Wafer slide holder

Abstract

The invention discloses a wafer slide holder which comprises a fine tuning platform, a reference frame is fixedly mounted on the fine tuning platform, a fixing frame is slidably mounted on the reference frame, a middle connecting frame is sleeved and fixedly mounted in the fixing frame, an adjusting frame is sleeved in the middle connecting frame, and the outer wall of the adjusting frame is in spherical fit with the inner wall of the middle connecting frame. An air suction type fixing structure is arranged between the middle connecting frame and the adjusting frame; a carrier plate is arranged on the adjusting frame, and a negative pressure adsorption mechanism is arranged between the carrier plate and the adjusting frame; a sheet body adsorption jacking mechanism is further installed on the adjusting frame, and an avoiding hole is formed in the carrying plate. The position of the plane where the wafer is located is adjusted, meanwhile, the wafer and the photoetching plate are kept in a parallel state, the parallelism adjustment is rapid and convenient, fixation is reliable and stable after adjustment, and a foundation is laid for guaranteeing the effects of exposure, photoetching and other processes and the product quality.

Description

Technical Field

[0001] This invention belongs to the field of wafer exposure parallelism adjustment technology, and particularly relates to a wafer stage. Background Technology

[0002] Currently, during wafer exposure and other processes, the wafer's position needs to be adjusted. The current method involves directly transferring the wafer to a fixed stage, which is then mounted on an adjustment device. The wafer's position in the X, Y, and Z directions is adjusted using an adjustment mechanism before exposure and other processes can proceed. However, this method has the following drawbacks:

[0003] A photomask is placed above the fixed stage. Whether the wafer and the photomask are parallel cannot be guaranteed, which affects the effect of processes such as exposure and photolithography, and thus affects the final product molding quality. Summary of the Invention

[0004] This invention provides a wafer stage to adjust the planar position of the wafer and maintain its parallel position with the photomask.

[0005] To solve the above-mentioned technical problems, the technical solution of the present invention is: a wafer carrier stage, including a fine-tuning platform, a reference frame fixedly mounted on the fine-tuning platform, a fixed frame slidably mounted on the reference frame, an intermediate connecting frame fitted and fixedly mounted inside the fixed frame, an adjusting frame fitted inside the intermediate connecting frame, the outer wall of the adjusting frame and the inner wall of the intermediate connecting frame having a spherical fit, and a gas suction fixing structure provided between the intermediate connecting frame and the adjusting frame;

[0006] The adjustment frame is provided with a carrier plate, and a negative pressure adsorption mechanism is provided between the carrier plate and the adjustment frame; the adjustment frame is also equipped with a sheet adsorption and lifting mechanism, and the carrier plate is provided with a clearance hole for the lifting component of the sheet adsorption and lifting mechanism to pass through.

[0007] As an improvement, the air suction fixing structure includes an air groove disposed on the inner wall of the intermediate connecting frame, the air groove extending circumferentially along the inner wall of the intermediate connecting frame and surrounding the adjusting frame;

[0008] The intermediate connecting frame is also provided with a first air intake hole that communicates with the air groove; a first air pipe connector is installed at the end of the intermediate connecting frame located in the fixed frame, and the first air pipe connector communicates with the first air intake hole.

[0009] As an improvement, both the adjusting frame and the fixed frame are hollow structures. A first elastic support adjustment mechanism is provided between the adjusting frame and the fixed frame located inside the fixed frame; a second elastic support adjustment mechanism is provided between the fixed frame and the reference frame located outside the fixed frame.

[0010] As a further improvement, the first elastic support adjustment mechanism includes an adjustment plate integrally formed on the adjustment frame and a connecting plate integrally formed on the fixed frame. At least three first support columns are arranged in a circumferential array between the adjustment plate and the connecting plate, and each of the first support columns is provided with a first limiting retaining ring at both ends.

[0011] Two first bushings are fitted on the first support column located between the adjusting plate and the connecting plate, and a first elastic element is fitted on the first support column between the two first bushings; a movable adjustment structure is provided between the first bushing, the first support column and the adjusting plate near the adjusting plate.

