Low-blue-light full-spectrum light source, preparation method thereof and LED device

Abstract

The invention provides a low-blue-light full-spectrum light source, a preparation method thereof and an LED device, the low-blue-light full-spectrum light source comprises a chip, a support bowl cup and an outer sealing adhesive, the chip is packaged in the support bowl cup, the outer sealing adhesive is coated on the chip, and the outer sealing adhesive is coated on the support bowl cup. The outer sealing compound comprises any three or a combination of more than three of blue-green powder, LuAG yellow-green powder, red powder and infrared powder, the wavelength of the blue-green powder is 400-480 nm, the wavelength of the LuAG yellow-green powder is 520-545 nm, the wavelength of the red powder is 630-680 nm, and the wavelength of the infrared powder is 680-780 nm, so that the infrared spectrum power of 680-780 nm is improved, meanwhile, the color rendering index CRI is greater than or equal to 98, the R1-R15 is greater than or equal to 90, the degree of fitting GFC with a solar spectrum is greater than or equal to 0.95, and the color rendering index CRI is greater than or equal to 0.95. And the solar spectrum full-spectrum light source with high fitting degree is obtained.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor technology, and specifically relates to a low blue light full spectrum light source, a preparation method thereof and an LED device. Background Art

[0002] Following the law of technological iteration and development in the LED lighting industry, people not only have higher demands on the basic color rendering performance and efficiency of light sources, but also on the high quality of the spectrum. The full spectrum of the sun shows excellent performance similar to natural sunlight. The full spectrum of the sun refers to the spectrum curve that contains ultraviolet light, visible light, and infrared light. The red, green, and blue ratios of the visible light part are similar to those of sunlight, and the color rendering index is close to 100. This light source not only improves the comfort and realism of lighting, but also helps regulate the body's biological clock and emotional state. In addition, recent studies have shown that infrared light has the effect of regulating the nervous system, enhancing immunity, and relieving fatigue, which has a positive reference significance for further improving LED healthy lighting.

[0003] At present, the solar full-spectrum technology is mainly developed and iterated in three aspects: spectrum continuity, blue light energy, and color rendering index. On the one hand, in order to improve the continuity of the spectrum and improve the blue light energy, a multi-chip combination solution is often used to package the product. Patent CN117790645A discloses a method for manufacturing a three-blue full-spectrum LED light source, which selects three blue light LED chips with different wavelengths for packaging. The band chips are 430-440nm, 450-460nm, and 470-480nm, forming a three-blue full-spectrum LED light source. However, there is a large depression in the blue light band spectrum curve, the spectrum continuity is poor, and the fit with the solar spectrum is low. Patent CN220456421U discloses a four-blue full-spectrum white LED light source, which uses a combination of multiple light-emitting chips with a combined wavelength of 437.5-442.5nm, 447.5-452.5nm, 457.5-462.6nm, and 467.5-472.5nm, achieving a stable blue light band spectrum curve, but the relative power of the blue light spectrum is still close to 60%. Patent CN220253265U discloses a full-spectrum package, which uses a combination of low-wave blue light chips, medium-wave blue light chips, high-wave blue light chips, and purple light chips to excite phosphors and improve spectral continuity, but the purple light chip has a high cost and limited technical maturity, making it difficult to further develop and apply. On the other hand, in order to improve the continuity of the spectrum and the color rendering index, the phosphor combination and the external sealant are improved and optimized. Patent CN117384632A discloses a full-spectrum LED fluorescent composition and its preparation method, which uses a combination of high thermal conductivity modified silica gel, modified fluorescent powder, polyvinyl alcohol, tetrahydrofuran and deionized water to spontaneously dissipate heat and improve the stability of the spectrum, but does not elaborate on the specific continuity of the spectrum. Patent CN116083082B discloses an ultra-high color rendering fluorescent powder and a full-spectrum LED, which uses a combination of blue-green fluorescent powder, green fluorescent powder, yellow fluorescent powder, red fluorescent powder, and red fluorescent powder to achieve a high color rendering index of Ra>99 and R1~R15>95, but the spectrum of the 680~780nm band has not been improved, showing a low relative power.

