Electromagnetic interference shielding for camera module

Abstract

The invention relates to electromagnetic interference shielding for camera modules. A camera module includes a wiring substrate, an image sensor, an electrical component, a molding compound, and an electromagnetic interference (EMI) shielding layer. The wiring substrate has a ground plane coupled between a first side of the wiring substrate and a second side of the wiring substrate. The image sensor is configured to receive incident image light. The electrical components are electrically coupled to the second side of the wiring substrate. The molding compound supports the image sensor and the electrical components. The EMI shielding layer is disposed on the molding compound, and the EMI shielding layer is coupled to the ground plane of the wiring substrate.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 548,454, filed on November 14, 2023, and U.S. Non-Provisional Patent Application No. 18 / 920,695, filed on October 18, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates generally to optics and, in particular, to cameras. Background Art

[0004] Cameras are ubiquitous in consumer electronic products. For example, smartphones, tablet computers, action-cameras, laptops, and even monitors may incorporate cameras. Typically, cameras incorporated into consumer electronic products include a lens assembly paired with a complementary metal-oxide semiconductor (CMOS) image sensor to capture color images. It is desirable to reduce the size of the camera and include features that protect the camera from adverse environmental factors. Summary of the invention

[0005] According to a first aspect of the present disclosure, a camera module is provided, comprising: a wiring substrate having a ground plane coupled between a first side of the wiring substrate and a second side of the wiring substrate; an image sensor configured to receive incident image light, wherein the image sensor is electrically coupled to the first side of the wiring substrate; an electrical component electrically coupled to the second side of the wiring substrate; a molding material supporting the image sensor and supporting the electrical component; and an electromagnetic interference (EMI) shielding layer disposed on the molding material, wherein the EMI shielding layer is connected to the ground plane of the wiring substrate.

[0006] According to another aspect of the present disclosure, a method for manufacturing a camera module is provided, the method comprising: electrically coupling an image sensor to a first side of a wiring substrate, the wiring substrate having a ground plane disposed between the first side and a second side of the wiring substrate; and depositing an electromagnetic interference (EMI) shielding layer on a molding compound, the molding compound supporting the image sensor and electrical components electrically coupled to the second side of the wiring layer, wherein depositing the EMI shielding layer electrically couples the EMI shielding layer to the ground plane of the wiring substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Non-limiting and non-exhaustive embodiments of the present invention are described with reference to the following figures, wherein like reference numerals refer to like parts throughout the various views unless otherwise specified.

[0008] Figure 1 An example camera module having a metal cover as an Electro-magnetic Interference (EMI) cover is shown.

[0009] Figure 2 A camera module according to aspects of the present disclosure is shown, the camera module including an image sensor and an EMI shielding layer disposed on a molding compound of the camera module.

[0010] Figure 3 An example process of manufacturing a camera module according to aspects of the present disclosure is shown.

[0011] Figure 4 A camera module according to aspects of the present disclosure is shown that includes an image sensor and an EMI shielding layer disposed on a molding compound of the camera module.

[0012] Figure 5 An example process for fabricating a camera module including laser-drilled vias in accordance with aspects of the present disclosure is shown.

[0013] Figure 6 A camera module including an EMI shielding layer coupled to a Bonded Via Array (BVA) according to aspects of the present disclosure is shown.

[0014] Figure 7 Example multi-layer EMI shielding layers according to aspects of the present disclosure are shown.

[0015] Figure 8 An example process for manufacturing a camera module using a bonded via array (BVA) according to aspects of the present disclosure is shown.

[0016] Fig. 9 A flow chart illustrating an example process for manufacturing a camera module with an EMI shield according to aspects of the present disclosure is shown. DETAILED DESCRIPTION

[0017] Embodiments of electromagnetic interference (EMI) shielding for camera modules are described herein. In the following description, numerous specific details are set forth to provide a thorough understanding of the various embodiments. However, those skilled in the relevant art will recognize that the techniques described herein may be implemented without one or more of these specific details, or with other methods, components, materials, etc. In other cases, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring certain aspects.

[0018] Throughout this specification, reference to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" throughout this specification are not necessarily all referring to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0019] Throughout this specification, several technical terms are used. These terms will adopt their ordinary meanings in the art, unless specifically defined herein or the context in which they are used clearly indicates otherwise.

[0020] In various aspects of the present disclosure, visible light can be defined as having a wavelength range of about 380 nanometers (nm) to 700nm. Invisible light can be defined as light with a wavelength outside the visible light range, such as ultraviolet light and infrared light. Infrared light with a wavelength range of about 700nm to 1 millimeter (mm) includes near infrared light. In various aspects of the present disclosure, near infrared light can be defined as having a wavelength range of about 700nm to 1.6 micrometers (μm).