[0012] As a further improvement, the movable adjustment structure includes an integrally formed spherical protrusion on the adjustment disk, the spherical protrusion engaging with the spherical surface of the first bushing; the adjustment disk is provided with a through hole for the first support column to pass through, the diameter of the through hole being larger than the diameter of the first support column.

[0013] As an improvement, the second elastic support adjustment mechanism includes a convex plate integrally formed on the fixed frame, and a convex ring and a fixed plate integrally formed on the reference frame. At least three second support columns are arranged in a circumferential array between the convex plate and the fixed plate. One end of the second support column is fixed to the fixed plate, and the other end of the second support column passes through the convex ring and the convex plate in sequence, and the end is provided with a second limiting ring.

[0014] Two second bushings are fitted on the second support column located between the cam and the fixed plate. The second bushings are distributed on both sides of the cam, and a second elastic element passing through the cam is fitted on the second support column between the two second bushings.

[0015] As a further improvement, the sheet adsorption lifting mechanism includes a mounting base fixedly installed on the adjusting plate, the mounting base is provided with a lifting seat driven by a pneumatic power element, and at least three top rods arranged in a triangle are installed on the lifting seat, the top rods extending into the clearance hole.

[0016] As a further improvement, the lifting seat is provided with a negative pressure air passage, and all the top rods are provided with a negative pressure air channel that communicates with the negative pressure air passage.

[0017] As an improvement, the negative pressure adsorption mechanism includes a plurality of second air pipe connectors disposed on the inner wall of the adjusting frame, and the end face of the adjusting frame is provided with a second air inlet, the second air inlet being connected to the second air pipe connector;

[0018] The end of the adjustment frame is also provided with a positioning groove, the carrier plate is positioned in the positioning groove, and the carrier plate is provided with a plurality of adsorption holes communicating with the second air intake hole. The adsorption holes are arranged in a straight line and multiple rows are arranged side by side.

[0019] As a further improvement, it also includes a substrate located above the carrier plate, the substrate having a central hole; the substrate also has at least three circumferentially distributed slots communicating with the central hole, a calibration plate arranged in the slots, the calibration plate having a calibration ball; the calibration plate is driven by a linear power element disposed on the substrate.

[0020] After adopting the above technical solution, the effect of the present invention is as follows:

[0021] The wafer stage includes a fine-tuning platform, a reference frame fixedly mounted on the fine-tuning platform, a fixed frame slidably mounted on the reference frame, an intermediate connecting frame fitted and fixedly mounted inside the fixed frame, and an adjusting frame fitted inside the intermediate connecting frame. The outer wall of the adjusting frame and the inner wall of the intermediate connecting frame are spherically fitted, and a pneumatic suction fixing structure is provided between the intermediate connecting frame and the adjusting frame. A carrier plate is mounted on the adjusting frame, and a negative pressure adsorption mechanism is provided between the carrier plate and the adjusting frame. A wafer adsorption and lifting mechanism is also mounted on the adjusting frame. The carrier plate has clearance holes for the lifting components of the wafer adsorption and lifting mechanism to pass through. Based on the above structure, a standard wafer is first placed on the carrier plate, and then... The wafer is then fixed by adsorption. A fine-tuning platform rotates and adjusts the wafer in the X, Y, and Z directions. During Z-axis adjustment, the end of the adjustment frame abuts against a reference component positioned above it for placing the photomask. During this abutment, the adjustment frame slides within the intermediate connecting frame via a spherical engagement with the intermediate connecting frame until the end face of the carrier plate is parallel to the reference component, i.e., the wafer and photomask are parallel. The adjustment frame is then fixed using a pneumatic suction fixing structure. When the wafer is ready for the next processing step, a wafer adsorption lifting mechanism lifts the wafer so that a transfer mechanism can transfer it from below.

