Display device

Abstract

A display device is disclosed. The display device includes a substrate including a first non-bending area, a second non-bending area, and a bending area disposed between the first non-bending area and the second non-bending area. The display device further includes a transistor and a light emitting diode layer disposed in the first non-bending area on the substrate. The display device further includes a cover layer disposed in the first non-bending area, the second non-bending area, and the bending area on the substrate. The display device further includes a spacer disposed in the second non-bending area on the substrate.

Description

Technical Field

[0001] The present disclosure relates to a display device, and more particularly, for example but not limited to, to a display device that improves crack and moisture permeability problems by providing a cover layer and a spacer. Background Art

[0002] Recently, display devices capable of displaying various information and interacting with a user viewing the information are required to have various sizes, various shapes, and various functions.

[0003] Examples of the display device include a liquid crystal display device (LCD), an electrophoretic display device (FPD), a field emission display device (FED), an organic light emitting display device (OLED), and an inorganic light emitting diode display device (LED).

[0004] As display devices are utilized in various ways, the design of display devices has become more diverse in order to reduce the area of ​​the non-display area where no image is displayed for the aesthetic sensitivity of the user. The high ratio of the size of the light-emitting display area to the size of the non-display area is one of the most important design challenges. All or part of the non-display area is folded to be disposed on the rear surface of the display area so that the non-display area is hidden from the user. Therefore, a display device having an increased ratio of the display area visible to the user is provided.

[0005] In order to provide a display device having an increased ratio of a display area visible to a user, a substrate is bent such that a portion of the substrate has a bent region (or a kinked region).

[0006] The description provided in the description of the background technology section should not be assumed to be prior art simply because it is mentioned in the description of the background technology section or is associated with the description of the background technology section. The description of the background technology section may include information describing one or more aspects of the subject technology, and the description in this part does not limit the present invention. Summary of the invention

[0007] The inventors have recognized that in a display device, a wiring disposed in a bending region may be cracked due to mechanical stress applied to the bending region (or bending region), and the crack may cause external moisture or oxygen to penetrate, resulting in problems such as electrolytic corrosion or corrosion of the wiring, which may interfere with image operation and cause abnormal image display problems. Therefore, an object to be achieved by the present disclosure is to provide a display device including a cover layer and a spacer to remove cracks and short circuits of the wiring generated in a bending region formed during or after a bending process of a substrate due to mechanical stress.

[0008] Another object to be achieved by the present disclosure is to provide a display device, wherein a cover layer is disposed in a bending region and overlaps with a wiring disposed in the bending region to remove cracks and short circuits of the wiring in the bending region.

[0009] According to one aspect of the present disclosure, a display device includes: a substrate, which includes a first non-bending area, a second non-bending area, and a bending area arranged between the first non-bending area and the second non-bending area; a transistor and light-emitting diode layer, which is arranged in the first non-bending area on the substrate; a covering layer, which is arranged in the first non-bending area, the second non-bending area, and the bending area; and a separator, which is arranged in the second non-bending area.

[0010] According to an exemplary embodiment of the present disclosure, a display device includes a cover layer and a spacer to improve cracks and short circuits of wirings generated in a bending region formed during or after a bending process of a substrate due to mechanical stress.

[0011] According to an exemplary embodiment of the present disclosure, the display device includes a covering layer, which is arranged in the bending area and overlaps with the wiring arranged in the bending area to improve cracks and short circuits of the wiring in the bending area formed during or after the bending process of the substrate due to mechanical stress.

[0012] According to an exemplary embodiment of the present disclosure, in a display device, a cover layer disposed in a display region extends to a bending region, so that a separate protective member need not be disposed in the bending region. Therefore, the number and cost of processes for manufacturing a display device can be reduced.

[0013] According to the exemplary embodiments of the present disclosure, in a display device, wiring is not broken and short-circuited, so that the display device is normally driven to provide improved aesthetic sensitivity, lifespan, and reliability and reduce power consumption and / or power.

[0014] The effects of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned above will be apparently understood by those of ordinary skill in the art from the following description.

[0015] The above-described objects to be achieved by the present disclosure, means for achieving the objects, and effects of the present disclosure do not specify essential features of the claims, and therefore, the scope of the claims is not limited to the disclosed contents of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0017] Figure 1is a view showing a display device according to an exemplary embodiment of the present disclosure;

[0018] Figure 2 is a plan view of a display panel according to an exemplary embodiment of the present disclosure;

[0019] Figure 3 According to an exemplary embodiment of the present disclosure Figure 2 A cross-sectional view taken along line II';

[0020] Figure 4 is a cross-sectional view of a display device according to an exemplary embodiment of the present disclosure;

[0021] Figure 5 is a plan view showing a display driver of a display panel according to an exemplary embodiment of the present disclosure;

[0022] Figure 6 is a view showing an arrangement of a light emitting unit and a non-light emitting unit of a display device according to an exemplary embodiment of the present disclosure;

[0023] Figure 7 According to an exemplary embodiment of the present disclosure Figure 6 A cross-sectional view taken along line II-II'; and

[0024] Figure 8 According to an exemplary embodiment of the present disclosure Figure 5 A cross-sectional view taken along line III-III'.

[0025] Throughout the drawings and detailed description, unless otherwise described, the same drawing reference numerals should be understood to refer to the same elements, features, and structures. The relative sizes and depictions of these elements may be exaggerated for clarity, illustration, and convenience. DETAILED DESCRIPTION

[0026] Through the attachment Figure 1 The advantages and features of the present disclosure and the methods for achieving the advantages and features will be clear with reference to the exemplary embodiments described in detail below. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only by way of example so that those skilled in the art can fully understand the disclosure of the present disclosure and the scope of the present disclosure.

[0027] The shapes, sizes, dimensions (e.g., length, width, height, thickness, radius, diameter, area, etc.), ratios, angles, quantities, etc. shown in the drawings for describing exemplary embodiments of the present disclosure are only examples, and the present disclosure is not limited thereto. Throughout the specification, similar reference numerals generally represent similar elements. In addition, in the following description of the present disclosure, a detailed explanation of known related art may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "comprising", "having", "including", "containing", "constituting", "made of", "formed of", "composed of" used herein are generally intended to allow the addition of other components, unless such terms are used together with the term "only". Unless otherwise expressly stated, any reference to the singular may include the plural.

[0028] The dimensions including size and thickness of the various components shown in the drawings are shown for ease of description, and the present disclosure is not limited to the size and thickness of the components shown, but it should be noted that the relative dimensions including relative size, position and thickness of the components shown in the various drawings submitted herein are part of the present disclosure.

[0029] Even if not explicitly stated, the components are interpreted as including the ordinary error range.

[0030] When terms such as "on," "over," "above," "below," "below," "beside," "under," "near," "near," "adjacent," "on the side of," and "close" are used to describe the positional relationship between two components, one or more components may be located between the two components unless such terms are used together with the terms "immediately" or "directly."

[0031] Spatially relative terms, such as "below," "below," "under," "lower," "above," "upper," etc., may be used herein to describe the relationship of one element or feature to another element or feature as shown in the figures. It should be understood that, in addition to the orientation shown in the figures, spatially relative terms may also include different orientations of elements in use or operation. For example, if the elements in the figures are inverted, elements described as being "below" or "below" other elements or features will be oriented as being "above" other elements or features. Therefore, the exemplary term "below" may include orientations below and above. Similarly, the exemplary terms "above" or "above" may include orientations "above" and "below."

[0032] When terms such as "after", "continuous to", "next", and "before" are used to describe a temporal order relationship, the order may not be sequential unless such terms are used with the terms "immediately" or "directly".

[0033] Although the terms "first", "second", "A", "B", "a", and "b" are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component to be mentioned below may be the second component in the technical concept of the present disclosure.

[0034] When describing the components of the exemplary embodiments of the present disclosure, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are used to distinguish components from other components, but the nature, order or number of the components are not limited by the terms. When a component is "linked," "coupled," or "connected" to another component, the component may be directly linked or connected to the other component. However, unless otherwise specifically stated, it should be understood that a third component may be interposed between components that may be indirectly linked or connected.

[0035] It should be understood that “at least one” includes all combinations of one or more associated components. For example, “at least one of the first, second and third components” means not only including the first, second or third component, but also including all combinations of two or more of the first, second and third components.

[0036] In this specification, in a narrow sense, "display device" may include a display device including a display panel and a driver for driving the display panel, such as a liquid crystal module (LCM), an organic light emitting module (OLED module) and a quantum dot module. In addition, "display device" may also include a complete set of electronic equipment or a complete set of equipment (or a complete set of devices) such as a notebook computer, a television set or a computer monitor as a complete product or final product including an LCM, an OLED module, a QD module, etc., an automobile display device or an equipment display device including other types of vehicles, and a mobile electronic device including a smart phone or an electronic tablet.

[0037] Therefore, the display device disclosed in the present invention may include not only the narrow display device itself such as LCM, OLED module, QD module, etc., but also the application product or complete set of equipment including LCD, OLED module, QD module, etc. as the final consumer device.

[0038] Furthermore, in some cases, an LCM, an OLED module, or a QD module configured by a display panel and a driver may be represented as a "display device" in a narrow sense, and an electronic device as a complete product including an LCM, an OLED module, and a QD module may be represented as a "set of equipment". For example, a display device in a narrow sense includes a liquid crystal (LCD) display panel, an OLED display panel, or a quantum dot display panel, and a source PCB as a controller for driving the display panel. In contrast, a set of equipment may be a concept that further includes a set of PCBs, which are set controllers electrically connected to the source PCB to control the entire set of equipment.

[0039] As the display panel used in the exemplary embodiment of the present disclosure, any type of display panel such as a liquid crystal display panel, an organic light emitting diode (OLED) display panel, a quantum dot (QD) display panel, an electroluminescent display panel, etc. can be used. The display panel of the exemplary embodiment of the present disclosure is not limited to a specific display panel whose frame is bent using a flexible substrate for an organic light emitting diode (OLED) display panel and a backplane support structure thereunder. In addition, the display panel for a display device according to the exemplary embodiment of the present disclosure is not limited to the shape or size of the display panel.

[0040] The features of various exemplary embodiments of the present disclosure may be partially or completely coupled or combined with each other, and may be technically interlocked and operated in various ways, and the exemplary embodiments may be performed independently or in association with each other.

[0041] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the example embodiments belong. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such in this article.

[0042] In aspects of the present disclosure, for ease of description, source electrodes and drain electrodes are distinguished from each other. However, source electrodes and drain electrodes may be used interchangeably. A source electrode may be a drain electrode, and a drain electrode may be a source electrode. In addition, a source electrode in any aspect of the present disclosure may be a drain electrode in another aspect of the present disclosure, and a drain electrode in any aspect of the present disclosure may be a source electrode in another aspect of the present disclosure.

[0043] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings and exemplary embodiments. For the purpose of description, the scale of components shown in the drawings is different from the actual scale, so that the scale is not limited to the scale shown in the drawings.

[0044] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0045] Figure 1 is a view showing a display device according to an exemplary embodiment of the present disclosure.

[0046] Figure 1 1 is a view showing a state in which the display panel 1 of the display device 1000 according to the exemplary embodiment of the present disclosure is bent.

[0047] The display panel 1 may include a bending area BA and a non-bending area NBA. According to the area of ​​the substrate, the non-bending area NBA may include two or more areas. For example, the substrate may have a bending area BA between two non-bending areas NBA.