[0021] In aspects of the present disclosure, the term "transparent" may be defined as a material having a light transmittance greater than 90%. In some aspects, the term "transparent" may be defined as a material having a visible light transmittance greater than 90%.

[0022] Electromagnetic interference (EMI) shielding of a camera module is desirable to maintain image signals and prevent the camera module from being damaged by electrostatic discharge (ESD) and other causes. Existing methods include attaching an EMI cover to a printed circuit board to which the camera module is electrically coupled. However, the gap between the camera module and the EMI cover increases the size of the camera module and additionally increases the expenditure of materials. In addition, attaching the EMI cover requires another process step and requires monitoring the tolerance of the EMI cover.

[0023] Figure 1An example camera module 100 is shown having a metal cover as an EMI cover 131. The EMI cover 13 may be made of stainless steel. It should be noted that there is a gap between the EMI cover 131 and the molding compound 161 surrounding the image sensor 110, so that the EMI cover 131 has sufficient clearance to be assembled on the molding compounds 161 and 162. The image sensor 110 is shown as a wafer level package (WLP), wherein solder balls 113 electrically couple the image sensor 110 to a wiring substrate (e.g., a printed circuit board) including a copper ground plane 121, and a first solder mask 126 on a first side of the wiring substrate and a second solder mask 127 on a second side of the wiring substrate. Figure 1 , the electrical component 170 is shown as a surface mount technology (SMT) component supported by the molding compound 162.

[0024] Figure 2 A camera module 200 according to aspects of the present disclosure is shown, the camera module including an image sensor 210 and an EMI shielding layer 233 disposed on a molding compound 261 of the camera module 200. The wiring substrate 220 includes a ground plane 221 (e.g., copper) coupled between a first side 251 of the wiring substrate 220 and a second side 252 of the wiring substrate 220. The image sensor 210 is configured to receive incident light 299 and is electrically coupled to the first side 251 of the wiring substrate 220. In the example shown, the image sensor 210 is electrically coupled to the first side 251 of the wiring substrate 220 through solder balls 213. The image sensor 210 may include a complementary metal oxide semiconductor (CMOS) image sensor in a wafer level package (WLP). The image sensor 210 may include an array of CMOS imaging pixels arranged in rows and columns, the CMOS imaging pixel array being configured to capture a digital image.

[0025] The electrical components are shown as surface mount technology (SMT) components 270 supported by the bottom molding compound 262. For example, the electrical components 270 can be passive (e.g., resistors, inductors, capacitors) or active (e.g., transistors). The electrical components can be electrically coupled to the image sensor 210 to support the functions of the image sensor 210. For example, capacitors can help suppress noise from the power rails provided to the image sensor 210. Figure 2In the illustration of FIG. 2 , the top molding material 261 supports the image sensor 210, and the bottom molding material 262 supports the electrical component 270. The top molding material 261 may surround the image sensor 210 to fix and protect the image sensor 210. In general, as shown in FIG. Figure 2 As shown, molding compound 261 can overhang a small portion of image sensor 210 to help secure image sensor 210 to wiring substrate 220 and camera module 200. Molding compound 262 can surround and / or encapsulate electrical components 270 to protect them from environmental impacts and / or add mechanical support. Molding compounds 261 and 262 can be electrical insulators.

[0026] The camera module 200 includes an EMI shielding layer 233 disposed on the molding materials 261 and 262. Figure 2 , the EMI shielding layer 233 is tied or coupled to the ground plane 221 of the wiring substrate 220. The EMI shielding layer 233 is disposed on the molding material 261 on the top on the first side 251 of the wiring substrate 220, and is disposed on the molding material 262 on the bottom of the second side 252 of the wiring substrate 220. The EMI shielding layer 233 includes metal. The metal may include copper or stainless steel, or both copper and stainless steel.

[0027] In some embodiments, EMI shielding layer 233 includes multiple layers. Figure 7 An example EMI shielding layer 733 that can be used as an EMI shielding layer according to aspects of the present disclosure is shown. The example EMI shielding layer 733 includes a first metal adhesion layer 736 configured to adhere to a molding compound (e.g., molding compounds 261 and 262), a second metal shielding layer 737 configured to shield a camera module (e.g., camera module 200) from electromagnetic interference, and a third metal protective layer 738 configured to shield the EMI shielding layer 733 from the environment surrounding the camera module. The second metal shielding layer 737 can be copper, and the first metal adhesion layer 736 and the third metal protective layer 738 can be stainless steel. The second metal shielding layer 737 can be about 0.05 microns, and the first metal adhesion layer 736 and the third metal protective layer 738 can be stainless steel with a thickness of about 0.03 microns.