[0004] Disadvantages of existing solutions:

[0005] 1. The blue light band of 380-450nm has high energy and poses a greater risk of blue light damage;

[0006] 2. The infrared band 680-780nm has low energy and a low fit with the solar spectrum;

[0007] 3. The spectral curve of the blue light band 380~450nm has large fluctuations and the spectral continuity is poor. Summary of the invention

[0008] In order to solve the above technical problems, the present invention provides a low blue light full spectrum light source, a preparation method thereof and an LED device, which are used to solve the technical problems of the background technology.

[0009] In the first aspect, the invention provides the following technical solutions: a low blue light full-spectrum light source, comprising a chip, a bracket bowl and an outer sealing glue, wherein the chip is encapsulated in the bracket bowl, and the outer sealing glue is applied on the chip, and the outer sealing glue comprises any three or more of blue-green powder, LuAG yellow-green powder, red powder and infrared powder, wherein the wavelength of the blue-green powder is 400nm~480nm, the wavelength of the LuAG yellow-green powder is 520nm~545nm, the wavelength of the red powder is 630~680nm, and the wavelength of the infrared powder is 680nm~780nm.

[0010] Compared with the prior art, the beneficial effects of the present invention are as follows: by setting the wavelength of the blue-green powder to be 400nm-480nm, the wavelength of the LuAG yellow-green powder to be 520nm-545nm, the wavelength of the red powder to be 630nm-680nm, and the wavelength of the infrared powder to be 680nm-780nm, the infrared spectrum power of 680nm-780nm is improved, and at the same time, the color rendering index CRI≥98, R1-R15≥90, and the degree of fit with the solar spectrum GFC≥0.95, a full-spectrum light source of the solar spectrum with high fit is obtained.

[0011] Furthermore, the outer sealing glue is made of the following raw materials in percentage by weight: red powder 5%-18%, LuAG yellow-green powder 25%-55%, blue-green powder 10%-20%, and infrared powder 15%-45%.

[0012] Furthermore, the low blue light full spectrum light source also includes glue, and the weight ratio of the glue to the external sealing glue is (0.2-3):1.

[0013] Furthermore, the wavelength range of the chip is 400nm to 480nm.

[0014] Furthermore, there are multiple chips, and the wavelength ranges of the multiple chips are 435nm~440nm, 440nm~445nm, 445nm~450nm, 452.5nm~457.5nm, and 460nm~475nm, respectively.

[0015] In a second aspect, the present application provides a method for manufacturing a low blue light full spectrum light source, comprising the following steps:

[0016] Step 1: Select multiple chips and solder the chips to a bracket cup with high thermal conductivity through alloy wires;

[0017] Step 2, selecting at least four kinds of phosphors, combining the at least four kinds of phosphors based on a preset first ratio to form a combined phosphor, and uniformly mixing the glue and the combined phosphor according to a preset second ratio to form an outer sealant, wherein the at least four kinds of phosphors respectively include 480nm-500nm blue-green powder, 520nm-545nm LuAG yellow-green powder, 630nm-680nm red powder and 680nm-780nm infrared powder;

[0018] Step three, evenly apply the outer sealing glue on the top of the chip, put the bracket bowl cup coated with the outer sealing glue into an oven for baking to obtain a solar full-spectrum light source.

[0019] Furthermore, the baking temperature range of the oven is 150° C. to 200° C., and the baking time of the oven is 0.5 h to 2 h.

[0020] In a third aspect, the present invention further provides an LED device, which is prepared according to the above-mentioned low blue light full-spectrum light source. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a flow chart of a method for preparing a low blue light full-spectrum light source in the second embodiment of the present invention.

[0022] Figure 2 A 5000K relative spectrum diagram is formed in the second embodiment of the present invention.

[0023] Figure 3 A 4000K relative spectrum diagram is formed in the third embodiment of the present invention.

[0024] Figure 4 A 3000K relative spectrum diagram is formed in the fourth embodiment of the present invention.

[0025] Figure 5 The 4000K full spectrum light source is obtained by the existing conventional method. DETAILED DESCRIPTION

[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0029] Embodiment 1

[0030] The low blue light full-spectrum light source in the first embodiment of the present invention comprises a chip, a bracket cup and an outer sealing glue, wherein the chip is encapsulated in the bracket cup, the outer sealing glue is applied on the chip, and the outer sealing glue comprises any three or more combinations of blue-green powder, LuAG yellow-green powder, red powder and infrared powder, wherein the wavelength of the blue-green powder is 400nm~480nm, the wavelength of the LuAG yellow-green powder is 520nm~545nm, the wavelength of the red powder is 630~680nm, and the wavelength of the infrared powder is 680nm~780nm.

