Anti-flash substrate and manufacturing method thereof

Abstract

The invention relates to an anti-flash substrate and a manufacturing method thereof. The anti-flash substrate includes a first major surface having a textured surface with a surface roughness Ra of 0.03 microns to 0.09 microns. The anti-flash substrate is a glass-based substrate or a ceramic-based substrate. The anti-flash substrate may exhibit a haze of from 3% to 40% and a flash of from 1% to 3.8%. The method includes chemically strengthening an existing first major surface, abrading the existing first major surface to form an intermediate first major surface, and etching the intermediate first major surface to form a first major surface of the anti-flash substrate.

Description

Technical Field

[0001] The present disclosure relates generally to antiglare substrates and methods of making the same, and more particularly to antiglare substrates and methods of making the same by surface abrasion. Background Art

[0002] Glass-based substrates are commonly used, for example, in display devices, such as liquid crystal displays (LCDs), electrophoretic displays (EPDs), organic light emitting diode displays (OLEDs), plasma display panels (PDPs), or laser phosphor displays (LPDs). It is known to provide an anti-glare surface on a glass substrate. However, the interaction between the anti-glare surface and the pixel display can result in glare, which is an undesirable grainy appearance and / or appearance variation (e.g., in terms of pixel horizontal dimension specifications) in an image produced by the display device. Therefore, it is desirable to develop a display device that can reduce glare. Summary of the invention

[0003] The above observations can be combined to provide anti-glare substrates and display devices including anti-glare substrates, which can reduce their glare by providing a textured surface as part of the first major surface of the anti-glare substrate. Reducing glare by the anti-glare substrates of the present disclosure can increase the uniformity of light emitted from the display device (as perceived by an observer of the display device), and / or can increase the aesthetic appearance of the resulting display device by reducing the perceived graininess associated with glare. As demonstrated in the examples, the methods of the present disclosure can provide anti-glare substrates that exhibit 3.8% or less or 3.1% or less glare, which is not achievable by the comparative examples. As demonstrated in the examples, the methods of the present disclosure can provide anti-glare substrates that exhibit 50% or greater gloss and / or 91% or greater (e.g., 93% or greater) distinctness of image (DOI), which is not achievable by the comparative examples.

[0004] Without wishing to be bound by theory, it is believed that the properties of the textured surface of the first major surface produced by the method of the present disclosure (e.g., surface roughness Ra, height Rq, width Rsm, gradient Sdq) enable the combination of optical properties stated above to be achieved simultaneously. Although a selected group of combinations of ranges of optical properties for the anti-glare substrate are stated in this paragraph, it is to be understood that other combinations of these ranges of optical properties and / or combinations of other optical properties stated in connection with the present disclosure are also possible in other aspects. Providing the anti-glare substrate as a glass-based substrate and / or a ceramic-based substrate can increase the damage resistance of the display device.

[0005] The textured surface of the anti-glare substrate can be formed by abrading a first major surface that has been chemically strengthened and then etching. As discussed herein for methods of making an anti-glare substrate (e.g., a textured surface), the present disclosure can provide smaller peaks and / or valleys by abrading the first major surface (which is not achievable in any other manner), and the smaller peaks and / or valleys achieve the lower sparkle and other optical properties set forth herein. Although a lower median particle size of the particles produces smaller pits (e.g., pit width and / or pit depth), there are physical and commercial limits to how small the particles can be made (and how uniform such particles can be). In the absence of a chemically strengthened substrate, abrasion followed by etching produces a textured substrate with high sparkle (e.g., 4% or greater) and / or high haze (e.g., 40% or greater), which is undesirable for use in high resolution display devices. As demonstrated in the examples herein, chemically strengthening the substrate prior to abrasion of the substrate unexpectedly produces smaller pits, which can be etched to produce an anti-glare substrate according to aspects of the present disclosure having low sparkle and / or other optical properties set forth herein.

[0006] Some exemplary aspects of the present disclosure are described below, and it is to be understood that any features of the various aspects may be used alone or in combination with each other.

[0007] Aspect 1: Method for forming an anti-glare substrate:

[0008] chemically strengthening the existing first main surface;

[0009] abrading the existing first major surface to form an intermediate first major surface; and

[0010] etching the first major surface of the intermediate body to form the first major surface of the antiglare substrate,

[0011] Among them, the anti-glare substrate exhibits a haze of 3% to 40% and a glare of 1% to 3.8%.

[0012] Aspect 2: The method of Aspect 1, wherein chemical strengthening comprises exposing an existing first major surface to a molten salt solution maintained at a first temperature of 370°C to 500°C for a period of 5 minutes to 8 hours, and chemical strengthening forms an intermediate compressive stress region extending from the existing first major surface, having an intermediate maximum compressive stress of 25 MPa to 1500 MPa.

[0013] Aspect 3: The method of aspect 2, wherein the antiglare substrate comprises a compressive stress region extending from the first major surface comprising a maximum compressive stress of 25 megapascals to 1200 megapascals, the maximum compressive stress being less than the intermediate maximum compressive stress.

[0014] Aspect 4: The method of any of Aspects 1-2, wherein the first major surface of the antiglare substrate is substantially unreinforced.

[0015] Aspect 5: The method of any of Aspects 1-4, wherein abrading comprises impacting the existing first major surface with particles comprising a median particle size of 3 microns to 15 microns.

[0016] Aspect 6: The method of Aspect 5, wherein the particles are pushed at a pressure of 200 kPa to 550 kPa.

[0017] Aspect 7: The method of any of Aspects 5-6, wherein the particles are pushed from a slurry comprising 10 wt% to 30 wt% of the particles, based on 100 wt% of the slurry.

[0018] Aspect 8: The method of any one of Aspects 5-7, wherein the particles include SiC, Al 2 O 3 or a combination thereof.

[0019] Aspect 9: The method of any of Aspects 5-8, wherein etching removes a thickness of 5 microns to 100 microns from the intermediate first major surface.

[0020] Aspect 10: The method of Aspect 9, wherein etching removes a thickness of 9 microns to 40 microns from the intermediate first major surface.

[0021] Aspect 11: The method of any of Aspects 1-10, wherein etching comprises contacting the intermediate first major surface with an acidic solution maintained at a temperature of 20° C. to 45° C. for 2 minutes to 2 hours.

[0022] Aspect 12: The method of Aspect 11, wherein the acidic solution contains 1 wt % to 20 wt % of hydrofluoric acid, based on 100 wt % of the acidic solution.

[0023] Aspect 13: The method of any of Aspects 1-10, wherein etching comprises contacting the intermediate first major surface with an alkaline solution maintained at a temperature of 95° C. to 165° C. for 10 minutes to 4 hours.

[0024] Aspect 14: The method of Aspect 13, wherein the alkaline solution comprises 10 wt % to 70 wt % of the hydroxide-containing compound, based on 100 wt % of the alkaline solution.

[0025] Aspect 15: The method of any of Aspects 1-14, wherein the sparkle is 3.1% to 3.8%, and the anti-glare substrate exhibits a distinctness of image DOI of 98% or less.

[0026] Aspect 16: The method of any of Aspects 1-14, wherein the sparkle is 3.1% to 1%, and the anti-glare substrate exhibits a distinctness of image DOI of 91% or greater.

[0027] Aspect 17: The method of any of Aspects 1-14, wherein the flash is 1.5% to 3.1%.

[0028] Aspect 18: The method of any of Aspects 1-17, wherein the haze is 8% to 20%.

[0029] Aspect 19: The method of any of Aspects 1-18, wherein the antiglare substrate exhibits a transmittance of 92% or more and a gloss of 55% to 150%.

[0030] Aspect 20: The method of any of Aspects 1-19, wherein the surface roughness Ra of the first major surface is 0.03 micrometers to 0.09 micrometers.

[0031] Aspect 21: The method of any of Aspects 1-20, wherein the root mean square height Sq of the first major surface is 0.05 microns to 0.17 microns.

[0032] Aspect 22: An antiglare substrate comprising:

[0033] A first major surface comprising a textured surface, the surface roughness Ra of the first major surface being 0.03 μm to 0.09 μm,

[0034] Among them, the anti-glare substrate is a glass-based substrate or a ceramic-based substrate, and the anti-glare substrate exhibits a haze of 3% to 40% and a glare of 1% to 3.8%.

[0035] Aspect 23: The antiglare substrate of Aspect 22, wherein the antiglare substrate comprises a compressive stress region extending from the first major surface comprising a maximum compressive stress of 25 megapascals to 1200 megapascals.

[0036] Aspect 24: The antiglare substrate of Aspect 22, wherein the first major surface of the antiglare substrate is substantially unreinforced.

[0037] Aspect 25: The antiglare substrate of any of Aspects 22-24, wherein the sparkle is from 3.1% to 3.8%, and the antiglare substrate exhibits a distinctness of image DOI of 98% or less.

[0038] Aspect 26: The antiglare substrate of any of Aspects 22-24, wherein the glare is from 1% to 3.1%, and the antiglare substrate exhibits a distinctness of image DOI of 91% or greater.

[0039] Aspect 27: The antiglare substrate of any of Aspects 22-24, wherein the glare is 1.5% to 3.1%.

[0040] Aspect 28: The antiglare substrate of any of Aspects 22-27, wherein the haze is from 8% to 20%.

[0041] Aspect 29: The antiglare substrate of any of Aspects 22-28, wherein the antiglare substrate exhibits a transmittance of 92% or more and a gloss of 55% to 150%.

[0042] Aspect 30: The antiglare substrate of any of Aspects 22-29, wherein the root mean square height Sq of the first major surface is from 0.05 micrometers to 0.17 micrometers. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The above features and advantages and other features and advantages of the present disclosure will be better understood by reading the following detailed description with reference to the accompanying drawings, wherein:

[0044] Figure 1 is a schematic diagram of an exemplary anti-glare substrate according to aspects;

[0045] Figure 2 It is based on the aspect Figure 1 Zoomed in view Figure 2 , showing the textured surface of the anti-glare substrate;

[0046] Figure 3 is a schematic plan view of an exemplary consumer electronic device according to aspects;

[0047] Figure 4 yes Figure 3 A perspective schematic diagram of an exemplary consumer electronic device;

[0048] Figure 5 is a flow chart showing an exemplary method of manufacturing an anti-glare substrate according to aspects;

[0049] Figure 6-9 Schematically showing steps in a method of making an antiglare substrate according to aspects of the present disclosure;

[0050] Fig.10 Schematically showing the functional relationship between the haze on the vertical axis (y-axis) and the thickness removed by etching on the horizontal axis (x-axis);

[0051] Fig.11Schematically showing the functional relationship between the sparkle on the vertical axis (y-axis) and the haze on the horizontal axis (x-axis); and

[0052] Fig.12 The functional relationship between the distinctness of image DOI on the vertical axis (y-axis) and the haze on the horizontal axis (x-axis) is schematically shown.

[0053] Throughout this disclosure, the drawings are used to emphasize certain aspects. Thus, unless otherwise explicitly stated, it should be assumed that the relative sizes of the various regions, parts, and substrates shown in the drawings are not proportional to their actual relative sizes. DETAILED DESCRIPTION

[0054] Aspects will be described more fully herein with reference to the accompanying drawings, in which exemplary aspects are shown. Whenever possible, the same reference numerals are used throughout the drawings to represent the same or similar parts. However, the claims may include many different aspects of various aspects and should not be interpreted as being limited to the aspects set forth herein.

