Liquid-cooled light module, opto-electric conversion unit and method of manufacturing the same

Abstract

The application provides a liquid-cooled light module, a photoelectric conversion unit and a manufacturing method thereof. The photoelectric conversion unit comprises a circuit board with photoelectric conversion elements, a light guide block comprising a light guide block body arranged on the circuit board, a light signal interface arranged on the light guide block body, and an element cavity arranged on the light guide block body and used for accommodating the photoelectric conversion elements, wherein the light guide block body is used for establishing an optical path between the light signal interface and the element cavity; a first sealing adhesive is arranged between a bottom surface of the light guide block body and the circuit board and is arranged around the element cavity; and a second sealing adhesive is arranged between the bottom surface of the light guide block body and the circuit board and is arranged around the first sealing adhesive. The photoelectric conversion unit has a more excellent sealing effect.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of optical communication technology. More specifically, the present invention relates to a photoelectric conversion unit, a method for manufacturing the photoelectric conversion unit, and a liquid-cooled optical module including the photoelectric conversion unit. Background Technology

[0002] Liquid-cooled optical modules are primarily used for converting between electrical and optical signals and are one of the core components of optical communication systems. They offer significant advantages such as rapid heat dissipation, low power consumption, and high data rates, and are widely used in data centers, cloud computing, and high-speed communications.

[0003] The liquid-cooled optical module mainly consists of a housing, a photoelectric conversion unit, and fiber optic patch cords connected to the photoelectric conversion unit. The photoelectric conversion unit includes a circuit board containing photoelectric conversion elements (such as chips), and a light guide block bonded to the circuit board, covering the photoelectric conversion elements, and coupled to the fiber optic patch cord. The light guide block's function is to establish an optical path between the fiber optic patch cord and the circuit board, allowing the photoelectric conversion elements on the circuit board to receive optical signals from the fiber optic patch cord or transmit optical signals to the fiber optic patch cord.

[0004] Currently, liquid-cooled optical modules employ a series of sealing measures to prevent coolant from entering the light guide block and damaging (corroding or accelerating the aging) the photoelectric conversion components. These measures include potting compound covering the fiber optic patch cord and light guide block, and a sealing adhesive layer placed between the light guide block and the circuit board. Although these two sealing layers provide some protection, they may still fail due to aging or corrosion under long-term immersion in coolant, leading to coolant seepage into the light guide block and damage to the photoelectric conversion components, ultimately affecting the normal operation of the photoelectric conversion components and even the entire liquid-cooled optical module. Therefore, how to further improve the sealing protection level of liquid-cooled optical modules, especially the photoelectric conversion unit, particularly the sealing level between the light guide block and the circuit board, is a problem that urgently needs to be solved in this field. Summary of the Invention

[0005] To address one or more of the technical problems mentioned above, the present invention provides a photoelectric conversion unit, a method for manufacturing the photoelectric conversion unit, and a liquid-cooled optical module including the photoelectric conversion unit. The photoelectric conversion unit has a superior sealing effect, which reduces the risk of coolant seeping into the light guide block and damaging the photoelectric conversion element, and ensures that the liquid-cooled optical module can operate stably for a long time in the coolant and transmit data efficiently and with high quality.

[0006] According to a first aspect of the present invention, a photoelectric conversion unit is provided, comprising: a circuit board having a photoelectric conversion element; a light guide block including a light guide block body disposed on the circuit board, an optical signal interface disposed on the light guide block body, and a component cavity disposed on the light guide block body for accommodating the photoelectric conversion element, wherein the light guide block body is used to establish an optical path between the optical signal interface and the component cavity; a first sealing adhesive disposed between the bottom surface of the light guide block body and the circuit board and arranged around the outside of the component cavity; and a second sealing adhesive disposed between the bottom surface of the light guide block body and the circuit board and arranged around the outside of the first sealing adhesive.

[0007] According to a second aspect of the present invention, a method for manufacturing a photoelectric conversion unit is provided, the steps of which include: preparing a circuit board for the photoelectric conversion unit, wherein the circuit board includes a circuit board having electrical signal terminals, and a photoelectric conversion element disposed on the circuit board and electrically connected to the electrical signal terminals; preparing a light guide block for the photoelectric conversion unit, the light guide block including a light guide block body, an optical signal interface disposed on the light guide block body, and an element cavity disposed on the light guide block body, wherein the light guide block body is used to establish an optical path between the optical signal interface and the photoelectric conversion unit; applying a first adhesive and a second adhesive to the light guide block, and then attaching the light guide block to the circuit board and accommodating the photoelectric conversion element through the element cavity, wherein the first adhesive, after curing, forms a first sealing adhesive for the photoelectric conversion unit, the first sealing adhesive being formed between the light guide block and the circuit board and surrounding the photoelectric conversion element, and the second adhesive, after curing, forms a second sealing adhesive for the photoelectric conversion unit, the second sealing adhesive being formed between the light guide block and the circuit board and surrounding the first sealing adhesive.

