Electronic paper production method

Abstract

The electronic paper production method comprises the following steps: A, baking an electronic ink film; the cut electronic ink film is subjected to A baking treatment, so that the water vapor content of the electronic ink film is uniform; in the A baking process, the humidity is within a set range, and the temperature is within a set range; step B, laminating; the electronic ink film is attached to the conductive layer and the FPC, and a semi-finished product A is formed; c, the laminated semi-finished product A is subjected to baking treatment B; b, in the baking process, the humidity is within a set range, and the temperature is within a set range; and step D, module UV glue sealing. According to the application, the problem of obvious color difference when the water vapor content of the color-changeable electronic paper is low or non-uniform is solved by optimizing the manufacturing process and controlling the water vapor content and uniformity in the electronic paper.

Description

Technical Field

[0001] The present application belongs to the field of display device manufacturing, and specifically relates to an electronic paper production method. Background Art

[0002] Color-changeable electronic paper is based on two-color electronic ink technology and contains two colors of charged particles: one white particle and one colored particle. The colored particles can be: black, yellow, green, red, brown, dark blue and light blue.

[0003] Take black and white electronic ink as an example. It is made up of millions of microcapsules, each of which contains negatively charged white particles and positively charged black particles suspended in a transparent liquid. Positive and negative electrodes are installed on the top and bottom of the electronic ink respectively.

[0004] The working principle of two-color electronic ink is to rely on the electrophoresis of black and white particles under the action of voltage to control the position distribution of the two particles in a tiny space, thereby forming different grayscales on the screen surface. Using the principle of positive and negative attraction, when the electric field is turned on, the corresponding black or white particles will move to the top of the microcapsule, and the user can see black or white on the block. The working principle of other color-changing electronic paper is the same as above.

[0005] like Figure 4 and Figure 5 As shown in the figure, in a conventional electronic paper preparation method, the electronic ink made of microcapsules is coated on a plastic film, namely, a PS film, to form an electronic ink film (FPL). During the production process of dual-color electronic paper, an ITO conductive film (ITO FILM) and a PS protective film are attached to the upper and lower electronic ink films; during the design and use process, it does not rely on a TFT substrate, and the upper and lower electrodes can control the drive, and the designer can cut out any desired shape.

[0006] In the production process of electronic paper display modules, electronic paper is very sensitive to high temperatures and is very easy to lose water under high temperature conditions. It uses segmented code driving or full-surface ITO driving to drive the movement of electronic ink. The driving capability is weaker than that of TFT thin-film transistors. Therefore, the display effect is greatly affected by water vapor. When the water vapor content is low or uneven, obvious color difference will appear.

[0007] Glossary:

[0008] FPL is the abbreviation of "Front Plane Lamination". The electronic ink made of microcapsules is coated on a layer of plastic film to become an electronic ink film (FPL).

[0009] CG bonding technology mainly includes two implementation methods: OCA bonding and LOCA bonding.

[0010] OCA bonding: Use optically clear adhesive (OCA) as adhesive, which has high light transmittance and good bonding strength, but the cost is higher.

[0011] LOCA bonding: Using liquid optical clear adhesive (LOCA), it has high light transmittance and good bonding performance, and the cost is relatively low, but it requires more process steps and time.

[0012] TFT is the abbreviation of "Thin Film Transistor" in English, which means thin film field effect transistor in Chinese. Each pixel on the TFT display is driven by the thin film transistor integrated behind it.

[0013] PET is the abbreviation of "Polyethylene terephthalate" in English, which means polyester resin film layer in Chinese.

[0014] IC is the abbreviation of “Integrated Circuit” in English, which means chip in Chinese.

[0015] FPC is the abbreviation of "Flexible Printed Circuit" in English, which means flexible circuit board in Chinese.

[0016] PS is the abbreviation of "Polystyrene" in English, which means polystyrene film in Chinese.

[0017] ITO is the abbreviation of "Indium Tin Oxide" in English, and its Chinese meaning is indium tin oxide. In this application, the electronic paper module ITO refers to the conductive film layer material of the transparent conductive film shielding glass mainly being ITO (indium tin oxide semiconductor) film. Summary of the invention

[0018] The present invention controls the water vapor content and uniformity in the electronic paper by optimizing the manufacturing process, thereby solving the problem of obvious color difference when the water vapor content of the color-changing electronic paper is low or uneven.