[0055] Figure 1-2 A schematic diagram of an anti-glare substrate 101 including a first major surface 105 according to the present disclosure is shown, wherein the first major surface 105 is a textured surface 111. Unless otherwise stated, the discussion of features for aspects of a display device, an anti-glare substrate, and / or a feature in a plurality of features can be equally applicable to corresponding features of any aspect of the present disclosure. For example, throughout the present disclosure, the same part number can indicate that, in some aspects, the referred features are consistent with each other, and unless otherwise stated, the discussion of the referred features of one aspect can be equally applicable to the referred features of any other aspect of the present disclosure.

[0056] like Figure 1-2 As shown, anti-glare substrate 101 includes substrate 103. In aspects, the substrate can include a glass-based material and / or a ceramic-based material.

[0057] As used herein, "glass-based" materials include both glass and glass ceramics, wherein the glass ceramics have: one or more crystalline phases, and an amorphous residual glass phase. Glass-based materials (e.g., glass-based substrates) can include amorphous materials (e.g., glass) and optionally one or more crystalline materials (e.g., ceramics). Amorphous materials and glass-based materials can be strengthened. As used herein, the term "strengthened" can refer to a material that has been chemically strengthened by, for example, exchanging smaller ions in the substrate surface with larger ions, as discussed below. However, other strengthening methods can also be used, such as using thermal tempering or a mismatch in the thermal expansion coefficient between substrate portions to produce compressive stress and a central tension region to form a strengthened substrate. Exemplary glass-based materials (which may not contain lithium oxide or contain lithium oxide) include: soda-lime silicate glass, alkali aluminosilicate glass, alkali-containing borosilicate glass, alkali-containing aluminoborosilicate glass, alkali-containing phosphosilicate glass, and alkali-containing aluminophosphosilicate glass. "Glass ceramics" include materials produced by controlled crystallization of glass. In aspects, the glass-ceramic has a crystallinity of about 1% to about 99%. Exemplary aspects of suitable glass-ceramics may include Li 2 O-Al 2 O 3 -SiO 2 System (ie, LAS system) glass ceramics, MgO-Al 2 O 3 -SiO 2 System (ie, MAS system) glass ceramics, ZnO×Al 2 O 3 ×nSiO 2 (i.e., ZAS system) and / or glass-ceramics including a main crystalline phase comprising β-quartz solid solution, β-spodumene, cordierite, petalite and / or lithium disilicate. The glass-ceramic substrate can be strengthened by chemical strengthening process, for example, MAS system glass-ceramic materials can be strengthened in Li 2 SO 4 Exemplary aspects of glass materials (e.g., those used in the examples below) are described in U.S. Patents 8,586,492 (published on November 19, 2013), 8,951,927 (published on February 10, 2015), 8,969,226 (published on March 3, 2015), 9,593,042 (published on March 14, 2017), and 11,066,323 (published on July 20, 2021), the contents of which are incorporated herein by reference.

[0058] As used herein, "ceramic-based" includes both ceramics and glass-ceramics, wherein the glass-ceramics have: one or more crystalline phases, and an amorphous residual glass phase. The ceramic-based material can be strengthened (e.g., chemically strengthened). In aspects, the ceramic-based material can be formed by heating a glass-based material to form a ceramic (e.g., crystalline) portion. In other aspects, the ceramic-based material can include one or more nucleating agents that promote the formation of a crystalline phase. In aspects, the ceramic-based material can include one or more oxides, nitrides, oxynitrides, carbides, borides, and / or silicides. Exemplary aspects of ceramic oxides include: zirconium oxide (ZrO 2 ), zircon (ZrSiO 4 ), alkali metal oxides (such as sodium oxide (Na 2 O)), alkaline earth metal oxides (such as magnesium oxide (MgO)), titanium dioxide (TiO 2 ), Hafnium Oxide (Hf 2 O), yttrium oxide (Y 2 O 3 ), iron oxide, beryllium oxide, vanadium oxide (VO 2 ), fused quartz, mullite (a mineral containing a combination of aluminum oxide and silicon dioxide), and spinel (MgAl 2 O 4 ). Exemplary aspects of ceramic nitrides include: silicon nitride (Si 3 N 4 ), aluminum nitride (AlN), gallium nitride (GaN), beryllium nitride (Be 3 N 2 ), boron nitride (BN), tungsten nitride (WN), vanadium nitride, alkaline earth metal nitrides (e.g. magnesium nitride (Mg 3 N 2 )), nickel nitride and tantalum nitride. Exemplary aspects of oxynitride ceramics include silicon oxynitride, aluminum oxynitride, and silicon aluminum oxynitride.

[0059] In aspects, the substrate 103 may include a pencil hardness of 8H or greater, such as 9H or greater. As used herein, pencil hardness is measured using a standard lead graded pencil according to ASTM D 3363-20. Throughout this disclosure, ISO527-1:2019 is used to measure elastic modulus (e.g., Young's modulus) and / or Poisson's ratio. In aspects, the substrate 103 may include an elastic modulus of about 10 gigapascals (GPa) or greater, about 30 GPa or greater, about 50 GPa or greater, about 60 GPa or greater, about 70 GPa or greater, about 200 GPa or less, about 150 GPa or less, about 120 GPa or less, 100 GPa or less, about 90 GPa or less, or about 80 GPa or less. In aspects, the substrate 103 can include an elastic modulus ranging from about 10 GPa to about 200 GPa, from about 30 GPa to about 150 GPa, from about 50 GPa to about 120 GPa, from about 60 GPa to about 100 GPa, from about 60 GPa to about 90 GPa, from about 70 GPa to about 90 GPa, or any range or sub-range therebetween.

[0060] like Figure 1-2 As shown, the substrate 103 of the anti-glare substrate 102 or 202 may include a first major surface 105 and a second major surface 107 opposite to the first major surface 105. Figure 1 As shown, the second major surface 107 may include a flat surface and / or a planar surface, but it is understood that in other aspects, the second major surface may be curved or textured. Figure 1-2As shown, substrate thickness 109 is measured as the average distance between first major surface 105 and second major surface 107 averaged over first major surface 105. In aspects, substrate thickness 109 can be: about 25 micrometers (μm) or thicker, about 80 μm or thicker, about 100 μm or thicker, about 125 μm or thicker, about 150 μm or thicker, about 200 μm or thicker, about 500 μm or thicker, about 700 μm or thicker, about 5 millimeters (mm) or thinner, about 3 mm or thinner, about 2 mm or thinner, about 1 mm or thinner, about 800 μm or thinner, about 500 μm or thinner, about 300 μm or thinner, about 200 μm or thinner, about 180 μm or thinner, or about 160 μm or thinner. In aspects, the substrate thickness 109 can be in the range of about 25 μm to about 5 mm, about 25 μm to about 3 mm, about 25 μm to about 2 mm, about 80 μm to about 1 mm, about 80 μm to about 800 μm, about 100 μm to about 500 μm, about 100 μm to about 300 μm, about 125 μm to about 200 μm, about 150 μm to about 160 μm, or any range or sub-range therebetween. In aspects, the substrate thickness 109 can be about 500 μm or thicker, for example, about 500 μm to about 3 mm, about 700 μm to about 2 mm, about 700 μm to about 1 mm, or any range or sub-range therebetween. In aspects, substrate thickness 109 can be about 500 μm or less, such as about 25 μm to about 500 μm, about 25 μm to about 300 μm, about 80 μm to about 200 μm, about 100 μm to about 200 μm, or any range or sub-range therebetween.

[0061] like Figure 2 As shown schematically, the textured surface 111 of the first major surface may include a plurality of peaks 201a and 201b and a plurality of valleys 203a and 203b. Figure 2 Only some of the peaks and valleys are shown, but it is understood that the textured surface 111 can be unevenly or irregularly textured rather than uniformly textured with the same peaks and valleys. In addition, it is understood that the textured surface can include the entire first major surface, although in other aspects the textured surface can include less than the entire first major surface (e.g., the textured surface may not be present around the perimeter of the first major surface and / or in areas that are not aligned with the display device). Figure 2The centerline 205 of the textured surface 111 of the first major surface 105 is shown, which corresponds to the plane defined by the local average position of a series of first major surfaces 105 (although the surface may be curved). Therefore, the centerline 205 corresponds to the "centerline" used to calculate the surface roughness Ra, height Sq (described in the following paragraphs). As discussed below for the method of making an anti-glare substrate (e.g., a textured surface), the present disclosure can provide smaller peaks and / or valleys (which would not be achieved in any other way) by abrading the first major surface, and the smaller peaks and / or valleys achieve the lower sparkle and other optical properties set forth herein.

[0062] Without wishing to be bound by theory, the textured surface of the first major surface may interfere with and / or reduce the intensity of specular reflections from the textured surface that would otherwise be associated with glare. In addition, the textured surface of the first major surface may be irregular so as to reduce the occurrence of glare (see below). Throughout this disclosure, the surface profile of the first major surface is measured over a test area of ​​at least 200 μm by 200 μm, using a NewView 9000 optical profiler (Zygo Co., Ltd.), which is used to characterize the first major surface using the parameters defined in ISO 4287:1997 and ISO 25178. As used herein, the surface roughness Ra is calculated as the arithmetic mean of the absolute deviations of the surface profile from a mean position. In other aspects, the surface roughness Ra of the textured surface can be: about 0.03 μm or greater, about 0.035 μm or greater, about 0.04 μm or greater, about 0.045 μm or greater, about 0.05 μm or greater, about 0.055 μm or greater, about 0.06 μm or greater, about 0.07 μm or greater, about 0.09 μm or less, about 0.085 μm or less, about 0.08 μm or less, about 0.07 μm or less, about 0.065 or less, or about 0.06 μm or less. In other aspects, the surface roughness Ra can be in the range of about 0.03 μm to about 0.09 μm, about 0.035 μm to about 0.085 μm, about 0.04 μm to about 0.08 μm, about 0.045 μm to about 0.075 μm, about 0.05 μm to about 0.07 μm, or any range or sub-range therebetween.

[0063] As used herein, height Sq is calculated as the root mean square deviation of the surface profile relative to the average position. Without wishing to be bound by theory, Sq is greater than or equal to Ra. In other aspects, the height Sq of the textured surface can be: about 0.05 μm or greater, about 0.06 μm or greater, about 0.07 μm or greater, about 0.08 μm or greater, about 0.09 μm or greater, about 0.10 μm or greater, about 0.20 μm or less, about 0.17 μm or less, 0.15 μm or less, about 0.14 μm or less, about 0.13 μm or less, about 0.12 μm or less, about 0.11 μm or less, about 0.10 μm or less, about 0.09 μm or less, about 0.08 μm or less, or about 0.07 μm or less. In other aspects, the height Sq of the textured surface can be in the range of about 0.05 μm to about 0.20 μm, about 0.05 μm to about 0.17 μm, about 0.05 μm to about 0.15 μm, about 0.06 μm to about 0.14 μm, about 0.06 μm to about 0.13 μm, about 0.07 to about 0.12 μm, about 0.08 μm to about 0.11 μm, about 0.09 μm to about 0.10 μm, or any range or sub-range therebetween. In aspects, the height Sq can be about 0.13 μm or less, for example, in the range of about 0.05 μm to about 0.13 μm, about 0.06 μm to about 0.12 μm, about 0.06 μm to about 0.11 μm, about 0.08 μm to about 0.10 μm, or any range or sub-range therebetween.

