Optical device and optical communication system
By introducing deformation parts into optical devices and adjusting heat transfer by using their shape changes, the problem of high power consumption in existing optical devices when regulating temperature is solved, the effects of low-temperature insulation and high-temperature heat dissipation are achieved, and the total power consumption of optical devices is reduced.
Patent Information
- Application Number
- CN202311598111.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-27
- Publication Date
- 2025-05-27
AI Technical Summary
When existing optical devices regulate temperature, the high power consumption of the thermoelectric cooler leads to a significant increase in the power consumption of the entire optical device, making it difficult to meet the strict temperature requirements of high-speed optical devices.
By introducing deformation parts into optical devices, a gap is formed at low temperatures by using their shape changes to block heat transfer and low temperature insulation is achieved; a gap is eliminated at high temperatures, heat transfer is promoted, and heat dissipation is achieved.
The optical device realizes the functions of low-temperature insulation and high-temperature heat dissipation through the shape changes of the deformation parts, reducing the power consumption of the optical device and reducing the dependence on the thermoelectric cooler.
Smart Images
Figure CN120044656A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of optical communication technologies, and particularly to an optical device and an optical communication system. Background Art
[0002] For an optical device, such as an optical module for optoelectronic conversion, the laser inside needs to work within a certain temperature range. Especially for high-speed optical devices, the temperature requirements are relatively strict.
[0003] Currently, a thermo electric cooler (TEC) is usually used to regulate the temperature inside the optical device. For example, a thermo electric cooler is used to dissipate heat from the laser. However, the power consumption of the thermo electric cooler is relatively large, resulting in a significant increase in the power consumption of the entire optical device. Summary of the Invention
[0004] The present disclosure provides an optical device and an optical communication system. For the optical device, when at a low temperature, a gap can be generated between the heat source and the shell wall of the housing, reducing the heat transfer between the heat source and the housing, achieving low-temperature heat preservation and reducing energy loss. When at a high temperature, the gap between the heat source and the shell wall of the housing can be eliminated, achieving rapid heat dissipation at high temperature to prevent the optical device from being burned out at high temperature.
[0005] In a first aspect, the present disclosure provides an optical device, which includes a housing, an optical component, and a deformation member;
[0006] Both the optical component and the deformation member are located in the housing, and the deformation member is located between the optical component and the shell wall of the housing;
[0007] When the temperature inside the optical device is higher than the temperature threshold, the shape of the deformation member is a first shape, and there is no gap between the heat source of the optical component and the shell wall of the housing;
[0008] When the temperature inside the optical device is not higher than the temperature threshold, the shape of the deformation member is a second shape, and there is a gap between the heat source of the optical component and the shell wall of the housing, where the first shape and the second shape are different.
[0009] In the solution shown in the present disclosure, when the temperature inside the optical device is relatively low, such as lower than the upper limit value of the target temperature range required for the normal operation of the optical device, in this temperature state, either the temperature needs to be maintained or the heating wire needs to be used for heating, but heat dissipation is not required. Therefore, a gap can be formed between the heat source of the optical component and the shell wall of the housing, and the heat transfer between the heat source and the housing is blocked through the gap to achieve the effect of low-temperature heat preservation and reduce energy loss. At high temperatures, such as higher than the upper limit value of the target temperature range required for the normal operation of the optical device, heat dissipation is required at this temperature to prevent the optical component from being damaged by high temperature. Therefore, there is no gap between the heat source of the optical component and the shell wall of the housing to accelerate the heat transfer between the heat source and the housing and achieve the effect of high-temperature heat dissipation.
[0010] It can be seen that this optical device can achieve the effects of low-temperature heat preservation and high-temperature heat dissipation by means of the shape change of the deformation member, which is beneficial to reducing the power consumption of the optical device.
[0011] In a possible implementation manner, the deformation member is located between the optical component and the first shell wall of the housing, and both ends are fixed to the first shell wall;
[0012] When the temperature inside the optical device is higher than the temperature threshold, there is no gap between the heat source of the optical component and the first shell wall. When the temperature inside the optical device is not higher than the temperature threshold, there is a gap between the heat source of the optical component and the first shell wall.