[0019] The technical solution of the present application to solve the above-mentioned technical problems is an electronic paper production method, including step A: baking the electronic ink film; performing A baking treatment on the cut electronic ink film to make the water vapor content of the electronic ink film uniform; during the A baking process, the humidity is within the set range, and the temperature is within the set range; step B: laminating; laminating the electronic ink film with the conductive layer and the waterproof layer to form an A semi-finished product; step C: performing B baking treatment on the A semi-finished product after lamination; during the B baking process, the humidity is within the set range, and the temperature is within the set range; step D: sealing the module with UV glue.

[0020] During the A baking process, the temperature is greater than 45 degrees Celsius and less than 60 degrees Celsius; the humidity is greater than 45% and less than 60%.

[0021] In the baking process A, the baking time is 72 hours, the temperature is 50 degrees Celsius, and the humidity is 53%.

[0022] During the B baking process, the temperature is greater than 45 degrees Celsius and less than 60 degrees Celsius; the humidity is greater than 45% and less than 60%.

[0023] In the B baking process, the baking time is 1 hour, the temperature is 50 degrees, and the humidity is 53%.

[0024] The step D further includes a step E: cleaning test.

[0025] The step A comprises: step A10: cutting the electronic ink film mother sheet to obtain the electronic ink film; and step A20: baking the electronic ink film.

[0026] The step B comprises: step B10: cutting the electronic ink film mother sheet to obtain the electronic ink film; step B20: laminating the conductive layer ITO and the waterproof layer to the electronic ink film to form a B semi-finished product; step B30: laminating the B semi-finished product to the FPC module to form a C semi-finished product; step B40: performing CG lamination on the C semi-finished product to form an A semi-finished product.

[0027] The step D comprises: step D10: applying UV glue to the edge of the semi-finished product A; step D20: after applying the UV glue, performing high-pressure defoaming to remove bubbles in the UV glue; and step D30: UV light curing.

[0028] In step D20, the high-pressure defoaming pressure is 0.5 MPa, the temperature is 25 degrees Celsius, and the time is 10 minutes.

[0029] One of the beneficial effects of the technical solution in the present application is that A baking treatment makes the water vapor content of the electronic ink film uniform. Baking at a set temperature and humidity before bonding can ensure that the moisture in the electronic ink film is not lost.

[0030] One of the beneficial effects of the technical solution in the present application is that the B baking process ensures that the moisture of the electronic ink film in the A semi-finished product is not lost.

[0031] One of the beneficial effects of the technical solution in the present application is that the combination of two baking steps provides timely remedy for the link in the production process where water loss may occur, and can keep the water in the electronic ink film from being lost as much as possible.

[0032] One of the beneficial effects of the technical solution in the present application is that A baking sets a temperature and humidity range suitable for maintaining moisture in the electronic ink film.

[0033] One of the beneficial effects of the technical solution in the present application is that the time set for baking A is long enough to ensure that the moisture in the electronic ink film can be maintained and replenished.

[0034] One of the beneficial effects of the technical solution in the present application is that the B baking sets the temperature and humidity range, which is suitable for maintaining moisture in the electronic ink film.

[0035] One of the beneficial effects of the technical solution in the present application is that the B baking time is set appropriately to ensure that the moisture in the electronic ink film can be maintained and replenished and the reliability of the bonding can be ensured.

[0036] One of the beneficial effects of the technical solution in the present application is that the cleaning test can ensure cleanliness and display normality.

[0037] One of the beneficial effects of the technical solution in the present application is that the electronic ink film is baked after cutting to ensure that moisture in the cut electronic ink film is not lost.

[0038] One of the beneficial effects of the technical solution in the present application is that UV glue is applied to the edge of the semi-finished product A to further ensure that moisture in the electronic ink film is not lost.

[0039] One of the beneficial effects of the technical solution in the present application is that after UV glue, high-pressure defoaming is performed to remove bubbles in the UV glue; ultraviolet light curing ensures that the cured seal is intact and keeps the moisture in the electronic ink film from being lost.

