A 3D imaging method and device for an ultrasonic two-dimensional phased array

By dividing the original array into subarrays and using time-sharing multiplexing and encoding excitation methods, the problem of high cost in three-dimensional ultrasound imaging is solved, and low-cost, high-frame rate three-dimensional ultrasound imaging is achieved.

CN119986671BActive Publication Date: 2025-07-04ZHEJIANG LAB
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Patent Information

Application Number
CN202510473835.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-04-16
Publication Date
2025-07-04
Estimated Expiration
2045-04-16

AI Technical Summary

Technical Problem

The existing three-dimensional ultrasonic imaging technology has increased with the size square relationship of the two-dimensional array, which requires extremely high number of channels, resulting in circuit wiring, data transmission and storage costs being too high, making it difficult to achieve low-cost three-dimensional ultrasonic imaging.

Method used

The original array is divided into multiple subarrays, and virtual wave source simulation and frequency domain analysis are performed through time-sharing multiplexing and encoding excitation, reducing the number of channels and improving the signal-to-noise ratio, simplifying the calculation process, and building a three-dimensional image.

Benefits of technology

Effectively control system costs, ensure high frame rate imaging, reduce system complexity, improve signal-to-noise ratio, simplify the calculation process, and realize low-cost three-dimensional ultrasound imaging.

✦ Generated by Eureka AI based on patent content.

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Abstract

This specification discloses a three-dimensional imaging method and device for an ultrasonic two-dimensional phased array. When constructing a target three-dimensional image using the three-dimensional imaging method for an ultrasonic two-dimensional phased array provided in this specification, based on the idea of time-division multiplexing, the original array is divided into multiple sub-arrays. Each sub-array sequentially and continuously simulates different virtual wave sources in a coded emission manner, and performs frequency-domain analysis on the collected echo signals, and constructs the target three-dimensional image according to the obtained frequency-domain echo data. This method uses time-division multiplexing to control a high-element-number array with a low channel number for imaging, effectively controlling the overall cost of the system; the diffusion wave emission and beam synthesis of the virtual wave sources ensure a high frame rate of imaging; the coded excitation increases the average energy of the sub-array emission, ensuring the signal-to-noise ratio of the sub-array acquisition; at the same time, frequency-domain decoding and beam synthesis are performed within the working frequency band of the original array, greatly simplifying the calculation process.
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Description

Technical Field

[0001] This specification relates to the field of ultrasonic imaging, and particularly to a three-dimensional imaging method and device for a two-dimensional ultrasonic phased array. Background Art

[0002] Three-dimensional ultrasonic imaging has high application value in various fields, but its technical complexity and implementation cost are relatively high. Currently, one of the main implementation methods of three-dimensional ultrasonic imaging is to use a two-dimensional array, and electronic focusing is used to control the emission and acquisition of array elements, so as to achieve three-dimensional area imaging. The switching time between different focusing scans of this imaging method is extremely short, and theoretically, a relatively high imaging frame rate can be achieved, which can be effectively applied to scenarios of fast three-dimensional motion that require fine capture.

[0003] However, currently, three-dimensional imaging with a two-dimensional array is extremely challenging. The main reason is that the number of array elements of a two-dimensional array increases in a square relationship with its size. In the case of the traditional full-connection method, the imaging system of a two-dimensional array probe requires a very high number of channels, resulting in extremely high costs in terms of circuit wiring, data transmission, and storage, and there are huge difficulties.

[0004] Therefore, how to achieve three-dimensional ultrasonic imaging of a two-dimensional array at low cost is an urgent problem to be solved. Summary of the Invention

[0005] This specification provides a three-dimensional imaging method, device, storage medium, and electronic device to at least partially solve the above problems existing in the prior art.

[0006] This specification adopts the following technical solutions:

[0007] This specification provides a three-dimensional imaging method, including:

[0008] Dividing an original array including a plurality of array elements to obtain a plurality of sub-arrays, where both the original array and the sub-arrays are two-dimensional arrays;

[0009] Determining the number of virtual wave sources according to the information of the imaging target and the imaging requirements, and determining the positions of each virtual wave source;

[0010] For each virtual wave source, determining the excitation pulse of each array element included in each sub-array when simulating the virtual wave source;

[0011] Sequentially for each sub-array, combining the excitation pulses of each array element included in the sub-array, and simulating each virtual wave source in a preset order;

[0012] Performing frequency-domain analysis on the received echo signals to obtain the frequency-domain echo data corresponding to each virtual wave source for each sub-array;

[0013] Construct a target three-dimensional image based on the frequency-domain echo data.

[0014] Optionally, each element included in the original array only exists in one sub-array after division, and there is no overlapping part between the sub-arrays.