[0022] In summary, this wafer stage enables the adjustment of the wafer's planar position while maintaining parallelism with the photomask. The parallelism adjustment is quick and convenient, and the adjusted wafer is reliably and stably fixed, laying the foundation for ensuring the effectiveness of exposure, photolithography, and other processes, as well as the quality of the product.

[0023] Because the air suction fixing structure includes an air groove on the inner wall of the intermediate connecting frame, the air groove extends circumferentially along the inner wall of the intermediate connecting frame and surrounds the adjusting frame; the intermediate connecting frame is also provided with a first suction hole communicating with the air groove; a first air pipe connector is installed at the end of the intermediate connecting frame located in the fixing frame, and the first air pipe connector communicates with the first suction hole. Thus, when fixing the adjusting frame, the cooperation between the air groove and the first suction hole creates a negative pressure in the air groove and performs negative pressure adsorption on the adjusting frame, so that the adjusting frame maintains a reliable and stable fixing effect during operation; at the same time, through the first air pipe connector arranged in the fixing frame, the air pipe connected to the first air pipe connector is also located in the fixing frame. The overall structure is simple and uncluttered, and effectively avoids the problem of interference between the air pipe and other structures during operation.

[0024] Since both the adjusting frame and the fixed frame are hollow structures, a first elastic support adjustment mechanism is provided between the adjusting frame and the fixed frame located inside the fixed frame; a second elastic support adjustment mechanism is provided between the fixed frame and the reference frame located outside the fixed frame. This effectively reduces the weight through the hollow structure, which is beneficial for adjusting the adjusting frame. The first elastic support adjustment mechanism provides elastic support for the adjusting frame, and the second elastic support adjustment mechanism provides elastic support for the fixed frame. At the same time, the adjusting frame can provide elastic buffering when it comes into contact with the reference component, which plays a safety protection role.

[0025] The first elastic support adjustment mechanism includes an adjustment plate integrally formed on the adjustment frame and a connecting plate integrally formed on the fixed frame. At least three first support columns are arranged in a circumferential array between the adjustment plate and the connecting plate, and each of the first support columns has a first limiting retaining ring at both ends. Two first bushings are fitted on the first support column located between the adjustment plate and the connecting plate, and a first elastic element is fitted on the first support column between the two first bushings. A movable adjustment structure is provided between the first bushing, the first support column, and the adjustment plate near the adjustment plate, so that the first support column, the first bushing and the first elastic element fitted on it cooperate to play an elastic buffering and support role. The movable adjustment structure enables the adjustment plate to follow the adjustment action, avoiding rigid connection that would affect the adjustment of the adjustment plate position. The integrally formed structure of the adjustment plate and the adjustment frame, as well as the connecting plate and the fixed frame, not only ensures the structural strength, but also ensures the long-term stability of the cooperation between them during operation.

[0026] The movable adjustment structure includes an integrally formed spherical protrusion on the adjustment plate, which mates with the spherical surface of the first bushing. The adjustment plate has a through hole for the first support column to pass through, and the diameter of the through hole is larger than the diameter of the first support column. Thus, when the adjustment plate moves, the large-diameter through hole prevents interference between the first support column and the adjustment plate, and also provides room for the movement of the adjustment plate. At the same time, the spherical protrusion mates with the spherical surface of the first bushing, and the mating changes accordingly with the movement of the adjustment plate. This not only does not affect the elastic support, but also prevents interference with any components during the adjustment process of the adjustment plate, resulting in smooth adjustment and low adjustment resistance.

[0027] The second elastic support adjustment mechanism includes a cam integrally formed on the fixed frame, and a cam ring and a fixed plate integrally formed on the reference frame. At least three second support columns are arranged in a circumferential array between the cam and the fixed plate. One end of the second support column is fixed to the fixed plate, and the other end of the second support column passes through the cam ring and the cam in sequence, and the end is provided with a second limiting ring. Two second bushings are fitted on the second support column located between the cam and the fixed plate. The second bushings are distributed on both sides of the cam ring, and a second elastic element passing through the cam ring is fitted on the second support column between the two second bushings. Thus, through the cooperation of the second support column and the second bushings and the second elastic element fitted on it, elastic buffering and support functions are achieved. At the same time, after the adjustment frame is adjusted in the Z direction, after the fine-tuning platform rises, the fixed frame and the reference frame continue to compress and then lock between the second bushing and the second support column. The current position of the fine-tuning platform is recorded as a standard for future lifting and lowering.