[0028] Reference again Figure 2In an embodiment, the ground plane 221 of the wiring substrate 220 is exposed on one or more ends 255 of the wiring substrate 220, so that the EMI shielding layer 233 is electrically coupled to the ground plane 221 on the ends 255 of the wiring substrate 220. In some embodiments, the ground plane 221 of the wiring substrate 220 is exposed around the entire wiring substrate 220, and the EMI shielding layer 233 surrounds the ground plane 221. After singulation (e.g., laser singulation) of the camera module 200 from other camera modules, the ground plane 221 can be exposed for deposition of the EMI shielding layer 233. In other words, singulation of the camera module can cause exposure of the ground plane 221.

[0029] In an embodiment, the ground plane 221 of the wiring substrate 220 is electrically insulated on one or more ends 255 of the wiring substrate, and the EMI shielding layer 233 is electrically coupled to the ground plane 221 of the wiring substrate 220 through the solder mask layer on the second side 252 of the wiring substrate 220.

[0030] Figure 3 An example process 300 of manufacturing a camera module according to aspects of the present disclosure is shown. Figure 3 A Physical Vapor Deposition (PVD) process is shown that can be used to sputter different coatings to form an EMI shielding layer 233 on the molding compound surface to connect to the ground plane. Figure 3 shows that PVD technology can be used for the bottom side of the camera module (e.g. Figure 2 252 ) and then to the top side (eg, side 251 ) of camera module 200 . Figure 3 The order in which some or all of the process blocks appear in the description should not be considered limiting. Instead, those of ordinary skill in the art who have benefited from the present disclosure will understand that some of the process blocks may be executed in various orders not shown, or even in parallel.

[0031] In process block 305, surface mount technology (SMT) passive components are provided. For example, component 270 may be an SMT passive component. In process block 310, the bottom of the structure is reflowed to electrically couple the SMT passive component to the second side 252 of the wiring substrate 220. In process block 315, molding compound 262 may be formed.

[0032] In process block 320, SMT components (including sensor 210) may be provided. In process block 325, the top of the structure is reflowed to electrically couple the SMT components provided in process block 320 to the first side 251 of the wiring substrate 220. In process block 330, molding compound 261 may be formed.

[0033] In process block 335, a laser can be used to separate a camera module (e.g., camera module 200) from other camera modules that share a common substrate. In process block 340, one or more layers of EMI shielding can be deposited on the bottom (e.g., the same as side 252) of the camera module using physical vapor deposition (PVD) techniques. PVD process techniques can include sputtering. As a result of the PVD process, the EMI shield can be electrically coupled to the ground plane 221 of the substrate 220. In examples where the EMI shield includes multiple layers, multiple rounds of PVD can be used to deposit each layer of the EMI shield. In process block 345, the EMI shield can be cured.

[0034] In process block 350, one or more layers of EMI shield may be deposited on the top of the camera module (e.g., the same as side 251) using physical vapor deposition (PVD) techniques. The image sensor 210 and other components on the top of the camera module may be masked off prior to process block 350 so that the deposition process does not affect certain components or portions of components. PVD process techniques may include sputtering. As a result of the PVD process, the EMI shield may be electrically coupled to the ground plane 221 of the substrate 220. In examples where the EMI shield includes multiple layers, multiple rounds of PVD may be used to deposit each layer of the EMI shield. In process block 355, the EMI shield may be cured. In process block 360, the electrical functionality of the camera module including the EMI shield may be tested.

[0035] Figure 4 A camera module 400 is shown that includes an image sensor 410 and an EMI shielding layer 433 disposed on molding compounds 461 and 462 of the camera module 400 in accordance with aspects of the present disclosure.

[0036] The wiring substrate 420 includes a ground plane 421 (e.g., copper) coupled between a first side 451 of the wiring substrate 420 and a second side 452 of the wiring substrate 420. The image sensor 410 is configured to receive incident light 499 and is electrically coupled to the first side 451 of the wiring substrate 420. In the example shown, the image sensor 410 is electrically coupled to the first side 451 of the wiring substrate 420 through solder balls 413. The image sensor 410 may include a complementary metal oxide semiconductor (CMOS) image sensor in a wafer level package (WLP). The image sensor 410 may include an array of CMOS imaging pixels arranged in rows and columns, which is configured to capture a digital image.

[0037] The electrical components are shown as SMT components 270 supported by molding compound 462. The electrical components can be passive (e.g., resistors, inductors, capacitors) or active (e.g., transistors). The electrical components can be electrically coupled to image sensor 410 to support the functionality of image sensor 410. For example, capacitors can help suppress noise from the power rails provided to image sensor 410. Figure 4 In the illustration of FIG. 4 , the molding material 461 / 462 supports the image sensor 410 and the electrical components. The top molding material 461 can surround the image sensor 410 to fix and protect the image sensor 410. Generally, as shown in FIG. Figure 4 As shown, top molding compound 461 may overhang a small portion of image sensor 410 to help secure image sensor 410 to wiring substrate 420 and camera module 400. Molding compound 462 may surround and / or encapsulate electrical components to protect them from the environment and / or add mechanical support. Molding compound 461 / 462 may be an electrical insulator.