[0040] One of the beneficial effects of the technical solution in the present application is that the pressure conditions of high-pressure defoaming are suitable for defoaming while not having a negative impact on other structures, and can balance the reliability of the connection relationship between various components. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 is a schematic flow diagram of an electronic paper production method;

[0042] Figure 2 is a schematic flow diagram of an electronic paper production method;

[0043] Figure 3 is a schematic flow diagram of an electronic paper production method;

[0044] Figure 4 It is a schematic diagram of the process of producing electronic paper in the prior art;

[0045] Figure 5 It is a schematic diagram of the structure of electronic paper. DETAILED DESCRIPTION

[0046] The embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0047] It should be noted that the following is a description of the preferred embodiments of the present application, which does not constitute any limitation to the present application. The description of the preferred embodiments of the present application is only an explanation of the general principles of the present application. The embodiments described in this application are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0048] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", and technical features numbered with Arabic numerals 1, 2, 3, etc., and numbers such as "A" and "B", are only used for descriptive purposes and are only for the convenience of explanation, and do not represent a sequential relationship in time or space; they cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and numbered with Arabic numerals 1, 2, 3, etc. may explicitly or implicitly include one or more of the features. In the description of the present application, “several” means two or more than two, unless otherwise clearly and specifically defined.

[0049] like Figure 4 As shown, the electronic paper in the prior art usually adopts Figure 5 The electronic paper preparation method shown. Figure 5 In the method shown, the cutting and laminating processes are performed under different environmental and tool conditions, and the ambient temperature may vary or fluctuate.

[0050] In the production process of electronic paper display modules, electronic paper is very sensitive to high temperatures and is very easy to lose water under high temperature conditions. It uses segmented code driving or full-surface ITO driving to drive the movement of electronic ink. The driving capability is weaker than that of TFT thin-film transistors. Therefore, the display effect is greatly affected by water vapor. When the water vapor content is low or uneven, obvious color difference will appear.

[0051] How to solve the problem of water loss during the production process of electronic paper display modules and the color difference caused by water loss is a problem that the electronic paper production method needs to solve.

[0052] like Figure 1 In an embodiment of an electronic paper production method, the method includes step A: baking the electronic ink film; performing A baking treatment on the cut electronic ink film to make the water vapor content of the electronic ink film uniform; during the A baking process, the humidity is within a set range, and the temperature is within a set range; step B: laminating; laminating the electronic ink film with the conductive layer and the waterproof layer to form an A semi-finished product; step C: performing B baking treatment on the laminating A semi-finished product; during the B baking process, the humidity is within a set range, and the temperature is within a set range; step D: sealing the module with UV glue.

[0053] like Figure 3 In an embodiment of an electronic paper production method, during the A baking process, the temperature is greater than 45 degrees Celsius and less than 60 degrees Celsius; the humidity is greater than 45% and less than 60%.

[0054] like Figure 3 In an embodiment of an electronic paper production method, in the A baking process, the baking time is 72 hours, the temperature is equal to 50 degrees Celsius; and the humidity is equal to 53%.

[0055] like Figure 3 In an embodiment of an electronic paper production method, in the B baking process, the temperature is greater than 45 degrees Celsius and less than 60 degrees Celsius; the humidity is greater than 45% and less than 60%.

[0056] like Figure 3 In an embodiment of an electronic paper production method, in the B baking process, the baking time is 1 hour, the temperature is equal to 50 degrees; and the humidity is equal to 53%.

[0057] like Figure 2 In an embodiment of an electronic paper production method, the step D further includes a step E: cleaning test.

[0058] like Figure 3 In an embodiment of an electronic paper production method, the step A includes: step A10: cutting the electronic ink film mother sheet to obtain the electronic ink film; step A20: baking the electronic ink film.

[0059] like Figure 3 In an embodiment of an electronic paper production method, the step B includes: step B10: cutting the electronic ink film mother sheet to obtain the electronic ink film; step B20: laminating the conductive layer ITO with the electronic ink film to form a B semi-finished product; step B30: laminating the B semi-finished product with the FPC module to form a C semi-finished product. Step B40: performing CG lamination on the C semi-finished product to form an A semi-finished product.

[0060] like Figure 3In an embodiment of an electronic paper production method, the step D comprises: step D10: applying UV glue to the edge of the semi-finished product A; step D20: after applying the UV glue, performing high-pressure defoaming to remove bubbles in the UV glue; step D30: UV light curing.