[0031] By setting the wavelength of the blue-green powder to be 400nm-480nm, the wavelength of the LuAG yellow-green powder to be 520nm-545nm, the wavelength of the red powder to be 630nm-680nm, and the wavelength of the infrared powder to be 680nm-780nm, the infrared spectrum power of 680nm-780nm is improved, and the color rendering index CRI≥98, R1-R15≥90, and the solar spectrum fitting degree GFC≥0.95, a full-spectrum light source with a high fitting degree of the solar spectrum is obtained.

[0032] Optionally, the outer sealing glue is made of the following raw materials in percentage by weight: red powder 6%-9%, LuAG yellow-green powder 19%-23%, blue-green powder 35%-39%, and infrared powder 32%-36%.

[0033] Optionally, the outer sealant is made of the following raw materials in percentage by weight: red powder 5%-18%, LuAG yellow-green powder 25%-55%, blue-green powder 10%-20%, infrared powder 15%-45%.

[0034] Optionally, the low blue light full spectrum light source further comprises glue, and the weight ratio of the glue to the external sealing glue is (0.2-3):1.

[0035] By setting the weight ratio between the blue-green powder, the LuAG yellow-green powder, the red powder and the infrared powder, and the weight ratio between the glue and the sum of the blue-green powder, the LuAG yellow-green powder, the red powder and the infrared powder, a light source with low blue light energy in the 400-500nm band is obtained.

[0036] Optionally, the chip has a wavelength range of 400nm to 480nm.

[0037] Specifically, there are multiple chips, and the wavelength ranges of the multiple chips are 435nm-440nm, 440nm-445nm, 445nm-450nm, 452.5nm-457.5nm, and 460nm-475nm, respectively.

[0038] Embodiment 2

[0039] See also Figure 1 , shown is a method for manufacturing a low blue light full spectrum light source in a second embodiment of the present invention, the method comprising the following steps: step 1 to step 3;

[0040] Step 1: Select multiple chips and solder the chips to a bracket cup with high thermal conductivity through alloy wires;

[0041] Specifically, the chip is a blue light chip.

[0042] In this embodiment, chips with wavelengths of 440nm to 445nm, 455nm to 460nm, and 465nm to 470nm are used, and the chips are fixedly soldered to a bracket bowl with high thermal conductivity by alloy wires.

[0043] Step 2: Select at least four phosphors, combine the at least four phosphors based on a preset first ratio to form a combined phosphor, and evenly mix the glue and the combined phosphor according to a preset second ratio to form a first outer sealing glue, wherein the at least four phosphors include 480nm~500nm blue-green powder, 520nm~545nmLuAG yellow-green powder, 630~680nm red powder and 680nm~780nm infrared powder.

[0044] In this embodiment, the first ratio is 7:19:34:31, and the second ratio is 2.4:1.

[0045] The specific implementation process of the first ratio and the second ratio is as follows:

[0046] First, select red powder R in the 650nm-670nm band, LuAG yellow-green powder G in the 530nm-540nm band, blue-green powder Q in the 490nm-500nm band, and infrared powder Y in the 680nm-710nm band, and combine the phosphors according to the first phosphor test ratio of R:G:Q:Y=9:20:35:30 to form a first phosphor test group, then mix glue with the first phosphor test group according to the first glue test ratio of 2.2:1 to form a first test glue, evenly apply the first test glue on the chip, put the bracket bowl coated with the first test glue into an oven for baking to obtain a lamp bead sample;

[0047] Then, a high-precision rapid spectroradiometer is used to test the dried material to obtain the optoelectronic parameter information and spectral information of the lamp beads. The spectrum is compared with the solar spectrum for fitting calculation. According to the missing bands of the spectrum, especially the blue light spectrum in the 380nm-490nm band, the first phosphor test ratio of the first phosphor test group and the first glue test ratio of the glue to the first phosphor test group are adjusted to obtain a new first test glue. Specifically, if the relative power of the spectrum in the 480nm-520nm band is low, the proportion of blue-green powder Q in the 490nm-500nm band is increased; if the relative power of the spectrum in the 520nm-580nm band is low, the proportion of LuAG yellow-green powder G in the 530nm-540nm band is increased; if the relative power of the spectrum in the 580nm-680nm band is low, the proportion of red powder R in the 650nm-670nm band is increased; if the relative power of the spectrum in the 680nm-780nm band is low, the proportion of infrared powder Y in the 680nm-710nm band is increased. At the same time, the blue light 380nm-480nm band is adjusted by adjusting the ratio of glue to the first phosphor test group.