[0013] In the solution shown in the present disclosure, the deformation member and the gap are located on the same side of the optical component. In this way, at low temperatures, the deformation member can arch up to lift the optical component, creating a gap between the heat source of the optical component and the first shell wall. At high temperatures, the deformation member resets and lies flat between the optical component and the first shell wall, eliminating the gap between the heat source of the optical component and the first shell wall.
[0014] In a possible implementation manner, the first shape of the deformation member is a sheet parallel to the first shell wall, and the second shape of the deformation member is an arch arched away from the first shell wall.
[0015] In the solution shown in the present disclosure, at high temperatures, the shape of the deformation member is an arch arched away from the first shell wall, thereby lifting the optical component and creating a gap between the heat source of the optical component and the first shell wall. At low temperatures, the shape of the deformation member is a sheet parallel to the first shell wall and no longer lifts the optical component, thereby eliminating the gap between the heat source of the optical component and the first shell wall. Thus, the optical device realizes low-temperature heat preservation and high-temperature heat dissipation.
[0016] In a possible implementation, the deformation member includes a first deformation sheet and a second deformation sheet. The coefficient of thermal expansion of the first deformation sheet is greater than that of the second deformation sheet. The first deformation sheet faces the optical component, and the second deformation sheet faces the first housing wall.
[0017] In the solution shown in the present disclosure, due to the coefficient of thermal expansion of the first deformation sheet being greater than that of the second deformation sheet, when the temperature changes, the expansion changes of the first deformation sheet and the second deformation sheet are inconsistent, so that the shape of the deformation member can be switched between arching and non-arching.
[0018] In a possible implementation, the material of the deformation member is a shape memory alloy.
[0019] In the solution shown in the present disclosure, when the material of the deformation member is a shape memory alloy, its shape can also be switched between arching and non-arching when the temperature changes.
[0020] In a possible implementation, the optical device includes an elastic member. The elastic member is located between the optical component and the second housing wall of the housing. The first housing wall and the second housing wall are opposite in position;
[0021] When the shape of the deformation member is the first shape, under the elastic action of the elastic member, there is no gap between the heat source of the optical component and the first housing wall. When the shape of the deformation member is the second shape, there is a gap between the heat source of the optical component and the first housing wall, and the elastic member is in a compressed state.
[0022] In the solution shown in the present disclosure, in the low-temperature state, the shape of the deformation member is an arch shape, which pushes up the optical component, so that a gap is generated between the heat source and the first housing wall. At this time, the elastic member is in a compressed state. At high temperature, the shape of the deformation member becomes a flat sheet parallel to the first housing wall. At this time, the elastic member resets and pushes the optical component to move towards the direction close to the first housing wall, thereby eliminating the gap between the heat source and the first housing wall.
[0023] In a possible implementation, the elastic member includes one or more of a spring, a spring sheet, and a flexible heat-conducting member located between the optical component and the second housing wall.
[0024] In the solution shown in the present disclosure, the elastic member can be a flexible heat-conducting member arranged between the optical component and the second housing wall. For example, it can be a flexible heat-conducting member arranged between the heat source and the second housing wall, and / or a flexible heat-conducting member arranged between the non-heat-source position and the second housing wall. The elastic member can also be a spring or a spring sheet arranged between the optical component and the second housing wall.
[0025] In a possible implementation, the first housing wall is the housing wall of the housing close to the radiator.
[0026] In the solution shown in the present disclosure, the optical device is inserted into the optical cage interface of the optical communication device, and a heat sink is placed on the outer surface of the optical cage interface to dissipate heat from the optical module. The first housing wall can be the housing wall close to the heat sink. Then, when heat dissipation is required for the optical device, the heat of the heat source can be quickly transferred to the heat sink through the first housing wall, and the heat sink dissipates heat from the optical device to accelerate the heat dissipation of the heat sink for the optical device.
[0027] In a possible implementation manner, the optical device includes a first heat conducting member, and the first heat conducting member is located between the heat source of the optical component and the first housing wall;
[0028] When the temperature inside the optical device is not higher than the temperature threshold, there is a gap between the first heat conducting member and the first housing wall, or there is a gap between the heat source of the optical component and the first heat conducting member.