[0038] The camera module 400 includes an EMI shielding layer 433 disposed on the molding material 461 / 462. The EMI shielding layer 433 is coupled to the ground plane of the wiring substrate 420. The EMI shielding layer 433 is disposed on the molding material 461 / 462 on the first side 451 and the second side 452 of the wiring substrate 420. The EMI shielding layer 433 includes a metal. The metal may include copper or stainless steel, or both copper and stainless steel.

[0039] In some embodiments, EMI shielding layer 433 includes multiple layers. Figure 7An example EMI shielding layer 733 is shown that can be used as EMI shielding layer 433 according to aspects of the present disclosure. In one embodiment, EMI shielding layer 433 includes a first metal adhesion layer configured to adhere to the molding compound, a second metal shielding layer configured to shield camera module 400 from electromagnetic interference, and a third metal protective layer configured to shield EMI shielding layer 433 from the environment of camera module 400. The second metal shielding layer can be copper, and the first metal adhesion layer and the third metal protective layer can be stainless steel. The second metal shielding layer can be about 0.05 microns, and the first metal adhesion layer and the third metal protective layer can be stainless steel with a thickness of about 0.03 microns.

[0040] exist Figure 4 In the embodiment, the EMI shielding layer 433 is electrically coupled to the ground plane of the wiring substrate 420 through a through hole 437 extending through the molding compound 462. At least a portion of the through hole 437 is disposed between the electrical components 270 on the second side 452 of the wiring substrate 420.

[0041] The via 437 can be created by laser drilling through the molding compound 462 along the example laser drilling path 435 to the ground plane 421 of the wiring substrate 420. The via 437 can be "plated-up" using nickel and / or gold plating techniques to provide electrical contact between the EMI shielding layer 433 and the ground plane 421. In some embodiments, the diameter of the via 437 is about 20 microns. In some embodiments, the via 437 is filled with a metal (e.g., stainless steel and / or copper) during a PVD process, and the vapor deposition of the metal within the via 437 provides electrical contact between the ground plane 421 and the EMI shielding layer 433.

[0042] Figure 5 An example process 500 of manufacturing a camera module according to aspects of the present disclosure is shown. Figure 5 The order of some or all of the process blocks in the process blocks that appear in the description should not be considered as limiting. Instead, those of ordinary skill in the art who benefit from the present disclosure will understand that some of the process blocks in the process blocks can be executed in various orders not shown, or even in parallel. Figure 5 Laser drilled vias are shown to connect the EMI shield to the ground plane through the molding compound.

[0043] In process block 505, surface mount technology (SMT) passive components are provided. For example, component 270 may be an SMT passive component. In process block 510, the bottom of the structure is reflowed to electrically couple the SMT passive component to the second side 452 of the wiring substrate 420. In process block 515, a molding compound 462 may be formed.

[0044] In process block 520, SMT components (including sensor 410) may be provided. In process block 525, the top of the structure is reflowed to electrically couple the SMT components provided in process block 520 to the first side 451 of the wiring substrate 420. In process block 530, molding compound 461 may be formed.

[0045] In process block 535, a laser may be used to drill a through hole 437 in the molding compound 462. Multiple through holes may be laser drilled along a laser drilling path such as the example laser drilling path 435. The laser drilling path may be orthogonal to the wiring substrate 420. Process block 540 shows that the laser drilled through hole may also be optionally drilled through the top molding compound 461.

[0046] In process block 545 , a laser may be used to singulate a camera module (eg, camera module 400 ) from other camera modules that share a common substrate.

[0047] In process block 550, one or more layers of EMI shield may be deposited on the bottom of the camera module (e.g., the same as side 452) using physical vapor deposition (PVD) techniques. PVD process techniques may include sputtering. In some embodiments, the PVD process also deposits metal into the laser drilled holes to create vias that ultimately connect the ground plane 421 to the EMI shielding layer 433. In examples where the EMI shield includes multiple layers, multiple rounds of PVD may be used to deposit each layer of the EMI shield. In process block 550, the metal plating and EMI shield deposits of the vias (e.g., via 437) may also be cured.

[0048] In process block 555, one or more layers of EMI shield may be deposited on the top of the camera module (e.g., the same as side 451) using physical vapor deposition (PVD) techniques. The image sensor 410 and other components on the top of the camera module may be masked prior to process block 555 so that the deposition process does not affect certain components or portions of components. PVD process techniques may include sputtering. As a result of the PVD process, the EMI shield may be electrically coupled to the ground plane 421 of the substrate 420. In examples where the EMI shield includes multiple layers, multiple rounds of PVD may be used to deposit each layer of the EMI shield. In process block 560, the electrical functionality of the camera module including the EMI shield may be tested.

