Etching and tin stripping device and method for multi-layer high-precision circuit board

Abstract

The invention relates to the field of circuit board production, in particular to an etching and tin stripping device and method for a multi-layer high-precision circuit board, the device comprises a vertical frame, the vertical frame is provided with an unfolding assembly, and the unfolding assembly is used for unfolding a plurality of multi-layer circuit boards; the unfolding assembly comprises an outer frame, a fixing frame connected to the outer frame in a sliding mode, a U-shaped frame fixedly connected to the bottom of the fixing frame and a second driving motor arranged on the back face of the U-shaped frame. The output end of the second driving motor is fixedly sleeved with a storage wheel, and two pull ropes are fixedly wound in a wheel groove of the storage wheel. An elastic plate is arranged on the front face of the U-shaped frame, and the end, away from the storage wheel, of the pull rope is fixedly connected to the end of the elastic plate. A plurality of mounting blocks are arranged on the front face of the elastic plate at equal intervals. The multi-layer circuit board can be driven to be unfolded mutually, the multi-layer circuit boards are made to vibrate in the tin stripping liquid, and the tin stripping efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, and in particular to an etching and tin stripping device and method for multi-layer high-precision circuit boards. Background Art

[0002] In the manufacturing process of multi-layer high-precision circuit boards, etching and detinning are two crucial steps. Etching is to remove unnecessary parts on the circuit board by chemical or physical methods to form a conductive pattern; while detinning is to remove the tin layer on the circuit board to facilitate subsequent processing and connection. The processing effect and efficiency of these two steps directly affect the quality and performance of the circuit board.

[0003] Announcement No. CN108282962B discloses an etching detinning machine for processing an integrated circuit board, a liquid storage tank is provided, a detinning liquid is provided in the liquid storage tank, the immersion inlet and the spray inlet of the liquid storage tank and the top cover are respectively connected through pipelines, and a immersion valve and a spray valve are provided correspondingly, and a water pump is provided on the pipeline. The present invention can realize immersion and spray detinning at the same time, and vibration can be generated at the same time, and the detinning effect is good. However, when detinning a multi-layer high-precision circuit board, the multi-layer circuit board has many layers and a complex structure, and the spacing between multiple multi-layer circuit boards is small. The detinning liquid is easy to encounter obstacles during the penetration process, and the detinning liquid is difficult to evenly penetrate into each area of ​​the multi-layer circuit board, resulting in incomplete detinning in some areas, affecting the quality and performance of the multi-layer high-precision circuit board. Summary of the invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defects in the prior art, thereby providing an etching and tin stripping device and method for a multi-layer high-precision circuit board.

[0005] In order to solve the above technical problems, the present invention provides an etching and tin stripping device for a multi-layer high-precision circuit board, comprising: A stand, wherein an unfolding assembly is provided on the stand, and the unfolding assembly is used to unfold a plurality of multi-layer circuit boards; The unfolding assembly includes an outer frame, a fixing frame slidably connected to the outer frame, a U-shaped frame fixedly connected to the bottom of the fixing frame, and a second driving motor arranged on the back of the U-shaped frame; The output end fixing sleeve of the second driving motor is provided with a receiving wheel, and two pull ropes are fixedly wound in the wheel groove of the receiving wheel; An elastic plate is provided on the front of the U-shaped frame, and one end of the pull rope away from the storage wheel is fixedly connected to the end of the elastic plate; A plurality of mounting blocks are equidistantly arranged on the front of the elastic plate, an adjusting rod with adjustable height is connected inside the mounting block, and a clamping piece for clamping a multi-layer circuit board is arranged at the bottom of the adjusting rod.

[0006] Further, push rods are provided on both sides of the bottom of the fixing frame, and a buffer spring is sleeved on the outer surface of the push rod, one end of the buffer spring abuts against the fixing frame, and the other end of the buffer spring abuts against the inner wall of the outer frame; One end of the push rod extends to the outside of the outer frame and is fixedly connected to a positioning rod; The stand is provided with a disturbance component for pushing the positioning rod.

[0007] Furthermore, both sides of the bottom of the fixing frame are provided with limiting frames, and the limiting frames are provided with limiting grooves, and the pull rope passes through the limiting grooves.

[0008] Further, the disturbance assembly includes a fixing plate fixedly connected to the stand, and a third driving motor and a support fixedly connected to the top of the fixing plate; A rotating shaft is rotatably connected to the middle of the support, one end of the rotating shaft is drivingly connected to the output end of the third driving motor, and a cam is fixedly sleeved on the outer surface of the rotating shaft.