[0064] As used herein, the arithmetic mean of the widths of features Rsm for a textured surface, where "feature" refers to the peaks and adjacent valleys (e.g., see Figure 2 In aspects, the Rsm width can be about 5 μm or more, about 7 μm or more, about 9 μm or more, about 10 μm or more, about 11 μm or more, about 12 μm or more, about 13 μm or more, about 20 μm or less, about 17 μm or less, about 16 μm or less, about 15 μm or less, about 14 μm or less, about 13 μm or less, about 12 μm or less, or about 11 μm or less. In aspects, the Rsm width can be in the range of about 5 μm to about 20 μm, about 5 μm to about 17 μm, about 7 μm to about 16 μm, about 9 μm to about 15 μm, about 10 μm to about 14 μm, about 11 μm to about 13 μm, or any range or sub-range therebetween. In aspects, the Rsm width can be about 16 μm or less, such as a range of about 5 μm to about 16 μm, about 7 μm to about 15 μm, about 9 μm to about 14 μm, about 10 μm to about 13 μm, or any range or sub-range therebetween.

[0065] As used herein, the gradient Sdq is defined as the root mean square of the slope of the textured surface and is unitless (e.g., mm / mm or μm / μm). In aspects, Sdq can be: about 0.005 or more, about 0.008 or more, about 0.01 or more, about 0.02 or more, about 0.03 or more, about 0.04 or more, about 0.05 or more, about 0.06 or more, about 0.08 or more, about 0.10 or more, about 0.12 or more, about 0.15 or more, about 0.27 or less, about 0.25 or less, about 0.22 or less, about 0.20 or less, about 0.18 or less, about 0.16 or less, about 0.14 or less, about 0.12 or less, about 0.10 or less, about 0.08 or less, about 0.06 or less, or about 0.04 or less. In aspects, the gradient Sdq can be in the range of about 0.005 to about 0.27, about 0.008 to about 0.25, about 0.01 to about 0.22, about 0.02 to about 0.20, about 0.03 to about 0.18, about 0.04 to about 0.16, about 0.05 to about 0.14, about 0.06 to about 0.12, about 0.07 to about 0.10, or any range or sub-range therebetween. In aspects, the gradient Sdq can be about 0.16 or less, for example, in the range of about 0.01 to about 0.16, about 0.02 to about 0.16, about 0.03 to about 0.16, about 0.05 to about 0.14, about 0.06 to about 0.12, about 0.07 to about 0.12, about 0.08 to about 0.10, or any range or sub-range therebetween.

[0066] Throughout this disclosure, the refractive index is measured according to ASTM E1967-19 using light containing a wavelength of 589 nm. In aspects, the substrate refractive index of the substrate 103 of the anti-glare substrate 102 or 202 can be about 1.4 or greater, about 1.45 or greater, about 1.47 or greater, about 1.49 or greater, about 1.5 or greater, about 1.53 or greater, about 1.55 or greater, about 1.6 or less, about 1.58 or less, about 1.56 or less, about 1.55 or less, about 1.54 or less, about 1.53 or less, about 1.52 or less, or about 1.54 or less. In aspects, the substrate refractive index of substrate 103 of anti-glare substrate 101 can be in the range of about 1.4 to about 1.6, about 1.45 to about 1.58, about 1.47 to about 1.56, about 1.49 to about 1.55, about 1.5 to about 1.54, about 1.51 to about 1.53, or any range or sub-range therebetween.

[0067] In aspects, the substrate 103 may include one or more compressive stress regions, for example extending from the first major surface 105 and / or the second major surface 107. In aspects, the compressive stress region can be generated by chemically strengthening the substrate. Chemical strengthening can include an ion exchange process, wherein ions in the surface layer are replaced or exchanged by larger ions having the same valence or oxidation state. The chemical strengthening method will be discussed later. Without wishing to be limited by theory, chemical strengthening of the substrate can achieve a small (e.g., less than about 10 mm or less) bending radius because the compressive stress from the chemical strengthening can offset the bending-induced tensile stress on the outermost surface of the substrate. The compressive stress region can extend into a portion of the substrate to a depth referred to as the compression depth. As used herein, the compression depth represents the depth at which the stress in the chemically strengthened substrate described herein changes from compressive stress to tensile stress. Depending on the ion exchange treatment and thickness of the article being measured, the compression depth can be measured by a surface stress meter or a scattered light polarizer (SCALP, wherein the values ​​recorded herein are obtained using a SCALP-5 manufactured by Glasstress, Estonia). When stress is induced in the substrate by exchanging potassium ions into the substrate, the depth of compression is measured using a surface stress meter (e.g., FSM-6000 (Orihara Industries, Ltd., Japan)). Unless otherwise stated, compressive stress (including surface CS) is measured by a surface stress meter (FSM), using, for example, a commercial instrument such as the FSM-6000 manufactured by Orihara Corporation. Surface stress measurements rely on accurate measurement of the stress-optical coefficient (SOC), which is related to the birefringence of the glass. Unless otherwise stated, SOC is measured according to Scheme C (Glass Disc Method) described in ASTM Standard C770-16, entitled "Standard Test Method for Measurement of Glass Stress-Optical Coefficient", the entire text of which is incorporated herein by reference. When stress is induced in the substrate by exchanging sodium ions into the substrate and the measured article is thicker than about 75 μm, the depth of compression and central tension (CT) are measured using SCALP. When stress is induced in the substrate by exchanging both potassium and sodium ions into the glass and the article measured is thicker than about 75 μm, the compression depth and CT are measured by SCALP. Without wishing to be bound by theory, the exchange depth of sodium may indicate the compression depth, while the exchange depth of potassium ions may indicate a change in the magnitude of the compressive stress (but not a change in stress from compression to tension).A graph representing the stress distribution may also be obtained using the refracted near field (RNF; RNF method) described in U.S. Pat. No. 8,854,623, entitled “Systems and methods for measuring a profile characteristic of a glass sample.” When the RNF method is used to obtain a graph representing the stress distribution, the maximum central tension value provided by SCALP is used in the RNF method. The graph representing the stress distribution obtained by RNF is force balanced and calibrated using the maximum central tension value provided by the SCALP measurement. As used herein, “depth of layer” (DOL) refers to the depth of exchange of ions (e.g., sodium, potassium) into the substrate. In the present disclosure, when the central tension cannot be directly measured by SCALP (when the article being measured is thinner than about 75 μm), the maximum central tension can be approximated by the product of the maximum compressive stress and the compression depth divided by the difference between the substrate thickness and twice the compressive stress, where the compressive stress and the compression depth are measured by FSM.

[0068] In aspects, the substrate 103 can be chemically strengthened to form a first compressive stress region extending from the first major surface 105 to a first compression depth. In aspects, the substrate 103 can be chemically strengthened to form a second compressive stress region extending from the second major surface 107 to a second compression depth. In even other aspects, the first compression depth (e.g., from the first major surface 105) and / or the second compression depth (e.g., from the second major surface 107) can be, as a percentage of the substrate thickness 109, about 1% or more, about 5% or more, about 10% or more, about 30% or less, about 25% or less, or about 20% or less. In even other aspects, the first compression depth and / or the second compression depth can be, as a percentage of the substrate thickness 109, in the range of about 1% to about 30%, about 1% to about 25%, about 5% to about 25%, about 5% to about 20%, about 10% to about 20%, or any range or sub-range therebetween. In aspects, the first compression depth and / or the second compression depth can be about 1 μm or more, about 10 μm or more, about 50 μm or more, about 200 μm or less, about 150 μm or less, or about 100 μm or less. In aspects, the first compression depth and / or the second compression depth can be in the range of about 1 μm to about 200 μm, about 1 μm to about 150 μm, about 10 μm to about 150 μm, about 50 μm to about 150 μm, about 50 μm to about 100 μm, or any range or sub-range therebetween. In aspects, the first compression depth can be greater than, less than, or substantially equal to the second compression depth. Good impact resistance and / or good puncture resistance can be achieved by providing a glass-based substrate and / or a ceramic-based substrate including a first compression depth and / or a second compression depth in the range of about 1% to about 30% of the first thickness.

[0069] In aspects, the substrate 103 can include a first layer depth of one or more alkali metal ions associated with a first compressive stress region and / or a second layer depth of one or more alkali metal ions associated with a second compressive stress region. In aspects, the first layer depth and / or the second layer depth can be, as a percentage of the substrate thickness 109, about 1% or more, about 5% or more, about 10% or more, about 15% or more, about 20% or more, about 35% or less, about 30% or less, about 25% or less, or about 22% or less. In aspects, the first layer depth and / or the second layer depth can be, as a percentage of the substrate thickness 109, in the range of about 1% to about 35%, about 5% to about 35%, about 5% to about 30%, about 10% to about 30%, about 10% to about 25%, about 15% to about 25%, about 15% to about 22%, about 20% to about 22%, or any range or sub-range therebetween. In aspects, the first layer depth and / or the second layer depth can be about 1 μm or more, about 10 μm or more, about 50 μm or more, about 200 μm or less, about 150 μm or less, or about 100 μm or less. In aspects, the first layer depth and / or the second layer depth can be in the range of about 1 μm to about 200 μm, about 1 μm to about 150 μm, about 10 μm to about 150 μm, about 50 μm to about 150 μm, about 50 μm to about 100 μm, or any range or sub-range therebetween.

[0070] In aspects, the first compressive stress region can include a maximum first compressive stress. In aspects, the second compressive stress region can include a maximum second compressive stress. In other aspects, the maximum first compressive stress and / or the maximum second compressive stress can be about 25 megapascals (MPa) or greater, about 50 MPa or greater, 100 MPa or greater, about 300 MPa or greater, about 500 MPa or greater, about 700 MPa or greater, about 1,500 MPa or less, about 1,200 MPa or less, about 1,000 MPa or less, or about 900 MPa or less. In other aspects, the maximum first compressive stress and / or the maximum second compressive stress can be in the range of about 25 MPa to about 1,500 MPa, about 25 MPa to about 1,200 MPa, about 50 MPa to about 1,200 MPa, about 100 MPa to about 1,200 MPa, about 300 MPa to about 1,000 MPa, about 300 MPa to about 1,000 MPa, about 500 MPa to about 900 MPa, about 700 MPa to about 900 MPa, or any range or sub-range therebetween. By providing a maximum first compressive stress and / or a maximum second compressive stress in the range of about 25 MPa to about 1,500 MPa, good impact resistance and / or puncture resistance can be achieved. Alternatively, in aspects, the first major surface and / or the second major surface of the anti-glare substrate can be substantially unreinforced and / or unreinforced. As used herein, "substantially unreinforced" refers to a maximum compressive stress (e.g., at the corresponding major surface) of less than 25 MPa.

[0071] In aspects, the substrate 103 can include a central tension region located between the first compressive stress region and the second compressive stress region. In other aspects, the central tension region can include a maximum central tensile stress. In aspects, the maximum central tensile stress can be about 10 MPa or more, about 25 MPa or more, about 50 MPa or more, about 100 MPa or more, about 200 MPa or more, about 250 MPa or more, about 750 MPa or less, about 600 MPa or less, about 500 MPa or less, about 450 MPa or less, about 400 MPa or less, about 350 MPa or less, or about 300 MPa or less. In aspects, the maximum central tensile stress can be in the range of about 10 MPa to about 750 MPa, about 25 MPa to about 600 MPa, about 50 MPa to about 600 MPa, about 100 MPa to about 600 MPa, about 100 MPa to about 500 MPa, about 200 MPa to about 500 MPa, about 200 MPa to about 450 MPa, about 250 MPa to about 450 MPa, about 250 MPa to about 350 MPa, about 250 MPa to about 300 MPa, or any range or sub-range therebetween.