[0015] Optionally, the sizes of the sub-arrays obtained by dividing the original array are the same.

[0016] Optionally, determine the number of virtual wave sources according to the information of the imaging target and the imaging requirements, specifically including:

[0017] Determine the number of virtual wave sources according to the imaging depth, imaging frame rate, and average sound speed of the imaging area of the target three-dimensional image to be constructed.

[0018] Optionally, when determining the excitation pulse of each element included in each sub-array for simulating the virtual wave source, specifically including:

[0019] For each sub-array, determine the magnitude and time delay of the excitation pulse of each element included in the sub-array when simulating the virtual wave source.

[0020] Optionally, combine the excitation pulses of each element included in the sub-array and simulate each virtual wave source in a preset order, specifically including:

[0021] Combine the excitation pulses of each element included in the sub-array in a polling reverse coding manner, and repeat the simulation of each virtual wave source a specified number of times in a preset order, where the signal polarity of the excitation pulses of the elements corresponding to one virtual wave source is reversed each time during the simulation.

[0022] Optionally, perform frequency-domain analysis on the received echo signal to obtain the frequency-domain echo data corresponding to each virtual wave source for each sub-array, specifically including:

[0023] For each sub-array, perform Fourier transform on the echo signal received by the sub-array to obtain the transformed echo data;

[0024] According to the transformed echo data, the signal frequency band and angular frequency of the original array, obtain the frequency-domain echo data corresponding to each virtual wave source for the sub-array.

[0025] A three-dimensional imaging device provided in this specification, the device includes:

[0026] A division module, configured to divide an original array including a plurality of elements to obtain a plurality of sub-arrays, where the original array and the sub-arrays are both two-dimensional arrays;

[0027] A first determination module, configured to determine the number of virtual wave sources according to the information of the imaging target and the imaging requirements, and determine the positions of the virtual wave sources;

[0028] A second determination module, configured to, for each virtual wave source, determine the excitation pulse of each array element included in each sub-array when simulating the virtual wave source;

[0029] A simulation module, configured to, for each sub-array in sequence, combine the excitation pulses of each array element included in the sub-array, and simulate each virtual wave source in a preset order;

[0030] An analysis module, configured to perform frequency-domain analysis on the received echo signal to obtain the frequency-domain echo data corresponding to each virtual wave source of each sub-array;

[0031] A construction module, configured to construct a target three-dimensional image according to the frequency-domain echo data.

[0032] This specification provides a computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the above three-dimensional imaging method is implemented.

[0033] This specification provides an electronic device, including a memory, a processor, and a computer program stored on the memory and executable on the processor, and when the processor executes the program, the above three-dimensional imaging method is implemented.

[0034] At least one of the above technical solutions adopted in this specification can achieve the following beneficial effects:

[0035] In the three-dimensional imaging method provided in this specification, the original array including a plurality of array elements is divided to obtain a plurality of sub-arrays, where the original array and the sub-arrays are both two-dimensional arrays; the number of virtual wave sources is determined according to the information of the imaging target and the imaging requirements, and the positions of the virtual wave sources are determined; for each virtual wave source, the excitation pulse of each array element included in each sub-array when simulating the virtual wave source is determined; for each sub-array in sequence, the excitation pulses of each array element included in the sub-array are combined, and each virtual wave source is simulated in a preset order; the received echo signal is subjected to frequency-domain analysis to obtain the frequency-domain echo data corresponding to each virtual wave source of each sub-array; and a target three-dimensional image is constructed according to the frequency-domain echo data.

[0036] When constructing a target three-dimensional image using the three-dimensional imaging method for ultrasonic two-dimensional phased arrays provided in this specification, based on the idea of time-division multiplexing, the original array is divided into multiple sub-arrays. Each sub-array sequentially and continuously simulates different virtual wave sources in a coded emission manner, and performs frequency-domain analysis on the collected echo signals. The target three-dimensional image is constructed according to the obtained frequency-domain echo data. This method uses time-division multiplexing to control a high-element-number array with a low number of channels for imaging, effectively controlling the overall cost of the system; the diffusion wave emission and beam synthesis of the virtual wave sources ensure a high frame rate of imaging; the coded excitation increases the average energy of the sub-array emission, ensuring the signal-to-noise ratio of the sub-array acquisition; at the same time, frequency-domain decoding and beam synthesis are performed within the working frequency band of the original array, greatly simplifying the calculation process. Description of the Drawings

[0037] The drawings described herein are used to provide a further understanding of this specification and form a part of this specification. The schematic embodiments of this specification and their descriptions are used to explain this specification and do not constitute an improper limitation to this specification. In the drawings:

[0038] Figure 1 It is a schematic flowchart of a three-dimensional imaging method in this specification;

[0039] Figure 2 It is a schematic diagram of partitioning the original array provided in this specification;

[0040] Figure 3 It is a schematic diagram of a process for simulating virtual wave sources provided in this specification;

[0041] Figure 4 It is a schematic diagram of emitting excitation pulses in a way of cyclic reverse coding provided in this specification;

[0042] Figure 5 It is a schematic diagram of a three-dimensional imaging device provided in this specification;

[0043] Figure 6 Corresponding to Figure 1 in this specification is a schematic diagram of an electronic device. Detailed Embodiments

[0044] To make the purpose, technical solutions, and advantages of this specification clearer, the technical solutions of this specification will be clearly and completely described below in conjunction with the specific embodiments of this specification and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this specification, rather than all the embodiments. Based on the embodiments in this specification, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope protected by this application.

[0045] The technical solutions provided by the embodiments of this specification will be described in detail below with reference to the accompanying drawings.

[0046] Figure 1 It is a schematic flowchart of a three-dimensional imaging method in this specification, which specifically includes the following steps:

[0047] S100: Divide the original array including multiple array elements to obtain several sub-arrays, where both the original array and the sub-arrays are two-dimensional arrays.

[0048] All steps in the three-dimensional imaging method provided by this specification can be implemented by any electronic device with computing functions, such as devices like terminals and servers.

[0049] In this method, ultrasonic two-dimensional phased arrays are used for three-dimensional imaging. Ultrasonic two-dimensional phased arrays can achieve flexible control of sound beams and multi-dimensional scanning through two-dimensionally arranged array elements, and have many advantages such as no complex mechanical structure and high imaging frame rate. However, the array elements of two-dimensional arrays are dense, and using a fully connected mode will bring a comprehensive increase in system complexity and cost. To solve this problem, in this method, three-dimensional imaging of two-dimensional arrays is realized based on time-division multiplexing. Time-division multiplexing is a technology that enables multiple signals to share the same transmission medium. Applying it to the ultrasonic system in this method can achieve the transmission and acquisition of a large number of array elements with a small number of channels, significantly reducing the required number of channels, effectively reducing the system complexity and cost, and greatly enhancing the practical application value of three-dimensional ultrasonic imaging technology.

[0050] Based on the above idea, in this step, first, the two-dimensional phased array for ultrasonic imaging, that is, the original array, will be divided. The original array contains several array elements that can emit excitation signals. After dividing the original array, several sub-arrays can be obtained, and each sub-array contains several array elements.

[0051] The obtained sub-arrays after division do not overlap with each other, that is, no two sub-arrays contain duplicate array elements. At the same time, each array element contained in the original array will exist and only exist in one sub-array after division, and there will be no array elements that are not divided.

[0052] In a more optimal specific embodiment, the sizes of the sub-arrays obtained after dividing the original array are the same. Thus, the signal transmission and reception modes of each sub-array can be the same, further reducing the complexity of this method and the required amount of calculation.

[0053] Specifically, an N×N original array can be divided into K M×M sub-arrays. For example, Figure 2 It is a schematic diagram of dividing the original array provided by this specification, such as Figure 2As shown, where each small square represents an array element, the original 6×6 array is divided into 4 sub-arrays of 3×3. Each sub-array is independent and non-overlapping.

[0054] S102: Determine the number of virtual wave sources according to the information of the imaging target and the imaging requirements, and determine the positions of the virtual wave sources.

[0055] After dividing the array into multiple sub-arrays in step S100, several virtual wave sources can be determined in this step. In this method, a virtual wave source is an imaginary wave source located behind the array. By setting the pulse excitation delay of each array element, the ultrasonic waves emitted by the virtual wave source can be simulated, so as to achieve the emission of diffused waves. Using diffused waves, each emission can almost cover the entire imaging field of view, that is, complete one scan, thus ensuring high-frame-rate imaging.

[0056] Figure 3 It is a schematic diagram of the process of simulating virtual wave sources provided in this specification. As Figure 3 shown, taking the surface of the array as the boundary, the imaging area direction is regarded as the front of the array, and the opposite direction is the back of the array. If there is a wave source behind the imaginary array, there is a time difference for this wave source to reach each array element. By setting the pulse excitation delay of each array element according to this time difference, the ultrasonic waves emitted by the virtual wave source can be simulated, so as to achieve the emission of diffused waves.

[0057] In this method, each virtual wave source can be simulated by the excitation pulse emitted by the array elements included in any one sub-array. Each sub-array works independently and does not affect each other.