[0009] Furthermore, an arc portion is provided on the outer side of the positioning rod, and the arc portion is slidably connected to the outer edge of the cam.

[0010] Furthermore, a lifting assembly is provided on the vertical frame, a transverse movement assembly is provided at the output end of the lifting assembly, a support assembly is provided at the output end of the transverse movement assembly, and the outer frame is fixedly connected to the support assembly.

[0011] Further, the transverse movement assembly includes a fixed frame, and a first driving motor fixedly connected to one side of the fixed frame; A lead screw is fixedly connected to the output end of the first driving motor, a moving block is threadedly sleeved on the outer surface of the lead screw, and the moving block is slidably connected to the fixed frame.

[0012] Further, the support assembly includes a first support seat and a second support seat, the first support seat is fixedly connected to the front of the moving block, the second support seat is fixedly connected to the top of the outer frame, and the second support seat is rotatably connected to the first support seat through a rotating shaft; A first pull rod is disposed inside the first support seat, a second pull rod is disposed inside the second support seat, and a plurality of tension springs are hung between the first pull rod and the second pull rod.

[0013] Furthermore, it also includes a tin stripping box, and the unfolding component is located above the tin stripping box.

[0014] A method for etching and detinning a multi-layer high-precision circuit board, comprising the following steps: S1: clamp multiple multi-layer circuit boards in the clamping parts in sequence, move the stand to one side of the desoldering box, and make the unfolded components located above the desoldering box; S2: Adjust the position of the unfolded components by lifting and lateral movement of the components, so that multiple multi-layer circuit boards are completely placed in the desoldering liquid of the desoldering box; S3: Start the second driving motor, pull the elastic plate to bend into a ring structure through the storage wheel and the pull rope, and drive the multiple multi-layer circuit boards to unfold each other; S4: Start the third driving motor to push the positioning rod through the rotating shaft and the cam, so that the multiple multi-layer circuit boards vibrate in the desoldering liquid.

[0015] By means of the above technical solution, the present invention provides an etching and tin stripping device and method for a multi-layer high-precision circuit board, which has at least the following beneficial effects: 1. The present invention can drive multiple multi-layer circuit boards to unfold each other, and make multiple multi-layer circuit boards vibrate in the tin stripping liquid, thereby improving the efficiency of the tin stripping process.

[0016] 2. In the present invention, the second drive motor is started, and the operation of the second drive motor drives the storage wheel to rotate, so that the pull rope is wound in the wheel groove of the storage wheel. The tension of the pull rope pulls the elastic plate to bend into a ring structure, driving multiple multi-layer circuit boards to unfold each other. The multi-layer circuit boards can maintain a certain unfolding state during the detinning process, which is conducive to the uniform penetration of the detinning liquid, avoiding the problem of uneven detinning caused by a large number of layers, complex structure, and close layout of multiple multi-layer circuit boards, thereby improving the efficiency of the detinning process.

[0017] 3. In the present invention, the disturbance component pushes the positioning rod, causing the fixing frame and the multi-layer circuit board thereon to vibrate slightly. The vibration force is conducive to the tin stripping liquid to better penetrate into the corners and tiny gaps of the multi-layer circuit board, thereby accelerating the dissolution and shedding of the tin layer and improving the tin stripping efficiency. Due to the large number of layers and complex structure of multi-layer circuit boards, the tin stripping liquid is prone to encounter obstacles during the penetration process. Vibration assistance can break these obstacles, making the tin stripping liquid more evenly distributed on the surface of the circuit board, avoiding the problem of incomplete or excessive tin stripping, and improving the quality and performance of multi-layer circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a schematic diagram of the local structure of the present invention; Figure 3 It is a schematic diagram of the structure of the transverse shift assembly of the present invention; Figure 4 This is a schematic diagram of the support assembly structure of the present invention; Figure 5 This is a front view of the unfolded component structure of the present invention; Figure 6 This is a rear view of the unfolded component structure of the present invention; Figure 7 It is a schematic diagram of the local structure of the components of the present invention; Figure 8 For the present invention Figure 2 Schematic diagram of the local enlarged structure at A.