[0048] The bending area BA is an area formed by bending a portion of the display panel 1. Alternatively, the bending area BA is an area formed by bending a portion of the substrate 110 included in the display panel 1. For example, the bending area is an area formed by bending a portion of the substrate 110 to set a pad unit and an external module bonded to the pad unit on the rear surface of the substrate 110. For example, when the bending area BA is bent toward the rear surface of the substrate 110, the external module of the pad unit bonded to the substrate 110 moves to the rear surface of the substrate 110, and the external module may not be visible from the top of the substrate 110. In addition, because the bending area BA is bent, the size of the non-display area NA visible from the top of the substrate 110 is reduced, so that a narrow bezel can be achieved.

[0049] The non-bending area NBA is a part of the substrate 110 that is not bent but flat. In the present disclosure, the non-bending area NBA may include two areas. For example, the non-bending area may include a first non-bending area NBA1 and a second non-bending area NBA2, wherein a plurality of sub-pixels SP are disposed in the first non-bending area NBA1 to display an image, and a pad connected or bonded to the flexible film 2 is disposed in the second non-bending area NBA2. However, the arrangement of the bending area BA and the non-bending area NBA of the present disclosure is not limited thereto, for example, the non-bending area NBA may include three areas, the bending area BA may include two areas, and the bending area BA may be disposed between the non-bending areas NBA, but is not limited thereto.

[0050] like Figure 1 As shown, the first non-bending area NBA1 and the second non-bending area NBA2 are bent by the bending area BA to be opposite to each other.

[0051] The display panel 1 may include a display area AA and a non-display area NA which completely or partially surrounds the display area AA. The non-display area NA may be adjacent to the display area AA and disposed outside the display area AA.

[0052] The display area AA may be an area where pixels P are provided to display an image. The non-display area NA is an area where no image is displayed and various wirings and driving circuits for driving a plurality of sub-pixels SP provided in the display area AA are provided. Figure 2 The display area AA and the non-display area NA are described in detail.

[0053] Figure 2 is a plan view of a display panel according to an exemplary embodiment of the present disclosure.

[0054] Reference Figure 2 , a display device 1000 according to an exemplary embodiment of the present disclosure may include a display panel 1 and a flexible film 2 .

[0055] The display panel 1 may be a panel that displays an image. For example, the display panel 1 may use any type of display panel such as a liquid crystal display panel, an organic light emitting diode (OLED) display panel, an inorganic light emitting diode (LED) display panel, and an electroluminescent display panel, but the exemplary embodiment is not limited thereto.

[0056] The display panel 1 may include a substrate 110 disposed in the first non-bending area NBA1, the second non-bending area NBA2, and the bending area BA. The display panel 1 may include the substrate 110, a plurality of components disposed on the substrate, and a combination thereof. For example, the display panel 1 may include the substrate 110, a display driver DISP, an encapsulation unit 600, and a touch unit 700.

[0057] In some exemplary embodiments, the substrate 110 may be made of a flexible polymer film. For example, the flexible polymer film may be made of any one of polyimide (PI), polyethylene terephthalate (PET), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polycarbonate (PC), polyether sulfone (PES), polyarylate (PAR), polysulfone (PSF), cyclic olefin copolymer (COC), triacetyl cellulose (TAC), polyvinyl alcohol (PVA), and polystyrene (PS). However, the present disclosure is not limited thereto.

[0058] The flexible film 2 may electrically connect the display panel 1 to a printed circuit board that generates a pixel driving signal and outputs it to the display panel 1 .

[0059] Alternatively, the flexible film 2 may transmit a signal output from the printed circuit board to the display panel 1 and / or the printed circuit board.

[0060] The flexible film 2 may be formed of a material having flexibility, and, for example, may be formed of a plastic material such as polyimide (PI).

[0061] The first non-bending area NBA1 of the display panel 1 may include a display area AA and a non-display area NA surrounding the display area AA. The non-display area NA may be adjacent to the display area AA and may be disposed outside the display area AA.

[0062] The display area AA may be an area where pixels P are set to display an image. A plurality of sub-pixels SPX are the minimum units constituting the display area, and n sub-pixels SPX form one pixel. Each of the plurality of sub-pixels SPX may emit light having wavelengths different from each other. The display area AA may include a plurality of sub-pixels SP1, SP2, and SP3 or may include a plurality of sub-pixels SP1, SP2, SP3, and SP4, and the plurality of sub-pixels SP1, SP2, and SP3 or the plurality of sub-pixels SP1, SP2, SP3, and SP4 may include a light-emitting diode layer for displaying an image and a thin film transistor for driving the light-emitting diode layer. For example, the plurality of sub-pixels SPX may include a red sub-pixel SPX, a green sub-pixel SPX, and a blue sub-pixel SPX. According to the present exemplary embodiment, at least some of the plurality of pixels PX may also include a white sub-pixel SPX. The plurality of sub-pixels SPX may be variously modified in color and configuration as needed. However, the present disclosure is not limited thereto.

[0063] For example, a plurality of sub-pixels SPX may include a red sub-pixel, a green sub-pixel, and a blue sub-pixel, wherein the red sub-pixel, the green sub-pixel, and the blue sub-pixel may be arranged in a repeated manner. Alternatively, a plurality of sub-pixels SPX may include a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel, wherein the red sub-pixel, the green sub-pixel, the blue sub-pixel, and the white sub-pixel may be arranged in a quadrilateral type. For example, the red sub-pixel, the blue sub-pixel, and the green sub-pixel may be arranged sequentially along the row direction, or the red sub-pixel, the blue sub-pixel, the green sub-pixel, and the white sub-pixel may be arranged sequentially along the row direction. However, in an embodiment of the present disclosure, the color type, arrangement type, and arrangement order of the sub-pixel are not limited, and may be configured in various forms according to the luminous characteristics, device life, and device specifications.

[0064] In addition, the sub-pixels may have different light-emitting areas according to the light-emitting characteristics. For example, a sub-pixel emitting light of a color different from the color of the blue sub-pixel may have a light-emitting area different from the light-emitting area of ​​the blue sub-pixel. For example, a red sub-pixel, a blue sub-pixel, and a green sub-pixel, or a red sub-pixel, a blue sub-pixel, a white sub-pixel, and a green sub-pixel may each have a different light-emitting area.

[0065] The non-display area NA may be an area where no image is displayed and where various wirings and driving circuits for driving the plurality of sub-pixels SP disposed in the display area AA are disposed. The non-display area NA does not display an image, so that a portion of the non-display area NA may be bent to reduce the non-display area NA, such as a frame area.

[0066] The pad unit 114 may be disposed on one side of the second non-bending area NBA2 of the display panel 1. The pad unit 114 may be a metal pattern to which an external module such as a flexible printed circuit board (FPCB) and a chip on film (COF) is bonded. Although the pad unit 114 is shown to be disposed on one side of the display panel 1, the shape and arrangement of the pad unit 114 are not limited thereto. For example, the pad unit 114 may be disposed on both sides of the display panel 1.

[0067] The connection line 116 may be disposed in a portion of the non-display area NA. The connection line 116 may be disposed in a bending area BA of the display device and first and second non-bending areas NBA1 and NBA2 adjacent to the bending area BA.

[0068] The connection line 116 may be a configuration for transmitting a signal (e.g., a voltage) from an external module bonded to the pad unit 114 to the display area AA or a circuit unit such as the gate driver 112. For example, various signals and voltages such as various gate signals, data signals, high potential voltages, and low potential voltages may be transmitted through the connection line 116.

[0069] The connection lines 116 may be divided into power connection lines and / or signal connection lines according to the voltage and / or image signal to be transmitted.

[0070] The power connection line may transmit a voltage supplied from an external module to the display area AA. The power connection line may be connected to a low potential voltage line VSS, a high potential voltage line VDD, and a gate low voltage line and / or a gate high voltage line included in a gate driver, but is not limited thereto.

[0071] The signal connection line may transmit a signal supplied from an external module to the display area AA. The signal connection line may be connected to a scan line and / or a data line, but is not limited thereto.

[0072] Figure 3is a view showing a display device before bending according to an exemplary embodiment of the present disclosure. Figure 3 is corresponding to Figure 2 A cross-sectional view of the display device in an area of ​​line II' of the display panel.

[0073] Reference Figure 3 , a display device 1000 according to an exemplary embodiment of the present disclosure may include a display panel 1 and a cover layer 800 .

[0074] The display panel 1 may display an image in a display device. The display panel according to the present disclosure may include a light emitting diode display device. Figures 5 to 8 Components of the display panel 1 are described.

[0075] A cover layer 800 , a polarizer 6 , and a flexible film 2 may be disposed on the display panel 1 .

[0076] The cover layer 800 may be disposed in the first non-bending area NBA1 and the bending area BA. Alternatively, the cover layer 800 may be disposed in a partial area of ​​the second non-bending area NBA2 adjacent to the bending area BA.

[0077] The cover layer 800 may be formed to extend from the first non-bending area NBA1 to the bending area BA and to a portion of the second non-bending area NBA2, but the present disclosure is not limited thereto.

[0078] The cover layer 800 disposed in the first non-bending area NBA1 may additionally planarize an area where a component disposed under the cover layer 800 is not planarized. Alternatively, the cover layer 800 may effectively block moisture and oxygen from entering from the outside of the display device.

[0079] The cover layer 800 disposed in the bending area BA can suppress cracks generated when the display panel 1 is bent and the problem of external moisture penetration. Alternatively, the cover layer can suppress the short circuit problem of the connection line 116 caused by the external impact applied to the bending area BA after bending or the problem of external moisture and / or oxygen penetrating into the display panel.

[0080] The cover layer 800 is disposed in a portion of the second non-bending area NBA2 to suppress a problem in which the cover layer 800 is not applied in the non-bending area NBA.

[0081] The cover layer 800 is disposed in the bending area BA and the first non-bending area NBA1 and may perform a process of bending the substrate 110. The cover layer 800 disposed in the bending area BA may minimize breakage of the display device due to cracks that may be generated during the bending process.

[0082] Even after the bending process, the cover layer 800 can minimize the breakage of the display device due to external impact, and the cracks and separation of the display panel are prevented to transmit signals normally. Therefore, a display device with improved reliability and low power can be provided. In addition, there is no need to arrange a separate protective member in the bending area BA, thereby reducing the number of processes and saving costs.

[0083] The separator 1300 controlling the cover layer 800 may be disposed on one side of the second non-bending area NBA2. For example, the separator 1300 may be disposed in the second non-bending area NBA2. For example, the separator 1300 may be disposed on one side of the bending area BA and spaced apart from one side of the bending area BA.

[0084] The spacer 1300 may be disposed along the periphery of at least one surface of the capping layer 800 to control the flow of the capping layer 800 composed of an organic material. The number of the spacer 1300 may be one or more, and the exemplary embodiments of the present disclosure are not limited thereto.

[0085] Will refer to Figure 7 and Figure 8 The configurations of the cover layer 800 and the spacer 1300 are described in detail.

[0086] The flexible film 2 may be disposed in the second non-bending area NBA2.

[0087] The flexible film 2 may be attached to the display panel 1 using an adhesive member 10. The adhesive member 10 may be formed of a material having adhesiveness, and for example, may be formed of an optically clear adhesive (OCA) or a pressure sensitive adhesive (PSA), but is not limited thereto.

[0088] The polarizer 6 may be disposed on at least a portion of the cover layer 800. The polarizer 6 may be disposed in the first non-bending area NBA1. For example, the polarizer 6 may be disposed in a partial area of ​​the first non-bending area NBA1, but the present disclosure is not limited thereto.

[0089] The polarizer 6 selectively transmits light to reduce the reflection of external light incident on the display device 1000. For example, the display device may include various metal materials applied to thin film transistors, light emitting diode layers, and wiring. External light incident on the display device may be reflected from the metal material, so that the visibility of the display device 1000 may be reduced due to the reflection of the external light. Therefore, the polarizer 6 is provided on one surface of the display device 1000 to suppress the reflection of external light and increase the outdoor visibility of the display device 1000.