[0048] The above experiment was repeated to adjust the first phosphor test ratio and the first glue test ratio to obtain the first outer sealing glue, so that the first ratio of the final phosphor combination was R:G:Q:Y=7:19:34:31, and the second ratio of glue to combined phosphor was 2.4:1, thereby obtaining a low blue light, high-fitting solar full-spectrum light source.

[0049] The above adjustments finally yield the following Figure 2 Relative spectrum and Table 1 Specific photoelectric parameters: Figure 2As shown in Table 1, the 5000K light source spectrum obtained in this embodiment has no obvious bumps and concavities in the overall spectrum, and has good continuity. Among them, the relative power of blue light in the 400-500nm band is not obviously convex compared with the other bands, that is, the light source shows the advantage of low blue light. In addition, the 680-780nm spectrum has been completed, which improves the spectral fitting degree; as shown in Table 1, the light source and the solar spectrum fitting coefficient GFC (the closer the coefficient is to 1, the better the fitting degree) is 0.97, and the light source Ra>98.R1~R15>95. In short, the spectrum and parameters show that the method of the present invention can obtain a full-spectrum light source with low blue light, high color rendering index and high fitting degree.

[0050] Step three, evenly apply the first external sealing glue on the chip, put the bracket bowl cup coated with the external sealing glue into an oven for baking, so as to obtain a solar full-spectrum light source.

[0051] Embodiment 3

[0052] The low blue light full spectrum light source in the third embodiment of the present invention, the method comprises the following steps: Step 3.1 to Step 3.5:

[0053] Step 3.1, using chips in the wavelength range of 435nm-440nm, 452nm-457nm, and 465nm-470nm, and soldering the chips to a support bowl with high thermal conductivity through alloy wires.

[0054] Step 3.2, select red powder R1 in the 650nm-680nm band, LuAG yellow-green powder G1 in the 530nm-550nm band, LuAG yellow-green powder G2 in the 510nm-525nm band, and infrared powder Y1 in the 710nm-730nm band, and combine the phosphors according to the first phosphor test ratio of R1:G1:G2:Y1=9:10:11:25 to form a second phosphor test group, mix the glue with the second phosphor test group according to the second glue test ratio of 1.5:1 to form a second test glue.

[0055] Step 3.3, apply the second test glue to fill the entire cup just above the chip, ensure that the glue flows levelly and does not overflow the bracket cup, then place the glued cup in an oven at 170°C and bake for 1 hour;

[0056] Step 3.4, measuring the spectrum information of the lamp bead sample by a high-precision fast spectral radiometer, performing a comparison fitting calculation based on the spectrum information and the solar spectrum, and adjusting the second phosphor test ratio and the second glue test ratio based on the calculation result to obtain a second outer sealing glue;

[0057] In this embodiment, the dried material is tested by a high-precision fast spectroradiometer to obtain the optoelectronic parameter information and spectrum information of the lamp beads, and the spectrum is compared with the solar spectrum for fitting calculation, and the phosphor ratio is adjusted according to the calculation results. If the relative power of the spectrum in the 480nm-520nm band is low, the G2 ratio is increased; if the relative power of the spectrum in the 520nm-580nm band is low, the G1 ratio is increased; if the relative power of the spectrum in the 580nm-680nm band is low, the R1 ratio is increased; if the relative power of the spectrum in the 680nm-780nm band is low, the Y1 ratio is increased. At the same time, by adjusting the ratio of glue to phosphor, the blue light 380nm-480nm band is adjusted. Until a solar full-spectrum light source with low blue light and high fitting degree is obtained.

[0058] Step 3.5, repeat the above experiment to adjust the second phosphor test ratio and the second glue test ratio to obtain the second outer sealing glue, so that the final phosphor combination first ratio is R1:G1:G2:Y1=10:11:11:26, and the second ratio of glue to combined phosphor is 1.4:1, so as to obtain a low blue light, high fitting solar full spectrum light source.