[0008] According to a third aspect of the present invention, a liquid-cooled optical module is provided, comprising: a housing including an optical port; a photoelectric conversion unit selected as the photoelectric conversion unit described in the first aspect of the present invention and disposed in the housing; and an optical fiber patch cord disposed within the housing, with one end disposed within the optical port and the other end inserted into and fixed in the optical signal interface of the light guide block of the photoelectric conversion unit.

[0009] According to a fourth aspect of the present invention, a liquid-cooled optical module is provided, comprising: a housing; a photoelectric conversion unit, selected as the photoelectric conversion unit as described in the first aspect of the present invention, and disposed in the housing; and an optical fiber patch cord disposed within the housing, with one end extending out of the housing and the other end inserted into and fixed in the optical signal interface of the light guide block of the photoelectric conversion unit.

[0010] In the photoelectric conversion unit, the manufacturing method of the photoelectric conversion unit, and the liquid-cooled optical module including the photoelectric conversion unit provided above, the applicant innovatively adds two layers of sealing protection between the light guide block and the circuit board. These are a first sealing adhesive arranged around the component cavity of the light guide block and a second sealing adhesive arranged around the first sealing adhesive. Compared with the prior art, which only has one layer of sealing protection, this at least two-layer sealing protection method can significantly enhance the isolation effect between the photoelectric conversion unit and the coolant, further reduce the risk of coolant seeping into the light guide block and damaging the photoelectric conversion element, and ensure that the liquid-cooled optical module can operate stably in the coolant for a long time and transmit data efficiently and with high quality.

[0011] In addition, the photoelectric conversion unit is also provided with an annular adhesive groove and an injection hole connected to it on the light guide block body. This ensures that the added third sealing adhesive can be formed in the annular adhesive groove and injection hole by filling. The light guide block is bonded to the circuit board and resealed between the first sealing adhesive and the second sealing adhesive. The third sealing adhesive can not only further reduce the risk of coolant seeping into the light guide block and damaging the photoelectric conversion element, ensuring that the liquid-cooled optical module can operate stably for a longer period of time in the coolant and transmit data efficiently and with high quality, but also increase the bonding area and bonding strength of the light guide block on the circuit board. Attached Figure Description

[0012] The above and other objects, features, and advantages of exemplary embodiments of the present invention will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the invention are illustrated by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein:

[0013] Figure 1 A perspective view of a photoelectric conversion unit according to an embodiment of the present invention is shown;

[0014] Figure 2 A cross-sectional view of a photoelectric conversion unit according to an embodiment of the present invention is shown;

[0015] Figure 3 It shows Figure 1 A three-dimensional view of the light guide block of the photoelectric conversion unit shown;

[0016] Figure 4 It shows Figure 1 A cross-sectional view of the light guide block of the photoelectric conversion unit shown;

[0017] Figure 5 It shows Figure 1 The image shows a bottom view of the light guide block of the photoelectric conversion unit.

[0018] Explanation of reference numerals in the attached drawings: 1. Circuit board; 11. Photoelectric conversion element; 2. Light guide block; 20. Encapsulating material; 21. Light guide block body; 21a. Block body; 21b. Base; 211. Top surface; 212. Bottom surface; 2121. First ring frame adhesive area; 2122. Second ring frame adhesive area; 22. Optical signal interface; 23. Component cavity; 24. Ring-shaped encapsulation groove; 24a. First cavity top; 24b. Second cavity top; 25. Injection hole; 26. First converging lens; 27. Second converging lens; 28. Cavity; 281. Reflective surface; 29. ​​Cover; 3. First sealing adhesive; 4. Second sealing adhesive; 5. Third sealing adhesive; 100. Photoelectric conversion unit; 300. Fiber optic patch cord. Detailed Implementation

[0019] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0020] This embodiment provides a photoelectric conversion unit 100, which is mainly used in liquid-cooled optical modules to realize the core function of liquid-cooled optical modules, namely, to realize the conversion between electrical signals and optical signals. Figure 1 and Figure 2 All examples illustrate the photoelectric conversion unit 100 of this invention. For instance... Figure 1 and Figure 2 As shown, the photoelectric conversion unit 100 includes a circuit board 1, a light guide block 2 disposed on the circuit board 1, and a first sealing adhesive 3 and a second sealing adhesive 4 for bonding the light guide block 2 to the circuit board 1. The circuit board 1 includes a photoelectric conversion element 11 disposed on its body. The photoelectric conversion element 11 mainly consists of an optical chip and an electrical chip electrically connected to it. When the photoelectric conversion unit 100 is used to receive optical signals and convert them into electrical signals, the optical chip receives the optical signals (from the fiber optic patch cord 300) through the light guide block 2 and converts them into electrical signals. The electrical chip is used to perform processing on the electrical signals, such as signal amplification and filtering, and outputs them externally. Conversely, when the photoelectric conversion unit 100 is used to receive electrical signals and convert them into optical signals, the electrical chip drives the optical chip so that the optical chip can convert the received electrical signals into optical signals and output them externally through the light guide block 2. It can be understood that the fiber optic patch cord 300 is a cable with a fiber optic connector at one end. It may or may not have an outer sheath, depending on its application scenario.