[0020] In the figure: 100, stand; 200, lifting assembly; 300, lateral movement assembly; 301, fixed frame; 302, first drive motor; 303, screw rod; 304, moving block; 305, slide rail; 400, support assembly; 401, first support seat; 402, second support seat; 403, first pull rod; 404, second pull rod; 405, tension spring; 500, unfolding assembly; 501, outer frame; 502, fixed frame; 503, U-shaped frame; 504, second drive motor; 505, storage wheel; 506, pull rope; 507, elastic plate; 508, mounting block; 509, adjustment rod; 510, clamping member; 511, push rod; 512, buffer spring; 513, positioning rod; 514, limit frame; 600, disturbance component; 601, fixing plate; 602, third drive motor; 603, support; 604, rotating shaft; 605, cam; 700, desoldering box. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] When desoldering multi-layer high-precision circuit boards, due to the characteristics of multi-layer high-precision circuit boards with many layers and complex structures, when the spacing between multiple multi-layer circuit boards is small, the desoldering liquid will encounter obstacles during the penetration process. This obstacle comes from the complex stacking structure, material interface and tight layout inside the circuit board.

[0023] As in the prior art, when multiple multi-layer circuit boards are closely arranged, the tiny spacing between them limits the flow space of the tin stripping liquid. In this case, the tin stripping liquid will be "stuck" during the penetration process and cannot be evenly distributed to all areas of the circuit board. This will not only result in incomplete tin stripping in some areas, leaving a difficult-to-remove tin layer, but also cause excessive tin stripping due to excessive concentration of the tin stripping liquid in certain areas, thereby damaging other materials or components on the circuit board.

[0024] Incomplete or excessive tin stripping will have a serious impact on the quality and performance of multi-layer high-precision circuit boards. Incomplete tin stripping will cause problems such as poor electrical connection and poor signal transmission during subsequent processing and use of the circuit board; while excessive tin stripping will damage other structures on the circuit board, such as the insulation layer, conductive lines, etc., thereby reducing the overall performance and reliability of the circuit board.

[0025] In view of this, an etching and detinning device and method for multi-layer high-precision circuit boards are designed, which can drive multiple multi-layer circuit boards to unfold each other and make multiple multi-layer circuit boards vibrate in the detinning liquid, thereby improving the efficiency of the detinning process.

[0026] Specifically: Embodiment 1, as Figure 1 As shown, an etching and tin stripping device for multi-layer high-precision circuit boards includes a stand 100, which is a gantry. The gantry provides stable support for the entire device with its solid structural design, ensuring that the device can remain stable during the etching and tin stripping process, avoiding operational errors or safety accidents caused by shaking or tilting, and the height and span of the gantry can be adjusted according to actual needs to adapt to different working environments and operating requirements, so that the operator can quickly adjust the working state of the device as needed, thereby improving work efficiency.

[0027] like Figure 1 As shown, an unfolding component 500 is provided on the stand 100, and the unfolding component 500 is used to unfold multiple multi-layer circuit boards.

[0028] like Figure 5 , Figure 6 and Figure 7As shown, the unfolding assembly 500 includes an outer frame 501, a fixing frame 502 slidably connected to the outer frame 501, a U-shaped frame 503 fixedly connected to the bottom of the fixing frame 502, and a second driving motor 504 arranged on the back of the U-shaped frame 503; a storage wheel 505 is fixedly sleeved at the output end of the second driving motor 504, and two pull ropes 506 are fixedly wound in the wheel groove of the storage wheel 505; an elastic plate 507 is provided on the front side of the U-shaped frame 503, and one end of the pull rope 506 away from the storage wheel 505 is fixedly connected to The end of the elastic plate 507; a plurality of mounting blocks 508 are equidistantly arranged on the front side of the elastic plate 507, and an adjusting rod 509 with adjustable height is connected inside the mounting block 508. After adjustment, the position of the adjusting rod 509 is fixed by a locking bolt, and a clamping member 510 for clamping a multi-layer circuit board is arranged at the bottom of the adjusting rod 509. The clamping member 510 is used to clamp the multi-layer circuit board. When selecting the clamping member 510, the fragility and vulnerability of the circuit board should be taken into consideration to ensure that the circuit board is not damaged during the clamping process.

[0029] When in use, the second drive motor 504 is started, and the second drive motor 504 drives the storage wheel 505 to rotate, so that the pull rope 506 is wrapped in the wheel groove of the storage wheel 505, and the tension of the pull rope 506 pulls the elastic plate 507 to bend into a ring structure, driving multiple multi-layer circuit boards to unfold each other. The multi-layer circuit boards can maintain a certain unfolding state during the detinning process, which is conducive to the uniform penetration of the detinning liquid, avoiding the uneven detinning problem caused by a large number of layers, complex structure, and close layout of multiple multi-layer circuit boards, thereby improving the efficiency of the detinning process.