[0049] Figure 6A camera module 600 is shown according to aspects of the present disclosure, the camera module including an EMI shielding layer 633 coupled to a bonded via array (BVA) 639. A wiring substrate 620 includes a ground plane 621 (e.g., copper) coupled between a first side 651 of the wiring substrate 620 and a second side 652 of the wiring substrate 620. An image sensor 610 is configured to receive incident light 699 and is electrically coupled to the first side 651 of the wiring substrate 620. In the example shown, the image sensor 610 is electrically coupled to the first side 651 of the wiring substrate 620 through solder balls 613. The image sensor 610 may include a complementary metal oxide semiconductor (CMOS) image sensor in a wafer level package (WLP). The image sensor 610 may include an array of CMOS imaging pixels arranged in rows and columns, the array of CMOS imaging pixels being configured to capture a digital image.

[0050] The electrical components are shown as surface mount technology (SMT) components 270 supported by molding compound 662. The electrical components can be passive (e.g., resistors, inductors, capacitors) or active (e.g., transistors). The electrical components can be electrically coupled to image sensor 610 to support the functionality of image sensor 610. Figure 6 In the illustration of FIG. 6 , the molding material 661 / 662 supports the image sensor 610 and the electrical component 270. The top molding material 661 can surround the image sensor 610 to fix and protect the image sensor 610. Figure 6 As shown, molding compound 661 can overhang a small portion of image sensor 610 to help secure image sensor 610 to wiring substrate 620 and camera module 600. Molding compound 662 can surround and / or encapsulate electrical components to protect them from the environment and / or add mechanical support. Molding compound 661 / 662 can be an electrical insulator.

[0051] The camera module 600 includes an EMI shielding layer 633 disposed on the molding material 661 / 662. The EMI shielding layer 633 is coupled to the ground plane of the wiring substrate 620. The EMI shielding layer 633 is disposed on the molding material 661 / 662 on the first side 651 and the second side 652 of the wiring substrate 620. The EMI shielding layer 633 includes a metal. The metal may include copper or stainless steel, or both copper and stainless steel.

[0052] In some embodiments, EMI shielding layer 633 includes multiple layers. Figure 7An example EMI shielding layer 733 is shown that can be used as the EMI shielding layer 633 according to aspects of the present disclosure. In one embodiment, the EMI shielding layer 633 includes a first metal adhesion layer configured to adhere to the molding compound, a second metal shielding layer configured to shield the camera module 600 from electromagnetic interference, and a third metal protective layer configured to shield the EMI shielding layer 633 from the environment of the camera module 600. The second metal shielding layer can be copper, and the first metal adhesion layer and the third metal protective layer can be stainless steel. The second metal shielding layer can be about 0.05 microns, and the first metal adhesion layer and the third metal protective layer can be stainless steel with a thickness of about 0.03 microns.

[0053] exist Figure 6 In the embodiment of the present invention, the EMI shielding layer 633 is electrically coupled to the ground plane of the wiring substrate 620 through a bonded via array (BVA) 639 extending through the molding compound 662. At least a portion of the BVA 639 is disposed between the electrical components 270 on the second side 652 of the wiring substrate 620. The BVA 639 may be orthogonal to the wiring substrate 620. The BVA 639 is electrically connected to the ground plane 621 of the wiring substrate 620. The BVA 639 may be manufactured using a wire bonding machine that inserts a wire (e.g., copper or gold) into a through hole already formed in a printed circuit board. The wiring substrate 620 may be implemented as a printed circuit board including a through hole in which the BVA may be inserted. The BVA technology is used for chip stacking solutions, such as stacking a processor chip to a memory chip. For example, the pitch of the wires in the array may be 0.2 mm to 0.4 mm, with a wire diameter of 0.025 mm to 0.05 mm. For example, the length of the wires of BVA 639 protruding above wiring substrate 620 may be about 0.3 mm to 0.8 mm. The wires of BVA 639 are electrically coupled to ground plane 621 and EMI shielding layer 633 of wiring substrate 620. The wires of BVA 639 also draw heat from ground plane 621.

[0054] Figure 8 An example process 800 for manufacturing a camera module using a BVA is shown in accordance with aspects of the present disclosure. Figure 8 The order of some or all of the process blocks in the process blocks that appear in the description should not be considered as limiting. Instead, those of ordinary skill in the art who benefit from the present disclosure will understand that some of the process blocks in the process blocks can be executed in various orders not shown, or even in parallel. Figure 8A BVA is shown used with a wiring substrate to connect an EMI shield to a ground plane through a molding compound. The metal of the EMI shield is connected to the top of the wires of the BVA to electrically couple the EMI shield to the ground plane. The wires of the BVA can extend from the molding compound to be exposed for deposition of the metal of the EMI shield.