[0021] Next, combine Figures 2 to 5 The light guide block 2 mentioned above will be described by way of example. Figures 2 to 4As shown, the light guide block 2 mentioned above mainly includes a light guide block body 21 disposed on the circuit board 1, an optical signal interface 22 disposed on the light guide block body 21, and a component cavity 23 disposed on the bottom surface 212 (i.e., the surface that is joined with the circuit board 1) of the light guide block body 21 for accommodating the photoelectric conversion element 11. The light guide block body 21 is used to establish an optical path between the optical signal interface 22 and the component cavity 23. The optical signal interface 22 is used to connect the fiber optic patch cord 300 of the liquid-cooled optical module, so that the fiber optic patch cord 300 can perform optical communication with the photoelectric conversion element 11 through the light guide block 2. The fiber optic patch cord 300 can be one fiber or multiple fibers. When multiple fibers are included, the optical signals output by the multiple fibers can propagate in multiple optical paths of the light guide block 2 and enter the photoelectric conversion unit 100, where the photoelectric conversion unit 100 performs signal conversion.

[0022] To improve the sealing and protection level of the photoelectric conversion unit 100, such as Figure 4 and Figure 5 As shown, the bottom surface 212 of the light guide block body 21 includes a first annular frame adhesive area 2121 arranged around the component cavity 23, and a second annular frame adhesive area 2122 arranged around the first annular frame adhesive area 2121. The second annular frame adhesive area 2122 is preferably located at the edge of the bottom surface 212 of the light guide block body 21. The photoelectric conversion unit 100 also includes a first sealing adhesive 3 and a second sealing adhesive 4 disposed between the bottom surface 212 of the light guide block body 21 and the circuit board 1. See [link to documentation]. Figure 2 and Figure 5 The first sealing adhesive 3 is disposed on the first annular adhesive area 2121 of the bottom surface 212 of the light guide block body 21 and is arranged around the outside of the component cavity 23. The second sealing adhesive 4 is disposed on the second annular adhesive area 2122 of the bottom surface 212 of the light guide block body 21 and is arranged around the outside of the first sealing adhesive 3. However, since the prior art only lays one layer of sealing adhesive between the bottom surface 212 of the light guide block body 21 and the circuit board 1, while this embodiment arranges at least two layers of sealing adhesive, the isolation effect between the photoelectric conversion unit 100 and the coolant can be significantly enhanced, further reducing the risk of coolant seeping into the light guide block 2 and damaging (corroding or accelerating aging) the photoelectric conversion element 11, ensuring that the liquid-cooled optical module can operate stably for a long time in the coolant and transmit data efficiently and with high quality.

[0023] It is particularly important to emphasize that even if the width of a single sealing adhesive layer in the prior art is relatively wide, even equal to the sum of the widths of the two sealing adhesive layers mentioned in this embodiment, it is still not as good as the sealing effect of this embodiment. The reason is that the double-layer sealing adhesive design in this embodiment not only provides physical redundancy protection but also enhances the service life of the sealing protection. First, the two sealing adhesive layers require two molding processes; even if one has a quality defect due to poor molding, the other can be immediately remedied. Second, the two sealing adhesive layers are in contact with the coolant at different times; the outer second sealing adhesive 4 contacts the coolant preferentially before the inner first sealing adhesive 3, ensuring that the first sealing adhesive 3 is less susceptible to damage from the coolant than the second sealing adhesive 4. This significantly reduces the risk of coolant seeping into the light guide block 2, ensuring that the aforementioned double-layer sealing protection has a more significant advantage in long-term protection.