[0072] Aspects of the present disclosure may include consumer electronic products. The consumer electronic product may include a front surface, a back surface, and a side surface. The consumer electronic product may also include an electronic component at least partially located within a housing. The electronic component may include a controller, a memory, and a display. The display may be located on the front surface of the housing or adjacent to the front surface of the housing. The display may include: a liquid crystal display (LCD), an electrophoretic display (EPD), an organic light emitting diode (OLED) display, or a plasma display panel (PDP). The consumer electronic product may include a cover substrate arranged above the display. In aspects, at least one of the display device or the housing includes the anti-glare substrate 101 discussed throughout the present disclosure. The consumer electronic product may include a portable electronic device, such as: a smart phone, a tablet, a wearable device (e.g., a watch), a navigation system, or a laptop computer. In addition, it is also understood that the anti-glare substrate 101 discussed throughout the present disclosure may be integrated into a building product, a transportation product (e.g., a vehicle, a train, an aircraft, a marine craft, etc.), or an electrical product containing a display.

[0073] The anti-glare substrate disclosed herein can be incorporated into another article, such as an article having a display screen (or display article) (e.g., consumer electronics, including mobile phones, tablets, computers, televisions and monitors, etc.), a building article, a transportation article (e.g., a vehicle, a train, an aircraft, a marine craft, etc.), or an electrical article. Exemplary articles incorporating any anti-glare substrate as disclosed herein are as follows: Figure 3-4 Specifically, Figure 3-4 A consumer electronic device 300 is shown, which includes a housing 302 having a front surface 304, a back surface 306, and side surfaces 308. Although not shown, the consumer electronic device may include electronic components that are at least partially located within the housing or completely located within the housing. For example, the electronic components may include at least a controller, a memory, and a display. Figure 3-4 As shown, display 310 can be located on or adjacent to the front surface of housing 302. The consumer electronic device can include a cover substrate 312 located on or above the front surface of housing 302, so that it is located above display 310. In aspects, the cover substrate and / or at least a portion of the housing can include an anti-glare substrate of the present disclosure. In other aspects, the cover substrate can include an anti-glare substrate of the present disclosure.

[0074] As mentioned above Figure 3-4As discussed, a display device (e.g., a consumer electronic device 300) can include an anti-glare substrate 101 disposed above a display (of an electronic component). In aspects, the display can be a pixel display including at least one pixel including a plurality of sub-pixels. In aspects, the pixel of the at least one pixel can include three sub-pixels, for example: a red sub-pixel (e.g., configured to emit light corresponding to a wavelength range of about 600 nm to about 660 nm), a green sub-pixel (e.g., configured to emit light corresponding to a wavelength range of about 500 nm to about 560 nm), and a blue sub-pixel (e.g., configured to emit light corresponding to a wavelength range of about 430 nm to about 490 nm), but other configurations are possible in other aspects. In aspects, a sub-pixel pitch, defined as the center-to-center spacing between adjacent sub-pixels in the same pixel, can be about 25 μm or greater, about 40 μm or greater, about 50 μm or greater, about 60 μm or greater, about 200 μm or less, about 100 μm or less, about 80 μm or less, or about 60 μm or less. In aspects, the sub-pixel pitch may be in the range of about 25 μm to about 200 μm, about 40 μm to about 100 μm, about 50 μm to about 80 μm, or any range or sub-range therebetween. In aspects, the pixel pitch defined as the pixel width may be in the range of about 75 μm or more, about 100 μm or more, about 150 μm, about 180 μm or more, about 200 μm or more, about 800 μm or less, about 500 μm or less, about 300 μm or less, about 250 μm or less, or about 200 μm or less. In aspects, the pixel pitch may be in the range of about 75 μm to about 800 μm, about 100 μm to about 500 μm, about 150 μm to about 300 μm, about 180 μm to about 250 μm, or any range or sub-range therebetween.

[0075] In aspects, the anti-glare substrate 101 may exhibit a sparkle measured as a percentage. Unless otherwise stated, the sparkle was measured using an SMS-1000 (Display-Messtechnik & Systeme) and a display arrangement comprising an edge-lit liquid crystal display (twisted nematic liquid crystal display) having a resolution of 140 pixels per inch (ppi) and a 1 mm thick glass stack between the pixel layer of the display and the substrate to be tested. In order to determine the sparkle of the anti-glare surface of a display system or a display system forming a part of, the screen is placed in the focus area of ​​an "eye simulator" camera (of the SMS-1000) having parameters approximating the eye of a human observer. Thus, the camera system includes an aperture (or "pupil aperture") which is inserted into the optical path to adjust the angle of collection of light, thereby approximating the aperture of the pupil of the human eye. In the sparkle measurements described herein, the iris aperture is set to the full angle of the device, which subtends an angle of at least 20 milliradians. Sparkle measurements are made by (1) focusing a camera and lens assembly onto the pixel layer of a display screen, (2) collecting a sample image on the display, (3) displacing the sample, (4) collecting a second texture image in the new area, and (5) calculating sparkle. Sparkle calculation involves taking the difference between the two images, applying a spatial filter, and calculating the standard deviation (or noise) in the resulting image. Filtering is used to account for the limited angular resolution of the human eye and to separate sparkle generated by display pixel modulation from surface (e.g., the anti-glare surface of an anti-glare substrate).

[0076] The phenomenon of display "flash" occurs when anti-glare or light scattering surfaces are incorporated into a display system. Flash is associated with a very fine, granular appearance that appears to shift the particle pattern as the viewing angle of the display changes. This type of flash is observed when a pixel display (e.g., an LCD) is viewed through an anti-glare surface. This type of flash is different from, and originates from, the "flash" or "speckle" observed and characteristic of projection or laser systems. In aspects, the flash value of the anti-glare substrate 101 can be: about 3.8% or less, about 3.6% or less, about 3.5% or less, about 3.3% or less, about 3.2% or less, about 3.1% or less, about 3.0% or less (or about 3% or less), about 2.7% or less, about 2.5% or less, about 2.2% or less, about 2.0% or less (or about 2% or less), about 1.9% or less, about 2.1 ... About 1.8% or less, about 1.0% or more (or about 1% or more), about 1.2% or more, about 1.5% or more, about 1.6% or more, about 1.7% or more, about 1.8% or more, about 1.9% or more, about 2.0% or more (or about 2% or more), about 2.2% or more, about 2.5% or more, about 2.7% or more, or about 3.0% or more (or about 3% or more). In aspects, the sparkle value of the anti-glare substrate 101 can be in the range of about 1% to about 3.8%, about 1% to about 3.6%, about 1.2% to about 3.5%, about 1.2% to about 3.3%, about 1.5% to about 3.2%, about 1.5% to about 3.1%, about 1.6% to about 3.0%, about 1.7% to about 2.7%, about 1.8% to about 2.5%, about 1.9% to about 2.2%, about 2.0% to about 2.2%, or any range or sub-range therebetween. In aspects, the sparkle value of the anti-glare substrate 101 can be about 3.5% or less, such as in the range of about 1.0% to about 3.5%, about 1.2% to about 3.3%, about 1.5% to about 3.1%, or any range or sub-range therebetween. In aspects, the anti-glare substrate 101 can have a sparkle value of about 3.1% or greater, such as a range of about 3.1% to about 3.8%, about 3.2% to about 3.8%, about 3.3% to about 3.7%, about 3.4% to about 3.7%, about 3.5% to about 3.6%, or any range or sub-range therebetween. In aspects, preferred ranges for sparkle values ​​are about 1% to about 3.8%, about 1.5% to about 3.1%, or about 3.1% to about 3.8%. Reducing sparkle by an anti-glare substrate of the present disclosure can increase the uniformity of light emitted from a display device (as perceived by an observer of the display device), and / or can increase the aesthetics of the resulting display device by reducing perceived graininess associated with sparkle.As demonstrated by the Examples, the methods of the present disclosure can provide an anti-glare substrate that exhibits 3.8% or less (eg, 3.5% or less, or 3.1% or less) glare, which is unattainable by the Comparative Examples.

[0077] The transmittance and haze values ​​reported herein were measured using a BYK Haze-Gard Dual (BYK Gardner). In aspects, an "optically transparent material" or "optically clear material" may have an average transmittance of 75% or greater, 80% or greater, 85% or greater, or 90% or greater, 92% or greater, 93% or greater, 94% or greater, 95% or greater, 96% or greater, through a 1.0 mm thick sheet of material over the wavelength range of 400 nm to 700 nm. The average transmittance over the wavelength range of 400 nm to 700 nm is calculated by measuring the transmittance at integer wavelengths from about 400 nm to about 700 nm and averaging the measurements. In aspects, the substrate 103 can include an average transmittance (averaged over a wavelength of light between 400 nm and 700 nm) of about 80% or more, about 90% or more, about 91% or more, about 92.0% or more, about 92.2% or more, about 92.5% or more, about 92.8% or more, about 93.0% or more, about 99% or less, about 96% or less, about 95% or less, or about 94% or less. In aspects, the substrate 103 can include an average transmittance (averaged over a wavelength of light between 400 nm and 700 nm) of about 80% to about 99%, about 90% to about 96%, about 91% to about 96%, about 92.0% to about 95%, about 92.2% to about 94%, about 92.5% to about 94%, about 92.8% to about 93%, or any range or sub-range therebetween.

[0078] As used herein, haze refers to transmission haze, which is measured according to ASTM D1003-21, through the textured surface 111 at a direction of 0° normal to the textured surface 111. Haze was measured using a BYK Haze-Gard Dual (BYK Gardner). A CIE D65 illuminant was used as the light source for illuminating the substrate 103. The haze values ​​reported herein were measured through a substrate comprising a thickness of 0.7 mm, and the light incident on the second major surface 107 was measured as it left the textured surface 111 of the first major surface 105. In other aspects, the haze of the anti-glare substrate 101 can be about 40% or less, about 35% or less, about 32% or less, about 30% or less, about 28% or less, about 25% or less, about 22% or less, about 20% or less, about 18% or less, about 16% or less, about 14% or less, about 12% or less, about 1% or more, about 2% or more, about 3% or more, about 4% or more, about 5% or more, about 6% or more, about 7% or more, about 8% or more, about 9% or more, about 10% or more, about 11% or more, about 13% or more, about 15% or more, or about 17% or more. In other aspects, the haze of the anti-glare substrate 101 can be in the range of about 1% to about 40%, about 2% to about 40%, about 3% to about 40%, about 3% to about 35%, about 4% to about 32%, about 5% to about 30%, about 5% to about 28%, about 6% to about 25%, about 7% to about 22%, about 8% to about 20%, about 9% to about 18%, about 10% to about 16%, about 11% to about 14%, or any range or sub-range therebetween.