[0058] In this step, the number of virtual wave sources can be determined first. In this method, the number of virtual wave sources can be determined according to the imaging depth, imaging frame rate of the target three-dimensional image to be constructed, and the average sound speed of the imaging area. Specifically, it can be expressed by the following formula:

[0059]

[0060] Among them, c represents the average sound speed of the imaging area, K represents the number of sub-arrays, D represents the imaging depth, F represents the imaging frame rate, and P represents the number of virtual wave sources.

[0061] The principle of the above formula is that each acquisition must wait for the ultrasonic wave to complete a full round trip within the specified imaging range. The round-trip time is jointly determined by the sound speed and the depth of the imaging range, that is, 2D / c. The more times of transmitting and acquiring, the longer the time to complete one imaging, and the lower the corresponding frame rate. For example, if a 6×6 (N = 6) two-dimensional array is divided into 4 (K = 4) sub-arrays of 3×3 (M = 3), the imaging depth is 60 mm, the average sound speed is 1500 m / s, and the required imaging frame rate is not less than 200 fps, then the number of virtual wave sources allowed for each sub-array cannot exceed 15.

[0062] After determining the number of virtual wave elements, the position of each virtual wave source can be further determined. The position of each virtual wave source can be set according to the determined number of virtual wave sources and the specific requirements of imaging. This specification does not make specific restrictions on this.

[0063] S104: For each virtual wave source, determine the excitation pulse of each element included in each sub-array when simulating the virtual wave source.

[0064] After determining the position of each virtual wave source, the excitation pulses of each element included in each sub-array can be further determined when each sub-array simulates different virtual wave sources respectively. The excitation pulse of an element can specifically consist of two aspects of information: the magnitude and the time delay of the excitation pulse. Based on this, when determining the excitation pulses of each sub-array simulating different virtual wave sources respectively, specifically, for each sub-array, determine the magnitude and time delay of the excitation pulse of each element included in the sub-array when simulating the virtual wave source.

[0065] The excitation pulses of the elements in each sub-array may be different when simulating each different virtual wave source. Among them, the magnitude of the excitation pulse can be set according to the specific requirements of the energy required for imaging. This specification does not make specific restrictions on this. The time delay of the excitation pulse is the time waited from the moment of starting to simulate the virtual wave source to the emission of the excitation pulse. When a sub-array simulates a virtual wave source, the time delays of the excitation pulses of each element included in the sub-array are not completely the same.

[0066] The time delay of the excitation pulse of an element is related to the position of the virtual wave source currently simulated by the sub-array where the element is located. When determining the time delay, first, it is necessary to determine the time for the ultrasonic wave emitted by the virtual wave source to reach each element, which can be specifically calculated by the following formula:

[0067]

[0068] Where i represents the label of the element, t represents the time required for the virtual wave source to transmit to the element, c represents the sound speed of the imaging area, r represents the position of the element, and s represents the position of the virtual wave source.

[0069] Subsequently, the excitation pulse delay of each array element can be determined according to the following formula:

[0070]

[0071] where d represents the delay, and t min represents the minimum value among all t i values.

[0072] It should be noted that in this method, for each sub-array, it is necessary to determine the excitation pulses of each array element included in the sub-array when simulating each virtual wave source; at the same time, each sub-array works independently, and the array elements included in different sub-arrays do not affect each other.

[0073] S106: For each sub-array in turn, combine the excitation pulses of each array element included in the sub-array, and simulate each virtual wave source in a preset order.

[0074] After determining the excitation pulses of each array element in each sub-array when simulating each virtual wave source in step S104, the excitation pulses can be emitted in this step to simulate the virtual wave source.

[0075] Since in this method, the time-division multiplexing method is adopted to operate different array elements in the array at different times. Therefore, in this step, only one sub-array occupies the channel to work at the same time, that is, after one sub-array completes the transmission and reception of signals, the next sub-array works, and each sub-array operates in turn.

[0076] Compared with the original array, the area of the sub-array is smaller, and the energy of a single excitation transmission is lower, resulting in a low signal-to-noise ratio of the echo signal, which may affect the quality of the final image. Therefore, in this method, this problem can be effectively solved by introducing coded excitation. The way of coded excitation is to extend the duration of the transmission pulse within one transmission, such as combining and transmitting the pulse excitations of multiple virtual wave sources in sequence, so as to increase the average transmission power and improve the signal-to-noise ratio of the echo signal.

[0077] For any sub-array, when it is working, it needs to simulate each virtual wave source in a preset order. Among them, the preset order is the order of the virtual wave sources set in advance. All virtual wave sources are included in the preset order, and each virtual wave source appears only once. The specific sorting of each virtual wave source in the preset order can be determined according to specific requirements, and this specification does not make specific restrictions on this.