[0024] To further improve the sealing protection level of the photoelectric conversion unit 100, an additional sealing protection layer is added to the photoelectric conversion unit 100 in this embodiment. For example... Figure 2 and Figure 3 As shown, the light guide block 2 may further include an annular adhesive groove 24 disposed on the bottom surface 212 of the light guide block body 21, and an injection hole 25 disposed on the light guide block body 21 and communicating with the annular adhesive groove 24. Meanwhile, the photoelectric conversion unit 100 may further include a third sealing adhesive 5 (see [reference]) filled in the annular adhesive groove 24 and the injection hole 25 for bonding the light guide block 2 to the circuit board 1. Figure 2 Since the annular adhesive groove 24 is located between the first annular frame adhesive area 2121 and the second annular frame adhesive area 2122, and the first sealing adhesive 3 and the second sealing adhesive 4 are sequentially located in the first annular frame adhesive area 2121 and the second annular frame adhesive area 2122, the third sealing adhesive 5 is located between the first sealing adhesive 3 and the second sealing adhesive 4. This third sealing adhesive 5 can not only further reduce the risk of coolant seeping into the light guide block 2 and damaging the photoelectric conversion element 11, ensuring that the liquid-cooled optical module can operate stably for a longer period of time in the coolant and transmit data efficiently and with high quality, but also increase the bonding area and bonding strength of the light guide block 2 on the circuit board 1.

[0025] As an example, such as Figure 4The central axis of the optical signal interface 22 is parallel to the bottom surface 212 of the light guide block body 21. The light guide block 2 may also include a first converging lens 26 disposed on the light guide block body 21 and located within the optical signal interface 22, a second converging lens 27 disposed on the light guide block body 21 and located within the component cavity 23, and a cavity 28 disposed on the top surface 211 of the light guide block body 21 (the surface opposite to the bottom surface 212 and away from the circuit board 1) and having a reflective surface 281. The optical axes of the first converging lens 26 and the second converging lens 27 intersect perpendicularly on the reflective surface 281 and are both within the optical path of the light guide block 2. The placement of the first converging lens 26 and the second converging lens 27 results in lower optical signal loss and a more concentrated beam during transmission, thereby improving the stability and reliability of the transmission process. Furthermore, the reflective surface 281 can alter the optical path and promote a more compact size for the light guide block 2, thus ensuring a more compact layout of the photoelectric conversion unit 100 and the liquid-cooled optical module and reducing their space occupation.

[0026] To effectively control the volume of the light guide block 2, the optical signal interface 22 and the annular adhesive groove 24 are configured such that their orthographic projections on the bottom surface 212 of the light guide block body 21 intersect, which helps to reduce the volume of the light guide block 2. Furthermore, the annular adhesive groove 24 includes a first cavity top 24a and a second cavity top 24b that is closer to the top surface 211 of the light guide block body 21 than the first cavity top 24a. The first cavity top 24a is located between the optical signal interface 22 and the bottom surface 212 of the light guide block body 21, while the second cavity top 24b is higher than the first cavity top 24a but lower than the top surface 211 of the light guide block body 21. The adhesive injection hole 25 connects to the annular adhesive groove 24 at the location of the second cavity top 24b. The cavity top of the annular adhesive groove 24 adopts a stepped surface design, and the adhesive injection hole 25 is positioned at a higher cavity top position. This arrangement allows the adhesive to be smoothly and evenly added to the annular adhesive groove 24, especially filling the lower area of ​​the cavity top. In this way, the third sealing adhesive 5, which is cured by the adhesive, can effectively perform the functions of bonding and sealing.

[0027] To further improve the bonding and sealing effects of the third sealing adhesive 5, the distance from the top 24a of the first cavity of the annular adhesive groove 24 to the bottom surface 212 of the light guide block body 21 is preferably 0.4~0.5mm. Extensive experimental verification shows that when the distance from the top 24a of the first cavity of the annular adhesive groove 24 to the bottom surface 212 of the light guide block body 21 is 0.4~0.5mm, the light guide block body 21 has sufficient strength at the top 24a of the first cavity of the annular adhesive groove 24, and the adhesive can fill the annular adhesive groove 24 more fully and evenly.

[0028] In this embodiment, the first sealing adhesive 3, the second sealing adhesive 4, and the third sealing adhesive 5 are all cured by either light-curing or thermosetting adhesives. Light-curing adhesives cure rapidly under light, while thermosetting adhesives cure by heating. These two curing methods ensure that the adhesives can quickly form strong adhesion during the curing process, thereby improving the reliability and efficiency of the connection and sealing. Preferably, the first sealing adhesive 3 and the third sealing adhesive 5 are manufactured using thermosetting adhesives. The light guide block 2 is made of a transparent material, allowing curing light such as ultraviolet light to pass through. However, the brightness and uniformity of the light-curing adhesive are significantly reduced when irradiated, affecting the molding quality and effect of the first sealing adhesive 3 and the third sealing adhesive 5. Therefore, to improve the molding quality and effect, it is more recommended that the first sealing adhesive 3 and the third sealing adhesive 5 be manufactured using thermosetting adhesives, thus achieving superior molding quality and effect.