[0090] However, depending on the structure of the display device 1000 , the polarizer 6 may be omitted.

[0091] The polarizer 6 may be attached to the display panel 1 using an adhesive member 10 .

[0092] The adhesive member 10 may be formed of a material having adhesiveness, and may be formed of, for example, an optically clear adhesive (OCA) or a pressure sensitive adhesive (PSA), but is not limited thereto.

[0093] The front member 7 may be disposed on the polarizer 6 and the cover layer 800. The front member 7 may be disposed in the first non-bending area NBA1 and the bending area BA. For example, the front member 7 may be disposed in the first non-bending area NBA1 and extend to a partial area of ​​the bending area BA. The front member 7 may protect the display panel 1 and other components disposed below or above the front member from external impact, moisture and heat. The front member 7 may be formed of a material having impact resistance and optical transmittance. For example, the front member 7 may be a substrate formed of glass or a film formed of a plastic material such as polymethyl methacrylate (PMMA), polyimide (PI) or polyethylene terephthalate (PET), but is not limited thereto. In addition, the front member 7 may be referred to as various terms, such as a cover window, a window cover or a cover glass, but exemplary embodiments of the present disclosure are not limited thereto.

[0094] The front member 7 may be formed to be transparent to allow light emitted from the display panel 1 to be transmitted to the outside of the display device and to allow a user to see an image provided by the display device.

[0095] The blocking unit may be provided at an end of the front member 7. The blocking unit may be provided to surround a portion of the end of the display panel 1. The blocking unit may be formed to be opaque so that wiring, a driving circuit, and various components formed under or over the front member 7 in the display device are not visible to the user.

[0096] The blocking unit may include a light shielding material such as a pigment, a dye, and carbon black. For example, the blocking unit may be formed in the front member 7 or coated with black ink. Alternatively, the blocking unit is formed at the edge of the rear surface of the front member 7 as a separate component to be attached to the front member 7.

[0097] The blocking unit may be disposed to overlap a portion of at least one of the display panel 1, the first plate 3a, the support member 4, or the heat dissipation member 5. When the display panel 1 is bent, the blocking unit may be disposed to overlap a portion of one or more of the second plate 3b or the flexible film 2.

[0098] A board, a supporting member, and a heat dissipation member are provided on the rear surface of the display panel 1 .

[0099] The plate may be disposed on the rear surface of the display panel 1. The display panel 1 may be supported and protected from the rear surface of the display panel 1. The plate may be formed of a material having rigidity and high thermal conductivity. For example, the plate may be formed of a metal material such as aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), stainless steel (SUS), or invar alloy, or a material such as plastic, but exemplary embodiments of the present disclosure are not limited thereto.

[0100] In the present disclosure, the board may include a first board 3a and a second board 3b. The first board 3a is disposed in the first non-bending area NBA1 and supports the display panel 1 having a flexible property to correspond to the display area AA of the display panel 1, thereby maintaining a flat state of the display panel. The second board 3b is disposed in the second non-bending area NBA2 and may support the flexible film 2 having a flexible property and the display panel 1.

[0101] The first plate 3 a and the second plate 3 b may be attached to the display panel 1 using an adhesive member 10 .

[0102] The adhesive member 10 may be formed of a material having adhesiveness, and may be formed of, for example, an optically clear adhesive (OCA) or a pressure sensitive adhesive (PSA), but is not limited thereto.

[0103] The support member 4 may be disposed on the rear surface of the first plate 3 a in the first non-bending area NBA1 .

[0104] The support member 4 may support one or more of the rear surface or the side surfaces of the display panel 1 , and may have a plate shape.

[0105] The support member 4 may be formed of a material having high rigidity and high thermal conductivity. For example, the support member 4 may be formed of a metal material such as aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), stainless steel (SUS) or Invar alloy or a material such as plastic, but the exemplary embodiments of the present disclosure are not limited thereto.

[0106] The supporting member 4 may be attached to the first plate 3 a using an adhesive member 10 .

[0107] The heat dissipation member 5 may be disposed on the rear surface of the support member 4 .

[0108] The heat dissipation member 5 can dissipate the heat transferred from the display panel 1. The heat dissipation member 5 includes a material with excellent thermal conductivity to disperse and dissipate the heat transferred from the display panel. For example, the heat dissipation member 5 can be formed of a metal material such as aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), stainless steel (SUS), invar alloy or graphite or a material such as plastic, and can include at least one or more materials, alloy materials thereof, or a bonding structure thereof. However, exemplary embodiments of the present disclosure are not limited thereto.

[0109] Figure 4 is a cross-sectional view of a display device according to an exemplary embodiment of the present disclosure.

[0110] In addition to the configuration after bending, Figure 4 Basically Figure 3 The same, so redundant description will be omitted.

[0111] exist Figure 4 In the embodiment, the bending process may be performed after attaching the display panel and the components disposed on the rear and front surfaces of the display panel. The first non-bending area NBA1 and the second non-bending area NBA2 may be opposite to each other. In addition, the second plate 3b and the heat dissipation member 5 may be attached using the adhesive member 10 through the bending process.

[0112] The cover layer 800 disposed in the bending area may be disposed on the display panel 1. For example, the cover layer 800 is formed on the display panel 1 in the bending area BA before the bending process to be bent with the display panel 1 during the bending process, thereby being disposed along the bending area.

[0113] The cover layer 800 disposed in the display area AA of the first non-bending area NBA1 may extend to the bending area BA and / or the non-bending area NBA. For example, the cover layer 800 disposed in the display area AA of the first non-bending area NBA1 may extend to the bending area BA and may extend to a portion of the non-bending area NBA, but the present disclosure is not limited thereto.

[0114] The cover layer 800 may cover the side surface of the display panel 1 disposed in the bending area BA. After arranging the frame 13 formed to reinforce the side surface of the display panel after the bending process, the side surface of the display device may be covered. Alternatively, the cover layer 800 may cover a portion of the display panel 1 disposed in the non-bending area NBA.

[0115] The connection line 116 disposed in the bending area BA is easily short-circuited by external impact, thereby causing the display device to fail to be driven. In order to prevent cracks or short-circuit problems of the connection line 116, a cover layer 800 may be disposed.

[0116] The cover layer 800 protects the connection line 116 disposed in the bending area BA to suppress a short circuit due to an impact from the outside. In addition, the display panel 1 may be suppressed from being broken or damaged, such as twisted or deformed.

[0117] The spacer 1300 may be disposed in the non-bending area NBA and may be disposed to be vertically opposite to the display area AA. The spacer 1300 may overlap at least a portion of the display area AA.

[0118] Figure 5 is a plan view showing a display driver of a display panel according to an exemplary embodiment of the present disclosure.

[0119] Reference Figure 5 The display panel 1 may include a substrate 110 having a display area AA and a non-display area NA.

[0120] The display panel 1 may include a substrate 110 , a display driver DISP, an encapsulation unit 600 , and a touch unit 700 .

[0121] A display driver DISP including a thin film transistor and a light emitting diode layer may be disposed on the substrate 110. An encapsulation unit 600, a touch unit 700, a cover layer 800, and a spacer 1300 may be disposed on the display driver DISP.

[0122] The substrate 110 may include a display area AA and a non-display area NA surrounding the display area AA. The non-display area NA of the substrate 110 is adjacent to the display area AA and disposed outside the display area AA.

[0123] The display area AA is an area where pixels P are provided to display images, and may include a plurality of sub-pixels SP1, SP2, and SP3. Each of the plurality of sub-pixels SP1, SP2, and SP3 may include a light emitting diode layer for displaying images and a thin film transistor for driving the light emitting diode layer.

[0124] The pixel P disposed in the display area AA may further include a plurality of sub-pixels SP1, SP2, and SP3 or may include a plurality of sub-pixels SP1, SP2, SP3, and SP4. The plurality of sub-pixels SP1, SP2, and SP3 or the plurality of sub-pixels SP1, SP2, SP3, and SP4 are separate units that emit light and may emit red light, green light, blue light, and / or white light, and exemplary embodiments of the present disclosure are not limited thereto.

[0125] One sub-pixel SP may include a plurality of transistors T, a capacitor C, and a plurality of wirings. For example, one sub-pixel SP may be configured with a structure 2T1C including two transistors and one capacitor, but is not limited thereto, and may be configured with 3T1C, 4T1C, 5T1C, 6T1C, 7T1C, 3T2C, 4T2C, 5T2C, 6T2C, 7T2C, and 8T2C, and may be implemented according to the structure and type of the thin film transistor.

[0126] The active layer of the thin film transistor TFT may be formed of a semiconductor material, such as an oxide semiconductor, an amorphous semiconductor, or a polycrystalline semiconductor, but is not limited thereto.

[0127] Oxide semiconductor materials can have excellent effects of preventing leakage current and relatively cheap manufacturing costs. Oxide semiconductors can be made of metal oxides such as zinc (Zn), indium (In), gallium (Ga), tin (Sn) and titanium (Ti) or metals such as zinc (Zn), indium (In), gallium (Ga), tin (Sn) or titanium (Ti) and combinations of their oxides. Specifically, oxide semiconductors can include zinc oxide (ZnO), zinc tin oxide (ZTO), zinc indium oxide (ZIO), indium oxide (InO), titanium oxide (TiO), indium gallium zinc oxide (IGZO), indium zinc tin oxide (IZTO), indium zinc oxide (IZO), indium gallium tin oxide (IGTO) and indium gallium oxide (IGO), but are not limited thereto.

[0128] The polycrystalline semiconductor material has a fast moving speed of carriers such as electrons and holes, and thus has high mobility, and has low power consumption and excellent reliability. The polycrystalline semiconductor may be made of polycrystalline silicon (poly-Si), but is not limited thereto.

[0129] The amorphous semiconductor material may be made of amorphous silicon (a-Si), but is not limited thereto.

[0130] The non-display area NA may be an area where no image is displayed and where various wirings and driving circuits for driving the plurality of sub-pixels SP disposed in the display area AA are disposed. The non-display area NA does not display an image, so that a portion of the non-display area NA of the substrate 110 may be bent to reduce the non-display area NA, such as a frame area.

[0131] Despite Figure 5 In the figure, the non-display area NA is shown to surround the quadrilateral display area AA, but the shape of the display area AA and the shape and arrangement of the non-display area NA adjacent to the display area AA are not limited to Figure 5The display area AA and the non-display area NA may have a shape suitable for the design of an electronic device including the display device 1000. In the case of a display device that can be worn by a user, the display area AA may have a circular shape such as a watch, and the exemplary embodiments of the present disclosure may also be applied to a free-form display device suitable for a vehicle dashboard. An exemplary shape of the display area AA may be a pentagon, a hexagon, a circle, or an oval, but is not limited thereto.

[0132] The display device 1000 may also include various additional elements to generate various signals or drive multiple sub-pixels SP1, SP2 and SP3 or multiple sub-pixels SP1, SP2, SP3 and SP4 in the display area AA. For example, the driving circuit for controlling (or driving) multiple sub-pixels SP1, SP2 and SP3 or multiple sub-pixels SP1, SP2, SP3 and SP4 may include a gate driver 112, a data signal line, a multiplexer (MUX), an electrostatic discharge (ESD) circuit, a power line, an inverter circuit, a connection line 116, etc. The power line may be a high potential voltage line and / or a low potential voltage line, and the exemplary embodiments of the present disclosure are not limited thereto. The display device 1000 may include additional elements in addition to the functions for driving multiple sub-pixels SP1, SP2 and SP3 or multiple sub-pixels SP1, SP2, SP3 and SP4. For example, the display device 1000 may include additional elements that provide a touch sensing function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure sensing function or a tactile feedback function, and the exemplary embodiments of the present disclosure are not limited thereto. The mentioned additional elements may be located in the non-display area NA or in an external circuit connected to the connection interface, and exemplary embodiments of the present disclosure are not limited thereto.