[0079] As used herein, gloss is measured according to ASTM D523 at an incident angle of 60° relative to the direction normal to the textured surface 111. Gloss measurements are calibrated using standards obtained from the BAM Federal Institute for Materials Research and Testing to produce the reported gloss values. Thus, the gloss values ​​reported in percent (%) are equivalent to standard gloss units (SGU). Unless otherwise specified, gloss is measured using a Rhopoint IQ 20 / 60 / 85 gloss haze DOI meter (Rhopoint Americas Inc.). In aspects, the gloss value of the anti-glare substrate 101 can be: about 55% or greater, about 60% or greater, about 65% or greater, about 70% or greater, about 75% or greater, about 80% or greater, about 90% or greater, about 100% or greater, about 110% or greater, about 150% or less, about 140% or less, about 130% or less, about 125% or less, about 120% or less, about 115% or less, about 110% or less, about 100% or less, about 90% or less, about 80% or less, about 70% or less. In aspects, the glossiness value of the anti-glare substrate 101 can be in the range of about 55% to about 150%, about 60% to about 140%, about 65% to about 130%, about 70% to about 125%, about 75% to about 120%, about 80% to about 115%, about 90% to about 110%, or any range or sub-range therebetween. In aspects, the glossiness value of the anti-glare substrate 101 can be 100% or less, such as in the range of about 30% to about 100%, about 50% to about 100%, about 55% to about 90%, about 60% to about 80%, about 65% to about 80%, or any range or sub-range therebetween. As demonstrated in the examples, the methods of the present disclosure can provide an anti-glare substrate that exhibits a glossiness of 50% or greater, which is unattainable by the comparative examples.

[0080] As used herein, distinctness of image (DOI) is measured according to ASTM D5767 Method A: 100x[1-Ro / Rs], where Rs is the relative reflective intensity averaged in the specular direction (averaged at +0.05° and -0.05° diameters relative to the incident light specular reflection), and Ro is the relative reflective intensity averaged in the specular direction at angles of 0.2° to 0.4° relative to the specular reflection. Unless otherwise specified, DOI was measured using a Rhopoint IQ 20 / 6085 gloss haze DOI meter (Rhopoint Americas Inc.). In aspects, the DOI of the anti-glare substrate 101 can be about 91% or greater, about 92% or greater, about 93% or greater, about 94% or greater, about 95% or greater, about 96% or greater, about 97% or greater, about 99% or less, about 98% or less, about 97% or less, about 96% or less, about 95% or less, about 94% or less, about 93% or less, or about 92% or less. In aspects, the DOI of the anti-glare substrate 101 can be in the range of about 91% to about 99%, about 92% to about 98%, about 93% to about 98%, about 93% to about 97%, about 94% to about 97%, about 95% to about 96%, or any range or sub-range therebetween. As demonstrated in the Examples, the methods of the present disclosure can provide an anti-glare substrate that exhibits a DOI of 91% or greater (e.g., 93% or greater), which is unattainable by the Comparative Examples.

[0081] In aspects, the anti-glare substrate 101 can exhibit 1% to 3.8% sparkle (e.g., 1.5% to 3.5% or 1.5% to 3.1%) in combination with 3% to 40% haze (e.g., 3% to 20%, 5% to 16%). In aspects, the anti-glare substrate 101 can exhibit 1% to 3.5% sparkle (e.g., 1.5% to 3.1%) in combination with a DOI of 91% or greater (e.g., 91% to 99%, 93% to 98%, or about 94% to about 98%). Alternatively, in aspects, the anti-glare substrate 101 can exhibit 3.1% to 3.8% sparkle (e.g., 3.5% to 3.8% or 3.1% to 3.5%) in combination with a DOI of 98% or greater (e.g., 91% to 98%, or 91% to 93%). In aspects, the antiglare substrate 101 can exhibit a transmittance of 92% or greater combined with a gloss of 55% to 150% (e.g., 50% to 130%, 55% to 120%, 70% to 120%, or 100% to 120%). Without wishing to be bound by theory, it is believed that the characteristics of the textured surface of the first major surface produced by the method of the present disclosure (e.g., surface roughness Ra, height Rq, width Rsm, gradient Sdq) enable the above-recited combinations of optical properties to be achieved simultaneously. Although a selected group of combinations of optical property ranges for the antiglare substrate are set forth in this paragraph, it is to be understood that other combinations of these optical property ranges and / or combinations of other optical properties set forth in connection with the present disclosure are also possible in other aspects.

[0082] Will refer to Figure 5 The flowchart and Figure 6-9 The exemplary method steps shown in the figure are used to describe the content of the present invention according to the present invention. Figure 1-2 The anti-glare substrate 101 shown will be discussed in terms of a method for manufacturing the same.

[0083] like Figure 5 As shown, the method of the present disclosure may start from step 501, including providing a substrate 103. In aspect, the substrate 103 may be provided by purchase or any other means or by forming the substrate. In aspect, the substrate 103 may include a glass-based material or a ceramic-based material. In other aspects, a glass-based substrate may be provided by forming through various strip forming processes, such as: slot drawing, down-drawing, fusion down-drawing, up-drawing, roller pressing, redrawing or float. In other aspects, a glass-based substrate containing ceramic crystals may be provided by heating a glass-based substrate to crystallize to obtain one or more ceramic crystals. In aspect, the substrate 103 may be chemically strengthened (e.g., containing a first compressive stress region and / or a second compressive stress region), but the substrate 103 may be chemically strengthened (or further chemically strengthened) in step 503.

[0084] In the aspect, after step 501, as Figure 5 As shown, the method can proceed to step 503, which includes chemically strengthening the substrate 103. In one aspect, as Figure 6 As shown, the substrate can include an existing first major surface 605 and an existing second major surface 607 opposite the existing first major surface 605. In other aspects, the existing thickness of the substrate 103 in step 503 (e.g., the average distance between the existing first major surface and the existing second major surface) can be within one or more ranges discussed above with respect to substrate thickness 109. In even other aspects, the existing thickness of the substrate 103 in step 503 can be greater than the resulting substrate thickness 109 of the anti-glare substrate 101 (e.g., as a result of the abrasion and etching in steps 505 and 507) by: about 5 μm or more, about 9 μm or more, about 15 μm or more, about 18 μm or more, about 25 μm or more, about 40 μm or more, about 200 μm or less, about 100 μm or less, about 80 μm or less, about 60 μm or less, about 50 μm or less, about 30 μm or less, or about 20 μm or less. In even other aspects, the pre-existing thickness of the substrate 103 in step 503 can be greater than the resulting substrate thickness 109 of the anti-glare substrate 101 by an amount in the following range: about 5 μm to about 200 μm, about 5 μm to about 100 μm, about 9 μm to about 80 μm, about 9 μm to about 60 μm, about 15 μm to about 50 μm, about 18 μm to about 30 μm, or any range or sub-range therebetween.

[0085] In terms of Figure 6 As shown, the chemical strengthening of the substrate 103 in step 503 includes chemically strengthening at least the already existing first main surface 605. Figure 6As shown, step 503 may also include chemically strengthening the already existing second main surface 607 in addition to the already existing first main surface 605. In aspects, as shown, chemically strengthening the substrate 103 in step 503 may include at least contacting (e.g., immersing) the already existing first main surface 605 in the molten salt solution 603 contained in the container 601. In other aspects, as shown, the entire substrate 103 can be immersed in the molten salt solution 603, but in other aspects, the chemical strengthening of the substrate can also be performed by applying the slurry to at least the first main surface and heating the substrate. In aspects, the molten salt solution 603 may include a sodium ion source and / or a potassium ion source. In other aspects, the potassium ion source may be potassium nitrate and / or the sodium ion source may be sodium nitrate. In aspects, the total amount of the sodium ion source and the potassium ion source (in terms of weight % of the molten salt solution) may be: 50% or more, 70% or more, 80% or more, 90% or more, 95% or more, 97% or more, 98% or more, or 99% or more. In aspects, the molten salt solution may optionally include silicic acid (e.g., 0.1 wt % to 5 wt %, 0.2 wt % to 2 wt %, 0.5 wt % to 1 wt %, or any range or sub-range therebetween). In aspects, the molten salt solution may optionally include other (i.e., other than sodium and potassium) alkaline ion (e.g., lithium) sources that may be: 10 wt % or less, 5 wt % or less, 2 wt % or less, 1 wt % or less, or 0.5 wt % or less.

[0086] In one aspect, exposing at least the already existing first major surface 605 to the molten salt solution 603 in step 503 can occur for 5 minutes or more, 10 minutes or more, 15 minutes or more, 30 minutes or more, 45 minutes or more, 1 hour or more, 1.5 hours or more, 2 hours or more, 8 hours or less, 4 hours or less, 3 hours or less, 2 hours or less, 1.5 hours or less, 1 hour or less, 0.75 hours or less, or 0.50 hours or less. In one aspect, exposing at least the already existing first major surface 605 to the molten salt solution 603 in step 503 can occur for a time period ranging from 5 minutes to 8 hours, 10 minutes to 4 hours, 30 minutes to 2 hours, 45 minutes to 1.5 hours, or any range or sub-range therebetween. In aspects, exposing at least the already existing first major surface 605 to the molten salt solution 603 in step 503 can occur for 1 hour or less, such as the following range: 5 minutes to 1 hour, 10 minutes to 0.75 hours, 15 minutes to 0.5 hours, or any range or sub-range therebetween. In aspects, (e.g., during the exposure of step 503) the molten salt solution 603 can be maintained at a temperature of 370°C or more, 380°C or more, 390°C or more, 400°C or more, 410°C or more, 420°C or more, 500°C or less, 480°C or less, 460°C or less, 440°C or less, 420°C or less, or 400°C or less. In aspects, the molten salt solution 603 can be maintained at a temperature in the range of 370°C to 500°C, 370°C to 480°C, 380°C to 460°C, 380°C to 440°C, 390°C to 420°C, 390°C to 400°C, or any range or sub-range therebetween (e.g., during the exposure of step 503).

[0087] like Figure 7 As shown, chemical strengthening can at least form an intermediate first compressive stress region 702 extending from an existing first main surface 605 to an intermediate first compressive depth 703. In one embodiment, as shown, chemical strengthening can also form an intermediate second compressive stress region 704 extending from an existing second main surface 607 to an intermediate second compressive depth 705. Figure 7As shown, the intermediate first compression depth 703 and / or the intermediate second compression depth 705 extend from the corresponding major surface to a position where the stress distribution switches from compression to tension (e.g., 0 MPa) (represented by dashed lines 713 and / or 713). The intermediate maximum first compression stress of the intermediate first compressive stress region can be: 25 MPa or greater, about 50 MPa or greater, 100 megapascals or greater, about 300 MPa or greater, about 500 MPa or greater, about 700 MPa or greater, about 1,500 MPa or less, about 1,200 MPa or less, about 1,000 MPa or less, or about 900 MPa or less. In other aspects, the intermediate maximum first compressive stress and / or the maximum second compressive stress can be in the range of about 25 MPa to about 1,500 MPa, about 25 MPa to about 1,200 MPa, about 50 MPa to about 1,200 MPa, about 100 MPa to about 1,200 MPa, about 300 MPa to about 1,000 MPa, about 300 MPa to about 1,000 MPa, about 500 MPa to about 900 MPa, about 700 MPa to about 900 MPa, or any range or sub-range therebetween.

[0088] In aspects, method 503 may include at least contacting the already existing first major surface with a plurality of molten salt solutions (e.g., sequentially). In other aspects, the total time that the already existing first major surface is in contact with the plurality of molten salt solutions may be within one or more corresponding ranges discussed above with respect to step 503. In other aspects, the plurality of molten salt solutions may sequentially increase the amount of the potassium ion source.