[0029] In a second aspect, an optical communication system is provided. The optical communication system includes an optical communication device and the optical device described in the first aspect, and the optical device is pluggable to the optical communication device.
[0030] In the solution shown in the present disclosure, the optical communication system includes the optical device described above. When the temperature of the optical device is higher than the temperature threshold, the shape of its deformation member is the first shape, which causes no gap between the heat source of the optical component and the housing wall of the housing, so that the heat of the heat source is quickly transferred to the housing and dissipated through the housing. When the temperature of the optical device is not higher than the temperature threshold, the shape of the deformation member is the second shape, which causes a gap between the heat source of the optical component and the housing wall of the housing, hinders the heat transfer between the heat source and the housing, and keeps the position where the heat source is located in a heat preservation state to avoid rapid heat dissipation. It can be seen that the optical device has the functions of heat preservation at low temperature and heat dissipation at high temperature. Then, the optical device can maintain the internal temperature without using a thermoelectric cooler, thereby reducing the power consumption of the optical device.
[0031] Even if the optical device includes a thermoelectric cooler, compared with a traditional optical device (i.e., an optical device without a deformation member), it also has the characteristic of lower power consumption. This is because the deformation member does not generate power consumption during deformation. Then, when the deformation member is used in combination with the thermoelectric cooler, the generated power consumption is less than that generated by only using the thermoelectric cooler. Description of the Drawings
[0032] Figure 1 is a schematic structural diagram of an optical device provided by an exemplary embodiment of the present disclosure;
[0033] Figure 2 is a schematic structural diagram of the optical device when the shape of the deformation member is the second shape provided by an exemplary embodiment of the present disclosure;
[0034] Figure 3 When the shape of the deformation component provided by an exemplary embodiment of the present disclosure is the first shape, it is a schematic structural diagram of an optical device;
[0035] Figure 4 It is a schematic structural diagram of a deformation component provided by an exemplary embodiment of the present disclosure;
[0036] Figure 5 It is a schematic structural diagram of a deformation component with the second shape provided by an exemplary embodiment of the present disclosure;
[0037] Figure 6 It is a schematic structural diagram of a deformation component with the first shape provided by an exemplary embodiment of the present disclosure.
[0038] Description of reference numerals
[0039] 1. Housing; 11. First housing wall; 12. Second housing wall.
[0040] 2. Optical component.
[0041] 3. Deformation component; 31. First deformation sheet; 32. Second deformation sheet.
[0042] 4. Gap.
[0043] 5. Main board.
[0044] 6. First heat conducting member.
[0045] 7. Second heat conducting member.
[0046] 8. Third heat conducting member.
[0047] 9. Fourth heat conducting member.
[0048] 10. Spring. Detailed implementation manners
[0049] To make the objectives, technical solutions, and advantages of the present disclosure clearer, the following will further describe the embodiments of the present disclosure in detail with reference to the accompanying drawings.
[0050] This embodiment relates to a heat dissipation solution for an optical device. The optical device can be an optical module (optical module) for optoelectronic conversion, which can be a transmitting optical module, a receiving optical module, or a transceiver optical module. Specifically, the optical module can be a single optical port optical module (receiving and transmitting optical signals through one optical port), or a dual optical port optical module (one optical port is used to receive optical signals, and the other optical port is used to transmit optical signals).
[0051] The optical device involved in this embodiment can be applied in fields such as fiber to the remote (FTTB), fiber to the home (FTTH), and fiber to the remote (FTTR).
[0052] Take the application of the optical device in the FTTR field as an example. FTTR means directly introducing optical fibers into each room to achieve high-speed and stable network connections. The FTTR includes an optical fiber terminal box, which is a device that converts optical fiber signals into electrical signals. Therefore, the optical device shown in this embodiment can be inserted into the optical cage interface of the optical fiber terminal box to convert optical signals into electrical signals, or convert electrical signals into optical signals.
[0053] With the increase in the transceiver rate of the optical device, the temperature control of the laser inside the optical device becomes more and more strict. The temperature inside the optical device needs to be controlled within an appropriate range so that the laser can ensure the best performance.
[0054] Currently, the optical device usually uses a thermo electric cooler (TEC) to regulate the internal temperature. However, the power consumption of the thermo electric cooler is relatively large, resulting in a large power consumption of the optical device, which is not conducive to cost control.