[0055] In process block 805, surface mount technology (SMT) passive components are provided. For example, component 270 may be an SMT passive component. In process block 810, the bottom of the structure is reflowed to electrically couple the SMT passive component to the second side 652 of the wiring substrate 620. In process block 815, a BVA is formed on the second side 652 of the wiring substrate 620. In process block 820, a molding compound 662 may be formed on the second side 652.

[0056] In process block 825, SMT components (including sensor 610) may be provided. In process block 830, the top of the structure is reflowed to electrically couple the SMT components provided in process block 825 to the first side 651 of the wiring substrate 620. In process block 835, a BVA may be formed on the first side 651 of the wiring substrate 620. In process block 840, a molding compound 661 may be formed on the first side 651.

[0057] In process block 845 , a laser may be used to singulate a camera module (eg, camera module 600 ) from other camera modules that share a common substrate.

[0058] In process block 850, one or more layers of the EMI shield may be deposited on the bottom (e.g., same as side 652) of the camera module using physical vapor deposition (PVD) techniques. The PVD process techniques may include sputtering. In examples where the EMI shield includes multiple layers, multiple rounds of PVD may be used to deposit each layer of the EMI shield. In process block 855, the EMI shield may be cured.

[0059] In process block 860, one or more layers of EMI shielding may be deposited on the top of the camera module (e.g., the same as side 651) using physical vapor deposition (PVD) techniques. The image sensor 610 and other components on the top of the camera module may be masked prior to process block 860 so that the deposition process does not affect certain components or portions of components. PVD process techniques may include sputtering. As a result of the PVD process, the EMI shield may be electrically coupled to the ground plane 621 of the wiring substrate 620. In examples where the EMI shield includes multiple layers, multiple rounds of PVD may be used to deposit each layer of the EMI shield. In process block 865, the EMI shield may be cured. In process block 870, the electrical functionality of the camera module including the EMI shield may be tested.

[0060] Fig. 9 A flow chart of an example process 900 for manufacturing a camera module with an EMI shield according to aspects of the present disclosure is shown. The order in which some or all of these process blocks appear in process 900 should not be considered limiting. Rather, one of ordinary skill in the art having the benefit of the present disclosure will appreciate that some of these process blocks may be performed in various orders not shown, or even in parallel.

[0061] In process block 905 , an image sensor is electrically coupled to a first side of a wiring substrate having a ground plane disposed between the first side and a second side of the wiring substrate.

[0062] In process block 910, an electromagnetic interference (EMI) shielding layer is deposited on a molding compound that supports the image sensor and electrical components electrically coupled to a second side of the wiring layer. Depositing the EMI shielding layer electrically couples the EMI shielding layer to a ground plane of the wiring substrate. The EMI shield may contact the molding compound.

[0063] Some embodiments of process 900 also include singulating the camera module from other camera modules disposed on a common wiring substrate. The singulation exposes a ground plane of the wiring substrate at an end of the wiring substrate so that the EMI shielding layer can be electrically coupled to the ground plane of the wiring substrate. The singulation can be caused by a laser singulation technique.

[0064] Some embodiments of process 900 include forming through holes in the molding compound before depositing the EMI shielding layer, wherein the through holes extend through the molding compound to the ground plane of the wiring substrate. The through holes can be laser drilled through holes. The deposited EMI shielding layer can fill the through holes to electrically couple the EMI shielding layer to the ground plane. In an embodiment, the through holes are plated with electrical conductors before depositing the EMI shielding layer, and the electrical conductors filling the through holes electrically couple the EMI shielding layer to the ground plane of the wiring substrate.

[0065] In an embodiment of process 900, depositing the EMI shielding layer in process box 910 includes: (1) depositing the EMI shielding layer to cover a molding compound that supports electrical components coupled to a second side of a wiring substrate; (2) curing the EMI shielding layer of the molding compound that covers the supporting electrical components; and (3) after curing the EMI shielding layer of the molding compound that covers the supporting electrical components, depositing the EMI shielding layer to cover the molding compound that supports an image sensor on a first side of the wiring substrate.

[0066] Some embodiments of process 900 include forming a bonded via array (BVA) by inserting wires into through holes of a wiring substrate before depositing the EMI shielding layer, wherein the through holes are electrically connected to a ground plane of the wiring substrate, and depositing the EMI shielding layer to electrically couple the EMI shielding layer to the BVA.