[0030] Embodiment 2: This embodiment is further optimized on the basis of embodiment 1, and the same parts as the above technical solution will not be repeated here. Figure 1 , Figure 2 , Figures 5 to 8As shown, further, in order to better realize the present invention, the following setting mode is particularly adopted: in this embodiment, push rods 511 are provided on both sides of the bottom of the fixing frame 502, and a buffer spring 512 is sleeved on the outer surface of the push rod 511, one end of the buffer spring 512 abuts on the fixing frame 502, and the other end of the buffer spring 512 abuts on the inner wall of the outer frame 501; one end of the push rod 511 extends to the outside of the outer frame 501 and is fixedly connected with a positioning rod 513; a disturbance component 600 is provided on the stand 100, which is used to push the positioning rod 513. The disturbance component 600 pushes the positioning rod 513, so that the fixing frame 502 and the multi-layer circuit board thereon generate slight vibrations, and the vibration force is conducive to the tin stripping liquid to better penetrate into each corner and tiny gap of the multi-layer circuit board, thereby accelerating the dissolution and shedding of the tin layer and improving the tin stripping efficiency. Due to the large number of layers and complex structure of multi-layer circuit boards, the stripping liquid is prone to encounter obstacles during the penetration process. Vibration can help break these obstacles and make the stripping liquid more evenly distributed on the surface of the circuit board, avoiding the problem of incomplete or excessive stripping, and improving the quality and performance of multi-layer circuit boards. Vibration is not only conducive to the penetration and dissolution of the stripping liquid, but also promotes the loosening and shedding of residues on the surface of the circuit board. During the stripping process, dirt, grease and other impurities on the surface of the circuit board are removed at the same time, improving the cleanliness of the circuit board and the reliability of subsequent processing.

[0031] A limiting frame 514 is provided on both sides of the bottom of the fixing frame 502. The limiting frame 514 is provided with a limiting groove, and the pull rope 506 passes through the limiting groove. The limiting groove on the limiting frame 514 provides guidance and restraint for the pull rope 506. If there is no guidance of the limiting groove, the pull rope 506 can easily be entangled or knotted during movement.

[0032] The disturbance component 600 includes a fixed plate 601 fixedly connected to the stand 100, and a third drive motor 602 and a support 603 fixedly connected to the top of the fixed plate 601; the middle part of the support 603 is rotatably connected with a rotating shaft 604, one end of the rotating shaft 604 is transmission-connected to the output end of the third drive motor 602, and a cam 605 is fixedly sleeved on the outer surface of the rotating shaft 604. An arc portion is provided on the outer side of the positioning rod 513, and the arc portion is slidably connected to the outer edge of the cam 605. The third drive motor 602 drives the rotating shaft 604 to rotate, thereby driving the cam 605 to rotate. When the outer edge of the cam 605 slides in contact with the arc portion on the outer side of the positioning rod 513, a certain driving force is generated, which causes the multi-layer circuit board to vibrate, thereby improving the detinning effect.

[0033] Embodiment 3: This embodiment is further optimized on the basis of embodiment 2, and the same parts as the above technical solutions will not be repeated here. Figure 1 to Figure 4As shown, in order to better realize the present invention, the following configuration is particularly adopted: in this embodiment, a lifting assembly 200 is provided on the stand 100, a lateral movement assembly 300 is provided at the output end of the lifting assembly 200, a support assembly 400 is provided at the output end of the lateral movement assembly 300, and an outer frame 501 is fixedly connected to the support assembly 400. The lifting assembly 200 and the lateral movement assembly 300 facilitate the adjustment of the position of the unfolding assembly 500, so that multiple multi-layer circuit boards are completely placed in the tin stripping liquid of the tin stripping box 700.

[0034] The transverse movement assembly 300 includes a fixed frame 301 and a first drive motor 302 fixedly connected to one side of the fixed frame 301; the output end of the first drive motor 302 is fixedly connected to a screw rod 303, the screw rod 303 is a ball screw, and a moving block 304 is threadedly sleeved on the outer surface of the screw rod 303, and a ball nut is arranged in the moving block 304, and the ball nut is threadedly sleeved on the ball screw. The ball screw and the ball nut cooperate to convert rotational motion into linear motion, thereby driving the moving block 304 to move along the axial direction of the ball screw. The moving block 304 is slidably connected to the fixed frame 301, and the outer frame 501 is fixedly connected to the moving block 304. A slider is provided on the moving block 304, and a slide rail 305 is provided on the inner side wall of the fixed frame 301. The slider is slidably connected to the slide rail 305. When the moving block 304 moves, the slider slides on the outer surface of the slide rail 305, thereby ensuring the stability of the movement of the moving block 304. The first driving motor 302 drives the lead screw 303 to rotate, and drives the outer frame 501 to move through the moving block 304, so as to adjust the position of the multi-layer circuit board.