[0055] Therefore, this embodiment provides an optical device that has the functions of low-temperature heat preservation and high-temperature heat dissipation to reduce power consumption. For example, when the internal temperature of the optical device is relatively low, such as below the temperature threshold, the thermal resistance is increased to slow down heat dissipation, and when the internal temperature is relatively high, such as above the temperature threshold, the thermal resistance is reduced to accelerate heat dissipation, thereby achieving low-temperature heat preservation and high-temperature heat dissipation.
[0056] The features of the optical device shown in this embodiment will be introduced in detail below.
[0057] As Figure 1 shown, it is an exploded schematic diagram of the optical device. Referring to Figure 1 shown, the optical device includes a housing 1, an optical component 2, and a main board 5. Among them, the housing 1 is in the shape of a long box with both ends open. One end opening serves as the optical port side of the optical device, and the other end opening serves as the electrical port side of the optical device. Among them, the optical port side is used for inserting the optical fiber connector of the optical fiber, and the electrical port side is used for inserting into the optical cage interface of the optical communication device.
[0058] Continue to refer to Figure 1 shown, the housing 1 includes a first shell wall 11, a second shell wall 12, and two side shell walls. The first shell wall 11 and the second shell wall 12 are opposite in position, one serves as the upper shell wall and the other serves as the lower shell wall, and the two side shell walls are opposite in position.
[0059] Continue to refer toFigure 1 As shown, the pins at the end of the optical component 2 are soldered to the main board 5 and electrically connected to the main board 5. The optical component 2 and the main board 5 are located in the housing 1. The fiber optic interface of the optical component 2 is exposed through the optical port at one end of the housing 1, and the gold finger connector at the end of the main board 5 is exposed through the electrical port at the other end of the housing 1.
[0060] For the optical component 2, if the optical device has two optical ports, the optical component 2 includes a transmitter optical sub-assembly (TOSA) and a receiver optical sub-assembly (ROSA). If the optical device has a single optical port as shown in Figure 1 the optical component 2 is a bi-directional optical sub-assembly (BOSA).
[0061] The main board 5 is specifically a circuit board, and its end has a gold finger connector for electrically connecting to the optical cage interface of the optical communication device.
[0062] In one example, the laser emission location of the optical device, that is, the location where the laser is located, is usually the location of the heat source. For example, if the laser of the optical device is a semiconductor laser encapsulated in a TO tube, then the location of the TO tube is the location of the heat source. As shown in Figure 1 the transistor outline (TO) tube of the optical device is located at the position connected to the main board 5. Continuing to refer to Figure 1 as shown, the TO tube is covered by the first heat conducting member 6 and the second heat conducting member 7.
[0063] In one example, in order to achieve heat preservation at low temperatures and heat dissipation at high temperatures, continuing to refer to Figure 1 as shown, the optical device further includes a deformation member 3, and the structure of the deformation member 3 can be referred to Figure 4 as shown. Referring to Figure 2 and Figure 3 as shown, the deformation member 3 is located in the housing 1, specifically between the optical component 2 and any shell wall of the housing 1.
[0064] Among them, the shape of the deformation member 3 can change with the ambient temperature. The deformation member 3 is used to form a gap between the heat source and the shell wall at low temperatures and eliminate the gap between the heat source and the shell wall at high temperatures.
[0065] For example, when the temperature inside the optical device is higher than the temperature threshold (denoted as high temperature), as shown in Figure 2 the shape of the deformation member 3 is the first shape. In this state, there is no gap between the heat source of the optical component 2 and the shell wall of the housing 1. When the temperature inside the optical device is not higher than the temperature threshold (denoted as low temperature), as shown inFigure 3 As shown, the shape of the deformation component 3 is the second shape. In this state, there is a gap 4 between the heat source of the optical component 2 and the shell wall of the housing 1.
[0066] In one example, air is distributed in the gap 4, and the thermal resistance of air is relatively large. Therefore, when there is a gap between the heat source of the optical component 2 and the shell wall of the housing 1, the thermal resistance between the heat source and the shell wall of the housing 1 is relatively large, and heat transfer is slow. When there is no gap between the heat source of the optical component 2 and the shell wall of the housing 1, the thermal resistance between the heat source and the shell wall of the housing 1 is relatively small, and heat transfer is relatively fast.