[0029] As an example, the frame widths of the first ring-shaped adhesive area 2121 and the second ring-shaped adhesive area 2122 are both 0.5~1mm. When the frame widths of the first ring-shaped adhesive area 2121 and the second ring-shaped adhesive area 2122 are precisely controlled within the range of 0.5~1mm, it not only provides sufficient bonding area for bonding with the first sealing adhesive 3 and the second sealing adhesive 4, and ensures that the first sealing adhesive 3 and the second sealing adhesive 4 can fully perform their connection and sealing functions, but also ensures that the wall structure of the light guide block body 21 used to form the first ring-shaped adhesive area 2121 and the second ring-shaped adhesive area 2122 has good mechanical strength, and ensures that the wall structure is not prone to breakage or other adverse situations during assembly and use.

[0030] Similarly, the width of the annular adhesive groove 24 is 1~2mm. The precise control of the width of the annular adhesive groove 24 at 1~2mm ensures that the adhesive can flow and distribute smoothly and evenly in the injection hole 25 and the annular adhesive groove 24, and form a uniform and continuous third sealing adhesive 5 between the light guide block 2 and the circuit board 1, thereby ensuring that the third sealing adhesive 5 can achieve more outstanding effects in terms of bonding and sealing.

[0031] Preferably, the injection hole 25 is a through hole with a diameter of 0.5~1mm. This hole diameter design is large enough to accommodate the size of common glue gun nozzles, ensuring that the adhesive can be smoothly injected into the annular glue groove 24, and small enough to reduce the impact on the structural strength of the light guide block body 21. In addition, the diameter of the injection hole 25 does not exceed the groove width (1~2mm) of the annular glue groove 24 and can be smoothly connected to it, ensuring that the adhesive can completely fill the space inside the groove during injection and curing, forming a uniform sealing adhesive.

[0032] Preferably, the shortest distance between the sidewall of the component cavity 23 and the photoelectric conversion element 11 is 0.5~1mm. This distance ensures that the sidewall of the component cavity 23 of the light guide block 2 is unlikely to come into contact with and damage the sensitive photoelectric conversion element 11. In particular, it avoids the aforementioned adverse situation from occurring during the process of attaching the light guide block 2 to the circuit board 1. It should be noted that the sidewall of the component cavity 23 is the surface that is in contact with the surface where the second converging lens 27 is located. It can be understood that, in practice, in order to reduce the processing difficulty of the circuit board 1, the photoelectric conversion element 11 is generally located on the vertical surface of the component cavity 23 near the optical signal interface 22.

[0033] In this embodiment, the light guide block 2 is preferably a one-piece molded structure to simplify the manufacturing process and improve the overall quality and performance. The light guide block body 21 includes a base 21b and a block body 21a fixedly mounted on the base 21b. The optical signal interface 22, the first converging lens 26, the second converging lens 27, and the cavity 28 are all formed in the block body 21a, while the annular adhesive groove 24 and the component cavity 23 are formed in the base 21b and the block body 21a. The cross-sectional area of ​​the base 21b is larger than that of the block body 21a. Due to its high-precision structural requirements, the block body 21a typically requires high-precision manufacturing molds and processes to ensure the accuracy of its optical and mechanical properties. The base 21b, on the other hand, mainly serves a connecting and accommodating function, and its processing precision requirements are relatively lower. In other words, only a groove for molding the base 21b needs to be created in the existing manufacturing mold; the existing manufacturing mold and process can then be used to manufacture the aforementioned light guide block 2, thus reducing manufacturing costs and processing difficulty.

[0034] As an example, the base 21b and the main body 21a of the light guide block 21 have a circular, rectangular, or polygonal cross-section in the direction perpendicular to the ground, but a rectangle is preferred for ease of manufacturing. In addition, some material reduction notches can be provided in the main body 21a, for example, two material reduction notches are provided on the rectangular main body 21a symmetrically arranged with respect to the optical signal interface 22, so as to reduce the material and weight of the light guide block 2 as much as possible.

[0035] In this embodiment, the light guide block 2 may further include a cap 29 fixedly disposed on the top surface 211 of the light guide block body 21 and sealing the cavity 28, see [link to previous embodiment]. Figure 2The reflective surface 281 is generally a fully reflective surface formed by the difference in refractive index between the material of the light guide block 2 and air. If impurities are present in the cavity 28, it will affect the performance of the reflective surface 281. The cover 29 can prevent dust, moisture, and other harmful substances from entering the cavity 28 of the light guide block 2, ensuring that the performance of the reflective surface 281 is always at its optimal level. To achieve better sealing of the photoelectric conversion unit 100, the photoelectric conversion unit 100 may also include a potting compound 20 disposed on the circuit board 1 and covering the cover 29, the light guide block 2, and the portion of the fiber optic patch cord 300 near the light guide block 2. The potting compound 20 takes precedence over the first sealing adhesive 3, the second sealing adhesive 4, and the third sealing adhesive 5 in terms of sealing and protection, and provides reinforcement and sealing enhancement for the cover 29. In addition, the potting compound 20 can also effectively prevent dust, bacteria, and other contaminants from damaging the photoelectric conversion unit 100.