[0078] For example, assume that there are a total of 15 virtual wave sources, and the preset order is virtual wave source 1, 2, 3, ……, 15. Then when each sub-array works, it needs to combine and emit corresponding excitation pulses through the array elements included in the sub-array in the order of virtual wave sources 1 to 15, and thus complete one encoding transmission. Among them, after the simulation of the previous virtual wave source ends, the simulation of the next virtual wave source will immediately start; the duration of the simulation of each virtual wave source can be set according to specific requirements, and this specification does not make specific restrictions on this.

[0079] More preferably, in this method, the encoding excitation method can be set to cyclic inversion encoding. That is, assume that the number of virtual wave sources is P. Then in cyclic inversion encoding, a total of P encoding transmissions are performed. For the i-th encoding transmission, the polarity of the array element excitation pulse corresponding to the i-th virtual wave source is reversed, and the excitation pulses of other virtual wave sources remain unchanged. Specifically, the excitation pulses of each array element included in the sub-array can be combined according to the cyclic inversion encoding method, and each virtual wave source is repeatedly simulated a specified number of times in the preset order, where the signal polarity of the excitation pulses of the array elements corresponding to one virtual wave source is reversed each time the simulation is performed.

[0080] Figure 4 This is a schematic diagram of emitting excitation pulses in the way of cyclic inversion encoding provided in this specification. As Figure 4 shown, specifically as Figure 4 shown, assume that three virtual wave sources are set for encoding transmission, and they are respectively represented by their position coordinates s i to control each sub-array to perform three encoding transmissions in turn. For each sub-array, first emit the diffused wave corresponding to s1 with a reversed pulse, then emit the diffused waves corresponding to s2 and s3 with a normal pulse, and after these emissions are completed, perform acquisition; in the second emission, emit the diffused waves corresponding to s1, s2, s3 in the same order, but reverse the pulse excitation corresponding to s2; in the third emission, emit the diffused waves corresponding to s1, s2, s3 in the same order s1, s2, s3, but reverse the pulse excitation corresponding to s3. In the above manner, the emissions and acquisitions of all sub-arrays are completed.

[0081] S108: Perform frequency-domain analysis on the received echo signals to obtain the frequency-domain echo data corresponding to each virtual wave source for each sub-array.

[0082] After the excitation pulses of the array elements are transmitted when simulating each virtual wave source for each sub-array in step S106, the received echo signals can be processed in this step. Among them, after each sub-array completes one coded transmission, that is, after simulating all virtual wave sources once in the preset order, all the array elements included in the sub-array will receive an echo signal once. For example, assuming that a sub-array contains 9 array elements and the sub-array simulates each virtual wave source 5 times in the preset order, then each sub-array will correspondingly receive 9×5 = 45 echo signals.

[0083] Since in this method, all virtual wave sources are simulated in each coded transmission, the information of all virtual wave sources is also included in each received echo signal simultaneously. Therefore, it is necessary to consider that the echo signals of the coded transmission cannot be directly used for beamforming, so a decoding operation is required to obtain the echo data corresponding to a single virtual wave source. Decoding is equivalent to the inverse process of coded transmission. Through decoding, echo data with high signal-to-noise ratio can be obtained.

[0084] Specifically, for each sub-array, a Fourier transform can be performed on the echo signals received by the sub-array to obtain transformed echo data; according to the transformed echo data, the signal frequency band and angular frequency of the original array, the frequency-domain echo data corresponding to each virtual wave source of the sub-array can be obtained.

[0085] Performing frequency-domain analysis on the echo signals encoded with the information of multiple virtual wave sources can obtain the frequency-domain echo data of a single virtual wave source. The specific process can be divided into the following three steps:

[0086] Step 1: Perform a time-domain Fourier transform on all echo signals to obtain frequency-domain signals;

[0087] Step 2: For each sub-array, taking the frequency-domain echo data when the sub-array simulates a single virtual wave source alone as the variable to be solved, a frequency-domain linear equation system is constructed according to the transmission code. The equation corresponding to the i-th coded transmission is as follows:

[0088]

[0089] Among them, y i represents the frequency-domain signal obtained after performing a Fourier transform on the echo signal corresponding to the i-th coded transmission, u i represents the frequency-domain echo data corresponding to the i-th virtual wave source, and g represents the phase rotation multiplier corresponding to the excitation interval, which is given by the following formula:

[0090]

[0091] Among them, j is the imaginary unit, ω is the angular frequency, and ΔT is the time interval between continuously simulating each virtual wave source (i.e., Figure 4The time intervals of the three excitations s1, s2, and s3 on the clock sequence, ΔT, generally take extremely small values and are approximately 0).