[0067] Embodiments of the present disclosure can significantly reduce the size of the camera module while also reducing the cost of using a dedicated EMI cover portion. The disclosed deposited EMI shielding layer can also increase heat dissipation of the image sensor and corresponding electrical components because the deposited EMI shielding layer 233 / 433 / 633 eliminates the air gap between these parts and the EMI cover. Figure 4 The drilled vias in may also provide additional heat sinking for heat transferred from the image sensor (via solder balls 413 ) to the ground plane because the drilled vias may extract heat from the ground plane 421 to the EMI shielding layer 433 . Figure 6 The conductors of BVA 639 in the image sensor can also provide additional heat dissipation for heat transferred from the image sensor (via solder balls 613) to the ground plane because the conductors can extract heat from the ground plane to the EMI shield 633. Improved heat dissipation also improves the image quality of image signals captured by the image pixel array in the image sensor.

[0068] Embodiments of the present invention may include an artificial reality system or be implemented in conjunction with an artificial reality system. Artificial reality is a form of reality that has been adjusted in some way before being presented to a user, and the form of reality may include, for example, virtual reality (VR), augmented reality (AR), mixed reality (MR), hybrid reality, or some combination and / or derivative thereof. Artificial reality content may include fully generated content or generated content combined with collected (e.g., real-world) content. Artificial reality content may include video, audio, tactile feedback, or some combination thereof, and any of the video, audio, tactile feedback, or some combination thereof may be presented in a single channel or in multiple channels (such as stereoscopic video that produces a three-dimensional effect to the audience). In addition, in some embodiments, artificial reality may also be associated with applications, products, accessories, services, or some combination thereof, which are used, for example, to create content in artificial reality and / or otherwise used in artificial reality (e.g., to perform activities in artificial reality). Artificial reality systems that provide artificial reality content can be implemented on a variety of platforms, including a head-mounted display (HMD) connected to a host computer system, a stand-alone HMD, a mobile device or computing system, or any other hardware platform capable of providing artificial reality content to one or more viewers.

[0069] The term "processing logic" in the present disclosure may include one or more processors, one or more microprocessors, one or more multi-core processors, one or more application-specific integrated circuits (ASICs), and / or field programmable gate arrays (FPGAs) that perform the operations disclosed herein. In some embodiments, a memory (not shown) is integrated into the processing logic to store instructions for performing operations and / or storing data. According to an embodiment of the present disclosure, the processing logic may also include analog circuits or digital circuits for performing operations.

[0070] The "memory" or "memory" described in the present disclosure may include one or more volatile or non-volatile memory architectures. The "memory" or "memory" may be removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules or other data). Example memory technologies may include random access memory (RAM), read-only memory (ROM), EEPROM, flash memory, CD-ROM, digital versatile disk (DVD), high-definition multimedia / data storage disk or other optical storage, magnetic cassette, magnetic tape, magnetic disk storage device or other magnetic storage device, or any other non-transmission medium that can be used to store information for access by a computing device.

[0071] The network may include any network or network system, such as but not limited to the following: peer-to-peer networks; Local Area Network (LAN); Wide Area Network (WAN); public networks (such as the Internet); private networks; cellular networks; wireless networks; wired networks; combined wireless and wired networks; and satellite networks.

[0072] The communication channel may include or be routed through one or more wired or wireless communications using the following: IEEE 802.11 protocol, short-range wireless protocol, Serial Peripheral Interface (SPI), Inter-Integrated Circuit (IC), or a combination of the following: 2 C), Universal Serial Port (USB), Controller Area Network (CAN), cellular data protocol (e.g., 3G, 4G, Long Term Evolution (LTE), 5G), optical communication network, Internet Service Provider (ISP), peer-to-peer network, local area network (LAN), wide area network (WAN), public network (e.g., "Internet"), private network, satellite network, or other network.

[0073] The computing device may include a desktop computer, a laptop computer, a tablet computer, a phablet, a smartphone, a feature phone, a server computer, or other device. The server computer may be located at a remote location relative to a data center, or may be stored locally.

[0074] The processes explained above are described in terms of computer software and hardware. The described techniques may constitute machine-executable instructions embodied in a tangible or non-transitory machine (e.g., computer) readable storage medium, which, when executed by a machine, will cause the machine to perform the described operations. In addition, these processes may be embodied in hardware (e.g., an application specific integrated circuit ("ASIC") or other hardware).

[0075] Tangible, non-transitory machine-readable storage media include any mechanism that provides (i.e., stores) information in a form accessible to a machine (e.g., a computer, a network device, a personal digital assistant, a manufacturing tool, any device having a set of one or more processors, etc.). For example, machine-readable storage media include recordable / non-recordable media (e.g., read-only memory (ROM), random access memory (RAM), magnetic disk storage media, optical storage media, flash memory devices, etc.).

[0076] The above description of the illustrated embodiments of the present invention (including what is described in the Abstract) is not intended to be exhaustive or to limit the present invention to the precise forms disclosed. Although specific embodiments and examples of the present invention are described herein for illustrative purposes, various modifications within the scope of the present invention are possible as will be appreciated by those skilled in the relevant art.