[0067] Therefore, for this optical device, through the deformation component 3, it can be achieved that when the temperature is not higher than the temperature threshold (denoted as low temperature), the heat dissipation of the heat source is slowed down to achieve the low-temperature heat preservation effect, and when the temperature is higher than the temperature threshold (denoted as high temperature), the heat source dissipates heat normally to achieve the high-temperature heat dissipation effect.
[0068] Among them, the above-mentioned temperature threshold can be the upper limit value of the target temperature range required for the optical device to work under the best performance.
[0069] For example, when the internal temperature of the optical device is within the target temperature range, its working performance is better. In this state, the optical device neither needs to dissipate heat nor needs to be heated, and only needs to maintain the current temperature by heat preservation. When the temperature is lower than the lower limit value of the target temperature range, heat dissipation is not required in this state, but the resistance wire inside the optical device needs to heat it to raise the temperature to within the target temperature range. When the temperature is higher than the upper limit value of the target temperature range, heat dissipation is required to lower the temperature to within the target temperature range.
[0070] In one example, the heat source of the optical component can be in direct contact with the shell wall of the housing 1, but when the heat source is in direct contact with the shell wall of the housing 1, there will be a contact gap, resulting in a poor heat dissipation effect when heat dissipation is required. For this reason, a heat conducting member can be arranged between the heat source and the shell wall of the housing 1.
[0071] Among them, the heat conducting member can be a rigid heat conducting member, such as a metal block, to accelerate the heat transfer between the heat source and the housing 1. The heat conducting member can also be a flexible heat conducting member, such as heat conducting grease or heat conducting gel or heat conducting silica gel, etc., to eliminate the contact gap between the heat source and the shell wall and accelerate the heat transfer between the heat source and the housing 1.
[0072] For example, as Figure 2 shown, the heat conducting member between the heat source and the first shell wall 11 can be denoted as the first heat conducting member 6, and the heat conducting member between the heat source and the second shell wall 12 can be denoted as the second heat conducting member 7.
[0073] Continue to refer to Figure 2As shown, the first heat-conducting member 6 can be a flexible heat-conducting member, and the second heat-conducting member 7 can be a rigid heat-conducting member for illustration. The second heat-conducting member 7 is rigid, and there will be a contact gap between the rigid second heat-conducting member 7 and the second shell wall 12. Then, in order to eliminate the contact gap, a third heat-conducting member 8 is also filled between the second shell wall 12 and the rigid second heat-conducting member 7. The third heat-conducting member 8 is a flexible heat-conducting pad.
[0074] In one example, a heat-conducting member can also be arranged between the non-heat source position of the optical component and the shell wall of the housing 1. Referring to Figure 2 As shown, the heat-conducting member between the non-heat source position of the optical component and the second shell wall 12 of the housing 1 can be denoted as the fourth heat-conducting member 9. The fourth heat-conducting member 9 is a flexible conductive gasket to absorb the contact gap between the optical component and the second shell wall 12.
[0075] As described above, a gap can be generated between the heat source and the shell wall of the housing 1 at low temperature. In one example, this gap can be generated between the heat source and any shell wall of the housing 1. For example, as Figure 2 shown, the gap is formed between the heat source and the first shell wall 11. Of course, the gap can also be formed between the heat source and the second shell wall 12, or between the heat source and the side shell wall of the housing.
[0076] In one example, the optical device is inserted into the optical cage interface of the optical communication device. Usually, a heat sink is arranged on the outer surface of the optical cage interface to dissipate heat from the optical module. Therefore, the gap can be formed between the heat source and the first shell wall 11, where the first shell wall 11 is the shell wall of the housing 1 close to the heat sink.
[0077] When the optical device is inserted into the optical cage interface of the optical communication device, since the first shell wall 11 is close to the heat sink, there is no gap between the heat source and the first shell wall 11 at high temperature. Then, the heat at the heat source can be quickly transferred to the first shell wall 11, and then transferred to the heat sink through the first shell wall 11 for heat dissipation by the heat sink.
