Freezing centrifugal rotor structure and centrifugal machine thereof

Abstract

The invention relates to the technical field of refrigerated centrifugal rotor structures, in particular to a refrigerated centrifugal rotor structure and a centrifugal machine thereof, the refrigerated centrifugal rotor structure comprises a rotating shaft, the rotating shaft is sequentially provided with a rotor, a semiconductor chilling plate, a first heat dissipation mechanism and a second heat dissipation mechanism, and the rotor is provided with a placing hole for placing an experimental reagent. The cold end of the semiconductor chilling plate is located at the end, close to the rotor, of the rotating shaft, the hot end of the semiconductor chilling plate is located at the end, away from the rotor, of the rotating shaft, and the semiconductor chilling plate is connected with an external power source. Meanwhile, the hot end of the semiconductor chilling plate conducts heat and dissipates heat through the first heat dissipation mechanism and is matched with the second heat dissipation mechanism to form wind for heat dissipation, the heat dissipation efficiency of the first heat dissipation mechanism is improved, the temperature of the experimental reagent on the rotor is prevented from being too high, the whole rotor is simple in structure and small in size, the occupied space is small, and the production cost and the size are reduced.

Description

Technical Field

[0001] The invention relates to the technical field of refrigerated centrifugal rotor structures, in particular to a refrigerated centrifugal rotor structure and a centrifuge thereof. Background Art

[0002] Centrifuges are often used in laboratories to conduct sample separation experiments. Centrifuges use the strong centrifugal force generated by the high-speed rotation of the centrifuge rotor to accelerate the sedimentation rate of particles in the liquid and separate substances with different sedimentation coefficients and buoyancy densities in the sample. The rotor of the centrifuge is mainly suitable for test tubes with specifications of 2ml / 1.5ml. There are 24 placement holes for test tubes evenly distributed on the rotor. Due to the extremely high speed of the centrifuge, its speed can reach 20,000 rpm. The high speed causes the experimental reagents to generate heat when rotating. Therefore, the centrifuge has high requirements for the temperature control of the centrifugal chamber during use. In order to avoid the serious consequences such as changes in the composition of the experimental reagents in the centrifugal chamber and deterioration of the drugs, it is necessary to control the temperature changes of the centrifugal chamber in a timely, accurate and stable manner. The refrigeration control part of the current refrigerated centrifuge is realized by the refrigeration solution provided by the compressor. The power consumption of the compressor refrigeration is high, and the structural design of its refrigeration unit is complex, large in size and occupies a large space, which adds a very large cost to the entire centrifuge production and manufacturing, and also increases the volume of the centrifuge. Summary of the invention

[0003] The technical problem to be solved by the present invention is: in order to solve the problem that the refrigeration control part of the existing refrigerated centrifuge is realized by providing a refrigeration solution with a compressor, the power consumption of the compressor refrigeration is high, and the structural design of the refrigeration unit is complex, the volume is large and the space occupied is large, which adds a very large cost to the production and manufacturing of the entire centrifuge, and also increases the volume of the centrifuge. A refrigerated centrifuge rotor structure and a centrifuge thereof are now provided.

[0004] The technical solution adopted by the present invention to solve its technical problems is: a refrigerated centrifugal rotor structure, including a rotating shaft, a rotor, a semiconductor cooling sheet, a first heat dissipation mechanism and a second heat dissipation mechanism are sequentially arranged on the rotating shaft, a placement hole for placing experimental reagents is arranged on the rotor, the cold end of the semiconductor cooling sheet is located at the end of the rotating shaft close to the rotor, the hot end of the semiconductor cooling sheet is located at the end of the rotating shaft away from the rotor, the semiconductor cooling sheet is connected to an external power supply, the first heat dissipation mechanism contacts the hot end of the semiconductor cooling sheet for heat conduction, the second heat dissipation mechanism is used to form wind for heat dissipation, and a driving mechanism for driving the rotating shaft to rotate is arranged at the end of the rotating shaft away from the rotor. Compared with the prior art, the present solution arranges a semiconductor cooling sheet on the rotating shaft, the cold end of the semiconductor cooling sheet cools the rotor, and the hot end of the semiconductor cooling sheet conducts heat and dissipates heat through the first heat dissipation mechanism, and cooperates with the second heat dissipation mechanism to form wind for heat dissipation, thereby improving the heat dissipation efficiency of the first heat dissipation mechanism, preventing the temperature of the experimental reagent on the rotor from being too high, and the entire rotor structure is simple, small in size and occupies little space, thereby reducing the production cost and volume of the centrifuge.