[0133] The pad unit 114 may be disposed on one side of the non-display area NA. The pad unit 114 may be a metal pattern bonded to an external module such as a flexible film (flexible printed circuit board FPCB) and a chip on film (COF). Although the pad unit 114 is shown to be disposed on one side of the substrate 110, the shape and arrangement of the pad unit 114 are not limited thereto.

[0134] The gate driver 112 that supplies a gate signal to the thin film transistor may be disposed in the non-display area NA located at both sides of the display area AA, respectively, but the present disclosure is not limited thereto, and the gate driver 112 may also be disposed in the non-display area NA located at one side of the display area AA. The gate driver 112 includes various gate driving circuits, and the gate driving circuits may be directly formed on the substrate 110. In this case, the gate driver 112 may be a gate in panel (GIP), but is not limited thereto.

[0135] The gate driver 112 may be disposed between the display area AA and the dam 117. A high potential voltage line VDD, a low potential voltage line VSS, a multiplexer (MUX), an electrostatic discharge (ESD) circuit unit, and a connection line 116 may be disposed between the pad unit 114 of the non-display area NA and the display area AA, and exemplary embodiments of the present disclosure are not limited thereto.

[0136] The high potential voltage line VDD, the low potential voltage line VSS, the multiplexer (MUX) and the connection line 116 may be disposed between the display area AA and the bending area BA. The high potential voltage line VDD, the low potential voltage line VSS, the multiplexer (MUX) and the connection line 116 may be disposed in the non-display area NA adjacent to the display area AA.

[0137] The connection line 116 may be disposed in a portion of the non-display area NA. The connection line 116 may be disposed in the bending area BA of the display device and a non-bending area adjacent to the bending area BA.

[0138] The connection line 116 may be a configuration for transmitting a signal (e.g., a voltage) from an external module bonded to the pad unit 114 to the display area AA or a circuit unit such as the gate driver 112. For example, various signals and voltages such as various gate signals, data signals, high potential voltages, and low potential voltages may be transmitted through the connection line 116.

[0139] The connection lines 116 may be classified as power connection lines and / or signal connection lines according to voltage and / or image signals to be transmitted.

[0140] The power connection line may transmit a voltage supplied from an external module to the display area AA. The power connection line may be connected to a low potential voltage line VSS, a high potential voltage line VDD, and a gate low voltage line and / or a gate high voltage line included in a gate driver, but is not limited thereto.

[0141] The signal connection line may transmit a signal supplied from an external module to the display area AA. The signal connection line may be connected to a scan line and / or a data line, but is not limited thereto.

[0142] The dam 117 may be disposed in the non-display area NA to surround all or a portion of the display area AA. The dam 117 may be adjacent to the display area AA and may be disposed outside the display area AA.

[0143] The dam 117 may be disposed along the periphery of the display area AA to control the flow of a layer including an organic material of an encapsulation unit disposed on the light emitting diode layer. The number of the dam 117 may be one or more, and the exemplary embodiments of the present disclosure are not limited thereto.

[0144] The panel crack detector 118 may be further disposed in a portion of the non-display area NA of the substrate 110 .

[0145] The panel crack detector 118 may be disposed between an end point (or end portion) of the substrate 110 and the dam 117 , or may be disposed below the dam 117 and overlap with at least a portion of the dam 117 .

[0146] The panel crack detector 118 is disposed at the periphery of the display device to detect defects such as cracks that may be generated at the periphery of the display device.

[0147] The display area AA may further include a hole H therein. The hole H is disposed between the plurality of sub-pixels SP in the display area AA. The hole H may be an area in which an optical component such as a camera or an optical sensor is disposed. The optical sensor may include a proximity sensor, an infrared sensor, and an ultraviolet sensor, but the exemplary embodiments of the present disclosure are not limited thereto. The hole H includes a hole H that passes through some configurations of the display device 1000 to arrange the optical component, so that a space for arranging the optical component can be ensured.

[0148] The cover layer 800 may be disposed on the front surface of the substrate 110. For example, the cover layer 800 may cover the entire first non-bending area NBA1 and the bending area BA. Ends of three surfaces of the substrate 110 and an end of the cover layer 800 may overlap.

[0149] The spacer 1300 of the control cover layer 800 may be disposed on one side of the non-display area, or the spacer 1300 of the control cover layer 800 may be disposed on one side of the second non-bending area NBA2. The spacer 1300 may be disposed between the bending area BA and the pad unit 114. The spacer 1300 may be disposed between the bending area BA and the flexible film 2.

[0150] The spacer 1300 may be disposed along the periphery of the bending area BA to control the flow of the capping layer 800 composed of an organic material. The number of the spacer 1300 may be one or more, and the exemplary embodiments of the present disclosure are not limited thereto.

[0151] Figure 6 is a view illustrating an arrangement of a light emitting unit and a non-light emitting unit of a display device according to an exemplary embodiment of the present disclosure.

[0152] The display area AA of the substrate 110 may include light emitting cells EA and non-light emitting cells NEA disposed between the light emitting cells.

[0153] The light emitting unit EA is a region of the sub-pixel SP that emits light from the light emitting diode layer, and each sub-pixel may include a light emitting unit. A plurality of light emitting units EA may be disposed on the substrate and may be spaced apart from each other. The non-light emitting unit NEA may be disposed to surround the light emitting unit.

[0154] The light emitting unit EA may be a region of the light emitting layer in which light is emitted to the outside, and refers to Figure 7 , may be an area in which the dam 520 is not provided.

[0155] The non-light emitting unit NEA may be a region where light of the light emitting layer is not emitted to the outside, and refers to Figure 7 , may be an area where the embankment 520 is provided.

[0156] Multiple light emitting units emitting different colors of light may be located in the light emitting unit EA. For example, the light emitting unit may include a first light emitting unit EA1 emitting red light, a second light emitting unit EA2 emitting green light, and a third light emitting unit EA3 emitting blue light. The light emitting unit may also include a white light emitting unit, etc., but is not limited thereto.

[0157] like Figure 6 As shown, each light emitting unit EA is formed to have a specific shape to be set in a specific form, but the light emitting unit EA of the display device 1000 according to the present disclosure is not only set to a specific shape, but can be set to various shapes and forms. For example, an exemplary shape of each light emitting unit EA can be a rectangle, a pentagon, a hexagon, an octagon, a circle, or an oval, but is not limited thereto. For example, the first light emitting unit EA1 and the third light emitting unit EA3 can have the same shape. The second light emitting unit EA2 can have a different shape from the first light emitting unit EA1. The second light emitting unit EA2 can have a different shape from the third light emitting unit EA3. For example, the second light emitting unit EA2 can have a different shape from the first light emitting unit EA1 and the third light emitting unit EA3.

[0158] A pixel P can be formed by a light emitting unit or a plurality of sub-pixels emitting light of the same color, such as Figure 6 For example, at least two or more second sub-pixels SP2 or second light emitting units EA2 may be provided in one pixel P. At least two or more second light emitting units EA2 emitting green light may be provided in one pixel P, and exemplary embodiments of the present disclosure are not limited thereto.

[0159] The size of the third light emitting unit EA3 may be larger than the sizes of other light emitting units. For example, the size of the third light emitting unit EA3 may be larger than the size of the first light emitting unit EA1. The size of the third light emitting unit EA3 that emits blue light may be larger than the size of the first light emitting unit EA1 that emits red light. For example, the size of the third light emitting unit EA3 may be larger than the size of the second light emitting unit EA2. The size of the third light emitting unit EA3 that emits blue light may be larger than the size of the second light emitting unit EA2 that emits green light. The third light emitting unit EA3 may be disposed above another light emitting unit. For example, the third light emitting unit EA3 may overlap at least a portion of the first light emitting unit EA1 and the second light emitting unit EA2.

[0160] The spacer 530 may be disposed to have a predetermined distance (or interval) from the plurality of sub-pixels SP. For example, the spacer 530 is spaced apart from the plurality of sub-pixels SP by a predetermined distance and may be disposed to be surrounded by the plurality of sub-pixels SP. Figure 6 As shown, four sub-pixels may surround one spacer, but are not limited thereto, and five, six, seven, and eight sub-pixels may be configured and implemented according to the structure and type of the display device.

[0161] The spacer 530 may be disposed substantially at the center of a plurality of sub-pixels emitting at least one same color. For example, the spacer 530 may be disposed at the center of the second light emitting unit EA2.

[0162] The spacer 530 may minimize damage to the display device 1000 due to an external impact by buffering an empty space between the substrate 110 on which the light emitting diode layer 500 is formed and the upper substrate.

[0163] In addition, the spacer 530 can protect the light emitting diode layer 500. For example, when forming the light emitting diode layer 500, a fine metal mask (FMM) can be used. The fine metal mask may sag due to its weight during the process. Therefore, the spacer 530 is provided so that the fine metal mask (FMM) contacts the spacer 530, so that deformation or damage of the dam 520 caused by direct contact between the fine metal mask and the dam 520 can be suppressed.

[0164] In the following, reference will be made to Figure 7 and Figure 8 The cross-sectional structure of the present disclosure is described in detail.

[0165] Figure 7 According to an exemplary embodiment of the present disclosure Figure 6 A cross-sectional view taken along line II-II'.

[0166] Figure 7 It shows that the setting Figure 6FIG. 1 is a view showing a portion of a cross-sectional structure of one sub-pixel SP in a display area. The sub-pixel SP may include a light emitting diode layer 500 for displaying an image and a plurality of first and second thin film transistors 200 and 300 for driving the light emitting diode layer 500.

[0167] The substrate 110 may support various components of the display device. The substrate 110 may be formed of a plastic material or glass having flexibility.

[0168] For example, the substrate 110 may be formed of at least one of polyimide (PI), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polyethersulfone, and polycarbonate (PC), but is not limited thereto.

[0169] When the substrate 110 is formed of polyimide, the substrate may be composed of two polyimide layers, and an inorganic film may be further provided between the two polyimide layers.

[0170] The substrate 110 may include a first substrate, a second substrate, and a third substrate. The second substrate is disposed on the first substrate, and the third substrate is disposed on the second substrate.

[0171] The first substrate and the third substrate may be substrates configured to support components formed on the substrate. The first substrate and the third substrate may be flexible substrates made of plastic material. In this case, flexibility may be interpreted in the same manner as bendable, unbreakable, rollable, and foldable properties.

[0172] For example, the first substrate and the third substrate may include plastic. In this case, the first substrate and the third substrate may be referred to as a plastic film or a plastic substrate. For example, the first substrate and the third substrate may include at least one selected from the group consisting of a polyester-based polymer, a silicon-based polymer, an acrylic-based polymer, a polyolefin-based polymer, and polymers thereof. For example, the first substrate and the third substrate may be a polyimide substrate made of polyimide (PI). However, the present disclosure is not limited thereto.

[0173] The second substrate may include an inorganic insulating material. The second substrate may be an inorganic film formed between the first substrate and the third substrate. For example, the second substrate may be configured as a single layer or multiple layers made of silicon nitride (SiNx) or silicon oxide (SiOx). For example, the second substrate may be formed by a single layer or multiple layers of inorganic films, for example, the single layer of inorganic film may be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, and the multilayer inorganic film may be formed by alternately stacking one or more layers of silicon oxide (SiOx) film, one or more layers of silicon nitride (SiNx) film and one or more layers of amorphous silicon (a-Si), but the present disclosure is not limited thereto.