[0089] In aspects, although not shown, step 503 may also include heating the substrate 103 after chemical strengthening. In other aspects, the temperature at which the substrate is heated may be greater than the temperature maintained by the molten salt solution. In other aspects, the temperature at which the substrate is heated may be: about 450°C or higher, about 480°C or higher, about 500°C or higher, about 600°C or lower, about 550°C or lower, about 520°C or lower, or about 500°C or lower. In other aspects, the temperature at which the substrate is heated may be in the range of about 450°C to about 600°C, about 480°C to about 550°C, about 550°C to about 520°C, or any range or sub-range therebetween. In aspects, the substrate may be heated for a period of time of 15 minutes or more, 30 minutes or more, 1 hour or less, 45 minutes or less, or 30 minutes or less, such as the range of 15 minutes to 1 hour, 30 minutes to 45 minutes, or any range or sub-range therebetween.

[0090] After step 501 or 503, if Figure 5As shown, the method can proceed to step 505, including the first main surface 605 (see Figure 6 ) is abraded to form an intermediate first major surface 805 (see Figure 8 ). In aspects, such as Figure 8As shown, abrading the existing first main surface includes impacting the existing first main surface with particles 815 (as shown by arrow 812) ejected from an orifice (e.g., a nozzle of an abrasive device 801), thereby forming an intermediate first main surface 805 having pits 808 formed by abrasion. In other aspects, as shown, the particles 815 ejected from the nozzle 811 can be spread (as shown by spraying 813), which can abrade a predetermined portion of the existing first main surface, but in other aspects, the nozzle can also be rotated or moved to abrade the entire predetermined portion of the existing first main surface. In other aspects, the particles 819 can be fed to the nozzle 811 as a slurry that, based on 100 wt % of the slurry, accounts for: 10 wt % or more, 12 wt % or more, 15 wt % or more, 17 wt % or more, 20 wt % or more, 22 wt % or more, 25 wt % or more, 30 wt % or less, 27 wt % or less, 25 wt % or less, 22 wt % or less, 20 wt % or less, 17 wt % or less, or 15 wt % or less. In other aspects, the particles 819 can be fed to the nozzle 811 as a slurry that, based on 100 wt % of the slurry, accounts for: 10 wt % to 30 wt %, 12 wt % to 27 wt %, 15 wt % to 25 wt %, 17 wt % to 22 wt %, 17 wt % to 20 wt %, or any range or sub-range therebetween. In other aspects, the pressure for particles 815 ejected through nozzle 811 (arrow 812) can be: about 200 kilopascals (kPa) or greater, about 225 kPa or more, about 250 kPa or more, about 275 kPa or more, about 300 kPa or more, about 325 kPa or more, about 350 kPa or more, about 375 kPa or more, about 400 kPa or more, about 425 kPa or more, about 450 kPa or more, about 550 kPa or less, about 525 kPa or less, about 500 kPa or less, about 475 kPa or less, about 450 kPa or less, about 425 kPa or less, about 400 kPa or less, about 375 kPa or less, about 350 kPa or less, about 325 kPa or less, or about 300 kPa or less. In other aspects, the pressure for the particles 815 ejected through the nozzle 811 (arrow 812) can be in the range of about 200 kPa to about 550 kPa, about 200 kPa to about 525 kPa, about 225 kPa to about 500 kPa, about 225 kPa to about 475 kPa, about 250 kPa to about 450 kPa, about 250 kPa to about 425 kPa, about 275 kPa to about 400 kPa, about 275 kPa to about 375 kPa, about 300 kPa to about 350 kPa, or any range or sub-range therebetween.

[0091] In one aspect, the particles 815 may include: SiC, Al 2 O 3 or a combination thereof. In aspects, the median particle size of particles 819 of particles 815 can be about 3 μm or more, about 4 μm or more, about 5 μm or more, about 6 μm or more, about 7 μm or more, about 8 μm or more, about 13 μm or less, about 12 μm or less, about 11 μm or less, about 10 μm or less, about 9 μm or less, about 8 μm or less, about 7 μm or less, about 6 μm or less, or about 5 μm or less. In aspects, the median particle size of particles 819 of particles 815 can be in the range of about 3 μm to about 13 μm, about 3 μm to about 12 μm, about 4 μm to about 11 μm, about 4 μm to about 10 μm, about 5 μm to about 9 μm, about 5 μm to about 8 μm, about 6 μm to about 7 μm, or any range or sub-range therebetween. Although a lower median particle size of particles 819 produces smaller pits 818 (e.g., pit width and / or pit depth 806), there are physical and commercial limits to how small particles can be made (and provided for step 505) (and how uniform such particles can be). In the absence of a chemically strengthened substrate (as produced by step 503), abrasion followed by etching (step 507) produces a textured substrate with high sparkle (e.g., 4% or greater) and / or high haze (e.g., 40% or greater), which is undesirable for use in high resolution display devices. As demonstrated in the examples herein, chemically strengthening a substrate prior to abrasion of the substrate (step 503 or any other means of providing a chemically strengthened substrate) unexpectedly produces smaller pits, which can be etched to produce an anti-glare substrate according to aspects of the present disclosure having low sparkle and / or other optical properties set forth herein.

[0092] After step 505, if Figure 5 As shown, the method can proceed to step 507, including etching the first major surface of the intermediate body to form the first major surface of the anti-glare substrate. Fig. 9 As shown, step 507 may include making at least the first major surface of the intermediate body (see Figure 8) is contacted with an etchant 903 (e.g., contained in a container 901) to form a textured surface 111 of the first major surface 105. In other aspects, the intermediate first major surface can be immersed in the etchant 903 contained in the container 901 to form the textured surface 111 of the first major surface 105. In other aspects, as shown, step 507 can include immersing the entire substrate 103 in the etchant 903 contained in the container 901. At the end of step 507, the existing second major surface (or the resulting surface) is referred to as the second major surface 107, regardless of whether the existing second major surface was etched in step 507.

[0093] Etching the intermediate first major surface produces a textured surface 111 of the first major surface 105 by, for example, isotropic etching of the pits with an etchant, thereby forming a smooth textured surface. Figure 8 ) will be irregular (e.g., in terms of spatial distribution, width and / or depth 806), and the resulting textured surface 111 will also be irregular, as discussed above. In the aspect, during the etching process of step 507, the intermediate first major surface 805 (see Figure 8 ) The thickness of the substrate 103 removed may be greater than or equal to the intermediate first compression depth 703 (see Figure 7 ), which removes the entire intermediate first compressive stress region 702 to produce an anti-glare substrate having a substantially unstrengthened first major surface 105. Alternatively, during the etching process of step 507, the intermediate first major surface 805 (see Figure 8 ) The thickness of the substrate 103 removed may be less than the intermediate first compression depth 703 (see Figure 7 ), so that the maximum first compressive stress of the compressive stress region of the resulting anti-glare substrate is non-zero and can fall within one or more corresponding ranges discussed above (e.g., 25 MPa to 1200 MPa) but is still less than the intermediate maximum first compressive stress. In one aspect, in step 505, an equal amount of material (e.g., thickness) can be removed from the second main surface 607 that already exists on the intermediate first main surface 807, so that the substrate thickness in step 501 and the substrate thickness 109 of the anti-glare substrate 101 fall within one or more corresponding ranges discussed above with reference to step 501. In one aspect, the thickness removed from the intermediate first main surface 805 by etching in step 507 (see Figure 8, without taking into account any thickness removed from the already existing second major surface 607) can be: about 5 μm or more, about 7 μm or more, 9 μm or more, about 12 μm or more, about 15 μm or more, about 18 μm or more, about 20 μm or more, about 22 μm or more, about 25 μm or more, about 100 μm or less, about 80 μm or less, about 60 μm or less, about 40 μm or less, about 30 μm or less, about 28 μm or less, about 25 μm or less, about 23 μm or less, or about 20 μm or less. In aspects, the thickness removed from the intermediate first major surface 805 by etching in step 507 (see Figure 8 , without taking into account any thickness removed from an already existing second major surface 607) can be in the range of about 5 μm to about 100 μm, about 5 μm to about 80 μm, about 7 μm to about 60 μm, about 9 μm to about 40 μm, about 12 μm to about 30 μm, about 15 μm to about 28 μm, about 18 μm to about 25 μm, about 20 μm to about 23 μm, or any range or sub-range therebetween.

[0094] In aspects, the etchant 903 may be an acidic solution. In other aspects, the acidic solution may include an inorganic acid. In other aspects, the acidic solution may include hydrofluoric acid. In even other aspects, the concentration of hydrofluoric acid in the acidic solution may be 1 wt % or more, 2 wt % or more, 3 wt % or more, 5 wt % or more, 7 wt % or more, 10 wt % or more, 20 wt % or less, 17 wt % or less, 15 wt % or less, 12 wt % or less, 10 wt % or less, or 8 wt % or less, based on 100 wt % of the acidic solution. In even other aspects, the concentration of hydrofluoric acid in the acidic solution may be in the range of 1 wt % to 20 wt %, 2 wt % to 18 wt %, 3 wt % to 15 wt %, 5 wt % to 12 wt %, 7 wt % to 10 wt %, or any range or sub-range therebetween, based on 100 wt % of the acidic solution. In other aspects, the acidic solution can be maintained at a temperature of 20°C or more, 23°C or more, 25°C or more, 30°C or more, 35°C or more, 45°C or less, 40°C or less, 36°C or less, 30°C or less, 27°C or less, or 25°C or less in step 507. In other aspects, the acidic solution can be maintained at a temperature in the range of 20°C to 45°C, 20°C to 40°C, 23°C to 36°C, 23°C to 30°C, 25°C to 30°C, or any range or sub-range therebetween in step 507. In other aspects, in step 507, the first intermediate surface can be contacted with the acidic solution for a period of time of 2 minutes or more, 5 minutes or more, 10 minutes or more, 15 minutes or more, 20 minutes or more, 30 minutes or more, 45 minutes or more, 60 minutes or more, 2 hours or less, 1.5 hours or less, 1.25 hours or less, 1 hour or less, 0.75 hours or less, 0.5 hours or less, or 0.25 hours or less. In aspects, in step 507, the first intermediate surface can be contacted with the acidic solution for a period of time in the range of 2 minutes to 2 hours, 5 minutes to 1.5 hours, 10 minutes to 1.25 hours, 15 minutes to 1 hour, 20 minutes to 0.75 hours, 20 minutes to 0.5 hours, or any range or sub-range therebetween.