[0059] The above adjustments finally yield the following Figure 3 Relative spectra and specific photoelectric parameters in Table 1, such as Figure 3 As shown, the 4000K light source spectrum obtained in this embodiment has no obvious bumps on the whole spectrum and good continuity. Among them, the relative power of blue light in the 400-500nm band has no obvious bumps compared with the other bands, that is, the light source shows the advantage of low blue light. In addition, the 680-780nm spectrum has been completed, which improves the spectral fitting degree. As shown in Table 1, the fitting coefficient GFC of the light source and the solar spectrum (the closer the coefficient is to 1, the better the fitting degree) is 0.98, and the light source Ra>98.R1~R15>95. Figure 5 The 4000K full-spectrum light source obtained by conventional methods has a significant bulge in blue light at the 400-500nm band, and the relative power of the 400-780nm band is weak. The GFC of the fitting degree with the solar spectrum is only 0.8, which is much lower than the light source obtained by the method of the present invention. In contrast, the light source of this embodiment shows the advantages of low blue light, high color rendering index, and high fitting degree.

[0060] Embodiment 4

[0061] The low blue light full spectrum light source in the fourth embodiment of the present invention, the method comprises the following steps: Step 4.1 to Step 4.5:

[0062] Step 4.1, using chips in the wavelength range of 440nm-445nm, 455nm-460nm, and 465nm-475nm, the chips are fixedly soldered to a support bowl with high thermal conductivity by alloy wire.

[0063] Step 4.2, select red powder R2 in the 660nm~680nm band, LuAG yellow-green powder G3 in the 535nm~570nm band, blue-green powder Q of nitrogen oxide in the 490nm~500nm band, infrared powder Y in the 680nm~710nm band, and infrared powder Y2 in the 710nm~760nm band, and combine each phosphor according to the third phosphor test ratio of R2:G3:Q:Y:Y2=1:5:1:1:2 to form a third phosphor test group, mix the glue and the third phosphor test group according to the second glue test ratio of 1.4:1 to form a third test glue.

[0064] Step 4.3, apply the third test glue to fill the entire cup just above the chip, ensure that the glue flows levelly and does not overflow the bracket cup, then place the glued cup in an oven at 170°C and bake for 1 hour;

[0065] Step 4.4, measuring the spectrum information of the lamp bead sample by a high-precision fast spectral radiometer, performing a comparison fitting calculation based on the spectrum information and the solar spectrum, and adjusting the third phosphor test ratio and the third glue test ratio based on the calculation result to obtain a third external sealing glue;

[0066] In this embodiment, the dried material is tested by a high-precision fast spectroradiometer to obtain the optoelectronic parameter information and spectrum information of the lamp beads, and the spectrum is compared with the solar spectrum for fitting calculation, and the phosphor ratio is adjusted according to the calculation results. If the relative power of the spectrum in the 480nm-520nm band is low in the spectrum, the Q ratio is increased; if the relative power of the spectrum in the 520nm-580nm band is low in the spectrum, the G3 ratio is increased; if the relative power of the spectrum in the 580nm-680nm band is low in the spectrum, the R2 ratio is increased; if the relative power of the spectrum in the 680nm-780nm band is low in the spectrum, the ratio of Y and Y2 is increased. At the same time, the blue light 380nm-480nm band is adjusted by adjusting the ratio of glue to phosphor. Until a solar full-spectrum light source with low blue light and high fitting degree is obtained.

[0067] Step 4.5, repeat the above experiment to adjust the third phosphor test ratio and the third glue test ratio to obtain the third outer sealing glue, so as to obtain the first ratio of the final phosphor combination of R2:G3:Q:Y:Y2=2:5:1:3:2, and the second ratio of glue to the combined phosphor is 1.5:1, so as to obtain a low blue light, high fitting solar full spectrum light source.