[0005] In order to realize one embodiment of connecting the semiconductor cooling plate to an external power source, preferably some embodiments, a first commutator is provided on the end of the rotating shaft away from the driving mechanism, the first commutator is connected to the external first electrode through a brush, and the first commutator and the semiconductor cooling plate are connected through a first wire. The first commutator at the end of the rotating shaft close to the rotor is connected to the external first electrode through a brush, and the semiconductor cooling plate and the first commutator are connected through a first guide, so that the semiconductor cooling plate is still connected to the external power source and can perform cooling when the rotating shaft rotates.

[0006] In order to facilitate the connection of the first wire between the first commutator and the semiconductor refrigeration plate, in some preferred embodiments, a first through hole is opened in the rotating shaft along its axial direction, one end of the first through hole is located at the rotating shaft close to the first commutator, and the other end of the first through hole is located at the rotating shaft close to the semiconductor refrigeration plate, and the first wire is arranged in the first through hole.

[0007] In order to protect the first commutator and install the brush, in some preferred embodiments, a first protective cover is installed on the rotating shaft, and the first protective cover is arranged on the first commutator. The first protective cover plays a role in protecting the first commutator, and the brush can be installed on the first protective cover, which is also convenient for the installation of the brush.

[0008] In order to realize another embodiment of connecting the semiconductor cooling plate to the external power supply, preferably some embodiments, a second commutator is provided on the end of the rotating shaft away from the driving mechanism, the second commutator is connected to the external second electrode through a brush, and the second commutator and the semiconductor cooling plate are connected through a second wire. The second commutator at the end of the rotating shaft close to the rotor is connected to the external second electrode through a brush, and the semiconductor cooling plate and the second commutator are connected through a second guide, so that the semiconductor cooling plate is still connected to the external power supply and can perform cooling when the rotating shaft rotates.

[0009] In order to facilitate the connection of the second wire between the second commutator and the semiconductor refrigeration plate, in some preferred embodiments, a second through hole is opened in the rotating shaft along its axial direction, one end of the second through hole is located at the rotating shaft close to the second commutator, and the other end of the second through hole is located at the rotating shaft close to the semiconductor refrigeration plate, and the second wire is arranged in the second through hole.

[0010] In order to protect the second commutator, in some preferred embodiments, a second protective cover is installed on the shaft, and the second protective cover is arranged on the second commutator. The first protective cover protects the first commutator, and the brush can be installed on the first protective cover, which is also convenient for the installation of the brush.

[0011] In order to realize the first heat dissipation mechanism, in some preferred embodiments, the first heat dissipation mechanism is a metal heat sink.

[0012] In order to realize the second heat dissipation mechanism, in some preferred embodiments, the second heat dissipation mechanism is a heat dissipation fan.

[0013] A centrifuge is provided with the above-mentioned refrigerated centrifugal rotor structure.

[0014] The beneficial effects of the present invention are as follows: when a refrigerated centrifugal rotor structure and a centrifuge thereof are used, a semiconductor refrigeration sheet is arranged on the rotating shaft, and the cold end of the semiconductor refrigeration sheet cools the rotor. At the same time, the hot end of the semiconductor refrigeration sheet conducts heat and dissipates heat through the first heat dissipation mechanism, and cooperates with the second heat dissipation mechanism to form wind for heat dissipation, thereby improving the heat dissipation efficiency of the first heat dissipation mechanism and preventing the temperature of the experimental reagent on the rotor from being too high. The entire rotor structure is simple, small in size and occupies little space, which reduces the production cost and volume of the centrifuge, avoids the refrigeration control part of the existing refrigerated centrifuge, and is realized by providing a refrigeration solution with a compressor. The power consumption of the compressor refrigeration is high, and the structural design of its refrigeration unit is complex, large in size and occupies a large space, which adds a very large cost to the production and manufacturing of the entire centrifuge, and also increases the volume of the centrifuge. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0016] Figure 1 It is a structural schematic diagram of Example 1 of the present invention;

[0017] Figure 2 is an exploded view of Example 1 of the present invention;

[0018] Figure 3 is an exploded view of Example 2 of the present invention;

[0019] Figure 4 is a schematic diagram of the three-dimensional structure of Example 3 of the present invention;

[0020] Figure 5 is a top view of Example 3 of the present invention;

[0021] Figure 6 yes Figure 5 Middle AA section view.