[0095] Alternatively, in aspects, the etchant 903 may be an alkaline solution including a hydroxide-containing compound. In other aspects, the hydroxide-containing compound may be an alkali metal hydroxide (e.g., NaOH, KOH) or ammonium hydroxide. In other aspects, the concentration of the hydroxide-containing compound may be 10 wt % or more, 15 wt % or more, 20 wt % or more, 25 wt % or more, 30 wt % or more, 35 wt % or more, 40 wt % or more, 45 wt % or more, 50 wt % or more, 70 wt % or less, 65 wt % or less, 60 wt % or less, 55 wt % or less, 50 wt % or less, 45 wt % or less, 40 wt % or less, 35 wt % or less, or 30 wt % or less, based on 100 wt % of the etchant. In other aspects, based on 100 wt % of the etchant, the concentration of the hydroxide-containing compound can be: 10 wt % to 70 wt %, 10 wt % to 65 wt %, 15 wt % to 60 wt %, 15 wt % to 55 wt %, 20 wt % to 50 wt %, 25 wt % to 45 wt %, 30 wt % to 40 wt %, or any range or sub-range therebetween. In other aspects, in step 507, the alkaline solution can be maintained at a temperature of 95°C or more, 100°C or more, 105°C or more, 110°C or more, 115°C or more, 120°C or more, 125°C or more, 130°C or more, 140°C or more, 150°C or more, 165°C or less, 160°C or less, 155°C or less, 150°C or less, 145°C or less, 140°C or less, 135°C or less, 130°C or less, 120°C or less, or 110°C or less. In other aspects, in step 507, the alkaline solution can be maintained at a temperature in the range of 95°C to 155°C, 100°C to 150°C, 105°C to 145°C, 110°C to 140°C, 115°C to 135°C, 120°C to 130°C, or any range or sub-range therebetween. In other aspects, in step 507, the first intermediate surface can be contacted with the alkaline solution for a period of time of 10 minutes or more, 20 minutes or more, 30 minutes or more, 45 minutes or more, 60 minutes or more, 90 minutes or more, 120 minutes or more, 4 hours or less, 3 hours or less, 2.5 hours or less, 2 hours or less, 1.5 hours or less, or 1 hour or less. In other aspects, in step 507, the first intermediate surface can be contacted with the alkaline solution for a period of time ranging from 10 minutes to 4 hours, 20 minutes to 3 hours, 30 minutes to 2.5 hours, 45 minutes to 2 hours, 60 minutes to 1.5 hours, or any range or sub-range therebetween.

[0096] After step 507, the method may proceed to step 509, including treating a display device (eg, Figure 3-4 101 is assembled with an anti-glare substrate 101 (e.g., a consumer electronic device in a display device). For example, second major surface 107 of anti-glare substrate 101 can be arranged above (and / or facing) a pixel display of a display device. In addition, in aspects, an optical stack can be placed between second major surface 107 of anti-glare substrate 101 and the pixel display. In aspects, as described above, anti-glare substrate 101 can be used in conjunction with a plurality of light emitting diodes (e.g., LEDs, OLEDs), for example, in a pixel display as part of a display device and / or a consumer electronic device. After step 507 or 511, the method can be completed after reaching step 511.

[0097] In one aspect, the method for manufacturing the anti-glare substrate 101 according to aspects of the present disclosure may be carried out along the following steps: Figure 5 Steps 501, 503, 505, 507, 509, and 511 of the flowchart of proceed in sequence, as discussed above. In aspects, arrow 502 can be from step 501 to step 505, for example, when at the end of step 501, the substrate 103 is chemically strengthened (e.g., an intermediate first compressive stress region 702 extending to an intermediate first compressive depth 703). In aspects, arrow 504 can be from step 507 to step 511, for example, if the method is completed at the end of step 507. A color-changing sheet according to aspects of the present disclosure can be manufactured in combination with any of the above options.

[0098] Example

[0099] Various aspects are further illustrated by the following examples. Comparative Examples AA-CC and Examples 1-6 used a glass-based substrate having a thickness of 0.5 mm (Composition A comprising approximately 64.5 mol % SiO 2 、15.9 mol% Al 2 O 3 、6.3 mol%Li 2 O, 10.9 mol% Na 2 O, 1.2 mol% ZnO and 1.1 mol% P 2 O 5 Comparative Examples DD-FF and Examples 7-12 used a glass-based substrate having a thickness of 1.0 mm (Composition B comprising approximately 68.6 mol % SiO 2 、12.7 mol% Al 2 O 3 , 0 mol%Li 2 O, 13.6 mol% Na 2 O, 3.7 mol% B 2 O 3and 2.3 mol % MgO).

[0100] Comparative Examples AA-FF were not chemically strengthened prior to abrasion (i.e., the already existing first major surface was not strengthened). 3 and 0.5 wt% LiNO 3 Examples 1-3 were chemically strengthened as in Examples 4-6 and then heated at 500°C for 30 minutes to reduce the maximum compressive stress from 1026 MPa to 122 MPa. Examples 10-12 were chemically strengthened in a molten salt bath containing 100 wt% KNO maintained at 500°C. 3 The samples were chemically strengthened in a molten salt bath (with 0.5 wt% added silicate superaddition) for 6 hours. Examples 7-9 were chemically strengthened as in Examples 10-12 and then in a molten salt bath containing 50 wt% NaNO maintained at 520°C. 3 and 50 wt% KNO 3 Further (e.g., reverse) ion exchange in a molten salt bath (with 0.5 wt. % added silicate super addition) reduces the compressive stress from 587 MPa to 164 MPa. It is understood that the reduced compressive stress of Examples 1-3 and 7-9 (relative to Examples 4-6 and 10-12) can be obtained by modifying a single molten salt solution (instead of additional heat treatment or reverse ion exchange).

[0101] The first major surface of the intermediate of Comparative Examples AA-FF and Examples 1-12 was abraded with SiC particles having a median particle size of 5 μm accounting for 20 wt% of the slurry, which was fed to a spray nozzle that ejected SiC particles at a pressure of about 350 kPa. Then, Comparative Examples AA-FF and Examples 1-12 were etched in an alkaline solution containing 50 wt% NaOH maintained at 120°C, wherein the etching time was adjusted to achieve the "etching thickness" (i.e., not including the thickness removed from the second major surface) (10 μm to 40 μm) stated in Table 1.

[0102] Table 1: Processing and surface properties of Comparative Examples AA-FF and Examples 1-12

[0103]

[0104]

[0105] Table 1 presents the processing details and surface properties of Comparative Examples AA-FF and Examples 1-12, while Table 2 presents the optical properties of these samples. As shown in Table 1, the thickness removed by etching for Examples 1 and 4 is greater than the compression depth provided by chemical strengthening. Therefore, although Examples 1 and 4 were chemically strengthened before abrasion, Examples 1 and 4 were essentially unstrengthened at the end of processing. On the other hand, Examples 2-3 and 5-12 are expected to have distinct compressive stress regions and maximum compressive stress values ​​in the final anti-glare substrate. In contrast, Comparative Examples AA-FF were unstrengthened before abrasion and remained unstrengthened substrates after etching.

[0106] As shown in Table 1, for the same chemical strengthening treatment (demarcated by the thicker line), as the thickness removed by etching increases, the surface roughness Ra, height Rq, and gradient Sdq generally decrease (although the measurement resolution may result in some of the same values ​​being recorded), which is expected to be due to etching smoothing out the pits formed by abrasion. For similar reasons, the feature width Rsm is expected to increase with increasing thickness removed via etching. For different chemical strengthening treatments, the greater the compressive stress (CS) recorded in Table 1, the lower the roughness Ra and height Rq (for example, compare Comparative Example AA with Examples 1 and 4 shown). This confirms that increasing the compressive stress from chemical strengthening reduces the size of the pits formed by abrasion.

[0107] Table 2 presents the optical properties of Comparative Examples AA-FF and Examples 1-12. Comparative Examples 1-12 and Comparative Example AA-FF have a transmittance (T) of 92% to 94%. For the same amount of thickness removed by etching, increasing the compressive stress generally increases the transmittance. Similarly, for the same amount of thickness removed by etching, increasing the compressive stress reduces the haze. Both trends are attributed to the reduction in the size of the pits formed by abrasion due to the increase in compressive stress from chemical strengthening. Comparative Example AA-FF has a haze greater than 10%, while Examples 6, 8 and 11-12 have a haze less than 10%.

[0108] Table 2: Optical properties of Comparative Examples AA-FF and Examples 1-12

[0109] T(％) Haze(%) Glossiness(%) DOI(%) flash(%) Comparative Example AA 92.4 40 21 90.1 3.3 Comparative Example BB 92.8 25 31 87.2 3.9 Comparative Example CC 93.0 14 46 85.1 4.7 Example 1 92.5 35 26 93.7 3.2 Example 2 92.9 23 34 91.3 3.8 Example 3 93.0 13 50 88.9 4.5 Example 4 92.8 19 57 97.6 2.9 Example 5 93.0 14 58 95.7 3.4 Example 6 93.1 8.7 67 93.8 3.8 Comparative Example DD 92.6 41 19 88.9 3.2 Comparative Example EE 93.1 23 32 87.9 4.0 Comparative Example FF 93.2 12 50 86.0 4.7 Example 7 92.7 29 31 95.3 3.1 Example 8 93.1 12 60 95.1 3.6 Example 9 93.2 3.5 101 95.5 3.8 Example 10 93.0 11 79 97.8 2.2 Embodiment 11 93.2 3.4 116 98.0 2.0 Example 12 93.2 0.9 128 98.3 1.5

[0110] As shown in Table 2, Comparative Examples BB-CC and EE-FF have a sparkle greater than 3.9%, while Examples 1-2, 4-5 and 7-12 have a sparkle of 3.8% or less. In addition, Examples 4, 7 and 10-12 have a sparkle of about 1.5% to 3.1%. Comparative Example AA-FF has a gloss of 50% or less, while Examples 4-6 and 8-12 have a gloss of 50% or more (e.g., Examples 9-12 have a haze of 75% or more). On the other hand, Examples 2 and 7 have a gloss of 50% or less (e.g., about 20% to about 50%). Comparative Example AA-FF has a DOI value of about 85% to about 90%, while Examples 1-2 and 4-12 have a DOI value of 91% or more and Examples 4-6 and 7-12 have a DOI value of about 93% or more (e.g., about 94% or more).

[0111] As shown in Table 2, examples with greater compressive stress have approximately the same or lower sparkle than those with lower compressive stress (e.g., compare Comparative Example BB with Examples 2 and 4; compare Comparative Example CC with Examples 3 and 6; compare Comparative Example DD with Examples 7 and 10; compare Comparative Example EE with Examples 8 and 11; and compare Comparative Example FF with Examples 9 and 12). Similarly, increases in compressive stress correlate with reduced haze, increased DOI, and increased gloss.

[0112] Fig.10 Schematic showing haze as a function of thickness removed by etching. Fig.10 , the horizontal axis 1001 (e.g., x-axis) corresponds to the thickness removed (in micrometers (μm)), and the vertical axis 1003 (e.g., y-axis) corresponds to the haze (%). Curve 1005 corresponds to Comparative Examples CC-FF, curve 1007 corresponds to Examples 7-9, and curve 1009 corresponds to Examples 10-12. As shown, the haze decreases as the compressive stress increases (from curve 1005 to curve 1007 and curve 1009).

[0113] Example 12 schematically shows the functional relationship between DOI and haze. Fig.12 , the horizontal axis 1201 (e.g., x-axis) corresponds to haze (%), and the vertical axis 1203 (e.g., y-axis) corresponds to DOI (%). Curve 1209 corresponds to Comparative Examples CC-FF, curve 1207 corresponds to Examples 7-9, and curve 1205 corresponds to Examples 10-12. As shown, an increase in compressive stress is also associated with an increase in DOI. In addition, an increase in the depth removed by etching is associated with an increase in DOI and a decrease in haze. In addition, Fig.12 It is shown that for these examples, DOI and haze are negatively correlated.