[0028] The wafer adsorption and lifting mechanism includes a mounting base fixedly installed on an adjustment plate. The mounting base is equipped with a lifting seat driven by a pneumatic power element. The lifting seat is equipped with at least three push rods arranged in a triangle. The push rods extend into the clearance hole. When transferring the wafer, the lifting seat is lifted by the pneumatic power element, and the three push rods also rise synchronously through the clearance hole. At this time, the wafer is lifted and detached from the carrier plate, or the wafer is placed on it. Then, the wafer is transferred or detached from the transfer mechanism by contacting the lower surface of the wafer. The structure is simple, the contact area is small, and it will not affect the working surface of the wafer.

[0029] Because the lifting platform is equipped with a negative pressure air path, and all the top rods are equipped with negative pressure air channels that are connected to the negative pressure air path, the wafer is continuously adsorbed during the lifting process through the cooperation of the negative pressure air path and the negative pressure air channels, thus ensuring the continuous fixation of the wafer position.

[0030] The negative pressure adsorption mechanism includes multiple second air pipe connectors installed on the inner wall of the adjustment frame. The end face of the adjustment frame is provided with a second air intake hole, which is connected to the second air pipe connector. The end of the adjustment frame is also provided with a positioning groove, in which the carrier plate is positioned. The carrier plate is provided with multiple adsorption holes connected to the second air intake hole. The adsorption holes are arranged in a straight line and multiple rows are arranged side by side. The positioning groove ensures the fixation of the carrier plate on the adjustment frame. The second air pipe connector, the second air intake hole and the adsorption holes work together to continuously adsorb the wafer placed on the carrier plate, ensuring the fixation of the wafer's position during processes such as exposure.

[0031] Since it also includes a substrate located above the carrier plate, the substrate has a central hole; the substrate also has at least three circumferentially distributed slots that communicate with the central hole, and a calibration plate is arranged in the slot, with a calibration ball on the calibration plate; the calibration plate is driven by a linear power element set on the substrate, so that when the adjustment frame is adjusted, the linear power element drives the calibration plate from the slot into the central hole, and the adjustment frame will make three-point contact with the calibration ball (the reference component mentioned above) and complete the parallelism adjustment with the photomask (because the photomask is placed on the substrate). The structure is simple, the parallelism adjustment is three-point contact, and the adjustment accuracy is high. Attached Figure Description

[0032] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0033] Figure 1 This is a schematic diagram of the structure of the present invention;

[0034] Figure 2 yes Figure 1 A sectional view;

[0035] Figure 3 yes Figure 1 Cross-sectional view of the middle substrate;

[0036] Figure 4 yes Figure 3 Enlarged view of A in the middle;

[0037] Figure 5 yes Figure 1 A schematic diagram of the structure after removing the substrate and the fine-tuning platform;

[0038] Figure 6 yes Figure 5 Schematic diagram of the structure after removing the carrier plate;

[0039] Figure 7 yes Figure 6 A sectional view;

[0040] Figure 8 yes Figure 7 A schematic diagram of the structure after removing the sheet adsorption lifting mechanism and the reference frame;

[0041] Figure 9 yes Figure 8 Schematic diagram of the intermediate connecting frame;

[0042] Figure 10 yes Figure 8 Enlarged view of B in the middle;