[0022] In the figure: 1, shaft, 2, rotor, 3, semiconductor refrigeration plate, 4, first heat dissipation mechanism, 5, second heat dissipation mechanism, 6, placement hole, 7, driving mechanism, 8, first commutator, 9, brush, 10, first protective cover, 11, second commutator, 12, second protective cover. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below in conjunction with embodiments:

[0024] The present invention is not limited to the following specific embodiments. A person skilled in the art can implement the present invention in various other specific embodiments according to the contents disclosed in the present invention, or any simple changes or modifications made to the design structure and ideas of the present invention fall within the protection scope of the present invention. It should be noted that the embodiments and features in the embodiments of the present invention can be combined with each other without conflict.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0027] Example 1

[0028] like Figure 1 and 2 As shown, a refrigerated centrifugal rotor structure includes a rotating shaft 1, on which a rotor 2, a semiconductor cooling sheet 3, a first heat dissipation mechanism 4 and a second heat dissipation mechanism 5 are fixedly mounted in sequence, a placement hole 6 for placing experimental reagents is provided on the rotor 2, the cold end of the semiconductor cooling sheet 3 is located at the end of the rotating shaft 1 close to the rotor 2, the cold end of the semiconductor cooling sheet 3 contacts the bottom of the rotating shaft 1, the hot end of the semiconductor cooling sheet 3 is located at the end of the rotating shaft 1 away from the rotor 2, the semiconductor cooling sheet 3 is connected to an external power supply, the first heat dissipation mechanism 4 contacts the hot end of the semiconductor cooling sheet 3 for heat conduction, the second heat dissipation mechanism 5 is used to form wind for heat dissipation, and a driving mechanism 7 for driving the rotating shaft 1 to rotate is provided at the end of the rotating shaft 1 away from the rotor 2. In this embodiment, the driving mechanism 7 is a motor.

[0029] A first commutator 8 is arranged on the end of the rotating shaft 1 away from the driving mechanism 7. The first commutator 8 is connected to the external first electrode through a brush 9. The first commutator 8 is connected to the semiconductor cooling plate 3 through a first wire. A first through hole is opened in the rotating shaft 1 along its axial direction. One end of the first through hole is located at the rotating shaft 1 close to the first commutator 8, and the other end of the first through hole is located at the rotating shaft 1 close to the semiconductor cooling plate 3. The first wire is arranged in the first through hole. A first protective cover 10 is installed on the rotating shaft 1, and the first protective cover 10 is arranged on the first commutator 8.

[0030] In this embodiment, the first heat dissipation mechanism 4 is a metal heat sink made of copper, which has good heat dissipation properties. The first heat dissipation mechanism 4 is mainly used to dissipate the heat of the hot end of the semiconductor refrigeration plate 3 in time. The second heat dissipation mechanism 5 is a heat dissipation fan. The rotation of the second heat dissipation mechanism 5 is mainly to accelerate the air flow rate by forming wind, so that the air flows and dissipates the heat emitted by the first heat dissipation mechanism 4.

[0031] Example 2

[0032] Embodiment 2 is another way of connecting the semiconductor cooling plate 3 and the external power supply in Embodiment 1, specifically: Figure 3As shown, a second commutator 11 is provided on the end of the rotating shaft 1 away from the driving mechanism 7. The second commutator 11 is connected to the external second electrode through the brush 9. The second commutator 11 is connected to the semiconductor cooling plate 3 through a second wire.

[0033] A second through hole is opened in the rotating shaft 1 along its axial direction, one end of the second through hole is located on the rotating shaft 1 close to the second commutator 11, and the other end of the second through hole is located on the rotating shaft 1 close to the semiconductor cooling plate 3, the second wire is arranged in the second through hole, and a second protective cover 12 is installed on the rotating shaft 1, and the second protective cover 12 is arranged on the second commutator 11.

[0034] Example 3

[0035] Embodiment 3 is the application of Embodiment 1 and Embodiment 2, specifically: Figure 4 , 5 As shown in Figure 6, a centrifuge includes an outer shell, in which the above-mentioned refrigerated centrifugal rotor structure is installed.