[0114] Example 11 schematically shows the functional relationship between sparkle and haze. Fig.11 , the horizontal axis 1101 (e.g., x-axis) corresponds to haze (%), and the vertical axis 1103 (e.g., y-axis) corresponds to sparkle (%). Curve 1105 corresponds to comparative examples CC-FF, curve 1107 corresponds to examples 7-9, and curve 1109 corresponds to examples 10-12. As shown, an increase in compressive stress is also associated with a decrease in sparkle. In addition, an increase in the depth removed by etching is associated with an increase in sparkle and a decrease in haze. For the case of the highest compressive stress (curve 1309), example 12 achieves the lowest sparkle. Although Fig.10 and 12 Results are shown for Comparative Examples DD-FF and Examples 7-12, but similar trends are observed for Comparative Examples AA-CC and Examples 1-6.

[0115] The above observations can be combined to provide anti-glare substrates and display devices including anti-glare substrates, which can reduce their glare by providing a textured surface as part of the first major surface of the anti-glare substrate. Reducing glare through the anti-glare substrates of the present disclosure can increase the uniformity of light emitted from the display device (as perceived by an observer of the display device), and / or can increase the aesthetic appearance of the resulting display device by reducing the perceived graininess associated with glare. As demonstrated in the examples, the methods of the present disclosure can provide anti-glare substrates that exhibit 3.8% or less (e.g., 3.5% or less, or 3.1% or less) glare, which is not achievable by the comparative examples. As demonstrated in the examples, the methods of the present disclosure can provide anti-glare substrates that exhibit 50% or greater gloss and / or 91% or greater (e.g., 93% or greater) DOI, which is not achievable by the comparative examples.

[0116] Without wishing to be bound by theory, it is believed that the properties of the textured surface of the first major surface produced by the method of the present disclosure (e.g., surface roughness Ra, height Rq, width Rsm, gradient Sdq) enable the combination of optical properties stated above to be achieved simultaneously. Although a selected group of combinations of ranges of optical properties for the anti-glare substrate are stated in this paragraph, it is to be understood that other combinations of these ranges of optical properties and / or combinations of other optical properties stated in connection with the present disclosure are also possible in other aspects. Providing the anti-glare substrate as a glass-based substrate and / or a ceramic-based substrate can increase the damage resistance of the display device.

[0117] The textured surface of the anti-glare substrate can be formed by abrading a first major surface that has been chemically strengthened and then etching. As discussed herein for methods of making an anti-glare substrate (e.g., a textured surface), the present disclosure can provide smaller peaks and / or valleys by abrading the first major surface (which is not achievable in any other manner), and the smaller peaks and / or valleys achieve the lower sparkle and other optical properties set forth herein. Although a lower median particle size of the particles produces smaller pits (e.g., pit width and / or pit depth), there are physical and commercial limits to how small the particles can be made (and how uniform such particles can be). In the absence of a chemically strengthened substrate, abrasion followed by etching produces a textured substrate with high sparkle (e.g., 4% or greater) and / or high haze (e.g., 40% or greater), which is undesirable for use in high resolution display devices. As demonstrated in the examples herein, chemically strengthening the substrate prior to abrasion of the substrate unexpectedly produces smaller pits, which can be etched to produce an anti-glare substrate according to aspects of the present disclosure having low sparkle and / or other optical properties set forth herein.

[0118] Directional terms used herein, such as up, down, left, right, front, back, top, and bottom, are only used with reference to the drawings and are not intended to represent absolute orientations.

[0119] It will be understood that the various aspects disclosed may relate to specific features, elements or steps described with a particular aspect. It will also be understood that although specific features, elements or steps are described in conjunction with one aspect, different aspects may be interchanged or combined with each other in various combinations or permutations not shown.

[0120] It is also to be understood that the terms "the," "an," or "an" as used herein mean "at least one" and should not be limited to "only one" unless expressly specified to the contrary. Thus, for example, reference to "an" component includes aspects having two or more such components unless the context clearly indicates otherwise. Similarly, "plurality" is intended to mean "more than one."

[0121] As used herein, the term "about" indicates that the amount, size, formulation, parameter and other variables and characteristics are not and need not be exact, but may be approximate and / or larger or smaller as needed, reflecting tolerances, conversion factors, rounding and measurement errors, etc., as well as other factors known to those skilled in the art. Herein, a range may be expressed as starting from "about" another specific value and / or terminating at "about" another specific value. When such a range is expressed, aspects include starting from a specific value and / or ending at another specific value. Similarly, when the antecedent "about" is used to indicate that a numerical value is an approximate value, it should be understood that a specific numerical value constitutes another aspect. Regardless of whether the numerical value or the endpoint of a range of this specification is stated as "about", the numerical value or the endpoint of the range is intended to include two aspects: one modified by "about" and one not modified by "about". It should also be understood that the endpoint values ​​of each range are meaningful when they are related to another endpoint value and when they are not related to another endpoint value.

[0122] As used herein, the terms "substantially," "substantially," and variations thereof are intended to mean that the described feature is equal to or approximately the same as a value or description. For example, a "substantially flat" surface is intended to mean a flat or approximately flat surface. Additionally, as defined above, "substantially similar" is intended to mean that two values ​​are equal or approximately equal. In aspects, "substantially similar" can mean that the values ​​are within about 10% of each other, such as within about 5% of each other, or within about 2% of each other.

[0123] Unless otherwise stated, it is not intended that any method described herein be construed as requiring that its steps be performed in a specific order. Therefore, when a method claim does not actually state that its steps follow a certain order or it does not specifically indicate in any other way in the claims or description that the steps are limited to a specific order, it is not intended to imply any particular order.

[0124] Although the transitional term "comprising" may be used to disclose various features, elements, or steps of a particular aspect, it is to be understood that this implies including alternative aspects that may be described using the transitional terms "consisting of," "consisting essentially of." Thus, for example, implicit alternative aspects for a device comprising A+B+C include aspects where the device consists of A+B+C and aspects where the device consists essentially of A+B+C. As used herein, unless otherwise noted, the terms "comprising" and "including" and variations thereof should be understood to be synonymous and open ended.

[0125] The above-described aspects and features of those aspects are exemplary and may be provided alone or in any combination with any one or more features of the other aspects provided herein without departing from the scope of the present disclosure.

[0126] It is obvious to those skilled in the art that various modifications and changes can be made to the present disclosure without departing from the scope and spirit of the present disclosure. Therefore, the present disclosure covers modifications and changes to aspects of this document as long as they fall within the scope of the appended claims and their equivalents.

Claims

1. A method for forming an anti-glare substrate: chemically strengthening the existing first main surface; abrading the existing first major surface to form an intermediate first major surface; and etching the first major surface of the intermediate body to form the first major surface of the antiglare substrate, in, Anti-glare substrates exhibit a haze of 3% to 40% and a sparkle of 1% to 3.8%.

2. The method according to claim 1, in, Chemical strengthening includes exposing the existing first major surface to a molten salt solution maintained at a first temperature of 370°C to 500°C for a period of 5 minutes to 8 hours, and the chemical strengthening forms an intermediate compressive stress region extending from the existing first major surface, which has an intermediate maximum compressive stress of 25 MPa to 1500 MPa.

3. The method according to claim 2, in, The antiglare substrate includes a compressive stress region extending from the first major surface comprising a maximum compressive stress of 25 megapascals to 1200 megapascals, the maximum compressive stress being less than the intermediate maximum compressive stress.

4. The method according to any one of claims 1 to 2, in, The first major surface of the antiglare substrate is substantially unreinforced.

5. The method according to any one of claims 1 to 4, in, Abrading includes impacting the existing first major surface with particles comprising a median particle size of 3 microns to 15 microns.

6. The method according to claim 5, in, The particles are propelled at a pressure of 200 kPa to 550 kPa.

7. The method according to any one of claims 5 to 6, in, The particles are pushed from a slurry containing 10 to 30 wt % of the particles, based on 100 wt % of the slurry.

8. The method according to any one of claims 5 to 7, in, Particles include SiC, Al 2 O 3 or a combination thereof.

9. The method according to any one of claims 5 to 8, in, The etching removes a thickness of 5 microns to 100 microns from the intermediate first major surface.

10. The method according to claim 9, in, The etching removed a thickness of 9 microns to 40 microns from the intermediate first major surface.

11. The method according to any one of claims 1 to 10, in, Etching includes contacting the intermediate first major surface with an acidic solution maintained at a temperature of 20° C. to 45° C. for a period of 2 minutes to 2 hours.

12. The method according to claim 11, in, The acidic solution contains 1 wt % to 20 wt % of hydrofluoric acid, based on 100 wt % of the acidic solution.

13. The method according to any one of claims 1 to 10, in, Etching includes contacting the intermediate first major surface with an alkaline solution maintained at a temperature of 95° C. to 165° C. for a period of 10 minutes to 4 hours.

14. The method according to claim 13, in, The alkaline solution contains 10 wt % to 70 wt % of the hydroxide-containing compound, based on 100 wt % of the alkaline solution.

15. The method according to any one of claims 1 to 14, in, The sparkle was 3.1% to 3.8%, and the anti-gloss substrate exhibited a distinctness of image DOI of 98% or less.

16. The method according to any one of claims 1 to 14, in, The sparkle is 1% to 3.1%, and the anti-gloss substrate exhibits a distinctness of image DOI of 91% or greater.

17. The method according to any one of claims 1 to 14, in, The flash is 1.5% to 3.1%.

18. The method according to any one of claims 1 to 17, in, The haze is 8% to 20%.

19. The method according to any one of claims 1 to 18, in, The antiglare substrate exhibits a transmittance of 92% or more and a gloss of 55% to 150%.

20. The method according to any one of claims 1 to 19, in, The surface roughness Ra of the first main surface is 0.03 μm to 0.09 μm.

21. The method according to any one of claims 1 to 20, in, A root mean square height Sq of the first main surface is 0.05 micrometer to 0.17 micrometer.

22. An anti-glare substrate, include: A first major surface comprising a textured surface, the surface roughness Ra of the first major surface being 0.03 μm to 0.09 μm, Among them, the anti-glare substrate is a glass-based substrate or a ceramic-based substrate, and the anti-glare substrate exhibits a haze of 3% to 40% and a glare of 1% to 3.8%.

23. The antiglare substrate according to claim 22, in, The antiglare substrate includes a compressive stress region extending from the first major surface comprising a maximum compressive stress of 25 megapascals to 1200 megapascals.

24. The antiglare substrate according to claim 22, in, The first major surface of the antiglare substrate is substantially unreinforced.

25. The antiglare substrate according to any one of claims 22 to 24, in, The sparkle was 3.1% to 3.8%, and the anti-gloss substrate exhibited a distinctness of image DOI of 98% or less.

26. The antiglare substrate according to any one of claims 22 to 24, in, The sparkle is 1% to 3.1%, and the anti-gloss substrate exhibits a distinctness of image DOI of 91% or greater.

27. The antiglare substrate according to any one of claims 22 to 24, in, The flash is 1.5% to 3.1%.

28. The antiglare substrate according to any one of claims 22 to 27, in, The haze is 8% to 20%.

29. The antiglare substrate according to any one of claims 22 to 28, in, The antiglare substrate exhibits a transmittance of 92% or more and a gloss of 55% to 150%.

30. The antiglare substrate according to any one of claims 22 to 29, in, A root mean square height Sq of the first main surface is 0.05 micrometer to 0.17 micrometer.

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