[0092] Step 3: Solve the linear equations for each frequency within the working frequency band of the original array to obtain the frequency-domain echo data emitted separately by each virtual wave source of the array. If the working frequency band of the original array is [f L , f H , then the echo data frequency components outside this interval are defaulted to 0 and are not concerned about.

[0093] S110: Construct a target three-dimensional image based on the frequency-domain echo data.

[0094] Finally, in this step, according to the frequency-domain echo data of each sub-array corresponding to each virtual wave source obtained in step S108, frequency-domain beamforming is performed on each pixel point in the imaging area to construct a target three-dimensional image.

[0095] For any pixel point r in the imaging area, its frequency-domain beamforming is given by the following formula:

[0096]

[0097] where u klp represents the frequency-domain echo data received by the l-th array element after the emission of the p-th virtual wave source corresponding to the k-th sub-array, τ klp represents the echo delay of the pixel point r at the l-th array element for this emission, and ω q represents the q-th angular frequency point.

[0098] When constructing a target three-dimensional image using the three-dimensional imaging method for an ultrasonic two-dimensional phased array provided in this specification, based on the idea of time-division multiplexing, the original array is divided into multiple sub-arrays. Each sub-array sequentially and continuously simulates different virtual wave sources in a coded emission manner, and performs frequency-domain analysis on the collected echo signals, and constructs a target three-dimensional image according to the obtained frequency-domain echo data. This method uses time-division multiplexing to control a high-element-number array with a low channel number for imaging, effectively controlling the overall cost of the system; ensuring a high frame rate of imaging through the diffused wave emission and beamforming of virtual wave sources; increasing the average energy of sub-array emissions with coded excitation to ensure the signal-to-noise ratio of sub-array acquisitions; and at the same time, performing frequency-domain decoding and beamforming within the working frequency band of the original array, greatly simplifying the calculation process.

[0099] The above is the three-dimensional imaging method provided in this specification. Based on the same idea, this specification also provides a corresponding three-dimensional imaging device, as Figure 5 shown.

[0100] Figure 5Schematic diagram of a three-dimensional imaging device provided in this specification, specifically including:

[0101] A partitioning module 200, configured to partition an original array including a plurality of array elements to obtain a plurality of sub-arrays, where both the original array and the sub-arrays are two-dimensional arrays;

[0102] A first determination module 202, configured to determine the number of virtual wave sources according to the information of the imaging target and the imaging requirements, and determine the positions of each virtual wave source;

[0103] A second determination module 204, configured to, for each virtual wave source, determine the excitation pulse of each array element included in each sub-array when simulating this virtual wave source;

[0104] A simulation module 206, configured to, for each sub-array in sequence, combine the excitation pulses of each array element included in this sub-array, and simulate each virtual wave source in a preset order;

[0105] An analysis module 208, configured to perform frequency-domain analysis on the received echo signal to obtain the frequency-domain echo data corresponding to each virtual wave source for each sub-array;

[0106] A construction module 210, configured to construct a target three-dimensional image according to the frequency-domain echo data.

[0107] Optionally, each array element included in the original array only exists in one sub-array after partitioning, and there is no overlapping part between the sub-arrays.

[0108] Optionally, the sizes of the sub-arrays obtained by partitioning the original array are the same.

[0109] Optionally, the first determination module 202 is specifically configured to determine the number of virtual wave sources according to the imaging depth, imaging frame rate of the target three-dimensional image to be constructed, and the average sound speed of the imaging area.

[0110] Optionally, the second determination module 204 is specifically configured to, for each sub-array, determine the magnitude and delay of the excitation pulse of each array element included in this sub-array when simulating this virtual wave source.

[0111] Optionally, the simulation module 206 is specifically configured to combine the excitation pulses of each array element included in this sub-array according to a polling reverse coding method, and repeat simulating each virtual wave source a specified number of times in a preset order, where the signal polarity of the excitation pulses of each array element corresponding to one virtual wave source is reversed each time of simulation.

[0112] Optionally, the parsing module 208 is specifically configured to perform Fourier transform on the echo signals received by each sub-array to obtain transformed echo data; and obtain the frequency-domain echo data corresponding to each virtual wave source of the sub-array according to the transformed echo data, the signal frequency band and the angular frequency of the original array.

[0113] This specification also provides a computer-readable storage medium storing a computer program that can be used to execute the above Figure 1 provided three-dimensional imaging method.