[0036] When the above-mentioned refrigerated centrifugal rotor structure and the centrifuge thereof are in use, the experimental reagent is placed in the placement hole 6 on the rotor 2, the motor at the driving mechanism 7 is started and drives the shaft 1 to rotate, and the rotor 2, the semiconductor cooling plate 3, the first heat dissipation mechanism 4 and the second heat dissipation mechanism 5 on the shaft 1 rotate accordingly, and the external power supply is connected to the two brushes 9 through the positive and negative electrodes, and then the brushes 9 contact the commutator, and the commutator is connected to the semiconductor cooling plate 3 through a wire to achieve communication between the power supply and the semiconductor cooling plate 3. At this time, the cold end of the semiconductor cooling plate 3 is refrigerated to cool the rotor 2. At the same time, the hot end of the semiconductor cooling plate 3 transfers the second to the second heat dissipation mechanism 5 through the heat conduction of the first heat dissipation mechanism 4. The second heat dissipation mechanism 5 generates air flow when the shaft 1 rotates, and convects the hot air and the cold air to achieve the effect of heat dissipation and cooling.

[0037] The above-mentioned ideal embodiments of the present invention are for inspiration. Through the above-mentioned description, relevant staff can make various changes and modifications without departing from the technical idea of ​​the present invention. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A refrigerated centrifugal rotor structure, characterized in that: The invention comprises a rotating shaft (1), on which a rotor (2), a semiconductor cooling sheet (3), a first heat dissipation mechanism (4) and a second heat dissipation mechanism (5) are sequentially arranged, the rotor (2) is provided with a placement hole (6) for placing an experimental reagent, the cold end of the semiconductor cooling sheet (3) is located at an end of the rotating shaft (1) close to the rotor (2), the hot end of the semiconductor cooling sheet (3) is located at an end of the rotating shaft (1) away from the rotor (2), the semiconductor cooling sheet (3) is connected to an external power source, the first heat dissipation mechanism (4) contacts the hot end of the semiconductor cooling sheet (3) for heat conduction, the second heat dissipation mechanism (5) is used to form wind for heat dissipation, and the end of the rotating shaft (1) away from the rotor (2) is provided with a driving mechanism (7) for driving the rotating shaft (1) to rotate.

2. A refrigerated centrifugal rotor structure according to claim 1, characterized in that: A first commutator (8) is provided on the end of the rotating shaft (1) away from the driving mechanism (7); the first commutator (8) is connected to an external first electrode via a brush (9); and the first commutator (8) is connected to the semiconductor cooling plate (3) via a first wire.

3. A refrigerated centrifuge rotor structure according to claim 2, characterized in that: A first through hole is provided in the rotating shaft (1) along its axial direction, one end of the first through hole is located on the rotating shaft (1) close to the first commutator (8), the other end of the first through hole is located on the rotating shaft (1) close to the semiconductor cooling plate (3), and the first wire is arranged in the first through hole.

4. A refrigerated centrifugal rotor structure according to claim 3, characterized in that: A first protective cover (10) is installed on the rotating shaft (1), and the first protective cover (10) is arranged on the first commutator (8).

5. A refrigerated centrifugal rotor structure according to claim 1, characterized in that: A second commutator (11) is provided on the end of the rotating shaft (1) away from the driving mechanism (7); the second commutator (11) is connected to an external second electrode via a brush (9); and the second commutator (11) is connected to the semiconductor cooling plate (3) via a second wire.

6. A refrigerated centrifugal rotor structure according to claim 5, characterized in that: A second through hole is provided in the rotating shaft (1) along its axial direction, one end of the second through hole is located on the rotating shaft (1) close to the second commutator (11), the other end of the second through hole is located on the rotating shaft (1) close to the semiconductor cooling plate (3), and the second wire is arranged in the second through hole.

7. A refrigerated centrifugal rotor structure according to claim 6, characterized in that: A second protective cover (12) is installed on the rotating shaft (1), and the second protective cover (12) is arranged on the second commutator (11).

8. A refrigerated centrifugal rotor structure according to claim 1, characterized in that: The first heat dissipation mechanism (4) is a metal heat sink.

9. A refrigerated centrifugal rotor structure according to claim 1, characterized in that: The second heat dissipation mechanism (5) is a heat dissipation fan.

10. A centrifuge, characterized in that: A refrigerated centrifugal rotor structure as described in any one of claims 1 to 9 is installed.

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