[0078] In one example, as described above, there is a first heat-conducting member 6 between the first shell wall 11 and the heat source. Then, referring to Figure 2 shown, the gap 4 can be specifically formed between the first heat-conducting member 6 and the first shell wall 11. Of course, it can also be formed between the heat source and the first heat-conducting member 6. Among them, in this embodiment, it is not limited to who the gap 4 is specifically generated between, as long as there is a gap between the heat source and the first shell wall 11 at high temperature. In the following introduction, the deformation member 3 can be used to generate the gap 4 between the first heat-conducting member 6 and the first shell wall 11 for illustration.
[0079] Among them, since the deformation member 3 is used to generate and eliminate the gap, the position of the deformation member 3 is related to the position of the gap 4.
[0080] In one example, the deformable member 3 and the gap 4 are located on the same side of the optical component. For example, as Figure 2 shown, both the deformable member 3 and the gap 4 are located between the optical component 2 and the first housing wall 11. Alternatively, both the deformable member 3 and the gap 4 are located between the optical component 2 and the second housing wall 12.
[0081] In another example, the deformable member 3 and the gap 4 are located on opposite sides of the optical component 2. For example, the gap 4 is located between the optical component 2 and the first housing wall 11, while the deformable member 3 is located between the optical component 2 and the second housing wall 12. Another example is that the gap 4 is located between the optical component 2 and the second housing wall 12, while the deformable member 3 is located between the optical component 2 and the first housing wall 11.
[0082] Among them, the gap is located between the optical component 2 and the housing wall, that is to say, the gap is formed between the optical component 2 and the housing wall.
[0083] Taking the deformable member 3 and the gap 4 being located on the same side of the optical component 2 as an example, the specific position of the deformable member 3 in the housing 1 is illustrated.
[0084] In one example, the deformable member 3 and the gap 4 are located on the same side of the optical component, and the deformable member 3 and the gap 4 are arranged front and back along the length direction of the optical device. Among them, the length direction of the optical device is also the light output direction of the optical device.
[0085] As Figure 4 and referring to Figure 2 and Figure 3 shown, the strip-shaped deformable member 3 is located between the optical component 2 and the first housing wall 11, and the length direction of the deformable member 3 is consistent with the length direction of the optical device, that is to say, the length direction of the deformable member 3 is consistent with the light output direction of the optical device.
[0086] In another example, the deformable member 3 and the gap 4 are located on the same side of the optical component, and the deformable member 3 and the gap 4 are located at the same position. For example, the deformable member 3 can be located between the first heat conducting member 6 and the first housing wall 11, while the gap 4 is located between the deformable member 3 and the first housing wall 11. For example, at low temperature, the deformable member 3 arches up, forming a gap between the deformable member 3 and the first housing wall 11.
[0087] Among them, in the scheme where the deformable member 3 can be located between the first heat conducting member 6 and the first housing wall 11, the length direction of the deformable member 3 can be perpendicular to the length direction of the optical device, that is to say, the length direction of the deformable member 3 is perpendicular to the light output direction of the optical device.
[0088] Among them, in this embodiment, there are no specific limitations on whether the deformable member 3 and the gap 4 are located on the same side of the optical component, and whether the deformable member 3 and the gap 4 are arranged front and back along the length direction of the optical device.
[0089] As shown below Figure 2 So hot Figure 3 As shown, a gap is generated between the first heat conducting member 6 and the first housing wall 11 at high temperature. The deformation member 3 is located between the optical component and the first housing wall 11, demonstrating the characteristics of the deformation member 3.
[0090] As Figure 6 shown, it is a schematic diagram of the deformation member 3 at high temperature. The first shape of the deformation member 3 is a flat sheet parallel to the first housing wall 11. As Figure 5 shown, it is a schematic diagram of the deformation member 3 at low temperature. The second shape of the deformation member 3 can be an arched shape arched away from the first housing wall 11.
[0091] In this way, when the temperature is not higher than the temperature threshold, that is, in the low temperature state, as Figure 2 shown, the shape of the deformation member 3 is an arched shape arched away from the first housing wall 11. The deformation member 3 pushes the optical component 2 towards the second housing wall 12, generating a gap 4 between the first heat conducting member 6 and the first housing wall 11. Air with a relatively low thermal conductivity is distributed in the gap 4, thereby blocking the heat transfer between the heat source and the first housing wall 11, keeping the heat source in a low temperature insulation state to reduce heat consumption and the power consumption of the optical device.