[0114] This specification also provides Figure 6 a schematic structural diagram of the electronic device shown. As Figure 6 described, at the hardware level, the electronic device includes a processor, an internal bus, a network interface, a memory, and a non-volatile memory. Of course, it may also include other hardware required for other services. The processor reads the corresponding computer program from the non-volatile memory into the memory and then runs it to implement the above Figure 1 described three-dimensional imaging method. Of course, in addition to the software implementation, this specification does not exclude other implementation methods, such as logic devices or a combination of software and hardware. That is to say, the execution subject of the following processing flow is not limited to each logic unit, but may also be hardware or a logic device.

[0115] Improvements to a technology can be clearly distinguished as hardware improvements (e.g., improvements to circuit structures such as diodes, transistors, switches, etc.) or software improvements (improvements to method flows). However, with the development of technology, many improvements to method flows today can be regarded as direct improvements to hardware circuit structures. Almost all designers obtain the corresponding hardware circuit structure by programming the improved method flow into the hardware circuit. Therefore, it cannot be said that an improvement to a method flow cannot be implemented with a hardware entity module. For example, a programmable logic device (PLD) (e.g., a field programmable gate array (FPGA)) is such an integrated circuit whose logic function is determined by the user programming the device. Designers can program themselves to "integrate" a digital system on a single PLD, without having to ask a chip manufacturer to design and fabricate a dedicated integrated circuit chip. Moreover, nowadays, instead of manually fabricating integrated circuit chips, this programming is mostly implemented using "logic compiler" software, which is similar to the software compiler used in program development and writing. The original code before compilation also has to be written in a specific programming language, which is called a hardware description language (HDL), and there is not only one type of HDL, but many types, such as ABEL (Advanced Boolean Expression Language), AHDL (Altera Hardware Description Language), Confluence, CUPL (Cornell University Programming Language), HDCal, JHDL (Java Hardware Description Language), Lava, Lola, MyHDL, PALASM, RHDL (Ruby Hardware Description Language), etc. The most commonly used ones currently are VHDL (Very-High-Speed Integrated Circuit Hardware Description Language) and Verilog. Those skilled in the art should also be aware that by simply performing a little logical programming on the method flow with the above-mentioned several hardware description languages and programming it into an integrated circuit, it is easy to obtain a hardware circuit that implements the logical method flow.

[0116] The controller can be implemented in any suitable manner. For example, the controller can take the form of, for example, a microprocessor or a processor and a computer-readable medium storing computer-readable program code (such as software or firmware) executable by the (micro)processor, logic gates, switches, an application specific integrated circuit (ASIC), a programmable logic controller, and an embedded microcontroller. Examples of the controller include, but are not limited to, the following microcontrollers: ARC 625D, Atmel AT91SAM, Microchip PIC18F26K20, and Silicone Labs C8051F320. The memory controller can also be implemented as part of the control logic of the memory. Those skilled in the art also know that in addition to implementing the controller in the form of pure computer-readable program code, it is entirely possible to logically program the method steps to enable the controller to be implemented in the form of logic gates, switches, application specific integrated circuits, programmable logic controllers, embedded microcontrollers, etc. to achieve the same function. Therefore, such a controller can be considered a hardware component, and the devices included therein for implementing various functions can also be regarded as the structures within the hardware component. Or even, the devices for implementing various functions can be regarded as either software modules for implementing the method or structures within the hardware component.

[0117] The systems, devices, modules, or units illustrated in the above embodiments can be specifically implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer. Specifically, the computer can be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or any combination of these devices.

[0118] For the convenience of description, when describing the above devices, they are described separately as various units according to their functions. Of course, when implementing this specification, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0119] Those skilled in the art should understand that the embodiments of the present application can be provided as a method, a system, or a computer program product. Therefore, the present application can take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0120] This application is described with reference to the flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the present application. It should be understood that each flow and / or block in the flowchart and / or block diagram can be implemented by computer program instructions, as well as the combination of flows and / or blocks in the flowchart and / or block diagram. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, such that the instructions executed by the processor of the computer or other programmable data processing device generate a means for implementing the specified functions in one or more flows Figure 1 or more flows and / or blocks Figure 1 or a means for implementing the specified functions in one or more blocks.

[0121] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, such that the instructions stored in the computer-readable memory generate a manufactured article including an instruction means that implements the specified functions in one or more flows Figure 1 or more flows and / or blocks Figure 1 or a means for implementing the specified functions in one or more blocks.

[0122] These computer program instructions can also be loaded onto a computer or other programmable data processing device, such that a series of operation steps are executed on the computer or other programmable device to generate a computer-implemented process, so that the instructions executed on the computer or other programmable device provide steps for implementing the specified functions in one or more flows Figure 1 or more flows and / or blocks Figure 1 or a means for implementing the specified functions in one or more blocks.

[0123] In a typical configuration, a computing device includes one or more processors (CPUs), an input / output interface, a network interface, and memory.