[0035] The support assembly 400 includes a first support seat 401 and a second support seat 402. The first support seat 401 is fixedly connected to the front of the moving block 304, and the second support seat 402 is fixedly connected to the top of the outer frame 501. The second support seat 402 is rotatably connected to the first support seat 401 through a rotating shaft. A first pull rod 403 is provided inside the first support seat 401, and a second pull rod 404 is provided inside the second support seat 402. A plurality of tension springs 405 are hung between the first pull rod 403 and the second pull rod 404. When the cam 605 rotates and contacts the arc portion of the positioning rod 513, a driving force is generated, which is transmitted to the fixing frame 502 and the multi-layer circuit board thereon through the positioning rod 513. The second support seat 402 rotates in the first support seat 401. This rotation is combined with the driving force of the cam 605, so that the multi-layer circuit board vibrates. At the same time, the tension spring 405 provides a certain elasticity and restoring force for the unfolding assembly 500. The number and number of turns of the tension spring 405 should be considered according to the vibration frequency and load requirements of the device.

[0036] like Figure 1As shown, an etching and tin stripping device for multi-layer high-precision circuit boards also includes a tin stripping box 700, and an unfolding component 500 is located above the tin stripping box 700. A tin stripping liquid is provided in the tin stripping box 700. The tin stripping liquid is also called a tin stripping agent, a tin stripping liquid, a tin-removing water, and an etching liquid. It is a single-liquid, peroxide-free, fluorine-free, and chelating agent-free high-efficiency tin stripping and lead stripping liquid, which is suitable for the stripping of tin plating, tin-lead alloy plating, and tin soldering points. In the manufacturing process of multi-layer high-precision circuit boards, in order to protect the graphic circuits from being etched away, it is usually necessary to plate a layer of metallic tin on the graphic circuits as an anti-corrosion agent. After the etching is completed, it is necessary to use a tin stripping liquid to remove this layer of metallic tin. The present application can unfold the multi-layer circuit board and immerse it in the tin stripping liquid, so that the circuit board can evenly contact the tin stripping liquid during the tin stripping process, and the multi-layer circuit board is taken out after a certain period of immersion and cleaned.

[0037] Embodiment 4: This embodiment provides a technical solution: Figures 1 to 8 As shown, a method for etching and desoldering a multi-layer high-precision circuit board includes the following steps: S1: clamp multiple multi-layer circuit boards in the clamping member 510 in sequence, move the stand 100 to one side of the desoldering box 700, and place the unfolding assembly 500 above the desoldering box 700; S2: adjusting the position of the unfolding assembly 500 by the lifting assembly 200 and the lateral movement assembly 300 so that the multiple multi-layer circuit boards are completely placed in the desoldering liquid of the desoldering box 700; S3: Start the second driving motor 504, pull the elastic plate 507 to bend into a ring structure through the storage wheel 505 and the pull rope 506, and drive the multiple multi-layer circuit boards to unfold each other; S4: Start the third driving motor 602 to push the positioning rod 513 through the rotating shaft 604 and the cam 605, so that the multiple multi-layer circuit boards vibrate in the tin stripping liquid.

[0038] It should be noted that the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An etching and tin stripping device for multi-layer high-precision circuit boards, characterized in that: include: A stand (100), wherein an unfolding assembly (500) is provided on the stand (100), and the unfolding assembly (500) is used to unfold a plurality of multi-layer circuit boards; The unfolding assembly (500) comprises an outer frame (501), a fixing frame (502) slidably connected to the outer frame (501), a U-shaped frame (503) fixedly connected to the bottom of the fixing frame (502), and a second driving motor (504) arranged on the back of the U-shaped frame (503); The output end fixed sleeve of the second driving motor (504) is provided with a storage wheel (505), and two pull ropes (506) are fixedly wound in the wheel groove of the storage wheel (505); An elastic plate (507) is provided on the front of the U-shaped frame (503), and one end of the pull rope (506) away from the storage wheel (505) is fixedly connected to the end of the elastic plate (507); A plurality of mounting blocks (508) are equidistantly arranged on the front side of the elastic plate (507); an adjusting rod (509) with adjustable height is connected inside the mounting block (508); a clamping piece (510) for clamping a multi-layer circuit board is arranged at the bottom of the adjusting rod (509).