[0092] When the temperature is higher than the temperature threshold, that is, in the high temperature state, as Figure 3 shown, the shape of the deformation member 3 is a sheet parallel to the first housing wall 11, making the first heat conducting member 6 in close contact with the first housing wall 11, eliminating the above-mentioned gap 4. Thus, the heat transfer between the heat source and the first housing wall 11 is accelerated to avoid damage to the optical component at high temperature.
[0093] In one example, the length of the gap 4 between the first heat conducting member 6 and the first housing wall 11 is related to the arch height of the deformation member 3. In applications, the length of the gap 4 can be designed based on simulation results and test results.
[0094] In one example, at high temperature, the deformation member 3 is a sheet parallel to the first housing wall 11. To make there be no gap (i.e., eliminate the gap 4) between the first heat conducting member 6 and the first housing wall 11, the optical device may include an elastic member located between the optical component 2 and the second housing wall 12.
[0095] In this way, at low temperature, as Figure 5 shown, the shape of the deformation member 3 is an arched shape. As Figure 2 shown, the arched deformation member 3 pushes up the optical component 2, and the elastic member between the optical component 2 and the second housing wall 12 is in a compressed state. And at high temperature, as Figure 6As shown, the deformation member 3 is a sheet parallel to the first housing wall 11. During the reset of the elastic member, the optical component 2 moves towards the direction close to the first housing wall 11, thus referring to Figure 3 As shown, the gap between the first heat conducting member 6 and the first housing wall 11 is eliminated.
[0096] Among them, the elastic member can be a flexible heat conducting member located between the optical component 2 and the second housing wall 12. This flexible heat conducting member has a certain elasticity. For example, Figure 2 and Figure 3 As shown, the elastic member can be the third heat conducting member 8 and / or the fourth heat conducting member 9.
[0097] Alternatively, the elastic member can also be a spring. For example, Figure 2 and Figure 3 As shown, a spring 10 is arranged between the optical component 2 and the second housing wall 12. Among them, the spring 10 can also be replaced by some elastic structural members with telescopic elasticity such as elastic sheets.
[0098] Alternatively, the elastic member can also include the spring 10, the third heat conducting member 8 and the fourth heat conducting member 9.
[0099] Regarding the material of the deformation member 3. In order to make the shape of the deformation member 3 related to the temperature, one solution can be that, for example, Figure 5 and Figure 6 As shown, the deformation member 3 includes a first deformation sheet 31 and a second deformation sheet 32, and the thermal expansion coefficients of the first deformation sheet 31 and the second deformation sheet 32 are different.
[0100] Among them, the first deformation sheet 31 and the second deformation sheet 32 can be metal sheets.
[0101] For example, the thermal expansion coefficient of the first deformation sheet 31 is greater than that of the second deformation sheet 32, and the first deformation sheet 31 faces the optical component 2, while the second deformation sheet 32 faces the first housing wall 11.
[0102] Since both ends of the first deformation sheet 31 and the second deformation sheet 32 are fixed together, and their thermal expansion coefficients are different, then when the temperature changes, it can cause the shape of the deformation member 3 to change between an arched shape and a flat sheet shape.
[0103] During the processing of the deformation member 3, it can be controlled that when the temperature is not higher than the temperature threshold, the shape of the deformation member 3 is the second shape, that is, the arched shape, and when the temperature is higher than the temperature threshold, the shape of the deformation member 3 is the first shape, that is, the flat sheet shape.
[0104] In order to make the shape of the deformation member 3 related to the temperature, another solution can be that the material of the deformation member 3 is a shape memory alloy, and the shape of the shape memory alloy is related to the temperature.