[0174] It may include elements and functional layers formed on the substrate 110, such as a switching thin film transistor, a driving thin film transistor connected to the switching thin film transistor, an organic light emitting diode connected to the driving thin film transistor, a protective layer, etc., but is not limited thereto.

[0175] The first insulating layer 120 may be disposed on the entire substrate 110. For example, the first insulating layer 120 may be disposed on the entire surface of the substrate 110.

[0176] The first insulating layer 120 is formed on the substrate 110 to block materials in the substrate 110 from moving to the thin film transistor or the semiconductor layer during a deposition process.

[0177] The first insulating layer 120 may be formed of an insulating inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx) or other insulating organic materials, but is not limited thereto.

[0178] The first insulating layer 120 may be formed of a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or a multilayer thereof, but the exemplary embodiments of the present disclosure are not limited thereto. When the first insulating layer 120 is formed of multiple layers, silicon oxide (SiOx) and silicon nitride (SiNx) may be alternately formed, but the exemplary embodiments of the present disclosure are not limited thereto. For example, the first insulating layer 120 may be formed by a single layer or multiple layers of an inorganic film, for example, a single layer of an inorganic film may be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, and a multilayer of an inorganic film may be formed by alternately stacking one or more layers of silicon oxide (SiOx) film, one or more layers of silicon nitride (SiNx) film, and one or more layers of amorphous silicon (a-Si), but the present disclosure is not limited thereto.

[0179] The first insulating layer 120 may be a buffer layer or a first buffer layer, but exemplary embodiments of the present disclosure are not limited thereto.

[0180] The first insulating layer 120 may be omitted according to the type or material of the substrate 110 and the structure and type of the thin film transistor.

[0181] The first thin film transistor 200 and the second thin film transistor 300 may be disposed on the first insulating layer 120. The first thin film transistor 200 may be a switching thin film transistor, and the second thin film transistor 300 may be a driving thin film transistor, and exemplary embodiments of the present disclosure are not limited thereto.

[0182] The first thin film transistor 200 may include a first semiconductor layer 210 , a first gate electrode 230 , a first source electrode 250 , and a first drain electrode 270 . The second thin film transistor 300 may include a second semiconductor layer 310 , a second gate electrode 330 , a second source electrode 350 , and a second drain electrode 370 .

[0183] For ease of description, only two thin film transistors among various thin film transistors are shown, but other thin film transistors may also be included in the display device 1000. In addition, for ease of description, the thin film transistor is shown as a top gate structure in which the gate electrode constituting the thin film transistor is located above the semiconductor layer, but is not limited to this structure. Therefore, the thin film transistor is also implemented as another structure, such as a bottom gate structure in which the gate electrode is arranged below the semiconductor layer or a double gate structure in which the gate electrode is arranged above and below the semiconductor layer.

[0184] The first semiconductor layer 210 of the first thin film transistor 200 and the second semiconductor layer 310 of the second thin film transistor 300 may be disposed on the first insulating layer 120 .

[0185] The first semiconductor layer 210 and the second semiconductor layer 310 may be formed of a polycrystalline semiconductor. For example, the polycrystalline semiconductor may be formed of low temperature polycrystalline silicon (LTPS) having high mobility, but is not limited thereto. When the first semiconductor layer 210 and the second semiconductor layer 310 are formed of a polycrystalline semiconductor, energy consumption is low and reliability is excellent.

[0186] In addition, the first semiconductor layer 210 and the second semiconductor layer 310 may be formed of an oxide semiconductor. For example, the first semiconductor layer 210 and the second semiconductor layer 310 may be formed of any one of indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), indium gallium tin oxide (IGTO), and indium gallium oxide (IGO), but are not limited thereto. When the first semiconductor layer 210 and the second semiconductor layer 310 are formed of an oxide semiconductor, they have an excellent effect of blocking leakage current, so that the brightness change of the sub-pixel during low-speed driving can be minimized.

[0187] When the first semiconductor layer 210 and the second semiconductor layer 310 are formed of a polycrystalline semiconductor or an oxide semiconductor, a conductive region may be provided in partial regions of the first semiconductor layer 210 and the second semiconductor layer 310 .

[0188] The first semiconductor layer 210 and the second semiconductor layer 310 may be formed of amorphous silicon (a-Si) or various organic semiconductor materials such as pentacene, but are not limited thereto.

[0189] The second insulating layer 130 may be disposed in an entire region of the substrate 110 on the first semiconductor layer 210 and the second semiconductor layer 310 .

[0190] The second insulating layer 130 is disposed between the first semiconductor layer 210 and the first gate electrode 230 to insulate the first semiconductor layer 210 and the first gate electrode 230 from each other. The second insulating layer 130 is disposed between the second semiconductor layer 310 and the second gate electrode 330 to insulate the second semiconductor layer 310 and the second gate electrode 330 from each other.

[0191] The second insulating layer 130 may be formed of an insulating inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx) or other insulating organic materials, but is not limited thereto. For example, the second insulating layer 130 may be formed by a single-layer or multi-layer inorganic film, for example, the single-layer inorganic film may be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, and the multi-layer inorganic film may be formed by alternately stacking one or more layers of silicon oxide (SiOx) film, one or more layers of silicon nitride (SiNx) film, and one or more layers of amorphous silicon (a-Si), but the present disclosure is not limited thereto.

[0192] The second insulating layer 130 may include a hole to electrically connect each of the first source electrode 250 and the first drain electrode 270 to the first semiconductor layer 210. The second insulating layer 130 may include a hole to electrically connect each of the second source electrode 350 and the second drain electrode 370 to the second semiconductor layer 310.

[0193] The first gate electrode 230 of the first thin film transistor 200 and the second gate electrode 330 of the second thin film transistor 300 may be disposed on the second insulating layer 130. The first gate electrode 230 may be disposed to overlap the first semiconductor layer 210. The second gate electrode 330 may be disposed to overlap the second semiconductor layer 310.

[0194] The storage capacitor 400 may be disposed on the second insulating layer 130. The storage capacitor 400 may include a first capacitor electrode 410 and a second capacitor electrode 420. The storage capacitor 400 stores a data voltage applied through the data line for a predetermined period of time to supply the data voltage to the first electrode 510.

[0195] The first capacitor electrode 410 of the storage capacitor 400 may be disposed on the second insulating layer 130 .

[0196] The first gate electrode 230 , the second gate electrode 330 , and the first capacitor electrode 410 may be disposed on the same layer. For example, the first gate electrode 230 , the second gate electrode 330 , and the first capacitor electrode 410 may be disposed on the second insulating layer 130 .

[0197] The first gate electrode 230 , the second gate electrode 330 , and the first capacitor electrode 410 may be formed by the same process.

[0198] The first gate electrode 230, the second gate electrode 330 and the first capacitor electrode 410 may be formed as a single layer or a multilayer formed of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W) or alloys thereof and a transparent conductive oxide (TCO), but are not limited thereto.

[0199] The third insulating layer 140 may be disposed on the entire area of ​​the substrate 110 on the first gate electrode 230 , the second gate electrode 330 , and the first capacitor electrode 410 .

[0200] The third insulating layer 140 is disposed between the first gate electrode 230 and the first source electrode 250 and the first drain electrode 270 to insulate the first gate electrode 230 from the first source electrode 250 and the first drain electrode 270. The third insulating layer 140 is disposed between the second gate electrode 330 and the second source electrode 350 and the second drain electrode 370 to insulate the second gate electrode 330 from the second source electrode 350 and the second drain electrode 370.

[0201] The third insulating layer 140 may include a hole to electrically connect each of the first source electrode 250 and the first drain electrode 270 to the first semiconductor layer 210. The third insulating layer 140 may include a hole to electrically connect each of the second source electrode 350 and the second drain electrode 370 to the second semiconductor layer 310.

[0202] The third insulating layer 140 may be formed of an insulating inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx) or other insulating organic materials, but is not limited thereto. For example, the third insulating layer 140 may be formed by a single-layer or multi-layer inorganic film, for example, the single-layer inorganic film may be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, and the multi-layer inorganic film may be formed by alternately stacking one or more layers of silicon oxide (SiOx) film, one or more layers of silicon nitride (SiNx) film, and one or more layers of amorphous silicon (a-Si), but the present disclosure is not limited thereto.

[0203] The second capacitor electrode 420 of the storage capacitor 400 may be disposed on the third insulating layer 140. The second capacitor electrode 420 may be disposed to overlap the first capacitor electrode 410.

[0204] The second capacitor electrode 420 may be formed as a single layer or a multilayer formed of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W) or an alloy thereof and a transparent conductive oxide (TCO), but is not limited thereto.

[0205] The fourth insulating layer 150 may be disposed in the entire region of the substrate 110 on the second capacitor electrode 420 .

[0206] The fourth insulating layer 150 is disposed between the first gate electrode 230 and the first source electrode 250 and the first drain electrode 270 to insulate the first gate electrode 230 from the first source electrode 250 and the first drain electrode 270. The fourth insulating layer 150 is disposed between the second gate electrode 330 and the second source electrode 350 and the second drain electrode 370 to insulate the second gate electrode 330 from the second source electrode 350 and the second drain electrode 370.

[0207] The fourth insulating layer 150 may include a hole to electrically connect each of the first source electrode 250 and the first drain electrode 270 to the first semiconductor layer 210. The fourth insulating layer 150 may include a hole to electrically connect each of the second source electrode 350 and the second drain electrode 370 to the second semiconductor layer 310.

[0208] The fourth insulating layer 150 may be formed of an insulating inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx) or other insulating organic materials, but is not limited thereto. For example, the fourth insulating layer 150 may be formed by a single-layer or multi-layer inorganic film, for example, the single-layer inorganic film may be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, and the multi-layer inorganic film may be formed by alternately stacking one or more layers of silicon oxide (SiOx) film, one or more layers of silicon nitride (SiNx) film, and one or more layers of amorphous silicon (a-Si), but the present disclosure is not limited thereto.

[0209] The first source electrode 250 and the first drain electrode 270 may be disposed on the fourth insulating layer 150. The second source electrode 350 and the second drain electrode 370 may be disposed on the fourth insulating layer 150.

[0210] Each of the first source electrode 250 and the first drain electrode 270 may be electrically connected to the first semiconductor layer 210 through the holes of the second insulating layer 130, the third insulating layer 140, and the fourth insulating layer 150. Each of the second source electrode 350 and the second drain electrode 370 may be electrically connected to the second semiconductor layer 310 through the holes of the second insulating layer 130, the third insulating layer 140, and the fourth insulating layer 150.

[0211] The first source electrode 250, the first drain electrode 270, the second source electrode 350 and the second drain electrode 370 may be formed as a single layer or multiple layers formed of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W) or an alloy thereof and a transparent conductive oxide (TCO), but are not limited thereto. For example, the first source electrode 250, the first drain electrode 270, the second source electrode 350 and the second drain electrode 370 may be configured with a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) formed of a conductive metal material, but are not limited thereto.

[0212] The fifth insulating layer 160 may be disposed on the entire area of ​​the substrate 110 on the first source electrode 250 , the first drain electrode 270 , the second source electrode 350 , and the second drain electrode 370 .

[0213] The fifth insulating layer 160 can protect the first thin film transistor 200 and the second thin film transistor 300. The fifth insulating layer 160 may be formed of an insulating inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx) or other insulating organic materials, but is not limited thereto. For example, the fifth insulating layer 160 may be formed by a single-layer or multi-layer inorganic film, for example, the single-layer inorganic film may be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, and the multi-layer inorganic film may be formed by alternately stacking one or more layers of silicon oxide (SiOx) film, one or more layers of silicon nitride (SiNx) film and one or more layers of amorphous silicon (a-Si), but the present disclosure is not limited thereto. The fifth insulating layer 160 may include a hole to electrically connect the second thin film transistor 300 to the connecting electrode 180 or the first electrode 510. Depending on the structure and type of the thin film transistor, the fifth insulating layer 160 may be omitted.

