considerations: one is the acoustic impedance matching, and the other is the surface properties of the fixture (surface roughness and hydrophilicity). Acoustic impedance indicates the degree of obstruction of the material to the propagation of sound waves, and determines the reflection and transmission characteristics of sound waves when propagating between different materials. The greater the difference in acoustic impedance at the detection point, the stronger the reflection of the sound wave. On the contrary, the smaller the difference in acoustic impedance, the easier it is for the sound wave to be transmitted. In addition, inappropriate material surface properties are prone to adsorb bubbles in water, affecting the analysis of ultrasonic detection results and reducing detection efficiency. The material selected in this embodiment not only has a small difference in acoustic impedance, but also has a small surface roughness and good hydrophilicity, so that ultrasonic waves can be easily transmitted on the cover plate 3 and the substrate 2 without easily generating bubbles, thereby reducing the impact on the chip detection structure while fixing the chip. At the same time, the bottom surface of the groove section 221 can be used as a calibration surface for the focal length of the transducer probe during transmission imaging, so as to obtain high-quality transmission imaging photos.

[0035] The working method of one embodiment of the ultrasonic testing fixture for micro plastic-encapsulated components of the present invention is as follows: first, after placing the chips one by one in each placement slot section 221, the cover plate 3 is placed on the substrate 2 and the protruding block 31 is aligned with each support slot section 222 for rapid positioning, and then the protruding block 31 is extended therein until the protruding block 31 is supported on the second step 223, the substrate 2 stacked with the cover plate 3 is placed in the first slot body 111 and supported on the first step 113, and the base plate 1 is installed on the stage to use an ultrasonic scanning microscope to detect the chip, and judge whether there are defects such as delamination and voids in the chip bonding and pin bonding according to the imaging. In order to further reduce the impact of the transducer probe on the imaging during the scanning process, the range of the ultrasonic scanning can be reduced to reduce the impact of the water wave fluctuation during the transducer sweeping process, and the scanning speed of the transducer probe can be reduced to reduce the scanning time while improving the detection efficiency to a certain extent.

[0036] Compared with the prior art, the ultrasonic testing fixture for micro plastic-encapsulated components of the present invention has the following advantages: the thickness of the base plate 1, the substrate 2 and the cover plate 3 are all between 2 and 3 mm, which can reduce the warping and unevenness of the fixture during the processing and molding process while ensuring sufficient thickness, and improve the consistency of imaging quality during large-scale testing; on the other hand, the thickness should not be too large, which can reduce the absorption or reflection of the ultrasonic signal by the fixture and improve the imaging signal strength; the chip can be fixed by the cooperation of the protruding block 31 and the bearing groove 22 to prevent the chip from moving, and the fixture material can be used to show a clearer chip such as Figure 7 shown.

Claims

1. An ultrasonic testing fixture suitable for tiny plastic-encapsulated components, characterized by: It includes a base plate adapted to be placed on the stage of an ultrasonic testing instrument, a substrate for carrying plastic-encapsulated components, and a cover plate for being stacked on the substrate and blocking the plastic-encapsulated components. A hollow portion connected along a longitudinal direction is formed on the base plate, and the substrate is installed in the hollow portion.

2. The ultrasonic testing fixture for tiny plastic-encapsulated components as claimed in claim 1, characterized in that: The hollow portion includes a first groove body opened longitudinally from one side of the base plate and a second groove body opened from the middle of the inner wall of the first groove body away from the base plate to the other side of the base plate, the first groove body is adapted to be set on the base plate and connected to the second groove body, the size of the second groove body is smaller than the size of the first groove body so as to form a first step extending inwardly relative to the inner walls of each side of the first groove body between the first groove body, the part surrounded by the inner side of the first step is configured as the second groove body, and the base plate is installed in the first groove body and supported on the first step.

3. The ultrasonic testing fixture for tiny plastic-encapsulated components as claimed in claim 2, characterized in that: The thickness of the first step is 0.5 mm.

4. The ultrasonic testing fixture for tiny plastic-encapsulated components as claimed in claim 2, characterized in that: A detection area is formed on the substrate at a position corresponding to the second slot body in the longitudinal direction. When the substrate is installed in the first slot body, the detection area is exposed outside the second slot body along the longitudinal direction toward one side of the second slot body. A plurality of spaced-apart bearing grooves adapted to the plastic-encapsulated components are formed on the detection area.

5. The ultrasonic testing fixture for tiny plastic-encapsulated components as claimed in claim 4, characterized in that: The bearing groove includes a placement groove section formed by being recessed on a top surface of the base plate facing the cover plate along the longitudinal direction. The size of the placement groove section in a horizontal direction perpendicular to the longitudinal direction is adapted to the plastic-encapsulated components. The placement groove section is used for placing the plastic-encapsulated components therein.

6. The ultrasonic testing fixture for tiny plastic-encapsulated components as claimed in claim 5, characterized in that: The bearing groove also includes a supporting groove section that is concavely widened in the horizontal direction from the groove opening of the placement groove section, the supporting groove section penetrates the top surface of the substrate in the longitudinal direction and forms a second step that extends inwardly and protrudes relative to the inner walls of each side of the supporting groove section between the placement groove section; The cover plate has protruding blocks at positions corresponding to the supporting groove sections along the longitudinal direction toward one side of the base plate. The protruding blocks are adapted to be arranged in the supporting groove sections to extend into the supporting groove sections and to block the placement groove sections.

7. The ultrasonic testing fixture for tiny plastic-encapsulated components as claimed in claim 6, characterized in that: A through hole is formed in the middle of the protruding block and passes through the cover plate in the longitudinal direction. The size of the protruding block in the horizontal direction is larger than the size of the placement groove section, and the size of the through hole in the horizontal direction is smaller than the size of the placement groove section. The protruding block is used to support on the second step and block the plastic-encapsulated components.

8. The ultrasonic testing fixture for tiny plastic-encapsulated components according to any one of claims 1 to 7, characterized in that: The thickness of the base plate, substrate and cover plate are all between 2 and 3 mm.

9. The ultrasonic testing fixture for tiny plastic-encapsulated components according to any one of claims 1 to 7, characterized in that: The base plate, substrate and cover plate are all made of one of organic glass, polycarbonate and polyamide.

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