[0105] In this embodiment, when the temperature of the optical device is higher than the temperature threshold, the shape of the deformation member is the first shape, which causes no gap between the heat source of the optical component and the shell wall of the housing, enabling the heat of the heat source to be quickly transferred to the housing and dissipated through the housing. When the temperature of the optical device is not higher than the temperature threshold, the shape of the deformation member is the second shape, which causes a gap between the heat source of the optical component and the shell wall of the housing, hindering the heat transfer between the heat source and the housing, keeping the position where the heat source is located in a heat-insulated state, and preventing the heat from dissipating quickly. It can be seen that this optical device has the functions of heat preservation at low temperature and heat dissipation at high temperature. Therefore, this optical device can maintain the internal temperature without using a thermoelectric cooler, thereby reducing the power consumption of the optical device.
[0106] Even if this optical device includes a thermoelectric cooler, compared with traditional optical devices (i.e., optical devices without deformation members), it also has the characteristic of lower power consumption. This is because the deformation member does not generate power consumption during deformation. Therefore, when the deformation member is used in combination with the thermoelectric cooler, the generated power consumption is less than that generated by only using the thermoelectric cooler.
[0107] This embodiment also provides an optical communication system, which includes an optical communication device and the above-mentioned optical device. Among them, the optical communication device can be a device such as a router or a switch, and the optical device can be an optical module.
Claims
1. An optical device, characterized in that, the optical device includes a housing (1), an optical component (2) and a deformation member (3); the optical component (2) and the deformation member (3) are both located in the housing (1), and the deformation member (3) is located between the optical component (2) and the wall of the housing (1); when the temperature inside the optical device is higher than the temperature threshold, the shape of the deformation member (3) is the first shape, and there is no gap between the heat source of the optical component (2) and the wall of the housing (1); when the temperature inside the optical device is not higher than the temperature threshold, the shape of the deformation member (3) is the second shape, and there is a gap (4) between the heat source of the optical component (2) and the wall of the housing (1), wherein the first shape and the second shape are different.
2. The optical device according to claim 1, characterized in that, the deformation member (3) is located between the optical component (2) and the first wall (11) of the housing (1), and both ends are fixed to the first wall (11); when the temperature inside the optical device is higher than the temperature threshold, there is no gap between the heat source of the optical component (2) and the first wall (11), and when the temperature inside the optical device is not higher than the temperature threshold, there is a gap between the heat source of the optical component (2) and the first wall (11).
3. The optical device according to claim 2, characterized in that, the first shape of the deformation member (3) is a sheet parallel to the first wall (11), and the second shape of the deformation member (3) is an arched shape arched away from the first wall (11).
4. The optical device according to claim 2 or 3, characterized in that, the deformation member (3) includes a first deformation sheet (31) and a second deformation sheet (32), the thermal expansion coefficient of the first deformation sheet (31) is greater than the thermal expansion coefficient of the second deformation sheet (32), and the first deformation sheet (31) faces the optical component (2), and the second deformation sheet (32) faces the first wall (11).
5. The optical device according to claim 2 or 3, characterized in that, the material of the deformation member (3) is a shape memory alloy.
6. The optical device according to any one of claims 2 to 5, characterized in that, the optical device includes an elastic member, the elastic member is located between the optical component (2) and the second wall (12) of the housing (1), and the first wall (11) and the second wall (12) are opposite in position; when the shape of the deformation member (3) is the first shape, under the elastic action of the elastic member, there is no gap between the heat source of the optical component (2) and the first wall (11), and when the shape of the deformation member (3) is the second shape, there is a gap (4) between the heat source of the optical component (2) and the first wall (11), and the elastic member is in a compressed state.
7. The optical device according to claim 6, characterized in that, the elastic member includes one or more of a spring, a spring sheet, and a flexible heat conducting member located between the optical component (2) and the second wall (12).
8. The optical device according to any one of claims 2 to 7, characterized in that, the first housing wall (11) is the housing wall of the housing (1) close to the radiator.
9. The optical device according to any one of claims 2 to 8, characterized in that, the optical device includes a first heat conducting member (6), and the first heat conducting member (6) is located between the heat source of the optical component (2) and the first housing wall (11); when the temperature inside the optical device is not higher than the temperature threshold, there is a gap (4) between the first heat conducting member (6) and the first housing wall (11), or there is a gap (4) between the heat source of the optical component (2) and the first heat conducting member (6).
10. An optical communication system, characterized in that, the optical communication system includes an optical communication device and the optical device according to any one of claims 1 to 9, and the optical device is pluggably connected to the optical communication device.