[0077] These modifications can be made to the present invention in light of the above detailed description. The terms used in the appended claims should not be interpreted as limiting the present invention to the specific embodiments disclosed in the specification. Rather, the scope of the present invention will be determined entirely by the appended claims, which will be interpreted in accordance with established principles of claim interpretation.

Claims

1. A camera module, comprising: a wiring substrate having a ground plane coupled between a first side of the wiring substrate and a second side of the wiring substrate; an image sensor configured to receive incident image light, wherein the image sensor is electrically coupled to the first side of the wiring substrate; an electrical component electrically coupled to the second side of the wiring substrate; a molding compound that supports the image sensor and supports the electrical component; and An electromagnetic interference (EMI) shielding layer is disposed on the molding compound, wherein the EMI shielding layer is coupled to the ground plane of the wiring substrate.

2. The camera module according to claim 1, wherein: The EMI shielding layer includes metal.

3. The camera module according to claim 1, wherein: The EMI shielding layer includes at least one of copper or stainless steel.

4. The camera module according to claim 1, wherein: The EMI shielding layer comprises: a first metal adhesion layer configured to adhere to the molding compound; a second metal shielding layer configured to shield the camera module from electromagnetic interference; and A third metal protection layer is configured to shield the EMI shielding layer from an environment of the camera module.

5. The camera module according to claim 1, wherein: The ground plane of the wiring substrate is exposed on an end of the wiring substrate, and wherein the EMI shielding layer is electrically coupled to the ground plane on the end of the wiring substrate.

6. The camera module according to claim 1, wherein: The ground plane of the wiring substrate is electrically isolated on an end of the wiring substrate, and wherein the EMI shielding layer is electrically coupled to the ground plane through a solder resist layer on the second side of the wiring substrate.

7. The camera module according to claim 1, further comprising: A via extends through the molding compound, wherein the via electrically couples the ground plane to the EMI shielding layer.

8. The camera module according to claim 7, wherein: At least a portion of the through-hole is provided between the electrical components on the second side of the wiring substrate.

9. The camera module according to claim 1, further comprising: A conductive line extends through a bonding via array (BVA) of the molding compound, wherein the conductive line electrically couples the ground plane to the EMI shielding layer.

10. The camera module according to claim 9, wherein: At least a portion of the conductive lines of the BVA are disposed between the electrical components on the second side of the wiring substrate, and wherein the wiring substrate includes a through hole extending to the ground plane to support the BVA, and the conductive lines of the BVA are inserted into and electrically coupled to the through hole of the wiring substrate.

11. A method for manufacturing a camera module, the method comprising: electrically coupling an image sensor to a first side of a wiring substrate having a ground plane disposed between the first side and a second side of the wiring substrate; as well as depositing an electromagnetic interference (EMI) shielding layer on a molding compound that supports the image sensor and electrical components electrically coupled to a second side of the wiring layer, Wherein, depositing the EMI shielding layer electrically couples the EMI shielding layer to the ground plane of the wiring substrate.

12. The method according to claim 11, further comprising: The camera module is segmented from other camera modules disposed on a common wiring substrate, wherein the segmentation exposes the ground plane of the wiring substrate at an end of the wiring substrate so that the EMI shielding layer can be electrically connected to the ground plane of the wiring substrate.

13. The method according to claim 12, wherein: The segmentation is effected by means of a laser segmentation technique.

14. The method according to claim 11, further comprising: A via is formed in the molding compound prior to depositing the EMI shielding layer, wherein the via extends through the molding compound to the ground plane of the wiring substrate.

15. The method according to claim 14, wherein: The through-holes are laser drilled through-holes.

16. The method according to claim 14, wherein: The EMI shielding layer is deposited to fill the via to electrically couple the EMI shielding layer to the ground plane.

17. The method according to claim 14, wherein: The through-holes are plated with electrical conductors prior to depositing the EMI shielding layer, wherein the electrical conductors filling the through-holes electrically couple the EMI shielding layer to the ground plane of the wiring substrate.

18. The method according to claim 11, wherein: Depositing the EMI shielding layer includes: depositing the EMI shielding layer to cover the molding compound supporting the electrical component coupled to the second side of the wiring substrate; curing the EMI shielding layer covering the molding compound supporting the electrical component; and After curing the EMI shielding layer covering the molding compound supporting the electrical component, the EMI shielding layer is deposited to cover the molding compound supporting the image sensor on the first side of the wiring substrate.

19. The method according to claim 11, further comprising: Prior to depositing the EMI shielding layer, a bonded via array (BVA) is formed by inserting wires into vias of the wiring substrate, wherein the vias are electrically connected to the ground plane of the wiring substrate, and wherein depositing the EMI shielding layer electrically couples the EMI shielding layer to the BVA.

20. The method according to claim 11, wherein: The EMI shielding layer contacts the molding compound.

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