[0036] The manufacturing method of the aforementioned photoelectric conversion unit 100 is described below. The steps include preparing the circuit board 1 and the light guide block 2 of the photoelectric conversion unit 100, then applying a first adhesive and a second adhesive to the bottom surface 212 of the light guide block body 21 of the light guide block 2, and then attaching the light guide block 2 to the circuit board 1 and accommodating the photoelectric conversion element 11 through the component cavity 23. The first adhesive is mainly applied to the first annular adhesive area 2121 of the bottom surface 212 of the light guide block body 21 of the light guide block 2, which can form the first sealing adhesive 3 of the photoelectric conversion unit 100 after curing; while the second adhesive is mainly applied to the second annular adhesive area 2122 of the bottom surface 212 of the light guide block body 21 of the light guide block 2, which can form the second sealing adhesive 4 of the photoelectric conversion unit 100 after curing. In the photoelectric conversion unit 100 obtained by this manufacturing method, the first sealing adhesive 3 and the second sealing adhesive 4 can further reduce the risk of coolant seeping into the light guide block 2 and damaging the photoelectric conversion element 11, ensuring that the liquid-cooled optical module can operate stably for a long time in the coolant and transmit data efficiently and with high quality.

[0037] In this embodiment, the manufacturing method may further include: injecting a third adhesive into the annular adhesive groove 24 through the injection hole 25 until the annular adhesive groove 24 and the injection hole 25 are completely filled, wherein the third adhesive, after curing, forms a third sealing adhesive 5 for the photoelectric conversion unit 100. Injecting the third adhesive through the injection hole 25 and forming the third sealing adhesive 5 ensures that the third sealing adhesive 5 can further reduce the risk of coolant seeping into the light guide block 2 and damaging the photoelectric conversion element 11.

[0038] As an example, the first, second, and third adhesives are all either light-curing or thermosetting adhesives, and their sources can be the same or different. Light-curing adhesives cure rapidly under light, while thermosetting adhesives cure by heating. These two curing methods ensure that the adhesives can quickly form strong adhesion during the curing process, thereby improving the reliability and efficiency of the connection and seal.

[0039] In one embodiment, the first and second adhesives are photocurable and thermocurable adhesives from the same source. The multi-layered structure of the light guide block 2 blocks ultraviolet light, leading to low curing efficiency and incomplete curing of the first sealing adhesive 3 and / or the second sealing adhesive 4, especially the first sealing adhesive 3 located below the thicker light guide block. Using photocurable adhesives eliminates the need to change glue guns during application. It is understood that when curing the first sealing adhesive 3 and the second sealing adhesive 4 to form the photoelectric conversion unit 100, they are first cured by ultraviolet light and then baked at high temperature until both are fully cured. It should be noted that the ultraviolet curing of the first sealing adhesive 3 and the second sealing adhesive 4 ensures that the light guide block 2 adheres to the circuit board 1, preventing displacement of the light guide block 2 during high-temperature baking.

[0040] In one embodiment, the third adhesive is a low-viscosity thermosetting adhesive with good wetting properties. The third adhesive is injected into the annular adhesive groove 24 through the injection hole 25. The low-viscosity adhesive with good wetting properties has good flowability and can fully fill the annular adhesive groove 24. Since the third sealing adhesive 5 has a relatively high thickness, using a light-curing adhesive can easily lead to problems such as insufficient internal curing; therefore, using a thermosetting adhesive results in better molding. It is understood that the third adhesive, which completely fills the annular adhesive groove 24 and the injection hole 25, is baked at high temperature to cure and form the third sealing adhesive 5.

[0041] In this embodiment, the manufacturing method may further include: inserting and fixing the fiber optic patch cord 300 into the optical signal interface 22 of the light guide block 2 of the photoelectric conversion unit 100, so that the fiber optic patch cord 300 can communicate optically with the photoelectric conversion element 11 of the photoelectric conversion unit 100 through the light guide block 2; covering the cover 29; adding potting compound to the circuit board 1 of the photoelectric conversion unit 100 and covering the cover 29, the light guide block 2, and the end of the fiber optic patch cord 300 near the light guide block 2, until the potting compound cures to form the potting compound 20 of the photoelectric conversion unit 100. Therefore, the potting compound 20 formed by the curing of the potting compound provides additional sealing protection and structural reinforcement for the entire photoelectric conversion unit 100. It is understood that in this invention, the order of covering the cover and inserting the fiber optic patch cord can be interchanged, that is, the fiber optic patch cord can be inserted first and then the cover can be covered, or the cover can be covered first and then the fiber optic patch cord can be inserted. Both orders can achieve the same technical effect.