[0124] The memory may include non-permanent memory in the form of computer-readable media, random access memory (RAM), and / or non-volatile memory such as read-only memory (ROM) or flash memory (flash RAM). The memory is an example of computer-readable media.

[0125] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0126] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0127] It should be understood by those skilled in the art that the embodiments of this specification may be provided as methods, systems or computer program products. Therefore, this specification may take the form of a complete hardware embodiment, a complete software embodiment or an embodiment combining software and hardware. Moreover, this specification may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0128] This specification may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. This specification may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0129] Each embodiment in this specification is described in a progressive manner. For the identical or similar parts among the embodiments, reference can be made to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and for the relevant parts, reference can be made to the corresponding description in the method embodiment.

[0130] The above description is only for the embodiments of this specification and is not intended to limit this specification. For those skilled in the art, various modifications and changes can be made to this specification. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this specification shall be included within the scope of the claims of this application.

Claims

1. A three-dimensional imaging method, characterized in that, Including: Dividing an original array including multiple array elements to obtain a plurality of sub - arrays, where the original array and the sub - arrays are both two - dimensional arrays; Determining the number of virtual wave sources according to the information of the imaging target and the imaging requirements, and determining the positions of each virtual wave source; For each virtual wave source, determining the excitation pulse of each array element included in each sub - array when simulating this virtual wave source; Sequentially for each sub - array, combining the excitation pulses of each array element included in this sub - array, and simulating each virtual wave source in a preset order; Performing frequency - domain analysis on the received echo signal to obtain the frequency - domain echo data corresponding to each virtual wave source for each sub - array; Constructing a target three - dimensional image according to the frequency - domain echo data; Among them, combining the excitation pulses of each array element included in this sub - array and simulating each virtual wave source in a preset order specifically includes: Combining the excitation pulses of each array element included in this sub - array according to a polling - reverse coding method, and repeating the simulation of each virtual wave source a specified number of times in a preset order, where the signal polarity of the excitation pulses of each array element corresponding to one virtual wave source is reversed each time of simulation.

2. The method according to claim 1, characterized in that, Each array element included in the original array only exists in one sub - array after division, and there is no overlapping part between the sub - arrays.

3. The method according to claim 1, characterized in that, The sizes of the sub - arrays obtained by dividing the original array are the same.

4. The method according to claim 1, characterized in that Determining the number of virtual wave sources according to the information of the imaging target and the imaging requirements specifically includes: Determining the number of virtual wave sources according to the imaging depth, imaging frame rate of the target three - dimensional image to be constructed, and the average sound speed of the imaging area.

5. The method according to claim 1, wherein Determining the excitation pulse of each array element included in each sub - array when simulating this virtual wave source specifically includes: For each sub - array, determining the magnitude and delay of the excitation pulse of each array element included in this sub - array when simulating this virtual wave source.

6. The method according to claim 1, characterized in that, Performing frequency - domain analysis on the received echo signal to obtain the frequency - domain echo data corresponding to each virtual wave source for each sub - array specifically includes: For each sub - array, performing Fourier transform on the echo signal received by this sub - array to obtain transformed echo data; According to the transformed echo data, the signal frequency band and angular frequency of the original array, obtaining the frequency - domain echo data corresponding to each virtual wave source for this sub - array.

7. A three-dimensional imaging device, characterized in that, Including: A dividing module for dividing an original array including multiple array elements to obtain a plurality of sub - arrays, where the original array and the sub - arrays are both two - dimensional arrays; A first determining module for determining the number of virtual wave sources according to the information of the imaging target and the imaging requirements, and determining the positions of each virtual wave source; A second determining module for, for each virtual wave source, determining the excitation pulse of each array element included in each sub - array when simulating this virtual wave source; A simulation module for, sequentially for each sub - array, combining the excitation pulses of each array element included in this sub - array, and simulating each virtual wave source in a preset order; An analysis module for performing frequency - domain analysis on the received echo signal to obtain the frequency - domain echo data corresponding to each virtual wave source for each sub - array; A construction module for constructing a target three - dimensional image according to the frequency - domain echo data; Among them, the simulation module is specifically configured to combine the excitation pulses of each element included in the sub-array according to the coding method of polling inversion, repeat the simulation of each virtual wave source a specified number of times in a preset order, and among them, when simulating each time, invert the signal polarity of the excitation pulses of the elements corresponding to one virtual wave source.

8. A computer-readable storage medium, characterized in that, The storage medium stores a computer program, and when the computer program is executed by a processor, the method described in any one of the above claims 1 to 6 is implemented.

9. An electronic device, comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, When the processor executes the computer program, the method described in any one of the above claims 1 to 6 is implemented.

Citation Information

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