[0043] Among them, 1-fine adjustment platform; 101-reference frame; 102-fixed frame; 103-connecting plate; 104-baffle plate; 2-intermediate connecting frame; 201-air groove; 202-first air intake hole; 203-first air pipe connector; 3-adjusting frame; 301-adjusting plate; 302-spherical protrusion; 303-through hole; 304-second air pipe connector; 305-second air intake hole; 306-positioning groove; 4-carrier plate; 401-avoidance hole; 402-adsorption hole; 5-plate adsorption lifting mechanism; 501-mounting base; 502-pneumatic power component; 503-lifting base; 504-top rod; 505-negative pressure air circuit; 506 - Negative pressure airway; 6- Base plate; 601- Center hole; 602- Slot; 603- Calibration plate; 604- Calibration ball; 605- Linear power element; 7- First elastic support adjustment mechanism; 701- First support column; 702- First limiting retaining ring; 703- First bushing; 704- First elastic element; 8- Second elastic support adjustment mechanism; 801- Convex plate; 802- Convex ring; 803- Fixed plate; 804- Second support column; 805- Second limiting retaining ring; 806- Second bushing; 807- Second elastic element; 808- Guide column; 809- Sliding sleeve; 810- Locking hole; 9- Movable adjustment structure. Detailed Implementation

[0044] The present invention will be further described in detail below through specific embodiments.

[0045] like Figures 1 to 7As shown in the diagram, a wafer carrier stage includes a rotatable fine-tuning platform 1 (or displacement platform) for adjusting the position in the XYZ axes. A reference frame 101 is fixedly mounted on the fine-tuning platform 1, and a fixed frame 102 is slidably mounted on the reference frame 101. An intermediate connecting frame 2 is fitted and fixedly mounted inside the fixed frame 102. An adjusting frame 3 is fitted inside the intermediate connecting frame 2. The outer wall of the adjusting frame 3 and the inner wall of the intermediate connecting frame 2 are spherically fitted (i.e., both the outer wall of the adjusting frame 3 and the inner wall of the intermediate connecting frame 2 have spherical surfaces). A pneumatic suction fixing joint is provided between the intermediate connecting frame 2 and the adjusting frame 3. The structure includes: a carrier plate 4 for placing standard wafers on the adjustment frame 3, a negative pressure adsorption mechanism between the carrier plate 4 and the adjustment frame 3; a wafer adsorption lifting mechanism 5 is also installed on the adjustment frame 3, and the carrier plate 4 has clearance holes 401 for the lifting components of the wafer adsorption lifting mechanism 5 to pass through; it also includes a substrate 6 located above the carrier plate 4, the substrate 6 having a central hole 601, and at least three circumferentially arranged slots 602 communicating with the central hole 601, a calibration plate 603 arranged in the slots 602, and calibration balls 604 for contacting the standard wafers (see [link to documentation]). Figures 1 to 4 The calibration plate 603 is driven by a linear power element 605 (such as a cylinder or hydraulic cylinder) disposed on the base plate 601.

[0046] The air-suction fixing structure includes an air groove 201 disposed on the inner wall of the intermediate connecting frame 2. The air groove 201 extends circumferentially along the inner wall of the intermediate connecting frame 2 and surrounds the adjusting frame 3. The intermediate connecting frame 2 is also provided with a first air intake hole 202 communicating with the air groove 201. A first air pipe connector 203 is installed at the end of the intermediate connecting frame 2 located in the fixing frame 102. The first air pipe connector 203 communicates with the first air intake hole 202 (see...). Figures 8 to 10 ).

[0047] like Figure 7 As shown, both the adjusting frame 3 and the fixed frame 102 are hollow structures. A first elastic support adjusting mechanism 7 is provided between the adjusting frame 3 and the fixed frame 102 located inside the fixed frame 102. A second elastic support adjusting mechanism 8 and a guide mechanism are provided between the fixed frame 102 and the reference frame 101 located outside the fixed frame 102.

[0048] The first elastic support adjustment mechanism 7 includes an adjustment disc 301 integrally formed on the adjustment frame 3 and a connecting disc 103 integrally formed on the fixed frame 102. At least three first support columns 701 are arranged in a circumferential array between the adjustment disc 301 and the connecting disc 103. Each end of the first support column 701 is provided with a first limiting retaining ring 702, which can also be a bolt, screw, or other connecting component threaded onto the first support column 701. Two first bushings 703 are fitted on the first support column 701 located between the adjustment disc 301 and the connecting disc 103. A first elastic element 704 (such as a tension spring) is fitted on the first support column 701 between the two first bushings 703. A movable adjustment structure 9 is provided between the first bushings 703, the first support columns 701, and the adjustment disc 301 near the adjustment disc 301. In this embodiment, a retaining plate 104 is installed on the fixed frame 102, and the retaining plate 104 is arranged on the side away from the adjustment frame 3.