[0214] The protective layer 170 may be disposed on the fifth insulating layer 160. For example, the protective layer 170 may be an insulating layer or a planarizing layer, but the exemplary embodiments of the present disclosure are not limited thereto. The protective layer 170 may protect the thin film transistor disposed below the protective layer 170, and mitigate or planarize the steps caused by various patterns of the components of the thin film transistor. For example, the protective layer 170 may insulate the components disposed above and below the protective layer 170. For example, the protective layer 170 may be disposed as a single layer, but may be disposed in two or more layers in consideration of the arrangement of the electrodes.

[0215] As the display device 1000 develops to a higher resolution, various signal lines increase, making it difficult to arrange all wiring on one layer while ensuring the minimum spacing. Therefore, an additional layer can be configured. By providing an additional layer, there is a margin in the arrangement of the wiring, which makes it easier to design the wire / electrode arrangement. In addition, when a dielectric material is used for a planarization layer composed of multiple layers, the protective layer 170 can be used to form a capacitor between the metal layers.

[0216] When two protective layers 170 are provided, the protective layers may include a first protective layer 171 and a second protective layer 172. For example, the first protective layer 171 may be a sixth insulating layer, but exemplary embodiments of the present disclosure are not limited thereto. For example, the second protective layer 172 may be a seventh insulating layer, but exemplary embodiments of the present disclosure are not limited thereto. For example, a hole is formed in the first protective layer 171, and a connecting electrode 180 may be disposed in the hole. The second protective layer 172 having a hole may be disposed on the first protective layer 171 and the connecting electrode 180. The first electrode 510 may be disposed in the hole of the second protective layer 172. Therefore, the first thin film transistor 200 and the first electrode 510 may be electrically connected through the connecting electrode 180.

[0217] One end (or part or one side) of the connection electrode 180 may be connected to the second thin film transistor 300 , and the other end (or another part or another side) of the connection electrode 180 may be connected to the first electrode 510 .

[0218] The connection electrode 180 may also be disposed on the first protection layer 171 .

[0219] The connection electrode 180 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W) or an alloy thereof and a transparent conductive oxide (TCO), but is not limited thereto. For example, the connection electrode 180 may be formed with a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) formed of a conductive metal material.

[0220] The connection electrode 180 may be a first connection electrode, but exemplary embodiments of the present disclosure are not limited thereto. Depending on the structure or type of the display device 1000 , the connection electrode 180 may be omitted.

[0221] The second protective layer 172 may be disposed on the first protective layer 171 and the connection electrode 180 .

[0222] The first and second protective layers 171 and 172 may be formed of at least one or more of organic insulating materials such as benzocyclobutene (BCB), acrylic resin, epoxy resin, phenol resin, polyamide resin, or polyimide resin, but are not limited thereto.

[0223] Considering the arrangement of electrodes, the protective layer 170 of the display device 1000 may be provided as three layers, but the exemplary embodiment of the present disclosure is not limited thereto. Therefore, a connection electrode may be further provided.

[0224] The light emitting diode layer 500 may be disposed on the protective layer 170 or the second protective layer 172. The light emitting diode layer 500 may include a first electrode 510, a light emitting layer 540, and a second electrode 550.

[0225] The first electrode 510 may be disposed on the protective layer 170. The first electrode 510 provides a hole to the light emitting layer 540 and may be formed of a conductive material having a high work function. The first electrode may be an anode electrode, and exemplary embodiments of the present disclosure are not limited thereto.

[0226] When the display device 1000 is a top emission type, an opaque conductive material may be used as a reflective electrode for reflecting light to set the first electrode 510. The first electrode 510 may be formed of at least one or more of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof, but the exemplary embodiments of the present disclosure are not limited thereto. For example, the first electrode 510 may be formed with a three-layer structure of silver (Ag) / palladium (Pd) / copper (Cu), but is not limited thereto. Alternatively, the first electrode 510 may also include a transparent conductive material layer having a high work function, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0227] When the display device 1000 is a bottom emission type, the first electrode 510 may be provided using a transparent conductive material through which light passes. For example, the first electrode 510 may be formed of at least one or more of indium tin oxide (ITO) and indium zinc oxide (IZO), but the exemplary embodiments of the present disclosure are not limited thereto.

[0228] The bank 520 may be disposed on the first electrode 510 and the protective layer 170 .

[0229] The bank 520 may divide a plurality of sub-pixels SP, minimize a glare phenomenon, and suppress color mixing at various viewing angles. The bank 520 may define (or divide) a light-emitting unit in which light is emitted and a non-light-emitting unit in which light is not emitted and which may be disposed in the non-light-emitting unit. The bank 520 may have a bank hole exposing the light-emitting unit and the first electrode 510.

[0230] The dam 520 may be formed of at least one or more of an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), an organic insulating material such as benzocyclobutene (BCB), an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin, or a photosensitizer including a black pigment, but is not limited thereto.

[0231] The bank 520 may be formed in black or in color. For example, when the bank 520 includes a black material, external light scattered from the side surface of the first electrode 510, internal reflected light, and / or scattered light may be inhibited from entering the thin film transistor, and brightness degradation of the display device may be improved. The bank 520 may be provided to cover an end portion (or a partial region) of the first electrode 510.

[0232] At least one spacer 530 may be disposed on the bank 520 .

[0233] The spacer 530 may suppress damage of the light emitting layer 540 during a process of the light emitting layer 540 and minimize breakage of the display device 1000 caused by an external impact.

[0234] The spacer 530 may be formed of the same material as the dam 520, and may be formed simultaneously with the dam 520, or may be formed by a separate process. For example, the spacer 530 may be formed to be transparent or black or colored. Alternatively, the spacer 530 may include a transparent material, a black material, or a colored material.

[0235] The thickness of the spacer 530 may be equal to or greater than the thickness of the bank 520 , and the thickness of the spacer 530 may be 1 μm to 2 μm, but exemplary embodiments of the present disclosure are not limited thereto.

[0236] The light emitting layer 540 may be disposed on the first electrode 510 and the bank 520. The light emitting layer 540 may include a light emitting layer EML for emitting light having a specific color in each of the plurality of sub-pixels SP. The light emitting layer may be a layer that emits light. For example, holes generated in the first electrode 510 and electrons generated in the second electrode 550 may be injected into the light emitting layer. The holes and electrons injected into the light emitting layer are coupled to generate excitons. When the generated excitons drop from an excited state to a ground state, light may be generated.

[0237] For example, the light-emitting layer may include a red light-emitting layer emitting red light, a green light-emitting layer emitting green light, a blue light-emitting layer emitting blue light, and a white light-emitting layer. When the light-emitting layer 540 includes a white light-emitting layer, a color filter for converting white light from the white light-emitting layer into another color light may be disposed above the light-emitting layer 540. In addition, the light-emitting layer 540 may further include a hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer (EBL), a hole blocking layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL), a hole blocking layer (HBL), and an electron blocking layer (EBL) disposed above or below the light-emitting layer. However, it is not limited thereto.

[0238] The light emitting layer 540 may be disposed in each of the plurality of sub-pixels SP, and a hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer (EBL), a hole blocking layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL) may be disposed in the entire display area AA.

[0239] The light-emitting layer 540 of the display device according to the present disclosure may be a light-emitting unit. At least one or more light-emitting units may be provided. For example, a plurality of light-emitting units are stacked between the first electrode 510 and the second electrode 550 to form a stacked structure. In this case, a charge generation layer may also be provided between the plurality of light-emitting units. A plurality of light-emitting units may be provided in each sub-pixel SP.

[0240] The second electrode 550 may be disposed on the light emitting layer 540. The second electrode 550 supplies electrons to the light emitting layer 540 and may be formed of a conductive material having a low work function. The second electrode 550 may be a cathode electrode, but exemplary embodiments of the present disclosure are not limited thereto.

[0241] When the display device 1000 is a top emission type, the second electrode 550 may be provided using a transparent conductive material through which light passes. For example, the second electrode may be formed of at least one of indium tin oxide (ITO) and indium zinc oxide (IZO), but is not limited thereto. In addition, the second electrode 550 may be provided using a translucent conductive material through which light passes. For example, the second electrode may be formed of at least one of an alloy such as LiF / Al, CsF / Al, Mg:Ag, Ca / Ag, Ca:Ag, LiF / Mg:Ag, LiF / Ca / Ag, and LiF / Ca:Ag, but is not limited thereto.

[0242] When the display device 1000 is a bottom emission type, an opaque conductive material may be used as a reflective electrode that reflects light to set the second electrode 550. For example, the second electrode 550 may be formed of at least one or more of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof.

[0243] The encapsulation unit 600 may be disposed on the second electrode 550. The encapsulation unit 600 may protect the light emitting layer 540 from external moisture, oxygen, or foreign matter. For example, the penetration of oxygen and moisture from the outside may be suppressed to avoid oxidation of the light emitting material and the electrode material.

[0244] The encapsulation unit 600 may include first, second, and third encapsulation layers 610, 620, and 630 that block penetration of moisture or oxygen. The first, second, and third encapsulation layers 610, 620, and 630 may be alternately laminated, but exemplary embodiments of the present disclosure are not limited thereto.

[0245] The encapsulation unit 600 may be formed of a transparent material to transmit light emitted from the light emitting layer.

[0246] The first encapsulation layer 610 and the third encapsulation layer 630 may be formed of at least one inorganic material of silicon nitride (SiNx), silicon oxide (SiOx), and aluminum oxide (AlyOz), but are not limited thereto. The first encapsulation layer 610 and the third encapsulation layer 630 may be formed using a vacuum film forming method such as chemical vapor deposition (CVD) or atomic layer deposition (ALD), but are not limited thereto.

[0247] The first encapsulation layer 610 and the third encapsulation layer 630 may be formed of at least two or more layers. For example, the first encapsulation layer 610 may be formed with a three-layer structure of silicon oxide (SiOx) / silicon nitride (SiNx) / silicon oxide (SiOx), but is not limited thereto. In addition, the first encapsulation layer 610 may be formed with a four-layer structure of silicon oxide (SiOx) / silicon nitride (SiNx) / silicon oxide (SiOx) / silicon oxide (SiOx), but is not limited thereto.

[0248] The second encapsulation layer 620 may cover foreign materials or particles that may be generated during the manufacturing process. Further, the second encapsulation layer 620 may planarize the surface of the first encapsulation layer 610. For example, the second encapsulation layer 620 may be a particle covering layer, but is not limited thereto.

[0249] The second encapsulation layer 620 may be an organic material, for example, a polymer such as silicon oxycarbon (SiOCz), epoxy, polyimide, polyethylene, or acrylate, but is not limited thereto.

[0250] The second encapsulation layer 620 may be formed of a thermosetting material or a photocurable material that is cured by heat or light.

[0251] The second encapsulation layer 620 may be formed by various methods such as inkjet coating or slit coating. For example, the second encapsulation layer 620 may be formed on the first encapsulation layer 610 by spraying or dripping a liquid organic material on the substrate 110 formed with the first encapsulation layer 610 in the display area AA using an inkjet device or a nozzle coating device. When the spray nozzle moves on the application area (or the nozzle is fixed and the object moves), the liquid organic material may be formed in the application area.

[0252] The material constituting the second encapsulation layer 620 has a low viscosity property so that it can be in a liquid state with high density until the material solidifies. To solve the problem of the second encapsulation layer 620 diffusing (or flowing) to the non-display area NA, a dam 117 may be provided in the non-display area NA.