[0061] like Figure 3 In an embodiment of an electronic paper production method, in the step D20, the vacuum defoaming pressure is 0.5 MPa, the temperature is 25 degrees Celsius, and the time is 10 minutes.

[0062] In the production process of electronic paper display modules, electronic paper is very sensitive to high temperatures and is very easy to lose water under high temperature conditions. Prism products use segmented code driving or full-surface ITO driving to drive the movement of electronic ink. The driving ability is weaker than that of TFT thin-film transistors. Therefore, the display effect is greatly affected by water vapor. When the water vapor content is low or uneven, obvious color difference will appear.

[0063] This process optimizes the process parameters and processes, controls the water vapor content and uniformity in the electronic paper, and thus optimizes the display effect of the prism product.

[0064] Original process flow and parameters: electronic paper cutting → electronic paper attachment (normal temperature) → back hot melt film attachment (normal temperature) → FPC bonding → CG bonding (normal temperature) → application of thermosetting adhesive → defoaming and curing (65℃ 0.5Mpa 80min) → product cleaning / testing.

[0065] Optimized process flow and parameters: electronic paper cutting → electronic paper baking (50℃53%RH 72H) → electronic paper attachment (normal temperature) → back hot melt film attachment (normal temperature) → FPC bonding → CG bonding (normal temperature) → baking (50℃53%RH1H) → UV glue application → defoaming (25℃0.5Mpa10min) → UV curing → product cleaning / testing. Optimized process description: electronic paper baking (50℃53%RH 72H): pre-treat the electronic paper before operation to make the water vapor content of the electronic paper uniform; baking (50℃53%RH1H): glue application to replenish the water vapor lost during the operation; UV glue application: the waterproof glue is changed from thermosetting glue to UV glue to solve the problem of water vapor loss in the electronic paper during the thermosetting process.

[0066] As shown in the accompanying drawings, the above are only embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the invention specification and the accompanying drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for producing electronic paper, characterized in that: include Step A: electronic ink film baking; the cut electronic ink film is subjected to A baking treatment to make the water vapor content of the electronic ink film uniform; during A baking process, the humidity is within the set range and the temperature is within the set range; Step B: Laminating: Laminating the electronic ink film with the conductive layer and the waterproof layer to form a semi-finished product A; Step C: Performing B baking treatment on the bonded semi-finished product A; during the B baking process, the humidity is within the set range and the temperature is within the set range; Step D: Module UV glue sealing.

2. The electronic paper production method according to claim 1, characterized in that: During the A baking process, the temperature is greater than 45 degrees Celsius and less than 60 degrees Celsius; the humidity is greater than 45% and less than 60%.

3. The electronic paper production method according to claim 2, characterized in that: In the baking process A, the baking time is 72 hours, the temperature is 50 degrees Celsius, and the humidity is 53%.

4. The electronic paper production method according to claim 1, characterized in that: During the B baking process, the temperature is greater than 45 degrees Celsius and less than 60 degrees Celsius; the humidity is greater than 45% and less than 60%.

5. The electronic paper production method according to claim 4, characterized in that: In the B baking process, the baking time is 1 hour, the temperature is 50 degrees, and the humidity is 53%.

6. The electronic paper production method according to claim 1, characterized in that: The step D further includes a step E: cleaning test.

7. The electronic paper production method according to claim 1, characterized in that: The step A comprises: Step A10: cutting the electronic ink film mother sheet to obtain the electronic ink film; Step A20: baking the electronic ink film.

8. The electronic paper production method according to claim 1, characterized in that: The step B comprises: Step B10: cutting the electronic ink film mother sheet to obtain the electronic ink film; Step B20: The conductive layer ITO is laminated to the electronic ink film to form a semi-finished product B; Step B30: The semi-finished product B is bonded to the FPC module to form the semi-finished product C; Step B40: Perform CG bonding on the C semi-finished product to form the A semi-finished product.

9. The electronic paper production method according to claim 1, characterized in that: The step D comprises: Step D10: Apply UV glue to the edge of semi-finished product A; Step D20: After applying the UV glue, perform high-pressure defoaming to remove bubbles in the UV glue; Step D30: UV light curing.

10. The electronic paper production method according to claim 9, characterized in that: In step D20, the high-pressure defoaming pressure is 0.5 MPa, the temperature is 25 degrees Celsius, and the time is 10 minutes.

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