[0049] The adjustable structure 9 includes a spherical protrusion 302 integrally formed on the adjusting plate 301, which spherically engages with the spherical surface of the first bushing 703; the adjusting plate 301 is provided with a through hole 303 through which the first support column 701 passes, and the diameter of the through hole 303 is larger than the diameter of the first support column 701.

[0050] The second elastic support adjustment mechanism 8 includes a convex plate 801 integrally formed on the fixed frame 102, a convex ring 802 integrally formed on the reference frame 101, and a fixed plate 803. At least three second support columns 804 are arranged in a circumferential array between the convex plate 801 and the fixed plate 803. One end of each second support column 804 is fixed to the fixed plate 803, and the other end of each second support column 804 passes through the convex ring 802 and the convex plate 801 in sequence, and is provided with a second limiting retaining ring 805 at its end. The limiting ring 805 can also be a bolt, screw or other connecting part threaded onto the second support column 804. The second limiting ring 805 is provided with a locking hole 810. Two second bushings 806 are fitted on the second support column 804 located between the cam 801 and the fixed plate 803. The second bushings 806 are distributed on both sides of the cam 802, and a second elastic element 807 (such as a tension spring) passing through the cam 802 is fitted on the second support column 804 between the two second bushings 806.

[0051] The guiding mechanism includes multiple guide posts 808 fixedly installed on the cam 801, and a sliding sleeve 809 is provided on the cam ring 802 corresponding to the guide post 808. The guide post 808 is vertically slidably installed in the sliding sleeve 809.

[0052] like Figure 6 and Figure 7As shown, the sheet adsorption lifting mechanism 5 includes a mounting base 501 fixedly mounted on the adjusting plate 301. The mounting base 501 is provided with a lifting seat 503 driven by a pneumatic power element 502 (such as a cylinder or hydraulic cylinder). At least three push rods 504 (i.e., lifting components) arranged in a triangle are mounted on the lifting seat 503. The push rods 504 extend into the clearance hole 401. Preferably, the lifting seat 503 is provided with a negative pressure air passage 505, and all push rods 504 are provided with a negative pressure air channel 506 communicating with the negative pressure air passage 505.

[0053] like Figure 5 and Figure 6 As shown, the negative pressure adsorption mechanism includes a plurality of second air pipe connectors 304 disposed on the inner wall of the adjusting frame 3. The end face of the adjusting frame 3 is provided with a second air intake hole 305, which is connected to the second air pipe connector 304. The end of the adjusting frame 3 is also provided with a positioning groove 306, and the carrier plate 4 is positioned in the positioning groove 306. The carrier plate 4 is provided with a plurality of adsorption holes 402 connected to the second air intake hole 305. The adsorption holes 402 are arranged in a straight line and multiple rows are arranged side by side.

[0054] The above-described embodiments are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Any modifications and alterations made to the technical solutions of the present invention without departing from the spirit of the present invention shall fall within the protection scope defined by the claims of the present invention.

Claims

1. A wafer carrier table comprising a fine adjustment stage, characterized by: The fine adjustment platform is fixedly installed with a reference frame, the reference frame is slidably installed with a fixed frame, the fixed frame is sleeved with and fixedly installed with an intermediate adapter frame, the intermediate adapter frame is sleeved with an adjustment frame, the outer wall of the adjustment frame is in spherical surface cooperation with the inner wall of the intermediate adapter frame, and the intermediate adapter frame and the adjustment frame are provided with air suction type fixing structures. The adjustment frame is provided with a carrier plate, the carrier plate and the adjustment frame are provided with a negative pressure suction mechanism, and the adjustment frame is also installed with a sheet suction and jacking mechanism, and the carrier plate is provided with an avoiding hole through which the jacking component of the sheet suction and jacking mechanism passes.