[0253] In addition, the encapsulation unit 600 is not limited to three layers, and for example, may include n layers (where n is an integer greater than 3) in which inorganic encapsulation layers and organic encapsulation layers are alternately stacked.

[0254] Will refer to Figure 8 The dam 117 is described in detail.

[0255] The touch unit 700 may be disposed on the encapsulation unit 600 .

[0256] The touch unit 700 may include a first touch electrode 740_R, a first touch connection electrode 720, a second touch electrode, and a second touch connection electrode 740_C.

[0257] Portions of the first touch electrode 740_R, the first touch connection electrode 720 , the second touch electrode, and the second touch connection electrode 740_C may be disposed to overlap the bank 520 .

[0258] The first touch electrode 740_R, the second touch electrode, the first touch connection electrode 720, and the second touch connection electrode 740_C may be formed with a mesh pattern in which metal lines having a small line width intersect each other. The mesh pattern may have a rhombus shape. In addition, the shape of the mesh pattern may be a rectangle, a pentagon, a hexagon, a circle, or an oval, but is not limited thereto.

[0259] The first touch electrode 740_R, the second touch electrode, the first touch connection electrode 720, and the second touch connection electrode 740_C may be provided using an opaque conductive material having a low resistance. For example, the first touch electrode 740_R, the second touch electrode, the first touch connection electrode 720, and the second touch connection electrode 740_C may be formed as a single layer or multiple layers formed of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W), or an alloy thereof and a transparent conductive oxide (TCO), but are not limited thereto. For example, the first touch electrode 740_R, the second touch electrode, the first touch connection electrode 720, and the second touch connection electrode 740_C may be configured with a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) formed of a conductive metal material, but are not limited thereto.

[0260] The first touch electrode 740_R, the second touch electrode, the first touch connection electrode 720, and the second touch connection electrode 740_C may be formed of the same material as the first source electrode 250, the first drain electrode 270, the second source electrode 350, and the second drain electrode 370. However, exemplary embodiments of the present disclosure are not limited thereto.

[0261] The buffer layer 710 may be disposed on the encapsulation unit 600. The buffer layer 710 may block liquid chemicals (developer or etchant) used during the process of manufacturing the touch unit 700 or moisture from the outside from penetrating into the light emitting diode layer 500 including an organic material. In addition, a short circuit of a plurality of touch sensor metals disposed above the buffer layer 710 due to an external impact may be suppressed, and an interference signal that may be generated when the touch unit 700 is driven may be blocked. For example, the buffer layer 710 may be a touch buffer layer, a second buffer layer, or an eighth insulating layer, but exemplary embodiments of the present disclosure are not limited thereto.

[0262] The buffer layer 710 may be formed of at least one or more of an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx) and an organic insulating material such as benzocyclobutene (BCB), acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin, but is not limited thereto.

[0263] The first touch connection electrode 720 may be disposed on the buffer layer 710 .

[0264] For example, the first touch connection electrode 720 may be disposed between adjacent first touch electrodes 740_R in the first direction (or X-axis direction). The first touch connection electrode 720 may electrically connect a plurality of adjacent first touch electrodes 740_R spaced apart in the first direction (or X-axis direction), but is not limited thereto.

[0265] The first touch connection electrode 720 may be arranged to overlap with the second touch connection electrode 740_C connected to the second touch electrode adjacent in the second direction (or Y-axis direction). The first touch connection electrode 720 and the second touch connection electrode 740_C are formed on different layers to be electrically insulated. For example, the first touch connection electrode 720 may be a connection electrode or a second connection electrode, but the exemplary embodiment of the present disclosure is not limited thereto. For example, the second touch connection electrode 740_C may be a third connection electrode, but the exemplary embodiment of the present disclosure is not limited thereto.

[0266] The insulating layer 730 may be disposed on the buffer layer 710 and the first touch connection electrode 720. For example, the insulating layer 730 may be a touch insulating layer or a ninth insulating layer, but exemplary embodiments of the present disclosure are not limited thereto.

[0267] The insulating layer 730 may include a hole to electrically connect the first touch electrode 740_R and the first touch connection electrode 720. For example, the insulating layer 730 may electrically insulate the second touch electrode and the second touch connection electrode 740_C. For example, the insulating layer 730 may be an organic material, for example, a polymer such as silicon oxycarbon (SiOCz), epoxy resin, polyimide, polyethylene, or acrylate, but is not limited thereto. The insulating layer 730 may be formed of a thermosetting material or a photocurable material that is hardened by heat or light.

[0268] When the insulating layer 730 is composed of an inorganic material, the insulating layer 730 is arranged along the sharp steps and curves of various components arranged below the insulating layer 730. Therefore, the sharp steps and curves are not covered, so that there may be the following problem: a part of the internal components of the display device may be visible to the outside. It is recognized by the user as a defect such as a spot, so that the user's aesthetic sensitivity may be reduced. In addition, compared with the insulating layer composed of an organic material, the insulating layer composed of an inorganic material is less effective in blocking moisture and oxygen that penetrate from the outside of the display device. In addition, the insulating layer composed of an inorganic material cannot cover foreign matter or particles that may be generated during the manufacturing process. When the insulating layer 730 is composed of an organic material, in the manufacturing process of a display device including a bending region, the problem of cracks and short circuits of the wiring caused by mechanical stress in the bending region during or after the bending process of the plate can be improved.

[0269] The first touch electrode 740_R, the second touch electrode, and the second touch connection electrode 740_C may be disposed on the insulating layer 730 .

[0270] The first touch electrode 740_R and the second touch electrode may be spaced apart from each other at a predetermined interval. At least one first touch electrode 740_R adjacent to each other in the first direction (or X-axis direction) may be formed to be spaced apart from each other. At least one or more first touch electrodes 740_R adjacent to each other in the first direction (or X-axis direction) may be connected to the first touch connection electrode 720 disposed between the plurality of first touch electrodes 740_R. For example, the plurality of adjacent first touch electrodes 740_R may be connected to the first touch connection electrode 720 by means of the hole of the insulating layer 730.

[0271] The second touch electrodes adjacent in the second direction (or Y-axis direction) may be connected by the second touch connection electrode 740_C. The second touch electrode and the second touch connection electrode 740_C may be formed on the same layer. For example, the second touch connection electrode 740_C may be disposed between a plurality of second touch electrodes on the same layer as the second touch electrode. The second touch connection electrode 740_C extends from the second touch electrode.

[0272] The first touch electrode 740_R, the second touch electrode, and the second touch connection electrode 740_C may be formed by the same process.

[0273] The third protective layer 750 may be disposed on the first touch electrode 740_R, the second touch electrode and the second touch connection electrode 740_C. For example, the third protective layer 750 may be a planarization layer, a touch planarization layer, a tenth insulating layer or a third protective layer, but exemplary embodiments of the present disclosure are not limited thereto.

[0274] The touch drive circuit may receive a touch sensing signal from the first touch electrode 740_R. Further, the touch drive circuit may transmit a touch drive signal from the second touch electrode. The touch drive circuit may sense the user's touch using the mutual capacitance between the plurality of first touch electrodes 740_R and the second touch electrodes. For example, when a touch operation is performed on the display device 1000, the capacitance between the first touch electrode 740_R and the second touch electrode may be changed. The touch drive circuit may sense the capacitance change to detect the touch coordinates.

[0275] In the non-display area NA of the display device 1000, a touch line and a touch driving circuit may be provided. The touch line may be provided in the first non-bending area NBA1, and the touch driving circuit may be provided in the second non-bending area NBA2. The touch line and the touch driving circuit may be electrically connected through a connecting line 116. For example, one end of the connecting line 116 may be connected to the touch line, and the other end of the connecting line 116 may be connected to the touch driving circuit.

[0276] Each of the first touch block Rx and the second touch block Tx may be electrically connected to a corresponding touch wire 760 .

[0277] The touch wire 760 may include a first touch wire 761 and a second touch wire 762. The first touch wire 761 is electrically connected to the first touch block Rx, and the second touch wire 762 is electrically connected to the second touch block Tx.

[0278] Each of the first touch block Rx and the second touch block Tx may be connected to a touch driving circuit TDC disposed in a portion of the first non-display area NA1 through a first touch line 761 and a second touch line 762. Each of the first touch block Rx and the second touch block Tx is connected to the touch driving circuit TDC to transmit or receive a signal.

[0279] The touch drive circuit TDC may receive a touch sensing signal from the first touch block Rx or the first touch electrode 740_R. Further, the touch drive circuit TDC may send a touch drive signal to the second touch block Tx or the second touch electrode. The touch drive circuit TDC may sense the user's touch using the mutual capacitance between the first touch block Rx and the second touch block Tx. For example, when a touch operation is performed on the display device 1000, the capacitance between the first touch block Rx and the second touch block Tx may change. The touch drive circuit TDC may sense the capacitance change to detect the touch coordinates.

[0280] The cover layer 800 may be disposed on the third protective layer 750 .

[0281] The cover layer 800 may further planarize the area not partially planarized by the third protective layer 750. Alternatively, the cover layer 800 may effectively block moisture and oxygen from entering from the outside of the display device. The cover layer 800 may be a fourth encapsulation layer, but exemplary embodiments of the present disclosure are not limited thereto.

[0282] The cover layer 800 may be an organic material, for example, a polymer such as silicon oxycarbon (SiOCz), epoxy, polyimide, polyethylene, or acrylate, but is not limited thereto. The cover layer 800 may be formed of a thermosetting material or a photocurable material that is hardened by heat or light.

[0283] The cover layer 800 may be formed of the same material as that forming the second encapsulation layer 620 .

[0284] The covering layer 800 may be formed by various methods such as inkjet coating or slit coating. For example, the covering layer 800 may be formed on the third protective layer 750 by spraying or dropping a liquid organic material on the substrate 110 formed with the third protective layer 750 in the display area AA using an inkjet device or a nozzle coating device. When the spray nozzle moves on the application area (or the nozzle is fixed and the object moves), the liquid organic material may be formed in the application area.

[0285] The material constituting the cover layer 800 has a low viscosity property so that it can be in a liquid state with a high density until the material hardens. The spacer 1300 can be disposed in the non-display area adjacent to the bending area to solve the problem of the cover layer 800 spreading (or flowing) to the bending area BA. Figure 8 The partition 1300 is described in detail.

[0286] refer to Figure 8 , the cover layer 800 may extend to the bending area BA and the second non-bending area NBA2.

[0287] In the following, reference will be made to Figure 8The separator is described in detail.

[0288] Figure 8 According to an exemplary embodiment of the present disclosure Figure 5 A cross-sectional view taken along line III-III'. Figure 8 2 is a view showing a non-display area NA illustrating a portion of the bending area BA.

[0289] Reference Figure 8 , the separator 1300 may be disposed in the second non-bending area NBA2.

[0290] In a portion adjacent to the display area AA, a plurality of insulating layers, protective layers, encapsulation layers, and cover layers disposed in the display area AA may extend to be disposed to the first non-display area NA1.

[0291] A first insulating layer 120, a second insulating layer 130, a third insulating layer 140, a fourth insulating layer 150, a fifth insulating layer 160, a first protective layer 171, a second protective layer 172, a fourth protective layer 521, a fifth protective layer 531, a first encapsulation layer 610, a second encapsulation layer 620, a third encapsulation layer 630, a buffer layer 710, an insulating layer 730, a third protective layer 750 and a covering layer 800 may be sequentially arranged on the substrate 110.

[0292] The fourth protective layer 521 may be formed of the same material as the bank 520 of the display area AA, and may be formed simultaneously with the bank 520, or may be formed by a separate process. The fourth protective layer 521 may be formed of at least one or more of an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), an organic insulating material such as benzocyclobutene (BCB), an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin, or a photosensitizer including a black pigment, but is not limited thereto. The fourth protective layer 521 may be formed to be transparent or black or colorful.