[0068] The above adjustments finally yield the following Figure 4 Relative spectra and specific photoelectric parameters in Table 1, such as Figure 4 As shown, the 3000K light source spectrum obtained in this embodiment has no obvious bumps on the whole spectrum and good continuity. Among them, the relative power of blue light in the 400-500nm band has no obvious protrusion compared with the other bands, that is, the light source exhibits the advantage of low blue light. In addition, the 680-780nm spectrum has been completed, which improves the spectral fitting degree. As shown in Table 1, the fitting coefficient GFC of the light source and the solar-like spectrum (the closer the coefficient is to 1, the better the fitting degree) is 0.97, and the light source Ra>98. R1~R15>95. In short, the spectral data can show the advantages of low blue light, high color rendering index and high fitting degree of the light source in the embodiment.

[0069] Table 1 Implementation case parameter information

[0070]

[0071] Embodiment 5

[0072] A fourth embodiment of the present invention provides an LED device, which is prepared according to the above-mentioned low blue light full-spectrum light source.

[0073] In summary, the low blue light full spectrum light source, its preparation method and LED device in the above embodiments of the present invention are:

[0074] 1. Select blue light chips of different wavelengths from 400nm to 480nm and the corresponding luminous power combination to obtain low blue light with good continuity from 380nm to 450nm.

[0075] 2. Through the combination of phosphors, especially regulating the ratio of LuAG yellow-green powder and blue-green powder of nitrogen oxide in the aluminate system, and adjusting the mass ratio of glue and phosphor, a light source with low blue light energy in the 400-500nm band is finally obtained.

[0076] 3. A combination of 680nm~780nm infrared phosphors is selected to improve the infrared spectrum power of 680nm~780nm. At the same time, the color rendering index CRI≥98, R1~R15≥90, and the solar spectrum fitting degree GFC≥0.95, obtaining a full-spectrum light source with a high degree of fitting of the solar spectrum.

[0077] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0078] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A low blue light full spectrum light source, characterized in that: It includes a chip, a bracket cup and an external sealing glue, wherein the chip is encapsulated in the bracket cup, the external sealing glue is coated on the chip, and the external sealing glue includes any three or more combinations of blue-green powder, LuAG yellow-green powder, red powder and infrared powder, wherein the wavelength of the blue-green powder is 400nm~480nm, the wavelength of the LuAG yellow-green powder is 520nm~545nm, the wavelength of the red powder is 630~680nm, and the wavelength of the infrared powder is 680nm~780nm.

2. The low blue light full spectrum light source according to claim 1, characterized in that: The outer sealing glue is made of the following raw materials in percentage by weight: 5%-18% red powder, 25%-55% LuAG yellow-green powder, 10%-20% blue-green powder, and 15%-45% infrared powder.

3. The low blue light full spectrum light source according to claim 2, characterized in that: When the outer sealing compound contains only three types of fluorescent powders, the proportion of the corresponding unused types of powders is zero.

4. The low blue light full spectrum light source according to claim 1, characterized in that: The low blue light full spectrum light source also includes glue, and the weight ratio of the glue to the external sealing glue is (0.2-3):

1.

5. The low blue light full spectrum light source according to claim 1, characterized in that: The waveband range of the chip is 400nm-480nm.

6. The low blue light full spectrum light source according to claim 5, characterized in that: There are multiple chips, and the wavelength ranges of the multiple chips are 435nm-440nm, 440nm-445nm, 445nm-450nm, 452.5nm-457.5nm, and 460nm-475nm respectively.

7. A method for manufacturing a low blue light full spectrum light source as claimed in any one of claims 1 to 6, characterized in that: The steps include: Step 1: Select multiple chips and solder the chips to a bracket cup with high thermal conductivity through alloy wires; Step 2, selecting at least four kinds of phosphors, combining the at least four kinds of phosphors based on a preset first ratio to form a combined phosphor, and uniformly mixing the glue and the combined phosphor according to a preset second ratio to form an outer sealant, wherein the at least four kinds of phosphors respectively include 480nm-500nm blue-green powder, 520nm-545nm LuAG yellow-green powder, 630nm-680nm red powder and 680nm-780nm infrared powder; Step three, evenly apply the outer sealing glue on the chip, put the bracket bowl cup coated with the outer sealing glue into an oven for baking to obtain a solar full-spectrum light source.

8. The method for manufacturing a low blue light full spectrum light source according to claim 8, characterized in that: The baking temperature range of the oven is 150° C. to 200° C., and the baking time of the oven is 0.5 h to 2 h.

9. An LED device, characterized in that: The LED device is prepared according to the low blue light full spectrum light source according to any one of claims 1-6.

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