2. The slide stage of claim 1, wherein: The air suction type fixing structure comprises air grooves arranged on the inner wall of the intermediate adapter frame, the air grooves extend along the inner wall of the intermediate adapter frame in a circumferential annular manner and embrace the adjustment frame. The intermediate adapter frame is also provided with a first air suction hole in communication with the air groove, and the end of the intermediate adapter frame located in the fixed frame is installed with a first air pipe joint in communication with the first air suction hole.

3. The slide stage of claim 1, wherein: The adjustment frame and the fixed frame are both hollow structures, the first elastic support adjustment mechanism is arranged between the adjustment frame and the fixed frame located in the fixed frame, and the second elastic support adjustment mechanism is arranged between the fixed frame located outside the fixed frame and the reference frame.

4. The slide stage of claim 3, wherein: The first elastic support adjustment mechanism comprises an adjustment disc integrally formed on the adjustment frame and a connecting disc integrally formed on the fixed frame, at least three first support columns are arranged in a circumferential array between the adjustment disc and the connecting disc, and the two ends of the first support column are both provided with a first limiting stop ring. Two first shaft sleeves are sleeved on the first support column located between the adjustment disc and the connecting disc, a first elastic element is sleeved on the first support column between the two first shaft sleeves, and the first shaft sleeve close to the adjustment disc, the first support column and the adjustment disc are provided with a movable adjustment structure.

5. The slide stage of claim 4, wherein: The movable adjustment structure comprises a spherical protrusion integrally formed on the adjustment disc, the spherical protrusion is in spherical surface cooperation with the first shaft sleeve, and the adjustment disc is provided with a through hole through which the first support column passes, and the diameter of the through hole is greater than the diameter of the first support column.

6. The slide stage of claim 3, wherein: The second elastic support adjustment mechanism comprises a convex disc integrally formed on the fixed frame, a convex ring and a fixed disc integrally formed on the reference frame, at least three second support columns are arranged in a circumferential array between the convex disc and the fixed disc, one end of the second support column is fixed to the fixed disc, the other end of the second support column sequentially passes through the convex ring and the convex disc, and the end is provided with a second limiting stop ring. Two second shaft sleeves are sleeved on the second support column located between the convex disc and the fixed disc, the second shaft sleeves are distributed on the two sides of the convex ring, and a second elastic element passing through the convex ring is sleeved on the second support column between the two second shaft sleeves.

7. The slide stage of claim 4, wherein: The sheet adsorption jacking mechanism comprises a mounting seat fixedly mounted on the adjusting disc, a lifting seat driven by a pneumatic power element is arranged on the mounting seat, at least three jacking rods arranged in a triangular shape are mounted on the lifting seat, and the jacking rods extend into the avoiding holes.

8. The slide stage of claim 7, wherein: A negative pressure gas path is arranged on the lifting seat, and a negative pressure gas channel in communication with the negative pressure gas path is arranged on all the jacking rods.

9. The slide stage of claim 1, wherein: The negative pressure adsorption mechanism comprises a plurality of second air pipe joints arranged on the inner wall of the adjusting frame, and an end surface of the adjusting frame is provided with a second air inlet hole in communication with the second air pipe joints. An end portion of the adjusting frame is further provided with a positioning groove, the carrier plate is positioned in the positioning groove, a plurality of adsorption holes in communication with the second air inlet hole are arranged on the carrier plate, and the adsorption holes are arranged in a straight line and are arranged in multiple rows.

10. The slide stage of any one of claims 1 to 9, wherein: Further comprising a base plate located above the carrier plate, the base plate is provided with a central hole; at least three circumferentially distributed groove positions in communication with the central hole are further arranged on the base plate, a calibration plate is arranged in the groove position, the calibration plate is provided with a calibration ball; and the calibration plate is driven by a linear power element arranged on the base plate.

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