[0293] The fifth protective layer 531 may be formed of the same material as the spacer 530 of the display area AA, and may be formed simultaneously with the spacer 530, or may be formed by a separate process. The fifth protective layer 531 may be formed of at least one or more of an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), an organic insulating material such as benzocyclobutene (BCB), an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin, or a photosensitizer including a black pigment, but is not limited thereto. The fifth protective layer 531 may be formed to be transparent or black or colorful.

[0294] The protective layer is etched to provide the dam 117 in a portion of the first non-display area NA1. For example, the first protective layer 171, the second protective layer 172, the fourth protective layer 521 and / or the fifth protective layer 531 are etched, and the dam 117 may be provided on the insulating layer or the fifth insulating layer 160.

[0295] The dam 117 may suppress the second encapsulation layer 620 formed of an organic material from overflowing to the driving element during a process before curing. The second encapsulation layer 620 may be in contact with the dam 117 .

[0296] The number of the dam 117 may be one or more, and when a plurality of dams 117 are provided, the second encapsulation layer 620 may be partially formed between the plurality of dams.

[0297] The dam 117 may be provided in a plurality of layers using at least one material. For example, the dam 117 is formed in a plurality of layers, and the dam 117 may include a first dam 117a, a second dam 117b, and a third dam 117c.

[0298] The first dam 117 a may be formed of the same material as at least one of the first protective layer 171 and the second protective layer 172 , and may be formed simultaneously with the protective layer 170 or through a separate process.

[0299] The second dam 117 b may be formed of the same material as the bank 520 and / or the fourth protective layer 521 , and may be formed simultaneously with the bank 520 and / or the fourth protective layer 521 , or may be formed through a separate process.

[0300] The third dam 117 c may be formed of the same material as the spacer 530 and / or the fifth protective layer 531 , and may be formed simultaneously with the spacer 530 and / or the fifth protective layer 531 , or may be formed through a separate process.

[0301] The fourth protection layer 521 and the fifth protection layer 531 may be formed at the same time, but are not limited thereto.

[0302] The encapsulation unit 600 may be disposed on the substrate 110 having the dam 117 disposed thereon. The first encapsulation layer 610 is disposed on the dam 117 disposed thereunder, the insulating layer and / or the protective layer, and may extend to the bending area BA while covering the dam 117.

[0303] The second encapsulation layer 620 may be disposed on the first encapsulation layer 610 and may contact the dam 117 .

[0304] The third encapsulation layer 630 may be disposed on the second encapsulation layer 620 and the dam 117. The third encapsulation layer 630 is disposed on the insulating layer, the protective layer, and / or the dam 117 disposed below the third encapsulation layer 630, and may extend to the bending area BA while covering the first encapsulation layer 610 and the dam 117. The first encapsulation layer 610 and the third encapsulation layer 630 may contact each other.

[0305] The packaging unit 600 may be provided with a touch line 760 electrically connected to the touch driving circuit TDC and the first touch block Rx and the second touch block Tx of the touch unit 700 to transmit or receive a signal.

[0306] The touch line 760 may be electrically connected to the touch driving circuit TDC through the connection line 116. The touch line 760 and the connection line 116 may contact each other by etching an insulating layer or a protective layer between the display area AA and the bending area BA. For example, the touch line 760 and the connection line 116 may contact each other between the dam 117 and the partition 1300.

[0307] The third protection layer 750 may be disposed on the touch line 760 .

[0308] According to the exemplary embodiment of the present disclosure, the insulating layer 730 is composed of an organic material, so that the third protective layer 750 composed of an organic material may be omitted.

[0309] The cover layer 800 may be disposed on the third protective layer 750. The material constituting the cover layer 800 has a low viscosity property so that it can be in a liquid state with high density until the material hardens. The separator 1300 may be disposed in a non-display area adjacent to the bending area to solve the problem of the cover layer 800 diffusing (or flowing) to the bending area BA. The cover layer may cover the touch unit and the touch line.

[0310] The partition 1300 may be disposed in a portion of the bending area BA to control the flow of the capping layer 800 including the organic material. The number of the partition 1300 may be one or more or more. When a plurality of partitions 1300 are configured, the partition may include a first partition 1310 and a second partition 1320.

[0311] A portion of the third protection layer 750 may be disposed around the separator 1300. The third protection layer 750 disposed in the second non-bending area NBA2 may be formed simultaneously with the third protection layer 750 formed in the first non-bending area NBA1 to protect the connection line 116 and / or the touch line 760 disposed in the non-bending area NBA.

[0312] The cover layer 800 may be partially disposed between the first spacer 1310 and the second spacer 1320. In addition, the cover layer 800 may be partially disposed between the third protective layer 750 and the spacer 1300.

[0313] In addition, the spacer 1300 may be provided in a plurality of layers using at least one or more materials. For example, the spacer 1300 may be formed of the same material as the third protective layer 750 .

[0314] The spacer 1300 may be formed simultaneously with the third protective layer 750 or through a separate process.

[0315] The display device 1000 includes the cover layer 800 and the spacer 1300 , so that the problem of wire breakage or short circuit caused by mechanical stress in the bending region during or after the bending process of the substrate 110 can be improved.

[0316] Exemplary embodiments of the present disclosure may also be described as follows:

[0317] According to one aspect of the present disclosure, a display device is provided. The display device includes a substrate, the substrate includes a first non-bending area, a second non-bending area, and a bending area arranged between the first non-bending area and the second non-bending area. The display device also includes a transistor and a light-emitting diode layer arranged in the first non-bending area on the substrate. The display device also includes a covering layer, which is arranged in the first non-bending area, the second non-bending area, and the bending area on the substrate. The display device also includes a separator arranged in the second non-bending area on the substrate.

[0318] The partition may include a first partition and a second partition spaced apart from each other.

[0319] The cover layer may be disposed in a partial region of the second non-bending region close to the bending region, and not disposed in other regions of the second non-bending region except the partial region.

[0320] The cover layer may be continuously disposed in the first non-bending region, the second non-bending region, and the bending region.

[0321] The cover layer may be in contact with one surface of the partition.

[0322] The display device may further include a touch unit disposed on the light emitting diode layer; and a protection layer disposed on the touch unit. The cover layer may be disposed on the protection layer.

[0323] The touch unit may include a touch line, and the cover layer contacts the touch line in the second non-bending region.

[0324] The display device may further include a second protective layer disposed between the transistor and the light-emitting diode layer, wherein the second protective layer includes a first sub-protective layer and a second sub-protective layer, and wherein a connection line connected to the touch line is disposed between the first sub-protective layer and the second sub-protective layer.

[0325] An end portion of the covering layer located in the second non-bending region may be disposed between the protective layer and the separator.

[0326] The separator may be arranged on the same layer as the protective layer.

[0327] The display device may further include a dam disposed on the first non-bending region.

[0328] The partition may be spaced apart from the dam by a bent region.

[0329] The display device may further include a second protective layer and a bank disposed between the transistor and the light emitting diode layer; and a spacer disposed on the bank.

[0330] The dam may be composed of the same material as at least one or more of materials constituting the spacer, the bank, and the protective layer.

[0331] The cover layer may be in contact with the second protective layer in the bending region.

[0332] According to another aspect of the present disclosure, a display device may include: a substrate, the substrate including a first non-bending region, a second non-bending region, and a bending region arranged between the first non-bending region and the second non-bending region; a light-emitting element layer, the light-emitting element layer is arranged in the first non-bending region on the substrate; a covering layer, the covering layer is arranged in the first non-bending region, the bending region and a part of the second non-bending region on the substrate, and the covering layer is arranged above the light-emitting element layer; a separator, the separator is arranged in the second non-bending region on the substrate.

[0333] The display device according to the exemplary embodiment of the present disclosure can be applicable to mobile devices, video phones, smart watches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, curved devices, sliding devices, variable devices, electronic notes, electronic books, portable multimedia players (PMP), personal digital assistants (PDA), MP3 players, mobile medical devices, desktop PCs, laptop PCs, netbook computers, workstations, navigation, vehicle navigation, vehicle display devices, vehicle devices, theater devices, theater display devices, televisions, wallpaper devices, signage devices, gaming devices, notebooks, monitors, cameras, video cameras, and consumer electronic devices. In addition, the display device according to one or more exemplary embodiments of the present disclosure can also be applied to organic light emitting lighting devices or inorganic light emitting lighting devices.

[0334] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited to the exemplary embodiments and can be modified in various forms without departing from the technical spirit of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical spirit of the present disclosure. The scope of the technical spirit of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure.

[0335] CROSS-REFERENCE TO RELATED APPLICATIONS

[0336] This application claims priority from Korean Patent Application No. 10-2023-0163684 filed in the Korean Intellectual Property Office on November 22, 2023, the entire contents of which are hereby expressly incorporated herein for all purposes.

Claims

1. A display device, comprising: A substrate, the substrate comprising a first non-bending region, a second non-bending region, and a bending region disposed between the first non-bending region and the second non-bending region; A transistor and a light-emitting diode layer, wherein the transistor and the light-emitting diode layer are arranged in the first non-bending area on the substrate; a covering layer, the covering layer being arranged on the substrate in the first non-bending region, the second non-bending region and the bending region; as well as A separator is provided in the second non-bending area on the substrate.

2. The display device according to claim 1, wherein: The partition includes a first partition and a second partition that are spaced apart from each other.

3. The display device according to claim 1, wherein: The covering layer is disposed in a partial region of the second non-bending region close to the bending region, and is not disposed in other regions of the second non-bending region except the partial region.

4. The display device according to claim 1, wherein: The covering layer is continuously disposed in the first non-bending area, the second non-bending area, and the bending area.

5. The display device according to claim 1, wherein: The cover layer is in contact with one surface of the separator.

6. The display device according to claim 1, further comprising: A touch unit, wherein the touch unit is arranged above the light emitting diode layer; as well as a protective layer, the protective layer being arranged on the touch unit, Wherein, the covering layer is arranged on the protective layer.

7. The display device according to claim 6, wherein: The touch unit includes a touch line, and the cover layer contacts the touch line in the second non-bending region.

8. The display device according to claim 7, further comprising a second protective layer, the second protective layer being disposed between the transistor and the light emitting diode layer, in, The second protective layer includes a first sub-protective layer and a second sub-protective layer, and Wherein, a connection line connected to the touch line is arranged between the first sub-protecting layer and the second sub-protecting layer.

9. The display device according to claim 6, wherein: An end portion of the covering layer located in the second non-bending region is disposed between the protection layer and the separator.

10. The display device according to claim 6, wherein: The separator and the protective layer are arranged on the same layer.

11. The display device according to claim 1, further comprising: A dam is provided in the first non-bending area.

12. The display device according to claim 11, wherein: The partition is spaced apart from the dam by the bending region.

13. The display device according to claim 11, further comprising: a second protective layer and a bank, wherein the second protective layer and the bank are disposed between the transistor and the light emitting diode layer; as well as A spacer is disposed on the bank.

14. The display device according to claim 13, wherein: The dam is composed of the same material as at least one or more of materials constituting the spacer, the bank, and the protective layer.

15. The display device according to claim 13, wherein: The cover layer contacts the second protection layer in the bending region.

16. A display device, comprising: A substrate, the substrate comprising a first non-bending region, a second non-bending region, and a bending region disposed between the first non-bending region and the second non-bending region; A light-emitting element layer, wherein the light-emitting element layer is arranged in the first non-bending area on the substrate; a covering layer, the covering layer being arranged on the substrate in the first non-bending region, the bending region and a part of the second non-bending region, and the covering layer being arranged above the light emitting element layer; as well as A separator is provided in the second non-bending area on the substrate.

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