2. The etching and tin stripping device for multi-layer high-precision circuit boards according to claim 1 is characterized in that: Push rods (511) are provided on both sides of the bottom of the fixing frame (502); a buffer spring (512) is sleeved on the outer surface of the push rod (511); one end of the buffer spring (512) abuts against the fixing frame (502), and the other end of the buffer spring (512) abuts against the inner wall of the outer frame (501); One end of the push rod (511) extends to the outside of the outer frame (501) and is fixedly connected to a positioning rod (513); The stand (100) is provided with a disturbance component (600) for pushing the positioning rod (513).

3. The etching and tin stripping device for multi-layer high-precision circuit boards according to claim 2 is characterized in that: Limiting frames (514) are provided on both sides of the bottom of the fixing frame (502), and limiting grooves are provided on the limiting frames (514), and the pull rope (506) passes through the limiting grooves.

4. The etching and tin stripping device for multi-layer high-precision circuit boards according to claim 2 is characterized in that: The disturbance assembly (600) comprises a fixing plate (601) fixedly connected to the stand (100), and a third driving motor (602) and a support (603) fixedly connected to the top of the fixing plate (601); The middle part of the support (603) is rotatably connected to a rotating shaft (604), one end of the rotating shaft (604) is drivingly connected to the output end of the third drive motor (602), and a cam (605) is fixedly sleeved on the outer surface of the rotating shaft (604).

5. The etching and tin stripping device and method for multi-layer high-precision circuit boards according to claim 4, characterized in that: An arc-shaped portion is provided on the outer side of the positioning rod (513), and the arc-shaped portion is slidably connected to the outer edge of the cam (605).

6. The etching and tin stripping device for multi-layer high-precision circuit boards according to claim 1, characterized in that: The stand (100) is provided with a lifting assembly (200), the output end of the lifting assembly (200) is provided with a transverse movement assembly (300), the output end of the transverse movement assembly (300) is provided with a support assembly (400), and the outer frame (501) is fixedly connected to the support assembly (400).

7. The etching and tin stripping device for multi-layer high-precision circuit boards according to claim 6 is characterized in that: The transverse movement assembly (300) comprises a fixed frame (301), and a first drive motor (302) fixedly connected to one side of the fixed frame (301); The output end of the first drive motor (302) is fixedly connected to a lead screw (303), a moving block (304) is threadedly sleeved on the outer surface of the lead screw (303), and the moving block (304) is slidably connected to the fixed frame (301).

8. The etching and tin stripping device for multi-layer high-precision circuit boards according to claim 7 is characterized in that: The support assembly (400) comprises a first support seat (401) and a second support seat (402), wherein the first support seat (401) is fixedly connected to the front side of the moving block (304), and the second support seat (402) is fixedly connected to the top of the outer frame (501), and the second support seat (402) is rotatably connected to the first support seat (401) via a rotating shaft; A first pull rod (403) is provided inside the first support seat (401), a second pull rod (404) is provided inside the second support seat (402), and a plurality of tension springs (405) are hung between the first pull rod (403) and the second pull rod (404).

9. The etching and tin stripping device for multi-layer high-precision circuit boards according to claim 1, characterized in that: It also includes a tin stripping box (700), and the unfolding component (500) is located above the tin stripping box (700).

10. A method for etching and detinning a multi-layer high-precision circuit board according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: clamping a plurality of multilayer circuit boards in the clamping member (510) in sequence, moving the stand (100) to one side of the desoldering box (700), and positioning the unfolding assembly (500) above the desoldering box (700); S2: adjusting the position of the unfolding component (500) by means of the lifting component (200) and the lateral movement component (300) so that the plurality of multi-layer circuit boards are completely placed in the desoldering liquid of the desoldering box (700); S3: starting the second driving motor (504), pulling the elastic plate (507) to bend into a ring structure through the storage wheel (505) and the pull rope (506), thereby driving the multiple multi-layer circuit boards to unfold each other; S4: starting the third driving motor (602) to push the positioning rod (513) via the rotating shaft (604) and the cam (605), so that the multiple multi-layer circuit boards vibrate in the tin stripping liquid.

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