[0042] The following describes the application of the photoelectric conversion unit 100 mentioned above in two types of liquid-cooled optical modules. In one application scenario, the liquid-cooled optical module includes a housing with optical and electrical ports, a photoelectric conversion unit arranged in the housing and electrically connected to the electrical port, and an optical fiber patch cord 300 located inside the housing, with one end at the optical port of the optical module and the other end inserted into and fixed in the optical signal interface 22 of the light guide block 2 of the photoelectric conversion unit. The photoelectric conversion unit 100 mentioned above is selected because of its excellent sealing and protection performance; it can operate continuously and efficiently even when immersed in coolant. Therefore, the liquid-cooled optical module can improve its reliability and durability through the photoelectric conversion unit 100, ensuring that the liquid-cooled optical module is an ideal choice for communication systems with high heat dissipation requirements. It should be noted that the optical port of the optical module is used for optical communication with the outside, and the optical fiber patch cord 300 located at one end of the optical port of the optical module is used to receive optical signals or output optical signals from the optical module.

[0043] In another application scenario, the liquid-cooled optical module includes a housing with an electrical port, a photoelectric conversion unit arranged in the housing and electrically connected to the electrical port, and a fiber optic patch cord 300 located inside the housing, with one end extending out (connecting to other optical fibers or another liquid-cooled optical module) and the other end inserted into and fixed in the optical signal interface 22 of the light guide block 2 of the photoelectric conversion unit. The photoelectric conversion unit is also selected as the aforementioned photoelectric conversion unit 100. One end of the fiber optic patch cord of this type of optical module extends out of the housing and can be directly coupled to another patch cord via an adapter. A tail sleeve or other plastic parts are provided on the side of the optical module away from the electrical interface. The housing can be interference-fitted with the tail sleeve to further optimize the sealing performance of the liquid-cooled optical module. Due to its excellent sealing and protection performance, it can operate persistently and efficiently even when immersed in coolant. Therefore, the liquid-cooled optical module can improve its reliability and durability through the photoelectric conversion unit 100, ensuring that the liquid-cooled optical module is an ideal choice for communication systems with high heat dissipation requirements.

[0044] In the foregoing description of this application, unless otherwise expressly specified and limited, the terms "fixed," "installed," "connected," or "linked" should be interpreted broadly. For example, the term "linked" can refer to a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; or it can refer to the internal communication of two components or the interaction between two components. Therefore, unless otherwise expressly limited in this application, those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0045] Based on the above description of this application, those skilled in the art will also understand that the terms used, such as "top," "bottom," "inner," and "outer," which indicate orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings of this application. They are only for the purpose of facilitating the explanation of the present invention and simplifying the description, and do not explicitly or implicitly suggest that the device or element involved must have the specific orientation, or be constructed and operated in a specific orientation. Therefore, the above-mentioned orientation or positional relationship terms cannot be understood or interpreted as a limitation on the present invention.

[0046] Furthermore, the terms "first" or "second," etc., used in this application to refer to numbers or ordinal numbers are for descriptive purposes only and should not be construed as explicitly or implicitly indicating relative importance or specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, or more, unless otherwise explicitly specified.

[0047] While numerous embodiments of the invention have been shown and described herein, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Many modifications, alterations, and alternatives will occur to those skilled in the art without departing from the spirit and essence of the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in the practice of the invention. The appended claims are intended to define the scope of protection of the invention and therefore cover equivalents or alternatives within the scope of these claims.

Claims

1. An opto-electric conversion unit, characterized by, It includes: Circuit board with photoelectric conversion elements; A light guide block includes a light guide block body disposed on the circuit board, an optical signal interface disposed on the light guide block body, and a component cavity disposed on the light guide block body for accommodating the photoelectric conversion element, wherein the light guide block body is used to establish an optical path between the optical signal interface and the component cavity. A first sealing adhesive is disposed between the bottom surface of the light guide block body and the circuit board and arranged in a surrounding manner around the outside of the component cavity; and The second sealing adhesive is disposed between the bottom surface of the light guide block body and the circuit board and is arranged around the outside of the first sealing adhesive. The light guide block further includes an annular adhesive groove on the bottom surface of the light guide block body, and an injection hole on the light guide block body that communicates with the annular adhesive groove. The photoelectric conversion unit further includes a third sealing adhesive that fills the annular adhesive groove and the injection hole and is used to bond the light guide block to the circuit board. The third sealing adhesive is located between the first sealing adhesive and the second sealing adhesive, and the source of the third sealing adhesive is different from the source of the first sealing adhesive and the second sealing adhesive.

2. The photoelectric conversion unit according to claim 1, characterized by The optical signal interface and the annular adhesive groove intersect on the bottom surface of the light guide block body.

3. The photoelectric conversion unit according to claim 2, characterized by The annular adhesive groove includes a first cavity top and a second cavity top that is closer to the top surface of the light guide block body than the first cavity top. The first cavity top is located between the optical signal interface and the bottom surface of the light guide block body. The second cavity top is higher than the first cavity top but lower than the top surface of the light guide block body. The glue injection hole is connected to the annular adhesive groove at the location of the second cavity top.

4. The photoelectric conversion unit according to any one of claims 1 to 3, characterized by, The bottom surface of the light guide block body includes a first ring frame adhesive area and a second ring frame adhesive area, which are separated by the annular adhesive groove and sequentially connected to the first sealing adhesive and the second sealing adhesive. The frame width of the first ring frame adhesive area and the second ring frame adhesive area is 0.5~1mm.

5. The photoelectric conversion unit according to any one of claims 1 to 3, characterized by, The central axis of the optical signal interface is parallel to the bottom surface of the light guide block body. The light guide block further includes a first converging lens disposed on the light guide block body and located within the optical signal interface, a second converging lens disposed on the light guide block body and located within the element cavity, and a cavity disposed on the top surface of the light guide block body and having a reflective surface. The optical axes of the first and second converging lenses intersect perpendicularly on the reflective surface and are both located in the optical path. The photoelectric conversion unit further includes a cover fixedly disposed on the top surface of the light guide block body and sealing the cavity. The photoelectric conversion unit is used in an optical module. The optical signal interface is used to connect the optical fiber patch cord of the optical module, so that the optical fiber patch cord can communicate optically with the photoelectric conversion element through the light guide block. The photoelectric conversion unit further includes a potting compound disposed on the circuit board and covering the cover, the light guide block, and the portion of the optical fiber patch cord near the light guide block.

6. A method for manufacturing a photoelectric conversion unit, characterized by The steps include: Prepare a circuit board for the photoelectric conversion unit, wherein the circuit board has photoelectric conversion elements; The preparation of the light guide block of the photoelectric conversion unit, the light guide block comprising a light guide block body arranged on the circuit board, a light signal interface arranged on the light guide block body, and an element cavity arranged on the light guide block body, wherein the light guide block body is used to establish an optical path between the light signal interface and the element cavity; and The first adhesive and the second adhesive are applied on the bottom surface of the light guide block body of the light guide block, and then the light guide block is attached to the circuit board and the photoelectric conversion element is accommodated in the element cavity, wherein the first adhesive forms a first sealing adhesive of the photoelectric conversion unit after curing, the first sealing adhesive is formed between the light guide block and the circuit board and surrounds the photoelectric conversion element, the second adhesive forms a second sealing adhesive of the photoelectric conversion unit after curing, and the second sealing adhesive is formed between the light guide block and the circuit board and surrounds the first sealing adhesive; The light guide block further comprises an annular glue accommodating groove arranged on the light guide block body and surrounding the element cavity, and a glue injection hole arranged on the light guide block body and communicating with the annular glue accommodating groove; The steps of the manufacturing method further comprise: injecting a third adhesive into the annular glue accommodating groove through the glue injection hole until the annular glue accommodating groove and the glue injection hole are completely filled, wherein the third adhesive forms a third sealing adhesive of the photoelectric conversion unit after curing, the third sealing adhesive is used to bond the light guide block and the circuit board and is located between the first sealing adhesive and the second sealing adhesive, and the source of the third sealing adhesive is different from the sources of the first sealing adhesive and the second sealing adhesive.

7. The manufacturing method according to claim 6, wherein: The photoelectric conversion unit further comprises a cover fixedly arranged on the top surface of the light guide block body and sealing the cavity of the light guide block body; The photoelectric conversion unit is applied in an optical module, and the light signal interface is used to connect a fiber jumper of the optical module; The steps of the manufacturing method further comprise: inserting and fixing the fiber jumper into the light signal interface of the light guide block of the photoelectric conversion unit, so that the fiber jumper can perform optical communication with the photoelectric conversion element of the photoelectric conversion unit through the light guide block; and adding potting glue to the circuit board of the photoelectric conversion unit and covering the cover, the light guide block, and the part of the fiber jumper close to the light guide block, until the potting glue forms a potting glue material of the photoelectric conversion unit after curing.

8. A liquid-cooled light module, characterized by It comprises: a housing having an optical port; a photoelectric conversion unit as claimed in any one of claims 1 to 5, arranged in the housing; and a fiber jumper arranged in the housing and arranged such that one end of the fiber jumper is arranged in the optical port and the other end of the fiber jumper is inserted and fixed in the light signal interface of the light guide block of the photoelectric conversion unit, or one end of the fiber jumper extends out of the housing and the other end of the fiber jumper is inserted and fixed in the light signal interface of the light guide block of the photoelectric conversion unit. ​

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